MSP432P401R LaunchPad™ Development Kit (MSP‑EXP432P401R) (Rev. B) Launch Pad Users Guide

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MSP432P401R LaunchPad™ Development Kit (MSP‑EXP432P401R)
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MSP432P401R LaunchPad™ Development Kit (MSP

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LaunchPad, MSP432, BoosterPack, Code Composer Studio, EnergyTrace, MSP430, SimpleLink, E2E are trademarks of Texas Instruments.

ARM, Cortex, Keil, µVision are registered trademarks of ARM Ltd.

IAR Embedded Workbench is a trademark of IAR Systems.

All other trademarks are the property of their respective owners.

User's Guide

SLAU597B–March 2015–Revised July 2016

MSP432P401R LaunchPad™ Development Kit

(MSP

‑‑

EXP432P401R)

The MSP‑EXP432P401R LaunchPad™ development kit is an easy-to-use evaluation module for the

MSP432P401R microcontroller. It contains everything needed to start developing on the MSP432™ Low-

Power + Performance ARM®32-bit Cortex®-M4F microcontroller (MCU), including onboard debug probe

for programming, debugging, and energy measurements. The MSP432P401R device supports low-power

applications requiring increased CPU speed, memory, analog, and 32-bit performance.

Figure 1. MSP‑‑EXP432P401R LaunchPad™ Development Kit

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Contents

1 Getting Started ............................................................................................................... 3

2 Hardware...................................................................................................................... 5

3 Software Examples ........................................................................................................ 19

4 Resources................................................................................................................... 37

5 FAQ .......................................................................................................................... 40

6 Schematics.................................................................................................................. 45

List of Figures

1 MSP‑EXP432P401R LaunchPad™ Development Kit .................................................................. 1

2 MSP-EXP432P401R Overview ............................................................................................ 5

3 Block Diagram................................................................................................................ 5

4 MSP432P401RIPZ Pinout .................................................................................................. 6

5 XDS110-ET Debug Probe .................................................................................................. 7

6 XDS110-ET Isolation Block................................................................................................. 8

7 Application Backchannel UART in Device Manager .................................................................... 9

8 EnergyTrace™ Technology Preferences ............................................................................... 11

9 EnergyTrace™ Windows.................................................................................................. 12

10 MSP‑EXP432P401R Power Block Diagram ............................................................................ 13

11 LaunchPad™ Development Kit to BoosterPack™ Plug-in Module Connector Pinout ............................ 16

12 Differences Between Rev 1.0 (Black) and Rev 2.0 (Red) ............................................................ 18

13 BSL Update Utility in TI Resource Explorer ............................................................................ 19

14 Out-of-Box GUI Running Locally ......................................................................................... 20

15 Out-of-Box GUI Running From TI Cloud Tools......................................................................... 21

16 Backend Block Diagram of CC3100BOOST MQTT-Twitter LED Control Demo................................... 23

17 Importing and Converting an Image With MSP Image Reformer .................................................... 25

18 Hardware Setup and Connections ....................................................................................... 26

19 Determine COM Port Number Using Device Manager on Windows ................................................ 27

20 Example Serial Terminal Configuration ................................................................................. 27

21 Snapshot of Serial Terminal Connected to Running Fuel Gauge Demo ........................................... 28

22 Setting up COM Port Configuration for the LaunchPad™ Development Kit ....................................... 29

23 Programming Sensor Software With the GUI .......................................................................... 30

24 Sensor GUI Layout......................................................................................................... 30

25 GUI Sensor Tile ............................................................................................................ 32

26 GUI Integrated EnergyTrace™ Measurements ........................................................................ 33

27 Board Movement Window................................................................................................. 33

28 Translation Along the X Axis.............................................................................................. 33

29 Translation Along the Y Axis.............................................................................................. 34

30 Translation Along the Z Axis.............................................................................................. 34

31 Rotation Around the X Axis ............................................................................................... 34

32 Rotation Around the Y Axis ............................................................................................... 35

33 Rotation Around the Z Axis ............................................................................................... 35

34 No Movement............................................................................................................... 35

35 Light Sensing in the Gesture Recognition Window.................................................................... 36

36 Using TI Resource Explorer to Browse MSP‑EXP432P401R in MSPWare........................................ 39

37 SWD Mode Settings ....................................................................................................... 40

38 Target Configurations...................................................................................................... 41

39 Launch Selected Configuration........................................................................................... 41

40 Show All Cores ............................................................................................................. 42

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41 Connect Target ............................................................................................................. 43

42 MSP432_Factory_Reset Script........................................................................................... 43

43 Schematics (1 of 6) ........................................................................................................ 45

44 Schematics (2 of 6) ........................................................................................................ 46

45 Schematics (3 of 6) ........................................................................................................ 47

46 Schematics (4 of 6) ........................................................................................................ 48

47 Schematics (5 of 6) ........................................................................................................ 49

48 Schematics (6 of 6) ........................................................................................................ 50

List of Tables

1 Isolation Block Connections................................................................................................ 7

2 Default Clock Operation................................................................................................... 14

3 Hardware Change Log .................................................................................................... 17

4 Software Examples ........................................................................................................ 19

5 IDE Minimum Requirements for MSP‑EXP432P401R ................................................................ 20

6 Source File and Folders................................................................................................... 22

7 Source File and Folders................................................................................................... 26

8 Source File and Folders................................................................................................... 29

9 Source Files and Folders.................................................................................................. 36

10 How MSP Device Documentation is Organized........................................................................ 39

1 Getting Started

1.1 Introduction

The MSP‑EXP432P401R LaunchPad development kit is an easy-to-use evaluation module for the

MSP432P401R microcontroller. It contains everything needed to start developing on the MSP432 Low-

Power + Performance ARM 32-bit Cortex-M4F microcontroller (MCU), including onboard debug probe for

programming, debugging, and energy measurements. The MSP432P401R device supports low-power

applications that require increased CPU speed, memory, analog, and 32-bit performance.

Rapid prototyping is simplified by access to the 40-pin headers and a wide variety of BoosterPack™ plug-

in modules that enable technologies such as wireless connectivity, graphical displays, environmental

sensing, and many more. Free software development tools are also available such as TI's Eclipse-based

Code Composer Studio™ (CCS) IDE, IAR Embedded Workbench™ IDE, and Keil®µVision®IDE. Code

Composer (CCS) supports EnergyTrace™ technology when paired with the MSP432P401R LaunchPad

development kit. More information about the LaunchPad development kit, the supported BoosterPack

plug-in modules, and the available resources can be found at TI's LaunchPad portal. To get started

quickly, and find available resources in MSPWare, visit the TI Cloud Development Environment.

1.2 Key Features

• Low-power ARM Cortex-M4F MSP432P401R

• 40-pin LaunchPad development kit standard that leverages the BoosterPack plug-in module ecosystem

• XDS110-ET, an open-source onboard debug probe featuring EnergyTrace+ technology and application

UART

• Two buttons and two LEDs for user interaction

• Backchannel UART through USB to PC

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1.3 What's Included

1.3.1 Kit Contents

• One MSP‑EXP432P401R LaunchPad development kit

• One Micro USB cable

• One Quick Start Guide

1.3.2 Software Examples (Section 3)

• Out-of-Box Software Example

• CC3100BOOST MQTT-Twitter LED Control Example

• BOOSTXL-K350QVG-S1 Graphics Library Example

• 430BOOST-SHARP96 Graphics Library Example

• BOOSTXL-BATPAKMKII Fuel Gauge Example

• BOOSTXL-SENSORS Sensor GUI Example

• BOOSTXL-SENSORS Sensor GUI with TI-RTOS Example

1.4 First Steps: Out-of-Box Experience

An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates

some key features of the LaunchPad development kit from a user level, showing how to use the

pushbutton switches together with onboard LEDs and basic serial communication with a computer.

A more detailed explanation of the out-of-box demo can be found in Section 3.

1.5 Next Steps: Looking Into the Provided Code

It is now time to start exploring more features of the EVM!

www.ti.com/beginMSP432launchpad

To get started, you will need an integrated development environment (IDE) to explore and start editing the

code examples. Refer to Section 4 for more information on IDEs and where to download them.

Continuing in the footsteps of the widely successful MSP430™ 16-bit ultra-low-power microcontroller

platform, Texas Instruments expands its MSP product line with the MSP432 microcontroller platform. If

you are used to developing with MSP430 devices, see MSP432 Platform Porting to help start your

MSP432 application with ease.

The out-of-box source code and more code examples can be downloaded from the MSP-EXP432P401R

tool folder. Find what code examples are available and more details about each example in Section 3. All

code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.

Target Device

MSP432P401R

Crystal

48 MHz

Micro‐B

USB

EnergyTrace+

Current

Measure HW

LDO

5 V, 3.3 V

ESD

Protection

Power

Switch

Debug

MCU

LED

Red, Green

Power, UART, JTAG to Target

User Interface

Buttons and LEDs

40‐pin LaunchPad

standard headers

{EnergyTrace Technology

Real-time power consumption

readings and state updates from the

MSP432P401R MCU viewable

through the EnergyTrace GUI

40-pin BoosterPack

plug-in module connector

(J1–J4) {

Button/Switch

User LEDs

LED1 and LED2

Button/Switch

Fanout of Unused Pins

- Access to unused pins on the

MSP432P401R device

- Support for bread-board connection

MSP432P401R Microcontroller

MSP1

{

Jumper Isolation Block

- J101

- Power

- GND, 5V, and 3V3

- Back-channel UART to the PC

- RXD, TXD

- JTAG

- RST, TMS, TCK, TDO, TDI

XDS110 onboard debug probe

Enables debugging and programming

as well as communication to the PC.

The XDS110 can also provide power

to the target MCU.

Reset

MSP432P401R Reset

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2 Hardware

Figure 2 shows an overview of the EVM hardware.

Figure 2. MSP-EXP432P401R Overview

2.1 Block Diagram

Figure 3 shows the block diagram.

Figure 3. Block Diagram

1P10.1/UCB3CLK

2P10.2/UCB3SIMO/UCB3SDA

3P10.3/UCB3SOMI/UCB3SCL

4P1.0/UCA0STE

5P1.1/UCA0CLK

6P1.2/UCA0RXD/UCA0SOMI

7P1.3/UCA0TXD/UCA0SIMO

8P1.4/UCB0STE

9P1.5/UCB0CLK

10P1.6/UCB0SIMO/UCB0SDA

11P1.7/UCB0SOMI/UCB0SCL

12VCORE

13DVCC1

14VSW

15DVSS1

16P2.0/PM_UCA1STE

17P2.1/PM_UCA1CLK

18P2.2/PM_UCA1RXD/PM_UCA1SOMI

19P2.3/PM_UCA1TXD/PM_UCA1SIMO

20P2.4/PM_TA0.1

21P2.5/PM_TA0.2

22P2.6/PM_TA0.3

23P2.7/PM_TA0.4

24P10.4/TA3.0/C0.7

25P10.5/TA3.1/C0.6

P7.4/PM_TA1.4/C0.5

P7.5/PM_TA1.3/C0.4

P7.6/PM_TA1.2/C0.3

P7.7/PM_TA1.1/C0.2

P8.0/UCB3STE/TA1.0/C0.1

P8.1/UCB3CLK/TA2.0/C0.0

P3.0/PM_UCA2STE

P3.1/PM_UCA2CLK

P3.2/PM_UCA2RXD/PM_UCA2SOMI

P3.3/PM_UCA2TXD/PM_UCA2SIMO

P3.4/PM_UCB2STE

P3.5/PM_UCB2CLK

P3.6/PM_UCB2SIMO/PM_UCB2SDA

P3.7/PM_UCB2SOMI/PM_UCB2SCL

AVSS3

PJ.0/LFXIN

PJ.1/LFXOUT

AVSS1

DCOR

AVCC1

P8.2/TA3.2/A23

P8.3/TA3CLK/A22

P8.4/A21

P8.5/A20

P8.6/A19

51 P8.7/A18

52 P9.0/A17

53 P9.1/A16

54 P6.0/A15

55 P6.1/A14

56 P4.0/A13

57 P4.1/A12

58 P4.2/ACLK/TA2CLK/A11

59 P4.3/MCLK/RTCCLK/A10

60 P4.4/HSMCLK/SVMHOUT/A9

61 P4.5/A8

62 P4.6/A7

63 P4.7/A6

64 P5.0/A5

65 P5.1/A4

66 P5.2/A3

67 P5.3/A2

68 P5.4/A1

69 P5.5/A0

70 P5.6/TA2.1/VREF+/VeREF+/C1.7

71 P5.7/TA2.2/VREF-/VeREF-/C1.6

72 DVSS2

73 DVCC2

74 P9.2/TA3.3

75 P9.3/TA3.4

P6.2/UCB1STE/C1.5

P6.3/UCB1CLK/C1.4

P6.4/UCB1SIMO/UCB1SDA/C1.3

P6.5/UCB1SOMI/UCB1SCL/C1.2

P6.6/TA2.3/UCB3SIMO/UCB3SDA/C1.1

P6.7/TA2.4/UCB3SOMI/UCB3SCL/C1.0

DVSS3

RSTn/NMI

AVSS2

PJ.2/HFXOUT

PJ.3/HFXIN

AVCC2

P7.0/PM_SMCLK/PM_DMAE0

P7.1/PM_C0OUT/PM_TA0CLK

P7.2/PM_C1OUT/PM_TA1CLK

P7.3/PM_TA0.0

PJ.4/TDI

PJ.5/TDO/SWO

SWDIOTMS

SWCLKTCK

P9.4/UCA3STE

P9.5/UCA3CLK

P9.6/UCA3RXD/UCA3SOMI

P9.7/UCA3TXD/UCA3SIMO

100

P10.0/UCB3STE

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2.2 MSP432P401R

The MSP432P401R is the first MSP432 family device featuring low-power performance with an ARM

Cortex-M4F core. Device features include:

• Low-power ARM Cortex-M4F MSP432P401R

• Up to 48-MHz system clock

• 256KB flash memory, 64KB SRAM, and 32KB ROM with MSPWare libraries

• Four 16-bit timers with capture/compare/PWM, two 32-bit timers, and RTC

• Up to eight serial communication channels (I2C, SPI, UART, and IrDA)

• Analog: 14-bit SAR ADC, capacitive touch, comparator

• Digital: AES256, CRC, uDMA

Figure 4. MSP432P401RIPZ Pinout

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2.3 XDS110-ET Onboard Debug Probe

To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard

debug probe, which eliminates the need for expensive programmers. The MSP‑EXP432P401R has the

XDS110-ET debug probe, which is a simple low-cost debug probe that supports nearly all TI ARM device

derivatives.

Figure 5. XDS110-ET Debug Probe

The XDS110-ET hardware can be found in the schematics in Section 6 and in the MSP‑EXP432P401R

Hardware Design Files.

2.3.1 XDS110-ET Isolation Block J101

The J101 isolation block is composed of J101 jumpers shown in Table 1. The J101 isolation block allows

the user to connect or disconnect signals that cross from the XDS110-ET domain into the MSP432P401R

target domain. This crossing is shown by the silkscreen dotted line across the LaunchPad development kit

through J101. No other signals cross the domain, so the XDS110-ET can be completely decoupled from

the MSP432P401R target side. This includes XDS110-ET power and GND signals, UART, and JTAG

signals.

Table 1 lists the signals that are controlled at the isolation block.

Table 1. Isolation Block Connections

Signal Description

GND GND power connection between XDS110 and MSP432 target GND planes. The GND jumper is

populated to connect the separate GND planes. This connection is required for proper operation with

3V3, 5V, UART, and JTAG.

5V 5-V power rail, VBUS from USB

3V3 3.3-V power rail, derived from VBUS by an LDO in the XDS110-ET domain

RXD << Backchannel UART: The target MCU receives data through this signal. The arrows indicate the direction

of the signal.

TXD >> Backchannel UART: The target MCU sends data through this signal. The arrows indicate the direction of

the signal.

RST MCU RST signal (active low)

TCK_SWCLK Serial wire clock input (SWCLK) / JTAG clock input (TCK)

TMS_SWDIO Serial wire data input/output (SWDIO) / JTAG test mode select (TMS)

TDO_SWO Serial wire trace output (SWO) / JTAG trace output (TWO) (Also PJ.5)

TDI JTAG test data input (Also PJ.4)

XDS110-ET

Debug Probe

MCU

J101

Isolation

Block

JTAG and SWD

Application UART

3.3V Power

5V Power

MSP432P401R

Target MCU

XDS110-ETMSP432 Target

USB Connector

in out

LDO

BoosterPack Header

USB

EnergyTrace

eUSCI_A0

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Reasons to open these connections:

• To remove any and all influence from the XDS110-ET debug probe for high accuracy target power

measurements

• To control 3-V and 5-V power flow between the XDS110-ET and target domains

• To expose the target MCU pins for other use than onboard debugging and application UART

communication

• To expose the UART interface of the XDS110-ET so that it can be used for devices other than the

onboard MCU.

Figure 6. XDS110-ET Isolation Block

2.3.2 Application (or "Backchannel") UART

The XDS110-ET provides a "backchannel" UART-over-USB connection with the host, which can be very

useful during debugging and for easy communication with a PC.

The backchannel UART allows communication with the USB host that is not part of the target application's

main functionality. This is very useful during development, and also provides a communication channel to

the PC host side. This can be used to create GUIs and other programs on the PC that communicate with

the LaunchPad development kit.

The pathway of the backchannel UART is shown in Figure 7. The backchannel UART eUSCI_A0 is

independent of the UART on the 40-pin BoosterPack plug-in module connector eUSCI_A2.

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On the host side, a virtual COM port for the application backchannel UART is generated when the

LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with

COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and

communicate with the target application. You need to identify the COM port for the backchannel. On

Windows PCs, Device Manager can assist.

Figure 7. Application Backchannel UART in Device Manager

The backchannel UART is the XDS110 Class Application/User UART port. In this case, Figure 7 shows

COM156, but this port can vary from one host PC to the next. After you identify the correct COM port,

configure it in your host application according to its documentation. You can then open the port and begin

communication to it from the host.

The XDS110-ET has a configurable baud rate; therefore, it is important that the PC application configures

the baud rate to be the same as what is configured on the eUSCI_A0 backchannel UART.

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2.3.3 Using an External Debug Probe Instead of the Onboard XDS110-ET

Many users have a specific external debug probe that they prefer to use, and may wish to bypass the

XDS110-ET debug probe to program the MSP432 target MCU. This is enabled by jumpers on isolation

block J101, and the connector J8. Using an external debug probe is simple, and full JTAG access is

provided through J8.

1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO,

and TDI.

2. Plug any ARM debug probe into J8.

(a) J8 follows the ARM Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.

3. Plug USB power into the LaunchPad development kit, or power it externally.

(a) Ensure that the jumpers across 3V3 and GND are connected if using USB power.

(b) External debug probes do not provide power, the VCC pin is a power sense pin.

2.3.4 Using the XDS110-ET Debug Probe With a Different Target

The XDS110-ET debug probe on the LaunchPad can interface to most ARM Cortex-M devices, not just

the onboard target MSP432P410R device. This functionality is enabled by the J102 10-pin Cortex-M JTAG

connector. The 10-pin cable can be purchased from DigiKey Electronics (sold separately from the

LaunchPad development kit).

Header J102 follows the Cortex-M ARM standard; however, pin 1 is not a voltage sense pin. The XDS110-

ET outputs only 3.3-V JTAG signals. If another voltage level is needed, the user must provide level

shifters to translate the JTAG signal voltages. Additionally, 3.3 V of output power can be sourced from the

XDS110-ET when jumper JP102 is connected. This allows the XDS110-ET to power the external target at

3.3 V through pin 1. By default JP102 is not populated as it does not explicitly follow the standard.

1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO,

and TDI.

2. Plug the 10-pin cable into J102, and connect to an external target a. J102 follows the ARM Cortex

Debug Connector standard outlined in Cortex-M Debug Connectors.

3. Plug USB power into the LaunchPad, or power it externally

(a) JTAG levels are 3.3 V ONLY.

(b) 3.3-V power can be sourced through J102 by shorting the JP102 jumper.

2.3.5 EnergyTrace+ Technology

EnergyTrace™ technology is an energy-based code analysis tool that measures and displays the

application's energy profile and helps to optimize it for ultra-low power consumption.

MSP432 devices with built-in EnergyTrace+[CPU State] (or in short EnergyTrace+) technology allow real-

time monitoring of internal device states while user program code executes.

EnergyTrace+ technology is supported on the LaunchPad development kit MSP432P401R device +

XDS110-ET debug probe. EnergyTrace technology is available as part of TI's Code Composer Studio IDE.

During application debug, additional windows are available for EnergyTrace technology.

To enable EnergyTrace technology, go to:

• Window > Preferences > Code Composer Studio > Advanced Tools > EnergyTrace™ Technology

• Check the Enable Auto-Launch on target connect box

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Figure 8. EnergyTrace™ Technology Preferences

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Starting a debug session will now open EnergyTrace technology windows. These windows show energy,

power, profile, and states to give the user a full view of the energy profile of their application.

Figure 9. EnergyTrace™ Windows

This data allows the user to see exactly where and how energy is consumed in their application.

Optimizations for energy can be quickly made for the lowest power application possible.

On the LaunchPad development kit, EnergyTrace technology measures the current that enters the target

side of the LaunchPad development kit. This includes all BoosterPack plug-in modules plugged in, and

anything else connected to the 3V3 power rail. For more information about powering the LaunchPad

development kit, see Section 2.4.

For more information about EnergyTrace technology, see http://www.ti.com/tool/energytrace.

For more details and questions about setting up and using EnergyTrace technology with the

MSP432P401R, see the Code Composer Studio 6 User's Guide for MSP432.

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2.4 Power

The board was designed to accommodate various powering methods, including through the onboard

XDS110-ET and from an external source or BoosterPack plug-in module.

Figure 10. MSP‑‑EXP432P401R Power Block Diagram

2.4.1 XDS110-ET USB Power

The most common power-supply scenario is from USB through the XDS110-ET debug probe. This

provides 5-V power from the USB and also regulates this power rail to 3.3 V for XDS110-ET operation and

3.3 V to the target side of the LaunchPad development kit. Power from the XDS110-ET is controlled by

the isolation block 3V3 jumper, ensure this jumper is connected for power to be provided to the target

MCU side.

Under normal operation, the LDO on the XDS110-ET can supply up to 500 mA of current to the target side

including any BoosterPack plug-in modules plugged in. However, when debugging and using the

EnergyTrace technology tool, this current is limited to 75 mA total. Be aware of this current limitation when

using EnergyTrace technology.

2.4.2 BoosterPack Plug-in Module and External Power Supply

Header J6 is present on the board to supply external power directly. It is important to comply with the

device voltage operation specifications when supplying external power. The MSP432P401R has an

operating range of 1.62 V to 3.7 V. More information can be found in the MSP432P401xx Mixed-Signal

Microcontroller data sheet.

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2.5 Measure MSP432 Current Draw

To measure the current draw of the MSP432P401R, use the 3V3 jumper on the jumper isolation block.

The current measured includes the target device and any current drawn through the BoosterPack plug-in

module headers.

To measure ultra-low power, follow these steps:

1. Remove the 3V3 jumper in the isolation block, and attach an ammeter across this jumper.

2. Consider the effect that the backchannel UART and any circuitry attached to the MSP432P401R may

have on current draw. Disconnect these at the isolation block if possible, or at least consider their

current sinking and sourcing capability in the final measurement.

3. Make sure there are no floating input I/Os. These cause unnecessary extra current draw. Every I/O

should either be driven out or, if it is an input, should be pulled or driven to a high or low level.

4. Begin target execution.

5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a

stable measurement. It is easier to measure quiescent states.

For a better look at the power consumed in the application, use EnergyTrace+ Technology. EnergyTrace+

Technology allows the user to see energy consumed as the application progresses. More details about

EnergyTrace+ Technology can be found in Section 2.3.5.

2.6 Clocking

The MSP‑EXP432P401R provides external clocks in addition to the internal clocks in the device.

• Q1: 32-kHz crystal (LFXTCLK)

• Q2: 48-MHz crystal (HFXTCLK)

The 32-kHz crystal allows for lower LPM3 sleep currents, and higher precision clock source than the

default internal 32 kHz REFOCLK. Therefore, the presence of the crystal allows the full range of low-

power modes to be used.

The 48-MHz crystal allows the device to run at its maximum operating speed for MCLK and HSMCLK.

The MSP432P401R device has several internal clocks that can be sourced from many clock sources.

Most peripherals on the device can select which of the internal clocks to use to operate at the desired

speed.

The internal clocks in the device default to the configuration listed in Table 2.

Table 2. Default Clock Operation

Clock Default Clock Source Default Clock

Frequency Description

MCLK DCO 3 MHz Master Clock

Sources CPU and peripherals

HSMCLK DCO 3 MHz Subsystem Master Clock

Sources peripherals

SMCLK DCO 3 MHz Low-speed subsystem master clock

Sources peripherals

ACLK LFXT (or REFO if no

crystal present) 32.768 kHz Auxiliary clock

Sources peripherals

BCLK LFXT(or REFO if no

crystal present) 32.768 kHz Low-speed backup domain clock

Sources LPM peripherals

For more information about configuring internal clocks and using the external oscillators, see the

MSP432P4xx Family Technical Reference Manual.

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2.7 BoosterPack Plug-in Module Pinout

The MSP‑EXP432P401R LaunchPad development kit adheres to the 40-pin LaunchPad development kit

pinout standard. A standard was created to aid compatibility between LaunchPad development kit and

BoosterPack plug-in module tools across the TI ecosystem.

The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad development

kits like the MSP‑EXP430FR4133. This allows some subset of functionality of 40-pin BoosterPack plug-in

modules to be used with 20-pin LaunchPad development kits.

While most BoosterPack plug-in modules are compliant with the standard, some are not. The

MSP‑EXP432P401R LaunchPad development kit is compatible with all 20-pin and 40-pin BoosterPack

plug-in modules that are compliant with the standard. If the reseller or owner of the BoosterPack plug-in

module does not explicitly indicate compatibility with the MSP‑EXP432P401R LaunchPad development kit,

compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad development kit

to ensure compatibility. Keep in mind that sometimes conflicts can be resolved by changing the

MSP432P401R device pin function configuration in software. More information about compatibility can

also be found at http://www.ti.com/launchpad.

Figure 11 shows the 40-pin pinout of the MSP‑EXP432P401R LaunchPad development kit.

Note that software configuration of the pin functions plays a role in compatibility. The MSP‑EXP432P401R

LaunchPad development kit side of the dashed line in Figure 11 shows all of the functions for which the

MSP432P401R device's pins can be configured. This can also be seen in the MSP432P401R data sheet.

The BoosterPack plug-in module side of the dashed line shows the standard. The MSP432P401R function

whose color matches the BoosterPack plug-in module function shows the specific software-configurable

function by which the MSP‑EXP432P401R LaunchPad development kit adheres to the standard.

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Figure 11. LaunchPad™ Development Kit to BoosterPack™ Plug-in Module Connector Pinout

2.8 Design Files

2.8.1 Hardware Design Files

Schematics can be found in Section 6. All design files including schematics, layout, bill of materials

(BOM), Gerber files, and documentation are available in the MSP‑EXP432P401R Hardware Design Files.

Do you have an older version of the LaunchPad development kit? The differences in the hardware are

outlined in Section 2.9. The hardware design files for older versions of the LaunchPad are available at the

link above – navigate to previous release versions according to Table 3.

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2.8.2 Software Examples

All design files including TI-TXT object-code firmware images, software example projects, and

documentation are available in the MSP‑EXP432P401R Software Examples.

Do you have an older version of the LaunchPad development kit? The differences in the hardware are

outlined in Section 2.9. In addition to the hardware being different, the device revision also changes with

the LaunchPad development kit revisions. Because of this, you must download a software package that

matches your exact hardware. The software example files for older versions of the LaunchPad

development kit are available at the link above – navigate to previous release versions according to

Table 3.

2.9 Hardware Change Log

Table 3 lists the hardware revisions.

Table 3. Hardware Change Log

PCB

Revision Date Description MSP432P401R Device Revision

MSP-EXP432P401R Hardware and

Software Download Version (for

downloading zip packages online

only)

Rev 1.0 March 2015 Initial Release XMS432P401R Rev B 2_00_00_03

Rev 2.0 June 2016 RTM Silicon Release

XMS432P401R Rev C or

MSP432P401R Rev C

(check device markings to

determine your version)

3_00_00_03

2.9.1 MSP-EXP432P401R Rev 1.0 (Black) LaunchPad Development Kit

As shown in Table 3, this was the initially released LaunchPad development kit, with XMS432P401R Rev

B silicon. Connecting any debugger to the old version of the MSP432 MCU will generate a warning telling

the user to update their silicon. TI will continue to support this board for the foreseeable future. However,

upgrading to the latest LaunchPad development kit gets you all the silicon upgrades and the final

production version of Driver Library in ROM.

2.9.2 MSP-EXP432P401R Rev 2.0 (Red) LaunchPad Development Kit

As shown in Table 3, this is the updated LaunchPad development kit for the silicon RTM, with

XMS432P401R Rev C or MSP432P401R Rev C silicon. In addition to the latest silicon, several updates

were made to the LaunchPad development kit hardware to enhance the user experience.

2.9.2.1 MSP-EXP432P401R Updates

From the perspective of the board, all of the changes are aesthetic or make the kit easier to use (see

Figure 12). For example, moving the user buttons to the side of the board makes them easier to reach

when you have a BoosterPack plug-in module plugged into the top of the LaunchPad development kit.

The button placement has changed, but the physical button connections are the same. The biggest

change comes from the addition of an extra 10-pin ARM JTAG connector. This connector lets you use the

LaunchPad development kit as a stand-alone XDS110 debug probe.

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Figure 12. Differences Between Rev 1.0 (Black) and Rev 2.0 (Red)

2.9.2.2 MSP432P401R Device Revision Differences

The primary MSP432P401R silicon differences are the differences between Rev. B and Rev. C devices.

For details of the differences, see Moving From Evaluation to Production With MSP432P401x MCUs.

The first shipments of Rev 2.0 (Red) LaunchPad development kit have XMS432P401R Rev C.

preproduction silicon before the final production version of MSP432P401R Rev C. silicon is released.

Which device is on a particular LaunchPad development kit can be determined by looking at the markings

on the MSP432P401R device. The XMS version have a marking of "XMS" instead of "MSP". For details

on the differences between the preproduction and production silicon, see XMS432P401x Rev. C

Preproduction Advisories.

To work around Advisory 1 in the document above, and as a general way to update to the latest device

BSL, TI provides a utility to download the latest BSL. This utility is available inside of TI Resource Explorer

(see Figure 13). Alternatively, the BSL can be updated by running Program_MSP432_BSL.bat in the

source files for MSP432P401R BSL update.

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Figure 13. BSL Update Utility in TI Resource Explorer

3 Software Examples

There are four software examples included with the MSP‑EXP432P401R LaunchPad development kit (see

Table 4), which can be found in the MSP‑EXP432P401R Software Examples.

Table 4. Software Examples

Demo Name BoosterPack Required Description More Details

Out-of-Box Software Example N/A The out-of-box demo programmed on the

LaunchPad development kit from the factory. Section 3.1

CC3100BOOST MQTT-Twitter

LED Control Example CC3100BOOST An IoT application demonstrating controlling an

RGB LED using Twitter through Wi-Fi Section 3.2

BOOSTXL-K350QVG-S1

Graphics Library Example BOOSTXL-K350SVG-S1

A simple example showing how to use MSP

Graphics Library (grlib) to display graphics

primitives and images and implement

touchscreen functionality

Section 3.3

430BOOST-SHARP96

Graphics Library Example 430BOOST-SHARP96 A simple example showing how to use MSP

Graphics Library (grlib) to display graphics

primitives and images Section 3.4

BOOSTXL-

BATPAKMKII_FuelGauge_

MSP432P401R BOOSTXL-BATPAKMKII Demonstrates how to initialize bq27441-G1 fuel

gauge configurations and how to control and

read data registers Section 3.5

BOOSTXL-

SENSORS_SensorGUI_

MSP432P401R BOOSTXL-SENSORS Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload Section 3.6

BOOSTXL-SENSORS_TI-

RTOS_SensorGUI_

MSP432P401R BOOSTXL-SENSORS Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload using TI-RTOS Section 3.7

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To use any of the software examples with the LaunchPad development kit, you must have an integrated

development environment (IDE) that supports the MSP432P401R device (see Table 5).

Table 5. IDE Minimum Requirements for MSP‑‑EXP432P401R

Code Composer Studio™ IDE IAR Embedded Workbench® IDE Keil™ µVision® IDE

CCS v6.1 or later IAR Embedded Workbench for ARM 7.10 or later Keil µVision MDK-ARM v5 or later

For more details on how to get started quickly and where to download the latest CCS, IAR, and Keil IDEs,

see Section 4.

3.1 Out-of-Box Software Example

This section describes the functionality and structure of the out-of-box software that is preloaded on the

EVM. The source code can be found in the MSP‑EXP432P401R Software Examples download, or more

easily accessible through MSPWare (see Section 4.3).

The out-of-box software extends a basic blink LED example to allow users to control the blink rate and

color of an RGB LED on the MSP432 LaunchPad development kit.

3.1.1 Operation

Upon powering up the out-of-box demo, the RGB LED2 blinks red at 1 Hz. Switch S1 can be tapped

repeatedly at a constant rate to set the blink frequency of LED2. Switch S2 cycles LED2 through four

different color settings: Red, Green, Blue, and random RGB color. Each color setting retains its own blink

frequency.

A PC GUI accompanies the out-of-box demo to allow user to set the color and blink rate of the RGB LED.

If not already, connect the LaunchPad development kit using the included USB cable to a computer. The

out-of-box GUI can be opened from within CCS using the TI Resource Explorer: MSPWare >

Development Tools > MSP‑EXP432P401R > Examples > Out of Box Experience GUI. A copy can also be

found in the MSP‑EXP432P401R Software Examples.

Figure 14. Out-of-Box GUI Running Locally

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The GUI can also run directly from the TI Cloud Tools (see Section 4.1.1).

Figure 15. Out-of-Box GUI Running From TI Cloud Tools

Click on the Connect button to connect to the LaunchPad development kit then open the serial COM port.

Once the connection has been established and the GUI indicates, "Target Status: Running…," you can

use the color wheel or the Red, Green, and Blue color sliders to set the color of the LaunchPad

development kit RGB LED. Changing the LED Beats Per Minute input box sets the RGB LED blink rate.

3.2 CC3100BOOST MQTT-Twitter LED Control Example

This section describes the functionality and structure of the CC3100BOOST MQTT-Twitter LED Control

demo that is included in the MSP‑EXP432P401R Software Examples download, or more easily accessible

through MSPWare (see Section 4.3).

NOTE: This CC3100BOOST MQTT-Twitter LED Control demo requires the CC3100BOOST

BoosterPack plug-in module to function properly.

This demo uses the MQTT connectivity protocol to realize a simple Internet-of-Things application that

allows user to control MSP432 LaunchPad development kit RGB LED wirelessly using Twitter tweets.

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3.2.1 Source File Structure

The project is split into multiple files (see Table 6). This makes it easier to navigate and reuse parts of it

for other projects.

Table 6. Source File and Folders

Name Description

main.c The demo's main function, shared ISRs, and so on

sl_common.h Common SimpleLink™ technology definitions

Driver: board Board specific driver including basic initializations

Driver: cli_uart Command line interface for backchannel UART communication

Driver: spi_cc3100 MSP432 SPI driver to interface CC3100

Driver: uart_cc3100 MSP432 UART driver to interface CC3100

Library: mqtt MQTT protocol library

Library: simplelink Simplelink library containing Wi-Fi APIs

Library: driverlib Device driver library (MSP432DRIVERLIB)

3.2.2 Running the Demo

In order to connect the CC3100BOOST to a wireless access point, start by modifying SSID_NAME and

PASSKEY in the #define section of main.c with your wireless access point's information. You may also

need to change SEC_TYPE depending on your access point's setting.

Next, using TI Cloud tools or offline IDEs, build and download the project to the MSP432 LaunchPad

development kit. If not already, plug the CC3100BOOST BoosterPack plug-in module onto the LaunchPad

development kit, and connect the LaunchPad development kit to your computer. The CC3100 should

automatically try to connect to the access point with the provided credentials. The LaunchPad

development kit outputs status messages through its Application/User UART COM port, which can be

viewed by opening it using terminal applications (see Section 2.3.2).

Once the CC3100 has established internet connection and successfully subscribed to the public MQTT

broker server, the LaunchPad development kit RGB LED is ready to be controlled with Twitter. Any public

tweets in the following format will change the RGB LED color on all MSP‑EXP432P401R LaunchPad

development kit running this demo:

RGB(red_value, green_value, blue_value) #MSP432LaunchPad

The color parameters can be integers ranging from 0 to 255.

Pressing the left push button S1 on the LaunchPad development kit publishes a 32-bit unique ID from the

LaunchPad development kit to the MQTT broker, which then gets tweeted by the twitter account,

@MSPLaunchPad. You may then use this 32-bit Unique ID in your tweet message to control the RGB

LED on the specific LaunchPad development kit and CC3100BOOST combination tied to that unique ID:

<32-bit unique ID> RGB(red_value, green_value, blue_value) #MSP432LaunchPad

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3.2.3 Overview of Backend Servers

Figure 16. Backend Block Diagram of CC3100BOOST MQTT-Twitter LED Control Demo

As shown in the above Figure 16, inputs from either the MSP432 LaunchPad development kit or Twitter

travel through a couple of intermediary servers before reaching the output on the opposite end. Instead of

interacting with Twitter server directly through the more resource intensive HTTP, the MSP432 LaunchPad

development kit communicates with the cloud solely through MQTT protocol. MQTT is a publish-subscribe

messaging protocol designed for lightweight M2M communications. Multiple clients sends message to one

another through a server known as a broker, and each client can publish messages to different topics and

subscribe to multiple topics. While a dedicated MQTT broker can be setup for an application, this demo

uses one of the several MQTT brokers that are freely available to the public,

http://iot.eclipse.org/sandbox.html.

Every LaunchPad development kit running the CC3100BOOST MQTT-Twitter LED Control demo

subscribes to the MQTT topic, "/msp/cc3100/demo". This is why any RGB data published to this topic will

change the LED color on all LaunchPad development kits running this demo. However, each LaunchPad

development kit also subscribes to an "<uniqueID>" topic that can be used to control LaunchPad

development kits individually.

A cloud server is also setup/maintained by the MSP Team using the IBM Bluemix cloud platform service.

This server runs a couple of Node-RED applications that interface with Twitter directly through HTTP.

After processing public tweets containing #MSP432LaunchPad, the Node-RED server also act as a MQTT

client, publishing color information to either the "/msp/cc3100/demo" or "<uniqueID>" topic, which then

gets received on subscribed LaunchPad development kits. Conversely, unique id data published by the

LaunchPad development kits to the "/msp/cc3100/demo/fromLP" topic gets received by the Node-RED

server, which then tweets a time stamped message on the Twitter account @MSPLaunchPad.

Check out IBM Bluemix to see how you can also build your own cloud application.

3.2.4 Developing With CC3100BOOST BoosterPack Plug-in Module

A SimpleLink Wi-Fi CC3100 Software Development Kit (SDK) can be downloaded at

http://www.ti.com/tool/cc3100sdk. It contains drivers, many sample applications for Wi-Fi features and

internet, and documentation needed to use the CC3100 Internet-on-a-chip™ solution.

The CC3100BOOST MQTT-Twitter LED Control Demo was developed on CC3100SDK_1.0.0. Service

pack update may be required on the CC3100BOOST with newer SDK release. Refer to the CC3100

SimpleLink Wi-Fi and IoT Solution Getting Started Guide for more information.

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3.3 BOOSTXL-K350QVG-S1 Graphics Library Example

This software is available in the MSP‑EXP432P401R Software Examples, or more easily accessible

through MSPWare (see Section 4.3).

The demo shows how to use the MSP Graphics Library http://www.ti.com/tool/msp-grlib or "grlib," in a

project with the Kentec display. This demo shows the user how to enable the touch screen, create

buttons, and use graphics primitives including colors and images.

The program begins by calibrating the touch screen. There is a routine that detects the four corner

coordinates to determine if an eligible rectangle boundary is formed. If the calibration was incorrect, a

message will display on the screen indicating the calibration failed. When successful, the calibration

provides a reference for all button presses throughout the rest of the program.

The next step is to select the mode of the program- display primitives or images. Each mode simply cycles

through without user interaction to show off features of the display. In the graphics primitives mode, the

following primitives are shown:

• Pixels

• Lines

• Circles

• Rectangles

• Text

The application is heavily commented to ensure it is very clear how to use the grlib APIs. The above

primitives are shown as well as the underlying concepts of grlib including background and foreground

colors, context, fonts, opacity, and more.

The images mode shows the drawing of a few different images both compressed and uncompressed.

Image compression can have a big impact to drawing speeds for simple images. To draw images with the

MSP Graphics Library, they must first be converted into the right file format. These files can be generated

by the Image Reformer tool that comes packaged with grlib. Launch this tool from the grlib folder or direct

from TI Resource Explorer.

• File Path: <grlib root>\utils\image-reformer\imagereformer.exe

• TI Resource Explorer > MSPWare > Libraries > Graphics Library > MSP430 Image Reformer

The Image Reformer tool allows you to import images and output into grlib specific files to add to your

grlib project. Image Reformer does not manipulate any images (such as color modifications, rotation, or

cropping), any image manipulation must be done before importing into the Image Reformer tool. More

information about MSP grlib and the Image Reformer tool can be found in Design Considerations When

Using the MSP430 Graphics Library.

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Figure 17. Importing and Converting an Image With MSP Image Reformer

3.4 430BOOST-SHARP96 Graphics Library Example

This software example is similar to the BOOSTXL-K350QVG-S1 Graphics library example. It shows how

to use the MSP Graphics Library http://www.ti.com/tool/msp-grlib or "grlib," in a project with the Sharp

96×96 display. The Sharp 96×96 display BoosterPack plug-in module does not support touch or color, it is

a simple monochrome LCD. It is a great LCD for ultra-low power display applications and has a unique

mirrored pixel display.

This demo cycles screens without user interaction to show simple graphics primitives.

• Pixels

• Lines

• Circles

• Rectangles

• Text

• Images

This demo introduces the functions to configure grlib such as initialization, color inversion, and using

foreground and background colors properly.

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3.5 BOOSTXL-BATPAKMKII_FuelGauge_MSP432P401R

This section describes the functionality and structure of the BOOSTXL-

BATPAKMKII_FuelGauge_MSP432P401R demo that is included in the MSP-EXP432P401R Software

Examples download, or more easily accessible through MSPWare (see Section 4.3).

3.5.1 Source File Structure

The project is split into multiple files (see Table 7). This makes it easier to navigate and reuse parts of it

for other projects.

Table 7. Source File and Folders

Name Description

Library: driverlib Device driver library (MSP432DRIVERLIB)

startup_msp432p401r.c MSP432™ MCU family interrupt vector table for CGT

HAL_BQ27441.c Driver for communicating with the bq27441-G1 fuel gauge

HAL_I2C.c Board specific support driver for I2C communication

HAL_UART.c Board specific driver for UART communication through Application/User UART

main.c The main function of the demo, global variables, and more

3.5.2 Running the Fuel Gauge Example

After the compiling/loading the BOOSTXL-BATPAKMKII_FuelGauge_MSP432P401R project or

downloading the pre-built firmware binary onto the MSP-EXP432P401R LaunchPad development kit,

included in the MSP-EXP432P401R Software Examples, follow the steps below to run the demo firmware.

Figure 18. Hardware Setup and Connections

1. Attach the BOOSTXL-BATPAKMKII Battery BoosterPack plug-in module to the LaunchPad

development kit.

2. Flip the switch to the "ON" position on the side of the BOOSTXL-BATPAKMKII Battery BoosterPack

plug-in module.

3. Connect the MSP-EXP432P401R LaunchPad development kit to a computer via micro-USB cable.

4. Launch a serial terminal application and connect to the COM port for "XDS110 Class Application/User

UART" at 115200 baud rate (see Figure 19 and Figure 20).

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Figure 19. Determine COM Port Number Using Device Manager on Windows

Figure 20. Example Serial Terminal Configuration

5. Press the reset button on the MSP-EXP432P401R LaunchPad development kit.

6. Observe serial data displaying Fuel Gauge configuration and Battery Information.

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Figure 21. Snapshot of Serial Terminal Connected to Running Fuel Gauge Demo

3.5.3 Firmware Overview

Refer to Quick Start Guide for bq27441-G1 and bq27441-G1 Technical Reference Manual for detailed

description of the Battery Fuel Gauge usage.

The demo program begins by initializing a number of configuration parameters in the bq27441-G1 to

match the target battery. Four important parameters are Design Capacity, Design Energy, Terminate

Voltage, and Taper Rate. Values are determined based on the target battery properties and bq27441-G1

documentations.

Next, the host MSP432P401R MCU clears the BIE (Batter Insert Enable) bit in the fuel gauge operation

configuration register. When BIE is cleared, the battery detection will rely on the host to issue a

BAT_INSERT subcommand to indicate battery presence, bypassing the J6 BIN jumper on the BOOSTXL-

BATPAKMKII BoosterPack plug-in module that the fuel gauge relies on for battery detection by default

when BIE is set (J6 shorted = Battery Inserted; J6 open = Battery Removed). This is done to ensure the

demo application works regardless if J6 is connected or not.

In end user applications, a switch or the host MCU would more likely be used control the BIN state of the

fuel gauge depending on battery connection. However, this is not implemented on the BoosterPack plug-in

module and a jumper is used to manually toggle between battery insertion and removal.

Once the bq27441-G1 has been configured properly, the main loop repeatedly reads back

DESIGN_CAPACITY, REMAINING_CAPACITY, STATE_OF_CHARGE, TEMPERATURE, VOLTAGE,

and AVERAGE_CURRENT from the fuel gauge. Results are formatted and transmitted through

Application/User UART.

3.6 BOOSTXL-SENSORS_SensorGUI_MSP432P401R

This section describes the functionality and structure of the BOOSTXL-

SENSORS_SensorGUI_MSP432P401R demo that is included in the MSP-EXP432P401R Software

Examples download, or more easily accessible through MSPWare (see Section 4.3).

www.ti.com

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3.6.1 Source File Structure

The project is split into multiple files (see Table 8). This makes it easier to navigate and reuse parts of it

for other projects.

Table 8. Source File and Folders

Name Description

msp432_startup_ccs.c MSP432™ MCU family interrupt vector table for CGT

Library: driverlib Device driver library (MSP432DRIVERLIB)

src/bme280.c Driver for communicating with the environmental sensor

src/bme280_support.c Support driver for communicating with the environmental sensor

src/bmi160.c Driver for communicating with the IMU and magnetometer sensors

src/bmi160_support.c Support driver for communicating with the IMU and magnetometer sensors

src/demo_sysctl.c Delay function for MSP432 MCU

src/i2c_driver.c Driver for I2C communication with the sensors

src/main.c The demo's main function, interrupt service routines, global variables, etc

src/opt3001.c Driver for communicating with the ambient light sensor

src/tmp007.c Driver for communicating with the infrared temperature sensor

src/uart_driver.c Driver for UART communication with the PC GUI

3.6.2 Working With the GUI

The Sensor GUI allows for quick visualizations of the sensors data and testing of applications.

3.6.2.1 Getting Started

1. Download the BOOSTXL-SENSORS_GUI+ET.zip, and extract its contents.

2. Launch BOOSTXL-SENSORS_GUI+ET.

3. Plug in your MSP432P401R LaunchPad development kit with Sensors BoosterPack into a USB port.

And click the icon in the lower left corner of the GUI.

• If needed, go to "Options" and select the proper COM Port for the Application UART and the baud

rate as 115200 (see Figure 22).

NOTE: For Windows, you can find the port number by opening Device Manager and looking for

"XDS110 Class Application/User UART" under "Ports (COM & LPT)". It will be listed as

COMnn, where nn is the number of the port.

Figure 22. Setting up COM Port Configuration for the LaunchPad™ Development Kit

4. Click "File" and click "Program Device". The Firmware should download to the LaunchPad

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development kit (see Figure 23).

Figure 23. Programming Sensor Software With the GUI

5. You should now be seeing live sensor data from the LaunchPad + BoosterPack.

3.6.2.2 Understanding the GUI

Figure 24 shows the layout of the sensor GUI.

Figure 24. Sensor GUI Layout

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(1) JSON = JavaScript Object Notation. This is the data format in which the information is sent. For more information, go to www.json.org.

The GUI contains six main elements:

1. Four sensor tiles

2. A serial monitor

3. The EnergyTrace™ software section

4. The board movement detection window

5. A menu bar

6. A status bar

The Serial Monitor lets you see the JSON (1) that is being reported back by the MCU.

The menu bar serves two functions:

• To change the serial port settings, click and then click . In the dialog, select a

port number and the baud rate, which should be 115200. To apply the settings, click "Configure".

• To program the GUI firmware to the MSP432 MCU LaunchPad development kit, click "File" and then

click "Program Device…".

The status bar indicates if the LaunchPad is connected to the PC, the port that is used, and the baud rate.

The following example indicates a connection to COM22 at 115000 baud:

. Click to disconnect the GUI:

The following example indicates a busy port on COM22:

. To connect the LaunchPad development kit to

this COM port, close any programs that are using that port, disconnect the GUI by clicking ,

disconnect and reconnect (or restart) the LaunchPad development kit, and reconnect the GUI.

3.6.2.3 Sensor Tiles

Four sensor tiles are available in the Sensor GUI for the BOOSTXL-SENSORS BoosterPack plug-in

module (see Figure 25). Each tile represents the data output for a sensor or set of integrated sensors. The

following is a brief description of each sensor tile:

The OPT3001 Ambient Light Sensor tile responds to ambient light, and displays the brightness of the

light in lux. Casting a shadow over this sensor causes the reading to decrease, and shining a light on the

sensor cause the reading to increase.

The TMP007 IR Temperature Sensor tile responds to infrared energy emitted by objects in its field of

view, displaying this in degrees Celsius. Holding a warm or cold object over the sensor causes a

response, even over short distances.

The BME280 Ambient Temperature, Relative Humidity, and Atmospheric Pressure Sensor tile

responds to atmospheric pressure in millimeters of mercury (which can be stimulated using a pressure

chamber or by lightly pressing on the sensor), relative humidity as a percentage, and ambient temperature

in degrees Celsius (both of which can be stimulated by breathing on the sensor).

The IMU tile is made up of two subtiles:

• The BMI160 Accelerometer and Gyroscope tile responds to acceleration in g (which can be

stimulated by changing the orientation of the board with respect to Earth's gravity, by shaking, or by

changing speed along an axis) and rotation in degrees per second (which can be stimulated by rotating

the board about its axes).

• The BMM150 Magnetometer tile responds to magnetic field in microtesla. This sensor can be

stimulated by changing the sensor orientation with respect to Earth's geomagnetic field or by passing a

magnet over it.

Software Examples

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Figure 25. GUI Sensor Tile

The sensor tiles all share a common set of features. With a special case being the IMU (which consists of

the BMM150 and BMI160).

1. The sensor part number

2. A hint button. Click for an animated demonstration on how to stimulate the sensors. Click again to

hide the hint.

3. A graphical and numerical read out of the sensor values.

4. A sample rate selection drop-down menu. Click to select another frequency. This is the

frequency at which the sensor is checked, which also affects the rate at which the MCU wakes from

LPM0.

5. A button to toggle the sensor on and off. Click to toggle the sensor on or off. The

current draw of each sensor's "ON" and "OFF" states can be seen in the table described in

Section 3.6.2.4, or in the EnergyTrace software hint.

The IMU tile is different from the other tiles in the following ways:

• It is made up of two parts, the BMI160 and the BMM150, each in its own box.

• Each box consists of graphs and numerical data, which are color coded to correspond to one another.

• Each part has its own sample rate selector.

• It has a hint button for each type of sensor; the accelerometer, gyroscope, and magnetometer.

The accelerometer has a display for the acceleration vector magnitude.

The ON/OFF toggle button puts the BMM150 into hibernate and the BMI160 into pedometer mode, and

only the accelerometer remains active.

www.ti.com

Software Examples

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3.6.2.4 EnergyTrace Software Function

Figure 26 shows the interface to EnergyTrace functions.

Figure 26. GUI Integrated EnergyTrace™ Measurements

This section provides monitoring of system current using TI's EnergyTrace technology. It consists of:

1. A hint button. Explains EnergyTrace software measurements and displays a table of expected sensor

currents.

2. A start button. Press this to shift any previous data down to the next time frame, clear the graph, and

begin the next measurement for the selected duration.

3. An input box. To set the duration in milliseconds, click the arrows or type a value:

4. The past three sensor settings and current measurements, with the most recent on top.

5. A graph showing the actual current draw over time. The X-axis corresponds to 0.5-ms ticks, the Y-axis

to the current in milliamps. Each peak is a good indicator of when the MCU is in active mode, and the

valleys indicate when the MCU is in LPM0.

This implementation is an abbreviated form of EnergyTrace software. The full version can track power

consumption, power mode, and more. EnergyTrace software can be used on any application through

Code Composer Studio™ IDE v6 or IAR Embedded Workbench™ IDE. For more information, visit

http://www.ti.com/tool/energytrace

3.6.2.5 Board Movement Window

Figure 27 shows the board movement section. When the "motion detection" toggle box is checked, it

responds to 10 motions (see Figure 28 through Figure 34):

• Translation along the X, Y, or Z axis

• Positive or negative rotation around the X, Y, or Z axis

• No movement

Software Examples

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Figure 27. Board Movement Window Figure 28. Translation Along the X Axis

Figure 29. Translation Along the Y Axis Figure 30. Translation Along the Z Axis

Figure 31. Rotation Around the X Axis

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Figure 32. Rotation Around the Y Axis

Figure 33. Rotation Around the Z Axis

Figure 34. No Movement

Software Examples

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With both the OPT3001 tile on and the Light Sensing toggle box checked, the image darkens, whether or

not gesture recognition is enabled (see Figure 35).

Figure 35. Light Sensing in the Gesture Recognition Window

Board movement data is updated whenever the BMI160 is sampled; that is, it follows the same frequency

as the BMI160 drop-down selection box. If motion detection is not enabled, no related calculations are

done on the microcontroller and hence no update occurs.

Similarly, light sensing data is updated whenever the OPT3001 is sampled.

3.7 BOOSTXL-SENSORS_TI-RTOS_SensorGUI_MSP432P401R

This section describes the functionality structure of the BOOSTXL-

SENSORS_TI_RTOS_SensorGUI_MSP432P401R demo that is included in the MSP-EXP432P401R

Software Examples download, or more easily accessible through MSPWare (see Section 4.3).

This example requires TI-RTOS MSP43x version 2_16_01_14 to be installed in CCS.

More information on the use of TI-RTOS can be found within the TI-RTOS User’s Guide.

3.7.1 Source File Structure

Table 9 lists the source files and folders.

Table 9. Source Files and Folders

Name Description

OS: TI-RTOS Real-Time Operating System using TI-RTOS Kernel

Library: driverlib Device driver library (MSP432DRIVERLIB)

bme280.c Driver for communicating with the environmental sensor

bme280_support.c Support driver for communicating with the environmental sensor

bmi160.c Driver for communicating with the IMU and magnetometer sensors

bmi160_support.c Support driver for communicating with the IMU and magnetometer sensors

MSP_EXP432P401R.c Driver for setting up board specific items (for example, I2C and UART)

main.c The demo’s main function, tasks, semaphores, global variables, and others

opt3001.c Driver for communicating with the ambient light sensor

tmp007.c Driver for communicating with the infrared temperature sensor

www.ti.com

Resources

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3.7.2 Working With the GUI

Collaboration with the Sensor GUI is identical to Section 3.6.2, except for programming the device directly

from the GUI. The .out file located within the GUI is specific to the BOOSTXL-

SENSORS_SensorGUI_MSP432P401R example project. To download the program, you must use a

separate IDE, such as CCS or IAR, and the BOOSTXL-SENSORS_TI_RTOS_SensorGUI_MSP432P401R

source code found within MSP-EXP432P401R Software Examples.

4 Resources

4.1 Integrated Development Environments

Although the source files can be viewed with any text editor, more can be done with the projects if they're

opened with a development environment like Code Composer Studio™ (CCS), Keil™ µVision®, IAR

Embedded Workbench®, or Energia.

4.1.1 TI Cloud Development Tools

TI's Cloud-based software development tools provide instant access to MSPWare content and a web-

based IDE.

4.1.1.1 TI Resource Explorer Cloud

TI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentation

found in MSPWare without having to download files to your local drive.

Go check out TI Resource Explorer Cloud now at dev.ti.com.

4.1.1.2 Code Composer Studio™ Cloud

Code Composer Studio Cloud is a web-based IDE that allows code edit, compile and download to devices

right from your web browser. It also integrates seamlessly with TI Resource Explorer Cloud with the ability

to import projects directly on the cloud.

A full comparison between CCS Cloud and CCS Desktop is available here.

See Code Composer Studio Cloud now at dev.ti.com.

4.1.2 Code Composer Studio™ IDE

Code Composer Studio Desktop is a professional integrated development environment that supports TI's

Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools

used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code

editor, project build environment, debugger, profiler, and many other features.

Note: MSP432 LaunchPad development kit requires CCS Version 6.1.0 or later. Refer to the Code

Composer Studio 6.1 for MSP432 User’s Guide for detailed instructions of using the IDE with MSP432.

Learn more about CCS and download it at http://www.ti.com/tool/ccstudio.

4.1.3 Keil®µVision®

The µVision IDE is an embedded project development environment included in Keil's Microcontroller

Development Kit Version 5, that provides an source code editor, project manager, and make utility tool.

µVision supports all the Keil tools including C/C++ Compiler, Macro Assembler, Linker, Library Manager,

and Object-HEX Converter.

Note: MSP432 LaunchPad development kit requires µVision IDE/MDK Version 5 or later. Refer to the

ARM Keil MDK 5 IDE for MSP432 User's Guide for detailed instructions of using the IDE with MSP432.

Learn more about Keil µVision and download it at http://www.keil.com/arm/mdk.asp.

Resources

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4.1.4 IAR Embedded Workbench®for ARM

IAR Embedded Workbench for ARM is another very powerful integrated development environment that

allows you to develop and manage complete embedded application projects. It integrates the IAR C/C++

Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IAR

C-SPY Debugger.

NOTE: The MSP432 LaunchPad development kit requires the IAR Embedded Workbench for ARM

IDE Version 7.10 or later. Refer to the IAR Embedded Workbench for ARM 7.40.2 for

MSP432 User's Guide for detailed instructions of using the IDE with MSP432.

Learn more about IAR Embedded Workbench and download it at https://www.iar.com/iar-embedded-

workbench/arm.

4.1.5 Energia

Energia is a simple open-source community-driven code editor that is based on the Wiring and Arduino

framework. Energia provides unmatched ease of use through very-high-level APIs that can be used

across hardware platforms. Energia is a light-weight IDE that does not have the full feature set of CCS,

Keil, or IAR. However, Energia is great for anyone who wants to get started very quickly or who does not

have significant coding experience.

Learn more about Energia and download it at www.energia.nu.

4.2 LaunchPad Development Kit Websites

More information about the LaunchPad development kit, supported BoosterPack plug-in modules, and

available resources can be found at:

•MSP‑EXP432P401R tool folder: Resources specific to this particular LaunchPad development kit

•TI's LaunchPad portal: Information about all LaunchPad development kits from TI

4.3 MSPWare and TI Resource Explorer

TI Resource Explorer is a tool integrated into CCS that allows you to browse through available design

resources. TI Resource Explorer will help you quickly find what you need inside packages including

MSPWare, ControlSuite, TivaWare and more. TI Resource Explorer is well organized to find everything

that you need quickly, and you can import software projects into your workspace in one click!

TI Resource Explorer Cloud is one of the TI Cloud Development tools, and is tightly integrated with CCS

Cloud. See Section 4.1.1 for more information.

MSPWare is a collection of code examples, software libraries, data sheets, and other design resources for

all MSP devices delivered in a convenient package – essentially everything developers need to become

MSP experts!

In addition to providing a complete collection of existing MSP design resources, MSPWare also includes a

high-level API called MSP Driver Library. This library makes it easy to program MSP hardware. More

information can be found at http://www.ti.com/tool/mspware.

www.ti.com

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Figure 36. Using TI Resource Explorer to Browse MSP‑‑EXP432P401R in MSPWare

Inside TI Resource Explorer, these examples and many more can be found and easily imported into CCS

with one click.

4.4 MSP432P401R

4.4.1 Device Documentation

At some point, you will probably want more information about the MSP432P401R device. For every MSP

device, the documentation is organized as shown in Table 10.

Table 10. How MSP Device Documentation is Organized

Document For MSP432P401R Description

Device family

user's guide MSP432P4xx Family Technical Reference Manual Architectural information about the device,

including all modules and peripherals such as

clocks, timers, ADC, and so on.

Device-specific

data sheet MSP432P401xx Mixed-Signal Microcontroller data sheet Device-specific information and all parametric

information for this device

4.4.2 MSP432P401R Code Examples

This is a set of very simple MSP432P401xx code examples that demonstrate how to use the entire set of

MSP432 peripherals: serial communication, ADC14, Timer_A, Timer_B, and so on. These examples show

both the direct register access and driver library methods.

Every MSP derivative has a set of these code examples. When starting a new project or adding a new

peripheral, these examples serve as a great starting point.

4.4.3 MSP432 Application Notes and TI Designs

There are many application notes that can be found at www.ti.com/msp432, as well as TI Designs with

practical design examples and topics.

Resources

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4.5 Community Resources

4.5.1 TI E2E™ Community

Search the E2E forums at e2e.ti.com. If you cannot find your answer, post your question to the

community!

4.5.2 Community at Large

Many online communities focus on the LaunchPad development kit; for example, http://www.43oh.com.

You can find additional tools, resources, and support from these communities.

5 FAQ

Q: I can't program my LaunchPad development kit; the IDE can't connect to target. What's wrong?

A: Check the following:

• Are the JTAG jumpers on J101 populated (GND, RST, TMS, TCK, TDO, TDI)

• Check for power to the target

– Are the 3V3 and GND jumpers on J101 populated and USB cable plugged in?

– If using an external debug probe, is USB power provided as shown above? Otherwise is external

power provided to the target?

• Check the debug probe settings: change to Serial Wire Debug (SWD) without SWO

– Under targetconfigs, double-click the *.ccxml file

– Click the Advanced tab at the bottom

– Click on Texas Instruments XDS110 USB Debug Probe

– Under Connection Properties, change SWD Mode Settings to Use SWD Mode with SWO Trace

Disabled

Figure 37. SWD Mode Settings

– When the settings of Port J (PJSEL0 and PJSEL1 bits) are changed, full JTAG access is prevented

on these pins. Changing to use SWD allows access through the dedicated debug pins only.

• If even this cannot connect, reset the device to factory settings

– Click View →Target Configurations. CCS shows the target configuration.

www.ti.com

FAQ

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Figure 38. Target Configurations

If using the onboard debug probe, XDS110-ET is shown.

– Right click Launch Selected Configuration.

Figure 39. Launch Selected Configuration

– The debug probe now connects to the device (which is still possible) but does not try to halt the

CPU, write to registers, or even download code (which would not be possible). The Debug view that

is spawned shows the CPU core but marks it as disconnected.

– Right click Show all cores.

FAQ

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Figure 40. Show All Cores

The MSP432 Debug Access Port, or DAP, is shown under Non Debuggable Devices.

– Right click Connect Target

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Figure 41. Connect Target

Now run a script to return the device back to factory settings:

Scripts > default > MSP432_Factory_Reset

Figure 42. MSP432_Factory_Reset Script

• These instructions are generally the same for all IDEs, but the exact steps may vary slightly by IDE.

See the following MSP432 IDE user's guides for additional details:

–Code Composer Studio 6 for MSP432 User's Guide

–Keil µVision IDE Version 5 for MSP432 User's Guide

–IAR Embedded Workbench for ARM 7.10 for MSP432 User's Guide

Q: How do I use the LaunchPad development kit and my Segger J-Link to debug the target externally? It

won't connect to the onboard connector.

A: The Segger J-Link is the only major ARM debug probe that does not come with an adapter for the 10-

pin small-pitch ARM connector. The adapter cable is found here and can be purchased from Digi-Key.

FAQ

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Q: Problems plugging the MSP432 LaunchPad development kit into a USB3.0 port.

A: It has been observed that when the MSP432 LaunchPad development kit is connected to USB3.0 ports

provided by a certain combination of USB3.0 host controller hardware and associated device drivers that

the IDE is unable to establish a debug session with the LaunchPad development kit, resulting in an error

message like "CS_DAP_0: Error connecting to the target: (Error -260 @ 0x0) An attempt to connect to the

XDS110 failed." in the case of Code Composer Studio IDE. In this case the CCS-provided low-level

command line utility ‘xdsdfu' will also not be able to establish a connection with the LaunchPad

development kit.

Specifically, this issue was observed on PCs running Windows 7 that show the "Renesas Electronics USB

3.0 Host Controller" and the associated "Renesas Electronics USB 3.0 Root Hub" in the device manager.

After updating the associated Windows USB drivers to more recent versions obtained from the hardware

vendor the issue went away. There might be other USB3.0 hardware and device driver combinations that

will lead to the same issue. If you think you might be affected try contacting your PC vendor or try locating

and installing more recent versions of the USB3.0 device drivers. Alternatively, connect the LaunchPad

development kit to an USB2.0 port on your PC if one is available.

Q: I can't get the backchannel UART to connect. What's wrong?

A: Check the following:

• Do the baud rate in the host's terminal application and the eUSCI settings match?

• Are the appropriate jumpers in place on the isolation jumper block?

• Probe on RXD and send data from the host. If you do not see data, it might be a problem on the host

side.

• Probe on TXD while sending data from the MSP432. If you do not see data, it might be a configuration

problem with the eUSCI module.

• Consider the use of the hardware flow control lines (especially for higher baud rates).

P10.1/UCB3CLK 1

P10.2/UCB3SIMO/UCB3SDA 2

P1.0/UCA0STE

P1.1/UCA0CLK

P1.2/UCA0RXD/UCA0SOMI

P1.3/UCA0TXD/UCA0SIMO

P1.4/UCB0STE

P1.5/UCB0CLK

P1.6/UCB0SIMO/UCB0SDA

P1.7/UCB0SOMI/UCB0SCL

P2.0/PM_UCA1STE

P2.1/PM_UCA1CLK

P2.2/PM_UCA1RXD/PM_UCA1SOMI

P2.3/PM_UCA1TXD/PM_UCA1SIMO

P2.4/PM_TA0.1

P2.5/PM_TA0.2

P2.6/PM_TA0.3

P2.7/PM_TA0.4

P3.0/PM_UCA2STE

P3.1/PM_UCA2CLK

P3.2/PM_UCA2RXD/PM_UCA2SOMI

P3.3/PM_UCA2TXD/PM_UCA2SIMO

P3.4/PM_UCB2STE

P3.5/PM_UCB2CLK

P3.6/PM_UCB2SIMO/PM_UCB2SDA

P3.7/PM_UCB2SOMI/PM_UCB2SCL

P4.0/A13

P4.1/A12

P4.2/ACLK/TA2CLK/A11

P4.3/MCLK/RTCCLK/A10

P4.4/HSMCLK/SVMHOUT/A9

P4.5/A8

P4.6/A7

P4.7/A6

P5.0/A5

P5.1/A4

P5.2/A3

P5.3/A2

P5.4/A1

P5.5/A0

P5.6/TA2.1/VREF+/VEREF+/C1.7

P5.7/TA2.2/VREF-/VEREF-/C1.6

P6.0/A15

P6.1/A14

P6.2/UCB1STE/C1.5

P6.3/UCB1CLK/C1.4

P6.4/UCB1SIMO/UCB1SDA/C1.3

P6.5/UCB1SOMI/UCB1SCL/C1.2

P6.6/TA2.3/UCB3SIMO/UCB3SDA/C1.1

P6.7/TA2.4/UCB3SOMI/UCB3SCL/C1.0

P10.3UCB3SOMI/UCB3SCL 3

P9.7/UCA3TXD/UCA3SIMO 99

P9.6/UCA3RXD/UCA3SOMI 98

P9.5/UCA3CLK 97

P9.4/UCA3STE 96

P9.3/TA3.4 75

P9.2/TA3.3 74

P9.1/A16 53

P9.0/A17 52

P8.7/A18 51

P8.6/A19 50

P8.5/A20 49

P8.4/A21 48

P8.3/TA3CLK/A22 47

P8.2/TA3.2/A23 46

P8.1/UCB3CLK/TA2.0/C0.0 31

P8.0/UCB3STE/TA1.0/C0.1 30

P7.0/PM_SMCLK/PM_DMAE0

P7.1/PM_C0OUT/PM_TA0CLK

P7.2/PM_C1OUT/PM_TA1CLK

P7.3/PM_TA0.0

P7.4/PM_TA1.4/C0.5

P7.5/PM_TA1.3/C0.4

P7.6/PM_TA1.2/C0.3

P7.7/PM_TA1.1/C0.2

DVSS3 82

SWDIOTMS 94

PJ.5/TDO/SWO 93

PJ.4/TDI/ADC14CLK 92

PJ.3/HFXIN 86

PJ.2/HFXOUT 85

PJ.1/LFXOUT 42

PJ.0/LFXIN 41

SWCLKTCK 95

AVSS3 40

RSTN/NMI 83

DCOR 44

DVSS2 72

DVSS1 15

AVSS2 84

AVSS1 43

AVCC2 87

AVCC1 45

DVCC2 73

DVCC1 13

VCORE 12

VSW 14

P10.5/TA3.1/C0.6 25

P10.4/TA3.0/C0.7 24

P10.0/UCB3STE 100

1 2

1 3

1 2 3 4 5 6

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Schematics

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6 Schematics

Figure 43. Schematics (1 of 6)

S1 S2

G2G1

S1 S2

G2G1

S1 S2

G2G1

1 2 3 4 5 6

Schematics

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Figure 44. Schematics (2 of 6)

37 38 38

36 36

34 34

32 32

30 30

28 28

26 26

24 24

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20 20

18 18

16 16

14 14

12 12

10 10

14 13

12 11

10 9

8 7

6 5

4 3

2 1

20 19

18 17

16 15

1 2

3 4

5 6

7 8

9 10

1 2

3 4

5 6

7 8

9 10

1 2 3 4 5 6

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Schematics

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Figure 45. Schematics (3 of 6)

PA0

P$33

PA1

P$34

PA2

P$35

PA3

P$36

PA4

P$37

PA5

P$38

PA6

P$40

PA7

P$41

PB0 P$95

PB1 P$96

PB2 P$91

PB3 P$92

PB4 P$121

PB5 P$120

PC0

P$100

PC1

P$99

PC2

P$98

PC3

P$97

PC4

P$25

PC5

P$24

PC6

P$23

PC7

P$22

PD0 P$1

PD1 P$2

PD2 P$3

PD3 P$4

PD4 P$125

PD5 P$126

PD6 P$127

PD7 P$128

PE0

P$15

PE1

P$14

PE2

P$13

PE3

P$12

PE4

P$123

PE5

P$124

PF0 P$42

PF1 P$43

PF2 P$44

PF3 P$45

PF4 P$46

PG0

P$49

PG1

P$50 PH0 P$29

PH1 P$30

PH2 P$31

PH3 P$32

PJ0

P$116

PJ1

P$117

PK0

P$18

PK1

P$19

PK2

P$20

PK3

P$21

PK4

P$63

PK5

P$62

PK6

P$61

PK7

P$60

PL0 P$81

PL1 P$82

PL2 P$83

PL3 P$84

PL4 P$85

PL5 P$86

PL6 P$94

PL7 P$93

PM0

P$78

PM1

P$77

PM2

P$76

PM3

P$75

PM4

P$74

PM5

P$73

PM6

P$72

PM7

P$71

PN0 P$107

PN1 P$108

PN2 P$109

PN3 P$110

PN4 P$111

PN5 P$112

PP0

P$118

PP1

P$119

PP2

P$103

PP3

P$104

PP4

P$105

PP5

P$106

PQ0 P$5

PQ1 P$6

PQ2 P$11

PQ3 P$27

PQ4 P$102

HIB P$65

RESET

P$70

WAKE P$64

EN0RXIN

P$53

EN0RXIP

P$54

EN0TXON

P$56

EN0TXOP

P$57

GND

P$17

GND

P$48

GND

P$55

GND

P$58

GND

P$80

GND

P$114

GNDA

P$10

OSC0

P$88

OSC1

P$89

RBIAS

P$59

VBAT P$68

VDD P$7

VDD P$16

VDD P$26

VDD P$28

VDD P$39

VDD P$47

VDD P$51

VDD P$52

VDD P$69

VDD P$79

VDD P$90

VDD P$101

VDD P$113

VDD P$122

VDDA P$8

VDDC P$87

VDDC P$115

VREFA+ P$9

XOSC0

P$66

XOSC1

P$67

OSC0

1NC 2

OSC1 3

NC2

NC_2

NC_3 4

NC 5

1 2 3 4 5 6

Schematics

www.ti.com

48 SLAU597B–March 2015–Revised July 2016

Submit Documentation Feedback

MSP432P401R LaunchPad™ Development Kit (MSP

‑

EXP432P401R)

Figure 46. Schematics (4 of 6)

7 10

8 9

1GND 2

IN2

3OUT 4

IN1

1 2 3 4 5 6

www.ti.com

Schematics

SLAU597B–March 2015–Revised July 2016

MSP432P401R LaunchPad™ Development Kit (MSP

‑

EXP432P401R)

Figure 47. Schematics (5 of 6)

OUT 1

NC0 2

GND

NC1 6

NC2 7

PAD

IO1

IO2

GND

3IO3 4

IO4 5

VCC 6

D+

D-

GND

VBUS

1 2 3 4 5 6

Schematics

www.ti.com

50 SLAU597B–March 2015–Revised July 2016

Submit Documentation Feedback

MSP432P401R LaunchPad™ Development Kit (MSP

‑

EXP432P401R)

Figure 48. Schematics (6 of 6)

www.ti.com

Revision History

SLAU597B–March 2015–Revised July 2016

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from July 21, 2015 to July 12, 2016 .................................................................................................................. Page

• Changed Figure 1,MSP

‑

EXP432P401R LaunchPad™ Development Kit......................................................... 1

• Added last three list items in Section 1.3.2,Software Examples ................................................................... 4

• Changed Figure 5,XDS110-ET Debug Probe ........................................................................................ 7

• Changed first paragraph in Section 2.3.1,XDS110-ET Isolation Block J101 ..................................................... 7

• In Table 1,Isolation Block Connections: removed Isolation Type column, removed RTS and CTS rows, removed notes,

added GND row ........................................................................................................................... 7

• Changed Figure 6,XDS110-ET Isolation Block....................................................................................... 8

• Removed the sentence that started "The provided UART supports hardware flow control..." from the first paragraph of

Section 2.3.2,Application (or "Backchannel") UART................................................................................. 8

• Removed the paragraph that started "The XDS110-ET also supports hardware flow control..." in Section 2.3.2,Application

(or "Backchannel") UART ................................................................................................................ 9

• Changed the first paragraph and all steps in Section 2.3.3,Using an External Debug Probe Instead of the Onboard

XDS110-ET............................................................................................................................... 10

• Updated all contents of Section 2.3.4,Using the XDS110-ET Emulator With a Different Target............................. 10

• Changed Figure 10,MSP

‑

EXP432P401R Power Block Diagram................................................................. 13

• Changed Figure 11,LaunchPad™ Development Kit to BoosterPack™ Plug-in Module Connector Pinout ................. 16

• Added the paragraph that starts "Do you have an older version..." in Section 2.8.1,Hardware Design Files .............. 16

• Added the paragraph that starts "Do you have an older version..." in Section 2.8.2,Software Examples .................. 17

• Added row for "Rev 2.0" and added two columns on right to Table 3,Hardware Change Log ............................... 17

• Added Section 2.9.1,MSP-EXP432P401R Rev 1.0 (Black) LaunchPad Development Kit.................................... 17

• Added Section 2.9.2,MSP-EXP432P401R Rev 2.0 (Red) LaunchPad Development Kit...................................... 17

• Added the last three rows to Table 4,Software Examples......................................................................... 19

• Added Section 3.5,BOOSTXL-BATPAKMKII Fuel Gauge Example ............................................................. 26

• Added Section 3.6,BOOSTXL-SENSORS Sensor GUI Example ................................................................ 28

• Added Section 3.7,BOOSTXL-SENSORS Sensor GUI With TI-RTOS Example............................................... 36

• Changed Figure 36,Using TI Resource Explorer to Browse MSP

‑

EXP432P401R in MSPWare............................. 39

• Changed the first two list items in the answer to the FAQ that starts "I can't program my LaunchPad development kit..." in

Section 5,FAQ........................................................................................................................... 40

• Removed the FAQ that started "Q: Why doesn't the back-channel UART ..."................................................... 43

• Changed all figures in Section 6,Schematics ....................................................................................... 45

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MSP432P401R LaunchPad™ Development Kit (MSP‑EXP432P401R) (Rev. B) Launch Pad Users Guide

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