MSP430FR5994 LaunchPad Development Kit (MSP EXP430FR5994) User's Guide (Rev. A) MSP430 Users

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User's Guide
SLAU678A – March 2016 – Revised April 2016

MSP430FR5994 LaunchPad™ Development Kit
(MSP‑EXP430FR5994)

The MSP-EXP430FR5994 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) for
the MSP430FR5994 microcontroller (MCU). It contains everything needed to start developing on the ultralow-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for programming,
debugging, and energy measurements. Figure 1 shows the development kit.

Figure 1. MSP-EXP430FR5994 LaunchPad Development Kit

LaunchPad, BoosterPack, Code Composer Studio, MSP430, EnergyTrace++, EnergyTrace, E2E are trademarks of Texas Instruments.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
All other trademarks are the property of their respective owners.
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Contents
Getting Started ............................................................................................................... 3
Hardware...................................................................................................................... 5
Software Examples ........................................................................................................ 16
Resources ................................................................................................................... 25
FAQ .......................................................................................................................... 32
Schematics .................................................................................................................. 33

MSP-EXP430FR5994 LaunchPad Development Kit .................................................................... 1

MSP-EXP430FR5994 Overview ........................................................................................... 5

MSP-EXP430FR5994 Block Diagram ..................................................................................... 6

MSP430FR5994 Pinout ..................................................................................................... 7

eZ-FET Debug Probe

eZ-FET Isolation Jumper Block Diagram................................................................................ 10

Application Backchannel UART in Device Manager ................................................................... 10

MSP-EXP430FR5994 Power Block Diagram ........................................................................... 12

MSP-EXP430FR5994 Super Cap Power Block Diagram ............................................................. 13

BoosterPack Plug-in Module Checker Tool ............................................................................. 15

LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout .................................. 16

MSP-EXP430FR5994 Out-of-Box Demo GUI .......................................................................... 18

Live Temperature Mode ................................................................................................... 19

FRAM Log Mode ........................................................................................................... 20

Record ....................................................................................................................... 22

Playback ..................................................................................................................... 23

Alternate Microphone Configuration ..................................................................................... 24

EEPROM SPI Interface Block Diagram ................................................................................. 25

EEPROM I2C Interface Block Diagram .................................................................................. 25

TI Resource Explorer Cloud .............................................................................................. 26

CCS Cloud .................................................................................................................. 27

Directing the Project>Import Function to the Demo Project .......................................................... 28

When CCS Has Found the Project

List of Figures

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.......................................................................................................

......................................................................................
Using TI Resource Explorer to Browse MSP-EXP430FR5994 in MSPWare.......................................
Schematics (1 of 7) ........................................................................................................
Schematics (2 of 7) ........................................................................................................
Schematics (3 of 7) ........................................................................................................
Schematics (4 of 7) ........................................................................................................
Schematics (5 of 7) ........................................................................................................
Schematics (6 of 7) ........................................................................................................
Schematics (7 of 7) ........................................................................................................

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Getting Started

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Getting Started

1.1

Introduction
The MSP-EXP430FR5994 LaunchPad development kit is an easy-to-use evaluation module (EVM) for the
MSP430FR5994 microcontroller (MCU). The LaunchPad development kit contains everything needed to
start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard
debug probe for programming, debugging and energy measurements. The board features onboard buttons
and LEDs for quick integration of a simple user interface, a microSD card port to interface with microSD
cards, and a super capacitor (super cap) to enable stand-alone applications without an external power
supply.
The MSP430FR5994 MCU features 256KB of embedded FRAM (Ferroelectric Random Access Memory),
a nonvolatile memory known for its ultra-low power, high endurance, and high speed write access. The
device also features 8 KB of SRAM, supports CPU speeds of up to 16 MHz and has integrated
peripherals for communication, ADC, timers, AES encryption, low-energy accelerator (LEA) (a new
hardware module for the FRAM family that is designed for fast, efficient, and low-power vector math), and
more–plenty to get you started in your development.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack modules. Quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or
choose among many already available from TI and third-party developers.
Free software development tools are also available, such as the TI Eclipse-based Code Composer
Studio™ IDE (CCS) and the IAR Embedded Workbench® for MSP430™ IDE (EW430). Both of these IDEs
support EnergyTrace++™ technology for real-time power profiling and debugging when paired with the
MSP430FR5994 LaunchPad kit.

1.2

Key Features
•
•
•
•
•
•
•

MSP ULP FRAM technology based MSP430FR5994 16-bit MCU
EnergyTrace++ Technology available for ultra-low-power debugging
40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
Onboard eZ-FET debug probe
Two buttons and two LEDs for user interaction
Onboard microSD card
Super capacitor (0.22 F)

1.3

What's Included

1.3.1

Kit Contents
• 1xMSP-EXP430FR5994 LaunchPad Development Kit
• 1xMicro USB cable
• 1xQuick start guide

1.3.2
•
•
•
•
•

Software Examples
Out-of-box software
Blink LED
Audio BoosterPack plug-in module record and playback
Low-energy accelerator for signal processing
EEPROM emulation

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Getting Started

1.4

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First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features from a user level.

1.4.1

Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends installing the drivers by
installing an IDE such as TI CCS or IAR EW430. Drivers are also available at ti.com/MSPdrivers.

1.4.2

Running the Out-of-Box Demo
When connected to the computer, the LaunchPad development kit powers up. Press and hold the S1 and
S2 buttons simultaneously to select a new mode. See Section 3.1 for a detailed explanation of each
mode.

1.4.2.1

Live Temperature Mode

This mode provides live temperature data streaming to the PC GUI. You can influence the temperature of
the device and see changes on the GUI.
1.4.2.2

FRAM Data Log Mode

This mode shows the FRAM data logging capabilities of the MSP430FR5994. After starting this mode, the
LaunchPad development kit wakes up every five seconds from sleep mode (indicated by LED blink) to log
both temperature and input voltage values. After reconnecting to the GUI, these values can be uploaded
and graphed in the GUI.
1.4.2.3

SD Card Data Log Mode

This mode shows the data logging capabilities of the MSP430FR5994 while interfacing with an SD card.
After starting this mode, the LaunchPad development kit wakes up every five seconds from sleep mode
(indicated by LED blink) to log both temperature and input voltage values. After reconnecting to the GUI,
these values can be uploaded and graphed in the GUI.

1.5

Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It's time to open an integrated
development environment and start editing the code examples. See Section 4 for available IDEs and
where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development
Tools. The cloud-based Resource Explorer provides access to all of the examples and resources in
MSPWare. Code Composer Studio Cloud is a simple cloud-based IDE that enables developing and
running applications on the LaunchPad development kit.
The out-of-box source code and more code examples are provided and available on the download page.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the
code.
With the onboard eZ-FET debug probe debugging and downloading new code is simple. A USB
connection between the EVM and a PC through the provided USB cable is all that is needed.

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Hardware
Figure 2 shows an overview of the MSP-EXP430FR5994 hardware.

Figure 2. MSP-EXP430FR5994 Overview

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Block Diagram
Figure 3 shows the block diagram.
Micro-B
USB

LED
red, green

ESD
protection

Crystal
4 MHz

Debug
MCU

EnergyTrace

UART, SBW to target

Power to target

3.3-V
LDO

Reset
button

Super capacitor

Crystal
32.768 kHz

User interface
2 buttons, 2 LEDs

Target device
MSP430FR5994

40-pin LaunchPad
standard headers

microSD Card

Figure 3. MSP-EXP430FR5994 Block Diagram

2.2
2.2.1

Hardware Features
MSP430FR5994 MCU
The MSP430FR5994 is the next device in TI's new ULP FRAM technology platform. FRAM is a cuttingedge memory technology that combines the best features of flash and RAM into one nonvolatile memory.
For more information on FRAM, see www.ti.com/fram.
Device features include:
• 1.8-V to 3.6-V operation
• 16-bit RISC architecture up to 16-MHz system clock and 8-MHz FRAM access
• 256KB of FRAM and 8KB of SRAM
• 16-channel 12-bit ADC
• 16-channel analog comparator
• Six 16-bit timers with seven capture/compare registers each
• 6-channel direct memory access (DMA)
• 128-bit or 256-bit AES
• 32-bit hardware multiplier (MPY)
• 68 GPIOs

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DVCC1

P2.7

P2.3/TA0.0/UCA1STE/A6/C10

P5.4/UCA2TXD/UCA2SIMO/TB0OUTH

P2.4/TA1.0/UCA1CLK/A7/C11

P5.5/UCA2RXD/UCA2SOMI/ACLK

P5.6/UCA2CLK/TA4.0/SMCLK

P5.7/UCA2STE/TA4.1/MCLK

P6.4/UCB3SIMO/UCB3SDA

P6.5/UCB3SOMI/UCB3SCL

P6.6/UCB3CLK

AVSS3

P6.7/UCB3STE

PJ.6/HFXIN

AVSS2
PJ.7/HFXOUT

PJ.4/LFXIN

AVSS1

PJ.5/LFXOUT

AVCC1

Figure 4 shows the pinout of the MSP430FR5994 MCU in the 80-pin PN package.

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61

P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-

P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+

DVSS1
P4.6

P1.2/TA1.1/TA0CLK/COUT/A2/C2

P4.5

P3.0/A12/C12

P4.4/TB0.5

P3.1/A13/C13

P5.3/UCB1STE

P3.2/A14/C14

P5.2/UCB1CLK/TA4CLK

P3.3/A15/C15
P6.0/UCA3TXD/UCA3SIMO

P5.1/UCB1SOMI/UCB1SCL

P5.0/UCB1SIMO/UCB1SDA

P6.1/UCA3RXD/UCA3SOMI

P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0

P6.2/UCA3CLK

P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0

P6.3/UCA3STE

P3.7/TB0.6

P4.7

P3.6/TB0.5

P7.0/UCB2SIMO/UCB2SDA

P3.5/TB0.4/COUT

P7.1/UCB2SOMI/UCB2SCL

P3.4/TB0.3/SMCLK

P8.0

P8.3

P1.3/TA1.2/UCB0STE/A3/C3

P8.2

P1.4/TB0.1/UCA0STE/A4/C4

P8.1

P1.5/TB0.2/UCA0CLK/A5/C5

P2.2/TB0.2/UCB0CLK

DVSS2

P2.1/TB0.0/UCA0RXD/UCA0SOMI

DVCC2

20
41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK

DVCC3

DVSS3

RST/NMI/SBWTDIO

TEST/SBWTCK

P2.6/TB0.1/UCA1RXD/UCA1SOMI

P2.5/TB0.0/UCA1TXD/UCA1SIMO

P4.3/A11

P4.2/A10

P4.1/A9

P4.0/A8

P7.7/A19

P7.6/A18

P7.5/A17

P7.4//TA4.0/A16

P7.3/UCB2STE/TA4.1

P7.2/UCB2CLK

PJ.3/TCK/SRCPUOFF/C9

PJ.2/TMS/ACLK/SROSCOFF/C8

PJ.1/TDI/TCLK/MCLK/SRSCG0/C7

PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6

MSP430FR59xxPN

Figure 4. MSP430FR5994 Pinout

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eZ-FET Onboard Debug Probe With EnergyTrace++ Technology
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The MSP-EXP430FR5994 has the
eZ-FET debug probe (see Figure 5), which is a simple and low-cost debugger that supports all MSP430
device derivatives.

Figure 5. eZ-FET Debug Probe
The MSP-EXP430FR5994 LaunchPad development kit features full EnergyTrace++ technology. The
EnergyTrace™ functionality varies across the MSP portfolio (see Table 1).
Table 1. EnergyTrace Technology
Features
Current Monitoring

EnergyTrace™ Technology

EnergyTrace++™ Technology

✓

✓
✓

CPU State

✓

Peripheral and System State
Devices Supported
Development Tool Required

All MSP430 MCUs

FR59 and FR69 MCUs

MSP-FET or eZ-FET

In Figure 5, the dotted line through J101 divides the eZ-FET debug probe from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. For more
details on the isolation jumper block, see Section 2.2.3.
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. For more details, see Section 2.2.4.
Details of the eZ-FET hardware can be found in the schematics in Section 6 and in the hardware design
files download page. The software and more information about the debugger can be found on the eZ-FET
wiki.

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2.2.3

Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 can connect or disconnect signals that cross from the eZ-FET
domain into the MSP430FR5994 target domain. This includes eZ-FET Spy-Bi-Wire signals, application
UART signals, and 3.3-V and 5-V power (see Table 2 and Figure 6).
Reasons to open these connections:
• To remove any and all influence from the eZ-FET debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard MCU.
Table 2. Isolation Block Connections
Jumper
GND

Description
Ground

5-V VBUS from USB

3V3

3.3-V rail, derived from VBUS in the eZ-FET domain

RXD <<

Backchannel UART: The target FR5994 receives data through this signal. The arrows indicate the direction of the
signal.

TXD >>

Backchannel UART: The target FR5994 sends data through this signal. The arrows indicate the direction of the
signal.

SBW RST

Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).

SBW TST

Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.

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USB Connector

USB

eZ-FET

eZ-FET Debug
Probe

out
LDO

EnergyTrace

Target MSP430 MCU

BoosterPack Header

Spy-Bi-Wire (SBW)
Emulation

Application UART

3.3-V Power

BoosterPack Header

MSP430 Target

5-V Power

Isolation
Jumper Block

Figure 6. eZ-FET Isolation Jumper Block Diagram

2.2.4

Application (or Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is very useful during development, and also provides a communication channel to
the PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the
PC that communicate with the LaunchPad development kit.
Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on
eUSCI_A0. This UART channel is separate from the UART on the 40-pin BoosterPack plug-in module
connector (eUSCI_A3).
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with
COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and
communicate with the target application. You need to identify the COM port for the backchannel. On
Windows PCs, Device Manager can assist (see Figure 7).

Figure 7. Application Backchannel UART in Device Manager
10

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The backchannel UART is the MSP Application UART1 (COM13) port. In this case, Figure 7 shows
COM13, but this port can vary from one host PC to the next. Identify the correct COM port and configure it
in the host application according to its documentation. Then open the port and begin communication to it
from the host.
On the target MSP430FR5994 side, the backchannel is connected to the eUSCI_A0 module. The eZ-FET
has a configurable baud rate; therefore, it is important that the PC application configures the baud rate to
be the same as what is configured on the eUSCI_A0.
2.2.5

Special Features

2.2.5.1

microSD Card

The MSP430FR5994 LaunchPad development kit features an onboard microSD card. With an SD card,
there is another method of cheap data logging available for users. The Out-Of-Box experience comes with
an SD Card Library that helps users interface the MSP430FR5994 with the SD Card. The library lets users
store data in files with a name of their choice, so that the data can be used later in conjunction with a PC.
The slot can detect if a card is present. If a card is inserted while the MSP430FR5994 is on, an interrupt
for the MCU is generated. Table 3 lists the SD Card Detect pin and the rest of the pin assignments that
are used to communicate with the SD card.
Table 3. microSD Card to MSP Connections
microSD Card Function

MSP430FR5994 Pin

SD Card Detect

P7.2

SD SPI MOSI

P1.6

SD SPI MISO

P1.7

SD SPI CS

P4.0

SD SPI CLK

P2.2

R7 on the MSP430FR5994 LaunchPad development kit is not populated on the board to ensure accurate
LPM current measurements. Use the internal MSP pullup resistor in software, or populate R7.
R5 is also not populated. In the SD Card library, the SPI CS line is driven high or low. Often why a pullup
resistor like R5 is included is for during system startup. Before the MSP430FR5994 fully starts and outputs
a high signal on the CS line, it is possible that CS may be floating, and the SD card may interpret other
floating SPI lines as communication. It is a good practice to populate this resistor in an application where
the exact startup conditions are not controlled. For the LaunchPad development kit, this resistor is
removed for precise current measurements when all GPIO are set low.
2.2.5.2

220-mF Super Capacitor

A 220-mF (0.22-F) capacitor is mounted onboard and allows powering the system without any external
power. The super cap can be used in the following ways: charging, using (direct connection to 3V3 rail),
and disconnected. For more details on these use modes and how to use them, see Section 2.3.

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Power
The board is designed to accommodate various powering methods, including through the onboard eZ-FET
and external or BoosterPack plug-in module power (see Figure 8).

Figure 8. MSP-EXP430FR5994 Power Block Diagram

2.3.1

eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For
3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.

2.3.2

BoosterPack Plug-in Module and External Power Supply
Header J6 on the board supplies external power directly. Comply with the device voltage operation
specifications when supplying external power. The MSP430FR5994 has an operating range of 1.8 V to 3.6
V. More information can be found in the MSP430FR5994 data sheet.

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Figure 9. MSP-EXP430FR5994 Super Cap Power Block Diagram

2.3.3

Super Cap (C1)
A 220-mF (0.22-F) super cap is mounted onboard and allows powering the system without any external
power. This demonstrates the ultra-low power of the MSP430FR5994 target MCU. See how long you can
run your application on the super cap alone!

2.3.3.1

Charging the Super Cap

The super cap can be charged when the EVM is plugged into the PC or when the board is externally
powered. During charging, set J8 to the Charge setting, which adds a current limiting resistor for charging.
To charge the super cap, power must be coming from the eZ-FET debug probe, external power through
J5, or a BoosterPack plug-in module powering through J1. Allow two to three minutes for the super cap to
charge (time may vary depending on initial charge of the super cap and the power source) to full VCC.
2.3.3.2

Using the Super Cap

After charging of the super cap, move the J8 jumper to the Use setting and unplug power. This connects
the super cap to the 3V3 rail without the charging resistor. Now, the LaunchPad development kit is being
powered completely by the C1 super capacitor.
For the lowest-power operation, make sure to disconnect the J101 jumpers and remove the microSD card
if it is not in use. Removing J101 jumpers prevents the super cap from powering the eZ-FET circuitry and
consuming additional power. The microSD card has approximately 100 µA of current draw just being
plugged into the system, even when not in use. Taking these steps allows your application to be powered
longer from only the super cap.
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Disabling the Super Cap

The super cap can be completely decoupled from the board by removing the J8 jumper. Hang this jumper
off only one pin to prevent losing the jumper.

2.4

Measure MSP430 Current Draw
To measure the current draw of the MSP430FR5994 using a multimeter, use the 3V3 jumper on the J101
jumper isolation block. The current measured includes the target device and any current drawn through
the BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
• Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
• Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR5994 may
have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider
their current sinking and sourcing capability in the final measurement.
• Make sure there are no floating inputs or outputs (I/Os) on the MSP430FR5994. These cause
unnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should be
pulled or driven to a high or low level.
• Begin target execution.
• Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
Alternatively, EnergyTrace++ technology can be used to measure the same current, and see energy
profiles through integrated GUI in CCS and IAR. EnergyTrace allows you to compare various current
profiles and better optimize the energy performance.

2.5

Clocking
The MSP-EXP430FR5994 provides external clocks in addition to the internal clocks in the device.
• Q1: 32-kHz Epson crystal (FC-135R)
• Q2: DNP high-frequency crystal footprint
The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources.
Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The high-frequency crystal is not populated by default, but the footprint for a crystal is provided. Populate
a high-frequency crystal for applications that need more precise high-frequency clock sources than the
internal DCO.
The internal clocks in the device default to the following configuration:
• MCLK: DCO 1 MHz
• SMCLK: DCO 1 MHz
• ACLK: REFO 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User's Guide.

2.6

Using the eZ-FET Debug Probe With a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 derivative
devices, not just the onboard MSP430FR5994 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the debug
probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. Note that to be compatible with SBW,
the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
JTAG interface circuitry is the MSP430 Hardware Tools User's Guide.
Finally, wire together these signals from the debug probe side of the isolation jumper block to the target
hardware:

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•
•
•
•
•
•
•

5 V (if 5 V is needed)
3.3 V
GND
SBWTDIO
SBWTCK
TXD (if the UART backchannel is to be used)
RXD (if the UART backchannel is to be used)

This wiring can be done either with jumper wires or by designing the board with a connector that plugs into
the isolation jumper block.

2.7

BoosterPack Plug-in Module Pinout
This LaunchPad development kit complies with the 40-pin LaunchPad development kit pinout standard.
This standard was created to aid compatibility between LaunchPad development kits and BoosterPack
plug-in modules across the TI ecosystem.
The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad development
kit like the MSP-EXP430FR4133. This allows some subset of functionality of 40-pin BoosterPack plug-in
modules to be used with 20-pin LaunchPad development kits.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSPEXP430FR5994 LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in module that
comply with the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly
indicate compatibility with the MSP-EXP430FR5994 LaunchPad development kit, compare the schematic
of the candidate BoosterPack plug-in module with the LaunchPad development kit to ensure compatibility.
Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR5994 MCU pin
function configuration in software.
To check the compatibility of your desired BoosterPack plug-in module for your design, with a LaunchPad
development kit of your choice, you can use the BoosterPack Checker tool (see Figure 10). This allows
you to select any LaunchPad development kit we offer and determine its compatibility with any number of
BoosterPack plug-in module that we offer. You can also add your own BoosterPack plug-in module to
check its compatibility as you prototype that next design.

Figure 10. BoosterPack Plug-in Module Checker Tool
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Figure 11 shows the 40-pin pinout of the MSP430FR5994 LaunchPad development kit.
Software configuration of the pin functions plays a role in compatibility. The LaunchPad development kit
side of the dashed line shows only the applicable function for conforming to the standard. However, each
pin has other functionality that can be configured by the software. See the MSP430FR5994 data sheet for
more details on individual pin functions.

Figure 11. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout

2.8
2.8.1

Design Files
Hardware
See Section 6 for schematics. All design files including schematics, layout, bill of materials (BOM), Gerber
files, and documentation are available on the MSP-EXP430FR5994 Design File Download Page.

2.8.2

Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available on the MSP-EXP430FR5994 Design File Download Page.

2.9

Hardware Change Log
Table 4 lists the change history for all released hardware revisions.
Table 4. Hardware Change Log
PCB Revision
Rev 1.1

Description
Initial Release

Software Examples
Software examples are included with the MSP430FR5994 LaunchPad development kit (see Table 5), and
can be found in the MSP430FR5994 LaunchPad development kit Download Page and are also available
in MSPWare.

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Table 5. Software Examples
Demo Name

BoosterPack Required

Description

More Details

OutOfBox_FR5994

None

The out-of-box demo pre-programmed on the LaunchPad
from the factory. Demonstrates features of
MSP430FR5994 MCU.

BlinkLED_FR5994

None

Blinks an LED on the LaunchPad at a fixed interval.

Section 3.2

Section 3.1

BOOSTXL-AUDIO_
RecordPlayback_
MSP430FR5994

• MSPEXP430FR5994
• BOOSTXL-AUDIO

Demonstrates how to record and playback audio from
FRAM memory using DMA.

Section 3.3

BOOSTXL-AUDIO_
LEA_MSP430FR5994

• MSPEXP40FR5994
• BOOSTXL-AUDIO
• 430BOOSTSHARP96

Demonstrates the performance of the MSP low-energy
accelerator (LEA) by performing FFT and FIR.

Section 3.4

EEPROM Emulation
TI Design

• MSPEXP40FR5994

Emulates EEPROM using FRAM technology on MSP
supporting both I2C and SPI

Section 3.5

To use any of the software examples with the LaunchPad kit, you must have an integrated development
environment (IDE) that supports the MSP430FR5994 MCU. Table 6 lists the minimum requirements for
IDEs.
Table 6. IDE Minimum Requirements for MSP-EXP430FR5994
Code Composer Studio™ IDE

IAR Embedded Workbench® IDE

CCS v6.1.3 or later

IAR Embedded Workbench for MSP430 v6.30 or later

For more details on how to get started quickly, and where to download the latest CCS and IAR IDEs, see
Section 4.

3.1

Out-of-Box Software Example
This section describes the functionality and structure of the out-of-box software that is preloaded on the
EVM.

3.1.1

Source File Structure
The project is organized in multiple files. This organization makes it easier to navigate and to reuse parts
of it for other projects. Table 7 describes each file in the project
Table 7. Source File and Folders
Name

Description

main.c

The out-of-box demo main function, initializations, shared ISRs, and more

LiveTempMode.c

Contains functions for the live temperature streaming mode

FRAMLogMode.c

Contains functions for the FRAM data logging mode

SDCardLogMode.c

Contains function for the SD card data logging mode

Library: Driverlib

Device driver library

Library: FatFs

Generic FAT file system module for small embedded systems (FatFs)

HAL/HAL_SDCard.c

Hardware abstraction layer for board/device to SD card connection

Library: SDCardLib

Wrapper library to provide higher-level SD card APIs

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Out-of-Box Demo GUI
The out-of-box demo GUI (see Figure 12) is required to control the out-of-box application running on the
MSP-EXP430FR5994 LaunchPad development kit. The GUI can be found in the latest MSPWare
installation or in MSP-EXP430FR5994_Software_Examples.zip, available on the MSP-EXP430FR5994
Design File Download Page.

Figure 12. MSP-EXP430FR5994 Out-of-Box Demo GUI
Establish connection to the LaunchPad development kit by first clicking the Connect button, followed by
selecting the correct Serial COM Port (MSP Application UART1) and clicking the Open button. On
Windows, open Device Manager → Ports (COM & LPT) to verify the corresponding COM port of the
backchannel UART.
After connection has been established, the GUI pings the LaunchPad development kit every few seconds
to make sure that it is still present and to keep the serial port open. If no response is received from the
LaunchPad development kit, the GUI automatically closes the serial port connection.
3.1.3

Power Up and Idle
When the LaunchPad development kit powers up after being connected to a computer, the red and green
LEDs toggle several times to indicate that the out-of-box demo is running. The MSP430FR5994 then
enters low-power mode 3 to wait for UART commands from the PC GUI.

3.1.4

Live Temperature Mode
To enter the live temperature mode, click the Start button below Live Temp Mode in the GUI Application
Controls panel (see Figure 13).

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Figure 13. Live Temperature Mode
The MSP430FR5994 first sends two ADC calibration constants for the temperature sensor to the PC GUI.
It then sets up its 12-bit ADC for sampling and converting the signals from its internal temperature sensor.
A hardware timer is also configured to trigger the ADC conversion every 0.125 seconds before the device
enters low-power mode 3 to conserve power. As soon as the ADC sample and conversion is complete,
the raw ADC data is sent the through the UART backchannel to the PC GUI.
As the raw ADC data is received by the PC GUI, Celsius and Fahrenheit units are calculated first. The PC
GUI keeps a buffer of the most recent 100 temperature measurements, which are graphed against the
current time of the PC on the Incoming Data panel.
A red horizontal line is drawn across the data plot to indicate the moving average of the incoming data.
To exit this mode, click the Stop button under Live Temp Mode. You must exit this mode before starting
the other modes.
3.1.5

FRAM Log Mode
To enter the FRAM Log Mode, click the Start button under FRAM Log Mode in the GUI Application
Controls panel. The PC GUI also sends its current timestamp over UART to be stored in the LaunchPad
development kit. This timestamp is later used to extrapolate the X-axis time values when the FRAM
logged data are transferred to the GUI (see Figure 14).

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Figure 14. FRAM Log Mode
When the MSP430FR5994 receives the UART command from the GUI, it starts the entry sequence by
initializing the Real-Time Clock to trigger an interrupt every 5 seconds. The red LED blinks three times to
indicate successful entry into FRAM Log Mode.
The MSP430FR5994 wakes up every 5 seconds from low-power mode 3 to perform data logging before
going back to low-power mode 3. The GUI automatically disconnects from the LaunchPad development kit
after entering FRAM Log Mode. Each time the device wakes up, the green LED lights up to indicate a data
point is stored. Two 10000 long FRAM array buffers are allocated to store the raw ADC output data.
Because the device can be powered solely with the onboard Super Cap, the 12-bit ADC is set up to
sample and convert the signals from its internal temperature sensor and battery monitor (super cap
voltage).
The board allows powering the application with the USB cable or the onboard super cap. See
Section 2.3.3 for more detail on the super cap. To switch to the super cap:
1. While board is powered through USB, configure the jumper to Charge on J8. Wait 2 to 3 minutes.
2. Start FRAM Logging.
3. Switch the jumper on J8 to Use.
4. Disconnect the SBWTDIO and 3v3 jumpers on J101 (to prevent back powering the eZ-FET).
5. Disconnect the USB.
NOTE: Remove the SD card from the holder to reduce power consumption and extend application
run time when using the super cap.

To exit the FRAM Log Mode, press the S2 (right) push button on the LaunchPad development kit. The red
LED turns on briefly to indicate successful exit and return to the Power up and Idle state. Reattach the
jumpers to the default positions and connect USB. Re-open the serial port to the LaunchPad development
kit in the GUI. Click the Transfer FRAM Data button to transmit the logged temperature and voltage data
from the device FRAM to the PC.
20

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3.1.6

SDCard Log Mode
The SD Card Mode works similarly to the FRAM Log Mode, except that the temperature and voltage data
are stored into .txt files on the SD card. Each time the SDCard Log Mode is started, a new LOG_#.TXT (#
increments for the next file) is created under /root/DATA_LOG/.
Enter and exit SDCard Log Mode the same way that you enter and exit FRAM Log Mode. Click Show
SDCard Data to transfer the data from the most recently created LOG_#.TXT to the PC.
NOTE: The super cap cannot power the SDCard Log Mode for long periods of time, because the
SDCard consumes significantly more power.

3.2

Blink LED Example
This simple software example demonstrates how to software toggle a GPIO to blink an LED on the
LaunchPad kit.

3.2.1

Source File Structure
The project is split into multiple files (see Table 8). This makes it easier to navigate and reuse parts of it
for other projects.
Table 8. Source File and Folders
Name

Description

main.c

The Blink LED main function

Library: Driverlib

Device driver library

The main code uses the MSP430 Driver Library to halt the watchdog timer and to configure/toggle the
P1.0 GPIO pin connected to the LED inside a software loop.

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Software Examples

3.3

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BOOSTXL-AUDIO Audio Record and Playback Example
This section describes the functionality and structure of the BOOSTXLAUDIO_RecordPlayback_MSP430FR5994 demo that is included in the MSP-EXP430FR5994 Software
Examples download, or that is more easily accessible through MSPWare (see Section 4.3).

3.3.1

Source File Structure
The project is split into multiple files (see Table 9). This makes it easier to navigate and reuse parts of it
for other projects.
Table 9. Source File and Folders
Name

3.3.2

Description

main.c

The demo's clock, GPIO, DAC and interrupt configurations.

application/application.c

Main application loop and interrupt service routines

application/audio_collect.c

Setup, start, stop and shutdown audio collect functions

application/audio_playback.c

Setup, start and stop playback functions and interrupt service routines

application/dac8311.c

Operating modes/functions of the onboard SPI DAC

application/global.h

Global variables definitions

Library: driverlib

Device driver library

Operation
This demo uses the built-in ADC12 on the MSP430FR5994 MCU to sample from the output of the analog
microphone on the Audio Signal Processing BoosterPack plug-in module. Using direct memory access
(DMA), the 12-bit microphone data is stored and retrieved from FRAM memory. During playback, the
microphone data is sent through SPI to the onboard DAC to drive the audio output of the onboard speaker
or headphones.
To begin recording an audio sample, press switch S1 on the MSP-EXP430FR5994 (see Figure 15). LED1
turns on while audio is being recorded and turns off when the recording phase is complete. Headphones
with an inline microphone can be used to record audio. The BoosterPack plug-in module automatically
detects the inline microphone when the headphones are plugged into the provided jack (J6) and records
from it instead of the onboard microphone.

Figure 15. Record
To play back the recorded audio sample, press switch S2 on the MSP-EXP430FR5994 LaunchPad
development kit (see Figure 16). LED2 turns on during playback and turns off when the playback phase is
complete. To use headphones to listen to the audio playback, plug headphones into the provided jack J6.
22

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Figure 16. Playback

3.4

Filtering and Signal Processing With LEA TI Design Example
This section describes the functionality and structure of the Filtering and Signal Processing With LEA TI
Design. Its software can be downloaded from TIDM-FILTERING-SIGNALPROCESSING-LEA Software.

3.4.1

Source File Structure
The project is split into multiple files (see Table 10). This makes it easier to navigate and reuse parts of it
for other projects.
Table 10. Source File and Folders
Name

Description

main.c

The demo's clock, GPIO, display and interrupt configurations.

application/application.c

Main application loop and interrupt service routines

application/audio_collect.c

Setup, start, stop and shutdown audio collect functions

application/audio_playback.c

Setup, start and stop playback functions and interrupt service routines

application/dac8311.c

Operating modes/functions of the onboard SPI DAC

application/global.h

Global variables definitions

application/fir.c

FIR filtering functions

application/FFT.c

Fast Fourier Transform filtering functions

application/FFT_430.asm

MSP430 Fast Fourier Transform filtering functions in assembly

application/benchmark.c

Performance benchmark timer and interrupt service routines

application/fir_coefficient

FIR coefficient definitions

Library: DSPLib

MSP430 DSP Library

Library: grlib

MSP430 Graphics Library

Library: driverlib

Device driver library

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Software Examples

3.4.2

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Operation
This demo is a TI Design highlighting the signal processing capabilities and performance of the
MSP430FR5994 MCU and its integrated Low Energy Accelerator (LEA). This example also uses the
430BOOST-SHARP96 BoosterPack plug-in module to display the filtered output of the audio signal and
act as a user interface. To use this code example user's must configure the Audio BoosterPack plug-in
module to use its alternate microphone power and output pins by moving the 0-ohm resistor on R1 to R3
and R4 to R5 as shown in Figure 17. For more information on this example please visit the TI Design
page at http://www.ti.com/tool/tidm-filtering-signalprocessing.

Figure 17. Alternate Microphone Configuration

3.5

Emulating EEPROM TI Design Example
This section describes the functionality and structure of the Emulating EEPROM TI Design. Its software
can be downloaded from TIDM-FRAM-EEPROM Software.

3.5.1

Source File Structure
The project is split into multiple files (see Table 11). This makes it easier to navigate and reuse parts of it
for other projects.
Table 11. Source File and Folders
Name

Description

main.c

The demo's clock, GPIO, EEPROM initialization and interrupt configurations.

eeprom_interface/eeprom_i2c.c

EEPROM I2C interface initialization and functions

eeprom_interface/eeprom_spi.c

EEPROM SPI interface initialization and functions

eeprom_definitions.h

Global variables definitions

eeprom.c

EEPROM standard functions

sensing_proc.c

Functions for sampling temperature and voltage

Library: driverlib

Device driver library

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3.5.2

Operation
The EEPROM emulation is configured to use I2C or SPI protocol in Slave mode as indicated by Figure 18
and Figure 19. It would typically be connected to a host processor which would act as the master. This
implementation, unlike traditional EEPROM, requires no caching after several hundred bytes. The host
could continuously write data to memory once the communication is initiated. And the data is immediately
written to memory. This means that the application could continuously stream data with much higher
throughput. The SPI operation also includes DMA.
MSP430FR5994
SCLK
MOSI
FRAM EEPROM
Host Processor

MISO
VCC Measure/
Sensing

CS
WP

TIDM-FRAM-EEPROM

Figure 18. EEPROM SPI Interface Block Diagram
VCC
MSP430FR5994
SCL
SDA
FRAM EEPROM
Host Processor
VCC Measure
and Sensing
WP

TIDM-FRAM-EEPROM

Figure 19. EEPROM I2C Interface Block Diagram
This TI Design also emulates industry standard EEPROM protocols such as I2C and SPI, as well as a
write protection pin to ensure that the device is protected from any writes. On top of EEPROM emulation,
the TI Design periodically samples the ADC for the latest VCC and temperature and stores it in FRAM at a
low priority. When the host application requests the data, it is immediately available. The sensor data is
currently configured to periodically sample every second and can be custom tailored for the application.
The sensor reading does not block the EEPROM emulation. The EEPROM emulation is the highest
priority function. For more information on this example please visit the TI Design page at
http://www.ti.com/tool/tidm-eeprom-emulation.

Resources

4.1

Integrated Development Environments
Although the source files can be viewed with any text editor, more can be done with the projects if they're
opened with a development environment like Code Composer Studio IDE (CCS) and IAR Embedded
Workbench IDE.

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TI Cloud Development Tools
TI's Cloud-based software development tools provide instant access to MSPWare content and a webbased IDE.

4.1.1.1

TI Resource Explorer Cloud

TI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentation
found in MSPWare without having to download files to your local drive (see Figure 20).
Learn more about TI Resource Explorer Cloud now at dev.ti.com.

Figure 20. TI Resource Explorer Cloud

4.1.1.2

Code Composer Studio Cloud

Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that enables you to quickly create, edit,
build and debug applications for your LaunchPad development kit (see Figure 21). No need to download
and install large software packages, simply connect your LaunchPad development kit and begin. You can
choose to select from a large variety of examples in MSPWare software and Energia or develop your own
application. CCS Cloud supports debug features such as execution control, breakpoints and viewing
variables.
A full comparison between CCS Cloud and CCS Desktop is available here.
Learn more about Code Composer Studio Cloud now at dev.ti.com.

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Figure 21. CCS Cloud

4.1.2

Code Composer Studio ™ IDE
Code Composer Studio Desktop is a professional integrated development environment that supports TI's
Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools
used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code
editor, project build environment, debugger, profiler, and many other features.
Learn more about CCS and download it at http://www.ti.com/tool/ccstudio.
CCS v6.1.3 or higher is required. When CCS has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the desired demo's project directory that contains
main.c (see Figure 22).

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Figure 22. Directing the Project>Import Function to the Demo Project
Selecting the \CCS subdirectory also works. The CCS-specific files are located there.
When you click OK, CCS should recognize the project and allow you to import it. The indication that CCS
has found it is that the project appears in the box shown in 19, and it has a checkmark to the left of it.

Figure 23. When CCS Has Found the Project
Sometimes CCS finds the project but does not show a checkmark. This might mean that the workspace
already has a project by that name. Resolve this conflict by renaming or deleting that project. Even if you
do not see it in the CCS workspace, check the workspace directory on the file system.

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4.1.3

IAR Embedded Workbench for MSP430
IAR Embedded Workbench for MSP430 is another very powerful integrated development environment that
allows you to develop and manage complete embedded application projects. It integrates the IAR C/C++
Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IAR
C-SPY® Debugger.
Learn more about IAR Embedded Workbench for MSP430 and download it at
http://supp.iar.com/Download/SW/?item=EW430-EVAL.
IAR 6.30 or higher is required. To open the demo in IAR, click File>Open>Workspace…, and browse to
the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is
contained within this file.
The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by
clicking Project>Add-Existing-Project….
Although the software examples have all of the code required to run them, IAR users may download and
install MSPWare, which contains MSP430 libraries and the TI Resource Explorer. By default, these are
already included in a CCS installation.

4.2

LaunchPad Websites
For more information about the LaunchPad development kit, supported BoosterPack plug-in modules, and
available resources, visit:
• MSP-EXP430FR5994 tool folder: Resources specific to this particular LaunchPad development kit
• TI LaunchPad portal: Information about all LaunchPad kits from TI

4.3

MSPWare and TI Resource Explorer
TI Resource Explorer is a tool integrated into CCS that allows you to browse through available design
resources (see Figure 24). TI Resource Explorer helps you quickly find what you need inside packages
including MSPWare, ControlSuite, TivaWare, and more. TI Resource Explorer is well organized to find
everything quickly, and you can import software projects into your workspace in one click.
TI Resource Explorer Cloud is one of the TI Cloud Development tools, and it is tightly integrated with CCS
Cloud. See Section 4.1.1 for more information.
MSPWare is a collection of code examples, software libraries, data sheets, and other design resources for
all MSP devices delivered in a convenient package–essentially everything developers need to become
MSP experts.
In addition to providing a complete collection of existing MSP design resources, MSPWare also includes a
high-level API called MSP Driver Library. This library makes it easy to program MSP hardware. For more
information, see http://www.ti.com/tool/mspware.

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Figure 24. Using TI Resource Explorer to Browse MSP-EXP430FR5994 in MSPWare
Inside TI Resource Explorer, these examples and many more can be found, and easily imported into CCS
with one click.

4.4

FRAM Utilities
The Texas Instruments™ FRAM Utilities is a collection of embedded software utilities that leverage the
ultra-low-power and virtually unlimited write endurance of FRAM. The utilities are available for
MSP430FRxx FRAM microcontrollers and provide example code to help start application development.

4.4.1

Compute Through Power Loss (CTPL)
CTPL is a utility API set that enables ease of use with LPMx.5 low-power modes and a powerful shutdown
mode that allows an application to save and restore critical system components when a power loss is
detected.

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4.5
4.5.1

MSP430FR5994 MCU
Device Documentation
At some point, you will probably need more information about the MSP430FR5994 MCU. For every MSP
device, the documentation is organized as shown in Table 12.
Table 12. How MSP Device Documentation is Organized
Document

4.5.2

For MSP430FR5994

Description

Device family
user's guide

MSP430FR58xx, MSP430FR59xx,
MSP430FR68xx, and MSP430FR69xx Family
User's Guide

Architectural information about the device,
including all modules and peripherals such as
clocks, timers, ADC, and so on.

Device-specific
data sheet

MSP430FR599x, MSP430FR596x Mixed-Signal
Microcontrollers

Device-specific information and all parametric
information for this device

MSP430FR5994 Code Examples
MSP430FR599x, MSP430FR596x Code Examples is a set of simple C examples that demonstrate how to
use the entire set of MSP430 peripherals (including serial communication, ADC12, LCD_C, Timer_A,
Timer_B, and others) through direct register access.
Every MSP derivative has a set of these code examples. When starting a new project or adding a new
peripheral, these examples serve as a great starting point. There are also MSP Driver Library based code
examples available in MSPWare.

4.5.3

MSP430 Application Notes and TI Designs
Visit www.ti.com/msp430 for many application notes and TI Designs with practical design examples and
topics.

4.6
4.6.1

Community Resources
TI E2E™ Community
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community!

4.6.2

Community at Large
Many online communities focus on the LaunchPad development kits (for example, http://www.43oh.com).
You can find additional tools, resources, and support from these communities.

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FAQ
Q: I can't get the backchannel UART to connect. What's wrong?
A:
•
•
•

Check the following:
Do the baud rate in the host terminal application and the eUSCI settings match?
Are the appropriate jumpers in place, on the isolation jumper block?
Probe on RXD and send data from the host. If you don't see data, it might be a problem on the host
side.
• Probe on TXD while sending data from the MSP. If you don't see data, it might be a configuration
problem with the eUSCI module.
• Consider the use of the hardware flow control lines (especially for higher baud rates).
Q: The MSP G2 LaunchPad had a socket, allowing me change the target device. Why doesn't this
LaunchPad kit use one?
A: This LaunchPad development kit provides more functionality, and this means using a device with more
pins. Sockets for devices with this many pins are too expensive for the target price of the LaunchPad
development kits.

SLAU678A – March 2016 – Revised April 2016
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Schematics

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Schematics

Figure 25. Schematics (1 of 7)

SLAU678A – March 2016 – Revised April 2016
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Schematics

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Figure 26. Schematics (2 of 7)

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Figure 27. Schematics (3 of 7)

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Figure 28. Schematics (4 of 7)

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Figure 29. Schematics (5 of 7)

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Figure 30. Schematics (6 of 7)

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Figure 31. Schematics (7 of 7)

SLAU678A – March 2016 – Revised April 2016
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Revision History

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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from March 31, 2016 to April 26, 2016 ............................................................................................................. Page
•
•

Changed the text and links in the first paragraph in Section 3.4, Filtering and Signal Processing With LEA TI Design
Example ................................................................................................................................... 23
Changed the text and links in the first paragraph in Section 3.5, Emulating EEPROM TI Design Example ................ 24

Revision History

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.

Delivery: TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation
which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms
and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

Regulatory Notices:
3.1 United States
3.1.1

Notice applicable to EVMs not FCC-Approved:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•

Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada
3.2.1

For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1

Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2

Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.

2.
3.

Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.

電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3

Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1

User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.

4.3.2

EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.

Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.

Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.

USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.

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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
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No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Keywords                        : SLAU678, SLAU678A
Title                           : MSP430FR5994 LaunchPad Development Kit (MSP-EXP430FR5994) User's Guide (Rev. A)
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MSP430FR5994 LaunchPad Development Kit (MSP EXP430FR5994) User's Guide (Rev. A) MSP430 Users

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