Sx_ds12 3 SCENIX

User Manual: SCENIX

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Scenix™ and the Scenix logo are trademarks of Scenix Semiconductor, Inc.

I2C™ is a trademark of Philips Corporation

PIC® is a registered trademark of Microchip Technology, Inc.

Microchip® is a registered trademark of Microchip Technology, Inc.

SX-Key™ is a trademark of Parallax, Inc.

Microwire™ is a trademark of National Semiconductor Corporation

All other trademarks mentioned in this document are property of their respec-

tive companies.

PRELIMINARY

December 3, 1998

SX18AC / SX20AC / SX28AC

High-Performance 8-Bit Microcontrollers with EE/Flash Program

Memory and In-System Programming Capability

1.0PRODUCT OVERVIEW

1.1Introduction

The SX18AC, SX20AC, and SX28AC are members of

the SX family of high-performance 8-bit microcontrollers

fabricated in an advanced CMOS process technology.

The advanced process, combined with a RISC-based

architecture, allows high-speed computation, flexible I/O

control, and efficient data manipulation. Throughput is

enhanced by operating the device at frequencies up to 50

MHz and by optimizing the instruction set to include

mostly single-cycle instructions.

On-chip functions include a general-purpose 8-bit timer

with prescaler, an analog comparator, a brown-out detec-

tor, a watchdog timer, a power-save mode with multi-

source wakeup capability, an internal R/C oscillator, user-

selectable clock modes, and high-current outputs.

1.2Key Features

•50 MIPS performance at 50 MHz oscillator frequency

•2048 x 12 bits EE/Flash program memory rated for

10,000 rewrite cycles

•136 x 8 bits SRAM

•In-system programming capability through OSC pins

•Internal RC oscillator with configurable rate from 31.25

KHz to 4 MHz, +8% accuracy

•User selectable clock modes:

–Internal RC oscillator

–External oscillator

–Crystal/resonator options

–External RC oscillator (continued on page 3)

Figure1-1. Block Diagram

Interrupt MIWU Port B Comp

Power-On

Reset RESET

8-bit Watchdog

Timer (WDT) 8-bit Timer

RTCC

888

Port C

Port A

Internal Data Bus

In-System

Debugging

In-System

Programming

2k x 12

EEPROM

System

Clock

Brown-Out MIWU

MCLR

OSC

Driver

4MHz

Internal

RC OSC

Clock

Select

÷ 4 or ÷ 1

136 Bytes

SRAM

Address

Write Data

Read Data

Instruction

FSR

STATUS

MODE

OPTION

System Clock

OSC1 OSC2

Instruction Pipeline

Four - Stage

Address 12

ALU

RTCC

Analog

Prescaler for RTCC

Postscaler for WDT

SX18AC / SX20AC / SX28AC

Table of Contents

11.0 Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2.1 CPU Features . . . . . . . . . . . . . . . . . . . . . 3

1.2.2 I/O Features . . . . . . . . . . . . . . . . . . . . . . . 3

1.3 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.4 Programming and Debugging Support . . . . . . . . . . 3

1.5 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.0 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.3 Part Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.0 Port Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.1 Reading and Writing the Ports . . . . . . . . . . . . . . . . . 7

3.2 Port Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2.1 MODE Register . . . . . . . . . . . . . . . . . . . . 8

3.2.2 Port Configuration Registers . . . . . . . . . . 8

3.2.3 Port Configuration Upon Power-Up . . . . . 9

4.0 Special-Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . 10

4.1 PC Register (02h) . . . . . . . . . . . . . . . . . . . . . . . . . 10

4.2 STATUS Register (03h) . . . . . . . . . . . . . . . . . . . . . 10

4.3 OPTION Register . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.0 Device Configuration Registers . . . . . . . . . . . . . . . . . . . . . 12

5.1 FUSE Word (Read/Program at FFFh in main memory

map) 12

5.2 FUSEX Word (Read/Program via Programming

Command) 13

5.3 DEVICE Word (Hard-Wired Read-Only) . . . . . . . . 13

6.0 Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.1 Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.1.1 Program Counter . . . . . . . . . . . . . . . . . . 14

6.1.2 Subroutine Stack . . . . . . . . . . . . . . . . . . 14

6.2 Data Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

6.2.1 File Select Register (04h) . . . . . . . . . . . 14

7.0 Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7.1 Multi-Input Wakeup . . . . . . . . . . . . . . . . . . . . . . . . 16

7.2 Port B MIWU/Interrupt Configuration . . . . . . . . . . . 17

8.0 Interrupt Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

9.0 Oscillator Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

9.1 XT, LP or HS modes . . . . . . . . . . . . . . . . . . . . . . . 20

9.2 External RC Mode . . . . . . . . . . . . . . . . . . . . . . . . . 21

9.3 Internal RC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . 21

10.0 Real Time Clock (RTCC)/Watchdog Timer . . . . . . . . . . . . .22

10.1 RTCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

10.2 Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . .22

10.3 The Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

11.0 Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

12.0 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

13.0 Brown-Out Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

14.0 Register States Upon Reset . . . . . . . . . . . . . . . . . . . . . . . . .26

15.0 Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

15.1 Instruction Set Features . . . . . . . . . . . . . . . . . . . . .27

15.2 Instruction Execution . . . . . . . . . . . . . . . . . . . . . . .27

15.3 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . .27

15.4 RAM Addressing . . . . . . . . . . . . . . . . . . . . . . . . . .28

15.5 The Bank Instruction . . . . . . . . . . . . . . . . . . . . . . .28

15.6 Bit Manipulation . . . . . . . . . . . . . . . . . . . . . . . . . . .28

15.7 Input/Output Operation . . . . . . . . . . . . . . . . . . . . . .28

15.7.1 Read-Modify-Write Considerations . . . .28

15.8 Increment/Decrement . . . . . . . . . . . . . . . . . . . . . . .28

15.9 Loop Counting and Data Pointing Testing . . . . . . .28

15.10 Branch and Loop Call Instructions . . . . . . . . . . . . .28

15.10.1 Jump Operation . . . . . . . . . . . . . . . . . . .28

15.10.2 Page Jump Operation . . . . . . . . . . . . . .29

15.10.3 Call Operation . . . . . . . . . . . . . . . . . . . .29

15.10.4 Page Call Operation . . . . . . . . . . . . . . . .29

15.11 Return Instructions . . . . . . . . . . . . . . . . . . . . . . . . .29

15.12 Subroutine Operation . . . . . . . . . . . . . . . . . . . . . . .29

15.12.1 Push Operation . . . . . . . . . . . . . . . . . . .29

15.12.2 Pop Operation . . . . . . . . . . . . . . . . . . . .30

15.13 Comparison and Conditional Branch Instructions .30

15.14 Logical Instruction . . . . . . . . . . . . . . . . . . . . . . . . .30

15.15 Shift and Rotate Instructions . . . . . . . . . . . . . . . . .30

15.16 Complement and SWAP . . . . . . . . . . . . . . . . . . . .30

15.17 Key to Abbreviations and Symbols . . . . . . . . . . . . .30

16.0 Instruction Set Summary Table . . . . . . . . . . . . . . . . . . . . . .31

16.1 Equivalent Assembler Mnemonics . . . . . . . . . . . . .34

17.0 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .35

17.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . .35

17.2 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .36

17.3 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .37

17.4 Comparator DC and AC Specifications . . . . . . . . .37

17.5 Typical Performance Characteristics . . . . . . . . . . .38

18.0 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

SX18AC / SX20AC / SX28AC

1.2 Key Features (Continued)

•Analog comparator

•Brown-out detector (4.2V, on/off)

•Multi-Input Wakeup (MIWU) on eight pins

•Fast lookup capability through run-time readable code

•Complete development tool support available through

Parallax

1.2.1 CPU Features

•Fully static design – DC to 50 MHz operation

•20 ns instruction cycle time

•Mostly single-cycle instructions

•Selectable 8-level deep hardware subroutine stack

•Single-level interrupt stack

•Fixed interrupt response time: 60 ns internal, 100 ns

external at 50 MHz

•Hardware context save/restore for interrupt

•Designed to be pin-compatible and upward code-com-

pitable with the PIC165x®

1.2.2 I/O Features

•Software-selectable I/O configuration

–Each pin programmable as an input or output

–TTL or CMOS level selection on inputs

–Internal weak pull-up selection on inputs (~20 kΩ to

Vdd)

•Schmitt trigger inputs on Port B and Port C

•All outputs capable of sinking/sourcing 30 mA

•Symmetrical drive on Port A outputs (same Vdrop +/-)

1.3Architecture

The SX devices use a modified Harvard architecture.

This architecture uses two separate memories with sepa-

rate address buses, one for the program and one for

data, while allowing transfer of data from program mem-

ory to SRAM. This ability allows accessing data tables

from program memory. The advantage of this architec-

ture is that instruction fetch and memory transfers can be

overlapped with a multi-stage pipeline, which means the

next instruction can be fetched from program memory

while the current instruction is being executed using data

from the data memory.

The SX family implements a four-stage pipeline (fetch,

decode, execute, and write back), which results in execu-

tion of one instruction per clock cycle. At the maximum

operating frequency of 50 MHz, instructions are executed

at the rate of one per 20-ns clock cycle.

1.4Programming and Debugging Support

The SX devices are currently supported by the SX-Key™

offered by Parallax, Inc. This tool provides an integrated

development environment including editor, macro assem-

bler, debugger, and programmer.

1.5Applications

Emerging applications and advances in existing ones

require higher performance while maintaining low cost

and fast time-to-market.

The SX devices provide solutions for many familiar appli-

cations such as process controllers, electronic appli-

ances/tools, security/monitoring systems, and personal

communication devices. In addition, the enhanced

throughput allows efficient development of software mod-

ules called Virtual Peripherals to replace on-chip hard-

ware peripherals. The concept of Virtual Peripherals

provides benefits such as using a more simple device,

reduced component count, fast time to market, increased

flexibility in design, and ultimately overall system cost

reduction.

Some examples of Virtual Peripheral modules are:

•Serial, Parallel, I2C™, Microwire™ (µ-Wire), Dallas µ-

Wire, SPI, DMX-512, X-10, IR transceivers

•Frequency generation and measurement

•Spectrum analysis

•Multi-tasking, interrupts, and networking

•Resonance loops

•DRAM drivers

•Music and voice synthesis

•PPM/PWM output

•Delta/Sigma ADC

•DTMF I/O and call progress

•300/1200 baud modem

•Quadrature encoder/decoder

•Peripheral Interface Device (PID) and servo control

•Video controller

SX18AC / SX20AC / SX28AC

2.0CONNECTION DIAGRAMS

2.1Pin Assignments

2.2Pin Descriptions

SSOP

RC4

RC3

RB6

RB5

SX 28-PIN

OSC2

RC7

RC6

RC5

Vdd

RA2

RA3

RB0

RB1

RB2

RB3

RB4

Vss

MCLR

OSC1

RC2

RC1

RC0

RB7

Vss

RTCC

RA0

RA1

RC4

RC3

RB6

RB5

SX 28-PIN

OSC2

RC7

RC6

RC5

n.c.

Vss

RA2

RA3

RB0

RB1

RB2

RB3

RB4

MCLR

OSC1

RC2

RC1

RC0

RB7

RTCC

Vdd

RA0

RA1

n.c.

SDIP/SOIC

RB5

RB4

SX 20-PIN

OSC2

RTCC RA0

RB0

RB1

RB2

RB3

MCLR

OSC1

Vdd

RB7

RB6

RA2

RA3

Vss

RA1

Vss

SSOP

RB5

RB4

SX 18-PIN

OSC2

RTCC RA0

RB0

RB1

RB2

RB3

MCLR

OSC1

Vdd

RB7

RB6

910

RA2

RA3 RA1

Vss

SDIP/SOIC

Name Pin Type Input Levels Description

RA0 I/O TTL/CMOS Bidirectional I/O Pin; symmetrical source / sink capability

RA1 I/O TTL/CMOS Bidirectional I/O Pin; symmetrical source / sink capability

RA2 I/O TTL/CMOS Bidirectional I/O Pin; symmetrical source / sink capability

RA3 I/O TTL/CMOS Bidirectional I/O Pin; symmetrical source / sink capability

RB0 I/O TTL/CMOS/ST Bidirectional I/O Pin; comparator output; MIWU input

RB1 I/O TTL/CMOS/ST Bidirectional I/O Pin; comparator negative input; MIWU input

RB2 I/O TTL/CMOS/ST Bidirectional I/O Pin; comparator positive input; MIWU input

RB3 I/O TTL/CMOS/ST Bidirectional I/O Pin; MIWU input

RB4 I/O TTL/CMOS/ST Bidirectional I/O Pin; MIWU input

RB5 I/O TTL/CMOS/ST Bidirectional I/O Pin; MIWU input

RB6 I/O TTL/CMOS/ST Bidirectional I/O Pin; MIWU input

RB7 I/O TTL/CMOS/ST Bidirectional I/O Pin; MIWU input

RC0 I/O TTL/CMOS/ST Bidirectional I/O pin

RC1 I/O TTL/CMOS/ST Bidirectional I/O pin

RC2 I/O TTL/CMOS/ST Bidirectional I/O pin

RC3 I/O TTL/CMOS/ST Bidirectional I/O pin

RC4 I/O TTL/CMOS/ST Bidirectional I/O pin

RC5 I/O TTL/CMOS/ST Bidirectional I/O pin

RC6 I/O TTL/CMOS/ST Bidirectional I/O pin

RC7 I/O TTL/CMOS/ST Bidirectional I/O pin

RTCC IST Input to Real-Time Clock/Counter

MCLR IST Master Clear reset input – active low

OSC1/In/Vpp IST Crystal oscillator input – external clock source input

OSC2/Out OCMOS Crystal oscillator output – in R/C mode, internally pulled to Vdd through weak

pull-up

Vdd P–Positive supply pin

Vss P–Ground pin

Note:I = input, O = output, I/O = Input/Output, P = Power, TTL = TTL input, CMOS = CMOS input, ST = Schmitt Trigger

input, MIWU = Multi-Input Wakeup input

SX18AC / SX20AC / SX28AC

2.3Part Numbering

Table2-1. Ordering Information

Device Pins I/O EE/Flash (Words) RAM (Bytes)

SX18AC/SO 18 12 2K 136

SX18AC/DP 18 12 2K 136

SX20AC/SS 20 12 2K 136

SX28AC/SO 28 20 2K 136

SX28AC/DP 28 20 2K 136

SX28AC/SS 28 20 2K 136

Figure2-1. Part Number Reference Guide

SX18AC-LI/SO

Package Type

Extended Temperature

Low Voltage

Memory Size

Feature Set

Pin Count

SceniX

A = 512 word

B = 1k word

C = 2k word

D = 4k word

E = 8k word

F = 16k word

G = 24k word

H = 32k word

I = 48k word

J = 64k word

SX18AC / SX20AC / SX28AC

3.0PORT DESCRIPTIONS

The device contains a 4-bit I/O port (Port A) and two 8-bit

I/O ports (Port B, Port C). Port A provides symmetrical

drive capability. Each port has three associated 8-bit reg-

isters (Direction, Data, TTL/CMOS Select, and Pull-Up

Enable) to configure each port pin as Hi-Z input or output,

to select TTL or CMOS voltage levels, and to enable/dis-

able the weak pull-up resistor. The upper four bits of the

registers associated with Port A are not used. The least

significant bit of the registers corresponds to the least

significant port pin. To access these registers, an appro-

priate value must be written into the MODE register.

Upon power-up, all bits in these registers are initialized to

“1”.

The associated registers allow for each port bit to be indi-

vidually configured under software control as shown

below:

Port B and Port C have additional associated registers

(Schmitt-Trigger Enable Registers ST_B and ST_C) to

enable or disable the Schmitt Trigger function on each

individual port pin as indicated in table below.

Port B also supports the on-chip differential comparator.

Ports RB1 and RB2 are the comparator negative and

positive inputs, respectively, while Port RB0 is the com-

parator output pin. Port B also supports the Multi-Input

Wakeup feature on all eight pins.

Figure3-1 shows the internal hardware structure and

configuration registers for each pin of Port A. Figure3-2

shows the same for each pin of Port B or Port C.

Table3-1. Port Configuration

Data Direction

Registers:

RA, RB, RC

TTL/CMOS

Select Registers:

LVL_A, LVL_B,

LVL_C

Pullup Enable

Registers:

PLP_A, PLP_B,

PLP_C

010101

Output Hi-Z

Input CMOS TTL Enable Disable

Table3-2. Schmitt Trigger Select

Schmitt Trigger Enable Registers: ST_B, ST_C

0 1

Enable Disable

Figure3-1. Port A Configuration

MODE

RA Data

LV_A

0 = Output

1 = Hi-Z Input

0 = CMOS

1 = TTL

TTL Buffer

CMOS Buffer

Vdd

Pullup

(~20kΩ)

Port A PIN

Internal Data Bus

Mode = 0F

Mode = 0E

Mode = 0D

Direction

PLP_A

0 = Pullup Enable

1 = Pullup Disable

Port A INPUT

SX18AC / SX20AC / SX28AC

3.1Reading and Writing the Ports

The three ports are memory-mapped into the data mem-

ory address space. To the CPU, the three ports are avail-

able as the RA, RB, and RC file registers at data memory

addresses 05h, 06h, and 07h, respectively. Writing to a

port data register sets the voltage levels of the corre-

sponding port pins that have been configured to operate

as outputs. Reading from a register reads the voltage lev-

els of the corresponding port pins that have been config-

ured as inputs.

For example, suppose all four Port A pins are configured

as outputs and with RA0 and RA1 to be high, and RA2

and RA3 to be low:

The second “mov” instruction in this example writes the

Port A data register (RA), which controls the output levels

of the four Port A pins, RA0 through RA3. Because Port

A has only four I/O pins, only the four least significant bits

of this register are used. The four high-order register bits

are “don’t care” bits. Port B and Port C are both eight bits

wide, so the full widths of the RB and RC registers are

used.

When a write is performed to a bit position for a port that

has been configured as an input, a write to the port data

ate effect on the pin. If later that pin is configured to

operate as an output, it will reflect the value that has

been written to the data register.

When a read is performed from a bit position for a port,

the operation is actually reading the voltage level on the

pin itself, not necessarily the bit value stored in the port

data register. This is true whether the pin is configured to

operate as an input or an output. Therefore, with the pin

configured to operate as an input, the data register con-

tents have no effect on the value that you read. With the

pin configured to operate as an output, what is read gen-

erally matches what has been written to the register.

Figure3-2. Port B, Port C Configuration

MODE

RB or RC

PLP_B or PLP_C

LV_B or LV_C

0 = Output

1 = Hi-Z Input

0 = Pullup Enable

1 = Pullup Disable

RD/WR

0 = CMOS

1 = TTL

Port B: Input, MIWU, Comparator

Vdd

Pullup Resistor

(~20kΩ)

Port B or

Internal Data Bus

Mode = 0F

Mode = 0E

Mode = 0D

Mode = 0C

ST_B or ST_C

RD/WR

0 = Schmitt Trigger Enable

1 = Schmitt Trigger Disable

Port C: Input Only

TTL Buffer

CMOS Buffer

Port C PIN

Schmitt Trigger Buffer

Direction

RB or RC

Data

mov W,#$03 ;load W with the value 03h

;(bits 0 and 1 high)

mov $05,W ;write 03h to Port A data

;register

SX18AC / SX20AC / SX28AC

When two successive read-modify-write instructions are

used on the same I/O port with a very high clock rate, the

“write” part of one instruction might not occur soon

enough before the “read” part of the very next instruction,

resulting in getting “old” data for the second instruction.

To ensure predictable results, avoid using two successive

read-modify-write instructions that access the same port

data register if the clock rate is high.

3.2Port Configuration

Each port pin offers the following configuration options:

•data direction

•input voltage levels (TTL or CMOS)

•pullup type (pullup resistor or open collector)

•Schmitt trigger input (for Port B and Port C only)

Port B offers the additional option to use the port pins for

the Multi-Input Wakeup/Interrupt function and/or the ana-

log comparator function.

Port configuration is preformed by writing to a set of con-

trol registers associated with the port. A special-purpose

instruction is used to write these control registers:

•mov !RA,W (move W to Port A control register)

•mov !RB,W (move W to Port B control register)

•mov !RC,W (move W to Port C control register)

Each one of these instructions writes a port control regis-

ter for Port A, Port B, or Port C. There are multiple control

registers for each port. To specify which one you want to

access, you use another register called the MODE regis-

ter.

3.2.1 MODE Register

The MODE register controls access to the port configura-

tion registers. Because the MODE register is not mem-

ory-mapped, it is accessed by the following special-

purpose instructions:

•mov M, #lit (move literal to MODE register)

•mov M,W (move W to MODE register)

•mov W,M (move MODE register to W)

The value contained in the MODE register determines

which port control register is accessed by the “mov !rx,W”

instruction as indicated in Table3-3. MODE register val-

ues not listed in the table are reserved for future expan-

sion and should not be used. Therefore, the MODE

Upon power-up, the MODE register is initialized to 0Fh,

which enables access to the port direction registers.

After a value is written to the MODE register, that setting

remains in effect until it is changed by writing to the

MODE register again. For example, you can write the

value 0Eh to the MODE register just once, and then write

to each of the three pullup configuration registers using

the three “mov !rx,W” instructions.

The following code example shows how to program the

pullup control registers.

First the MODE register is loaded with 0Eh to select

access to the pullup control registers (PLP_A, PLP_B,

and PLP_C). Then the MOV !rx,W instructions are used

to specify which port pins are to be connected to the

internal pullup resistors. Setting a bit to 1 disconnects the

corresponding pullup resistor, and clearing a bit to 0 con-

nects the corresponding pullup resistor.

3.2.2 Port Configuration Registers

The port configuration registers that you control with the

MOV !rx,W instruction operate as described below.

RA, RB, and RC Data Direction Registers (MODE=0Fh)

Each register bit sets the data direction for one port pin.

Set the bit to 1 to make the pin operate as a high-imped-

ance input. Clear the bit to 0 to make the pin operate as

an output.

PLP_A, PLP_B, and PLP_C: Pullup Enable Registers

(MODE=0Eh)

Each register bit determines whether an internal pullup

resistor is connected to the pin. Set the bit to 1 to discon-

nect the pullup resistor or clear the bit to 0 to connect the

pullup resistor.

Table3-3. MODE Register and Port

Control Register Access

MODE Reg. mov !RA,W mov !RB,W mov !RC,W

08h not used CMP_B not used

09h not used WKPND_B not used

0Ah not used WKED_B not used

0Bh not used WKEN_B not used

0Ch not used ST_B ST_C

0Dh LVL_A LVL_B LVL_C

0Eh PLP_A PLP_B PLP_C

0Fh RA Direction RB Direction RC Direction

mov M,#$0E ;MODE=0Eh to access port pullup

;registers

mov W,#$03 ;W = 0000 0011

mov !RA,W ;disable pullups for A0 and A1

mov W,#$FF ;W = 1111 1111

mov !RB,W ;disable all pullups for B0-B7

mov W,#$00 ;W = 0000 0000

mov !RC,W ;enable all pullups for C0-C7

SX18AC / SX20AC / SX28AC

LVL_A, LVL_B, and LVL_C: Input Level Registers

(MODE=0Dh)

Each register bit determines the voltage levels sensed on

the input port, either TTL or CMOS, when the Schmitt

trigger option is disabled. Program each bit according to

the type of device that is driving the port input pin. Set the

bit to 1 for TTL or clear the bit to 0 for CMOS.

ST_B and ST_C: Schmitt Trigger Enable Registers

(MODE=0Ch)

Each register bit determines whether the port input pin

operates with a Schmitt trigger. Set the bit to 1 to disable

Schmitt trigger operation and sense either TTL or CMOS

voltage levels; or clear the bit to 0 to enable Schmitt trig-

ger operation.

WKEN_B: Wakeup Enable Register (MODE=0Bh)

Each register bit enables or disables the Multi-Input

Wakeup/Interrupt (MIWU) function for the corresponding

Port B input pin. Clear the bit to 0 to enable MIWU opera-

tion or set the bit to 1 to disable MIWU operation. For

more information on using the Multi-Input Wakeup/Inter-

rupt function, see Section 7.1.

WKED_B: Wakeup Edge Register (MODE=0Ah)

Each register bit selects the edge sensitivity of the Port B

input pin for MIWU operation. Set the bit to 1 to sense ris-

ing (low-to-high) edges. Clear the bit to 0 to sense falling

(high-to-low) edges.

WKPND_B: Wakeup Pending Flag Register

(MODE=09h)

When you access the WKPND_B register using MOV

!RB,W, the CPU does an exchange between the contents

of W and WKPND_B. This feature lets you read the

WKPND_B register contents. Each bit indicates the sta-

tus of the corresponding MIWU pin. A bit set to 1 indi-

cates that a valid edge has occurred on the

corresponding MIWU pin, triggering a wakeup or inter-

rupt. A bit set to 0 indicates that no valid edge has

occurred on the MIWU pin.

CMP_B: Comparator Register (MODE=08h)

When you access the CMP_B register using MOV

!RB,W, the CPU does an exchange between the contents

of W and CMP_B. This feature lets you read the CMP_B

comparator. Clear bit 6 to place the comparator result on

the RB0 pin. Bit 0 is a result flag that is set to 1 when the

voltage on RB2 is greater than RB1, or cleared to 0 oth-

erwise. (For more information using the comparator, see

Section 11.0.)

3.2.3 Port Configuration Upon Power-Up

Upon power-up, all the port control registers are initial-

ized to FFh. Thus, each pin is configured to operate as a

high-impedance input that senses TTL voltage levels,

with no internal pullup resistor connected. The MODE

access to the data direction registers using the “MOV

!rx,W” instruction.

SX18AC / SX20AC / SX28AC

4.0SPECIAL-FUNCTION REGISTERS

The CPU uses a set of special-function registers to con-

trol the operation of the device.

The CPU registers include an 8-bit working register (W),

which serves as a pseudo accumulator. It holds the sec-

ond operand of an instruction, receives the literal in

immediate type instructions, and also can be program-

selected as the destination register.

A set of 31 file registers serves as the primary accumula-

tor. One of these registers holds the first operand of an

instruction and another can be program-selected as the

destination register. The first eight file registers include

the Real-Time Clock/Counter register (RTCC), the lower

eight bits of the 11-bit Program Counter (PC), the 8-bit

STATUS register, three port control registers for Port A,

Port B, Port C, and the 8-bit File Select Register (FSR).

The five low-order bits of the FSR register select one of

the 31 file registers in the indirect addressing mode. Call-

ing for the file register located at address 00h (INDF) in

any of the file-oriented instructions selects indirect

addressing, which uses the FSR register. It should be

noted that the file register at address 00h is not a physi-

cally implemented register. The CPU also contains an 8-

level, 11-bit hardware push/pop stack for subroutine link-

age.

*In the SX18 package, Port C is not used, and address

07h is available as a general-purpose RAM location.

4.1PC Register (02h)

The PC register holds the lower eight bits of the program

counter. It is accessible at run time to perform branch

operations.

4.2STATUS Register (03h)

The STATUS register holds the arithmetic status of the

ALU, the page select bits, and the reset state. The

STATUS register is accessible during run time, except

that bits PD and TO are read-only. It is recommended

that only SETB and CLRB instructions be used on this

STATUS register as the ALU status bits are updated

upon completion of the write operation, possibly leaving

the STATUS register with a result that is different than

intended.

Table4-1. Special-Function Registers

Addr Name Function

00h INDF Used for indirect addressing

01h RTCC Real Time Clock/Counter

02h PC Program Counter (low byte)

03h STATUS Holds Status bits of ALU

04h FSR File Select Register

05h RA Port RA Control register

06h RB Port RB Control register

07h RC* Port RC Control register

PA2 PA1 PA0 TO PD Z DC C

Bit 7 Bit 0

Bit 7-5: Page select bits PA2:PA0

000 = Page 0 (000h – 01FFh)

001 = Page 1 (200h – 03FFh)

010 = Page 2 (400h – 05FFh)

011 = Page 3 (600h – 07FFh)

Bit 4: Time Out bit, TO

1 = Set to 1 after power up and upon exe-

cution of CLRWDT or SLEEP instructions

0 = A watchdog time-out occurred

Bit 3: Power Down bit, PD

1= Set to a 1 after power up and upon ex-

ecution of the CLRWDT instruction

0 = Cleared to a ‘0’ upon execution of

SLEEP instruction

Bit 2: Zero bit, Z

1 = Result of math operation is zero

0 = Result of math operation is non-zero

Bit 1: Digit Carry bit, DC

After Addition:

1 = A carry from bit 3 occurred

0 = No carry from bit 3 occurred

After Subtraction:

1 = No borrow from bit 3 occurred

0 = A borrow from bit 3 occurred

Bit 0: Carry bit, C

1 = A carry or borrow from the MSB of the

result occurred. For rotate (RR and RL) in-

structions, this bit is loaded with the low or

high order bit, respectively.

0 = No carry from the MSB as a result of

Add operation, or borrow as a result of

Subtract operation.

SX18AC / SX20AC / SX28AC

4.3OPTION Register

When the OPTIONX bit in the FUSE word is cleared, bits

7 and 6 of the OPTION register are implemented.

When the OPTIONX bit is set, bits 7 and 6 of the

OPTION register read as ‘1’s.

Upon reset, all bits in the OPTION register are set to 1.

RTW RTE

_IE RTS RTE

_ES PSA PS2 PS1 PS0

Bit 7 Bit 0

RTW RTCC/W register selection:

0 = Register 01h addresses W

1 = Register 01h addresses RTCC

RTE_IE RTCC edge interrupt enable:

0 = RTCC roll-over interrupt is enabled

1 = RTCC roll-over interrupt is disabled

RTS RTCC increment select:

0 = RTCC increments on internal instruction

cycle

1 = RTCC increments upon transition on

RTCC pin

RTE_ES RTCC edge select:

0 = RTCC increments on low-to-high transi-

tions

1 = RTCC increments on high-to-low transi-

tions

PSA Prescaler Assignment:

0 = Prescaler is assigned to RTCC, with di-

vide rate determined by PS0-PS2 bits

1 = Prescaler is assigned to WDT, and divide

rate on RTCC is 1:1

PS2-PS0 Prescaler divider (see Table4-2)

Table4-2. Prescaler Divider Ratios

PS2, PS1, PS0 RTCC

Divide Rate Watchdog Timer

Divide Rate

000 1:2 1:1

001 1:4 1:2

010 1:8 1:4

011 1:16 1:8

100 1:32 1:16

101 1:64 1:32

110 1:128 1:64

111 1:256 1:128

SX18AC / SX20AC / SX28AC

5.0DEVICE CONFIGURATION REGISTERS

The SX device has three registers (FUSE, FUSEX,

DEVICE) that control functions such as operating the

device in Turbo mode, extended (8-level deep) stack

operation, and speed selection for the internal RC oscilla-

tor. These registers are not programmable “on the fly”

during normal device operation. Instead, the FUSE and

FUSEX registers can only be accessed when the SX

device is being programmed. The DEVICE register is a

read-only, hard-wired register, programmed during the

manufacturing process.

5.1FUSE Word (Read/Program at FFFh in main memory map)

TURBO SYNC OPTIONX STACKX IRC DIV2 DIV1 DIV0 CP WDTE FOSC1 FOSC0

Bit 11 Bit 0

TURBO Turbo mode enable:

0 = turbo (instruction clock = osc/1)

1 = instr clock = osc/4

SYNC Synchronous input enable (for turbo mode):

0 = enabled

1 = disabled

OPTIONX OPTION register extension enable:

0 = OPTION register increased from six to eight bits for RTW and RTW_IE

1 = OPTION register is six bits (two most significant bits forced to 1)

STACKX Stack extension enable:

0 = 8 levels (stack extension enabled)

1 = 2 levels (stack extension disabled)

IRC Internal RC oscillator enable:

0 = enabled - OSC1 weakly pulled low, OSC2 weakly pulled high

1 = disabled - OSC1 and OSC2 behave according to FOSC1: FOSC0

DIV2: DIV0 Internal RC oscillator divider:

000b =4 MHz

001b =2 MHz

010b =1 MHz

011b =500 KHz

100b =250 KHz

101b =125 KHz

110b =62.5 KHz

111b =31.25 KHz

CP Code protect enable:

0 = enabled (FUSE, code, and ID memories read back as garbled data)

1 = disabled (FUSE, code, and ID memories can be read normally)

WDTE Watchdog timer enable:

0 = disabled

1 = enabled

FOSC1: FOSC0 External oscillator configuration (valid when IRC = 1):

00b = LP – low power crystal

10b = HS – high speed crystal

01b = XT – normal crystal

11b = RC network - OSC2 is weakly pulled high (no CLKOUT output)

SX18AC / SX20AC / SX28AC

5.2FUSEX Word (Read/Program via Programming Command)

5.3DEVICE Word (Hard-Wired Read-Only)

Preset Preset Preset Preset Preset CF BOR1 BOR0 RAM1 RAM0 MEM1 MEM0

Bit 11 Bit 0

Preset bitsFactory preset values, not intended to be user configurable. These bits should not be altered by the pro-

gramming equipment.

CF active low – makes carry flag input to ADD and SUB instructions.

BOR1: BOR0 Brown-Out Reset; factory preset values. Bits should not be changed unless brown-out feature is to be

disabled. Set bits to “11b” to disable.

RAM1: RAM0 Configured number of RAM banks on chip:

00b = 1 bank

01b = 2 bank

10b = 4 bank

11b = 8 banks

MEM1:MEM0 Configured memory size on chip

Pages Banks

00b = 11

01b = 12

10b = 44

11b = 48 (default configuration)

Res. Res. Res. Res. Res. Res. Res. Res. RAM1 RAM0 MEM1 MEM0

Bit 11 Bit 0

Res. Reserved bit that reads “1”

RAM1:RAM0 Absolute number of RAM banks on chip:

00b = 1

01b = 2

10b = 4

11b = 8 banks

MEM1:MEM0 Absolute memory size on chip:

00b = 512 words

01b = 1024 words

10b = 2048 words

11b = 4096 words (Reserved)

SX18AC / SX20AC / SX28AC

6.0MEMORY ORGANIZATION

6.1Program Memory

The program memory is organized as 2K, 12-bit wide

words. The program memory words are addressed

sequentially by a binary program counter. The program

counter starts at zero. If there is no branch operation, it

will increment to the maximum value possible for the

device and roll over and begin again.

Internally, the program memory has a semi-transparent

page structure. A page is composed of 512 contiguous

program memory words. The lower nine bits of the pro-

gram counter are zeros at the first address of a page and

ones at the last address of a page. This page structure

has no effect on the program counter. The program

counter will freely increment through the page bound-

aries.

6.1.1 Program Counter

The program counter contains the 11-bit address of the

instruction to be executed. The lower eight bits of the pro-

gram counter are contained in the PC register (02h) while

the upper bits come from the upper three bits of the STA-

TUS register (PA0, PA1, PA2). This is necessary to cause

jumps and subroutine calls across program memory

page boundaries. Prior to the execution of a branch oper-

ation, the user program must initialize the upper bits of

the STATUS register to cause a branch to the desired

page. An alternative method is to use the PAGE instruc-

tion, which automatically causes branch to the desired

page, based on the value specified in the operand field.

Upon reset, the program counter is initialized with 07FFh.

6.1.2 Subroutine Stack

The subroutine stack consists of eight 11-bit save regis-

ters. A physical transfer of register contents from the pro-

gram counter to the stack or vice versa, and within the

stack, occurs on all operations affecting the stack, prima-

rily calls and returns. The stack is physically and logically

separate from data RAM. The program cannot read or

write the stack.

6.2Data Memory

The data memory consists of 136 bytes of RAM, orga-

nized as eight banks of 16 registers plus eight registers

which are not banked. Both banked and non-banked

memory locations can be addressed directly or indirectly

using the FSR (File Select Register). The special-func-

tion registers are mapped into the data memory.

6.2.1 File Select Register (04h)

Instructions that specify a register as the operand can

only express five bits of register address. This means

that only registers 00h to 1Fh can be accessed. The File

Select Register (FSR) provides the ability to access reg-

isters beyond 1Fh.

Figure6-1 shows how FSR can be used to address RAM

locations. The three high-order bits of FSR select one of

eight SRAM banks to be accessed. The five low-order

bits select one of 32 SRAM locations within the selected

bank. For the lower 16 addresses, Bank 0 is always

accessed, irrespective of the three high-order bits. Thus,

RAM register addresses 00h through 0Fh are “global” in

that they can always be accessed, regardless of the con-

tents of the FSR.

The entire data memory (including the dedicated-function

registers) consists of the lower 16 bytes of Bank 0 and

the upper 16 bytes of Bank 0 through Bank 7, for a total

of (1+8)*16 = 144 bytes. Eight of these bytes are for the

function registers, leaving 136 general-purpose memory

locations. In the 18-pin SX packages, register RC is not

used, which makes address 07h available as an addi-

tional general-purpose memory location.

Below is an example of how to write to register 10h in

Bank 4:

mov FSR,#$90 ;Select Bank 4 by

;setting FSR<7:5>

mov 10h,#$64 ;load register 10h with

;the literal 64h

SX18AC / SX20AC / SX28AC

Figure6-1. Data Memory Organization

Function Registers

INDF

RTCC

STATUS

FSR

SRAM

(8 bytes)

Bank 7

Bank 6

Bank 5

Bank 4

Bank 3

Bank 2

Bank 1

Bank 0

000

001

010

011

100

101

110

111

FSR

SRAM

(16 bytes

each bank

128 bytes

total)

7 6 5 432 1 0

Bank 0 is always accessed for

the lower 16 addresses,

irrespective of the three high-

order bits of FSR.

Registers

(8 bytes)

Bank 0

SX18AC / SX20AC / SX28AC

7.0POWER DOWN MODE

The power down mode is entered through the execution

of the SLEEP instruction while the SLEEP mode is

enabled.

In SLEEP mode, only the Watchdog Timer (WDT) is

active. If the Watchdog Timer is enabled, upon execution

of the SLEEP instruction, the Watchdog Timer is cleared,

the TO bit is set in the STATUS register, and the PD bit is

cleared in the STATUS register.

There are three different ways to exit from the low power

sleep mode: a timer overflow signal from the Watchdog

Timer (WDT), a valid transition on any of the Multi-Input

Wakeup pins (Port B pins), or through an external reset

input on the MCLR pin.

To achieve the lowest possible power consumption, the

Watchdog Timer should be disabled and the device

should exit the SLEEP mode through the MIWU pins or

an external reset.

7.1Multi-Input Wakeup

Multi-Input Wakeup is one way of causing the device to

exit the power down mode. Port B is used to support this

feature. The WKEN_B register (Wakeup Enable Regis-

ter) allows any Port B pin or combination of pins to cause

the wakeup. Clearing a bit in the WKEN_B register

enables the wakeup on the corresponding Port B pin. If

multi-input wakeup is selected to cause a wakeup, the

trigger condition on the selected pin can be either rising

edge (low to high) or falling edge (high to low). The

WKED_B register (Wakeup Edge Select) selects the

desired transition edge. Setting a bit in the WKED_B reg-

ister selects the falling edge on the corresponding Port B.

Resetting the bit selects the rising edge. The WKEN_B

and WKED_B registers are set to FFh upon reset.

Once a valid transition occurs on the selected pin, the

WKPND_B register (Wakeup Pending Register) latches

the transition in the corresponding bit position. A logic ‘1’

indicates the occurrence of the selected trigger edge on

the corresponding Port B pin.

Upon exiting the power down mode, the Multi-Input

Wakeup logic causes program counter to branch to the

maximum program memory address (same as reset).

Figure7-1 shows the Multi-Input Wakeup block diagram.

Figure7-1. Multi-Input Wakeup Block Diagram

Internal Data Bus

MODE

Wake-up : Exit Power Down

RB7 RB6 RB1 RB0

WKED_B

WKPND_B

WKEN_B

MODE = 09

MODE = 0B

MODE = 0A

Port B

Configured

as Input

0 1

0 = Enable

1 = Disable

SX18AC / SX20AC / SX28AC

7.2Port B MIWU/Interrupt Configuration

The WKPND_B register comes up with a random value

upon reset. The user program must clear the register

prior to enabling the wake-up condition or interrupts. The

proper initialization sequence is:

1. Clear the WKPND_B register

2. Select the desired edge (through WKED_B register)

3. Enable the Wakeup condition (through WKEN_B regis-

ter)

Below is an example how to read the WKPND_B register

to determine which Port B pin caused the wakeup or

interrupt, and to clear the WKPND_B register:

The final “mov” instruction in this example performs an

exchange of data between the working register (W) and

the WKPND_B register. This exchange occurs only with

Port B accesses. Otherwise, the “mov” instruction does

not perform an exchange, but only moves data from the

source to the destination.

Here is an example of a program segment that config-

ures the RB0, RB1, and RB2 pins to operate as Multi-

Input Wakeup/Interrupt pins, sensitive to falling edges:

To prevent false interrupts, the enabling step (clearing

bits in WKEN_B) should be done as the last step in a

sequence of Port B configuration steps.

After this program segment is executed, the device can

receive interrupts on the RB0, RB1, and RB2 pins. If the

device is put into the power down mode (by executing a

“sleep” instruction), the device can then receive wakeup

signals on those same pins.

mov M,#$09

clr W

mov !RB,W ;W contains WKPND_B

;contents of W exchanged

;with contents of WKPND_B

mov M,#$09 ;prepare to access WKPND_B

;(pending) register

mov W,#$00 ;clear W

mov !RB,W ;clear all wakeup pending flags

mov M,#$0F ;prepare to write port data

;direction registers

mov W,#$07 ;load W with the value 07h

mov !RB,W ;configure RB0-RB2 to be inputs

mov M,#$0A ;prepare to write WKED_B

;(edge) register

;W contains the value 07h

mov !RB,W ;configure RB0-RB2 to sense

;falling edges

mov M,#$0B ;prepare to write WKEN_B (enable)

;register

mov W,#$F8h ;load W with the value F8h

mov !RB,W ;enable RB0-RB2 to operate as

;wakeup inputs

SX18AC / SX20AC / SX28AC

8.0INTERRUPT SUPPORT

The device supports both internal and external maskable

interrupts. The internal interrupt is generated as a result

of the RTCC rolling over from 0FFh to 00h. This interrupt

source has an associated enable bit located in the

OPTION register. There is no pending flag associated

with this interrupt.

Port B provides the source for eight external software

selectable, edge sensitive interrupts, when the device is

not in the SLEEP mode. These interrupt sources share

logic with the Multi-Input Wakeup circuitry. The WKEN_B

enabled or disabled. Clearing a bit in the WKEN_B regis-

ter enables the interrupt on the corresponding Port B pin.

The WKED_B selects the transition edge to be either

positive or negative. The WKEN_B and WKED_B regis-

ters are cleared upon reset. Setting a bit in the WKED_B

selects the rising edge on the corresponding Port B pin.

The WKPND_B register serves as the external interrupt

pending register.

The WKPND_B register comes up a with random value

upon reset. The user program must clear the WKPND_B

sequence is described in Section 7.2.

Figure8-1 shows the structure of the interrupt logic.

All interrupts are global in nature; that is, no interrupt has

priority over another. Interrupts are handled sequentially.

Figure8-2 shows the interrupt processing sequence.

Once an interrupt is acknowledged, all subsequent global

interrupts are disabled until return from servicing the cur-

rent interrupt. The PC is pushed onto the single level

interrupt stack, and the contents of the FSR, STATUS,

and W registers are saved in their corresponding shadow

registers. The interrupt logic has its own single-level

stack and is not part of the CALL subroutine stack. The

vector for the interrupt service routines is address 0.

Once in the interrupt service routine, the user program

must poll all external interrupt pending bits to determine

the source of the interrupt. The interrupt service routine

should clear the corresponding interrupt pending flag.

The user program may also need to read the contents of

RTCC to determine any recent RTCC rollover. This is

needed since there is no interrupt pending flag associ-

ated with the RTCC rollover.

Upon return from the interrupt service routine, the con-

tents of PC, FSR, STATUS, and W registers are restored

from their corresponding shadow registers. The interrupt

service routine should end with instructions such as RETI

and RETIW. RETI pops the interrupt stack and the spe-

cial shadow registers used for storing W, STATUS, and

FSR (preserved during interrupt handling). RETIW

behaves like RETI but also writes the literal to RTCC.

The interrupt return instruction enables the global inter-

rupts.

Figure8-1. Interrupt Structure

RTCC

WKED_B

Internal Data Bus

WKED_B

WKPND_B

From MODE

(Mode = 09)

OPTION

RTE_IE

WKEN_B

1 = Ext Interrupt through Port B

0 = Sleep Mode, no Ext Interrupt

STATUS PD

Port B PIN

Interrupt

PC Interrupt Stack

000

Overflow

SX18AC / SX20AC / SX28AC

Figure8-2. Interrupt Processing

Interrupt

RETI

PC PC

0000h

Address 0000h

Program

Memory Interrupt

Service

Routine

STATUS

FSR

Shadow Register

STATUS

Shadow Register

FSR

Shadow Register

STATUS

FSR

Shadow Register

STATUS

Shadow Register

FSR

Shadow Register

Stack

Interrupt

Stack

Note:The interrupt logic has its own single-level

stack and is not part of the CALL subroutine stack.

SX18AC / SX20AC / SX28AC

9.0OSCILLATOR CIRCUITS

The device supports several user-selectable oscillator

modes. The oscillator modes are selected by program-

ming the appropriate values into the FUSE Word register.

These are the different oscillator modes offered:

9.1XT, LP or HS modes

In XT, LP or HS, modes, you can use either an external

resonator network or an external clock signal as the

device clock.

To use an external resonator network, you connect a

crystal or ceramic resonator to the OSC1/CLKIN and

OSC2/CLKOUT pins according to the circuit configura-

tion shown in Figure9-1. Table9-1 shows the recom-

mended capacitor values to be used with ceramic

resonators. Table9-2 shows the recommended compo-

nent values to be used at different crystal frequencies. A

parallel resonant crystal type is recommended. Use of a

series resonant crystal may result in a frequency that is

outside the crystal manufacturer specifications.

If the XT, LP, or HS mode is selected, the OSC1/CLKIN

pin can driven by an external clock source rather than a

resonator network, as long as the clock signal meets the

specified duty cycle, rise and fall times, and input levels

(Figure9-2). In this case, the OSC2/CLKOUT pin should

be left open.

Note:Series resistor (RS) is not required for frequencies

higher than 1 MHz; use a direct connection instead.

LP: Low Power Crystal

XT: Crystal/Resonator

HS: High Speed Crystal/Resonator

RC: External Resistor/Capacitor

Internal Resistor/Capacitor

Figure9-1. Crystal Operation (or Ceramic Resonator)

(HS, XT or LP OSC Configuration)

SX Device

XTAL

OSC2

OSC1

C1C2

Internal

Circuitry

SLEEP

Figure9-2. External Clock Input Operation

(HS, XT or LP OSC Configuration)

Table9-1. Capacitor Selection for

Ceramic Resonators

Clock

Mode Resonator

Frequency C1 C2 RFRS

XT 455 kHz 220 pF 220 pF 1 MΩ6.8 kΩ

XT 1 MHz 100 pF 100 pF 1 MΩ6.8 kΩ

XT 2 MHz 100 pF 100 pF 100 kΩ680 Ω

HS 4 MHz 100 pF 100 pF 100 kΩ0

HS 4 MHz Internal

(47 pF) Internal

(47 pF) 100 kΩ470 Ω

HS 8 MHz 30 pF 30 pF 1 MΩ0

HS 8 MHz Internal

(47 pF) Internal

(47 pF) 1 MΩ470 Ω

HS 12 MHz 30 pF 30 pF 1 MΩ0

HS 12 MHz Internal

(22 pF) Internal

(22 pF) 1 MΩ0

HS 16 MHz 15 pF 15 pF 1 MΩ0

HS 16 MHz Internal

(15 pF) Internal

(15 pF) 1 MΩ0

HS 20 MHz 10 pF 10 pF 1 MΩ0

HS 33 MHz 10 pF 10 pF 33 kΩ0

HS 50 MHz* Internal

(5 pF) Internal

(5 pF) 33 kΩ0

* Note: Resonator with built-in capacitors.

Externally

Generated Clock

OSC1 OSC2

Open

SX Device

SX18AC / SX20AC / SX28AC

Note:Resistor Rf is not required for the Version 2.1 device

(both crystal and resonator circuits.)

9.2External RC Mode

The external RC oscillator mode provides a cost-effective

approach for applications that do not require a precise

operating frequency. In this mode, the RC oscillator fre-

quency is a function of the supply voltage, the resistor (R)

and capacitor (C) values, and the operating temperature.

In addition, the oscillator frequency will vary from unit to

unit due to normal manufacturing process variations. Fur-

thermore, the difference in lead frame capacitance

between package types also affects the oscillation fre-

quency, especially for low C values. The external R and

C component tolerances contribute to oscillator fre-

quency variation as well.

Figure9-3 shows the external RC connection diagram.

The recommended R value is from 3kΩ to 100kΩ. For R

values below 2.2kΩ, the oscillator may become unstable,

or may stop completely. For very high R values (such as

1 MΩ), the oscillator becomes sensitive to noise, humid-

ity, and leakage.

Although the oscillator will operate with no external

capacitor (C = 0pF), it is recommended that you use val-

ues above 20 pF for noise immunity and stability. With no

or small external capacitance, the oscillation frequency

can vary significantly due to variation in PCB trace or

package lead frame capacitances.

In the external RC mode, the OSC2/CLKOUT pin pro-

vides an output frequency, which the input frequency

divided by four.

9.3Internal RC Mode

The internal RC mode uses an internal oscillator, so the

device does not need any external components. At 4

MHz, the internal oscillator provides +/–8% accuracy

over the allowed temperature range. The internal clock

frequency can be divided down to provide one of eight

lower-frequency choices by selecting the desired value in

the FUSE Word register. The frequency range is from

31.25 KHz to 4 MHz.

Table9-2. Component Selection for

Crystal Oscillator

Osc

Type Resonator

Frequency C1

(pF) C2

(pF) RF

XT 4 20 47 1M

HS 8 20 47 1M

HS 12 20 47 1M

HS 16 15 30 1M

HS 20 15 30 1M

HS 25 5 20 10k

HS 30 5 20 4.7k

HS 36 5 15 3.3k

HS 40 5 15 3.3k

HS 50 5 10 3.3k

Figure9-3. RC Oscillator Mode

Vdd R

Internal

Circuitry

OSC2

OSC1

÷ 4

SX Device

SX18AC / SX20AC / SX28AC

10.0REAL TIME CLOCK

(RTCC)/WATCHDOG TIMER

The device contains an 8-bit Real Time Clock/Counter

(RTCC) and an 8-bit Watchdog Timer (WDT). An 8-bit

programmable prescaler extends the RTCC to 16 bits. If

the prescaler is not used for the RTCC, it can serve as a

postscaler for the Watchdog Timer. Figure10-1 shows

the RTCC and WDT block diagram.

10.1RTCC

RTCC is an 8-bit real-time timer that is incremented once

each instruction cycle or from a transition on the RTCC

pin. The on-board prescaler can be used to extend the

RTCC counter to 16 bits.

The RTCC counter can be clocked by the internal instruc-

tion cycle clock or by an external clock source presented

at the RTCC pin.

To select the internal clock source, bit 5 of the OPTION

mented at each instruction cycle unless the prescaler is

selected to increment the counter.

To select the external clock source, bit 5 of the OPTION

incremented with each valid signal transition at the RTTC

pin. By using bit 4 of the OPTION register, the transition

can be programmed to be either a falling edge or rising

edge. Setting the control bit selects the falling edge to

increment the counter. Resetting the bit selects the rising

edge.

The RTCC generates an interrupt as a result of an RTCC

rollover from 0FF to 000. There is no interrupt pending bit

to indicate the overflow occurrence. The RTCC register

must be sampled by the program to determine any over-

flow occurrence.

10.2Watchdog Timer

The watchdog logic consists of a Watchdog Timer which

shares the same 8-bit programmable prescaler with the

RTCC. The prescaler actually serves as a postscaler if

used in conjunction with the WDT, in contrast to its use as

a prescaler with the RTCC.

10.3The Prescaler

The 8-bit prescaler may be assigned to either the RTCC

or the WDT through the PSA bit (bit 3 of the OPTION reg-

ister). Setting the PSA bit assigns the prescaler to the

WDT. If assigned to the WDT, the WDT clocks the pres-

caler and the prescaler divide rate is selected by the

PS0, PS1, and PS2 bits located in the OPTION register.

Resetting the PSA bit assigns the prescaler to the RTCC.

Once assigned to the RTCC, the prescaler clocks the

RTCC and the divide rate is selected by the PS0, PS1,

and PS2 bits in the OPTION register. The prescaler is not

mapped into the data memory, so run-time access is not

possible.

The prescaler cannot be assigned to both the RTCC and

WDT simultaneously.

Figure10-1. RTCC and WDT Block Diagram

WDTE (from FUSE Word)

RTCC pin

MUX

8-Bit Prescaler

MUX (8 to 1)

8-Bits

WDT Time-out

Data Bus

WDT

MUX

XRTCC

FOSC RST

RTE_ES

PSA

PS2

PS1

PS0

OPTION

RTCC Rollover

Interrupt

RTE_IE

RTW

RTCC

Interrupt

Enable

SX18AC / SX20AC / SX28AC

11.0COMPARATOR

The device contains an on-chip differential comparator.

Ports RB0-RB2 support the comparator. Ports RB1 and

RB2 are the comparator negative and positive inputs,

respectively, while Port RB0 serves as the comparator

output pin. To use these pins in conjunction with the com-

parator, the user program must configure Ports RB1 and

RB2 as inputs and Port RB0 as an output. The CMP_B

put of the comparator internally, and to enable the output

of the comparator to the comparator output pin.

The comparator enable bits are set to “1” upon reset,

thus disabling the comparator. To avoid drawing addi-

tional current during the SLEEP mode, the comparator

should be disabled before entering the SLEEP mode.

Here is an example of how to setup the comparator and

read the CMP_B register.

The final “mov” instruction in this example performs an

exchange of data between the working register (W) and

the CMP_B register. This exchange occurs only with Port

B accesses. Otherwise, the “mov” instruction does not

perform an exchange, but only moves data from the

source to the destination.

The following figure shows the format of the CMP_B reg-

ister.

CMP_B - Comparator Enable/Status Register

mov M,#$08 ;set MODE register to access

;CMP_B

mov W,#$00 ;clear W

mov !RB,W ;enable comparator and its

;output

... ;delay after enabling

;comparator for response

mov M,#$08 ;set MODE register to access

;CMP_B

mov W,#$00 ;clear W

mov !RB,W ;enable comparator and its

;output and also read CMP_B

;(exchange W and CMB_B)

and W,#$01 ;set/clear Z flag based on

;comparator result

snb $03.2 ;test Z flag in STATUS reg

;(0 => RB2<RB1)

jmp rb2_hi ;jump only if RB2>RB1

...

CMP_EN CMP_OE Reserved CMP_RES

Bit 7 Bit 6 Bits 5–1 Bit 0

CMP_RES Comparator result: 1 for RB2>RB1 or 0

for RB2<RB1. Comparator must be en-

abled (CMP_EN = 0) to read the result.

The result can be read whether or not the

CMP_OE bit is cleared.

CMP_OE When cleared to 0, enables the compar-

ator output to the RB0 pin.

CMP_EN When cleared to 0, enables the compar-

ator.

Figure11-1. Comparator Block Diagram

MODE

CMP_EN

CMP_OE

CMP_RES

RB0

RB1

RB2

CMP_B

MODE = 08h

Point to CMP_B

Internal Data Bus

SX18AC / SX20AC / SX28AC

12.0RESET

Power-On-Reset, Brown-Out reset, watchdog reset, or

external reset initializes the device. Each one of these

reset conditions causes the program counter to branch to

the top of the program memory. For example, on the

device with 2K of program memory, the program counter

is initialized to 07FF.

The device incorporates an on-chip Power-On Reset

(POR) circuit that generates an internal reset as Vdd rises

during power-up. Figure12-1 is a block diagram of the

circuit. The circuit contains an 8-bit Delay Reset Timer

(DRT) and a reset latch. The DRT controls the reset time-

out delay. The reset latch controls the internal reset sig-

nal. Upon power-up, the reset latch is set (device held in

reset), and the DRT starts counting once it detects a valid

logic high signal at the MCLR pin. Once DRT reaches the

end of the timeout period (typically 72 msec), the reset

latch is cleared, releasing the device from reset state.

Figure12-2 shows a power-up sequence where MCLR is

not tied to the Vdd pin and Vdd signal is allowed to rise

and stabilize before MCLR pin is brought high. The

device will actually come out of reset Tdrt msec after

MCLR goes high.

The brown-out circuitry resets the chip when device

power (Vdd) dips below its minimum allowed value, but

not to zero, and then recovers to the normal value.

Figure12-3 shows the on-chip Power-On Reset

sequence where the MCLR and Vdd pins are tied

together. The Vdd signal is stable before the DRT time-

out period expires. In this case, the device will receive a

proper reset. However, Figure12-4 depicts a situation

where Vdd rises too slowly. In this scenario, the DRT will

time-out prior to Vdd reaching a valid operating voltage

level (Vdd min). This means the device will come out of

reset and start operating with the supply voltage not at a

valid level. In this situation, it is recommended that you

use the external RC circuit shown in Figure12-5. The RC

delay should exceed the time period it takes Vdd to reach

a valid operating voltage.

Note1:The external Power-On Reset circuit is required

only if Vdd power-up is too slow. The diode D helps dis-

charge the capacitor quickly when Vdd powers down.

Note2:R < 40 kΩ is recommended to make sure that

voltage drop across R does not violate the device electri-

cal specifications.

Note3:R1 = 100Ω to 1kΩ will limit any current flowing

into MCLR from external capacitor C. This helps prevent

MCLR pin breakdown due to Electrostatic Discharge

(ESD) or Electrical Overstress (EOS).

Note:Ripple counter is 10 bits for Power on Reset (POR)

only.

Figure12-1. Block Diagram of On-Chip Reset Circuit

POR

BROWN-OUT

MIWU

MCLR/Vpp pin wdt_time_out

10-Bit Asynch

Ripple

Counter

(DRT Start-Up

Timer)

Vdd

rc_clk drt_time

_out

QN RESET

POR

enable

Figure12-2. Time-Out Sequence on Power-Up

(MCLR not tied to Vdd)

Figure12-3. Time-out Sequence on Power-up

(MCLR tied to Vdd): Fast Vdd Rise Time

Figure12-4. Time-out Sequence on Power-up

(MCLR tied to Vdd): Slow Rise Time

Vdd

MCLR

POR

drt_time_out

RESET

Tdrt

Vdd

MCLR

POR

drt_time_out

RESET

Tdrt

Vdd

MCLR

POR

drt_time_out

RESET

Tdrt

SX18AC / SX20AC / SX28AC

13.0BROWN-OUT DETECTOR

The on-chip brown-out detection circuitry resets the

device when Vdd dips below the specified brown-out volt-

age. The device is held in reset as long as Vdd stays

below the brown-out voltage. The device will come out of

reset when Vdd rises above the brown-out voltage. The

brown-out level is preset to approximately 4.2V at the

factory. The brown-out circuit can be disabled through

BOR0 and BOR1 bits contained in the FUSEX Word reg-

ister.

Figure12-5. External Power-On Reset Circuit

(For Slow Vdd Power-up)

Vdd

MCLR

DR1

SX18AC / SX20AC / SX28AC

14.0REGISTER STATES UPON RESET

The effect of a reset operation on a register depends on

the register and the type of reset operation. Some regis-

ters are initialized to specific values, some are left

unchanged (for wakeup and brown-out resets), and some

are initialized to an unknown value. A register that starts

with an unknown value should be initialized by the soft-

ware to a known value; you cannot simply test the initial

state and rely on it starting in that state consistently.

Table14-1 lists the SX registers and shows the state of

each register upon different reset.

Table14-1. Register States Upon Reset

Timeout MCLR

WUndefined Unchanged Undefined Unchanged Unchanged

OPTION FFh FFh FFh FFh FFh

MODE 0Fh 0Fh 0Fh 0Fh 0Fh

RTCC (01h) Undefined Unchanged Undefined Unchanged Unchanged

PC (02h) 0Fh 0Fh 0Fh 0Fh 0Fh

STATUS (03h) Bits 0-2: Unde-

fined

Bits 3-4: 1

Bits 5-7: 0

Bits 0-2: Unde-

fined

Bits 3-4: Unch.

Bits 5-7: 0

Bits 0-4: Unde-

fined

Bits 5-7: 0

Bits 0-2: Unde-

fined

Bits 3-4: (Note 1)

Bits 5-7: 0

Bits 0-2: Unde-

fined

Bits 3-4: (Note 2)

Bits 5-7: 0

FSR (04h) Undefined Bits 0-6: Unde-

fined

Bit 7: 1

Bits 0-6: Unde-

fined

Bit 7: 1

Bits 0-6: Unde-

fined

Bit 7: 1

Bits 0-6: Unde-

fined

Bit 7: 1

RA/RB/RC

Direction

FFh FFh FFh FFh FFh

RA/RB/RC Data Undefined Unchanged Undefined Unchanged Unchanged

Other File Registers -

SRAM Undefined Unchanged Undefined Unchanged Unchanged

CMP_B Bits 0, 6-7: 1

Bits 1-5: Unde-

fined

Bits 0, 6-7: 1

Bits 1-5: Unde-

fined

Bits 0, 6-7: 1

Bits 1-5: Unde-

fined

Bits 0, 6-7: 1

Bits 1-5: Unde-

fined

Bits 0, 6-7: 1

Bits 1-5: Unde-

fined

WKPND_B FFh Unchanged Undefined Unchanged Unchanged

WKED_B FFh FFh FFh FFh FFh

WKEN_B FFh FFh FFh FFh FFh

ST_B/ST_C FFh FFh FFh FFh FFh

LVL_A/LVL_B/LVL_C FFh FFh FFh FFh FFh

PLP_A/PLP_B/PLP_C FFh FFh FFh FFh FFh

Watchdog Counter Undefined Unchanged Undefined Unchanged Unchanged

NOTE: 1. Watchdog reset during SLEEP mode: 00

Watchdog reset during Active mode: 01

NOTE: 2. External reset during SLEEP mode: 10

External reset during Active mode: Unchanged

SX18AC / SX20AC / SX28AC

15.0INSTRUCTION SET

As mentioned earlier, the SX family of devices uses a

modified Harvard architecture with memory-mapped

input/output. The device also has a RISC type architec-

ture in that there are 43 single-word basic instructions.

The instruction set contains byte-oriented file register, bit-

oriented file register, and literal/control instructions.

Working register W is one of the CPU registers, which

serves as a pseudo accumulator. It is a pseudo accumu-

lator in a sense that it holds the second operand,

receives the literal in the immediate type instructions, and

also can be program-selected as the destination register.

The bank of 31 file registers can also serve as the pri-

mary accumulators, but they represent the first operand

and may be program-selected as the destination regis-

ters.

15.1Instruction Set Features

1. All single-word (12-bit) instructions for compact code

efficiency.

2. All instructions are single cycle except the jump type in-

structions (JMP, CALL) and failed test instructions

(DECSZ fr, INCSZ fr, SB bit, SNB bit), which are two-

cycle.

3. A set of File registers can be addressed directly or indi-

rectly, and serve as accumulators to provide first oper-

and; W register provides the second operand.

4. Many instructions include a destination bit which se-

lects either the register file or the accumulator as the

destination for the result.

5. Bit manipulation instructions (Set, Clear, Test and Skip

if Set, Test and Skip if Clear).

6. STATUS Word register memory-mapped as a register

file, allowing testing of status bits (carry, digit carry, ze-

ro, power down, and timeout).

7. Program Counter (PC) memory-mapped as register file

allows W to be used as offset register for indirect ad-

dressing of program memory.

8. Indirect addressing data pointer FSR (file select regis-

ter) memory-mapped as a register file.

9. IREAD instruction allows reading the instruction from

the program memory addressed by W and upper four

bits of MODE register.

10.Eight-level, 11-bit push/pop hardware stack for sub-

routine linkage using the Call and Return instructions.

11.Six addressing modes provide great flexibility.

15.2Instruction Execution

An instruction goes through a four-stage pipeline to be

executed (Figure15-1). The first instruction is fetched

from the program memory on the first clock cycle. On the

second clock cycle, the first instruction is decoded and

the second instruction is fetched. On the third clock cycle,

the first instruction is executed, the second instruction is

decoded, and the third instruction is fetched. On the

fourth clock cycle, the first instruction’s results are written

to its destination, the second instruction is executed, the

third instruction is decoded, and the fourth instruction is

fetched. Once the pipeline is full, instructions are exe-

cuted at the rate of one per clock cycle.

Instructions that directly affect the contents of the pro-

gram counter (such as jumps and calls) require that the

pipeline be cleared and subsequently refilled. Therefore,

these instruction take more than one clock cycle.

The instruction execution time is derived by dividing the

oscillator frequency by either one (turbo mode) or four

(non-turbo mode). The divide-by factor is selected

through the FUSE Word register.

15.3Addressing Modes

The device support the following addressing modes:

Data Direct

Data Indirect

Immediate

Program Direct

Program Indirect

Relative

Both direct and indirect addressing modes are available.

The INDF register, though physically not implemented, is

used in conjunction with the indirect data pointer (FSR) to

perform indirect addressing. An instruction using INDF as

its operand field actually performs the operation on the

quently, processing two multiple-byte operands requires

alternate loading of the operand addresses into the FSR

pointer as the multiple byte data fields are processed.

Examples:

Direct addressing:

Indirect Addressing:

Figure15-1. Pipeline and Clock Scheme

mov RA,#01 ;move “1” to RA

mov FSR,#RA ;FSR = address of RA

mov INDF,#$01 ;move “1” to RA

Fetch Decode Execute Write

Clock

Cycle

Clock

Cycle

Clock

Cycle

Clock

Cycle

SX18AC / SX20AC / SX28AC

15.4RAM Addressing

Direct Addressing

The FSR register must initialized with an appropriate

value in order to address the desired RAM register. The

following table and code example show how to directly

access the banked registers.

Indirect Addressing

To access any register via indirect addressing, simply

move the eight-bit address of the desired register into the

FSR and use INDF as the operand. The example below

shows how to clear all RAM locations from 10h to 1Fh in

all eight banks:

15.5The Bank Instruction

Often it is desirable to set the bank select bits of the FSR

provides this capability. This instruction sets the upper

bits of the FSR to point to a specific RAM bank without

affecting the other FSR bits.

Example:

15.6Bit Manipulation

The instruction set contains instructions to set, reset, and

test individual bits in data memory. The device is capable

of bit addressing anywhere in data memory.

15.7Input/Output Operation

The device contains three registers associated with each

I/O port. The first register (Data Direction Register), con-

figures each port pin as a Hi-Z input or output. The sec-

ond register (TTL/CMOS Register), selects the desired

input level for the input. The third register (Pull-Up Regis-

ter), enables a weak pull-up resistor on the pin configured

as a input. In addition to using the associated port regis-

ters, appropriate values must be written into the MODE

15.7.1 Read-Modify-Write Considerations

Caution must be exercised when performing successive

SETB or CLRB operations on I/O port pin. Input data

used for an instruction must be valid during the time the

instruction is executed, and the output result from an

instruction is valid only after that instruction completes its

operation. Unexpected results from successive read-

modify-write operations on I/O pins can occur when the

device is running at extremely high speeds. Although the

device has an internal write-back section to prevent such

conditions, it is still recommended that the user program

include a NOP instruction as a buffer between succes-

sive read-modify-write instructions performed on I/O pins

of the same port.

Also note that reading an I/O port is actually reading the

pins, not the output data latches. That is, if the pin output

driver is enabled and driven high while the pin is held low

externally, the port pin will read low.

15.8Increment/Decrement

The bank of 31 registers serves as a set of accumulators.

The instruction set contains instructions to increment and

decrement the register file. The device also includes both

INCSZ fr (increment file register and skip if zero) and

DECSZ fr (decrement file register and skip if zero)

instructions.

15.9Loop Counting and Data Pointing

Testing

The device has specific instructions to facilitate loop

counting. The DECSZ fr (decrement file register and skip

if zero) tests any one of the file registers and skips the

next instruction (which can be a branch back to loop) if

the result is zero.

15.10Branch and Loop Call Instructions

The device contains an 8-level hardware stack where the

return address is stored with a subroutine call. Multiple

stack levels allow subroutine nesting. The instruction set

supports absolute address branching.

15.10.1 Jump Operation

When a JMP instruction is executed, the lower nine bits

of the program counter is loaded with the address of the

specified label. The upper two bits of the program

counter are loaded with the page select bits, PA1:PA0,

contained in the STATUS register. Therefore, care must

be exercised to ensure the page select bits are pointing

to the correct page before the jump occurs.

Bank FSR Value

0010h

1030h

2050h

3070h

4090h

50B0h

60D0h

70F0h

mov FSR,#$070 ;Select RAM Bank 3

clr $010 ;Clear register 10h on

;Bank 3

mov FSR,#$D0 ;Select RAM Bank 6

clr $010 ;Clear register 10h on

;Bank 6

clr FSR ;clear FSR to 00h (at address

;04h)

:loop setb SFR.4 ;set bit 4: address 10h-1Fh,

;30-3Fh, etc

clr INDF ;clear register pointed to by

;FSR

incsz FSR ;increment FSR and test, skip

;jmp if 00h

jmp :loop ;jump back and clear next

;register

bank $F0 ;Select Bank 7 in FSR

inc $1F ;increment file register

;1Fh in Bank 7

SX18AC / SX20AC / SX28AC

15.10.2 Page Jump Operation

When a JMP instruction is executed and the intended

destination is on a different page, the page select bits

must be initialized with appropriate values to point to the

desired page before the jump occurs. This can be done

easily with SETB and CLRB instructions or by writing a

value to the STATUS register. The device also has the

PAGE instruction, which automatically selects the page in

a single-cycle execution.

Note:“N” must be 0, 1, 2, or 3.

15.10.3 Call Operation

The following happens when a CALL instruction is exe-

cuted:

•The current value of the program counter is increment-

ed and pushed onto the top of the stack.

•The lower eight bits of the label address are copied into

the lower eight bits of the program counter.

•The ninth bit of the Program Counter is cleared to zero.

•The page select bits (in STATUS register) are copied

into the upper two bits of the Program Counter.

This means that the call destination must start in the

lower half of any page. For example, 00h-0FFh, 200h-

2FFh, 400h-4FFh, etc.

15.10.4 Page Call Operation

When a subroutine that resides on a different page is

called, the page select bits must contain the proper val-

ues to point to the desired page before the call instruction

is executed. This can be done easily using SETB and

CLRB instructions or writing a value to the STATUS reg-

ister. The device also has the PAGE instruction, which

automatically selects the page in a single-cycle execu-

tion.

Note:“N” must be 0, 1, 2, or 3.

15.11Return Instructions

The device has several instructions for returning from

subroutines and interrupt service routines. The return

from subroutine instructions are RET (return without

affecting W), RETP (same as RET but affects PA1:PA0),

RETI (return from interrupt), RETIW (return that affects

W), and RETW #literal (return and place literal in W). The

literal serves as an immediate data value from memory.

This instruction can be used for table lookup operations.

To do table lookup, the table must contain a string of

RETW #literal instructions. The first instruction just in

front of the table calculates the offset into the table. The

table can be used as a result of a CALL.

15.12Subroutine Operation

15.12.1 Push Operation

When a subroutine is called, the return address is

pushed onto the subroutine stack. Specifically, each

address in the stack is moved to the next lower level in

order to make room for the new address to be stored.

Stack 1 receives the contents of the program counter.

Stack 8 is overwritten with what was in Stack 7. The con-

tents of stack 8 are lost.

STATUS<6:5> JMP LABEL

PC<10:9> PC<8:0>

PAGE N

STATUS<6:5> JMP LABEL

PC<10:9> PC<8:0>

STATUS<6:5> 0 CALL LABEL

PC<10:9> PC<8> PC<7:0>

PAGE N

STATUS<6:5> 0 CALL LABEL

PC<10:9> PC<8> PC<7:0>

PC<10:0>

STACK 1

STACK 2

STACK 3

STACK 4

STACK 5

STACK 6

STACK 7

STACK 8

SX18AC / SX20AC / SX28AC

15.12.2 Pop Operation

When a return instruction is executed the subroutine

stack is popped. Specifically, the contents of Stack 1 are

copied into the program counter and the contents of each

stack level are moved to the next higher level. For exam-

ple, Stack 1 receives the contents of Stack 2, etc., until

Stack 7 is overwritten with the contents of Stack 8. Stack

8 is left unchanged, so the contents of Stack 8 are dupli-

cated in Stack 7.

15.13Comparison and Conditional Branch

Instructions

The instruction set includes instructions such as DECSZ

fr (decrement file register and skip if zero), INCSZ fr

(increment file register and skip if zero), SNB bit (bit test

file register and skip if bit clear), and SB bit (bit test file

the next instruction to be skipped if the tested condition is

true.

15.14Logical Instruction

The instruction set contain a full complement of the logi-

cal instructions (AND, OR, Exclusive OR), with the W

direct or indirect addressing) serving as the two oper-

ands.

15.15Shift and Rotate Instructions

The instruction set includes instructions for left or right

rotate-through-carry.

15.16Complement and SWAP

The device can perform one’s complement operation on

the file register (fr) and W register. The MOV W,<>fr

instruction performs nibble-swap on the fr and puts the

value into the W register.

15.17Key to Abbreviations and Symbols

PC<10:0>

STACK 1

STACK 2

STACK 3

STACK 4

STACK 5

STACK 6

STACK 7

STACK 8

Symbol Description

WWorking register

fr File register (memory-mapped register in the

range of 00h to FFh)

PC Lower eight bits of program counter (file regis-

ter 02h)

STATUS STATUS register (file register 03h)

FSR File Select Register (file register 04h)

CCarry flag in STATUS register (bit 0)

DC Digit Carry flag in STATUS register (bit 1)

ZZero flag in STATUS register (bit 2

PD Power Down flag in STATUS register (bit 3)

TO Watchdog Timeout flag in STATUS register

(bit 4)

PA2:PA0 Page select bits in STATUS register (bits 7:5)

OPTION OPTION register (not memory-mapped)

WDT Watchdog Timer register (not memory-

mapped)

MODE MODE register (not memory-mapped)

rx Port control register pointer (RA, RB, or RC)

!Non-memory-mapped register designator

fFile register address bit in opcode

kConstant value bit in opcode

nNumerical value bit in opcode

bBit position selector bit in opcode

.File register / bit selector separator in assem-

bly language instruction

#Immediate literal designator in assembly lan-

guage instruction

lit Literal value in assembly language instruction

addr8 8-bit address in assembly language instruction

addr9 9-bit address in assembly language instruction

addr12 12-bit address in assembly language instruc-

tion

/Logical 1’s complement

|Logical OR

^Logical exclusive OR

&Logical AND

<> Swap high and low nibbles (4-bit segments)

<< Rotate left through carry flag

>> Rotate right through carry flag

- - Decrement file register

++ Increment file register

SX18AC / SX20AC / SX28AC

16.0INSTRUCTION SET SUMMARY TABLE

Table16-1 list all of the instructions, organized by cate-

gory. For each instruction, the table shows the instruction

mnemonic (as written in assembly language), a brief

description of what the instruction does, the number of

instruction cycles required for execution, the binary

opcode, and the status flags affected by the instruction.

The “Cycles” column typically shows a value of 1, which

means that the overall throughput for the instruction is

one per clock cycle. In some cases, the exact number of

cycles depends on the outcome of the instruction (such

as the test-and-skip instructions) or the clocking mode

(Compatible or Turbo). In those cases, all possible num-

bers of cycles are shown in the table.

The instruction execution time is derived by dividing the

oscillator frequency by either one (Turbo mode) or four

(Compatible mode). The divide-by factor is selected

through the FUSE Word register.

Table16-1. The SX Instruction Set

Mnemonic,

Operands Description Cycles

(Compatible) Cycles

(Turbo) Opcode Flags

Affected

Logical Operations

AND fr, W AND of fr and W into fr (fr = fr & W) 1 1 0001 011f ffff Z

AND W, fr AND of W and fr into W (W = W & fr) 1 1 0001 010f ffff Z

AND W,#lit AND of W and Literal into W (W = W & lit) 1 1 1110 kkkk kkkk Z

NOT fr Complement of fr into fr (fr = fr ^ FFh) 1 1 0010 011f ffff Z

OR fr,W OR of fr and W into fr (fr = fr | W) 1 1 0001 001f ffff Z

OR W,fr OR of W and fr into fr (W = W | fr) 1 1 0001 000f ffff Z

OR W,#lit OR of W and Literal into W (W = W | lit) 1 1 1101 kkkk kkkk Z

XOR fr,W XOR of fr and W into fr (fr = fr ^ W) 1 1 0001 010f ffff Z

XOR W,fr XOR of W and fr into W (W = W ^ fr) 1 1 0001 100f ffff Z

XOR W,#lit XOR of W and Literal into W (W = W ^ lit) 1 1 1111 kkkk kkkk Z

Arithmetic and Shift Operations

ADD fr,W Add W to fr (fr = fr + W); carry flag is added if CF

bit in FUSEX register is cleared to 0 1 1 0001 111f ffff C, DC, Z

ADD W,fr Add fr to W (W = W + fr); carry flag is added if

CF bit in FUSEX register is cleared to 0 1 1 0001 110f ffff C, DC, Z

CLR fr Clear fr (fr = 0) 1 1 0000 011f ffff Z

CLR W Clear W (W = 0) 1 1 0000 0100 0000 Z

CLR !WDT Clear Watchdog Timer 1 1 0000 0000 0100 TO, PD

DEC fr Decrement fr (fr = fr - 1) 1 1 0000 111f ffff Z

DECSZ fr Decrement fr and Skip if Zero (fr = fr - 1 and skip

next instruction if result is zero) 1 or

2 (skip)

1 or

2 (skip)

0010 111f ffff none

INC fr Increment fr (fr = fr + 1) 1 1 0010 101f ffff Z

INCSZ fr Increment fr and Skip if Zero (fr = fr + 1 and skip

next instruction if result is zero) 1 or

2 (skip)

1 or

2 (skip)

0011 111f ffff none

RL fr Rotate fr Left through Carry (fr = << fr) 1 1 0011 011f ffff C

RR fr Rotate fr Right through Carry (fr = >> fr) 1 1 0011 001f ffff C

SUB fr,W Subtract W from fr (fr = fr - W); complement of

the carry flag is subtracted if CF bit in FUSEX

1 1 0000 101f ffff C, DC, Z

SWAP fr Swap High/Low Nibbles of fr (fr = <> fr) 1 1 0011 101f ffff none

SX18AC / SX20AC / SX28AC

Bitwise Operations

CLRB fr.bit Clear Bit in fr (fr.bit = 0) 1 1 0100 bbbf ffff none

SB fr.bit Test Bit in fr and Skip if Set (test fr.bit and skip

next instruction if bit is 1) 1 or

2 (skip)

1 or

2 (skip)

0111 bbbf ffff none

SETB fr.bit Set Bit in fr (fr.bit = 1) 1 1 0101 bbbf ffff none

SNB fr.bit Test Bit in fr and Skip if Clear (test fr.bit and skip

next instruction if bit is 0) 1 or

2 (skip)

1 or

2 (skip)

0110 bbbf ffff none

Data Movement Instructions

MOV fr,W Move W to fr (fr = W) 1 1 0000 001f ffff none

MOV W,fr Move fr to W (W = fr) 1 1 0010 000f ffff Z

MOV W,fr-W Move (fr-W) to W (W = fr - W); complement of

carry flag is subtracted if CF bit in FUSEX regis-

ter is cleared to 0

1 1 0000 100f ffff C, DC, Z

MOV W,#lit Move Literal to W (W = lit) 1 1 1100 kkkk kkkk none

MOV W,/fr Move Complement of fr to W (W = fr ^ FFh) 1 1 0010 010f ffff Z

MOV W,--fr Move (fr-1) to W (W = fr - 1) 1 1 0000 110f ffff Z

MOV W,++fr Move (fr+1) to W (W = fr + 1) 1 1 0010 100f ffff Z

MOV W,<<fr Rotate fr Left through Carry and Move to W

(W = << fr) 1 1 0011 010f ffff C

MOV W,>>fr Rotate fr Right through Carry and Move to W

(W = >> fr) 1 1 0011 000f ffff C

MOV W,<>fr Swap High/Low Nibbles of fr and move to W

(W = <> fr) 1 1 0011 100f ffff none

MOV W,M Move MODE Register to W (W = MODE) 1 1 0000 0100 0010 none

MOVSZ W,--fr Move (fr-1) to W and Skip if Zero (W = fr -1 and

skip next instruction if result is zero) 1 or

2 (skip)

0010 110f ffff none

MOVSZ W,++fr Move (fr+1) to W and Skip if Zero (W = fr + 1 and

skip next instruction if result is zero) 1 or

2 (skip)

0011 110f ffff none

MOV M,W Move W to MODE Register (MODE = W) 1 1 0000 0100 0011 none

MOV M,#lit Move Literal to MODE Register (MODE = lit) 1 1 0000 0101 kkkk none

MOV !rx,W Move W to Port Rx Control Register:

rx <=> W

(exchange W and WKPND_B or CMP_B) or

rx = W

(move W to rx for all other port control registers)

1 1 0000 0000 0fff none

MOV !OPTION, W Move W to OPTION Register (OPTION = W) 1 1 0000 0000 0010 none

TEST fr Test fr for Zero (fr = fr to set or clear Z flag) 1 1 0010 001f ffff Z

Table16-1. The SX Instruction Set (Continued)

Mnemonic,

Operands Description Cycles

(Compatible) Cycles

(Turbo) Opcode Flags

Affected

SX18AC / SX20AC / SX28AC

Program Control instruction

CALL addr8 Call Subroutine:

top-of-stack = program counter + 1

PC(7:0) = addr8

program counter (8) = 0

program counter (10:9) = PA1:PA0

2 3 1001 kkkk kkkk none

JMP addr9 Jump to Address:

PC(7:0) = addr9(7:0)

program counter (8) = addr9(8)

program counter (10:9) = PA1:PA0

2 3 101k kkkk kkkk none

NOP No Operation 1 1 0000 0000 0000 none

RET Return from Subroutine

(program counter = top-of-stack) 2 3 0000 0000 1100 none

RETP Return from Subroutine Across Page Boundary

(PA1:PA0 = top-of-stack (10:9) and

program counter = top-of-stack)

2 3 0000 0000 1101 none

RETI Return from Interrupt (restore W, STATUS,

FSR, and program counter from shadow regis-

ters)

2 3 0000 0000 1110 all STA-

TUS

RETIW Return from Interrupt and Adjust RTCC with W

(restore W, STATUS, FSR, and program

counter from shadow registers; and subtract W

from RTCC register)

2 3 0000 0000 1111 all STA-

TUS

RETW lit Return from Subroutine with Literal in W

(W = lit and program counter = top-of-stack) 2 3 1000 kkkk kkkk none

System Control Instructions

BANK addr8 Load Bank Number into FSR(7:5)

FSR(7:5) = addr8(7:5) 1 1 0000 0001 1nnn none

IREAD Read Word from Instruction Memory

MODE:W = data at (MODE:W) 1 4 0000 0100 0001 none

PAGE addr12 Load Page Number into STATUS(7:5)

STATUS(7:5) = addr12(11:9) 1 1 0000 0001 0nnn none

SLEEP Power Down Mode

WDT = 00h, TO = 1, PD = 1, stop oscillator 1 1 0000 0000 0011 TO, PD

Table16-1. The SX Instruction Set (Continued)

Mnemonic,

Operands Description Cycles

(Compatible) Cycles

(Turbo) Opcode Flags

Affected

SX18AC / SX20AC / SX28AC

16.1Equivalent Assembler Mnemonics

Some assemblers support additional instruction mne-

monics that are special cases of existing instructions or

alternative mnemonics for standard ones. For example,

an assembler might support the mnemonic “CLC” (clear

carry), which is interpreted the same as the instruction

“clrb $03.0” (clear bit 3 in the STATUS register). Some of

the commonly supported equivalent assembler mnemon-

ics are described in

Table16-2. Equivalent Assembler Mnemonics

Syntax Description Equivalent Cycles

CLC Clear Carry Flag CLRB $03.0 1

CLZ Clear Zero Flag CLRB $03.2 1

JMP W Jump Indirect W MOV $02,W 4 or 3 (note 1)

JMP PC+W Jump Indirect W Relative ADD $02,W 4 or 3 (note 1)

MODE imm4 Move Immediate to MODE

NOT W Complement W XOR W,#$FF 1

SC Skip if Carry Flag Set SB $03.0 1 or 2 (note 2)

SKIP Skip Next Instruction SNB $02.0 or SB $02.0 4 or 2 (note 3)

Note1:The JMP W or JMP PC+W instruction takes 4 cycles in the “compatible” clocking mode or 3 cycles in the

“turbo” clocking mode.

Note2:The SC instruction takes 1 cycle if the tested condition is false or 2 cycles if the tested condition is true.

Note3:The assembler converts the SKIP instruction into a SNB or SB instruction that tests the least significant bit

of the program counter, choosing SNB or SB so that the tested condition is always true. The instruction takes 4 cycles

in the “compatible” clocking mode or 2 cycles in the “turbo” clocking mode.

SX18AC / SX20AC / SX28AC

17.0ELECTRICAL CHARACTERISTICS

17.1Absolute Maximum Ratings

Ambient temperature under bias -40° C to +85° C (to +125° C at 4V to 6.25V)

Storage temperature -65° C to +150° C

Voltage on Vdd with respect to Vss 0 V to +7.5V

Voltage on OSC1 with respect to Vss 0 V to +12.5V

Voltage on MCLR with respect to Vss 0 V to +14V

Voltage on all other pins with respect to Vss 0.6 V to (Vdd + 0.6V)V

Total power dissipation TBD mW

Max. current out of Vss pin 100mA

Max. current into Vdd pin 100mA

Max. DC current into an input pin (with internal protection diode forward

biased) +500µA

Max. allowable sink current per I/O pin 45mA

Max. allowable source current per I/O pin 45 mA

SX18AC / SX20AC / SX28AC

17.2DC Characteristics

Operating Temperature 0° C <= Ta <= +70° C (Commercial)

Symbol Parameter Conditions Min Typ Max Units

Vdd Supply Voltage RC

3.3

–6.25

6.25

Vpor Vdd start voltage to ensure

Power-On Reset

–Vss – – V

SVdd Vdd rise rate –0.05 – – V/ms

Idd Supply Current, active Vdd = 5.0V, Fosc = 50 MHz

Vdd = 5.0V, Fosc = 4 MHz internal

Vdd = 3.3V, Fosc = 20 MHz

-60

7.5

–mA

Ipd Supply Current, power down Vdd = 4.5V, WDT enabled

Vdd = 4.5V, WDT disabled

-TBD

–µA

µA

Vih, Vil Input Levels

MCLR, OSC1, RTCC

Logic High

Logic Low

All Other Inputs

CMOS

Logic High

Logic Low

TTL

Logic High

Logic Low

0.8Vdd

Vss

0.7Vdd

Vss

2.0

Vss

Vdd

0.2Vdd

Vdd

0.3Vdd

Vdd

0.8

Iil Input Leakage Current Vin = Vdd or Vss -1.0 +1.0 µA

Ipup Weak Pullup Current Vdd = 5.5V, Vin = 0V

Vdd = 3.3V, Vin = 0V

400

180

µA

Voh Output High Voltage

OSC2, Ports B, C

Port A

Ioh = 20mA, Vdd = 4.5V

Ioh = 12mA, Vdd = 3.3V

Ioh = 30mA, Vdd = 4.5V

Ioh = 20mA, Vdd = 3.3V

Vdd-0.7

Vol Output Low Voltage

OSC2, All Ports

Iol = 30mA, Vdd = 4.5V

Iol = 20mA, Vdd = 3.3V

0.6

SX18AC / SX20AC / SX28AC

17.3AC Characteristics

Operating Temperature 0° C <= Ta <= +70° C (Commercial)

Note:Data in the Typical (“TYP”) column is at 5V, 25° C unless otherwise stated.

Internal RC Oscillator AC specs are still being characterized. Specification is 4MHz ± 8% over commercial temp (0° C-

70° C) range.

17.4Comparator DC and AC Specifications

Symbol Parameter Min Typ Max Units Conditions

Fosc External CLKIN Frequency DC –4.0

4.0

200

MHz

KHz

Oscillator Frequency DC

0.1

–4.0

4.0

200

MHz

KHz

Tosc External CLKIN Period 250

250

5.0

– – ns

µs

Oscillator Period 250

250

5.0

– –

10,000

250

200

µs

TosL, TosH Clock in (OSC1) Low or High Time 50

8.0

2.0

– – ns

µs

TosR, TosF Clock in (OSC1) Rise or Fall Time – – 25

µs

Parameter Conditions Min Typ Max Units

Input Offset Voltage 0.4V < Vin < Vcc – 1.5V +/- 10 +/- 25 mV

Input Common Mode Voltage Range 0.4 Vcc – 1.3 V

Voltage Gain 300k V/V

DC Supply Current (enabled) Vcc = 5.5V 120 µA

Response Time Voverdrive = 25mV 250 ns

SX18AC / SX20AC / SX28AC

17.5Typical Performance Characteristics

Active Supply Current (External Clock)

Operating Frequency (MHz)

Idd (mA)

Vdd = 5.5V

Vdd = 3.3V

10 20 30 40 50

Port A/B/C Weak Pull-Up Source Current

Voh (V)

Ipup (µA)

Vdd = 5.5V

Vdd = 3.3V

400

300

200

100

1 2 3 4 5 6

OSC2, Port A/B/C Source Current

Voh (V)

Ioh (mA)

1 2 3 4 5 6

Vol (V)

Iol (mA)

Vdd = 4.5V

0.5 1.0

Vdd = 3.3V

OSC2, Port A/B/C Sink Current

Vdd = 4.5V

OSC2, Port B/C

OSC2, Port A

Vdd = 3.3V

OSC2, Port B/C

OSC2, Port A

SX18AC / SX20AC / SX28AC

18.0PACKAGE DIMENSIONS

SX18AC/SO

0.090 - 0.094

(2.29 - 2.39)

0.292 - 0.299

(7.42 - 7.59)

0.451 - 0.461

(11.46 - 11.71)

0.090 - 0.094

(2.29 - 2.39)

0.014 - 0.019

(0.35 - 0.48)

0.0050 - 0.0115

(0.127 - 0.292)

0.400 - 0.410

(10.16 - 10.41)

0.292 - 0.299

7.42 - 7.59)

0.045 - 0.055

(1.143 - 1.397)

0.035 - 0.045

(0.890 - 1.143)

0.050 BSC

(1.27 BSC)

SX18AC/DP

0.008 - 0.012

(0.20 - 0.31)

0.895 - 0.905

(22.73 - 22.99)

0.430 max.

(10.92 max.)

0.300 BSC at 90o

(7.62 BSC at 90o)

[ ]

0.240 - 0.260

(6.10 -6.60)

0.130 nom.

(3.3 nom.)

0.125 - 0.135

(3.17 - 3.43)

0.015 min.

(0.38 min.)

0.100 BSC

(2.54 BSC) 0.055 -0.065

(1.39 - 1.65) 0.015 - 0.022

(0.38 - 0.56)

0.170 max.

(4.32 max.)

SX18AC / SX20AC / SX28AC

SX20AC/SS

0.205 - 0.212

(5.20 - 5.38)

0.066 - 0.070

(1.68 - 1.78)

12o - 16o

0.066 - 0.070

(1.68 - 1.78)

0.0256 BSC

(0.65 BSC)

0.010 - 0.015

(0.25 - 0.38)

0.002 - 0.008

(0.05 - 0.21)

0.278 - 0.289

(7.07 - 7.33)

0.301 - 0.311

(7.65 - 7.90)

0.205 - 0.212

(5.20 - 5.38)

0.039

(1.00)

0.039

(1.00)

14 1

SX28AC/SO

0.090 - 0.094

(2.29 - 2.39)

0.292 - 0.299

(7.42 - 7.59)

0.701 - 0.710

(17.81 - 18.06)

0.090 - 0.094

(2.29 - 2.39)

0.014 - 0.019

(0.35 - 0.48)

0.0050 - 0.0115

(0.127 - 0.292)

0.40 - 0.41

(10.16 - 10.41)

0.292 - 0.299

7.42 - 7.59)

0.045 - 0.055

(1.143 - 1.397)

0.035 - 0.045

(0.890 - 1.143)

0.050 BSC

(1.27 BSC)

SX18AC / SX20AC / SX28AC

SX28AC/DP

0.430 max.

(10.92 max.)

0.009 - 0.014

(0.23 - 0.36)

1.360 - 1.370

(34.54 - 34.80)

0.280 - 0.295

(7.11 - 7.49)

0.130 nom.

(3.3 nom.)

0.120 - 0.135

(3.05 - 3.43)

0.015 - 0.021

(0.38 - 0.53)

0.045 - 0.055

(1.14 - 1.40)

0.100 BSC

(2.54 BSC)

0.180 max.

(4.57 max.)

0.020 min.

(0.51 min.)

0.300 BSC at 90o

(7.62 BSC at 90o)

[ ]

2815

14 1

SX28AC/SS

0.205 - 0.212

(5.20 - 5.38)

0.066 - 0.070

(1.68 - 1.78)

0.066 - 0.070

(1.68 - 1.78)

0.0256 BSC

(0.65 BSC)

0.010 - 0.015

(0.25 - 0.38)

0.002 - 0.008

(0.05 - 0.21)

0.397 - 0.407

(10.07 - 10.33)

0.301 - 0.311

(7.65 - 7.90)

0.205 - 0.212

(5.20 - 5.38)

0.039

(1.00)

0.039

(1.00)

12o - 16o

For the latest contact and support information on SX devices, please visit the Scenix Semiconductor website at

www.scenix.com. The site contains technical literature, local sales contacts, tech support and many other features.

Scenix Semiconductor, Inc. 3160 De La Cruz Blvd., Suite #200

Santa Clara, CA 95054

(408) 327-8888

http://www.scenix.com

SX18AC / SX20AC / SX28AC

Sales and Tech Support Contact Information

US DISTRIBUTOR

Unique Technologies

9980 Huennekens Street

San Diego, CA 92121

(800) 677-5664 Corporate Headquarters

(800) 556-0225 Direct to Local Office

DEVELOPMENT TOOLS

Parallax Inc.

3805 Atherton Road, Suite 102

Rocklin, CA 95765

(916) 624-8333

http://www.parallaxinc.com

MANUFACTURERS REPRESENTATIVES

South Nevada; Utah,

Idaho; Montana;

Wyoming; Colorado;

New Mexico;

Arizona

Nelco Electronix

Chandler

Tel: (602) 726-2334

Email: nelcoaz@aol.com

9725 E. Hampden Avenue

Suite 100

Denver, CO 80231

Tel: (303) 671-7677

Email: nelcoelect@aol.com

Boise

Tel: (208) 343-9171

Email: nelcotd@aol.com

Albuquerque

Tel: (505) 293-1399

Email: nelco@swcp.com

El Paso

Tel: (915) 833-7300

Email: nelco@dzn.com

Utah

Tel: (208) 343-9171

Email: nelcotd@aol.com

New York; East

Pennsylvania;

South New Jersey

Quality Components, Inc.

4211 Anita Drive

Collegeville, PA 19426

Tel: (800) 965-8885

Email: brogers@quality-compo-

nent.com

116 Fayette Street

Manilus, NY 13104

Tel: (315) 682-8885

Tennesse; N. Carolina;

S. Carolina; Georgia;

Alabama; Mississippi

STG

101 Washington Street

Suite 6

Huntsville, AL 35801

Tel: (205) 534-2376

Email: hstokes@stghsv.com

6045 Atlantic Boulevard

Norcross, GA 30071

Tel: (770) 239-7576

Email: hstokes@stghsv.com

207 New Edition Court

Cary, NC 27511

Tel: (919) 468-1524

Email: hstokes@stghsv.com

North California

Impact Technical Sales, Inc.

1150 N. First St. #205

San Jose, CA 95112

Tel: (408) 291-5100

Email: info@impactTSI.com

South California

Spectrum Rep Company

30 Fairbanks

Suite 115

Irvine, CA 92618

Tel: (949) 461-5280

Email: paulscarbo@spectrum-

rep.com

http://www.spectrumrep.com

31368 Via Colinas

Suite 101

Westlake Village, CA 91362

Tel: (818) 706-2919

Email: larryclark@spectrum-

rep.com

http://www.spectrumrep.com

N. Dakota; S. Dakota;

Minnesota

Com-Tek Sales, Inc

3502 Shoreline Drive

Navarre, MN 55392-0017

Tel: (612) 471-7181

Email: comtek@comtek-

sales.com

Michigan; Indiana; Ohio;

Kentucky;

West Pennsylvania

Schillinger Associates, Inc.

2297 East Boulevard

Kokomo, IN 46902

Tel: (765) 457-7241

Email: saicorp@msn.com

Southeast New York;

North New Jersey

ERA

354 Veterans Memorial Highway

Commack, NY 11725

Tel NY: (516) 543-0510

Tel NJ: (800) 645-5500

Email: info.era@erareps.com

http://www.erareps.com

Texas; Oklahoma;

Arizona; Louisiana

M-Rep

12801 Stemmons Freeway

Suite 825

Dallas, TX 75234

Tel: (972) 484-5711

Email: sales@mrep.com

http://www.mrep.com

7605 Parkway Circle

Austin, TX 78731

Tel: (512) 502-9962

Email: howard@mrep.com

http://www.mrep.com

Wisconsin; Illinois

Dynamic Technical Sales

416 East State Parkway

Suite 212

Schaumberg, IL 60173

Tel: (847) 755-5490

Email: dts@dtsrep.com

553 Industrial Drive

Suite 6

Hartland, WI 53029

Tel: (414) 367-1821

Email: dtsinc@execpc.com

For the latest contact and support information on SX devices, please visit the Scenix Semiconductor website at

www.scenix.com. The site contains technical literature, local sales contacts, tech support and many other features.

Scenix Semiconductor, Inc. 3160 De La Cruz Blvd., Suite #200

Santa Clara, CA 95054

(408) 327-8888

http://www.scenix.com

SX18AC / SX20AC / SX28AC

MANUFACTURERS REPRESENTATIVES

Benelux

Memec Benelux

Gen. De Wittelaan, 17 B10

2800 Mechelen

Tel: (32) 15-400-0800

Email:

BdeVries@meb.memec.com

France

A2M

5 rue Carle Vernet

92315 Sevres Cedex

Tel: (33) 1-4623-7900

Email: mgadreau@tekelec.fr

Germany

Topas Electronic GmbH

Fliegerstrasse 1

30179 Hannover

Tel: (49) 898-991-430

Email: ulf.Topas@t-online.de

Scantec Mikroelektronik GmbH

Behringstrasse 10

82152 Planegg

Tel: (49) 511-968-640

Email: stenwaldo@com-

puserve.com

United Kingdom

Ambar Components

Rabans Close

Aylesbury

HP19 3RS Bucks

Tel: (944) 129-639-7396

Email:

rthomson@acp.memec.com

Ireland

Curragh Technology

Block H, Lock Quay

Clare Street

Limerick

Tel: (353) 6-131-6116

Email: jburton@ctl.memec.com

Italy

Silverstar-Celdis

Viale Fulvio Testi, 280

20126 Milano

Tel: (39) 2-661-251

Email: rbaldoni@arrowitaly.com

Norway

BIT Elektronikk

Smedsvingen 4

PO BOX 194

1360 Nesbru

Tel: (47) 66-776-599

Email: njh@bit.no

Switzerland

Computer Components AG

Neunbrunnenstrasse 55

8050 Zurich

Tel: (41) 13-086-655

Email: kolbicz@ccontrols.ch

China/Hong Kong

Sunrise Technology, Ltd.

Room 907, Tower 1, Silvercord

30 Canton Road, TST

Kowloon, Hong Kong

Tel: (852) 2376-1882

Email:

sunadmin@sunrise.com.hk

Room 3113, Everbright ITIC

Bldg.

15 Bai Shi Qiao Road

Hai Dian Dist., Beijing, 100081

Tel: (010) 6848-6895

Email:

sunadmin@sunrise.com.hk

Room 519, Changning S&T

Bldg.

No. 201 Tian Shan Zhi Road

Shanghai, 200051

Tel: (201) 6259-4939

Email:

sunadmin@sunrise.com.hk

8/F, Block B, Overseas Decora-

tion Bldg.

11 Zhenhua Road

Shenzhen, 518031

Tel: (0755) 332-5656

Email:

sunadmin@sunrise.com.hk

Taiwan

Promate Electronic Co., Ltd.

4F 32m Sec.1, Huan Shan Road

Nei Hu, Taipei 114

Tel: (886) 2-2659-0303

Email: irving@promate.com.tw

Pinnacle Technology Co.

4F, 270, Sec. 3, Nan-Kang Road

Taipei

Tel: (886) 2-2788-4800

Email: pinnacle@ms1.hinet.net

Japan

Sumisho Electronic Devices

Corp.

1 Kandamitoshirocho

Chiyoda-ku, Tokyo 101

Tel: (81) 3-5282-7225

Email:

masayuki_kobayashi@sed.co.jp

Korea

Comfile Technology

30-1 Shingae-Dong

Youngsan-Gu, Seoul 140-090

Tel: (82) 2-711-2592

Email:

comfile@soback.kornet.nm.kr

Team Korea

292-6 Yatap-Dong, Bundang-Ku

Sungam-Si, Kyungki-Do

Tel: (82) 342-705-1825

Email:

mikechoi@teamkorea.com

http://www.teamkorea.com

Sx_ds12 3 SCENIX

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