SF530

User Manual: SF530

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SF-530_XAA.0000051600.E.16.pdf

SERVICE

SAMSUNG FACSIMILE

SF-530/531P

Manual

FACSIMILE CONTENTS

1. Precautions

2. Specifications

3. Disassembly and Reassembly

4. Troubleshooting

5. Exploded Views and Parts List

6. Block Diagram

7. Connection Diagram

ELECTRONICS

2001

Printed in Korea.

VERSION NO. : 1.00 CODE : JC-0059A

This service manual is also provided on the web,

the ITSELF system Samsung Electronics Co., Ltd.

http://itself.sec.samsung.co.kr

This manual is stated and

provided for service description.

information in this manual are prohibited

from free duplication, use or translation

without prior written approval except in

cases allowed by the Copyright Act.

Specifications are subject to change without

prior notice.

Samsung Electronics Digital Printing CS Group

Precautions

1-1

Samsung Electronics

1. Precautions

Please read the following carefully to prevent any accidents and not to damage the unit during service.

1-1 Safety Precautions

1-2 Precautions on Disassembly and Reassembly

1. Safety Precautions

There are some electric or machinery parts with safety

related property. If the parts replaced are different from

the original, the safety may not function. Even if the part

could allow higher voltage than that of the part used, do

not replace it and use a regular product clarified in spec-

ifications.

2. Be careful not to leave a switch, a cover or a safety device

out when reinstalling or assembling the product after

repair.

3. Replacing Precautions

Do not change or add parts as you like. You cannot ben-

efit from such a remodeled product at your will during the

term of guarantee.

4. You must replace overheated or damaged parts or cords

with regular products. Please solve the problem causing

any damage or overheating and troubles beforehand.

Especially mind the safety on the part with this

mark.

You must use regular parts described in specifica-

tions for the parts inflammable and where the cur-

rent can be flown. Otherwise any hazard such as

an electric shock or a fire could occur.

LASER STATEMENT (LASERTURVALLISUUS)

WARNING : NEVER OPERATE AND SERVICE THE PRINTER

WITH THE PROTECTIVE COVER REMOVED

FROM LASER/SCANNER ASSEMBLY. THE

REFLECTIVE BEAM, ALTHOUGH INVISIBLE, CAN

DAMAGE YOUR EYES.

Class 1 laser product

Luokan 1 laserlaite

Klass 1 laser apparat

Allonpituus 770-795nm

Teho 0.3mW±0.03mW

CAUTION

VORSICHT

ATTENTION

ATTENZIONE

PRECAUCION

CAUTION : Avoid exposure to invisible laser radiation when the

development unit is not installed.

INVISIBLE LASER RADIATION WHEN

THIS COVER OPEN. DO NOT OPEN

THIS COVER.

UNSICHTBARE LASERSTRAHLUNG,

WENN ABDECKUNG GEOFFNET.

NIGHT DEM STRAHL AUSSETZEN.

REYONNEMENT LASER INVISIBLE EN CAS

D’OUVERTURE. EXPOSITION DANGERUSE AU

FAISCEAU.

RADIAZIONE LASER INVISIBLE IN CASO DI

APERTURA. EVITARE L’ESPOSIZONE LA FASCIO.

REDIACION LASER INVISIBLE CUANDO SE

ABRE. EVITAR EXPONERSE AL RAYO.

Very careful precautions should be taken when replacing

parts. Before replacing, please check cables because you

cannot put the cables that you removed for replacing parts

into the proper place if you would not make sure of where

they were connected and in which condition.

Please do the following before disassembling

for a repair or replacement of parts.

1. Pull out paper cassette, printer cartridge installed.

Especially careful not to be scratched by the surface of

developer or not to expose them to light.

2. Turn the power switch off.

3. Take out the power plug, printer cable from the printer.

4. Use only the same type of part as original when replacing

parts.

5. Do not force to open or fasten plastic material compo-

nents.

6. Be careful that small parts such as screws should not get

in the printer.

7. When disassembling, assembling, also observe small

components are located in place.

8. If you uncover and turn the machine over to replace some

parts, toner or paper particles may contaminate the LSU

window. Protect the LSU window with clean paper.

Releasing Plastic Latches

Many of parts are held in

place with plastic latches.

The latches break easily :

release them carefully.

To remove such parts, press

the hook end of the latch

away from the part to which

it is latched.

Certain semiconductor devices can be easily damaged by

static electricity. Such components are commonly called

“Electrostatically Sensitive (ES) Devices”, or ESDs.

Examples of typical ESDs are: integrated circuits, some field

effect transistors, and semiconductor “chip” components.

The techniques outlined below should be followed to help

reduce the incidence of component damage caused by sta-

tic electricity.

1. Immediately before handling a semiconductor compo-

nent or semiconductor-equipped assembly, drain off any

electrostatic charge on your body by touching a known

earth ground. Alternatively, employ a commercially avail-

able wrist strap device, which should be removed for your

personal safety reasons prior to applying power to the unit

under test.

2. After removing an electrical assembly equipped with

ESDs, place the assembly on a conductive surface, such

as aluminum or copper foil, or conductive foam, to pre-

vent electrostatic charge buildup in the vicinity of the

assembly.

3. Use only a grounded tip soldering iron to solder or desol-

der ESDs.

4. Use only an “anti-static” solder removal device. Some sol-

der removal devices not classified as “anti-static” can

generate electrical charges sufficient to damage ESDs.

5. Do not use Freon-propelled chemicals. When sprayed,

these can generate electrical charges sufficient to dam-

age ESDs.

6. Do not remove a replacement ESD from its protective

packaging until immediately before installing it. Most

replacement ESDs are packaged with all leads shorted

together by conductive foam, aluminum foil, or a compa-

rable conductive material.

7. Immediately before removing the protective shorting

material from the leads of a replacement ESD, touch the

protective material to the chassis or circuit assembly into

which the device will be installed.

8. Maintain continuous electrical contact between the ESD

and the assembly into which it will be installed, until com-

pletely plugged or soldered into the circuit.

9. Minimize bodily motions when handling unpackaged

replacement ESDs. Normal motions, such as the brush-

ing together of clothing fabric and lifting one’s foot from a

carpeted floor, can generate static electricity sufficient to

damage an ESD.

1-3 ESD Precautions

Precautions

1-2 Samsung Electronics

CAUTION:

Be sure no power is applied to the chassis or cir-

cuit, and observe all other safety precautions.

Precautions

1-3

Samsung Electronics

1-4 Tools for Troubleshooting

The following tools are recommended for safe and smooth troubleshooting described in this service manual.

DCU(Diagnostic Control Unit)

Standard: Test equipment to diagnose the Laser

printer supplied by Samsung Electronics.

DVM(Digital Volt Meter)

Standard: Indicates more than 3 digits.

Electronic Scale

Standard: Equipment to check the weight of con-

sumables(toner cartridge) supplied by Samsung

Electronics. (The gram unit can be measured.)

Driver

Standard: "-" type, "+" type (M3 long, M3 short,

M2 long, M2 short).

Pinset

Standard: For general home use, small type.

Cotton Swab

Standard: For general home use, for medical ser-

vice.

Cleaning Equipments a IPA(Isopropyl

Alcohol)dry cloth or a soft stuff neutral

detergent.

Software(Driver) installation CD ROM

Mind your hands not to be touched when

you disassemble and reassemble PBAASS'Y,

such as the main board, SMPS, HVPS.

Note

ITEMS FAX MFP REMARKS

SF-530 SF-531P

2.Specifications

Samsung Electronics 2-1

General Size(W*D*H) 370 X 356 X 195 mm

Weight 6.9 Kg (With accessories)

Power Rating AC 110V ~ 120V ± 15%, 50/60Hz ± 3Hz

AC 220V ~ 240V ± 15%, 50/60Hz ± 3Hz

Operating Environment Temperature : 10 ~ 32˚C

Humidity : 20 ~ 85% RH

LCD 16*1 Char 16*1 Char

Interface NA ECP(IEEE1284), USB

Halftone 64 Level 64 Level

Life 50000 Pages 50000 Pages

Power Power Button No No

Input Voltage 110V~120V, 220V~240V 110V~120V, 220V~240V

Power Idle 10 W/H 10 W/H

Consumption Max 140 W/H 140 W/H

Power Save Mode OFF, 15, 30, 60 Min OFF, 15, 30, 60 Min

Print Print Method Laser Laser

Speed 8ppm (FAX Print Out) 8ppm (

PC Print & Fax Print)

Resolution Normal NA 600 x 600 DPI

Print language No PrinThru

Toner Save 30 ~ 50 % 30 ~ 50 %

Scan Scan Method CIS CIS

Quick Scan Speed 6 sec 3 sec

Resolution 200 x 200 DPI 300 x 300 DPI

Scan Width Max 216 mm 216 mm

Effective 210 mm 210 mm

Scan Length Max 1000 mm 1000 mm

(Std Mode : 365 mm) (Std Mode : 365 mm)

Copy Speed 8 ppm 8 ppm

Resolution 600 x 600 DPI 600 x 600 DPI

Zoom Range 50 ~ 130 % 50 ~ 200%

Collate/Reverse Yes Yes

Multi Copy 1 ~ 99 1 ~ 99

2-2 Samsung Electronics

Specifications

ITEMS FAX MFP REMARKS

SF-530 SF-531P

Telephone

Handset Yes Yes

1-Touch Dial 20 EA 20 EA

Speed Dial 80 EA 80 EA

Group Dial 20 EA 20 EA

Caller ID Yes

(Germany, France, Canada, Australia, New Zealand, US)

TAD No

TAD I/F Yes

Tone/Pulse Tone : US, UK, Korea

Tone/Pulse : ETC

No Power Operation No

Earth/Recall Yes

External Phone Transfer Yes

FAX Compatibility ITU G3

Communication System PSTN/PABX

Modem Speed 33.6Kbps Fax Modem

TX Speed 3sec Using CCitt #1 Chart

with Standard Resolution

Compression MH/MR/MMRc

Rcv. Mode TEL, FAX, AUTO, ANS/FAX

ECM Yes

DRPD Yes USA, New Zealand,

Australia, SEMI only

Resolution Std 203*98dpi

Fine 203*196dpi

S.Fine 203*392dpi

Memory Capacity 2MB

Optional Memory None

Functions Voice Request Yes

TTI Yes

RTI Yes

Polling Yes

Flash Yes

Auto Reduction Yes

Broadcasting 20 EA (99 locations) 20 EA(98 locations)

Forced Memory Yes

Delay TX 20 Locations 19 locations

Memory RX Yes

RDC Yes

Battery B/U Yes (Max 20 Min)

Paper ASF Type BIN

Handling Input Capacity 150 Sheets / 20Ib

Optional Cassette No

Output Capacity 100Sheets / 20Ib

Output Control Face up

Bypass No Yes

Media Type Plain Paper Plain, Coated, Transparency,

Envelop, Card, Post Card,

Label

Media Size A4, Letter, Legal • Paper : A4, Letter, Legal, Envelop : Manual

Folio, Executive, feeding only

B5, A5

• Envelop : 6 3/4, 7 3/4, #9,

#10, DL, C5,

B5, Baronial

Media Weight 16~24Ib 16~43Ib

ADF Input Capacity 20 Sheets / 20Ib

Media Weight 12.5 ~32Ib

Software Compatibility DOS No

Win 3.x No

Win 95 No Yes

Win 98 No Yes

Win NT 4.0 No Yes

Win 2000 No

Provide After Launch Win 2000

Driver Printer No Samsung PrinThru

TWAIN No Samsung ScanThru (TWAIN)

PC-FAX No Samsung FaxThru

Media CD-ROM No Yes

Diskette No No

Y2K Compliant Yes Yes

Including Software No Print/Scan/Copy/Driver,

PC-Fax/ E-mail/ OCR Software

Special Direct E-mail Send No Yes

Features Fax Forward Yes

Toner Save Yes

Reprint No Yes (Only Last PC Print)

2-up FAX Receive Yes

Scan to PC-FAX No Yes

Toner Life Initial 1,000 Pages

Using 4% Coverage Pattern

Cartridge Running 2,500 Pages

Using 4% Coverage Pattern

Toner Sensor

Support Yes

Method Software Dot Counting

Lock Key (With Printer & OEM) Yes

Maintena ADF Rubber 10K Pages Scan

nce Cycle Paper Feeding Roller 50K Pages Printer

Transfer Roller 60K Pages Print

Fuser Unit 50K Pages Print

Samsung Electronics 2-3

Specifications

ITEMS FAX MFP REMARKS

SF-530 SF-531P

3-1

Samsung Electronics

3. Disassembly and Reassembly

3-1 General Precautions on Disassembly

When you disassemble and reassemble compo-

nents, you must use extreme caution. The close

proximity of cables to moving parts makes proper

routing a must.

If components are removed, any cables disturbed

by the procedure must be restored as close as

possible to their original positions. Before removing

any component from the machine, note the cable

routing that will be affected.

Whenever servicing the machine, you must per-

form as follows:

1. Check to verify that documents are not stored in

memory.

2. Be sure to remove the toner cartridge before you

disassemble parts.

3. Unplug the power cord.

4. Use a flat and clean surface.

5. Replace only with authorized components.

6. Do not force plastic-material components.

7. Make sure all components are in their proper

position.

Releasing Plastic Latches

Many of the parts are held in place with plastic

latches. The latches break easily; release them

carefully.

To remove such parts, press the hook end of the

latch away from the part to which it is latched.

3-2 Cradle

1. Push the lever and remove the cradle as shown

below.

3-3 White Roller

1. Open the OPE cover.

2. Push the bushing on the end of the Roller slightly

inward, then rotate it until it reaches the slot.

Then lift, the Roller out.

Note : Check the Roller for any dirt. If dirty, wipe it off with

soft cloth dampened with water. If the Roller is

heavily worn, replace it with a new one.

3-2

Samsung Electronics

Disassembly and Reassembly

Control Panel

Bushing

White Roller

3-4 OPE Cover

1. Pull the cover release button on both sides of the

machine, and open the front cover.

2. Remove two stoppers holding the front cover unit and

unplug one connector and one wire.

3. Pull the bottom left end of the cover downward to

unlatch the front cover unit and remove the cover

from the main frame.

4. Remove two screws securing bracket scan board,

then take out the bracket scan board.

5. Unplug two connectors and one wire from the scan

board.

6. Lift the OPE cover.

Samsung Electronics

3-3

Disassembly and Reassembly

7. Remove the stopper holding the OPE cover.

8. Unlatch the bottom ends, then remove the OPE

cover.

3-4

Samsung Electronics

Disassembly and Reassembly

3-5 ADF Rubber

1. Open the OPE unit.

2. Insert a flat blade screw driver and pinset into the slot

as shown below, and release the latches. Take out the

Holder Rubber, Sheet ADF and the Rubber ADF.

Notes : • When you reassemble the them, be sure that

the Rubber ADF and Holder Rubber fit into the

guide boss and the Holder Rubber latches fit

into the corresponding hole. Then push firmly

until it clicks.

3. Clean the surface of the rubber pad with IPA (Isopropyl

Alcohol). After wiping it, be sure to dry it. Check the rub-

ber wear. If the wear reaches 1/2 its original thickness,

replace it with a new one.

Samsung Electronics

3-5

Disassembly and Reassembly

Holder Rubber

Rubber ADF

Guide Boss

Holder Rubber

Rubber ADF

Pinset or

Screw Driver

Safely Precautions :

Do not force to open or fasten plastic material

components.

Rubber ADF

Guide Boss

Holder Rubber

3-6 OPE Board

1. Before you remove the OPE board, you should

remove:

– OPE cover (see page 3-3)

2. Remove four screws securing the OPE board.

3. Release two latches securing the both side of the

LCD and the two of four latches securing the board.

Then remove the OPE board.

3-6

Samsung Electronics

Disassembly and Reassembly

3-7 Lever Sensor Doc.

1. Unlatch the lever sensor Doc from the scan upper

frame and take it out.

3-8 Lever Sensor Scan

1. Push the both sides of Lever sensor Scan inward,

then unlatch and take out the sensor Scan from the

scan upper frame.

3-9 Scan Board

1. Before you remove Scan board, you should remove:

– Bracket scam board (see page 3-3)

2. Unplug all the connectors from the scan board and

remove the board.

Samsung Electronics

3-7

Disassembly and Reassembly

3-10 Scan Motor

1. Before you disassemble Scan Motor, you should

remove:

– OPE cover (see page 3-3)

– Bracket scan board (see page 3-3)

2. Unplug one connector from the scan board.

3. Remove three screws, then remove the motor Ass’y

from the main frame.

4. Take out the gear from the Motor Ass’y.

5. Remove two screws and remove the motor.

3-11 ADF Roller

1. Before you remove the ADF Roller, you should

remove:

– OPE cover (see page 3-3)

2. Remove two screws securing the guide paper and

remove the guide paper.

3. Remove ADF Roller from the scan front frame.

3-8

Samsung Electronics

Disassembly and Reassembly

Guide Paper

ADF Roller

3-12 CIS

1. Remove one screw and push CIS as shown below

and lift it. 2. Separate the Dummy CIS from CIS.

CIS

tape

3-13 Rear Cover

1. Remove two screws.

2. Push the metal clip on the parallel port down and

remove the rear cover from the main frame.

Samsung Electronics

3-9

Disassembly and Reassembly

3-14 Top Cover

1. Before you remove the ADF Roller, you should

remove:

– OPE cover (see page 3-3)

– Rear cover (see above)

2. Remove two screws securing the top cover from the

back side of the machine.

3. Remove two screws and slide the left and right paper

guides fully inward. Then spread the bottom of the top

cover and lift the cover to remove.

Paper guides

3-15 Tray

1. Before you remove the tray, you should remove:

– OPE cover (see page 3-3)

– Rear cover (see page 3-9)

– Top cover (see page 3-9)

2. Take out the tray from the main frame.

3-10

Samsung Electronics

Disassembly and Reassembly

3-16 LSU

1. Before you remove the LSU, you should remove:

– All covers (see page 3-3, 3-9)

2. Remove three screws securing the LSU.

3. Unplug two connectors from the LSU and remove the

LSU.

3-17 Transfer Roller

1. Pull the cover release button on both sides of the

machine, and open the front cover.

2. Lift the transfer Roller using a proper tool (-Driver) and

take out the Roller.

Samsung Electronics

3-11

Disassembly and Reassembly

3-18 Engine Board

1. Before you remove the Engine board, you should

remove:

– All covers (see page 3-3, 3-9)

– LSU (see page 3-10)

2. Unplug five connectors and remove one screw from

the engine board, then remove the board.

3-19 Pick-up Roller Ass’y

1. Before you remove the pick-up Roller Ass’y, you

should remove:

– All covers (see page 3-3, 3-9)

– LSU (see page 3-10)

2. Unplug all the connectors from the engine board.

3. Remove four screws securing the plate upper and

remove the plate upper as below.

4. Remove two screws and remove the Roller from the

plate.

Note : When you reassemble the pick-up Roller, make

sure that the right end of the pick-up Roller fits

into the pick-up gear shaft.

3-12

Samsung Electronics

Disassembly and Reassembly

Pick-up gear shaft

3-20 Knock-up Ass’y

1. Before you remove the knock-up Ass’y, you should

remove:

– All covers (see page 3-3, 3-9)

– LSU (see page 3-10)

– Plate upper (see page 3-12)

2. Pull the knock-up Ass’y fully backward.

3. Remove the knock-up Ass’y from the main frame.

Samsung Electronics

3-13

Disassembly and Reassembly

3-21 Cap-Pad

1. Before you remove the cap-pad, you should remove:

– All covers (see page 3-3, 3-5)

– LSU (see page 3-10)

– Plate upper (see page 3-12)

– Knock-up Ass’y (see above)

2. Take out the cap-pad from the main frame.

3-22 Holder-Pad

1. Before you remove the holder-pad, you should

remove:

– All covers (see page 3-3, 3-9)

– LSU (see page 3-10)

– Plate upper (see page 3-12)

– Knock-up Ass’y (see 3-13)

– Cap-Pad (see 3-13)

2. Remove the holder-pad from the main frame.

3-14

Samsung Electronics

Disassembly and Reassembly

3-23 Motor Ass’y

1. Before you remove the motor Ass’y, you should

remove:

– All covers (see page 3-3, 3-9)

2. Remove four screws securing the motor Ass’y and

unplug one connector from the engine board, then

remove the motor Ass’y.

Note : When you reassemble the motor Ass’y, make

sure that the boss shown in the figure below fit

into the corresponding screw holes on the motor

Ass’y to allow the screws to be fastened properly.

Boss

3-24 Fan

1. Before you remove the fan, you should remove:

– All covers (see page 3-0)

– Motor Ass’y (see page 3-15)

2. Unplug one connector from the engine board and

remove the fan.

Samsung Electronics

3-15

Disassembly and Reassembly

3-25 Gear pick-up Ass’y

1. Before you remove the gear pick-up Ass’y, you

should remove:

– All covers (see page 3-3, 3-9)

Note: When reassembling, make sure that the direction

of the gear is correct.

2. Release two snap-fits and remove the gear pick-up

Ass’y from the main frame.

3-26 Solenoid

1. Before you remove the solenoid, you should remove:

– All covers (see page 3-3, 3-9)

2. Unplug one connector from the engine board and

remove one screw, then remove the solenoid.

3-16

Samsung Electronics

Disassembly and Reassembly

3-27 HVPS Board

1. Before you remove the HVPS board, you should

remove:

– All covers (see page 3-3, 3-9)

2. Remove three screws and one connector from the

HVPS board, then remove the board.

Note : when reassembling, make sure that the terminal

is five.

3-28 Hook Board

1. Before you remove the hook board, you should

remove:

– All covers (see page 3-3, 3-9)

2. Unplug one connector from the main board and

remove two screws, then remove the hook board from

the main frame.

Samsung Electronics

3-17

Disassembly and Reassembly

3-29 Fuser Ass’y

1. Before you remove the fuser Ass’y, you should

remove:

– All covers (see page 3-3, 3-9)

2. Remove two wires after remove two screws from the

main frame and one connector from the inter connec-

tor.

3. Remove two screws and unlatch the fuser Ass’y using

a proper tool.

3-30 Thermostat

1. Remove one screw and remove the cover thermostat

from the fuser Ass’y. 2. Remove two screws and take out thermostat from the

fuser Ass’y.

3-18

Samsung Electronics

Disassembly and Reassembly

3-31 Halogen Lamp

1. Before you remove the thermostat, you should

remove:

– All covers (see page 3-3, 3-9)

– Fuser Ass’y (see page 3-17)

2. On the fuser Ass’y, remove the two screws, then

remove the heat Roller.

3. Remove the halogen lamp from the heat Roller.

3-32 Pressure Roller

1. Before you remove the pressure Roller, you should

remove:

– All covers (see page 3-3, 3-9)

– Fuser Ass’y (see page 3-17)

2. Lift and remove the pressure Roller from the main

frame.

Samsung Electronics

3-19

Disassembly and Reassembly

3-33 Actuator-Exit

1. Before you remove the actuator-exit, you should

remove:

– All covers (see page 3-3, 3-9)

– Fuser Ass’y (see page 3-17)

2. Lift and remove the actuator-exit from the main

frame.

3-34 SMPS Board

1. Before you remove the SMPS board, you should

remove:

– Rear cover (see page 3-9)

– Shield Engine Ass’y (see page 3-19)

2. Remove four screws and three connectors, then

remove the SMPS board from the main frame.

3-20

Samsung Electronics

Disassembly and Reassembly

3-34 Shield Engine Ass’y

1. Before you remove the shield engine Ass’y, you

should remove:

– Rear cover (see page 3-9)

2. Remove eight screws securing the shield engine

Ass’y and remove the shield engine Ass’y from the

main frame.

Samsung Electronics

3-21

Disassembly and Reassembly

3-36 Speaker

1. Before you remove the speaker, you should remove:

– Rear cover (see page 3-9)

– Shield Engine Ass’y (see page 3-19)

– SMPS board (see above)

2. Remove one connector that connects the speaker to

the main board and two screws securing the speaker,

then remove the speaker.

3-37 LIU Board

1. Before you remove the LIU board, you should

remove:

– Rear cover (see page 3-9)

– Shield Engine Ass’y (see page 3-19)

2. Remove three screws and three connectors from the

LIU board, then remove the board from the main

frame.

3-39 Sensor Board

1. Before you remove the sensor board, you should

remove:

– Rear cover (see page 3-9)

– Shield Engine Ass’y (see page 3-19)

2. Release four snap-fits securing the sensor board and

unplug one connector from the main board, then

remove the sensor board.

3-22

Samsung Electronics

Disassembly and Reassembly

3-38 Main Board

1. Before you remove the main board, you should

remove:

– Rear cover (see page 3-9)

– Shield Engine Ass’y (see page 3-19)

2. Remove four screws and all the connectors (9) from

the main board, then remove the board.

Samsung Electronics

3-23

Disassembly and Reassembly

3-40 Actuator Empty/Feeder

1. Before you remove the actuator empty/feeder, you

should remove:

– Rear cover (see page 3-9)

– Shield Engine Ass’y (see page 3-19)

2. Remove one connector from the main board and two

screws securing the holder feed Ass’y, then remove

the holder feeder Ass’y.

3. Remove the Feed sensor and the Empty sensor.

Feed Sensor

Empty Sensor

3-24

Samsung Electronics

Disassembly and Reassembly

3-41 Roller Feeder

1. Before you remove the actuator empty/feeder, you

should remove:

– All covers (see page 3-0)

– Motor Ass’y (see page 3-15)

2. Release two snap-fits and remove the gear-feed,

clutch-feed, and the spring-clutch.

3. Rotate the pick-up bushing as shown below and

remove holder feeder Ass’y and Roller feeder.

4. Separate the Roller Feeder from the Holder Feeder

Ass’y.

Spring-clutch

Clutch-feed

Gear-feed

Roller Feed

Holder Feed

4-1

Samsung Electronics

4. Troubleshooting

4-1 Preventative Maintenance

The cycle period outlined below is a general guideline for maintenance. The example list is for an average usage of 50 trans-

mitted and received documents per day.

Environmental conditions and actual use will vary these factors. The cycle period given below is for reference only.

COMPONENT CLEANING CYCLE REPLACEMENT CYCLE SOLUTION

SCANNER

PRINTER

ADF Rubber

ADF Roller

White Roller

CIS

Cartridge

Pickup Roller

Feed Roller

Transfer Roller

Fuser

6 Months

1 Year

As Needed

10,000 Pages

20,000 Pages

10,000 Pages

2,500 Pages

60,000 Pages

50,000 Pages

60,000 Pages

50,000 Pages

4-2 Tech Mode

In Tech mode, the technician can perform various tests to isolate the causes of a malfunction, and set the technical option fea-

tures to customize the machine depending on the user’s operation environment.

To access TECH mode

: Press SETUP, #, 1, 9, 3, 4 in sequence, and the LCD displays ‘TECH’ in the standby mode screen. While in TECH mode,

the machine still performs all normal operations.

To return to the normal user mode

: Turn the power off, then back on.

The technical options you have set in TECH mode are not changed unless you clear the machine’s memory in TECH mode.

To communicate via direct connection with another fax machine, press OHD/V.REQ followed by Start/Enter.

• Caution :

When you finish operating in Tech Mode, you must turn the power Off/On.

Troubleshooting

4-2 Samsung Electronics

Function Item Content Default

FAX NUMBER/NAME FAX NUMBER

FAX NAME

TIME/DATE SETUP DATE FORMAT EUROPE/USA EUROPE

TIME/DATE

SYSTEM SETUP LANGUAGE ENG/GER/FRE/ITA/SPA/POR/DUT ENGLISH

SENDING MEMORY ON/OFF ON

SEND FROM CONFIRM ON/OFF/ERROR ERROR

FAX PAPER SIZE LETTER/A4/LEGAL A4

AUTO REDUCTION ON/OFF ON

DISCARD SIZE 0~30mm 20MM

RINGS TO ANSWER 1~7 2

STAMP RCV.NAME ON/OFF OFF

RCV.START CODE 0~9 * 9 *

ECM MODE ON/OFF ON

CALLER ID ON/OFF OFF

JUNK FAX BARRIER ON/OFF OFF

DRPD MODE ON/OFF OFF

TECH MODE MODEM SPEED 2.4/4.8/7.2/9.6/12.0/14.4/28.8/33.6 26.4 KBPS

DIALING MODE TONE/PULSE TONE

SEND FAX LEVEL 0~15 -12 DBM

RCV. FAX LEVEL 40~50 -43DBM

FLASH TIME(RECALL TIME) 80/280/600 80 MS

PAUSE TIME 1~9 4 SEC

REDIAL INTERVAL 1~15 3 MIN

REDIAL COUNT 0~5 2

DP MAKE/BREAK 40/60~33/67 33/67

SILENCE TIME UNLIMITED/12SEC UNLIMITED ERROR

RATE 5%/10% 10%

IGNORE TONER EMPTY ON/OFF OFF

GROUP DIAL SETUP GROUP NO[1-20]

VOLUM SETUP ALARM VOLUM ON/OFF ON

KEY VOLUM ON/OFF ON

MEMORY CLEAR FAX NUMBER/NAME

DIAL/SCHEDULE

JOURNAL

DEFAULT SETUP

MAINTENANCE CLEANING DRUM

ADJUST SHADING

REMOTE TEST OFF/ON

NOTIFY TONER LOW OFF/ON

ROM TEST ROM OK! (VERSION)

CIS TEST

DRAM TEST DRAM OK

SWITCH TEST

DTMF TEST

TONER COUNT

PRINTING INFO OFF/ON

PROGRAM DOWNLODE

SCAN COUNT CLEAR COUNT CLEARING ..

4-2-1 System Data List in TECH MODE

: Only Tech Mode

Troubleshooting

4-3

Samsung Electronics

In TECH mode, press SETUP, then press or until

‘TECH MODE’ appears in the display. Press Start/Enter.

The following technical options are available.

Note : If necessary, print System Data List in TECH mode.

The list shows all current system data settings

including the TECH MODE options. To print the sys-

tem data list, press Report/Help, then press

or until ‘SYSTEM DATA’ appears in the dis-

play, and press Start/Enter.

Modem Speed

• You can set the maximum modem speed.

• Communication is done with modem speed automatically

set at lower speed when communicating with the modem

with lower speed since communication is done on the stan-

dard of the side where modem speed is low for transmis-

sion/reception. It is better set 26.4KBPS as default setting.

DIALING MODE

• Select the dialing mode according to the user's line status.

• TONE: Electrical type of dial

• PULSE: Mechanical type of dial

SEND FAX LEVEL

• You can set the level of the transmission signal. Typically,

the Tx level should be under -12 dBm. The level within the

range of 1 to -15 dBm is acceptable.

• Caution: The Send Fax Level is set at the best condition

in the shipment from factory. Never change set-

tings arbitrarily.

RCV FAX LEVEL

• You can set the level of the receiving signal.

•

The reception level may be too low due to the cable losses.

• If it is set to -43 dBm, the reception sensitivity will be

between 0 and -43 dBm. If it is set to -48 dBm, the recep-

tion sensitivity will be between 0 and -48 dBm.

• Caution: The Send Fax Level is set at the best condition

in the shipment from factory. Never change set-

tings arbitrarily.

FLASH TIME

• Set the flash time to 80, 280, or 600 milliseconds.

PAUSE TIME

• Pause time mean delay time (unit: second) inserted

between dial number signal and the next number of signal

in the automatic dial (One touch, Speed dial, Redial) and

the manual dial.

• Caution: The Send Fax Level is set at the best condition

in the shipment from factory. Never change set-

tings arbitrarily.

REDIAL INTERVAL

• If the remote machine is busy when the machine sends a

fax using automatic dialing, the machine automatically

redials the number. Select the time interval between auto-

matic redial attempts. Enter the desired redial interval

using the number keypad: 1 - 15 minutes.

REDIAL COUNT

• You can set times that redial automatically attempts when

automatic transmission is done or when the remote

machine is busy or when the machine send a fax. If there

is no response after redialing by the times already set,

redial is no longer attempted. No redial is attempted if the

settings is 0. Enter the desired times from 1 through 5.

DP Make/Break

• Select the dial pulse make and break time: 40-60 or 33-67

• Caution: Send Fax Level is set at the best condition in the ship-

ment from factory. Never change settings arbitrarily.

SILENCE TIME

• In ANS/FAX mode, after a call is picked up by the answer-

ing machine, the machine monitors the line.

• If a period of silence is detected on the line at any time, the

call will be treated as a fax message and the machine

begins receiving.

• Silence detection time is selectable between limited (about

12 seconds) and unlimited time.

• When '2 sec' is selected, the machine switches to receiv-

ing mode as soon as it detects a period of silence. When

'unlimited'is selected, the machine waits until the answer-

ing operation is concluded even though a period of silence

is detected. After the answering operation is concluded,

the machine switches to receiving mode.

ERROR RATE

• When the error rate is about to be over the setting value,

the Baud rate automatically lowers up to 2400 bps to make

the error rate remain below the setting value.

• You can select the rate between 5% and 10%.

IGNORE TONER EMP

• You can set this function ON if desiring to drive the engine

continuously even though the life of toner is run out and it

becomes Toner Empty status.

4-2-2 Tech Mode Options

Troubleshooting

4-4 Samsung Electronics

In TECH mode, press SETUP, then press or until

‘MAINTENANCE’ appears in the display. Press Start/Enter.

The following technical options are available

CLEAN DRUM

• Use this feature to get rid of the toner remained in the

development unit, so you can get a clean printout.Perform

this feature if stains or specks appear on the printing mate-

rials and print quality falls.

• Perform this feature several times until a clean printing

material appears.

ADJUST SHADING

• Use this feature to correct the white reference of the scan-

ner if you experience bad copy images. When using this

feature, a white paper should be used to get clean copy

images.

• Use this adjustment feature to achieve best image (scan)

quality depending on the characteristics of the CIS (Contact

Image Sensor) parts.

1. Select [ADJUST SHADING] from the Service Mode.

2. Insert a clean white original [Letter Size] into the paper

loading part.

3. Original is scanned if pressing the Setting button.

4. If the original scan is completed, message is displayed

on the LCD window and CIS SHADING PROFILE is

output.

• If the output image is different from the normal screen, the

CIS is poor.

Caution:

1. Always perform the CIS TEST after downloading

Firmware. Otherwise, the system may not operate prop-

erly.

2. Always perform ADJUST SHADING after replacing the

CIS.

3. Always use a clean white paper in ADJUST SHADING

(Maximum paper width: Letter Size).

4. ADJUST SHADING may be performed even in the User

Mode but ADJUST SHADING profile is output only in the

TECH MODE.

REMOTE TEST

• The Remote Test feature can be enabled in order to allow

a remote location to call up and run a diagnostic test on

your machine. You may be instructed by a service repre-

sentative to enable this feature.

NOTIFY TONER LOW

• With this feature enabled, when the toner becomes low, the

toner low information will be sent to ta specified contact

point, for example, the service company. After you access

this menu, select ON, and when the LCD prompts, enter

the name and the number of the contact point, the cus-

tomer's fax number, the model name, and the serial num-

ber.

ROM TEST

• Use this feature to test the machine'S ROM. The result and

the software version appear in the LCD display.

CIS TEST

• This test checks the operation of the Contact Image Sensor

(CIS). Each time the number changes by one increment,

the average ADC value of CIS prints out.

DRAM TEST

• Use this feature to test the machine's DRAM. The result

appears in the LCD display.

SWITCH TEST

Use this feature to test all keys on the operation control

panel. The result is displayed on the LCD window each time

you press a key.

MODEM TEST

• Use this feature to hear various transmission signals to the

telephone line from the modem and to check the modem.

• If no transmission signal sound is heard, it means that the

modem part of the main board is poor.

DTMF TEST

• DTMF (Dual Tone Multi Frequency) signal. When you

press any key on the number keypad including • and #, you

will hear the corresponding key tone.

TONER COUNT

•This feature shows the current state of the toner cartridge.

•TONER CNT: The total number of the dots used to print up

to current time.

•CRU STATE: The page number which the toner cartridge

can print.

• Caution : After replacing Main board to new one, you

should update the information to the new board.

4-2-3 Maintenance Options

Troubleshooting

4-5

Samsung Electronics

PRINTING INFO

• This feature allows the machine to automatically print vari-

ous information, like toner count, transfer voltage, fusing

temperature and so on, at the bottom of each printed page.

• PAGE TONER CNT: prints the number of dots used to print

the page.

• TOTAL TONER CNT: prints the total number of the dots

used to print up to current time.

• THV ON DUTY: prints ADC value of transfer voltage.

• THERMISTER: prints ADC value of fusing temperature.

• P: prints the page number.

PROGRAM DOWNLOAD

• Use this feature to download a new upgraded ROM file

from a PC that is connected to the machine with a parallel

cable (IEEE 1284).

SCAN COUNT CLEAR

• If performing this feature, the value of scanning original until

now is initialized (0). (Total scan count value on the system

data list becomes 0.)

Adjust Shading Sample Pattern

Troubleshooting

4-6 Samsung Electronics

In TECH mode, press Report/Help, then select the desired

list or report by using or key, then press Start/Enter.

The following options are available

HELP

• It shows a brief description on the machine's basic func-

tions and commands.Use it as a quick reference guide

SENT JOURNAL

• This journal shows a specific information concerning trans-

mission activities, the time and dates of up to 40 of the

most recent transmissions.

RECEIVED JOURNAL

• This journal shows a specific information concerning

reception activities, the time and dates of up to 40 of the

most recent receptions.

PHONEBOOK

• It lists all telephone numbers that have been stored in the

machine.

SENDING CONFIRM

• It shows the result of the last send operation.

SCHEDULE INFORM

• This list shows a specific information on the documents

currently stored for delayed transmission. It provides the

operation number, starting time, type of operation, etc.

SYSTEM DATA

• This list provides a list of the user system data settings and

tech mode settings.

PROTOCOL LIST

• This list shows the sequence of the CCITT group 3 T.30

protocol during the most recent sending or receiving oper-

ation. Use this list to check for send and receive errors. If

a communication error occurs while the machine is in

TECH mode, the protocol list will print automatically.

PATTERN PRINT

• Using this pattern printout, you can check if the printer

mechanism is functioning properly. Examine the pattern

and look for a break in the diagonal line. If the diagonal

lines are not broken, the printer mechanism is functioning

properly.

SHADING PRIN

• With this print, you can check the scanning elements of the

CIS (Contact Image Sensor).

The Engine test mode is used to check the operation of the

components related to the printer engine.

The following test are available.

To access the Engine Test Mode:

1. Press Setup, #, 1, 9, 3, 1 in sequence.

2. When ‘ENGINE TEST?’ appears, press Start/Enter.

3. Scroll the options by pressing or repeatedly find

the one you want.

4. Press Start/Enter to start the test.

5. Press Stop to exit the Engine test mode.

• Caution :

When you finish operating in Engine Test Mode, you must turn

the power Off/On.

Engine Test Mode Options :

1. MAIN MOTOR TEST

2 PTL TEST

3. FAN TEST

4. FUSER TEST

( FUSER ON : 145˚C , FUSER OFF : 145˚C )

5. LSU MOTOR TEST

6. LD(LASER DIODE) TEST

7. HSYNC TEST (NG/OK)

8. LSU OPERATION TEST (NG/OK)

SENSOR TEST ( FEED , EXIT , PAPER EMPTY , COVER OPEN)

10. SOLENOID TEST

11. MHV TEST ( -1550 V )

12. DEV TEST ( - 430 V )

13. THV(+) TEST ( +1300 V )

14. THV(-) TEST

15. THV TRIGGER TEST

16. ALL FUNCTION TEST :

This function is for a manufacturing press . You can test

all function(1~15)

• When you push the “Start” button, the Main Motor runs.

• If you push the “Start” button again , the current test

stops, and the next test starts.

4-2-4 Printout Report

4-2-5 Engine Test Mode

S NSF 61005820003380140200001302090018010000

S/R FCF FIF DATA ASCII

S CSI 2020202020202020202020202O20202020202020

S CSI 202020202020202020202022O202020220202020

R TSI 2020202020202020202020202O20202020202020

S DIS 00000000 01110111 00010111 00100010

R DCS 00000000 01100001 00010101 00000000

R TSI 2020202020202020202020202O20202020202020

R DCS 00000000 01100001 00010101 00000000

S CFR

R MPS

S MCF

S DCN

S FTT

S NSF 61005020003380140200001302090018010000

PROTOCOL DUMP LIST OCT-20-1999 06:35

Sending/Receiving Name of signal

(Facsimile Control Field)

Facsimile Information Field

data described in hexdecmal code

FIF data described

in ASCII code

Troubleshooting

4-7

Samsung Electronics

< SAMPLE OF A PROTOCOL DUMP LIST >

A number of reports can be printed from the fax machine

within the test mode. The protocol list all contain detailed

information which may be required when contacting techni-

cal support.

To printout the protocol list :

1. Get into the Tech mode by pressing Setup, #, 1, 9, 3, 4.

2. In Tech mode, press Report/Help.

3. Press or repeatedly until you find the Protocol

List. When you find ‘PROTOCOL LIST’, press ENTER.

SAMPLE OF A PROTOCOL DUMP LIST

4-2-6 Maintenance List

Troubleshooting

4-8 Samsung Electronics

4-3 Diagnostics

This section describes methods and procedures to isolate the cause of a malfunction in the machine. This machine displays diag-

nostic information on the LCD. In addition, it can perform a series of tests that allow the machine to observe individual machine

functions.

4-3-1 Error Messages

DOCUMENT JAM

DOOR OPEN

LINE ERROR

LOAD DOCUMENT

LSU ERROR

The loaded document has jammed in the feeder. Clear the document jam.

The top cover is not securely latched. Press down on the cover until it clicks in

place.

Your unit cannot connect with the remote

machine, or has lost contact because of a prob-

lem on the phone line.

Try again. If failure persists, wait an hour

or so for the line to clear, then try again.

Or, turn the ECM mode on.

You have attempted to set up a sending oper-

ation with no document loaded. Load a document and try again.

There occurs a problem in the LSU

(Laser Scanning Unit). Unplug the power code and plug it back

in. If the problem still persists, please call

for service.

FUSER ERROR There occurs a problem in the fuser unit. Unplug the power code and plug it back

in. If the problem still persists, please call

for service.

MEMORY FULL The memory is full. Either delete unnecessary documents, or

retransmit after more memory becomes

available, or split the transmission into

more than one operation.

JAM/NO CARTRIDGE Recording paper has jammed inside the unit, or

the toner cartridge is not installed.

Clear the jam, or install the cartridge

NO ANSWER The remote machine has not answered after all

the redial attempts. Try again. Make sure the remote machine

is operational.

NO. NOT ASSIGNED The one-touch or speed dial location you tried

to use has no number assigned to it. Dial the number manually with the key-

pad, or assign a number.

Error Message Description Solution

Troubleshooting

4-9

Samsung Electronics

NO PAPER

OVER HEAT

POLLING ERROR

POWER FAILURE

RECEIVE ERROR

The recording paper has run out. Load the recording paper.

The printer part in your unit has overheated. Please wait until it cools down.

If you cannot solve the problem, please

call for service.

The remote fax machine you want to poll is not

ready to respond to your poll.

Or When setting up to poll another fax machine,

you have used an incorrect poll code.

The remote operator should know in

advance that you are polling and have

their fax unit loaded with the original doc-

ument. Enter the correct poll code.

A power failure has occurred. If documents have been stored in the

memory, a ‘Power Failure Report’ will be

printed automatically when the power is

restored.

A fax has not been received successfully. A problem with the facsmile communica-

tions has occurred. Ask the sender to try

again.

PAPER JAM 0 Recording paper has jammed in the paper feed-

ing area.

Clear the jam.

RETRY REDIAL ? The machine is waiting for a specified time inter-

val to redial a previously busy station. You can press Start to immediately redi-

al, or Stop to cancel the redial operation.

PAPER JAM 2 Jammed paper still remains inside the unit. Clear the jam, or install the cartridge

SEND ERROR Your fax has not gone through successfully. A problem with the facsmile communica-

tions has occurred. Try again.

TONER EMPTY

TONER LOW

WARMING UP

The toner cartridge has run out. The machine

stops.

The toner is almost empty.

The printer is warming up and is off-line.

Replace with a new toner cartridge.

Take out the toner cartridge and gently

shake it. Using this way, you can tem-

porarily re-establish the print quality.

Wait until the printer is on-line.

Error Message Description Solution

Troubleshooting

4-10 Samsung Electronics

When you replace the main board to new one, the informa-

tion on the toner state is cleared. Therefore, you should

update the information to the new board by entering the

exact value of total toner count and specifying the toner car-

tridge installed currently is shipped with the machine or new.

If not, ‘TONER LOW/EMPTY’ message may not appear

when the toner is run out.

1. In Tech mode, print ‘SYSTEM DATA LIST’. The list

includes the total toner count and CRU state information.

• TOTAL TONER COUNT: The total number of the dots

used to print up to current time.

• CRU STATE: The page number which the toner car-

tridge can print. (The yield of a new toner cartridge is

approximately 2,500 pages and that of the cartridge

supplied with the machine is approximately 1.000

pages.)

2. Replace Main board.

3. In Tech mode,

3-1) Press Setup, and find ‘MAINTENANCE’ by pressing

repeatedly or , then press Start/Enter.

3-2) When ‘TONER COUNT’ is displayed in LCD, press

Start/Enter, and enter the value of the total toner

count in the system data list.

3-3) When you are prompted to enter CRU STATE, press

Start/Enter.

3-4) When you see ‘[1.1000 2.2300]’ in LCD, select the

value of the CRU state in the system data list.

4. In Tech mode, print ‘SYSTEM DATA LIST’ and make sure

that the toner information is updated.

4-4 Print Quality

4-5 Note for replacing Main board

No Roller Abnormal image period Kind of abnormal image

1 OPC Drum 75.4mm •White spot on black image

•Black spot

2 Charge Roller 37.7mm Black spot

3 Supply Roller 26.8mm Horizontal density band

4 Develope Roller 31.6mm Horizontal density band

5 Transfer Roller 47.1mm Black side contamination/transfer fault

6 Heat Roller 50.1mm Black spot, White spot

7 Pressure Roller 50.2mm Black side contamination

Troubleshooting

4-11

Samsung Electronics

Vertical black line and band

YES

OK after

replacing the LSU? Remove part on the paper

path causing the trouble

OK after replacing

developer?

Any obstacles on

the developer blocking

the laser beam.

OK after

removing the

obstacles?

Any obstacles ON

mirror lens of LSU and

laser path?

Remove the obstacles.

Replace the LSU

Replace the developer

END

YES

4-6 Troubleshooting Flow Chart

Troubleshooting

4-12 Samsung Electronics

Check connection to

computer or replace

controller

Take out the cartridge

and prepare the tester

for electronic connection

Repair or replace the GND

terminal

Check the path between

video controller, engine board

and HVPS. Repair or replace

the defective component

or board

The mirror in LSU might be

misplaced so the light path to the

OPC deviates ->Repair or replace

LSU or remove any deffective

matters in the machine

Self test

pattern prints?

No image?

Self testing

is possible via

Tech Mode?

Is the OPC

terminal of machine

is well-connected

to Frame?

Does the

video data line to

LSU transit to High/Low

when printing?

Re-test after replacing the

conector or Main board

A on

NO NO

YES

YES YES

YES

No Image

Troubleshooting

4-13

Samsung Electronics

Transfer roller might be out of its location

-> Locate the roller into its place

This could occurrs when he power of LSU is low or

the density is low due to the obstacles on the window

-> Replace LSU or clean the window

Trnasfer

voltage OK? (on the

transfer roller

shaft)

Is the

connection of

OPC GND and Frame Ground

correct? (less than

10 ‰)

Are the

connection terminal

and connection

correct?

Repair or replace terminal

Replace HVPS or repair defective component

Is the connection

terminal OK?

Check the connection of

frame Ground and OPC GND

Replace HVPS or repair defective component

Repair or replace terminal

Developing

(-350V) and supplying

(-550V) voltage

are OK?

Does the

counter indicate over

the toner’s guarranty

life

Replace the toner cartridge

NO NO

YES

Troubleshooting

4-14 Samsung Electronics

Replace the developer

YES

END

YESYES

NO NO

YES

Replace the HVPS

Ok after setting to the

normal mode?

YES

Remove the obstacles

YES

Clean transfer roller

and gear holder

YES

Replace the LSU

Replace the developer

Is it not over

the guaranty life of dot

counter?

Is the toner save

mode or the light mode

is selected?

Is the high voltage

normal? (charging,

developing,

transfer)

Any obstacles on the

gab between high voltage

terminal and

developer?

Transfer roller

works OK?

OK after replacing

LSU?

HVPS works OK?

Light image

Troubleshooting

4-15

Samsung Electronics

All black in

printing area?

Is transfer

voltage supplied

(-1.55 KV)?

Is the

Hsync/ signal received

in LSU?

Transfer part’s contact

is bad -> Repair or

replace toner cartridge

Does the

video data line to LSU

transit to High/Low when

printing?

Replace LSU

Check the path among video

controller, engine board,

HVPS, LSU for the shortage

or open -> Repair or replace

the boards

Repair or replace HVPS

Replace LSU

YES

All Black

Troubleshooting

4-16 Samsung Electronics

White line

missing definitely?

Dirt of dust stuck onto the window of internal

lens of LSU

-> Clean it or replace LSU

Preventive obstacles through the path between

OPC of developer and LSU prevent the path

-> Remove the obstacles

Check if the

printout is still has the

same problem even right after

passed through the

transfer roller

Toner material might be stuck to blade in the developer

inside and it prevents toner supply

-> Replace the toner cartridge

Check both if the toner cartridge’s counter is over its

guaranty and amount of the toner material

-> Replace the toner cartridge

The ribs in fuser or toner on the roller may invoke

the image problem

-> Replace the fuser cover or the defective part

The image is originally black or the black part is

far close to the top

-> Use the pattern which has the image below bigger

than 10mm from the top

END

YES

Does the problem

persist?

YES

Vertical White Line (Band)

Troubleshooting

4-17

Samsung Electronics

Dark selected

via RCP?

Change to

Normal and test

Works cor

with -350V of Bias

voltage?

Works

correctly after

replaced LSU?

Repair or replace the defective

component

The power of LSU is set

high or internal problem

-> Replace LSU or adjust

voluem

Same at Normal? END

Toner over supply due to the

adjustment fault of metering

blade in developer

-> Replace developer

YES

Dark Image

Troubleshooting

4-18 Samsung Electronics

Recommended

paper used?

Is pressure of

transfer roller too high?

Does the operation of

TR work properly?

Transfer,

charge and developing

voltage are OK?

Operating/

storage atmosphere is

too high temperature

/humidity?

Solve the problem under

the recommended condition

(10-32 degree Centigrade)

Dirt or

dust around the

charge roller?

Clean the charge roller

or replace step-up device

/terminal after check

Work OK?

Internal blade or suppying

part of the developer is

defective

-> Replace the toner cartridge

Check Terminals or contacts and ’Guide-Deve Spring’

are misplaced

-> Repair or replace transfer roller etc.

Print 20 to 30 pages using

the recommended paper

Same problem

occurs?

- Adjust voltage or replace HVPS

- Repair or replace after checking the

terminals’ contacts

Replace transfer

roller’s holder END

Replace the

toner cartridge

NO YES

YES

YES YES

YES

Background

Troubleshooting

4-19

Samsung Electronics

Is it regular

interval of 75.4mm?

Irregularity of NIP

between rollers in

developer

-> Replace developer

Clean heat roller

or replace it

Clean transfer roller’s holder and

TR drive gearor replace TR holder ass’y

Clean TR drive

and OPC gear

END

A specific part of the transfer roller has

ruined or its resistance value is changed

-> Replace transfer roller

Transfer roller cannot force regularly due

to the gears eccentricity of transfer roller

-> Replace the defective component

Adjust the Bias

voltage or replace HVPS

There may be a problem in toner

layer control in toner cartridge

-> Replace the developer

Use the machine with

recommended paper

Check if the hardness of

P/R, and spring force is OK?

(spring’s force: 2.5 Kg)

Re-assemble

thermistor

NO NO

YES

YES YES YES

Poor Fusing Grade

Troubleshooting

4-29

Samsung Electronics

Plug in the

power cord?

The power

voltage supplying is

the same as

rating?

The fan

revolves when

powered on?

LEDs blink

once when

powered on?

The On-Line

key is being pressed

or shortage on

the panel

board?

Repair/replace the

board

Check the voltage first and plug

the power cord

Supply the power as the rating

Connections

on board are OK?

Re-connect firmly

and re-test

The connection

error between

controller board

and panel board

or malfunction

of boards.

-> Replace the

boards

Fuse of SMPS

if open?

Shortage

between 5V and

GND, or between

24V and

GND?

Replace the fuse

Toner cartridge

is in the set?

Detect failure due to the

board which detects top

cover open or switch error

-> Replace the board or switch

Put in the

cartridge

Remove the shortage

or replace the board

NO NO

YES

YES YES

YES

YES YES

YES

No Power (LCD NO display LED Off)

Troubleshooting

4-30 Samsung Electronics

Less than 10W?

AC is being supplied?

The voltage

of pin #208 of U5

(CPU) on the Main board

is about 2.3V when

printing?

END

Thermostat is open due to the heat etc.

-> Replace the thermostat

Check the PCI and fusing

control part and CN502

on the SMPS

-> Replace the component

or replace the SMPS

Measure the resistance

at the both ends of AC

Line with covers open

Remove the covers

Re-assemble the top

cover and close it

Thermistor, connecting point or engine

board defect -> Repair/replace the

component/board

YES

Fuser Error

Troubleshooting

4-31

Samsung Electronics

Sounds the

solenoid on when starts

print?

Does the

paper move?

Does the

paper move more than

100mm?

The Engine board defected

-> Replace boards

The solenoid defected

-> Replace it

The pick-up unit is

assembled wrong

-> Re-assemble or replace

the unit

Feeder

sensor and paper

width detect sensor

are assembled

reverse?

Switch them

The Sensor board

defected

-> Repair/replace

Too many

papers in the

feeder?

Paper guides

fit the paper width?

Paper end curled? Does the

extender pulled out?

Use the MPF for the thick

paper such as envelope

and cardstock

Reduce the amount

and re-test

Take out the paper

and re-insert

Use the recommended

and quality paper

Pull out the

extender

NO NO

YES

YES YES

Paper Jam (Mis-feeding)

Troubleshooting

4-32 Samsung Electronics

Paper

stopped before

the OPC?

Check the LSU and

if it has the defect

replace it

Paper

stopped before

the fuser?

Severe skew

when feeding?

Adjust the paper guides to fit the

paper width

The force of springs pressing the

developer is weak

-> Check guide-DEVE

The paper

came out through

between fuser and

developer?

Too thin

or sensitive paper to

static electricity?

Use the recommended

paper

Check guide transfer

is grounded Check

the shutter prevents

feeding

Check the input path

to the fuser (such as

mis-assembly)

The

actuator of

paper exit sensor

works OK?

Check the actuator exists and its

operation and around the engine board

-> Replace

Is the paper

rolled around the

presseure

roller?

Remove the fuser, remove

the paper and replace the

pressure roller, if necessary

Feeds

multiple pages?

Remove any factors

Check the roller

and ribs of fuser

are in place, and

remove burrs, if

any

-> Remove the

factors of jam

NO NO NO

NO NO

YES YES YES

YES

YES YES

YES

Paper Jam (Jam1)

Troubleshooting

4-33

Samsung Electronics

Try again to connector

Replace connector

END

Check

CBF Harness28P

(MAIN B’D to ENGINE

B’D)

YES

Check

MAIN B’D CN9-6,

HSYNC Signal

( )

Replace LSU

YES

Check

MAIN B’D CN9-3,

P_MOTOR Signal

( )

Replace MAIN B’D

YES

Check

MAIN B’D CN9-4,

LREDADY Signal

( )

Replace LSU

YES

Check

MAIN B’D CN9-9,

LDON Signal

( )

Replace MAIN B’D

YES

LSU Error

5-1

Samsung Electronics

5. Exploded Views and Parts List

5-1 Main Assembly

5-2 Shield Engine Unit Assembly

5-3 Engine Assembly

5-4 Frame Lower Assembly

5-5 Fuser Assembly

5-6 Plate-Upper Unit Assembly

5-7 OPE Unit

5-8 Scan Upper Assembly

5-9 Front Assembly

5-10 RX Drive Unit Assembly

Exploded Views and Parts List

Samsung Electronics5-2

5-1 Main Assembly

10 &12

16-2

16-1

17-1

17-2

19-1

19-2

18-1

18-2

14-1

14-2

Exploded Views and Parts List

5-3

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

SF-530 / 531P

1 SMPS-V1 JC44-00032A 1 O 110V

SMPS-V2(4CH) JC44-00023A 1 O 220V

2 UNIT-LSU JC59-00006A 1 O

3 IPR-PLATE_CHANNEL JC70-00058A 1 O

4 MEC-PLATE UPPER JC75-00057A 1 O

5 MEC-TRAY JC75-00062A 1 O SF-530

MEC-TRAY(P) JC75-00075A 1 O SF-531P

6 MEC-CRADLE JC75-00083A 1 O

7 PBA MAIN-LIU PBA JC92-01379A 1 O

8 ELA HOU-HANDSET JC96-01629B 1 O

9 ELA-UNIT DEV APO6 E * 1 X

10 ELA HOU-ENGINE ASS’Y * 1 X

11 ELA HOU-SHIELD ENGINE * 1 X SF-530

ELA HOU-SHIELD ENGINE * 1 X SF-531P

12 ELA HOU-FRAME LOWER JC96-02094B 1 O 110V

ELA HOU-FRAME LOWER JC96-02094A 1 O 220V

13 ELA HOU-RX DRIVE JC96-01755A 1 O

14 MEA HOU-OPE FRONT JC97-01463L 1 O SF-530

MEA HOU-OPE FRONT TBD 1 O SF-531P

14-1 PBA MAIN-SCAN JC81-00441A 1 O

14-2 PMO-BASHING WHITE JF72-41306A 1 O

15 PMO-COVER TOP JC72-00128A 1 O

16 MEC-COVER REAR JC75-00059A 1 O

16-1 PMO-COVER_REAR * 1 X

16-2 PMO-TRAY_LARGE * 1 X

17 MEC-STCKER JC75-00060A 1 O

17-1 PMO-STACKER_MAIN * 1 X

17-2 PMO-STACKER_SUB * 1 X

18 MEA UNIT-CHUTE ASS’Y JC97-01187E 1 O

18-1 PMO-CHUTE * 1 X

18-2 PMO-DUMMY CHUTE * 1 X

19 MEC-STACKER JC75-00084A 1 O

19-1 PMO-STACKER TX(APOLLO) JC72-00223A 1 O

19-2 PMO-STACKER TX(B) * 1 X

Main Assembly Parts List

Exploded Views and Parts List

Samsung Electronics5-4

5-2 Shield Engine Unit Assembly

S-9

LIU B’d

Exploded Views and Parts List

5-5

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-SHIELD ENGINE * 1 X SF-530

ELA HOU-SHIELD ENGINE * 1 X SF-531P

1 CABLE-FLAT 3809-001161 1 O

2 CBF HARNESS-LSU JC39-00043A 1 O

3 CBF HARNESS-MAIN-HVPS JC39-00193A 1 O

4 CBF HARNESS-LIU/HOOK 2 JC39-00174A 1 O

5 CBF HARNESS-MODULA 2 JC39-00175A 1 O

6 CBF HARNESS JC39-40022A 1 O INLET

7 IPR-SHIELD ENGINE JC70-00200A 1 O

8 IPR-SHILED SMPS JC70-00263A 1 O

9 MEC-GUIDE STAKE ASS’Y JC75-00087A 2 O

10 PBA MAIN-MAIN JC92-01308B 1 O SF-530

PBA MAIN-MAIN JC92-01308D 1 O SF-531P

11 ELA M/MEDIO AUD-SPEAKER JC96-01607A 1 O

12 WASHER-E.T * 1 X

13 CBF HARNESS-THERMISTOR JC39-00045A 1 O

S2 SCREW-MACHINE 6001-000568 2 O

S8 SCREW-TAPTITE 6003-000221 1 O

S9 SCREW-TAPTITE 6003-000264 11 O

Shield Engine Unit Assembly Parts List

Exploded Views and Parts List

Samsung Electronics5-6

5-3 Engine Assembly

21-1

21-3

21-2

14 13-1

13-2

22-2

22-3 22-1

S-1

19 S-6 S-10

S-1

1-2

1-1

17-4

17-3

17-1

17-2

Frame Lawer Ass’y

Bushing-Shaft

Exploded Views and Parts List

5-7

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-ENGINE ASS’Y*1X

1 MEC-CAM PICK UP JC75-00072A 1 O

1-1 PMO-CAM_PICKUP * 1 X

1-2 PMO-SHAFT_PICKUP * 1 X

2 CBF HARNESS-EARTH (TX MOTOR) JB39-00017A 1 O

3 SOLENOID-(APOLLO) JC33-00002A 1 O

5 SMPS-HVPS JC44-00017A 1 O

6 SPRING-CLUTCH JC61-00012A 1 O

7 SPRING-KNOCK UP JC61-00023A 1 O

8 PBA MAIN-HOOK 2 JC92-01378A 1 O

9 PBA MAIN-ENGINE JC92-01320A 1 O

10 PMO-GEAR_FEED JC72-00115A 1 O

11 PMO-CLUTCH_FEED JC72-00116A 1 O

12 PMO-CAP_PAD JC72-00124A 1 O

13 MEA RACK-TR ASS’Y*1X

13-1 PPR-SPACER DR * 1 X

13-2 MEC-TRANSFER ROLLER JC75-00035A 1 O

14 PMO-GEAR_TRANSFER JC72-00179A 1 O

15 PCT-INSULATOR ENG BD * 1 X

16 PMO-DUMMY SIDE * 1 X

17 MEC-HOLDER PAD JC75-00156A 1 O

17-1 SPRING-PAD JC61-00054A 2 O

17-2 PMO-HOLDER PAD JC72-00535A 1 O

17-3 PMO-HOLDER PAD LARGE JC72-00536A 1 O

17-4 RPR-PAD FRICTION * 1 X

18 MEC-TERMINAL JC75-00049A 5 O

19 MEC-SIDE PAD(L) JC75-00050B 1 O

20 MEC-SIDE PAD(R) JC75-00051B 1 O

21 MEC-KNOCKUP ASS’Y JC75-00053A 1 O

21-1 IPR-BAR_KNOCKUP * 1 X

21-2 PMO-PLATE-KNOCKUP * 1 X

21-3 PMO-CAM-KNOCKUP * 1 X

22 MEC-GEAR PICK UP JC75-00056A 1 O

22-1 SPRING-PICK UP GEAR * 1 X

22-2 PMO-GEAR_PICKUP,1 * 1 X

22-3 PMO-GEAR_PICKUP,2 * 1 X

S7 SCREW-TAPTITE 6003-000196 7 O

S10 SCREW-TAPTITE 6003-000266 2 O

S11 SCREW-TAPTITE 6003-000119 17 O

Engine Assembly Parts List

Exploded Views and Parts List

Samsung Electronics5-8

5-4 Frame Lower Assembly

S-2

28-3

28-4

28-5

28-1

28-2

34-2 34-1

24 4

S-1

S-6

S-1

S-2

S-6

27-1

27-2

29-3

30-2

29-4

29-1

29-2

30-3

30-1

S-1

Transfer Roller

Exploded Views and Parts List

5-9

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-FRAME LOWER JC96-02094B 1 O 110V

ELA HOU-FRAME LOWER JC96-02094A 1 O 220V

1 CBF HARNESS-OPE GND * 1 X

2 CBF HARNESS-FUSER JC39-00061A 1 O

3 SPRING-P/R (APOLLO) * 2 X

4 SPRING-GUIDE DEVE * 2 X

5 BEARING-PRESSURE R * 2 X

6 IPR-SAW_PLATE * 1 X

7 IPR-EARTH_TRANS * 1 X

8 IPR-GROUND_GUIDE * 1 X

9 IPR-GROUND_HVPS * 1 X

10 IPR-GROUND_FUSER * 1 X

11 IPR-GUIDE-TR * 1 X

12 IPR-PLATE-TERMINAL * 1 X

13 IPR-GROUND DRIVE * 1 X

14 PMO-BUSHING_TERMINAL * 1 X

15 PMO-ACTUATOR_EXIT JC72-00130A 1 O

16 PMO-GUIDE_INPUT * 1 X

17 PCT-FILM SAW * 1 X

18 PMO-HOLDER PR JC72-00531A 2 O

19 PMO-HOLDER EXIT JC72-00532A 2 O

20 PMO-FRAME LOWER JC72-00533A 1 O

21 PMO-COVER PTL JC72-00534A 1 O

23 PMO-CAP PLTE G/DEV R JC72-41135A 1 O

24 PMO-CAP PLTE G/DEV L JC72-41173A 1 O

25 PMO-STOPPER EXIT * 2 X

26 RMO-RUBBER_FOOT * 2 X

27 MEC-ROLLER FEED JC75-00054A 1 O

27-1 RPR-ROLLER FEED * 2 X

27-2 MEC-SHAFT FEED * 1 X

28 MEC-HOLDER FEED JC75-00055A 1 O

28-1 SPRING-ACT, FEED * 1 X

28-2 PMO-HOLDER_FEED * 1 X

28-3 PMO-BUSHING_FEED * 2 X

28-4 PMO-ACTUATOR_EMPTY * 1 X

28-5 PMO-ACTUATOR_FEED JC72-00119A 1 O

29 MEC-HOLDER TR L JC75-00106C 1 O

29-1 SPRING-TR(300) * 1 X

29-2 IPR-PLATE_TR * 1 X

29-3 PMO-HOLDER TR JC72-00100C 1 O

29-4 PMO-BUSHING_TR(L) JC72-00102A 1 O

30 MEC-HOLDER TR R JC75-00107C 1 O

30-1 SPRING-TR(300) * 1 X

30-2 PMO-HOLDER TR JC72-00100C 1 O

30-3 PMO-BUSHING_TR(R) JC72-00101A 1 O

31 MEC-ROLLER_PR 1210 JC75-00130A 1 O

32 PBA MAIN-SENSOR JC92-01197A 1 O

33 ELA HOU-MOTOR GND JC96-01579A 1 O

34 ELA HOU-OPEN SENSOR JC96-01584A 1 O

34-1 CBF HARNESS-COVER JC39-00041A 1 O

34-2 IPR-BRKT-SENSOR * 1 X

35 ELA HOU-PTL ASS’Y JC96-02312A 1 O

36 ELA HOU-FUSER 110V JC81-00439A 1 O 110V

ELA HOU-FUSER 220V(531P) JC81-00440A 1 O 220V

37 PMO-BUSHING SHAFT JG72-40849A 1 O

38 GEAR-FU_IN 47 JC66-00306A 1 O

39 PMO-HUB GEAR JC72-00676A 1 O

40 GEAR-FU_OUT 47 * 1 X

41 PMO-GEAR_83/35 JC72-00154A 1 O

42 IPR-BRACKET FUSER DRV * 1 X

43 FAN-DC 3103-001085 1 O

S6 SCREW-TAPTITE 6003-000152 1 O

S7 SCREW-TAPTITE 6003-000196 2 O

S11 SCREW-TAPTITE 6003-000119 17 O

Frame Lower Assembly Parts List

Exploded Views and Parts List

Samsung Electronics5-10

5-5 Fuser Assembly

14-1

14-2

Exploded Views and Parts List

5-11

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-FUSER 110V JC81-00439A 1 O 110V

ELA HOU-FUSER 220V(531P) JC81-00440A 1 O 220V

1 THERMISTOR-NTC 1404-001188 1 O

2 THERMOSTAT 4712-000001 1 O

3 LAMP-HALOGEN 4713-001120 1 O 110V

LAMP-HALOGEN 4713-001121 1 O 220V

4 PMO-FUSER_UPPER * 1 X

5 PMO-BUSHING H/R L JC72-00530A 1 O

6 PMO-BUSHING H/R R JC72-00529A 1 O

7 PMO-COVER_THERMOSTAT * 1 X

8 NPR-ROLLER HEAT JC71-00012B 1 O

9 IPR-ELECTRODE_PLATE * 1 X

10 IPR-GROUND_FU * 1 X

11 IPR-PIN ROLLER EXIT * 4 X

12 IPR-ELECTRODE WIRE1 * 1 X

13 IPR-ELECTRODE WIRE,S * 1 X

14 MEA ETC-SHAFT EXIT * 1 X

14-1 PMO-SHAFT_EXIT(Z15) JC72-00150A 1 O

14-2 RMO-RUBBER_EXIT * 4 X

15 PMO-ROLLER_IDLE EXIT JC72-00567A 4 O

16 SPRING-EXIT JC61-00017A 4 O

17 PMO-GEAR_EXIT_DRV16 * 1 X

18 PMO-GEAR_EXIT_IDLE * 1 X

19 GEAR-FUSER 1210 JC66-00037B 1 O

20 LABEL(R)-CAU_HOT_FU * 1 X

21 SPRING-CLAW * 5 X

22 PMO-GUIDE CLAW * 5 X

S SCREW-TAPTITE 6003-000119 5 O

S SCREW-TAPTITE 6003-000196 1 O

Fuser Assembly Parts List

Exploded Views and Parts List

Samsung Electronics5-12

5-6 Plate-Upper Unit Assembly

6-1

6-2

6-3

6-1

6-2

6-3

S-1

4-1

4-2

4-3

Exploded Views and Parts List

5-13

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 MEC-PLATE UPPER JC75-00057A 1 O

1 IPR-UPPER-PLATE * 1 X

2 IPR-PLATE SPRING DEV JC70-10223A 2 O

3 ELA UNIT-FUSE DEVE * 1 X

4 MEA ETC-ROLLER PICK UP * 1 X

4-1 PMO-HOUSING_PICKUP JC72-00109A 1 O

4-2 RMO-ROLLER_PICKUP * 1 X

4-3 PMO-IDLE_PICKUP * 2 X

6 MEA ETC-IDLE FEED * 2 X

6-1 PMO-HOLDER_PICKUP * 1 X

6-2 SPRING-FEED * 1 X

6-3 PMO-HOLDER_IDLE,FEED * 1 X

7 CABLE CLAMP 6502-000130 1 O

8 ICT-ROLLER IDEL FEED * 1 X

S5 SCREW-TAPTITE * 2 X

S10 SCREW-TAPTITE 6003-000266 1 O

S10 SCREW-TAPTITE 6003-000266 2 O

Plate-Upper Unit Assembly Parts List

Exploded Views and Parts List

Samsung Electronics5-14

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-OPE ASS’Y JC81-00442A 1 O SF-530

ELA HOU-OPE ASS’Y JC81-00468A 1 O SF-531P

1 SCREW-TAPTITE 6003-000119 6 O

2 MPR-COVER ADRESS JG74-10543A 1 O

3 PMO-KEY COPY JB72-00102A 1 O

4 PMO-KET STOP JB72-00108A 1 O

5 LABEL(P)-ONE TOUCH * 1 X

6 PMO-KEY OT JC72-00275A 1 O

7 PMO-KEY FUNCTION * 1 X

8 PMO-KEY START * 1 X

9 PMO-OPE COVER JC72-00665L 1 O SF-530

PMO-OPE COVER TBD 1 O SF-531P

10 PMO-KEY TEL JC72-00667A 1 O

11 PMO-KEY SAVE JC72-00668A 1 O

12 PCT-LCD WINDOW JC72-00672A 1 O

13 PMO-KEY FOWARD JC72-00886A 1 O

14 PMO-KEY MODE(B) JC72-41320A 1 O

15 RMO-TEL JC73-00072A 1 O

16 RMO-ONE TOUCH JC73-00073A 1 O

17 PBA MAIN-OPE JC81-00456A 1 O

OPE Unit Parts List

5-7 OPE Unit

Exploded Views and Parts List

5-15

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-SCAN UPPER JC81-00457A 1 O

1 MEC-PINCH JG75-10015A 1 O

2 RPR-SPONGE ADF * 1 X

3 MPR-TAPE ADF * 1 X

4 CBF HARNESS-SCAN GND JC39-00101A 1 O

5 SPRING-SENSOR * 1 X

6 SPRING-COIL ADF JC61-00040A 1 O

7 PMO-SCAN UPPER JC72-00671A 1 O

8 PMO-LEVER SENSOR DOC JC72-00823A 1 O

9 PMO-LEVER SENSOR JC72-41322A 1 O

10 ICT-SHAFT PINCH JF70-40521B 1 O

11 PMO-HOLDER RUBBER JG72-40044A 1 O

12 PMO-ROLL PINCH JG72-40663A 2 O

13 PMO-SUPPORT ADF JG72-41083A 1 O

14 RPR-RUBBER ADF JC73-00032A 1 O

15 MEC-BRUSH ANTISTATIC JG75-10004A 1 O

Scan Upper Assembly Parts List

5-8 Scan Upper Assembly

Exploded Views and Parts List

Samsung Electronics5-16

5-9 Front Assembly

1-4

1-2

1-5

1-3

1-1

Bushing White

319

32 32

Exploded Views and Parts List

5-17

Samsung Electronics

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-FRONT ASS’Y JC81-00458A 1 O

1 MEA ETC-GUIDE PAPER * 1 X

1-1 PMO-GUIDE PAPER * 1 X

1-2 PMO-GUIDE DOC L * 1 X

1-3 PMO-GUIDE DOC R * 1 X

1-4 GEAR-PINION JG66-40003A 1 O

1-5 IPR-WASHER SPRING CU JF70-10616A 1 O

2 CONTACT IMAGE SENSOR 0609-001127 1 O SF-530

CONTACT IMAGE SENSOR 0609-001125 1 O SF-531P

3 MOTOR STEP-SCAN JC31-00011A 1 O

4 MEC-ROLLER WHITE JC75-00126A 1 O

5 CBF HARNESS-SCAN/CIS(200) JC39-00049A 1 O SF-530

CBF HARNESS-SCAN/CIS(300) JC39-00136A 1 O SF-531P

6 CBF HARNESS-MAIN/SCAN JC39-00192A 1 O

7 CBF HARNESS-SCAN GND JC39-00101A 1 O

8 SPRING-LOCKER R JC61-00027A 1 O

9 SPRING-LOCKER L JC61-00028A 1 O

10 GEAR- 39/20 JC66-00304A 1 O

11 GEAR- IDLE 30 JC66-00305A 1 O

13 IPR-BRKT MOTOR * 1 X

14 NPR-GROUND CIS * 1 X

15 PMO-OPEN LOCKER L * 1 X

16 PMO-OPEN LOCKER R * 1 X

17 PMO-BRKT SCAN B’D JC72-00222A 1 O

18 PMO-OPEN BUTTON JC72-00273A 2 O

19 PMO-COVER MOTOR JC72-00670A 1 O

20 PMO-COVER FRONT JC72-00673A 1 O

21 PMO-DUMMY CIS L SF-530 JC72-00880A 1 O SF-530

PMO-DUMMY CIS L JC72-00495A 1 O SF-531P

22 PMO-DUMMY CIS R SF-530 JC72-00881A 1 O SF-530

PMO-DUMMY CIS R JC72-00496A 1 O SF-531P

23 PMO-STOPPER EXIT * 1 X

24 MEC-ROLLER DRIVE JC75-00123A 1 O

25 MEA ETC-ROLLER ADF * 1 X

26 SPECIAL SCREW JG60-10001A 2 O

27 LOCKER-TX JG64-30001A 2 O

28 GEAR-IDLE25 JG66-40036A 3 O

29 PMO-SHAFT EXIT JG72-40042A 1 O

30 PMO-GEAR TRANS(B4) JG72-40741A 2 O

31 PMO-BUSHING TX(B4) JG72-40744A 9 O

32 RING-C 6044-000159 3 O

33 SPRING CIS JG61-70533A 2 O

S1 SCREW-MACHINE 6001-000131 2 O

S3 SCREW-TAPPING 6002-000175 2 O

S4 SCREW-TAPPING 6002-001078 1 O

S7 SCREW-TAPTITE 6003-000196 2 O

S11 SCREW-TAPTITE 6003-000119 2 O

S11 SCREW-TAPTITE 6003-000119 6 O

Front Assembly Parts List

Exploded Views and Parts List

Samsung Electronics5-18

O : Service available X: Service not available

No. Description SEC.Code Q’ty SA Remark

0 ELA HOU-RX DRIVE JC96-01755A 1 O

1 MOTOR-STEP JC31-00005A 1 O

2 PMO-GEAR_71/28 * 1 X

3 PMO-GEAR_73/22 * 1 X

4 PMO-GEAR_132/19 * 1 X

5 IPR-BRKT_MOTOR * 1 X

6 IPR-BRKT_GEAR JC70-00129A 1 O

7 CBF-HARNESS_MOTOR JC39-00110A 1 O

S-7 SCREW-MACHINE 6001-000131 5 O YELLOW

5-10 RX Drive Unit Assembly

RX Drive Assembly Parts List

S-7 S-7

S-7

6-1

Samsung Electronics

6. Block Diagram

MA I N

POWER

CORD

KS32C65100

ARM7 T

GEU

P1284

ITU

I/O I/F

CACHE( 6 K)

DMAC

PVC

UART* 2

ME MO R Y I / F

MODEM

DRAM

(8MB)

CI S I NTERFACE

PART

HOST

CI S

CENTRONI CS

USB

TX MOTOR

DRI VER

MOTOR

RT C

Bac k - u p Par t

LI U

MO DE M &

EXT_ PHONE

SEPER ATI NG

PA RT

600/ / 600

Tx : Rx

TRANSFORMER

EXTER NAL

PHONE

DET ECT I ON

PAR T

EXTERNAL

PHONE

LI NE

HAND SET

600/ / 600

Tx : Rx

TRANSFORMER

FLASH

MEMORY

(2MB)

+5V

UART

-5V

SCAN B o a r d

MI COM

- L CD Dr i v e

- Key Scan

OPE

LCD

DOC

SE N SO R

SM P S

HVPS

+24V

MOTOR

OLEN OIDE

ENGINE

B’D

FAN

OPC_FUSE

Audi o Par t

EX IT

SEN SOR

MHV

OPC GND

SUPPLY

DEV

THV

UNI CON

(USB IC)

Note. -. SF-530 : Fax Functio n Only

-. SF-531P : Printer Function with Fax

*Note

33600 bps

Repair Manual

1. Block Diagram

2. Connection Diagram

3. Circuit Description

4. Schematic Diagrams

CONTENTS

SAMSUNG FACSIMILE

SF-530/531P

Samsung Electronics Digital Printing

CS Group

This manual is made and

described centering around

circuit diagram

and circuit description needed

in the repair center

in the form of appendix.

SAMSUNG

1-1

Samsung Electronics

BLOCK DIAGRAM

Repair Manual

1. Block Diagram

MAI N

POWER

CORD

KS32C65100

ARM7T

GEU

P1284

ITU

I/OI/F

CACHE( 6K)

DMAC

PVC

UART* 2

MEMORY I / F

MODEM

DRAM

(8MB)

CI S I NTERFACE

PART

HOST

CI S

CENTRONI CS

USB

TX MOTOR

DRI VER

MOTOR

RTC

Back- up Par t

LI U

MO DEM &

EXT_PHONE

SEPERATI NG

PART

600/ / 600

Tx: Rx

TRANSFORMER

EXTERNAL

PHONE

DETECTI ON

PART EXTERNAL

PHONE

LI NE

HANDSET

600/ / 600

Tx: Rx

TRANSFORMER

FLASH

MEMORY

(2MB)

+5V

UART

-5V

SCAN Boar d

MI COM

- LCD Dr ive

- Key Scan

OPE

LCD

DOC

SEN SOR

SMPS

HVPS

+24V

MOTOR

OLENOIDE

ENGINE

B'D

FAN

OPC_FUSE

Audi o Part

EXIT

SEN SOR

MHV

OPC GND

SUPPLY

DEV

THV

UNI CON

(USB IC)

Note. -. SF-530 : Fax Function Only

-. SF-531P : Printer Function with Fax

*Note

33600 bps

2-1

Samsung Electronics

CONNECTION DIAGRAM

Repair Manual

2. Connection Diagram

5GND5

4+5V

3OPE_TXD

2OPE_RST

1OPERXD

LCD

CN1

OP E

CN 3

SCAN B’ D

18+24V

17+24V

16SCNM

OTA

15+5V

14SCNM

OT*B

13SCNM

OT*A

12SCNM

OTB

11G

10O

PERXD

9GND5

8OP

TXD

7OPERST

6GND5

5+5V

4CISSIG

3CISLCD

2CISSI

1CISCLK

CN1

214365871091211141316151817

CN1 6

1 2 34 5 678 91011 121314 15161718

HOST

(PC)

IEEE1284 I/F

(36PIN)

USB PORT

(4PIN)

CN2

CN19

1+5V

2/PEMPTY

3/FEED

4GND5

SENSOR

B’ D

COVER

SWIT CH 1+24V

2+24VS

HVPS

CN1 1+24VS1

2GND24

3THVPWM

4/THV_EA

5THVREAD

6MHVPWM

7BIASPWM

8+5V

9GND

CN8 - 1

THER- MI STOR 1THERM_A

2THERM_B CN7

CN1 8

CN15- 1

CN1 3 - 1

CN7

CN9

ENG INE

B’ d

LSU

LD DIODE

POLY GO N

MOT OR

1+24VS

2GND24

3PMOTOR

4/LREADY

5EXTCLK

6/USYNC

7+5V

8CND5

9/LD_ON

10 VD0

11 /APC_SH

12 SLUTCH

13 FAN

14 PTL

15 DEV_FUSE

16 /NEW_DEVE

17 /EGMOT_A0

18 /EGMOT_ A1

19 EGMOT_PHA

20 /EGMOT_B0

21 /EGMOT_B1

22 GND5

23 +5V

24 EGMOT_PHA

25 +24VS

26 +24VS

27 GND24

28 GND24

CN1 2 SPK

1SPKOUT

2AGND

14M

DEMTXA1

13M

DEMTXA2

12AGND

11NC

10M

DEMRX

9/EXTP

HONE

8CML1

7REMOTE

6CM

5/DP

4/HOOK1

3+5V

2GND5

1/RING

CN1 4

1+24VS

2FUSER_ON

3+5V

4/EXIT

5+5V

6GND5

7+5V

8GND5

9-5V

10 GND5

11 24V

12 GND24

13 24V

14 GND24

15 24V

16 GND24

CN5 0 3

SMPS

Heat Lamp

(Fuser)

HOT

Neutral

CLINE

MAIN B’d

1GND5

2+5V

3V0

4LCD_RS

5LCD_RW

6LCD_F

7LED_0

8LED_1

9LED_2

10 LED_3

11 LED_4

12 LED_5

13 LED_6

14 LED_7

HOOK B’d CN2 CN1

CN3 MJ 1

1LINE_2

2LINE_3

3LINR_4

4LINR_5

5LINR_6

6EXT_3

7EXT_4

8EXT_5

1MIC1

2 RCV3

3MIC2

4 RCV1

5 HOOK2

6 HOOK2 _NC

7 HOOK2 _NO

10 HOOK1

11 HOOK1_NO

12 HOOK1_NC

LIU B’d

MJ 1

1 CIS_SIG

2 GND

3 +5V

4 GND

5 GND

6 START PULSE

7 GND

8 CIS MAIN CLOCK

9 LED B

10 LED G

11 LED R

12 V LED

1 CIS_SIG

2 GND

3 +5V

4 CIS_SI

5 CIS_CLK

6 CIS_LED

7 +24V

200 DPI 300 DPI

1 +24

2 +24

3 SCNMOT_A

4 SCNMOT_*A

5 SCNMOT_B

6 SCNMOT_*B

SCAN

MOTOR

CN 2 C N4

CIS

3-1

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

3. Circuit Description

3-1 Main PBA

3-1-1 Summary

The main circuit that consists of CPU, MFP controller including various I/O device drivers, system memory, scanner, print-

er, motor driver, PC I/F, and FAX transceiver controls the whole system. The entire structure of the main circuit is as follows:

I/O Ports

Controller

Scan Image &

Scan Motor

Controller

Ink Head

Controller

DMA

Controller

Parallel

Port

Interface

Video Data

Controller

UART/

Serial I/O

LSU

Control

PWM &

Gen. Timer

System Bus Controller Bus Arbitration

Bus Interface

ROM/SRAM/DRAM Controller

System Manager

Bus Router

PLL & Clock

Save

Interrupt

Controller

A/D

Converter

Derasterizer

Carrier Motor

Control

Position &

Fire Control

Paper Motor

Control

Real Time

Clock

Watch Dog

Timer

CPU

(ARM7TDMI)

I/D Cache

(2-KB)

LBUS

ADDR

DATA

CNTR

3-2

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

3-1-2 Circuit Operation

• CLOCK

1) System Clock

Device Oscillator

Frequency 9.500132 MHz

KS32C65100 RISC PROCESSOR: drives PLL internally and uses 37.17 MHz.

2) Video Clock

Device Oscillator

Frequency 28.7448 MHz

3) USB Clock

Device Oscillator

Frequency 48 MHz±%

3-3

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

• KS32C65100 MICROPROCESSOR

1) KS32C65100 MICROPROCESSOR PIN & INTERFACE

Signal Pin No. I/O Type Description

OSCI 184 I7 KS32C65100 master clock input.

OSCO 185 O7 KS32C65100 master clock output.

PLL_FILTER 183 I5 PLL filter

nRESET 182 I4

Not reset. nRESET is the global reset input for the

KS32C65100. For a system reset, nRESET must be held to

low level for at least 65 machine cycles.

nSLCTIN/GIP[16] 152 I1 Not select information. This input signal is used by parallel

port interface to request 'on-line' status information.

nSTROBE 151 I1 Not strobe. The nSTROBE input indicates when valid data is

on parallel port data bus, PPD[7:0]

nAUTOFD/GIP[17] 154 I1

Not auto feed. The nAUTOFD input indicates whether data

on the parallel port data bus, PPD[7:0], is an auto feed

command. Otherwise, the bus signals are interpreted as data

only.

nINIT/GIP[15] 153 I1 Not initialization. The nINIT input signal initializes the parallel

port's input control.

nACK 159 I1

Not parallel port acknowledge. The nACK output signal is

issued whenever a transfer on the parallel port data bus is

completed.

BUSY 158 O1 Parallel port busy. The BUSY output signal indicates that the

KS32C65100 parallel port is currently busy.

SELECT 156 O1

Parallel port select. The SELECT output signal indicates

whether the device connected to the KS32C65100 parallel

port is 'on-line' or 'off-line'.

PERROR 157 O1

Parallel port paper error. PERROR output indicates that a

problem exists with the paper in the ink-jet printer. It could

indicate that the printer has a paper jam or that the printer

isoutofpaper.

nFAULT 155 O1

Not fault. The nFAULT output indicates that an error

condition exists with the printer. This signal can be used to

indicate that the printer is out of ink or to inform the user

that the printer is not turned on.

PPD[7:0] 142~149 I/O2

arallel port data bus. This 8-bit, tri-state bus is used to

exchange data between the KS32C65100 and an external

host(peripheral).

SAVRT 2 I6 Top reference voltage for IP ADC

SAIN 3 I6 Analog input for IP ADC

SAVRB 4 I6 Bottom reference voltage for IP ADC

3-4

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

Signal Pin No. I/O Type Description

CIS_CLK 6 O1 CIS shift clock

CIS_SI 7 O1 CIS latch signal

PHA_IA0 164 O1 Line feed motor phase signal A

PHA_IA1 165 O1 Line feed motor phase signal AZ

PHB_IB0 167 O1 Line feed motor phase signal B

PHB_IB1 168 O1 Line feed motor phase signal BZ

LF_PH0/GOPA[21] 163 O1 Line feed motor control signal 0

LF_PH1/GOPA[22] 166 O1 Line feed motor control signal 1

CR_PHA/GOPA[23] 110 O1 Direction control line for phase A

CR_PHB/GOPA[24] 113 O1 Direction control line for phase B

CRIA0/GOPA[25] 109 O1 Current control line 0 for phase A

CRIA1/GOPA[26] 111 O1 Current control line 1 for phase A

CRIB0/GOPA[27] 112 O1 Current control line 0 for phase B

CRIB1/GOPA[28] 114 O1 Current control line 1 for phase B

CHX/GIP[8] 116 I3 Encode sensor

CHY/GIP[9] 117 I3 Encode sensor

ADDR[21:0]

77~80,

82~88,

90~100 O5

Address bus. The 22bit address bus, ADDR[21:0], covers

the full 4M half-words address range of each ROM/SRAM,

DRAM, and external I/O bank

DATA[15:0] 59~66,

68~75 I/O3 External bi-directional 16-bit data bus.

nRAS[1:0] 52,53 O1

Not row address strobe for DRAM. The KS32C65100

supports up to two DRAM banks. One nRAS output is

provided for each bank.

nCAS[1:0] 54,55 O1

Not column address strobe for DRAM. The two nCAS

outputs indicate the byte selections whenever a DRAM bank

is accessed.

nOE 56 O1

Not output enable. Whenever a memory access occurs, the

nOE output controls the output enable port of the specific

memory device.

nWE 57 O6

Not write enable. Whenever a memory access occurs, the

nWE output controls the write enable port of the specific

memory device.

nPHGA[13:1]/

GOPB[12:0]

16~24,

26~29 O1 Gate control line for print head.

PHOE[16:1]/

GIOP[26:11]

31~38,

40~47 I/O1 Drain control line for print head.

3-5

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

Signal Pin No. I/O Type Description

RXD0/GIP[0] 194 I1 Receive data input for the UART0. RXD0 is the UART0

channel's input signal for receiving serial data.

RXD1/GIP[1] 192 I1 Receive data input for the UART1. RXD1 is the UART1

channel's input signal for receiving serial data.

RXD2/GIP[2] 190 I1 Receive data input for the UART2. RXD2 is the UART2

channel's input signal for receiving serial data.

nEINT0/GIP[3] 8I3 External interrupt request input nEINT0.

nEINT1/GIP[4] 9I3 External interrupt request input nEINT1.

nEINT2/GIP[5] 10 I3 External interrupt request input nEINT2.

nXDREQ/GIP[6] 199 I3 External DMA request.

TXD0/GOPA[0] 193 O1 Transmit data output for the UART0. TXD0 is the UART0

channel's output for transmitting serial data.

TXD1/GOPA[1] 191 O1 Transmit data output for the UART1. TXD1 is the UART1

channel's output for transmitting serial data.

TXD2/GOPA[2] 189 O1 Transmit data output for the UART2. TXD2 is the UART2

channel's output for transmitting serial data.

nXDACK/GOPA[5] 200 O1 External DMA acknowledge. This active low output signal is

generated whenever a DMA transfer is completed.

TONEOUT/GOPA[3] 188 O1 Tone generator output.

nWDTO/GOPA[4] 187 P3 Reset out by watch dog timer.

nIOWR/GOPA[10] 161 O1 External output write strobe

nIORD/GOPA[9] 162 O1 External output read strobe

CLKOUT/GOPA[6] 180 O1 Clock for external chip

nECS2/GOPA[8] 14 O1 External memory chip select 2.

TCK 132 I2 JTAG TCK interface in MDS mode.

TMS 135 I2 JTAGTMSinterfaceinMDSmode.

TDI 133 I2 JTAG TDI interface in MDS mode.

nTRST 136 I2 JTAG nTRST interface in MDS mode.

TDO 134 O1 JTAG TDO interface in MDS mode.

GIOP[10:0] 137~140,

173~179 I/O4 General I/O port.

TEST0 169 I2 Test 0 pin. At normal operation this pin must be connected

to GND.

TEST1 170 I2 Test 1 pin. At normal operation this pin must be connected

to GND.

TEST2 171 I2 Test 2 pin. At normal operation this pin must be connected

to GND.

3-6

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

Signal Pin No. I/O Type Description

nECS[1:0] 12,13 O1

Not external chip select. Three I/O banks are provided for

external memory-mapped I/O operations. Each I/O bank

contains up to 4M half-word. The nECS signals indicate that

an external I/O bank is selected.

nRCS[2] 51 O2 Not ROM/SRAM chip select. The KS32C65100 can access

up to three external ROM/SRAM banks. nRCS[0]

corresponds to ROM/SRAM bank 0, nRCS[1] to bank 1, and

nRCS[2] to bank 2. By controlling the nRCS signals, CPU

addresses can be mapped into the physical memory banks.

nRCS[1]/GOPA[7] 50 O1

nRCS[0] 49 O1

SC_CONPHA/

GOPA[19] 102 O1 Scan motor control/Bi-phase

SC_CONPHB/

GOPA[20] 105 O1 Scan motor control/Bi-phase

SC_CUR[3:0] 103, 104,

106, 107 O1 Scan motor bi-current/uni-phase

PWMO[2:0]/

GOPA[13:11] 118~120 O1 PWM out signal

VDO2/GOPA[29] 121 O4 Video out from PIFC

VDO1/GOPA[14] 122 O5 Video out from LSU control

LSU_CLK/

GOPA[15] 123 O1 Clock for LSU motor

nHSYNC1/GIP[10] 125 I1 HSYNC1

nLREADY/GIP[11] 126 I1 LSU ready

nHSYNC2/GIP[12] 127 I1 HSYNC2

VDI/GIP[13] 128 I2 Video data input from RET

VCLK/GIP[14] 129 I2 External video clock

nEXTWAIT/GIP[7] 130 I3 External wait

RTCXIN 202 I7 RTC oscillator clock input.

RTCXOUT 203 O7 RTC oscillator clock output.

SLED[2:0]/

GOPA[18:16] 196~198 O1 CIS LED signals

GAVRT 205 I5 Top reference voltage for general ADC

GAIN[2:0] 206~208 I5 Analog inputs for general ADC

RTC_VDD 201 RTC VDD.

Signal Pin No. I/O Type Description

VDD_PLL 186 PLL power (3.3V).

SAVDD 1Analog power for scan ADC and general ADC (3.3V).

SAVSS 5Scan ADC ground.

GAVSS 204 General ADC ground

3VDD

15, 30, 81,

115, 131,

160

3.3V internal power.

Externally connected to the 3.3V regulator.

5VDD 48, 67, 89,

141, 195

5V I/O power.

Externally connected to the VCC board plane.

VSS

11, 25, 39,

58, 76, 101,

108, 124,

150, 172,

181

System ground.

Externally connected to the ground board plane.

3-7

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

3-1-3 PROGRAM ROM (FLASH MEMORY)

1) DEVICE

TYPE No. AM29F800B

CAPACITY 2 Mbit (512K * 16bit * 2)

2) PROGRAMMING

BEFORE ASS’Y EPROM PROGRAMMER or PROGRAMMING at the factory

AFTER ASS’Y DOWNLOAD from PC

3-1-4 DRAM CONTROL

1) DEVICE

TYPE NO. K4E641611D-TC50(EDO Type)

CAPACITY 64 Mbit (4M * 16bit)

2) OPERATING PRINCIPLE

DRAM can either read or write. The data can be stored in the DRAM only when the power is on. It stores data white the

CPU processes data. The address to read and write the data is specified by RAS SIGNAL and CAS SIGNAL.

DRAMWE*SIGNAL is activated when writing data and DRAMOE*SIGNAL, when reading.

3-1-5 USB (Universal Serial Bus)

SAMSUNG’S UNICON is used as the interface IC and 48MHz clock is used.

When the data is received through the USB port, USBIRQ SIGNAL is activated to send interrupt to CPU, then it directly

sends the data to DRAM by USB_CS SIGNAL through D(0;7).

3-1-6 Modem and TX-and RX Related Circuits

MODEM

The Conexant™ FM336 modem is a V.34 half-duplex modem that supports Group 3 facsimile send and receive speeds

up to 33600 bps using the V.34 half-duplex mode. Using a V.34 technique to optimize modem configuration for line condi-

tions, the modem connects at the optimal selected data rate that the channel can support from 33600 bps to 2400 bps.

The modem can operate over the public switched telephone network (PSTN) through a line terminator provided by a Data

Access rrangement (DAA). The modem satisfies the requirements specified inITU-T recommendations V.34, V.17, V.29,

V.27 ter, V.23, V.21, and meets the binary signal ingrequirements of V.8 and T.30. Internal HDLC support eliminates the

need for an external serial input/output (SIO) device in the DTE for products incorporating error detection and T.30 proto-

col. The modem can perform HDLC framing per T.30 at all data speeds. CRC generation/checking along with zero inser-

tion/deletion enhances DLC/HDLC frame operations. An FSK flag pattern detector facilitates FSK detection during high

speed reception.The modem features a programmable DTMF transmitter/receiver and three programmable tone detectors

which operate in the tone mode.

The modem offers lower power consumption and small size to allow the design of compact system enclosures for use in

industrial, office, and home environments.The modem is available in a 100-pin PQFP package.

3-8

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

FM336 FEATURES

• 2-wire half

- duplex fax modem modes with send and receive data rates up to 33600 bps.

- V.34, V.17, V.29, V.27 ter, and V.21 channel 2

- Short train option in V.17 and V.27 ter

• 2-wire full

- duplex data modem modes

- V.21, V.23 (75 bps TX/1200 bps RX or 1200 bps TX/ 75 bps RX)

• PSTN session starting

- V.8 signaling

• HDLC support at all speeds

- Flag generation, 0 bit stuffing, ITU CRC

- 16 or CRC

- 32 calculation and generation

- Flag detection, 0 bit deletion, ITU CRC

- 16 or CRC

- 32 check sum error detection

FSK flag pattern detection during high speed receiving

• Tone modes and features

- Programmable single or dual tone generation

- DTMF receive

- Tone detection with three programmable tone detectors

• Serial synchronous data

• Parallel synchronous data

• Automatic Rate Adaptation (ARA) in V.34 Half-Duplex

• TTL and CMOS compatible DTE interface

- ITU-T V.24 (EIA/TIA-232-E) (data/control)

- Microprocessor bus (data/configuration/control)

• Receive dynamic range: 0 dBm to –43 dBm for V.17, V.33, V.29, V.27terand V.21, –9 dBm to –43 dBm for V.34 half-duplex

• Programmable RLSD turn-on and turn-off thresholds

• Programmable transmit level: 0 to -15 dBm

• Adjustable speaker output to monitor received signal

• DMA support interrupt lines

• Two 16-byte FIFO data buffers for burst data transfer with extension up to 255 bytes

• NRZI encoding/decoding

• Diagnostic capability

• +3.3V operation with +5V tolerant inputs

• +5V analog signal interface

• Typical power consumption:- Sleep mode: 20 mW

- Normal mode: 250 mWa

• 100-pin PQFP package

3-9

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

Signaling Rates, and Data Rates

Configuration Modulation1Carrier Frequency

(Hz) –0.01%

Data Rate (bps)

–0.01%

Symbol Rate

(Symbols/Sec.)

Bits/Symbol -

Data

Bits/Symbol -

TCM

Constellation

Points

V.34 33600 TCM TCM Note 2 33600 3429 only Note 2 Note 2 Note 2

V.34 31200 TCM TCM Note 2 31200 3200 min Note 2 Note 2 Note 2

V.34 28800 TCM TCM Note 2 28800 3000 min Note 2 Note 2 Note 2

V.34 26400 TCM TCM Note 2 26400 2800 min Note 2 Note 2 Note 2

V.34 24000 TCM TCM Note 2 24000 2800 min Note 2 Note 2 Note 2

V.34 21600 TCM TCM Note 2 21600 2400 min Note 2 Note 2 Note 2

V.34 19200 TCM TCM Note 2 19200 2400 to 3429 Note 2 Note 2 Note 2

V.34 16800 TCM TCM Note 2 16800 2400 to 3429 Note 2 Note 2 Note 2

V.34 14400 TCM TCM Note 2 14400 2400 to 3429 Note 2 Note 2 Note 2

V.34 12000 TCM TCM Note 2 12000 2400 to 3429 Note 2 Note 2 Note 2

V.34 9600 TCM TCM Note 2 9600 2400 to 3429 Note 2 Note 2 Note 2

V.34 7200 TCM TCM Note 2 7200 2400 to 3429 Note 2 Note 2 Note 2

V.34 4800 TCM TCM Note 2 4800 2400 to 3429 Note 2 Note 2 Note 2

V.34 2400 TCM TCM Note 2 2400 2400 only Note 2 Note 2 Note 2

V.23 1200/75 FSK 1700/420 1200/75 1200 1 0 —

V.21 FSK 1080/1750 Up to300 300 1 0 —

V.17 14400 TCM TCM 1800 14400 2400 6 1 128

V.17 12000 TCM TCM 1800 12000 2400 5 1 64

V.17 9600 TCM TCM 1800 9600 2400 4 1 32

V.17 7200 TCM TCM 1800 7200 2400 3 1 16

V.29 9600 QAM 1700 9600 2400 4 0 16

V.29 7200 QAM 1700 7200 2400 3 0 8

V.29 4800 QAM 1700 4800 2400 2 0 4

V.27 ter 4800 DPSK 1800 4800 1600 3 0 8

V.27 ter 2400 DPSK 1800 2400 1200 2 0 4

V.21 Channel 2 FSK 1750 300 300 1 0 —

Notes:

1. Modulation legend: TCM:Trellis-Coded Modulation QAM: Quadrature Amplitude Modulation

FSK:Frequency Shift Keying DPSK: Differential Phase Shift Keying

2. Adaptive; established during handshake:

Carrier Frequency (Hz)

Symbol Rate (Baud) V.34 Low Carrier V.34 High Carrier

2400 1600 1800

2800 1680 1867

3000 1800 2000

3200 1829 1920

3429 1959 1959

3-10

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

V.24

Interface

Host

Processor

FM336

Modem

Crystal

Power Supply

Speaker

Amplifier

Optional

Eye Pattern

Generator

Line

Interface

/RTS

TXD

/CTS

TDCLK

XTCLK

/RLSD

RXD

/RDCLK

/DTR

/RI*

/DSR**

/RD

/CS

/WR

D[7:0]

RS[4:0]

IRQ

/RESET

TXRQ*

RXRQ**

XTL0

XTLI

TXA1

RIN

TXA2

/TALK

RINGD

EYEXY

EYESYNC

EYECLK

+5V

AGND

DGND

SPKR

* Selectable; TXRQ output replaces /RI output.

** Selectable; RXRQ output replaces /DSR output.

1176DG F2-1

TIP

RING

telephone

line

+3.3V

Oscillator

CLKIN

Modem Functions Interface Signals

3-11

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

Pin Signal Label I/O Type 1Interface3Pin Signal Label I/O Type1Interface 3

1 RESERVED - - 51 RESERVED - -

2 RS2 IA HOST Interface 52 VSUB GND -

3 RS3 IA HOST Interface 53 VSS GND -

4 RS4 IA HOST Interface 54 NC - NC

5 /CS IA HOST Interface 55 NC - NC

6 /WR IA HOST Interface 56 Sleep MI Modem Interconnect

7 /RD IA HOST Interface 57 VDD1 PWR -

8 /RDCLK OA DTE Serial Interface 58 RESERVED - -

9 /RLSD OA DTE Serial Interface 59 RESERVED - -

10 TDCLK OA DTE Serial Interface 60 NC - NC

11 TXD IA DTE Serial Interface 61 SR1IO MI Modem Interconnect

12 /CTS OA DTE Serial Interface 62 VCORE PWR -

13 VDD1 PWR - 63 VDD1 PWR -

14 RESERVED - - 64 XTCLK IA DTE Serial Interface

15 RESERVED - - 65 VSS GND -

16 VSS GND - 66 RESERVED - -

17 NC - NC 67 RXD OA DTE Serial Interface

18 /RESET OA Modem Interconnect 68 /DTR IA DTE Serial Interface

19 SR4OUT OA Modem Interconnect 69 VDD1 PWR -

20 NC - NC 70 IA_SLEEP MI Modem Interconnect

21 SR4IN IA Modem Interconnect 71 VGG PWR -

22 CLK_OUT OA Modem Interconnect 72 YCLK OA Overhead Signal

23 EYESYNC OA Diagnostic Signal 73 XCLK OA Overhead Signal

24 EYECLK OA Diagnostic Signal 74 EYEXY OA Diagnostic Signal

25 MAVSS GND - 75 /DSR OA DTE Serial Interface

26 MAVDD PWR - 76 /RI OA Telephone Line Interface

27 SPKR O(DF) Telephone Line Interface 77 RINGD IA Telephone Line Interface

28 TXA2 O(DD) Telephone Line Interface 78 /RTS IA DTE Serial Interface

29 TXA1 O(DD) Telephone Line Interface 79 IRQ OA HOST Interface

30 VREF MI Modem Interconnect 80 VSS GND -

31 VC MI Modem Interconnect 81 GPO0 MI Modem Interconnect

32 RIN I(DA) Telephone Line Interface 82 RESERVED - -

33 MAVSS AGND - 83 RESERVED - -

34 /POR IA Modem Interconnect 84 VDD1 PWR -

35 RESERVED - - 85 XTALI/CLKIN I Overhead Signal

36 RESERVED - - 86 XTALO O Overhead Signal

37 /TALK O(DD) Telephone Line Interface 87 D0 IA/OB HOST Interface

38 VDD PWR - 88 D1 IA/OB HOST Interface

39 RESERVED - - 89 D2 IA/OB HOST Interface

40 RESERVED - - 90 D3 IA/OB HOST Interface

41 NC - NC 91 D4 IA/OB HOST Interface

42 M_CNTRL_SIN IA Modem Interconnect 92 VDD1 PWR -

43 M_CLKIN IA Modem Interconnect 93 D5 IA/OB HOST Interface

44 M_TXSIN IA Modem Interconnect 94 D6 IA/OB HOST Interface

45 M_SCK IA Modem Interconnect 95 D7 IA/OB HOST Interface

46 M_RXOUT IA Modem Interconnect 96 RS0 IA/OB HOST Interface

47 M_STROBE IA Modem Interconnect 97 RS1 IA/OB HOST Interface

48 RESERVED - - 98 PLL_VDD PWR -

49 OH O(DD) Telephone Line Interface 99 VSS GND -

50 VDD PWR - 100 PLL_GND GND -

Notes:

1. I/O types:

MI = Modem interconnect.

IA, IB = Digital input.

OA, OB = Digital output.

I(DA) = Analog input.

O(DD), O(DF) = Analog output.

2. NC = No external connection required.

RESERVED = No external connection allowed.

3. Interface Legend:

HOST = Modem Control Unit (Host)

DTE = Data Terminal Equipment

FM336 Pin Signals

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CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

Label I/O Type Signal Name/Description

TELEPHONE LINE INTERFACE/AUXILIARY

TXA1, TXA2 O(DD) Transmit Analog 1 and 2. The TXA1 and TXA2 outputs are differential outputs 180 degrees out of phase

with each other. Each output can drive a 300 load.

RIN O(DA) Receive Analog. RIN is a single-ended receive data input from the telephone line interface or an optional

external hybrid circuit.

RINGD IA Ring Detect. The RINGD input is monitored for pulses in the range of 15 Hz to 68 Hz. The frequency

detection range may be changed by the host in DSP RAM. The circuit driving RINGD should be a 4N35

optoisolator or equivalent. The circuit driving RINGD should not respond to momentary bursts of ringing

less than 125 ms in duration, or less than 40 VRMS (15 Hz to 68 Hz) across TIP and RING. Detected ring

signals are reflected on the /RI output signal as well as the RI bit.

/TALK O(DD) Relay B Control. The /TALK open collector output can directly drive a +5V reed relay coil with a minimum

resistance of 360 ohms (13.9 mA max. @ 5.0V) and a must-operate voltage no greater than 4.0 VDC. A

clamp diode, such as a 1N4148, should be installed across the relay coil. An external transistor can be

used to drive heavier loads (electro-mechanical relays). /TALK is controlled by host setting/resetting of the

RB bit.

In a typical application, /TALK is connected to the normally closed Talk/Data relay (/TALK). In this case,

/TALK active opens the relay to disconnect the handset from the telephone line.

OH O(DD) Relay A Control. The OH open collector output can directly drive a +5V reed relay coil with a minimum

resistance of 360 ohms (13.9 mA max. @ 5.0V) and a must-operate voltage no greater than 4.0 VDC. A

clamp diode, such as a 1N4148, should be installed across the relay coil. An external transistor can be

used to drive heavier loads (electro-mechanical relays). OH is controlled by host setting/resetting of the RA

bit.

In a typical application, OH is connected to the normally open Off-Hook relay (OHRC). In this case, OH

active closes the relay to connect the modem to the telephone line.

Alternatively, in a typical application, OH is connected to the normally open Caller ID relay (CALLID). When

the modem detects a Calling Number Delivery (CND) message, the OH output is asserted to close the

CALLID relay in order to AC couple the CND information to the modem RIN input (without closing the off-

hook relay and allowing loop current flow which would indicate an off-hook condition).

/RI OA Ring Indicator. /RI output follows the ringing signal present on the line with a low level (0 V) during the ON

time, and a high level (+3.3 V) during the OFF time coincident with the ringing signal. The RI status bit

reflects the state of the /RI output.

DIAGNOSTIC SIGNALS

Three signals provide the timing and data necessary to create an oscilloscope quadrature eye pattern. The

eye pattern is a display of received baseband constellation. By observing this constellation, common line

disturbances can usually be identified.

EYEXY OA Serial Eye Pattern X/Y Output. EYEXY is a serial output containing two 11-bit diagnostic words (EYEX

and EYEY) for display on the oscilloscope X axis (EYEX) and Y axis (EYEY). EYEX is the first word clocked

out; EYEY follows. Each word has 8-bits of significance. EYEXY is clocked by the rising edge of EYECLK.

This serial digital data must be converted to parallel digital form by a serial-to-parallel converter, and then to

analog form by two digital-to-analog (D/A) converters.

EYECLK OA Serial Eye Pattern Clock. EYECLK is a 336 kHz output clock for use by the serial-to-parallel converters.

The low-to-high transitions of RDCLK coincide with the low-to-high transitions of EYECLK. EYECLK,

therefore, can be used as a receiver multiplexer clock.

EYESYNC OASerial Eye Pattern Strobe. EYESYNC is a strobe for loading the D/A converters.

SPEAKER INTERFACE

SPKR O(DF) Speaker Analog Output. The SPKR output reflects the received analog input signal. The SPKR on/off and

three levels of attenuation are controlled by bits in DSP RAM. When the speaker is turned off, the SPKR

output is clamped to the voltage at the VC pin. The SPKR output can drive an impedance as low as 300

ohms. In a typical application, the SPKR output is an input to an external LM386 audio power amplifier.

FM336 Signals Definitions

3-13

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CIRCUIT DESCRIPTION

Repair Manual

Label I/O Type Signal Name/Description

REFERENCE SIGNALS AND MODEM INTERCONNECT

VC MI Low Voltage Reference. Connect to analog ground through 10 F (polarized, + terminal to VC)

and 0.1 F (ceramic) in parallel.

VREF MI High Voltage Reference. Connect to VC through 10 F (polarized, + terminal to VREF) and 0.1 F

(ceramic) in parallel.

/POR IA Power-On-Reset. Connects to /RESET.

/RESET OA Reset. Connects to /POR.

CLK_OUT MI IA Clock. Connect to M_CLKIN.

SR4OUT OA SR4OUT. Connect to M_TXSIN.

SR4IN IA SR4IN. Connect to M_RXOUT.

SR1IO OA SR1IO. Connect to M_CNTRL_SIN.

M_CNTRL_SIN IA M_CNTRL_SIN. Connect to SR1IO.

M_CLKIN IA M_CLKIN. Connect to CLK_OUT.

M_TXSIN IA M_TXSIN. Connect to SR4OUT.

M_SCK IA M_SCK. Connect to EYECLK.

M_RXOUT IA M_RXOUT. Connect to SR4IN.

M_STROBE IA M_STROBE. Connect to EYESYNC.

SLEEP MI SLEEP. Connect to IA_SLEEP.

IA_SLEEP MI IA_SLEEP. Connect to SLEEP

GPO0 MI GPO0. Connect to /RDCLK.

DTE SERIAL INTERFACE

/RDCLK OA Receive Data Clock. The modem outputs a synchronous Receive Data Clock (/RDCLK) for USRT

timing. The /RDCLK frequency is the data rate (–0.01%) with a duty cycle of 50 –1%. The /RDCLK

low-to-high transitions coincide with the center of the received data bits.

/RLSD OA Received Line Signal Detector. For V.17, V.33, V.29, and V.27 ter; RLSD goes active at the end

of the training sequence. If energy is above the turn-on threshold and training is not detected, the

/RLSD off-to-on response time is 816 baud times for V.17/V.33, V.29, and V.27 ter long train; 492

baud times for V.17/V.33; and 486 baud times for V.27 ter short train. The /RLSD on-to-off time is

40 – 5 ms for V.17/V.33, 35 – 5 ms for V.29 or 11.6 – 5 ms for V.27 ter. The /RLSD on-to-off time

ensures that all valid data bits have appeared on RXD.

The /RLSD programmable threshold levels default to —43 dBm for off-to-on and to —48 dBm for on-

to-off. A minimum hysteresis of 2 dBm exists between the actual off-to-on and on-to-off transition

levels. The threshold level and hysteresis are measured with an unmodulated 2100 Hz tone applied

to the Receiver Analog (RXA) input.

Note: Performance may be degraded when the received signal level is less than —43 dBm.

TDCLK OA Data Clock. The modem outputs a synchronous Data Clock (DCLK) for USRT timing. The DCLK

frequency is the data rate (–0.01%) with a duty cycle of 50 –1%. The DCLK low-to-high transitions

coincide with the center of the data bits. Transmit Data (TXD) must be stable during the one

microsecond period immediately preceding the rising edge of DCLK and following the rising edge of

DCLK.

TXD IA Transmit Data. The modem obtains serial data to be transmitted from the local DTE on the

Transmit Data (TXD) input in serial data mode (TPDM bit = 0), or from the interface memory

Transmit Data Register (TBUFFER) in parallel data mode (TPDM bit = 1).

FM336 Signals Definitions (Cont’d)

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Repair Manual

Label I/O Type Signal Name/Description

/CTS OA Clear To Send. /CTS active indicates to the local DTE that the modem will transmit any data

present on TXD. /CTS response times from an active condition of /RTS are shown in Table 1-3.

XTCLK IA External Transmit Clock. In synchronous communication, an external transmit data clock can be

connected to the modem XTCLK input. The clock supplied at XTCLK must exhibit the same

characteristics as TDCLK. The XTCLK input is then reflected at the TDCLK output.

RXD OA Received Data. The modem presents received serial data to the local DTE on the Received Data

(RXD) output and to the interface memory Receive Data Register (DBUFFER) in parallel data

mode.

/DTR IA Data Terminal Ready. In V.8 and V.34 configuration, activating /DTR initiates the handshake

sequence. The DATA bit must be set to complete the handshake.

In V.21 or V.23 configuration, activating /DTR causes the modem to enter the data state provided

that the DATA bit is a 1. If in answer mode, the modem immediately sends answer tone. During the

data mode, deactivating /DTR causes the transmitter and receiver to turn off and return to the idle

state.

The /DTR input and the /DTR control bit are logically ORed.

/DSR OA Data Set Ready. DSR ON indicates that the modem is in the data transfer state. DSR OFF

indicates that the DTE is to disregard all signals appearing on the interchange circuits except Ring

Indicator (/RI). /DSR is OFF when the modem is in a test mode (local analog or remote digital

loopback). The /DSR status bit reflects the state of the /DSR output.

/RTS IA Request to Send. The active low /RTS input allows the modem to transmit data present at TXD in

the serial data mode (TPDM bit = 0), or in DBUFFER in the parallel data mode (TPDM bit = 1),

when /CTS becomes active.

The /RTS hardware control input is logically ORed with the /RTSP bit by the modem to form the

resultant control signal.

HOST INTERFACE

/CS IA Chip Select. The active low /CS input selects and enables the modem DSP for parallel data

transfer between the DSP and the host over the microprocessor bus.

/WR IA Write. Writing is controlled by the host pulsing /WR input low during the microprocessor bus access

cycle. The write timing is:

Parameter Symbol Min. Max. Units

CS Setup Time TCS 0 —ns

RSi Setup Time TRS 10 —ns

Control Hold Time THC 10 —ns

Write Data Setup Time TWDS 20 —ns

Write Data Hold Time TDHW 10 —ns

Note: A read or write operation following a write operation must be delayed by at least 4 XCLK

cycles.

/RD IA Read Enable. Reading is controlled by the host pulsing /RD input low during the microprocessor

bus access cycle. The read timing is:

Parameter Symbol Min. Max. Units

CS Setup Time TCS 0 —ns

RSi Setup Time TRS 10 —ns

Data Access Time TDA —45 ns

Data Hold Time TDHR 10 —ns

Control Hold Time THC 10 —ns

Notes:

1. /CS and /RD must not both be continuously active.

A read or write operation following a read operation must be delayed by at least 2 XCLK cycle.

FM336 Signals Definitions (Cont’d)

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CIRCUIT DESCRIPTION

Repair Manual

Label I/O Type Signal Name/Description

IRQ OA Interrupt Request. Interrupt request outputs may be connected to the host processor interrupt

request input in order to interrupt host program execution for immediate modem service. The IRQ

output can be enabled in DSP interface memory to indicate immediate change of conditions in the

modem. The use of IRQ is optional depending upon modem application.

The IRQ output structure is an open-drain field-effect-transistor (FET). The IRQ output can be wire-

ORed with other IRQ lines in the application system. Any of these sources can drive the host

interrupt input low, and the host interrupt servicing process normally continues until all interrupt

requests have been serviced (all IRQ lines have returned high).

Because of the open-drain structure of IRQ#, an external pull-up resistor to +3.3V is required at

some point on the IRQ line. The resistor value should be small enough to pull the IRQ line high

when all IRQ drivers are off (it must overcome the leakage currents). The resistor value should be

large enough to limit the driver sink current to a level acceptable to each driver. If only the modem

IRQ# output is used, a resistor value of 5.6K ohms, 20%, 0.25 W, is sufficient.

D0-D7 IA/OB Data Lines. Eight bi-directional data lines (D0—D7) provide parallel transfer of data between the

host and the modem. The most significant bit is D7. Data direction is controlled by the Read Enable

(READ#-¿2) and Write Enable (WRITE#-R/W#) signals.

During a read cycle, data from the DSP interface memory register is gated onto the data bus via

three-state drivers in the DSP. These drivers force the data lines high for a one bit, or low for a zero

bit. When not read, the three-state drivers assume their high-impedance (off) state.

During a write cycle, data from the data bus is copied into the selected DSP interface memory

RS0-RS4 IA/OB Register Select Lines. Five active high Register Select inputs (RS0—RS4) address interface

memory registers within the DSP when /CS is low. These lines are typically connected to address

lines A0-A4.

When selected by /CS low, the DSP decodes RS0 through RS4 to address one of 32 8-bit internal

interface memory registers (00-1F). The most significant address bit is RS4 while the least

significant address bit is RS0. The selected register can be read from, or written into, via the 8-bit

parallel data bus (D0—D7).

OVERHEAD SIGNALS

VDD1 PWR 3.3V Supply Voltage for DSP Digital Circuits.

VSS DGND Digital ground.

VGG PWR 5V Supply Voltage for DSP Digital Circuits.

MAVSS AGND Analog ground.

MAVDD PWR 5V Supply Voltage for IA Analog Circuits.

VDD PWR 5V Supply Voltage for IA Digital Circuits.

VSUB GND Connect to analog ground.

XCLK OA XCLK Output. Output clock at 63.5045 MHz, which runs during normal operational mode and

turned off during Sleep Mode.

YCLK OA YCLK. Output clock at 28.224 MHz, which runs during normal operational mode and turned off

during Sleep Mode..

Label I/O Type Signal Name/Description

XTALI/CLKIN I/O Crystal In/Clock In. Connect to an external 28.224 MHz crystal circuit or an external 28.224 MHz

oscillator circuit.

Label Crystal Oscillator

XTALI/CLKIN XTALI CLKIN

XTALO/NC I/O Crystal Out/NC. Connect to the external crystal circuit return or leave open.

Label Crystal Oscillator

XTALO/NC XTALO NC

PLL_VDD PWR PLL Supply Voltage.

PLL_GND DGND PLL Supply Voltage return.

VCORE PWR 3.3V Supply Voltage. Connect to VDD1.

RESERVED - Reserved pins are used for future development and should not be connected to any circuitry.

FM336 Signals Definitions (Cont’d)

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CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

3-1-7 Scanner Part

CIS DRIVER, INPUT PROCESSOR

CIS contacl signal is consist of BLED, RLED, GLED, CIS_CLK CIS_SI. CIS driver power supply is +5v, LED driver power

supply is +5v also. As CIS input signal, minc-Vref values O, MAXC+Vref Values is about 1.2V.

SPECIFICATION

PIN FUNCTION DESCRIPTION

No. Signature Name Description

1 SIG signal output Video output signal

2 GND Ground 0V DC ; reference point

3 VDD Supply voltage +5V DC supply (ref. to GND)

4 GND Ground 0V DC ; reference point

5 GND Ground 0V DC ; reference point

6 SI Start pulse Start pulse

7 GND Ground 0V DC ; reference point

8 CLK Clock CIS main clock

9 LEDB LED Ground (blue) LED POWER SUPPLY BLUE

10 LEDG LED Ground (green) LED POWER SUPPLY GREEN

11 LEDR LED Ground (red) LED POWER SUPPLY RED

12 VLED Supply voltage LED POWER SUPPLY

Readable width 216mm

Number of sensor elements 2552 dots(21~2572 dots available)

Resolution 75 ms/line

Scanning speed 7.5 ms/line

Light source Color LEDs

Red (640 mm)

Green(525mm)

Blue(470mm)

Data output 1 analogue

Outward dimension(WXHXL) 18.0 X 12.2 X 231.0 mm (attachment)

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CIRCUIT DESCRIPTION

Repair Manual

ELECTRICAL CHARACTERISTICS (TA=25˚C)

CIS Driver Clock Timing

Item SYMBOL MIN. TYP. MAX. UNIT NOTE

Power Supply VDD 4.75 5.0 5.25 V

VLED 4.75 5.0 5.25 V

Input Voltage VIH 3.2 V SI & CLK

VIL 0.8 V

Input Current IIH 20 µA. SI & CLK

IIH 0.2 mA.

LED Current ILEDr 30 mA. REF.

ILEDg 60 mA. REF.

ILEDb 60 mA. REF.

Clock Frequency. CLK 2 MHz

Clock Pulse “L” Duty 15 % tw/to

Setup Time tsu 0 tw/2 ns

Hold Time th tw/2 ns

SIG Delay Time tpd 1 250 ns

tpd 2 30 ns

Sampling Reriod ts 90 ns

CLK

SIG

tpd2

tpd1

tsu

2nd1st

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CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

ROD LENS ARRAY

SHIFT REGISER & ANALOG SWITCH

VLED

LEDR

LEDG

LEDB

VDD

GND

OP AMP

SENSOR

CLK

SIG

12021

2.5ms

1.2ms

7.5ms/line

OFF

B O/P R O/P G O/P B O/P R O/P G O/P

OFF

LED_R

LED_G

LED_B

SIG O/P

CIS Block Diagram

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Repair Manual

3-1-8 HOST INTERFACE:

Parallel Port Interface

PARALLEL PORT INTERFACE PART KS32C61100 has the Parallel Port Interface Part that enables Parallel Interface with

PC. This part is connected to PC through Centronics connector. It generates major control signals that are used to actu-

ate parallel communication. It is comprised of/ERROR, PE, BUSY, /ACK, SLCT, /INIT, /SLCTIN, /AUTOFD and /STB. This

part and the PC data transmission method support the method specified in IEEE P1283 Parallel Port Standard

(http://www.fapo.com/ieee1284.html). In other words, it supports both compatibility mode (basic print data transmitting

method), the nibble mode (4bit data; supports data uploading to PC) and ECP (enhanced capabilities port: 8bits data - high

speed two-way data transmission with PC). Compatibility mode is generally referred to as the Centronics mode and this is

the protocol used by most PC to transmit data to the printer. ECP mode is an improved protocol for the communication

between PC and peripherals such as printer and scanner, and it provides high speed two-way data communication. ECP

mode provides two cycles in the two-way data transmission; data cycle and command cycle. The command cycle has two

formats; Run-Length Count and Channel Addressing. RLE (Run-Length Count) has high compression rate (64x) and it

allows real-time data compression that it is useful for the printer and scanner that need to transmit large raster image that

has a series of same data. Channel Addressing was designed to address multiple devices with single structure. For exam-

ple, like this system, when the fax/printer/scanner have one structure, the parallel port can be used for other purposes while

the printer image is being processed.This system uses RLE for high speed data transmission. PC control signals and data

send/receive tasks such as PC data printing, high speed uploading of scanned data to PC, upload/download of the fax

data to send or receive and monitoring the system control signal and overall system from PC are all processed through

this part.

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CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

1. The host places data on the data lines and indicates a data cycle by setting nAUTOFD

2. Host asserts nSTROBE low to indicate valid data

3. Peripheral acknowledges host by setting BUSY high

4. Host sets nSTROBE high. This is the edge that should be used to clock the data into the Peripheral

5. Peripheral sets BUSY low to indicate that it is ready for the next byte

6. The cycle repeats, but this time it is a command cycle because nAUTOFD is low

PPD( 7: 0)

nSTROBE

BUSY

nACK

DATA

COMPATIBILITY HARDWARE HANDSHAKING TIMING

PPD( 7: 0)

nAUTOFD

nSTROBE

BUSY

BYTE0 BYTE1

COMMAND BYTE

DATA BYTE

12345 6

ECP HARDWARE HANDSHAKING TIMING (FORWARD)

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Repair Manual

PPD(7:0)

BUSY

nACK

nAUTOFD

BYTE0 BYTE1

COMMAND BYTE

DATA BYTE

12 3 4 56

nINIT

ECP HARDWARE HANDSHAKING TIMING (REVERSE)

1. The host request a reverse channel transfer by setting nINIT low

2. The peripheral signals that it is OK to proceed by setting PE low

3. The peripheral places data on the data lines and indicates a data cycle by setting BUSY high

4. Peripheral asserts nACK low to indicate valid data

5. Host acknowledges by setting nAUTOFD high

6. Peripheral sets nACK high. This is the edge that should be used to clock the data into the host

7. Host sets nAUTOFD low to indicate that it is ready for the next byte

8. The cycle repeats, but this time it is a command cycle because BUSY is low

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Repair Manual

CS RD VVR A0/ALE D[7:0]/AD[7:0] INTR MODE[1:0]

Microcontroller Interface

Endpoint/Contol FIFOs

Control Status

RESET

Vcc

GND

XIN

XOUT

CLKOUT

48 MHz

Oscillator

Clock

Generator

SIE

Media Access Controller[MAC]

Physical Layer interface[PHY]

Trans ceiver VReg

Clock

Recovery

USB Event

Detect

V3.3

AGND

D+ D- Upstream Port

USB INTERFACE

• Full-Speed USB Node Device

• USB transceiver

• 3.3V signal voltage regulator

• 48 MHz oscillator circuit

• Programmable clock generator

• Serial Interface Engine consisting of Physical Layer In-terrace (PHY) and Media Access Controller (MAC), USB

Specification 1.0 compliant

• Control/Status Register File

• USB Function Controller with seven FIFO-based End-points :

- One bidirectional Control Endpoint 0 (8bytes)

- Three Transmit Endpoints (2*32 and 1*64 bytes)

- Three Receive Endpoints (2*32 and 1*64 bytes)

• 8-bit parallel interface with two selectable modes :

- non-multiplexed

- multiplexed (Inter compatible)

• DMA support for parallel interface

• MICROWIRE/PLUS Interface

• 28-pin SO package

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Repair Manual

VVR

D[7:0]

DATA_IN

DATA_OUT

ADDR

DATA_IN

DATA_OUT

ADDRESS

0x00

0x3F

REGISTERFILE

NON-MULTIPLEXED MODE INTERFACE BLOCK DIAGRAM

NON-MULTIPLEXED MODE BASIC TIMING DIAGRAM

VVR

D[7:0] input out

vvrte Address Read Data

out

Burst Read Data

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Repair Manual

3-2 OPE PBA

3-2-1 SUMMARY

Scan

Position

Sensor

Document

Detect

Sensor

Connector

MICOM

HT48C5A

UART

Reset

RESONATOR

7.37 MHz

LCD

16x 1Line

Key Matrix

LEDs

OPE Board is separated functionally from the main board

and operated by the micom(HT48C5A) in the board. OPE

and the main use UART (universal asynchronous receiv-

er/transmitter) channel to exchange information. OPE

reset can be controlled by the main.

OPE micom controls key-scanning and LCD and LED dis-

play, detects documents and senses SCAN position. If

there occurs an event in OPE (such as key touch and sen-

sor level change), it sends specific codes to the main to

respond to the situation and the main analyzes these

codes and operates the system.

For example, it the main is to display messages in OPE,

the main transmits data through UART line to OPE

according to the designated format and OPE displays this

on LCD, LED. OPE’s sensing is also transmitted to the

main through UART line and then the main drives neces-

sary operation.

OPE PBA consists of U1(MICOM, HT48C5A),LCD, key

matrix, LED indicators, SCAN position sensor and the

document detect sensor. Refer to OPE Schematic

Diagram and Wiring Diagram sections of this manual.

• Display from the controller is received at U2 pin 47

(RX DATA).

• LCD drive signals are sent from P1-x pin group, P1-

4~P1-14 pins.

• Machine status LED drive signals are sent from U2

LED0~LED4.

• Document detect sensor output is received at U2 pin 1.

• Scan position sensor output is received at U2 pin7

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Repair Manual

3-3 LIU PBA

The LIU (Line Interface Unit) using the discrete method is comprised of the following.

(1) Tel_line Interface Circuit that connects the PSTN(exchange) and the system (Facsimile)

(2) Telephone circuit composed of dial/speech circuit.

3-3-1 Tel_Line interface Circuit

Tel_Line Interface is the path that connects the signals between PSTN(exchange) and the system (Facsimile) and it is com-

prised of Tel-Line Interface Circuit and Impedance Matching Trans Circuit.

(1) TEL_LINE Interface Circuit

(2) TRANS Circuit for IMPEDANCE MATCHING

3-3-2 Telephone Circuit (Ringer/Dial/Speech Circuit, etc)

The telephone circuit is comprised of ring detect circuit, dialer circuit, speech circuit, external hook detect circuit and recall

circuit.

(1) Ring Detect Circuit

(2) Dialling Circuit (including MF Dialling Signal Transmitting Circuit)

(3) Speech Circuit

(4) External Hook Detect Circuit

(5) Recall Circuit

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Repair Manual

3-3-3 Detailed Spec.

TEL_LINE INTERFACE CIRCUIT

1) TEL_LINE INTERFACE CIRCUIT

• It is an interface that physically connects facsimile to the PSTN (public switching telephone network) through TIP and

RING as in fig. 1.

• ARS 1-3 protects the system from voltage overload such as the surge coming through PSTN. ARS 2 and ARS 3 are

used as overload protection in common mode (between TIP/RING and FRAME GROUND). ARS 1 is used as over-

load protection in normal mode (between TIN and RING) and it uses ARRESTOR for 600V. However, arrestor’s rated

voltage differs from European and USA(400v).

• CML (CONNECT MODEM to LINE) RELAY K1 is a switch designed to selectively connect the PSTN to system voice

communication path and fax communication path. In STAND_BY MODE and voice communication mode, it is con-

nected to TEL PART and FAX PART while communicating and dialing.

• CML Relay (K1): CML relay interfaces with T2(600:600) TRANS in communication mode.

• DC Impedance: DC impedance is determined in the DC Feeding Unit. It represents DC characteristic of the comput-

er connected through -48V DC power of the switch and lines. The DC characteristic of required by the communica-

tion standards of a number of countries is the DC resistance of 50Ω~300Ωto the current range of 20mA~120mA.

(value varies depend on countries).

• AC Impedance or Return Loss: AC impedance is determined by the peripheral circuits of T2 Transformer. It is the stan-

dard required for optimum signal transmission between computer and switch. When the AC impedance of the com-

puter for AC signal transmission and the AC impedance of the switch matches, the signal can be transmitted without

loss. Therefore, communication standards specifies the AC impedance of the computer and it implies the return loss.

The communication standards of each country, considering the characteristic of their lines, requires 600Ωor the return

loss of 14dB and higher against the AC impedance of Complex and the AC signals of 300Hz~400Hz. The AC imped-

ance of transformer changes depending on the load resistance, the core material, coil inductance and resistance, but

generally its characteristic against load resistance is considered.

TIP

RING

ARS1

ARS2

ARS3

K1 to FAX

to TEL

<TEL_LINE INTERFACE CIRCUIT>

3-27

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

RINGER DIAL CIRCUIT

1) Ringer Circuit

• The ring detect circuit detects the ring signal by sending the bell signal sent from PSTN to the primary photo coupler

(PC814). At this point, C(1uF/250V) is used to match the ring impedance and R is coupled directly in order to prevent

any damage to the photo coupler due to ring voltage.

2) Dialing Circuit

• Dialing circuit is initiated only when the power is on and it is transmitted to line through the modem of main part (T2

trans)

3) External Hook Detect Circuit

• In the discrete LIU method, the external hook detect circuit is designed to use both the photo coupler and current

detector in order to be used in all countries including the countries with low series resistance (Germany, Switzerland,

Belgium, Austria, etc.). To use photo coupler (PC814), you must carefully select the resister connected parallel (75Ω)

to the photo coupler in order to satisfy the voltage drop standards of England and a few other countries. The diode

connected to the current detector pin (5/6) was used to detect the external hook all through when the line parity turns

over.

4) Recall Circuit

• In the discrete LIU method, we used the recalling method using low cost photo coupler instead of using photo MOS

relay in order to initiate the recalling for handset hook off dialling after the power is turned on. In this case, the time

break recall was enabled by switching the power transistor of the telephone circuit using the secondary CPU control.

3-28

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

3-4 Engine PPA

3-4-1 Engine Configuration

3-4-1-1. Video Controller Board

Video Controller Board receives image data from the host computer and converts it into bitmap (binary) image or receives

bitmap image directly from the host computer and sends it to the engine controller board.

3-4-1-2. SMPS Board

It basically receives AC input and generates ripple-free DC level +5V and -5V +24V. Next, it supplies these voltages to each

unit appropriately.

It also supplies AC power to heat lamp of fixing unit.

3-4-1-3. HVPS Board

HVPS board generates high voltages of THV/MHV/Supply/Dev and supplies them to the developing unit to create images.

It is designed to realize optimum conditions for the images.

This board includes LSU interface unit and cover open sensing unit that it intercepts +24V voltage to the main motor, LSU,

fan, clutch and fixing unit when you open the front cover.

3-4-1-4. Developer

Using the digital picture process, developing unit generates visible images. It is comprised of charge roller, OPC drum,

developer roller, supply roller and toner.

3-4-1-5. LSU (Laser Scanning Unit)

This is controlled by engine controller. Using laser beam control, exposure of OPC drum and the rotational principle of poly-

gon mirror, it forms electro-static latent image in the OPC drum with the video data received from engine. It is the core part

of LBP. OPC drum synchronizes with the feeding speed of the paper and rotates. When the laser beam inside LSU reach-

es at the end of polygon mirror, it generates /HSYNC signal and send it to engine. Then the engine detects /HSYNC sig-

nal and adjusts the lengthwise row of the image on the paper. After detecting /HSYNC and after set time period, it sends

the video data to LSU to adjust the left margin on the paper.

The one side of the polygon mirror is the one line scanned.

3-4-1-6. Transfer

Transcribing unit is comprised of PTL(pre-transfer lamp) and transcribing roller. PTL detects the beam of the OPC drum,

lowers the electric potential of the developing unit and lower the adhesiveness of toner to enhance transcription coefficient.

And the transcribing roller transfers the toner (constituting element of video image) on OPC drum to the paper.

3-4-1-7. Fixer

It is comprised of heat lamp, heat roller, pressure roller, thermistor and thermostat. It fixes the toner powder transferred to

the paper on the paper using pressure and high heat in order to finish the final printing job.

3-29

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

3-4-2. Developing Process

3-4-2-1 Feeder

Engine operates this unit. Solenoid rotates the feed roller and feeds one paper. Then the paper is fed into the set and hits

the actuator of the feed sensor. At this point, the engine detects the signal and prepares to spray according to the image

data. If any problem happens to this feed sensor operation, the system displays “paper jam error” on the OP panel.

Also, feed sensor unit is closely related to the paper margin.

3-4-2-2. Electrifier

This unit electrifies consistent negative voltage to OPC. When the high negative voltage (-1550V) is allowed to charge roller,

the OPC drum surface will be consistently electrified with approximately +1300V. This is the first process in generating the

digital picture.

3-4-2-3. Exposer

After receiving bitmap image data from engine board, LSU turns the laser diode either on or off depending on whether the

digital data is present or absent in order to expose the OPC drum with the switched laser beam data. The difference

between the voltages generated at this point is presented above. In other words, the part exposed to the laser will have -

50V and its relative electric potential will increase and form electrostatic latent image.

The part unexposed to the laser as it did not have the video data will consistently retain -800V. Eventually, the image will

form in the part electrified and rose to -50V(forms black dot) and the part retaining -800V will be white in order to make the

basic condition to form the video data.

LSU

2.Charging

7.Fixing

8.Exit

EXIT

SENSOR 6.Transfer 5.Pre-Transfer

FEED

SENSOR

3.Exposure

4.Development

1.Feeding

H/R

P/R

C/R

OPC

T/R PTL

D/R S/R

< Engine Operating Description >

3-30

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

3-4-2-4. Developer Unit

On the surface where OPC drum and developer roller (rotate in opposite direction) meet, the toner that has negative elec-

tric characteristic moves to the exposed part (-50V) due to the electric potential difference, but it will not move to the unex-

posed part (-800V).

3-4-2-5. Transfer Unit

Toner on the OPC drum is transferred to paper by transfer unit. In other words, the toner on the OPC drum surface is induct-

ed by the transfer roller electrified to approximately +1.3KV(600~2800V variable) to the paper.

At this point, the voltage (600~2800V variable) is determined by temperature and humidity.

The above process is called “transfer”.

OPC

T/R

GND

1.3 KV

3-31

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

3-4-2-6. Anchorage unit

The toner transferred on to the paper is at the electronically low state and it can be easily scattered. Considering this fact,

we used heat (180°C) and pressure (4kg) to fix the toner on the paper permanently. Then the image formed will remain on

the paper permanently. Heat roller transfers the heat from the heat lamp inside to the paper. The surface of the heat roller

specially coated with Teflon repels toner melted by the heat from the surface.

The pressure roller on the bottom of the heat roller is made of silicon resin and its surface is also coated with Teflon. The

thermistor of the fixer unit detects the surface temperature of the heat roller and feeds this information back in order to retain

180°C while printing and 135°C, while on standby. The thermostat is used as the secondary safety device and it prevents

overheat by shutting the main power when the heat lamp

is overheated.

3-4-2-7. Exit

After the digital picture process is finished, the printed paper will come out of the set through the exit sensor. The signal

detected will be transferred to the engine and provide the position information. If the actuator and the sensor do not work

normally, the system will display “Paper Jam 2 Error”.

Heat Lamp

Heat Roller

Paper

Toner

Pressure

Roller

Spring

Thermistor

3-32

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

SWITCHING

CONTROL UNIT

TRANS

SWITCHING

CONTROL UNIT

SWITCHING

CONTROL UNIT

MHV-PWM

DEV-EA

SUPPLY-EA

REGULATION

CIRCUIT

OUTPUT

CIRCUIT

FEEDBACK

THVPWM

THVEA

THVREAD

PWM

CONTROL UNIT SWITCHING

CONTROL UNIT TRANS

SWITCHING

CONTROL UNIT TRANS

FEED BACK

THV

REGULATION

CIRCUIT

REGULATION

CIRCUIT

THV

ENVIRONMENT

RECOGNITION

CIRCUIT

BIAS OUTPUT UNIT BLOCK DIAGRAM

TRANSFER OUTPUT UNIT BLOCK DIAGRAM

3-33

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

3-4-2-8. MHV (Electrification Output Enable)

Electrification Output Enable is the electrification output control signal 'PWM-LOW ACTIVE'.

When MHV-PWM LOW signal is received, Q401 turns on and the steady voltage will be accepted to the non-inverting ter-

minal of OP-AMP 324. As the voltage higher than the inverting reference voltage of OP-AMP, which is set to R405 and

R406, OP-AMP output turns high.

This output sends IB to the TRANS auxiliary wire through current-restricting resistance Q402 via R408 and C403 and Q402

turns on. When the current is accepted to Q402, Ic increases to the current proportional to time through the T401 primary

coil, and when it reaches the Hfe limit of Q402, it will not retain the "on" state, but will turn to "off". As Q402 turns 'off', TRANS

N1 will have counter-electromotive force, discharge energy to the secondary unit, sends current to the load and outputs

MHV voltage through the high voltage output enable, which is comprised of Regulation– circuit.

MHV-PWM U2 7407

R411 2.2K

18V

Q401 A708

R403 130K

R402

82K

R412 2K

R404

27K

C408

104 R406

2.2K

R405 220K

24VS

R408

47K R409

390

KA324 C403

333

Q402

D526

24VS

T401

C404

3K/471

D402

4KV

C406

3K/471

R416

15M

R417

15M

MHV OUTPUT

3-34

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

3-4-2-9. BIAS (supply/dev output unit)

BIAS voltage output is generated only when electrification voltage is set to output. In the circuit presented above, it orga-

nizes enough zener-diodes required to output dev/supply voltage from electrification output.

Supply voltage is output when the supply-ea signal is 'L'. When supply-ea is 'L', Q104 turns off and as Q105 does not turn

on, the electric potential of the output unit retains the electric potential of zener and thus -500V is output as the supply volt-

age.

In case supply-ea signal is 'H', both Q104 and Q105 will turn on and the electric potential of the output unit will not retain

the electric potential of zener and become GND level and thus the output voltage will become .

The output condition of developer voltage is the same as that of the supply voltage.

MHV-PWM U2 7407

R411 2.2K

18V

Q401 A708

R403 130K

R402

82K

R412 2K

R404

27K

C408

104 R406

2.2K

R405 220K

24VS

R408

47K R409

390

KA324 C403

333

Q402

D526

24VS

T401

C404

3K/471

D402

4KV

C406

3K/471

R416

15M

R417

15M

MHV

OUTPUT

DEV-EA

24VS

R114

33K

R113

10K

R115 3.3K

R117 10K

R116

2.2K

Q106

C3198

Q107 A1413 R118

33K

C107

1K/101

ZD401 150V

ZD402 150V

ZD403 51V

DEV

OUTPUT

SUPPLY

OUTPUT

SUPPLY-EA

24VS

R107

33K

R106

10K

R108 33K

R112

Q104

C3198

Q105 A1413

R109 10K

R110

2.2K

R111

33K C106

1K/101

ZD404 150V

ZD405 150V

ZD406 100V

ZD407 100V

3-35

Samsung Electronics

CIRCUIT DESCRIPTION

Repair Manual

3-4-2-10. THV(THV(+)/THV(-) Output Unit)

Transfer(+) output unit is the transfer output control signal 'PWM-LOW ACTIVE'.

When THV-PWM LOW signal is received, Q203 turns on and the steady voltage will be accepted to the non-inverting ter-

minal of OP-AMP 324. As the voltage is higher than the inverting reference voltage of OP-AMP, OP-AMP output turns high.

The 24V power adjusts the electric potential to ZD201 and ZD202, sends IB to TRANS auxiliary wire through current-

restricting resistance R215 via R212 and C204, and eventually Q204 will turn on. When the current is accepted to Q402,

Ic increases to the current proportional to time through the T201 primary coil, and when it reaches the Hfe limit of Q204, it

will not retain the "on" state, but will turn to "off". As Q402 turns 'off', TRANS N1 will have counter-electromotive force, dis-

charge energy to the secondary coil, sends current to the load and outputs THV voltage through the high voltage output

enable, which is comprised of Regulation– circuit. The output voltage is determined by the DUTY width. Q203 switches

with PWM DUTY cycle to fluctuate the output by fluctuating the OP-AMP non-inverting end VREF electric potential, and

the maximum is output at 0% and the minimum, at 100%.Transfer(-) output unit is THV-EA 'L' enable.

When THV-EA is 'L', Q302 turns on and the VCE electric potential of Q302 will be formed and sends IB to TRANS auxil-

iary wire through R311, C305 and VR302 via current-restricting resistance R314, and eventually Q303 will turn on. When

the current is accepted to Q303, Q303's Ic increases to the current proportional to time through the T301 primary coil, and

when it reaches the Hfe limit of Q303, it will not retain the "on" state, but will turn to "off". As Q303 turns 'off', TRANS N1

will have counter-electromotive force, discharge energy to the secondary coil, send current to load and output THV(-) volt-

age through the high voltage output enable, which is comprised of Regulation– circuit.

#7 TEV-PWM

R201

10K

R205

1.8K

R206

100

Q203

A708Y

R208

30K

18V

R209

100KF

VR201

50K

R207

2K C201

103 C202

121 R210

845KF

D202

1N4148 R211

1MF

_U1

11 KA324

24VS

+C101

35V47UF

D201

1N4148

24VS

R213

2.2K

R212

680K C203

472 D203

1N4148 ZD201

5.65V ZD202

705V

R214

2.2K

C204

333Z

Q204

D526

T201

KAB-007 C206

3KV470pF

C205

2KV68pF D204

4KV D205

4KV

R215

390

C207

3KV470pF

R216

SBR306 R218

MGR1/2W100KF

R217

SBR207

#17

#19

#24

TEV-EA

TEV-READ

18V

1/2W560

ZD1

5.6V

104

D301

1N4148

7U2

7407

D-GND

24VS

103

KA324

R301

470K

C301

222

R302

33K R303

100KF

C302

102 D302

1N4148

C303

103

R304

389KF

R305

10KF

VR301

R306

26.1KF

C304

500V103Z

18V

R309

202K

R307

33K

Q301

A708Y

18V

R310

2.2K

R308

33K

Q302

A708Y

R312

1W56

R313

1W56

Q303

D526

R311

100KF

C305

333Z

VR302

R314

1.7K

KAB-006

T301

C307

3KW470pF D304

4KV

C306

2KV68pF D303

4KV C308

3KV470pF R315

SBR306

3-36

CIRCUIT DESCRIPTION

Samsung Electronics

Repair Manual

3-4-2-11. Environment Recognition

THV voltage recognizes changes in transfer roller environment and allows the voltage suitable for the environment in order

to realize optimum image output. The analog input is converted to digital output by the comparator that recognizes the envi-

ronmental changes of the transfer roller. It is to allow the right transfer voltage to perform appropriate environmental

response considering the environment and the type of paper depending on this digital output by the programs that can be

input to the engine controller ROM.

For ML-5000 or ML-5200 series, this environment recognition setting is organized as follows: First, set the THV(+) stan-

dard voltage. Allow 200MΩload to transfer output, enable output and set the standard voltage 800V using VR201. Then

set 78 (CPU's recognition index value) as the standard using VR302. This standard value with CPU makes sure that the

current feedback is 4µA when output voltage is 800V and load is

200MΩ.If the load shows different resistance value when 800V is output, the current feedback will also be different and

thus the index value will also be different. according to the index value read by CPU, the transfer voltage output will differ

according to the preset transfer table.

The changes in transfer output required by each load is controlled by PWM-DUTY.

4-1

Samsung Electronics

SCHEMATIC DIAGRAMS

Repair Manual

4.Schematic Diagrams

4-1 Main Circuit Diagram (1/6)

APOLLO2(MAIN)

4-2

SCHEMATIC DIAGRAMS

Samsung Electronics

Repair Manual

4-2 Main Circuit Diagram (2/6)

APOLLO2(MAIN)

4-3

Samsung Electronics

SCHEMATIC DIAGRAMS

Repair Manual

4-3 Main Circuit Diagram (3/6)

APOLLO2(MAIN)

4-4

SCHEMATIC DIAGRAMS

Samsung Electronics

Repair Manual

4-4 Main Circuit Diagram (4/6)

APOLLO2(MAIN)

4-5

Samsung Electronics

SCHEMATIC DIAGRAMS

Repair Manual

4-5 Main Circuit Diagram (5/6)

APOLLO2(MAIN)

4-6

SCHEMATIC DIAGRAMS

Samsung Electronics

Repair Manual

4-6 Main Circuit Diagram (6/6)

APOLLO2(MAIN)

4-7

Samsung Electronics

SCHEMATIC DIAGRAMS

Repair Manual

4-7 LIU Circuit Diagram (1/2)

APOLLO2(LIU)

4-8

SCHEMATIC DIAGRAMS

Samsung Electronics

Repair Manual

4-8 LIU Circuit Diagram (2/2)

APOLLO2(LIU)

4-9

Samsung Electronics

SCHEMATIC DIAGRAMS

Repair Manual

4-9 OPE Circuit Diagram

STOP

Drawn by:

PAPER

/DELETE

ADVANCED FAX

SETUP

2.0

REDIAL

REPRINT

Page:

SAMSUNG ELECTRONICS

TITLE: Size:

DOC CTRL CHK:

Drawing Number:

TONER

POWER

START/

Date Changed:Changed by:

R&D CHK:

QA CHK:

TOLL PAPER POWER TONER E-MAIL

COPY/ SEARCHOHD/

RECALL

4 *

V-REQUEST

HELP

CONTRAST

Engineer:

MFG ENGR CHK:

REPORT/

Ho-Jin Park

Son-Hyun 1

REV:

RESOLUTION

Time Changed:

RCV-MODE/

E-MAIL

TOLL

01 06

R46

200

V17

KSA1182-Y

SLS-NNGR202TS

LED5

SW10 SW16

GND5

100pF

P1 12

V15

GND5

SW22

SW15

SW14

SW32

SW31

SW29

SW30

SW28

SW27

P1 14

SW26

P1 2

C18

220pF

R48

SW41

SW42

100nF

35 _RESET

MMSD914T1

TMR0

TMR1 34

48 TXD

VDD

VSS

37 XTAL1

XTAL2

_INT 20

NC3

NC4

NC5 39

NC6

NC7 41

NC8

47 RXD

SENSOR

LED2 4

LED3

LED4 46

LED5

LED6 44

LED7

NC1

NC2

LCD_D6

LCD_D7

LCD_D0

LCD_E

LCD_RS

9LCD_RW

LED0 6

LED1

KEY5

KEY6 28

KEY7

LCD_D1

LCD_D2

LCD_D3

18 LCD_D4

LCD_D5

HT48R50

D_DET

D_SCAN

KEY0 22

KEY1

KEY2 24

KEY3

KEY4 26

+5V

GND5

R34

680

R49

R36

22K

SW39

SW25 SW40

SW24

GND5

SW23

22K

SW6

SW4

MMSD914T1

SW11

22K

13 12

P1 6

SLS-NNGR202TS

+5V

CD74HC14MX

LED4

R47

200

SW53

GND5

200

R40

22K

R37

SW52

KSA1182-Y

C17

10uF

16V

22K

+5V

GND5

+5V

R41

200

300

R21

SW34

SW5

GND5

SW33

MMSD914T1

P1 7

+5V

R51

SW48

GND5

SW47

+5V

GND5

+5V

GND5

LED3

SLS-NNGR202TS

22K

+5V

GND5

CSA7.37MTZ-TF01

GND5

MMSD914T1

+5V

C14

100nF

SW37

SW38

SW36

R15

SW44

SW19

SW18 SW21

SW20

R19

300

GND5

V16

22K

100nF

P1 9

CD74HC14MX

11 10

+5V

CD74HC14MX

220pF

C19

+5V

MMSD914T1

200

KSA1182-Y

R42

200

GND5

V10

R44

GND5

KSA1182-Y

V11

V13

SW54

R22

300

P1 3

SW49

V12

SW12

SW3

SW2

CD74HC14MX

200R38

SW7

KSA1182-Y

CD74HC14MX

200

R45

100nF

C21

R50

+5V

C16

47pF

R18

SW13

P1 11

300

GND5

SW1

R10

SLS-NNGR202TS

LED1

200 200

R11

SW45

MMSD914T1

KPI-L05

ITR-9702/F2

GND5

+5V

C20

220pF

R1 200

GND5

22K

CN1

GILS-5P-S2T2-EF

MMSD914T1

GND5

16V

10uF

C13

R35

10K

CD74HC14MX

200

R43

C12

100nF

22K

C15

47pF

P1 8

R39

P1 1

P1 5

KA2-14P8-2.54DSA

SW9

SW35

SW8

V14

GND5

+5V

SW43

SLS-NNGR202TS

LED2

D_SCAND_DET

SW17

D(5)

D(6)

D(5)

D(1)

D(0)

D_SCAN

D(1)

D(3)

D(6)

D_DET

D(0)

D(2)

D(4)

D(2)

D(3)

D(4)

APOLLO2 (OPE)

4-10

SCHEMATIC DIAGRAMS

Samsung Electronics

Repair Manual

4-10 Scan Circuit Diagram (200DPI)

APOLLO2(200DPI)

4-11

Samsung Electronics

SCHEMATIC DIAGRAMS

Repair Manual

4-11 Scan Circuit Diagram (300DPI)

APOLLO2(300DPI)

4-12

SCHEMATIC DIAGRAMS

Samsung Electronics

Repair Manual

4-12 HVPS Circuit Diagram (1/2)

R512

430

24VS

R405

220KF

MHV-PWM

SIZE A4

R503

100

ZD401

1W 130V

R416

MGR1/2W 15MF

R515

MGR1/2W 6MF

U1-C

KA324

D501

1N4148

R508

86.6KF

R504

C405

2KV 680

OUT

R516

MGR1/2W 50K

35V 47uF

D402

4KV

MHV

R505

100KF

VR501

50K

R514

MGR1/2W 15MF

DRW. NO

C501

104

R520

MGR1/2W 9MF

D-GND

18V

Q501

A708-Y

R502

2.2K

APPROVED

GND

R519

MGR1/2W 50K

R506

86.6KF

B1151-Y

REV.

R513

1W 3

Q502

D526-Y

R510

47K

Q401

A708-Y

THV-EA

C403

333

R422

5.6K

R401

100

THV-PWM

CHECKED

D502

4KV

1W 1K

24VS

C404

3KV 471

Q402

D526-Y

5.6K

DESIGNED

R410

1W 3

R509

12KF

D404

1N4148

R403

110KF

D401

4KV

U1-D

KA324

C1008-Y

R411

2.2K

DEV

THV-READ

100

R414

MGR1/2W 6MF

T501

T1167

J.S.YOUN

C504

333

1 OF 2

R413

MGR1/2W 6MF

SUPPLY

18V

C503

104

2.0

D403

1N4148

104

C402

103

R408

47K

T401

KAB-006

R507

27K

R409

430

U2-A

R407

240K

C408

104

MHV-PWM

OPC

104

C506

3KV 471

18V

R501

5.6K

R402

56KF

CN1-#7

REF. NO

C401

331

R517

MGR1/2W 6MF

C505

2KV 680

U2-B

BIAS-PWM

TITLE

R404

33K

A-GND

7407

C406

3KV 471

VR401

50K

BIAS-PWM

GIL-S-9P-S2T2-EF

CN1

CN1-#6 7407

24V

R518

MGR1/2W 9MF

R426

MGR1/2W 100KF

24VS

R511

47K

KA7818

C502

222

24VS

R406

2.2KF

ZD501

1W 200V

R417

MGR1/2W 15MF

R412

DONGYANG INSTRUMENTS

APOLLO2 (HVPS)

4-13

Samsung Electronics

SCHEMATIC DIAGRAMS

Repair Manual

4-13 HVPS Circuit Diagram (2/2)

C301

222

104

APPROVED

R218

MGR1/2W 100KF

R309

2.2K

TITLE

18V

7407

R316

1KF

R211

1MF

VR302

11 10

CHECKED

ZD202

7.5V

R305

6.2KF

CN1-#8

7407

+C101

35V 47uF

R304

200KF

DESIGNED

CN1-#4

R303

100KF

U2-E

Q302

A708-Y

U1-B

KA324

R314

3KF

R315

BR1/2W 30MJ

2 OF 2

CN1-#5

Q203

A708-Y

Q303

D526-Y

R215

430

D301

1N4148

R206

100

C207

6KV 471

THV-EA

R214

1.2K

R217

BR1/2W 200MG

U2-F

R301

470K

R307

33K

C305

333

J.S.YOUN

D204

6KV

C209

6KV 471

R306

26.1KF

3.0

24VS

R216

BR1/2W 30MJ

VR301

10K

R311

100KF

7407

VR201

50K

D304

4KV

REV.

D201

1N4148

C308

3KV 471

D-GND

R209

110KF

ZD201

5.6V

THV

CN1-#3

Q301

A708-Y

C302

102

R205

D202

1N4148

T201

HVT-2A

D303

4KV

C205

6KV 101

D302

1N4148

D203

1N4148

R210

510KF

C306

2KV 680

R201

10K D207

6KV

C208

6KV 471

C304

500V 103

13 12

C307

3KV 471

D206

6KV

R308

33K

SIZE A4

C203

472

U1-A

KA324

C201

103

C303

333

THV-PWM

R317

2KF

R208

30KF

THV-READ

R212

470K

R207

R213

2.2K

24VS

C202

331 1/2W

D205

6KV

REF. NO

U2-C

9 8

C206

6KV 471

18V

T301

KAB-006

5 6

24VS

R302

33K

500V

DRW. NO

18V

DONGYANG INSTRUMENTS

C204

473

Q204

D526-Y

R310

2.2K

APOLLO2 (HVPS)

Contents

Samsung Electronics

CONTENTS

1. Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

1-1 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

1-2 Precautions on Disassembly and Reassembly . . . . . . . . . . . . . . . . . . . .1-1

1-3 ESD Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-2

1-4 Tools for Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-3

2. Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1

3. Disassembly and Reassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

3-1 General Precautions on Disassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

3-2 Cradle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2

3-3 White Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2

3-4 OPE Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-3

3-5 ADF Rubber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-5

3-6 OPE Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6

3-7 Lever Sensor Doc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6

3-8 Lever Sensor Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6

3-9 Scan Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-7

3-10 Scan Motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-7

3-11 ADF Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8

3-12 CIS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8

3-13 Rear Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-9

3-14 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-9

3-15 Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-10

3-16 LSU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-10

3-17 Transfer Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11

3-18 Engine Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11

3-19 Pick-up Roller Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-12

3-20 Knock-up Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-13

3-21 Cap-pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-13

3-22 Holder-pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-14

3-23 Motor Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-14

3-24 Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-15

3-25 Gear Pick-up Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-15

3-26 Solenoid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-16

3-27 HVPS Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-16

3-28 Hook Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-17

3-29 Fuser Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-17

3-30 Thermostat . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-18

3-31 Halogen Lamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-18

3-32 Pressure Roller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-19

3-33 Actuator-Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-19

3-34 Shield Engine Ass'y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20

3-34 SMPS Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-20

3-36 Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-21

3-37 LIU Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-21

3-38 Main Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

3-39 Sensor Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

3-40 Actuator Empty/Feeder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-23

3-41 Roller Feeder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-24

Contents

Samsung Electronics

4. Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

4-1 Preventative Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

4-2 Tech Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

4-2-1 System Data List in TECH MODE . . . . . . . . . . . . . . . . . . . . . . . . . .4-2

4-2-2 Tech Mode Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3

4-2-3 Maintenance Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4

4-2-4 Printout Report . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-6

4-2-5 Engine Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-6

4-2-6 Maintenance List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-7

4-3 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-8

4-3-1 Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-8

4-4 Print Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-10

4-5 Note for replacing Main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-10

4-6 Troubleshooting Flow Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-11

5. Exploded Views and Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

5-1 Main Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-2

5-2 Shield Engine Unit Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-4

5-3 Engine Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-6

5-4 Frame Lower Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-8

5-5 Fuser Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-10

5-6 Plate-Upper Unit Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-12

5-7 OPE Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-14

5-8 Scan Upper Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-15

5-9 Front Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-16

5-10 RX Drive Unit Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-18

6. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1

7. Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1

SF530

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