BOOSTXL SENSORS BoosterPack™ Plug In Module User's Guide (Rev. B) Sensor Booster Pack User Manual

Sensors%20User's%20Guide

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module
Revision History
Important Notice

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

User's Guide

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in

Module

The Sensors BoosterPack™ kit (BOOSTXL-SENSORS) is an easy-to-use plug-in module for adding digital

sensors to your LaunchPad™ development kit design. SimpleLink™ microcontroller (MCU) LaunchPad

development kit developers can use this BoosterPack plug-in module to start developing sensor

applications using the onboard gyroscope, accelerometer, magnetometer, pressure, ambient temperature,

humidity, ambient light, and infrared temperature sensors.

Figure 1. BOOSTXL-SENSORS BoosterPack™ Plug-in Module

Contents

1 Getting Started ............................................................................................................... 3

2 Hardware...................................................................................................................... 4

3 Software Examples .......................................................................................................... 8

4 Additional Resources ...................................................................................................... 19

5 Schematics.................................................................................................................. 25

List of Figures

1 BOOSTXL-SENSORS BoosterPack™ Plug-in Module................................................................. 1

2 BOOSTXL-SENSORS Overview .......................................................................................... 4

3 BoosterPack Plug-in Module Pinout....................................................................................... 4

4 Setting up COM Port Configuration for the LaunchPad Development Kit .......................................... 10

5 Programming Sensor Software With the GUI .......................................................................... 10

6 Sensor GUI Layout......................................................................................................... 11

7 GUI Sensor Tile ............................................................................................................ 12

8 GUI Integrated EnergyTrace Measurements ........................................................................... 13

9 Board Movement Window................................................................................................. 14

10 Translation Along the X Axis.............................................................................................. 14

11 Translation Along the Y Axis.............................................................................................. 14

12 Translation Along the Z Axis.............................................................................................. 14

13 Rotation Around the X Axis ............................................................................................... 15

14 Rotation Around the Y Axis ............................................................................................... 15

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15 Rotation Around the Z Axis ............................................................................................... 16

16 No Movement............................................................................................................... 16

17 Light Sensing in the Gesture Recognition Window.................................................................... 17

18 TI Resource Explorer Cloud .............................................................................................. 19

19 CCS Cloud .................................................................................................................. 20

20 Directing the Project>Import Function to the Demo Project .......................................................... 21

21 When CCS Has Found the Project ...................................................................................... 22

22 TI Drivers Software Examples in TI Resource Explorer .............................................................. 23

23 Schematics.................................................................................................................. 25

List of Tables

1 OPT3001 Pinout ............................................................................................................. 5

2 TMP007 Pinout............................................................................................................... 5

3 BMI160 Pinout ............................................................................................................... 6

4 BMM150 Pinout .............................................................................................................. 6

5 BME280 Pinout .............................................................................................................. 7

6 Hardware Change Log...................................................................................................... 7

7 Software Examples.......................................................................................................... 8

8 IDE Minimum Requirements for MSP-EXP432P401R.................................................................. 8

9 IDE Minimum Requirements for MSP-EXP430FR5994 ................................................................ 8

10 Source File and Folders .................................................................................................... 9

11 Source Files and Folders.................................................................................................. 17

12 Source Files and Folders.................................................................................................. 18

Trademarks

BoosterPack, LaunchPad, SimpleLink, Code Composer Studio, MSP432, EnergyTrace, MSP430Ware,

MSP430, E2E are trademarks of Texas Instruments.

ARM, Keil, µVision are registered trademarks of ARM Ltd.

Bluetooth is a registered trademark of Bluetooth SIG.

IAR Embedded Workbench is a registered trademark of IAR Systems AB.

Bosch is a registered trademark of Robert Bosch LLC.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

All other trademarks are the property of their respective owners.

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Getting Started

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

1 Getting Started

1.1 Introduction

The Sensors BoosterPack kit (BOOSTXL-SENSORS) is an easy-to-use plug-in module for adding digital

sensors to the LaunchPad development kit design. SimpleLink MCU LaunchPad development kit

developers can use this BoosterPack plug-in module to start developing sensor applications using the

onboard gyroscope, accelerometer, magnetometer, pressure, ambient temperature, humidity, ambient

light, and infrared temperature sensors. (Only the PCB footprint is provided for the infrared temperature

sensor due to TMP007 device end-of-life.)

1.2 Key Features

• Inertial measurement unit (IMU) sensor – accelerometer and gyroscope

• Magnetometer

• Environmental sensor: pressure, ambient temperature, and humidity

• Ambient light sensor

• PCB footprint for the infrared temperature sensor (device not populated due to end-of-life)

• Works with TI LaunchPad development kits

1.3 What's Included

1.3.1 Kit Contents

• 1x BOOSTXL-SENSORS BoosterPack plug-in module

• 1x quick start guide

1.3.2 Software Examples

• SimpleLink MSP-EXP432P401R LaunchPad development kit + BOOSTXL-SENSORS demos (see

Section 3)

– Raw sensor data output + GUI

– TI RTOS sensor output + GUI

• MSP-EXP430FR5994 LaunchPad development kit + BOOSTXL-SENSORS demos (see Section 3)

– TI RTOS sensor output + GUI

1.4 Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It's time to open an integrated

development environment (IDE) and start looking at the code examples. Section 3 describes the example

projects available to make it easy to understand the provided software.

Hardware

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2 Hardware

Figure 2 shows an overview of the BoosterPack plug-in module.

Figure 2. BOOSTXL-SENSORS Overview

2.1 Hardware Features

2.1.1 BoosterPack Pinout

Figure 3 shows the pinout of the BoosterPack plug-in module.

Figure 3. BoosterPack Plug-in Module Pinout

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Hardware

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

The Sensors BoosterPack plug-in module adheres to the 40-pin LaunchPad development kit and

BoosterPack plug-in module pinout standard. A standard was created to aid compatibility between

LaunchPad development kits and BoosterPack plug-in modules across the TI ecosystem.

The 40-pin standard on the BOOSTXL-SENSORS is compatible with the 20-pin standard that is used by

other LaunchPad development kits like the MSP-EXP430G2 LaunchPad development kit. This allows for

40-pin BoosterPack plug-in modules to be used with 20-pin LaunchPad development kits.

The BOOSTXL-SENSORS BoosterPack plug-in module has both male and female headers to support

stacking on top. You must take careful consideration when stacking other BoosterPack plug-in modules

near the Sensors BoosterPack plug-in module as heat, shade, and electromagnetic fields can adversely

affect the sensors readings.

More information about compatibility can also be found at www.ti.com/launchpad.

2.1.2 TI OPT3001 Light Sensor

The OPT3001 is a digital ambient light sensor (ALS) that measures the intensity of light as visible by the

human eye. Covering the sensor with a finger or shining a flashlight on it changes the output of the

OPT3001. The digital output is reported over an I2C- and System Management Bus (SMBus)-compatible,

2-wire serial interface. The reference designator for the OPT3001 is U1. Table 1 lists the pin connections

of the OPT3001.

More information on the OPT3001 light sensor can be found at www.ti.com/product/opt3001.

(1) Pin is multiplexed with the I2C communication lines of the TMP007,

BMI160, and BME280.

Table 1. OPT3001 Pinout

BoosterPack Header Connection Pin Function

J1.9(1) I2C SCL

J1.10(1) I2C SDA

J2.11 OPT3001 Interrupt

2.1.3 TI TMP007 Temperature Sensor

The TMP007 is a digital infrared (IR) thermopile contactless temperature sensor with integrated math

engine that measures the temperature of an object without having to be in direct contact. Placing your

hand over the sensor increases the sensor output. The digital output is reported over an I2C- and SMBus-

compatible, 2-wire serial interface. The reference designator for the TMP007 is U5. Table 2 lists the pin

connections of the TMP007.

NOTE: The TMP007 infrared temperature sensor is no longer populated on this BoosterPack board,

and only the PCB footprint is provided due to the end-of-life status of the device.

(1) Pin is multiplexed with the I2C communication lines of the OPT3001,

BMI160, and BME280.

Table 2. TMP007 Pinout

BoosterPack Header Connection Pin Function

J1.9(1) I2C SCL

J1.10(1) I2C SDA

J2.12 TMP007 Interrupt

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2.1.4 Bosch®BMI160 Inertial Measurement Sensor

The Bosch BMI160 inertial measurement unit is a 6-axis digital accelerometer and gyroscope sensor that

measures gravitational forces exerted on the EVM as well as speed of rotation in degrees per second. The

BMI160 can synchronize its own accelerometer and gyroscope data as well as with an external device

such as a geomagnetic sensor. Rotating the board about its axis increases the gyroscope output of the

sensor, and changing the orientation of the board with respect to the earth changes its accelerometer

output (for example, with the X arrow toward the earth, the X value of the accelerometer is positive). The

BMI160 has a secondary I2C interface for connecting additional Bosch sensors such as the BMM150

geomagnetic sensor. The digital output of both sensors is reported over an I2C- and SMBus-compatible 2-

wire serial interface. The reference designator for the BMI160 is U3. Table 3 lists the pin connections of

the BMI160.

More information on the BMI160 inertial measurement unit can be found at www.bosch-

sensortec.com/en/bst/products/all_products/bmi160.

(1) Pin is multiplexed with the I2C communication lines of the OPT3001,

TMP007, and BME280

Table 3. BMI160 Pinout

BoosterPack Header Connection Pin Function

J1.5 BMI160 Interrupt 1

J1.9(1) I2C SCL

J1.10(1) I2C SDA

J2.13 BMI160 Interrupt 2

2.1.5 Bosch BMM150 Geomagnetic Sensor

The Bosch BMM150 geomagnetic sensor is a 3-axis digital magnetometer sensor that measures the

strength of magnetic fields in microtesla for e-compass applications. The BMM150 can be used in

combination with the BMI160 for 9-axis sensing. Placing a magnet near the sensor increases the sensor

output. The BMM150 is connected to the BMI160 as a secondary I2C device, and all of its sensor data is

passed to the BMI160 to be reported out over an I2C- and SMBus-compatible, 2-wire serial interface. The

reference designator for the BMM150 is U2. Table 4 lists the pin connections of the BMM150.

More information on the BMM150 geomagnetic sensor can be found at www.bosch-

sensortec.com/en/bst/products/all_products/bmm150.

Table 4. BMM150 Pinout

BoosterPack Header Connection Pin Function

J1.8 BMM150 Interrupt

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

2.1.6 Bosch BME280 Environmental Sensor

The Bosch BME280 integrated environmental unit is a digital pressure, ambient temperature and relative

humidity sensor. Changes in the environment surrounding the sensor cause changes in the sensor output.

The digital output of the sensor is reported over an I2C- and SMBus-compatible, 2-wire serial interface.

The reference designator for the BMI160 is U3. Table 5 lists the pin connections of the BME280.

More information on the BME280 environmental sensor can be found at www.bosch-

sensortec.com/en/bst/products/all_products/bme280.

(1) Pin is multiplexed with the I2C communication lines of the OPT3001,

TMP007, and BMI60.

Table 5. BME280 Pinout

BoosterPack Header Connection Pin Function

J1.9(1) I2C SCL

J1.10(1) I2C SDA

2.2 Power

The board was designed to be powered by the attached LaunchPad development kit.

2.2.1 LaunchPad Development Kit Default Power

This is the default power configuration for the BOOSTXL-SENSORS. In this configuration, power is

provided through the 3V3 (J1.1) pin on the BoosterPack plug-in module headers. The 3V3 pin powers

everything on the Sensors BoosterPack plug-in module.

2.3 Design Files

2.3.1 Hardware

Schematics can be found in Section 5. All design files including schematics, layout, bill of materials

(BOM), Gerber files, and documentation are available on the BOOSTXL-SENSORS Hardware Design

Files on the download page.

2.3.2 Software

All design files including TI-TXT object-code firmware images, software example projects, and

documentation are available in the software folders that are specific to each LaunchPad development kit.

To see which LaunchPad development kits feature BOOSTXL-SENSORS examples, visit the download

page.

2.3.3 Quick Start Guide

A quick start guide is available for download.

2.4 Hardware Change Log

Table 6 lists the hardware revision history.

Table 6. Hardware Change Log

PCB Revision Description

Rev 1.0 Initial release

Rev 1.1 Updates for CE

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3 Software Examples

The following software examples are included with the SimpleLink MSP-EXP432P401R and

MSPEXP430FR5994 LaunchPad development kits for the Sensors BoosterPack plug-in module (see

Table 7). These examples can be found in the MSP-EXP432P401R Software Examples and MSP-

EXP430FR5994 Software Examples zip folders.

Table 7. Software Examples

Demo Name LaunchPad /

BoosterPack Required Description More Details

BOOSTXL- SENSORS_SensorGUI_

MSP432P401R MSP-EXP432P401R /

BOOSTXL-SENSORS

Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload Section 3.1

BOOSTXL-SENSORS_TI-RTOS_

SensorGUI_MSP432P401R MSP-EXP432P401R /

BOOSTXL-SENSORS

Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload Section 3.2

BOOSTXL-SENSORS_TI-RTOS_

SensorGUI_MSP430FR5994 MSP-EXP430FR5994 /

BOOSTXL-SENSORS

Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload Section 3.3

To use any of the software examples with the LaunchPad development kit, you must have an integrated

development environment (IDE) that supports the MSP432P401R and MSP430FR5994 devices (see

Table 8).

Table 8. IDE Minimum Requirements for MSP-EXP432P401R

Code Composer Studio™ IDE IAR Embedded Workbench®for ARM IDE ARM®Keil®µVision®IDE

v7.1.0 v7.80.3 MDK-ARM v5

Table 9. IDE Minimum Requirements for MSP-EXP430FR5994

Code Composer Studio™ IDE IAR Embedded Workbench®for ARM IDE

v6.1.3 v6.30

For more details on how to get started quickly, and where to download the latest CCS, IAR, and Keil IDEs,

see Section 4.

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3.1 BOOSTXL-SENSORS_SensorGUI_MSP432P401R

This section describes the functionality and structure of the BOOSTXL-

SENSORS_SensorGUI_MSP432P401R demo that is included in the MSP-EXP432P401R Software

Examples, or more easily accessible through the SimpleLink MSP432™ SDK (see Section 4.6).

3.1.1 Source File Structure

The project is split into multiple files (see Table 10). This makes it easier to navigate and reuse parts of it

for other projects.

Table 10. Source File and Folders

Name Description

msp432_startup_ccs.c SimpleLink MSP432 MCU family interrupt vector table for CGT

Library: driverlib Device driver library (MSP432DRIVERLIB)

src/bme280.c Driver for communicating with the environmental sensor

src/bme280_support.c Support driver for communicating with the environmental sensor

src/bmi160.c Driver for communicating with the IMU and magnetometer sensors

src/bmi160_support.c Support driver for communicating with the IMU and magnetometer sensors

src/demo_sysctl.c Delay function for MSP432 MCU

src/i2c_driver.c Driver for I2C communication with the sensors

src/main.c The main function of the demo, interrupt service routines, global variables, and more

src/opt3001.c Driver for communicating with the ambient light sensor

src/tmp007.c Driver for communicating with the infrared temperature sensor

src/uart_driver.c Driver for UART communication with the PC GUI

3.1.2 Working With the GUI

The Sensor GUI allows for quick visualizations of the sensors data and testing of applications.

3.1.2.1 Getting Started

1. Download the BOOSTXL-SENSORS_GUI+ET zip file, and extract its contents.

2. Launch BOOSTXL-SENSORS_GUI+ET.

3. Plug your MSP432P401R LaunchPad development kit with Sensors BoosterPack plug-in module into a

USB port. And click the icon in the lower left corner of the GUI.

• If needed, go to "Options" and select the proper COM Port for the Application UART and the baud

rate as 115200 (see Figure 4).

NOTE: For Windows, you can find the port number by opening Device Manager and looking for

"XDS110 Class Application/User UART" under "Ports (COM & LPT)". It will be listed as

COMnn, where nn is the number of the port.

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Figure 4. Setting up COM Port Configuration for the LaunchPad Development Kit

4. Click "File" and click "Program Device". The firmware should download to the LaunchPad development

kit (see Figure 5).

Figure 5. Programming Sensor Software With the GUI

5. You should now be seeing live sensor data from the LaunchPad development kit plus the BoosterPack

plug-in module.

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(1) JSON = JavaScript Object Notation. This is the data format in which the information is sent. For more information, go to www.json.org.

3.1.2.2 Understanding the GUI

Figure 6 shows the layout of the sensor GUI.

Figure 6. Sensor GUI Layout

The GUI contains six main elements:

1. Four sensor tiles

2. A serial monitor

3. The EnergyTrace™ software section

4. The board movement detection window

5. A menu bar

6. A status bar

The Serial Monitor lets you see the JSON (1) that is being reported back by the MCU.

The menu bar serves two functions:

• To change the serial port settings, click and then click . In the dialog, select a

port number and the baud rate, which should be 115200. To apply the settings, click "Configure".

• To program the GUI firmware to the MSP432 MCU LaunchPad development kit, click "File" and then

click "Program Device…".

The status bar indicates if the LaunchPad development kit is connected to the PC, the port that is used,

and the baud rate.

The following example indicates a connection to COM22 at 115000 baud:

. Click to disconnect the GUI:

The following example indicates a busy port on COM22:

. To connect the LaunchPad development kit to

this COM port, close any programs that are using that port, disconnect the GUI by clicking ,

disconnect and reconnect (or restart) the LaunchPad development kit, and reconnect the GUI.

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3.1.2.3 Sensor Tiles

Four sensor tiles are available in the Sensor GUI for the BOOSTXL-SENSORS BoosterPack plug-in

module (see Figure 7). Each tile represents the data output for a sensor or set of integrated sensors. The

following is a brief description of each sensor tile:

The OPT3001 Ambient Light Sensor tile responds to ambient light, and displays the brightness of the

light in lux. Casting a shadow over this sensor causes the reading to decrease, and shining a light on the

sensor cause the reading to increase.

The TMP007 IR Temperature Sensor tile responds to infrared energy emitted by objects in its field of

view, displaying this in degrees Celsius. Holding a warm or cold object over the sensor causes a

response, even over short distances.

The BME280 Ambient Temperature, Relative Humidity, and Atmospheric Pressure Sensor tile

responds to atmospheric pressure in millimeters of mercury (which can be stimulated using a pressure

chamber or by lightly pressing on the sensor), relative humidity as a percentage, and ambient temperature

in degrees Celsius (both of which can be stimulated by breathing on the sensor).

The IMU tile is made up of two subtiles:

• The BMI160 Accelerometer and Gyroscope tile responds to acceleration in g (which can be

stimulated by changing the orientation of the board with respect to Earth's gravity, by shaking, or by

changing speed along an axis) and rotation in degrees per second (which can be stimulated by rotating

the board about its axes).

• The BMM150 Magnetometer tile responds to magnetic field in microtesla. This sensor can be

stimulated by changing the sensor orientation with respect to Earth's geomagnetic field or by passing a

magnet over it.

Figure 7. GUI Sensor Tile

The sensor tiles all share a common set of features. With a special case being the IMU (which consists of

the BMM150 and BMI160).

1. The sensor part number

2. A hint button. Click for an animated demonstration on how to stimulate the sensors. Click again to

hide the hint.

3. A graphical and numerical read out of the sensor values.

4. A sample rate selection drop-down menu. Click to select another frequency. This is the

frequency at which the sensor is checked, which also affects the rate at which the MCU wakes from

LPM0.

5. A button to toggle the sensor on and off. Click to toggle the sensor on or off. The

current draw of each sensor's "ON" and "OFF" states can be seen in the table described in

Section 3.1.2.4, or in the EnergyTrace software hint.

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The IMU tile is different from the other tiles in the following ways:

• It is made up of two parts, the BMI160 and the BMM150, each in its own box.

• Each box consists of graphs and numerical data, which are color coded to correspond to one another.

• Each part has its own sample rate selector.

• It has a hint button for each type of sensor; the accelerometer, gyroscope, and magnetometer.

The accelerometer has a display for the acceleration vector magnitude.

The ON/OFF toggle button puts the BMM150 into hibernate and the BMI160 into pedometer mode, and

only the accelerometer remains active.

3.1.2.4 EnergyTrace™ Software Function

Figure 8 shows the interface to EnergyTrace technology functions.

Figure 8. GUI Integrated EnergyTrace Measurements

This section provides monitoring of system current using TI's EnergyTrace technology. It consists of:

1. A hint button. Explains EnergyTrace software measurements and displays a table of expected sensor

currents.

2. A start button. Press this to shift any previous data down to the next time frame, clear the graph, and

begin the next measurement for the selected duration.

3. An input box. To set the duration in milliseconds, click the arrows or type a value:

4. The past three sensor settings and current measurements, with the most recent on top.

5. A graph showing the actual current draw over time. The X-axis corresponds to 0.5-ms ticks, the Y-axis

to the current in milliamps. Each peak is a good indicator of when the MCU is in active mode, and the

valleys indicate when the MCU is in LPM0.

This implementation is an abbreviated form of EnergyTrace software. The full version can track power

consumption, power mode, and more. EnergyTrace software can be used on any application through

Code Composer Studio IDE v6 or IAR Embedded Workbench. For more information, visit

www.ti.com/tool/energytrace.

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3.1.2.5 Board Movement Window

Figure 9 shows the board movement section. When the "motion detection" toggle box is checked, it

responds to 10 motions (see Figure 10 through Figure 16):

• Translation along the X, Y, or Z axis

• Positive or negative rotation around the X, Y, or Z axis

• No movement

Figure 9. Board Movement Window Figure 10. Translation Along the X Axis

Figure 11. Translation Along the Y Axis Figure 12. Translation Along the Z Axis

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Figure 13. Rotation Around the X Axis

Figure 14. Rotation Around the Y Axis

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Figure 15. Rotation Around the Z Axis

Figure 16. No Movement

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With both the OPT3001 tile on and the Light Sensing toggle box checked, the image darkens, whether or

not gesture recognition is enabled (see Figure 17).

Figure 17. Light Sensing in the Gesture Recognition Window

Board movement data is updated whenever the BMI160 is sampled; that is, it follows the same frequency

as the BMI160 drop-down selection box. If motion detection is not enabled, no related calculations are

done on the microcontroller and hence no update occurs.

Similarly, light sensing data is updated whenever the OPT3001 is sampled.

3.2 BOOSTXL-SENSORS_TI-RTOS_SensorGUI_MSP432P401R

This section describes the functionality structure of the BOOSTXL-

SENSORS_TI_RTOS_SensorGUI_MSP432P401R demo that is included in the MSP-EXP432P401R

Software Examples download, or more easily accessible through the SimpleLink MSP432 SDK (see

Section 4.6).

This example requires TI-RTOS MSP43x version 2_16_01_14 to be installed in CCS.

More information on the use of TI-RTOS can be found within the TI-RTOS User's Guide.

3.2.1 Source File Structure

Table 11 lists the source files and folders.

Table 11. Source Files and Folders

Name Description

OS: TI-RTOS Real-Time Operating System using TI-RTOS Kernel

Library: driverlib Device driver library (MSP432DRIVERLIB)

bme280.c Driver for communicating with the environmental sensor

bme280_support.c Support driver for communicating with the environmental sensor

bmi160.c Driver for communicating with the IMU and magnetometer sensors

bmi160_support.c Support driver for communicating with the IMU and magnetometer sensors

MSP_EXP432P401R.c Driver for setting up board specific items (for example, I2C and UART)

main.c The demo's main function, tasks, semaphores, global variables, and others

opt3001.c Driver for communicating with the ambient light sensor

tmp007.c Driver for communicating with the infrared temperature sensor

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3.2.2 Working With the GUI

Collaboration with the Sensor GUI is identical to Section 3.1.2, except for programming the device directly

from the GUI. The .out file located within the GUI is specific to the BOOSTXL-

SENSORS_SensorGUI_MSP432P401R example project. To download the program, you must use a

separate IDE, such as CCS or IAR, and the BOOSTXL-SENSORS_TI_RTOS_SensorGUI_MSP432P401R

source code found within MSP-EXP432P401R Software Examples.

3.3 BOOSTXL-SENSORS_TI-RTOS_SensorGUI_MSP430FR5994

This section describes the functionality structure of the BOOSTXL-

SENSORS_TI_RTOS_SensorGUI_MSP430FR5994 demo that is included in the MSP-EXP430FR5994

Software Examples download, or more easily accessible through MSP430Ware™ software (see

Section 4.6).

3.3.1 Source File Structure

Table 12 lists the source files and folders.

Table 12. Source Files and Folders

Name Description

Library: driverlib Device driver library (MSP432DRIVERLIB)

src/bme280.c Driver for communicating with the environmental sensor

src/bme280_support.c Support driver for communicating with the environmental sensor

src/bmi160.c Driver for communicating with the IMU and magnetometer sensors

src/bmi160_support.c Support driver for communicating with the IMU and magnetometer sensors

src/demo_sysctl.c Provides a small delay

src/i2c_driver.c Driver for I2C communication with the sensors

src/main.c The demo's main function, interrupt service routines, global variables, and others

src/opt3001.c Driver for communicating with the ambient light sensor

src/tmp007.c Driver for communicating with the infrared temperature sensor

src/uart_driver.c Driver for UART communication with the PC GUI

3.3.2 Working With the GUI

Collaboration with the Sensor GUI is identical to Section 3.1.2, except for programming the device directly

from the GUI. The .out file located within the GUI is specific to the BOOSTXL-

SENSORS_SensorGUI_MSP432P401R example project. To download the program, you must use a

separate IDE, such as CCS or IAR, and the BOOSTXL-SENSORS_SensorGUI_MSP430FR5994 source

code found in MSP-EXP430FR5994 Software Examples.

www.ti.com

Additional Resources

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

4 Additional Resources

4.1 TI LaunchPad Development Kit Portal

More information about LaunchPad development kits, supported BoosterPack plug-in modules, and

available resources can be found at:

•TI's LaunchPad portal: Information about all LaunchPad development kits from TI, for all

microcontrollers

4.2 TI Cloud Development Tools

TI's Cloud-based software development tools provide instant access to SimpleLink SDK content and a

web-based IDE.

4.2.1 TI Resource Explorer Cloud

TI Resource Explorer Cloud provides a web interface for browsing examples, libraries, and documentation

found in the SimpleLink SDK without having to download files to the local drive (see Figure 18).

Learn more about TI Resource Explorer Cloud at https://dev.ti.com/.

Figure 18. TI Resource Explorer Cloud

Additional Resources

www.ti.com

20 SLAU666B–June 2016–Revised May 2018

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4.2.2 Code Composer Studio Cloud

Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that lets you quickly create, edit, build,

and debug applications for the LaunchPad development kit (see Figure 19). No need to download and

install large software packages, simply connect the LaunchPad development kit and begin. You can

choose to select from a large variety of examples in the SimpleLink MSP432 SDK and Energia or develop

your own application. CCS Cloud IDE supports debug features such as execution control, breakpoints and

viewing variables.

A full comparison between CCS IDE Cloud and CCS Desktop is available here.

Learn more about Code Composer Studio Cloud IDE at https://dev.ti.com/.

Figure 19. CCS Cloud

www.ti.com

Additional Resources

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

4.3 Code Composer Studio IDE

Code Composer Studio IDE Desktop is a professional integrated development environment that supports

TI's microcontroller and Embedded Processors portfolio. Code Composer Studio IDE comprises a suite of

tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source

code editor, project build environment, debugger, profiler, and many other features.

Learn more about CCS IDE and download it at www.ti.com/tool/ccstudio.

CCS IDE v6.1 or higher is required. When CCS has been launched, and a workspace directory chosen,

use Project>Import Existing CCS Eclipse Project. Direct it to the desired demo's project directory that

contains main.c (see Figure 20).

Figure 20. Directing the Project>Import Function to the Demo Project

Selecting the \CCS subdirectory also works. The CCS-specific files are located there.

When you click OK, CCS should recognize the project and allow import.

Additional Resources

www.ti.com

22 SLAU666B–June 2016–Revised May 2018

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

The indication that CCS has found it is that the project appears in the Import CCS Eclipse Projects

window and has a checkmark to the left of it (see Figure 21).

Figure 21. When CCS Has Found the Project

Sometimes the CCS IDE finds the project but does not show a checkmark; this might mean that your

workspace already has a project by that name. You can resolve this by renaming or deleting that project.

Even if you do not see it in the CCS IDE workspace, be sure to check the workspace directory on the file

system.

4.4 IAR Embedded Workbench for TI MSP430 MCUs

IAR Embedded Workbench for MSP430™ MCUs is another very powerful integrated development

environment that allows you to develop and manage complete embedded application projects. IAR

Embedded Workbench integrates the IAR C/C++ Compiler, IAR Assembler, IAR ILINK Linker, editor,

project manager, command line build utility, and IAR C-SPY® Debugger.

Learn more about IAR Embedded Workbench for MSP430 and download it at www.iar.com/.

IAR 6.10 or higher is required. To open the demo in IAR, click File>Open>Workspace…, and browse to

the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is

contained within this file.

The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by

clicking Project>Add-Existing-Project….

Although the software examples have all of the code required to run them, IAR users may download and

install MSP430Ware software, which contains MSP430 MCU libraries and the TI Resource Explorer.

These are already included in a Code Composer Studio IDE installation (unless the user selected

otherwise).

www.ti.com

Additional Resources

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

4.5 Energia

Energia is a simple, open-source, and community-driven code editor that is based on the Wiring and

Arduino framework. Energia provides unmatched ease of use through very high-level APIs that can be

used across hardware platforms. Energia is a lightweight IDE that does not have the full feature set of

Code Composer Studio IDE or IAR Embedded Workbench IDE. However, Energia is great for anyone who

wants to get started very quickly or who does not have significant coding experience.

Learn more about Energia and download it at www.energia.nu.

4.6 SimpleLink MSP432 SDK, MSP430Ware Software, and TI Resource Explorer

The MSP432 device is part of the SimpleLink microcontroller (MCU) platform, which consists of Wi-Fi®,

Bluetooth®low energy, Sub-1 GHz, and host MCUs. All share a common, easy-to-use development

environment with a single core software development kit (SDK) and rich tool set. A one-time integration of

the SimpleLink platform lets you add any combination of devices from the portfolio into your design. The

ultimate goal of the SimpleLink platform is to achieve 100 percent code reuse when your design

requirements change. For more information, visit www.ti.com/simplelink.

For the MSP430 16-bit MCUs, the MSP430Ware software package is used. MSP430Ware software is a

complete collection of libraries and tools. It includes a driver library (driverlib) graphics library (grlib), and

many other software tools. MSP430Ware software is optionally included in a Code Composer Studio IDE

installation or can be downloaded separately. IAR users must download it separately.

Both the SimpleLink MSP432 SDK and the MSP430Ware software are included in the TI Resource

Explorer for easily browsing tools, documents, examples, and more (see Figure 22).

Figure 22. TI Drivers Software Examples in TI Resource Explorer

Inside TI Resource Explorer, these examples and many more can be found and easily imported into Code

Composer Studio IDE with one click.

Additional Resources

www.ti.com

24 SLAU666B–June 2016–Revised May 2018

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

4.7 The Community

4.7.1 TI E2E™ Online Community

Search the forums at e2e.ti.com. If you cannot find the answer, post a question to the community.

4.7.2 Community at Large

Many online communities focus on the LaunchPad development kit and BoosterPack plug-in module

ecosystem; for example, www.43oh.com. You can find additional tools, resources, and support from these

communities.

VDD VDD

GND VDD

GND

VDD

GND

VDD

GNDGND

VDD

GND

VDD

GND

GND VDD

GND

VDD VDD

100nF

0.01uF

10k

2.2k

OPT3001

TMP007

VDD

VDDIO

GND

GNDIO

INT1

INT2

9OSDO 11

OCSB 10

ASCL 3

CSB 12

ASDA 2

SDX 14

SDO 1

SCX 13

CSB A5

DRY

GND

INT

SCK A3

SDI B4

SDO C1

GND E1

GND E3

VDD

VDDIO

GND 1

CSB 2

SDI 3

SCK 4

SDO

VDDIO

GND2

VDD

C1 C2 C3 C4 C5 C6

VDD

ADDR

GND

GND SCL SCL

INT INT

SDA SDA

TH_PAD

T_PAD

ADR1

DGND DGND

AGND AGND

V+ V+

SCL SCL

SDA

ALERT

ADR0

GND

SCL

SDA

ASCL

ASDAASDA

INT2

OPT_INT

TMP_INT

MAG_INT

INT1

GPIO2

GPIO1

LP_SCL

LP_SDA

Texas Instruments

Mike Pridgen

1.1

BMI160

BMM150 12P

BME280

U4 BME280

1 2 3 4 5 6

BMI160 I2C Addresses: 0x69 (7 bit) BMM150 I2C Address: 0x13 (7 bit) BME280 I2C Address: 0x77 (7 bit address)

Place one pair near to

each of the Bosch sensor

TMP007 I2C Address: 0x40 (7 bit)

OPT3001 I2C Address: 0x47 (7 bit)

www.ti.com

Schematics

SLAU666B–June 2016–Revised May 2018

Submit Documentation Feedback

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

5 Schematics

Figure 23 shows the schematic. Hardware design files can be found in the BOOSTXL-SENSORS Hardware Design Files.

Figure 23. Schematics

Revision History

www.ti.com

26 SLAU666B–June 2016–Revised May 2018

Submit Documentation Feedback

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from March 6, 2017 to May 15, 2018 ................................................................................................................. Page

• Added that TMP007 infrared temperature sensor is no longer populated on board at end of Section 1.1,Introduction .... 3

• Changed list item to indicate that TMP007 infrared temperature sensor is no longer populated on board in Section 1.2,

Key Features............................................................................................................................... 3

• Added note that the TMP007 infrared temperature sensor is end-of-life and not populated in Section 2.1.3,TI TMP007

Temperature Sensor ...................................................................................................................... 5

STANDARD TERMS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance

with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not

finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For

clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions

set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,

or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production

system.

2Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License

Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by

neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have

been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications

or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control

techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)

business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit

User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty

period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or

replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be

warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day

warranty period.

3Regulatory Notices:

3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:

FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software

associated with the kit to determine whether to incorporate such items in a finished product and software developers to write

software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or

otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition

that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.

Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must

operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not

cause harmful interference, and (2) this device must accept any interference received, including interference that may cause

undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to

operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of

the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is

operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.

Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to

correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of

the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance

with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference

will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more

of the following measures:

•Reorient or relocate the receiving antenna.

•Increase the separation between the equipment and receiver.

•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

•Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:

(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may

cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation

est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit

accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)

gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type

and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for

successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types

listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited

for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et

d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage

radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope

rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le

présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le

manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne

non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de

l'émetteur

3.3 Japan

3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。

http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified

by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the

instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs

(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):

1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for

Enforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to

EVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan

with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note

that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けて

いないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの

措置を取っていただく必要がありますのでご注意ください。

1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。

2. 実験局の免許を取得後ご使用いただく。

3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社

東京都新宿区西新宿６丁目２４番１号

西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/

/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

3.4 European Union

3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):

This is a class A product intended for use in environments other than domestic environments that are connected to a

low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this

product may cause radio interference in which case the user may be required to take adequate measures.

4EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT

LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling

or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information

related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and

customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input

and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or

property damage. If there are questions concerning performance ratings and specifications, User should contact a TI

field representative prior to connecting interface electronics including input power and intended loads. Any loads applied

outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible

permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any

load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit

components may have elevated case temperatures. These components include but are not limited to linear regulators,

switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the

information in the associated documentation. When working with the EVM, please be aware that the EVM may become

very warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the

dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.

User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,

affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic

and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely

limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and

liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or

designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,

state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all

responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and

liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local

requirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate

as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as

accurate, complete, reliable, current, or error-free.

6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT

LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL

FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT

NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS

FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE

SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE

CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR

INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE

EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR

IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS

LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,

EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY

HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY

WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL

THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE

TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF

SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR

REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,

OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF

USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI

MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS

OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED

HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN

CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR

EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE

CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)

will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in

a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable

order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),

excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,

without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to

these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.

Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief

in any United States or foreign court.

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BOOSTXL SENSORS BoosterPack™ Plug In Module User's Guide (Rev. B) Sensor Booster Pack User Manual

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