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AMC7135
350mA ADVANCED CURRENT REGULATOR

www.addmtek.com
DESCRIPTION

FEATURES

The AMC7135 is a low dropout current regulator
rated for 350mA constant sink current. The low quiescent
current and low dropout voltage is achieved by advanced
Bi-CMOS process.

„

350mA constant sink current.

„

Output short / open circuit protection.

„

Low dropout voltage.

„

Low quiescent current

„

Supply voltage range 2.7V ~ 6V

„

2KV HBM ESD protection

„

Advanced Bi-CMOS process.

„

SOT-89 and TO-252 package

TYPICAL APPLICATION CIRCUIT

APPLICATIONS

„

Supply
Voltage
2.7V ~ 6V

Power LED driver

PACKAGE PIN OUT
C BP

VDD

OUT
VDD

VDD
GND

GND

AMC7135

OUT

GND

OUT
SOT-89

TO-252
(Top View)

ORDER INFORMATION
IOUT

PK

SOT-89

SJ

3-pin

TO-252
3-pin

340-380mA

AMC7135PKF

AMC7135SJF

300-340mA

AMC7135PKFA

AMC7135SJFA

Note:

1. All surface-mount packages are available in Tape & Reel. Append the letter “T” to part number (i.e. AMC7135PKFAT).
2. The letter ”F” is marked for Lead Free process.
3. The letter ”A” is marked for current ranking.

Copyright © 2007 ADDtek Corp.

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AMC7135
ABSOLUTE MAXIMUM RATINGS (Note)
-0.3V to 7V
-0.3V to 7V
150OC
-40OC to 150OC
260OC

Input Voltage, VDD
Output Voltage, VOUT
Maximum Junction Temperature, TJ
Storage Temperature Range
Lead Temperature (Soldering, 10 seconds)
Note:

Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground.
Currents are positive into, negative out of the specified terminal.

BLOCK DIAGRAM

VDD

AMC7135

Band-gap
Reference

OUT

Control
Circuit

GND

PIN DESCRIPTION
Pin Name

Pin Function

VDD

Power supply.

OUT

Output pins. Connected to load.

GND

Ground.

Copyright © 2007 ADDtek Corp.

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RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Output Sink Current
Operating Free-air Temperature Range

Symbol

Min

VDD
IOUT
TA

2.7

Typ

-40

Max

Unit

6
400
+85

V
mA
℃

DC ELECTRICAL CHARACTERISTICS
VDD=3.7V, TA=25°C, No Load, ( Unless otherwise noted)
Parameter

Symbol

Output Sink Current

ISINK

Condition

Min

Typ

Max

Unit

VOUT=0.2V

340

360

380

mA

VOUT=0.2V, Rank A

300

320

340

mA

Apply
Pin

Load Regulation

VOUT=0.2V to 3V

3

mA/V

Line Regulation

VDD= 3V to 6V,
VOUT=0.2V

3

mA/V

Output Dropout Voltage

VOUTL

120

mV

Supply Current Consumption

IDD

200

uA

OUT

VDD

Note 1: Output dropout voltage: 90% x IOUT @ VOUT=200mV

TYPICAL OPERATION CHRACTERISTICS
QUIESCENT CURRENT vs. TEMP

QUIESCENT CURRENT vs. SUPPLY VOLTAGE
0.17

0.22

0.16

0.2

0.15

0.18
IQ (mA)

IQ (mA)

0.14
0.13

0.16
0.14

0.12

0.12

0.11

0.1

0.10
2

2.5

3

3.5

20

4

40

60

80

100

TEMP (ºC)

VIN (V)

OUT CURRENT vs.OUT_DROPOUT VOLTAGE
400
350

OUT (mA)

300
250
200
150
100
50
0
0.01

0.1

1

10

OUT_DROPOUT (V)

Copyright © 2007 ADDtek Corp.

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APPLICATION INFORMATION

The Maximum Power Dissipation on Regulator:
PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IQ
VOUT(MAX) = the maximum voltage on output pin;
IOUT(NOM) = the nominal output current;
IQ = the quiescent current the regulator consumes at IOUT(MAX);
VIN(MAX) = the maximum input voltage.

Thermal Consideration:
The maximum junction temperature ratings of AMC7135 should not be exceeded under continuous normal load
conditions. When power consumption is over about 700mW (SOT-89 package, at TA=70°C) or 1000mW (TO-252
package, at TA=70°C), additional heat sink is required to control the junction temperature below 120°C.
The junction temperature is:

TJ = PD (θJT +θCS +θSA ) + TA
PD : Dissipated power.
θJT: Thermal resistance from the junction to the mounting tab of the package.
θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, θCS < 1.0°C /W)
θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size
of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through-hole vias.
PCB θSA (°C /W)
PCB heat sink size (mm2)

Copyright © 2007 ADDtek Corp.

59
500

45
1000

38
1500

4

33
2000

27
3000

24
4000

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21
5000

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AMC7135
PACKAGE

Copyright © 2007 ADDtek Corp.

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AMC7135
IMPORTANT NOTICE

ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service
without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing
orders, that the information being relied on is current.
A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe
property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or
warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of
ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks
associated with the customer’s applications, the customer should provide adequate design and operating safeguards.
ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of
its products to the specifications applicable at the time of sale.

ADDtek Corp.
9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105
TEL: 2-25700299
FAX: 2-25700196
Copyright © 2007 ADDtek Corp.

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