BSS123 Datasheet. Www.s Manuals.com. Philips

User Manual: Marking of electronic components, SMD Codes SA, SA***, SA-, SAG, SAH, SAW, SAp, SAt, sa**. Datasheets AP65201WU-7, BSS123, BSS123N3, BZX84J-B12, KTC4377, PT7M6102CHC4E, PT7M6102CHNE, PT7M6102CHTAE, RP130K341A, TLV70013DDCR, TS391AG-AF5, TS391AG-AL5.

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Philips Semiconductors

Product specification

N-channel TrenchMOS transistor
Logic level FET
FEATURES

BSS123

SYMBOL

• ’Trench’ technology
• Extremely fast switching
• Logic level compatible
• Subminiature surface mounting
package

QUICK REFERENCE DATA
d

VDSS = 100 V
ID = 150 mA
g

RDS(ON) ≤ 6 Ω (VGS = 10 V)
s

GENERAL DESCRIPTION

PINNING

N-channel enhancement mode
field-effect transistor in a plastic
envelope
using
’trench’
technology.
Applications:• Relay driver
• High-speed line driver
• Telephone ringer

PIN

SOT23
DESCRIPTION

1

gate

2

source

3

drain

3
Top view

1

2

The BSS123 is supplied in the
SOT23
subminiature
surface
mounting package.

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

VDSS
VDGR
VGS
ID
IDM
PD
Tj, Tstg

Tj = 25 ˚C to 150˚C
Tj = 25 ˚C to 150˚C; RGS = 20 kΩ

- 55

100
100
± 20
150
600
0.25
150

V
V
V
mA
mA
W
˚C

CONDITIONS

TYP.

MAX.

UNIT

surface mounted on FR4 board

500

-

K/W

Drain-source voltage
Drain-gate voltage
Gate-source voltage
Continuous drain current
Pulsed drain current
Total power dissipation
Operating junction and
storage temperature

Ta = 25 ˚C
Ta = 25 ˚C
Ta = 25 ˚C

THERMAL RESISTANCES
SYMBOL PARAMETER
Rth j-a

Thermal resistance junction
to ambient

August 2000

1

Rev 1.000

Philips Semiconductors

Product specification

N-channel TrenchMOS transistor
Logic level FET

BSS123

ELECTRICAL CHARACTERISTICS
Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER
V(BR)DSS
VGS(TO)
RDS(ON)

Drain-source breakdown
voltage
Gate threshold voltage
Drain-source on-state
resistance

CONDITIONS

MIN.

TYP. MAX. UNIT

VGS = 0 V; ID = 10 µA

100

130

-

V

VDS = VGS; ID = 1 mA
VGS = 10 V; ID = 120 mA

1
-

2
3.5

2.8
6

V
Ω

VDS = 25 V; ID = 120 mA

-

350

-

mS

-

10

100

nA

-

10

100

nA

-

3

10

ns

-

12

20

ns

-

23
6
4

40
25
10

pF
pF
pF

gfs

Forward transconductance

IDSS
IGSS

Zero gate voltage drain
VDS = 60 V; VGS = 0 V
current
Gate source leakage current VGS = ±20 V; VDS = 0 V

ton

Turn-on time

toff

Turn-off time

Ciss
Coss
Crss

Input capacitance
Output capacitance
Feedback capacitance

August 2000

VDD = 50 V; RD = 250 Ω; VGS = 10 V;
RG = 50 Ω; Resistive load
VGS = 0 V; VDS = 25 V; f = 1 MHz

2

Rev 1.000

Philips Semiconductors

Product specification

N-channel TrenchMOS transistor
Logic level FET

BSS123

MECHANICAL DATA
Plastic surface mounted package; 3 leads

SOT23

D

E

B

A

X

HE

v M A

3

Q
A
A1

1

2
e1

bp

c
w M B

Lp

e
detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)
UNIT

A

mm

1.1
0.9

OUTLINE
VERSION

A1
max.

bp

c

D

E

0.1

0.48
0.38

0.15
0.09

3.0
2.8

1.4
1.2

e
1.9

e1

HE

Lp

Q

v

w

0.95

2.5
2.1

0.45
0.15

0.55
0.45

0.2

0.1

REFERENCES
IEC

JEDEC

EIAJ

EUROPEAN
PROJECTION

ISSUE DATE
97-02-28

SOT23

Fig.1. SOT23 surface mounting package.
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static
discharge during transport or handling.
2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.
3. Epoxy meets UL94 V0 at 1/8".

August 2000

3

Rev 1.000

Philips Semiconductors

Product specification

N-channel TrenchMOS transistor
Logic level FET

BSS123

DEFINITIONS
Data sheet status
Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification

This data sheet contains final product specifications.

Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

August 2000

4

Rev 1.000

www.s-manuals.com



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