FDG6301N Datasheet. Www.s Manuals.com. Fairchild

User Manual: Marking of electronic components, SMD Codes 01, 01**, 010*, 014N03LS, 014N03MS, 016N03LS, 016N03MS, 016N04LS, 016b*, 017**, 017N04NS, 018N04LS, 019N02KS, 019N04NS. Datasheets BSC014N03LS G, BSC014N03MS G, BSC016N03LS G, BSC016N03MS G, BSC016N04LS G, BSC017N04NS G, BSC018N04LS G, BSC019N02KS G, BSC019N04NS G, EC49016X-F, FDG6301N, MT2301, SE9017, SSTPAD100, STP7401S32RG.

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July 1999

FDG6301N

Dual N-Channel, Digital FET

General Description Features

*The pinouts are symmetrical; pin 1 and 4 are interchangeable.

Units inside the carrier can be of either orientation and will not affect the functionality of the device.

Absolute Maximum Ratings TA = 25°C unless otherwise noted

Symbol Parameter FDG6301NUnits

VDSS Drain-Source Voltage 25 V

VGSS Gate-Source Voltage 8V

IDDrain/Output Current - Continuous 0.22 A

- Pulsed 0.65

PDMaximum Power Dissipation (Note 1)0.3 W

TJ,TSTG Operating and Storage Temperature Range -55 to 150 °C

ESD Electrostatic Discharge Rating MIL-STD-883D

Human Body Model(100 pF / 1500 Ω)

6.0 kV

THERMAL CHARACTERISTICS

RθJA Thermal Resistance, Junction-to-Ambient 415 °C/W

FDG6301N Rev.E1

25 V, 0.22 A continuous, 0.65 A peak.

RDS(ON) = 4 Ω @ VGS= 4.5 V,

RDS(ON) = 5 Ω @ VGS= 2.7 V.

Very low level gate drive requirements allowing direct

operation in 3 V circuits (VGS(th) < 1.5 V).

Gate-Source Zener for ESD ruggedness

(>6kV Human Body Model).

Compact industry standard SC70-6 surface mount

package.

These dual N-Channel logic level enhancement mode

field effect transistors are produced using Fairchild's

proprietary, high cell density, DMOS technology. This

very high density process is especially tailored to

minimize on-state resistance. This device has been

designed especially for low voltage applications as a

replacement for bipolar digital transistors and small

signal MOSFETs.

SOT-23 SuperSOTTM-8 SO-8 SOT-223

SC70-6 SuperSOTTM-6

1 or 4 *6 or 3

5 or 2

4 or 1 *

2 or 5

3 or 6

SC70-6

G1D2

S1

D1

S2

G2

.01

Electrical Characteristics (TA = 25 OC unless otherwise noted )

Symbol Parameter Conditions Min Typ Max Units

OFF CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 25 V

∆BVDSS/∆TJBreakdown Voltage Temp. Coefficient ID = 250 µA, Referenced to 25 o C25 mV / oC

IDSS Zero Gate Voltage Drain Current VDS = 20 V, VGS = 0 V 1µA

TJ = 55°C 10 µA

IGSS Gate - Body Leakage Current VGS = 8 V, VDS = 0 V 100 nA

ON CHARACTERISTICS (Note 2)

VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA0.65 0.85 1.5 V

∆VGS(th)/∆TJGate Threshold Voltage Temp.Coefficient ID = 250 µA, Referenced to 25 o C-2.1 mV / oC

RDS(ON) Static Drain-Source On-Resistance VGS = 4.5 V, ID = 0.22 A 2.6 4Ω

TJ =125°C 5.3 7

VGS = 2.7 V, ID = 0.19 A 3.7 5

ID(ON) On-State Drain Current VGS = 4.5 V, VDS = 5 V 0.22 A

gFS Forward Transconductance VDS = 5 V, ID= 0.22 A 0.2 S

DYNAMIC CHARACTERISTICS

Ciss Input Capacitance VDS = 10 V, VGS = 0 V,

f = 1.0 MHz 9.5 pF

Coss Output Capacitance 6 pF

Crss Reverse Transfer Capacitance 1.3 pF

SWITCHING CHARACTERISTICS (Note 2)

tD(on)Turn - On Delay Time VDD = 5 V, ID = 0.5 A,

VGS = 4.5 V, RGEN = 50 Ω510 ns

trTurn - On Rise Time 4.5 10 ns

tD(off) Turn - Off Delay Time 4 8 ns

tfTurn - Off Fall Time 3.2 7ns

QgTotal Gate Charge VDS = 5 V, ID = 0.22 A,

VGS = 4.5 V 0.29 0.4 nC

Qgs Gate-Source Charge 0.12 nC

Qgd Gate-Drain Charge 0.03 nC

DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS

ISMaximum Continuous Source Current 0.25 A

VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 0.25 A (Note 2)0.8 1.2 V

Notes:

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed

by design while RθCA is determined by the user's board design. RθJA = 415OC/W on minimum pad mounting on FR-4 board in still air.

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

FDG6301N Rev.E1

FDG6301N Rev.E1

Typical Electrical Characteristics

Figure 1. On-Region Characteristics.Figure 2. On-Resistance Variation with

Drain Current and Gate Voltage.

Figure 3. On-Resistance Variation

with Temperature.

Figure 5. Transfer Characteristics.

Figure 4. On-Resistance Variation with

Gate-to-Source Voltage.

-50 -25 0 25 50 75 100 125 150

0.6

0.8

1

1.2

1.4

1.6

1.8

T , JUNCTION TEMPERATURE (°C)

DRAIN-SOURCE ON-RESISTANCE

J

R , NORMALIZED

DS(ON)

V = 4.5V

GS

I = 0.22A

D

012345

0

0.1

0.2

0.3

0.4

0.5

V , DRAIN-SOURCE VOLTAGE (V)

I , DRAIN-SOURCE CURRENT (A)

V =4.5V

GS

DS

D

2.5V

3.0V

2.0V

3.5V

2.7V

00.1 0.2 0.3 0.4

2

2.5

3

3.5

4

4.5

5

I , DRAIN CURRENT (A)

DRAIN-SOURCE ON-RESISTANCE

V = 2.5V

GS

D

R , NORMALIZED

DS(ON)

5.0V

4.5V

2.7V

4.0V

3.5V

3.0V

1 2 3 4 5

0

4

8

12

16

20

V ,GATE TO SOURCE VOLTAGE (V)

R , ON-RESISTANCE(OHM)

GS

DS(ON)

25°C

I = 0.10A

D

T =125°C

A

0.5 11.5 22.5 3

0

0.05

0.1

0.15

0.2

V , GATE TO SOURCE VOLTAGE (V)

I , DRAIN CURRENT (A)

V = 5V

DS

GS

D

T = -55°C

J

125°C

25°C

00.2 0.4 0.6 0.8 11.2

0.0001

0.001

0.01

0.1

0.4

V , BODY DIODE FORWARD VOLTAGE (V)

I , REVERSE DRAIN CURRENT (A)

25°C

-55°C

V = 0V

GS

SD

S

T = 125°C

J

Figure 6. Body Diode Forward Voltage

Variation with Source Current

and Temperature.

FDG6301N Rev.E1

Figure 10. Single Pulse Maximum Power

Dissipation.

Figure 8. Capacitance Characteristics.

Figure 7. Gate Charge Characteristics.

Figure 9. Maximum Safe Operating Area.

Typical Electrical Characteristics ( continued)

00.1 0.2 0.3 0.4 0.5 0.6

0

1

2

3

4

5

6

Q , GATE CHARGE (nC)

V , GATE-SOURCE VOLTAGE (V)

g

GS

I = 0.22A

DV = 5V

DS 10V

0.4 0.8 2 5 10 25 40

0.01

0.03

0.1

0.3

1

V , DRAIN-SOURCE VOLTAGE (V)

I , DRAIN CURRENT (A)

RDS(ON) LIMIT

D

DC

DS

10s

100ms

10ms

V = 4.5V

SINGLE PULSE

R = 415 °C/W

T = 25°C

θJA

GS

A

1s

0.1 0.3 1 3 10 25

2

3

5

8

15

30

V , DRAIN TO SOURCE VOLTAGE (V)

CAPACITANCE (pF)

DS

C

iss

f = 1 MHz

V = 0 V

GS

C

oss

C

rss

0.0001 0.001 0.01 0.1 110 200

0

10

20

30

40

50

SINGLE PULSE TIME (SEC)

POWER (W)

SINGLE PULSE

R =415°C/W

T = 25°C

θJA

A

0.0001 0.001 0.01 0.1 1 10 100 200

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

TRANSIENT THERMAL RESISTANCE

r(t), NORMALIZED EFFECTIVE

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

1 2

T - T = P * R (t)

A

J

P(pk)

t

1 t

2

θJA

R (t) = r(t) * R

R =415 °C/W

θJA

θJA

θJA

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in note 1.

Transient thermal response will change depending on the circuit board design.

SC70-6 Unit Orientation

SC70-6 Packaging

Configuration: Figure 1.0

Components Leader Tape

500mm minimum or

125 empty pockets

Trailer Tape

300mm minimum or

75 empty pockets

SC70-6 Tape Leader and Trailer

Configuration: Figure 2.0

Cover Tape

Carrier Tape

Note/Comments

Packaging Option

SC70-6 Packaging Information

Standard

(no flow code) D87Z

Packaging type

Reel Size

TNR

7" Dia

TNR

13"

Qty per Reel/Tube/Bag 3,000 10,000

Box Dimension (mm) 184x187x47 343x343x64

Max qty per Box 9,000 30,000

Weight per unit (gm) 0.0055 0.0055

Weight per Reel (kg) 0.1140 0.3960

F63TNR

Label

Customized Label

Antistatic Cover Tape

184mm x 187mm x 47mm

Pizza Box for Standard Option

F63TNR

Label

F63TNR Barcode Label

F63TNR Label sample

343mm x 342mm x 64mm

Intermediate box for D87Z Option

21 21 21 21

F63TNR

Label

21

Pin 1

LOT: CBVK741B019

FSID: FDG6302P

D/C1: D9842 QTY1: SPEC REV:

SPEC:

QTY: 3000

D/C2: QTY2: CPN: N/F: F (F63TNR)3

Packaging Description:

SC70-6 parts are shipped in tape. The carrier tape is

made from a dissipative (carbon filled) polycarbonate

resin. The cover tape is a multilayer film (Heat Activated

Adhesive in nature) primarily composed of polyester film,

adhesive layer, sealant, and anti-static sprayed agent.

These reeled parts in standard option are shipped with

3,000 units per 7" or 177cm diameter reel. The reels are

dark blue in color and is made of polystyrene plastic (anti-

static coated). Other option comes in 10,000 units per 13"

or 330cm diameter reel. This and some other options are

described in the Packaging Information table.

These full reels are individually barcode labeled and

placed inside a pizza box (illustrated in figure 1.0) made of

recyclable corrugated brown paper with a Fairchild logo

printing. One pizza box contains three reels maximum.

And these pizza boxes are placed inside a barcode

labeled shipping box which comes in different sizes

depending on the number of parts shipped.

Static Dissipative

Embossed Carrier Tape

SC70-6 Tape and Reel Data and Package Dimensions

August 1999, Rev. C

SC70-6 Tape and Reel Data and Package Dimensions, continued

July 1999, Rev. C

P1

A0 D1

P0

F

W

E1

D0

E2

B0

Tc

Wc

K0

T

Dimensions are in inches and millimeters

Tape Size Reel

Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)

8mm 7" Dia 7.00

177.8 0.059

1.5 0.512 +0.020/-0.008

13 +0.5/-0.2 0.795

20.2 2.165

55 0.331 +0.059/-0.000

8.4 +1.5/0 0.567

14.4 0.311 – 0.429

7.9 – 10.9

8mm 13" Dia 13.00

330 0.059

1.5 0.512 +0.020/-0.008

13 +0.5/-0.2 0.795

20.2 4.00

100 0.331 +0.059/-0.000

8.4 +1.5/0 0.567

14.4 0.311 – 0.429

7.9 – 10.9

See detail AA

Dim A

max

13" Diameter Option

7" Diameter Option

Dim A

Max

See detail AA

W3

W2 max Measured at Hub

W1 Measured at Hub

Dim N

Dim D

min

Dim C

B Min

DETAIL AA

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481

rotational and lateral movement requirements (see sketches A, B, and C).

20 deg maximum component rotation

0.5mm

maximum

0.5mm

maximum

Sketch C (Top View)

Component lateral movement

Typical

component

cavity

center line

20 deg maximum

Typical

component

center line

B0

A0

Sketch B (Top View)

Component Rotation

Sketch A (Side or Front Sectional View)

Component Rotation

User Direction of Feed

SC70-6 Embossed Carrier Tape

Configuration: Figure 3.0

SC70-6 Reel Configuration: Figure 4.0

Dimensions are in millimeter

Pkg type

A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc

SC70-6

(8mm)

2.24

+/-0.10 2.34

+/-0.10 8.0

+/-0.3 1.55

+/-0.05 1.125

+/-0.125 1.75

+/-0.10 6.25

min 3.50

+/-0.05 4.0

+/-0.1 4.0

+/-0.1 1.20

+/-0.10 0.255

+/-0.150 5.2

+/-0.3 0.06

+/-0.02

SC70-6 (FS PKG Code 76)

SC70-6 Tape and Reel Data and Package Dimensions, continued

September 1998, Rev. A1

1:1

Scale 1:1 on letter size paper

Dimensions shown below are in:

inches [millimeters]

Part Weight per unit (gram): 0.0055

TRADEMARKS

ACEx™

CoolFET™

CROSSVOLT™

E2CMOSTM

FACT™

FACT Quiet Series™

FAST®

FASTr™

GTO™

HiSeC™

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is

not intended to be an exhaustive list of all such trademarks.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant into

the body, or (b) support or sustain life, or (c) whose

failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be

reasonably expected to result in significant injury to the

user.

2. A critical component is any component of a life

support device or system whose failure to perform can

be reasonably expected to cause the failure of the life

support device or system, or to affect its safety or

effectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information

Preliminary

No Identification Needed

Obsolete

This datasheet contains the design specifications for

product development. Specifications may change in

any manner without notice.

This datasheet contains preliminary data, and

supplementary data will be published at a later date.

Fairchild Semiconductor reserves the right to make

changes at any time without notice in order to improve

design.

This datasheet contains final specifications. Fairchild

Semiconductor reserves the right to make changes at

any time without notice in order to improve design.

This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.

The datasheet is printed for reference information only.

Formative or

In Design

First Production

Full Production

Not In Production

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER

NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD

DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT

RIGHTS, NOR THE RIGHTS OF OTHERS.

TinyLogic™

UHC™

VCX™

ISOPLANAR™

MICROWIRE™

POP™

PowerTrench™

QFET™

QS™

Quiet Series™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

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