LG Flatron W1934S Service Manual. Www.s Manuals.com. Manual

User Manual: LCD Monitor LG Flatron W1934S - Service manuals and Schematics. Free.

Open the PDF directly: View PDF .
Page Count: 50

#EV#

Website:http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.html

COLOR MONITOR

SERVICE MANUAL

CHASSIS NO. :

MODEL:

W1934S

(W1934S-

SNI/W1934S-BNI.Axx*QP)

xx * means sales region and module type

(AxxIQP: INL 5ms, AxxQQP: CMO 5ms, AxxYQP: IVO 5ms)

CAUTION

BEFORE SERVICING THE UNIT,

READ THE

SAFETY PRECAUTIONS

IN THIS MANUAL.

*To apply the MSTAR Chip.

CONTENTS

SPECIFICATIONS ...................................................

PRECAUTIONS .......................................................

TIMING CHART

.......................................................

DISASSEMBLY

........................................................ 9

BLOCK DIAGRAM...................................................11

DISCRIPTION OF BLOCK DIAGRAM

...................

ADJUSTMENT ......................................................

SERVICE OSD

............................................... .........16

TROUBLESHOOTING GUIDE

..............................

WIRING DIAGRAM

...............................................

EXPLODED VIEW

................................................... 25

REPLACEMENT PARTS LIST

............................... 27

SCHEMATIC DIAGRAM

.........................................

SPECIFICATIONS

1. LCD CHARACTERISTICS

Type

: TFT Color LCD Module

Active Display Area

: 19 inch

Pixel Pitch

: 0.285(H) x 0.285(V)

Color Depth

: 16.7M colors

3-3. Operating Frequency:

40~80 KHz

. Max. Resolution

D-sub Analog: 1440 x 900 @ 75Hz

5. POWER SUPPLY

5-1. Power

: AC 90~264V, 47.5~63Hz, <0.8A

5-2. Power Consumption

Size

410.4mm (H)*256.5mm (V)

Electrical Interface

: LVDS

Surface Treatment

: Hard-coating (3H),

Haze=25% Anti-Glare

treatment

Operating Mode

Normally White,

Transmissive mode

Backlight Unit

: Top/Bottom edge side 4-CCFL

(Cold Cathode Fluorescent Lamp)

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio

(a) For

InnoLux

MT190AW01 V.5

Left 70°/Right 70°; Top 70°/Bottom 70°

at Min CR≥10

(b) For CMO

M190A1-L07 panel

Left 75°/Right75°; Top 70°/Bottom 70°

at Min CR≥10

panel

H 140(min),160(typ),V 140(min) 160(typ)CR≥10

2-2. Luminance

(a) For InnoLux MT190AW01 V.5

panel: 300cd/m2 (Typ.)

220cd/m2 (Min.) (6500k);170 cd/m2 (Min.)(9300k)

(b)

For

CMO M190A1-L07 panel: 300cd/m2 (Typ.)

220cd/m2 (Min.) (6500k);170 cd/m2 (Min.)(9300k)

(b)

For

IVO M190MWW1-201 panel: 300cd/m2 (Typ.)

220cd/m2 (Min.) (6500k);170 cd/m2 (Min.)(9300k)

2-3. Contrast Ratio

(a) For

InnoLux

MT190AW01 V.5 1000:1 Typical

(b) For CMO

M190A1-L07 panel: 1000:1 Typical

panel: 800:1 Typical

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

Type

Separate Sync, Composite, and

SOG (Sync On Green)

3-2. Video Input Signal

1) Type

: R, G, B Analog

2) Voltage Level

: 0~0.71 V

3) Input Impedance

6. ENVIRONMENT

6-1. Operating Temperature

0°C to 40°C

6-2. Relative Humidity

20% to 90%

6-3. MTBF

60,000 HRS with 90% Confidence

Lamp Life

: 60,000 Hours (Min)

7. DIMENSIONS (with TILT/SWIVEL)

Width:

434.8mm

Depth:

180mm (W Base), 75.5mm (W/O

Base)

Height:

370mm (W Base), 287.8mm (W/O Base)

8. WEIGHT (with TILT/SWIVEL)

Net. Weight :

3.615+/-0.5Kg(IVO);3.655+/-

0.5Kg(V5);3.355+/-0.5Kg(INL)

Gross Weight:

4.7+/-0.5Kg (IVO); 4.7+/-0.5Kg (V5); 4.4+/-

0.5Kg (INL)

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD

monitor that are important for safety. These parts are

marked on the schematic diagram and

the replacement parts list. It is essential that these

critical parts should be replaced with the

manufacturer’s specified parts to prevent electric

shock, fire or other hazard.

• Do not modify original design without obtaining written

permission from manufacturer or you will void the

original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged

in four corners.

• Do not press on the panel, edge of the frame strongly

or electric shock as this will result in damage to the

screen.

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL)

or inverter circuit, must disconnect the AC

adapter because high voltage appears at inverter

circuit about

650Vrms.

• Handle with care wires or connectors of the

inverter circuit. If the wires are pressed cause short

and may burn or take fire.

• Be careful while tilting and rotating the monitor to

avoid pinching hand(s)

Leakage Current Hot Check Circuit

AC Volt-meter

Good Earth Ground

such as WATER PIPE,

• Protect the module from the ESD as it may damage the

electronic circuit (C-MOS).

• Make certain that treatment person’s body is

grounded through wrist band.

• Do not leave the module in high temperature and in

areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within

the module.

• If the surface of panel become dirty, please wipe it off

with a soft material. (Cleaning with a dirty or rough cloth

may damage the panel.)

To Instrument's

exposed METALLIC

PARTS

1.5 Kohm/10W

CONDUIT etc.

CAUTION

Please use only a plastic screwdriver to protect yourself

from shock hazard during service operation.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read

and follow the SAFETY PRECAUTIONS on page 3 of this

publication.

NOTE:

If unforeseen circumstances create conflict

between the following servicing precautions and any of the

safety precautions on page 3 of this publication, always

follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC

power source before;

a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect

polarity installation of electrolytic capacitors may

result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltage

measuring device (DVM, FETVOM, etc) equipped with a

suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first

connecting one end of an insulated clip lead to the

degaussing or kine aquadag grounding system shield

at the point where the picture tube socket ground lead is

connected, and then (b) touch the other end of the

insulated clip lead to the picture tube anode button,

using an insulating handle to avoid personal contact

with high voltage.

4. Do not spray chemicals on or near this receiver or any of

its assemblies.

5. Unless specified otherwise in this service manual,

clean electrical contacts only by applying the following

mixture to the contacts with a pipe cleaner, cotton-

tipped stick or comparable non-abrasive applicator;

10% (by volume) Acetone and 90% (by volume)

isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual,

lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks

with which receivers covered by this service manual

might be equipped.

7. Do not apply AC power to this instrument and/or any of

its electrical assemblies unless all solid-state device

heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the

receiver chassis ground before connecting the test

receiver positive lead.

Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap

to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be

damaged easily by static electricity. Such components

commonly are called Electrostatically Sensitive (ES)

Devices. Examples of typical ES devices are integrated

circuits and some field-effect transistors

and semiconductor "chip" components. The

following techniques should be used to help reduce the

incidence of component damage caused by static by static

electricity.

1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain

off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a

commercially available discharging wrist strap device,

which should be removed to prevent potential shock

reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with

ES devices, place the assembly on a conductive

surface such as aluminum foil, to prevent electrostatic

charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or

unsolder ES devices.

4. Use only an anti-static type solder removal device.

Some solder removal devices not classified as "anti-

static" can generate electrical charges sufficient to

damage ES devices.

5. Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ES

devices.

6. Do not remove a replacement ES device from its

protective package until immediately before you are

ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by

conductive foam, aluminum foil or comparable

conductive material).

7. Immediately before removing the protective material

from the leads of a replacement ES device, touch the

protective material to the chassis or circuit assembly

into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis

or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or

the lifting of your foot from a carpeted floor

can generate static electricity sufficient to damage an

ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tip

temperature within the range or 500。F to 600。F.

2. Use an appropriate gauge of RMA resin-core solder

composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a

mall wire-bristle (0.5 inch, or 1.25cm) brush with a

metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal

temperature.

(500。F to 600。F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal

temperature (500。F to 600。F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and

hold it there only until the solder flows onto and

around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the

circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle

brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong)

through which the IC leads are inserted and then bent flat

against the circuit foil. When holes are the slotted type,

the following technique should be used to remove and

replace the IC. When working with boards using the

familiar round hole, use the standard technique as

outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation

by gently prying up on the lead with the soldering iron

tip as the solder melts.

2. Draw away the melted solder with an anti-static

suction-type solder removal device (or with solder

braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad

and solder it.

3. Clean the soldered areas with a small wire-bristle

brush. (It is not necessary to reapply acrylic coating to

the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as

close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads

remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the

corresponding leads extending from the circuit board

and crimp the "U" with long nose pliers to insure metal

to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor

leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the

circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close

as possible to diode body.

2. Bend the two remaining leads perpendicular y to the

circuit board.

3. Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuit

board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the

solder joints of the two "original" leads. If they are not

shiny, reheat them and if necessary, apply additional

solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board

hollow stake.

2. Securely crimp the leads of replacement component

around notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the

replaced component and adjacent components and the

circuit board to prevent excessive

component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed

circuit board will weaken the adhesive that bonds the foil to

the circuit board causing the foil to separate from or

"lift-off" the board. The following guidelines and

procedures should be followed whenever this condition is

encountered.

At IC Connections

To repair a defective copper pattern at IC connections use

the following procedure to install a jumper wire on the

copper pattern side of the circuit board. (Use this

technique only on IC connections).

1. Carefully remove the damaged copper pattern with a

sharp knife. (Remove only as much copper as

absolutely necessary).

2. carefully scratch away the solder resist and acrylic

coating (if used) from the end of the remaining copper

pattern.

3. Bend a small "U" in one end of a small gauge jumper

wire and carefully crimp it around the IC pin. Solder the

IC connection.

4. Route the jumper wire along the path of the out-away

copper pattern and let it overlap the previously scraped

end of the good copper pattern. Solder the overlapped

area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper

pattern at connections other than IC Pins. This technique

involves the installation of a jumper wire on the

component side of the circuit board.

1. Remove the defective copper pattern with a sharp

knife.

Remove at least 1/4 inch of copper, to ensure that a

hazardous condition will not exist if the jumper wire

opens.

2. Trace along the copper pattern from both sides of the

pattern break and locate the nearest component that is

directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead

of the nearest component on one side of the pattern

break to the lead of the nearest component on the

other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire

is dressed so the it does not touch components or

sharp edges.

TIMING CHART

VIDEO

D B

SYNC

distingis

hment

Polo

rity

DOT

CLOCK

[MHz]

Frequency

[kHz]/ [Hz]

Total period

(E)

Display

(A)

Front

Porch

(D)

Sync.

(C)

Back

Porch

(B)

Resolutio

H(Pixels) + 31.469 800 640 16 96 48

V(Lines) -

25.175

70.8 449 350 37 2 60

640 x 350

H(Pixels) - 31.468 900 720 18 108 54

2 V(Lines) +

28.321

70.09 449 400 12 2 35

720 X 400

H(Pixels) - 31.469 800 640 16 96 48

3 V(Lines) -

25.175

59.94 525 480 10 2 33

640 x 480

H(Pixels) - 37.5 840 640 16 64 120

4 V(Lines) -

31.5

75 500 480 1 3 16

640 x 480

H(Pixels) + 37.879 1056 800 40 128 88

5 V(Lines) +

40.0

60.317 628 600 1 4 23

800 x 600

H(Pixels) + 46.875 1056 800 16 80 160

6 V(Lines) +

49.5

75.0 625 600 1 3 21

800 x 600

H(Pixels) +/- 49.725 1152 832 32 64 224

7 V(Lines) +/-

57.283

74.55 667 624 1 3 39

832 x 624

H(Pixels) - 48.363 1344 1024 24 136 160

8 V(Lines) -

65.0

60.0 806 768 3 6 29

1024 x 768

H(Pixels) - 60.123 1312 1024 16 96 176

9 V(Lines) -

78.75

75.029 800 768 1 3 28

1024 x 768

H(Pixels) +/- 68.681 1456 1152 32 128 144

10 V(Lines) +/-

100.0

75.062 915 870 3 3 39

1152 x 870

H(Pixels) +/- 61.805 1504 1152 18 134 200

11 V(Lines) +/-

92.978

65.96 937 900 2 4 31

1152 x 900

H(Pixels) + 63.981 1688 1280 48 112 248

12 V(Lines) +

108.0

60.02 1066 1024 1 3 38

1280 x 1024

H(Pixels) + 79.976 1688 1280 16 144 248

13 V(Lines) +

135.0

75.035 1066 1024 1 3 38

1280 x 1024

14 H(Pixels) + 88.750 55.5 1600 1440 48 32 80 1440 x 900

V(Lines) - 59.90 926 900 3 6 17

H(Pixels) - 55.935 1904 1440 80 152 232

V(Lines) +

106.500

59.887 934 900 3 6 25

1440x 900

H(Pixels) - 70.635 1936 1440 96 152 248

V(Lines) +

136.750

74.984 942 900 3 6 33

1440x 900

DISASSEMBLY

BLOCK DIAGRAM

DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the

digital video signal using a pixel clock.

The pixel clock for each mode is generated by the PLL.

The range of the pixel clock is from 25MHz to 135MHz.

This part consists of the Scaler, ADC convertor and LVDS transmitter.

The Scaler gets the video signal converted analog to digital, interpolates input to 1440 X 900 resolution signal and

outputs 8-bit R, G, B signal to transmitter.

2. Power Part.

This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.

14V is provided for inverter, 14V is provided for LCD panel and 5V for micom.

Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.

The inverter converts from DC14V to AC 700Vrms and operates back-light lamps of module.

3. MICOM Part.

This part is include video controller part. And this part consists of EEPROM IC which stores control data, and the

Micom which imbedded in scaler IC.

The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.

The controlled data of each modes is stored in EEPROM.

LIPS Board Block Diagram

Operation description_LIPS

1. EMI components.

This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the

circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.

This part function is transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to

adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the

over power protection is also monitor by this part.

5. Photo-Coupler isolation.

This part function is to feed back the dc output changing status through a photo transistor to primary controller to

achieve the stabilized dc output voltage.

6. Signal collection.

This part function is to collect the any change from the dc output and feed back to the primary through photo

transistor.

50-60HZ

ADJUSTMENT

1. Software

a. port95nt.exe

b. Edid.exe

c. Writing data: Mars W1934

2. Hardware

a. PC（winXP, win2000 or win98）1 pc；

b. Writing tools（Including EDID writing card、connecting cable etc.）

3. EDID Writing Connection

4. EDID Writing SOP:

a. Select “File＂ submenu，select “Auto Write”.

Figure 1 Figure 2 Figure 3

b. Select “Model” of main menu. Password: 1234

c. Select written model W1934S

d. Input product serial number (The SN is 12 numbers) in “S/N”Column, then the program auto writing start.

SERVICE OSD

1) Press MENU Key and Power Key, Monitor Will Enter Service OSD.

2) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) Auto Color : W/B balance and Automatically sets the gain and offset value.

b) NVRAM INIT : EEPROM initialize.(24C04)

c) CLEAR ETI : To initialize using time.

d) AGING : Select Aging mode(on/off).

e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.

f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.

g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)

h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)

i) MODULE : Show Current module Type

j)RS232: Enable/Disable Debug Mode(on/off)

k)SRGB:Allows you to set the sRGB value manually

Insert to

Parallel Port

on PC

ISP Board LCD

Monitor D-

Sub

Parallel

Port

D-SUB

15PIN

Figure 1.Cable Connection For ISP

TROUBLESHOOTING GUIDE

1. No Power & Power LED Off

owe

Check primary

rectifier volta

Check IC802,

C805, T801

Check circuit

if short

Check F801, P801,

D801

Check pin3 of

IC802 voltage

about 1V

Check R801, R805,

R822, R823, R817

Check pin2 of IC802

volta

e about 2V

Check R803, R807,

R824, R825

Check pin1 of IC802

Check R812, R816,

C818

END

2. Backlight can’t be turned on

END

No raster?

LED Green?

Yes

Backlight can’t be

turned on.

Check power supply

Is there high-level

voltage on pin10 of IC501? No Is Ok R526? Check I/F board

Yes

R526 open

Yes

Is there instantaneously pulse

wave on pin1, pin3, pin15 of IC501

at the moment of restart?

No Is Ok IC501? Yes U501, U502 fail

No IC501 fail

Yes

Is ok T501, T502? T501, T502 fail

Are connected rightly CN501,

CN502, CN503 and CN504?

No Connecting the

output

connector

Yes

Is there 5Vdc voltage on

pin2 of IC501?

Yes

Check feedback circuit

Isen,Vsen.(D503,D504,D501,D50

3. DC output voltage is unstable

Check R810, R811

Check feedback

circuit Check Vpin3-4 of

IC801 about 6V

Check Vpin1-2 of

IC801 about 1V

Check C815,

D806, R812

Check R809,

R814

END

Output Voltage Unstable

Check Vbe of

Q801 below 0.3V Check circuit if

short

Check ZD801,

ZD802, ZD803,

D803

D805

Check Q801, Q802

Check reference

voltage

Check Pin R of

IC803 voltage

about 2.5V

Check R809,

R814, IC801,

R818

4. Output power is unstable

Check the R pin

voltage of IC803

about 2.5V

Check R809, R808,

R814, D809

Check D806, C815 if

short

Change

D806, C815

Check pin1 of

IC802 voltage

is 5.8V

Check pin3 of

IC802 voltage

about 1V

Change R801, R805,

R822, R823, R817

END

Check the C

pin voltage

of IC803 if

Change

IC803

Unstable power

Check sampling

Circuit

Check R810,

R811, R818

Change

R810, R811,

Black Screen

Power Fail

Check power supply:

Pin1, 2 of CN101

Check pin34, 51, 66, and 82

Of U105

Check Crystal: Pin96,

Pin97

Of U105

Check CCFL -

Enable

(pin85) of U105

MCU Fail

Check FB103

Check: X101,

C153, C154

Inverter Fail

Check Reset (pin84)

Of U105

Check pin5 of

CN101

Check R167, Q106

R108, R110

Check C144, R172

OK OK

Check pin32, 49, 56, and 75

Of U105

And U102

Check FB106

And U101

5. Black Screen and backlight turn on

White Screen

LVDS Cable

Reinsert

Change LVDS

Cable

Check VLCD

Is 5V?

Check Panel

Enable

Of U105 (pin48) is High?

Check R168, R105

Q103, Q101

END

Workmanship

LVDS Cable NG

Panel Fail

Check LVDS

Signals

Check the HW Reset

Of U105 pin84

Check the pins

Of U105

Check C144

R172

OK OK

6. White Screen

7. BAD SCREEN

Bad Screen

WorkmanshipLVDS Cable Reinsert

Change LVDS Cable

Check Crystal:Pin96,97

Of U105

Check the communication

Of U105 and U106

Check the pins of

U105 and U106

LVDS Cable NG

Check :X101,

C153,C154

Check: SDO,SCZ,

SCK,SDI, Reset

WIRING DIAGRAM

Exploded View and Parts List

080

090

070

060

050

040

030

020

100

010

120

130

110

Ref.No. LGE Part No. INL Part No. Description

ABJ53968501 714030014200R ASSY,BEZEL,SILVER,LE19B5

10 ABJ53968502 714030014201R ASSY,BEZEL,BLACK,LE19B5

COV30007401 631102091440R LCP 19" M190A1-L07-908(A)(CMO)ROHS

COV30007601 631102091370R LCP 19" M190MWW1-201(A)(MTDIS)ROHS (IVO)

COV30007501 631102091401R LCP 19" MT190AW01-V5- G1,AM1900004511(INL)

30 EBU49007701 791271500000R PCBA,KEYPAD BOARD,LE19B5-6E0 ROHS

40 EBU49009001 791271400600R PCBA,P/I BOARD,W/O SPK,LE19B5-6E0 ROHS

EBU49008101 791271300500R PCBA,I/F BOARD,L07,W/O SPK,LE19B5-5E0 ROHS

EBU49008501 791271300600R PCBA,I/F BOARD,V5,W/O SPK,LE19B5-6E0 ROHS 50

EBU49008901 791271300E00R PCBA,I/F BOARD,W/O SPK,LE19B5-EE0 ROHS

60 MDQ47252401 502090309100R CHASSIS,LE17B4

ACQ53969101 714050013200R ASSY,BACK COVER,LE19B5-6E0

70 ACQ53969102 714050013210R ASSY,BACK COVER,LE19B5-EE0 (FOR IVO)

80 ACQ52748101 714020012000R ASSY,BASE ,LE19B5

90 MCK47213101 502020800110R STAND ,LE19B5

6410TUW008A 453070800150R PWR CORD 10A/125V BLK 6FT UL/CSA SVT 3Cx

--US/Mexico/Panama/Canada

6410TBW004A 453070800720R PWRCORD 10A/250V BLK 6FT UK,H05VV-F 3Cx0

--UK/Malaysia/Singapore

6410TEW003A 453070800730R PWRCORD 16A/250V BLK 6FT VDE,H05VV-F 3Cx

---Europe/Thailand/Vietnam/Russia/U.A.E

6410TSW003A 453070800740R PWRCORD 10A/250V BLK 1850mm SAA,H05W-F 3

---Australia

100

6410TTW001A 453070800750R PWRCORD 7A/125V BLK 1850mm CNS,VCTF 3Gx0

---Taiwan

110 MFZ47237101 506060008100R CUSHION,EPS-L,LE19B5

120 MFZ47237102 506060008110R CUSHION,EPS-R,LE19B5

130 MAY42295502 506020019900R CARTON LG W1934S(LE19B5)

Related to Models: W1934-SNI/BNI.AxxIQP for 5ms InnoLux module and

W1934-SNI/BNI.AxxQQP for 5ms CMO Module and

W1934-SNI/BNI.AxxYQP for 5ms IVO Module

For INL

Item LGE PN INL PN Descriptions Usage MOQ

1 COV30007501 631102091401R LCP 19" MT190AW01-V5- G1,AM1900004511(INL) 1 20

2 EBU49008501 791271300600R PCBA,I/F BOARD,V5,W/O SPK,LE19B5-6E0 ROHS 1 20

3 EBU49009001 791271400600R PCBA,P/I BOARD,W/O SPK,LE19B5-6E0 ROHS 1 20

4 EBU49007701 791271500000R PCBA,KEYPAD BOARD,LE19B5-6E0 ROHS 1 20

5 ACQ52748101 714020012000R ASSY,BASE ,LE19B5 1 20

6 ABJ53968501 714030014200R ASSY,BEZEL,SILVER,LE19B5 1 20

7 ABJ53968502 714030014201R ASSY,BEZEL,BLACK,LE19B5 1 20

8 ACQ53969101 714050013200R ASSY,BACK COVER,LE19B5-6E0 1 20

9 MDQ47252401 502090309100R CHASSIS,LE17B4 1 20

10 MCK47213101 502020800110R STAND ,LE19B5 1 20

11 COV30007701 430300801620R HRN ASS'Y 8P 260mm UL1571#28, ROHS 1 20

12 COV30007702 430303001410R HRN LVDS FFC 30P 171mm RoHs 1 20

13 COV30007703 453010100340R CABLE D-SUB 15P MALE 1850mm BLACK/BLUE R 1 20

14 6410TUW008A 453070800150R

PWR CORD 10A/125V BLK 6FT UL/CSA,SVT 3Cx

--US/Mexico/Panama/Canada 1 20

6410TBW004A 453070800720R

PWRCORD 10A/250V BLK 6FT UK,H05VV-F 3Cx0

--UK/Malaysia/Singapore 1 20

6410TEW003A 453070800730R PWRCORD 16A/250V BLK 6FT VDE,H05VV-F 3Cx

---Europe/Thailand/Vietnam/Russia/U.A.E 1 20

6410TSW003A 453070800740R

PWRCORD 10A/250V BLK 1850mm SAA,H05W-F 3

---Australia 1 20

6410TTW001A 453070800750R

PWRCORD 7A/125V BLK 1850mm CNS,VCTF 3Gx0

---Taiwan 1 20

MAY42295502 506020019900R CARTON LG W1934S(LE19B5) 1 20

16 MFZ47237101 506060008100R CUSHION,EPS-L,LE19B5 1 20

17 MFZ47237102 506060008110R CUSHION,EPS-R,LE19B5 1 20

For CMO

Item LGE PN INL PN Descriptions Usage MOQ

1 COV30007401 631102091440R LCP 19" M190A1-L07-908(A)(CMO)ROHS 1 20

2 EBU49008101 791271300500R PCBA,I/F BOARD,L07,W/O SPK,LE19B5-5E0 ROHS 1 20

3 EBU49009001 791271400600R PCBA,P/I BOARD,W/O SPK,LE19B5-6E0 ROHS 1 20

4 EBU49007701 791271500000R PCBA,KEYPAD BOARD,LE19B5-6E0 ROHS 1 20

5 ACQ52748101 714020012000R ASSY,BASE ,LE19B5 1 20

6 ABJ53968501 714030014200R ASSY,BEZEL,SILVER,LE19B5 1 20

7 ABJ53968502 714030014201R ASSY,BEZEL,BLACK,LE19B5 1 20

8 ACQ53969101 714050013200R ASSY,BACK COVER,LE19B5-6E0 1 20

9 MDQ47252401 502090309100R CHASSIS,LE17B4 1 20

10 MCK47213101 502020800110R STAND ,LE19B5 1 20

11 COV30007701 430300801620R HRN ASS'Y 8P 260mm UL1571#28, ROHS 1 20

12 COV30007702 430303001410R HRN LVDS FFC 30P 171mm RoHs 1 20

13 COV30007703 453010100340R CABLE D-SUB 15P MALE 1850mm BLACK/BLUE R 1 20

14 6410TUW008A 453070800150R

PWR CORD 10A/125V BLK 6FT UL/CSA,SVT 3Cx

--US/Mexico/Panama/Canada 1 20

6410TBW004A 453070800720R

PWRCORD 10A/250V BLK 6FT UK,H05VV-F 3Cx0

--UK/Malaysia/Singapore 1 20

6410TEW003A 453070800730R PWRCORD 16A/250V BLK 6FT VDE,H05VV-F 3Cx

---Europe/Thailand/Vietnam/Russia/U.A.E 1 20

6410TSW003A 453070800740R

PWRCORD 10A/250V BLK 1850mm SAA,H05W-F 3

---Australia 1 20

6410TTW001A 453070800750R

PWRCORD 7A/125V BLK 1850mm CNS,VCTF 3Gx0

---Taiwan 1 20

MAY42295502 506020019900R CARTON LG W1934S(LE19B5) 1 20

16 MFZ47237101 506060008100R CUSHION,EPS-L,LE19B5 1 20

17 MFZ47237102 506060008110R CUSHION,EPS-R,LE19B5 1 20

For IVO

Item LGE PN INL PN Descriptions Usage MOQ

1 COV30007601 631102091370R LCP 19" M190MWW1-201(A)(MTDIS)ROHS (IVO) 1 20

2 EBU49008901 791271300E00R PCBA,I/F BOARD,W/O SPK,LE19B5-EE0 ROHS 1 20

3 EBU49009001 791271400600R PCBA,P/I BOARD,W/O SPK,LE19B5-6E0 ROHS 1 20

4 EBU49007701 791271500000R PCBA,KEYPAD BOARD,LE19B5-6E0 ROHS 1 20

5 ACQ52748101 714020012000R ASSY,BASE ,LE19B5 1 20

6 ABJ53968501 714030014200R ASSY,BEZEL,SILVER,LE19B5 1 20

7 ABJ53968502 714030014201R ASSY,BEZEL,BLACK,LE19B5 1 20

8 ACQ53969102 714050013210R ASSY,BACK COVER,LE19B5-EE0 (FOR IVO) 1 20

10 MDQ47252401 502090309100R CHASSIS,LE17B4 1 20

11 MCK47213101 502020800110R STAND ,LE19B5 1 20

12 COV30007701 430300801620R HRN ASS'Y 8P 260mm UL1571#28, ROHS 1 20

13 COV30007702 430303001410R HRN LVDS FFC 30P 171mm RoHs 1 20

14 COV30007703 453010100340R CABLE D-SUB 15P MALE 1850mm BLACK/BLUE R 1 20

15 6410TUW008A 453070800150R

PWR CORD 10A/125V BLK 6FT UL/CSA,SVT 3Cx

--US/Mexico/Panama/Canada 120

6410TBW004A 453070800720R

PWRCORD 10A/250V BLK 6FT UK,H05VV-F 3Cx0

--UK/Malaysia/Singapore 120

6410TEW003A 453070800730R PWRCORD 16A/250V BLK 6FT VDE,H05VV-F 3Cx

---Europe/Thailand/Vietnam/Russia/U.A.E 120

6410TSW003A 453070800740R

PWRCORD 10A/250V BLK 1850mm SAA,H05W-F 3

---Australia 120

6410TTW001A 453070800750R

PWRCORD 7A/125V BLK 1850mm CNS,VCTF

3Gx0

---Taiwan 120

MAY42295502 506020019900R CARTON LG W1934S(LE19B5) 1 20

17 MFZ47237101 506060008100R CUSHION,EPS-L,LE19B5 1 20

18 MFZ47237102 506060008110R CUSHION,EPS-R,LE19B5 1 20

IF BOARD

1. FOR INL

ITEM Location P/N Description Usage Un

791271300600R PCBA,I/F BOARD,V5,W/O SPK,LE19B5-6E0 ROH

10 629030014000R PROGRAM,V5,W/O SPK,LE19B5-6E0 ROHS 1 PC

20 791271320600R PCBA,I/F BOARD,MI,LE19B5-6E0 ROHS 1 PC

30 791271340600R PCBA,I/F BOARD,SMT,LE19B5-6E0 ROHS 1 PC

40 511130001201R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5(SAC305 VAC 2 G

50 C111,C144, 420431000260R CAP EC 10uF 25V M,105℃ ST 5x11 RoHS 2 PC

60 C101,C102, 420431010461R CAP EC 100uF 16V M,105℃ ST 5x11(SK) RoH 2 PC

70 C105,C130,C133,C142,C145, 420432200460R CAP EC 22uF 16V M,105℃ ST, 5x11,RoHS 5 PC

80 C108, 420432210460R CAP EC 220uF 16V M,105℃ ST 6.3x11 RoHS 1 PC

90 CN101, 430631060020R WAFER 2.0mm 6P 180°,RoHS 1 PC

100 CN105, 430631080130R WAFER 2x4P 2.0mm,200PHD-2*4ST RoHS 1 PC

110 X101, 432008010370R XTAL 14.31818MHz 16pF HC-49US 30PPM,DIP, 1 PC

120 CN103, 440819015030R CON D-SUB FEM.15P RA W/O SCREW DZ11AA1-H 1 PC

130 Q103,Q106, 410500045210R XSTR PMBT3904 NPN 200MA,40V SOT23(PHILIP 2 PC

140 Q102,Q105, 410500046210R XSTR PMBT3906 PNP 200MA,40V SOT23(PHILIP 2 PC

150 Q101, 410500068290R XSTR AP2305GN P-CH SOT23(APEC) RoHS 1 PC

160 Q107, 410500050210R XSTR 2N7002,N-CH FET SOT-23 (PHILIPS)RoH 1 PC

170 TVS101,TVS102,

TVS103,TVS104, 411020026210R DIO BAV99 350mW 70V SOT-23(PHI RoHS 4 PC

180 D103, 411020047210R DIO BAV70 85V SOT23 (PHILIPS) RoHS 1 PC

190 ZD101,ZD105, ZD106,

ZD107,ZD108, 411100956920R ZENER 5.6V MMSZ5232A SOD123(PE C)RoHS 5 PC

200 U108, 412000279480R IC AT24C04N-10SU-2.7 SOP8 4K(A TMEL)RoHS 1 PC

210 U102, 412000330830R IC AS1117L-1.8/TR-LF,SOT223(A1 SEMI)RoHS 1 PC

220 U101, 412000372830R IC AS1117L-3.3TR-LF,SOT223(A1S EMI)RoHS 1 PC

230 U103, 412000435480R IC AT24C02BN-10SU-1.8 SOIC8 2K (ATMEL)Ro 1 PC

240 U105, 412000508190R IC TSUM16AL-LF-1 PQFP100(MSTAR)RoHS 1 PC

250 U106, 412000373190R IC SST25VF010A-33-4C-SAE,SOIC- 8(SST)RoH 1 PC

260 R103,R190, 414916000050R RES SMD (0603) 0Ω J,RT RoHS 2 PC

270 R186,R187, 414916010050R RES SMD (0603) 10Ω J,RT RoHS 2 PC

280

R114,R117,R120,

R124,R125,R127,

R129,R130,R131,

R132,R167,R168,

R178,R179,R161,

414916010150R RES SMD (0603) 100Ω J,RT RoHS REV:A 15 PC

290 R157,R158,R159,

R160,R162,R163, 414916010250R RES SMD (0603) 1KΩ J,RT RoHS REV:A 6 PC

300 R106,R172,R180,

R181,R191,R184,

R185,R175, 414916010350R RES SMD (0603) 10KΩ J,RT RoHS 8 PC

310 R102, 414916010450R RES SMD (0603) 100KΩ J,RT REV:A RoHS 1 PC

320 R105, 414916020350R RES SMD (0603) 20KΩ J,RT RoHS REV:A 1 PC

330 R136,R137, 414916022250R RES SMD (0603) 2.2KΩ J,RT RoHS 2 PC

340 R121, 414916047150R RES SMD (0603) 470Ω J,RT RoHS REV:A 1 PC

350

R108,R109,R110,

R122,R149,R150,

R154,R155,R166,

R173,R174,R182,

R183,R176,

414916047250R RES SMD (0603) 4.7KΩ J,RT RoHS 14 PC

360 R169, 414916390010R RES SMD (0603) 390Ω F,RT RoHS 1 PC

370 R133,R134,R135, 414916750910R RES SMD (0603) 75Ω F,RT RoHS REV:A 3 PC

380 RP102, 415751035080R RP(0612)10KΩx4 1/16W J 8P4R RoHS 1 PC

390 C158,C159,C160,

C161,C162,C163,

C164,C138,C155, 419311020060R C SMD(0603) X7R 1000PF/50V K RoHS 9 PC

400 C153,C154, 419302200560R C SMD(0603) NPO 22PF/50V J RoHS 2 PC

410 C126, 419302210560R C SMD(0603) NPO 220PF/50V J RoHS 1 PC

420 C125, 419303300560R C SMD(0603) NPO 33PF/50V J RoHS 1 PC

430

C103,C104,C106,

C107,C109,C129,

C131,C132,C134,

C135,C136,C137,

C139,C141,C143,

C147,C148,C149,

C150,C151,C152,

C156,C166,C146,

419311040060R C SMD(0603) X7R 0.1uF/50V K RoHS 24 PC

440 C140, 419311054070R C SMD(0805) X7R 1uF/16V K RoHS REV:A 1 PC

450 C112,C113,C114,

C115,C116,C117,

C118, 419314730060R C SMD (0603) X7R 0.047uF 50V,K RoHS 7 PC

460 FB101, 432002312111R BEAD CORE SMD(0805)120Ω 300mA RoHS 1 PC

470 FB102,FB103,

FB105,FB106, 432002360012R BEAD CORE SMD(0805)60Ω 800mA GBK201209T 4 PC

480 CN104, 444099030030R CON, SMD 1.0mm 30PIN RoHS AL2309-A0G1Z 1 PC

490 506140005700R LABEL,BARCODE,BLANK,33x7mm, ROHS,FOR

PCB 1 PC

500 491291300100R PCB,I/F BOARD,LE19B5-XE0 ROHS 1 PC

510 R107, 414916068150R RES SMD (0603) 680Ω J,RT RoHS REV:A 1 PC

520 R113,R116,R119, 414916560910R RES SMD (0603) 56Ω F,RT RoHS REV:A 3 PC

530 FB107,FB108,

FB109, 432002360140R BEAD CORE SMD(0603)60Ω 600mA, GBK160808 3 PC

540 511130002203R SOLDER PASTE,Sn96.5/Ag3.0/Cu0.5(SAC305 O 0.21 G

550 R101, 414916033150R RES SMD (0603) 330Ω J,RT RoHS 1 PC

2. FOR CMO

ITEM Location P/N Description Usage Un

791271300500R PCBA,I/F BOARD,L07,W/O SPK,LE19B5-5E0 RO

10 629030014020R PROGRAM,L07,W/O SPK,LE19B5-5E0 ROHS 1 PC

20 791271320600R PCBA,I/F BOARD,MI,LE19B5-6E0 ROHS 1 PC

30 791271340600R PCBA,I/F BOARD,SMT,LE19B5-6E0 ROHS 1 PC

40 511130001201R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5(SAC305 VAC 2 G

50 C111,C144, 420431000260R

CAP EC 10uF 25V M,105℃ ST 5x11 RoHS 2 PC

60 C101,C102, 420431010461R

CAP EC 100uF 16V M,105℃ ST 5x11(SK) RoH 2 PC

70 C105,C130,

C133,C142,

C145, 420432200460R CAP EC 22uF 16V M,105℃ ST, 5x11,RoHS 5 PC

80 C108, 420432210460R

CAP EC 220uF 16V M,105℃ ST 6.3x11 RoHS 1 PC

90 CN101, 430631060020R WAFER 2.0mm 6P 180°,RoHS 1 PC

100 CN105, 430631080130R WAFER 2x4P 2.0mm,200PHD-2*4ST RoHS 1 PC

110 X101, 432008010370R XTAL 14.31818MHz 16pF HC-49US 30PPM,DIP, 1 PC

120 CN103, 440819015030R CON D-SUB FEM.15P RA W/O SCREW DZ11AA1-H 1 PC

130 Q103,Q106, 410500045210R XSTR PMBT3904 NPN 200MA,40V SOT23(PHILIP 2 PC

140 Q102,Q105, 410500046210R XSTR PMBT3906 PNP 200MA,40V SOT23(PHILIP 2 PC

150 Q101, 410500068290R XSTR AP2305GN P-CH SOT23(APEC) RoHS 1 PC

160 Q107, 410500050210R XSTR 2N7002,N-CH FET SOT-23 (PHILIPS)RoH 1 PC

170 TVS101,TVS102,

TVS103,TVS104, 411020026210R DIO BAV99 350mW 70V SOT-23(PHI RoHS 4 PC

180 D103, 411020047210R DIO BAV70 85V SOT23 (PHILIPS) RoHS 1 PC

190 ZD101,ZD105,

ZD106,ZD107,

ZD108, 411100956920R ZENER 5.6V MMSZ5232A SOD123(PE C)RoHS 5 PC