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User Manual: Phone Nokia 2600 classic RM-340, RM-341 - Service manuals and Schematics, Disassembly / Assembly. Free.

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Amendment Record Sheet
Copyright
Warnings and cautions
For your safety
Care and maintenance
ESD protection
Battery information
Company Policy
Nokia 2600c-2; Nokia 2600c-2b Service Manual Structure
1 General Information
- RM-340/RM-341 product selection
- Features
2 Service Devices and Service Concepts
- Service devices
- Service concepts
3 Baseband Troubleshooting Instructions
4 RF Troubleshooting Instructions
5 Camera Module Troubleshooting
6 System Module
Glossary

Service Manual

RM-340; RM-341 (Nokia 2600c-2; Nokia

2600c-2b)

Mobile Terminal

Part No: 9205777 (Issue 1)

Nokia Customer Care

COMPANY CONFIDENTIAL

Amendment Record Sheet

Amendment No Date Inserted By Comments

Issue 1 12/2007 Y Liu

RM-340; RM-341

Amendment Record Sheet

Page ii COMPANY CONFIDENTIAL Issue 1

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form

without the prior written permission of Nokia is prohibited.

Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia

Corporation. Other product and company names mentioned herein may be trademarks or tradenames of

their respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and

improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,

consequential or indirect damages howsoever caused.

The contents of this document are provided "as is". Except as required by applicable law, no warranties of

any kind, either express or implied, including, but not limited to, the implied warranties of merchantability

and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this

document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

The availability of particular products may vary by region.

IMPORTANT

This document is intended for use by qualified service personnel only.

RM-340; RM-341

Issue 1 COMPANY CONFIDENTIAL Page iii

Warnings and cautions

Warnings

• IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED

WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT

CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/

MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

•THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,

FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE

WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE

MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY

ALSO BE SUBJECT TO INTERFERENCE.

• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions

• Servicing and alignment must be undertaken by qualified personnel only.

• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

• Use only approved components as specified in the parts list.

• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and

alignment.

• Ensure all cables and wires are repositioned correctly.

•Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the

measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb

nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.

• During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise

GSM or WCDMA PA may be damaged.

RM-340; RM-341

Warnings and cautions

Page iv COMPANY CONFIDENTIAL Issue 1

For your safety

QUALIFIED SERVICE

Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES

Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES

When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect

incompatible products.

RM-340; RM-341

For your safety

Issue 1 COMPANY CONFIDENTIAL Page v

Care and maintenance

This product is of superior design and craftsmanship and should be treated with care. The suggestions below

will help you to fulfil any warranty obligations and to enjoy this product for many years.

• Keep the phone and all its parts and accessories out of the reach of small children.

•Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that

will corrode electronic circuits.

• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.

•Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage

batteries, and warp or melt certain plastics.

• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form

inside, which may damage electronic circuit boards.

• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.

• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.

• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.

• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or

attachments could damage the phone and may violate regulations governing radio devices.

All of the above suggestions apply equally to the product, battery, charger or any accessory.

RM-340; RM-341

Care and maintenance

Page vi COMPANY CONFIDENTIAL Issue 1

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing

the phone.

Any product of which the covers are removed must be handled with ESD protection. The SIM card can be

replaced without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied.

All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity

discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside

any ESD Protected Area (EPA).

Every repair action involving opening the product or handling the product components must be done under

ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.

For more information and local requirements about ESD protection and ESD Protected Area, contact your local

Nokia After Market Services representative.

RM-340; RM-341

ESD protection

Issue 1 COMPANY CONFIDENTIAL Page vii

Battery information

Note: A new battery's full performance is achieved only after two or three complete charge and

discharge cycles!

The battery can be charged and discharged hundreds of times but it will eventually wear out. When the

operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.

Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers

approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to

a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged

battery will discharge itself over time.

Temperature extremes can affect the ability of your battery to charge.

For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the

product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory

available for the product). Do not attempt to discharge the battery by any other means.

Use the battery only for its intended purpose.

Never use any charger or battery which is damaged.

Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or

pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example

when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery

or the connecting object.

Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce

the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°

F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.

Batteries' performance is particularly limited in temperatures well below freezing.

Do not dispose of batteries in a fire!

Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

RM-340; RM-341

Battery information

Page viii COMPANY CONFIDENTIAL Issue 1

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service

bulletins.

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If

any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/e-

mail.

Please state:

• Title of the Document + Issue Number/Date of publication

• Latest Amendment Number (if applicable)

• Page(s) and/or Figure(s) in error

Please send to:

NOKIA CORPORATION

Nokia Mobile Phones Business Group

Nokia Customer Care

PO Box 86

FIN-24101 SALO

Finland

E-mail: Service.Manuals@nokia.com

RM-340; RM-341

Company Policy

Issue 1 COMPANY CONFIDENTIAL Page ix

RM-340; RM-341

Company Policy

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Page x COMPANY CONFIDENTIAL Issue 1

Nokia 2600c-2; Nokia 2600c-2b Service Manual Structure

1 General Information

2 Service Devices and Service Concepts

3 Baseband Troubleshooting Instructions

4 RF Troubleshooting Instructions

5 Camera Module Troubleshooting

6 System Module

Glossary

RM-340; RM-341

Nokia 2600c-2; Nokia 2600c-2b Service Manual

Structure

Issue 1 COMPANY CONFIDENTIAL Page xi

RM-340; RM-341

Nokia 2600c-2; Nokia 2600c-2b Service Manual

Structure

(This page left intentionally blank.)

Page xii COMPANY CONFIDENTIAL Issue 1

1 — General Information

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 1 –1

RM-340; RM-341

General Information

(This page left intentionally blank.)

Page 1 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

RM-340/RM-341 product selection .......................................................................................................................1–5

Features...................................................................................................................................................................1–5

Hardware features ............................................................................................................................................1–5

Software features..............................................................................................................................................1–6

UI features..........................................................................................................................................................1–6

Mobile enhancements.......................................................................................................................................1–6

List of Tables

Table 1 Power.........................................................................................................................................................1–6

Table 2 Car...............................................................................................................................................................1–6

Table 3 Audio..........................................................................................................................................................1–7

List of Figures

Figure 1 RM-340/341 product picture ..................................................................................................................1–5

RM-340; RM-341

General Information

Issue 1 COMPANY CONFIDENTIAL Page 1 –3

RM-340; RM-341

General Information

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Page 1 –4 COMPANY CONFIDENTIAL Issue 1

RM-340/RM-341 product selection

The RM-340 is the EU version of the telephone with a dual band transceiver unit designed for the GSM900

and GSM1800 networks.

The RM-341 is the US version of the telephone with a dual band transceiver unit designed for the GSM850

and GSM1900 networks.

Figure 1 RM-340/341 product picture

Features

Hardware features

• EGSM dualband 900/1800 for EMEA, APAC, China, LTA·

• GSM dualband 850/1900 for LTA

• Display: 128x160 TFT color display

• Codecs: HR, FR, EFR and AMR

• IHF Slim Malt 16mm Speaker

• Internal antenna

• Easy flash II system connector

• BT combined with FM radio

• VGA camera

• Built-in Vibra

• GPRS: Class 6

RM-340; RM-341

General Information

Issue 1 COMPANY CONFIDENTIAL Page 1 –5

Software features

• OS: ISA

• UI Style: S40

• MIDP 2.0 Java, with latest APIs

• Browser: XHTML over TCP/IP (WAP 2.0 compliant)

• Video capture and playback (7.5fps, H.263; MPEG4)

• MMS 1.2

• English-Chinese dictionary for China/APAC

• E-mail Client 4

• Nokia Xpress audio messaging

UI features

• Douglas V UI style with 3 soft keysl

• Nokia Series 40 user interface

• MP3 ringing tones & 40 polyphonic ringing tones

• Themes, colour games and wall papers

• Java games (downloadable)

• To-do list and Notes

• Countdown timer

• Phonebook image

• Menu with animated icons

• 2 font sizes are supported in the editor

• Calendar in day/week/month view

• Chinese lunar Calendar II (not for all regions)

• “Pulsating light” indicating missed call, unread messages, etc.

Mobile enhancements

Table 1 Power

Type Name

BL-5BT Battery 870 mAh Li-Ion

AC-3 Compact charger

AC-4 Travel charger

AC-5 Compact travel charger

CA-44 Charger adapter

DC-4 Mobile charger

Table 2 Car

Type Name

CK-15W Display car kit

RM-340; RM-341

General Information

Page 1 –6 COMPANY CONFIDENTIAL Issue 1

Type Name

CK-20W Multimedia car kit

CK-25W Multimedia car kit

Table 3 Audio

Type Name

HS-38W Nokia bluetooth headset BH-202

HS-40 Headset

HS-47 Stereo headset

HS-50W Nokia bluetooth headset BH-300

HS-51W Nokia bluetooth headset BH-301

HS-52W Nokia bluetooth headset BH-201

HS-58W Nokia bluetooth headset BH-200

HS-68W Nokia bluetooth headset BH-203

HS-73W Nokia bluetooth headset BH-302

HS-78W Nokia bluetooth headset BH-100

HS-79W Nokia bluetooth headset BH-303

HS-80W Nokia bluetooth headset BH-208

HS-84W/88W Nokia bluetooth headset BH-204

HS-85W Nokia bluetooth headset BH-206

HS-86W Nokia bluetooth headset BH-207

MD-4 Mini speakers

RM-340; RM-341

General Information

Issue 1 COMPANY CONFIDENTIAL Page 1 –7

RM-340; RM-341

General Information

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Page 1 –8 COMPANY CONFIDENTIAL Issue 1

2 — Service Devices and

Service Concepts

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –1

RM-340; RM-341

Service Devices and Service Concepts

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Page 2 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

Service devices........................................................................................................................................................2–5

CA-106DS ............................................................................................................................................................2–5

CA-111DS ............................................................................................................................................................2–5

CA-112DS ............................................................................................................................................................2–5

CA-41PS...............................................................................................................................................................2–6

CA-52PS...............................................................................................................................................................2–6

CA-58RS...............................................................................................................................................................2–6

DA-69 ..................................................................................................................................................................2–6

DAU-9S................................................................................................................................................................2–7

FLS-4S..................................................................................................................................................................2–7

FLS-5 ...................................................................................................................................................................2–7

FPS-10.................................................................................................................................................................2–8

JBV-1 ...................................................................................................................................................................2–8

MJ-138.................................................................................................................................................................2–9

PCS-1...................................................................................................................................................................2–9

PK-1.....................................................................................................................................................................2–9

PKD-1 ............................................................................................................................................................... 2–10

RJ-200 .............................................................................................................................................................. 2–10

RJ-51 ................................................................................................................................................................ 2–10

RJ-72 ................................................................................................................................................................ 2–10

SA-93................................................................................................................................................................ 2–11

SRT-6................................................................................................................................................................ 2–11

SS-88................................................................................................................................................................ 2–11

SS-93................................................................................................................................................................ 2–11

ST-30................................................................................................................................................................ 2–12

ST-32................................................................................................................................................................ 2–12

SX-4.................................................................................................................................................................. 2–12

XCS-4 ................................................................................................................................................................ 2–12

XRS-6................................................................................................................................................................ 2–13

Service concepts .................................................................................................................................................. 2–13

POS flash concept with FLS-4S....................................................................................................................... 2–13

POS flash concept with FLS-5 ........................................................................................................................ 2–14

Flash concept with FPS-10............................................................................................................................. 2–15

RF-test/BB-tune concept with JBV-1............................................................................................................. 2–16

EM calibration concept with JBV-1................................................................................................................ 2–17

RF-test/BB-tune & flash concept with JBV-1, FPS-10................................................................................... 2–18

RF/BB tune& flash concept with MJ-137, FPS-10......................................................................................... 2–19

List of Figures

Figure 2 POS flash concept with FLS-4S............................................................................................................. 2–13

Figure 3 POS flash concept with FLS-5............................................................................................................... 2–14

Figure 4 Flash concept with FPS-10................................................................................................................... 2–15

Figure 5 RF-test/BB-tune concept with JBV-1................................................................................................... 2–16

Figure 6 EM calibration concept with JBV-1...................................................................................................... 2–17

Figure 7 RF-test/BB-tune & flash concept with JBV-1, FPS-10......................................................................... 2–18

Figure 8 RF/BB tune& flash concept with MJ-137, FPS-10 ............................................................................... 2–19

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –3

RM-340; RM-341

Service Devices and Service Concepts

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Page 2 –4 COMPANY CONFIDENTIAL Issue 1

Service devices

The table below gives a short overview of service devices that can be used for testing, error analysis, and

repair of product RM-340; RM-341. For the correct use of the service devices, and the best effort of workbench

setup, please refer to various concepts.

CA-106DS Easy flash II cable

The cable is used for connecting phone DC port to the flash prommer

FPS-10.

CA-111DS Easy flash II cable

The cable is used for connecting phone DC port to either POS flashing

device FLS-4S or to the PROMMER box FPS-11.

CA-112DS Easy flash II cable

The CA-112DS easy flash II cable is used for connecting phone DC port

to the PROMMER facilities (FLS-5, FPS-21).

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –5

CA-41PS Power cable

Power cable for connection of e.g. the JBV-1 docking station to the

FPS-10 prommer box.

CA-52PS DC Cable

The cable is used to connect JBV-1 docking station to the phone

charger jack for ADC/VCHAR/ICHAR calibration.

CA-58RS RF Cable

This RF cable is used together with MJ-138 to connect to RF

measurement equipment.

DA-69 Docking station

adapter

The docking station adapter is used for this phone in combination with

JBV-1. The adapter supports flashing and energy management

calibration,

Features include:

• compatible with JBV-1

• easy phone attachment and detachment

• reliable phone locking

• switch for detecting phone

• replaceable SIM interface

RM-340; RM-341

Service Devices and Service Concepts

Page 2 –6 COMPANY CONFIDENTIAL Issue 1

DAU-9S MBUS cable

The MBUS cable DAU-9S has a modular connector and is used, for

example, between the PC's serial port and module jigs, flash adapters

or docking station adapters.

Note: Docking station adapters valid for DCT4 products.

FLS-4S Flash device

FLS-4S is a dongle and flash device incorporated into one package,

developed specifically for POS use.

FLS-5 Flash device

FLS-5 is a dongle and flash device incorporated into one package,

developed specifically for POS use.

Note: FLS-5 can be used as an alternative to PKD-1.

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –7

FPS-10 Flash prommer

FPS-10 interfaces with:

• PC

• Control unit

• Flash adapter

• Smart card

FPS-10 flash prommer features:

• Flash functionality for BB5 and DCT-4 terminals

• Smart Card reader for SX-2 or SX-4

• USB traffic forwarding

• USB to FBUS/Flashbus conversion

• LAN to FBUS/Flashbus and USB conversion

• Vusb output switchable by PC command

FPS-10 sales package includes:

• FPS-10 prommer

• Power Supply with 5 country specific cords

• USB cable

Note: FPS-21 is substitute FPS-10 if FPS-10 has not been set

up.

JBV-1 Docking station

The JBV-1 docking station is a general tool that has been designed for

calibration and software update use. The JBV-1 is used together with

a docking station adapter as one unit

In calibration mode the JBV-1 is powered by an external power supply:

11-16V DC. When flashing the power for the phone must be taken from

the flash prommer.

Note: JBV-1 main electrical functions are:

• adjustable VBATT calibration voltage, current

measurement limit voltage: VCHAR, current measurement:

ICHAR

• adjustable ADC calibration voltage via BTEM and the BSI

signal

• BTEMP and BSI calibration resistor

• signal from FBUS to the phone via the parallel jig

• control via FBUS or USB

• Flash OK/FAIL indication

RM-340; RM-341

Service Devices and Service Concepts

Page 2 –8 COMPANY CONFIDENTIAL Issue 1

MJ-138 Module jig

MJ-138 is meant for component level troubleshooting.

The jig includes an RF interface for GSM and Bluetooth. in addition, it

has the following features:

• Provides mechanical interface with the engine and UI module

• Provides galvanic connection to all needed test pads in module

• Duplicated SIM connector

• Audio components: IHF, MIC

• Connector for control unit

Note: CA-58RS(RF cable) is used together with MJ-138.

CA-58RS is not a part of the MJ-138 sales package and has to

be ordered separately.

The following table shows the attenuation values for MJ-138:

•Band Tuning

Channel Attenuat

ion RX Toleranc

e RX Attenuat

ion TX Toleranc

e TX

GSM 900 975 -6.0884 1 -6.9200 2

38 -6.4203 1 -7.4584 2

124 -6.6911 1 -8.4678 2

GSM

1800

512 -8.8416 1 -7.5614 2

700 -8.0418 1 -7.0011 2

885 -7.7039 1 -6.4946 2

PCS-1 Power cable

The PCS-1 power cable (DC) is used with a docking station, a module

jig or a control unit to supply a controlled voltage.

PK-1 Software protection

key

PK-1 is a hardware protection key with a USB interface. It has the same

functionality as the PKD-1 series dongle.

PK-1 is meant for use with a PC that does not have a series interface.

To use this USB dongle for security service functions please register

the dongle in the same way as the PKD-1 series dongle.

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –9

PKD-1 SW security device

SW security device is a piece of hardware enabling the use of the

service software when connected to the parallel (LPT) port of the PC.

Without the device, it is not possible to use the service software.

Printer or any such device can be connected to the PC through the

device if needed.

RJ-200 Soldering jig

The jig is used for soldering and as a rework jig for the system module.

It is made of lead-free rework compatible material.

RJ-51 Rework jig

To be used with ST-30!

RJ-72 Rework jig

To be used with rework stencil ST-32.

RM-340; RM-341

Service Devices and Service Concepts

Page 2 –10 COMPANY CONFIDENTIAL Issue 1

SA-93 RF coupler

The coupler is used for Go/No-Go test after changing components in

the RF part of the phone.

It is mounted on the docking station adapter.

The following table shows attenuations from the antenna pads of the

mobile terminal to the SMA connectors of SA-93:

•Band Tuning

channel Attenuation RX

(dB) Attenuation

TX(dB)

GSM850 128 8 8

190 8 8

251 8 8

GSM900 38 8 8

124 8 8

975 8 8

GSM1800 512 10 10

700 10 10

885 10 10

GSM1900 512 10 10

661 10 10

810 10 10

SRT-6 Opening tool

SRT-6 is used to open phone covers and B-to-B connectors.

Caution: Handle the tool with care because the tip is only 0.7

mm in diameter.

When not in use, store in a safe location.

SS-88 Camera removal tool

The camera removal tool SS-88 is used to remove/attach the front

camera module from/to the socket.

SS-93 Opening tool

SS-93 is used for opening JAE connectors.

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –11

ST-30 Rework stencil

It is used together with RJ-51 to rework N6301.

ST-32 Rework stencil for

B2100

Rework stencil to be used together with RJ-72 for rework of B2100.

SX-4 Smart card

SX-4 is a BB5 security device used to protect critical features in tuning

and testing.

SX-4 is also needed together with FPS-10 when DCT-4 phones are

flashed.

XCS-4 Modular cable

XCS-4 is a shielded (one specially shielded conductor) modular cable

for flashing and service purposes.

RM-340; RM-341

Service Devices and Service Concepts

Page 2 –12 COMPANY CONFIDENTIAL Issue 1

XRS-6 RF cable

The RF cable is used to connect, for example, a module repair jig to

the RF measurement equipment.

SMA to N-Connector approximately 610 mm.

Attenuation for:

• GSM850/900: 0.3+-0.1 dB

• GSM1800/1900: 0.5+-0.1 dB

• WLAN: 0.6+-0.1dB

Service concepts

POS flash concept with FLS-4S

Figure 2 POS flash concept with FLS-4S

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –13

POS flash concept with FLS-5

Figure 3 POS flash concept with FLS-5

RM-340; RM-341

Service Devices and Service Concepts

Page 2 –14 COMPANY CONFIDENTIAL Issue 1

Flash concept with FPS-10

Figure 4 Flash concept with FPS-10

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –15

RF-test/BB-tune concept with JBV-1

Figure 5 RF-test/BB-tune concept with JBV-1

RM-340; RM-341

Service Devices and Service Concepts

Page 2 –16 COMPANY CONFIDENTIAL Issue 1

EM calibration concept with JBV-1

Figure 6 EM calibration concept with JBV-1

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –17

RF-test/BB-tune & flash concept with JBV-1, FPS-10

Figure 7 RF-test/BB-tune & flash concept with JBV-1, FPS-10

RM-340; RM-341

Service Devices and Service Concepts

Page 2 –18 COMPANY CONFIDENTIAL Issue 1

RF/BB tune& flash concept with MJ-137, FPS-10

Figure 8 RF/BB tune& flash concept with MJ-137, FPS-10

RM-340; RM-341

Service Devices and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 –19

RM-340; RM-341

Service Devices and Service Concepts

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Page 2 –20 COMPANY CONFIDENTIAL Issue 1

3 — Baseband

Troubleshooting Instructions

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 3 –1

RM-340; RM-341

Baseband Troubleshooting Instructions

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Page 3 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

General baseband troubleshooting......................................................................................................................3–5

Key components................................................................................................................................................3–5

Power supply test points..................................................................................................................................3–5

Phone cannot be powered on (I).....................................................................................................................3–5

Phone cannot be powered on (II)....................................................................................................................3–7

Phone cannot be flashed..................................................................................................................................3–8

Easy flash programming does not work...................................................................................................... 3–10

Display shows "Contact Service"................................................................................................................... 3–12

The phone does not register to the networks, or the phone cannot make a call................................... 3–13

SIM related faults................................................................................................................................................. 3–15

Insert SIM card fault....................................................................................................................................... 3–15

SIM card rejected............................................................................................................................................ 3–16

User interface....................................................................................................................................................... 3–16

Blank display................................................................................................................................................... 3–16

Corrupted display ........................................................................................................................................... 3–17

Dead keys ........................................................................................................................................................ 3–17

No backlight for display or/and keys ........................................................................................................... 3–18

Audio troubleshooting........................................................................................................................................ 3–19

Audio troubleshooting using phoenix......................................................................................................... 3–19

Check microphone using "Hp microphone in Ext speaker out" loop ........................................................ 3–20

Check earpiece using "Ext microphone in Hp speaker out" loop .............................................................. 3–21

Check IHF & ringing tone function using "Buzzer"...................................................................................... 3–21

Check vibra function using "Vibra control".................................................................................................. 3–22

Earpiece fault.................................................................................................................................................. 3–23

IHF/ringing tone fault.................................................................................................................................... 3–24

Microphone fault ............................................................................................................................................ 3–25

Headset earpiece fault................................................................................................................................... 3–26

Headset microphone fault............................................................................................................................. 3–27

List of Tables

Table 4 Connector for External Audio Accessories ........................................................................................... 3–20

List of Figures

Figure 9 Troubleshooting when phone cannot be powered on .......................................................................3–6

Figure 10 Troubleshooting when phone does not stay on or phone is jammed ............................................3–7

Figure 11 Flash programming fault......................................................................................................................3–9

Figure 12 Easy flash programming fault........................................................................................................... 3–11

Figure 13 Troubleshooting when the "Contact Service" message is seen .................................................... 3–13

Figure 14 No registering or call ......................................................................................................................... 3–14

Figure 15 Insert SIM card fault........................................................................................................................... 3–15

Figure 16 Signal diagram ................................................................................................................................... 3–16

Figure 17 Signal diagram ................................................................................................................................... 3–16

Figure 18 Phoenix audio test window.............................................................................................................. 3–19

Figure 19 4-pole jack plug for audio accessory................................................................................................ 3–20

Figure 20 Test arrangement for microphone................................................................................................... 3–21

Figure 21 Test arrangement for of earpiece..................................................................................................... 3–21

Figure 22 Checking IHF and ring tone by using "Buzzer"................................................................................ 3–22

Figure 23 Checking vibra function by using vibra control .............................................................................. 3–22

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –3

Figure 24 Earpiece fault flow chart ................................................................................................................... 3–23

Figure 25 IHF/ringing tone fault flow chart...................................................................................................... 3–24

Figure 26 Microphone fault flow chart.............................................................................................................. 3–25

Figure 27 Headset earpiece fault flow chart .................................................................................................... 3–26

Figure 28 Headset microphone fault flow chart .............................................................................................. 3–27

RM-340; RM-341

Baseband Troubleshooting Instructions

Page 3 –4 COMPANY CONFIDENTIAL Issue 1

General baseband troubleshooting

Key components

Power supply test points

Phone cannot be powered on (I)

Context

This means that the phone does not use any current at all when the supply is connected and/or power key

is pressed. It is assumed that the voltage supplied is 3.6VDC. The UEMCLite will prevent any functionality at

battery/supply levels below 2.9VDC.

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –5

Troubleshooting flow

Figure 9 Troubleshooting when phone cannot be powered on

RM-340; RM-341

Baseband Troubleshooting Instructions

Page 3 –6 COMPANY CONFIDENTIAL Issue 1

Phone cannot be powered on (II)

Context

If this kind of failure is presenting itself immediately after FLALI, it is most likely caused by ASIC's missing

contact with PWB.

If the MCU doesn’t service the watchdog register within the UEMCLite, the operations watchdog will run out

after approximately 32 seconds. Unfortunately, the service routine can not be measured.

Troubleshooting flow

Figure 10 Troubleshooting when phone does not stay on or phone is jammed

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –7

Phone cannot be flashed

Context

The flash programming can be done via the pads on the PWB (J2060). If failed, then follow up the trouble

shooting flow chart.

In case of flash failure in the FLALI station, swap the phone and send it back to the care program for further

analysis. Possible failures could be short-circuit of balls under µBGAs (UEMCLite, UPP4M, FLASH), or missing

or misaligned components.

In flash programming error cases, the flash prommer can give some information about a fault. The fault

information messages could be:

Phone doesn't set FBUS_TX line low

Because of the use of uBGA components, it is not possible to verify if there is a short circuit in the control and

address lines of MCU (UPP8M) and the memory (flash).

RM-340; RM-341

Baseband Troubleshooting Instructions

Page 3 –8 COMPANY CONFIDENTIAL Issue 1

Troubleshooting flow

Figure 11 Flash programming fault

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –9

Easy flash programming does not work

Context

The flash programming can be done via the easy flash connector. If failed, then follow up the trouble shooting

below.

It is not possible to verify if there is a short circuit in control and address lines of MCU (UPP8M) and memory

(flash) because BGA package is used in RM-340/341.

RM-340; RM-341

Baseband Troubleshooting Instructions

Page 3 –10 COMPANY CONFIDENTIAL Issue 1

Troubleshooting flow

Figure 12 Easy flash programming fault

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –11

Display shows "Contact Service"

Troubleshooting flow

This error can only happen at power up where several self-tests are run. If any of these test cases fails the

display will show the message: "Contact Service".

They are individual test cases, so the below lineup of error hunting's has no chronological order. Use common

sense and experience to decide which test case to start error hunting at.

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Baseband Troubleshooting Instructions

Page 3 –12 COMPANY CONFIDENTIAL Issue 1

Figure 13 Troubleshooting when the "Contact Service" message is seen

The phone does not register to the networks, or the phone cannot make a call

Context

If the phone doesn't register to the network, the fault can be in either BB or RF. Only few signals can be tested

since several signals are 'buried' in one or more of the inner layers of the PWB.

First, check that SIM LOCK is not causing the error by using a Test-SIM card and connect the phone to a tester.

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –13

Troubleshooting flow

Figure 14 No registering or call

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Baseband Troubleshooting Instructions

Page 3 –14 COMPANY CONFIDENTIAL Issue 1

SIM related faults

Insert SIM card fault

Troubleshooting flow

The hardware of the SIM interface from UEMCLite (D2200) to the SIM connector (X2700) can be tested without

a SIM card. When the power is switched on the phone first check for a 1.8V SIM card and then a 3V SIM card.

The phone will try this four times, where after it will display ”Insert SIM card”.

Figure 15 Insert SIM card fault

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –15

Figure 16 Signal diagram

SIM card rejected

The error ”SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data

signal levels are wrong. The first data is always ATR and it is sent from card to phone.

For reference a picture with normal SIM power-up is shown below.

Figure 17 Signal diagram

User interface

Blank display

Context

The display does not show any information at all. If there is only main or sub display blank, the problem

mostly exists in individual display. Replace related display first. For main and sub display blank, refer to

troubleshooting flow below.

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Baseband Troubleshooting Instructions

Page 3 –16 COMPANY CONFIDENTIAL Issue 1

Troubleshooting flow

Corrupted display

Context

The display contains missing or fading segments, or color presentation is incorrect.

Troubleshooting flow

Dead keys

Context

One or more keys has no function.

RM-340; RM-341

Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –17

Troubleshooting flow

No backlight for display or/and keys

Context

There are 3 kinds of statuses: No backlight for both display and keys; No backlight for only display; No

backlight for only keys.

Troubleshooting flow

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Baseband Troubleshooting Instructions

Page 3 –18 COMPANY CONFIDENTIAL Issue 1

Audio troubleshooting

Audio troubleshooting using phoenix

Figure 18 Phoenix audio test window

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Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –19

Figure 19 4-pole jack plug for audio accessory

Table 4 Connector for External Audio Accessories

Pin Signal name Direction Description

5 PLUGDET Input Terminal internal

connection, plug

detection

4 HS EAR L Output Audio output

3 HS EAR R Output Audio output

2 HS MIC Input Multiplexed

microphone audio and

control data

1 HS GND - Ground contact

Check microphone using "Hp microphone in Ext speaker out" loop

Steps

1. Connect phone with Phoenix.

2. Open “audio test” window from “Testing -> Audio test”, as shown in

Figure Phoenix audio test window

above.

3. Select “Hp microphone in Ext speaker out”

4. Select "Acc. Detection" as "Off".

5. Select “Loop” as “On”

6. Input sound at microphone port, for example 94dB SPL 1kHz.

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Baseband Troubleshooting Instructions

Page 3 –20 COMPANY CONFIDENTIAL Issue 1

7. Check if signal is detected at HS EAR L/R, shown in

Figure 4-pole jack plug for audio accessory

above.

Figure 20 Test arrangement for microphone

Check earpiece using "Ext microphone in Hp speaker out" loop

Steps

1. Connect phone with Phoenix.

2. Open the

Audio Test

window from Testing→ Audio test , as shown in Figure

Phoenix audio test

window

above.

3. Select Ext microphone in Hp speaker out.

4. Select Acc.Detection as Off.

5. Select Loop as On.

6. Input signal to HS MIC, as shown in Figure

4-pole jack plug for audio accessory

above, for example

100mVpp, 1kHz.

7. Check if sound is heard in the earpiece.

Figure 21 Test arrangement for of earpiece

Check IHF & ringing tone function using "Buzzer"

Steps

1. Connect phone with Phoenix.

2. Open “audio test” window from “Testing -> Audio test”, as shown in

Figure Phoenix audio test window

above.

3. In “Buzzer” area, select suitable signal to be played, for example 1 kHz, Strength 5”

4. Select “Volume” as “On”

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Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –21

5. Check if sound is heard in IHF.

Figure 22 Checking IHF and ring tone by using "Buzzer"

Check vibra function using "Vibra control"

Steps

1. Connect phone with Phoenix.

2. Open “Vibra control” window from “Testing -> Vibra control”, as shown in the figure below.

3. Select suitable intensity value, for example 53 %.

4. Select “Vibra state” as “Enabled”

5. Click “Write”.

6. Check if Vibra works.

Figure 23 Checking vibra function by using vibra control

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Baseband Troubleshooting Instructions

Page 3 –22 COMPANY CONFIDENTIAL Issue 1

Earpiece fault

Troubleshooting flow

Figure 24 Earpiece fault flow chart

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Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –23

IHF/ringing tone fault

Troubleshooting flow

Figure 25 IHF/ringing tone fault flow chart

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Baseband Troubleshooting Instructions

Page 3 –24 COMPANY CONFIDENTIAL Issue 1

Microphone fault

Troubleshooting flow

Figure 26 Microphone fault flow chart

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Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –25

Headset earpiece fault

Troubleshooting flow

Figure 27 Headset earpiece fault flow chart

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Baseband Troubleshooting Instructions

Page 3 –26 COMPANY CONFIDENTIAL Issue 1

Headset microphone fault

Troubleshooting flow

Figure 28 Headset microphone fault flow chart

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Baseband Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 3 –27

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4 — RF Troubleshooting

Instructions

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 4 –1

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RF Troubleshooting Instructions

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Table of Contents

General RF troubleshooting ..................................................................................................................................4–7

General RF troubleshooting .............................................................................................................................4–7

RF key components ...........................................................................................................................................4–7

Auto tuning........................................................................................................................................................4–9

RM-340 receiver .................................................................................................................................................. 4–10

General instructions for GSM900 RX troubleshooting ................................................................................ 4–10

Troubleshooting diagram for GSM900 receiver .......................................................................................... 4–12

General instructions for GSM 1800 RX troubleshooting ............................................................................. 4–13

Troubleshooting diagram for GSM1800 receiver ........................................................................................ 4–15

Measurement points in the receiver ............................................................................................................ 4–16

RM-340 transmitter............................................................................................................................................. 4–17

General instructions for GSM 900 TX troubleshooting................................................................................ 4–17

Troubleshooting diagram for GSM900 transmitter .................................................................................... 4–19

GSM900 TX output power.............................................................................................................................. 4–19

General instructions for GSM1800 TX troubleshooting .............................................................................. 4–22

Troubleshooting diagram for GSM1800 transmitter .................................................................................. 4–24

GSM1800 TX output power............................................................................................................................ 4–24

RM-341 receiver................................................................................................................................................... 4–27

General instructions for GSM 850 RX troubleshooting ............................................................................... 4–27

Troubleshooting diagram for GSM850 receiver .......................................................................................... 4–29

General instructions for GSM1900 RX troubleshooting .............................................................................. 4–30

Troubleshooting diagram for GSM1900 receiver ........................................................................................ 4–32

Measurement points in the receiver ............................................................................................................ 4–34

RM-341 transmitter ............................................................................................................................................ 4–35

General instructions for GSM 850 TX troubleshooting................................................................................ 4–35

Troubleshooting diagram for GSM850 transmitter .................................................................................... 4–37

GSM850 TX output power.............................................................................................................................. 4–38

General instructions for GSM1900 TX troubleshooting .............................................................................. 4–40

Troubleshooting diagram for GSM1900 transmitter .................................................................................. 4–42

GSM1900 TX output power............................................................................................................................ 4–43

Synthesizer troubleshooting ............................................................................................................................. 4–45

Introduction.................................................................................................................................................... 4–45

Troubleshooting diagram for PLL synthesizer ............................................................................................ 4–47

Measurement points at the VCXO ................................................................................................................. 4–48

FM radio and bluetooth troubleshooting ......................................................................................................... 4–48

Measurement settings ................................................................................................................................... 4–48

Troubleshooting diagram for FM radio........................................................................................................ 4–50

Bluetooth and FM radio test points.............................................................................................................. 4–51

Introduction to Bluetooth troubleshooting ................................................................................................ 4–52

Bluetooth settings for Phoenix..................................................................................................................... 4–52

Bluetooth self tests in Phoenix..................................................................................................................... 4–53

Bluetooth BER failure troubleshooting........................................................................................................ 4–54

Antenna troubleshooting ................................................................................................................................... 4–56

Antenna troubleshooting diagram............................................................................................................... 4–56

List of Figures

Figure 29 RF key components on PWB.................................................................................................................4–7

Figure 30 Supply points at UEM (D2200)..............................................................................................................4–8

Figure 31 Supply point at RF IC (N7600) ..............................................................................................................4–9

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –3

Figure 32 Supply point at BT & FM IC (N6000).....................................................................................................4–9

Figure 33 GSM900 RF controls window............................................................................................................. 4–11

Figure 34 GSM900 receiver troubleshooting .................................................................................................... 4–12

Figure 35 900 RX I/Q signal waveform.............................................................................................................. 4–13

Figure 36 GSM1800 RF controls window........................................................................................................... 4–14

Figure 37 GSM1800 receiver troubleshooting .................................................................................................. 4–15

Figure 38 1800 RX I/Q signal waveform............................................................................................................ 4–16

Figure 39 RX measurements point of the control voltages to FEM N7700.................................................... 4–16

Figure 40 Measurement points at the RX SAW Filters – Z7600/Z7602 ........................................................... 4–17

Figure 41 RX I/Q signals...................................................................................................................................... 4–17

Figure 42 GSM 900 RF controls window............................................................................................................ 4–18

Figure 43 GSM900 tarnsmitter troubleshooting .............................................................................................. 4–19

Figure 44 TX I/O signal........................................................................................................................................ 4–20

Figure 45 VC1, VC3 signals .................................................................................................................................. 4–20

Figure 46 TXP signal............................................................................................................................................ 4–21

Figure 47 TXC signals at PCL5 ............................................................................................................................. 4–21

Figure 48 TXC signals at PCL19........................................................................................................................... 4–22

Figure 49 GSM 1800 RF controls window.......................................................................................................... 4–23

Figure 50 GSM1800 transmitter troubleshooting ............................................................................................ 4–24

Figure 51 TX I/O signal........................................................................................................................................ 4–25

Figure 52 VC1, VC2, VC3 signals .......................................................................................................................... 4–25

Figure 53 TXP signal............................................................................................................................................ 4–26

Figure 54 TXC signals at PCL0 ............................................................................................................................. 4–26

Figure 55 TXC signals at PCL15........................................................................................................................... 4–27

Figure 56 GSM850 RF controls window............................................................................................................. 4–28

Figure 57 GSM850 receiver troubleshooting .................................................................................................... 4–29

Figure 58 850 RX I/Q signal waveform.............................................................................................................. 4–30

Figure 59 GSM 1900 RF controls window.......................................................................................................... 4–31

Figure 60 GSM1900 receiver troubleshooting .................................................................................................. 4–32

Figure 61 1900 RX I/Q signal waveform............................................................................................................ 4–33

Figure 62 RX measurements point of the control voltages to FEM N7700.................................................... 4–34

Figure 63 Measurement points at the RX SAW Filters – Z7600/Z7602 ........................................................... 4–34

Figure 64 RX I/Q signals...................................................................................................................................... 4–35

Figure 65 GSM 850 RF controls window............................................................................................................ 4–36

Figure 66 GSM850 transmitter troubleshooting .............................................................................................. 4–37

Figure 67 TX I/O signal........................................................................................................................................ 4–38

Figure 68 VC1, VC3 signal.................................................................................................................................... 4–38

Figure 69 TXP signal............................................................................................................................................ 4–39

Figure 70 TXC signals at PCL5 ............................................................................................................................. 4–39

Figure 71 TXC signals at PCL19........................................................................................................................... 4–40

Figure 72 GSM 1900 RF controls window.......................................................................................................... 4–41

Figure 73 GSM1900 transmitter troubleshooting ............................................................................................ 4–42

Figure 74 TX I/O signal........................................................................................................................................ 4–43

Figure 75 VC1, VC2, VC3 signals .......................................................................................................................... 4–43

Figure 76 TXP signal............................................................................................................................................ 4–44

Figure 77 TXC signals at PCL0 ............................................................................................................................. 4–44

Figure 78 TXC signals at PCL15........................................................................................................................... 4–45

Figure 79 VCXO 26 MHz waveform..................................................................................................................... 4–46

Figure 80 PLL Troubleshooting diagram........................................................................................................... 4–47

Figure 81 Measurement point for VCXO ............................................................................................................ 4–48

Figure 82 Phoenix settings................................................................................................................................. 4–49

Figure 83 FM circuit troubleshooting diagram................................................................................................. 4–50

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RF Troubleshooting Instructions

Page 4 –4 COMPANY CONFIDENTIAL Issue 1

Figure 84 Bluetooth and FM radio test points.................................................................................................. 4–51

Figure 85 XAUDIO output signal......................................................................................................................... 4–51

Figure 86 FM module output signal................................................................................................................... 4–52

Figure 87 BER test result..................................................................................................................................... 4–53

Figure 88 Bluetooth self tests in Phoenix......................................................................................................... 4–54

Figure 89 Antenna troubleshooting.................................................................................................................. 4–56

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –5

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General RF troubleshooting

Most RF semiconductors are static discharge sensitive

Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or

"LF".

• RF measurements are done with a Spectrum Analyzer and a high-frequency 500 ohm passive probe, for

example HP54006A. (Note that when measuring with the 500ohm probe the signal will be around 20dB

attenuated. The values in the following will have these 20dB subtracted and represent the real value seen

on the spectrum analyzer). Note that the testing have some losses which must be taken into consideration

when calibrating the test system.

•LF (Low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe

used in the following is 10Mohm/8pF passive probe. If using another probe then bear in mind that the

voltages displayed may be slightly different. Always make sure the measurement set-up is calibrated when

measuring RF parameters on the antenna pad. Remember to include the loss in the module repair jig when

realigning the phone.

So ESD protection must be applied during repair (ground straps and ESD soldering irons). Mjoelner and Bifrost

are moisture sensitive so parts must be pre-baked prior to soldering. Apart from key-components described

in this document there are a lot of discrete components (resistors, inductors and capacitors) for which

troubleshooting is done by checking if soldering of the component is done properly and checking if the

component is missing from PWB. Capacitors can be checked for short-circuiting and resistors for value by

means of an ohmmeter, but be aware in-circuit measurements should be evaluated carefully. In the following

both the name EGSM and GSM850 will be used for the lower band and both PCN and GSM1900 will be used

for the upper band.

RF key components

Figure 29 RF key components on PWB

N7600 PMB3258 RF IC

N7700 FEM (PA and antenna switch)

Z7602 EGSM 850/900 RX SAW filter

Z7600 DCS 1800/PCS1900 RX SAW filter

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –7

Z7603 EGSM 850/900 TX filter

Z7604 DCS 1800/PCS1900 TX filter

B7600 26 MHz crystal

N6000 BT & FM IC

Z6000 BT SAW filter

Refer to the picture below for measuring points at the UEM (D2200).

Figure 30 Supply points at UEM (D2200)

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RF Troubleshooting Instructions

Page 4 –8 COMPANY CONFIDENTIAL Issue 1

Figure 31 Supply point at RF IC (N7600)

Figure 32 Supply point at BT & FM IC (N6000)

Auto tuning

This phone can be tuned automatically.

RM-340; RM-341

RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –9

Autotune is designed to align the phone's RF part easier and faster. It performs calibrations, tunings and

measurements of RX and TX. The results are displayed and logged in a result file, if initiated.

Hardware set up

Hardware requirements for auto tuning:

• PC (Windows 2000/NT) with GPIB card

• Power supply

• Product specific module jig

• Cables: 3 (alt.1) RF cable, 1 GPIB cable and DAU-9S

• Signal analyser (TX), signal generator (RX) and RF-splitter

one device including all.

Phoenix preparations

Copy the two phone specific ini-files, for example

rm_13_tunings.ini

and

autotune_RM-13.ini,

to a phone

specific folder, for example

\Phoenix\products\RM-13\

Auto tuning procedure

1 Make sure the phone (in the jig) is connected to the equipment. Else, some menus will not be shown in

Phoenix.

2 The first time you are using automatic tuning on this phone model, on this computer, you will have to

Set loss

for cables and jigs.

3 To go to autotune, select

Tuning (Alt-U)

Auto-Tune (Alt-A)

from the menu.

4 If you need more assistance, please refer to the Phoenix

Help

RM-340 receiver

General instructions for GSM900 RX troubleshooting

Steps

1. Connect the phone to a PC with the module repair jig.

2. Start

Phoenix

and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Active Unit: RX

ii Band: GSM 900

iii Operation Mode: Continuous mode

iv RX/TX Channel 37

v AGC: 8: FEG_ON + DTOS_ON+BB_6=Vgain_36

Results

The setup should now look like this:

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RF Troubleshooting Instructions

Page 4 –10 COMPANY CONFIDENTIAL Issue 1

Figure 33 GSM900 RF controls window

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –11

Troubleshooting diagram for GSM900 receiver

Troubleshooting flow

Figure 34 GSM900 receiver troubleshooting

Results

By measuring with an oscilloscope at RXIP or RXQP on a working GSM900 receiver this picture should be seen.

Signal amplitude peak-peak 108mV. DC offset 1.0V.

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RF Troubleshooting Instructions

Page 4 –12 COMPANY CONFIDENTIAL Issue 1

Figure 35 900 RX I/Q signal waveform

General instructions for GSM 1800 RX troubleshooting

Steps

1. Connect the phone to a PC with the module repair jig.

2. Start

Phoenix

and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Active Unit: RX

ii Band: GSM 1800

iii Operation Mode: Continuous mode

iv RX/TX Channel 700

v AGC: 8: FEG_ON + DTOS_ON+BB_6=Vgain_36

Results

The setup should now look like this:

RM-340; RM-341

RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –13

Figure 36 GSM1800 RF controls window

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RF Troubleshooting Instructions

Page 4 –14 COMPANY CONFIDENTIAL Issue 1

Troubleshooting diagram for GSM1800 receiver

Troubleshooting flow

Figure 37 GSM1800 receiver troubleshooting

Results

By measuring with an oscilloscope at RXIP or RXQP on a working GSM1800 receiver this picture should be

seen. Signal amplitude peak-peak 114mV. DC offset 1.0V.

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –15

Figure 38 1800 RX I/Q signal waveform

Measurement points in the receiver

Figure 39 RX measurements point of the control voltages to FEM N7700

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RF Troubleshooting Instructions

Page 4 –16 COMPANY CONFIDENTIAL Issue 1

Figure 40 Measurement points at the RX SAW Filters – Z7600/Z7602

Figure 41 RX I/Q signals

RM-340 transmitter

General instructions for GSM 900 TX troubleshooting

Steps

1. Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be

connected to an attenuator at least 10dB before connected to the measurement equipment, otherwise

the PA may be damaged.

2. Start

Phoenix

and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Band: GSM 900

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –17

ii Active Unit: TX

iii TX Power Level: 5

iv TX Data Type: Random

Results

The setup should now look like this:

Figure 42 GSM 900 RF controls window

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RF Troubleshooting Instructions

Page 4 –18 COMPANY CONFIDENTIAL Issue 1

Troubleshooting diagram for GSM900 transmitter

Troubleshooting flow

Figure 43 GSM900 tarnsmitter troubleshooting

GSM900 TX output power

Measure the output power of the phone; it should be about 32.5dBm. Remember the cable loss is about

0.3dB.

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –19

Figure 44 TX I/O signal

Figure 45 VC1, VC3 signals

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RF Troubleshooting Instructions

Page 4 –20 COMPANY CONFIDENTIAL Issue 1

Figure 46 TXP signal

Figure 47 TXC signals at PCL5

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RF Troubleshooting Instructions

Issue 1 COMPANY CONFIDENTIAL Page 4 –21

Figure 48 TXC signals at PCL19

General instructions for GSM1800 TX troubleshooting

Steps

1. Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be

connected to an attenuator at least 10dB before connected to the measurement equipment, otherwise

the PA may be damaged.

2. Start

Phoenix

and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Band: GSM 1800

ii Active Unit: TX

iii TX Power Level: 0

iv TX Data Type: Random

Results

The setup should now look like this:

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Figure 49 GSM 1800 RF controls window

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Troubleshooting diagram for GSM1800 transmitter

Troubleshooting flow

Figure 50 GSM1800 transmitter troubleshooting

GSM1800 TX output power

Measure the output power of the phone; it should be about 30.5dBm. Remember the cable loss is about

0.5dB.

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Figure 51 TX I/O signal

Figure 52 VC1, VC2, VC3 signals

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Figure 53 TXP signal

Figure 54 TXC signals at PCL0

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Figure 55 TXC signals at PCL15

RM-341 receiver

General instructions for GSM 850 RX troubleshooting

Steps

1. Connect the phone to a PC with the module repair jig.

2. Start

Phoenix

and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Active Unit: RX

ii Band: GSM 850

iii Operation Mode: Continuous mode

iv RX/TX Channel 190

v AGC: 8: FEG_ON + DTOS_ON+BB_6=Vgain_36

Results

The setup should now look like this:

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Figure 56 GSM850 RF controls window

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Troubleshooting diagram for GSM850 receiver

Troubleshooting flow

Figure 57 GSM850 receiver troubleshooting

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Results

By measuring with an oscilloscope at RXIP or RXQP on a working GSM850 receiver this picture should be seen.

Signal amplitude 114mVp-p. DC offset 1.0V.

Figure 58 850 RX I/Q signal waveform

General instructions for GSM1900 RX troubleshooting

Steps

1. Connect the phone to a PC with the module repair jig.

2. Start Phoenix and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Active Unit: RX

ii Band: GSM 1900

iii Operation Mode: Continuous mode

iv RX/TX Channel 661

v AGC: 8: FEG_ON + DTOS_ON+BB_6=Vgain_36

Results

The setup should now look like this:

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Figure 59 GSM 1900 RF controls window

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Troubleshooting diagram for GSM1900 receiver

Troubleshooting flow

Figure 60 GSM1900 receiver troubleshooting

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Results

By measuring with an oscilloscope at RXIP or RXQP on a working GSM1900 receiver this picture should be

seen. Signal amplitude 108 mVp-p. DC offset 1.0V.

Figure 61 1900 RX I/Q signal waveform

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Measurement points in the receiver

Figure 62 RX measurements point of the control voltages to FEM N7700

Figure 63 Measurement points at the RX SAW Filters – Z7600/Z7602

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Figure 64 RX I/Q signals

RM-341 transmitter

General instructions for GSM 850 TX troubleshooting

Steps

1. Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be

connected to an attenuator at least 10dB before connected to the measurement equipment, otherwise

the PA may be damaged.

2. Start

Phoenix

and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Band: GSM 850

ii Active Unit: TX

iii TX Power Level: 5

iv TX Data Type: Random

Results

The setup should now look like this:

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Figure 65 GSM 850 RF controls window

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Troubleshooting diagram for GSM850 transmitter

Troubleshooting flow

Figure 66 GSM850 transmitter troubleshooting

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GSM850 TX output power

Measure the output power of the phone; it should be about 32.5 dBm. Remember the cable loss is about 0.3

dB.

Figure 67 TX I/O signal

Figure 68 VC1, VC3 signal

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Figure 69 TXP signal

Figure 70 TXC signals at PCL5

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Figure 71 TXC signals at PCL19

General instructions for GSM1900 TX troubleshooting

Steps

1. Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be

connected to an attenuator at least 10dB before connected to the measurement equipment, otherwise

the PA may be damaged.

2. Start

Phoenix

and establish a connection to the phone with the data cable e.g. FBUS.

3. Select File and Scan product.

4. Wait a while for the PC to read the information from the phone.

5. Select Testing and RF Controls.

6. Set the parameters as follows:

i Band: GSM 1900

ii Active Unit: TX

iii TX Power Level: 0

iv TX Data Type: Random

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7. The setup should now look like this:

Figure 72 GSM 1900 RF controls window

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Troubleshooting diagram for GSM1900 transmitter

Troubleshooting flow

Figure 73 GSM1900 transmitter troubleshooting

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GSM1900 TX output power

Measure the output power of the phone; it should be about 29.1dBm. Remember the cable loss is about

0.5dB.

Figure 74 TX I/O signal

Figure 75 VC1, VC2, VC3 signals

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Figure 76 TXP signal

Figure 77 TXC signals at PCL0

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Figure 78 TXC signals at PCL15

Synthesizer troubleshooting

Introduction

26 MHz Reference Oscillator (VCXO)

There is only one PLL synthesizer generating Local Oscillator frequencies for both RX and TX in both bands

(PCN and EGSM). The VCO frequency is divided by 2 for PCN operation or by 4 for EGSM operation inside the

Mjoelner IC.

The 26MHz oscillator is located near the Mjoelner IC. (N7600). The coarse frequency for this oscillator is set

by an external crystal (B7600). The reference oscillator is used as a reference frequency for the PLL synthesizer

and as the system clock for the Baseband. The 26MHz signal is divided by 2 to achieve 13MHz inside the UPP

IC (D2800).

The 26MHz signal from the VCXO can be measured by probing R2900. The level at this point is approx.

770mVpp. Frequency of this oscillator is adjusted by changing the AFC-register inside the UEM IC. Example

Signal Measured at VCXO output (R2900).

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Figure 79 VCXO 26 MHz waveform

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Troubleshooting diagram for PLL synthesizer

Figure 80 PLL Troubleshooting diagram

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Measurement points at the VCXO

Figure 81 Measurement point for VCXO

FM radio and bluetooth troubleshooting

Measurement settings

Steps

1. Connect the phone to a PC with the module repair jig.

2. Start Phoenix and establish a connection to the phone with the data cable e.g. FBUS.

3. Phoenix settings shall be as follows:

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Figure 82 Phoenix settings

4. Establish input of a standard FM signal to the FM module.

5. Signal generator settings shall be as follows:

i Frequency: 98 MHz

ii Level: - 60 dBm

iii FM deviation: 75 kHz

iv LFGEN frequency: 1 kHZ

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Troubleshooting diagram for FM radio

Troubleshooting flow

Figure 83 FM circuit troubleshooting diagram

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Bluetooth and FM radio test points

Figure 84 Bluetooth and FM radio test points

Figure 85 XAUDIO output signal

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Figure 86 FM module output signal

Introduction to Bluetooth troubleshooting

There are two main Bluetooth (BT) problems that can occur:

Problem Description

Detachment of the BT antenna. This would most likely happen if the device has

been dropped repeatedly to the ground. It could

cause the BT antenna to become loose or partially

detached from the PWB.

A malfunction in the BT ASIC, BB ASICs or the phone’s

BT SMD components.

This is unpredictable and could have many causes

i.e. SW or HW related.

The main issue is to find out if the problem is related to the BT antenna or related to the BT system or the

phone’s BB and then replace/fix the faulty component. For location of the antenna, please refer to the

exploded view in the Parts and layouts section.

Bluetooth settings for Phoenix

Steps

1. Start

Phoenix

service software.

2. From the File menu, choose Open Product, and then choose the correct type designator from the

Product list.

3. Place the phone to a flash adapter in the local mode.

4. Choose Testing→Bluetooth LOCALS .

5. Locate JBT-9’s serial number (12 digits) found in the type label on the back of JBT-9.

In addition to JBT-9, also SB-6, JBT-3 and JBT-6 Bluetooth test boxes can be used.

6. In the

Bluetooth LOCALS

window, write the 12-digit serial number on the

Counterpart BT Device Address line.

This needs to be done only once provided that JBT-9 is not changed.

7. Place the JBT-9 box near (within 10 cm) the BT antenna and click Run BER Test.

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Results

Bit Error Rate test result is displayed in the

Bit Error Rate (BER) Tests

pane in the

Bluetooth LOCALS

window.

Figure 87 BER test result

Bluetooth self tests in Phoenix

Steps

1. Start

Phoenix

service software.

2. ChooseFile→Scan Product.

3. Place the phone to a flash adapter.

4. From the Mode drop-down menu, set mode to Local.

5. Choose Testing→Self Tests.

6. In the

Self Tests

window check the following Bluetooth related tests:

•ST_LPRF_IF_TEST

•ST_LPRF_AUDIO_LINES_TEST

•ST_BT_WAKEUP_TEST

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7. To run the tests, click Start.

Figure 88 Bluetooth self tests in

Phoenix

Bluetooth BER failure troubleshooting

Context

Basic encoding rules, BER, is a self-identifying and self-delimiting encoding scheme, which means that each

data value can be identified, extracted and decoded individually.

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Bluetooth circuit troubleshooting diagram

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Antenna troubleshooting

Antenna troubleshooting diagram

Troubleshooting flow

Figure 89 Antenna troubleshooting

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5 — Camera Module

Troubleshooting

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 5 –1

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Table of Contents

Introduction to camera module troubleshooting ..............................................................................................5–5

The effect of image taking conditions on image quality...................................................................................5–6

Camera construction........................................................................................................................................... 5–10

Dynamic camera configuration.......................................................................................................................... 5–12

Image quality analysis ....................................................................................................................................... 5–13

Testing for dust in camera module .............................................................................................................. 5–13

Testing camera image sharpness................................................................................................................. 5–14

Dirty camera lens protection window ......................................................................................................... 5–15

Image bit errors ............................................................................................................................................. 5–15

Camera troubleshooting flowcharts.................................................................................................................. 5–16

Camera hardware failure message troubleshooting.................................................................................. 5–16

Camera baseband HW troubleshooting....................................................................................................... 5–18

Camera viewfinder troubleshooting ............................................................................................................ 5–19

Bad camera image quality troubleshooting................................................................................................ 5–20

List of Tables

Table 5 Camera specifications............................................................................................................................ 5–10

List of Figures

Figure 90 Blurred image. Target too close. .........................................................................................................5–6

Figure 91 Blurring caused by shaking hands ......................................................................................................5–7

Figure 92 Near objects get skewed when taking images from a moving vehicle...........................................5–7

Figure 93 Noisy image taken in +70 degrees Celsius .........................................................................................5–8

Figure 94 Image taken against light....................................................................................................................5–8

Figure 95 Flicker in an image; object illuminated by strong fluorescent light................................................5–9

Figure 96 A lens reflection effect caused by sunshine........................................................................................5–9

Figure 97 Good image taken indoors................................................................................................................ 5–10

Figure 98 Good image taken outdoors ............................................................................................................. 5–10

Figure 99 Camera module cross section and assembly principle................................................................... 5–11

Figure 100 Camera module bottom view including serial numbering.......................................................... 5–12

Figure 101 DCC data update .............................................................................................................................. 5–13

Figure 102 Effects of dust on optical path........................................................................................................ 5–14

Figure 103 Image taken with clean protection window................................................................................. 5–15

Figure 104 Image taken with greasy protection window .............................................................................. 5–15

Figure 105 Bit errors caused by JPEG compression.......................................................................................... 5–16

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Introduction to camera module troubleshooting

Background, tools and terminology

Faults or complaints in camera operation can be roughly categorised into three subgroups:

1 Camera is not functional at all; no image can be taken.

2 Images can be taken but there is nothing recognizable in them.

3 Images can be taken and they are recognizable but for some reason the quality of images is seriously

degraded.

Image quality is very hard to measure quantitatively, and even comparative measurements are difficult

(comparing two images) to do, if the difference is small. Especially if the user is not satisfied with his/her

device's image quality, and tells, for example, that the images are not sharp, it is fairly difficult to accurately

test the device and get an exact figure which would tell whether the device is functioning properly.

Often subjective evaluation has to be used for finding out if a certain property of the camera is acceptable

or not. Some training or experience of a correctly operating reference device may be needed in order to

detect what actually is wrong.

It is easy for the user to take bad images in bad conditions. Therefore the camera operation has to be checked

always in constant conditions (lighting, temperature) or by using a second, known-to-be good device as

reference.

When checking for possible errors in camera functionality, knowing what error is suspected significantly

helps the testing by narrowing down the amount of test cases. The following types of image quality problems

may be expected to appear:

• Dust (black spots)

• Lack of sharpness

• Bit errors

Terms

Dynamic range

Camera's ability to capture details in dark and bright areas of the scene

simultaneously.

Exposure time

Camera modules use silicon sensor to collect light and for forming an

image. The imaging process roughly corresponds to traditional film

photography, in which exposure time means the time during which the

film is exposed to light coming through optics. Increasing the time will

allow for more light hitting the film and thus results in brighter image. The

operation principle is exactly the same with silicon sensor, but the shutter

functionality is handled electronically i.e. there is no mechanical moving

parts like in film cameras.

Flicker

Phenomenon, which is caused by pulsating in scene lighting, typically

appearing as wide horizontal stripes in an image.

Noise

Variation of response between pixels with same level of input illumination.

Resolution

Usually the amount of pixels in the camera sensor; for example,

RM-340/341 has a 640 x 480 pixel sensor resolution. In some occasions the

term resolution is used for describing the sharpness of the images.

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Sensitivity

Camera module's sensitivity to light. In equivalent illumination conditions,

a less sensitive camera needs a longer exposure time to gather enough

light in forming a good image. Analogous to ISO speed in photographic

film.

Sharpness

Good quality images are 'sharp' or 'crisp', meaning that image details are

well visible in the picture. However, certain issues, such as non-idealities

in optics or high levels of digital zoom, cause image blurring, making

objects in picture to appear 'soft'. Each camera type typically has its own

level of performance.

The effect of image taking conditions on image quality

There are some factors, which may cause poor image quality, if not taken into account by the end user when

shooting images, and thus may result in complaints. The items listed are normal to camera operation and

are not a reason for changing the camera module.

Distance to target

The lens in the module is specified to operate satisfactorily from 20 cm to infinite distance of scene objects.

In practice, the operation is such that close objects may be noticed to get more blurred when distance to

them is shorter than 20 cm. The lack of sharpness is first visible in full resolution images. If observing just

the viewfinder, even very close objects may seem to appear sharp. This is normal; do not change the camera

module.

Figure 90 Blurred image. Target too close.

The amount of light available

In dim conditions camera runs out of sensitivity. The exposure time is long (especially in the night mode)

and the risk of getting shaken (= blurred) images increases. In addition, image noise level grows. The

maximum exposure time in the night mode is ¼ seconds. Therefore, images need to be taken with extreme

care and by supporting the phone when the amount of light reflected from the target is low. Because of the

longer exposure time and larger gain value, noise level increases in low light conditions. Sometimes blurring

may even occur in daytime, if the image is taken very carelessly. See the figure below for an example. This

is normal; do not change the camera module.

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Figure 91 Blurring caused by shaking hands

Movement in bright light

If an image is taken of moving objects or if the device is used in a moving vehicle, object 'skewing' or 'tilting'

may occur. This phenomenon is fundamental to most CMOS camera types, and usually cannot be avoided.

The movement of camera or object sometimes cause blurring indoors or in dim lighting conditions because

of long exposure time. This is normal; do not change the camera module.

Figure 92 Near objects get skewed when taking images from a moving vehicle

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Temperature

High temperatures inside the mobile phone cause more noise to appear in images. For example, in +70

degrees (Celsius), the noise level may be very high, and it further grows if the conditions are dim. If the phone

processor has been heavily loaded for a long time before taking an image, the phone might have considerably

higher temperature inside than in the surrounding environment. This is also normal to camera operation;

do not change the camera module.

Figure 93 Noisy image taken in +70 degrees Celsius

Phone display

If the display contrast is set too dark, the image quality degrades: the images may be very dark depending

on the setting. If the display contrast is set too bright, image contrast appears bad and "faint". This problem

is solved by setting the display contrast correctly. This is normal behaviour; do not change the camera module.

Basic rules of photography (especially shooting against light)

Because of dynamic range limitations, taking images against bright light might cause either saturated image

or the actual target appear too dark. In practice, this means that when taking an image indoors and having,

for example, a window behind the object, the result is usually poor. This is normal behaviour; do not change

the camera module.

Figure 94 Image taken against light

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Flicker

In some occasions a bright fluorescent light may cause flicker in the viewfinder and captured image. This

phenomenon may also be a result, if images are taken indoors under the mismatch of 50/60 Hz electricity

network frequency. The electricity frequency used is automatically detected by the camera module. In some

very few countries, both 50 and 60 Hz networks are present and thus probability for the phenomenon

increases. Flickering occurs also under high artificial illumination level. This is normal behaviour; do not

change the camera module.

Figure 95 Flicker in an image; object illuminated by strong fluorescent light

Bright light outside of image view

Especially the sun can cause clearly visible lens glare phenomenon and poor contrast in images. This happens

because of undesired reflections inside the camera optics. Generally this kind of reflections are common in

all optical systems. This is normal behaviour; do not change the camera module.

Figure 96 A lens reflection effect caused by sunshine

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Examples of good quality images

Figure 97 Good image taken indoors

Figure 98 Good image taken outdoors

Camera construction

This section describes the mechanical construction of the camera module for getting a better understanding

of the actual mechanical structure of the module.

Table 5 Camera specifications

Sensor type CMOS Sensor

Photo detectors 0.3 million

F number/Aperture f/2.8

Focal length 1.78 mm

Focus range 20 cm to infinity

Still Image resolutions 640x480, 320x240, 160x120

Still images file format EXIF (JPEG), *.jpg

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Video resolutions 128x96, at 13 frames per second

Video clip length 9 seconds or free, maximal clip length in free mode

is 2 minutes (limited by the data storing capabilities

of the device)

Video file format 3GPP, *.3gp

Exposure Automatic

White Balance Automatic

Colours 16.7 million / 24-bit

Capture Modes Night mode, Sequence mode, self timer

Figure 99 Camera module cross section and assembly principle

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Figure 100 Camera module bottom view including serial numbering

The camera module as a component is not a repairable part, meaning that the components inside the module

may not be changed. Cleaning dust from the front face is allowed only. Use clean compressed air.

The camera module uses socket type connecting. For versioning, laser marked serial numbering is used on

the PWB.

The main parts of the module are:

• Lens unit including lens aperture.

•Infrared filter; used to prevent infrared light from contaminating the image colours. The IR filter is glued

to the EMI shielded camera body.

• Camera body; made of conductive metallized plastic and attached to the PWB with glue.

• Sensor array including DSP functions is glued and wire-bonded to the PWB.

• PWB, FR-4 type

• Passive components

• Camera protection window; part of the phone cover mechanics

• Dust gasket between the lens unit and camera protection window

Dynamic camera configuration

DCC (Dynamic Camera Configuration) is a system to allow final camera tuning values to be programmed on

Service Centre. DCC data generated for a camera hardware is set by Camera Entity IQ department and placed

into global DCC settings database. Service centres could replace a defective module with a spare one to get

camera function recovered by updating DCC data.

DCC data update instruction

Service software is used to update DCC data when camera configuration (a camera or a hardware accelerator)

of the terminal has been changed. Service software DCC update feature reads camera configuration

identification from the terminal, selects a new configuration data file from DP (data package) and writes

data into the memory of the terminal during the process. If the update fails, new camera configuration

installed into the terminal is not supported by DP. Always update DCC when a camera or a HWA has been

changed.

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In Service software press “Read”, and the Camera Configuration window shows available DCC data file name

and its version to upload. If the previous camera configuration was the same as installed, then Current

Configuration Version displays DCC data version currently in the terminal memory, otherwise it shows xxx.xxx.

Press “Upload” and then the DCC data settings are updated.

Figure 101 DCC data update

Image quality analysis

Testing for dust in camera module

Symptoms and diagnosis

For detecting these kinds of problems, take an image of a uniform white surface and analyse it in full

resolution. A good quality PC monitor is preferred for analysis. Search carefully, since finding these defects

is not always easy. Figure "Effects of dust on optical path" is an example image containing easily detectable

dust problems.

When taking a white image, use uniformly lightened white paper or white wall. One possibility is to use

uniform light but in this case make sure that the camera image is not flickering when taking the test image.

In case flickering happens, try to reduce illumination level. Use JPEG image format for analysing, and set the

image quality parameter to ‘High Quality’.

Black spots in an image are caused by dirt particles trapped inside the optical system. Clearly visible and

sharp edged black dots in an image are typically dust particles on the image sensor. These spots are searched

for in the manufacturing phase, but it is possible that the camera body cavity contains a particle, which may

move onto the image sensor active surface, for example, when the phone is dropped. Thus it is also possible

that the problem will disappear before the phone is brought to service. The camera should be replaced if the

problem is present when the service technician analyses the phone.

If a dust particle is lying on the infrared filter surface on either side, they are hard to locate because they are

out of focus, and appear in the image as large, grayish and fading-edge 'blobs'. Sometimes they are invisible

to the eye, and thus the user probably does not notice them at all. However, it is possible that a larger particle

disturbs the user, causing need for service.

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Figure 102 Effects of dust on optical path

If large dust particles get trapped on top of the lens surface in the cavity between camera window and lens,

they will cause image blurring and poor contrast. The dust gasket between the window and lens should

prevent any particles from getting into the cavity after the manufacturing phase. Dust in this position should

be blown away by using compressed air.

Unauthorized disassembling of the product can also be the root of the problem. However, in most cases it

should be possible to remove the particle(s) by using clean compressed air. Never wipe the lens surface before

trying compressed air; the possibility of damaging the lens is substantial. Always check the image sharpness

after removing dust.

Testing camera image sharpness

Symptoms and diagnosis

If pictures taken with a device are claimed to be blurry, there are six possible sources for the problem:

1 The protection window is fingerprinted, soiled, dirty, visibly scratched or broken.

2 The photographed object is too close – the camera lens operates with distances from 20 cm to infinity.

This is no cause to replace camera module.

3 User has tried to take pictures in too dark conditions, and images are blurred due to handshake or

movement. This is no cause to replace camera module.

4 There is dirt between the protection window and camera lens.

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5The protection window is defective. This can be either a manufacturing failure or caused by the user. The

window should be changed.

6 The camera lens is misfocused because of a manufacturing error.

7 Very high level of digital zoom is used

A quantitative analysis of sharpness is very difficult to conduct in any other environment than optics

laboratory. Therefore, subjective analysis should be used.

If no visible defects (items 1-4) are found, a couple of test images should be taken. Generally, a well-

illuminated typical indoor scene can be used as a target. The main considerations are:

• The protection window has to be clean.

• The amount of light (300 – 600 lux (bright office lighting)) is sufficient.

• The scene should contain, for example, small objects for checking sharpness. Their distance should be 1

– 2 meters.

• If possible, compare the image to another image of the same scene, taken with a different device. Note

that the reference device has to be a similar Nokia phone.

Steps

1. Take several images of small objects in the distance of 1-2 metres.

2. Analyse the images on a PC screen at 100% scaling with the reference images.

Pay attention to the computer display settings: at least 65000 colors (16-bit) have to be used. True colour

(24-bit, 16 million colours) or 32-bit (full colour) setting is recommended.

Next actions

If there appears to be a clearly noticeable difference between the reference image and the test images, the

module might have a misfocused lens -> change the module.

Re-check the resolution after changing the camera module.

If the changed module produces the same result, the fault is probably in the camera window. Check the

window by looking carefully through it when replacing the module.

Dirty camera lens protection window

The following series of images demonstrates the effects of fingerprints on the camera protection window.

It should be noted that the effects of any dirt in images can vary much. It may be difficult to judge whether

the window has been dirty or if something else is wrong. Therefore, the cleanness of the protection window

should always be checked and the window should be wiped clean with a suitable cloth.

Figure 103 Image taken with clean protection window Figure 104 Image taken with greasy protection window

Image bit errors

Bit errors are image defects caused by data transmission errors between the camera module and the phone

baseband and/or errors inside the module.

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Issue 1 COMPANY CONFIDENTIAL Page 5 –15

Usually bit errors can be easily detected in images, and they are best visible in full resolution images. A good

practice is to use a uniform white test target when analysing these errors. The errors are clearly visible,

colourful sharp dots or lines in camera images. See the following figure.

Figure 105 Bit errors caused by JPEG compression

One type of bit error is a lack of bit depth. In this case, the image is almost totally black under normal

conditions, and only senses something in very highly illuminated environments. Typically this is a contact

problem between the camera module and the phone main PWB. Very black images and viewfinder may also

be caused by failure of the 2.8V supply to the camera. You should check the camera assembly and connector

contacts.

If the fault is in the camera module, bit errors are typically visible only when using some specific image

resolution. For example, in case of a viewfinder fault, the error might exist but is not visible in a full size

image.

Camera troubleshooting flowcharts

Camera hardware failure message troubleshooting

Context

If you get a hardware failure message when using the camera, follow the next troubleshooting flowchart.

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Page 5 –16 COMPANY CONFIDENTIAL Issue 1

Troubleshooting flow

Note: Make sure that the phone has the latest software before continuing.

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Camera Module Troubleshooting

Issue 1 COMPANY CONFIDENTIAL Page 5 –17

Camera baseband HW troubleshooting

Troubleshooting flow

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Camera Module Troubleshooting

Page 5 –18 COMPANY CONFIDENTIAL Issue 1

Camera viewfinder troubleshooting

Troubleshooting flow

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Camera Module Troubleshooting

Issue 1 COMPANY CONFIDENTIAL Page 5 –19

Bad camera image quality troubleshooting

Troubleshooting flow

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Camera Module Troubleshooting

Page 5 –20 COMPANY CONFIDENTIAL Issue 1

6 — System Module

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 6 –1

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System Module

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Page 6 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

System module block diagram .............................................................................................................................6–5

Baseband description ............................................................................................................................................6–6

Functional description......................................................................................................................................6–6

UPP .....................................................................................................................................................................6–6

Memory ..............................................................................................................................................................6–6

UEMCLite .............................................................................................................................................................6–6

External regulators............................................................................................................................................6–6

Energy management.........................................................................................................................................6–7

Modes of operation...........................................................................................................................................6–8

Voltage limits.....................................................................................................................................................6–8

Audio function description...............................................................................................................................6–8

External audio connector .................................................................................................................................6–9

HALL sensor..................................................................................................................................................... 6–10

Interfaces ............................................................................................................................................................. 6–12

RF and baseband interfaces .......................................................................................................................... 6–12

Analogue Signals............................................................................................................................................ 6–14

LCD interface ................................................................................................................................................... 6–15

Keyboard ......................................................................................................................................................... 6–15

SIM interface ................................................................................................................................................... 6–16

External signals and connections ................................................................................................................. 6–18

Battery connector........................................................................................................................................... 6–18

Battery interface............................................................................................................................................. 6–19

PWB outline .................................................................................................................................................... 6–20

RF description ...................................................................................................................................................... 6–20

Frequency band, power and multi-slot class............................................................................................... 6–20

Transmitter - general description ................................................................................................................ 6–21

Transmitter - signal processing.................................................................................................................... 6–21

Receiver - general description ...................................................................................................................... 6–21

VCXO and PLL................................................................................................................................................... 6–22

Technical specifications...................................................................................................................................... 6–22

General specifications.................................................................................................................................... 6–22

Battery endurance.......................................................................................................................................... 6–23

Environmental conditions ............................................................................................................................. 6–23

Electrical characteristics ................................................................................................................................ 6–23

List of Tables

Table 6 Voltage limits ............................................................................................................................................6–8

Table 7 Connector for External Audio Accessories ........................................................................................... 6–10

Table 8 AC and DC Characteristics of BB4.0 LiteV2 RF-Base band Digital Signals .......................................... 6–12

Table 9 AC and DC Characteristics of RF-Base band Analogue Signals ........................................................... 6–14

Table 10 SIM interface......................................................................................................................................... 6–17

Table 11 System connector ................................................................................................................................ 6–18

Table 12 Battery IF .............................................................................................................................................. 6–18

Table 13 Pin numbering of battery pack .......................................................................................................... 6–19

Table 14 Frequency bands and TX power class................................................................................................ 6–20

Table 15 Multi-slot class ..................................................................................................................................... 6–21

Table 16 Normal and extreme voltages............................................................................................................ 6–23

Table 17 Current consumption........................................................................................................................... 6–24

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List of Figures

Figure 106 Module block diagram........................................................................................................................6–5

Figure 107 Power connection diagram................................................................................................................6–7

Figure 108 SIM filtering .........................................................................................................................................6–7

Figure 109 Audio block diagram...........................................................................................................................6–9

Figure 110 4-pole jack plug for audio accessory.............................................................................................. 6–10

Figure 111 HALL sensor....................................................................................................................................... 6–11

Figure 112 Keyboard schematics....................................................................................................................... 6–16

Figure 113 SIM interface block diagram ........................................................................................................... 6–17

Figure 114 BL-5BT battery pack contacts.......................................................................................................... 6–19

Figure 115 PWB top side component placement............................................................................................. 6–20

Figure 116 PWB bottom side component placement...................................................................................... 6–20

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System module block diagram

The main board consists of a radio frequency part and a baseband part. The User Interface parts are situated

at the UI side, which is on the opposite side of the engine board. The 2CP is the engine module of the mobile

device, and the 2CQ is the UI module of module of the mobile device.

Figure 106 Module block diagram

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Baseband description

Functional description

The BB core is based on UPP8M CPU. UPP8M takes care of all the signal processing and operation controlling

tasks of the mobile device. For power management, there is one main ASIC for controlling charging and

supplying power UEMCLite plus a discrete power supply. The main reset for the system is generated by the

UEMCLite. The memory comprises of 128 Mbit flash and 16 Mbit PsRAM. memory devices that are stacked on

top of each other in a single Combo package.

The interface to the RF and audio sections is also handled by the UEMCLite. This ASIC provides A/D and D/A

conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions

of received and transmitted audio signals. Data transmission between UEMCLite and RF and the UPP8M is

implemented using different serial connections (CBUS, DBUS and RFBUS). Digital speech processing is handled

by UPP8M ASIC.

A real time clock function is integrated into UEMCLite, which utilizes the same 32 kHz-clock source as the

sleep clock. The SLCK/RTC runs all time when the phone battery is connected. It is running also when the

phone is switched off. In UEMCLite there is no back up battery/capacitor connection.

There are three audio transducers in the product; 16 mm speaker, an earpiece and a microphone. The earpiece

is used to generate audios for earpiece; the speaker is used to generate audios for IHF and ringing tones. A

separate audio amplifier drives the speaker. There is only one microphone for both HS and IHF modes.

The display is an TFT type color display with 65536 colors and 128 x 160 pixels with backlighting. The keypad

module features a function keymat with a 4-way navigation key with a center selection key.

UPP

UPP (Universal Phone Processor) is the digital ASIC of the DCT4 generation base band. UPP8M includes 4.5

MBit internal RAM, 16/32-bit RISC MCU core. UPP8Mv6.11 includes ARM7TDMI rev4 16/32-bit RISC MCU core, TI

Lead3 16-bit DSP phase2+ core with DMA controller, ROM for MCU boot code and all digital control logic.

Memory

This mobile uses two kinds of memories, Flash and Synchronous RAM (SRAM). These memories have are

sharing the same bus interface to UPP8M. SDRAM is used as the working memory. The SRAM size is 16 Mbits.

SRAM I/O is 1.8 V and core 1.8 V supplied by UEMCLite regulator VIO. All memory contents are lost if the supply

voltage is switched off.

Multiplexed flash memory interface is used to store the MCU program code and user data.

Configuration of flash memory is a 128 Mbit NOR flash memory. Flash I/O and core voltage are 1.8 V.

UEMCLite

The UEMCLite is a low cost energy management ASIC contains for BB use two 2.78V LDO regulators, 1.8V linear

regulator, programmable 1.0 - 1.5 V linear regulator and 1.8/3.0 V LDO regulator. For RF use UEMCLite has

five 2.78 V LDOs. In addition, the UEMCLite contains audio codec, A/D converters, RF converters, many drivers,

etc.

External regulators

White LED Driver solution is implemented with DC/DC converter. The driver circuit is controlled by UEM output

pin DLIGHT, which add external pull up using a digital transistor and one resistor. The schematics also

combined the UEMIO (5) to control DC/DC enable as another optional using two jumper.

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Energy management

Filter components

The master of EM control is UEMCLite and with SW it has the main control of the system voltages and operating

modes. The power distribution diagram is presented in the illustration below.

Figure 107 Power connection diagram

All connectors going to the “outside world” have filter components, ESD protection and EMC reduction.

The Digital/Data lines on SIM have special dedicated filter ASIP. The below figure show the SIM filtering.

Figure 108 SIM filtering

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The Audio circuit: Earpiece, IHF, internal microphone and external speaker are filtered with discrete

components (common mode reduction coils, Varistors, caps and resistors), where as the external microphone

uses differential mode mic. ASIP

The 16 UEMECLite BB & RF regulators are specified to have a decoupling cap of 1 µF ±20%.

Modes of operation

BB4.0 LiteV2 base band has five different functional modes, which are defined in UEMCLite specification:

• No supply: In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to disconnection of

main battery or low battery voltage level in battery. Phone is exiting from NO_SUPPLY mode when sufficient

battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT >

VMSTR+ or by connecting charger and charging the battery above VMSTR+.

•Acting Dead: If the phone is off when the charger is connected, the phone is powered on but enters a state

called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery charging alert is given

and/or a battery charging indication on the display is shown to acknowledge the user that the battery is

being charged.

• Active: In the Active mode the phone is in normal operation, scanning for channels, listening to a base

station, transmitting and processing information. There are several sub-states in the active mode

depending on if the phone is in burst reception, burst transmission, if DSP is working etc.

In Active mode the RF regulators are controlled by SW writing into UEMCLite’s registers wanted settings:

VR regulators can be disabled, enabled or forced into low quiescent current mode. VR2 is always enabled

in Active mode for system clock chain supply

• Sleep: In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for

the base band.

• Charging: Charging can be performed in any operating mode. The battery type / size is indicated by a

resistor inside the battery pack. The resistor value corresponds to a specific battery capacity. This capacity

value is related to the battery technology as different capacity values are achieved by using different

battery technology. The battery voltage, temperature, size and current are measured by the UEMCLite and

controlled by the charging software running in the UPP. The charging control circuitry (CHACON) inside the

UEMCLite controls the charging current delivered from the charger to the battery. The battery voltage rise

is limited by turning the UEMCLite switch off when the battery voltage has reached 4.2 V. Charging current

is monitored by measuring the voltage drop across a 220 mW resistor. The PWM output doesn’t exist any

more from UEMCLite to the bottom connector

Voltage limits

Table 6 Voltage limits

Parameter Description Value/V

Vmstr+ Master reset threshold (rising) 2.1 ±0.1

Vmstr- Master reset threshold (falling) 1.9 ±0.1

Vcoff+ Hardware cutoff (rising) 3.1 ±0.1

Vcoff- Hardware cutoff (falling) 2.8 ±0.1

SW shutdown SW cutoff limit (> regulator drop-

out limit) MIN!

3.2 V

Audio function description

The basic audio structure and communication between HW-audio modules and the audio ASIC's is illustrated

in the block diagram below.

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Figure 109 Audio block diagram

UEMcLite supports three microphone inputs and two outputs. The inputs can be used for internal, headset

or handsfree microphones. The microphone signals from different sources are connected to separate inputs

at the UEMcLite ASIC. The inputs and outputs are all differential.

Three inputs (MIC1, MIC2) and two outputs (EAR, HF) are used in the phone.

MIC1P/MIC1N inputs are used for the internal microphone, using single-ended biasing circuitry. EARP/EARN

outputs from UEMcLite are used for hand-portable mode.

Uplink external audio (headset as well as carkit) is connected to MIC2P/MIC2N, while downlink audio is

provided via the HF outputs from UEMcLite. A special situation exists since the carkit can be used with two

different microphones: either the phone's internal microphone (MIC1-inputs) or an external microphone that

connects to the carkit. In these cases UEMcLite is capable of switching between MIC1 and MIC2.

The audio control is taken care of by UEMcLite, which contains the MCU and audio codec. UPP contains DSP

blocks, and handling and processing of the audio signals.

Input and output selection, and gain control is performed inside UEMcLite. DTMF-tones and other audio tones

are generated and encoded by UPP and transmitted to UEMcLite for decoding.

External audio connector

The system connector, containing a 4-pole Jack plug, gains the access to the external audio interface. The

Jack plug, which is integrated in the system connector, contains a mechanical switch, which is used to detect

the connection of the accessories. The configuration for the 4-pole Jack-plug is shown in the following figure.

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Figure 110 4-pole jack plug for audio accessory

Table 7 Connector for External Audio Accessories

Pin Signal name Direction Description

5 PLUGDET Input Terminal internal

connection, plug

detection

4 HS EAR L Output Audio output

3 HS EAR R Output Audio output

2 HS MIC Input Multiplexed

microphone audio and

control data

1 HS GND - Ground contact

HALL sensor

The HALL sensor is used to recognize the position of the flap.

The HALL sensor incorporates advanced chopper-stabilization techniques to provide accurate and stable

magnetic switch points. The circuit design provides an internally controlled clocking mechanism to cycle

power to the HALL element and analog signal processing circuits. This serves to place the high current-

consuming portions of the circuit into the sleep mode. Periodically the device is awakened by this internal

logic and the magnetic flux from the HALL element is evaluated against the predefined thresholds. If the flux

density is above or below the BOP/BRP thresholds, the output transistor is driven to change states accordingly.

While in the sleep cycle, the output transistor is latched in its previous state.

The output transistor of the SH248CSP is latched on at the presence of a sufficiently strong south or north

magnetic field facing the marked side of the package. The output is latched off in the absence of a magnetic

field.

The output of hall sensor is sent to GENIO24 of UPP. Baseband knows the status of the hall sensor that

represents the phone position (folded or not).

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Figure 111 HALL sensor

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Interfaces

RF and baseband interfaces

Table 8 AC and DC Characteristics of BB4.0 LiteV2 RF-Base band Digital Signals

Signal

name From To Para-meter Input characteristics Function

Min Typ Max Unit

TXP1 UPP RF-IC 1 1.38 1.88 V Depends of

the RF design

RFGenOu

GenIO5 0 0 0.4 V

Load

Resistance

10 kW

Load

Capacitanc

20 pF

Timing

Accuracy

¼ symbo

TXP2 UPP RF-IC 1 1.38 1.88 V Depends of

the RF design

(GenIO6

)

0 0 0.4 V

Load

Resistance

10 kW

Load

Capacitanc

20 pF

Timing

Accuracy

¼ symbo

RFBusEn1

UPP RF-IC 1 1.38 1.88 V RFIC Chip SelX

0 0 0.4 V

Internal PU

Current

50 uA

Load

resistance

10 kW

Load

capacitanc

20 pF

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Signal

name From To Para-meter Input characteristics Function

Min Typ Max Unit

RFBusDa UPP /

RF-IC

RF-

IC/

UPP

1 1.38 1.88 V Bi-directional

RF Control

serial bus

data,

0 0 0.4 V

Load

resistance

10 kW

Load

capacitanc

20 pF

Data

frequency

13 MHz

RFBusClk UPP RF IC 1 1.38 1.88 V RF Control

serial bus bit

clock

0 0 0.4 V

Load

resistance

10 kW

Load

capacitanc

20 pF

Data

frequency

13 MHz

GENIO3 UEMCLit

RF IC 1 2.78 V RF Control *

0 V Depends of

the RF design

Load

resistance

Output

current

4 mA

GENIO4 UEMCLit

RF IC 1 2.78 V Audio clock

input in

UEMCLiteV3

and LittiV2

0 V

Load

resistance

Output

current

4 mA

GENIO5 UEMCLit

RF IC 1 2.78 V RF Control *

0 V Depends of

the RF design

Load

resistance

Output

current

4 mA

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Analogue Signals

Table 9 AC and DC Characteristics of RF-Base band Analogue Signals

Signal

name From To Parameter Min Typ Max Unit Function

RFCLK VCTCXO UPP Frequency 13/26 MHz System Clk from RF to

BB,

Signal

amplitude

0.2 0.8 1.32 Vpp 13/26 MHz Depending

on RF chipset

Input

Impedance

10 kW UPP minimum

recommended

amplitude is 0.3Vpp.

Input

Capacitanc

10 pF

Harmonic

Content

-8 dBc

Clear signal

window

(no glitch)

200 mVpp

Duty Cycle 40 60 %

RFCLKGnd VCTCXO UPP DC Level 0 V System Clock slicer Ref

GND, not separated

from pwb GND layer

RXIP,

RXIN,

RXQP,

RXQN

RF-IC UEMCL

ite

Voltage

swing

(static)

1.4 1.45 Vpp Differential positive /

negative in-phase

and quadrature Rx

Signals.

DC level 1.3 1.35 1.4 V

I/Q

amplitude

mismatch

0.2 dB

I/Q phase

mismatch

-0.5 0.5 deg

TXIP,

TXIN,

TXQP,

TXQN

UEMCLit

RF-IC Differential

voltage

swing

(static)

2.25 2.45 Vpp Differential positive /

negative in-phase

and quadrature Tx

Signals

In High-Z when RX is

receiving.

DC level 1.17 1.20 1.23 V

Source

Impedance

200 W

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Signal

name From To Parameter Min Typ Max Unit Function

AFC UEMCLit

VCTCX

Voltage Min 0.0 0.1 V Automatic Frequency

Control signal for

VCTCXO

Programmable

(AFCOUT

)

Max 2.4 2.55

Resolution 11 bits

Load

resistance

1 kW

and

capacitanc

100 nF

Source

Impedance

200 W

Output

impedance

10 MW Path powered down

TxC UEMCLit

RF-IC Voltage Min 0.1 V Transmitter power

level and ramping

control, Ref UEMCLite

RF converter

specification

(AUXOUT

)

Max 2.4

Source

Impedance

200 W

Resolution 10 bits

VCXOTEMP RF-IC UEMCL

ite

Input

voltage

range

0 2.7 V

Input

resistance

900 6000 Ohm

Resolution 10 bits

PATEMP RF-IC UEMCL

ite

Voltage at

-20oC

1.57 V Usage depends of the

RF design

LCD interface

The display is controlled by phone processor UPP.

The main LCD module is connected to the PWB by a 24-pin board-to-board connector.

The sub LCD module is connected to the PWB by a 10-pin board-to-board connector.

Keyboard

A 5 X 5 matrix keyboad consists of 21 keys, one 10-channel integrated passive filiter arrays with downstream

ESD protection of >8KV connect the matrix keyboard to UPP.

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Figure 112 Keyboard schematics

SIM interface

The UEMCLite contains the SIM interface logic level shifting. The SIM interface can be programmed to support

3V and 1.8V SIMs. SIM supply voltage is selected by with register in the UEMCLite. It is only allowed to change

the SIM supply voltage when the SIM IF is powered down.

The SIM power up/down sequence is generated in the UEMCLite. This means that the UEMCLite generates the

RST signal to the SIM. In addition, the SIMCardDet signal is connected to UEMCLite. The detection is taken from

the BSI signal, which detects the removal of the battery. The monitoring of the BSI signal is done by a

comparator inside UEMCLite. The comparator offset is such that the comparator outputs do not alter state as

long as the battery is connected. The threshold voltage is calculated from the battery size specifications.

The SIM interface is powered up when the SIMCardDet signal indicates ”card in”. This signal is derived from

the BSI signal.

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Table 10 SIM interface

Pin Name Parameter Min Typ Max Unit Notes

4 DATA 1.8V Voh 0.9xVSI

VSIM V SIM data (output)

1.8V Vol 0 0.15xVSIM

3V Voh 0.9xVSI

VSIM

3V Vol 0 0.15xVSIM

1.8V Vih 0.7xVSI

VSIM V SIM data (input)

1.8V Vil 0 0.15xVSIM Trise/Tfall max

1us

3V Vil 0.7xVSI

VSIM

3V Vil 0 0.15xVSIM

5 NC Not connected

6 GND GND 0 0 V Ground

VSIM specified in regulator section in this document

Figure 113 SIM interface block diagram

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External signals and connections

Table 11 System connector

Signal From To Min Nom Max Condi-tion Note

XMICP HS/HF Mic UEMC

Lite

2/60m

V diff

Analog

audio in

Headset Mic bias and

audio signal 2mV

nominal. HF Mic signal

60mV nominal.

Differential symmetric

input.

DC bias

2V2kohm

Accessory detection by

bias loading

XMICN 2/60m

V diff

Ana in / 1k

to GND

Hook interrupt by heavy

bias loading

XEARP HS/HF UEMC

Lite

100 mV

diff

Ana in Quasi-differential DC-

coupled earpiece/HF

amplifier signal to

accessory. DC biased to

0.8V

XEARN EAR/

Amp.

INT

HEADINT

Switch UEMC

Lite

0/2.7V Dig in HS interrupt from bottom

connector switch when

plug inserted.

VCHARIN Charger UEMC

Lite

11.1Vp

eak

16.9

Vpeak

Standard Vch from Charger

Connector, max 20V

7.9

VRMS

1.0

Apeak

7.0

VRMS

8.4

VRMS

9.2

VRMS

Fast charger

850 mA

GND GND GND from/to Charger

connector

Battery connector

Table 12 Battery IF

Signal From To Min Nom Max Note

GND Global Batt (-) Global GND

VBAT Batt (+) 3.1 5.1 Battery Voltage

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Signal From To Min Nom Max Note

BSI UEMCLite 0 2.78 Analog input, Battery Size

Indicator Resistor, 100

kohm pull up to 2.78V

(VBB1). FDL Init, refer to

flash download.

Battery interface

• Type: BL-5BT

• Technology: Li-Ion, 4.2 V charging, 3.1 V cut-off

• Capacity: 870 mAh.

BL-5BT has a 3 pin interface with overcharge / discharge protection (safety circuit) and battery size indication

BSI with an internal resistor. The BSI fixed resistor value indicates type and default capacity of a battery.

Figure 114 BL-5BT battery pack contacts

Table 13 Pin numbering of battery pack

Signal name Pin number Function

GND 2 Negative/common battery

terminal

BSI 3 Battery capacity measurement

(fixed resistor inside the battery

pack)

VBAT 1 Positive battery terminal

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PWB outline

Figure 115 PWB top side component placement

Figure 116 PWB bottom side component placement

RF description

Frequency band, power and multi-slot class

The requirement leads to the specification in the table below:

Table 14 Frequency bands and TX power class

System Frequency band TX power class

GSM900 Tx: 880 – 915 MHz 4 (33dBm)

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System Frequency band TX power class

Rx: 925 – 960 MHz

GSM1800 Tx: 1710 – 1785 MHz 1 (30dBm)

Rx: 1805 – 1880 MHz

Table 15 Multi-slot class

Multislot Class

GPRS MSC 10 (4Dn/2Up), sum=5

E-GPRS MSC 6 in DL, max. 3Dn

Transmitter - general description

The transmitter has separate, parallel paths covering the different bands. The transmitter operates in GMSK

mode only. The power level control circuitry is integrated in the front-end module.

Each path of the transmitter is composed of a baseband lowpass filter for the I/Q signals and a quadrature

direct modulator integrated in PMB3258. At the modulator’s output there is a bandpass filter for each band

(so-called H3 filter) and a balun transformer to convert the differential output signal from the modulator into

a single-ended 50 ohm signal. This signal is fed into the input of the PA. The two power amplifiers and the

antenna switch are integrated in a single module with built-in power control loop.

The two control methods used are open-loop Vcc control (RFMD) and feedback control with current sensing.

The reference waveform (TXC) for the control loop comes from the baseband. The output of the PA goes into

a low pass filter located inside the FEM (Front End Module). Finally the transmit signal goes through the band

selection and TX/RX switches to the antenna port.

The FEM is controlled with four digital control signals (TXP, Vc1, Vc2 and Vc3) to meet the TDMA frame timing

requirements.

Transmitter - signal processing

The I/Q signals coming from the baseband section are fed into the modulator and converted up to the carrier

frequency. The I/Q are post filtered by a 1st order passive RC filter (discrete components on PWB) and a 3rd

order active filter (Legendre type) inside PMB3258.

The nominal output level of the modulator is +3.5 dBm in both bands. The modulator's output is an open-

collector type and need an external load and a DC supply feed. The load and the DC supply feed are

implemented as the part of the H3 filter.

The filtered signal is fed into the input of the FEM, which amplifies it to the desired power level and provides

the signal at the antenna port.

There is also a temperature sensor close to the FEM to enable SW temperature compensation for e.g. the

power levels. The sensor is connected to one of the slow ADC channels in the baseband.

Receiver - general description

The receiver is a direct conversion linear receiver. It is a dual-band receiver with receiver paths for either

GSM850/1900 or GSM900/1800 configuration.

From the antenna, the received RF-signal is fed into the front-end module, which routes the signal to the

appropriate RX path. After the FEM, the RX signals are filtered by SAW filters (one for each band), which reject

the out-of band blocking signals to low enough level to be handled by the RF ASIC.

RM-340; RM-341

System Module

Issue 1 COMPANY CONFIDENTIAL Page 6 –21

There are two paths – one for each band. In each path, the signal is then fed to the low noise amplifier (LNA).

One LNA can handle both the GSM850 and GSM900 signals and another is used for GSM1800 and GSM1900.

The LNA inputs are matched to the SAW filter outputs by means of discrete LC matching networks. The SAW

filters and the matching networks are different for different band combinations, but the PWB layout is the

same for both 850/1900 and 900/1800 versions.

The RX front-end circuitry contains the LNA and the quadrature down converting mixers. The front-end gain

is programmable so that the gain can be reduced in strong-signal conditions. The mixers at each signal path

convert the RF signal directly down to baseband I/Q signals. Local oscillator signals for the mixers are

generated by an on-chip VCO.

The output signals (I/Q) of each demodulator are all differential. They are combined to two differential signal

paths, one for I-channel and one for Q-channel, common for all bands. The baseband RX signals are then fed

into a 3rd order active blocking filter, which has programmable gain. One of the three poles is implemented

by an off-chip capacitor connected directly between the mixer outputs. There are a total of two off-chip

capacitors, one for I-channel and one for Q-channel, respectively.

After the blocking filter, the signal is fed into a buffer amplifier, which also has programmable gain. Around

the amplifier there is the first DC-offset compensation block, which removes most of the cumulated DC offset

so far. The DC offset compensation method is based on digital successive approximation technique.

The next block in the RX chain is a switched-capacitor (SC) channel filter, which provides the close-in selectivity

for the analog receiver. Because the SC-filter is insensitive to the IC process tolerances, no production

calibration of the filter is necessary. The SC-filter operates on 6.5 MHz clock, which is generated by dividing

the 26 MHz reference clock by four.

After the SC-filter there is a continuous-time smoothing filter which attenuates the alias signals generated

by the sampling process inherent in the SC-filter. The smoothing filter also has programmable gain.

The next block is a programmable gain amplifier (PGA), which has the second DC-offset compensation block

around it. The DC-offset compensation method is again based on digital successive approximation technique.

The last block in the analog receiver is an output buffer amplifier, which feeds the differential I/Q signals off-

chip to be A/D converted in the digital baseband.

VCXO and PLL

The VCO frequency is locked by a PLL (phase locked loop) into a stable frequency source given by a VCXO. The

frequency of the VCXO is in turn locked into the frequency of the base station with the help of an AFC (automatic

frequency control) voltage, which is generated in the UEM. The reference frequency is 26 MHz.

The VCXO also provides a 26 MHz system clock for the digital baseband.

The PLL is located in PMB3258 and it is controlled via the RFBUS.

Technical specifications

General specifications

Unit Dimension LxWxT (mm) Weight (g) Volume (cc)

Transceiver with BL-5BT

870mAh Li-Ion battery

pack

109.34x46.48x12 73 55

RM-340; RM-341

System Module

Page 6 –22 COMPANY CONFIDENTIAL Issue 1

Battery endurance

Nokia measurements of operation times in GSM900/1800

Talk time

Battery: BL-5BT 870mAh 380 mins

Standby time

Battery: BL-5BT 870mAh 580 mins

Note: Variation in operation times will occur depending on SIM card, network settings and usage.

Talk time is increased by up to 30% if half rate is active and reduced by 5% if enhanced full rate is

active.

Environmental conditions

Environmental

condition Ambient temperature Notes

Normal operation -15 oC ... +55 oCSpecifications fulfilled

Reduced performance -30 ...15 oC and +55oC ... +70 oCOperational only for short periods

Intermittent or no

operation -40 oC ... -30 oC and +70 oC ... +85oCOperation not guaranteed but an

attempt to operate will not damage

the phone

No operation or

storage <-40 oC and >+85 oCNo storage. An attempt to operate

may cause permanent damage

Charging allowed -15 oC ... +55 oC

Long term storage

conditions 0 oC ... +85 oC

Humidity and water

resistance

Relative humidity range is 5 to 95%.

Condensed or dripping water may

cause intermittent malfunctions.

Protection against dripping water

has to be implemented in (enclosure)

mechanics.

Continuous dampness will cause

permanent damage to the module.

Electrical characteristics

Table 16 Normal and extreme voltages

Voltage Voltage (V) Condition

General conditions

RM-340; RM-341

System Module

Issue 1 COMPANY CONFIDENTIAL Page 6 –23

Voltage Voltage (V) Condition

Nominal voltage 3.90V a

Lower extreme voltage 3.30V b

Higher extreme voltage 4.30V c

HW shutdown voltages

Vmstr+ 2.1V ± 0,1V Off to on

Vmstr- 1.9V ± 0,1V On to off

SW shutdown voltages

SW shutdown 3. 1V In call

SW shutdown 3. 2V In idle

Min operating voltage

Vcoff+ 3. 1V ± 0,1V Off to on

Vcoff- 2. 8V ± 0,1V On to off

HW reset demands

Min 1. 0V d

Max --

a. The nominal voltage is defined as being 15% higher than the lower extreme voltage. TA will test with this

nominal voltage at an 85% range (0.85x3.9V a 3.3V).

b. This limit is set to be above SW shutdown limit in TA.

c. During fast charging of an empty battery, this voltage might exceed this value. Voltages between 4.20 and

4.60 might appear for a short while.

d. The minimum battery cell voltage required for the reset circuitry to turn on. This is not confirmed by

measures at pt.

Table 17 Current consumption

Condition Min Typical Max Unit

Call (MoU)

(E)GSM 900

GSM 1800

GSM 1900

235

165

226

Idle (MoU) 1.47 mA

Power off 30 33 35 uA

RM-340; RM-341

System Module

Page 6 –24 COMPANY CONFIDENTIAL Issue 1

Glossary

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page Glossary–1

RM-340; RM-341

Glossary

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Page Glossary–2 COMPANY CONFIDENTIAL Issue 1

A/D-converter Analogue-to-digital converter

ACI Accessory Control Interface

ADC Analogue-to-digital converter

ADSP Application DPS (expected to run high level tasks)

AGC Automatic gain control (maintains volume)

ALS Ambient light sensor

AMSL After Market Service Leader

ARM Advanced RISC Machines

ARPU Average revenue per user (per month or per year)

ASIC Application Specific Integrated Circuit

ASIP Application Specific Interface Protector

B2B Board to board, connector between PWB and UI board

BB Baseband

BC02 Bluetooth module made by CSR

BIQUAD Bi-quadratic (type of filter function)

BSI Battery Size Indicator

BT Bluetooth

CBus MCU controlled serial bus connected to UPP_WD2, UEME and Zocus

CCP Compact Camera Port

CDMA Code division multiple access

CDSP Cellular DSP (expected to run at low levels)

CLDC Connected limited device configuration

CMOS Complimentary metal-oxide semiconductor circuit (low power consumption)

COF Chip on Foil

COG Chip on Glass

CPU Central Processing Unit

CSD Circuit-switched data

CSR Cambridge silicon radio

CSTN Colour Super Twisted Nematic

CTSI Clock Timing Sleep and interrupt block of Tiku

CW Continuous wave

D/A-converter Digital-to-analogue converter

DAC Digital-to-analogue converter

DBI Digital Battery Interface

DBus DSP controlled serial bus connected between UPP_WD2 and Helgo

DCT-4 Digital Core Technology

RM-340; RM-341

Glossary

Issue 1 COMPANY CONFIDENTIAL Page Glossary–3

DMA Direct memory access

DP Data Package

DPLL Digital Phase Locked Loop

DSP Digital Signal Processor

DTM Dual Transfer Mode

DtoS Differential to Single ended

EDGE Enhanced data rates for global/GSM evolution

EGSM Extended GSM

EM Energy management

EMC Electromagnetic compatibility

EMI Electromagnetic interference

ESD Electrostatic discharge

FCI Functional cover interface

FPS Flash Programming Tool

FR Full rate

FSTN Film compensated super twisted nematic

GMSK Gaussian Minimum Shift Keying

GND Ground, conductive mass

GPIB General-purpose interface bus

GPRS General Packet Radio Service

GSM Group Special Mobile/Global System for Mobile communication

HSDPA High-speed downlink packet access

HF Hands free

HFCM Handsfree Common

HS Handset

HSCSD High speed circuit switched data (data transmission connection faster than GSM)

HW Hardware

I/O Input/Output

IBAT Battery current

IC Integrated circuit

ICHAR Charger current

IF Interface

IHF Integrated hands free

IMEI International Mobile Equipment Identity

IR Infrared

IrDA Infrared Data Association

RM-340; RM-341

Glossary

Page Glossary–4 COMPANY CONFIDENTIAL Issue 1

ISA Intelligent software architecture

JPEG/JPG Joint Photographic Experts Group

LCD Liquid Crystal Display

LDO Low Drop Out

LED Light-emitting diode

LPRF Low Power Radio Frequency

MCU Micro Controller Unit (microprocessor)

MCU Multiport control unit

MIC, mic Microphone

MIDP Mobile Information Device Profile

MIN Mobile identification number

MIPS Million instructions per second

MMC Multimedia card

MMS Multimedia messaging service

MTP Multipoint-to-point connection

NTC Negative temperature coefficient, temperature sensitive resistor used as a

temperature sensor

OMA Object management architecture

OMAP Operations, maintenance, and administration part

Opamp Operational Amplifier

PA Power amplifier

PDA Pocket Data Application

PDA Personal digital assistant

PDRAM Program/Data RAM (on chip in Tiku)

Phoenix Software tool of DCT4.x and BB5

PIM Personal Information Management

PLL Phase locked loop

PM (Phone) Permanent memory

PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX Power-up reset

PWB Printed Wiring Board

PWM Pulse width modulation

RC-filter Resistance-Capacitance filter

RF Radio Frequency

RF PopPort™ Reduced function PopPort™ interface

RFBUS Serial control Bus For RF

RM-340; RM-341

Glossary

Issue 1 COMPANY CONFIDENTIAL Page Glossary–5

RSK Right Soft Key

RS-MMC Reduced size Multimedia Card

RSS Web content Syndication Format

RSSI Receiving signal strength indicator

RST Reset Switch

RTC Real Time Clock (provides date and time)

RX Radio Receiver

SARAM Single Access RAM

SAW filter Surface Acoustic Wave filter

SDRAM Synchronous Dynamic Random Access Memory

SID Security ID

SIM Subscriber Identity Module

SMPS Switched Mode Power Supply

SNR Signal-to-noise ratio

SPR Standard Product requirements

SRAM Static random access memory

STI Serial Trace Interface

SW Software

SWIM Subscriber/Wallet Identification Module

TCP/IP Transmission control protocol/Internet protocol

TCXO Temperature controlled Oscillator

Tiku Finnish for Chip, Successor of the UPP

TX Radio Transmitter

UART Universal asynchronous receiver/transmitter

UEME Universal Energy Management chip (Enhanced version)

UEMEK See UEME

UI User Interface

UPnP Universal Plug and Play

UPP Universal Phone Processor

UPP_WD2 Communicator version of DCT4 system ASIC

USB Universal Serial Bus

VBAT Battery voltage

VCHAR Charger voltage

VCO Voltage controlled oscillator

VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO Voltage Controlled Crystal Oscillator

RM-340; RM-341

Glossary

Page Glossary–6 COMPANY CONFIDENTIAL Issue 1

Vp-p Peak-to-peak voltage

VSIM SIM voltage

WAP Wireless application protocol

WCDMA Wideband code division multiple access

WD Watchdog

WLAN Wireless local area network

XHTML Extensible hypertext markup language

Zocus Current sensor (used to monitor the current flow to and from the battery)

RM-340; RM-341

Glossary

Issue 1 COMPANY CONFIDENTIAL Page Glossary–7

RM-340; RM-341

Glossary

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Page Glossary–8 COMPANY CONFIDENTIAL Issue 1

www.s-manuals.com

Nokia 2600C 2 RM 340, 341 Service Manual Level 3&4. Www.s Manuals.com. 34 V1.0

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