Nokia 6030 Rm 74 Service Manual 34 V1

User Manual: Phone Nokia 6030 RM-74, RM-75 - Service manuals and Schematics, Disassembly / Assembly. Free.

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Amendment Record Sheet
Copyright
Warnings and cautions
For your safety
Care and maintenance
ESD protection
Battery information
Company Policy
NOKIA 6030 Service Manual Structure
1 General information
2 Parts and layouts
3 Phoenix service SW
- Service software installation
- Service software instructions
4 Service Tools
- Service tools
  - List of Service Tools
- Service software concept
5 Disassembly and reassembly instructions
- Disassembly instructions
- Reassembly instructions
6 Baseband troubleshooting
7 RF troubleshooting
8 System module
9 Schematics
- Schematics
Glossary

Service Manual

RM-74 (NOKIA 6030)

Mobile Terminal

Part No: (9242678 (Issue 1))

Nokia Customer Care

Company Confidential

Amendment Record Sheet

Amendment No Date Inserted By Comments

Issue 1 06/2005 Gillis Rudh

RM-74

Nokia Customer Care Amendment Record Sheet

Page ii Company Confidential 9242678 (Issue 1)

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form without

the prior written permission of Nokia is prohibited.

Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia

Corporation. Other product and company names mentioned herein may be trademarks or tradenames of their

respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and

improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,

consequential or indirect damages howsoever caused.

The contents of this document are provided “as is”. Except as required by applicable law, no warranties of any

kind, either express or implied, including, but not limited to, the implied warranties of merchantability and

fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this document.

Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

The availability of particular products may vary by region.

IMPORTANT

This document is intended for use by qualified service personnel only.

RM-74

9242678 (Issue 1) Company Confidential Page iii

Warnings and cautions

Warnings

•IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH

ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT

CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/

MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

• THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES, FOR

EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE WITH

THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE

MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO

BE SUBJECT TO INTERFERENCE.

• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions

• Servicing and alignment must be undertaken by qualified personnel only.

• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

• Use only approved components as specified in the parts list.

• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and alignment.

Ensure all cables and wires are repositioned correctly.

Use only approved components as specified in the parts list.

• Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the

measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb

nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.

• During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise GSM

or WCDMA PA may be damaged.

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Nokia Customer Care Warnings and cautions

Page iv Company Confidential 9242678 (Issue 1)

For your safety

QUALIFIED SERVICE

Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES

Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES

When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect

incompatible products.

RM-74

For your safety Nokia Customer Care

9242678 (Issue 1) Company Confidential Page v

Care and maintenance

This product is of superior design and craftsmanship and should be treated with care. The suggestions below

will help you to fulfil any warranty obligations and to enjoy this product for many years.

• Keep the phone and all its parts and accessories out of the reach of small children.

• Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that

will corrode electronic circuits.

• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.

• Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage

batteries, and warp or melt certain plastics.

• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form

inside, which may damage electronic circuit boards.

• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.

• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.

• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.

• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or

attachments could damage the phone and may violate regulations governing radio devices.

All of the above suggestions apply equally to the product, battery, charger or any accessory.

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Nokia Customer Care Care and maintenance

Page vi Company Confidential 9242678 (Issue 1)

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing the

phone.

Any product of which the covers are removed must be handled with ESD protection. The SIM card can be replaced

without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied.

All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity

discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside any

ESD Protected Area (EPA).

Every repair action involving opening the product or handling the product components must be done under

ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.

For more information and local requirements about ESD protection and ESD Protected Area, contact your local

Nokia After Market Services representative.

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ESD protection Nokia Customer Care

9242678 (Issue 1) Company Confidential Page vii

Battery information

Note: A new battery's full performance is achieved only after two or three complete charge and

discharge cycles!

The battery can be charged and discharged hundreds of times but it will eventually wear out. When the

operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.

Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers

approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to a

charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged battery

will discharge itself over time.

Temperature extremes can affect the ability of your battery to charge.

For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the

product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory

available for the product). Do not attempt to discharge the battery by any other means.

Use the battery only for its intended purpose.

Never use any charger or battery which is damaged.

Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or pen)

causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example when

you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery or the

connecting object.

Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce the

capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°F). A

phone with a hot or cold battery may temporarily not work, even when the battery is fully charged. Batteries'

performance is particularly limited in temperatures well below freezing.

Do not dispose of batteries in a fire!

Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

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Nokia Customer Care Battery information

Page viii Company Confidential 9242678 (Issue 1)

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service

bulletins.

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any

errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/e-mail.

Please state:

• Title of the Document + Issue Number/Date of publication

• Latest Amendment Number (if applicable)

• Page(s) and/or Figure(s) in error

Please send to:

NOKIA CORPORATION

Nokia Mobile Phones Business Group

Nokia Customer Care

PO Box 86

FIN-24101 SALO

Finland

E-mail: Service.Manuals@nokia.com

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9242678 (Issue 1) Company Confidential Page ix

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NOKIA 6030 Service Manual Structure

1 General information

2 Parts and layouts

3 Phoenix service SW

4 Service Tools

5 Disassembly and reassembly instructions

6 Baseband troubleshooting

7 RF troubleshooting

8 System module

9 Schematics

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Page xii Company Confidential 9242678 (Issue 1)

1 — General information

Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 1–1

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Table of Contents

Product selection.............................................................................................................................................................................1–5

Display and keypad features.......................................................................................................................................................1–5

Features..............................................................................................................................................................................................1–5

Hardware features....................................................................................................................................................................1–5

Software features......................................................................................................................................................................1–5

UI features...................................................................................................................................................................................1–6

Mobile enhancements..............................................................................................................................................................1–7

Technical specifications................................................................................................................................................................1–7

General specifications..............................................................................................................................................................1–7

Battery endurance....................................................................................................................................................................1–8

Environmental conditions......................................................................................................................................................1–8

Electrical characteristics..........................................................................................................................................................1–8

List of Tables

Table 1 Power...................................................................................................................................................................................1–7

Table 2 Car.........................................................................................................................................................................................1–7

Table 3 Audio....................................................................................................................................................................................1–7

Table 4 Xpress-on™ covers...........................................................................................................................................................1–7

Table 5 Normal and extreme voltages.....................................................................................................................................1–8

Table 6 Current consumption......................................................................................................................................................1–9

List of Figures

Figure 1 RM-74 product picture..................................................................................................................................................1–5

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Product selection

The RM-74 is the EU version of the telephone with a dual band transceiver unit designed for the GSM900 and

GSM1800 networks.

Figure 1 RM-74 product picture

Display and keypad features

• High resolution CSTN display (128x128 pixels) with 65,536 colors

• 4UI-style, 5-way navigation key including selection key,

• Hardtop keymat

Features

Hardware features

• GSM E900/1800

• AMR/HR/FR/EFR codecs

• Internal antenna

• Charger plug

• Headset connector

• Mono FM Radio

• GPRS: Class B, multislot class 6

• Internal vibrator

• User changeable front- and back covers and top cap

• SIM (1.8 and 3.0 V)

Software features

• OS: ISA

• UI Style: S40

• MIDP 2.0 Java, with latest APIs

• Browser: XHTML over WAP stack (WAP 1.2.1 compliant)

• MMS 1.2

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General information Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 1–5

• 16 polyphonic ringing tones

• OTA downloading - ringing tones, wallpapers, operator logos, business cards, settings

UI features

Messaging • Multimedia messaging: send and receive messages containing text, an audio

clip, and an image to other compatible devices (maximum message size: up

to 100kB)

• SMS messaging

• Predictive text input

• Asia-Pacific: English, Chinese Simplified, Chinese Traditional, Thai, Philipino,

Vietnamese, Bahasa Indonesia, Bahasa Malaysia, Hindi

• Europe and Africa: Danish, Dutch, English, French, Finnish, German, Icelandic,

Italian, Portugese, Spanish, Swedish, Norwegian, Turkish, Greek, Bulgarian,

Ukranian, Hebrew, Arabic, Slovakian, Czech, Hungarian, Polish, Romanian,

Serbian, Croatian, Slovenian, Russian, Estonian, Latvian, Lithuanian

• Non-predictive text input: Urdu, Farsi, Zulu, Xhosa, Sesotho, Swahili, Merathi,

Tamil, Gujarati, Bengali

Memory functions • Phone book (up to 300 entries)

• Calendar notes (up to 500 entries)

Connectivity • Plug and play connector

Java™ applications • Java™ MIDP 2.0

• Over-the-air download of Java™-based applications and games

Browsing • Integrated XHTML browser over WAP

• OMA DRM for content protection

Data transfer • GPRS, class 6 (up to 40 kbps)

• WAP 2.0

Call management • Speed dialing: up to 8 names (keys 2-9)

• Last number redial from dialed calls list (dial key brings out the dialed calls

list)

• Automatic redial (max 10 attempts)

• Automatic answer (works with headset or car kit only)

• Call waiting, call hold, call divert, and call timer

• Automatic and manual network selection

• Vibrating alert

Voice features • Integrated handsfree speaker

Personalise • Graphics, icons, animations, logos

• Games: possibility to download new games

• Ringing tones: Polyphonic tones

• Themes: possibility to download new themes

Phone features • Phone Features

• Alarm clock Calendar

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Nokia Customer Care General information

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Mobile enhancements

Table 1 Power

Type Name

BL-5C Battery 900 mAh Li-Ion

AC-1 Retractable charger

ACP-12 Travel charger

LCH-12 Mobile charger

Table 2 Car

Type Name

BHF-2 Headrest hands free

CK-10 Nokia car kit

HF-8 Nokia plug-in car handsfreet

MP-2 Microphone

CR-39 Nokia universal holder

Table 3 Audio

Type Name

HDB-5 Boom Headset

HDC-5 Headset

HDE-2 Headset

HS-7 Dual Headset

HDA-9 TTY Adapter

Table 4 Xpress-on™ covers

Type Name

CC 232D EMEA colors: Gray, Blue, Orange, except APAC, which only have gray and blue.

Technical specifications

General specifications

Unit Dimension (mm) Weight (g) Volume (cc)

Transceiver with BL-5C

900mAh Li-Ion battery

pack

101x44x18 90 75

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Battery endurance

Nokia measurements of operation times in GSM900/1800

Talk time

Battery: BL-5C 900mAh Up to 180 min

Standby time

Battery: BL-5C 900mAh Up to 300 min

Note: Variation in operation times will occur depending on SIM card, network settings and usage. Talk

time is increased by up to 30% if half rate is active and reduced by 5% if enhanced full rate is active.

Environmental conditions

Environmental

condition

Ambient temperature Notes

Normal operation -15 oC ... +55 oCSpecifications fulfilled

Reduced performance -30 ...15 oC and +55oC ... +70 oCOperational only for short periods

Intermittent or no

operation

-40 oC ... -30 oC and +70 oC ... +85oCOperation not guaranteed but an

attempt to operate will not damage

the phone

No operation or

storage

<-40 oC and >+85 oCNo storage. An attempt to operate

may cause permanent damage

Charging allowed -15 oC ... +55 oC

Long term storage

conditions

0 oC ... +85 oC

Humidity and water

resistance

Relative humidity range is 5 to 95%.

Condensed or dripping water may

cause intermittent malfunctions.

Protection against dripping water has

to be implemented in (enclosure)

mechanics.

Continuous dampness will cause

permanent damage to the module.

Electrical characteristics

Table 5 Normal and extreme voltages

Voltage Voltage (V) Condition

General conditions

Nominal voltage 3.90V a

Lower extreme voltage 3.30V b

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Nokia Customer Care General information

Page 1–8 Company Confidential 9242678 (Issue 1)

Voltage Voltage (V) Condition

Higher extreme voltage 4.30V c

HW shutdown voltages

Vmstr+ 2.1V ± 0,1V Off to on

Vmstr- 1.9V ± 0,1V On to off

SW shutdown voltages

SW shutdown 3. 1V In call

SW shutdown 3. 2V In idle

Min operating voltage

Vcoff+ 3. 1V ± 0,1V Off to on

Vcoff- 2. 8V ± 0,1V On to off

HW reset demands

Min 1. 0V d

Max --

a. The nominal voltage is defined as being 15% higher than the lower extreme voltage. TA will test with this

nominal voltage at an 85% range (0.85x3.9V a 3.3V).

b. This limit is set to be above SW shutdown limit in TA.

c. During fast charging of an empty battery, this voltage might exceed this value. Voltages between 4.20 and

4.60 might appear for a short while.

d. The minimum battery cell voltage required for the reset circuitry to turn on. This is not confirmed by measures

at pt.

Table 6 Current consumption

Condition Min Typical Max Unit

Call (MoU)

(E)GSM 900

GSM 1800

GSM 1900

208

188

168

Idle (MoU) 2.72

Power off 150 250 mA

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2 — Parts and layouts

Nokia Customer Care

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Table of Contents

Exploded view..................................................................................................................................................................................2–5

Mechanical parts list.......................................................................................................................................................................2–6

Spare parts overview.....................................................................................................................................................................2–7

SWAP phones....................................................................................................................................................................................2–8

Component parts list......................................................................................................................................................................2–8

Component layouts......................................................................................................................................................................2–15

List of Tables

Table 7 Mechanical parts list.......................................................................................................................................................2–6

Table 8 SWAP phones for RM-74.................................................................................................................................................2–8

Table 9 Component parts.............................................................................................................................................................2–8

List of Figures

Figure 2 Exploded view.................................................................................................................................................................2–5

Figure 3 Spare parts overview....................................................................................................................................................2–7

Figure 4 Component layout, RM-74, 1mf_51a, bottom.....................................................................................................2–16

Figure 5 Component layout, RM-74, 1mf_51a, top.............................................................................................................2–16

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Exploded view

Figure 2 Exploded view

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Mechanical parts list

Table 7 Mechanical parts list

ITEM/

CIRCUIT

REF.

QTY PART NAME

* = not available as spare part

I001* 1 A-cover

I002* 1 Soft Keys

I003 1 KEYMAT

I004 6 Screws T6+

I005 1 LCD shielding

I006 1 Acoustic channel

I007 1 LCD module

I008 1 Locking clip

I009 1 Light guide assembly

I010 1 Domesheet

I011 1 Engine module (not supplied)

I012 1 BB shieldning lid assembly

I013 1 RF shielding lid

I014 1 FEM shielding lid

I015* 1 Antenna (A2)

I016* 1 IHF (A2)

I017* 1 Power button (A3)

I018* 1 SIM lid (A3)

I019 4 Microphone

I020 1 Easy flash connector (A3)

I021* 1 D-cover (A3)

I022 1 Type label

I023 1 B-cover

I024 1 Top cap

I025 1 Easy flash connector cap

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Nokia Customer Care Parts and layouts

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Spare parts overview

Figure 3 Spare parts overview

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SWAP phones

Table 8 SWAP phones for RM-74

SWAP phones for RM-74

RM-74 SWAP ENGINE EURO-C

RM-74 SWAP ENGINE EURO-C FRANCE

RM-74 EURO-C TURKEY

RM-74 SWAP ENGINE EURO-K

RM-74 SWAP ENGINE UKR

RM-74 SWAP ENGINE EURO-L SOUTH AFRICA

RM-74 SWAP ENGING APAC-S, Singapore

RM-74 SWAP ENGINE APAC-T, Philippines

Component parts list

Table 9 Component parts

Item ref Name Side X/Y Value

A7001 BB SHIELDING ASSY Top O 5 ~

A7002 RF ASIC SHIELDING ASSY Top J 6 ~

A7003 FEM SHIELDING ASSY Top J 3 ~

B2200 CRYSTAL 32.768KHZ+-20PPM 12.5PF Top O 7 32.768KHz

B7600 CRYSTAL 26.OMHZ+-10PPM 15.5PF Top K 5 26MHz

C2000 CHIPCAP NP0 27P J 50V 0402 Top G 3 27p

C2001 CHIPCAP NP0 10P J 50V 0402 Top G 2 10p

C2002 CHIPTCAP 150U M 10V 6X3.2X1.5 Top G 4 150u_10V

C2003 CHIPCAP NP0 22P J 50V 0402 Top S 5 22p

C2004 CHIPCAP NP0 22P J 50V 0402 Top R 5 22p

C2005 CHIPCAP NP0 22P J 50V 0402 Top R 5 22p

C2006 CHIPCAP NP0 22P J 50V 0402 Top R 5 22p

C2007 CHIPCAP Y5V 100N Z 25V 0603 Top S 7 100n

C2008 CHIPCAP X7R 10N K 16V 0402 Top S 4 10n

C2009 CHIPCAP X7R 10N K 16V 0402 Top R 4 10n

C2010 CHIPCAP X7R 10N K 16V 0402 Top R 5 10n

C2011 CHIPCAP X5R 1U K 6V3 0603 Top S 3 1u0

C2012 CHIPCAP X7R 10N K 16V 0402 Top R 4 10n

C2013 CHIPCAP X7R 1N0 K 50V 0402 Top

C2017 CHIPCAP NP0 33P J 50V 0402 Top G 5 33p

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Page 2–8 Company Confidential 9242678 (Issue 1)

Item ref Name Side X/Y Value

C2151 CHIP ARRAY X5R 2X33N K 10V 0405 Top N 7 2x33n

C2152 CHIPCAP NP0 10P J 50V 0402 Top S 3 10p

C2153 CHIPCAP NP0 47P J 50V 0402 Bottom B 6 47p

C2154 CHIPCAP NP0 47P J 50V 0402 Bottom B 7 47p

C2155 CHIP ARRAY X5R 2X33N K 10V 0405 Top N 7 2x33n

C2157 CHIPCAP NP0 100P J 50V 0402 Top O 8 100p

C2159 CHIPCAP X7R 15N K 16V 0402 Top N 7 8n2

C2161 CHIPCAP X5R 100N M 16V 0402 Top N 8 100n

C2164 CHIP ARRAY NP0 2X27P K 25V 0405 Top N 6 2x27p

C2165 CHIP ARRAY X5R 2X1N K 16V 0405 Top N 6 2x27p

C2171 CHIPCAP X5R 2U2 K 6V3 0603 Top N 8 2u2

C2180 CHIPCAP X7R 15N K 16V 0402 Top N 7 8n2

C2181 CHIPCAP X5R 100N K 10V 0402 Top M 7 100n

C2182 CHIPCAP X5R 1U K 6V3 0603 Top M 7 1u0

C2200 CHIPCAP X5R 1U K 6V3 0603 Top O 7 1u0

C2202 CHIPCAP X5R 1U K 6V3 0603 Top O 7 1u0

C2203 CHIPCAP X5R 1U K 6V3 0603 Top O 7 1u0

C2204 CHIPCAP X5R 1U K 6V3 0603 Top P 5 1u0

C2205 CHIPCAP X5R 1U K 6V3 0603 Top P 5 1u0

C2208 CHIPCAP X5R 1U K 6V3 0603 Top P 4 1u0

C2220 CHIPCAP X7R 10N K 16V 0402 Top M 7 10n

C2222 CHIPCAP X5R 1U K 6V3 0603 Top P 7 1u0

C2223 CHIPCAP X5R 1U K 6V3 0603 Top O 7 1u0

C2225 CHIPCAP X5R 1U K 6V3 0603 Top M 6 1u0

C2226 CHIPCAP X5R 1U K 6V3 0603 Top P 7 1u0

C2227 CHIPCAP X5R 1U K 6V3 0603 Top M 6 1u0

C2230 CHIPCAP X5R 1U K 6V3 0603 Top O 7 1u0

C2233 CHIPCAP X5R 1U K 6V3 0603 Top O 7 1u0

C2235 CHIPCAP X5R 1U K 6V3 0603 Top M 7 1u0

C2236 CHIPCAP X5R 100N K 10V 0402 Top M 5 100n

C2237 CHIPCAP X5R 100N K 10V 0402 Top M 5 100n

C2239 CHIPCAP X5R 100N K 10V 0402 Top P 5 100n

C2240 CHIPCAP X7R 10N K 16V 0402 Top M 6 10n

C2241 CHIPCAP X7R 1N0 K 50V 0402 Top M 6 1n0

C2242 CHIPCAP X7R 1N0 K 50V 0402 Top M 6 1n0

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Item ref Name Side X/Y Value

C2261 CHIPCAP X5R 4U7 K 10V 0805 Top P 6 4u7

C2262 CHIPCAP X5R 100N K 10V 0402 Top Q 8 100n

C2263 CHIPCAP X5R 100N K 10V 0402 Top R 8 100n

C2287 CHIPCAP X5R 100N K 10V 0402 Top M 5 100n

C2330 CHIPCAP NP0 33P J 50V 0402 Top G 2 33p

C2331 CHIPCAP X5R 1U K 6V3 0603 Top P 5 1u0

C2332 CHIPCAP X5R 4U7 K 10V 0805 Top P 5 4u7

C2400 CHIPCAP X5R 1U K 16V 0603 Bottom U 4 1u0

C2401 CHIPCAP X5R 1U K 6V3 0603 Bottom U 6 1u0

C2402 CHIPCAP X5R 100N K 10V 0402 Bottom C 2 100n

C2403 CHIPCAP X5R 100N K 10V 0402 Bottom C 2 100n

C2404 CHIPCAP NP0 22P J 50V 0402 Top C 4 22p

C2405 CHIPCAP NP0 47P J 50V 0402 Top P 5 47p

C2700 CHIPCAP X5R 100N K 10V 0402 Top R 4 100n

C2880 CHIPCAP X7R 10N K 16V 0402 Top O 4 10n

C2881 CHIPCAP X5R 100N K 10V 0402 Top P 3 100n

C2882 CHIPCAP X7R 10N K 16V 0402 Top P 3 10n

C2883 CHIPCAP X7R 10N K 16V 0402 Top O 2 10n

C2884 CHIPCAP X5R 100N K 10V 0402 Top O 2 100n

C2885 CHIPCAP X7R 10N K 16V 0402 Top P 3 10n

C2886 CHIPCAP X5R 100N K 10V 0402 Top P 3 100n

C2887 CHIPCAP X7R 10N K 16V 0402 Top O 2 10n

C2900 CHIPCAP X7R 1N0 K 50V 0402 Top K 7 1n0

C3030 CHIPCAP X7R 10N K 16V 0402 Top N 2 10n

C3031 CHIPCAP X5R 100N K 10V 0402 Top N 2 100n

C3032 CHIPCAP X5R 100N M 16V 0402 Top N 2 100n

C6157 CHIPCAP X7R 10N K 16V 0402 Top R 6 10n

C6158 CHIPCAP X5R 100N K 10V 0402 Top R 6 100n

C6159 CHIPCAP X7R 33N K 10V 0402 Top Q 7 33n

C6162 CHIPCAP X7R 33N K 10V 0402 Top Q 6 33n

C6163 CHIPCAP X7R 33N K 10V 0402 Top R 6 33n

C6165 CHIPCAP X7R 33N K 10V 0402 Top Q 8 33n

C6170 CHIPCAP X7R 10N K 16V 0402 Top R 7 10n

C6176 CHIPCAP NP0 100P J 50V 0402 Top R 7 100p

C6178 CHIPCAP NP0 27P J 50V 0402 Top R 7 27p

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Item ref Name Side X/Y Value

C6179 CHIPCAP NP0 47P J 50V 0402 Top R 7 47p

C7604 CHIPCAP NP0 1P0 C 50V 0402 Top I 6 1p0

C7607 CHIPCAP NP0 1P2 C 50V 0402 Top I 7 1p2

C7610 CHIPCAP NP0 10P J 50V 0402 Top I 8 10p

C7611 CHIPCAP NP0 10P J 50V 0402 Top I 7 10p

C7612 CHIPCAP NP0 10P J 50V 0402 Top I 7 10p

C7613 CHIPCAP X5R 1U K 6V3 0402 Top I 8 1u0

C7614 CHIPCAP NP0 4P7 C 50V 0402 Top J 7 4p7

C7620 CHIPCAP X5R 2U2 K 6V3 0603 Top K 7 2u2

C7623 CHIPCAP NP0 22P J 50V 0402 Top J 7 22p

C7624 CHIPCAP X5R 100N K 10V 0402 Top J 8 100n

C7625 CHIPCAP NP0 22P J 50V 0402 Top J 6 22p

C7627 CHIPCAP NP0 56P J 50V 0402 Top J 5 56p

C7628 CHIPCAP NP0 56P J 50V 0402 Top J 5 56p

C7630 CHIPCAP NP0 22P J 50V 0402 Top K 6 22p

C7631 CHIPCAP NP0 0P5 C 50V 0402 Top D 3 0p5

C7634 CHIPCAP X5R 100N K 10V 0402 Top I 7 100n

C7635 CHIPCAP X5R 100N K 10V 0402 Top K 6 100n

C7636 CHIPCAP NP0 1P8 C 50V 0402 Top K 6 1p0

C7637 CHIPCAP X7R 1N0 J 50V 0402 Top K 2 1n0

C7638 CHIPCAP NP0 33P J 50V 0402 Top K 2 33p

C7639 CHIPCAP NP0 270P J 50V 0402 Top J 7 270p

C7641 CHIPCAP NP0 270P J 50V 0402 Top J 7 270p

C7643 CHIPCAP X5R 100N K 10V 0402 Top K 6 100n

C7644 CHIPCAP X7R 560P J 50V 0402 Top J 7 560p

C7645 CHIPCAP X7R 560P J 50V 0402 Top I 7 560p

C7655 CHIPCAP NP0 10P J 50V 0402 Top I 5 10p

C7656 CHIPCAP X5R 100N K 10V 0402 Top J 5 100n

C7657 CHIPCAP NP0 22P J 50V 0402 Top K 7 22p

C7658 CHIPCAP NP0 22P J 50V 0402 Top J 7 22p

C7659 CHIPCAP NP0 22P J 50V 0402 Top I 6 22p

C7668 CHIPCAP NP0 22P J 50V 0402 Top I 6 22p

C7669 CHIPCAP NP0 3N9 J 25V 0805 Top K 8 3n9

C7700 CHIPCAP NP0 33P J 50V 0402 Top K 3 33p

C7701 CHIPCAP NP0 33P J 50V 0402 Top K 3 33p

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Item ref Name Side X/Y Value

C7702 CHIPCAP NP0 33P J 50V 0402 Top K 4 33p

C7711 CHIPCAP X5R 2U2 K 10V 0805 Top I 2 2u2

C7712 CHIPCAP NP0 15P J 50V 0402 Top I 4 15p

C7713 CHIPCAP NP0 27P J 50V 0402 Top I 2 27p

C7714 CHIPCAP NP0 27P J 50V 0402 Top K 3 27p

C7720 CHIPCAP NP0 33P J 50V 0402 Top K 4 33p

C7725 CHIPCAP NP0 120P J 50V 0402 Top K 3 120p

C7726 CHIPCAP NP0 22P J 50V 0402 Top J 2 22p

C7727 CHIPCAP NP0 10P J 50V 0402 Top K 2 10p

C7728 CHIPCAP NP0 0P5 C 50V 0402 Top K 2 0p5

D2200 UEMCLITE V2.2 WD ENA LEADFREE TFB Top O 5 ~

D2800 UPP4M v3 F761522 10x10 uBGA173 Top O 3 ~

D3000 COMBO 128M NOR + 16M PSRAM TFBGA4 Top M 3 8Mx16/1Mx16

F2000 SM FUSE FF 2A 32V 0402 Top T 7 2.0A

H2400 SM CONN 2X5F P0.5 PWB/PWB Bottom C 3 ~

L2000 FERR.BEAD 0R03 42R/100MHZ 3A 0805 Top T 7 42R/100MHz

L2001 CHIP BEAD ARRAY 2X1000R 0405 Top R 3 2x1000R/100MHz

L2002 CHIP BEAD ARRAY 2X1000R 0405 Top R 4 2x1000R/100MHz

L2005 CHIP COIL 68NH J Q12/100MHZ 0603 Top R 6 68nH

L2170 FERRITE BEAD 0R5 600R/100MHZ 0603 Top S 3 600R/100MHz

L2180 FERR.BEAD 220R/100M 2A 0R05 0603 Top M 7 220R/100MHz

L2181 FERR.BEAD 220R/100M 2A 0R05 0603 Top M 7 220R/100MHz

L2182 CHIP COIL 33N J Q23/800MHZ 0402 Bottom B 6 33nH

L2183 CHIP COIL 33N J Q23/800MHZ 0402 Bottom B 6 33nH

L2400 CHOKE 22U M 0.33A 1R5 3.3X3.3X1.3 Bottom U 6 22uH

L6156 CHIP COIL 47N G Q38/200MHz 0603 Top Q 6 47nH

L6176 CHIP COIL 120N J Q32/150MHZ 0603 Top R 7 120nH

L7602 CHIP COIL 10N J Q30/800MHZ 0402 Top I 7 10nH

L7603 CHIP COIL 10N J Q30/800MHZ 0402 Top I 7 10nH

L7604 CHIP COIL 2N2 +-0N3 Q30/800M 0402 Top I 6 2n2H

L7605 CHIP COIL 2N2 +-0N3 Q30/800M 0402 Top I 6 2n2H

M2000 SMD VIBRA MOTOR 1.3V 90MA 9000RPM Top G 6 ~

N2150 PW AMP TPA2010D1YZF 250kHz CSP9 Top M 7 ~

N2160 TI Analog Switch TS5A3159DCKR Top L 7 ~

N2161 TI Analog Switch TS5A3159DCKR Top L 7 ~

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Item ref Name Side X/Y Value

N2400 DC/DC CONV TK65600 USMD8 Bottom T 6 ~

N6156 FM RECEIVER TEA5761UK N3D (Ti) CS Top Q 7 ~

N7600 HUGIN+ PMB3258V1.1 B9C PGVQFN48-4 Top J 7 ~

N7700 FEM RF3282E5.1 2B TX/RX (900/1800 Top J 3 ~

R2000 CHIP VARISTOR VWM5.6V VC15.5V 040 Top G 3 5/50V

R2001 NTC RES 0W1 47K J B 4050+-3% 0402 Top Q 3 47k

R2002 CHIPRES 0W06 100R J 0402 Top R 5 100R

R2003 CHIPRES 0W06 100R J 0402 Top R 5 100R

R2004 CHIPRES 0W06 100R J 0402 Top R 5 100R

R2005 CHIPRES 0W06 100R J 0402 Top S 5 100R

R2006 RES VARISTOR 14/350V 3pF 0402 Top R 5 5/50V

R2007 CHIP VARISTOR VWM14V VC50V 0402 Top R 4 14V/50V

R2008 CHIP VARISTOR VWM14V VC50V 0402 Top S 4 14V/50V

R2009 CHIP VARISTOR VWM14V VC50V 0402 Top R 4 14V/50V

R2010 CHIPRES 0W06 100K J 0402 Top S 3 100k

R2011 RES NETWORK 0W06 2X10R J 0404 Top R 4 2x10R

R2013 CHIP VARISTOR VWM5.6V VC15.5V 040 Top R 5 5.6V/15V/0.05J

R2020 ASIP 4XESD *** PB-FREE *** BGA5 Top R 5 ~

R2027 CHIPRES 0W06 10K J 0402 Top R 5 10k

R2068 RES NETWORK 0W03 4X22R J 0804 Top S 2 4x22R

R2069 CHIPRES 0W06 1K0 J 0402 Top S 2 1k0

R2070 CHIP VARISTOR VWM5.6V VC15.5V 040 Top S 2 5.6V/15V/0.05J

R2150 RES NETWORK 0W06 2X1K0 J 0404 Top N 7 2x1k0

R2151 CHIPRES 0W06 10R J 0402 Top M 7 10R

R2152 CHIPRES 0W06 10K J 0402 Top N 7 10k

R2153 RES NETWORK 0W06 2X2K2 J 0404 Top N 7 2x2k2

R2154 RES NETWORK 0W06 2X2K2 J 0404 Top N 7 2x2k2

R2155 CHIPRES 0W06 10R J 0402 Top L 6 10R

R2156 CHIPRES 0W06 2K2 J 0402 Top O 7 2k2

R2158 CHIPRES 0W06 18K J 0402 Top N 7 39k

R2159 CHIPRES 0W06 18K J 0402 Top N 7 39k

R2160 CHIPRES 0W06 100K J 0402 Top L 6 100k

R2171 CHIPRES 0W06 220R J 0402 Top N 8 220R

R2200 CHIPRES 0W25 0R22 J 0805 Top P 6 0R22

R2202 CHIPRES 0W06 100K J 0402 Top M 7 100k

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Item ref Name Side X/Y Value

R2203 CHIPRES 0W06 100K J 0402 Top M 7 100k

R2204 CHIPRES 0W06 100K J 0402 Top M 6 100k

R2205 RES NETWORK 0W06 2X10K J 0404 Top M 6 2x10k

R2206 CHIPRES 0W06 100K J 0402 Top M 7 100k

R2207 CHIPRES 0W06 1K0 J 0402 Top L 4 1k0

R2400 CHIPRES 0W06 33R J 0402 Bottom U 5 33R

R2406 CHIPRES 0W06 220R J 0402 Top O 2 220R

R2407 CHIPRES 0W06 220R J 0402 Top P 2 220R

R2408 CHIPRES 0W06 220R J 0402 Top P 2 220R

R2409 CHIPRES 0W06 10K J 0402 Bottom T 4 10k

R2410 CHIPRES 0W06 27K J 0402 Top C 4 27k

R2700 ASIP SIM INTERFACE **low cap** BG Top P 4 ~

R2900 CHIPRES 0W06 330R J 0402 Top K 7 330R

R3030 CHIPRES 0W06 4K7 J 0402 Top O 2 4k7

R6110 CHIPRES 0W06 1K0 J 0402 Top Q 8 1k0

R6156 CHIPRES JUMPER 0R0 0402 Top Q 7 0R

R6159 CHIPRES 0W06 10K J 0402 Top R 6 10k

R6160 CHIPRES 0W06 100K J 0402 Top R 6 100k

R6161 CHIPRES JUMPER 0R0 0402 Top R 7 0R

R6163 CHIPRES JUMPER 0R0 0402 Top Q 6 0R

R6170 CHIPRES JUMPER 0R0 0402 Top R 8 0R

R7605 CHIPRES 0W06 22R J 0402 Top K 7 22R

R7606 CHIPRES JUMPER 0R0 0402 Top

R7607 CHIPRES JUMPER 0R0 0402 Top

R7609 CHIPRES 0W06 12K F 0402 Top K 6 12k

R7610 RES NETWORK 0W06 2X5K6 J 0404 Top M 5 2x5k6

R7611 RES NETWORK 0W06 2X5K6 J 0404 Top M 5 2x5k6

R7615 CHIPRES 0W06 100R J 0402 Top H 8 100R

R7616 CHIPRES 0W06 100R J 0402 Top H 7 100R

R7617 CHIPRES 0W06 100R J 0402 Top H 7 100R

R7619 CHIPRES 0W06 3K3 J 0402 Top J 8 3k3

R7630 CHIPRES 0W06 100K J 0402 Top K 6 100k

R7631 CHIPRES 0W06 18K J 0402 Top K 7 18k

R7632 CHIPRES 0W06 39R J 0402 Top K 6 39R

R7633 NTC RES 0W1 47K J B 4050+-3% 0402 Top K 2 47k

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Item ref Name Side X/Y Value

R7635 CHIPRES 0W06 1K0 J 0402 Top K 2 1k0

R7663 CHIPRES 0W06 4K7 J 0402 Top K 8 4k7

R7700 CHIPRES 0W06 1K0 J 0402 Top I 5 1k0

R7701 CHIPRES 0W06 1K0 J 0402 Top I 5 1k0

R7703 CHIPRES JUMPER 0R0 0402 Top J 5 0R

R7704 CHIPRES 0W06 1K0 J 0402 Top K 3 1k0

R7705 CHIPRES 0W06 1K0 J 0402 Top K 3 1k0

R7706 CHIPRES 0W06 1K0 J 0402 Top K 3 1k0

R7707 CHIPRES 0W06 1K0 J 0402 Top I 5 1k0

R7709 CHIPRES JUMPER 0R0 0402 Top I 5 0R

R7711 RES NETWORK 0W04 1DB ATT 0404 Top J 4 870R/5R77/870R

R7714 RES NETWORK 0W04 1DB ATT 0404 Top J 2 870R/5R77/870R

R7720 CHIPRES 0W06 1K0 J 0402 Top K 4 1k0

R7732 CHIPRES 0W06 10K J 0402 Top K 2 10k

R7733 CHIPRES 0W06 100R J 0402 Top K 2 100R

S2422 SM SW TACT SPST 12V SIDE KEY 3N Top B 4 ~

V2000 ASIP TVS BGA4 Top S 7 ~

V2160 TR PDTC114EE N50V RB RBE 10K SC75 Top L 6 ~

V2400 LED WHITE 112-355MCD 15MA 0DEG 16 Bottom U 5 ~

V2401 TR PDTA114EE RB RBE 10K 50V SC75 Bottom U 3 ~

V7600 DI CAP 40/15.8PF 1/3V SCD80 Top K 6 ~

X2005 SM LYNX BATT CONN 3POL 12V 2A H7. Top G 3 ~

X2060 MODULE ID COMPONENT 2.8X1.8X0.3 Bottom T 3 ~

X2700 SM SIM CONN 6POL P2.54 H1.8 Top Q 4 ~

Z2400 ASIP KEYBOARD INTERFACE *PB-FREE* Top Q 3 ~

Z7600 SAW FILT 1842.5+-37.5MHZ/2.0X1.6 Top H 6 1842.5MHz

Z7602 SAW FILT 942.5+-17.5MHZ/2.0X1.6 Top H 7 942.5MHz

Z7603 SILICON FILT 869.5±45.5MHZ P-TSLP Top J 5 824-915MHz

Z7604 SILICON FILT 1810±100MHZ P-TSLP- Top J 5 1710-1910MHz

PWB M6 4/PA

Component layouts

Note: See also lager size layouts in the Schematics section (Page 9–8).

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Component layout, bottom

Figure 4 Component layout, RM-74, 1mf_51a, bottom

Component layout, top

Figure 5 Component layout, RM-74, 1mf_51a, top

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3 — Phoenix service SW

Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 3–1

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Page 3–2 Company Confidential 9242678 (Issue 1)

Table of Contents

Service software installation.......................................................................................................................................................3–5

Phoenix installation steps in brief.......................................................................................................................................3–5

Installing Phoenix.....................................................................................................................................................................3–5

Phoenix update installation................................................................................................................................................3–11

Uninstalling Phoenix..............................................................................................................................................................3–12

Repairing Phoenix installation...........................................................................................................................................3–14

Phoenix service software data package overview.......................................................................................................3–15

Installing Phoenix data package........................................................................................................................................3–16

Uninstalling Phoenix data package..................................................................................................................................3–20

Service software instructions...................................................................................................................................................3–21

Configuring users in Phoenix..............................................................................................................................................3–21

Managing connections in Phoenix....................................................................................................................................3–22

Installing Flash support files for FPS-8* and FLS-4*.....................................................................................................3–25

Updating FPS-8 Flash prommer software.......................................................................................................................3–28

Activating FPS-8.......................................................................................................................................................................3–30

Deactivating FPS-8..................................................................................................................................................................3–32

Updating JBV-1 docking station software.......................................................................................................................3–33

List of Figures

Figure 6 Dongle not found...........................................................................................................................................................3–6

Figure 7 Preparing setup..............................................................................................................................................................3–6

Figure 8 Welcome dialog..............................................................................................................................................................3–7

Figure 9 Disclaimer text................................................................................................................................................................3–7

Figure 10 Destination folder........................................................................................................................................................3–8

Figure 11 Installation status 1....................................................................................................................................................3–8

Figure 12 Installation status 2....................................................................................................................................................3–9

Figure 13 Registering components 1........................................................................................................................................3–9

Figure 14 Restart computer.......................................................................................................................................................3–10

Figure 15 Registering components 2.....................................................................................................................................3–10

Figure 16 Finish installation......................................................................................................................................................3–11

Figure 17 Installation interrupted...........................................................................................................................................3–12

Figure 18 Remove program.......................................................................................................................................................3–12

Figure 19 Uninstallation status................................................................................................................................................3–13

Figure 20 Finish uninstallation.................................................................................................................................................3–13

Figure 21 Restart computer.......................................................................................................................................................3–14

Figure 22 Repair program..........................................................................................................................................................3–15

Figure 23 Finish repair installation.........................................................................................................................................3–15

Figure 24 Extracting files............................................................................................................................................................3–16

Figure 25 Continue data package installation.....................................................................................................................3–17

Figure 26 Data package setup information..........................................................................................................................3–17

Figure 27 Data package destination folder..........................................................................................................................3–18

Figure 28 Start copying files......................................................................................................................................................3–18

Figure 29 Data package installation status..........................................................................................................................3–19

Figure 30 Finish data package installation..........................................................................................................................3–19

Figure 31 Uninstalling Phoenix data package.....................................................................................................................3–20

Figure 32 Finish data package uninstallation.....................................................................................................................3–20

Figure 33 Login..............................................................................................................................................................................3–21

Figure 34 Add information for new user 1...........................................................................................................................3–21

Figure 35 Add information for new user 2...........................................................................................................................3–21

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Figure 36 Login, user configured.............................................................................................................................................3–22

Figure 37 Phoenix icon...............................................................................................................................................................3–22

Figure 38 Manage connections................................................................................................................................................3–22

Figure 39 Connections list..........................................................................................................................................................3–23

Figure 40 Select mode: Manual................................................................................................................................................3–23

Figure 41 FLS virtual port icon..................................................................................................................................................3–23

Figure 42 Connections list..........................................................................................................................................................3–24

Figure 43 Connection information..........................................................................................................................................3–24

Figure 44 Scan product...............................................................................................................................................................3–24

Figure 45 Product support module information................................................................................................................3–25

Figure 46 Flash update welcome dialog...............................................................................................................................3–25

Figure 47 Uninstall flash update package.............................................................................................................................3–26

Figure 48 Flash installation interrupted................................................................................................................................3–26

Figure 49 Continue flash update..............................................................................................................................................3–26

Figure 50 Flash destination folder..........................................................................................................................................3–27

Figure 51 Flash installation status..........................................................................................................................................3–27

Figure 52 Finish flash update....................................................................................................................................................3–28

Figure 53 Phoenix icon...............................................................................................................................................................3–28

Figure 54 FPS-8 maintenance...................................................................................................................................................3–28

Figure 55 Prommer SW update................................................................................................................................................3–29

Figure 56 Prommer SW update done.....................................................................................................................................3–29

Figure 57 FPS-8 info window....................................................................................................................................................3–30

Figure 58 Flash directory window...........................................................................................................................................3–30

Figure 59 FPS-8 maintenance...................................................................................................................................................3–31

Figure 60 FPS-8 info window....................................................................................................................................................3–31

Figure 61 Box activation.............................................................................................................................................................3–32

Figure 62 Deactivation warning..............................................................................................................................................3–32

Figure 63 Extracting JBV-1 update files.................................................................................................................................3–33

Figure 64 JBV-1 update information.......................................................................................................................................3–34

Figure 65 JBV-1 update destination folder...........................................................................................................................3–34

Figure 66 Select installation: Full.............................................................................................................................................3–35

Figure 67 Select program folder..............................................................................................................................................3–35

Figure 68 Finish JBV-1 update installation...........................................................................................................................3–36

Figure 69 Checking JBV-1 SW version.....................................................................................................................................3–36

Figure 70 JBV-1 update directory window...........................................................................................................................3–37

Figure 71 JBV-1 SW update done.............................................................................................................................................3–37

Figure 72 JBV-1 SW status..........................................................................................................................................................3–37

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Service software installation

Phoenix installation steps in brief

Phoenix is the DCT-4 generation service software for reprogramming, testing and tuning the phone.

To install Phoenix, you need to:

• Connect a DK2 Dongle or FLS-4S POS Flash Device

• Install the Phoenix Service SW

• Install the Data Package for Phoenix

• Configure users

• Manage connection settings (depends on the tools you are using)

Phoenix is now ready for FLS-4S Point Of Sales Flash Device use.

If you use FPS-8:

• Update FPS-8 SW

• Activate FPS-8

• Update JBV-1 Docking Station SW (only when needed)

Phoenix is now ready to be used with FPS-8 flash prommer and other tools as well.

The Phoenix Service Software installation contains:

• Service software support for all phone models included in the package

• Flash update package files for FPS-8* and FLS-4S programming devices

• All needed drivers for:

• DK2 dongle

• FLS-4S point of sales flash device

• USB devices

Note: Separate installation packages for flash update files and drivers are also available, but it is not

necessary to use them unless updates appear between Phoenix Service SW releases. If separate update

packages are used, they should be used after Phoenix and data packages have been installed.

Supported operating systems

• Windows 2000 and XP.

Hardware requirements for using Phoenix

• Minimum: Processor 300 MHz, RAM memory 64 MB, disk space 100 MB.

• Recommended for Windows 2000: Processor 700 MHz, RAM memory 256 MB, disk space 150 MB.

Installing Phoenix

Before you begin

• Check that a Dongle is attached to the parallel port of your computer.

• Download the installation package (for example, phoenix_service_sw_a15_2004_24_7_55.exe) to your

computer (in C:\TEMP, for instance).

• Close all other programs.

• Run the application file (for example, phoenix_service_sw_a15_2004_24_7_55.exe) and follow the instructions

on the screen.

Note: Administrator rights may be required to be able to install Phoenix depending on the operating

system.

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If uninstalling or rebooting is needed at any point, you will be prompted by the Install Shield program.

Context

If at any point during installation you get this message, Dongle is not found and installation cannot continue:

Figure 6 Dongle not found

Possible reasons may be a defective or too old PKD-1 Dongle (a new dongle has a six digit serial number).

Check the COM/parallel ports used first! After correcting the problem the installation can be restarted.

For more detailed information, please refer to Phoenix Help files. Each feature in Phoenix has its own Help

function, which can be activated while running the program. Press the F1 key or the Help button to activate a

Help file.

Steps

1. Run the phoenix_service_sw_a15_2004_24_7_55.exe to start installation. Install Shield prepared the setup.

Figure 7 Preparing setup

Install Shield will prepare.

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2. Click Next in Welcome dialog to continue.

Figure 8 Welcome dialog

3. Read the disclaimer carefully.

Figure 9 Disclaimer text

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4. Choose destination folder. The default folder C:\ProgramFiles\Nokia\Phoenix is recommended. Then click

Next to continue. You may choose another location by selecting Browse (not recommended).

Figure 10 Destination folder

5. Wait for the components to be copied. The progress of the setup is shown in the Setup Status window.

Figure 11 Installation status 1

6. Wait for the drivers to be installed and updated.

The process may take several minutes to complete.

If the operating system does not require rebooting (Windows 2000, XP) the PC components are registered

right away.

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Figure 12 Installation status 2

Figure 13 Registering components 1

If the operating system requires restarting your computer (Windows 98, SE, ME) the Install Shield Wizard

will tell you about it. Select Yes... to reboot the PC immediately and No... to reboot the PC manually afterwards.

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Figure 14 Restart computer

After the reboot, components are registered and Phoenix is ready for use.

Note: Phoenix does not work, if components have not been registered.

Figure 15 Registering components 2

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7. Click Finish to end installation.

Figure 16 Finish installation

Phoenix is now ready for use.

Next action

Before using Phoenix Service Software, you must:

• install phone model specific data package for Phoenix, and

• configure users and connections.

FPS-8* can be used after updating its Flash Update Package files.

Phoenix update installation

If you already have the Phoenix Service SW installed on your computer, sooner or later there will be need to

update it when new versions are released.

Always use the latest available versions of both the Phoenix Service SW and the phone-specific Data Package.

Instructions can be found in phone model specific Technical Bulletins and Phone Data Package readme.txt files

(shown during installation).

To update the Phoenix Service Software you need to take exactly the same steps as when installing it for the

first time:

• Download the installation package to your computer hard disk.

• Close all other programs.

• Run the application file (for example, phoenix_service_sw_a15_2004_24_7_55.exe).

• New version of Phoenix will be installed.

• Driver versions will be checked and updated.

When you update Phoenix from old to new version (for example, a14_2004_16_4_47 to a15_2004_24_7_55), the

update will take place automatically without uninstallation.

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If you try to update the Phoenix Service Software with the same version that you already have (for example,

a15_2004_24_7_55 to a15_2004_24_7_55) you are asked if you want to uninstall the version of Phoenix you have

on your PC. In this case you can choose between total uninstallation and repair just like when you choose to

uninstall Phoenix service software from the Windows Control panel.

If you try to install an older version (for example, downgrade from a15_2004_24_7_55 to a14_2004_16_4_47),

installation will be interrupted.

Always follow the instructions on the screen.

Figure 17 Installation interrupted

Uninstalling Phoenix

Context

Uninstallation can be done manually from Windows Control Panel → Add/Remove Programs .

Steps

1. Choose Phoenix Service Software → Add/Remove → Remove to uninstall Phoenix.

Figure 18 Remove program

The progress of the uninstallation is shown.

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Figure 19 Uninstallation status

2. If the operating system does not require rebooting, click Finish to complete.

Else, Install Shield Wizard will tell you about it. Select Yes... to reboot the PC immediately and No... to reboot

the PC manually afterwards.

Figure 20 Finish uninstallation

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Figure 21 Restart computer

Repairing Phoenix installation

Context

If you experience any problems with the service software, or suspect that files have been lost, you can use the

repair function before completely reinstalling Phoenix.

Note: The original installation package (for example, phoenix_service_sw_a15_2004_24_7_55.exe) must

be found on your PC when you run the repair setup.

Steps

1. Open Windows Control Panel → Add/Remove Programs .

2. Select Phoenix Service Software → Add/Remove .

3. In the following view, choose Repair.

Phoenix will now reinstall components and register them. The procedure is the same as in the update

installation.

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Figure 22 Repair program

4. Click Finish to complete repair.

Figure 23 Finish repair installation

Phoenix service software data package overview

Each product has its own data package (DP). This contains all product-specific data files to make the Phoenix

Service Software and tools usable with a certain phone model:

• Product software binary files

• Files for type label printing

• Validation file for the faultlog repair data reporting system

• All product-specific configuration files for Phoenix Service Software components

Data files are stored under C:\Program Files\Nokia\Phoenix (default).

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Installing Phoenix data package

Before you begin

1 Verify that The data package contains all product-specific data to make the Phoenix Service Software and

tools usable with a certain phone model.

2 Check that the dongle is attached to the parallel port of your computer.

3 Install Phoenix Service SW.

4 Download the installation package (for example, RM-51_dp_EA_v_1_0.exe) to your computer (for example, in

C:\TEMP).

5 Close all other programs.

6 Run the application file (for example, RM-51_dp_EA_ v_1_0.exe) and follow the instructions on the screen.

If you already have the Phoenix Service SW installed on your computer, you will need to update it when a new

version is released.

Note: Very often the Phoenix Service SW and the phone-specific data package for Phoenix come in

pairs, meaning that a certain version of Phoenix can only be used with a certain version of the data

package. Always use the latest available versions of both. Instructions can be found in phone model

specific Technical Bulletins and readme.txt files of the data packages.

Steps

1. To start installation, run the application file (for example, RM-51_dp_EA_ v_1_0.exe).

2. Click Next, and wait for the installation files to be extracted.

Figure 24 Extracting files

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3. Click Next to continue.

Figure 25 Continue data package installation

In this view you can see the contents of the data package. Read the text carefully. There should be information

about the Phoenix version required with this data package.

Click Next to continue.

Figure 26 Data package setup information

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4. Confirm location and click Next to continue.

Figure 27 Data package destination folder

The install shield checks where the Phoenix application is installed and the directory is shown.

Click Next to continue.

5. Click Next to start copying the files.

Phone model specific files will be installed. Please wait.

Figure 28 Start copying files

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Figure 29 Data package installation status

6. Click Finish to complete the installation.

Figure 30 Finish data package installation

You now have all phone model specific files installed in your Phoenix Service SW.

Next action

Phoenix can be used, for example, for flashing phones and printing type labels. But first you must:

• configure users, and

• manage connections.

FLS-4S can be used right away.

FPS-8* can be used after updating Flash Update Package files.

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Uninstalling Phoenix data package

Context

If you try to install the same version of Phoenix data package that you already have, you are asked if you want

to uninstall the version you have on your PC. Older versions of data packages don´t need to be uninstalled unless

instructions to do so are given in the readme.txt file of the data package and bulletins concerning the release.

Please read all related documents carefully.

Steps

1. Click OK to uninstall, Cancel if you don’t want to uninstall.

Figure 31 Uninstalling Phoenix data package

2. Once the previously installed data package is uninstalled, click Finish.

Figure 32 Finish data package uninstallation

Alternative steps

•Uninstallation can also be done manually from Windows Control Panel → Add/Remove Programs →

xx-xx (* Phone Data Package) . (*= type designator of the phone

Next action

Run the installation package again to continue installation from the beginning.

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Service software instructions

Configuring users in Phoenix

Steps

1. Start Phoenix Service SW and log in.

If your user ID is already configured, choose it from the dropdown list and click OK. To add a new user or

edit existing ones click Maintain.

Figure 33 Login

2. Choose New to add information for a new user.

Figure 34 Add information for new user 1

3. Type in your name and initials and click OK.

Figure 35 Add information for new user 2

A new user is now created.

4. Click OK.

You are now able to login with this user name.

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5. Click OK.

Figure 36 Login, user configured

Managing connections in Phoenix

Steps

1. Start Phoenix Service SW and log in.

Figure 37 Phoenix icon

2. Choose File → Manage Connections .

Figure 38 Manage connections

Existing connections can be selected, edited, deleted, and new ones created by using this dialog.

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Figure 39 Connections list

3. Click Add to add a new connection, and select if you want to create it manually or by using the Connection

Wizard.

In the following dialogs you will be asked to select settings for the connection. If you use the Wizard, connect

the tools and a phone to your PC and the wizard will automatically try to configure the correct connection.

4. Select Manual mode, and click Next to continue.

Figure 40 Select mode: Manual

i For FLS-4S POS Flash Device, choose the following connection settings:

• Media: FBUS

• COM Port: Virtual COM Port used by FLS-4

Note: ALWAYS check this. Go to Windows → Control Panel → FLS Virtual Port → Configuration .

Figure 41 FLS virtual port icon

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ii For FPS-8 Flash Prommer, choose the following connection settings:

• Media: FPS-8

• Port Num: COM Port where FPS-8 is connected

• COMBOX_DEF_MEDIA: FBUS

5. Click Finish to complete the configuration.

6. Activate the connection you want to use by clicking it, use up/down arrows to move it on top of the list, and

click Apply.

Figure 42 Connections list

The connection is now selected and can be used after closing the Manage Connections window.

Selected connection will be shown on the right hand bottom corner of the screen.

Figure 43 Connection information

7. To use the selected connection, connect the phone to Phoenix with correct service tools, make sure that it

is switched on and select Scan Product.

Figure 44 Scan product

When a product is found, Phoenix will load product support. Name of the loaded product support module

and its version information will be shown on the bottom of the screen.

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Figure 45 Product support module information

Installing Flash support files for FPS-8* and FLS-4*

Before you begin

Note: This is a separate installation package.

• Install Phoenix Service SW.

• Install phone model specific data package for Phoenix.

• The flash support files are delivered in the same installation package with Phoenix data packages or newer

Phoenix packages since September 2003.

• Normally it is enough to install Phoenix and the phone-specific data package because the Phoenix installation

always includes the latest flash update package files for FLS-4S/FPS-8*.

• A separate installation package for flash support files is available, and the files can be updated according to

this instruction if updates appear between Phoenix/data package releases.

Context

If you are not using a separate installation package, you can skip this section and continue with FPS-8 Flash

prommer SW update (Page 3–28) after installing a new phone data package.

Steps

1. Start by double clicking flash_update_03_13_001.exe to begin installation.

Figure 46 Flash update welcome dialog

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2. If the same version of Flash Update package already exists, and you want to reinstall it, the previous package

is first uninstalled. Run the installation again.

Figure 47 Uninstall flash update package

If you try to downgrade the existing version to older ones, the setup will be aborted. If you really want to

downgrade, uninstall newer files manually from Control Panel and then rerun the installation again.

Figure 48 Flash installation interrupted

If an older version exists on your PC and it needs to be updated, click Next to continue installation.

Figure 49 Continue flash update

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3. It is highly recommended to install the files to the default destination folder C:\Program Files\Nokia

\Phoenix. Click Next to continue.

Figure 50 Flash destination folder

When installing the flash update files for the first time you may choose another location by selecting

Browse. However, this is not recommended.

Installation will continue.

Figure 51 Flash installation status

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4. Choose Finish to complete the installation procedure.

Figure 52 Finish flash update

Next action

FLS-4 can be used right after the Flash Update Package is installed.

FPS-8* flash prommer must be updated using Phoenix!

Updating FPS-8 Flash prommer software

Steps

1. Start Phoenix Service Software and log in, manage connection correctly for the FPS-8* flash prommer.

Figure 53 Phoenix icon

2. Choose Flashing → FPS-8 Maintenance .

Figure 54 FPS-8 maintenance

Note: Screen shots may be different depending on the Phoenix version used and the connected

components.

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3. When the new FPS-8 flash update package is installed to computer you will be asked to update the files to

your FPS-8 Prommer. Select Yes to update files.

Figure 55 Prommer SW update

4. Wait until you are notified that update has been successful; the procedure will take a couple of minutes.

Click OK to close the FPS-8 Maintenance window.

Figure 56 Prommer SW update done

View after successful prommer software update:

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Figure 57 FPS-8 info window

Alternative steps

• FPS-8 SW can also be updated by pressing Update button and selecting appropriate fps8upd.ini file in C:

\Program Files\Nokia\Phoenix\Flash.

Figure 58 Flash directory window

• All files can be loaded separately to FPS-8. To do this, just press the right mouse button in the Flash box

files window and select the file type to be loaded.

More information can be found in Phoenix Help.

Activating FPS-8

Context

Before FPS-8 can be successfully used for phone programming, it must first be activated. Fill in first the FPS-8

activation request sheet in the FPS-8 sales package and follow the instructions on the sheet (included in sales

package CD-ROM or from partner web site).

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When activation file is received (for example, 00000.in), copy it to C:\ProgramFiles\Nokia\Phoenix

\BoxActivation directory on your computer (this directory is created when Phoenix is installed).

Steps

1. Start Phoenix Service Software.

2. Select Flashing → FPS-8 maintenance .

Figure 59 FPS-8 maintenance

3. Click Activate in the FPS-8 Maintenance window.

Figure 60 FPS-8 info window

If you saved the activation file to some other directory on your PC, Browse to find it

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4. Click Open to activate the box.

Figure 61 Box activation

5. Turn the FPS-8's power off and on to complete activation.

Deactivating FPS-8

Context

If there is, for example, a need to send the FPS-8 box for repair, it must be deactivated first.

Steps

1. Start Phoenix Service Software.

2. Choose Maintenance → Prommer Maintenance .

3. In the Prommer Maintenance window, click Deactivate.

4. To confirm the deactivation, click Yes.

Figure 62 Deactivation warning

The box is deactivated.

5. To complete the deactivation, restart FPS-8.

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Updating JBV-1 docking station software

Before you begin

The JBV-1 docking station contains software (firmware) which can be updated. You need the following

equipment to update the software:

• PC with USB connection

• operating system supporting USB (Not Win 95 or NT)

• USB Cable (can be purchased from shops or suppliers providing PC hardware and accessories)

• JBV-1 docking station

• external power supply (11-16V)

Before installation:

• Download Jbv1_18_update.zip file to your computer (in C:\TEMP for example) from your download web site.

• Close all other programs.

• Follow instructions on the screen.

Context

The JBV-1 docking station is a common tool for all DCT-4 generation products. In order to make the JBV-1 usable

with different phone models, a phone-specific docking station adapter is used.

Steps

1. Run Jbv1_18_update.zip file and start software installation by double clicking Setup.exe.

Note: DO NOT CONNECT THE USB CABLE/JBV-1 TO YOUR COMPUTER YET!

Figure 63 Extracting JBV-1 update files

Files needed for JBV-1 package setup program will be extracted.

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2. Read the instructions in the dialog box and click Next to continue.

Figure 64 JBV-1 update information

3. Accept the suggested destination folder for installing the JBV-1 SW Package, and click Next to continue.

Figure 65 JBV-1 update destination folder

4. Select Full installation and click Next to continue.

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Figure 66 Select installation: Full

5. A program folder is created and the software files are installed there. Click Next to continue.

Figure 67 Select program folder

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6. Click Finish to complete the installation.

Figure 68 Finish JBV-1 update installation

7. Connect the USB cable/JBV-1 to your computer. Connect power to JBV-1 (11-16V DC) from an external power

supply, then connect the USB Cable between the JBV-1 USB connector and the PC.

8. Install or update the JBV-1 USB drivers which are delivered with the JBV-1 SW installation package.

The drivers can be found in C:\Program Files\Nokia\ JBV-1 Firmware Update\JBV-1USB driver

•If there is no previously installed JBV-1 Firmware update package installed on your computer, Windows

will detect connected USB cable and detect drivers for new HW. You will be prompted about this, please

follow the instructions and allow Windows to search and install the best drivers available.

• If there is a previously installed JBV-1 Firmware update package (v.17 or older) on your computer, please

update the JBV-1 USB driver. Please see the readme.txt file in C:\Program Files\Nokia\JBV-1 Firmware

Update\JBV-1USB driver folder for instructions on how to update the JBV-1 USB Driver.

After you have installed or updated the JBV-1 USB driver, the actual JBV-1 SW update can begin.

9. Go to folder C:\Program Files\Nokia\JBV-1 Firmware Update\JBV-1 Firmware Update and start JBV-1 Update

SW by double clicking fwup.exe.

JBV-1 Firmware update starts and shows current status of the connected JBV-1. If firmware version read

from your JBV-1 is not the latest one available (v.17 or older), it needs to be updated to version 18 by

clicking Update Firmware.

10. Choose Refresh Status to check the SW version.

Figure 69 Checking JBV-1 SW version

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11. Choose file JBV1v18.CDE and click Open to update your JBV-1 to a new version (v.18).

Figure 70 JBV-1 update directory window

Wait until you hear a "click" from the JBV-1.

The older SW file JBV1v17.CDE is visible in this view only if the previous JBV-1 SW package has been installed

on your computer.

12. Click OK to see the current JBV-1 status (after a successful update).

Figure 71 JBV-1 SW update done

Figure 72 JBV-1 SW status

You have now updated the software of your JBV-1 docking station and it is ready for use.

Next action

If you have several docking stations you need to update, disconnect the power and USB cables from the previous

one and connect them to the next docking station. First, click Refresh Status to see the current SW version and

then Update Firmware to update the software.

After you have updated all docking stations, close the JBV-1 Firmware Update dialog box.

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4 — Service Tools

Nokia Customer Care

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Table of Contents

Service tools......................................................................................................................................................................................4–5

ACF-8..............................................................................................................................................................................................4–5

CA-45.........................................................................................................................................................................................4–0

CA-5S..............................................................................................................................................................................................4–5

CA-65DS....................................................................................................................................................................................4–0

CA-67DS....................................................................................................................................................................................4–0

DA-49........................................................................................................................................................................................4–0

DAU-9S......................................................................................................................................................................................4–0

FLC-2..............................................................................................................................................................................................4–6

FLS-4S............................................................................................................................................................................................4–7

FPS-10.......................................................................................................................................................................................4–0

FPS-8..............................................................................................................................................................................................4–7

JBV-1..............................................................................................................................................................................................4–8

MJ-59.........................................................................................................................................................................................4–0

PCS-1.........................................................................................................................................................................................4–0

PKD-1........................................................................................................................................................................................4–0

RJ-51 PA...................................................................................................................................................................................4–0

RJ-79.........................................................................................................................................................................................4–0

SA-41........................................................................................................................................................................................4–0

SF-10.........................................................................................................................................................................................4–0

SS-54.........................................................................................................................................................................................4–0

ST-30.........................................................................................................................................................................................4–0

SX-4...........................................................................................................................................................................................4–0

XCS-1...........................................................................................................................................................................................4–10

XCS-4...........................................................................................................................................................................................4–11

XRF-1.........................................................................................................................................................................................4–0

Service software concept...........................................................................................................................................................4–12

POS (Point of Sales) flash concept.....................................................................................................................................4–12

FPS-8 Prommer box flash concept.....................................................................................................................................4–13

JBV-1 flash concept.................................................................................................................................................................4–14

Module jig (MJ-59) service concept...................................................................................................................................4–15

List of Figures

Figure 73 POS flash concept......................................................................................................................................................4–12

Figure 74 FPS-8 Prommer box flash concept.......................................................................................................................4–13

Figure 75 JBV-1 flash concept...................................................................................................................................................4–14

Figure 76 Module jig service concept.....................................................................................................................................4–15

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Service tools

List of Service Tools

The table below gives a short overview of service tools that can be used for testing, error analysis and repair

of product , refer to various concepts.

ACF-8 Universal power

supply

ACF-8 universal power supply is used to power FPS-8. ACF-8 has 6V DC

and 2.1A output.

CA-45 DS easy flash cable

The CA-45 DS easy flash cable is used to connect the phone bottom

connector to either POS flashing device (FLS-4S) or to one of the

PROMMER boxes (FPS-8/FPS-10).

CA-5S DC cable

The DC cable CA-5S is used to connect JBV-1 to the phone charger jack

for ADC/VCHAR/ICHAR calibration

Note: Old SCB-3 can be used as well.

CA-65DS Easy flash cable

This cable connects the phone DC port to the FLS-4S prommer.

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CA-67DS Easy flash cable

This cable connects the phone DC port to the FPS-10 prommer.

DA-49 Docking station

adapter

The Docking Station adaptor is used for this phone in combination with

JBV-1. The adapter supports flashing and energy management

calibration.

Features include:

• compatible with the JBV-1

• easy phone attachment and detachment.

• reliable phone locking

• switch for detecting phone

• replaceable SIM interface

DAU-9S MBUS cable

The MBUS cable DAU-9S has a modular connector and is used, for

example, between the PC's serial port and module jigs, flash adapters or

docking station adapters.

Note: Docking station adapters valid for DCT4 products.

FLC-2 DC cable

FLC-2 is used with a flash adapter to supply a controlled operating

voltage.

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FLS-4S Flash device

FLS-4S is a dongle and flash device incorporated into one package,

developed specifically for POS use.

FPS-10 Flash prommer

FPS-10 interfaces with:

• PC

• Control unit

• Flash adapter

• Smart card

FPS-10 flash prommer features:

• Flash functionality for BB5 terminals

• Smart Card reader for SX-2 or SX-4

• USB traffic forwarding

• USB to FBUS/Flashbus conversion

• LAN to FBUS/Flashbus and USB conversion

• Vusb output switchable by PC command

FPS-10 sales package includes:

• FPS-10 prommer

• Power Supply with 5 country specific cords

• USB cable

FPS-8 FLASH prommer

The flash prommer FPS-8 is used for example with flash adapters,

docking station adapters and flash/docking stations. Power is supplied

to FPS-8 from the universal power supply, ACF-8.

The sales pack includes:

• FPS-8 flash prommer

• FPS-8 activation sheet

• ACF-8 universal power supply

• AXS-4 service cable (D9-D9)

• Printer cable

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JBV-1 Docking station

The JBV-1 docking station is a general tool that has been designed for

calibration and software update use. The JBV-1 is used together with a

docking station adapter as one unit

In calibration mode the JBV-1 is powered by an external power supply:

11-16V DC. When flashing the power for the phone can be taken from

the flash prommer or external power supply: 11-16 V DC.

Note: JBV-1 main electrical functions are:

• adjustable VBATT calibration voltage, current measurement

limit voltage: VCHAR, current measurement: ICHAR

• adjustable ADC calibration voltage via BTEM and the BSI

signal

• BTEMP and BSI calibration resistor

• signal from FBUS to the phone via the parallel jig

• control via FBUS or USB

• Flash OK/FAIL indication

MJ-59 Module jig

MJ-59 is meant for component level troubleshooting.

The jig includes an RF interface for GSM and WCDMA. In addition, it has

the following features:

• Provides mechanical interface with Engine module

• Provides galvanic connection to all needed test pads in module

• Multiplexing between USB and FBUS media, controlled by Vusb

• UI test interface

• MMC interface

• Duplicated SIM connector

• Audio components: IHF, MIC, earpiece

• Connector for control unit

•Access for Pop-PortTM system connector

Note: In the picture CU-4 is connected to MJ-59 . CU-4 is not part

of the MJ-59 sales package and has to be ordered separately.

PCS-1 Power cable

The PCS-1 power cable (DC) is used with a docking station, a module jig

or a control unit to supply a controlled operating voltage.

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PKD-1 SW security device

SW security device is a piece of hardware enabling the use of the service

software when connected to the parallel (LPT) port of the PC.

Without the device, it is not possible to use the service software.

Printer or any such device can be connected to the PC through the device

if needed.

RJ-51 PA Rework jig

To be used with ST-30!

RJ-79 Soldering jig

The soldering jig RJ-79 is used for soldering and as a rework jig for system

module. It is made of lead-free rework compatible material.

SA-41 RF Coupler

SA-41 RF Coupler is used for Go/No-Go test after changing components

in the RF part of the phone.

The SA-41 is mounted on the docking station adapter, after which the

phone can be placed in the docking station adapter.

Note: For RF attenuation values, please refer to the Service

bulletin.

SF-10 POS flash adapter

The POS flash adapter SF-10 allows FBUS/MBUS connections for flashing.

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SS-54 Alignment Jig

Alignment jig is used to efficiently assemble the dome-sheet to the

pone's PWB. The jig is made of EDS proof material.

ST-30 Rework stencil

Front End Module (FEM)

SX-4 Smart card

SX-4 is a BB5 security device used to protect critical features in tuning

and testing.

SX-4 is also needed together with FPS-10 when DCT-4 phones are flashed.

XCS-1 Service cable

The XCS-1 service cable is used to connect FLS-4S to the POS flash adapter

for supplying a controlled operating voltage and data connection.

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XCS-4 Modular cable

XCS-4 is a shielded (one specially shielded conductor) modular cable for

flashing and service purposes.

XRF-1 RF cable

The RF cable is used to connect, for example, a module repair jig to the

RF measurement equipment.

SMA to N-Connector ca. 610mm.

Attenuation for:

• GSM850/900: 0.3+-0.1 dB

• GSM1800/1900: 0.5+-0.1 dB

• WLAN: 0.6+-0.1dB

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Service software concept

POS (Point of Sales) flash concept

Figure 73 POS flash concept

Item Description Type

1Phone

2 Battery

3 Easy flash cable CA-67DS

4 FLS-4S sales pack FLS-4S

5 AC charger ACF-8

6 PC with Service SW CD-ROM

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FPS-8 Prommer box flash concept

Figure 74 FPS-8 Prommer box flash concept

Item Description Type

1Phone

2 Battery

3 Service cable CA-65DS

4 Flash prommer box sales pack including 2 pcs SF12 SRAM FPS-8

5 AC Charger, included in FPS-8 sales package ACF-8

6 RS-232 (D9 – D9) cable, included in FPS-8 sales pack AXS-4

6 Printer cable, included in FPS-8 sales package

8 Software protection key PKD-1

9 PC with service SW

Note: More than 32MB SRAM required in FPS-8.

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JBV-1 flash concept

Figure 75 JBV-1 flash concept

Item Description Type

1Docking station JBV-1

2 Docking station adapter DA-49

3 DC power cable PCS-1

4 Modular cable XCS-4

5 Flash prommer box sales pack FPS-8

6 Power supply, included in FPS-8 sales package AFC-8

7 RS-232 (D9 – D9) cable, included in FPS-8 sales package AXS-4

8 Printer cable, included in FPS-8 sales package

9 Software protection key PKD-1

10 Service SW (PHOENIX)

Note: More than 32MB SRAM required in FPS-8.

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Module jig (MJ-59) service concept

Figure 76 Module jig service concept

Item Description Type

1Module jig MJ-59

2 RF test cable XCF-4

3 Service MBUS/FBUS cable DAU-9S

4 DC power cable PCS-1

5 Software protection key PKD-1

6 PC with Service SW (PHOENIX)

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5 — Disassembly and

reassembly instructions

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Table of Contents

Disassembly instructions..............................................................................................................................................................5–5

Reassembly instructions...............................................................................................................................................................5–9

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Disassembly instructions

Steps

1. Tools needed for disassembly and reassembly

2. Protect the window with a film.

3. Unlock and remove the B-cover.

4. Place the SRT-6 between the D-cover assy and the top cap as shown in the picture.

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5. First turn the top cap as shown in the picture and then remove it carefully.

6. Use the SRT-6 as a lever to unlock the A-cover assy.

7. Remove the A-cover assy.

8. Remove the keymat and protect the inner side of the window with a film.

9. Unscrew the six Torx Plus size 6 screws in the shown order.

Note: For reassembly ALWAYS USE NEW SCREWS!

For reassembly, use the reverse order and a Torx Plus size 6 driver with a torque setting of 28 Ncm.

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10. Lift the modules a bit with SRT-6 and remove them from the D-cover assy.

11. First, lift the LCD shielding with LCD module a little and then remove the Light guide assy.

12. Separate the modules carefully to open the board-to-board connector.

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13. Unlock the LCD module...

14. ...and protect it with a film.

15. Remove the Locking clips.

16. Note: For reassembly only!

First place the LCD module into the LCD shielding and then insert the locking clips to secure the LCD

module. Note the correct position of the clips.

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17. Remove the acoustic channel.

18. The antenna IHF assy drops out when turning the D-cover assy.

19. Press out the easy flash connector by using the DC-plug.

20. Remove the microphone with the dental tool.

Reassembly instructions

For reassembly, follow the Disassembly instructions, but in reversed order

Note: Pay special attention to step 16 and 9.

Note: For reassembly, ALWAYS USE NEW SCREWS.

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6 — Baseband

troubleshooting

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Table of Contents

General baseband troubleshooting..........................................................................................................................................6–5

Phone is dead.............................................................................................................................................................................6–5

Flash programming do not work.........................................................................................................................................6–6

Easy flash programming does not work............................................................................................................................6–7

Power does not stay on or the phone is jammed...........................................................................................................6–9

Display shows "Contact Service"........................................................................................................................................6–10

The phone does not register to the networks, or the phone can not make a call............................................6–11

SIM related faults..........................................................................................................................................................................6–12

Insert SIM card fault...............................................................................................................................................................6–12

SIM card rejected.....................................................................................................................................................................6–12

User interface.................................................................................................................................................................................6–13

Blank display............................................................................................................................................................................6–13

Display is corrupt....................................................................................................................................................................6–13

Dead keys..................................................................................................................................................................................6–14

No backlight for display or keys.........................................................................................................................................6–14

Audio troubleshooting................................................................................................................................................................6–16

Audio troubleshooting using phoenix.............................................................................................................................6–16

Check microphone using "Hp microphone in Ext speaker out" loop.....................................................................6–17

Check earpiece using "Ext microphone in Hp speaker out" loop.............................................................................6–18

Check IHF & ringing tone function using "Buzzer".......................................................................................................6–18

Check vibra function using "Vibra control".....................................................................................................................6–19

Earpiece fault...........................................................................................................................................................................6–20

IHF/ringing tone fault............................................................................................................................................................6–21

Headset earpiece fault..........................................................................................................................................................6–22

Microphone fault.....................................................................................................................................................................6–23

Headset microphone fault...................................................................................................................................................6–24

List of Figures

Figure 77 Phone is dead troubleshooting...............................................................................................................................6–6

Figure 78 Flash programming fault..........................................................................................................................................6–7

Figure 79 Easy flash programming fault..................................................................................................................................6–8

Figure 80 Power does not stay on or the phone is jammed.............................................................................................6–9

Figure 81 Troubleshooting when the "Contact Service" message is seen.................................................................6–10

Figure 82 No registering or call................................................................................................................................................6–11

Figure 83 Insert SIM card fault..................................................................................................................................................6–12

Figure 84 Signal diagram...........................................................................................................................................................6–12

Figure 85 Signal diagram...........................................................................................................................................................6–13

Figure 86 Blank display...............................................................................................................................................................6–13

Figure 87 Display is corrupt.......................................................................................................................................................6–14

Figure 88 Dead keys.....................................................................................................................................................................6–14

Figure 89 No backlight for display or keys...........................................................................................................................6–15

Figure 90 Phoenix audio test window...................................................................................................................................6–16

Figure 91 PWB audio test points.............................................................................................................................................6–17

Figure 92 Test arrangement for microphone......................................................................................................................6–18

Figure 93 Test arrangement for of earpiece........................................................................................................................6–18

Figure 94 Checking IHF and ring tone by using "Buzzer".................................................................................................6–19

Figure 95 Checking vibra function by using vibra control...............................................................................................6–19

Figure 96 Earpiece fault flow chart.........................................................................................................................................6–20

Figure 97 IHF/ringing tone fault flow chart.........................................................................................................................6–21

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Figure 98 Headset earpiece fault flow chart........................................................................................................................6–22

Figure 99 Microphone fault flow chart..................................................................................................................................6–23

Figure 100 Headset microphone fault flow chart..............................................................................................................6–24

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General baseband troubleshooting

Phone is dead

This means that the phone does not use any current at all when the supply is connected and/or power key is

pressed.

It is assumed that the voltage supplied is 3.6 VDC. The UEMCLite will prevent any functionality at battery/supply

levels below 2.9 VDC.

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Figure 77 Phone is dead troubleshooting

Flash programming do not work

The flash programming can be done via the pads on the PWB (J2060).

In case of Flash failure in FLALI station, swap the phone and send it back to the care program for further analysis.

Possible failures could be short-circuit of balls under µBGAs (UEMCLite, UPP4M, FLASH). Missing or misaligned

components. In flash programming error cases the flash prommer can give some information about a fault. The

fault information messages could be:

Phone doesn't set FBUS_TX line low

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Because of the use of uBGA components it is not possible to verify if there is a short circuit in control- and address

lines of MCU (UPP4M) and memory (flash).

Figure 78 Flash programming fault

Easy flash programming does not work

The flash programming can also be done via the easy flash connector.

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In case of Flash failure in FLALI station, swap the phone and send it back to the care program for further analysis.

Possible failures could be short-circuit of balls under µBGAs (UEMCLite, UPP4M, FLASH). Missing or misaligned

components.

In flash programming error cases the flash prommer can give some information about a fault. The fault

information messages could be:

- Phone does not set FBUS_TX line low

Because of the use of uBGA components it is not possible to verify if there is a short circuit in control- and address

lines of MCU (UPP4M) and memory (flash).

Figure 79 Easy flash programming fault

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Power does not stay on or the phone is jammed

If this kind of a failure is presenting itself immediately after FLALI, it is most likely caused by ASIC's missing

contact with PWB.

If the MCU doesn’t service the watchdog register within the UEMCLite, the operations watchdog will run out

after approximately 32 seconds. Unfortunately, the service routine can not be measured.

Figure 80 Power does not stay on or the phone is jammed

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Display shows "Contact Service"

This error can only happen at power up where several self-tests is run. If any of these test cases fails the display

will show the message: "Contact Service".

It's individual test cases so the below lineup of error hunting's has no chronological order. Use common sense

and experience to decide which test case to start error hunting at.

Figure 81 Troubleshooting when the "Contact Service" message is seen

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The phone does not register to the networks, or the phone can not make a call

If the phone doesn't register to the network, the fault can be in either BB or RF. Only few signals can be tested

since several signals is 'buried' in one or more of the inner layers of the PWB.

First of all check that SIM LOCK is not causing the error by using a Test-SIM card and connect the phone to a tester.

Figure 82 No registering or call

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SIM related faults

Insert SIM card fault

The hardware of the SIM interface from UEMCLite (D2200) to the SIM connector (X2700) can be tested without

a SIM card. When the power is switched on the phone first check for a 1.8 V SIM card and then a 3 V SIM card.

The phone will try this four times, where after it will display ”Insert SIM card”.

Figure 83 Insert SIM card fault

Figure 84 Signal diagram

SIM card rejected

The error ”SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data signal

levels are wrong. The first data is always ATR and it is sent from card to phone.

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For reference a picture with normal SIM power-up is shown below.

Figure 85 Signal diagram

User interface

Blank display

The display does not show any information at all.

Figure 86 Blank display

Display is corrupt

The display contains missing or fading segments or color presentation is incorrect.

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Figure 87 Display is corrupt

Dead keys

Not a single key is responding.

Figure 88 Dead keys

No backlight for display or keys

There is no backlight on the display or on the keys.

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Figure 89 No backlight for display or keys

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Audio troubleshooting

Audio troubleshooting using phoenix

Figure 90 Phoenix audio test window

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Figure 91 PWB audio test points

Check microphone using "Hp microphone in Ext speaker out" loop

Steps

1. Connect phone with Phoenix.

2. Open “audio test” window from “Testing -> Audio test”, as shown in Figure Phoenix audio test window above.

3. Select “Hp microphone in Ext speaker out”

4. Select “Loop” as “On”

5. Input sound at microphone port, for example 94 dB SPL 1 kHz.

6. Check if signal is detected at XEARP/N pads, shown in Figure PWB audio test points above.

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Figure 92 Test arrangement for microphone

Check earpiece using "Ext microphone in Hp speaker out" loop

Steps

1. Connect phone with Phoenix.

2. Open “audio test” window from “Testing -> Audio test”, as shown in Figure Phoenix audio test window above.

3. Select “Ext microphone in Hp speaker out”

4. Select “Loop” as “On”

5. Input signal to XMICP/N pads, as shown in Figure PWB audio test points above, for example 100 mVpp, 1 kHz.

6. Check if sound is heard in earpiece.

Figure 93 Test arrangement for of earpiece

Check IHF & ringing tone function using "Buzzer"

Steps

1. Connect phone with Phoenix.

2. Open “audio test” window from “Testing -> Audio test”, as shown in Figure Phoenix audio test window above.

3. In “Buzzer” area, select suitable signal to be played, for example 1 kHz, Strength 5”

4. Select “Volume” as “On”

5. Check if sound is heard in IHF.

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Figure 94 Checking IHF and ring tone by using "Buzzer"

Check vibra function using "Vibra control"

Steps

1. Connect phone with Phoenix.

2. Open “Vibra control” window from “Testing -> Vibra control”, as shown in the figure below.

3. Select suitable intensity value, for example 53 %.

4. Select “Vibra state” as “Enabled”

5. Click “Write”.

6. Check if Vibra works.

Figure 95 Checking vibra function by using vibra control

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Earpiece fault

Figure 96 Earpiece fault flow chart

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IHF/ringing tone fault

Figure 97 IHF/ringing tone fault flow chart

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Headset earpiece fault

Figure 98 Headset earpiece fault flow chart

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Microphone fault

Figure 99 Microphone fault flow chart

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Headset microphone fault

Figure 100 Headset microphone fault flow chart

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7 — RF troubleshooting

Nokia Customer Care

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Table of Contents

General RF troubleshooting.........................................................................................................................................................7–5

General RF troubleshooting...................................................................................................................................................7–5

RF key components...................................................................................................................................................................7–6

Auto tuning.......................................................................................................................................................................................7–8

Auto tuning.................................................................................................................................................................................7–8

Receiver..............................................................................................................................................................................................7–8

General instructions for GSM 900 RX troubleshooting..................................................................................................7–8

Troubleshooting diagram for GSM 900 receiver...........................................................................................................7–10

General instructions for GSM 1800 RX troubleshooting.............................................................................................7–11

Troubleshooting diagram for GSM 1800 receiver.........................................................................................................7–13

Measurement points in the receiver.................................................................................................................................7–14

Transmitter.....................................................................................................................................................................................7–15

General instructions for GSM 900 TX troubleshooting................................................................................................7–15

Troubleshooting diagram for GSM 900 transmitter....................................................................................................7–17

GSM 900 TX output power....................................................................................................................................................7–17

General instructions for GSM 1800 TX troubleshooting..............................................................................................7–20

Troubleshooting diagram for GSM 1800 transmitter..................................................................................................7–22

GSM 1800 TX output power.................................................................................................................................................7–22

Synthesizer troubleshooting ....................................................................................................................................................7–25

Introduction.............................................................................................................................................................................7–25

Troubleshooting diagram for PLL synthesizer..............................................................................................................7–27

Measurement points at the VCXO.......................................................................................................................................7–28

FM radio troubleshooting..........................................................................................................................................................7–28

Measurement settings...........................................................................................................................................................7–28

Troubleshooting diagram for FM radio............................................................................................................................7–29

Measurement points in the receiver.................................................................................................................................7–30

Antenna troubleshooting...........................................................................................................................................................7–31

Antenna troubleshooting.....................................................................................................................................................7–31

List of Figures

Figure 101 RF key components on PWB..................................................................................................................................7–6

Figure 102 Supply points at UEM (D2200)...............................................................................................................................7–7

Figure 103 Supply point at RF IC (N7600)................................................................................................................................7–7

Figure 104 Supply point at FM Radio IC (N6156)...................................................................................................................7–7

Figure 105 GSM 900 RF controls window................................................................................................................................7–9

Figure 106 GSM 900 Receiver troubleshooting...................................................................................................................7–10

Figure 107 900 RX I/Q signal waveform................................................................................................................................7–11

Figure 108 GSM 1800 RF controls window...........................................................................................................................7–12

Figure 109 GSM 1800 Receiver troubleshooting.................................................................................................................7–13

Figure 110 1800 RX I/Q signal waveform.............................................................................................................................7–14

Figure 111 RX measurements point of the control voltages to FEM N7700..............................................................7–14

Figure 112 Measurement points at the RX SAW Filters – Z7600/Z7602......................................................................7–15

Figure 113 RX I/Q signals............................................................................................................................................................7–15

Figure 114 GSM 900 RF controls window..............................................................................................................................7–16

Figure 115 GSM 900 transmitter troubleshooting.............................................................................................................7–17

Figure 116 TX I/O signal..............................................................................................................................................................7–18

Figure 117 VC1, VC3 signals.......................................................................................................................................................7–18

Figure 118 TXP signal..................................................................................................................................................................7–19

Figure 119 TXC signals at PCL5.................................................................................................................................................7–19

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Figure 120 TXC signals at PCL19...............................................................................................................................................7–20

Figure 121 GSM 1800 RF controls window...........................................................................................................................7–21

Figure 122 GSM 1800 transmitter troubleshooting...........................................................................................................7–22

Figure 123 TX I/O signal..............................................................................................................................................................7–23

Figure 124 VC1, VC2, VC3 signals..............................................................................................................................................7–23

Figure 125 TXP signal..................................................................................................................................................................7–24

Figure 126 TXC signals at PCL0.................................................................................................................................................7–24

Figure 127 TXC signals at PCL15...............................................................................................................................................7–25

Figure 128 VCXO 26 MHz waveform........................................................................................................................................7–26

Figure 129 PLL Troubleshooting diagram............................................................................................................................7–27

Figure 130 Measurement point for VCXO..............................................................................................................................7–28

Figure 131 Phoenix settings......................................................................................................................................................7–28

Figure 132 FM circuit troubleshooting diagram.................................................................................................................7–29

Figure 133 RX measurements point of the control voltages to FEM N7700..............................................................7–30

Figure 134 Measurement points at the RX SAW Filters – Z7600/Z7602......................................................................7–30

Figure 135 RX I/Q signals............................................................................................................................................................7–30

Figure 136 Antenna troubleshooting.....................................................................................................................................7–31

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General RF troubleshooting

Most RF semiconductors are static discharge sensitive

Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or "LF".

• RF measurements are done with a Spectrum Analyzer and a high-frequency 500 ohm passive probe, for

example HP54006A. (Note that when measuring with the 500 ohm probe the signal will be around 20 dB

attenuated. The values in the following will have these 20 dB subtracted and represent the real value seen

on the spectrum analyzer). Note that the testing have some losses which must be taken into consideration

when calibrating the test system.

• LF (Low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe

used in the following is 10 Mohm/8pF passive probe. If using another probe then bear in mind that the

voltages displayed may be slightly different. Always make sure the measurement set-up is calibrated when

measuring RF parameters on the antenna pad. Remember to include the loss in the module repair jig when

realigning the phone.

So ESD protection must be applied during repair (ground straps and ESD soldering irons). RF IC N7600 and FEM

are moisture sensitive so parts must be pre-baked prior to soldering. Apart from key-components described in

this document there are a lot of discrete components (resistors, inductors and capacitors) for which

troubleshooting is done by checking if soldering of the component is done properly and checking if the

component is missing from PWB. Capacitors can be checked for short-circuiting and resistors for value by means

of an ohmmeter, but be aware in-circuit measurements should be evaluated carefully. In the following both

the name EGSM and GSM 850 will be used for the lower band and both PCN and GSM 1900 will be used for the

upper band.

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RF key components

Figure 101 RF key components on PWB

N7600 RF IC

N7700 FEM (PA and antenna switch)

Z7602 EGSM 850/900 RX SAW filter

Z7600 DCS 1800/PCS1900 RX SAW filter

Z7603 EGSM 850/900 TX filter

Z7604 DCS 1800/PCS1900 TX filter

B7600 26 MHz crystal

N6156 FM radio IC

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Refer to the picture below for measuring points at the UEM (D2200).

Figure 102 Supply points at UEM (D2200)

Figure 103 Supply point at RF IC (N7600)

Figure 104 Supply point at FM Radio IC (N6156)

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Auto tuning

This phone can be tuned automatically.

Autotune is designed to align the phone's RF part easier and faster. It performs calibrations, tunings and

measurements of RX and TX. The results are displayed and logged in a result file, if initiated.

Hardware set up

Hardware requirements for auto tuning:

• PC (Windows 2000/NT) with GPIB card

• Power supply

• Product specific module jig

• Cables: 3 (alt.1) RF cable, 1 GPIB cable and DAU-9S

• Signal analyser (TX), signal generator (RX) and RF-splitter or one device including all.

Phoenix preparations

Copy the two phone specific ini-files, for example rm_13_tunings.ini and autotune_RM-13.ini, to a phone specific

folder, for example \Phoenix\products\RM-13\.

Auto tuning procedure

1 Make sure the phone (in the jig) is connected to the equipment. Else, some menus will not be shown in

Phoenix.

2 The first time you are using automatic tuning on this phone model, on this computer, you will have to Set

loss for cables and jigs.

3 To go to autotune, select Tuning (Alt-U) > Auto-Tune (Alt-A) from the menu.

4 If you need more assistance, please refer to the Phoenix Help.

Receiver

General instructions for GSM 900 RX troubleshooting

1 Connect the phone to a PC with the module repair jig.

2 Start Phoenix and establish a connection to the phone with the data cable e.g. FBUS.

3 Select File and Scan product

4 Wait a while for the PC to read the information from the phone

5 Select Testing and RF Controls

6 Set the parameters as follows:

• Active Unit: RX

• Band: GSM 900

• Operation Mode: Continuous mode

• RX/TX Channel 37

• AGC: 8: FEG_ON + DTOS_ON+BB_6=Vgain_36

The setup should now look like this:

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Figure 105 GSM 900 RF controls window

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Troubleshooting diagram for GSM 900 receiver

Figure 106 GSM 900 Receiver troubleshooting

By measuring with an oscilloscope at RXIP or RXQP on a working GSM 900 receiver this picture should be seen.

Signal amplitude 114 mVp-p. DC offset 1.0 V.

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Figure 107 900 RX I/Q signal waveform

General instructions for GSM 1800 RX troubleshooting

1 Connect the phone to a PC with the module repair jig.

2 Start Phoenix and establish a connection to the phone with the data cable e.g. FBUS.

3 Select File and Scan product

4 Wait a while for the PC to read the information from the phone

5 Select Testing and RF Controls

6 Set the parameters as follows:

• Active Unit: RX

• Band: GSM 1800

• Operation Mode: Continuous mode

• RX/TX Channel 700

• AGC: 8: FEG_ON + DTOS_ON+BB_6=Vgain_36

The setup should now look like this:

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Figure 108 GSM 1800 RF controls window

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Troubleshooting diagram for GSM 1800 receiver

Figure 109 GSM 1800 Receiver troubleshooting

By measuring with an oscilloscope at RXIP or RXQP on a working GSM 1800 receiver this picture should be seen.

Signal amplitude 114 mVp-p. DC offset 1.0 V.

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Figure 110 1800 RX I/Q signal waveform

Measurement points in the receiver

Figure 111 RX measurements point of the control voltages to FEM N7700

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Figure 112 Measurement points at the RX SAW Filters – Z7600/Z7602

Figure 113 RX I/Q signals

Transmitter

General instructions for GSM 900 TX troubleshooting

1 Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be

connected to an attenuator at least 10 dB before connected to the measurement equipment, otherwise the

PA may be damaged.

2 Start Phoenix and establish a connection to the phone with the data cable e.g. FBUS.

3 Select File and Scan product

4 Wait a while for the PC to read the information from the phone

5 Select Testing and RF Controls

6 Set the parameters as follows:

• Band: GSM 900

• Active Unit: TX

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• TX Power Level: 5

• TX Data Type: Random

The setup should now look like this:

Figure 114 GSM 900 RF controls window

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Troubleshooting diagram for GSM 900 transmitter

Figure 115 GSM 900 transmitter troubleshooting

GSM 900 TX output power

Measure the output power of the phone; it should be about 32.5 dBm. Remember the cable loss is about 0.3 dB.

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Figure 116 TX I/O signal

Figure 117 VC1, VC3 signals

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Figure 118 TXP signal

Figure 119 TXC signals at PCL5

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Figure 120 TXC signals at PCL19

General instructions for GSM 1800 TX troubleshooting

1 Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be

connected to an attenuator at least 10 dB before connected to the measurement equipment, otherwise the

PA may be damaged.

2 Start Phoenix and establish a connection to the phone with the data cable e.g. FBUS.

3 Select File and Scan product

4 Wait a while for the PC to read the information from the phone

5 Select Testing and RF Controls

6 Set the parameters as follows:

• Band: GSM 1800

• Active Unit: TX

• TX Power Level: 0

• TX Data Type: Random

The setup should now look like this:

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Figure 121 GSM 1800 RF controls window

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Troubleshooting diagram for GSM 1800 transmitter

Figure 122 GSM 1800 transmitter troubleshooting

GSM 1800 TX output power

Measure the output power of the phone; it should be about 29.5 dBm. Remember the cable loss is about 0.5 dB.

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Figure 123 TX I/O signal

Figure 124 VC1, VC2, VC3 signals

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Figure 125 TXP signal

Figure 126 TXC signals at PCL0

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Figure 127 TXC signals at PCL15

Synthesizer troubleshooting

Introduction

26 MHz Reference Oscillator (VCXO)

There is only one PLL synthesizer generating Local Oscillator frequencies for both RX and TX in both bands (PCN

and EGSM). The VCO frequency is divided by 2 for PCN operation or by 4 for EGSM operation inside the RF IC.

The 26 MHz oscillator is located near the RF IC (N7600). The coarse frequency for this oscillator is set by an

external crystal (B7600). The reference oscillator is used as a reference frequency for the PLL synthesizer and

as the system clock for the Baseband. The 26 MHz signal is divided by 2 to achieve 13 MHz inside the UPP IC

(D2800).

The 26 MHz signal from the VCXO can be measured by probing R2900. The level at this point is approx. 770 mVpp.

Frequency of this oscillator is adjusted by changing the AFC-register inside the UEM IC. Example Signal Measured

at VCXO output (R2900).

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Figure 128 VCXO 26 MHz waveform

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Troubleshooting diagram for PLL synthesizer

Figure 129 PLL Troubleshooting diagram

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Measurement points at the VCXO

Figure 130 Measurement point for VCXO

FM radio troubleshooting

Measurement settings

1 Connect the phone to a PC with the module repair jig.

2 Start Phoenix and establish a connection to the phone with the data cable e.g. FBUS.

3 Phoenix settings shall be as follows:

Figure 131 Phoenix settings

1 Establish input of a standard FM signal to the FM module.

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2 Signal generator settings shall be as follows:

• Frequency: 98 MHz

• Level: 60 dBm

• FM deviation: 75 kHz

• LFGEN frequency: 1 kHZ

Troubleshooting diagram for FM radio

Figure 132 FM circuit troubleshooting diagram

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Measurement points in the receiver

Figure 133 RX measurements point of the control voltages to FEM N7700

Figure 134 Measurement points at the RX SAW Filters – Z7600/Z7602

Figure 135 RX I/Q signals

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Antenna troubleshooting

Figure 136 Antenna troubleshooting

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8 — System module

Nokia Customer Care

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Page 8–2 Company Confidential 9242678 (Issue 1)

Table of Contents

Block diagram..................................................................................................................................................................................8–5

System module block diagram.............................................................................................................................................8–5

Functional description.............................................................................................................................................................8–6

Baseband description....................................................................................................................................................................8–6

UPP ................................................................................................................................................................................................8–6

UEMCLite.......................................................................................................................................................................................8–6

External regulators...................................................................................................................................................................8–7

Energy management................................................................................................................................................................8–7

Modes of operation...................................................................................................................................................................8–8

Voltage limits..............................................................................................................................................................................8–9

Audio function description.....................................................................................................................................................8–9

External audio connector.....................................................................................................................................................8–11

External signals and connections......................................................................................................................................8–11

Interfaces.........................................................................................................................................................................................8–12

RF and baseband interfaces................................................................................................................................................8–12

Analogue Signals.....................................................................................................................................................................8–15

FM radio.....................................................................................................................................................................................8–16

LCD interface.............................................................................................................................................................................8–16

Keyboard....................................................................................................................................................................................8–17

SIM interface.............................................................................................................................................................................8–18

External signals and connections......................................................................................................................................8–11

Battery connector...................................................................................................................................................................8–19

Battery........................................................................................................................................................................................8–20

PWB outline..............................................................................................................................................................................8–21

RF description................................................................................................................................................................................8–21

Frequency band, power and multi-slot class.................................................................................................................8–21

Transmitter - general description.....................................................................................................................................8–22

Transmitter - signal processing..........................................................................................................................................8–22

VCXO and PLL............................................................................................................................................................................8–22

List of Tables

Table 10 RF power supply.............................................................................................................................................................8–7

Table 11 Baseband power supply..............................................................................................................................................8–7

Table 12 Voltage limits..................................................................................................................................................................8–9

Table 13 Connector for External Audio Accessories...........................................................................................................8–11

Table 14 System connector........................................................................................................................................................8–11

Table 15 AC and DC Characteristics of BB4.0 LiteV2 RF-Base band Digital Signals...................................................8–12

Table 16 AC and DC Characteristics of RF-Base band Analogue Signals.......................................................................8–15

Table 17 The electrical parameters.........................................................................................................................................8–18

Table 18 System connector........................................................................................................................................................8–11

Table 19 Battery IF........................................................................................................................................................................8–19

Table 20 Frequency bands and TX power class...................................................................................................................8–21

Table 21 Multi-slot class..............................................................................................................................................................8–22

List of Figures

Figure 137 Module block diagram.............................................................................................................................................8–5

Figure 138 Power connection diagram....................................................................................................................................8–8

Figure 139 SIM filtering.................................................................................................................................................................8–8

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Figure 140 Audio block diagram..............................................................................................................................................8–10

Figure 141 4-pole jack plug for audio accessory................................................................................................................8–11

Figure 142 Keyboard schematics.............................................................................................................................................8–17

Figure 143 Keyboard layout in UI side...................................................................................................................................8–17

Figure 144 BL-5C battery connection order..........................................................................................................................8–20

Figure 145 BL-5C battery block.................................................................................................................................................8–20

Figure 146 PWB top side component placement...............................................................................................................8–21

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Block diagram

System module block diagram

The main board consists of a radio frequency part and a baseband part. The User Interface parts are situated

at the UI side, which is on the opposite side of the engine board. The 1MF is the system module of the mobile

device.

Figure 137 Module block diagram

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Functional description

The BB core is based on UPP4M CPU. UPP4M takes care of all the signal processing and operation controlling

tasks of the mobile device. For power management, there is one main ASIC for controlling, charging and

supplying power UEMCLite plus a discrete power supply. The UEMCLite generates the main reset for the system.

Memories comprise 128 Mbit flash and 16 Mbit PsRAM. Memory devices are stacked on top of each other in a

single Combo package.

The UEMCLite also handles the interface to the RF and audio sections. This ASIC provides A/D and D/A conversion

of the in-phase and quadrate receive and transmit signal paths and also A/D and D/A conversions of received

and transmitted audio signals. Data transmission between UEMCLite and RF and the UPP4M is implemented

using different serial connections (CBUS, DBUS and RFBUS). UPP4M ASIC handles digital speech processing.

A real time clock function is integrated into UEMCLite, which utilizes the same 32 kHz-clock source as the sleep

clock. The SLCK/RTC runs all time when the phone battery is connected. It is running also when the phone is

switched off. In UEMCLite there is no back up battery/capacitor connection.

There are two audio transducers in the product; 13 mm speaker and a microphone. The speaker is used to

generate audios for earpiece, IHF and ringing tones. A separate audio amplifier drives the speaker. There is only

one microphone for both HS and IHF modes.

The display is a CSTN type color display with 65536 colors and 128 x 128 pixels with backlighting. The UI module

features a function key mat with a 4-way navigation key with a center selection key.

Baseband description

UPP

UPP (Universal Phone Processor) is the digital ASIC of the DCT4 generation base band. In LiteV2 BB the UPP4M_v3/

UPP4Mv4 and UPP2Mv2 are supported types. UPP4Mv3 includes 4.5 MBit internal RAM, ARM7TDMI rev4 16/32-

bit RISC MCU core, TI Lead3 16-bit DSP phase2+ core with DMA controller, ROM for MCU boot code and all digital

control logic. UPP general purpose IO (GENIO) can be used for predefined HW purpose or but they can also be

controlled with SW for product specific features.

Memory

This mobile uses two kinds of memories, Flash and Synchronous RAM (SRAM). These memories have are sharing

the same bus interface to UPP4M. SDRAM is used as the working memory. Interface is 16 bit wide data and 14

bit address. Memory clocking speed is 52 MHz. The SRAM size is 16 Mbits.

SRAM I/O is 1.8 V and core 1.8 V supplied by UEMCLite regulator VIO. All memory contents are lost if the supply

voltage is switched off.

Multiplexed flash memory interface is used to store the MCU program code and user data. The memory interface

is a burst type FLASH with multiplexed address/data bus, running at 52 MHz.

Configuration of flash memory is a 128 Mbit NOR flash memory. Flash I/O and core voltage are 1.8 V supplied

by UEMCLite’s VIO.

UEMCLite

Power management in the RM-74/75 follows the DCT4 Core design, having anyhow less regulators than

traditional architecture. The UEMCLite, that is a low cost energy management ASIC with completely new design

contains for BB use two 2.78V LDO regulators, 1.8V linear regulator, programmable 1.0 - 1.5 V linear regulator

and 1.8/3.0 V LDO regulator. For RF use UEMCLite has five 2.78 V LDOs. In addition, the UEMCLite contains audio

codec, A/D converters, RF converters, many drivers, etc.

Below is a list of the supply voltages.

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Table 10 RF power supply

Vmin/V Vtyp/V Vmax/V ItypmA Imax

Notes

VR1 2.7 2.78 2.86 65 75 VTX (Supply voltage for PMB3258 LO and RX parts

VR2 2.7 2.78 2.78 2.4 3.0 VXO (VCXO supply voltage)

VR3 2.7 2.78 2.86 41 47 VTX2 (Supply voltage for PMB3258 modulator

output stage)

VR4 2.7 2.78 2.86 43 48 VRX (Supply for RFIC RX and TX parts)

VR5 2.7 2.78 2.86 29 35 VPLL (Supply for VCO, PLL and digital parts

VBATTRF 3.1 3.6 4.7 1.5 3.5 Supply voltage for the front-end module (Vbatt,

max=6.0 V)

The table below shows the typical current consumption in different operation modes.

Table 11 Baseband power supply

Signal, Nom Volt.,

Max Current

Min-Max Voltage (V) Iqmax PSSR(dB)* Notes

VANA, 2,78V, 80mA 2.7-2.86 200 50, 40 Disabled in sleep

mode

VBB1 2,78V, sleep

2mA, norm. 50mA

2.7-2.86 15 sleep, 200 40, - Sleep mode

possibility

VSIM, 1.8/3.0, 25mA 1.745- 1.8552.910-

3.090

30 sleep, 80 40, - Sleep mode

possibility,

programmable

VIO, 1.8V 1.72 - 1.88 15 sleep, 100 45, - Sleep mode

possibility

VCORE,1.055/1.25/

1.35/1.5V

1.0 - 1.111.188 -

1.3131.285

-1.4151.425 -1.575

20 sleep, 200 40, - Sleep,

programmable,

Initial voltage

1.35V from reset

External regulators

White LED Driver solution is implemented with DC/DC converter. The driver circuit is controlled by UEM output

pin DLIGHT, which add external pull up using a digital transistor and one resistor. The schematics also combined

the UEMIO (5) to control DC/DC enable as another optional using two jumper.

Energy management

Filter components

The master of EM control is UEMCLite and with SW it has the main control of the system voltages and operating

modes. The RM-74 power distribution diagram is presented in the illustration below.

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Figure 138 Power connection diagram

All connectors going to the “outside world” have filter components, ESD protection and EMC reduction.

The Digital/Data lines on SIM have special dedicated filter ASIP. The below figure show the SIM filtering.

Figure 139 SIM filtering

The Audio circuit: Earpiece, IHF, internal microphone and external speaker are filtered with discrete components

(common mode reduction coils, Varistors, caps and resistors), where as the external microphone uses

differential mode mic. ASIP

The 16 UEMECLite BB & RF regulators are specified to have a decoupling cap of 1 µF ±20%.

Modes of operation

BB4.0 LiteV2 base band has five different functional modes, which are defined in UEMCLite specification:

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• No supply: In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to disconnection of main

battery or low battery voltage level in battery. Phone is exiting from NO_SUPPLY mode when sufficient battery

voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT > VMSTR+ or

by connecting charger and charging the battery above VMSTR+.

• Acting Dead: If the phone is off when the charger is connected, the phone is powered on but enters a state

called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery charging alert is given

and/or a battery charging indication on the display is shown to acknowledge the user that the battery is

being charged.

• Active: In the Active mode the phone is in normal operation, scanning for channels, listening to a base station,

transmitting and processing information. There are several sub-states in the active mode depending on if

the phone is in burst reception, burst transmission, if DSP is working etc. One of the sub-states of the active

mode is FM radio on state. In that case, Audio Amplifier and FM radio are powered on. FM radio circuitry is

controlled by the MCU and 32kHz-reference clock is generated in the UPP. BBLite supports also the MIC3 audio

path enabling also in the sleep mode allowing for example the FM radio listening during sleep mode. This

requires that the FM radio work with 32kHz sleep clock frequency.

In Active mode the RF regulators are controlled by SW writing into UEMCLite’s registers wanted settings: VR

regulators can be disabled, enabled or forced into low quiescent current mode. VR2 is always enabled in

Active mode for system clock chain supply

• Sleep: In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for the

base band.

• Charging: Charging can be performed in any operating mode. The battery type / size is indicated by a resistor

inside the battery pack. The resistor value corresponds to a specific battery capacity. This capacity value is

related to the battery technology as different capacity values are achieved by using different battery

technology. The battery voltage, temperature, size and current are measured by the UEMCLite and controlled

by the charging software running in the UPP. The charging control circuitry (CHACON) inside the UEMCLite

controls the charging current delivered from the charger to the battery. The battery voltage rise is limited

by turning the UEMCLite switch off when the battery voltage has reached 4.2 V. Charging current is monitored

by measuring the voltage drop across a 220 mW resistor. The PWM output doesn’t exist any more from

UEMCLite to the bottom connector

Voltage limits

Table 12 Voltage limits

Parameter Description Value/V

Vmstr+ Master reset threshold (rising) 2.1 ±0.1

Vmstr- Master reset threshold (falling) 1.9 ±0.1

Vcoff+ Hardware cutoff (rising) 3.1 ±0.1

Vcoff- Hardware cutoff (falling) 2.8 ±0.1

SW shutdown SW cutoff limit (> regulator drop-

out limit) MIN!

3.2 V

Audio function description

Audio

The basic audio structure and communication between HW-audio modules and the audio ASIC's is illustrated

in the block diagram below.

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Figure 140 Audio block diagram

UEMCLite supports three microphone inputs and two earphone outputs. The microphone signals from different

sources are connected to separate inputs at the UEMCLite ASIC. The inputs and outputs are all differential.

Three inputs (MIC1, MIC2, MIC3) and two outputs (EAR, HF/HFCM) are used. MIC1P/MIC1N input is used for the

internal microphone, using single-ended biasing circuitry. EARP/EARN output from UEMCLite is used for hand-

portable mode.

Uplink external audio (headset as well as car kit) is connected to MIC2P/MIC2N, while downlink audio is provided

via the HF/HFCM output from UEMCLite. The car kit only can be used with external microphone connected.

MIC3 (positive input) connects to single ended outputs from the FM radio. The other input MIC3N is AC-coupled

to GND.

The audio control is taken care of by UEMCLite, which contains the MCU and audio codec. Input and output

selection, and gain control is performed inside UEMCLite. DTMF-tones and other audio tones are generated and

encoded by UPP and transmitted to UEMCLite for decoding.

An external amplifier (D-class) is connected to provide sufficient power for an 8 W load. The inputs are wired

to the headset connections HF and HFCM from UEMCLite.

EARP/N output is used for hand-portable speech, connected with PA output through switches.

Under normal conditions HF and HFCM is used for downlink audio to the headset/car kit. During headset/car kit

usage the audio amplifier is disabled by means of the shutdown pin. Keeping the shutdown pin "low" also

during sleep, secures a minimum amount of standby current to be consumed.

SMD vibra has a diameter is about 4.0-mm. Vibra is driven by PWM signal, generating vibration by rotating an

un-balanced mass (counter weight) with radius of R=2.3-mm. The vibration signal is used as a silent alert call

and also as a noticeable shock in gaming.

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External audio connector

The system connector, containing a 4-pole Jack plug, gains the access to the external audio interface. The Jack

plug, which is integrated in the system connector, contains a mechanical switch, which is used to detect the

connection of the accessories. The configuration for the 4-pole Jack-plug is shown in the following figure.

Figure 141 4-pole jack plug for audio accessory

Table 13 Connector for External Audio Accessories

Line symbol Function

XMICP External microphone signal input

XMICN External microphone signal input

XEARP External earphone signal output

XEARN External earphone signal output

INT Accessory detection

GND Ground (Only used by PPH-1)

External signals and connections

Table 14 System connector

Signal From To Min Nom Max Condi-tion Note

XMICP HS/HF Mic UEMC

Lite

2/60mV

diff

Analog

audio in

Headset Mic bias and audio

signal 2mV nominal. HF Mic

signal 60mV nominal.

Differential symmetric

input.

DC bias

2V2kohm

Accessory detection by

bias loading

XMICN 2/60mV

diff

Ana in / 1k to

GND

Hook interrupt by heavy

bias loading

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Signal From To Min Nom Max Condi-tion Note

XEARP HS/HF UEMC

Lite

100 mV

diff

Ana in Quasi-differential DC-

coupled earpiece/HF

amplifier signal to

accessory. DC biased to

0.8V

XEARN EAR/

Amp.

INT

HEADINT

Switch UEMC

Lite

0/2.7V Dig in HS interrupt from bottom

connector switch when

plug inserted.

VCHARIN Charger UEMC

Lite

11.1Vp

eak

16.9

Vpeak

Standard Vch from Charger

Connector, max 20V

7.9

VRMS

1.0

Apeak

7.0

VRMS

8.4

VRMS

9.2

VRMS

Fast charger

850 mA

GND GND GND from/to Charger

connector

Interfaces

RF and baseband interfaces

Table 15 AC and DC Characteristics of BB4.0 LiteV2 RF-Base band Digital Signals

Signal

name

From To Para-meter Input characteristics Function

Min Typ Max Unit

TXP1 UPP RF-IC 1 1.38 1.88 V Depends of the

RF design

RFGenOut

GenIO5 0 0 0.4 V

Load

Resistance

10 kW

Load

Capacitance

20 pF

Timing

Accuracy

¼ symbol

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Signal

name

From To Para-meter Input characteristics Function

Min Typ Max Unit

TXP2 UPP RF-IC 1 1.38 1.88 V Depends of the

RF design

(GenIO6) 0 0 0.4 V

Load

Resistance

10 kW

Load

Capacitance

20 pF

Timing

Accuracy

¼ symbol

RFBusEn1

UPP RF-IC 1 1.38 1.88 V RFIC Chip SelX

0 0 0.4 V

Internal PU

Current

50 uA

Load

resistance

10 kW

Load

capacitance

20 pF

RFBusDa UPP / RF-

RF- IC/

UPP

1 1.38 1.88 V Bi-directional

RF Control serial

bus data,

0 0 0.4 V

Load

resistance

10 kW

Load

capacitance

20 pF

Data

frequency

13 MHz

RFBusClk UPP RF IC 1 1.38 1.88 V RF Control serial

bus bit clock

0 0 0.4 V

Load

resistance

10 kW

Load

capacitance

20 pF

Data

frequency

13 MHz

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Signal

name

From To Para-meter Input characteristics Function

Min Typ Max Unit

GENIO3 UEMCLite RF IC 1 2.78 V RF Control *

0 V Depends of the

RF design

Load

resistance

Output

current

4 mA

GENIO4 UEMCLite RF IC 1 2.78 V Audio clock

input in

UEMCLiteV3 and

LittiV2

0 V

Load

resistance

Output

current

4 mA

GENIO5 UEMCLite RF IC 1 2.78 V RF Control *

0 V Depends of the

RF design

Load

resistance

Output

current

4 mA

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Analogue Signals

Table 16 AC and DC Characteristics of RF-Base band Analogue Signals

Signal

name

From To Parameter Min Typ Max Unit Function

RFCLK VCTCXO UPP Frequency 13/26 MHz System Clk from RF to

BB,

Signal

amplitude

0.2 0.8 1.32 Vpp 13/26 MHz Depending

on RF chipset

Input

Impedance

10 kW UPP minimum

recommended

amplitude is 0.3Vpp.

Input

Capacitance

10 pF

Harmonic

Content

-8 dBc

Clear signal

window (no

glitch)

200 mVpp

Duty Cycle 40 60 %

RFCLKGnd VCTCXO UPP DC Level 0 V System Clock slicer Ref

GND, not separated

from pwb GND layer

RXIP,

RXIN,

RXQP,

RXQN

RF-IC UEMCL

ite

Voltage

swing

(static)

1.4 1.45 Vpp Differential positive /

negative in-phase and

quadrature Rx Signals.

DC level 1.3 1.35 1.4 V

I/Q

amplitude

mismatch

0.2 dB

I/Q phase

mismatch

-0.5 0.5 deg

TXIP,

TXIN,

TXQP,

TXQN

UEMCLite RF-IC Differential

voltage

swing

(static)

2.25 2.45 Vpp Differential positive /

negative in-phase and

quadrature Tx Signals

In High-Z when RX is

receiving.

DC level 1.17 1.20 1.23 V

Source

Impedance

200 W

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Signal

name

From To Parameter Min Typ Max Unit Function

AFC UEMCLite VCTCX

Voltage Min 0.0 0.1 V Automatic Frequency

Control signal for

VCTCXO

Programmable

(AFCOUT

)

Max 2.4 2.55

Resolution 11 bits

Load

resistance

1 kW

and

capacitance

100 nF

Source

Impedance

200 W

Output

impedance

10 MW Path powered down

TxC UEMCLite RF-IC Voltage Min 0.1 V Transmitter power

level and ramping

control, Ref UEMCLite

RF converter

specification

(AUXOUT

)

Max 2.4

Source

Impedance

200 W

Resolution 10 bits

VCXOTEMP RF-IC UEMCL

ite

Input

voltage

range

0 2.7 V

Input

resistance

900 6000 Ohm

Resolution 10 bits

PATEMP RF-IC UEMCL

ite

Voltage at

-20oC

1.57 V Usage depends of the

RF design

FM radio

Signal From To Min Nom Max Cond Note

KEYB1 /

MIC3P

FM radio UEMCLite Differential/single ended

signal from internal

additional audio device,

Muxed with analog

keyboard inputs.

KEYB2 /

MIC3N

LCD interface

The figure below illustrates the structure of LCD module. LCD module includes UV tape, Driver IC, Prism sheet,

LGP, Flex Assy, label Tape, Adhesive Tape, Protection film, LCD glass, Rim Tape, Diffuser, Reflector and Holder

Frame.

LCD panel includes upper and lower polarizers, LCD transflective glass, single chip COG driver with

132x132x116bit RAM, 10-pin board-to-board connector and FPC with discrete components.

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Keyboard

A 5 X 5 matrix keyboad consists of 21keys, one 10-channel integrated passive filiter arrays with downstream

ESD protection of >8KV connect the matrix keyboard to UPP.

Figure 142 Keyboard schematics

The layout is shown in Keyboard layout in UI side.

Figure 143 Keyboard layout in UI side

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SIM interface

The SIM interface is programmed to support 3V and 1.8V SIMs. SIM supply voltage is selected by with register

in the UEMCLite. It is only allowed to change the SIM supply voltage when the SIM IF is powered down. The SIM

power up/down sequence is generated in the UEMCLite.

The SIM interface is powered up when the SIMCardDet signal indicates ”card in”. This signal is derived from the

BSI signal.

SIM interface is implemented in two ASICs, UPP and UEMCLite. The SIM interface is the electrical interface between

the Subscriber Identity Module Card (SIM Card) and mobile phone (via UEMCLite device).

Table 17 The electrical parameters

Pin Name Parameter Min Typ Max Unit Notes

1VSIM 1.8V SIM Card 1.6 1.8 1.9 V Supply voltage

3V SIM Card 2.8 3.0 3.2 V

2 SIMRST 1.8V SIM Card 0.9xVSIM VSIM V SIM reset (output)

0 0.15xVSIM

3V SIM Card 0.9xVSIM VSIM V

0 0.15xVSIM

3 SIMCLK Frequency 3.25 MHz SIM clock. UPP4Mv3

and UPP4mv4

support 3GPP

Release 5, SIMCLK/8

data rate. UPP2Mv2

supports SIMCLK/16

data rate.

Trise/Tfall 50 ns

1.8V Voh 0.9xVSIM VSIM V

1.8V Vol 0

3V Voh 0.9xVSIM VSIM V

3V Vol 0

4 DATA 1.8V Voh 0.9xVSIM VSIM V SIM data (output)

1.8V Vol 0 0.15xVSIM

3V Voh 0.9xVSIM VSIM

3V Vol 0 0.15xVSIM

1.8V Vih 0.7xVSIM VSIM V SIM data (input)

1.8V Vil 0 0.15xVSIM Trise/Tfall max 1us

3V Vil 0.7xVSIM VSIM

3V Vil 0 0.15xVSIM

5 NC Not connected

6 GND GND 0 0 V Ground

VSIM specified in regulator section in this document

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Page 8–18 Company Confidential 9242678 (Issue 1)

External signals and connections

Table 18 System connector

Signal From To Min Nom Max Condi-tion Note

XMICP HS/HF Mic UEMC

Lite

2/60mV

diff

Analog

audio in

Headset Mic bias and audio

signal 2mV nominal. HF Mic

signal 60mV nominal.

Differential symmetric

input.

DC bias

2V2kohm

Accessory detection by

bias loading

XMICN 2/60mV

diff

Ana in / 1k to

GND

Hook interrupt by heavy

bias loading

XEARP HS/HF UEMC

Lite

100 mV

diff

Ana in Quasi-differential DC-

coupled earpiece/HF

amplifier signal to

accessory. DC biased to

0.8V

XEARN EAR/

Amp.

INT

HEADINT

Switch UEMC

Lite

0/2.7V Dig in HS interrupt from bottom

connector switch when

plug inserted.

VCHARIN Charger UEMC

Lite

11.1Vp

eak

16.9

Vpeak

Standard Vch from Charger

Connector, max 20V

7.9

VRMS

1.0

Apeak

7.0

VRMS

8.4

VRMS

9.2

VRMS

Fast charger

850 mA

GND GND GND from/to Charger

connector

Battery connector

Internal, user-changeable batteries. Semi-fixed. Types: Li-Ion, NiMH. Interface, 4 terminals (VBATT, GND, BSI,

BTEMP) Janette battery interface is used. The battery type and size are defined in the next chapter.

Table 19 Battery IF

Signal From To Min Nom Max Condi-tion Note

GND Global Batt (-) Global GND

VBAT Batt (+) 3.1 5.1 Battery Voltage

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System module Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 8–19

Signal From To Min Nom Max Condi-tion Note

BSI UEMCLite 0 2.78 Analog input, Battery Size

Indicator Resistor, 100

kohm pull up to 2.78V

(VBB1). FDL Init, refer to

flash download.

BTEMP UEMCLite 0 2.78 Btemp NTC Resistor, 100

kohm pull up to 2.78V

(VANA)

* Note! In BL-5C battery IF the BTEMP signal doesn’t exists. Temperature measurement is done on system board

with NTC resistor.

Figure 144 BL-5C battery connection order

Battery

• Type: BL-5C

• Technology: Li-Ion, 4.2 V charging, 3.1 V cut-off

• Capacity: 900 mAh.

The BSI resistor is placed on the main PWB as the telephone supports only one battery capacity. Further a BSI

connection is added to the Flash interface. The battery temperature is measured by a NTC resistor placed on

the main PWB, opposite to the Battery. Battery pack has an impedance of 130 - 150 mΩ (0 – 45 °C).

Figure 145 BL-5C battery block

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Page 8–20 Company Confidential 9242678 (Issue 1)

PWB outline

Figure 146 PWB top side component placement

RF description

Frequency band, power and multi-slot class

The requirements leads to the specification in the table below:

Table 20 Frequency bands and TX power class

System Frequency band TX power class

GSM850 Tx: 824 – 849 MHz 4 (33dBm)

GSM900 Tx: 880 – 915 MHz 4 (33dBm)

Rx: 925 – 960 MHz

GSM1800 Tx: 1710 – 1785 MHz 1 (30dBm)

Rx: 1805 – 1880 MHz

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System module Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 8–21

System Frequency band TX power class

GSM1900 Tx: 1850 – 1910 MHz 1 (30dBm)

Rx: 1930 – 1990 MHz

Table 21 Multi-slot class

Multislot Class

GPRS MSC 6 (up to 3+1 and 2+2)

Transmitter - general description

The transmitter has 2 separate parallel paths one covering either the 850 or the 900 band and the other the

1800/1900 bands. The transmitter operates in GMSK mode only. The power level control circuitry is integrated

in the front-end module.

Each path of the transmitter is composed of a baseband lowpass filter for the I/Q signals and a quadrature direct

modulator integrated in PMB3258. At the modulator’s output there is a bandpass filter for each band (so-called

H3 filter) and a balun transformer to convert the differential output signal from the modulator into a single-

ended 50 ohm signal. This signal is fed into the input of the PA. The two power amplifiers and the antenna

switch are located in a single module with built-in power control loop.

The two control methods used are open-loop Vcc control (RFMD) and feedback control with current sensing

(Renesas, Philips). The reference waveform (TXC) for the control loop comes from the baseband. The output of

the PA goes into a low pass filter located inside the FEM (Front End Module). Finally the transmit signal goes

through the band selection and TX/RX switches to the antenna port.

The FEM is controlled with four digital control signals (TXP, Vc1, Vc2 and Vc3) to meet the TDMA frame timing

requirements.

Transmitter - signal processing

The I/Q signals coming from the baseband section are fed into the modulator and converted up to the carrier

frequency. The I/Q are post filtered by a 1st order passive RC filter (discrete components on PWB) and a 3rd

order active filter (Legendre type) inside PMB3258.

The nominal output level of the modulator is +3.5 dBm in both bands. The modulator's output is an open-

collector type and need an external load and a DC supply feed. The load and the DC supply feed are implemented

as the part of the H3 filter. The H3 filter will attenuate mainly the 2nd and 3rd harmonics of the modulated RF

signal and provide suitable termination impedance for the modulator on the fundamental and harmonic

frequencies. Owing to the low noise floor of the PMB3258 modulator a narrow-band filter for the TX noise is

not required on either band, although the margin to the specification limit is quite narrow in the GSM850/900

bands.

The filtered signal is fed into the input of the FEM, which amplifies it to the desired power level and provides

the signal at the antenna port. There are built-in lowpass filters for the TX harmonics in the front-end module.

There is also a temperature sensor close to the FEM to enable SW temperature compensation for e.g. the power

levels. The sensor is connected to one of the slow ADC channels in the baseband.

VCXO and PLL

The VCO frequency is locked by a PLL (phase locked loop) into a stable frequency source given by a VCXO. The

frequency of the VCXO is in turn locked into the frequency of the base station with the help of an AFC (automatic

frequency control) voltage, which is generated in the UEM. The reference frequency is 26 MHz.

The VCXO also provides a 26 MHz system clock for the digital baseband.

The PLL is located in PMB3258 and it is controlled via the RFBUS.

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Page 8–22 Company Confidential 9242678 (Issue 1)

9 — Schematics

Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 9–1

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Page 9–2 Company Confidential 9242678 (Issue 1)

Table of Contents

Schematics.........................................................................................................................................................................................9–4

List of Figures

Figure 147 RM-74, 1mf_07a: UPP, UEM, Combo memory, Radio, SIM..............................................................................9–4

Figure 148 RM-74, 1mf_07a: UI, Keyboard, Audio.................................................................................................................9–5

Figure 149 RM-74, 1mf_07a: RF part.........................................................................................................................................9–6

Figure 150 RM-74, 1mf_07a: Signal overview........................................................................................................................9–7

Figure 151 RM-74, 1mf_07a: Component finder....................................................................................................................9–8

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Schematics Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 9–3

Schematics

UPP, UEM, Combo memory, Radio, SIM

Figure 147 RM-74, 1mf_07a: UPP, UEM, Combo memory, Radio, SIM

RM-74

Schematics Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 9–4

UI, Keyboard, Audio

Figure 148 RM-74, 1mf_07a: UI, Keyboard, Audio

RM-74

Schematics Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 9–5

RF part

Figure 149 RM-74, 1mf_07a: RF part

RM-74

Schematics Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 9–6

Signal overview

Figure 150 RM-74, 1mf_07a: Signal overview

RM-74

Schematics Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 9–7

Component finder

Figure 151 RM-74, 1mf_07a: Component finder

RM-74

Schematics Nokia Customer Care

9242678 (Issue 1) Company Confidential Page 9–8

Glossary

Nokia Customer Care

9242678 (Issue 1) Company Confidential Page Glossary–1

RM-74

Nokia Customer Care Glossary of terms

(This page left intentionally blank.)

Page Glossary–2 Company Confidential 9242678 (Issue 1)

A/D-converter Analog-to-digital converter

ACI Accessory Control Interface

ADC Analog-to-digital converter

ADSP Application DPS (expected to run high level tasks)

AGC Automatic gain control (maintains volume)

ALS Ambient light sensor

AMSL After Market Service Leader

ARM Advanced RISC Machines

ARPU Average revenue per user (per month or per year)

ASIC Application Specific Integrated Circuit

ASIP Application Specific Interface Protector

B2B Board to board, connector between PWB and UI board

BB Baseband

BC02 Bluetooth module made by CSR

BIQUAD Bi-quadratic ,type of filter function)

BSI Battery Size Indicator

BT Bluetooth

CBus MCU controlled serial bus connected to UPP_WD2,UEME and Zocus

CCP Compact Camera Port

CDSP Cellular DSP (expected to run at low levels)

CLDC Connected limited device configuration

CMOS Complimentary metal-oxide semiconductor circuit (low power consumption)

COF Chip on Foil

COG Chip on Glass

CPU Central Processing Unit

CSR cambridge silicon radio

CSTN Color Super Twisted Nematic

CTSI Clock Timing Sleep and interrupt block of Tiku

CW Continuous wave

D/A-converter Digital-to-analouge converter

DAC Digital-to-analouge converter

DBI Digital Battery Interface

DBus DSP controlled serial bus connected between UPP_WD2 and Helgo

DCT-4 Digital Core Technology

DMA Direct memory access

DP Data Package

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Glossary of terms Nokia Customer Care

9242678 (Issue 1) Company Confidential Page Glossary–3

DPLL Digital Phase Locked Loop

DSP Digital Signal Processor

DtoS Differential to Single ended

EDGE Enhanced data rates for global/GSM evaluation

EGSM Extended GSM

EM Energy management

EMC Electromagnetic compability

EMI Electromagnetic interference

ESD Electrostatic discharge

FCI Functional cover interface

FPS Flash Programming Tool

FR Full rate

FSTN Film compensated super twisted nematic

GND Ground, conductive mass

GPIB General-purpose interface bus

GPRS General Packet Radio Service

GSM Group Special Mobile/Global System for Mobile communication

HF Hands free

HFCM Handsfree Common

HS Handset

HSCSD High speed circuit switched data (data transmission connection faster than GSM)

HW Hardware

I/O Input/Output

IBAT Battery current

IC Integrated circuit

ICHAR Charger current

IF Interface

IHF Integrated hands free

IMEI International Mobile Equipment Identity

IR Infrared

IrDA Infrared Data Associasion

ISA Intelligent software architecture

JPEG/JPG Joint Photographic Experts Group

LCD Liquid Crystal Display

LDO Low Drop Out

LED Light-emitting diode

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Nokia Customer Care Glossary of terms

Page Glossary–4 Company Confidential 9242678 (Issue 1)

LPRF Low Power Radio Frequency

MCU Micro Controller Unit (microprocessor)

MCU Multiport control unit

MIC, mic Microphone

MIDP Mobile Information Device Profile

MIN Mobile identification number

MIPS Million instructions per second

MMC Multimedia card

MMS Multimedia messaging service

NTC Negative temperature coefficient, temperature sensitive resistor used as a

temperature sensor

OMA Object management architechture

OMAP Operations, maintenance, and administartion part

Opamp Operational Amplifier

PA Power amplifier

PDA Pocket Data Application

PDA Personal digital assistant

PDRAM Program/Data RAM (on chip in Tiku)

Phoenix Software tool of DCT4.x

PIM Personal Information Management

PLL Phase locked loop

PM (Phone) Permanent memory

PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX Power-up reset

PWB Printed Wiring Board

PWM Pulse width modulation

RC-filter Resistance-Capacitance filter

RF Radio Frequency

RF PopPort TM Reduced function PopPortTM interface

RFBUS Serial control Bus For RF

RSK Right Soft Key

RS-MMC Reduced size Multi Media Card

RSSI Receiving signal strength indicator

RST Reset Switch

RTC Real Time Clock (provides date and time)

RX Radio Receiver

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Glossary of terms Nokia Customer Care

9242678 (Issue 1) Company Confidential Page Glossary–5

SARAM Single Access RAM

SAW filter Surface Acoustic Wave filter

SDRAM Synchronous Dynamic Random Access Memory

SID Security ID

SIM Subscriber Identity Module

SMPS Switched Mode Power Supply

SNR Signal-to-noice ratio

SPR Standard Product requirements

SRAM Static random access memory

STI Serial Trace Interface

SW Software

SWIM Subscriber/Wallet Identification Module

TCXO Temperature controlled Oscillator

Tiku Finnish for Chip, Successor of the UPP, Official Tiku3G

TX Radio Transmitter

UART Universal asynchronous receiver/transmitter

UEME Universal Energy Management chip (Enhanced version)

UEMEK See UEME

UI User Interface

UPP Universal Phone Processor

UPP_WD2 Communicator version of DCT4 system ASIC

USB Universal Serial Bus

VBAT Battery voltage

VCHAR Charger voltage

VCO Voltage controlled oscillator

VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO Voltage Controlled Crystal Oscillator

Vp-p Peak-to-peak voltage

VSIM SIM voltage

WAP Wireless application protocol

WD Watchdog

XHTML Extensible hypertext markup language

Zocus Current sensor, (used to monitor the current flow to and from the battery)

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Nokia Customer Care Glossary of terms

Page Glossary–6 Company Confidential 9242678 (Issue 1)

Nokia 6030 Rm 74 Service Manual 34 V1

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