Nokia E6 00 Rm 609 Service Manual 34 V1

User Manual: Smartphone Nokia E6-00 RM-609 - Service manuals and Schematics, Disassembly / Assembly. Free.

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Amendment Record Sheet
Copyright
Warnings and cautions
For your safety
ESD protection
Care and maintenance
Company policy
Battery information
Nokia E6-00; L3&4 Service Manual Structure
1 General Information
2 Service Tools and Service Concepts
- Service tools
- Service concepts
3 BB Troubleshooting and Manual Tuning Guide
4 Cellular RF troubleshooting
5 Camera Module Troubleshooting
6 System Module
Glossary

Service Manual

RM-609 (Nokia E6-00; L3&4)

Mobile Terminal

Part No: (Issue 1)

Nokia Customer Care

COMPANY CONFIDENTIAL

Amendment Record Sheet

Amendment No Date Inserted By Comments

Issue 1 04/2011 MT

RM-609

Amendment Record Sheet

Page ii COMPANY CONFIDENTIAL Issue 1

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form

without the prior written permission of Nokia is prohibited.

Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia

Corporation. Other product and company names mentioned herein may be trademarks or tradenames of

their respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and

improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,

consequential or indirect damages howsoever caused.

The contents of this document are provided "as is". Except as required by applicable law, no warranties of

any kind, either express or implied, including, but not limited to, the implied warranties of merchantability

and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this

document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

The availability of particular products may vary by region.

IMPORTANT

This document is intended for use by qualified service personnel only.

RM-609

Issue 1 COMPANY CONFIDENTIAL Page iii

Warnings and cautions

Warnings

•IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED

WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT

CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/

MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

•THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,

FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

•OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE

WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE

MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY

ALSO BE SUBJECT TO INTERFERENCE.

•BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions

•Servicing and alignment must be undertaken by qualified personnel only.

•Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

•Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

•Use only approved components as specified in the parts list.

•Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and

alignment.

•Ensure all cables and wires are repositioned correctly.

•Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the

measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb

nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.

•During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise

GSM or WCDMA PA may be damaged.

RM-609

Warnings and cautions

Page iv COMPANY CONFIDENTIAL Issue 1

For your safety

QUALIFIED SERVICE

Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES

Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES

When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect

incompatible products.

RM-609

For your safety

Issue 1 COMPANY CONFIDENTIAL Page v

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing

the phone.

Any product of which the covers are removed must be handled with ESD protection. The SIM card can be

replaced without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied.

All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity

discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside

any ESD Protected Area (EPA).

Every repair action involving opening the product or handling the product components must be done under

ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.

For more information and local requirements about ESD protection and ESD Protected Area, contact your local

Nokia After Market Services representative.

RM-609

ESD protection

Page vi COMPANY CONFIDENTIAL Issue 1

Care and maintenance

This product is of superior design and craftsmanship and should be treated with care. The suggestions below

will help you to fulfil any warranty obligations and to enjoy this product for many years.

•Keep the phone and all its parts and accessories out of the reach of small children.

•Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that

will corrode electronic circuits.

•Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.

•Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage

batteries, and warp or melt certain plastics.

•Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form

inside, which may damage electronic circuit boards.

•Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.

•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.

•Do not paint the phone. Paint can clog the moving parts and prevent proper operation.

•Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or

attachments could damage the phone and may violate regulations governing radio devices.

All of the above suggestions apply equally to the product, battery, charger or any accessory.

RM-609

Care and maintenance

Issue 1 COMPANY CONFIDENTIAL Page vii

Company policy

Our policy is of continuous development; details of all technical modifications will be included with service

bulletins.

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If

any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/e-

mail.

Please state:

•Title of the Document + Issue Number/Date of publication

•Latest Amendment Number (if applicable)

•Page(s) and/or Figure(s) in error

Please send to:

NOKIA CORPORATION

Nokia Mobile Phones Business Group

Nokia Customer Care

PO Box 86

FIN-24101 SALO

Finland

E-mail: Service.Manuals@nokia.com

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Company policy

Page viii COMPANY CONFIDENTIAL Issue 1

Battery information

Note: A new battery's full performance is achieved only after two or three complete charge and

discharge cycles!

The battery can be charged and discharged hundreds of times but it will eventually wear out. When the

operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.

Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers

approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to

a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged

battery will discharge itself over time.

Temperature extremes can affect the ability of your battery to charge.

For good operation times with Li-Pol batteries, discharge the battery from time to time by leaving the product

switched on until it turns itself off (or by using the battery discharge facility of any approved accessory

available for the product). Do not attempt to discharge the battery by any other means.

Use the battery only for its intended purpose.

Never use any charger or battery which is damaged.

Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or

pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example

when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery

or the connecting object.

Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce

the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°

F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.

Batteries' performance is particularly limited in temperatures well below freezing.

Do not dispose of batteries in a fire!

Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

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Battery information

Issue 1 COMPANY CONFIDENTIAL Page ix

RM-609

Battery information

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Page x COMPANY CONFIDENTIAL Issue 1

Nokia E6-00; L3&4 Service Manual Structure

1 General Information

2 Service Tools and Service Concepts

3 BB Troubleshooting and Manual Tuning Guide

4 Cellular RF troubleshooting

5 Camera Module Troubleshooting

6 System Module

Glossary

RM-609

Nokia E6-00; L3&4 Service Manual Structure

Issue 1 COMPANY CONFIDENTIAL Page xi

RM-609

Nokia E6-00; L3&4 Service Manual Structure

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Page xii COMPANY CONFIDENTIAL Issue 1

1 — General Information

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 1 – 1

RM-609

General Information

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Page 1 – 2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

Product selection................................................................................................................................................... 1–5

Product features and sales package.................................................................................................................... 1–6

Product and module list ....................................................................................................................................... 1–9

Mobile enhancements........................................................................................................................................... 1–9

Technical specifications..................................................................................................................................... 1–11

Transceiver general specifications .............................................................................................................. 1–11

Main RF characteristics for GSM850/900/1800/1900 and WCDMA VIII/V/IV/II/I phones........................ 1–11

Battery endurance......................................................................................................................................... 1–13

Environmental conditions ............................................................................................................................ 1–13

List of Tables

Table 1 Audio......................................................................................................................................................... 1–9

Table 2 Car........................................................................................................................................................... 1–10

Table 3 Data ........................................................................................................................................................ 1–11

Table 4 Messaging.............................................................................................................................................. 1–11

Table 5 Power..................................................................................................................................................... 1–11

List of Figures

Figure 1 View of RM-609....................................................................................................................................... 1–5

RM-609

General Information

Issue 1 COMPANY CONFIDENTIAL Page 1 – 3

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Product selection

RM-609 is a GSM/HSDPA/WCDMA tri-mode handportable monoblock multimedia computer with a capacitive

touch UI, integrated GPS (A-GPS OMA SUPL), WLAN and a TV-out connection. It supports EGSM

850/900/1800/1900 and WCDMA 850/900/1700/1900/2100 bands, and CSD/HSCSD, GPRS/EGPRS and WCDMA/

HSDPA data bearers.

For WCDMA the maximum bit rate is up to 384 kbit/s for downlink and 384 kbit/s for uplink with simultaneous

CS speech or CS video (max. 64 kbit/s). The HSDPA peak is 3.6 Mbit/s downlink (with limited use cases).

In PS/CS mode, RM-609 supports DTM Class with multi slot class 11 (max. 4 RX + 3TX, sum 5). With EGPRS this

means maximum download speed of up to 236.8 kbit/s simultaneously with speech. With GPRS this means

maximum download speed of up to 64.2 kbit/s simultaneously with speech.

In PS only mode, RM-609 supports MSC 33 (max. 5 Rx + 4 TX, sum 6) timeslots resulting in maximum download

speed of up to 296 kbit/s with EGPRS, and up to 107 kbit/s with GPRS.

RM-609 has a 2.46” TFT LCD (640 x 480 pixels) color display with 16 million colors. It also has an 8 megapixel

full focus (EDOF) camera with 4 x digital zoom and an integrated dual LED flash. The device supports two-

way video calls with two integrated cameras, one on the front and one on the back.

The MMS implementation follows the OMA MMS standard release 1.3. The browser is a highly advanced

Internet browser also capable of viewing operator domain XHTML Mobile Profile (MP) content. The device

also supports Bluetooth 2.1 EDR standard.

RM-609 uses Symbian 9.2 operating system, S60 (release 3.2) UI, and supports the full Web Browser for S60,

which brings desktop-like Web browsing experience to mobile devices. It also supports MIDP Java 2.1 ,

providing a good platform for compelling 3rd party applications.

Figure 1 View of RM-609

RM-609

General Information

Issue 1 COMPANY CONFIDENTIAL Page 1 – 5

Product features and sales package

Imaging

Main camera:

•Sensor: 8 megapixel EDOF (Extended Depth Of Field)

•F number/Aperture: F2.8

•Digital zoom: 4x

•Focal length: 28 mm

•Focus range: 5 cm ~ infinity

•Flash: Integrated dual LED flash

Secondary camera:

•Sensor: VGA (640 x 480 pixels)

•F number/Aperture: F2.8

•Focal length: 1.39 mm

•Focus range: 10 cm ~ infinity

Video:

•Video resolution: nHD or VGA at 30fps

•Audio recording: AAC (AMR for MMS)

•Video stabilization

•Video clip length: Max. 90 min

•Video file format: .mp4 (default), .3gp (for MMS)

•White balance: automatic, sunny, cloudy, incandescent, fluorescent

•Scene: Auto, Night

•Colour tone: normal, sepia, B&W, vivid, negative

•Zoom (digital): up to 4x

•Video recording indicator

Photo:

•Aspect ratio: 16:9

•View finder: Full screen view finder

•Still image resolutions: up to 8 megapixel: 3280 x 2464

•Still image file format: JPEG/EXIF

•Auto exposure: center weighted AE

•Image orientation: automatic

•Exposure compensation: +2 ~ -2EV at 0.5 step

•White balance: automatic, sunny, cloudy, incandescent, fluorescent

•Scene: auto, sports, portrait, close-up, landscape, night, user defined

•Colour tone: normal, sepia, B&W, vivid, negative

•Zoom (digital): up to 4x

Edit

•On device Photo editor and Video editor (manual & automatic)

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General Information

Page 1 – 6 COMPANY CONFIDENTIAL Issue 1

View

•2.46" TFT LCD, (640 x 480 pixels) color display, up to 16M colors, 16:9 aspect ratio

•Digital Ambient Light Sensor (ALS) – used to optimize display/key brightness and power consumption

•Slideshow from Gallery

•Nokia XpressShare - share effortlessly from Gallery or after capture via Email, Bluetooth or MMS

•Direct connection to TV via cable or WLAN (UPnP)

•Video call and video sharing support (WCDMA services)

•Online Album: Image/Video uploading from Gallery

•Nokia XpressPrint – direct printing via USB (PictBridge), Bluetooth (BPP), and WLAN (UPnP), from memory

card or via online printing

Store

•8 GB internal user memory

•Nokia XpressTransfer – easy to transfer and organize photos and video between your device and a

compatible PC

•Nokia Lifeblog (mobile & PC)

Music

•Digital music player: supports MP3/ AAC/ eAAC/ eAAC+/ WMA/ AMR-NB/ AMR-WB with playlists, equalizer

and album art

•Synchronise music with Microsoft Windows Media Player 10 & 11

•One click CD ripping, converting and transferring music to your device using Nokia Music Manager

•Stereo FM radio (87.5-108 MHz /76-90 MHz) with Visual Radio™ support

•Bluetooth speakers

•Integrated handsfree speaker

•Nokia Music Headset (WH-207), inbox

Media

•Full-screen video playback to view downloaded, streamed or recorded video clips

•Supported video formats: MPEG-4 , H.264/AVC, H.263/3GPP, VC-1, Real Video 10, ON2 VP6, Flash video

Productivity

Context management:

•OMA DRM version 2.0

•OTA provisioning & over the air SW update (FOTA)

•Ovi Suite

•Web Browser (OSS), Java ™ MIDP 2.1, XHTML browsing over TCP/IP

Messaging:

•E-mail (SMTP, IMAP4, POP3), MMS, SMS, unified editor

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General Information

Issue 1 COMPANY CONFIDENTIAL Page 1 – 7

•IM client

Office applications:

•Viewing of email attachments – .doc, .xls, .ppt, .pdf, .zip

•Mail for Exchange

PIM:

•Contacts, calendar, to-do, notes, recorder, calculator, clock, converter

Synchronization:

•Local/Remote (using SyncML)

•Data: Calendar, Contacts, To-do, Notes, E-mail

•PC Applications: Microsoft Outlook (98, 2000, 2002, 2003), Outlook Express, Lotus Organizer (5.0, 6.0),

Lotus Notes (5.0, 6.0)

Call management:

•Call logs, speed dial, voice dialling (with SIND) and voice commands

•Nokia Push to Talk (PoC)

Connectivity

•Integrated GPS (A-GPS OMA SUPL)

•Nokia Maps 3.0, including Friend Finder

•WLAN - IEEE802.11 g/b/n with UPnP support

•Micro USB interface with USB 2.0 high speed

•Bluetooth wireless technology 2.1 + EDR + A2DP

•MicroSD memory card - support up to 32 GB

•Nokia 3.5 mm AV connector

•2.0 mm DC connector

Add-on software framework

•Symbian 9.2 OS

•Nokia Series 60, 5th edition, feature pack 2

•Java: MIDP2.1

•C++ and Java SDKs

•Flash Lite 4.0

Additional technical specifications

•Vibrating alert

•3GPP Rel 5/6 WCDMA , Rel 4 EGSM compliant

•Speech codecs supported: AMR, NB AMR, WB AMR, FR, EFR

•GPRS/EGPRS Class B, Multi slot class 33

•Dual Transfer Mode (DTM) class A, multi slot class 11

•WCDMA DL 384 kbit/s, UL 384 kbit/s

•HSDPA up to 10.2 Mbps, HSUPA 2 Mbps

Sales package

•Transceiver RM-609

RM-609

General Information

Page 1 – 8 COMPANY CONFIDENTIAL Issue 1

•Charger (AC-15)

•Battery (BP-4L)

•Music headset (WH-207)

•Connectivity cable (CA-179)

Product and module list

Module name Type code Notes

System/RF module PWB 3DJ

UI flex module 3DH

Flash flex module 3DQ

Mobile enhancements

Table 1 Audio

Enhancement Type

Music headset WH-207

Nokia Wireless Stereo Gateway AD-42W

Mini speakers MD-8

MD-9

Hearing aids HDA-12

LPS-5

Wired headsets WH-205

WH-502

WH-700

WH-701

WH-800

WH-900

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General Information

Issue 1 COMPANY CONFIDENTIAL Page 1 – 9

Enhancement Type

Bluetooth headsets BH-103

BH-214

BH-215

BH-500

BH-501

BH-503

BH-504

BH-505

BH-606

BH-607

BH-702

BH-704

BH-804

BH-805

BH-900

BH-902

BH-904

BH-905

Bluetooth speakers MD-5W

MD-7W

Table 2 Car

Enhancement Type

Nokia Universal Mobile Holder CR-99

Speakerphone HF-310

HF-510

Car kit CK-100

Display car kit CK-600

Mobile charger DC-9

DC-10

DC-11

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General Information

Page 1 – 10 COMPANY CONFIDENTIAL Issue 1

Table 3 Data

Enhancement Type

Connectivity cable CA-179

MicroSD card MU-43, 8GB

MU-44, 16GB

MU-45 32GB

Table 4 Messaging

Enhancement Type

Other multimedia peripherals SU-33W

Stylus STYLUS PEN ASSY

Table 5 Power

Enhancement Type

Battery 1500 mAh Li-Polymer BP-4L

Travel charger AC-6

AC-8

AC-10

AC-15

Technical specifications

Transceiver general specifications

Unit Dimensions (L x W x T)

(mm) Weight (g) Volume (cm3)

Transceiver with BP-4L

1500 mAh Li-Polymer

battery pack

115.5 x 59.2 x 11.7 129 66

Main RF characteristics for GSM850/900/1800/1900 and WCDMA VIII/V/IV/II/I phones

Parameter Unit

Cellular system GSM850, EGSM900, GSM1800/1900, WCDMA VIII (900), WCDMA V

(850), WCDMA IV (1700/2100), WCDMA II (1900) and WCDMA I

(2100)

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General Information

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Parameter Unit

Rx frequency band GSM850: 869 - 894MHz

EGSM900: 925 - 960 MHz

GSM1800: 1805 - 1880 MHz

GSM1900: 1930 - 1990 MHz

WCDMA VIII (900): 925 - 960 MHz

WCDMA V (850): 869 - 894 MHz

WCDMA IV (1700/2100): 2110 - 2155 MHz

WCDMA II (1900): 1930 - 1990 MHz

WCDMA I (2100): 2110 - 2170 MHz

Tx frequency band GSM850: 824 - 849 MHz

EGSM900: 880 - 915 MHz

GSM1800: 1710 - 1785 MHz

GSM1900: 1850 - 1910 MHz

WCDMA VIII (900): 880 - 915 MHz

WCDMA V (850): 824 - 849 MHz

WCDMA IV (1700/2100): 1710 - 1755 MHz

WCDMA II (1900): 1850 - 1910 MHz

WCDMA I (2100): 1920 - 1980 MHz

Output power GSM850: +5 ...+33 dBm/3.2 mW ... 2 W

GSM900: +5 … +33 dBm/3.2 mW … 2 W

GSM1800: +0 … +30 dBm/1.0 mW … 1 W

GSM1900: +0 … +30 dBm/1.0 mW … 1 W

WCDMA VIII (900): -50 ... +24 dBm/0.01 μW ... 251 mW

WCDMA V (850): -50 ... +24 dBm/0.01 μW ... 251 mW

WCDMA IV (1700/2100): -50 ... +24 dBm/0.01 μW ... 251 mW

WCDMA II (1900): -50 ... +21 dBm/0.01 μW ... 126 mW

WCDMA I (2100): -50 ... +24 dBm/0.01 μW ... 251 mW

EDGE output power EDGE850: +5 … +27 dBm/3.2 mW … 501 mW

EDGE900: +5 … +27 dBm/3.2 mW … 501 mW

EDGE1800: +0 … +26 dBm/1.0 mW … 398 mW

EDGE1900:+0 … +26 dBm/1.0 mW … 398 mW

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General Information

Page 1 – 12 COMPANY CONFIDENTIAL Issue 1

Parameter Unit

Number of RF channels GSM850: 124

GSM900: 174

GSM1800: 374

GSM1900: 299

WCDMA VIII (900): 152

WCDMA V (850): 108

WCDMA IV (1700/2100): 211

WCDMA II (1900): 289

WCDMA I (2100): 277

Channel spacing 200 kHz (WCDMA II, IV and V 100/200 kHz)

Number of Tx power levels GSM850: 15

GSM900: 15

GSM1800: 16

GSM1900: 16

WCDMA VIII (900): 75

WCDMA V (850): 75

WCDMA IV (1700/2100): 75

WCDMA II (1900): 75

WCDMA I (2100): 75

Battery endurance

Battery Capacity

(mAh) Talk time Stand-by Music playback Video playback

H.264 720p 30fps

BP-4L 1500 Up to 9.7 h

(GSM)

Up to 6.1 h

(WCDMA)

Up to 792 h

(GSM)

Up to 684 h

(WCDMA)

75 h 8.8 h

Environmental conditions

Temperature conditions

Environmental condition Ambient temperature Notes (Operational for short

periods only)

Normal operation -15oC...+55oCSpecifications fulfilled

Reduced performance -25oC...-15oC

+55oC...+70oC

Operational for shorts periods

only

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Environmental condition Ambient temperature Notes (Operational for short

periods only)

Intermittent operation -40oC...-15oC

+70oC...+85 oC

Operation not guaranteed but an

attempt to operate does not

damage the phone.

No operation or storage <-40oC...>+85oCNo storage or operation: an

attempt may damage the phone.

Charging allowed -10oC...+60oCBTemp measurement range for

charging.

Long term storage conditions 0oC...+85oC

Humidity

Relative humidity range is 5...95%.

The HW module is not protected against water. Condensed or splashed water might cause malfunction. Any

submersion of the phone will cause permanent damage. Long-term high humidity, with condensation, will

cause permanent damage because of corrosion.

Vibration

The module should withstand the following vibrations:

•5 - 10 Hz; +10dB / octave

•10 - 50 Hz; 5.58 m2 / s3 (0.0558 g2/ Hz)

•50 - 300 Hz; - 10 dB / octave

ESD strength

Conducted discharge is 8 kV (>10 discharges) and air contact 15 kV ( >10 discharges ).

The standard for electrostatic discharge is IEC 61000-4-2, and this device fulfils level 4 requirements.

RoHS

This device uses RoHS compliant components and lead-free soldering process.

RM-609

General Information

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2 — Service Tools and Service

Concepts

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 – 1

RM-609

Service Tools and Service Concepts

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Table of Contents

Service tools........................................................................................................................................................... 2–5

Product specific tools....................................................................................................................................... 2–5

MJ-300 .......................................................................................................................................................... 2–5

SS-227........................................................................................................................................................... 2–5

General tools..................................................................................................................................................... 2–6

AC-35............................................................................................................................................................. 2–6

ACF-8............................................................................................................................................................. 2–6

CU-4............................................................................................................................................................... 2–7

FLS-5 ............................................................................................................................................................. 2–8

FPS-21........................................................................................................................................................... 2–8

JXS-1.............................................................................................................................................................. 2–9

PK-1............................................................................................................................................................... 2–9

SB-6............................................................................................................................................................... 2–9

SB-7............................................................................................................................................................... 2–9

SD-77 ......................................................................................................................................................... 2–10

SRT-6.......................................................................................................................................................... 2–10

SS-210........................................................................................................................................................ 2–10

SS-93.......................................................................................................................................................... 2–10

SX-4............................................................................................................................................................ 2–10

Removing a camera with the removal tool SS-210 .............................................................................. 2–11

Cables.............................................................................................................................................................. 2–12

CA-101 ....................................................................................................................................................... 2–13

CA-128RS ................................................................................................................................................... 2–13

CA-31D ....................................................................................................................................................... 2–13

CA-89DS ..................................................................................................................................................... 2–14

CA-99PS...................................................................................................................................................... 2–14

PCS-1.......................................................................................................................................................... 2–14

XRS-6.......................................................................................................................................................... 2–15

Service concepts ................................................................................................................................................. 2–15

POS (Point of Sale) flash concept ................................................................................................................. 2–15

BB5 USB only – Basic flash concept L3......................................................................................................... 2–16

Level 3 concept for flashing, certificate restore and product code change option 3............................. 2–17

BB5 MJ-300 universal module jig concept .................................................................................................. 2–18

BB5 Extended MJ-300 universal module jig concept ................................................................................. 2–19

Bluetooth testing concept with SB-6 .......................................................................................................... 2–21

WLAN functionality testing concept with SB-7 .......................................................................................... 2–22

List of Figures

Figure 2 POS flash concept ................................................................................................................................ 2–15

Figure 3 BB5 USB only – Basic flash concept L3............................................................................................... 2–16

Figure 4 Level 3 concept for flashing, certificate restore and product code change .................................. 2–17

Figure 5 BB5 MJ-300 universal module jig concept ........................................................................................ 2–18

Figure 6 BB5 Extended MJ-300 universal module jig concept ....................................................................... 2–19

Figure 7 Bluetooth testing concept with SB-6 ................................................................................................ 2–21

Figure 8 WLAN functionality testing concept with SB-7................................................................................. 2–22

RM-609

Service Tools and Service Concepts

Issue 1 COMPANY CONFIDENTIAL Page 2 – 3

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Service Tools and Service Concepts

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Service tools

Product specific tools

The table below gives a short overview of service devices that can be used for testing, error analysis, and

repair of product RM-609. For the correct use of the service devices, and the best effort of workbench setup,

please refer to various concepts.

MJ-300 Module jig

Module jig MJ-300 is designed for regional Central Services for engine

testing. It can be used for flashing via USB and RF, battery and system

testing.

The main functions are:

•Powering with external power

•CU-4 interface adapter to phone (requires SS-227)

•WLAN/BT/GPS RF-interfaces with probes

•GSM/WCDMA RF-interfaces with probes

•BSI mode selector (Tabby and Lynx interface, selected with battery

cable)

•VBATT interface (Tabby and Lynx interface, selected with battery

cable)

•CA-128RS cable is used together with this jig for RF testing

VBATT functions can be performed in the CU-4 (requires SS-227).

Calibration voltages and currents e.g. are protected and monitored by

the CU-4 interface software (protection for over-current, overvoltage

and reverse voltage).

VBATT can be powered through MJ-300 (SS-227 not required) with

external power. MJ-300 provides the VBATT with SMPS regulation to

3.9V/2A and regulation bypass with overvoltage protection (trip point

~4.4VDC). The VBATT external supply is provided with overvoltage

protection (trip point ~16.5VDC), polarity protection and over-current

protection (fuse 2.5A slow).

SS-227 Interface for CU-4

control unit

SS-227 is designed for regional Central Services to be able to use CU-4

with MJ-300 module jig. With SS-227, CU-4 can be used for battery

testing.

The main functions of SS-227 are:

•CU-4 interface adapter to MJ-300

•BSI mode selector (Lynx and Tabby mode selection)

•VBATT interface

All functions are performed in the CU-4. Calibration voltages and

currents e.g. are protected and monitored by the CU-4 interface

software (protection for over-current, overvoltage and reverse

voltage).

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Service Tools and Service Concepts

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General tools

The table below gives a short overview of service devices that can be used for testing, error analysis, and

repair of product RM-609. For the correct use of the service devices, and the best effort of workbench setup,

please refer to various concepts.

AC-35 Power supply

Universal power supply for FPS-21; included in the FPS-21 sales

package.

Input 100V…230V 50Hz…60Hz, output voltage of 12 V and output

current up to 3 A.

ACF-8 Universal power

supply

The ACF-8 universal power supply is used to power FLS-5.

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CU-4 Control unit

CU-4 is a general service tool used with a module jig and/or a flash

adapter. It requires an external 12 V power supply.

The unit has the following features:

•software controlled via USB

•EM calibration function

•Forwards FBUS/Flashbus traffic to/from terminal

•Forwards USB traffic to/from terminal

•software controlled BSI values

•regulated VBATT voltage

•2 x USB2.0 connector (Hub)

•FBUS and USB connections supported

When using CU-4, note the special order of connecting cables and

other service equipment:

Instructions

1 Connect a service tool (jig, flash adapter) to CU-4.

2 Connect CU-4 to your PC with a USB cable.

3 Connect supply voltage (12 V)

4 Connect an FBUS cable (if necessary).

5 Start Phoenix service software.

Note: Phoenix enables CU-4 regulators via USB when it is

started.

Reconnecting the power supply requires a Phoenix restart.

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FLS-5 Flash device

FLS-5 is a dongle and flash device incorporated into one package,

developed specifically for POS use.

Note: FLS-5 can be used as an alternative to PK-1.

FPS-21 Flash prommer

FPS-21 sales package:

•FPS-21 prommer

•AC-35 power supply

•CA-31D USB cable

FPS-21 interfaces:

Front

•Service cable connector

Provides Flashbus, USB and VBAT connections to a mobile device.

•SmartCard socket

A SmartCard is needed to allow DCT-4 generation mobile device

programming.

Rear

•DC power input

For connecting the external power supply (AC-35).

•Two USB A type ports (USB1/USB3)

Can be used, for example, for connecting external storage memory

devices or mobile devices

•One USB B type device connector (USB2)

For connecting a PC.

•Phone connector

Service cable connection for connecting Flashbus/FLA.

•Ethernet RJ45 type socket (LAN)

For connecting the FPS-21 to LAN.

Inside

•Four SD card memory slots

For internal storage memory.

Note: In order to access the SD memory card slots inside

FPS-21, the prommer needs to be opened by removing the

front panel, rear panel and heatsink from the prommer body.

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JXS-1 RF shield box

Because the WCDMA network disturbs the RX side testing of the WCDMA

phone and the Tx signal of the WCDMA phone can severely disturb the

WCDMA network, a shield box is needed in all testing, tuning and fault

finding which requires WCDMA RF signal.

The shield box is not an active device, it contains only passive filtering

components for RF attenuation.

PK-1 Software protection

key

PK-1 is a hardware protection key with a USB interface. It has the same

functionality as the PKD-1 series dongle.

PK-1 is meant for use with a PC that does not have a series interface.

To use this USB dongle for security service functions please register

the dongle in the same way as the PKD-1 series dongle.

SB-6 Bluetooth test and

interface box (sales

package)

The SB-6 test box is a generic service device used to perform Bluetooth

bit error rate (BER) testing, and establishing cordless FBUS connection

via Bluetooth. An ACP-8x charger is needed for BER testing and an

AXS-4 cable in case of cordless interface usage testing .

Sales package includes:

•SB-6 test box

•Installation and warranty information

SB-7 WLAN test box

WLAN test requires defined position for the device.

Place the phone on coordinates "E-1" for testing.

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SD-77 Dummy battery

SD-77 is designed to support mass SW flashing which enables local

mode while connecting the phone. This dummy battery can be used

with Nokia battery types BL-5K, BV-4D, BL-4D, BP-4L.

SRT-6 Opening tool

SRT-6 is used to open phone covers.

Note: The SRT-6 is included in the Nokia Standard Toolkit.

SS-210 Camera removal tool

The camera removal tool SS-210 is used to remove/attach the camera

module from/to the socket.

SS-93 Opening tool

SS-93 is used for opening JAE connectors.

Note: The SS-93 is included in Nokia Standard Toolkit.

SX-4 Smart card

SX-4 is a BB5 security device used to protect critical features in tuning

and testing.

SX-4 is also needed together with FPS-21 when DCT-4 phones are

flashed.

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Removing a camera with the removal tool SS-210

Steps

1. Insert the camera tool on top of the camera, do not press the metal sheets down.

2. Press the camera down a little bit with the camera tool black plastic part.

3. Press the metal sheets down.

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4. Press the metal plates from the sides to tighten them to the camera.

5. Pull out the camera.

Cables

The table below gives a short overview of service devices that can be used for testing, error analysis, and

repair of product RM-609. For the correct use of the service devices, and the best effort of workbench setup,

please refer to various concepts.

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Service Tools and Service Concepts

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CA-101 Micro USB cable

The CA-101 is a USB-to-microUSB data cable that allows connections

between the PC and the phone.

CA-128RS RF tuning cable

Product-specific adapter cable for RF tuning.

CA-31D USB cable

The CA-31D USB cable is used to connect FPS-21 to a PC. It is included

in the FPS-21 sales package.

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CA-89DS Cable

Provides VBAT and Flashbus connections to mobile device

programming adapters.

CA-99PS Adapter

CA-99PS adapter, 3.5 jack to 5.5 plug.

PCS-1 Power cable

The PCS-1 power cable (DC) is used with a docking station, a module

jig or a control unit to supply a controlled voltage.

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XRS-6 RF cable

The RF cable is used to connect, for example, a module repair jig to

the RF measurement equipment.

SMA to N-Connector approximately 610 mm.

Attenuation for:

•GSM850/900: 0.3+-0.1 dB

•GSM1800/1900: 0.5+-0.1 dB

•WCDMA/WLAN: 0.6+-0.1dB

Service concepts

POS (Point of Sale) flash concept

Figure 2 POS flash concept

Type Description

Product specific tools

SD-77 Care dummy battery

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Type Description

Other tools

FLS-5 POS flash dongle

PC with Phoenix service software

Cables

CA-101 Micro USB cable

BB5 USB only – Basic flash concept L3

Figure 3 BB5 USB only – Basic flash concept L3

Type Description

Product specific devices

SD-77 Care dummy battery

Other devices

PK-1 SW security device

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Type Description

PC with Phoenix service software

Cables

CA-101 Micro USB cable

Level 3 concept for flashing, certificate restore and product code change option 3

Figure 4 Level 3 concept for flashing, certificate restore and product code change

Type Description

Product specific devices

SD-77 Care dummy battery

Other devices

CA-146C Power conversion adapter

FPS-21 Flash prommer box

AC-35 Power supply

PK-1 SW security device

SX-4 Smart card (for DCT-4 generation mobile device programming)

PC with Phoenix service software

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Type Description

Cables

CA-101 Micro USB cable

CA-89DS Service cable

BB5 MJ-300 universal module jig concept

Figure 5 BB5 MJ-300 universal module jig concept

Type Description

Product specific tools

MJ-300 Module jig

Other tools

FPS-21 Flash prommer box

PK-1 SW security device

SX-4 Smart card

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Type Description

PC with service software

Cables

CA-101 Micro USB cable

CA-89DS Service cable

CA-99PS Adapter

PCS-1 Power cable

USB cable

BB5 Extended MJ-300 universal module jig concept

Figure 6 BB5 Extended MJ-300 universal module jig concept

Type Description

Phone specific devices

MJ-300 Module jig

Other devices

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Type Description

CU-4 Control unit

SS-227 CU-4 interface part

FPS-21 Flash prommer box

PK-1 SW security device

SX-4 Smart card

PC with service software

Measurement equipment

Cables

CA-101 Micro USB cable

PCS-1 DC power cable

XRS-6 RF cable

USB cable

GPIB control cable

CA-128RS Product specific RF adapter cable

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Bluetooth testing concept with SB-6

Figure 7 Bluetooth testing concept with SB-6

Type Description

Product specific devices

BP-4L Battery

Other devices

PK-1 SW security device

SX-4 Smart card

SB-6 Bluetooth test and interface box

Smart card reader

PC with Phoenix service software

Cables

CA-101 Micro USB cable

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WLAN functionality testing concept with SB-7

Figure 8 WLAN functionality testing concept with SB-7

Type Description

Product specific tools

BP-4L Battery

Other tools

SX-4 Smart card

PK-1 SW Security device

Note: PK-1 can be used instead of PKD-1.

Cables

CA-101 Micro USB cable

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3 — BB Troubleshooting and

Manual Tuning Guide

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 3 – 1

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Table of Contents

Baseband main troubleshooting......................................................................................................................... 3–5

Power and charging troubleshooting................................................................................................................. 3–9

Backup battery troubleshooting..................................................................................................................... 3–9

Battery current measuring fault troubleshooting ..................................................................................... 3–10

General power checking troubleshooting .................................................................................................. 3–11

Dead or jammed device troubleshooting................................................................................................... 3–11

Dynamo charging troubleshooting ............................................................................................................. 3–13

Clocking troubleshooting ............................................................................................................................. 3–14

USB charging troubleshooting..................................................................................................................... 3–15

Interface troubleshooting ................................................................................................................................. 3–16

USB data interface troubleshooting............................................................................................................ 3–16

SIM card troubleshooting ............................................................................................................................. 3–17

MicroSD card troubleshooting...................................................................................................................... 3–19

IVE troubleshooting ........................................................................................................................................... 3–19

Introduction to IVE troubleshooting........................................................................................................... 3–19

IVE troubleshooting ...................................................................................................................................... 3–21

TV out troubleshooting...................................................................................................................................... 3–22

Introduction to SDTV troubleshooting........................................................................................................ 3–22

SDTV out troubleshooting ............................................................................................................................ 3–23

Display module troubleshooting ...................................................................................................................... 3–25

General instructions for display troubleshooting...................................................................................... 3–25

Introduction to display troubleshooting.................................................................................................... 3–26

Display fault troubleshooting ...................................................................................................................... 3–27

Touch panel troubleshooting....................................................................................................................... 3–27

Illumination troubleshooting ...................................................................................................................... 3–29

Charging illumination troubleshooting................................................................................................. 3–29

Menu key backlight troubleshooting ..................................................................................................... 3–29

Keyboard troubleshooting ................................................................................................................................ 3–31

Keys troubleshooting.................................................................................................................................... 3–31

Power key troubleshooting.......................................................................................................................... 3–31

Sensors troubleshooting ................................................................................................................................... 3–32

Accelerometer troubleshooting................................................................................................................... 3–32

Magnetometer troubleshooting.................................................................................................................. 3–33

Proximity sensor troubleshooting............................................................................................................... 3–34

Audio troubleshooting....................................................................................................................................... 3–34

Audio troubleshooting test instructions..................................................................................................... 3–34

External earpiece troubleshooting.............................................................................................................. 3–36

External microphone troubleshooting........................................................................................................ 3–37

Internal earpiece troubleshooting .............................................................................................................. 3–37

Internal handsfree (IHF) troubleshooting................................................................................................... 3–40

Internal microphone troubleshooting........................................................................................................ 3–40

Vibra troubleshooting................................................................................................................................... 3–41

ALS technical description and troubleshooting .............................................................................................. 3–42

Dipro ALS function......................................................................................................................................... 3–42

Re-tuning ALS................................................................................................................................................. 3–43

Bluetooth and FM radio troubleshooting ........................................................................................................ 3–43

Introduction to Bluetooth/FM radio troubleshooting............................................................................... 3–43

Bluetooth BER test......................................................................................................................................... 3–45

Bluetooth and FM radio self tests in Phoenix............................................................................................. 3–46

Bluetooth troubleshooting .......................................................................................................................... 3–47

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FM radio troubleshooting............................................................................................................................. 3–47

FM radio testing............................................................................................................................................. 3–49

GPS troubleshooting .......................................................................................................................................... 3–49

GPS layout and basic test points.................................................................................................................. 3–49

GPS settings for Phoenix............................................................................................................................... 3–49

Quick Test window................................................................................................................................... 3–49

GPS control................................................................................................................................................ 3–50

GPS troubleshooting ..................................................................................................................................... 3–52

WLAN troubleshooting....................................................................................................................................... 3–52

WLAN functional description........................................................................................................................ 3–52

WLAN settings for Phoenix........................................................................................................................... 3–53

WLAN functional tests................................................................................................................................... 3–54

WLAN auto tuning......................................................................................................................................... 3–57

WLAN troubleshooting ................................................................................................................................. 3–58

Baseband manual tuning guide........................................................................................................................ 3–59

Certificate restoring ...................................................................................................................................... 3–59

Product code change .................................................................................................................................... 3–62

Energy management calibration................................................................................................................. 3–66

List of Tables

Table 6 Display module troubleshooting cases............................................................................................... 3–25

Table 7 Pixel defects .......................................................................................................................................... 3–25

Table 8 Defects table.......................................................................................................................................... 3–26

Table 9 Calibration value limits ........................................................................................................................ 3–67

List of Figures

Figure 9 SIM power-on sequence on X2700. Sequence is first done at 1.8V and then changed to 3.0V....

3–18

Figure 10 Expected Crystal clock input to BCM2727B on Oscilloscope.......................................................... 3–21

Figure 11 Expected SDTV CVBS PAL signal on Oscilloscope............................................................................. 3–24

Figure 12 Expected SDTV CVBS NTSC signal on Oscilloscope........................................................................... 3–24

Figure 13 Phoenix audio sweep ....................................................................................................................... 3–38

Figure 14 Earpiece audio signals ...................................................................................................................... 3–38

Figure 15 VDigiMic audioclk .............................................................................................................................. 3–41

Figure 16 Vibra drive.......................................................................................................................................... 3–42

Figure 17 Bluetooth/WLAN antenna ................................................................................................................ 3–43

Figure 18 Bluetooth and FM radio self tests in Phoenix................................................................................. 3–46

Figure 19 GPS Quick Test window .................................................................................................................... 3–50

Figure 20 GPS Control dialogue box ................................................................................................................. 3–51

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Baseband main troubleshooting

Context

Always start the troubleshooting procedure by running the Phoenix self tests. If a test fails, please follow the

diagrams below. If the phone is dead and you cannot perform the self tests, go to

Dead or jammed device

troubleshooting

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Troubleshooting flow — Page 1 of 3

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Troubleshooting flow — Page 2 of 3

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Troubleshooting flow — Page 3 of 3

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Power and charging troubleshooting

Backup battery troubleshooting

Troubleshooting flow

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Battery current measuring fault troubleshooting

Troubleshooting flow

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General power checking troubleshooting

Troubleshooting flow

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Dead or jammed device troubleshooting

Troubleshooting flow

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Dynamo charging troubleshooting

Troubleshooting flow

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Clocking troubleshooting

Troubleshooting flow

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USB charging troubleshooting

Troubleshooting flow

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Interface troubleshooting

USB data interface troubleshooting

Troubleshooting flow

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SIM card troubleshooting

Troubleshooting flow

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Figure 9 SIM power-on sequence on X2700. Sequence is first done at 1.8V and then changed to 3.0V.

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MicroSD card troubleshooting

Troubleshooting flow

IVE troubleshooting

Introduction to IVE troubleshooting

The IVE engine is a next generation imaging and video engine based on BCM2727B. The BCM2727B acts as

imaging, video, display, and HDTV and SDTV hardware accelerator.

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The following references on the PWB help in the effective debugging and troubleshooting of IVE.

Sr. No Reference Description

1 B1400 19.2MHz Crystal

2 D1400 IVE/BCM2727B IC

The following test points on the PWB help in the effective debugging and troubleshooting.

Sr. No Signal name Measuring point Description

1 VIVE_2V5_FILT C1417 2.5V supply to BCM2727B

2 VIVE_2V8_FILT C1414 2.8V supply to BCM2727B

3 VIVE_1V8_FILT C1406 1.8V supply to BCM2727B

4 VBAT L1407 VBAT supply to BCM2727B

5 RUN J1413 Enable signal to IVE. This needs to be

High for IVE to be Up.

6 XIN C1448 19.2MHz clock to IVE

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IVE troubleshooting

Troubleshooting flow

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Figure 10 Expected Crystal clock input to BCM2727B on Oscilloscope

TV out troubleshooting

Introduction to SDTV troubleshooting

SDTV

The phone has SDTV capability. The phone can be connected to an analog TV through a TV Out cable.

The following references on the PWB help in the effective debugging and troubleshooting of SDTV Out.

Sr. No Reference Description

1 R1419 DAC termination resistor. Resistor value 15 OHMS.

2 D1400 BCM2727B IC

3 N2001 Analog switch

4 L2001 Ferrite bead on the CVBS signal

5 Gold pads E2002 through

E2007

AV connector

The following test points on the PWB help in the effective debugging and troubleshooting.

Sr No Signal name Measuring point Description

1 CVBS Gold pad E2003 SDTV signal

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SDTV out troubleshooting

Troubleshooting flow

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Figure 11 Expected SDTV CVBS PAL signal on Oscilloscope

Figure 12 Expected SDTV CVBS NTSC signal on Oscilloscope

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Display module troubleshooting

General instructions for display troubleshooting

The first step is to verify with a working display that the fault is not on the display module itself. The display

module cannot be repaired.

The second step is to check that the engine is working normally. This can be done by connecting the phone

to a docking station and starting Phoenix service software. With the help of Phoenix read the phone

information to check that also the application engine is functioning normally (you should be able to read the

APE ID).

After these checks proceed to the display troubleshooting flowcharts. Use the Display Test tool in Phoenix to

find the detailed fault mode.

Pixel defects

Table 6 Display module troubleshooting cases

Display blank There is no image on the display. The display looks

the same when the phone is on as it does when the

phone is off. The backlight can be on in some cases.

Image on the display not correct Image on the display can be corrupted or a part of

the image can be missing. If a part of the image is

missing, change the display module. If the image is

otherwise corrupted, follow the appropriate

troubleshooting diagram.

Backlight dim or not working at all Backlight LED components are inside the display

module. Backlight failure can also be in the

connector or in the backlight power source in the

main engine of the phone. Backlight is also

controlled automatically by the ambient light

sensor.

This means that in case the display is working

(image OK), the backlight is faulty.

Visual defects (pixel) Pixel defects can be checked by controlling the

display with Phoenix. Use both colours, black and

white, on a full screen.

The display may have some random pixel defects

that are acceptable for this type of display. The

criteria when pixel defects are regarded as a display

failure, resulting in a replacement of the display, are

presented the following table.

Table 7 Pixel defects

Bright sub-pixels (sometimes called on-pixels or stuck-on) are

characterized by the appearance of bright/colored

pixels in, for example, black full screen picture.

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Dark sub-pixels (sometimes called off-pixels, stuck-off, or black

pixels) are characterized by the appearance of dark

pixels in white, red, green, or blue full-screen

picture.

Combined sub-pixel defects are characterized by at least two sub-pixels

defects (bright or dim) being closer than 5 mm to

each other.

Temporal sub-pixels (sometimes called blinking defects) exhibit

temporal variations not related to any steady-state

video input. Temporal sub-pixel defects may be

intermittent, exhibit a sudden change of state, or

be flickering.

Table 8 Defects table

Item Bright dot (sub-

pixel) defect Dark dot (sub-

pixel) defect Total

1Defect counts Not allowed

2 Combined sub-

pixel defect

Not allowed

3 Temporal sub-

pixel defect

Not allowed

Note: Blinking pixels are not allowed in normal operating temperatures and light conditions.

Introduction to display troubleshooting

The display module is a 640 X 480 VGA colour LCD known as 'Batura.' It connects to the main engine by a

multi-way ZIF connector. The locking lever mechanism on this connector must be carefully lifted up before

removing the LCD flexi.

The following references on the PWB help in the effective debugging and troubleshooting of the display.

Sr No Reference Description

1 X2450 Display connector

2 D1400 BCM2727B IC

The following test points on the PWB help in the effective debugging and troubleshooting.

Sr. No Signal name Measuring point Description

1 VIO L2473 1.8V supply to display

2 VAUX1 L2472 2.78V supply to display

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Display fault troubleshooting

Troubleshooting flow

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Touch panel troubleshooting

Troubleshooting flow

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Illumination troubleshooting

Charging illumination troubleshooting

Troubleshooting flow

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Menu key backlight troubleshooting

Troubleshooting flow

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Keyboard troubleshooting

Keys troubleshooting

Troubleshooting flow

Power key troubleshooting

The power key has a 10K pull-up resistor to VBAT and is normally high. A low level voltage should happen

when the key is pressed, and if this is long enough, the phone should turn ON if it is OFF and OFF if it is ON.

Check for mechanical damage to the outer button, stuck or misplaced gaskets, broken switch, liquid

contamination or broken solder pads or joints. Repair if possible.

Electrical tests, measure:

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•With switch open, you should measure VBAT at both ends of R2400.

•With switch closed, you should measure VBAT at top end of R2400 and 0V at switch end of R2400.

Component check and consider replacement of:

•V2400 for short circuit.

•R2400 for open circuit.

•S2401 for short circuit.

•N2200 main power ASIC may be broken.

Sensors troubleshooting

Accelerometer troubleshooting

Troubleshooting flow

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Magnetometer troubleshooting

Troubleshooting flow

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Proximity sensor troubleshooting

Troubleshooting flow

Audio troubleshooting

Audio troubleshooting test instructions

Single-ended external earpiece and differential internal earpiece outputs can be measured either with a

single-ended or a differential probe.

When measuring with a single-ended probe each output is measured against the ground.

Internal handsfree output is measured using a current probe, if a special low-pass filter designed for

measuring a digital amplifier is not available. Note also that when using a current probe, the input signal

frequency must be set to 2 kHz.

The input signal for each loop test can be either single-ended or differential. Exception to this is a digital

microphone which needs input signal from an external sound source (laptop speaker) to playback, eg. 1 kHz

sine wave from 5 cm distance.

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Required equipment

The following equipment is needed for the tests:

•Oscilloscope

•Function generator (sine waveform)

•Current probe (Internal handsfree DPMA output measurement)

•Phoenix service software

•Battery voltage 3.7V

•Sound source (laptop speaker or B&K type 4231 calibrator)

Test procedure

Audio can be tested using the Phoenix audio routings option. Three different audio loop paths can be

activated:

•External headset mic to earpiece

•External headset mic to IHF mono

•Internal digital microphone to headset

Each audio loop sets routing from the specified input to the specified output enabling a quick in-out test.

Loop path gains are fixed and they cannot be changed using Phoenix. Correct pins and signals for each test

are presented in the following table.

Phoenix audio loop tests and test results

The results presented in the table apply when no accessory is connected and battery voltage is set to 3.7V.

Earpiece, internal microphone and speaker are in place during measurement. Applying a headset accessory

during measurement causes a significant drop in measured quantities.

The gain values presented in the table apply for a differential output vs. single-ended/differential input.

Loop test Input

terminal Output

terminal Path gain

[dB]

(fixed)

Input

voltage

[mVp-p]

Output DC

level [V] Output

voltage

[mVp-p]

External

headset

mic to

earpiece

HS_MIC &

GND

J2101 0 300 1.35 300

J2100

External

headset

mic to IHF

mono

HS_MIC &

GND

L2158 10 200 630

L2159

Internal

digital

micropho

ne to

headset

Acoustica

l Input,

1kHz sine

wave

E2006 NA 94 dBSPL 70

E2007

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External earpiece troubleshooting

Troubleshooting flow

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External microphone troubleshooting

Troubleshooting flow

Internal earpiece troubleshooting

Check for obvious blocked holes, magnetic filings or debris jamming the earpiece, broken gauze, misplaced

gaskets, dirty contacts. Clean, fix or replace if required.

Electrical tests using the Phoenix audio sweep, measure:

•D.C. voltage plus audio at J2100

•Same D.C. voltage plus inverse audio at J2101

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Figure 13 Phoenix audio sweep

Figure 14 Earpiece audio signals

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Component check and consider replacement of:

•Earpiece transducer

•Gold Pads J2100 and J2101 maybe worn

•L2103 maybe open circuit

•L2104 maybe open circuit

•N2200 audio ASIC may be broken

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Internal handsfree (IHF) troubleshooting

Troubleshooting flow

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Internal microphone troubleshooting

Check for mechanical contamination in the microphone holes, misplaced gaskets, misplaced gauze, liquid

damage.

Perform DigiMic Self Test.

Electrical tests using audio clip record application, measure:

•1.8V on VDigiMic on C2115

•DigiMicClk on J2856

(There is no test access to DigimicData)

Figure 15 VDigiMic audioclk

Component check and consider replacement of:

•C2115 microphone VDigiMic supply decoupling maybe short

•C2850 microphone clock filter maybe short circuit

•B2100 main microphone maybe broken (no audio or intermittant audio)

•B2104 noise cancelling microphone maybe broken (poor audio or strange fault report)

•N2200 audio asic

•D2800 main BB asic

Vibra troubleshooting

Check for mechanical jamming by foreign object, sticky vibra shaft or obvious damage.

Electrical tests using normal touchscreen haptics screenpress operation, ensure the option is activated and

measure:

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•Drive signals on + and - side of vibra

•Drive signals on other side of L2105, L2106

Figure 16 Vibra drive

Component check and consider replacement of:

•M2100 vibra motor

•C2108 maybe short

•C2109 maybe short

•C2110 maybe short

•L2105 maybe short

•L2106 maybe short

•N2200 audio asic

Tip: Dilbert vibra drive signals are generated in N2200, so there is no point replacing D2800 to try

to fix a vibra fault.

ALS technical description and troubleshooting

Dipro ALS function

The automatic light sensor and proximity sensor functions are combined in N1100, "Dipro".

The ALS is used to change the brightness of the display and LED lighting. The proximity sensor picks up

reflected short pulses of infra-red light from LED V1100 and is used to turn the display off when in-call to

save power.

Check for the display changing brightness in different lighting, with the phone user setting adjusted

appropriately.

Perform Dipro Self Test.

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Check for misplaced gaskets, mechanical contamination, obvious window problems.

Electrical tests, measure:

•VBAT at C1100

•VAUX2 2.8V at C1101

•ALS related I2C traffic when light level changes at R2850 and R2851

•VIO on supply side of R2850 and R2851

Component check and consider replacement of:

•C1100 VAUX2 decoupler maybe short

•N1100 Dipro device

Tip: You can check for IR LED stuck "ON" by viewing the IR LED with a normal phone digital camera.

Re-tuning ALS

There is no need to re-tune ALS, since ALS default value will be written the first time the phone boots up.

Bluetooth and FM radio troubleshooting

Introduction to Bluetooth/FM radio troubleshooting

Bluetooth/WLAN antenna

The BT RF signal is routed from BTFMRDS2.2 through the WLAN module to the shared WLAN/BT antenna in

the phone's B-cover. Check the antenna pin contacts with Bluetooth/WLAN antenna.

Figure 17 Bluetooth/WLAN antenna

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Introduction to Bluetooth/FM radio troubleshooting

The Bluetooth and FM radio are combined in the same ASIC, so both features are checked when

troubleshooting.

The following problems can occur with the Bluetooth and FM radio hardware:

Symptom Problem Repair solution

Unable to switch on Bluetooth on

phone user interface

Open circuit solder joints or

component failure of BTH/FM

ASIC/module BB ASICs or SMD

components

Replacement of Bluetooth/

FM ASIC/module

Able to send data file to another

Bluetooth device, but unable to

hear audio through functional

Bluetooth headset

Open circuit solder joints or

component failure of BTH/FM

ASIC/module BB ASICs

Replacement of Bluetooth/

FM ASIC/module

Able to switch on Bluetooth on

phone user interface, but unable

to detect other Bluetooth devices

Open circuit solder joints or

antenna pins not making

contact with Bluetooth/WLAN

antenna

Repair or replace Bluetooth/

WLAN antenna

Able to turn on FM radio and

Bluetooth on phone user

interface, but unable to detect

local FM radio stations with Nokia

headset inserted

Open circuit solder joints or

detached component in FM

antenna circuit

Check antenna pin contacts with

Bluetooth/WLAN antenna

Repair components or

replace Bluetooth/WLAN

antenna module

Able to perform scans to detect

local FM radio stations with

functional Nokia headset

inserted, but unable to hear FM

audio through headset

Open circuit solder joints or

detached component in FM

audio path between Bluetooth/

FM ASIC and headset

Repair of FM audio circuit

Users may experience the following problems resulting in functional phones being returned to the repair

centre:

Symptom Problem Repair solution

Bluetooth feature does not

operate as desired with another

Bluetooth device

Bluetooth Profile implemented

in Bluetooth accessory not

supported in Nokia phone

Use Bluetooth accessory with

Bluetooth profiles supported

by phone

Poor FM radio reception (unable

to detect many radio stations)

Nokia headset not being used Use Nokia headset

Test coverage

The tests listed in the table below should be performed to verify whether the Bluetooth and FM receiver and

transmitter are functional. The use of Self Tests are described in section

BT and FM Self Tests in Phoenix

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Test Test Coverage Repair solution

Blueooth Self Test: ST_LPRF_IF_TEST Bluetooth-FM ASIC UART interface

(controls Bluetooth and FM

receiver and transmitter)

Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

Bluetooth Self Test:

ST_BT_WAKEUP_TEST

Bluetooth ASIC interrupt control

interface

Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

Bluetooth Self Test:

ST_LPRF_AUDIO_LINES_TEST

Bluetooth ASIC PCM interface Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

Bluetooth Functional Test: BER test

with BT-Box or functional test with

other Bluetooth device

Bluetooth antenna circuit Repair of Bluetooth antenna

circuit (including RF filter or

WLAN switch if fitted)

FM Radio Self Test: ST_RADIO_TEST FM Radio I2C interface Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

FM Radio Functional Test: Perform

scan for local radio stations and

check station list displayed on

phone

FM receiver antenna circuit Repair of FM antenna circuit

(between BTHFM ASIC and

headset connector)

FM Radio Functional Test: Listen to

local radio station

FM receiver audio circuit Repair of FM receiver audio

circuit (between BTHFM ASIC

and headset connector)

The self tests run from Phoenix software are used for fault diagnosis.

If Phoenix software is not available the functional tests with phone accessories are sufficient to verify the

functionality Bluetooth and FM radio receiver and transmitter.

Bluetooth/FM radio component layout and test points

The Bluetooth antenna is product specific (antenna integrated into phone B cover). On phones with WLAN,

the Bluetooth RF signal is routed through a WLAN front-end module and a shared Bluetooth / WLAN antenna

is used. The FM RF signal is routed through a product specific FM antenna matching circuit to the phone

headset connector. The FM radio audio signal is routed to the headset connector through the BB ASIC shared

by the phone audio functions.

Bluetooth BER test

Prerequisites

JBT-9, or SB-6 Bluetooth test box (BT-box) is required to perform a BER test. If a BT-box not available Bluetooth

functionality can be checked by transferring a file to another Bluetooth phone.

Steps

1. Connect data cable to phone.

2. Start

Phoenix

service software.

3. Choose File → Scan Product.

4. Choose Testing → Bluetooth LOCALS .

5. Locate the BT-box serial number (12 digits) found in the type label on the back of the JBT-9, or SB-6

Bluetooth test box.

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6. In the Bluetooth

LOCALS

window, write the 12-digit serial number on the

Counterpart BT Device

Address

line.

7. Place the BT-box near (within 10 cm) of the phone and click Start BER Test.

Bluetooth and FM radio self tests in Phoenix

Prerequisites

A flash adapter (or phone data cable) connected to a PC with Phoenix service software is required.

Steps

1. Place the phone in the flash adapter or connect data cable to phone.

2. Start

Phoenix

service software.

3. Choose File → Scan Product.

4. From the Mode drop-down menu, set mode to Local.

5. Choose Testing → Self Tests.

6. In the

Self Tests

window check the following Bluetooth and FM radio related tests:

•ST_LPRF_IF_TEST

•ST_LPRF_AUDIO_LINES_TEST

•ST_BT_WAKEUP_TEST

•ST_RADIO_TEST

7. To run the tests, click Start.

Figure 18 Bluetooth and FM radio self tests in

Phoenix

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Bluetooth troubleshooting

Troubleshooting flow

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FM radio troubleshooting

Troubleshooting flow

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FM radio testing

Steps

1. Set signal generator parameters:

•FM modulation on

•Frequency 100MHz

•FM deviation 22kHz

•Modulation frequency 1kHz

•RF level should be varied during the test to obtain good audio signal quality

•Connect suitable antenna to signal generator

Note: You may alternatively use a known good FM radio broadcast as a test signal.

2. Attach the Nokia headset to the phone’s AV connector.

3. Use Scroll button to autotune to the radio frequency.

4. Set volume to suitable level.

5. Check audio quality with a headset.

GPS troubleshooting

GPS layout and basic test points

The GPS components are located on the bottom side of the PWB. The GPS chip and associated components

are in a can which does not have a removable lid. Satellite signals are picked up by the GPS antenna in the

B-cover. The signal is then routed through a diplexer and then a filter before being processed by the GPS5350

receiver ASIC.

GPS settings for Phoenix

Quick Test window

This test will perform 3 tests in one: Self test, Oscillator Test and CW Test and will provide a Pass/Fail Response

for each. The HW Self Test confirms basic communication with the GPS ASIC. The oscillator test confirms the

frequency accuracy of the GPS TCXO against the Ref_Clk. The CW Test confirms end-to-end connectivity

between the GPS antenna and the GPS ASIC. It also contains a receive button.

Before this test is performed a known good phone should be tested in order to calibrate the setup. The signal

level of the Signal Generator should be adjusted so a reading of SNR 35 dB is achieved with the reference

unit. A good starting point is to set up the signal generator to -50 dBm.

These checks are part of

GPS failure troubleshooting

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Figure 19 GPS Quick Test window

GPS control

Prerequisites

A flash adapter with RF coupler connected to a PC with Phoenix service software is required. The GPS signal

should be connected to the RF coupler. Calibrate the signal level with a known good phone. Signal level will

be high (approx -45dBm) because it is a leakage connection.

Context

Use the following to test GPS using Phoenix.

Steps

1. Place phone to Flash Adaptor.

2. Start Phoenix service software.

3. From the File menu, select Scan Product and check that the correct product version is displayed.

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4. From the Testing menu, select GPS Control. This opens up

GPS Control

dialogue box, as shown in the

figure below, and enables the GPS.

Figure 20 GPS Control dialogue box

Select Idle to confirm the GPS is enabled and is in idle mode; at this point all clocks should be present,

GPS_En_Reset & SleepX should be high, and Vdd_Dig, Vcc_TCXO & Vcc_PLL/VCO will be present.

Receiver On turns on all RF sections of the ASIC and so all LDOs will be on.

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GPS troubleshooting

Troubleshooting flow

WLAN troubleshooting

WLAN functional description

The Bob 1.0 module is a combined device with WLAN and Bluetooth functionality. It has a single antenna

connection and uses the CWS antenna through a diplexer. The Bob software is downloaded from the host

engine when the phone is powered on through the dedicated SPI interface. The Bob 38.4MHz clock is supplied

from the Linko engine.

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WLAN settings for Phoenix

Use the following to test WLAN using Phoenix:

1 Set phone into Local Mode .

2 From the File menu, select Scan Product and check that the correct product version is displayed

3 From the Testing menu, select Self Test. This opens up a Self Test dialogue box, as shown below.

Select the ST_WLAN_TEST check box as shown and then select Start button. The test turns on the WLAN, sets

up the SPI interface and then downloads the WLAN firmware into the WLAN module. During the download

the WLAN acknowledges the data blocks and so the self test is a good way to confirm that the WLAN module

is communicating with the Host. The result column will change to Passed after a few seconds if operating

properly.

In addition, a test of the Bluetooth interface can be done by selecting the ST_BT_WAKEUP_TEST. This test

verifies the interface to Bluetooth.

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In summary these two Self tests provide a simple means of ensuring the Host engine is able to communicate

with the WLAN module and check the interface to BTH. More detailed WLAN performance test is covered in

WLAN functional test section.

WLAN functional tests

On/Off test

Prerequisites

A flash adapter connected to a PC with Phoenix service software is required.

From the testing toolbar select WLAN Configuration option. This opens the WLAN configuration dialogue

box below. Selecting the Power state option button (as indicated), the WLAN can be turned ON and OFF:

1 With Power State set to OFF, measure the dc power supply current consumption of the flash adaptor.

2 Next return the Power state to ON and re-measure the dc power supply current of the flash adaptor.

The difference between the currents in (1) and (2) should be between 190 to 220mA. When WLAN is ON, the

firmware has been downloaded and the WLAN module is in the receive state. When OFF WLAN is powered

down.

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TX tests

Prerequisites

From the testing toolbar select WLAN Tx Test option shown below. This test can be used to verify TX

configuration and functionality. The default settings are sufficient for testing the TX operation, although

other channels and data rates are equally suitable. To start the test, select the Start option button:

1 Monitor the WLAN TX spectrum on a Spectrum analyser. (When making a radiated test ensure that other

WLAN devices are not transmitting as these may be detected as well, confusing the result). A typical

11MBPS TX spectrum is shown in figure below.

2 To finish the test select the Finish option button.

The difference between the two readings should be approximately 150mA and measures the transmit current

in 11MBPS, 802.11b mode of operation.

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RX Tests

Prerequisites

There are different options available for testing the Rx path. The simplest is to use the WLAN to report Rx

packets when operating in an area where there is an active WLAN network. Simply starting an Rx test will

show the number of packets detected by the WLAN module as it monitors the network. However, it does

require a properly configured WLAN network.

From the testing toolbar select WLAN Rx Test option shown below. This test can be used to verify Rx

configuration and functionality.

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To start the test, select the Start option button.

As the WLAN monitors an active WLAN network, the Rx test results window will update and show the number

of Frames received, as well as the Packer error rate.

Monitoring the detected frames is a simple method to verify the WLAN antenna and receiver path is working

properly.

WLAN auto tuning

In case of WLAN ASIC change, RF power auto tuning is needed. Connect WLAN RF test connector to CMU200

input using proper RF cable. Start Phoenix WLAN autotune window. Check the settings and verify your PC

communicates with CMU200 via GBIP.

Auto tuning procedure

1 Open the Tuning → WLAN_TX_TUNING menu and click Start Power Calibration.

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2 To save the tune data, open the Extended Tuning menu and click Write.

WLAN troubleshooting

Troubleshooting flow

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Baseband manual tuning guide

Certificate restoring

Context

This procedure is performed when the device certificate is corrupted for some reason.

All tunings (RF & Baseband, UI) must be done after performing the certificate restoring procedure.

Required equipment and setup:

•Latest

Phoenix

service software.

•“Tucson add on” package if one has been released between complete Phoenix releases

•FPS-10 or 21 Flash prommer updated with latest flash update package.

•Latest product specific data package, supporting for the variants you want to change the phones to.

Certificate restoring without flashing does not require data packages to be installed

•SX-4 or SX-4T Smart Card, which has been registered for Tucson use in Nokia Online Security Device Master,

and for which local Nokia Care has granted Tucson user rights

•BB 5.0 models:SS-46 with phone specific flash adapter connected to flash prommer

•DCT-4 models:JBV-1 with phone specific flash adapter connected to flash prommer

•Active online connection to internet, please refer to Technical Bulletins for IP addresses

Connection to Tucson online server:

•All requests are handled online. That means a permanent Internet connection is required. Previously used

e-mail based system is no longer in use.

•Phoenix, when contacting Tucson server, is using IP address, 147.243.3.169 port 443

Terms in Tucson:

•When certificate restoring for BB 5 products or IMEI rebuild for DCT-4 products is performed, existing data

from Nokia System is programmed in the phone. The phone will be in the same condition as it was when

it left the factory for the first time.

•If “Product Code Change” has been SUCCESSFULLY performed with Tucson after the phone left the factory,

it will be restored back to the variant it was made into during Product Code change event.

•It is recommended to perform “Restore” function without selecting “Flash Product” – option to avoid

possible SW downgrade which causes the phone to die.

The procedure for certificate restoring is the following:

Steps

1. Connect phone and scan product, read phone information to check communication with phone.

2. Open

Tools

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3. Provide Tucson password and PIN code which have been delivered to you by email. Please note that

characters are case sensitive.

4. Select OK, Phoenix will read product information from phone.

5. Product code shown on the UI does not matter, because during restoring it will be replaced by the product

code which is the latest one stored in Nokia system.

6. It is recommended to perform "Restore"-function without selecting "Flash Product"-option to avoid

possible SW downgrade which causes the phone to die.

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7. Information from phone and Smart Card are read and connection to Tucson server is established.

8. Information from Nokia system is retreived and programmed in the phone.

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9. After programming, confirmation about successful event is sent to Nokia system.

Next actions

After a successful rewrite, you must retune the phone completely by using

Phoenix

tuning functions.

Important: Perform all tunings: RF, BB, and UI.

Product code change

Context

•When Product Code change with Tucson is successfully performed, phone variant will be changed. Data

for the new variant is extracted from Nokia System, and programmed in the phone.

•After successful change, phone specific information in Nokia systems will match the new variant, and it

can be used for e.g. certificate restoring. If you perform several product code changes, Nokia system will

always be up to date with the latest successful event.

•Failed / incomplete actions will not change the phone specific information in Nokia systems.

•This function can be performed with or without flashing the phone with correct software, selection can

be made by checking / unchecking the tick box on Phoenix UI.

The procedure for product code change is the following:

Steps

1. Connect phone and scan product, read phone information to check communication with phone

2. Open

Tools

Product Code Change

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3. Provide Tucson password and PIN code which have been delivered to you by email. Please note that

characters are case sensitive.

4. Select product code of new variant from list. If the product code you want is not shown, please install

correct data package including the variant.

5. Select “OK” and “SWAP”.

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6. Information from phone is read and connection to Tucson server is established.

7. If “Flash Product” – option was selected, phone SW is programmed.

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8. New data retrieved from Nokia system is programmed in the phone.

9. Confirmation about successful event is sent to Nokia system.

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10. Phone has now been changed to another variant. If there is need to restore the data, this information

will be sent back to phone. Warranty information in NOL will show the current information in about 24

hours.

Energy management calibration

Prerequisites

Energy Management (EM) calibration is performed to calibrate the setting (gain and offset) of AD converters

in several channels (that is, battery voltage, BSI, battery current) to get an accurate AD conversion result.

Hardware setup:

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•An external power supply is needed.

•Supply 12V DC from an external power supply to CU-4 to power up the phone.

•The phone must be connected to a CU-4 control unit with a product-specific flash adapter.

Steps

1. Place the phone to the docking station adapter (CU-4 is connected to the adapter).

2. Start

Phoenix

service software.

3. Choose File → Scan Product.

4. Choose Tuning → Energy Management Calibration.

5. To show the current values in the phone memory, click Read, and check that communication between

the phone and CU-4 works.

6. Check that the CU-4 used check box is checked.

7. Select the item(s) to be calibrated.

Note: ADC calibration has to be performed before other item(s). However, if all calibrations are

selected at the same time, there is no need to perform the ADC calibration first.

8. Click Calibrate.

The calibration of the selected item(s) is carried out automatically.

The candidates for the new calibration values are shown in the

Calculated values

column. If the new

calibration values seem to be acceptable (please refer to the following "Calibration value limits" table),

click Write to store the new calibration values to the phone permanent memory.

Table 9 Calibration value limits

Parameter Min. Max.

ADC Offset -30 +40

ADC Gain 12000 14000

BSI Gain 1100 1350

VBAT Offset 2635 2755

VBAT Gain 14900 15900

VCHAR Gain N/A N/A

IBAT (ICal) Gain 7750 12250

9. Click Read, and confirm that the new calibration values are stored in the phone memory correctly. If the

values are not stored to the phone memory, click Write and/or repeat the procedure again.

10. To end the procedure, close the

Energy Management Calibration

window.

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4 — Cellular RF

troubleshooting

Nokia Customer Care

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Table of Contents

General instructions for cellular RF troubleshooting......................................................................................... 4–5

Cellular RF key components.................................................................................................................................. 4–6

Cellular RF main troubleshooting ........................................................................................................................ 4–7

Cellular RF main troubleshooting................................................................................................................... 4–7

Self test troubleshooting.............................................................................................................................. 4–10

Troubleshooting with RF Self tests......................................................................................................... 4–10

RF-BB interface self test troubleshooting.............................................................................................. 4–11

RF supply self test troubleshooting........................................................................................................ 4–12

VBAT level.................................................................................................................................................. 4–13

VXO level.................................................................................................................................................... 4–15

VIO level..................................................................................................................................................... 4–15

VREF level .................................................................................................................................................. 4–16

VHIA (Vhi) level ......................................................................................................................................... 4–17

VDCDCA (Vlow) level ................................................................................................................................. 4–18

VPA level.................................................................................................................................................... 4–18

RF tuning and testing ........................................................................................................................................ 4–20

RF auto tuning and testing with Nokia Care Suite..................................................................................... 4–20

RF auto tuning procedure ............................................................................................................................ 4–20

Automatic RF testing with Nokia Care Suite............................................................................................... 4–25

Troubleshooting with Testing And Tuning Tool ........................................................................................ 4–26

Manual transmitter (TX) testing with Phoenix........................................................................................... 4–29

General instructions for transmitter (TX) activation ............................................................................ 4–29

GSM transmitter activation...................................................................................................................... 4–29

WCDMA transmitter activation................................................................................................................ 4–32

Manual receiver (RX) testing with Phoenix ................................................................................................ 4–33

General instructions for manual receiver testing................................................................................. 4–33

GSM RX chain activation for manual measurements/GSM RSSI measurement .................................. 4–34

WCDMA RX chain activation for manual measurement........................................................................ 4–34

WCDMA RSSI measurement ..................................................................................................................... 4–35

Antenna............................................................................................................................................................... 4–36

Antenna overview ......................................................................................................................................... 4–36

Main antenna functionality.......................................................................................................................... 4–36

Antenna troubleshooting............................................................................................................................. 4–36

List of Figures

Figure 21 Linko shields......................................................................................................................................... 4–7

Figure 22 Antenna contacts .............................................................................................................................. 4–36

Figure 23 Antennas ............................................................................................................................................ 4–37

Figure 24 B-cover................................................................................................................................................ 4–37

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General instructions for cellular RF troubleshooting

Most RF semiconductors are static sensitive

ESD protection must be applied during repair (ground straps and ESD soldering irons).

Measuring equipment

All measurements should be done using:

•An oscilloscope for low frequency and DC measurements. Recommended probe: 10:1, 10 Mohm//8 pF.

•Willtek 440x/3100, Rohde & Schwarz CMU-200 or CMW-500 radio communication tester.

Note: A mobile phone WCDMA transmitter should never be tested with full TX power (permitted

only if measurements and tests are performed in an RF-shielded environment). Even low power

WCDMA transmitters may disturb nearby WCDMA networks and cause problems to 3G cellular

communication in a wide area.

Note: All measurements with an RF coupler should be performed in an RF-shielded environment

because nearby base stations can disturb sensitive receiver measurements. If there is no possibility

to use an RF-shielded environment, testing at frequencies of nearby base stations should be avoided.

Note: All communication test set screen dumps are from CMU-200. Other testers are different.

RF auto tune

Cellular RF parameters should always be re-tuned by means of Testing and Tuning Tool if one or more of the

RF components have been changed or memory (D3000) is corrupted.

RF shield cans

Once a peel-off type RF shield can is opened, a repair lid (Nokia code 9501325) should always be installed.

RF shielding does not work at all if RF shield cans are left open.

Level of repair

The scope of this guideline is to verify functionality of the cellular RF block as well as possible without

removing RF shields.

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Cellular RF key components

Linko RF has the following key components:

•Älli N7512 (Transceiver RF ASIC)

•Aura N7509 (RF power management ASIC)

•UKKO N7510 (Power amplifier, PA)

•QuBBE Z7513 (Front end module)

Linko RF has separate RF shielding cans for:

•Älli N7512 + surroundings (Shield C)

•QuBBE Z7513 + Ukko PA N7510 (Shield B)

•Aura N7509 + surroundings (Shield A)

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Figure 21 Linko shields

RF shield A is peel-off type and can be opened for repair purposes. The other two RF shield cans (B and C) are

solid and should not be opened in service centers.

The maximum height of the shields is 1.70 mm.

Cellular RF main troubleshooting

Context

Always start the cellular RF related troubleshooting procedure by following the diagram below.

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Troubleshooting flow — Page 1 of 2

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Troubleshooting flow — Page 2 of 2

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Self test troubleshooting

Troubleshooting with RF Self tests

Context

ÄLLI (N7512) RF ASIC contains test structures that can be used to detect certain RF related errors. In order to

use these self tests the most efficient way, it is very important that the tests are performed in a certain order,

or at least that the error data is analyzed in this order. The tests are designed so that by going through them

in this order it is easy to find the problem component without any redundant checks. The flowcharts

presented in this document are based on that idea.

The testing order recommended and used in this troubleshooting guide is the following:

1 ST_CDSP_RF_BB_IF test (ID hex. 56)

•Tests the functionality of the BB/Linko serial interface & reset lines.

•If this test fails, it means that there is a problem in programming of the N7512 and all of the following

tests cannot give correct data.

2 ST_CDSP_RF_SUPPLY_TEST (ID hex. 53)

•Tests the functionality of N7512 bias block, regulators, reference voltage line and supply connections,

as well as almost all Aura (N7509) regulator voltages..

•If this test fails, all other N7512 tests can/will fail.

3 ST_CDSP_DIGI_RXTX_IF_TEST (ID hex. 7D)

•Test checks that the digital RX and TX lines between BB and N7512 are properly connected.

4 ST_CDSP_STROBE_TEST (ID hex. 7C)

•Tests the functionality of the RFStrobe signal..

5 ST_CDSP_PA_ID_PIN_TEST (ID hex. 7F)

•The purpose of this test is to identify the PAs of the different vendors.

•Tests also the functionality of the temperature sensor V7502.

6 ST_CDSP_TX_WCDMA_POWER_TEST (ID hex. 4B)

•Tests the basic functionality of the WCDMA transmitter.

To get the best out of these instructions you need to have the valid schematics at hand.

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Troubleshooting flow

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RF-BB interface self test troubleshooting

Troubleshooting flow

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RF supply self test troubleshooting

Troubleshooting flow

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VBAT level

Check the VBAT level at the L7504. The level should be the same as the battery voltage and always on.

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VXO level

Check the VXO level (2.5V) at C2222. The signal is always on when the phone is in local mode.

VIO level

Check the VIO level (1.8V) at C2806. The signal is always on when the phone is in local mode.

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VREF level

Check the Vref level (1.2 V) at C7529.

The GSM or WCDMA transmitter (or receiver) has to be activated before the Vref supply voltage can be

measured. Follow the instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → GSM

transmitter activation' or 'WCDMA transmitter activation'.

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VHIA (Vhi) level

Check the VHIA level (2.6 V) at L7509.

The GSM or WCDMA transmitter (or receiver) has to be activated before the VPA supply voltage can be

measured. Follow the instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → GSM

transmitter activation' or 'WCDMA transmitter activation'.

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VDCDCA (Vlow) level

Check the VDCDCA level (1.5 V) at C7528.

The WCDMA transmitter has to be activated before the VDCDCA supply voltage can be measured. Follow the

instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → 'WCDMA transmitter activation'.

Note: The VDCDCA signal is continuously on when WCDMA TX is activated.

VPA level

The GSM or WCDMA transmitter has to be activated before the VPA supply voltage can be measured. Follow

the instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → GSM transmitter activation'

or 'WCDMA transmitter activation'.

Check the VPA voltage level at C7514.

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In WCDMA mode, the voltage levels should be:

•0.4…0.8 V @ Start level 0 dBm

•0.8…1.3 V @ Start level 10 dBm

•3.0…4.2 V @ Start level 24 dBm

In GSM mode, the voltage levels should be:

•0.1…0.5 V @ GSM 900 & Tx Power Level 19

•0.5…1.1 V @ GSM 900 & Tx Power Level 12

•3.5…4.3 V @ GSM 900 & Tx Power Level 5

Note: The VPA signal is continuously on when WCDMA TX is activated, but has a pulsed nature in

GSM TX mode (the signal is on only when a GSM TX burst is transmitted).

Note: The VPA signal is not tested by ST_CDSP_RF_SUPPLY_TEST.

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RF tuning and testing

RF auto tuning and testing with Nokia Care Suite

Introduction to cellular RF tunings

RM-609 cellular RF engine has been tuned correctly in production. There is no reason to do re-calibration

unless one or more of the RF components are changed or memory (D3000) is corrupted.

RM-609 can be tuned automatically. Auto tuning is designed to align the phone's RF part easily and faster. It

performs calibrations, tunings and measurements of RX and TX. The results are displayed and logged in a

result file, if initiated.

Note: Always perform RF tuning with the help of the module jig MJ-300, never with RF couplers.

Using an RF coupler in the tuning phase will cause a complete mistuning of the RF part.

Important: After RF component changes, always perform cellular RF auto tuning.

Cable and adapter losses

RF cables and adapters have some losses. They have to be taken into account when the phone is tuned. As

all the RF losses are frequency dependent, the user has to act very carefully and understand the measurement

setup. For RF attenuations of the CA-128RS RF cable, please refer to section 'Service Tools and Service

Concepts'.

Hardware set up

For hardware requirements for auto tuning, please refer to

BB5 Extended MJ-300 Universal Module Jig

concept

in section 'Service Tools and Service Concepts'.

Nokia Care Suite preparations

Install Testing And Tuning Tool add-on application to Nokia Care Suite. Automatic RF testing and tuning is

not possible without this application. There is no more support in Phoenix to auto tune RM-609 product.

Install the phone specific data package, for example

Nokia_firmware_RM-609_EUROPE_10.014_v41.0.exe

. This

defines phone specific settings.

RF auto tuning procedure

Note: If RF splitter is in use, skip steps 10, 11 and 12.

1 Make sure the phone (in the module jig) is connected to the PC.

2Connect the RF cable between the phone (low band antenna connector) and the communication tester.

If an RF splitter is in use, connect both low and high band antenna cables.

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3 Start

Nokia Care Suite

application. The following window opens:

Note: The window appearance may differ depending on the

Nokia Care Suite

version.

Note:

Fuse, Multi Software Updater, Product Support Tool For Store

and

Testing And Tuning Tool

are Care Suite add-on applications. The list is different if there are different add-on applications

installed.

4 To open the application, double-click Testing And Tuning Tool icon.

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5 If the application is able to find a connected phone, the following view will open:

Note: The window appearance may differ depending on the

Nokia Care Suite

and

Testing And Tuning

Tool

versions

6 Click on the RF Tuning button. The following view opens:

Note: The window appearance may differ depending on the

Nokia Care Suite

and

Testing And Tuning

Tool

versions

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7 Select Cellular RF Tunings and Tests from the drop-down menu.

8 Select the RF cable used (and possible RF splitter / RF shield box) from the drop-down menu. CA-128RS

attenuation values are always taken automatically into account when RM-609 product is connected to

Nokia Care Suite

tool.

9 Click the Run button.

Note: The window appearance may differ depending on the

Nokia Care Suite

and

Testing And Tuning

Tool

versions

10 If no critical errors happen during the low band RF tuning procedure, the following window will pop up:

11 Change the CA-128RS cable to the high band RF connector on the phone PWB.

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12 Click OK and RF tunings will automatically be performed for high cellular bands.

13 RF tunings will be ready when all the tunings and measurements are green in the tool window and no

errors occur.

14 If errors do happen, failed tuning/testing steps are marked with a red color and more detailed results

are shown on the screen. An example fail case is shown below:

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Note: The window appearance may differ depending on the

Nokia Care Suite

and

Testing And Tuning

Tool

versions

Automatic RF testing with Nokia Care Suite

Testing And Tuning Tool

add-on application can be used also for non-signalling RF tests. The automatic RF

testing procedure is the same as explained in the chapter

RF auto tuning procedure

, but RF Testing should

be selected in the

Testing And Tuning Tool

main window instead of RF Tuning .

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Note: The window appearance may differ depending on the

Nokia Care Suite

and

Testing And Tuning

Tool

versions.

RF Testing selection does all the same measurements as RF Tuning , but does not perform any tunings.

RF Testing

is a safe way to check the basic cellular RF performance of the phone. The following test cases will

be performed (the complete set of measurements may differ depending on the data package content):

•GSM SNR

•GSM RSSI

•GSM / EDGE TX Power Level

•GSM Modulation & Switching spectrum

•GSM EDGE EVM

•GSM Burst Template

•GSM Phase Error

•WCDMA RSSI

•WCDMA SNR

•WCDMA TX Power Range

•WCDMA TX Max Output Power

•WCDMA ACP

•WCDMA EVM

Troubleshooting with Testing And Tuning Tool

Context

If limit fails occur while RF tests are performed with Testing And Tuning Tool, the user has to be very careful

to understand the measurement results. Fails may occur because of many reasons:

1 RF attenuation between the phone and the communication tester is something else as expected by the

Testing And Tuning Tool

. Please check that cable, splitter and shield box selections are correct in the

Testing And Tuning Tool

main window.

2 Test limits (specified in the product specific data package) are quite tight. Small limit violations do not

always mean that the tested product is broken, but the RF performance may not be as good as it should

be.

3 RX measurements (RSSI, SNR) may fail because of strong signals from base stations nearby. It is

recommended to always perform RF measurements in an RF-shielded environment (in an RF-shield box

or room).

4 The phone is really broken and needs more specific troubleshooting. Typical for these cases is that

Testing

gives measurement results which are far from the test limits.

Note: Start the more specific troubleshooting always from the chapter

Cellular RF main

troubleshooting

. The troubleshooting flow below may be misleading if followed without upper level

instructions.

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Troubleshooting flow — Page 1 of 3

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Troubleshooting flow — Page 2 of 3

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Troubleshooting flow — Page 3 of 3

Manual transmitter (TX) testing with Phoenix

General instructions for transmitter (TX) activation

Please note the following before performing transmitter tests:

•TX troubleshooting requires TX operation

•Do not transmit on frequencies that are in use

•The transmitter can be controlled in local mode for diagnostic purposes

•The most useful Phoenix tool for GSM transmitter testing is “RF Controls”, in WCDMA transmitter testing

the best tool is “TX Control”

Note: Never activate the GSM or WCDMA transmitter without a proper antenna load. Always connect

a 50 Ω load to the RF connector (antenna, RF measurement equipment or at least a 2 W dummy

load), otherwise the power amplifier (PA) may be damaged.

GSM transmitter activation

Steps

1. Set the phone to local mode.

2. Activate the RF controls tool in Phoenix ( Testing → GSM → RF Controls ).

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3. Make settings as shown in the figure:

4. GSM transmitter is activated when Active Unit is set to “Tx”. Aura (N7509) supply voltages are on for

measurement purposes after this step is completed.

Optional step (not needed if GSM TX activation only required):

Check the basic TX parameters (i.e. power,

phase error, modulation and switching spectrum) manually, using a communication analyzer (for example

CMU–200). Change power level (in “RF Controls” tool) and make sure the power reading follows

accordingly.

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WCDMA transmitter activation

Steps

1. Set the phone to local mode.

2. In Phoenix, select Testing → WCDMA → TX Control .

3. Select Algorithm mode tab.

4. In the TX Control window, make settings as in the figure:

5. Click Send to enable the settings and activate TX. If settings are changed (e.g. new channel or power level),

you have to click RF Stop and Send again. Aura (N7509) supply voltages are on for measurement purposes

after this step is completed.

Optional step (not needed if WCDMA TX activation only required):

Check the basic TX parameters using a

communication analyzer (for example CMU–200).

Note: RM-609 WCDMA TX power classes: WCDMA I, IV, V and VIII class 3 (maximum output power

+24 dBm), WCDMA II class 4 (maximum output power +21 dBm).

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Manual receiver (RX) testing with Phoenix

General instructions for manual receiver testing

RX can be tested manually by making a phone call or in local mode. For the local mode testing, use Phoenix

service software.

The most important RX measurement in local mode is RSSI reading. This test measures the signal strength

of the received signal. For GSM RSSI measurements, see chapter

GSM RX chain activation for manual

measurements/GSM RSSI measurement

. For a similar test in WCDMA mode, see chapter

WCDMA RSSI

measurement

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GSM RX chain activation for manual measurements/GSM RSSI measurement

Prerequisites

Connect a signal generator to a proper RF connector on the phone PWB (note: there are two antenna

connectors for cellular RF on the phone PWB, one for low bands and one for high bands).

Steps

1. Set the phone to local mode.

2. Activate GSM RSSI reading in Phoenix ( Testing → GSM → RSSI Reading )

3. Use the following frequrencies and RF levels in RF generator for different GSM bands:

Setting GSM850 GSM900 GSM1800 GSM1900

Phoenix:

Monitor

Channel

190 37 700 661

RF frequency 881.6 MHz 942.4 MHz 1842.8 MHz 1960.0 MHz

Signal generator

frequency

881.66771 MHz 942.46771 MHz 1842.86771 MHz 1960.06771 MHz

Signal generator

RF level (CW

signal)

-60dBm -60dBm -60dBm -60dBm

Results

The

RSSI level

reading should reflect the level of the signal generator (- losses) +/- 5 dB.

When varying the level in the range of -30 to -102 dBm, the reading should follow within +/-5 dB.

WCDMA RX chain activation for manual measurement

Steps

1. Set the phone to local mode.

2. Activate

RX Control

tool in Phoenix (Testing —> WCDMA —> RX Control) .

3. In the RX Control window, make the following settings:

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4. Click Start to activate the WCDMA RX. If the settings are changed later on (for example, change of channel)

you have to click Stop and Start again.

Note: Channels for testing: WCDMA I 10700, II 9800, IV 1637, V 4408, VIII 3012.

Note: Clicking Stop also disables TX control if it was active.

WCDMA RSSI measurement

Prerequisites

WCDMA RX must be activated before RSSI can be measured. For instructions, please refer to chapter

WCDMA

RX chain activation for manual measurement

. Connect a signal generator to a proper RF connector on the

phone PWB (note: there are two antenna connectors for cellular RF on the phone PWB, one for low bands

and one for high bands).

Steps

1. Use the following frequencies and RF levels in RF generator for different WCDMA bands:

Setting WCDMA I WCDMA II WCDMA IV WCDMA V WCDMA VIII

Phoenix:

Channel

10700 9800 1637 4408 3012

RX frequency 2140.0 MHz 1960.0 MHz 2132.4 MHz 881.6 MHz 942.4 MHz

Signal generator

frequency

2141.0 MHz 1961.0 MHz 2133.4 MHz 882.6 MHz 943.4 MHz

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Setting WCDMA I WCDMA II WCDMA IV WCDMA V WCDMA VIII

Signal generator

RF level (CW

signal)

-48 dBm -48 dBm -48 dBm -48 dBm -48 dBm

2. Activate WCDMA RSSI reading in Phoenix (Testing —> WCDMA —> Rx Power Measurement) .

3. In the Rx Power Measurement window, make the following settings:

4. Click Start to perform the measurement.

Results

The

Result

reading should reflect the level of the signal generator (- losses) +/- 5 dB.

When varying the level in the range of -40 to -100 dB, the reading should follow within +/- 5 dB.

Note: In some versions of the Phoenix service tool, the

WCDMA Rx Power Measurement

tool does

not work as it should. In these cases, the result is something really small (for example -8387684.9).

Antenna

Antenna overview

The phone has two antennas on the B-cover, the main antenna and a GPS/WLAN/BT antenna.

The main antenna covers the GSM and WCDMA bands and has separate antenna feeds for low and high band.

Connection is implemented by C-clips (3pcs). The main antenna is attached to the bottom of the B-cover with

adhesive.

GPS & BT/WLAN are diplexed to the same antenna. Feeding is made by two C-clips.

Main antenna functionality

The main antenna is functioning normally when the feeds and GND pads take proper contact to the contact

springs on the PWB.

The main antenna functionality must also be checked by measuring the transmitted power with RF coupler

at GSM900 channel 124.

Antenna troubleshooting

Antenna contacts, visual check

The main cellular antenna has two feeds and one ground pad. Check that all the clips take proper contact to

the pads on the PWB.

Check that the BT/WLAN and GPS antenna pads take proper contact to the C-clips on the PWB and the C-clips

are clearly open.

Figure 22 Antenna contacts

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Figure 23 Antennas

Figure 24 B-cover

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5 — Camera Module

Troubleshooting

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 5 – 1

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Camera Module Troubleshooting

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Table of Contents

Introduction to camera module troubleshooting ............................................................................................. 5–5

The effect of image taking conditions on image quality.................................................................................. 5–6

Image quality analysis ...................................................................................................................................... 5–10

Possible faults in image quality................................................................................................................... 5–10

Testing for dust in camera module ............................................................................................................. 5–10

Testing camera image sharpness................................................................................................................ 5–11

Effects of dirty or defective camera lens protection window................................................................... 5–11

Faulty pixels in images ................................................................................................................................. 5–13

Flash photography problems....................................................................................................................... 5–14

Main (back) camera troubleshooting flowcharts............................................................................................ 5–15

No recognizable viewfinder image ............................................................................................................. 5–15

Bad image quality troubleshooting ............................................................................................................ 5–16

Main camera troubleshooting...................................................................................................................... 5–17

Secondary camera troubleshooting ................................................................................................................. 5–18

Flash troubleshooting........................................................................................................................................ 5–20

List of Figures

Figure 25 Blurring caused by shaking hands ..................................................................................................... 5–6

Figure 26 Near objects get skewed when taking images from a moving vehicle.......................................... 5–7

Figure 27 Noisy image taken in +70 degrees Celsius ........................................................................................ 5–7

Figure 28 Image taken against light................................................................................................................... 5–8

Figure 29 Flicker in an image; object illuminated by strong fluorescent light............................................... 5–8

Figure 30 A lens reflection effect caused by sunshine....................................................................................... 5–9

Figure 31 Good image taken indoors.................................................................................................................. 5–9

Figure 32 Good image taken outdoors ............................................................................................................... 5–9

Figure 33 Effects of dust on optical path ......................................................................................................... 5–10

Figure 34 Image taken with clear protection window .................................................................................. 5–12

Figure 35 Image taken with greasy protection window ............................................................................... 5–12

Figure 36 Image of point light sources taken with a clean protective window.......................................... 5–13

Figure 37 Image of point light sources taken with a dirty (finger print) protective window ................... 5–13

Figure 38 Enlargement of a hot pixel............................................................................................................... 5–14

Figure 39 Light from the flash has reflected on particles in front of the camera ....................................... 5–14

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Introduction to camera module troubleshooting

Background, tools and terminology

Faults or complaints in camera operation can be roughly categorised into three subgroups:

1 Camera is not functional at all; no image can be taken.

2 Images can be taken but there is nothing recognizable in them.

3 Images can be taken and they are recognizable but for some reason the quality of images is seriously

degraded, or customer complains about image quality.

Image quality is very hard to measure quantitatively, and even comparative measurements are difficult

(comparing two images) to do, if the difference is small. Especially if the user is not satisfied with his/her

device's image quality, and tells, for example, that the images are not sharp, it is fairly difficult to accurately

test the device and get an exact figure which would tell whether the device is functioning properly.

Often subjective evaluation has to be used for finding out if a certain property of the camera is acceptable

or not. Some training or experience of a correctly operating reference device may be needed in order to

detect what actually is wrong, or is there anything wrong at all.

It is easy for the user to take bad images in bad conditions. Therefore the camera operation has to be checked

always in constant conditions (lighting, temperature) or by using a second, known-to-be good device as

reference. Experience helps significantly in analysing image quality.

Terms

Digital zoom Digital zoom is done by first cropping the image by the zoom ratio and

then upscaling it to the output resolution. This will decrease the image

quality especially with high zoom ratios.

Dynamic range Camera's ability to capture details in dark and bright areas of the scene

simultaneously.

Exposure time Camera modules use silicon sensor to collect light and for forming an

image. The imaging process roughly corresponds to traditional film

photography, in which exposure time means the time during which the

film is exposed to light coming through optics. Increasing the time will

allow for more light hitting the film and thus results in brighter image. The

operation principle is exactly the same with silicon sensor, but the shutter

functionality is handled electronically i.e. there is no mechanical moving

parts like in film cameras.

Flicker Phenomenon, which is caused by pulsating in scene lighting, typically

appearing as wide horizontal stripes in an image.

Noise Variation of response between pixels with same level of input illumination.

Resolution Usually the amount of pixels in the camera sensor. In some occasions the

term resolution is used for describing the sharpness of the images.

Sensitivity Camera module's sensitivity to light. In equivalent illumination conditions,

a less sensitive camera needs a longer exposure time to gather enough

light in forming a good image. Analogous to ISO speed in photographic

film.

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Sharpness Good quality images are 'sharp' or 'crisp', meaning that image details are

well visible in the picture. However, certain issues, such as non-idealities

in optics, cause image blurring, making objects in picture to appear 'soft'.

Each camera type typically has its own level of performance.

The effect of image taking conditions on image quality

There are some factors, which may cause poor image quality, if not taken into account by the end user when

shooting images, and thus may result in complaints. The items listed are normal to camera operation and

are not a reason for changing the camera module.

The amount of light available

In dim conditions camera runs out of sensitivity. The exposure time is long (especially in the night mode)

and the risk of getting shaken (= blurred) images increases. In addition, image noise level grows. The

maximum exposure time in the night mode is ¼ seconds. Therefore, images need to be taken with extreme

care and by supporting the phone when the amount of light reflected from the target is low. Because of the

longer exposure time and larger gain value, noise level increases in low light conditions. Sometimes blurring

may even occur in daytime, if the image is taken very carelessly. See the figure below for an example. This

is normal; do not change the camera module.

Figure 25 Blurring caused by shaking hands

Movement in bright light

If an image is taken of moving objects or if the device is used in a moving vehicle, object 'skewing' or 'tilting'

may occur. This phenomenon is fundamental to most CMOS camera types, and may happen when using the

electronic shutter. The movement of camera or object sometimes cause blurring indoors or in dim lighting

conditions because of long exposure time. This is normal; do not change the camera module.

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Figure 26 Near objects get skewed when taking images from a moving vehicle

Temperature

High temperatures inside the mobile phone cause more noise to appear in images. For example, in +70

degrees (Celsius), the noise level may be very high, and it further grows if the conditions are dim. If the phone

processor has been heavily loaded for a long time before taking an image, the phone might have considerably

higher temperature inside than in the surrounding environment. This is also normal to camera operation;

do not change the camera module.

Figure 27 Noisy image taken in +70 degrees Celsius

Phone display

If the display contrast is set too dark, the image quality degrades: the images may be very dark depending

on the setting. If the display contrast is set too bright, image contrast appears bad and "faint". This problem

is solved by setting the display contrast correctly. This is normal behaviour; do not change the camera module.

Basic rules of photography (especially shooting against light)

Because of dynamic range limitations, taking images against bright light might cause either saturated image

or the actual target appear too dark. In practice, this means that when taking an image indoors and having,

for example, a window behind the object, the result is usually poor. This is normal behaviour; do not change

the camera module.

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Figure 28 Image taken against light

Flicker

In some occasions a bright fluorescent light may cause flicker in the viewfinder and captured image. This

phenomenon may also be a result, if images are taken indoors under the mismatch of 50/60 Hz electricity

network frequency. The electricity frequency used is automatically detected by the camera module. In some

very few countries, both 50 and 60 Hz networks are present and thus probability for the phenomenon

increases. Flickering occurs also under high artificial illumination level. Flickering only occurs when the rolling

shutter is used. This is normal behaviour; do not change the camera module.

Figure 29 Flicker in an image; object illuminated by strong fluorescent light

Bright light outside of image view

Especially the sun can cause clearly visible lens glare phenomenon and poor contrast in images. This happens

because of undesired reflections inside the camera optics. Generally this kind of reflections are common in

all optical systems. This is normal behaviour; do not change the camera module.

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Figure 30 A lens reflection effect caused by sunshine

Examples of good quality images

Figure 31 Good image taken indoors

Figure 32 Good image taken outdoors

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Image quality analysis

Possible faults in image quality

When checking for possible errors in camera functionality, knowing what error is suspected significantly

helps the testing by narrowing down the amount of test cases. The following types of image quality problems

may be expected to appear:

•Dust (black spots)

•Lack of sharpness

•Bit errors

In addition, there are many other kinds of possibilities for bad image quality, but those are ruled out from

the scope of this document since the probability of their appearance is small.

Testing for dust in camera module

Symptoms and diagnosis

For detecting these kinds of problems, take an image of a uniform white surface and analyse it in full

resolution. A good quality PC monitor is preferred for analysis. Search carefully, since finding these defects

is not always easy. Figure "Effects of dust on optical path" is an example image containing easily detectable

dust problems.

When taking a white image, use uniformly lightened white paper or white wall. One possibility is to use

uniform light but in this case make sure that the camera image is not flickering when taking the test image.

In case flickering happens, try to reduce illumination level. Use JPEG image format for analysing, and set the

image quality parameter to ‘High Quality’.

Black spots in an image are caused by dirt particles trapped inside the optical system. Clearly visible and

sharp edged black dots in an image are typically dust particles on the image sensor. These spots are searched

for in the manufacturing phase, but it is possible that the camera body cavity contains a particle, which may

move onto the image sensor active surface, for example, when the phone is dropped. Thus it is also possible

that the problem will disappear before the phone is brought to service. The camera should be replaced if the

problem is present when the service technician analyses the phone.

If a dust particle is lying on the infrared filter surface on either side, they are hard to locate because they are

out of focus, and appear in the image as large, grayish and fading-edge 'blobs'. Sometimes they are invisible

to the eye, and thus the user probably does not notice them at all. However, it is possible that a larger particle

disturbs the user, causing need for service.

Figure 33 Effects of dust on optical path

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If large dust particles get trapped on top of the lens surface in the cavity between camera window and lens,

they will cause image blurring and poor contrast. The dust gasket between the window and lens should

prevent any particles from getting into the cavity after the manufacturing phase.

If dust particles are found on the sensor, this is classified as a manufacturing error of the module and the

camera should be replaced. Any particles inside the cavity between the protection window and lens have

most probably been trapped there in the assembly phase at a Nokia factory. Unauthorized disassembling of

the product can also be the root of the problem. However, in most cases it should be possible to remove the

particle(s) by using clean compressed air. Never wipe the lens surface before trying compressed air; the

possibility of damaging the lens is substantial. Always check the image sharpness after removing dust.

Testing camera image sharpness

Symptoms and diagnosis

If pictures taken with a device are claimed to be blurry, there are four possible sources for the problem:

1 The protection window is fingerprinted, soiled, dirty, visibly scratched or broken.

2 User has tried to take pictures in too dark conditions and images are blurred due to handshake or

movement. This is not a cause to replace camera module.

3 There is dirt between the protection window and the camera lens.

4The protection window is defective. This can be either a manufacturing failure or caused by the user. The

window should be changed.

A quantitative analysis of sharpness is very difficult to conduct in any other environment than optics

laboratory. Therefore, subjective analysis should be used.

If no visible defects (items 1-4) are found, a couple of test images should be taken. Generally, a well-

illuminated typical indoor scene, such as the one in Figure "Good image taken indoors", can be used as a

target. The main considerations are:

•The protection window has to be clean.

•The amount of light (300 – 600 lux (bright office lighting)) is sufficient.

•The scene should contain, for example, small objects for checking sharpness. Their distance should be 1

– 2 meters.

•If possible, compare the image to another image of the same scene, taken with a different device. Note

that the reference device has to be a similar Nokia phone.

The taken images should be analysed on PC screen at 100% scaling simultaneously with a reference image.

Pay attention to the computer display settings; at least 65000 colors (16 bit) have to be used. 256 (8-bit)

color setting is not sufficient; true color (24 bit, 16 million colors) or 32 bit (full color) setting is recommended.

If the differences are noticeable at a glance and also if the one under investigation is significantly inferior,

the module might have a faulty lens. In this case, the module should be changed. Always re-check the

resolution after changing the camera module. If a different module produces a clearly noticeable quality gap,

the fault is probably in the camera window. Check the window by looking carefully through it when replacing

the module. As references Figure "Good image taken indoors" and Figure "Good image taken outdoors" can

be used. Another possibility is to use a service point comparison phone, if available.

Effects of dirty or defective camera lens protection window

The following series of images demonstrates the effects of fingerprints on the camera protection window.

Note: The effects of any dirt in images can vary very much; it may be difficult to judge if the window

has been dirty when some image has been taken or if something else has been wrong. That is why

the cleanness of the protection window should always be checked and the window should be wiped

clean with a suitable cloth.

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Figure 34 Image taken with clear protection window

Figure 35 Image taken with greasy protection window

Bright point light sources might cause images that have flares around the light source if the protection

window is dirty. A smeared fingerprint may be hard to see on the protective window but if will affect the

image quality. These flares can be avoided by cleaning the window with a suitable cloth.

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Figure 36 Image of point light sources taken with a clean protective window

Figure 37 Image of point light sources taken with a dirty (finger print) protective window

Faulty pixels in images

Faulty pixels are pixels that do not respond to light in the same way as the pixels around them. There are

three main types of faulty pixels, dead, stuck and hot pixels.

Dead pixels are always black or significantly darker than their surrounding. Dead pixels appear as black spots

in all lightning conditions. Camera modules producing images with dead pixels that are clearly noticeable

should be replaced.

If the pixel remains always saturated to its maximum value it is stuck. Stuck pixels may appear as red, green,

blue or white spots in all lightning conditions. Camera modules producing images with one or more stuck

pixels should be replaced.

Hot pixels are pixels that easily saturate in dim light conditions. It is normal to get a lot of noise and hot

pixels in night conditions or otherwise dark conditions. The hot pixels should disappear when the ambient

light is increased, but may still appear in darker areas of an otherwise well illuminated scene.

When examining an image for defect pixels, test images should be viewed as 100% enlargements on a PC

monitor.

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Figure 38 Enlargement of a hot pixel

Flash photography problems

Use of flash device may affect the image in many ways.

•White balance errors. The image may get a wrong tone due to mixing of flash colour temperature and

ambient lightning. This is unwanted but normal feature.

•Dust reflections. Dust or water drops in front of the flash unit may reflect strongly to the camera sensor.

See the following figure.

Figure 39 Light from the flash has reflected on particles in front of the camera

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Main (back) camera troubleshooting flowcharts

No recognizable viewfinder image

Troubleshooting flow

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Bad image quality troubleshooting

Troubleshooting flow

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Main camera troubleshooting

Context

The following references on the PWB help in the effective debugging and troubleshooting of the main/

primary camera.

Sr. No Reference Description

1 X1400 Primary camera socket

2 R1477, R1478 Pull-up resistors on primary camera I2C lines. Resistor value 4.7

KOHMS.

3 D1400 BCM2727B IC

4 N1515 VCAM_1V8 regulator

5 N1517 VCAM_2V8 regulator

The following test points on the PWB help in the effective debugging and troubleshooting.

Sr. No Signal name Measuring point Description

1 VCAM_1V8 L1515/C1516 1.8V supply to primary camera

2 VCAM_2V8 C1520 2.8V supply to primary camera

3 VDIG_ENABLE J1515 Enable signal for VCAM_1V8 regulator. This

signal needs to be High for the regulator to

be On.

4 VANA_ENABLE J1516 Enable signal for VCAM_2V8 regulator. This

signal needs to be High for the regulator to

be On.

5 PRI_CAM_CLK R1430/C1471 External clock signal to primary camera

6 PRI_CAM_I2C(1:0) R1477, R1478 I2C signals for primary camera

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Troubleshooting flow

Secondary camera troubleshooting

Context

The following references on the PWB help in the effective debugging and troubleshooting of the secondary

camera.

Sr. No Reference Description

1 H1450 Secondary camera on UI flex

2 R1487, R1488 Pull-up resistors on the secondary camera I2C lines. Resistor value

4.7 KOHMS.

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Sr. No Reference Description

3 D1400 BCM2727B IC

4 N1515 VCAM_1V8 regulator

5 N1517 VCAM_2V8 regulator

The following test points on the PWB help in the effective debugging and troubleshooting.

Sr. No Signal name Measuring point Description

1 VCAM_1V8 L1515/C1516 1.8V supply to secondary camera

2 VCAM_2V8 C1520 2.8V supply to secondary camera

3 VDIG_ENABLE J1515 Enable signal for VCAM_1V8 regulator. This signal

needs to be High for the regulator to be On.

4 VANA_ENABLE J1516 Enable signal for VCAM_2V8 regulator. This signal

needs to be High for the regulator to be On.

5 SEC_CAM_CLK R1429/C1470 External clock signal to secondary camera

6 SEC_CAM_I2C(1:0) R1487, R1488 I2C signals for secondary camera

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Troubleshooting flow

Flash troubleshooting

Context

The following references on the PWB help in the effective debugging and troubleshooting of the flash.

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Sr. No Reference Description

1 N1400 Flash driver

2 X1412/X1411 Two pogo pins for flash PWB

3 D1400 BCM2727B IC

The following test points on the PWB help in the effective debugging and troubleshooting of the flash.

Sr. No Signal name Measuring point Description

1 VBAT L1408/L1409 VBAT supply to flash driver

2 FLASH_TRIGGER J1425 Flash trigger signal

3 FLASH_ENABLE J1499 Flash enable signal

4 TORCH_EN J1498 Torch mode enable signal

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Troubleshooting flow

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6 — System Module

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 6 – 1

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Table of Contents

Introduction........................................................................................................................................................... 6–5

Phone description ............................................................................................................................................ 6–5

Energy management.......................................................................................................................................... 6–11

Battery and charging .................................................................................................................................... 6–11

Normal and extreme voltages ..................................................................................................................... 6–11

Power key and system power up ................................................................................................................ 6–12

Modes of operation....................................................................................................................................... 6–12

Power distribution........................................................................................................................................ 6–13

Clocking scheme............................................................................................................................................ 6–13

SIM interface ....................................................................................................................................................... 6–15

Device memory................................................................................................................................................... 6–16

BOB1.0M-b module............................................................................................................................................. 6–16

GPS interface....................................................................................................................................................... 6–18

USB....................................................................................................................................................................... 6–19

USB interface.................................................................................................................................................. 6–19

MicroUSB connector ...................................................................................................................................... 6–19

Charger interface................................................................................................................................................ 6–20

User interface...................................................................................................................................................... 6–20

Touch module................................................................................................................................................ 6–20

Proximity sensor and ambient light sensor ............................................................................................... 6–20

Imaging and video........................................................................................................................................ 6–21

Multimedia application processor.......................................................................................................... 6–21

Display module......................................................................................................................................... 6–22

TV-out interface........................................................................................................................................ 6–22

Cameras..................................................................................................................................................... 6–23

Illumination ................................................................................................................................................... 6–24

Keyboard interface........................................................................................................................................ 6–25

Accelerometer................................................................................................................................................ 6–26

Magnetometer............................................................................................................................................... 6–26

Audio concept..................................................................................................................................................... 6–27

Audio HW architecture.................................................................................................................................. 6–27

Internal earpiece........................................................................................................................................... 6–29

Internal handsfree (IHF) speakers ............................................................................................................... 6–29

Internal microphones ................................................................................................................................... 6–29

External earpiece and microphone ............................................................................................................. 6–30

Vibra ............................................................................................................................................................... 6–30

AV connector.................................................................................................................................................. 6–30

Cellular RF technical description....................................................................................................................... 6–31

RF block .......................................................................................................................................................... 6–31

QuBBE ............................................................................................................................................................. 6–31

Receiver (RX).................................................................................................................................................. 6–32

Synthesizer..................................................................................................................................................... 6–32

Transmitter (TX) ............................................................................................................................................ 6–32

Frequency mappings.......................................................................................................................................... 6–34

GSM850 frequencies...................................................................................................................................... 6–34

EGSM900 frequencies.................................................................................................................................... 6–34

GSM1800 frequencies.................................................................................................................................... 6–35

GSM1900 frequencies.................................................................................................................................... 6–37

WCDMA I (2100) Rx frequencies ................................................................................................................... 6–38

WCDMA I (2100) Tx frequencies ................................................................................................................... 6–39

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WCDMA II (1900) frequencies....................................................................................................................... 6–40

WCDMA IV (1700/2100) frequencies............................................................................................................ 6–41

WCDMA V (850) frequencies ......................................................................................................................... 6–42

WCDMA VIII (900) frequencies...................................................................................................................... 6–43

List of Tables

Table 10 Nominal voltages................................................................................................................................ 6–11

List of Figures

Figure 40 Battery pin order............................................................................................................................... 6–11

Figure 41 Blade battery connector ................................................................................................................... 6–11

Figure 42 SIM interface ...................................................................................................................................... 6–15

Figure 43 Puzzle SIM connector circuitry ........................................................................................................ 6–16

Figure 44 BOB1.0M-b module block diagram and application circuit........................................................... 6–17

Figure 45 BOB1.0M-b interface ......................................................................................................................... 6–18

Figure 46 GPS interface...................................................................................................................................... 6–18

Figure 47 USB interface...................................................................................................................................... 6–19

Figure 48 MicroUSB connector .......................................................................................................................... 6–19

Figure 49 Charger interface............................................................................................................................... 6–20

Figure 50 Touch module interface.................................................................................................................... 6–20

Figure 51 Proximity sensor and ALS................................................................................................................. 6–21

Figure 52 BCM2727B block diagram................................................................................................................. 6–22

Figure 53 Primary camera interface................................................................................................................. 6–23

Figure 54 Secondary camera interface............................................................................................................. 6–24

Figure 55 Keyboard interface............................................................................................................................ 6–25

Figure 56 Accelerometer interface ................................................................................................................... 6–26

Figure 57 Magnetometer interface................................................................................................................... 6–27

Figure 58 Audio block diagram......................................................................................................................... 6–28

Figure 59 Internal earpiece............................................................................................................................... 6–29

Figure 60 Internal handsfree (IHF) speaker diagram ..................................................................................... 6–29

Figure 61 Internal microphones diagram........................................................................................................ 6–30

Figure 62 Vibra diagram.................................................................................................................................... 6–30

Figure 63 AV connector...................................................................................................................................... 6–31

Figure 64 Linko RF block diagram .................................................................................................................... 6–31

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Introduction

Phone description

RAPUYAMA is the main digital baseband ASIC in the phone. It contains functionality for both WCDMA and GSM

EDGE. The hardware accelerator is used for imaging and video.

GAZOO/PEARL (N2200) is the main audio and energy management controller for the phone.

Key components

Function Description Item ref

Main PWB 3DJ

UI flexi module (chassis) 3DH

Flash module 3DQ

Baseband ASIC EM ASIC GAZOO/PEARL N2200

RF ASIC LINKO N7512

Processor RAPUYAMA D2800

GSM/WCDMA PA GSM850/900/1800/1900

WCDMA850/900/1700/1900/2100

N7510

Oscillators VCTCXO

TCXO 16.368 MHZ

Crystal 32.768KHZ

Crystal 38.4 MHZ

Crystal 19.2 MHZ

G6200

B2200

B7500

B1400

CMT memory Combo POP4 2Gb DDR + 8Gb M3 NAND (stacked with RAPU) D3000

Back-up capacitor RTC back-up capacitor G2200

WLAN/ Bluetooth/ FM

radio/ FM transmitter

BOB 1.0M-b module N6300

GPS GPSCost4.1 N6200

Battery BP-4L

Battery connector Tabby blade interface X2070

UI flex connector Board-to board connector for UI flex module X2400

Display connector Board-to-board connector X2450

RF connectors

USB transceiver ISP1707 HS USB transceiver D3300

MicroSD connector X3200

eMMC 8GB internal mass memory D3200

Touch module connector X2403

IVE Imaging processor D1400

AV connector

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Function Description Item ref

Charging SMPS BQ24153 for USB charging N3301

Charging SMPS BQ21456 for Dynamo charging N3323

Earpiece Petra

Microphone Knopfler B2100

B2104

IHF Mean

Vibra SMD type vibra M2100

Accelerometer 3-axis accelerometer Ahti N1102

Magnetometer 3-axis magnetic sensor N1103

Combined Proximity

Sensor and Ambient Light

Sensor

DiPro N1100

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Key component placement

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System module block diagram

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Board and module connections

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Energy management

Battery and charging

BP-4L battery

The phone is powered by a 3-pole BP-4L battery 1500 mAh. The three poles are named VBAT, BSI and GND

where the BSI line is used to recognize the battery capacity. This is done by means of an internal battery pull

down resistor.

Figure 40 Battery pin order

The battery temperature is estimated by measuring separate temperature NTC resistor via the BTEMP line of

EM ASIC N2200. This is located on the main PWB, near the battery connector.

Battery connector

The battery connector is a blade connector. It has three blades:

•BSI (Battery size indicator)

•GND (Ground)

•VBAT (Battery voltage)

Figure 41 Blade battery connector

Charging

The phone is charged through the 2 mm Nokia standard interface charger plug. Charging is controlled by

dynamo charging IC BQ24156 (N3323). Dynamo charger detection is handled by EM ASIC (N2200) and external

components are needed to protect the baseband module against EMC, reverse polarity and transient

frequency deviation. For charger detection, a pulse of duration 15ms is sent to EM ASIC via V3370 MOSFET.

Normal and extreme voltages

Energy management is mainly carried out in the EM ASIC (N2200). that contains a number of regulators. In

addition there are also some external regulators.

In the table below normal and extreme voltages are shown when a BP-4L battery is used.

Table 10 Nominal voltages

Voltage Voltage [V] Condition

General Conditions

Nominal voltage 3.700

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Voltage Voltage [V] Condition

Lower extreme voltage 3.5

Higher extreme voltage

4.1(fast charging)

HW Shutdown Voltages

Vmstr+ 2.1 ± 0.1 Off to on

Vmstr- 1.9 ± 0.1 On to off

SW Shutdown Voltages

Sw shutdown 3.1 In call

Sw shutdown 3.2 In idle

Min Operating Voltage

Vcoff+ 2.9 ± 0.1 Off to on

Vcoff- 2.7 ± 0.1 On to off

Power key and system power up

When the battery is placed in the phone, the power key circuits are energized. When the power key is pressed,

the system boots up (if an adequate battery voltage is present).

Power down can be initiated by pressing the power key again and the system is powered down with the aid

of SW. The power key is connected to EM ASIC (N2200) via the PWRONX signal.

The PWRONX line cannot be detected when SW hangs. For that reason, the user has to remove the battery.

Modes of operation

Mode Description

NO_SUPPLY (Dead) mode means that the main battery is not present or its voltage is too low (below

N2200 master reset threshold) and that the back-up battery voltage is too low.

BACK_UP The main battery is not present or its voltage is too low but back-up battery is adequate

and the 32 kHz oscillator is running.

PWR_OFF In this mode (warm), the main battery is present and its voltage is over N2200 master

reset threshold. All regulators are disabled, PURX is on low state, the RTC is on and the

oscillator is on. PWR_OFF (cold) mode is almost the same as PWR_OFF (warm), but the

RTC and the oscillator are off.

RESET RESET mode is a synonym for start-up sequence. RESET mode uses 32 kHz clock to count

the RESET mode delay (typically 16ms).

SLEEP SLEEP mode is entered only from PWR_ON mode with the aid of SW when the system’s

activity is low.

FLASHING FLASHING mode is for SW downloading.

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Power distribution

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Clocking scheme

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SIM interface

The phone has a SIM (Subscriber Identification Module) interface including a SIM connector.

The SIM interface consists of an internal interface between RAPU and EM ASIC (N2200), and an external

interface between EM ASIC and SIM contacts.

Figure 42 SIM interface

As the phone does not have a traditional battery cover due to semi-fixed battery concept, the SIM card can

be removed and inserted without removing the battery. For safe SIM card functionality, a new Puzzle push-

push SIM reader with card detection and removal pre-warning switches is used.

Pre-warning and card detect signals are connected together in the Puzzle layout symbol, so there is only one

switch connection in the schematics symbol. The combined switch signal is connected through an inverter

to Gazoo/Pearl SimDetX input. The following figure shows the principle of SIM circuitry with the Puzzle.

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Figure 43 Puzzle SIM connector circuitry

The SIM interface supports both 1.8V and 3.0V SIM cards. The SIM interface voltage is first 1.8 V when the SIM

card is inserted, and if the card does not response to the ATR (Answer to Request), 3V interface voltage is

used.

Device memory

The memory components of the device are internal COMBO POP4 2Gb DDR + 8Gb M3 (NAND), a card reader for

MicroSD, and 8GB eMMC memory which is non-removable and internal to the phone.

The MicroSD is used as a user’s data storage memory. The µSD card is connected to RAPU via EM ASIC which

has an internal level shifter with an ESD protection filter. The μSD card door state is detected by a detect

switch connected to RAPU Genio25. When the door is open, the uSD card is powered off. Hot swap is supported,

which means that the card may be plugged in/out at any time, without removing the battery.

The device uses 8GB eMMC (D3200) external memory. The eMMC interface is a 6-wire serial/parallel data bus

which includes a clock (CLK), 4 data signals (DAT), and command (CMD) wires. The eMMC interface is completely

formed of the GENIOs of RAPU. The eMMC consists of an internal NAND controller and an MMC controller for I/

O interface. It is a dual supply device which requires VCC of 2.9V for the NAND core and VCCQ of 1.8V for the

MMC I/O interface.

BOB1.0M-b module

The BOB1.0M-b module provides full 802.11b,g & n WLAN, BT 2.1 + EDR, FM RDS and FM TX connectivity.

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BOB is the name given to a generic technology release that combines WLAN, Bluetooth, FM Rx and FM TX radio

on a single monolithic IC. The phone uses BOB1.0M-b module that consists of a single chip transceiver WL1271,

plus a separate RF front end (FE) device. The BOB1.0M-b release operates in the 2.4GHz (ISM) and the

76-108MHz FM bands.

Figure 44 BOB1.0M-b module block diagram and application circuit

From a troubleshooting point of view, WLAN is tested separately, but BTH, FMRX and FMTX are checked in

parallel.

REFOUT_EXT1 single ended 38.4 MHz analog clock from Linko RF is provided to BOB1.0M-b. The clock request

for the reference clock in the BOB1.0M-b module is shared between WLAN and BTHFM blocks. When either

system requires a clock, this signal will be active. The CLK_REQ is connected to ExtSysClkReq pin of RAPU. The

SLEEPCLK input of 32.768 KHz clock from EM ASIC is used for power management and for FM in low power

mode.

The internal SMPS supplies the whole BOB1.0M-b solution from the phone battery supply, VBAT, apart from

VIO, which is needed for interface signal reference levels.

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Figure 45 BOB1.0M-b interface

GPS interface

The phone includes an inbuilt single chip GPS receiver GPSCost4.1D, comprising both RF and BB blocks

integrated in a single digital die. GPSCost4.1D is connected to RAPU ASIC via I2C_1 and some GENIOs. GPSCost4.1

D operates in Multi-master mode and the REF clock is requested via AGPS_CLK_REQ signal connected to RAPU

genio46. REFOUT_EXT2 single ended 38.4 MHz analog clock from Linko RF is provided to GPSCost4.1D.

Figure 46 GPS interface

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USB

USB interface

The phone has an interface for USB (Universal Serial Bus). USB is a differential serial bus that provides a wired

connectivity between a PC and peripheral devices, as in this case a mobile phone.

Figure 47 USB interface

The phone supports USB 2.0 with High-Speed (480 Mbps).

Hot swap is supported, which means that USB devices may be plugged in and out at any time.

MicroUSB connector

This phone is provided with a specific connector for microUSB.

Figure 48 MicroUSB connector

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Charger interface

The charger interface is a 2 mm Dynamo charger plug. Older chargers with a 3.5 mm plug are supported via

the charger adapter cable CA-44.

Charging is controlled by EM ASIC. Additional external components are needed for EMC purposes, reverse

polarity and transient protection of the input to the baseband module.

Figure 49 Charger interface

User interface

Touch module

This phone uses Atmel capacitive touch solution.

The Atmel touch module is interfaced to I2C0 bus of RAPU. RAPU’s GenIO123 is used for Touch INT.

The Atmel touch module uses VAUX1 for its analogue supply and VIO for its digital supply. Communication

with RAPU is via Symbian I2C bus.

Whenever the user touches the touch screen, the controller raises an interrupt to RAPU which initiates I2C

transactions to identify the locations the user touches on the display.

Figure 50 Touch module interface

Proximity sensor and ambient light sensor

This phone uses a combined proximity and ambient light sensor called DiPro.

The proximity part of the device uses an external IR LED supplied by VBAT. The current this LED consumes is

controlled by DiPro and set using software. The interrupt output of DiPro changes state when the infra red

light from the LED is reflected back by a suitable reflective surface.

The ambient light sensor detects the level of ambient light and adjusts the display and key brightness

accordingly whenever the display is active. Covering this sensor results in dimmed display and key lights.

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Figure 51 Proximity sensor and ALS

Imaging and video

Multimedia application processor

Multimedia application processor, BCM2727B, is used as a HW accelerator for imaging and video graphics.

The key features of BCM2727B are:

•8MPIx primary camera

•Secondary camera

•Dual LED flash

•nHD OLED DSI display

•NTSC/PAL analog TV-out

MeSSI-16 and CCP2-Tx are the key interfaces between RapuYama and BCM2727B. BCM2727B has in-build

256Mb stacked SDRAM.

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Figure 52 BCM2727B block diagram

Display module

This phone uses a 2.46’’ TFT type VGA Batura display with 16 million colors. The display module supports the

display format of 480 rows x 640 columns . The dimension of the display module is 54.9 mm x 47.4 mm x 1.9

mm. The module interfaces to the phone via FPC with a 20 pins board to board connector.

The primary display is controlled by BCM2727B over CDP interface. The CDP interface is used for data transfer

and control. Other display signals, RESET and TE, are interfaced to BCM2727B.

TV-out interface

The phone has Analog PAL/NTSC TV-Out capability.

For the Analog TV-out, video data is passed from the host to the BCM2727B over MeSSI-16 interface and

BCM2727B sends it to the AV connector. Audio is routed separately by the host to the AV connector.

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Cameras

This phone has two cameras, an 8 MPix resolution main camera and a VGA resolution secondary camera. A

dual LED flash is used for the main camera.

Primary camera (Gambino)

The primary camera is an 8 Megapixel EDOF (Enhanced Depth of Field) camera module. The module size is

8.5 mm x 8.5 mm x 6.1 mm and it fits into the 20-pin camera socket on the phone. The camera module is

SMIA profile 2 compliant and is configured by the BCM2727B using I2C control bus. Image data is transferred

to the BCM2727B for furher processing over CSI-2 (PRI_CAM_CSI).

Figure 53 Primary camera interface

Secondary camera (VGA Acme mini)

The secondary camera is a VGA fixed focus camera module. It is SMIA compliant and is configured by the

BCM2727B using I2C control bus. Image data is transferred to the BCM2727B for further processing over a CCP

based bus (SEC_CAM_CCP).

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Figure 54 Secondary camera interface

Flash (dual LED)

The dual LED flash consists of two high power white LEDs for use as a camera flash, torch mode and video

light. The torch and video light have significantly reduced power compared to the image capture flash. A red

indicator light is also present for privacy reasons to indicate when an image is being captured or a video

recorded.

Illumination

Key illumination

Navi (Breathing) key, E-series keys, Qwerty keys, Volume up/down keys and Mute key illumination is

supported by LED driver NJOY9.

Charging illumination

A single white LED is used for charging indication. The LED is connected to EM ASIC “ChInd” pin and blinks

only during dead battery USB charging in intervals of 1.5s. When under SW control, this LED provides a fixed

light level.

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Keyboard interface

All the keys with the exception of the power key are on a key matrix connected through a small type IO

Expander (25 bump) to RAPU.

Figure 55 Keyboard interface

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Accelerometer

Accelerometer is a geometric type component which can be configured either to generate an inertial wake-

up interrupt signal when a programmable acceleration threshold is exceeded along one of the three axes (x,

y, and z), or to detect a free-fall event. Each axe has its own sensor and those can measure positive and

negative directions.

The 3D accelerometer (N1102) Ahti_A sensor is connected to RAPU via two GENIOs ie Genio12 and Genio44

and I2C_0 bus. Power supply voltage is provided from VIO & VAUX2 output of EM ASIC.

It has the following features:

•2.16V to 3.6V supply voltage

•1.8V compatible IOs

•Low power consumption

•±2g/±8g dynamically selectable scale

•I2C/SPI digital output interface

•Embedded self test

•10000g high shock survivability

•Pb free/RoHS compliancy

Figure 56 Accelerometer interface

Magnetometer

3D magnetometer sensor (N1103) is connected to RAPU via two GENIOs ie Genio40 and Genio41 and I2C_0

bus. Power supply voltage is provided from VIO & VAUX1 output of EM ASIC. The magnetometer is used as a

city compass sensor. It detects the earth magnetic field density and composes bearing information for

navigation applications.

The magnetometer has the following features:

•3-axis magnetometer device suitable for compass application

•Built-in A to D converter for magnetometer data out

•Self test function

•I2C bus interface

•Power modes: OFF mode, stand-by mode and active mode

•DRDY function for measurement data ready

•INT function to inform exceeding magnetic field strength threshold.

The operating temperature is -20°C to +85°C.

The operating supply voltages are:

•Analogue supply +2.4V to +3.6V

•Digital interface supply +1.70V to analogue supply voltage.

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Figure 57 Magnetometer interface

Audio concept

Audio HW architecture

TPA6140 (N2000), BoostMono (N2150) along with mixed-signal ASIC Gazoo/Pearl provides the analogue audio

output interfaces and RAPU provides the digital audio output interface support.

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Figure 58 Audio block diagram

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Internal earpiece

The internal earpiece used is Petra (8X12) and is connected to EM ASIC EARP and EARN lines.

Figure 59 Internal earpiece

Internal handsfree (IHF) speakers

IHF speakers used are Donau and are connected to BoostMono Vallu N2150. Vallu is a mono D-class speaker

amplifier with an integrated inductive boost converter. Vallu’s differential audio inputs are connected to EM

ASIC Gazoo/Pearl XEarL, XEarLC and it can be enabled/disabled by Genout105 from Rapu.

Figure 60 Internal handsfree (IHF) speaker diagram

Internal microphones

Digital microphones used are Knopfler and are connected to Rapu. DigiMic CLK is connected to RAPU Genio72

and DigiMic DATA is connected to Rapu Genio39.

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Figure 61 Internal microphones diagram

External earpiece and microphone

The AV headset earpiece is connected to TPA6140 audio amplifier which is used for high quality audio output

and to guarantee long playback time for accessory use. TPA6140 is connected to Gazoo/Pearl XEarL, XEarLC,

XEarR, XEarRC lines for audio and is controlled via I2C_2 bus by RAPU.

The AV headset microphone line is connected to EM ASIC Gazoo/Pearl Mic2 line via AV switch N2001.

Vibra

Vibra is connected to VibraN and VibraP lines of EM ASIC Gazoo/Pearl.

Figure 62 Vibra diagram

AV connector

The AV connector handles both audio and video signals output. It has audio left and right signals separately

(pins 4 and 5) and the microphone signal wired to pin 3.

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Figure 63 AV connector

The AVVideoControl signal handles microphone usage of the AV connector. The plug detection signal handles

the AV connector plug detection with HeadDet signal from EM ASIC.

Cellular RF technical description

RF block

Linko RF consists of the following key components:

•Älli (Transceiver RF Asic)

•Aura (RF power management Asic)

•Ukko PA

•QuBBE (Front end module)

Figure 64 Linko RF block diagram

The RF block uses RF ASIC N7512 that performs the RF back-end functions of receive and transmit function of

the cellular transceiver.

QuBBE

The front end module called QuBBE contains the needed front end filters and the switches. QuBBE contains:

•3 duplexers (Band II, V, VIII)

•1 triplexer (Band I, IV)

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•12 switches with the control

•Low and high band GSM TX low bass filters

•50 ohms low and high and antenna interface

The control signals for the switches come from Älli.

Receiver (RX)

Linko RF has higher integration level compared to previous RF generations and especially more digital design

blocks have been integrated to Älli, RF Asic.

Älli contains the receiver chain from LNAs to digital base band interface. Digital RX baseband interface

contains four data and one clk signals. The data rate and clock frequency depend on the use case.

The main blocks in Älli are:

•LNAs: Balanced inputs for 850, 900, 1800, 1900, 2100 bands

•Passive mixer

•Analog baseband: Programmable for different modes

•ADC: Programmable Sigma Delta Modulator topology ADC

•RX Digital Front End (RXDFE): Contains for example digital filtering, DC offset compensation, wide/

narrowband power measurement blocks

There is integrated external LNA matching on the bands 900, 1800, 1900 and 2100. On 850 band, there is an

integrated matching.

Synthesizer

The synthesizer has separate highly integrated 4GHz VCOs for RX and TX. The integrator capacitors of the loop

filter are outside of the IC. The PLLs are fractional type of dividers.

The reference oscillator is an on-chip 38.4 MHz digitally controlled oscillator. The 38.4 MHz crystal is outside

of Älli. DCXO delivers the internal clock to Älli, differential clock signal to BB, and two single mode clock signals

to NCW modules. Älli delivers a clk signal to diversity RX. The oscillator is controlled via RFBus with AFC signal.

Temperature compensation of the oscillator is running by the SW in Älli. The temperature sensor itself is

outside of Älli.

Transmitter (TX)

The main features of Linko1 transmitter are:

•Common PA for GSM and WCDMA

•High and low band signal paths

•Low band: 824 - 915 MHz

•High band: 1710 - 1980 MHz

•Two operation modes in PA

•Saturation mode in GMSK usage

•Linear mode in Edge and WCDMA usage

•No TX filter between PA and Älli

•Common regulators for GSM and WCDMA

•Boost and SMPS regulators in Aura

•Feeding the supply voltage to PA

•Operation frequency varies depending on the used system

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Frequency SMPS Boost DCDC

WCDMA 3.0 MHz (typ) 4.5 MHz (typ) 1.3 MHz (typ)

GSM 9.5 MHz 7.5 MHz 2.7 MHz

•Digital interface to baseband

•WCDMA mode

•Digital IQ interface

•3 data and 1 clk signals

•GSM mode

•GSM TX data bits are sourced from baseband via RFBus to Älli

In GMSK mode, the output level of Älli is kept high with all power levels, and the output power is adjusted

by altering the collector voltage of PA. In practice, the output level of Älli is also slightly changed (optimized)

in the highest power level to keep the PA compression level more constant, which results in better overall

efficiency and performance.

In WCDMA and EDGE mode, the output power is tuned by output level of Älli. The supply voltage in WCDMA

mode is adjusted in power levels to optimize the current consumption.

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Frequency mappings

GSM850 frequencies

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EGSM900 frequencies

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GSM1800 frequencies

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GSM1900 frequencies

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WCDMA I (2100) Rx frequencies

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WCDMA I (2100) Tx frequencies

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WCDMA II (1900) frequencies

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WCDMA IV (1700/2100) frequencies

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WCDMA V (850) frequencies

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WCDMA VIII (900) frequencies

Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2712 882,4 3529,6 2937 927,4 3709,6

2713 882,6 3530,4 2938 927,6 3710,4

2714 882,8 3531,2 2939 927,8 3711,2

2715 883 3532 2940 928 3712

2716 883,2 3532,8 2941 928,2 3712,8

2717 883,4 3533,6 2942 928,4 3713,6

2718 883,6 3534,4 2943 928,6 3714,4

2719 883,8 3535,2 2944 928,8 3715,2

2720 884 3536 2945 929 3716

2721 884,2 3536,8 2946 929,2 3716,8

2722 884,4 3537,6 2947 929,4 3717,6

2723 884,6 3538,4 2948 929,6 3718,4

2724 884,8 3539,2 2949 929,8 3719,2

2725 885 3540 2950 930 3720

2726 885,2 3540,8 2951 930,2 3720,8

2727 885,4 3541,6 2952 930,4 3721,6

2728 885,6 3542,4 2953 930,6 3722,4

2729 885,8 3543,2 2954 930,8 3723,2

2730 886 3544 2955 931 3724

2731 886,2 3544,8 2956 931,2 3724,8

2732 886,4 3545,6 2957 931,4 3725,6

2733 886,6 3546,4 2958 931,6 3726,4

2734 886,8 3547,2 2959 931,8 3727,2

2735 887 3548 2960 932 3728

2736 887,2 3548,8 2961 932,2 3728,8

2737 887,4 3549,6 2962 932,4 3729,6

2738 887,6 3550,4 2963 932,6 3730,4

2739 887,8 3551,2 2964 932,8 3731,2

2740 888 3552 2965 933 3732

2741 888,2 3552,8 2966 933,2 3732,8

2742 888,4 3553,6 2967 933,4 3733,6

2743 888,6 3554,4 2968 933,6 3734,4

2744 888,8 3555,2 2969 933,8 3735,2

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Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2745 889 3556 2970 934 3736

2746 889,2 3556,8 2971 934,2 3736,8

2747 889,4 3557,6 2972 934,4 3737,6

2748 889,6 3558,4 2973 934,6 3738,4

2749 889,8 3559,2 2974 934,8 3739,2

2750 890 3560 2975 935 3740

2751 890,2 3560,8 2976 935,2 3740,8

2752 890,4 3561,6 2977 935,4 3741,6

2753 890,6 3562,4 2978 935,6 3742,4

2754 890,8 3563,2 2979 935,8 3743,2

2755 891 3564 2980 936 3744

2756 891,2 3564,8 2981 936,2 3744,8

2757 891,4 3565,6 2982 936,4 3745,6

2758 891,6 3566,4 2983 936,6 3746,4

2759 891,8 3567,2 2984 936,8 3747,2

2760 892 3568 2985 937 3748

2761 892,2 3568,8 2986 937,2 3748,8

2762 892,4 3569,6 2987 937,4 3749,6

2763 892,6 3570,4 2988 937,6 3750,4

2764 892,8 3571,2 2989 937,8 3751,2

2765 893 3572 2990 938 3752

2766 893,2 3572,8 2991 938,2 3752,8

2767 893,4 3573,6 2992 938,4 3753,6

2768 893,6 3574,4 2993 938,6 3754,4

2769 893,8 3575,2 2994 938,8 3755,2

2770 894 3576 2995 939 3756

2771 894,2 3576,8 2996 939,2 3756,8

2772 894,4 3577,6 2997 939,4 3757,6

2773 894,6 3578,4 2998 939,6 3758,4

2774 894,8 3579,2 2999 939,8 3759,2

2775 895 3580 3000 940 3760

2776 895,2 3580,8 3001 940,2 3760,8

2777 895,4 3581,6 3002 940,4 3761,6

2778 895,6 3582,4 3003 940,6 3762,4

2779 895,8 3583,2 3004 940,8 3763,2

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Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2780 896 3584 3005 941 3764

2781 896,2 3584,8 3006 941,2 3764,8

2782 896,4 3585,6 3007 941,4 3765,6

2783 896,6 3586,4 3008 941,6 3766,4

2784 896,8 3587,2 3009 941,8 3767,2

2785 897 3588 3010 942 3768

2786 897,2 3588,8 3011 942,2 3768,8

2787 897,4 3589,6 3012 942,4 3769,6

2788 897,6 3590,4 3013 942,6 3770,4

2789 897,8 3591,2 3014 942,8 3771,2

2790 898 3592 3015 943 3772

2791 898,2 3592,8 3016 943,2 3772,8

2792 898,4 3593,6 3017 943,4 3773,6

2793 898,6 3594,4 3018 943,6 3774,4

2794 898,8 3595,2 3019 943,8 3775,2

2795 899 3596 3020 944 3776

2796 899,2 3596,8 3021 944,2 3776,8

2797 899,4 3597,6 3022 944,4 3777,6

2798 899,6 3598,4 3023 944,6 3778,4

2799 899,8 3599,2 3024 944,8 3779,2

2800 900 3600 3025 945 3780

2801 900,2 3600,8 3026 945,2 3780,8

2802 900,4 3601,6 3027 945,4 3781,6

2803 900,6 3602,4 3028 945,6 3782,4

2804 900,8 3603,2 3029 945,8 3783,2

2805 901 3604 3030 946 3784

2806 901,2 3604,8 3031 946,2 3784,8

2807 901,4 3605,6 3032 946,4 3785,6

2808 901,6 3606,4 3033 946,6 3786,4

2809 901,8 3607,2 3034 946,8 3787,2

2810 902 3608 3035 947 3788

2811 902,2 3608,8 3036 947,2 3788,8

2812 902,4 3609,6 3037 947,4 3789,6

2813 902,6 3610,4 3038 947,6 3790,4

2814 902,8 3611,2 3039 947,8 3791,2

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Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2815 903 3612 3040 948 3792

2816 903,2 3612,8 3041 948,2 3792,8

2817 903,4 3613,6 3042 948,4 3793,6

2818 903,6 3614,4 3043 948,6 3794,4

2819 903,8 3615,2 3044 948,8 3795,2

2820 904 3616 3045 949 3796

2821 904,2 3616,8 3046 949,2 3796,8

2822 904,4 3617,6 3047 949,4 3797,6

2823 904,6 3618,4 3048 949,6 3798,4

2824 904,8 3619,2 3049 949,8 3799,2

2825 905 3620 3050 950 3800

2826 905,2 3620,8 3051 950,2 3800,8

2827 905,4 3621,6 3052 950,4 3801,6

2828 905,6 3622,4 3053 950,6 3802,4

2829 905,8 3623,2 3054 950,8 3803,2

2830 906 3624 3055 951 3804

2831 906,2 3624,8 3056 951,2 3804,8

2832 906,4 3625,6 3057 951,4 3805,6

2833 906,6 3626,4 3058 951,6 3806,4

2834 906,8 3627,2 3059 951,8 3807,2

2835 907 3628 3060 952 3808

2836 907,2 3628,8 3061 952,2 3808,8

2837 907,4 3629,6 3062 952,4 3809,6

2838 907,6 3630,4 3063 952,6 3810,4

2839 907,8 3631,2 3064 952,8 3811,2

2840 908 3632 3065 953 3812

2841 908,2 3632,8 3066 953,2 3812,8

2842 908,4 3633,6 3067 953,4 3813,6

2843 908,6 3634,4 3068 953,6 3814,4

2844 908,8 3635,2 3069 953,8 3815,2

2845 909 3636 3070 954 3816

2846 909,2 3636,8 3071 954,2 3816,8

2847 909,4 3637,6 3072 954,4 3817,6

2848 909,6 3638,4 3073 954,6 3818,4

2849 909,8 3639,2 3074 954,8 3819,2

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Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2850 910 3640 3075 955 3820

2851 910,2 3640,8 3076 955,2 3820,8

2852 910,4 3641,6 3077 955,4 3821,6

2853 910,6 3642,4 3078 955,6 3822,4

2854 910,8 3643,2 3079 955,8 3823,2

2855 911 3644 3080 956 3824

2856 911,2 3644,8 3081 956,2 3824,8

2857 911,4 3645,6 3082 956,4 3825,6

2858 911,6 3646,4 3083 956,6 3826,4

2859 911,8 3647,2 3084 956,8 3827,2

2860 912 3648 3085 957 3828

2861 912,2 3648,8 3086 957,2 3828,8

2862 912,4 3649,6 3087 957,4 3829,6

2863 912,6 3650,4 3088 957,6 3830,4

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Glossary

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page Glossary– 1

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Page Glossary– 2 COMPANY CONFIDENTIAL Issue 1

A/D-converter Analogue-to-digital converter

ACI Accessory Control Interface

ADC Analogue-to-digital converter

ADSP Application DPS (expected to run high level tasks)

AGC Automatic gain control (maintains volume)

ALS Ambient light sensor

AMSL After Market Service Leader

ARM Advanced RISC Machines

ARPU Average revenue per user (per month or per year)

ASIC Application Specific Integrated Circuit

ASIP Application Specific Interface Protector

B2B Board to board, connector between PWB and UI board

BA Board Assembly

BB Baseband

BC02 Bluetooth module made by CSR

BIQUAD Bi-quadratic (type of filter function)

BSI Battery Size Indicator

BT Bluetooth

CBus MCU controlled serial bus connected to UPP_WD2, UEME and Zocus

CCP Compact Camera Port

CDMA Code division multiple access

CDSP Cellular DSP (expected to run at low levels)

CLDC Connected limited device configuration

CMOS Complimentary metal-oxide semiconductor circuit (low power consumption)

COF Chip on Foil

COG Chip on Glass

CPU Central Processing Unit

CSD Circuit-switched data

CSR Cambridge silicon radio

CSTN Colour Super Twisted Nematic

CTSI Clock Timing Sleep and interrupt block of Tiku

CW Continuous wave

D/A-converter Digital-to-analogue converter

DAC Digital-to-analogue converter

DBI Digital Battery Interface

DBus DSP controlled serial bus connected between UPP_WD2 and Helgo

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Glossary

Issue 1 COMPANY CONFIDENTIAL Page Glossary– 3

DCT-4 Digital Core Technology

DMA Direct memory access

DP Data Package

DPLL Digital Phase Locked Loop

DSP Digital Signal Processor

DTM Dual Transfer Mode

DtoS Differential to Single ended

EDGE Enhanced data rates for global/GSM evolution

EGSM Extended GSM

EM Energy management

EMC Electromagnetic compatibility

EMI Electromagnetic interference

ESD Electrostatic discharge

FCI Functional cover interface

FM Frequency Modulation

FPS Flash Programming Tool

FR Full rate

FSTN Film compensated super twisted nematic

GMSK Gaussian Minimum Shift Keying

GND Ground, conductive mass

GPIB General-purpose interface bus

GPRS General Packet Radio Service

GSM Group Special Mobile/Global System for Mobile communication

HSDPA High-speed downlink packet access

HF Hands free

HFCM Handsfree Common

HS Handset

HSCSD High speed circuit switched data (data transmission connection faster than GSM)

HW Hardware

I/O Input/Output

IBAT Battery current

IC Integrated circuit

ICHAR Charger current

IF Interface

IHF Integrated hands free

IMEI International Mobile Equipment Identity

RM-609

Glossary

Page Glossary– 4 COMPANY CONFIDENTIAL Issue 1

IR Infrared

IrDA Infrared Data Association

ISA Intelligent software architecture

JPEG/JPG Joint Photographic Experts Group

LCD Liquid Crystal Display

LDO Low Drop Out

LED Light-emitting diode

LPRF Low Power Radio Frequency

MCU Micro Controller Unit (microprocessor)

MCU Multiport control unit

MIC, mic Microphone

MIDP Mobile Information Device Profile

MIN Mobile identification number

MIPS Million instructions per second

MMC Multimedia card

MMS Multimedia messaging service

MP3 Compressed audio file format developed by Moving Picture Experts Group

MTP Multipoint-to-point connection

NFC Near field communication

NTC Negative temperature coefficient, temperature sensitive resistor used as a

temperature sensor

OMA Object management architecture

OMAP Operations, maintenance, and administration part

Opamp Operational Amplifier

PA Power amplifier

PCM Pulse Code Modulation

PDA Pocket Data Application

PDA Personal digital assistant

PDRAM Program/Data RAM (on chip in Tiku)

Phoenix Software tool of DCT4.x and BB5

PIM Personal Information Management

PLL Phase locked loop

PM (Phone) Permanent memory

PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX Power-up reset

PWB Printed Wiring Board

RM-609

Glossary

Issue 1 COMPANY CONFIDENTIAL Page Glossary– 5

PWM Pulse width modulation

RC-filter Resistance-Capacitance filter

RDS Radio Data Service

RF Radio Frequency

RF PopPort ™ Reduced function PopPort ™ interface

RFBUS Serial control Bus For RF

RSK Right Soft Key

RS-MMC Reduced size Multimedia Card

RSS Web content Syndication Format

RSSI Receiving signal strength indicator

RST Reset Switch

RTC Real Time Clock (provides date and time)

RX Radio Receiver

SARAM Single Access RAM

SAW filter Surface Acoustic Wave filter

SDRAM Synchronous Dynamic Random Access Memory

SID Security ID

SIM Subscriber Identity Module

SMPS Switched Mode Power Supply

SNR Signal-to-noise ratio

SPR Standard Product requirements

SRAM Static random access memory

STI Serial Trace Interface

SW Software

SWIM Subscriber/Wallet Identification Module

TCP/IP Transmission control protocol/Internet protocol

TCXO Temperature controlled Oscillator

Tiku Finnish for Chip, Successor of the UPP

TX Radio Transmitter

UART Universal asynchronous receiver/transmitter

UEME Universal Energy Management chip (Enhanced version)

UEMEK See UEME

UI User Interface

UPnP Universal Plug and Play

UPP Universal Phone Processor

UPP_WD2 Communicator version of DCT4 system ASIC

RM-609

Glossary

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USB Universal Serial Bus

VBAT Battery voltage

VCHAR Charger voltage

VCO Voltage controlled oscillator

VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO Voltage Controlled Crystal Oscillator

VF View Finder

Vp-p Peak-to-peak voltage

VSIM SIM voltage

WAP Wireless application protocol

WCDMA Wideband code division multiple access

WD Watchdog

WLAN Wireless local area network

XHTML Extensible hypertext markup language

Zocus Current sensor (used to monitor the current flow to and from the battery)

RM-609

Glossary

Issue 1 COMPANY CONFIDENTIAL Page Glossary– 7

RM-609

Glossary

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Nokia E6 00 Rm 609 Service Manual 34 V1

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