Nokia N85 Rm 333 334 335 Service Manual 34 V2

User Manual: Smartphone Nokia N85 RM-333, RM-334, RM-335 - Service manuals and Schematics, Disassembly / Assembly. Free.

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Amendment Record Sheet
Copyright
Warnings and cautions
ESD protection
Care and maintenance
Company policy
Battery information
Nokia N85; L3&4 Service Manual Structure
1 General Information
2 Service Tools and Service Concepts
- Service tools
- Service concepts
3 BB Troubleshooting
4 RF Troubleshooting
5 Camera Module Troubleshooting
6 FMTx 2.1 Technical Description
7 FMTx 2.1 Troubleshooting
8 System Module and User Interface
9 Service information differences between RM-335 and RM-333
Glossary

Service Manual

RM-333; RM-334; RM-335 (Nokia N85; L3&4)

Mobile Terminal

Part No: (Issue 2)

Nokia Customer Care

COMPANY CONFIDENTIAL

Amendment Record Sheet

Amendment No Date Inserted By Comments

Issue 1 09/2008 A. Salo

Issue 2 10/2008 A. Salo New chapter added:

Service information differences

between RM-335 and RM-333

RM-333; RM-334; RM-335

Amendment Record Sheet

Page ii COMPANY CONFIDENTIAL Issue 2

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form

without the prior written permission of Nokia is prohibited.

Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia

Corporation. Other product and company names mentioned herein may be trademarks or tradenames of

their respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and

improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,

consequential or indirect damages howsoever caused.

The contents of this document are provided "as is". Except as required by applicable law, no warranties of

any kind, either express or implied, including, but not limited to, the implied warranties of merchantability

and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this

document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

The availability of particular products may vary by region.

IMPORTANT

This document is intended for use by qualified service personnel only.

RM-333; RM-334; RM-335

Issue 2 COMPANY CONFIDENTIAL Page iii

Warnings and cautions

Warnings

•IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED

WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT

CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/

MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

•THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,

FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

•OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE

WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE

MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY

ALSO BE SUBJECT TO INTERFERENCE.

•BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions

•Servicing and alignment must be undertaken by qualified personnel only.

•Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

•Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

•Use only approved components as specified in the parts list.

•Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and

alignment.

•Ensure all cables and wires are repositioned correctly.

•Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the

measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb

nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.

•During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise

GSM or WCDMA PA may be damaged.

RM-333; RM-334; RM-335

Warnings and cautions

Page iv COMPANY CONFIDENTIAL Issue 2

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing

the phone.

Any product of which the covers are removed must be handled with ESD protection. The SIM card can be

replaced without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied.

All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity

discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside

any ESD Protected Area (EPA).

Every repair action involving opening the product or handling the product components must be done under

ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.

For more information and local requirements about ESD protection and ESD Protected Area, contact your local

Nokia After Market Services representative.

RM-333; RM-334; RM-335

ESD protection

Issue 2 COMPANY CONFIDENTIAL Page v

Care and maintenance

This product is of superior design and craftsmanship and should be treated with care. The suggestions below

will help you to fulfil any warranty obligations and to enjoy this product for many years.

•Keep the phone and all its parts and accessories out of the reach of small children.

•Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that

will corrode electronic circuits.

•Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.

•Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage

batteries, and warp or melt certain plastics.

•Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form

inside, which may damage electronic circuit boards.

•Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.

•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.

•Do not paint the phone. Paint can clog the moving parts and prevent proper operation.

•Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or

attachments could damage the phone and may violate regulations governing radio devices.

All of the above suggestions apply equally to the product, battery, charger or any accessory.

RM-333; RM-334; RM-335

Care and maintenance

Page vi COMPANY CONFIDENTIAL Issue 2

Company policy

Our policy is of continuous development; details of all technical modifications will be included with service

bulletins.

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If

any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/e-

mail.

Please state:

•Title of the Document + Issue Number/Date of publication

•Latest Amendment Number (if applicable)

•Page(s) and/or Figure(s) in error

Please send to:

NOKIA CORPORATION

Nokia Mobile Phones Business Group

Nokia Customer Care

PO Box 86

FIN-24101 SALO

Finland

E-mail: Service.Manuals@nokia.com

RM-333; RM-334; RM-335

Company policy

Issue 2 COMPANY CONFIDENTIAL Page vii

Battery information

Note: A new battery's full performance is achieved only after two or three complete charge and

discharge cycles!

The battery can be charged and discharged hundreds of times but it will eventually wear out. When the

operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.

Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers

approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to

a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged

battery will discharge itself over time.

Temperature extremes can affect the ability of your battery to charge.

For good operation times with Li-Ion batteries, discharge the battery from time to time by leaving the product

switched on until it turns itself off (or by using the battery discharge facility of any approved accessory

available for the product). Do not attempt to discharge the battery by any other means.

Use the battery only for its intended purpose.

Never use any charger or battery which is damaged.

Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or

pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example

when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery

or the connecting object.

Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce

the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°

F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.

Batteries' performance is particularly limited in temperatures well below freezing.

Do not dispose of batteries in a fire!

Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

RM-333; RM-334; RM-335

Battery information

Page viii COMPANY CONFIDENTIAL Issue 2

Nokia N85; L3&4 Service Manual Structure

1 General Information

2 Service Tools and Service Concepts

3 BB Troubleshooting

4 RF Troubleshooting

5 Camera Module Troubleshooting

6 FMTx 2.1 Technical Description

7 FMTx 2.1 Troubleshooting

8 System Module and User Interface

9 Service information differences between RM-335 and RM-333

Glossary

RM-333; RM-334; RM-335

Nokia N85; L3&4 Service Manual Structure

Issue 2 COMPANY CONFIDENTIAL Page ix

RM-333; RM-334; RM-335

Nokia N85; L3&4 Service Manual Structure

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Page x COMPANY CONFIDENTIAL Issue 2

1 — General Information

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 1 –1

RM-333; RM-334; RM-335

General Information

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Page 1 –2 COMPANY CONFIDENTIAL Issue 2

Table of Contents

Product selection....................................................................................................................................................1–5

Product features and sales package.....................................................................................................................1–5

Mobile enhancements............................................................................................................................................1–8

Technical Specifications...................................................................................................................................... 1–10

Transceiver general specifications ............................................................................................................... 1–10

Main RF characteristics for GSM850/900/1800/1900 and WCDMA VIII/II/I phones ................................. 1–10

Main RF characteristics for GSM850/900/1800/1900 and WCDMA V/II/I phones ..................................... 1–11

Battery endurance.......................................................................................................................................... 1–13

Environmental conditions ............................................................................................................................. 1–13

List of Tables

Table 1 Audio..........................................................................................................................................................1–8

Table 2 Car...............................................................................................................................................................1–9

Table 3 Data ............................................................................................................................................................1–9

Table 4 Messaging..................................................................................................................................................1–9

Table 5 Power...................................................................................................................................................... 1–10

List of Figures

Figure 1 View of RM-333/RM-334 .........................................................................................................................1–5

RM-333; RM-334; RM-335

General Information

Issue 2 COMPANY CONFIDENTIAL Page 1 –3

RM-333; RM-334; RM-335

General Information

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Page 1 –4 COMPANY CONFIDENTIAL Issue 2

Product selection

RM-333 is a dual mode handportable multimedia computer, supporting GSM/GPRS/

EGPRS850/900/1800/1900, with WCDMA VIII (900)/ II (1900)/ I (2100) HSDPA and WLAN. RM-334 supports

GSM/GPRS/EGPRS850/900/1800/1900, with WCDMA V (850)/ II (1900)/ I (2100) HSDPA and WLAN.

The device is a 3GPP Release 5 terminal supporting WCDMA/HSDPA, EGPRS and GPRS data bearers. For WCDMA

HSDPA the maximum bit rate is up to 3.6 Mbps for downlink and 384 kbps for uplink with simultaneous CS

speech or CS video (max. 64 kbps).

For 2G and 2.5G networks the device is a Class A EGPRS DTM MSC 11 which means a maximum download speed

of up to 296kbit/s with EGPRS, and up to 107kbit/s with GPRS.

According to GSM standard 05.05 it responds to class 4 (max. 2W) in GSM 850 and EGSM 900 class 1 (1W) in

DCS 1800 and class 1 in PCS 1900. The device supports EGPRS (EDGE) class B as well as Bluetooth 2.0 EDR

standard.

The device supports two way video calls with two integrated cameras, one on the front and one on the back.

The device is an MMS (Multimedia Messaging Service) enabled multimedia computer with a large 2.6’’ QVGA

(240 x 320 pixels) TFT colour display capable of displaying 16 million colours and an integrated 5 Megapixel

auto focus camera. The MMS implementation follows the OMA MMS standard release 1.2. The Browser is a

highly advanced internet browser also capable of viewing operator domain XHTML Mobile Profile (MP)

content.

The device uses Symbian 9.3 operating system and supports MIDP Java 2.0 & CLDC1.1, providing a good

platform for compelling 3rd party applications.

Figure 1 View of RM-333/RM-334

Product features and sales package

Imaging

Main camera:

RM-333; RM-334; RM-335

General Information

Issue 2 COMPANY CONFIDENTIAL Page 1 –5

•Sensor: 5 megapixel

•Carl Zeiss Optics: Tessar™ lens

•F number/Aperture: F2.8

•Focal length: 4.6 mm

35 mm (35 mm equivalent)

•Focus range: 10 cm ~ infinity

•Macro focus distance: 10-50 cm

•Shutter speed: Mechanical shutter 1/1000~1/4 s

Secondary camera:

•Sensor: CIF (352 x 288 pixels)

•F number/Aperture: F2.8

•Focal length: 43 mm (35mm equivalent)

•Focus range: 10 cm ~ infinity

Video:

•Video resolution: QCIF at 15 fps

•Audio recording: AAC (AMR for MMS)

•Video stabilization

•Video clip length: 60 min

•Video file format: .mp4 (default), .3gp (for MMS)

•White balance: automatic, sunny, cloudy, incandescent, fluorescent

•Scene: Auto, Night

•Colour tone: normal, sepia, B&W, vivid, negative

•Zoom (digital): up to 8x

Photo:

•Still image resolutions: up to 3.2 megapixel: 2048 x 1536

•Still image file format: JPEG/EXIF

•Auto focus

•Auto exposure: center weighted AE

•Image orientation: automatic

•Exposure compensation: +2 ~ -2EV at 0.5 step

•White balance: automatic, sunny, cloudy, incandescent, fluorescent

•Scene: auto, sports, portrait, close-up, landscape, night, user defined

•Colour tone: normal, sepia, B&W, vivid, negative

•Zoom (digital): up to 20x

Other camera features:

•LED flash and recording indicator

•Front camera, CIF (352 x 288) sensor

Edit

•On device Photo editor and Video editor (manual & automatic)

RM-333; RM-334; RM-335

General Information

Page 1 –6 COMPANY CONFIDENTIAL Issue 2

View

•2.6” QVGA (240 x 320 pixels) 16 million colour TFT display with wide viewing angle and ambient light

detector - used to optimize display and keypad backlight brightness and power consumption

•Slideshow from Gallery

•Nokia XpressShare - share effortlessly from Gallery or after capture via Email, Bluetooth, MMS or IrDA

•Direct connection to TV via cable or WLAN (UPnP)

•Video call and video sharing support. (WCDMA services)

•Online Album : Image/Video uploading from Gallery

•Nokia XpressPrint – direct printing via USB (PictBridge), Bluetooth (BPP), and WLAN (UPnP), from memory

card or via online printing

Store

•Nokia XpressTransfer – easy to transfer and organize photos and video between your device and a

compatible PC

•Nokia Lifeblog (mobile & PC)

Music

•Digital music player: supports MP3/ AAC/ AAC+/ eAAC+/ WMA with playlists, equalizer and album art.

•Synchronise music with Microsoft Windows Media Player 10 & 11

•One click CD ripping, converting and transferring music to your device using Nokia Music Manager

•Stereo FM radio (87.5-108MHz /76-90MHz) with Visual Radio™ support

•Stereo speakers

•Integrated FM transmitter (88.1 – 107.9 MHz)

•Integrated handsfree speaker

•Nokia Stereo Headset (HS-45), in-box

Media

•Full-screen video playback to view downloaded, streamed or recorded video clips

•Supported video formats: MPEG-4 , H.264/AVC, H.263/3GPP, RealVideo 8/9/10

Productivity

Messaging:

•E-mail (SMTP, IMAP4, POP3), MMS, SMS

Office applications:

•Viewing of email attachments – .doc, .xls, .ppt, . pdf

PIM:

•Contacts, calendar, to-do, notes, recorder, calculator, clock, converter

Synchronization:

•Local/Remote (using SyncML)

RM-333; RM-334; RM-335

General Information

Issue 2 COMPANY CONFIDENTIAL Page 1 –7

•Data: Calendar, Contacts, To-do, Notes, E-mail

•PC Applications: Microsoft Outlook (98, 2000, 2002, 2003), Outlook Express, Lotus Organizer (5.0, 6.0),

Lotus Notes (5.0, 6.0)

Call management:

•Call logs, speed dial, voice dialling (with SIND) and voice commands

•Nokia Push to Talk (PoC)

Connectivity

•WLAN - IEEE802.11 g/b with UPnP support

•Mini USB type B interface with USB 2.0 full speed

•Bluetooth wireless technology 2.0 + EDR

•Nokia 3.5 mm AV connector

Add-on software framework

•Symbian 9.3 OS

•Nokia Series 60, 3rd edition, feature pack 2

•Java: MIDP2.0

•C++ and Java SDKs

Additional technical specifications

•Vibrating alert

•3GPP Rel 5 WCDMA , Rel 4 EGSM compliant

•Speech codecs supported in WCDMA: AMR

•Speech codecs supported in GSM: FR AMR/HR AMR/EFR/FR/HR

•WCDMA HSDPA with simultaneous voice and packet data (PS max speed DL/UL= 3.6Mbps/384kbps, CS max

speed 64kbps)

•Dual Transfer Mode (DTM) support for simultaneous voice and packet data connection in GSM/EDGE

networks. Simple class A, multi slot class 11, max speed DL/UL: 118.4/118.4kbits/s

•EGPRS class B, multi slot class 32, (5 Rx + 3 Tx / Max Sum 6), max speed DL/UL= 296 / 177.6 kbits/s

•GPRS class B, multi slot class 32 (5 Rx + 3 Tx / Max Sum 6), max speed DL/UL= 107 / 64.2 kbits/s

•GPS

Sales package

•Transceiver RM-333 or RM-334

•Charger (AC-10)

•Battery (BL-5K)

•Music headset (HS-45/AD-54)

•Connectivity cable (CA-101)

Mobile enhancements

Table 1 Audio

Enhancement Type

Music headset HS-45 with AD-45 3.5mm stereo plug

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General Information

Page 1 –8 COMPANY CONFIDENTIAL Issue 2

Enhancement Type

Basic headset HS-41

Stereo headset HS-48

Bluetooth headset BH-101

BH-201

BH-208

BH-600

BH-604

BH-800

BH-801

BH-803

BH-900

BH-903

Mini speaker MD-6

Table 2 Car

Enhancement Type

Nokia Universal Holder CR-99

Car kit Nokia 616

Multimedia car kit CK-7W

Table 3 Data

Enhancement Type

Connectivity cable CA-101

Video connectivity cable CA-75U

MicroSD card MU-28, 512 MB MicroSD Card

MU-22, 1 GB MicroSD Card

MU-37, 2 GB MicroSD Card

MU-41, 4 GB MicroSD Card

MU-43, 8 GB MicroSD Card

Table 4 Messaging

Enhancement Type

Wireless keyboard SU-8W

RM-333; RM-334; RM-335

General Information

Issue 2 COMPANY CONFIDENTIAL Page 1 –9

Table 5 Power

Enhancement Type

Battery 1200mAh Li-ion BL-5K

Travel charger AC-10

Technical Specifications

Transceiver general specifications

Unit Dimensions (L x W x T)

(mm) Weight (g) Volume (cm3)

Transceiver with BL-5K

1200mAh li-ion battery

back

103 x 50 x 16.0 126.5 76

Main RF characteristics for GSM850/900/1800/1900 and WCDMA VIII/II/I phones

Parameter Unit

Cellular system GSM850, EGSM900, GSM1800/1900, WCDMA VIII

(900), WCDMA II (1900) and WCDMA I (2100)

Rx frequency band GSM850: 869 - 894 MHz

EGSM900: 925 - 960 MHz

GSM1800: 1805 - 1880 MHz

GSM1900: 1930 - 1990 MHz

WCDMA VIII (900): 925- 960 MHz

WCDMA II (1900): 1930-1990MHz

WCDMA I (2100): 2110 - 2170 MHz

Tx frequency band GSM850: 824 - 849 MHz

EGSM900: 880 - 915 MHz

GSM1800: 1710 - 1785 MHz

GSM1900: 1850 - 1910 MHz

WCDMA VIII (900): 880 - 915 MHz

WCDMA II (1900): 1850-1910MHz

WCDMA I (2100): 1920 - 1980 MHz

RM-333; RM-334; RM-335

General Information

Page 1 –10 COMPANY CONFIDENTIAL Issue 2

Parameter Unit

Output power GSM850: +5 ...+33dBm/3.2mW ... 2W

GSM900: +5 … +33dBm/3.2mW … 2W

GSM1800: +0 … +30dBm/1.0mW … 1W

GSM1900: +0 … +30dBm/1.0mW … 1W

WCDMA VIII (900): -50 ... +24 dBm/0.01μW ...

251.2mW

WCDMA II (1900): -50 ... +24dBm/0.01µW ...

251.2mW

WCDMA I (2100): -50 ... +24 dBm/0.01μW ...

251.2mW

EDGE output power EDGE850: +5 … +29dBm/3.2mW … 794mW

EDGE900: +5 … +29dBm/3.2mW … 794mW

EDGE1800: +0 … +26dBm/1.0mW … 400mW

EDGE1900:+0 … +26dBm/1.0mW … 400mW

Number of RF channels GSM850: 124

GSM900: 174

GSM1800: 374

GSM1900: 299

WCDMA VIII (900): 152

WCDMA II (1900): 289

WCDMA I (2100): 277

Channel spacing 200 kHz (WCDMA II 100/200 kHz)

Number of Tx power levels GSM850: 15

GSM900: 15

GSM1800: 16

GSM1900: 16

WCDMA VIII (900): 75

WCDMA II (1900): 75

WCDMA I (2100): 75

Main RF characteristics for GSM850/900/1800/1900 and WCDMA V/II/I phones

Parameter Unit

Cellular system GSM850, EGSM900, GSM1800/1900, WCDMA V (850), WCDMA II

(1900) and WCDMA I (2100)

RM-333; RM-334; RM-335

General Information

Issue 2 COMPANY CONFIDENTIAL Page 1 –11

Parameter Unit

Rx frequency band GSM850: 869 - 894MHz

EGSM900: 925 - 960 MHz

GSM1800: 1805 - 1880 MHz

GSM1900: 1930 - 1990 MHz

WCDMA V (850): 869 - 894 MHz

WCDMA II (1900): 1930 - 1990 MHz

WCDMA I (2100): 2110 - 2170 MHz

Tx frequency band GSM850: 824 - 849MHz

EGSM900: 880 - 915 MHz

GSM1800: 1710 - 1785 MHz

GSM1900: 1850 - 1910 MHz

WCDMA V (850): 824 - 849 MHz

WCDMA II (1900): 1850 - 1910 MHz

WCDMA I (2100): 1920 - 1980 MHz

Output power GSM850: +5 ...+33dBm/3.2mW ... 2W

GSM900: +5 … +33dBm/3.2mW … 2W

GSM1800: +0 … +30dBm/1.0mW … 1W

GSM1900: +0 … +30dBm/1.0mW … 1W

WCDMA V (850): -50 ... +24 dBm/0.01μW ... 251.2mW

WCDMA II (1900): -50 ... +24 dBm/0.01μW ... 251.2mW

WCDMA I (2100): -50 ... +24 dBm/0.01μW ... 251.2mW

EDGE output power EDGE850: +5 … +29dBm/3.2mW … 794mW

EDGE900: +5 … +29dBm/3.2mW … 794mW

EDGE1800: +0 … +26dBm/1.0mW … 400mW

EDGE1900:+0 … +26dBm/1.0mW … 400mW

Number of RF channels GSM850: 124

GSM900: 174

GSM1800: 374

GSM1900: 299

WCDMA V (850): 108

WCDMA II (1900): 289

WCDMA I (2100): 277

Channel spacing 200 kHz (WCDMA V and II 100/200 kHz)

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General Information

Page 1 –12 COMPANY CONFIDENTIAL Issue 2

Parameter Unit

Number of Tx power levels GSM850: 15

GSM900: 15

GSM1800: 16

GSM1900: 16

WCDMA V (850): 75

WCDMA II (1900): 75

WCDMA I (2100): 75

Battery endurance

Battery Capacity (mAh) Talk time Stand-by

BL-5K 1200 up to 190 mins (WCDMA)

& 260 mins (GSM)

up to 320 hrs (WCDMA) &

320 hrs (GSM)

Charging times

AC-10

1h 30 min

Environmental conditions

Environmental

condition Ambient temperature Notes

Normal operation -10 oC ... +55 oCSpecifications fulfilled

Reduced performance 55 oC ... +70 oCOperational only for short periods

Intermittent or no

operation -40 oC ... -15 oC and +70 oC ... +85oCOperation not guaranteed but an

attempt to operate will not damage

the phone

No operation or

storage <-40 oC and >+85 oCNo storage. An attempt to operate

may cause permanent damage

Charging allowed -15 oC ... +55 oC

Long term storage

conditions 0 oC ... +85 oC

RM-333; RM-334; RM-335

General Information

Issue 2 COMPANY CONFIDENTIAL Page 1 –13

Environmental

condition Ambient temperature Notes

Humidity and water

resistance

Relative humidity range is 5 to 95%.

Condensed or dripping water may

cause intermittent malfunctions.

Protection against dripping water

has to be implemented in (enclosure)

mechanics.

Continuous dampness will cause

permanent damage to the module.

RM-333; RM-334; RM-335

General Information

Page 1 –14 COMPANY CONFIDENTIAL Issue 2

2 — Service Tools and Service

Concepts

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 2 –1

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Service Tools and Service Concepts

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Page 2 –2 COMPANY CONFIDENTIAL Issue 2

Table of Contents

Service tools............................................................................................................................................................2–5

Product specific tools........................................................................................................................................2–5

FS-73..............................................................................................................................................................2–5

MJ-161 ...........................................................................................................................................................2–6

RJ-230 ............................................................................................................................................................2–6

SA-154 ...........................................................................................................................................................2–6

SS-100............................................................................................................................................................2–7

SS-157............................................................................................................................................................2–7

General tools......................................................................................................................................................2–7

RJ-166 ............................................................................................................................................................2–7

RJ-209 ...........................................................................................................................................................2–7

RJ-227 ............................................................................................................................................................2–8

RJ-93 ..............................................................................................................................................................2–8

ST-53..............................................................................................................................................................2–8

ST-64..............................................................................................................................................................2–8

ST-70..............................................................................................................................................................2–8

Cables..................................................................................................................................................................2–8

CA-101 ...........................................................................................................................................................2–9

CA-128RS .......................................................................................................................................................2–9

CA-31D ...........................................................................................................................................................2–9

CA-35S............................................................................................................................................................2–9

PCS-1........................................................................................................................................................... 2–10

XCS-1........................................................................................................................................................... 2–10

XCS-4........................................................................................................................................................... 2–10

Service concepts .................................................................................................................................................. 2–11

POS (Point of Sale) flash concept .................................................................................................................. 2–11

Flash concept with FPS-10............................................................................................................................. 2–12

CU-4 flash concept with FPS-10..................................................................................................................... 2–13

Flash concept with FPS-10 and SB-6............................................................................................................. 2–14

Flash concept with SS-46 and CA-89DS ........................................................................................................ 2–15

Flash concept with SS-62 and CA-89DS ........................................................................................................ 2–16

Flash concept with FPS-10, SS-62 and SB-6 ................................................................................................. 2–17

Flash concept with FPS-10, SS-62 and SB-7 ................................................................................................. 2–18

Module jig service concept............................................................................................................................ 2–19

Module jig service concept with SB-6........................................................................................................... 2–20

RF testing concept with RF coupler .............................................................................................................. 2–21

Service concept for RF testing and RF/BB tuning........................................................................................ 2–22

List of Figures

Figure 2 POS flash concept ................................................................................................................................. 2–11

Figure 3 Basic flash concept with FPS-10.......................................................................................................... 2–12

Figure 4 CU-4 flash concept with FPS-10........................................................................................................... 2–13

Figure 5 Flash concept with FPS-10 and SB-6................................................................................................... 2–14

Figure 6 Flash concept with SS-46 and CA-89DS .............................................................................................. 2–15

Figure 7 Flash concept with SS-62 and CA-89DS .............................................................................................. 2–16

Figure 8 Flash concept with FPS-10, SS-62 and SB-6 ....................................................................................... 2–17

Figure 9 Flash concept with FPS-10, SB-7 and JBT-9........................................................................................ 2–18

Figure 10 Module jig service concept................................................................................................................ 2–19

Figure 11 Module jig service concept with SB-6............................................................................................... 2–20

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –3

Figure 12 RF testing concept with RF coupler.................................................................................................. 2–21

Figure 13 Service concept for RF testing and RF/BB tuning............................................................................ 2–22

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –4 COMPANY CONFIDENTIAL Issue 2

Service tools

Product specific tools

The table below gives a short overview of service devices that can be used for testing, error analysis, and

repair of product RM-333; RM-334; RM-335. For the correct use of the service devices, and the best effort of

workbench setup, please refer to various concepts.

FS-73 Flash adapter

•FS-73 is equipped with a clip interlock system

•provides standardised interface towards Control Unit

•multiplexing between USB and FBUS media, controlled by VUSB

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –5

MJ-161 Module jig

MJ-161 is meant for component level troubleshooting.

The jig includes RF interface for Bluetooth, WLAN and GPS. In addition,

it has the following features:

•Provides mechanical interface with the engine module

•Provides galvanic connection to all needed test pads in module

•Multiplexing between USB and FBUS media, controlled by Vusb

•Connector for control unit

•Access for Audio-, MMC, and USB connectors

•Module jig attenuation values:

Band F Attenuation

GSM850 TX 824-849 0.4dB

GSM850 RX 869-894 0.4dB

EGSM900 TX 880-915 0.4dB

EGSM900 RX 935-960 0.4dB

GSM1800 TX 1710-1785 0.6dB

GSM1800 RX 1805-1880 0.6dB

GSM1900 TX 1850-1910 0.6dB

GSM1900 RX 1930-1990 0.6dB

WCDMA850 TX 824-849 0.4dB

WCDMA850 RX 869-894 0.4dB

WCDMA1900 TX 1850-1910 0.6dB

WCDMA1900 RX 1930-1990 0.6dB

RJ-230 Soldering jig

The jig is used for soldering and as a rework jig for the system module.

It is made of lead-free rework compatible material.

SA-154 RF coupler

SA-154 is an RF coupler for WCDMA and GSM RF testing. It is used

together with the product-specific flash adapter.

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –6 COMPANY CONFIDENTIAL Issue 2

SS-100 Camera removal tool

The camera removal tool SS-100 is used to remove/attach a camera

module from/to the camera socket of the phone PWB.

SS-157 Domesheet

alignment jig

SS-157 is used for domesheet alignment.

General tools

The table below gives a short overview of service devices that can be used for testing, error analysis, and

repair of product RM-333; RM-334; RM-335. For the correct use of the service devices, and the best effort of

workbench setup, please refer to various concepts.

RJ-166 Rework jig

RJ-166 is a jig used for soldering and as a rework jig for the engine

module. It is used together with the ST-53 stencil.

RJ-209 Rework jig

RJ-209 is used as a rework jig for the WLAN 4.0 module

This stencil takes the WLAN 4.0 module for spreading soldering paste

onto the component. This must be used together with the ST-64

rework stencil.

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –7

RJ-227 Rework jig

RJ-227 is a rework jig used when servicing the BTHFM module (D6000).

It is used together with the ST-70 rework stencil.

RJ-93 Rework jig

RJ-93 is a rework jig used with ST-40.

ST-53 Rework stencil

ST-53 is a rework stencil used with rework jig RJ-166.

ST-64 Rework stencil

ST-64 is the stencil used during rework of the WLAN 4.0 module. It

must be used together with the RJ-209 rework jig.

ST-70 Rework stencil

ST-70 rework stencil is used with RJ-227 rework jig to service the

BTHFM module (D6000).

Cables

The table below gives a short overview of service devices that can be used for testing, error analysis, and

repair of product RM-333; RM-334; RM-335. For the correct use of the service devices, and the best effort of

workbench setup, please refer to various concepts.

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –8 COMPANY CONFIDENTIAL Issue 2

CA-101 Micro USB cable

The CA-101 is a USB-to-microUSB data cable that allows connections

between the PC and the phone.

CA-128RS RF tuning cable

Product-specific adapter cable for RF tuning.

CA-31D USB cable

The CA-31D USB cable is used to connect FPS-10 or FPS-11 to a PC. It is

included in the FPS-10 and FPS-11 sales packages.

CA-35S Power cable

CA-35S is a power cable for connecting, for example, the FPS-10 flash

prommer to the Point-Of-Sales (POS) flash adapter.

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –9

PCS-1 Power cable

The PCS-1 power cable (DC) is used with a docking station, a module

jig or a control unit to supply a controlled voltage.

XCS-1 Service cable

The XCS-1 service cable is used to connect FLS-4S to the POS flash

adapter for supplying a controlled operating voltage and data

connection.

XCS-4 Modular cable

XCS-4 is a shielded (one specially shielded conductor) modular cable

for flashing and service purposes.

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –10 COMPANY CONFIDENTIAL Issue 2

Service concepts

POS (Point of Sale) flash concept

Figure 2 POS flash concept

Type Description

Product specific tools

BL-5K Battery

Other tools

FLS-5 POS flash dongle

PC with Phoenix service software

Cables

CA-101 USB connectivity cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –11

Flash concept with FPS-10

Figure 3 Basic flash concept with FPS-10

Type Description

Product specific devices

FS-73 Flash adapter

Other devices

FPS-10 Flash prommer box

PKD-1/PK-1 SW security device

SS-46 Interface adapter

PC with Phoenix service software

Cables

XCS-4 Modular cable

CA-35S Power cable

USB cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –12 COMPANY CONFIDENTIAL Issue 2

CU-4 flash concept with FPS-10

Figure 4 CU-4 flash concept with FPS-10

Type Description

Product specific devices

FS-73 Flash adapter

Other devices

CU-4 Control unit

FPS-10 Flash prommer box

PKD-1/PK-1 SW security device

SS-62 Flash adapter base

SX-4 Smart card

PC with Phoenix service software

Cables

PCS-1 Power cable

XCS-4 Modular cable

Standard USB cable

USB cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –13

Flash concept with FPS-10 and SB-6

Figure 5 Flash concept with FPS-10 and SB-6

Type Description

Product specific tools

FS-73 Flash adapter

Other tools

FPS-10 Flash prommer box

PKD-1/PK-1 SW security device

SS-46 Interface adapter

SB-6 Bluetooth test and interface box

PC with Phoenix service software

Cables

XCS-4 Modular cable

CA-35S Power cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –14 COMPANY CONFIDENTIAL Issue 2

Type Description

USB cable

Flash concept with SS-46 and CA-89DS

Figure 6 Flash concept with SS-46 and CA-89DS

Type Description

Product specific tools

FS-73 Flash adapter

Other tools

FLS-5 Flash device

SS-46 Interface adapter

PC with Phoenix service software

Cables

CA-89DS Cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –15

Flash concept with SS-62 and CA-89DS

Figure 7 Flash concept with SS-62 and CA-89DS

Type Description

Product specific tools

FS-73 Flash adapter

Other tools

CU-4 Control unit

FLS-5 Flash device

SS-62 Flash adapter base

PC with Phoenix service software

Cables

CA-89DS Cable

PCS-1 Power cable

USB cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –16 COMPANY CONFIDENTIAL Issue 2

Flash concept with FPS-10, SS-62 and SB-6

Figure 8 Flash concept with FPS-10, SS-62 and SB-6

Type Description

Product specific tools

FS-73 Flash adapter

Other tools

CU-4 Control unit

FPS-10 Flash prommer box

PKD-1/PK-1 SW security device

SS-62 Flash adapter base

SB-6 Bluetooth test and interface box

SX-4 Smart card

PC with Phoenix service software

Cables

XCS-4 Modular cable

PCS-1 Power cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –17

Type Description

USB cable

Flash concept with FPS-10, SS-62 and SB-7

Figure 9 Flash concept with FPS-10, SB-7 and JBT-9

Type Description

Product specific tools

FS-73 Flash adapter

Other tools

CU-4 Control unit

FPS-10 Flash prommer box

PKD-1/PK-1 SW security device

SB-7 WLAN test box

SS-62 Flash adapter base

SX-4 Smart card

PC with Phoenix service software

Cables

XCS-4 Modular cable

PCS-1 Power cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –18 COMPANY CONFIDENTIAL Issue 2

Type Description

USB cable

Module jig service concept

Figure 10 Module jig service concept

Type Description

Phone specific devices

MJ-161 Module jig

Other devices

CU-4 Control unit

FPS-10 Flash prommer box

PK-1 SW security device

SX-4 Smart card

PC with VPOS and Phoenix service software

Measurement equipment

Cables

PCS-1 DC power cable

XCS-4 Modular cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –19

Type Description

XRF-1 RF cable

CA-128RS RF tuning cable

USB cable

GPIB control cable

Module jig service concept with SB-6

Figure 11 Module jig service concept with SB-6

Type Description

Product specific tools

MJ-161 Module jig

Other tools

CU-4 Control unit

FPS-10 Flash prommer box

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –20 COMPANY CONFIDENTIAL Issue 2

Type Description

SB-6 Bluetooth test and interface box

PKD-1 SW security device

SX-4 Smart card

Measurement equipment

PC with Phoenix service software

Cables

PCS-1 DC power cable

XCS-4 Modular cable

XRS-6 RF cable

CA-128RS RF tuning cable

GPIB control cable

USB cable

RF testing concept with RF coupler

Figure 12 RF testing concept with RF coupler

Type Description

Product specific devices

FS-73 Flash adapter

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –21

Type Description

SA-154 RF coupler

Other devices

CU-4 Control unit

SX-4 Smart card

FPS-10 Flash prommer box

PKD-1/PK-1 SW security device

SS-62 Flash adapter base

Measurement equipment

PC with Phoenix service software

Cables

PCS-1 Power cable

XCS-4 Modular cable

XRS-6 RF cable

GPIB control cable

USB cable

Service concept for RF testing and RF/BB tuning

Figure 13 Service concept for RF testing and RF/BB tuning

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Page 2 –22 COMPANY CONFIDENTIAL Issue 2

Type Description

Product specific devices

MJ-161 Module jig

Other devices

CU-4 Control unit

PK-1/PKD-1 SW security device

SX-4 Smart card

Measurement equipment

Smart card reader

PC with Phoenix service software

Cables

DAU-9S MBUS cable

PCS-1 DC power cable

XRS-6 RF cable

CA-128RS RF tuning cable

GPIB control cable

USB cable

RM-333; RM-334; RM-335

Service Tools and Service Concepts

Issue 2 COMPANY CONFIDENTIAL Page 2 –23

RM-333; RM-334; RM-335

Service Tools and Service Concepts

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Page 2 –24 COMPANY CONFIDENTIAL Issue 2

3 — BB Troubleshooting

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 3 –1

RM-333; RM-334; RM-335

BB Troubleshooting

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Page 3 –2 COMPANY CONFIDENTIAL Issue 2

Table of Contents

Baseband main troubleshooting..........................................................................................................................3–5

General power checking ........................................................................................................................................3–7

Backup battery troubleshooting...........................................................................................................................3–8

Dead or jammed device troubleshooting......................................................................................................... 3–10

Keyboard troubleshooting ................................................................................................................................. 3–11

Hall sensor troubleshooting............................................................................................................................... 3–13

TV- out troubleshooting ..................................................................................................................................... 3–14

General power checking troubleshooting ........................................................................................................ 3–15

USB troubleshooting ........................................................................................................................................... 3–16

SIM card troubleshooting ................................................................................................................................... 3–17

MicroSD card troubleshooting............................................................................................................................ 3–18

Combo memory troubleshooting ...................................................................................................................... 3–20

Flash programming troubleshooting................................................................................................................ 3–21

USB charging troubleshooting........................................................................................................................... 3–24

Clocking troubleshooting ................................................................................................................................... 3–25

Power key troubleshooting................................................................................................................................ 3–26

Naviscroll troubleshooting................................................................................................................................. 3–27

User interface troubleshooting.......................................................................................................................... 3–28

Display Troubleshooting..................................................................................................................................... 3–29

Display Troubleshooting................................................................................................................................ 3–29

Illumination troubleshooting ....................................................................................................................... 3–30

LED driver troubleshooting ........................................................................................................................... 3–33

I/O expander troubleshooting ...................................................................................................................... 3–35

Audio Troubleshooting....................................................................................................................................... 3–35

Audio troubleshooting test instructions...................................................................................................... 3–35

External earpiece troubleshooting............................................................................................................... 3–39

DAC33 troubleshooting.................................................................................................................................. 3–40

External microphone troubleshooting ........................................................................................................ 3–41

Internal earpiece troubleshooting .............................................................................................................. 3–42

Internal handsfree speaker troubleshooting ............................................................................................. 3–43

Internal microphone troubleshooting ........................................................................................................ 3–44

Vibra troubleshooting.................................................................................................................................... 3–45

ALS Technical Description and Troubleshooting.............................................................................................. 3–46

Ambient Light Sensor..................................................................................................................................... 3–46

ALS troubleshooting....................................................................................................................................... 3–46

Re-tuning ALS.................................................................................................................................................. 3–47

Bluetooth and FM Radio Troubleshooting........................................................................................................ 3–48

Introduction to Bluetooth/FM radio troubleshooting................................................................................ 3–48

Bluetooth BER test.......................................................................................................................................... 3–51

Bluetooth and FM radio self tests in Phoenix.............................................................................................. 3–52

Bluetooth troubleshooting ........................................................................................................................... 3–53

FM radio troubleshooting.............................................................................................................................. 3–53

FM radio testing.............................................................................................................................................. 3–55

GPS Troubleshooting........................................................................................................................................... 3–55

GPS layout and basic test points................................................................................................................... 3–55

GPS Settings for Phoenix ............................................................................................................................... 3–56

GPS control................................................................................................................................................. 3–56

Quick Test window.................................................................................................................................... 3–57

GPS failure troubleshooting.......................................................................................................................... 3–59

WLAN Troubleshooting....................................................................................................................................... 3–59

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –3

WLAN functional description......................................................................................................................... 3–59

WLAN settings for Phoenix............................................................................................................................ 3–60

WLAN functional tests.................................................................................................................................... 3–62

WLAN auto tuning.......................................................................................................................................... 3–64

List of Figures

Figure 14 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is

connected .................................................................................................................................................. 3–37

Figure 15 Single-ended output waveform of the Ext_in_IHF_out out loop measurement when speaker

is connected (measured at speaker pads), no filter is used ................................................................. 3–37

Figure 16 Single-ended output waveform of the Ext_in_Ext_out loop........................................................... 3–38

Figure 17 Single-ended output waveform of the Digital_stereo_microphone_in_Ext_out loop.................. 3–38

Figure 18 Ambient Light Sensor ........................................................................................................................ 3–46

Figure 19 Bluetooth/WLAN antenna ................................................................................................................. 3–49

Figure 20 BT/FM component layout .................................................................................................................. 3–51

Figure 21 Bluetooth and FM radio self tests in Phoenix.................................................................................. 3–52

Figure 22 GPS layout and basic test points....................................................................................................... 3–56

Figure 23 GPS Control dialogue box .................................................................................................................. 3–57

Figure 24 GPS Quick Test window ..................................................................................................................... 3–58

Figure 25 WLAN circuitry .................................................................................................................................... 3–60

Figure 26 WLAN auto tune settings................................................................................................................... 3–65

Figure 27 WLAN auto tune results..................................................................................................................... 3–66

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –4 COMPANY CONFIDENTIAL Issue 2

Baseband main troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –5

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –6 COMPANY CONFIDENTIAL Issue 2

General power checking

Check the following voltages:

Signal

name Regulator Sleep Idle Nominal

voltage Main user Notes

VIO_V AVILMA ON ON 1.82 Not used

VBACK AVILMA ON ON 2.5 RTC circuitry

VSIM1 AVILMA ON ON 1.8/3.0 Sim card

VSIM2 AVILMA ON ON 3.0 Digital microphone

VAUX AVILMA OFF OFF 2.78 Accelerometer, Hall

switches, 2nd

camera

VANA AVILMA ON ON 2.5 Vilma internal

VR1 AVILMA OFF ON 2.5 VCTXO

VRFC AVILMA ON OFF 1.8 RAPIDO converter

VRCP1 AVILMA OFF OFF 4.75 RFmodule RF active

VIO LM3677 ON ON 1.8 Rapido , Betty I/O

VDRAM LM3677 ON ON 1.8 M3 Memory

VCORE TPS62350 ON ON 1.2 Rapido core

VDAC LP3985 3.0 DAC33 On when

used

VCAM_1V8 LM3677 OFF OFF 1.8 Julie, LP5952

VCAM_1V3 OFF OFF 1.3 Julie,core

VCAM_2V8 OFF OFF 2.8 Main camera

VSD LP3930 OFF OFF 2.9 SD card On when

used

V_ELVDD TPS65136 OFF OFF 4.6 Falcon OLED Display

V_ELVSS TPS65136 OFF OFF -4.9 Falcon OLED Display

VCORE_WD LP5952 OFF OFF 1.5 White Dwarf Core

VBAT 3.6

VCORE BETTY OFF OFF 1.2 Not used

VDRAM_V AVILMA ON 1.82 Not used

VLED BETTY 6-18 Not used

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –7

Backup battery troubleshooting

Verify that the backup battery G2200 is empty (U<1V). Switch the phone on. Measure voltage of the battery

when the main battery is connected to the phone and the phone is switched on. Wait a few minutes and

monitor that the backup battery voltage rises. Switch off the phone, disconnect the main battery and monitor

that the voltage of the backup battery decreases. Normal behaviour of the voltage is described in the figures

below:

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –8 COMPANY CONFIDENTIAL Issue 2

If the voltage rises and falls quickly, check the back-up battery G2200 contacts for loose soldering or short-

circuit, and repair or change G2200 if necessary. If the voltage stays ~0V, check resistance VBACK against GND.

If there is no shortcircuit, AVILMA N2200 is faulty. Replace N2200.

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –9

Dead or jammed device troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –10 COMPANY CONFIDENTIAL Issue 2

Keyboard troubleshooting

Context

There are two possible failure modes in the keyboard module:

1 One or more keys are stuck, so that the key(s) does not react when you press a keydome. This kind of

failure is caused by mechanical reasons (dirt, corrosion).

2Malfunction of several keys at the same time; this happens when one or more rows or columns are failing

(shortcut or open connection). For a more detailed description of the keyboard and keymatrix, see section

Keyboard.

If the failure mode is not clear, start with the Keyboard Test in

Phoenix

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –11

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –12 COMPANY CONFIDENTIAL Issue 2

Hall sensor troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –13

TV- out troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –14 COMPANY CONFIDENTIAL Issue 2

General power checking troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –15

USB troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –16 COMPANY CONFIDENTIAL Issue 2

SIM card troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –17

MicroSD card troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –18 COMPANY CONFIDENTIAL Issue 2

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –19

Combo memory troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –20 COMPANY CONFIDENTIAL Issue 2

Flash programming troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –21

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –22 COMPANY CONFIDENTIAL Issue 2

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –23

USB charging troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –24 COMPANY CONFIDENTIAL Issue 2

Clocking troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –25

Power key troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –26 COMPANY CONFIDENTIAL Issue 2

Naviscroll troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –27

User interface troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –28 COMPANY CONFIDENTIAL Issue 2

Display Troubleshooting

Display blank

There is no image on the display. Display looks the same as if the phone is off even when the phone is on.

Image on display not correct

Image on the display can be corrupted or part of the image can be missing. If part of image is missing change

the UI module. If the image is otherwise corrupted, follow the path below.

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –29

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –30 COMPANY CONFIDENTIAL Issue 2

Illumination troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –31

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –32 COMPANY CONFIDENTIAL Issue 2

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –33

LED driver troubleshooting

Troubleshooting flow

RM-333; RM-334; RM-335

BB Troubleshooting

Page 3 –34 COMPANY CONFIDENTIAL Issue 2

I/O expander troubleshooting

Troubleshooting flow

Audio Troubleshooting

Audio troubleshooting test instructions

Single-ended external earpiece and differential internal earpiece outputs can be measured either with a

single-ended or a differential probe.

When measuring with a single-ended probe each output is measured against the ground.

Internal handsfree output is measured using a current probe, if a special low-pass filter designed for

measuring a digital amplifier is not available. Note also that when using a current probe, the input signal

frequency must be set to 2 kHz.

The input signal for each loop test can be either single-ended or differential. Exception to this is a digital

microphone, which needs input signal from an external sound source (laptop speaker) to playback eg. 1kHz

sine wave from 5cm distance

RM-333; RM-334; RM-335

BB Troubleshooting

Issue 2 COMPANY CONFIDENTIAL Page 3 –35

Required equipment

The following equipment is needed for the tests:

•Oscilloscope

•Function generator (sine waveform)

•Current probe (Internal handsfree DPMA output measurement)

•Phoenix service software

•Battery voltage 3.7V

•Sound source (laptop speaker or B&K type 4231 calibrator)

Test procedure

Audio can be tested using the Phoenix audio routings option. Three different audio loop paths can be

activated:

•External microphone to Internal earpiece

•External microphone to Internal handsfree speaker

•Internal microphone to External earpiece

Each audio loop sets routing from the specified input to the specified output enabling a quick in-out test.

Loop path gains are fixed and they cannot be changed using Phoenix. Correct pins and signals for each test

are presented in the following table.

Phoenix audio loop tests and test results

The results presented in the table apply when no accessory is connected and battery voltage is set to 3.7V.

Earpiece, internal microphone and speaker are in place during measurement. Applying a headset accessory

during measurement causes a significant drop in measured quantities.

The gain values presented in the table apply for a differential output vs. single-ended/differential input.

Loop test Input

terminal Output

terminal Path gain

[dB]

(fixed)

Input

voltage

[mVp-p]

Outout

voltage

[mVp-p]

Output DC

level [V] Output

current

[mA]

External

Mic to

External

Earpiece

HS_MIC &

GND

HS_EAR_L

& GND

-8.6 1000 367 1.2 NA

HS_EAR_R

& GND

External

Mic to

Internal

Earpiece

HS_MIC &

GND

EarP & -10 1000 310 1.2 NA

GND

EarN &

GND

External

Mic to

Internal

handsfre

HS_MIC &

GND

J2103 &

J2104

-6 1000

J2101 &

J2102

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Loop test Input

terminal Output

terminal Path gain

[dB]

(fixed)

Input

voltage

[mVp-p]

Outout

voltage

[mVp-p]

Output DC

level [V] Output

current

[mA]

Digital

Mic to

External

Earpiece

Acoustica

l input,

1KHz sine

wave

HS_EAR_L

& GND

NA 94 dB SPL 100 NA

Measurement data

Earpiece signal

Figure 14 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is connected

Integrated handsfree signal

Figure 15 Single-ended output waveform of the Ext_in_IHF_out out loop measurement when speaker is connected

(measured at speaker pads), no filter is used

External output from AV

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Figure 16 Single-ended output waveform of the Ext_in_Ext_out loop

External output from AV (acoustic input)

Figure 17 Single-ended output waveform of the Digital_stereo_microphone_in_Ext_out loop

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External earpiece troubleshooting

Troubleshooting flow

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DAC33 troubleshooting

Troubleshooting flow

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External microphone troubleshooting

Troubleshooting flow

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Internal earpiece troubleshooting

Troubleshooting flow

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Internal handsfree speaker troubleshooting

Troubleshooting flow

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Internal microphone troubleshooting

Troubleshooting flow

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Vibra troubleshooting

Troubleshooting flow

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ALS Technical Description and Troubleshooting

Ambient Light Sensor

Figure 18 Ambient Light Sensor

Ambient Light Sensor consists of the following components:

•Light guide

•Ambient Light Sensor (ALS)

ALS is a digital I2C interface component, having two channels with different spectral sensitivities. When

combined, the component responds to illuminance similar as human eye.

•Vdd Filtering capacitor C1103

Ambient Light Sensor information is used to control keypad and display brightness of the phone.

Keyboard backlight is turned OFF, when it’s not needed. Display brightness is dimmed, when environment

lighting is dark.

Ambient Light Sensor is calibrated in production and can be re-tuned in service points though not

recommended unless calibration coefficient are lost for some reason

ALS troubleshooting

Context

Functionality check:

Steps

1. Connect phone to Phoenix and set the phone (e.g. on the table) so that the amount of ambient light seen

by ALS is as stable as possible.

2. Start Phoenix

3. Choose File -> Scan product

4. Choose Testing -> Display Test

5. Open the Lights tab, check Ambient Light Sensor check box, click Read, cover the sensor and click Read

again. When covered, Luminance reading should be less than after clicking Read without covering the

sensor.

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6. If component doesn’t give any reading or reading doesn’t change when sensor is/is not covered, replace

the part.

Note: After replacing the ALS. If calibration values of the new sensor are lost or for some other

reason, ALS re-tuning is required (see instructions later in this document).

When doing the ALS calibration procedure, it is required to have a reference phone, which includes

calibrated ALS. ALS re-tuning instructions show why the reference phone is needed.

Re-tuning ALS

Steps

1. Connect reference phone to Phoenix and set the phone (e.g. on the table) so that the amount of ambient

light seen by ALS is as stable as possible.

2. Start Phoenix.

3. Choose File→Scan Product.

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4. Choose Tuning -> Ambient Light Sensor Calibration. You should see the following window:

5. Read AD-count values for Channel 0 and Channel 1 by click Read button and write them down.

6. Repeat 1-5 for the phone to be calibrated and make sure the phone to be calibrated is located in the

same place as reference phone was when luminance reading was taken.

7. Calculate co-efficient from reference phone and phone to be calibrated AD-count values by division: Co-

efficient = AD-count(reference phone) / AD-count(phone to be calibrated), write down the calculated co-

efficient values.

8. -> Iterate by changing Channel 0 and Channel 1 (reference level) values (remove cross from ‘Use default

values only’). After writing some value to Channel 0 and Channel 1 (reference value), calibrate button

must be pressed. Stop iterating when Co-efficient is equal to Co-efficient calculated in step 7. Note that

decimal numbers should be used in the iteration in order to achieve enough precision (e.g. 200.2455)

9. After having same Co-efficient value in “Co-efficient” textbox as the calculated value, make sure that

ambient light values (read using Testing → Display Test → “Luminance” textbox) are almost the same

in reference phone and calibrated phone. Remember that illuminance readings for reference and

calibrated phones must be done in the same ambient light conditions. If illuminance values differs a lot

(difference max. +- 10%), repeat whole ALS re-tuning procedure.

10. To end the calibration, click Close.

Bluetooth and FM Radio Troubleshooting

Introduction to Bluetooth/FM radio troubleshooting

Bluetooth/WLAN antenna

The BT RF signal is routed from BTFMRDS2.1 through the WLAN module to the shared WLAN/BT antenna in

the phone's C-cover.

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Figure 19 Bluetooth/WLAN antenna

Introduction to Bluetooth/FM radio troubleshooting

The Bluetooth and FM radio are combined in the same ASIC, so both features are checked when

troubleshooting.

The following problems can occur with the Bluetooth and FM radio hardware:

Symptom Problem Repair solution

Unable to switch on Bluetooth on

phone user interface

Open circuit solder joints or

component failure of BTH/FM

ASIC/module BB ASICs or SMD

components.

Replacement of Bluetooth/

FM ASIC/module

Able to send data file to another

Bluetooth device, but unable to

hear audio through functional

Bluetooth headset

Open circuit solder joints or

component failure of BTH/FM

ASIC/module BB ASICs.

Replacement of Bluetooth/

FM ASIC/module

Able to switch on Bluetooth on

phone user interface, but unable

to detect other Bluetooth devices

Open circuit solder joints or

Pogo Pins not making contact

with c-cover

Repair or replace c-cover

Able to turn on FM radio and

Bluetooth on phone user

interface, but unable to detect

local FM radio stations with Nokia

headset inserted

Open circuit solder joints or

detached component in FM

antenna circuit

Repair of FM antenna

connection or FM circuit

component

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Symptom Problem Repair solution

Able to perform scans to detect

local FM radio stations with

functional Nokia headset

inserted, but unable to hear FM

audio through headset

Open circuit solder joints or

detached component in FM

audio path between Bluetooth/

FM ASIC and headset

Repair of FM audio circuit

Users may experience the following problems resulting in functional phones being returned to the repair

centre:

Symptom Problem Repair solution

Bluetooth feature does not

operate as desired with another

Bluetooth device

Bluetooth Profile implemented

in Bluetooth accessory not

supported in Nokia phone

Use Bluetooth accessory with

Bluetooth profiles supported

by phone

Poor FM radio reception (unable

to detect many radio stations)

Nokia headset not being used Use Nokia headset

Test coverage

The tests listed in the table below should be performed to verify whether the Bluetooth and FM receiver and

transmitter are functional. The use of Self Tests are described in section

BT and FM Self Tests in Phoenix

Test Test Coverage Repair solution

Blueooth Self Test: ST_LPRF_IF_TEST Bluetooth-FM ASIC UART interface

(controls Bluetooth and FM

receiver and transmitter)

Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

Bluetooth Self Test:

ST_BT_WAKEUP_TEST

Bluetooth ASIC interrupt control

interface

Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

Bluetooth Self Test:

ST_LPRF_AUDIO_LINES_TEST

Bluetooth ASIC PCM interface Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

Bluetooth Functional Test: BER test

with BT-Box or functional test with

other Bluetooth device

Bluetooth antenna circuit Repair of Bluetooth antenna

circuit (including RF filter or

WLAN switch if fitted)

FM Radio Self Test: ST_RADIO_TEST FM Radio I2C interface Replacement of Bluetooth/FM

ASIC (or repair of phone BB)

FM Radio Functional Test: Perform

scan for local radio stations and

check station list displayed on

phone

FM receiver antenna circuit Repair of FM antenna circuit

(between BTHFM ASIC and

headset connector)

FM Radio Functional Test: Listen to

local radio station

FM receiver audio circuit Repair of FM receiver audio

circuit (between BTHFM ASIC

and headset connector)

The self tests run from Phoenix software are used for fault diagnosis.

If Phoenix software is not available the functional tests with phone accessories are sufficient to verify the

functionality Bluetooth and FM radio receiver and transmitter.

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Bluetooth/FM radio component layout and test points

Figure 20 BT/FM component layout

The Bluetooth antenna is product specific (antenna integrated into phone C cover). On phones with WLAN,

the Bluetooth RF signal is routed through a WLAN front-end module and a shared Bluetooth / WLAN antenna

is used. The FM RF signal is routed through a product specific FM antenna matching circuit to the phone

headset connector. The FM radio audio signal is routed to the headset connector through the BB ASIC shared

by the phone audio functions.

Bluetooth BER test

Prerequisites

JBT-9, or SB-6 Bluetooth test box (BT-box) is required to perform a BER test. If a BT-box not available Bluetooth

functionality can be checked by transferring a file to another Bluetooth phone. For the BER or file transfer

test the C-cover should be fitted as the BT antenna is on the C-cover.

Steps

1. Connect data cable to phone.

2. Start

Phoenix

service software.

3. Choose File → Scan Product.

4. Choose Testing → Bluetooth LOCALS .

5. Locate the BT-box serial number (12 digits) found in the type label on the back of the JBT-9, or SB-6

Bluetooth test box.

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6. In the Bluetooth

LOCALS

window, write the 12-digit serial number on the

Counterpart BT Device

Address

line.

7. Place the BT-box near (within 10 cm) of the phone and click Start BER Test.

Bluetooth and FM radio self tests in Phoenix

Prerequisites

A flash adapter (or phone data cable) connected to a PC with Phoenix service software is required.

Steps

1. Place the phone in the flash adapter or connect data cable to phone.

2. Start

Phoenix

service software.

3. Choose File→Scan Product.

4. From the Mode drop-down menu, set mode to Local.

5. Choose Testing→Self Tests.

6. In the

Self Tests

window check the following Bluetooth and FM radio related tests:

•ST_LPRF_IF_TEST

•ST_LPRF_AUDIO_LINES_TEST

•ST_BT_WAKEUP_TEST

•ST_RADIO_TEST

7. To run the tests, click Start.

Figure 21 Bluetooth and FM radio self tests in

Phoenix

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Bluetooth troubleshooting

Troubleshooting flow

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FM radio troubleshooting

Troubleshooting flow

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FM radio testing

Steps

1. Set signal generator parameters:

•FM modulation on

•Frequency 100MHz

•FM deviation 22kHz

•Modulation frequency 1kHz

•RF level should be varied during the test to obtain good audio signal quality

•Connect suitable antenna to signal generator

Note: You may alternately use a known good FM radio broadcast as a test signal.

2. Attach the Nokia headset to the phone’s AV connector.

3. Use Scroll button to autotune to the radio frequency.

4. Set volume to suitable level.

5. Check audio quality with a headset.

GPS Troubleshooting

GPS layout and basic test points

The GPS components are located on small 2nd PWB. Satellite signals are picked up by the phones GPS antenna

in the C-cover. The signal is then routed through a filter before being processed by the GPS5350 receiver ASIC.

Verify that the GPS voltage and clock signal levels are as in RM-333 GPS schematics.

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Figure 22 GPS layout and basic test points

GPS Settings for Phoenix

GPS control

Prerequisites

A flash adapter with RF coupler connected to a PC with Phoenix service software is required. The GPS signal

should be connected to the RF coupler. Calibrate the signal level with a known good phone. Signal level will

be high (approx -45dBm) because it is a leakage connection.

Context

Use the following to test GPS using Phoenix.

Steps

1. Place phone to Flash Adaptor.

2. Start Phoenix service software.

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3. From the File menu, select Scan Product and check that the correct product version is displayed.

4. From the Testing menu, select GPS Control. This opens up

GPS Control

dialogue box, as shown in the

figure below, and enables the GPS.

Figure 23 GPS Control dialogue box

Select Idle to confirm the GPS is enabled and is in idle mode; at this point all clocks should be present,

GPS_En_Reset & SleepX should be high, and Vdd_Dig, Vcc_TCXO & Vcc_PLL/VCO will be present.

Receiver On turns on all RF sections of the ASIC and so all LDOs will be on.

Quick Test window

This test will perform 3 tests in one: Self test, Oscillator Test and CW Test and will provide a Pass/Fail Response

for each. The HW Self Test confirms basic communication with the GPS ASIC. The oscillator test confirms the

frequency accuracy of the GPS TCXO against the Ref_Clk. The CW Test confirms end-to-end connectivity

between the GPS antenna pogo pins and the GPS ASIC. It also contains a receive button.

Before this test is performed a known good phone should be tested in order to calibrate the setup. The signal

level of the Signal Generator should be adjusted so a reading of SNR 40 dB is achieved with the reference

unit. A good starting point is to set up the signal generator to -45dBm.

These checks are part of GPS failure troubleshooting (page 3–59).

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Figure 24 GPS Quick Test window

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GPS failure troubleshooting

Troubleshooting flow

WLAN Troubleshooting

WLAN functional description

The Size 4 WLAN module is designed for use with a single antenna shared between itself and a co-located

BT device. The WLAN SW is downloaded from the host engine when the WLAN is turned on over the dedicated

SPI interface. BT and WLAN have their own 38,4MHz TCXO.

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Figure 25 WLAN circuitry

WLAN settings for Phoenix

Use the following to test WLAN using Phoenix:

1 Set phone into Local Mode .

2 From the File menu, select Scan Product and check that the correct product version is displayed

3 From the Testing menu, select Self Test. This opens up a Self Test dialogue box, as shown below.

Select the ST_WLAN_TEST check box as shown and then select Start button. The test turns on the WLAN, sets

up the SPI interface and then downloads the WLAN firmware into the WLAN module. During the download

the WLAN acknowledges the data blocks and so the self test is a good way to confirm that the WLAN module

is communicating with the Host. The result column will change to Passed after a few seconds if operating

properly.

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In addition, a test of the WLAN to BTH interface can be done by selecting the

ST_BT_WLAN_COEXISTENCE_TEST check box and selecting Start button.

This test verifies that the WLAN to BTH co-existence interface signals are properly connected and there are

no open circuit or shorts on the four interface signals.

The co-existence interface comprises BTH Txconfig, BTH RF Active, BTH Priority, and BTH Frequency.

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In summary these two Self tests provide a simple means of ensuring the Host engine is able to communicate

with the WLAN module and check the interface to BTH. More detailed WLAN performance test is covered in

WLAN functional test section.

WLAN functional tests

On/Off test

Prerequisites

A flash adapter connected to a PC with Phoenix service software is required.

From the testing toolbar select WLAN Configuration option. This opens the WLAN configuration dialogue

box below. Selecting the Power state option button (as indicated), the WLAN can be turned ON and OFF:

1 With Power State set to OFF, measure the dc power supply current consumption of the flash adaptor.

2 Next return the Power state to ON and re-measure the dc power supply current of the flash adaptor.

The difference between the currents in (1) and (2) should be between 190 to 220mA. When WLAN is ON, the

firmware has been downloaded and the WLAN module is in the receive state. When OFF WLAN is powered

down.

TX tests

Prerequisites

Connect complete phone assembly with C-cover to a PC with Phoenix service software using a USB data cable.

From the testing toolbar select WLAN Tx Test option shown below. This test can be used to verify TX

configuration and functionality. The default settings are sufficient for testing the TX operation, although

other channels and data rates are equally suitable. To start the test, select the Start option button:

1 Monitor the WLAN TX spectrum on a Spectrum analyser. (When making a radiated test ensure that other

WLAN devices are not transmitting as these may be detected as well, confusing the result). A typical

11MBPS TX spectrum is shown in figure below.

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2 To finish the test select the Finish option button.

The difference between the two readings should be approximately 150mA and measures the transmit current

in 11MBPS, 802.11b mode of operation.

RX Tests

Prerequisites

Connect complete phone assembly with C-cover to a PC with Phoenix service software using a USB data cable.

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There are different options available for testing the Rx path. The simplest is to use the WLAN to report Rx

packets when operating in an area where there is an active WLAN network. Simply starting an Rx test will

show the number of packets detected by the WLAN module as it monitors the network. However, it does

require a properly configured WLAN network.

From the testing toolbar select WLAN Rx Test option shown below. This test can be used to verify Rx

configuration and functionality.

To start the test, select the Start option button.

As the WLAN monitors an active WLAN network, the Rx test results window will update and show the number

of Frames received, as well as the Packer error rate.

Monitoring the detected frames is a simple method to verify the WLAN antenna and receiver path is working

properly.

WLAN auto tuning

In case of WLAN ASIC change, RF power auto tuning is needed. Connect WLAN RF test connector to CMU200

input using proper RF cable. Start Phoenix WLAN autotune window. Check the settings and verify your PC

communicates with CMU200 via GPIB.

Auto tuning procedure

1 Start tuning by pressing Tune.

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Figure 26 WLAN auto tune settings

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Figure 27 WLAN auto tune results

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4 — RF Troubleshooting

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 4 –1

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RF Troubleshooting

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Table of Contents

General RF troubleshooting ..................................................................................................................................4–5

Introduction to RF troubleshooting ................................................................................................................4–5

RF key components and test points ................................................................................................................4–6

Auto tuning.............................................................................................................................................................4–7

Introduction to RF tunings...............................................................................................................................4–7

Auto tuning........................................................................................................................................................4–7

Self Test Troubleshooting......................................................................................................................................4–7

Self test troubleshooting..................................................................................................................................4–7

Receiver Troubleshooting .....................................................................................................................................4–9

Introduction to receiver (RX) troubleshooting...............................................................................................4–9

GSM RX chain activation for manual measurements/GSM RSSI measurement ...........................................4–9

GSM receiver troubleshooting flowchart ..................................................................................................... 4–10

WCDMA RX chain activation for manual measurement.............................................................................. 4–10

WCDMA RSSI measurement ........................................................................................................................... 4–11

WCDMA receiver troubleshooting flowchart................................................................................................ 4–13

Transmitter Troubleshooting............................................................................................................................. 4–13

General instructions for transmitter (TX) troubleshooting........................................................................ 4–13

GSM transmitter troubleshooting................................................................................................................. 4–13

WCDMA transmitter troubleshooting ........................................................................................................... 4–16

Antenna Troubleshooting .................................................................................................................................. 4–17

Antenna troubleshooting.............................................................................................................................. 4–17

List of Figures

Figure 28 RF key components ...............................................................................................................................4–6

Figure 29 RF test points.........................................................................................................................................4–6

Figure 30 Phoenix GSM RSSI reading window.....................................................................................................4–9

Figure 31 Phoenix WCDMA RX Control window................................................................................................ 4–11

Figure 32 WCDMA RX generator settings .......................................................................................................... 4–12

Figure 33 Phoenix WCDMA RX power measurement window ........................................................................ 4–12

Figure 34 Phoenix GSM RF controls window..................................................................................................... 4–14

Figure 35 Antenna contacts and matching components ................................................................................ 4–18

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General RF troubleshooting

Introduction to RF troubleshooting

Most RF semiconductors are static discharge sensitive

ESD protection must be applied during repair (ground straps and ESD soldering irons).

Measuring equipment

All measurements should be done using:

•An oscilloscope for low frequency and DC measurements. Recommended probe: 10:1, 10Mohm//8pF.

•A radio communication tester including RF generator and spectrum analyser, for example Rohde & Schwarz

CMU200. (Alternatively a spectrum analyser and an RF generator can be used. Some tests in this guide are

not possible to perform if this solution is chosen).

Note: A mobile phone WCDMA transmitter should never be tested with full TX power (it is only

possible to perform the measurements in a good RF-shielded room). Even low power WCDMA

transmitters may disturb nearby WCDMA networks and cause problems to 3G cellular phone

communication in a wide area.

Note: All communication Test Set Screen dumps are from CMU200. Other testers are different.

Note: All measurements with an RF coupler should be performed in an RF-shielded environment

because nearby base stations can disturb sensitive receiver measurements. If there is no possibility

to use RF shielded environment, testing at frequencies of nearby base stations should be avoided.

Level of repair

The scope of this guideline is to verify functionality of the cellular RF block without removing RF shield.

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RF key components and test points

Figure 28 RF key components

Figure 29 RF test points

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Auto tuning

Introduction to RF tunings

RF tuning is always performed with the help of a product-specific module jig, never with an RF coupler. Using

an RF coupler in the tuning phase will cause a complete mistuning of the RF part.

Cable and adapter losses

RF cables and adapters have some losses. They have to be taken into account when the phone is tuned. As

all RF losses are frequency dependent, the user has to act very carefully and understand the measurement

setup. For RF attenuations of the module jig and RF cable, please refer to the Service Tools section.

Auto tuning

This phone can be tuned automatically.

Auto tuning is designed to align the phone's RF part easier and faster. It performs calibrations, tunings and

measurements of RX and TX. The results are displayed and logged in a result file, if initiated.

Hardware set up

For hardware requirements for auto tuning, please refer to Service concept for RF testing and RF/BB tuning

(page 4–22).

Phoenix preparations

Install the phone specific data package, for example

Nokia_firmware_RM-333_EUROPE_10.014_v41.0.exe

. This

defines phone specific settings.

Auto tuning procedure

1Make sure the phone (in the jig) is connected to the equipment. Otherwise some menus will not be shown

in Phoenix.

2 To go to autotune, select Tuning (Alt-U)→Auto-Tune (Alt-A) from the menu.

3 Start autotuning by clicking the

Tune

button.

Self Test Troubleshooting

Self test troubleshooting

Troubleshooting flow

Note: Self tests are recommended to be made when phone is in jig and 50 Ohm load is connected

to RF connector. Otherwise powertests may fail depending on antenna load.

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Receiver Troubleshooting

Introduction to receiver (RX) troubleshooting

RX can be tested by making a phone call or in local mode. For the local mode testing, use Phoenix service

software.

The main RX troubleshooting measurement is RSSI reading. This test measures the signal strength of the

received signal. For GSM RSSI measurements, see

GSM RX chain activation for manual measurements/GSM

RSSI measurement

. For a similar test in WCDMA mode, see

WCDMA RSSI measurement

GSM RX chain activation for manual measurements/GSM RSSI measurement

Prerequisites

Make the following settings in Phoenix service software:

Setting GSM850 GSM900 GSM1800 GSM1900

Phoenix Channel 190 37 700 661

Signal generator

to antenna

connector

881.66771MHz 942.46771MHz 1842.86771MHz 1960.06771MHz

(67.71kHz offset) (67.71kHz offset) (67.71kHz offset) (67.71kHz offset)

at -60dBm at -60dBm at -60dBm at -60dBm

Steps

1. Set the phone to local mode.

2. Activate RSSI reading in Phoenix (Testing→GSM→RSSI reading )

Figure 30 Phoenix GSM RSSI reading window

Results

The reading should reflect the level of the signal generator (-losses) +/- 5 dB.

When varying the level in the range -30 to -102 dBm the reading should then follow within +/-5 dB.

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GSM receiver troubleshooting flowchart

Troubleshooting flow

WCDMA RX chain activation for manual measurement

Steps

1. Via Phoenix Testing menu, choose WCDMA/RX Control.

2. In the RX control window, make the following settings:

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Figure 31 Phoenix WCDMA RX Control window

Note: Channel for band WCDMA II 9800, V 4408, VIII 3012

3. Click Start to activate the settings.

If the settings are changed later on (for example, change of channel) you have to click Stop and Start

again.

Note: Clicking Stop also disables TX control if it was active.

WCDMA RSSI measurement

Prerequisites

WCDMA RX must be activated before RSSI can be measured. For instructions, please refer to WCDMA RX chain

activation. Connect signal generator to RF connector and use appropriate frequency for each channel

(2141MHz for channel 10700 WCDMA band I, WCDMA modulation).

Steps

1. Set the following RF generator settings:

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Figure 32 WCDMA RX generator settings

Note: Frequency for band WCDMA II 1961.0MHz, V 882.6MHz, VIII 943.4MHz

2. From the Phoenix testing menu, select WCDMA→RX Power measurement

3. In the RX power measurement window, make the following settings:

Figure 33 Phoenix WCDMA RX power measurement window

4. Click Start to perform the measurement.

Note: WCDMA RSSI measurement is accurate only with WCDMA modulated signal.

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WCDMA receiver troubleshooting flowchart

Troubleshooting flow

Transmitter Troubleshooting

General instructions for transmitter (TX) troubleshooting

Please note the following before performing transmitter tests:

•TX troubleshooting requires TX operation.

•Do not transmit on frequencies that are in use.

•The transmitter can be controlled in local mode for diagnostic purposes.

•The most useful Phoenix tool for GSM transmitter testing is “RF Controls”, in WCDMA transmitter testing

the best tool is “TX Control”.

•Remember that re-tuning is not a fix! Phones are tuned correctly in production.

Note: Never activate the GSM or WCDMA transmitter without a proper antenna load. Always connect

a 50 Ω load to the RF connector (antenna, RF-measurement equipment or at least a 2 W dummy

load); otherwise the GSM or WCDMA Power amplifier (PA) may be damaged.

GSM transmitter troubleshooting

Steps

1. Set the phone to local mode.

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2. Activate RF controls in Phoenix (Testing→GSM→Rf Controls ).

Make settings as shown in the figure:

Figure 34 Phoenix GSM RF controls window

3. Check the basic TX parameters (i.e. power, phase error, modulation and switching spectrum), using a

communication analyser (for example CMU200).

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4. Change power level (RF controls) and make sure the power reading follows accordingly.

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Next actions

If you want to troubleshoot the other bands, change band with RF controls and set the communication

analyser accordingly.

WCDMA transmitter troubleshooting

Steps

1. Set the phone to local mode.

2. In Phoenix, select Testing→WCDMA→TX control .

3. In the TX control window, make settings as in the picture:

Note: For WCDMA TX channels: band V 4183, VIII 2787

4. Click Send to enable the settings and activate TX.

If settings are changed (eg. new channel), you have to click RF Stop and Send again.

5. Check the basic TX parameters using a communication analyzer (for example CMU200).

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Next actions

If you want to troubleshoot the other bands, change band with RF controls and set the communication

analyser accordingly.

Antenna Troubleshooting

Antenna troubleshooting

Antenna contacts, visual check

In the main antenna there is one feed and two GND contacts. Check that GND and feed pads take proper

contact to the C-clips on main PWB.

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Antenna matching components, visual check

There are four matching components on the antenna flex. Check visually that all components are properly

soldered on the flex. In the case damage you need to replace the whole antenna.

Figure 35 Antenna contacts and matching components

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5 — Camera Module

Troubleshooting

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 5 –1

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Table of Contents

Introduction to camera module troubleshooting ..............................................................................................5–5

The effect of image taking conditions on image quality...................................................................................5–6

Image quality analysis ....................................................................................................................................... 5–10

Possible faults in image quality.................................................................................................................... 5–10

Testing for dust in camera module .............................................................................................................. 5–11

Testing camera image sharpness................................................................................................................. 5–12

Effects of dirty or defective camera lens protection window.................................................................... 5–13

Faulty pixels in images .................................................................................................................................. 5–14

Flash photography problems........................................................................................................................ 5–15

Main (back) camera troubleshooting flowcharts............................................................................................. 5–16

Main camera troubleshooting....................................................................................................................... 5–16

Main camera baseband troubleshooting..................................................................................................... 5–16

Main camera baseband troubleshooting - powerings ............................................................................... 5–18

No recognizable viewfinder image .............................................................................................................. 5–19

Bad image quality troubleshooting ............................................................................................................. 5–20

Flash troubleshooting.................................................................................................................................... 5–21

Secondary (front) camera troubleshooting flow ............................................................................................. 5–22

Accelerometer troubleshooting......................................................................................................................... 5–23

List of Figures

Figure 36 Only center part of image is in focus due to limited depth of focus ...............................................5–6

Figure 37 Blurring caused by shaking hands ......................................................................................................5–7

Figure 38 Near objects get skewed when taking images from a moving vehicle...........................................5–7

Figure 39 Noisy image taken in +70 degrees Celsius .........................................................................................5–8

Figure 40 Image taken against light....................................................................................................................5–8

Figure 41 Flicker in an image; object illuminated by strong fluorescent light................................................5–9

Figure 42 A lens reflection effect caused by sunshine........................................................................................5–9

Figure 43 Good image taken indoors................................................................................................................ 5–10

Figure 44 Good image taken outdoors ............................................................................................................. 5–10

Figure 45 Effects of dust on optical path .......................................................................................................... 5–11

Figure 46 Image taken with clear protection window ................................................................................... 5–13

Figure 47 Image taken with greasy protection window ................................................................................ 5–13

Figure 48 Image of point light sources taken with a clean protective window........................................... 5–14

Figure 49 Image of point light sources taken with a dirty (finger print) protective window .................... 5–14

Figure 50 Enlargement of a hot pixel................................................................................................................ 5–15

Figure 51 Light from the flash has reflected on particles in front of the camera ........................................ 5–15

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Introduction to camera module troubleshooting

Background, tools and terminology

Faults or complaints in camera operation can be roughly categorised into three subgroups:

1 Camera is not functional at all; no image can be taken.

2 Images can be taken but there is nothing recognizable in them.

3 Images can be taken and they are recognizable but for some reason the quality of images is seriously

degraded, or customer complains about image quality.

Image quality is very hard to measure quantitatively, and even comparative measurements are difficult

(comparing two images) to do, if the difference is small. Especially if the user is not satisfied with his/her

device's image quality, and tells, for example, that the images are not sharp, it is fairly difficult to accurately

test the device and get an exact figure which would tell whether the device is functioning properly.

Often subjective evaluation has to be used for finding out if a certain property of the camera is acceptable

or not. Some training or experience of a correctly operating reference device may be needed in order to

detect what actually is wrong, or is there anything wrong at all.

It is easy for the user to take bad images in bad conditions. Therefore the camera operation has to be checked

always in constant conditions (lighting, temperature) or by using a second, known-to-be good device as

reference. Experience helps significantly in analysing image quality.

Terms

Autofocus Camera module contains lens movement mechanics for focus adjustment.

Autofocus enables camera to take sharp images of objects positioned

between 10cm to infinity. During AF the viewfinder image will be

momentarily blurred as the camera searches for the right focus setting.

Digital zoom Digital zoom is done by first cropping the image by the zoom ratio and

then upscaling it to the output resolution. This will decrease the image

quality especially with high zoom ratios.

Dynamic range Camera's ability to capture details in dark and bright areas of the scene

simultaneously.

Exposure time Camera modules use silicon sensor to collect light and for forming an

image. The imaging process roughly corresponds to traditional film

photography, in which exposure time means the time during which the

film is exposed to light coming through optics. Increasing the time will

allow for more light hitting the film and thus results in brighter image. The

operation principle is exactly the same with silicon sensor, but the shutter

functionality is handled electronically i.e. there is no mechanical moving

parts like in film cameras.

Flicker Phenomenon, which is caused by pulsating in scene lighting, typically

appearing as wide horizontal stripes in an image.

ND-filter Neutral density filter is a filter which is used in very bright conditions to

reduce the amount of light hitting the sensor. The filter is built into the

camera module and applied automatically when needed.

Noise Variation of response between pixels with same level of input illumination.

Resolution Usually the amount of pixels in the camera sensor. In some occasions the

term resolution is used for describing the sharpness of the images.

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Sensitivity Camera module's sensitivity to light. In equivalent illumination conditions,

a less sensitive camera needs a longer exposure time to gather enough

light in forming a good image. Analogous to ISO speed in photographic

film.

Sharpness Good quality images are 'sharp' or 'crisp', meaning that image details are

well visible in the picture. However, certain issues, such as non-idealities

in optics, cause image blurring, making objects in picture to appear 'soft'.

Each camera type typically has its own level of performance.

Shutter The electronic shutter is used when short exposure times are needed and

in video. When the mechanical shutter is used a black sheet will cover the

lens after the exposure.

The effect of image taking conditions on image quality

There are some factors, which may cause poor image quality, if not taken into account by the end user when

shooting images, and thus may result in complaints. The items listed are normal to camera operation and

are not a reason for changing the camera module.

Autofocus

When the camera is focusing a lens is moved inside the module to give the sharpest possible image. This

camera module is specified to operate satisfactorily from 10 cm to infinite distance of scene objects. Trying

to photograph objects closer than 10 cm is likely to result in a blurred out of focus image. The lack of sharpness

is first visible in full resolution images. Images taken very close to the subject, a limited depth of focus will

be visible, that is the upper or lower parts of the image may be out of focus. This is normal; do not change

the camera module.

Figure 36 Only center part of image is in focus due to limited depth of focus

The amount of light available

In dim conditions camera runs out of sensitivity. The exposure time is long (especially in the night mode)

and the risk of getting shaken (= blurred) images increases. In addition, image noise level grows. The

maximum exposure time in the night mode is ¼ seconds. Therefore, images need to be taken with extreme

care and by supporting the phone when the amount of light reflected from the target is low. Because of the

longer exposure time and larger gain value, noise level increases in low light conditions. Sometimes blurring

may even occur in daytime, if the image is taken very carelessly. See the figure below for an example. This

is normal; do not change the camera module.

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Figure 37 Blurring caused by shaking hands

Movement in bright light

If an image is taken of moving objects or if the device is used in a moving vehicle, object 'skewing' or 'tilting'

may occur. This phenomenon is fundamental to most CMOS camera types, and may happen when using the

electronic shutter. The movement of camera or object sometimes cause blurring indoors or in dim lighting

conditions because of long exposure time. This is normal; do not change the camera module.

Figure 38 Near objects get skewed when taking images from a moving vehicle

Temperature

High temperatures inside the mobile phone cause more noise to appear in images. For example, in +70

degrees (Celsius), the noise level may be very high, and it further grows if the conditions are dim. If the phone

processor has been heavily loaded for a long time before taking an image, the phone might have considerably

higher temperature inside than in the surrounding environment. This is also normal to camera operation;

do not change the camera module.

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Figure 39 Noisy image taken in +70 degrees Celsius

Phone display

If the display contrast is set too dark, the image quality degrades: the images may be very dark depending

on the setting. If the display contrast is set too bright, image contrast appears bad and "faint". This problem

is solved by setting the display contrast correctly. This is normal behaviour; do not change the camera module.

Basic rules of photography (especially shooting against light)

Because of dynamic range limitations, taking images against bright light might cause either saturated image

or the actual target appear too dark. In practice, this means that when taking an image indoors and having,

for example, a window behind the object, the result is usually poor. This is normal behaviour; do not change

the camera module.

Figure 40 Image taken against light

Flicker

In some occasions a bright fluorescent light may cause flicker in the viewfinder and captured image. This

phenomenon may also be a result, if images are taken indoors under the mismatch of 50/60 Hz electricity

network frequency. The electricity frequency used is automatically detected by the camera module. In some

very few countries, both 50 and 60 Hz networks are present and thus probability for the phenomenon

increases. Flickering occurs also under high artificial illumination level. Flickering only occurs when the rolling

shutter is used. This is normal behaviour; do not change the camera module.

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Figure 41 Flicker in an image; object illuminated by strong fluorescent light

Bright light outside of image view

Especially the sun can cause clearly visible lens glare phenomenon and poor contrast in images. This happens

because of undesired reflections inside the camera optics. Generally this kind of reflections are common in

all optical systems. This is normal behaviour; do not change the camera module.

Figure 42 A lens reflection effect caused by sunshine

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Examples of good quality images

Figure 43 Good image taken indoors

Figure 44 Good image taken outdoors

Image quality analysis

Possible faults in image quality

When checking for possible errors in camera functionality, knowing what error is suspected significantly

helps the testing by narrowing down the amount of test cases. The following types of image quality problems

may be expected to appear:

•Dust (black spots)

•Lack of sharpness

•Bit errors

In addition, there are many other kinds of possibilities for bad image quality, but those are ruled out from

the scope of this document since the probability of their appearance is small.

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Testing for dust in camera module

Symptoms and diagnosis

For detecting these kinds of problems, take an image of a uniform white surface and analyse it in full

resolution. A good quality PC monitor is preferred for analysis. Search carefully, since finding these defects

is not always easy. Figure "Effects of dust on optical path" is an example image containing easily detectable

dust problems.

When taking a white image, use uniformly lightened white paper or white wall. One possibility is to use

uniform light but in this case make sure that the camera image is not flickering when taking the test image.

In case flickering happens, try to reduce illumination level. Use JPEG image format for analysing, and set the

image quality parameter to ‘High Quality’.

Black spots in an image are caused by dirt particles trapped inside the optical system. Clearly visible and

sharp edged black dots in an image are typically dust particles on the image sensor. These spots are searched

for in the manufacturing phase, but it is possible that the camera body cavity contains a particle, which may

move onto the image sensor active surface, for example, when the phone is dropped. Thus it is also possible

that the problem will disappear before the phone is brought to service. The camera should be replaced if the

problem is present when the service technician analyses the phone.

If a dust particle is lying on the infrared filter surface on either side, they are hard to locate because they are

out of focus, and appear in the image as large, grayish and fading-edge 'blobs'. Sometimes they are invisible

to the eye, and thus the user probably does not notice them at all. However, it is possible that a larger particle

disturbs the user, causing need for service.

Figure 45 Effects of dust on optical path

If large dust particles get trapped on top of the lens surface in the cavity between camera window and lens,

they will cause image blurring and poor contrast. The dust gasket between the window and lens should

prevent any particles from getting into the cavity after the manufacturing phase.

If dust particles are found on the sensor, this is classified as a manufacturing error of the module and the

camera should be replaced. Any particles inside the cavity between the protection window and lens have

most probably been trapped there in the assembly phase at a Nokia factory. Unauthorized disassembling of

the product can also be the root of the problem. However, in most cases it should be possible to remove the

particle(s) by using clean compressed air. Never wipe the lens surface before trying compressed air; the

possibility of damaging the lens is substantial. Always check the image sharpness after removing dust.

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Testing camera image sharpness

Symptoms and diagnosis

If pictures taken with a device are claimed to be blurry, there are five possible sources for the problem:

1 The protection window is fingerprinted, soiled, dirty, visibly scratched or broken.

2 The camera module has failed to focus correctly, producing a blurred image.

3 User has tried to take pictures in too dark conditions and images are blurred due to handshake or

movement. This is not a cause to replace camera module.

4 There is dirt between the protection window and the camera lens.

5The protection window is defective. This can be either a manufacturing failure or caused by the user. The

window should be changed.

A quantitative analysis of sharpness is very difficult to conduct in any other environment than optics

laboratory. Therefore, subjective analysis should be used.

If no visible defects (items 1-4) are found, a couple of test images should be taken. Generally, a well-

illuminated typical indoor scene, such as the one in Figure "Good image taken indoors", can be used as a

target. The main considerations are:

•The camera module has to be given time to focus correctly. Correct focusing is normally indicated with a

flashing icon or green bracket in the viewfinder. During focusing, the image in the viewfinder moves

slightly back and fourth, this is normal and shows that the lens unit is moving. During the movement a

faint sound can be heard from the camera head.

•The protection window has to be clean.

•The amount of light (300 – 600 lux (bright office lighting)) is sufficient.

•The scene should contain, for example, small objects for checking sharpness. Their distance should be 1

– 2 meters.

•If possible, compare the image to another image of the same scene, taken with a different device. Note

that the reference device has to be a similar Nokia phone.

There are several conditions in which AF operation is challenging for the camera module, i.e. failing from

time to time. These include:

•Low light scenes and night mode

•Scenes with low contrast

•Fast-moving objects

AF operation is disabled on purpose in “night”, “landscape”, “sports”, and “video” modes. When using these

modes the lens is set to a predetermined focal position and isn’t moved during use.

Under low light and night mode the AF function is slower than under good light, it may even fail to find

correct focus position. Low contrast scenes or fast moving objects may also slow down or cause AF to fail.

This is normal operation, and is not a cause to replace camera.

The operation of AF can be tested by taking images of objects at different distances. Good distances are 20

cm, 60 cm and infinity (>3 m). Any LED or xenon flashes should not be used while taking the images.

The taken images should be analysed on PC screen at 100% scaling simultaneously with a reference image.

Pay attention to the computer display settings; at least 65000 colors (16 bit) have to be used. 256 (8-bit)

color setting is not sufficient; true color (24 bit, 16 million colors) or 32 bit (full color) setting is recommended.

If the differences are noticeable at a glance and also if the one under investigation is significantly inferior,

the module might have a faulty lens. In this case, the module should be changed. Always recheck the

resolution after changing the camera module. If a different module produces a clearly noticeable quality gap,

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the fault is probably in the camera window. Check the window by looking carefully through it when replacing

the module. As references Figure "Good image taken indoors" and Figure "Good image taken outdoors" can

be used. Another possibility is to use a service point comparison phone, if available.

Effects of dirty or defective camera lens protection window

The following series of images demonstrates the effects of fingerprints on the camera protection window.

Note: The effects of any dirt in images can vary very much; it may be difficult to judge if the window

has been dirty when some image has been taken or if something else has been wrong. That is why

the cleanness of the protection window should always be checked and the window should be wiped

clean with a suitable cloth.

Figure 46 Image taken with clear protection window

Figure 47 Image taken with greasy protection window

Bright point light sources might cause images that have flares around the light source if the protection

window is dirty. A smeared fingerprint may be hard to see on the protective window but if will affect the

image quality. These flares can be avoided by cleaning the window with a suitable cloth.

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Figure 48 Image of point light sources taken with a clean protective window

Figure 49 Image of point light sources taken with a dirty (finger print) protective window

Faulty pixels in images

Faulty pixels are pixels that do not respond to light in the same way as the pixels around them. There are

three main types of faulty pixels, dead, stuck and hot pixels.

Dead pixels are always black or significantly darker than their surrounding. Dead pixels appear as black spots

in all lightning conditions. Camera modules producing images with dead pixels that are clearly noticeable

should be replaced.

If the pixel remains always saturated to its maximum value it is stuck. Stuck pixels may appear as red, green,

blue or white spots in all lightning conditions. Camera modules producing images with one or more stuck

pixels should be replaced.

Hot pixels are pixels that easily saturate in dim light conditions. It is normal to get a lot of noise and hot

pixels in night conditions or otherwise dark conditions. The hot pixels should disappear when the ambient

light is increased, but may still appear in darker areas of an otherwise well illuminated scene.

When examining an image for defect pixels, test images should be viewed as 100% enlargements on a PC

monitor.

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Figure 50 Enlargement of a hot pixel

Flash photography problems

Use of flash device may affect the image in many ways.

•White balance errors. The image may get a wrong tone due to mixing of flash colour temperature and

ambient lightning. This is unwanted but normal feature.

•Dust reflections. Dust or water drops in front of the flash unit may reflect strongly to the camera sensor.

See the following figure.

Figure 51 Light from the flash has reflected on particles in front of the camera

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Main (back) camera troubleshooting flowcharts

Main camera troubleshooting

Troubleshooting flow

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Main camera baseband troubleshooting

Troubleshooting flow

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Main camera baseband troubleshooting - powerings

Troubleshooting flow

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No recognizable viewfinder image

Troubleshooting flow

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Bad image quality troubleshooting

Troubleshooting flow

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Flash troubleshooting

Context

Note: Before checking flash functionality, make sure that the main camera is working ok.

Troubleshooting flow

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Secondary (front) camera troubleshooting flow

Troubleshooting flow

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Accelerometer troubleshooting

Troubleshooting flow

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6 — FMTx 2.1 Technical

Description

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 6 –1

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Table of Contents

Glossary ...................................................................................................................................................................6–5

FMTx2.1 HW block...................................................................................................................................................6–5

Device pin layout (Si4713-GM) and interfaces.....................................................................................................6–7

List of Figures

Figure 52 FMTx 2.1 system block diagram...........................................................................................................6–6

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Glossary

AF Audio Frequency

RF Radio Frequency

FM Frequency Modulation

Tx Transmitter

Rx Receiver

FMTx FM Transmitter

LPD Low Power Device

LNA Low Noise Amplifier

LDO Low Drop Out regulator

RSSI

Received Signal Strength Indicator

(same as RPS)

RPS

Received Power Scan (Same as

RSSI)

QFN Quad Flat No-Lead

FMTx2.1 HW block

The FMTx 2.1 implementation is based on the Silicon Laboratories Si4713 low power FM transmitter device.

This device has some state of the art features which have been utilised in the Nokia implementation. Apart

from having excellent RF transmitter performance and exceptional AF performance the device offers a number

of unique features, including the ability to retune the output stage of the device to ensure optimal matching

between the Tx antenna and the output stage of the device.

Functional description

The FMTx 2.1 solution comprises of the Si4713 device and ten external components. These components

consist of:

•A filter - an inductor and a varistor for filtering of emissions from the chip

•ESD protection - a resistor and diode package

•A dual capacitor package which is connected to the analogue audio input pins LIN & RIN. The fundamental

purpose of these capacitors is as DC blocking caps

•A filter on the reset line comprising a capacitor and a resistor

•An antenna which also provides the inductive load required by the Si4713 device

The Si4713 device is in a 3 x 3mm 20 pin QFN package.

Current implementations make use of the DAC33 device which allows data to be digitally clocked into the

DAC at high data rates, buffered and then streamed out at the correct rate while the rest of the baseband is

put to sleep in order to save power. This solution significantly increases playback time of audio content.

The Si4713 device has the following features:

•88.1MHz – 107.9MHz FM band support.

•Programmable pre-emphasis (50/75us).

•Analogue audio interface

•Audio silence/signal present detection.

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•Programmable reference clock.

•RDS/RBDS encoder

•Loop and monopole antenna support with self-calibrated capacitor tuning.

•Programmable transmit level.

•Audio dynamic range control.

System block diagram

Figure 52 FMTx 2.1 system block diagram

The figure above shows the basic system block diagram for the FMTx 2.1 implementation. _SEN is shown here

unconnected since this pin decides which I2C address is used depending on if this pin is pulled low or high.

On RM-333 the _SEN is pulled high by connecting it to VIO.

RM-333 uses a loop antenna which is located in the removable C-cover of the device. The loop antenna also

acts as the tuning inductor which is required by the Si4713 chip. The location of the antenna in the removable

cover means that ESD protection is required to prevent damage to the Si4713 device.

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Device pin layout (Si4713-GM) and interfaces

Inteface pin descriptions

Pin Number(s) Name Description

1, 2, 20 NC No connect, left floating.

3 RFGND RF ground. Connected to ground

plane on PCB.

4 TXO FM transmitter output connection

to Tx antenna.

5 RST Device reset (active low) input.

6 SEN Serial enable input (active low).

7 SCLK Serial clock input.

8 SDIO Serial data input/output.

9 RCLK External reference oscillator input.

10 VIO I/O supply voltage.

11 VDD Supply voltage.

13 DIN Digital input data.

14 DFS Digital frame synchronisation.

15 RIN Right audio line input.

16 LIN Left audio line input.

17 GPO3/DCLK General purpose output – Digital bit

synchronous clock.

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Pin Number(s) Name Description

18 GPO2/IRQ General purpose output – Interrupt

request.

19 GPO1 General purpose output.

12, GND PAD GND Ground. Connect to ground plane on

PCB.

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7 — FMTx 2.1 Troubleshooting

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 7 –1

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Table of Contents

FMTx 2.1 schematic ................................................................................................................................................7–5

FMTx 2.1 component layout ..................................................................................................................................7–5

FMTx 2.1 PWB traces ..............................................................................................................................................7–6

Specific digital and power supply test points .....................................................................................................7–6

FMTx2.1 specific RF test points .............................................................................................................................7–7

Specific clock test points........................................................................................................................................7–7

General visual inspection guidelines....................................................................................................................7–7

FMTx2.1 troubleshooting.......................................................................................................................................7–8

FMTx2.1 antenna visual inspection troubleshooting .........................................................................................7–9

FMTx2.1 audio path visual inspection troubleshooting.................................................................................. 7–10

FMTx2.1 Si4713 visual inspection troubleshooting ......................................................................................... 7–11

Checking validity of signals................................................................................................................................ 7–11

FMTx2.1 troubleshooting faults......................................................................................................................... 7–12

Phoenix PC tool.................................................................................................................................................... 7–12

List of Tables

Table 6 Bus mode selection truth table...............................................................................................................7–6

Table 7 I2C 7-bit bus address selection summary...............................................................................................7–7

Table 8 Left and right audio self test truth table............................................................................................. 7–15

List of Figures

Figure 53 FMTx 2.1 schematic ...............................................................................................................................7–5

Figure 54 FMTx 2.1 Component References and Location..................................................................................7–5

Figure 55 FMTx 2.1 layout......................................................................................................................................7–6

Figure 56 FMTx panel before connection to the handset................................................................................ 7–13

Figure 57 FMTx panel after connection to the handset................................................................................... 7–13

Figure 58 FMTx panel in action .......................................................................................................................... 7–15

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FMTx 2.1 schematic

Figure 53 FMTx 2.1 schematic

The handset uses an antenna that is integral to the removable cover. The connection to the cover is exposed

when the cover is removed.

The loop antenna requires two connection points, J6200 and J6201 (the signal and the ground). It is important

to check these connection points for damage or dirt since the performance of the FMTx 2.1 implementation

will be severely impaired if these connections are not in good condition.

FMTx 2.1 component layout

Figure 54 FMTx 2.1 Component References and Location

The main component of the FMTx 2.1 solution is the Si4713 low power transmitter device (N6150).

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FMTx 2.1 PWB traces

Figure 55 FMTx 2.1 layout

Specific digital and power supply test points

Using access to signals figure as a reference it can be seen that supplies to the Si4713 device VIO (pin 10) and

VDD (pin 11) can be accessed easily. The FMTx 2.1 solution utilises a QFN package. This type of package lends

itself well to analysis of signals on the various pins of the device.

VIO & VDD

VIO should be in the range 1.5 to 3.6 Volts.

VDD should be in the range 2.7 to 5.5 Volts.

_RST

Also, the _RST signal to the device can be monitored. This is an active low signal and should only be asserted

during power up. The _RST signal is driven by the PURX line.

The state of pins 19 & 18 (GPO1 and GP02 respectively) on the rising edge of the _RST pin determines what

interface is selected when the device powers up.

Table 6 Bus mode selection truth table

Bus Name Bus Mode GPO1 GPO2/IRQ

I2C 2-Wire High Low

SPI SPI High Low (must drive)

CBus 3-Wire Low (must

drive)

Low

It’s possible that if GP01 and/or GPO2 are not at the correct state when the Si4713 device has power applied

then the wrong bus mode could be selected and the handset would be unable to communicate with the

device. For RM-333, the bus mode should be I2C.

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_SEN

The _SEN pin is used to select one of two possible 7-bit I2C bus addresses. When _SEN is low, the I2C bus

address for the Si4713 device is 0010001 (0x11). When _SEN is high, the I2C bus address for the Si4713 is

1100011 (0x63).

If the _SEN signal is not correct (i.e. not selecting the correct I2C address), then this is also another possible

reason why control of the FMTx 2.1 feature might not be possible. For RM-333 the I2C address used for FMTx

2.1 will be 0x63.

Table 7 I2C 7-bit bus address selection summary

I2C address _SEN

0010001 (0x11). High

1100011 (0x63). Low

FMTx2.1 specific RF test points

TXO

Pin 4 is the TXO pin. This is the transmitter output pin and probe access can be obtained easily. Using a high

impedance probe and a spectrum analyser it would be possible to examine the TXO pin and check that the

transmitter is outputting a signal.

Specific clock test points

RCLK

Pin 9 is the RCLK (Reference Clock) input to the device. This is typically 32.768KHz and is driven from the sleep

clock from the base band. When measuring this clock frequency, it may be seen to vary by as much as +/-

120 ~ 200ppm. The device can only typically tolerate +/- 20ppm in order to maintain transmit frequency

accuracy. To overcome this, the software driver for the device calculates what the actual sleep clock (RCLK)

frequency is and periodically programs the device with this frequency.

The device then internally adjusts its dividers in order to maintain the required output frequency. Using this

method it is possible to reduce the effective ppm of the reference clock down to +/- 14ppm over the full

operating temperature range of -15 to +50 degrees Centigrade.

General visual inspection guidelines

•If the handset has the FMTx antenna in the back cover then check the condition of the cover, the antenna

trace and any mechanical interfaces for the antenna e.g. pogo pins.

•Check that the Si4713 device is placed correctly on the PWB and that there are no obvious signs of damage.

•Check the surrounding components and ensure correct placement on the PWB and that there is no visual

damage. Check that there are no missing components.

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FMTx2.1 troubleshooting

Troubleshooting flow

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FMTx2.1 antenna visual inspection troubleshooting

Troubleshooting flow

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FMTx2.1 audio path visual inspection troubleshooting

Troubleshooting flow

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FMTx2.1 Si4713 visual inspection troubleshooting

Troubleshooting flow

Checking validity of signals

Please refer to Access to signals figure as a reference. Generally all power supply levels and clocks willbe

consistent. Signals on the analogue audio input pins (RIN & LIN – pins 15 and 16 respectively) will be

dependant on the audio content being injected to the device. During the audio self test (initiated from

Phoenix) it is possible to monitor these pins and check that the DSP generated 1KHz tones can be seen at

some point during the test. Check that the signals are clean and that no obvious distortion can be seen such

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as clipping of the signals. Typical maximum swing of these tones will be ~636mV peak to peak. The maximum

swing may vary between Nokia handsets but for the FMTx 2.1 implementation, the swing should not be

greater than the aforementioned value.

FMTx2.1 troubleshooting faults

Possible faults

Expected fault reports relating to the FMTx 2.1 implementation may consist of one or more of the following;

1 No left audio

2 No right audio

3 No audio

4 Can’t start FMTx

5 Can’t locate FM transmission on an FM receiver or no FM transmission

6 Distortion on audio

7 Poor reception on FM receiver

8 No RDS information

Initial fault analysis

Where possible, attempt to reproduce and verify the reported fault. Intermittent problems are likely to be

due to bad connections or broken components/solder joints. Any faults relating to poor FM transmitter

performance or frequent failure to locate usable frequencies when performing a scan are likely to be due to

some kind of antenna issues.

In handsets that utilise an antenna solution in a removable cover it is likely that the connecting interface

pins are either damaged, dirty or that the cover fits poorly perhaps due to broken tabs/latching lugs. Poor

audio fault reports may also be due to the above antenna issues.

Phoenix PC tool

Setting Up Phoenix

Required equipment:

•A Deskey security dongle for Phoenix to run.

•The latest version of Phoenix that has the FMTx 2.1 GUI installed on a PC (version 2007.21.000.27897 or

greater).

•A jig suitable for the handset.

•A cable to connect the jig/handset to the PC. Run Phoenix and select the FMTx panel.

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Using the FMTx panel to drive the FMTx 2.1 features

Figure 56 FMTx panel before connection to the handset

Figure 57 FMTx panel after connection to the handset

Typing in a valid FM transmitter frequency and clicking on ‘Activate’ will turn on the FMTx feature and will

begin transmitting the carrier on the selected frequency. Note: Unless this carrier signal is modulated with

some audio (either via the music player or a DSP or Si4713 generated tone) then all that will be heard if an

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FM receiver is tuned to the same frequency would be silence. After approximately 10 seconds of silence the

handset should begin to ‘chirp’ periodically with a short 1Khz tone that repeats every 5 seconds. This indicates

that there is no audio input and reminds the user that the feature is on.

The Phoenix FMTx 2.1 panel can be used to control the following features;

•Set the FM frequency to transmit on (88.1 to 107.9MHz).

•Select Stereo or Mono mode (generally all Nokia handsets will only use stereo)

•Mute both left and right audio channels.

•Mute only the left or the right audio channels.

•Allow an internal tone to be generated and transmitted from the Si4713 device. The audio frequency of

this tone can be selected along with the on/off time and the volume of the tone. Selecting 0 (zero) in either

the on or off time will produce a continuous tone.

•Obtain a list of suitable ‘quiet or free’ channels. This effectively performs an RSSI (RPS) scan to locate quiet

channels to transmit on. If the ‘AutoJump’ tick box is checked then this list will be transmitted to the FM

receiver to allow the handset to perform AF jumps. This is dependent on the Nokia handset and if the FM

receiver is RDS capable. The use of AF feature allows an RDS capable FM receiver to follow the transmissions

of the FM transmitter automatically.

•FMTx 2.1 status panel. This provides information on the state of the FMTx feature. This can be polled by

Phoenix at regular intervals defined by the user when the ‘Read periodically each...’ check box is checked.

The status can otherwise be read at any point by clicking on the ‘Read’ button. The MCC value is the ‘Mobile

Country Code’ and provided the phone is registered on a network will provide the code pertaining to the

country in which it resides. The antenna tuning value is a good indicator of the state of the antenna and

the other components connected to the TXO pin. For RM-333 the tuning values should be in the range 0 –

80. Any value outside of this range will indicate some problem with the components connected to the TXO

pin (including the antenna). In the case of a removable antenna, the cause of the out of range value is like

to be because of a poor antenna connection. This might be because of broken or dirty connections between

the handset and the cover in which the antenna is fitted.

•The RDS panel can be used to set the PS name and/or to enter a Radio Text (RT) string. If access to an FM

receiver is available that supports RDS then these strings can be observed on the display of the FM receiver.

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Figure 58 FMTx panel in action

Using the audio self test

The audio self test can be used to quickly determine if the left and right audio paths are intact.

The left and right audio connectivity self test process performs the following steps:

1 Measure and store silence.

2 Inject 1KHz tone (left or right) to give 75KHz deviation. Measure and store.

3 Inject same tone on both left and right analogue audio inputs. Measure and store. Compare result from

(2) with result from (1). If the delta is NOT more than a specified threshold level then fail. This would

indicate that the selected channel is open circuit. If an over deviation indication is detected on (2), then

the audio channels must be shorted together. This is a fail condition. For (3), a returned value of zero is

expected. This indicates that there is an over deviation condition which in turn indicates that the ‘other’

audio input channel is connected correctly.

If on (3) there is no over deviation response, then the ‘other’ channel must be open circuit at some point in

the audio path. This is a fail condition.

The table shows the truth table for the left and right audio self test.

Table 8 Left and right audio self test truth table

LEFT RIGHT ASQ Condition Comment

0 0 0 SILENCE

1 0 0 OPEN/SHORT

1 0 1 OK

1 0 2 SHORT

0 1 X Don’t Care

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LEFT RIGHT ASQ Condition Comment

0 1 X Don’t Care

1 1 0 ALL OPEN/SHORT

1 1 1 OPEN

1 1 2 OK

Using the auto tune panel

The Auto Tune panel should only be used if one or more of the following components have been changed:

•The Si4713 device.

•The Inductor connected to the TXO pin 4.

•The inline resistor connected to the TXO pin 4 (if fitted).

•The ESD diode package connected to the TXO pin 4 (if fitted).

This procedure follows the alignment that is done in the factory to ensure that the FMTx 2.1 solution is aligned

to provide the correct Tx output power for the relevant legislations such as FCC and ETSI.

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8 — System Module and User

Interface

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 8 –1

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System Module and User Interface

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Table of Contents

Introduction............................................................................................................................................................8–5

Phone description .............................................................................................................................................8–5

Energy management..............................................................................................................................................8–7

Battery and charging ........................................................................................................................................8–7

Backup battery...................................................................................................................................................8–7

Normal and extreme voltages .........................................................................................................................8–8

Power key and system power-up....................................................................................................................8–8

Power distribution............................................................................................................................................8–9

Clocking scheme............................................................................................................................................. 8–10

Bluetooth and FM RDS radio module................................................................................................................. 8–11

GPS module .......................................................................................................................................................... 8–12

WLAN module ...................................................................................................................................................... 8–13

FM transmitter module....................................................................................................................................... 8–13

High-speed USB.................................................................................................................................................... 8–13

CBUS interface...................................................................................................................................................... 8–14

FBUS interface...................................................................................................................................................... 8–14

ECI interface ......................................................................................................................................................... 8–14

USB charger interface.......................................................................................................................................... 8–14

SIM interface ........................................................................................................................................................ 8–15

MicroSD card interface ........................................................................................................................................ 8–16

Camera concept ................................................................................................................................................... 8–16

Camera concept.............................................................................................................................................. 8–16

User interface....................................................................................................................................................... 8–17

User interface.................................................................................................................................................. 8–17

Display module............................................................................................................................................... 8–18

I/O expander and keyboard .......................................................................................................................... 8–19

Illumination .................................................................................................................................................... 8–21

Naviscroll......................................................................................................................................................... 8–22

ASICs...................................................................................................................................................................... 8–23

RAPIDOYAWE .................................................................................................................................................. 8–23

EM ASIC BETTY N2300 ..................................................................................................................................... 8–23

EM ASIC VILMA N2200 ..................................................................................................................................... 8–23

Device memories................................................................................................................................................. 8–24

Combo memory .............................................................................................................................................. 8–24

Audio concept...................................................................................................................................................... 8–24

Audio HW architecture................................................................................................................................... 8–24

Internal microphone...................................................................................................................................... 8–25

Internal earpiece............................................................................................................................................ 8–25

Internal speakers............................................................................................................................................ 8–26

Vibra circuitry ................................................................................................................................................. 8–26

Accessory AV connector ................................................................................................................................. 8–27

External earpiece and microphone .............................................................................................................. 8–28

Baseband technical specifications..................................................................................................................... 8–29

External interfaces ......................................................................................................................................... 8–29

SIM IF connections.......................................................................................................................................... 8–29

Charger connector and charging interface connections & electrical characteristics .............................. 8–29

Internal interfaces.......................................................................................................................................... 8–30

Back-up battery interface electrical characteristics.................................................................................... 8–30

RF technical description...................................................................................................................................... 8–31

RF block diagram............................................................................................................................................ 8–31

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Receiver (RX)................................................................................................................................................... 8–32

Transmitter (TX) ............................................................................................................................................. 8–32

Frequency mappings........................................................................................................................................... 8–33

GSM850 frequencies....................................................................................................................................... 8–33

EGSM900 frequencies..................................................................................................................................... 8–33

GSM1800 frequencies..................................................................................................................................... 8–34

GSM1900 frequencies..................................................................................................................................... 8–36

WCDMA 2100 Rx frequencies......................................................................................................................... 8–37

WCDMA 2100 Tx frequencies ......................................................................................................................... 8–38

WCDMA V (850) frequencies .......................................................................................................................... 8–39

WCDMA VIII (900) frequencies....................................................................................................................... 8–40

List of Tables

Table 9 Nominal voltages......................................................................................................................................8–8

Table 10 Keyboard matrix .................................................................................................................................. 8–20

Table 11 Charging interface connections ......................................................................................................... 8–30

Table 12 Charging IF electrical characteristics ................................................................................................. 8–30

Table 13 Back-up battery electrical characteristics ......................................................................................... 8–30

List of Figures

Figure 59 System module block diagram ............................................................................................................8–6

Figure 60 Board and module connections...........................................................................................................8–7

Figure 61 Power distribution................................................................................................................................8–9

Figure 62 Clocking scheme................................................................................................................................. 8–10

Figure 63 Bluetooth & FM radio block diagram ............................................................................................... 8–12

Figure 64 GPS module......................................................................................................................................... 8–12

Figure 65 WLAN module ..................................................................................................................................... 8–13

Figure 66 FM transmitter.................................................................................................................................... 8–13

Figure 67 HS USB block diagram........................................................................................................................ 8–14

Figure 68 USB charging interface block diagram............................................................................................. 8–15

Figure 69 SIM interface ....................................................................................................................................... 8–15

Figure 70 MicroSD card interface ....................................................................................................................... 8–16

Figure 71 Camera block diagram....................................................................................................................... 8–17

Figure 72 User interface block diagram............................................................................................................ 8–18

Figure 73 Display interface block diagram ....................................................................................................... 8–19

Figure 74 I/O expander and keyboard matrix.................................................................................................. 8–20

Figure 75 Illumination block diagram .............................................................................................................. 8–21

Figure 76 Light segments................................................................................................................................... 8–22

Figure 77 Block diagram of Naviscroll Interface .............................................................................................. 8–23

Figure 78 Audio system block ............................................................................................................................ 8–25

Figure 79 Internal microphone.......................................................................................................................... 8–25

Figure 80 Internal earpiece circuitry................................................................................................................. 8–26

Figure 81 Internal speakers................................................................................................................................ 8–26

Figure 82 Vibra circuitry ..................................................................................................................................... 8–26

Figure 83 Accessory (AV) connector................................................................................................................... 8–27

Figure 84 Accessory (AV) connector with DAC33 and TPA6130 audio enhancements ................................. 8–28

Figure 85 External earpiece and microphone audio circuit............................................................................ 8–28

Figure 86 Charger connector.............................................................................................................................. 8–29

Figure 87 RF block diagram RM-333 using RF ASIC N7500 .............................................................................. 8–31

Figure 88 RF block diagram RM-334 using RF ASIC N7500 .............................................................................. 8–32

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Introduction

Phone description

RAPIDOYAWE is the main digital baseband ASIC in the HW53. It contains functionality for both WCDMA and

GSM EDGE.

AVILMA is power management ASIC having voltage regulators and audio transceiver and BETTY is energy

management ASIC having charging switch and FBUS transceiver.

Memory components are internal COMBO 1 Gb/2 Gb and a card reader for MicroSD.

Function Description Item ref

EM ASIC AVILMA N2200

BETTY N2300

System ASIC RAPIDOYAWE D2800

Memory Combo 1Gb DDR + 2Gb M3 D3000

Camera accelerator OMAP-DM500 N1400

Display controller S1D13747 D2450

Back-up battery RTC BACKUP CAPAC 311 G2200

FM-radio with RDS BTHFMRDS2.1 module D6000

Bluetooth BTHFMRDS2.1 module D6000

WLAN WLAN module ENW49701N N6300

GPS GPS5350_ROM3.0 N6200

RF ASIC Vapaus N7500

GSM PA 850/900/1800/1900 N7520

WCDMA PA 850/900/1900/2100 N7540

Oscillator VCTCXO 38.4MHZ G7500

TCXO 38.4 MHz G6450

Crystal 32.768KHZ B2200

IO-expander BASIC IOExpander N2850

SIM card reader X2700

HS USB transceiver ISP1704 D3300

FM transmitter SI4713 N6150

TV out graphics engine S1D13771B D2480

Naviscroll driver QTC12C15 N2525

Accelerometer AHTI_A 3-AXIS N6501

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System module block diagram

Figure 59 System module block diagram

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Board and module connections

Figure 60 Board and module connections

Energy management

Battery and charging

Battery

Supported battery type is BL-5K.

Battery connector

Blade battery connector type.

•VBAT (Battery voltage)

•BSI (Battery size indication)

•GND (Battery ground)

Charging

This phone is charged through the micro USB connector. The phone supports dedicated, host or hub chargers.

Charging is controlled by energy management, and external components are needed to protect the baseband

module against EMC, reverse polarity and transient frequency deviation.

Backup battery

When the main battery is not attached EM ASIC (N2200) goes in backup mode using back-up battery that

supplies voltage to RTC in EM ASIC (N2200).

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Normal and extreme voltages

Energy management is mainly carried out in the two Application Specific Integrated Circuits (ASICs) BETTY

and AVILMA. These two circuits contains a number of regulators. In addition there are some external

regulators too.

In the table below normal and extreme voltages are shown when a BL-5K battery is used.

Table 9 Nominal voltages

Voltage Voltage [V] Condition

General Conditions

Nominal voltage 3.700

Lower extreme voltage 3.145

Higher extreme voltage

4.230(fast charging)

HW Shutdown Voltages

Vmstr+ 2.1 ± 0.1 Off to on

Vmstr- 1.9 ± 0.1 On to off

SW Shutdown Voltages

Sw shutdown 3.15 In call

Sw shutdown 3.3 In idle

Min Operating Voltage

Vcoff+ 2.9 ± 0.1 Off to on

Vcoff- 2.6 ± 0.1 On to off

Power key and system power-up

When the battery is placed in the phone the power key circuits are energized. When the power key is pressed,

the system boots up (if an adequate battery voltage is present).

Power down can be initiated by pressing the power key again (the system is powered down with the aid of

SW). The power key is connected to EM ASIC N2200 (AVILMA) via PWRONX signal.

The power key may be disabled in certain charging cases.

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Power distribution

Figure 61 Power distribution

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Clocking scheme

Figure 62 Clocking scheme

HW 53 engine clocks

RFCLK 38.4 MHz

SleepClk 32.768kHz

RFCLKEXT 38.4 MHz

SYSCLK 19.2 MHz

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Bluetooth and FM RDS radio module

Bluetooth and FM radio receiver are provided by the same ASIC (Broadcom BCM2048). The device supports

Bluetooth operation and FM radio rececption in both European/USA and Japanese bands (the appropriate

region-specific FM radio band is pre-configured in the phone software). The UART interface allows the device

to communicate with the phone baseband engine using Bluetooth HCI commands. Commands to the FM radio

can also be sent over the I2C interface.

When Bluetooth is switched on, the phone user interface the BT_RESETX line is toggled to reset the Bluetooth

device, and commands are sent over the UART interface to configure the device. If UART communication fails

(due to a hardware fault) it will not be possible to switch on Bluetooth from the phone user interface.

The device has two clock signals: SYS_CLK (19.2MHz, 26.0MHz, or 38.4MHz supported) and SLEEP_CLK

(32.768kHz). The SLEEP_CLK is supplied all the time the phone is switched on. To maximise the phone standby

time, it is only necessary to provide a SYS_CLK signal when Bluetooth activity occurs, such as sending Bluetooth

data to another device, or checking periodically if there are any other Bluetooth devices attempting to

communicate with it. At other times when the Bluetooth device is in standby mode or the FM radio is switched

on it is only necessary to provide a SLEEP_CLK signal. The Bluetooth-FM ASIC is powered directly from the

phone battery voltage line (VBAT). An internal regulator is enabled when Bluetooth or FM radio is switched

on.

Bluetooth audio signals are sent to and from the device using a PCM interface. The Bluetooth RF signal is

routed via a buried track to the Bluetooth antenna on the side of the PWB. An RF filter is needed between

the Bluetooth antenna and Bluetooth ASIC to prevent interference to and from the celluar phone antenna.

Phones that have both Bluetooth and WLAN use a shared antenna, as both services occupy the 2.4GHz ISM

frequency band. The co-existence signaling interface between Bluetooth and WLAN ASICs controls the RF

activity in the shared frequency band.

The audio signal from the FM radio is routed via the phone Audio ASIC to the phone headset or loudspeaker.

The external wired headset is also used as an Antenna for the FM radio. The FM radio receiver RF signal is

routed from the ASIC via a buried track to an impedance matching circuit placed near the headset connector.

The following block diagram shows how Bluetooth-FM is connected to the host engine.

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Figure 63 Bluetooth & FM radio block diagram

GPS module

HW53 supports GPSCost4.0 release. GPS module is connected to cellular engine via I2C interface and GenIO

control signals. GPS clock configuration includes dedicated GPS TCXO and reference clock from Ahneus.

Figure 64 GPS module

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WLAN module

WLAN module HW53 supports WLANSize4.0 release. WLAN module is configured as Cellular engine SPI slave.

WLAN and Bluetooth co-existence is supported via BTH-WLAN interface. WLANSize4.0 has a reference clock

of external oscillator 38.4MHz and it is shared with BTHFMRDS2.1.

Figure 65 WLAN module

FM transmitter module

The FM transmitter module Si4713 is controlled by I2C from RAPIDO with left and right analog audio input

from the DAC33.

Figure 66 FM transmitter

High-speed USB

The device can transmit and receive USB data at high-speed (480 Mbit/s), full-speed (12 Mbit/s) and low-

speed (1.5Mbit/s). The external interface is the micro-B connector X3300. The interface between D3300 USB

transceiver and micro-B receptacle is the standard USB interface specified in the Universal Serial Bus

specification Rev. 2.0. The USB transfers signal and power over four-wire interface, which carries differential

data, Vbus and GND. Signalling occurs over differential data line D+ and D-. The clock is transmitted encoded

along with the differential data. ESD protection is done with USB ASIP Z3300. VBUS (+5V) is provided by the

host device. The circuit is protected from an overvoltage condition by transistor pair V3300 and reference

zenner diode V3301.

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Figure 67 HS USB block diagram

CBUS interface

CBUS is a main system control bus in BB5. RAPIDO controls the functionality of EM ASICs AVilma (N2200) and

Betty (N2300) with CBUS.

CBUS is a four-wire half-duplex master-slave interface. In HW53 CBUS clock frequency is 4.39 MHz.

FBUS interface

FBUS is a 2-wire serial communication bus between HW53 engine and service SW.

ECI interface

The ECI (Enhancement Control Interface) is a point-to-point, bi-directional, single line serial bus.

The purpose of the ECI is to identify and authenticate the accessory, and to act as a data bus (intended for

control purposes) between the phone and the accessory .

USB charger interface

The main battery can be charged from the USB port. Default charging current level is 80 – 100 mA during the

initial charging. Primary charging current level is up to 500 mA from USB Host and up to 1.25A from USB wall

charger with external switch-mode USB Charger BQ24150.

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Figure 68 USB charging interface block diagram

SIM interface

The device has one SIM (Subscriber Identification Module) interface. It is only accessible if battery is removed.

The SIM interface consists of an internal interface between RAPIDO and EM ASIC (N2200), and of an external

interface between N2200 and SIM contacts.

The SIM IF is shown in the following figure:

Figure 69 SIM interface

The EM ASIC handles the detection of the SIM card. The detection method is based in the BSI line. Because of

the location of the SIM card, removing the battery causes a quick power down of the SIM IF.

The EM ASIC SIM1 interface supports both 1.8 V and 3.0 V SIM cards. The SIM interface voltage is first 1.8 V

when the SIM card is inserted, and if the card does not response to the ATR a 3 V interface voltage is used.

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MicroSD card interface

Figure 70 MicroSD card interface

The MicroSD card is connected to the engine by an external level shifter with an ESD protection filter. Supplied

voltages:

•VSD: 2.85 V (from level shifter)

•VIO: 1.8 V (from VIO SMPS)

Hot swap is supported, which means that the card may be plugged in/out at any time, without removing the

battery.

Camera concept

The camera is supported by DM299 (N1400) Camera accelerator, which is used for image and video processing.

DM-299 uses 64Mbit discrete SDRAM. The camera module includes 3MPix main camera, CIF+ secondary camera,

Flash LED and TPS61052 LED driver which are connected to DM-299.

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Figure 71 Camera block diagram

User interface

The UI module contains the following main features:

•ITU keypad and five-way cursor control and dedicated multimedia key implemented on a standard cross-

point matrix

•Finger position sensing keys for functions not part of the ITU matrix

•Finger position sensing beneath the five-way cursor control for the implementation of scrolling features

in the UI

•The handset microphone and one of the IHF speakers

•Various independently controlled lighting zones for the UI features described above

The cross-point matrix, LEDs, microphone and IHF are connected to the handset engine using the I/O expander

described below, and the finger position sensing controller is connected via an I2C bus.

A block diagram of the UI module is shown below. For clarity, the filtering components are not shown.

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Figure 72 User interface block diagram

The interface to the UI capacitive sensing controller is at 3.0V, which is provided from the engine by a

dedicated linear regulator, and a dedicated level shifter provides the interface to allow the otherwise 1.8V

logic levels of the engine to be used on the UI.

The capacitive sensors function by sensing changes in the the charge coupled from one electrode to another

when the users finger is placed close to the electrodes patterns. There are further mechanical domes

associated with this sensing arrangement which only allows the scanning of the charge transfer to occur

when the user presses down on the front of the UI module – this is intended to prevent false key-activations.

Due to the construction of the module (it is mostly glued together) service is not possible, and if faultly, must

be replaced. This includes any faults that are found in the internal microphone or the lower of the two IHF

speakers.

For operational reasons, the modules are supplied unlocalised, and the correct localization front-panel needs

to be attached after the ‘bare’ module has been installed in the handset.

Display module

Display features

•2.6” AM OLED QVGA display (240 columns x 320 rows) supports up to 16.7M colors

•Ambient Light Sensor to optimize display brightness and power consumption

Display interface

Figure

Display interface block diagram

below shows how the display related signals are routed. Hurricane

display HWA controlling is done via LoSSI bus and pixel data is transferred via ViSSI-12 bus. MeSSI-8 is the

interface between Hurricane display HWA and Falcon OLED display.

As Falcon is self-emissive AM OLED display, no LED driver based backlighting is needed. An external DC-DC

convertor TPS65136 is used for the display powering.

Supply voltages for Falcon display:

1 VIO from the baseband SMPS (1.8V )

2 VBAT from Battery(3.7V)

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3 ELVDD supply from external DC/DC converter TPS65136 (+4.6V)

4 ELVSS supply from external DC/DC converter TPS65136 (-4.9V)

EL_ON signal from Falcon display is enable for the DC/DC converter TPS65136.

Figure 73 Display interface block diagram

I/O expander and keyboard

HW53 supports LM8323 I/O Expander. I/O expander is connected to Rapido via I2C bus and Genio66 is used

as an I/O Expander interrupt pin. Keyboard matrix 6x4 is connected to I/O expander. In addition, the I/O

expander has general purpose IO’s. Camera accelerator RSTX and Regulator enable, TVout Accelarator reset

and Regulator enable are connected to I/O expander GPIO’s.

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Figure 74 I/O expander and keyboard matrix

RM-333 has three separate keyboards:

•ITU keyboard

•Multimedia Keyboard

•S60 keyboard

ITU keyboard is visible when the slider is moved upwards. ITU keypads are located on the system/RF module.

System/RF module includes also side keys (volume keys, 2-position capture key and keylock switch) and MM

dome switches. MM keyboard is visible when the slider is moved downwards. S60 keys are located on UI/

slide module. They are connected as 3x4 key matrix to the Naviscroll driver which operates like I/O Expander.

More detailed description of S60 keyboard can be found in chapter

Naviscroll technical description

Table 10 Keyboard matrix

Expander’s

PINS KP-Y0 KP-Y1 KP-Y2 KP-Y3

Lines COL0 COL1 COL2 COL3

KP-X0 ROW0 1 6 2 Vol Up

KP-X1 ROW1 5 9 # Vol Down

KP-X2 ROW2 3 0 8

Capture

half

KP-X3 ROW3 * 7 4

Capture

full

KP-X4 ROW4 MM1 MM2 MM3 MM4

KP-X5 ROW5 Keylock

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Illumination

LED driver solution

Three LP5521 ‘NJOY LED drivers are used to supply power for different light segments. Each LED driver has

three independently programmable constant current outputs (R, G and B). LED drivers are controlled by

Rapido via ISA_I2C bus and they use 32kHz external clock from Vilma.

Figure 75 Illumination block diagram

Light segments

9+1 different light segments are used for illumination, each having 1-4 parallel connected LEDs (see Figure

2). ITU and Game light segments are connected to the same LED driver output. Betty controls them via GenOut1

and GenOut2 outputs (see Figure 1). Parallel connected LEDs which are in same LED driver output branch have

serial resistor to even their currents. As ITU keyboard backlights are controlled by the Ambient Light Sensor

(ALS) they are turned ON only in dark ambient light.

RM-333 has a self-emissive AM OLED display, therefore it does not need LEDs for backlighting

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Issue 2 COMPANY CONFIDENTIAL Page 8 –21

Figure 76 Light segments

Naviscroll

HW53 uses Quantum QT12C15 as Naviscroll Driver. As shown in Figure 1, it is interfaced to RAPIDO via SPP I2C

bus for control and data, two change lines TouchPadInt and KeyInt used by Naviscroll Driver to report to

RAPIDO any changes in the touchpad state or changes in the S60 key states, Rst is used as a reset signal from

RAPIDO to Naviscroll Driver.

On the other side, Naviscroll Driver interfaces Naviscroll touchpad and S60 keys as 3x4 matrix. When there is

a change in the touchpad state i.e. when the finger is scrolled over the naviscroll touchpad the Naviscroll

Driver gives an interrupt to RAPIDO via TouchPadInt line by pulling it low. Similarly when any of the S60 keys

is pressed the Naviscroll Driver gives an interrupt to RAPIDO via KeyInt line by pulling it low. When receiving

either of the Interrupts, RAPIDO performs an I2C data read from Naviscroll Driver internal registers to

determine Naviscroll touchpad XY position change if TouchPadInt was detected and to determine which S60

keys were pressed if KeyInt was detected. After that, the interrupt lines change state from low to high. 2V8

voltage regulator located on the UI flex supplies power for the Naviscroll driver.

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Figure 77 Block diagram of Naviscroll Interface

ASICs

RAPIDOYAWE

RAPIDOYAWE ASIC (D2800) is a die-stacked Processor (RAPIDO) with 3G HDSPA logic (YAWE). RAM memory is

integrated into RAPIDO.

EM ASIC BETTY N2300

The EM ASIC (N2300) includes the following functional blocks:

•Core supply generation

•Charge control circuitry

•Level shifter and regulator for USB/FBUS

•Current gauge for battery current measuring

•LED control for display backlighting

•Digital interface (CBUS)

EM ASIC VILMA N2200

The EM ASIC (N2200) includes the following functional blocks:

•Start up logic and reset control

•Charger detection

•Battery voltage monitoring

•32.768kHz clock with external crystal

•Real time clock with external backup battery

•SIM card interface

•Stereo audio codecs and amplifiers

•A/D converter

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•Regulators

•Vibra interface

•Digital interface (CBUS)

EMC ASIP (Appcation Specified Integrated Passive) have been integrated inside the ASIC. It includes biasing

passives for microphone , EMC filter for SIM, microphones etc.

Device memories

Combo memory

The memory of the device consists of stacked DDR SDRAM and MuxedMassMemory (M3). Combo memory DDR/

M3 memory has 768Mb DDR + 2Gb M3.

Audio concept

Audio HW architecture

The functional core of the audio hardware is built around three ASICs: RAPIDOYAWE engine ASIC, mixed signal

ASIC Avilma and D/A converter DAC33.

DAC33 converts digital audio signal to analog and is routed to the FM Transmitter and amplifier TPA6130

which provides an interface for the transducers and the accessory connector.

AVilma provides analog signal for earpiece and for D-class audio amplifier TPA2012D2, which drives

integrated stereo handsfree speakers.

There are four audio transducers:

•8x12 mm dynamic earpiece

•Two 8x12 mm dynamic speakers

•Digital MEMS (microelectromechanical systems) microphone

Avilma provides an output for the dynamic vibra component. All wired audio accessories are connected to

the AV accessory connector. A Bluetooth audio and FM radio module, which is connected to RAPIDOYAWE,

supports Bluetooth audio and FM radio functionality.

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Figure 78 Audio system block

Internal microphone

The internal microphone is used for HandPortable (HP) and Internal HandsFree (IHF) call modes. A digital

MEMS microphone data and clock line are connected to Rapidoyawe and operating voltage is received from

Avilma.

Figure 79 Internal microphone

Internal earpiece

Internal earpiece is used for the HandPortable (HP) call mode. A dynamic 8x12 mm earpiece capsule is

Connected to Avilma ASIC’s differential output EarP and EarN.

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Figure 80 Internal earpiece circuitry

Internal speakers

Internal speakers are used for Internal HandsFree (IHF) call mode, video call, ringing tones, FM radio and

music listening.

Two dynamic 8x12mm speakers are connected to Avilma ASIC’s outputs XearR/XearL via stereo D-class IHF

amplifier TPA2012D2. The amplifier has 12 dB fixed gain and it is put to shutdown mode when not in use.

Figure 81 Internal speakers

Vibra circuitry

Vibra is used for the vibra alarm function.

The vibra motor is connected to the Avilma ASIC VibraP and VibraN Pulse Width Modulated (PWM) outputs.

Figure 82 Vibra circuitry

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Accessory AV connector

The features that are supported by Gadget accessory interface are the following:

•Audio output (stereo headset/headphones having the impedance >16ohm)

•Audio input (mono microphone from headset)

•Control data (ECI)

•TV-out with composite signal to 75ohm coax cable

•Connects FM receiver to headphones, which serves as FM antenna

Figure 83 Accessory (AV) connector

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Issue 2 COMPANY CONFIDENTIAL Page 8 –27

Figure 84 Accessory (AV) connector with DAC33 and TPA6130 audio enhancements

External earpiece and microphone

Figure 85 External earpiece and microphone audio circuit

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Baseband technical specifications

External interfaces

Name of connection Connector reference

HS USB X3300

MicroSD card X3200

Battery connector X2070

SIM card reader X2700

Accessory (AV)

connector

X2010

Charger X3300

SIM IF connections

Pin Signal I/O Engine connection Notes

1 VSIM Out EM ASIC N2200 VSIM1 Supply voltage

to SIM card,

1.8V or 3.0V.

2 SIMRST Out EM ASIC N2200 SIM1Rst Reset signal to

SIM card

3 SIMCLK Out EM ASIC N2200 SIM1ClkC Clock signal to

SIM card

5 GND - GND Ground

7 SIMDATA In/Out EM ASIC N2200 SIM1DaC Data input /

output

Charger connector and charging interface connections & electrical characteristics

Figure 86 Charger connector

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Table 11 Charging interface connections

PIN Signal I/O Engine connection Description

1 VBUS IN

D3300/

N3301 VBUS/DCIN 5V

2 D- IN/OUT D3300 DM Data minus

3 D+ IN/OUT D3300 DN Data plus

4 ID Not in use

5 ground Ground

Signal

ground

Table 12 Charging IF electrical characteristics

Description Parameter Min Max Unit

VBUS Vcharge 4.75 5.25 V

VBUS Icharge 1.8 A

D+,D-,Ground 1 A

Internal interfaces

Name of connection Component reference

DALS N6502

Earpiece B2100

Microphone B2 (On UI Module)

IHF speakers B2151 / B1

Main camera socket X1450

Sub-camera N1450

Main display connector X2450

Vibra M2110

Back-up battery interface electrical characteristics

Table 13 Back-up battery electrical characteristics

Description Parameter Min Typ Max Unit

Back-Up

Battery

Voltage

Vback 0 2.5 2.7 V

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RF technical description

RF block diagram

Figure 87 RF block diagram RM-333 using RF ASIC N7500

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Issue 2 COMPANY CONFIDENTIAL Page 8 –31

Figure 88 RF block diagram RM-334 using RF ASIC N7500

The RF block diagram uses RF ASIC N7500 that performs the RF back-end functions of receive and transmit

function of the cellular transceiver.

Receiver (RX)

An analogue signal is received by the phone's antenna. The signal is converted to a digital signal and is then

transferred further to the baseband (eg. to the earpiece).

The receiver functions are implemented in the RF ASIC.

Signals with different frequencies take different paths, therefore being handled by different components.

The principle of GSM and WCDMA is the same.

Transmitter (TX)

The digital baseband signal (eg. from the microphone) is converted to an analogue signal, which is then

amplified and transmitted from the antenna. The frequency of this signal can be tuned to match the bandwith

of the system in use (eg. GSM900).

The transmitter functions are implemented in the RF ASIC.

Even though the GSM and WCDMA signals are sent via different components, the principles of the transmission

is the same.

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Frequency mappings

GSM850 frequencies

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EGSM900 frequencies

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GSM1800 frequencies

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GSM1900 frequencies

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WCDMA 2100 Rx frequencies

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WCDMA 2100 Tx frequencies

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WCDMA V (850) frequencies

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WCDMA VIII (900) frequencies

Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2712 882,4 3529,6 2937 927,4 3709,6

2713 882,6 3530,4 2938 927,6 3710,4

2714 882,8 3531,2 2939 927,8 3711,2

2715 883 3532 2940 928 3712

2716 883,2 3532,8 2941 928,2 3712,8

2717 883,4 3533,6 2942 928,4 3713,6

2718 883,6 3534,4 2943 928,6 3714,4

2719 883,8 3535,2 2944 928,8 3715,2

2720 884 3536 2945 929 3716

2721 884,2 3536,8 2946 929,2 3716,8

2722 884,4 3537,6 2947 929,4 3717,6

2723 884,6 3538,4 2948 929,6 3718,4

2724 884,8 3539,2 2949 929,8 3719,2

2725 885 3540 2950 930 3720

2726 885,2 3540,8 2951 930,2 3720,8

2727 885,4 3541,6 2952 930,4 3721,6

2728 885,6 3542,4 2953 930,6 3722,4

2729 885,8 3543,2 2954 930,8 3723,2

2730 886 3544 2955 931 3724

2731 886,2 3544,8 2956 931,2 3724,8

2732 886,4 3545,6 2957 931,4 3725,6

2733 886,6 3546,4 2958 931,6 3726,4

2734 886,8 3547,2 2959 931,8 3727,2

2735 887 3548 2960 932 3728

2736 887,2 3548,8 2961 932,2 3728,8

2737 887,4 3549,6 2962 932,4 3729,6

2738 887,6 3550,4 2963 932,6 3730,4

2739 887,8 3551,2 2964 932,8 3731,2

2740 888 3552 2965 933 3732

2741 888,2 3552,8 2966 933,2 3732,8

2742 888,4 3553,6 2967 933,4 3733,6

2743 888,6 3554,4 2968 933,6 3734,4

2744 888,8 3555,2 2969 933,8 3735,2

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Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2745 889 3556 2970 934 3736

2746 889,2 3556,8 2971 934,2 3736,8

2747 889,4 3557,6 2972 934,4 3737,6

2748 889,6 3558,4 2973 934,6 3738,4

2749 889,8 3559,2 2974 934,8 3739,2

2750 890 3560 2975 935 3740

2751 890,2 3560,8 2976 935,2 3740,8

2752 890,4 3561,6 2977 935,4 3741,6

2753 890,6 3562,4 2978 935,6 3742,4

2754 890,8 3563,2 2979 935,8 3743,2

2755 891 3564 2980 936 3744

2756 891,2 3564,8 2981 936,2 3744,8

2757 891,4 3565,6 2982 936,4 3745,6

2758 891,6 3566,4 2983 936,6 3746,4

2759 891,8 3567,2 2984 936,8 3747,2

2760 892 3568 2985 937 3748

2761 892,2 3568,8 2986 937,2 3748,8

2762 892,4 3569,6 2987 937,4 3749,6

2763 892,6 3570,4 2988 937,6 3750,4

2764 892,8 3571,2 2989 937,8 3751,2

2765 893 3572 2990 938 3752

2766 893,2 3572,8 2991 938,2 3752,8

2767 893,4 3573,6 2992 938,4 3753,6

2768 893,6 3574,4 2993 938,6 3754,4

2769 893,8 3575,2 2994 938,8 3755,2

2770 894 3576 2995 939 3756

2771 894,2 3576,8 2996 939,2 3756,8

2772 894,4 3577,6 2997 939,4 3757,6

2773 894,6 3578,4 2998 939,6 3758,4

2774 894,8 3579,2 2999 939,8 3759,2

2775 895 3580 3000 940 3760

2776 895,2 3580,8 3001 940,2 3760,8

2777 895,4 3581,6 3002 940,4 3761,6

2778 895,6 3582,4 3003 940,6 3762,4

2779 895,8 3583,2 3004 940,8 3763,2

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Issue 2 COMPANY CONFIDENTIAL Page 8 –41

Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2780 896 3584 3005 941 3764

2781 896,2 3584,8 3006 941,2 3764,8

2782 896,4 3585,6 3007 941,4 3765,6

2783 896,6 3586,4 3008 941,6 3766,4

2784 896,8 3587,2 3009 941,8 3767,2

2785 897 3588 3010 942 3768

2786 897,2 3588,8 3011 942,2 3768,8

2787 897,4 3589,6 3012 942,4 3769,6

2788 897,6 3590,4 3013 942,6 3770,4

2789 897,8 3591,2 3014 942,8 3771,2

2790 898 3592 3015 943 3772

2791 898,2 3592,8 3016 943,2 3772,8

2792 898,4 3593,6 3017 943,4 3773,6

2793 898,6 3594,4 3018 943,6 3774,4

2794 898,8 3595,2 3019 943,8 3775,2

2795 899 3596 3020 944 3776

2796 899,2 3596,8 3021 944,2 3776,8

2797 899,4 3597,6 3022 944,4 3777,6

2798 899,6 3598,4 3023 944,6 3778,4

2799 899,8 3599,2 3024 944,8 3779,2

2800 900 3600 3025 945 3780

2801 900,2 3600,8 3026 945,2 3780,8

2802 900,4 3601,6 3027 945,4 3781,6

2803 900,6 3602,4 3028 945,6 3782,4

2804 900,8 3603,2 3029 945,8 3783,2

2805 901 3604 3030 946 3784

2806 901,2 3604,8 3031 946,2 3784,8

2807 901,4 3605,6 3032 946,4 3785,6

2808 901,6 3606,4 3033 946,6 3786,4

2809 901,8 3607,2 3034 946,8 3787,2

2810 902 3608 3035 947 3788

2811 902,2 3608,8 3036 947,2 3788,8

2812 902,4 3609,6 3037 947,4 3789,6

2813 902,6 3610,4 3038 947,6 3790,4

2814 902,8 3611,2 3039 947,8 3791,2

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Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2815 903 3612 3040 948 3792

2816 903,2 3612,8 3041 948,2 3792,8

2817 903,4 3613,6 3042 948,4 3793,6

2818 903,6 3614,4 3043 948,6 3794,4

2819 903,8 3615,2 3044 948,8 3795,2

2820 904 3616 3045 949 3796

2821 904,2 3616,8 3046 949,2 3796,8

2822 904,4 3617,6 3047 949,4 3797,6

2823 904,6 3618,4 3048 949,6 3798,4

2824 904,8 3619,2 3049 949,8 3799,2

2825 905 3620 3050 950 3800

2826 905,2 3620,8 3051 950,2 3800,8

2827 905,4 3621,6 3052 950,4 3801,6

2828 905,6 3622,4 3053 950,6 3802,4

2829 905,8 3623,2 3054 950,8 3803,2

2830 906 3624 3055 951 3804

2831 906,2 3624,8 3056 951,2 3804,8

2832 906,4 3625,6 3057 951,4 3805,6

2833 906,6 3626,4 3058 951,6 3806,4

2834 906,8 3627,2 3059 951,8 3807,2

2835 907 3628 3060 952 3808

2836 907,2 3628,8 3061 952,2 3808,8

2837 907,4 3629,6 3062 952,4 3809,6

2838 907,6 3630,4 3063 952,6 3810,4

2839 907,8 3631,2 3064 952,8 3811,2

2840 908 3632 3065 953 3812

2841 908,2 3632,8 3066 953,2 3812,8

2842 908,4 3633,6 3067 953,4 3813,6

2843 908,6 3634,4 3068 953,6 3814,4

2844 908,8 3635,2 3069 953,8 3815,2

2845 909 3636 3070 954 3816

2846 909,2 3636,8 3071 954,2 3816,8

2847 909,4 3637,6 3072 954,4 3817,6

2848 909,6 3638,4 3073 954,6 3818,4

2849 909,8 3639,2 3074 954,8 3819,2

RM-333; RM-334; RM-335

System Module and User Interface

Issue 2 COMPANY CONFIDENTIAL Page 8 –43

Uplink CH (TX) Freq (MHz) VCO (MHz) Downlink CH (RX) Freq (MHz) VCO (MHz)

2850 910 3640 3075 955 3820

2851 910,2 3640,8 3076 955,2 3820,8

2852 910,4 3641,6 3077 955,4 3821,6

2853 910,6 3642,4 3078 955,6 3822,4

2854 910,8 3643,2 3079 955,8 3823,2

2855 911 3644 3080 956 3824

2856 911,2 3644,8 3081 956,2 3824,8

2857 911,4 3645,6 3082 956,4 3825,6

2858 911,6 3646,4 3083 956,6 3826,4

2859 911,8 3647,2 3084 956,8 3827,2

2860 912 3648 3085 957 3828

2861 912,2 3648,8 3086 957,2 3828,8

2862 912,4 3649,6 3087 957,4 3829,6

2863 912,6 3650,4 3088 957,6 3830,4

RM-333; RM-334; RM-335

System Module and User Interface

Page 8 –44 COMPANY CONFIDENTIAL Issue 2

9 — Service information

differences between RM-335

and RM-333

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page 9 –1

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

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Page 9 –2 COMPANY CONFIDENTIAL Issue 2

Table of Contents

General Information...............................................................................................................................................9–5

RM-335 Product data ........................................................................................................................................9–5

Main RF characteristics for GSM850/900/1800/1900 (quadband) and EDGE phones .................................9–6

BB Troubleshooting................................................................................................................................................9–7

BB HW differences between RM-335 and RM-333..........................................................................................9–7

RF Troubleshooting................................................................................................................................................9–7

RM-335 RF block ................................................................................................................................................9–7

List of Tables

Table 14 Main RF characteristics...........................................................................................................................9–6

List of Figures

Figure 89 View of RM-335......................................................................................................................................9–5

Figure 90 USB charging components in RM-335 and RM-333............................................................................9–7

Figure 91 RM-335 RF key components .................................................................................................................9–8

Figure 92 RM-335 RF block diagram.....................................................................................................................9–9

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

Issue 2 COMPANY CONFIDENTIAL Page 9 –3

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

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Page 9 –4 COMPANY CONFIDENTIAL Issue 2

General Information

RM-335 Product data

RM-335 is a 2G variant of the Nokia N85. The key product data differences between the RM-335 (2G) and

RM-333 (3G) are described below.

RM-335 is a GSM handportable phone, supporting GSM/ GPRS/ EGPRS 850/900/1800/1900. RM-335 does not

support WCDMA or WLAN.

Figure 89 View of RM-335

Connectivity

Operating bands EGSM900/GSM850/1800/1900 MHz (no WCDMA/

HSDPA)

Sales package

•Transceiver RM-335

•Nokia Battery (BL-5K)

•Nokia Charger (AC-10)

•Nokia Music Headset (HS-45/AD-54)

•Nokia Connectivity Cable (CA-101) (micro USB)

•CD-ROM

•User Guide

•Sales carton

•Warranty card

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

Issue 2 COMPANY CONFIDENTIAL Page 9 –5

Main RF characteristics for GSM850/900/1800/1900 (quadband) and EDGE phones

Table 14 Main RF characteristics

Parameter Unit

Cellular system GSM850, EGSM900, GSM1800/1900 and EDGE

Rx frequency band GSM850: 869 - 894 MHz

EGSM900: 925 - 960 MHz

GSM1800: 1805 - 1880 MHz

GSM1900: 1930 - 1990 MHz

Tx frequency band GSM850: 824 - 849 MHz

EGSM900: 880 - 915 MHz

GSM1800: 1710 - 1785 MHz

GSM1900: 1850 - 1910 MHz

Output power GSM850: +5 … +33dBm/3.2mW … 2W

GSM900: +5 … +33dBm/3.2mW … 2W

GSM1800: +0 … +30dBm/1.0mW … 1W

GSM1900: +0 … +30dBm/1.0mW … 1W

EDGE output power EDGE850: +5 … +27dBm/3.2mW … 500mW

EDGE900: +5 … +27dBm/3.2mW … 500mW

EDGE1800: +0 … +26dBm/1.0mW … 400mW

EDGE1900:+0 … +26dBm/1.0mW … 400mW

Number of RF channels GSM850: 124

GSM900: 194

GSM1800: 374

GSM1900: 299

Channel spacing 200 kHz

Number of Tx power levels GSM850: 15

GSM900: 15

GSM1800: 16

GSM1900: 16

Number of EDGE Tx power levels GSM850 EDGE: 12

GSM900 EDGE: 12

GSM1800 EDGE: 14

GSM1900 EDGE: 14

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

Page 9 –6 COMPANY CONFIDENTIAL Issue 2

BB Troubleshooting

BB HW differences between RM-335 and RM-333

Figure 90 USB charging components in RM-335 and RM-333

RF Troubleshooting

RM-335 RF block

As RM-335 is a 2G variant of the RM-333/334, there are no WCDMA RF components in the RF block of the

RM-335. For example, the following WCDMA RF components are not assembled in RM-335:

•N7540 WCDMA PA

•Z7541 WCDMA duplex filter high band 1

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

Issue 2 COMPANY CONFIDENTIAL Page 9 –7

•Z7543 WCDMA TX dual SAW filter high bands

•Z7544 WCDMA TX SAW filter low bands

Figure 91 RM-335 RF key components

Note: The attenuation values for the SA-154 RF coupler as well as the TX power level tuning targets

are the same for the GSM bands in both RM-335 and RM-333.

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

Page 9 –8 COMPANY CONFIDENTIAL Issue 2

Figure 92 RM-335 RF block diagram

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

Issue 2 COMPANY CONFIDENTIAL Page 9 –9

RM-333; RM-334; RM-335

Service information differences between RM-335 and

RM-333

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Page 9 –10 COMPANY CONFIDENTIAL Issue 2

Glossary

Nokia Customer Care

Issue 2 COMPANY CONFIDENTIAL Page Glossary–1

RM-333; RM-334; RM-335

Glossary

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Page Glossary–2 COMPANY CONFIDENTIAL Issue 2

A/D-converter Analogue-to-digital converter

ACI Accessory Control Interface

ADC Analogue-to-digital converter

ADSP Application DPS (expected to run high level tasks)

AGC Automatic gain control (maintains volume)

ALS Ambient light sensor

AMSL After Market Service Leader

ARM Advanced RISC Machines

ARPU Average revenue per user (per month or per year)

ASIC Application Specific Integrated Circuit

ASIP Application Specific Interface Protector

B2B Board to board, connector between PWB and UI board

BA Board Assembly

BB Baseband

BC02 Bluetooth module made by CSR

BIQUAD Bi-quadratic (type of filter function)

BSI Battery Size Indicator

BT Bluetooth

CBus MCU controlled serial bus connected to UPP_WD2, UEME and Zocus

CCP Compact Camera Port

CDMA Code division multiple access

CDSP Cellular DSP (expected to run at low levels)

CLDC Connected limited device configuration

CMOS Complimentary metal-oxide semiconductor circuit (low power consumption)

COF Chip on Foil

COG Chip on Glass

CPU Central Processing Unit

CSD Circuit-switched data

CSR Cambridge silicon radio

CSTN Colour Super Twisted Nematic

CTSI Clock Timing Sleep and interrupt block of Tiku

CW Continuous wave

D/A-converter Digital-to-analogue converter

DAC Digital-to-analogue converter

DBI Digital Battery Interface

DBus DSP controlled serial bus connected between UPP_WD2 and Helgo

RM-333; RM-334; RM-335

Glossary

Issue 2 COMPANY CONFIDENTIAL Page Glossary–3

DCT-4 Digital Core Technology

DMA Direct memory access

DP Data Package

DPLL Digital Phase Locked Loop

DSP Digital Signal Processor

DTM Dual Transfer Mode

DtoS Differential to Single ended

EDGE Enhanced data rates for global/GSM evolution

EGSM Extended GSM

EM Energy management

EMC Electromagnetic compatibility

EMI Electromagnetic interference

ESD Electrostatic discharge

FCI Functional cover interface

FPS Flash Programming Tool

FR Full rate

FSTN Film compensated super twisted nematic

GMSK Gaussian Minimum Shift Keying

GND Ground, conductive mass

GPIB General-purpose interface bus

GPRS General Packet Radio Service

GSM Group Special Mobile/Global System for Mobile communication

HSDPA High-speed downlink packet access

HF Hands free

HFCM Handsfree Common

HS Handset

HSCSD High speed circuit switched data (data transmission connection faster than GSM)

HW Hardware

I/O Input/Output

IBAT Battery current

IC Integrated circuit

ICHAR Charger current

IF Interface

IHF Integrated hands free

IMEI International Mobile Equipment Identity

IR Infrared

RM-333; RM-334; RM-335

Glossary

Page Glossary–4 COMPANY CONFIDENTIAL Issue 2

IrDA Infrared Data Association

ISA Intelligent software architecture

JPEG/JPG Joint Photographic Experts Group

LCD Liquid Crystal Display

LDO Low Drop Out

LED Light-emitting diode

LPRF Low Power Radio Frequency

MCU Micro Controller Unit (microprocessor)

MCU Multiport control unit

MIC, mic Microphone

MIDP Mobile Information Device Profile

MIN Mobile identification number

MIPS Million instructions per second

MMC Multimedia card

MMS Multimedia messaging service

MTP Multipoint-to-point connection

NFC Near field communication

NTC Negative temperature coefficient, temperature sensitive resistor used as a

temperature sensor

OMA Object management architecture

OMAP Operations, maintenance, and administration part

Opamp Operational Amplifier

PA Power amplifier

PDA Pocket Data Application

PDA Personal digital assistant

PDRAM Program/Data RAM (on chip in Tiku)

Phoenix Software tool of DCT4.x and BB5

PIM Personal Information Management

PLL Phase locked loop

PM (Phone) Permanent memory

PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX Power-up reset

PWB Printed Wiring Board

PWM Pulse width modulation

RC-filter Resistance-Capacitance filter

RF Radio Frequency

RM-333; RM-334; RM-335

Glossary

Issue 2 COMPANY CONFIDENTIAL Page Glossary–5

RF PopPort™ Reduced function PopPort™ interface

RFBUS Serial control Bus For RF

RSK Right Soft Key

RS-MMC Reduced size Multimedia Card

RSS Web content Syndication Format

RSSI Receiving signal strength indicator

RST Reset Switch

RTC Real Time Clock (provides date and time)

RX Radio Receiver

SARAM Single Access RAM

SAW filter Surface Acoustic Wave filter

SDRAM Synchronous Dynamic Random Access Memory

SID Security ID

SIM Subscriber Identity Module

SMPS Switched Mode Power Supply

SNR Signal-to-noise ratio

SPR Standard Product requirements

SRAM Static random access memory

STI Serial Trace Interface

SW Software

SWIM Subscriber/Wallet Identification Module

TCP/IP Transmission control protocol/Internet protocol

TCXO Temperature controlled Oscillator

Tiku Finnish for Chip, Successor of the UPP

TX Radio Transmitter

UART Universal asynchronous receiver/transmitter

UEME Universal Energy Management chip (Enhanced version)

UEMEK See UEME

UI User Interface

UPnP Universal Plug and Play

UPP Universal Phone Processor

UPP_WD2 Communicator version of DCT4 system ASIC

USB Universal Serial Bus

VBAT Battery voltage

VCHAR Charger voltage

VCO Voltage controlled oscillator

RM-333; RM-334; RM-335

Glossary

Page Glossary–6 COMPANY CONFIDENTIAL Issue 2

VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO Voltage Controlled Crystal Oscillator

VF View Finder

Vp-p Peak-to-peak voltage

VSIM SIM voltage

WAP Wireless application protocol

WCDMA Wideband code division multiple access

WD Watchdog

WLAN Wireless local area network

XHTML Extensible hypertext markup language

Zocus Current sensor (used to monitor the current flow to and from the battery)

RM-333; RM-334; RM-335

Glossary

Issue 2 COMPANY CONFIDENTIAL Page Glossary–7

RM-333; RM-334; RM-335

Glossary

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Page Glossary–8 COMPANY CONFIDENTIAL Issue 2

Nokia N85 Rm 333 334 335 Service Manual 34 V2

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