Thundersoft TurboX® D845 SOM Datasheet Rb3 Hardware User Manual
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Qualcomm® Robotics RB3 Platform Hardware User Manual 1 www.thundercomm.com/ Table of Contents 1 Introduction ........................................................................................................................................................ 6 1.1 Board overview .................................................................................................................................... 8 2 What’s in the Box .............................................................................................................................................. 9 3 Getting started ................................................................................................................................................. 10 3.1 Prerequisites....................................................................................................................................... 10 3.2 Starting the board for the first time .................................................................................................... 10 3.2.1 4 Starting process for LE OS ........................................................................................................ 10 DragonBoard 845c Overview ............................................................................................................................ 12 4.1 System Block diagram ....................................................................................................................... 12 4.2 Processor ............................................................................................................................................ 12 4.3 Memory ............................................................................................................................................. 12 4.4 MicroSD ............................................................................................................................................ 13 4.5 WiFi/BT RF ....................................................................................................................................... 13 4.6 Display Interface ................................................................................................................................ 14 4.6.1 HDMI ......................................................................................................................................... 14 4.6.2 MIPI-DSI ................................................................................................................................... 15 4.7 Camera Interfaces .............................................................................................................................. 15 4.8 USB Ports .......................................................................................................................................... 15 4.9 4.8.1 USB-Host ports........................................................................................................................ 16 4.8.2 USB-Device port...................................................................................................................... 16 Audio ................................................................................................................................................. 16 4.9.1 BT Audio ................................................................................................................................... 16 4.9.2 HDMI Audio .............................................................................................................................. 16 4.9.3 DisplayPort Audio .................................................................................................................... 17 4.10 DC-power and Battery Power ............................................................................................................ 17 4.11 Measurements .................................................................................................................................... 17 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 2 www.thundercomm.com/ 5 4.12 Buttons ............................................................................................................................................... 17 4.13 External Fan connection .................................................................................................................... 17 4.14 UART................................................................................................................................................. 17 4.15 System and user LEDs ....................................................................................................................... 18 4.16 Expansion Connector ......................................................................................................................... 18 4.17 Additional Functionality .................................................................................................................... 18 4.17.1 Ethernet Connector ................................................................................................................. 19 4.17.2 Inertial Sensors........................................................................................................................ 19 4.17.3 Dip Switch ................................................................................................................................ 19 4.17.4 Extra High Speed Expansion Connector ............................................................................. 20 4.17.5 Extra Low Speed Expansion Connectors ............................................................................ 20 Low speed Expansion connector .................................................................................................................. 21 5.1 5.2 Primary Low Speed Expansion Connector: LS1 ⑩ ......................................................................... 21 5.1.1 UART {0/1} ............................................................................................................................... 22 5.1.2 I2C {0/1} .................................................................................................................................... 23 5.1.3 GPIO {A-L} ............................................................................................................................... 23 5.1.4 SPI ............................................................................................................................................. 23 5.1.5 PCM/I2S ................................................................................................................................... 23 5.1.6 Power and Reset ..................................................................................................................... 24 5.1.7 Power Supplies........................................................................................................................ 24 Secondary Low Speed Connector:LS2 ⑩ ........................................................................................ 24 5.2.1 Headset ...................................................................................................................................... 26 5.2.2 Stereo speaker ............................................................................................................................ 26 5.2.3 Digital Microphones .................................................................................................................. 27 5.2.4 CAN ........................................................................................................................................... 27 5.2.5 I2S .............................................................................................................................................. 28 5.2.6 GPIOs ........................................................................................................................................ 28 5.2.7 Other signals on Secondary Low Speed Connector ................................................................... 28 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 3 www.thundercomm.com/ 5.3 6 5.3.1 SSC SPI ..................................................................................................................................... 29 5.3.2 SSC I2C ..................................................................................................................................... 30 5.3.3 Sensor interrupt .......................................................................................................................... 30 5.3.4 Other signals on Tertiary Low Speed Connector ....................................................................... 31 High speed expansion connectors ............................................................................................................... 32 6.1 6.2 7 Tertiary Low Speed Connector:LS3 ⑪............................................................................................. 29 Primary High Speed expansion connector: HS1 ⑥ .......................................................................... 32 6.1.1 MIPI DSI 0 ................................................................................................................................ 35 6.1.2 MIPI CSI {0/1} .......................................................................................................................... 35 6.1.3 I2C {2/3} ................................................................................................................................... 36 6.1.4 HSIC .......................................................................................................................................... 36 6.1.5 Reserved .................................................................................................................................... 36 6.1.6 SD/SPI ....................................................................................................................................... 36 6.1.7 Clocks ........................................................................................................................................ 36 6.1.8 USB............................................................................................................................................ 37 Secondary High Speed Connector: HS2⑫ ....................................................................................... 37 6.2.1 MIPI CSI {1/2} .......................................................................................................................... 39 6.2.2 Clock .......................................................................................................................................... 39 6.2.3 SPI{SSC_SPI2} ......................................................................................................................... 40 6.2.4 PCIe1 ......................................................................................................................................... 40 6.2.5 USB............................................................................................................................................ 41 6.2.6 Other signals on Secondary High Speed Connector .................................................................. 41 Power management........................................................................................................................................ 43 7.1 DC Power Input ................................................................................................................................. 43 7.2 Power Source Selection ..................................................................................................................... 44 7.3 Power Sequencing ............................................................................................................................. 44 7.4 Power Measurements ......................................................................................................................... 44 7.5 DC-In measurement ........................................................................................................................... 44 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 4 www.thundercomm.com/ 7.6 8 Buttons and status LED’s .................................................................................................................................. 46 8.1 8.2 9 PMIC Power-In measurement............................................................................................................ 44 Buttons ............................................................................................................................................... 46 8.1.1 Volume up .................................................................................................................................. 46 8.1.2 Volume down ............................................................................................................................. 46 8.1.3 Power Button ............................................................................................................................. 46 8.1.4 Reset Button............................................................................................................................... 46 8.1.5 Force_USB_BOOT Button ........................................................................................................ 47 LED’s................................................................................................................................................. 47 8.2.1 User LED 1-4 ............................................................................................................................. 47 8.2.2 Bluetooth status ......................................................................................................................... 47 8.2.3 WiFi status ................................................................................................................................. 47 8.2.4 Power Indicator LED ................................................................................................................. 47 Boot configuration ............................................................................................................................................. 48 10 Mechanical specification ........................................................................................................................... 49 10.1 Board dimensions .............................................................................................................................. 49 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 5 www.thundercomm.com/ 1 Introduction The Qualcomm Robotics RB3 Platform is a dedicated robotics platform designed to accelerate computing and intelligence capabilities for consumer and industrial robotics.It supports the development of smart, power-efficient and cost-effective robots by combining high-performance heterogeneous computing, Qualcomm® Artificial Intelligence (AI) Engine for on-device machine learning, computer vision, voice interface, multimedia and connectivity.The hardware of this platform mainly consists of DragonBoard™ 845c, navigation mezzanine and cellular mezzanine. The DragonBoard™ 845c development board is a 96Boards compliant community board based on Qualcomm® Snapdragon™ 845 processor(SDA845). The following table lists its key features: SoC Qualcomm® Snapdragon™ 845 platform (SDA845) CPU Custom 64-bit ARM v8-compliant octa-core CPU Up to 2.8 GHz, 10nm LPP FinFET process technology GPU Adreno™ 630 GPU OpenGL™ ES 3.2 + AEP , DX next, Vulkan® 2, OpenCL™ 2.0 full profile, RenderScript DSP Hexagon™ 685 DSP RAM 4GB LPDDR4x SDRAM @ 1866 MHz Storage 64GB UFS 2.1 on board storage and MicroSD card slot Ethernet 1x GbE Ethernet Wireless WLAN 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MIMO & Bluetooth 5.0, On board WLAN/BT/GPS antennas. USB 1 x USB 2.0 Micro B (Debug only ) 1 x USB 3.0 Type C (OTG mode) 2 x USB 3.0 Type A (Host mode only) Display Two 4-lane DSI, D-PHY 1.2 or C-PHY 1.0; VESA DSC 1.1 1 x HDMI 1.4 (Type A - full) connector Video 4K60 decode for H.264 High Profile, H.265 Main 10 Profile and VP9 Profile 2 4K60 encode for H.264 High Profile, H.265 Main 10 Profile Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 6 www.thundercomm.com/ Audio MP3; aacPlus, eAAC; WMA 9/Pro Camera Qualcomm Spectra™ 280 ISP, dual 14-bit ISP+one Lite ISP, 32 MP 30 fps ZSL with a dual ISP Sensor Accelerometer + Gyro Sensor/ Proximity sensor Expansion Interface Expansion Connectors: HS1:1 x 60 pin High-Speed connector (4L-MIPI DSI, USB 2.0 x 2, I2C x 2, 2L+4L-MIPI CSI) HS2:1 x 60 pin High-Speed connector (4L-MIPI CSI x 2, SSC SPI, PCIe 3.0, USB 3.0 x 1, GPIO x 9) LS1:1x 96boards 40 pin Low-Speed connector (UART x 2, SPI, I2S, I2C x2, GPIO x 12, DC power) LS2:1 x 96boards 40 pin Low-Speed connector (headset, stereo speaker, DMIC I/F x 3, CAN, I2S, GPIO x 7, PWM x 2, ADC x 2) LS3:1 x 96boards 20 pin Low-Speed connector (SSC SPI x 3, SSC I2C, sensor interrupt x 5) LED 7 LED indicators: 4 - user controllable 2 - for radios (BT and WLAN activity) 1 -power indicator Button Power, Volume Up/Down, Force Usb Boot, Dip Switch (6 PIN) Power Source 12V@2.5A adapter with a DC plug: Plug specification is inner diameter 1.75mm and outer diameter is 4.75mm OS Support Linux Embedded (LE) Mechanical & 85mm by 54 mm meeting 96Boards™ Consumer Edition Standard form dimensions Environmental specifications Operating Temp: -20°C to +70°C RoHS and Reach compliant Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 7 www.thundercomm.com/ 1.1 Board overview Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 8 www.thundercomm.com/ 2 What’s in the Box The box contains one DragonBoard 845c development board and a Quick Start Guide. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 9 www.thundercomm.com/ 3 Getting started 3.1 Prerequisites Before you power up your DragonBoard 845c for the first time you will need the following: • • • • • DragonBoard 845c development board o Board based on Qualcomm® Snapdragon™ 845 processor Power adapter o 96Boards specification requires a 12V with 2500mA power adapter USB to micro USB cable o This is needed for serial console interface and fastboot/adb commands USB to USB Type C cable o This is needed to connect the USB3.0 Type C port and flash the images Host PC o This is needed to connect the DragonBoard and have fastboot installed 3.2 Starting the board for the first time 3.2.1 Starting process for LE OS To start the board, follow these simple steps (Display is not supported in the LE OS): • • Step 1: Open the serial console tool on the Host PC.(for example:minicom) Step 2: Enable the USB2.0 debug port by turning on the SW2 of the Dip Switch ⑮ Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 10 www.thundercomm.com/ • • • • Step 3: Connect the Micro-B plug on the USB cable to the USB2.0 debug port ㉑ on the device,and the other end to an available USB port on the host PC Note: please set the Bps/Par/Bits to 115200 8N1 Step 4: Connect the power supply to power connector ⑬ Step 5: Plug the power supply into a power outlet,and “power up” green Led should illuminate Step 6: Press and release the power button on the device,and user yellow Led0 should illuminate The board will start the booting process, and you should see Login Credentials displayed on the host PC: sda845 login: root Password: 123456 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 11 www.thundercomm.com/ 4 DragonBoard 845c Overview 4.1 System Block diagram MI2S MI2S Turbox-845 TurboX D845SOM SOM DSI0 WSA8810 UFS FLASH 64GB WCD9340 CAN SPI to CAN SLIMBUS SPI Low speed expansion 3 SPI QUP5 QUP PM/PMI GPIOs PM/PMI GPIOx7 (incl. 2xPWM) Opt. external clk clock GPIO SPI SPI/INT switch INTx3 I2C/INT LTR-553 Prox Sensor HDMI DSI1 MICs Invensense ICM-42688 MIPI to HDMI LT9611 DSI1 DSI1 DSI Switch FS644 CCI I2C x 2 DSI – 4 lane I2C x 2 SDC4 SDC CAM MCLK GPIO x 2 CSI0 CSI3 CAM MCLKs CSI0 – 4 lane CSI3 – 2 lane DP/DM DP/DM I2C SSC SPI/I2C/INT uUSB 2.0 TPS54428 x2 GPIOs x 10 PCIe1 SYS DC_IN (12V) FT230XQ-R UART to USB USB CAMERA RESET/CONTROL GPIOs expansion expansion speed speed High High 2 2 Extra SPI CS, Extra INT UART CAM MCLK GPIO x 2 CSI1 CSI2 CAM MCLKs x 2 CSI2 – 4 lane SSC SPI SPI PM GPIOs x 2 Buttons (power/volume) PM GPIOs SS LANES PCM/I2S I2C x 2 I2C x 2 Secondary USB (Type 2/3) USB 3.0 USB2.0 SPI QUP/GPIO x 12 QUP/GPIOs x 12 PWR/RST PWR/RST TPS54428 SD card 5V USB3.0 UART x 2 UART x 2 PCIe0 USB 3.0 Type A PCM PCIe Gen2 USB 2.0 USB 3.0 PCIe To USB SYS DC_IN (12V) USB 3.0 USB 3.0 USB to LAN USB 3.0 Type A Low speed expansion 1 DIP switches SYS DC_IN (12V) RJ45 Low speed expansion 2 DSI0 POP memory LPDDR4x 4GB WSA8810 SPKR HDMI Type-A SYS DC_IN (12V) High speed expansion 1 TPS54428 VBAT SDC2 SDC2 WLAN1 RF connectors 12V DC Jack BT TPS54428 4V Primary USB Type 2/3/C VBAT USB VBUS SS LANES x 2 DP/DM USB_VBUS USB Type C WLAN0 4.2 Processor The Snapdragon 845 processor has a 64-bit ARM v8-compliant octa-core Qualcomm® Kryo™ 385 CPU, supports LPDDR4X SDRAM interface, Compute DSP with Hexagon Vector eXtensions, 32MP camera, Adreno 630 GPU, 4K video encode/decode, Bluetooth 5.0. 4.3 Memory Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 12 www.thundercomm.com/ The DragonBoard 845c uses a package on package (PoP) LPDDR4X RAM configuration and discrete UFS2.1 flash memory. ●The LPDDR4X interface directly to the Snapdragon 845 built-in LPDDR controller. The maximum DDR clock is 1866 Mhz. ●The UFS flash memory interfaces with Snapdragon 845 over a dedicated UFS PHY bus supporting the UFS 2.1 specification. 4.4 MicroSD The DragonBoard 845c SD slot (⑭) signals are routed directly to the Snapdragon 845 SDC2 interface. The slot is a push-push type with a dedicated support for card detect signal (many SD slots do not have a dedicated CD pins, they use DATA3 state as the card detected signal). The DragonBoard 845c board uses SDA GPIO_126 as the SD_CARD_DET_N. 4.5 WiFi/BT RF The DragonBoard 845c uses Qualcomm RF chip WCN3990 solution that integrates two wireless connectivity technologies into a single device. The interfaces are: ●WLAN compliant with IEEE 802.11 b/g/n/ac specifications, exceeding 96Boards minimal requirements for WiFi. ●Bluetooth compliant with the BT specifications version 5.0 (BR/EDT + BLE), meeting the 96Boards requirements for BT. The DragonBoard 845c onboard antenna(㉒) are connected to SOM antenna socket with RF coaxial cable. The SOM antenna sockets adopts the MIMO type, the socket(㉓) combines BT and WIFI chain0; the socket(㉔) only supports WIFI chain1. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 13 www.thundercomm.com/ 4.6 Display Interface Dip SW High Speed Exp CONN1 GPIO_120 0 5xSPDT (Diff) DSI1 4LANE DSI0 4LANE DSI TO HDMI (LT9611) I2S(4bit) HDMI (TMDS+DDC) HPD HDMI Type A 1 I2C GPIO_84 INT 4.6.1 HDMI The Snapdragon 845 doesn’t include a built-in HDMI interface. The DragonBoard 845c deploys the built-in MIPIDSI 2x4 lanes interface as the source for the HDMI output. A peripheral DSI to HDMI Bridge (LONTIUM SEMICONDUCTOR LT9611) performs this task and it supports a resolution from 1080p to 4K at 30Hz. While the LT9611 supports automatic input video format timing detection (D-PHY1.2,DSI1.3/CSI-2 1.00 and DCS 1.02.00), an I2C channel from the Snapdragon 845 allows the user to configure the operation of this bridge. It is QUP10 I2C interface from the SoC that connects to the bridge. This bridge supports audio as well (meeting the 96Boards requirements to provide audio via HDMI). The DragonBoard uses a 4 bit I2S2 interface from the Snapdragon 845 for this task. Please note that the 96Boards specification calls for a MIPI-DSI interface to be routed to the High-Speed Expansion connector. Since the Snapdragon 845 has two MIPI-DSI interfaces for HDMI. A muxing device (FSA644UCX) is being use on the board. Only one interface, HDMI, or the Expansion MIPI-DSI can be active at a given time. The controlling signal is named ‘GPIO120_DSI_SW_SEL’. When this signal is logic high, ‘1’, the MIPI-DSI is routed to the DSI-HDMI Bridge. When ‘GPIO120_DSI_SW_SEL’ is logic level low, ‘0’, the MIPI-DSI is routed to the High Speed Expansion connector. This design assigned the ‘GPIO120_DSI_SW_SEL’ function to GPIO_120. User can overwrite the software control by sliding switch 4 of Dip Switch to the ‘ON’ position. That action forces the DSI mux to route the MIPI-DSI to the High Speed Expansion connector. The overwrite option exist for the HighQualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 14 www.thundercomm.com/ Speed Expansion only, you cannot software overwrite the mux to DSI-HDMI Bridge. 4.6.2 MIPI-DSI The DragonBoard 845c implemented a four-lane MIPI_DSI interface meeting this requirement. More information about this implementation can be found in chapter 6 “High speed expansion connector”. 4.7 Camera Interfaces The DragonBoard 845c implements four camera interfaces. ● 4 lane CSI0 camera on primary high speed connector ⑥(J2000). ● 4 lane CSI1camera on secondary high speed connector ⑫ (J2001). ● 4 lane CSI2 camera on secondary high speed connector ⑫ (J2001). ● 2 lane CSI3 camera on primary high speed connector ⑥(J2000). More information about this implementation can be found in chapter 6 “High speed expansion connector”. 4.8 USB Ports High Speed Exp CONN HS1 SDA845 PCIe0 USB hs USB2 USB hs PCIe->USB High Speed Exp CONN HS2 USB4 USB SS USB1 Type A (USB SS+HS) VBUS 5V Buck VBUS Type A (USB SS+HS) USB2 USB1 PMI8998 VBUS CC1/CC2 Type C (USB SS+HS) Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 15 www.thundercomm.com/ 4.8.1 USB-Host ports The Snapdragon 845 includes two USB channel: USB1(⑤) is for Type C port, the other USB2 (③)is for normal host port. The DragonBoard 845c supports 3 USB Host ports as follows: Port 1 of the SoC USB2(③), a Type ‘A’ USB Host 3.0 (Super speed) connector. A current limited sets the Power Current limit to 1.0A. Port 2 of the USB HUB (①), a Type ‘A’ USB Host 3.0 (Super speed) connector. A current limited sets the Power Current limit to 1.0A. Port 3 of the USB HUB is routed to the High Speed Expansion connectors (Super speed to ⑥, High speed to ⑫). No current limited controller is implemented on the board for this channel. Another USB HUB port is routed to the High Speed Expansion connectors ⑥ (High speed). No current limited controller is implemented on the board for this channel. 4.8.2 USB-Device port The DragonBoard 845c implements a USB device port. The port is located at ⑤, a Type C connector. The Type C supports the device or host with different peripheral, the Snapdragon 845 do the configure based on Type C rules. The board can work in one mode at a time, Host mode or Device mode, not both. Note: There is a micro-B USB port ㉑, it is only for debug log output which is from Snapdragon 845 debug UART to USB transformation. 4.9 Audio The 96Boards specifications calls for a minimum of single channel audio through two interfaces, BT and HDMI/MHL/DisplayPort. The DragonBoard 845c meets this requirement with HDMI support, Display Port, and has additional audio channels, including support for headset jack. More information about these additional channels can be found in sections 5. Note that MHL is not supported. 4.9.1 BT Audio The BT 5.0 implementation on the DragonBoard 845c is via a MAC in the SDA845 and an external modem, WCN3990. The UART and IQ interface between the SoC and the modem carriers all communication including audio. 4.9.2 HDMI Audio Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 16 www.thundercomm.com/ A 4-bit (audio out only) I2S channel is routed directly from the Snapdragon 845 SoC I2S interface pins to the DSIHDMI bridge. 4.9.3 DisplayPort Audio The DisplayPort audio is routed directly from the Snapdragon 845 SoC EDP interface pins to Type C USB connector. 4.10 DC-power and Battery Power The DragonBoard 845c supports power to be provided to the board in one of the following ways: • An 8V to 18V power from a dedicated DC jack • An 8V to 18V power from the SYS_DCIN pins on the Low Speed Expansion Connector • A USB Type C port at 5V Please see section 7 for detailed information on 845c implementation of DC Power. 4.11 Measurements The 96Boards specification calls for support for measuring power consumptions of the board. Please see section 7 for detailed information on DragonBoard 845c power measurement implementation. 4.12 Buttons The 96Boards specification calls for the present of two buttons, a Power on/sleep button and a Reset button. The DragonBoard 845c meets these requirements. Please see section 8 for detailed information on the buttons of the DragonBoard 845c. 4.13 External Fan connection The 96Boards specification calls for support for an external fan. That can be achieved by using the 5V or the DC IN. Both present on the Low Speed Expansion connector. 4.14 UART The DragonBoard 845c supports for one SoC UART and an optional second UART both to be routed to the Low Speed Expansion Connector. One UART is directly from SoC pins to Low Speed Expansion Connector; the other option one is for the UART debug log port, if the user wants to use the port for log output, it needs to switch the dip switch pin 2 to "OFF" state. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 17 www.thundercomm.com/ 4.15 System and user LEDs The DragonBoard 845c supports six LEDs to be implemented on the board. The specification defines the LEDs color and mechanical location on the board. Two activity LEDs: • WiFi activity LED – 845c drives this Yellow LED via GPIO9 from the PMIC(PM845). • BT activity LED – 845c drives this Blue LED via GPIO5 from the PMIC(PM845). Four User LEDs: The four user LEDs are surface mount Green in 0603 size located next to the two USB type A connector and labeled ‘USER LEDS 3 2 1 0’. The 845c drives three LEDs from the red, green and blue LED drive from power management IC PMI8998. The fourth User LEDs is driven by the PM845 via GPIO13. Power indicator LED: A green LED is included to indicate the presence of input power to the DragonBoard 845c . 4.16 Expansion Connector The 96Boards specification calls for two Expansion Connectors, a Low Speed and a High Speed. The DragonBoard 845c meets this requirement, please review section 5 for detailed information regarding the Low Speed Expansion Connector and section 6 for detailed information regarding the High Speed Expansion Connectors. 4.17 Additional Functionality The 96Boards specifications allows for additional functionality provided that all mandatory functionality is available and there is no impact on the physical footprint specifications including height and do not prevent the use of the 96Boards CE low speed and high speed expansion facilities. The DragonBoard 845c board implements a few additional functions, which are listed in the following sub-chapters. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 18 www.thundercomm.com/ 4.17.1 Ethernet Connector SDA845 PCIe->USB PCIe0 USB3 USB->Ethernet Ctr RJ45 Gigabit Ethernet is not supported by the Snapdragon 845 SoC, the DragonBoard 845c board has the translation from PCIe0 to USB and then USB to Gigabit Ethernet controller, it uses an RJ45⑧ as the physical interface. 4.17.2 Inertial Sensors The DragonBoard 845c includes the following inertial sensors ● 6-axis Accelerometer/Gyroscope: INVENSENSE ICM-42688 ●LIGHT SENSOR AND PROXIMITY SENSOR: LITEON LTR-553ALS-WA 4.17.3 Dip Switch There is a dip switch ⑮ on the DragonBoard 845c. Switch 1: NA; Switch 2: 'ONBOARD_DEBUG_UART_EN_N', when set to 'ON' position, will force the debug UART log to micro USB port; when set to 'OFF', will force the debug UART log to Low Speed Expansion Connector. Switch 3:' CBL_PWR_N ', when set to 'ON' position, SDA845 system will power on automatically; when set to 'OFF', SDA845 system will power on by ON-KEY manually. Switch 4:' SW_DSI1_TO_LT9611_N ', when set to 'ON' position, the SDA845 DSI1 will force to High Speed Expansion Connector; when set to 'OFF', the DSI1will force to LT9611 DSI->HDMI bridge. Switch 5:' SENSOR_DISCONNECT ', when set to 'ON' position, the SDA845 SSC sensor SPI/I2C will force to Low Speed Expansion Connector; when set to 'OFF', the SSC sensor SPI/I2C will force to onboard sensor. Switch 6:' IMU_EXT_CLK_TOGGLE ', when set to 'ON' position, the onboard ICM-42688 sensor will use the external clk of GPIO78 from SoC; when set to 'OFF', the onboard ICM-42688 sensor will use another interrupt output to SoC GPIO118. These GPIOs needs the software configure setting. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 19 www.thundercomm.com/ 4.17.4 Extra High Speed Expansion Connector The DragonBoard 845c has another High Speed Expansion Connector. Detail information is provided in section 6. 4.17.5 Extra Low Speed Expansion Connectors The DragonBoard 845c has another two Low Speed Expansion Connectors. Detail information is provided in section 5. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 20 www.thundercomm.com/ 5 Low speed Expansion connector 5.1 Primary Low Speed Expansion Connector: LS1 ⑩ PIN 96 Boards Signals 845c Signal 1 GND GND 3 UART0_CTS GPIO41_UART0_CTS 5 UART0_TxD GPIO43_UART0_TXD 7 UART0_RxD GPIO44_UART0_RXD 9 UART0_RTS GPIO42_UART0_RTS 11 UART1_TxD GPIO4_DEBUG_UART_TX_LS1 13 UART1_RxD GPIO5_DEBUG_UART_RX_LS1 15 I2C0_SCL GPIO34_I2C0_SCL 17 I2C0_SDA GPIO33_I2C0_SDA 19 I2C1_SCL GPIO32_I2C1_SCL 21 I2C1_SDA GPIO31_I2C1_SDA 23 GPIO-A GPIO49_QUP12 25 GPIO-C GPIO50_QUP12 27 GPIO-E GPIO51_QUP12 29 GPIO-G GPIO10 31 GPIO-I GPIO9_CAM0_RST_N 33 GPIO-K GPIO8_CAM1_RST_N 35 +1V8 VREG_S4A_1P8 37 +5V VDC_5V 39 GND GND PIN 96 Boards Signals 845c Signal Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries Note Note 21 www.thundercomm.com/ 2 GND GND 4 PWR_BTN_N PHONE_ON_N 6 RST_BTN_N PM_RESIN_N 8 SPI0_SCLK GPIO29_SPI0_SCLK 10 SPI0_DIN GPIO27_SPI0_MISO 12 SPI0_CS GPIO30_SPI0_CS 14 SPI0_DOUT GPIO28_SPI0_MOSI 16 PCM_FS GPIO81_PCM_FS 18 PCM_CLK GPIO80_PCM_CLK 20 PCM_DO GPIO83_PCM_DO 22 PCM_DI GPIO82_PCM_DI 24 GPIO-B GPIO79_MI2S1_MCLK 26 GPIO-D GPIO52_QUP12 28 GPIO-F GPIO7_I2C_SCL 30 GPIO-H GPIO6_I2C_SDA 33 GPIO-J GPIO26_CAM0_VSYNC_OUT 34 GPIO-L GPIO40_CAM1_AFE_GPO 36 SYS_DCIN DC12V 38 SYC_DCIN DC12V 40 GND GND Default volume down; 5.1.1 UART {0/1} The 96Boards specifications calls for a 4-wire UART implementation, UART0 and an optimal second 2-wire UART, UART1 on the Low Speed Expansion Connector. The DragonBoard 845c implements UART0 as a 4-wire UART that connects directly to the SDA845 SoC. These signals are driven at 1.8V. The DragonBoard 845c implements UART1 as a 2-wire UART that connects directly to the Snapdragon 845 SoC. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 22 www.thundercomm.com/ These signals are driven at 1.8V. 5.1.2 I2C {0/1} The 96Boards specification calls for two I2C interfaces to be implemented on the Low Speed Expansion Connector. The DragonBoard 845c implements both interfaces, I2C0 and I2C1 that connects directly to the Snapdragon 845 SoC. A resistor is needed to provide as pull-up for each of the I2C lines per the I2C specifications for further, these pull-ups need to be connected to the 1.8V voltage rail. 5.1.3 GPIO {A-L} The 96Boards specifications calls for 12 GPIO lines to be implemented on the Low Speed Expansion Connector. The DragonBoard 845c implements this requirement. 12 GPIOs are routed from the Snapdragon 845 SoC. The GPIOs are 1.8V voltage rail. • GPIO A - Connects to GPIO_49 of SDA845 SoC, Can be configured to be an IRQ line. • GPIO B - Connects to GPIO_79 of SDA845 SoC. Can be configured to be an IRQ line, and SEC_MI2S_MCLK • GPIO C - Connects to GPIO_50 of SDA845 SoC. • GPIO D - Connects to GPIO_52 of SDA845 SoC. Can be configured to be an IRQ line • GPIO E - Connects to GPIO_51 of SDA845 SoC. • GPIO F - Connects to GPIO_7 of SDA845 SoC. Can be configured to be I2C SCL. • GPIO G - Connects to GPIO_10 of SDA845 SoC. Can be configured to be IRQ line. • GPIO H - Connects to GPIO_6 of SDA845 SoC. Can be configured to be I2C SDA. • GPIO I - Connects to GPIO_9 of SDA845 SoC. Can be configured to be a CAM0_RST signal. • GPIO J - Connects to GPIO_26 of SDA845 SoC. Can be configured to be IRQ line and CAM0_VSYNC_OUT. • GPIO K - Connects to GPIO_8 of SDA845 SoC. Can be configured to be a CAM1_RST signal. • GPIO L - Connects to GPIO_40 of SDA845 SoC. Can be configured to be IRQ line and CAM1_AFE_GPO signal. The IRQ lines create a wake-up event for the SoC. 5.1.4 SPI The 96Boards specification calls for one SPI bus master to be provided on the Low Speed Expansion Connector. The DragonBoard 845C implements a full SPI master with 4 wires, CLK, CS, MOSI and MISO all connect directly to the SDA845 SoC. These signals are driven at 1.8V. 5.1.5 PCM/I2S The 96Boards specification calls for one PCM/I2S bus to be provided on the Low Speed Expansion Connector. The CLK, FS and DO signals are required while the DI is optional. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 23 www.thundercomm.com/ The DragonBoard 845c implements a PCM/I2S with 4 wires, CLK, FS, D0 and DI. The I2S signals are connected directly to the SDA845 SoC. These signals are driven at 1.8V. 5.1.6 Power and Reset The 96Boards specification calls for a signal on the Low Speed Expansion Connector that can power on/off the board and a signal that serves as a board reset signal. The DragonBoard 845c routes the PWR_BTN_N (named PHONE_ON_N on 845c schematic) signal to the KYP_DPWR_N pin of the PM845 PMIC. This signal is driven by SW1301 as well, the on-board power on pushbutton switch(⑳). Please note that the push button only provides an On/Sleep function and not OFF functionality. A mezzanine implementation of this signals should not drive it with any voltage, the only allowed operation is to force it to GND to start the board from a sleep mode. A board shutdown will occur when this signal is held to ground for more than 15 seconds. The DragonBoard 845c board routes the RST_BTN_N (named PM_RESIN_N on DragonBoard 845c schematic) signal to the RESIN_N pin of the PM845 PMIC. This signal is driven by SW1302, the on-board reset switch(⑰). This signal is a dual purpose, the default purpose is Volume Down, the other purpose is the Reset function that needs the software configure setting. 5.1.7 Power Supplies The 96Boards specification calls for three power rails to be present on the Low Speed Expansion Connector: ● +1.8V : Max of 100mA ● +5V : Able to provide a minimum of 5W of power (1A). ● SYS_DCIN : 9-18V input with enough current to support all the board functions or the output DCIN from on-board DC Connector able to provide a minimum of 7W of power. The DragonBoard 845c supports these requirements as follows: +1.8V : Driven by PMIC PM845 VREG_S4A_1P8, which can provide 100mA. +5V : Driven by the 4A 5.0V DC to DC converter (U0801). This buck switcher powers HDMI and CAN current devices. The remaining capacity provides a max current of 2A to the Low Speed Expansion Connector to meets the 96Boards requirements. SYS_DCIN: DC jack input can serve as the board’s main power source. 5.2 Secondary Low Speed Connector:LS2 ⑩ PIN 845c Signal Connect to 1 DMIC_CLK1_OR_AMIC1_P WCD9340 3 DMIC_DATA1_OR_AMIC1_M WCD9340 Note Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 24 www.thundercomm.com/ 5 MIC_BIAS1 WCD9340 7 DMIC_CLK2_OR_AMIC3_P WCD9340 9 DMIC_DATA2_OR_AMIC3_M WCD9340 11 MIC_BIAS3 WCD9340 13 DMIC_CLK3_OR_HPH_MIC_P WCD9340 15 DMIC_DATA3_OR_HPH_MIC_M WCD9340 17 MIC_BIAS4_OR_HS_MIC_BIAS2 WCD9340 19 WCD_HPH_R WCD9340 21 WCD_HPH_REF WCD9340 23 WCD_HPH_L WCD9340 25 WSA0_SPKR_OUT_P WSA8810 27 WSA0_SPKR_OUT_M WSA8810 29 WSA1_SPKR_OUT_P WSA8810 31 WSA1_SPKR_OUT_M WSA8810 33 WCD_HSDET_L WCD9340 35 PM_GPIO13_GREEN_U4_LED PM845 37 VBAT 39 GND PIN 845c Signal Connect to 2 LS2_CAN_H MCP2561 4 LS2_CAN_L MCP2561 6 VREG_LVS1A_1P8 PM845 8 GND 10 PMI_GPIO5 PMI8998 12 PMI_GPIO8 PMI8998 14 GPIO85_QUP5 SDA845 A board DC buck power 4.2V Note Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 25 www.thundercomm.com/ 16 GPIO86_QUP5 SDA845 18 GPIO87_QUP5 SDA845 20 GPIO88_QUP5 SDA845 22 GPIO76_MI2S2_WS SDA845 24 GPIO75_MI2S2_SCK SDA845 26 GPIO77_MI2S2_DATA0 SDA845 28 GPIO78_MI2S2_DATA1 SDA845 30 PM_GPIO21 PM845 33 PM_GPIO8 PM845 34 PM_GPIO9_YEL_WIFI_LED PM845 36 PM_GPIO5_BLUE_BT_LED PM845 38 USB_VBUS PMI8998 40 GND 5.2.1 Headset The headset signals are routed from the WCD9340 codec, one signal is routed from the connector to the CODEC, the signals are: ●WCD_HPH_R - Headphone PA right channel output ●WCD_HPH_L - Headphone PA left channel output ●WCD_HPH_REF - Headphone PA ground sensing ●WCD_HSDET_L- Headset detection 5.2.2 Stereo speaker The speaker signals are routed from the Stereo WSA8810; the signals are: ●WSA0_SPKR_OUT_P - Class-D speaker amplifier output+ ●WSA0_SPKR_OUT_M - Class-D speaker amplifier output●WSA1_SPKR_OUT_P - Class-D speaker amplifier output+ ●WSA1_SPKR_OUT_M - Class-D speaker amplifier output+ Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 26 www.thundercomm.com/ 5.2.3 Digital Microphones The expansion connector supports 3 additional default digital microphone inputs: ●DMIC_1 or AMIC_1 ●DMIC_2 or AMIC_2 ●DMIC_3 or HPH_MIC: Headset MIC ●MIC_BIAS1 ●MIC_BIAS3 ●MIC_BIAS4_OR_HS_MIC_BIAS2: Reference micbias4 or headset microphone bias The analog microphone can be configured by changing the WCD codec audio share resistors. The HPH MIC is for headset microphone input. 5.2.4 CAN SDA845 CAN Controller CAN Transceiver TX CAN_H Low Speed Expansion Connector QUP0 SPI RX CAN_L The CAN signals are routed from CAN transceiver which is from SPI translation. The signals are: ●LS2_CAN_H: CAN High-Level Voltage I/O ●LS2_CAN_L: CAN Low-Level Voltage I/O Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 27 www.thundercomm.com/ 5.2.5 I2S The DragonBoard 845c board implements another PCM/I2S with 4 wires, CLK, FS, D0 and DI. The I2S signals are connected directly to the SDA845 SoC. These signals are driven at 1.8V. The signals are: ●GPIO76_MI2S2_WS :TER_MI2S_WS ●GPIO75_MI2S2_SCK : TER_MI2S_SCK ●GPIO77_MI2S2_DATA0 : TER_MI2S_DATA0 ●GPIO78_MI2S2_DATA1 : TER_MI2S_DATA1 5.2.6 GPIOs The DragonBoard 845c board implements more GPIOs for Low Speed Expansion Connector. The GPIOs are 1.8V voltage rail. • GPIO85_QUP5 - Connects to GPIO_85 of SDA845 SoC QUP5, Can be configured to be an IRQ line. • GPIO86_QUP5- Connects to GPIO_86 of SDA845 SoC QUP5. Can be configured to be an IRQ line, • GPIO87_QUP5 - Connects to GPIO_87 of SDA845 SoC QUP5. • GPIO88_QUP5 - Connects to GPIO_88 of SDA845 SoC QUP5. Can be configured to be an IRQ line • PMI_GPIO5 - Connects to GPIO_5 of PMI8998 PMIC. Can be configured to be a PWM • PMI_GPIO8 - Connects to GPIO_8 of PMI8998 PMIC. Can be configured to be a PWM. • PM_GPIO21 - Connects to GPIO_21 of PM845 PMIC. Can be configured to be ADC. • PM_GPIO8 - Connects to GPIO_8 of PM845 PMIC. Can be configured to be ADC. • PM_GPIO5_BLUE_BT_LED - Connects to GPIO_5 of PM845 PMIC. Can be configured to be Bluetooth LED enable. • PM_GPIO9_YEL_WIFI_LED - Connects to GPIO_9 of PM845 PMIC. Can be configured to be WIFI LED enable. • PM_GPIO13_GREEN_U4_LED - Connects to GPIO_13 of PM845 PMIC. Can be configured to be USER4 LED enable. The IRQ lines create a wake-up event for the SoC. 5.2.7 Other signals on Secondary Low Speed Connector The DragonBoard 845c implements more source voltage at the Lowe Speed Expansion Connector. The signals are: • USB_VBUS : Connects to VBUS of PMI8998 PMIC, Can be configured to be an OTG USB VBUS. • VBAT : Connects to a DC-DC buck of board power, be configured to output 4.2V source. • VREG_LVS1A_1P8 : Connects to a SOM PMIC PM845 LVS1A LDO, be configured to output 1.8V source. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 28 www.thundercomm.com/ 5.3 Tertiary Low Speed Connector:LS3 ⑪ PIN 845c Signal Connect to Note 1 SSC4_SPI_CLK SDA845 3 SSC3_SPI_MOSI SDA845 5 SSC2_SPI_MISO SDA845 7 SSC7_SPI_ACCEL_CS SDA845 9 SSC6_SPI_GYRO_CS SDA845 11 SSC5_SPI_MAG_CS SDA845 13 VREG_LVS2A_1P8 PM845 15 VDC_5V A board DC buck power 5V 17 VBAT A board DC buck power 4.2V 19 GND PIN 845c Signal Connect to 2 GPIO124_PS_INT SDA845 4 GPIO117_ACCEL_INT SDA845 6 GPIO118_GYRO_INT SDA845 8 GPIO123_MAG_INT SDA845 10 GPIO119_MAG_DRDY_INT SDA845 12 SSC0_I2C_SDA SDA845 14 SSC1_I2C_SCL SDA845 16 VREG_S4A_1P8 PM845 18 GND 20 GND Note 5.3.1 SSC SPI Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 29 www.thundercomm.com/ The DragonBoard 845c implements a SSC SPI interface for different sensors that connect to Snapdragon 845 processor sensor core. The SPI can support 3 CS signals. The signals are: • SSC4_SPI_CLK : Connects to SSC4 of SDA845 SoC, Be configured to CLK. • SSC3_SPI_MOSI : Connects to SSC3 of SDA845 SoC. Be configured to MOSI. • SSC2_SPI_MISO : Connects to SSC2 of SDA845 SoC. Be configured to MISO. • SSC7_SPI_ACCEL_CS : Connects to SSC7 of SDA845 SoC. Be configured to Accelerometer CS. • SSC6_SPI_GYRO_CS : Connects to SSC6 of SDA845 SoC. Be configured to Gyroscope CS. • SSC5_SPI_MAG_CS : Connects to SSC5 of SDA845 SoC. Be configured to Magnetometer CS. The dip switch(⑮) pin5 is the different configure setting for onboard 6-axis sensor ICM-42688 or other expansion. If the SPI for other expansion, dip switch pin5 needs to be removed from “OFF” to “ON”. 5.3.2 SSC I2C The DragonBoard 845c implements a SSC I2C interface for different sensors that connect to Snapdragon 845 processor sensor core. A 2.2k resistor is neededto provide as pull-up for each of the I2C lines per the I2C specifications, these pull-ups need to connected to the 1.8V voltage rail. The signals are: • SSC0_I2C_SDA : Connects to SSC0 of SDA845 SoC, Be configured to I2C SDA. • SSC1_I2C_SCL : Connects to SSC1 of SDA845 SoC. Be configured to I2C SCL. The dip switch(⑮) pin5 is the different configure setting for onboard I2C sensor LTR-553ALS-WA or other expansion. If the I2C for other expansion, dip switch pin5 needs to be removed from “OFF” to “ON”. 5.3.3 Sensor interrupt The DragonBoard 845c implements a SSC interrupt for sensor interrupts that is the 1.8V voltage rail. The signals are: • GPIO117_ACCEL_INT : Connects to GPIO_117 of SDA845 SoC, Be configured to Accelerometer INT. • GPIO118_GYRO_INT : Connects to GPIO_118 of SDA845 SoC, Be configured to Gyroscope INT. •GPIO119_MAG_DRDY_INT : Connects to GPIO_119 of SDA845 SoC, Be configured to Magnetometer data INT. • GPIO123_MAG_INT : Connects to GPIO_123 of SDA845 SoC, Be configured to Magnetometer INT. • GPIO124_PS_INT : Connects to GPIO_124 of SDA845 SoC, Be configured to Proximity INT. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 30 www.thundercomm.com/ 5.3.4 Other signals on Tertiary Low Speed Connector The DragonBoard 845c implements more source voltage at the Lowe Speed Expansion Connector. The signals are: • VREG_LVS2A_1P8 : Connects to LVS2 LDO of PM845 PMIC, Can be as sensor IO voltage source. • VDC_5V : Connects to a board DC buck power 5V, Can be as a 5V voltage source. •VBAT : Connects to a board DC buck power 4.2V, Can be as a 4.2V voltage source. • VREG_S4A_1P8 : Connects to S4A LDO of PM845 PMIC, Can be as a 1.8V voltage and 100mA source. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 31 www.thundercomm.com/ 6 High speed expansion connectors 6.1 Primary High Speed expansion connector: HS1 ⑥ The following table shows the High Speed Expansion Connector pin out: PIN 96Boards Signals 845c Signals 1 SD_DAT0/SPI1_DOUT SDC4_DATA0 3 SD_DAT1 SDC4_DATA1 5 SD_DAT2 SDC4_DATA2 7 SD_DAT3/SPI1_CS SDC4_DATA3 9 SD_SCLK/SPI1_SCLK SDC4_CLK 11 SD_CMD/SPI1_DIN SDC4_CMD 13 GND GND 15 CLK0/CSI0_MCLK CAM0_MCLK 17 CLK1/CSI1_MCLK CAM3_MCLK 19 GND GND 21 DSI_CLK+ MIPI_DSI1_CLK_P 23 DSI_CLK- MIPI_DSI1_CLK_N 25 GND GND 27 DSI_D0+ MIPI_DSI1_LANE0_P 29 DSI_D0- MIPI_DSI1_LANE0_N 31 GND GND 33 DSI_D1+ MIPI_DSI1_LANE1_P 35 DSI_D1- MIPI_DSI1_LANE1_N 37 GND GND 39 DSI_D2+ MIPI_DSI1_LANE2_P 41 DSI_D2- MIPI_DSI1_LANE2_N Note Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 32 www.thundercomm.com/ 43 GND GND 45 DSI_D3+ MIPI_DSI1_LANE3_P 47 DSI_D3- MIPI_DSI1_LANE3_N 49 GND GND 51 USB_D+ PCIE0_USB4_HS_DP 53 USB_D- PCIE0_USB4_HS_DM 55 GND GND 57 HSIC_STR PCIE0_USB5_HS_DP 59 HSIC_DATA PCIE0_USB5_HS_DM PIN 96Boards Signals 845c Signals 2 CSI0_C+ MIPI_CSI0_CLK_P 4 CSI0_C- MIPI_CSI0_CLK_N 6 GND GND 8 CSI0_D0+ MIPI_CSI0_LANE0_P 10 CSI0_D0- MIPI_CSI0_LANE0_N 12 GND GND 14 CSI0_D1+ MIPI_CSI0_LANE1_P 16 CSI0_D1- MIPI_CSI0_LANE1_N 18 GND GND 20 CSI0_D2+ MIPI_CSI0_LANE2_P 22 CSI0_D2- MIPI_CSI0_LANE2_N 24 GND GND 26 CSI0_D3+ MIPI_CSI0_LANE3_P 28 CSI0_D3- MIPI_CSI0_LANE3_N 30 GND GND PCIe USB HUB port 4. No HSIC implementation; configured as USB 2.0 expansion. PCIe USB port 2. Note Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 33 www.thundercomm.com/ 32 I2C2_SCL CCI_I2C_SDA0 34 I2C2_SCL CCI_I2C_SCL0 36 I2C3_SDA CCI_I2C_SDA1 38 I2C3_SDA CCI_I2C_SCL1 40 GND GND 42 CSI1_D0+ MIPI_CSI3_LANE0_P 44 CSI1_D0- MIPI_CSI3_LANE0_N 46 GND GND 48 CSI1_D1+ MIPI_CSI3_LANE1_P 50 CSI1_D1- MIPI_CSI3_LANE1_N 52 GND GND 54 CSI1_C+ MIPI_CSI3_CLK_P 56 CSI1_C- MIPI_CSI3_CLK_N 58 GND GND 60 RESERVED VREG_S4A_1P8 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 34 www.thundercomm.com/ 6.1.1 MIPI DSI 0 SDA845 Dip SW High Speed Exp CONN1 GPIO_120 0 5xSPDT (Diff) DSI1 4LANE DSI0 4LANE DSI TO HDMI (LT9611) I2S(4bit) HDMI (TMDS+DDC) HPD HDMI Type A 1 I2C GPIO_84 INT The 96Boards specification calls for a MIPI-DSI to be present on the High Speed Expansion Connector. A minimum of one lane is required and up to four lanes can be accommodated on the connector. The DragonBoard 845c implementation supports a full four lane MIPI-DSI interface that is routed to the Primary High Speed Expansion Connector. Since the SDA845 has no HDMI interface, and it is used to drive the DSI-HDMI Bridge, DSI muxing is required. A muxing device (FSA644UCX) is being use on the board. Only one interface, HDMI, or the Expansion MIPI-DSI can be active at a given time. The signal is named ‘GPIO120_DSI_SW_SEL’. When this signal is logic high, ‘1’, the MIPI-DSI is routed to the DSI-HDMI Bridge. When ‘GPIO120_DSI_SW_SEL’ is logic level low, ‘0’, the MIPI-DSI is routed to the High Speed Expansion connector. This design assigned the ‘GPIO120_DSI_SW_SEL’ function to GPIO_120. User can overwrite the software control by sliding switch 4 of Dip Switch to the ‘ON’ position. That action forces the DSI mux to route the MIPI-DSI to the High Speed Expansion connector. The overwrite option exist for the High Speed Expansion only, you cannot software overwrite the mux to DSI-HDMI Bridge. 6.1.2 MIPI CSI {0/1} The 96Boards specification calls for two MIPI-CSI interfaces to be present on the High Speed Expansion Connector. Both interfaces are optional. CSI0 interface can be up to four lanes while CSI1 is up to two lanes. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 35 www.thundercomm.com/ The current DragonBoard 845c implementation supports a full four lane MIPI-CSI interface on CSI0 and two lanes of MIPI-CSI on CSI3. All MIPI-CSI signals are routed directly to/from the SDA845. 6.1.3 I2C {2/3} The 96Boards specification calls for two I2C interfaces to be present on the High Speed Expansion Connector. Both interfaces are optional unless a MIPI-CSI interface has been implemented. Then an I2C interface shall be implemented. The current DragonBoard 845c implementation supports two MIPI-CSI interfaces and therefore must support two I2C interfaces. For MIPI-CSI0 the companion I2C2 is routed directly from the SDA845. For MIPI-CSI3, the companion I2C is I2C3. Note: Both interfaces, I2C2 and I2C3 have an on-board 2.2K pull-up resistors pulled-up to the 1.8V voltage rail. 6.1.4 HSIC The 96Boards specification calls for an optional MIPI-HSIC interface to be present on the High Speed Expansion Connector. The DragonBoard 845c implementation doesn’t support this optional requirement. 6.1.5 Reserved The 96Boards specification calls for a 10K pull-up to 1.8V to be connected to pin 60 of the High Speed Expansion Connector. The DragonBoard 845c utilizes a 100K pull-up on pin 60. 6.1.6 SD/SPI The 96Boards specification calls for an SD interface or a SPI port to be part of the High Speed Expansion Connector. The DragonBoard 845c implements a full SD master with SDIO (CLK/CMD/D0~D3) directly to the SDA845 SoC. These signals are driven at 1.8V. 6.1.7 Clocks The 96Boards specification calls for one or two programmable clock interfaces to be provided on the High Speed Expansion Connector. These clocks may have a secondary function of being CSI0_MCLK and CSI1_MCLK. If these clocks can’t be supported by the SoC than an alternative GPIO or No-Connect is allowed by the specifications. The DragonBoard 845c implements two CSI clocks, CAM0_MCLK via SDA GPIO_13 for CSI0 and CAM3_MCLK via SDA GPIO_16 for CSI3. These signals are driven at 1.8V. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 36 www.thundercomm.com/ 6.1.8 USB The 96Boards specification calls for a USB Data line interface to be present on the High Speed Expansion Connector. The DragonBoard 845c implements this requirement by routing USB channel 2/4 from the PCIe USB HUB to the High Speed Expansion Connector. 6.2 Secondary High Speed Connector: HS2⑫ PIN 845c Signals Connect to 1 PCIE1_REFCLK_M SDA845 3 PCIE1_REFCLK_P SDA845 4 PCIE1_RX_M SDA845 7 PCIE1_RX_P SDA845 9 PCIE1_TX_M SDA845 11 PCIE1_TX_P SDA845 13 GPIO102_PCIE1_RST_N SDA845 Note Configured for PCIe1 RST 15 GPIO103_PCIE1_CLK_REQ SDA845 Configured for PCIe1 CLK REQ 17 GPIO11_PCIE1_WAKE_N SDA845 Configured for PCIe1 WAKE 19 GPIO12_CAM2_RST_N SDA845 21 GPIO21_CAM3_RST_N SDA845 23 GPIO116_CAM3_VSYNC_OUT SDA845 25 GND 27 CAM1_MCLK SDA845 29 CAM2_MCLK SDA845 31 GND 33 MIPI_CSI2_CLK_P SDA845 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 37 www.thundercomm.com/ 35 MIPI_CSI2_CLK_N SDA845 37 GND 39 MIPI_CSI2_LANE0_P SDA845 41 MIPI_CSI2_LANE0_N SDA845 43 GND 45 MIPI_CSI2_LANE1_P SDA845 47 MIPI_CSI2_LANE1_N SDA845 49 GND 51 MIPI_CSI2_LANE2_P SDA845 53 MIPI_CSI2_LANE2_N SDA845 55 GND 57 MIPI_CSI2_LANE3_P SDA845 59 MIPI_CSI2_LANE3_N SDA845 PIN 845c Signals Connect to 2 MIPI_CSI1_CLK_P SDA845 4 MIPI_CSI1_CLK_N SDA845 6 GND 8 MIPI_CSI1_LANE0_P SDA845 10 MIPI_CSI1_LANE0_N SDA845 12 GND 14 MIPI_CSI1_LANE1_P SDA845 16 MIPI_CSI1_LANE1_N SDA845 18 GND 20 MIPI_CSI1_LANE2_P SDA845 22 MIPI_CSI1_LANE2_N SDA845 Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries Note 38 www.thundercomm.com/ 24 GND 26 MIPI_CSI1_LANE3_P SDA845 28 MIPI_CSI1_LANE3_N SDA845 30 GND 32 SSC10_SPI2_CLK SDA845 34 SSC11_SPI2_CS_L SDA845 36 SSC9_SPI2_MOSI SDA845 38 SSC8_SPI2_MISO SDA845 40 GPIO24_CAM2_SLM_IRQ SDA845 42 GPIO22_CAM0_STROBE_OUT SDA845 44 GPIO23 SDA845 46 GPIO69_CAM2_SLM_EN SDA845 48 PM_GPIO12 PM845 50 PM_GPIO10 PM845 52 GND 54 PCIE0_USB4_SS_TX_P PCIe USB HUB PORT4 56 PCIE0_USB4_SS_TX_M PCIe USB HUB PORT4 58 PCIE0_USB4_SS_RX_P PCIe USB HUB PORT4 60 PCIE0_USB4_SS_RX_M PCIe USB HUB PORT4 6.2.1 MIPI CSI {1/2} The Secondary High Speed Expansion Connector supports a 4-lane MIPI-CSI bus (MIPI-CSI1/MIPI-CSI2). All MIPI-CSI signals are routed directly to/from the SDA845. 6.2.2 Clock Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 39 www.thundercomm.com/ The DragonBoard 845c implements another two CSI clocks on the Secondary High Speed Expansion Connector, CAM1_MCLK via SDA GPIO_14 for CSI1 and CAM2_MCLK via SDA GPIO_15 for CSI2. These signals are driven at 1.8V. 6.2.3 SPI{SSC_SPI2} The DragonBoard 845c implements another SSC SPI interface on the Secondary High Speed Expansion Connector that connect to Snapdragon 845 processor sensor core. These signals are driven at 1.8V. • SSC8_SPI2_MISO : Connects to SSC8 of SDA845 SoC. Be configured to MISO. • SSC9_SPI2_MOSI : Connects to SSC9 of SDA845 SoC. Be configured to MOSI. • SSC10_SPI2_CLK : Connects to SSC10 of SDA845 SoC. Be configured to CLK. • SSC11_SPI2_CS_L : Connects to SSC11 of SDA845 SoC. Be configured to CS. 6.2.4 PCIe1 The SDA845 processor has two PCIe ports. The DraonBoard 845c implements one PCIe1 interface on the Secondary High Speed Expansion Connector that connect to SDA845. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 40 www.thundercomm.com/ 6.2.5 USB High Speed Exp CONN HS1 SDA845 USB hs USB2 USB hs PCIe0 PCIe->USB High Speed Exp CONN HS2 USB4 USB SS USB1 Type A (USB SS+HS) VBUS 5V Buck VBUS Type A (USB SS+HS) USB2 USB1 PMI8998 VBUS CC1/CC2 Type C (USB SS+HS) The DragonBoard 845c implements one USB Supper speed interface on the Secondary High Speed Expansion Connector. The Supper Speed USB of HS2 and High Speed USB of HS1 can be combined to one USB3.0 port. 6.2.6 Other signals on Secondary High Speed Connector The DragonBoard 845c implements more GPIOs on the Secondary High Speed Expansion Connector. The GPIOs are 1.8V voltage rail. • GPIO12_CAM2_RST_N - Connects to GPIO_12 of SDA845 SoC. Can be configured to be Camera 2 reset. • GPIO21_CAM3_RST_N - Connects to GPIO_21 of SDA845 SoC. Can be configured to be Camera 3 reset. • GPIO116_CAM3_VSYNC_OUT - Connects to GPIO_116 of SDA845 SoC. Can be configured to be an IRQ line or CAM3 VSYNC. • GPIO24_CAM2_SLM_IRQ - Connects to GPIO_24 of SDA845 SoC. Can be configured to be an IRQ line Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 41 www.thundercomm.com/ • GPIO22_CAM0_STROBE_OUT - Connects to GPIO_22 of SDA845 SoC. Can be configured to be IRQ line or camera 0 strobe. • GPIO23 - Connects to GPIO_23 of SDA845 SoC. • GPIO69_CAM2_SLM_EN - Connects to GPIO_69 of SDA845 SoC. • PM_GPIO12 - Connects to GPIO_12 of PM845 PMIC. • PM_GPIO10 - Connects to GPIO_10 of PM845 PMIC. The IRQ lines create a wake-up event for the SoC. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 42 www.thundercomm.com/ 7 Power management CAN power LS1 Exp Conn HDMI Type A Conn VREG_S4A_1P8 5V DC-DC Buck 1.8V DC-DC Buck DSI-HDMI Bridge SYS_DCIN 3.3V DC-DC Buck Primisity Sensor DC Jack Stereo WSA PA 4.2V DC-DC Buck LS2 Exp Conn VREG_LVS1A_1P8 PCIe-> USB USB->LAN SD card VREG_S4A_1P8 4.2V DC-DC Buck SDA845 SOM LS3 Exp Conn SDA845 Power Grid VREG_LVS2A_1P8 5V DC-DC Buck USB Type A Conn x2 The 96Boards specification defines how power arrives to the board and few supplies that the board needs to provide. The on-board power requirement for each 96Boards implementation depends on the SoC and the set of peripherals that are specific to that implementation. The DragonBoard 845c uses five buck regulators, U0700, U0701, U0800, U0801 and U1505 takes the power in to the board. The U0700 and U0701 generates 4.2V at 4A. U0700 feeds the WSA power and others, U0701 feed the SDA845 SOM power. U0800 generates the 3.3V at 1A for sensor and HDMI IO voltage. U0801 generates at 5V at 2A, feeds the HDMI, CAN and LS1/LS3.U1505 generates 5V at 2A, feeds the USB type A power. 7.1 DC Power Input The 96Boards specification calls for a power to be provided to the board in one of the following ways: • An 8V to 18V power from a dedicated DC jack. The DragonBoard 845c supports this requirement through the use of ⑬, ‘SYS_DCIN’ power connector. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 43 www.thundercomm.com/ Please note: the SYS_DCIN can be as low as 6.5V on the 845c board. • An 8V to 18V power from the SYS_DCIN pins on the Low Speed Expansion Connector. Please note: the SYS_DCIN can be as low as 6.5V on the 845c board. The DragonBoard 845c supports incoming power through this connector. • A USB Type C port at 5V. The DragonBoard 845c supports the 5V from USB Type C port. But it can't support the bring up the system power on. 7.2 Power Source Selection The 96Boards specification calls for only one power source to be applied to the board at any given time. Following this requirement, the user of the DragonBoard 845c should never apply power to the board from ⑬ and the Low Speed Expansion connector at the same time. There is no active or passive mechanism on the DragonBoard 845c to prioritize one source over the other. 7.3 Power Sequencing Upon applying power to the DragonBoard 845c (either one of the two sources), both buck regulators will be enabled and will start regulating their target voltages. When the output of U0701 is on, it will power the on-board PMIC, the PMI8998 power management device. PMI8998 generates VPH_PWR which supplies the PM845. The sequencing of all power rails is set within the PMIC configuration scheme during the production of this part. The user has no access to alter, modify or change the PMIC power up sequencing. 7.4 Power Measurements The 96Boards specification calls for a minimum of one current sense resistor to be placed on the board permitting a basic power measurement functions. The DragonBoard 845c implements two different power measurements. 7.5 DC-In measurement A 0.01ohm resistor R0719 is placed in line of the DC12V on the DC input. Placing a probe over the resistor pins will provide a voltage measurement of the voltage drop across the resistor. Dividing this measurement by 0.01 will give you the amount of the current flowing into the DC. 7.6 PMIC Power-In measurement A 0.01ohm resistor R0709 is placed in line to the VBAT_SOM on the 4.2V supply on the output of U0701. Placing Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 44 www.thundercomm.com/ a probe over the resistor pins will provide a voltage measurement of the voltage drop across the resistor. Dividing this measurement by 0.01 will give you the amount of the current flowing into the SDA PMIC. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 45 www.thundercomm.com/ 8 Buttons and status LED’s 8.1 Buttons 8.1.1 Volume up The Volume UP button (⑯) is used to control the audio volume of the DragonBoard 845c. 8.1.2 Volume down The Volume Down button (⑰) is used to control the audio volume of the DragonBoard 845c. 8.1.3 Power Button The push-button ⑳ servers as the power-on/off/sleep button. Upon applying power to the board, the boot process will start. Once the board is powered on and booted up: Sleep/suspend ● You can put the device to sleep by pressing this button momentarily. ● You can wake the device from sleep by pressing this button momentarily. Power Off/On Option 1: Long press/hold ● While the device is awake, pressing and holding the power button ⑳ for longer than 15 seconds will result in the device powering off. ● Once powered off, pressing and holding the power button ⑳ for longer than 3 seconds will result in the device powering on. Option 2: Short press/hold ● While the device is awake, pressing and holding the power button ⑳ for 2~3 seconds will result in the user interface displaying the ‘power off’ notice. ● Using a mouse, clicking on this notice will cause the DragonBoard 845c to power off. ● Once powered off, pressing and holding the power button ⑳ for longer than 3 seconds will result in the device powering on. 8.1.4 Reset Button The on-board ⑰ push-button has two functions, it serves as a reset button and as a Volume button. The reset function needs to be software configured setting. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 46 www.thundercomm.com/ 8.1.5 Force_USB_BOOT Button The on-board ⑱ push-button is used for emergency USB boot for during development. 8.2 LED’s There are two status LEDs and four User LEDs on the 845c. The Status LEDs report the status of the Bluetooth and Wi-Fi devices onboard. The user LEDs are driven by the SoC directly. 8.2.1 User LED 1-4 The four user LEDs are surface mount Green LEDs, 0603 size, located next to the two USB type A connector and labeled ‘USER LEDS 3 2 1 0’. 8.2.2 Bluetooth status The BT LED on the DragonBoard 845c is located next to the USB OTG connector; this LED reflects the status of the Bluetooth device. 8.2.3 WiFi status The WIFI LED on the DragonBoard 845c is located beside the BT LED, this LED reflects the status of the Wi-Fi device. 8.2.4 Power Indicator LED The power indicator on the DragonBoard 845c is located beside the DC jack, this LED notify the user that the power is applied. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 47 www.thundercomm.com/ 9 Boot configuration There is a Dip Switch ⑮ located on the top of the development board. Switch 1: NA. Switch 2: 'ONBOARD_DEBUG_UART_EN_N' SD BOOT’, when set to ‘ON’ position, will force the SDA UART log to USB port, when set to ‘OFF’ position, will force the SDA UART log to Low Speed Expansion Connector LS1. Switch 3: ‘CBL_PWR_N’, when set to ‘ON’ position, will force the device to boot up automatically; when set to 'OFF' position, will force the deice to boot up by manual power button. Switch 4: ‘SW_DSI1_TO_LT9611_N’, when set to ‘ON’ position, will force the MIPI-DSI1 to High Speed Expansion Connector HS1; when set to 'OFF ' position, the MIPI-DSI1 to LT9611 DSI-HDMI bridge. Switch 5: ' SENSOR_DISCONNECT ', when set to 'ON' position, will force the SDA845 SSC sensor SPI/I2C to Low Speed Expansion Connector; when set to 'OFF', will force the SSC sensor SPI/I2C to onboard sensor. Switch 6: ' IMU_EXT_CLK_TOGGLE ', when set to 'ON' position, the onboard ICM-42688 sensor will use the external clk of GPIO78 from SoC; when set to 'OFF', the onboard ICM-42688 sensor will use another interrupt output to SoC GPIO118. These GPIOs needs the software configure setting. Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 48 www.thundercomm.com/ 10 Mechanical specification 10.1 Board dimensions Bottom Qualcomm Robotics RB3 Platform is a product of Qualcomm Technologies, Inc. and/or its subsidiaries 49
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