RT7266 Datasheet. Www.s Manuals.com. Richtek

User Manual: Datasheets RT7266, RT7266ZSP.

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RT7266

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Pin Configurations

(TOP VIEW)

General Description

The RT7266 is an adaptive on-time ACOTTM mode

synchronous buck converter. The adaptive on-time ACOTTM

mode control provides a very fast transient response with

few external components. The low impedance internal

MOSFET can support high efficiency operation with wide

input voltage range from 4.5V to 18V . The proprietary

circuit of the RT7266 enables to support all ceramic

capacitors. The output voltage can be adjustable between

0.8V and 8V. The soft-start is adjustable by an external

capacitor.

Ordering Information

Note :

Richtek products are :

 RoHS compliant and compatible with the current require-

ments of IPC/JEDEC J-STD-020.

 Suitable for use in SnPb or Pb-free soldering processes.

SOP-8 (Exposed Pad)

Marking Information

Features

zACOTTM Mode Enables Fast Transient Response

z4.5V to 18V Input Voltage Range

z3A Output Current

z60mΩΩ

ΩΩ

Ω Internal Low Site N-MOSFET

zAdaptive On-Time Control

zFast Transient Response

zSupport All Ceramic Capacitors

zUp to 95% Efficiency

z700kHz Switching Frequency

zAdjustable Output Voltage from 0.8V to 8V

zAdjustable Soft-Start

zCycle-by-Cycle Current Limit

zInput Under Voltage Lockout

zThermal Shutdown Protection

zRoHS Compliant and Halogen Free

PVCC

VIN

BOOT

GND

Applications

zIndustrial and Commercial Low Power Systems

zComputer Peripherals

zLCD Monitors and TVs

zGreen Electronics/Appliances

zPoint of Load Regulation for High-Performance DSPs,

FPGAs, and ASICs

RT7266

Package Type

SP : SOP-8 (Exposed Pad-Option 2)

Lead Plating System

Z : ECO (Ecological Element with

Halogen Free and Pb free)

RT7266

ZSPYMDNN

RT7266ZSP : Product Number

YMDNN : Date Code

3A, 18V, 700kHz ACOTTM Synchronous Step-Down

Converter

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Pin No. Pin Name Pin Function

1 EN

Enable Input. A logic-high enables the converter; a logic-low forces the RT7266

into shutdown mode reducing the supply current to less than 10μA. Attach this

pin to VIN with a 100kΩ pull up resistor for automatic start-up.

2 FB

Feedback Input. It is used to regulate the output of the converter to a set value

via an external resistive voltage divider. The feedback reference voltage is

0.765V typically.

3 PVCC

Internal Regulator Output. Connect a 1μF capacitor to GND to stabilize

output voltage.

4 SS

Soft-Start Control Input. SS controls the soft-start period. Connect a capacitor

from SS to GND to set the soft-start period. A 3.9nF capacitor sets the soft-start

period to 1.5ms.

5, 9 (Exposed pad) GND Ground. The Exposed pad should be soldered to a large PCB and connected to

GND for maximum thermal dissipation.

6 SW Switch Node. Connect this pin to an external L-C filter.

7 BOOT

Bootstrap for High Side Gate Driver. Connect a 0.1μF or greater ceramic

capacitor from BOOT to SW pins.

8 VIN

Supply Input. The input voltage range is from 4.5V to 18V. Must bypass with a

suitable large ( ≥10μF x 2) ceramic capacitor.

Functional Pin Description

Table 1. Suggested Component Values

VOUT (V) R1 (kΩ) R2 (kΩ) C3 (pF) L1 (μH) C7 (μF)

1 6.81 22.1 -- 1.4 22 to 68

1.05 8.25 22.1 -- 1.4 22 to 68

1.2 12.7 22.1 -- 1.4 22 to 68

1.8 30.1 22.1 5 to 22 2 22 to 68

2.5 49.9 22.1 5 to 22 2 22 to 68

3.3 73.2 22.1 5 to 22 2 22 to 68

5 124 22.1 5 to 22 3.3 22 to 68

7 180 22.1 5 to 22 3.3 22 to 68

Typical Application Circuit

RT7266

PVCC

GND

VIN

10µF x 2

C1 0.1µF

BOOT

1.4µH

0.1µF

C6 22µF x 2

Chip Enable

3.9nF

1µF

VOUT

1.05V/3A

5, 9 (Exposed Pad)

8.25k

22.1k

VPVCC

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Function Block Diagram

VIN

Reg

UGATE

LGATE

Driver

BOOT

Control

FB On-Time

EN EN

Comparator

Soft-Start

GND

PVCC

VREF

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(VIN = 12V, TA = 25°C, unless otherwise specified)

Electrical Characteristics

Recommended Operating Conditions (Note 3)

zSupply Voltage, VIN ----------------------------------------------------------------------------------------------- 4.5V to 18V

zJunction Temperature Range ------------------------------------------------------------------------------------- −40°C to 125°C

zAmbient Temperature Range------------------------------------------------------------------------------------- −40°C to 85°C

Absolute Maximum Ratings (Note 1)

zSupply Voltage, VIN ----------------------------------------------------------------------------------------------- −0.3V to 20V

zSwitch Voltage, SW ----------------------------------------------------------------------------------------------- −0.8V to (VIN + 0.3V)

< 10ns----------------------------------------------------------------------------------------------------------------- −5V to 25V

zBOOT to SW -------------------------------------------------------------------------------------------------------- −0.3V to 6V

zAll Other Pins ------------------------------------------------------------------------------------------------------- −0.3V to 6V

zPower Dissipation, PD @ TA = 25°C

SOP-8 (Exposed Pad) -------------------------------------------------------------------------------------------- 1.333W

zPackage Thermal Resistance (Note 2)

SOP-8 (Exposed Pad), θJA --------------------------------------------------------------------------------------- 75°C/W

SOP-8 (Exposed Pad), θJC -------------------------------------------------------------------------------------- 15°C/W

zJunction Temperature Range ------------------------------------------------------------------------------------- 150°C

zLead Temperature (Soldering, 10 sec.)------------------------------------------------------------------------ 260°C

zStorage Temperature Range ------------------------------------------------------------------------------------- −65°C to 150°C

Parameter Symbol Test Conditions Min Typ Max Unit

Supply Current

Shutdown Current ISHDN V

EN = 0V -- 1 10 μA

Quiescent Current IQ V

EN = 3V, VFB = 1V -- 0.7 -- mA

Logic Threshold

Logic-High 2 -- 5.5

EN Voltage Logic-Low -- -- 0.4 V

VREF Voltage and Discharge Resistance

Feedback Reference Voltage VREF 4.5V ≤ VIN ≤ 18V 0.753 0.765 0.777 V

Feedback Input Current IFB V

FB = 0.8V −0.1 0 0.1 μA

VPVCC Output

VPVCC Output Voltage VPVCC 6V ≤ VIN ≤ 18V, 0 < IPVCC < 5mA 4.7 5.1 5.5 V

Line Regulation 6V ≤ VIN ≤ 18V, IPVCC = 5mA -- -- 20 mV

Load Regulation 0 < IPVCC < 5mA -- -- 60 mV

Output Current IPVCC V

IN = 6V, VPVCC = 4V -- 110 -- mA

RDS(ON)

High Side RDS(ON)_H -- 90 --

Switch On

Resistance Low Side RDS(ON)_L -- 60 -- mΩ

Current Limit

Current limit ILIM 3.5 4.1 5.7 A

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Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in

the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may

affect device reliability.

Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is

measured at the exposed pad of the package.

Note 3. The device is not guaranteed to function outside its operating conditions.

Parameter Symbol Test Conditions Min Typ Max Unit

Thermal Shutdown

Thermal Shutdown Threshold TSD -- 150 --

Thermal Shutdown

Hysteresis ΔTSD -- 20 --

°C

On-Time Timer Control

On-Time tON V

IN = 12V, VOUT = 1.05V -- 145 -- ns

Minimum On-Time tON(MIN) -- 60 -- ns

Minimum Off-Time tOFF(MIN) -- 230 -- ns

Soft-Start

SS Charge Current VSS = 0V 1.4 2 2.6 μA

SS Discharge Current VSS = 0.5V 0.05 0.1 -- mA

UVLO

UVLO Threshold VIN Rising to Wake up VPVCC 3.55 3.85 4.15

Hysteresis -- 0.3 --

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Typical Operating Characteristics

Output Voltage vs. Output Current

1.03

1.04

1.05

1.06

1.07

0 0.5 1 1.5 2 2.5 3

Output Current (A)

Output Voltage (V)

VIN = 4.5V

VIN = 12V

VIN = 17V

VOUT = 1.05V

Efficiency vs. Output Current

100

0 0.5 1 1.5 2 2.5 3

Output Current (A)

Efficiency (%)

VOUT = 5V

VOUT = 3.3V

VOUT = 1.05V

VIN = 12V

Frequency vs. Input Voltage

400

500

600

700

800

900

4 6 8 1012141618

Input Voltage (V)

Frequency (kHz) 1

VOUT = 1.05V, ILOAD = 0.1A

Reference Voltage vs. Input Voltage

0.750

0.755

0.760

0.765

0.770

0.775

0.780

4 6 8 1012141618

Input Voltage (V)

Reference Voltage (V)

No Load, VOUT = 1.05V

Output Voltage vs. Input Voltage

1.03

1.04

1.05

1.06

1.07

4 6 8 1012141618

Input Voltage (V)

Output Voltage (V)

VOUT = 1.05V

IOUT = 0A

IOUT = 1A

IOUT = 2A

IOUT = 3A

Reference Voltage vs. Temperature

0.750

0.755

0.760

0.765

0.770

0.775

0.780

-50 -25 0 25 50 75 100 125

Temperature (°C)

Reference Voltage (V)

VIN = 17V

VIN = 12V

VIN = 4.5V

No Load, VOUT = 1.05V

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Output Voltage Ripple

VSW

(10V/Div)

Time (500ns/Div)

VOUT

(10mV/Div)

VIN = 12V, VOUT = 1.05V, IOUT = 3A

Shutdown Current vs. Temperature

-50-25 0 25 50 75100125

Temperature (°C)

Shutdown Current (µA) 1

VIN = 17V

VIN = 12V

VIN = 4.5V

VEN = 0V

Load Transient Response

VOUT

(20mV/Div)

Time (100μs/Div)

IOUT

(2A/Div)

VIN = 12V, VOUT = 1.05V, IOUT = 0A to 3A

Quiescent Current vs. Temperature

0.3

0.4

0.5

0.6

0.7

0.8

-50 -25 0 25 50 75 100 125

Temperature (°C)

Quiescent Current (mA

)

VIN = 17V

VIN = 12V

VIN = 4.5V

VEN = 3V, VFB = 1V

Current Limit vs. Input Voltage

4 6 8 1012141618

Input Voltage (V)

Current Limit (A)

VOUT = 0V

Current Limit vs. Temperature

-50-250 255075100125

Temperature (°C)

Current Limit (A)

VIN = 17V

VIN = 12V

VIN = 4.5V

VOUT = 0V

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Power Off from VIN

VOUT

(1V/Div)

Time (10ms/Div)

IOUT

(5A/Div)

VIN = 12V, VOUT = 1.05V, IOUT = 3A

VSW

(10V/Div)

VIN

(20V/Div)

Power Off from VEN

VOUT

(1V/Div)

Time (100μs/Div)

IOUT

(5A/Div)

VIN = 12V, VOUT = 1.05V, IOUT = 3A

VSW

(10V/Div)

VEN

(5V/Div)

Power On from VEN

VOUT

(1V/Div)

Time (5ms/Div)

IOUT

(5A/Div)

VIN = 12V, VOUT = 1.05V, IOUT = 3A

VSW

(10V/Div)

VEN

(5V/Div)

Power On from VIN

VOUT

(1V/Div)

Time (5ms/Div)

IOUT

(5A/Div)

VIN = 12V, VOUT = 1.05V, IOUT = 3A

VSW

(10V/Div)

VIN

(20V/Div)

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Application Information

The RT7266 is a synchronous high voltage buck converter

that can support the input voltage range from 4.5V to 18V

and the output current can be up to 3A. It operates using

adaptive on-time ACOTTM mode control and provides a very

fast transient response with few external compensation

components. The RT7266 allows low external component

count configuration with both low ESR and ceramic output

capacitors.

PWM Operation

It is suitable for low external component count

configuration with appropriate amount of Equivalent Series

Resistance (ESR) capacitor(s) at the output. The output

ripple valley voltage is monitored at a feedback point

voltage. The synchronous high side MOSFET is turned

on at the beginning of each cycle. After the internal one

shot timer expires, the MOSFET is turned off. The pulse

width of this one shot is determined by the converter's

input and output voltages to keep the frequency fairly

constant over the entire input voltage range.

Adaptive On-Time Control

The RT7266 has a unique circuit to ensure the switching

frequency on 700kHz over full input voltage range and full

loading range. This circuit sets the on-time one-shot timer

by monitoring the input voltage and SW signal. The

switching frequency will keep constant if the duty ratio is

VOUT/VIN.

Duty Ratio = VOUT/VIN = tON / T

For Fixed T, Ton is proportional to VOUT/VIN.

Soft-Start

The RT7266 contains an external soft-start clamp that

gradually raises the output voltage. The soft-start timing

can be programmed by the external capacitor between

SS pin and GND. The chip provides a 2μA charge current

for the external capacitor. If a 3.9nF capacitor is used,

the soft-start will be 2ms (typ.). The available capacitance

range is from 2.7nF to 220nF.

SS SS

C5 (nF) 1.065

t (ms) = I (A)

Chip Enable Operation

The EN pin is the chip enable input. Pulling the EN pin

low (<0.4V) will shutdown the device. During shutdown

mode, the RT7266 quiescent current drops to lower than

10μA. Driving the EN pin high (>2V, <5.5V) will turn on

the device again. For external timing control, the EN pin

can also be externally pulled high by adding a REN* resistor

and CEN* capacitor from the VIN pin (see Figure 1).

Figure 1. External Timing Control

An external MOSFET can be added to implement digital

control on the EN pin when no system voltage above 2V

is available, as shown in Figure 2. In this case, a 100kΩ

pull-up resistor, REN, is connected between VIN and the

EN pin. MOSFET Q1 will be under logic control to pull

down the EN pin.

Figure 2. Logic Control with Low Voltage

VIN

GND

BOOT

VOUT

Chip Enable

VIN

RT7266

PVCC 3

REN

100k

9 (Exposed Pad) C4

VIN

GND

BOOT

VOUT

Chip Enable

VIN

4.5V to 18V RT7266

C5 PVCC C4

9 (Exposed Pad)

REN*

CEN*

* : Optional

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OUT OUT

LIN

I = 1

fL V

⎡⎤⎡ ⎤

Δ×−

⎢⎥⎢ ⎥

⎣⎦⎣ ⎦

Having a lower ripple current reduces not only the ESR

losses in the output capacitors but also the output voltage

ripple. High frequency with small ripple current can achieve

highest efficiency operation. However, it requires a large

inductor to achieve this goal. For the ripple current

selection, the value of ΔIL = 0.2(IMAX) will be a reasonable

starting point. The largest ripple current occurs at the

highest VIN. To guarantee that the ripple current stays

below the specified maximum, the inductor value should

be chosen according to the following equation :

OUT OUT

L(MAX) IN(MAX)

L = 1

fI V

⎡⎤⎡ ⎤

×−

⎢⎥⎢ ⎥

×Δ

⎣⎦⎣ ⎦

CIN and COUT Selection

The input capacitance, CIN, is needed to filter the

trapezoidal current at the source of the high side MOSFET.

To prevent large ripple current, a low ESR input capacitor

sized for the maximum RMS current should be used. The

RMS current is given by :

OUT IN

RMS OUT(MAX) IN OUT

I = I 1

−

This formula has a maximum at VIN = 2VOUT, where

IRMS = IOUT/2. This simple worst-case condition is

commonly used for design because even significant

deviations do not offer much relief.

Choose a capacitor rated at a higher temperature than

required. Several capacitors may also be paralleled to

meet size or height requirements in the design. For the

input capacitor, two 10μF and 0.1μF low ESR ceramic

capacitors are recommended.

Output Voltage Setting

The resistive divider allows the FB pin to sense the output

voltage as shown in Figure 4.

Where VFB is the feedback reference voltage (0.765V

typ.).

Under Voltage Lockout Protection

The RT7266 has Under Voltage Lockout Protection (UVLO)

that monitors the voltage of PVCC pin. When the VPVCC

voltage is lower than UVLO threshold voltage, the RT7266

will be turned off in this state. This is non-latch protection.

Over Temperature Protection

The RT7266 equips an Over Temperature Protection (OTP)

circuitry to prevent overheating due to excessive power

Figure 4. Output Voltage Setting

The output voltage is set by an external resistive divider

according to the following equation. It is recommended to

use 1% tolerance or better divider resistors.

)

OUT FB R1

V = V ( 1 +

RT7266

GND

VOUT

To prevent enabling circuit when VIN is smaller than the

VOUT target value, a resistive voltage divider can be placed

between the input voltage and ground and connected to

the EN pin to adjust IC lockout threshold, as shown in

Figure 3. For example, if an 8V output voltage is regulated

from a 12V input voltage, the resistor REN2 can be selected

to set input lockout threshold larger than 8V.

Figure 3. The Resistors can be Selected to Set IC

Lockout Threshold

dissipation. The OTP will shut down switching operation

when junction temperature exceeds 150°C. Once the

junction temperature cools down by approximately 20°C

the main converter will resume operation. To maintain

continuous operation maximum, the junction temperature

should be prevented from rising above 150°C.

Inductor Selection

The inductor value and operating frequency determine the

ripple current according to a specific input and an output

voltage. The ripple current ΔIL increases with higher VIN

and decreases with higher inductance.

VIN

GND

BOOT

VOUT

VIN

RT7266

PVCC C4

100k

12V

REN2

REN1

9 (Exposed Pad)

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OUT L OUT

VIESR

8fC

⎡⎤

Δ≤Δ +

⎢⎥

⎣⎦

The output ripple will be highest at the maximum input

voltage since ΔIL increases with input voltage. Multiple

capacitors placed in parallel may be needed to meet the

ESR and RMS current handling requirements.

Higher values, lower cost ceramic capacitors are now

becoming available in smaller case sizes. Their high ripple

current, high voltage rating and low ESR make them ideal

for switching regulator applications. However, care must

be taken when these capacitors are used at input and

output. When a ceramic capacitor is used at the input

and the power is supplied by a wall adapter through long

wires, a load step at the output can induce ringing at the

input, VIN. At best, this ringing can couple to the output

and be mistaken as loop instability. At worst, a sudden

inrush of current through the long wires can potentially

cause a voltage spike at VIN large enough to damage the

part.

External Bootstrap Diode

Connect a 0.1μF low ESR ceramic capacitor between the

BOOT and SW pins. This capacitor provides the gate driver

voltage for the high side MOSFET. It is recommended to

add an external bootstrap diode between an external 5V

and the BOOT pin for efficiency improvement when input

voltage is lower than 5.5V or duty ratio is higher than 65%.

The bootstrap diode can be a low cost one such as 1N4148

or BAT54. The external 5V can be a 5V fixed input from

system or a 5V output of the RT7266. Note that the external

boot voltage must be lower than 5.5V

BOOT

RT7266 0.1µF

Figure 5. External Bootstrap Diode

PVCC Capacitor Selection

Decouple with a 1μF ceramic capacitor. X7R or X5R grade

dielectric ceramic capacitors are recommended for their

stable temperature characteristics.

Over Current Protection

When the output shorts to ground, the inductor current

decays very slowly during a single switching cycle. A over

current detector is used to monitor inductor current to

prevent current runaway. The over current detector monitors

the voltage between SW and GND during the low-side MOS

turn-on state. This is cycle-by-cycle protection. The over

current detector also supports temperature compensated.

Thermal Considerations

For continuous operation, do not exceed absolute

maximum junction temperature. The maximum power

dissipation depends on the thermal resistance of the IC

package, PCB layout, rate of surrounding airflow, and

difference between junction and ambient temperature. The

maximum power dissipation can be calculated by the

following formula :

PD(MAX) = (TJ(MAX) − TA) / θJA

where TJ(MAX) is the maximum junction temperature, TA is

the ambient temperature, and θJA is the junction to ambient

thermal resistance.

For recommended operating condition specifications, the

maximum junction temperature is 125°C. The junction to

ambient thermal resistance, θJA, is layout dependent. For

SOP-8 (Exposed Pad) packages, the thermal resistance,

θJA, is 75°C/W on a standard JEDEC 51-7 four-layer

thermal test board. The maximum power dissipation at

TA = 25°C can be calculated by the following formulas :

PD(MAX) = (125°C − 25°C) / (75°C/W) = 1.333W for

SOP-8 (Exposed Pad) package

The maximum power dissipation depends on the operating

ambient temperature for fixed TJ(MAX) and thermal

resistance, θJA. The derating curves in Figure 6 allow the

designer to see the effect of rising ambient temperature

on the maximum power dissipation.

The selection of COUT is determined by the required ESR

to minimize voltage ripple.

Moreover, the amount of bulk capacitance is also a key

for COUT selection to ensure that the control loop is stable.

The output ripple, ΔVOUT , is determined by :

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Figure 7. PCB Layout Guide

Figure 6. Derating Curve of Maximum Power Dissipation

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 25 50 75 100 125

Ambient Temperature (°C)

Maximum Power Dissipation (W) 1

Four-Layer PCB Layout Consideration

Follow the PCB layout guidelines for optimal performance

of the RT7266

 Keep the traces of the main current paths as short and

wide as possible.

Put the input capacitor as close as possible to the device

pins (VIN and GND).

SW node is with high frequency voltage swing and

should be kept at small area. Keep sensitive

components away from the SW node to prevent stray

capacitive noise pickup.

Connect feedback network behind the output capacitors.

Keep the loop area small. Place the feedback

components near the RT7266.

The GND and Exposed Pad should be connected to a

strong ground plane for heat sinking and noise protection.

PVCC

VIN

BOOT

GND

VOUT

GND

Input capacitor must be placed

as close to the IC as possible.

SW should be connected to inductor by

wide and short trace. Keep sensitive

components away from this trace.

The resistor divider must be connected

as close to the device as possible.

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Richtek Technology Corporation

5F, No. 20, Taiyuen Street, Chupei City

Hsinchu, Taiwan, R.O.C.

Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should

obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot

assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be

accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

EXPOSED THERMAL PAD

(Bottom of Package)

8-Lead SOP (Exposed Pad) Plastic Package

Dimensions In Millimeters Dimensions In Inches

Symbol Min Max Min Max

A 4.801 5.004 0.189 0.197

B 3.810 4.000 0.150 0.157

C 1.346 1.753 0.053 0.069

D 0.330 0.510 0.013 0.020

F 1.194 1.346 0.047 0.053

H 0.170 0.254 0.007 0.010

I 0.000 0.152 0.000 0.006

J 5.791 6.200 0.228 0.244

M 0.406 1.270 0.016 0.050

X 2.000 2.300 0.079 0.091

Option 1 Y 2.000 2.300 0.079 0.091

X 2.100 2.500 0.083 0.098

Option 2 Y 3.000 3.500 0.118 0.138

Outline Dimension

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