RT8248A Datasheet. Www.s Manuals.com. R04 Richtek

User Manual: Marking of electronic components, SMD Codes 5E, 5E*, 5E=**. Datasheets BC808-16, MM1Z13, MM5Z9V1, PDTA115EE , RB751V-40S2, RB751V40, RT8248AGQW.

Open the PDF directly: View PDF .
Page Count: 21

RT8248A

®

DS8248A-04 October 2014 www.richtek.com

1

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

©

Complete DDR Memory Power Supply Controller

General Description

The RT8248A provides a complete power supply for DDR2/

DDR3/DDR3L/LPDDR3/DDR4 memory systems. It

integrates a synchronous PWM Buck controller with a

1.5A sink/source tracking linear regulator and buffered low

noise reference.

The PWM controller provides the low quiescent current,

high efficiency, excellent transient response, and high DC

output accuracy needed for stepping down high-voltage

batteries to generate low-voltage chipset RAM supplies

in notebook computers. The constant on-time PWM

control scheme handles wide input/output voltage ratios

with ease and provides 100ns “instant-on” response to

load transients while maintaining a relatively constant

switching frequency.

The RT8248A achieves high efficiency at a reduced cost

by eliminating the current-sense resistor found in

traditional current mode PWMs. Efficiency is further

enhanced by its ability to drive very large synchronous

rectifier MOSFETs. The Buck conversion allows this device

to directly step down high-voltage batteries for the highest

possible efficiency.

The 1.5A sink/source LDO maintains fast transient

response only requiring a 10μF ceramic output capacitor.

In addition, the LDO supply input is available externally

to significantly reduce the total power losses. The IC

supports all of the sleep state controls placing VTT at

high-Z in S3 and discharging VDDQ, VTT and VTTREF

(soft-off) in S4/S5.

The RT8248A provides protections including OVP, UVP,

and thermal shutdown and available in the WQFN-20L 3x3

package.

Simplified Application Circuit

RT8248A

VDD

PHASE

LGATE

BOOT

UGATE

FB

GND

V

VDDQ

VVDD

VIN

TON

VLDOIN

VTT

VTT

VTTSNS

VTTREF

CS

S3

S5

VID

VDDQ

PGOODPGOOD

Features

--

--

-PWM Controller





 Adjustable Current Limit with Low-Side RDS(ON)

Sensing





 Low Quiescent Supply Current





 Quick Load-Step Response within 100ns





 1% VVDDQ Accuracy Over Line and Load





 Adjustable 0.675V to 3.3V Output Range for 1.8V

(DDR2), 1.5V (DDR3), 1.35V (DDR3L), 1.2V (LPDDR3)

and 1.2V (DDR4)





 4.5V to 26V Battery Input Range





 Resistor Adjustable Frequency





 Over-/Under-Voltage Protection





 Internal Voltage Ramp Soft-Start





 Drives Large Synchronous Rectifier MOSFETs





 Power Good Indicator

--

--

-1.5A LDO (VTT), Buffered Reference (VTTREF)





 Capable to Sink and Source Up to 1.5A





 LDO Input Available to Optimize Power Losses





 Requires Only 10μμ

μμ

μF Ceramic Output Capacitor





 Integrated Divider Tracks 1/2 VDDQ for both VTT

and VTTREF





 Accuracy ±±

±±

±20mV for both VTTREF and VTT





 Supports High-Z in S3 and Soft-Off in S4/S5

RT8248A

2

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Functional Pin Description

Pin No. Pin Name Pin Function

1 VTTGND Power Ground for the VTT LDO.

2 VTTSNS Voltage Sense Input for the VTT LDO. Connect to the terminal of the VTT_LDO

output capacitor.

3, 21

(Exposed Pad) GND The exposed pad must be soldered to a large PCB and connected to GND for

maximum power dissipation.

4 VTTREF VTTREF Buffered Reference Output.

5 VDDQ Reference Input for VTT and VTTREF.

6 FB Feedback Voltage Input. Connect to a resistive voltage divider from VDDQ to

GND to adjust the output voltage.

7 S3 VTT LDO Enable Control Input. Do not leave this pin floating.

8 S5 PWM Enable Control Input. Do not leave this pin floating.

9 TON Set the UGATE On-Time Through a Pull-Up Resistor Connecting to VIN.

10 PGOOD

Power Good Open-Drain Output. In high state when VDDQ output voltage is

within the target range.

11 VID Internal Reference Voltage Setting.

12 VDD Supply Voltage Input for the Analog Supply and LGATE Gate Driver.

13 CS Current Limit Threshold Setting Input. Connect to GND through the voltage

setting resistor.

14 PGND Power Ground for Low-Side MOSFET.

15 LGATE Low-Side Gate Driver Output for VDDQ.

16 PHASE

Switch Node. External inductor connection for VDDQ and behave as the current

sense comparator input for Low-Side MOSFET RDS

(

ON

)

sensing.

17 UGATE High-Side Gate Driver Output for VDDQ.

18 BOOT Bootstrap Supply for High-Side Gate Driver.

19 VLDOIN Power Supply for VTT LDO.

20 VTT Power Output for the VTT LDO.

Ordering Information

Note :

Richtek products are :

 RoHS compliant and compatible with the current require-

ments of IPC/JEDEC J-STD-020.

 Suitable for use in SnPb or Pb-free soldering processes.

Applications

-DDR2/DDR3/DDR3L/LPDDR3/DDR4 Memory Power

Supplies

-Notebook computers

-SSTL18, SSTL15 and HSTL bus termination

Pin Configurations

(TOP VIEW)

WQFN-20L 3x3

VTT

VLDOIN

VTTREF

GND

VTTGND

VTTSNS

LGATE

PGND

VDD

CS

FB

S3

TON UGATE

BOOT

PHASE

VDDQ VID

PGOOD

S5

15

14

13

12

17181920

1

2

3

4

9876

GND

21

115

16

10

Marking Information

5E= : Product Code

YMDNN : Date Code

RT8248AGQW

5E=YM

DNN

RT8248A

Package Type

QW : WQFN-20L 3x3 (W-Type)

Lead Plating System

G : Green (Halogen Free and Pb Free)

RT8248A

3

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Function Block Diagram

Buck Controller

VTT LDO

GND

+

-

+

-

+

-

+

-

VTTREF

VTT

VLDOIN

VTTGND

Non-Tracking

Discharge

VTTSNS

S3

S5

VDDQ

Thermal

Shutdown

R

QS

Comp

S1 Q

Latch

S1 Q

Latch

+

-

OV

+

-

UV

115%VREF

0.45V

+

-

85% VREF

SS Timer Thermal

Shutdown

DEM

+

-

On-Time

1-SHOT

CS

FB

VDDQ

UGATE

PHASE

VDD

PGOOD

PGND

LGATE

TON

BOOT

TRIG

S5

5µA

SS Int

+

-

+

1/10

VREF

Reference

Voltage

Selector

VID

VREF

Min. TOFF

TRIG

VDD

RT8248A

4

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Operation

The RT8248A is a constant on-time synchronous step-

down controller. In normal operation, the high-side

N-MOSFET is turned on when the output voltage is lower

than VREF, and is turned off after the internal one-shot

timer expires. While the high-side N-MOSFET is turned

off, the low-side N-MOSFET is turned on to conduct the

inductor current until next cycle begins.

Soft-Start (SS)

For internal soft-start function, an internal current source

charges an internal capacitor to build the soft-start ramp

voltage. The output voltage will track the internal ramp

voltage during soft-start interval.

PGOOD

The power good output is an open-drain architecture. When

the soft-start is finished, the PGOOD open-drain output

will be high impedance.

Current Limit

The current limit circuit employs a unique “valley” current

sensing algorithm. If the magnitude of the current sense

signal at PHASE is above the current limit threshold, the

PWM is not allowed to initiate a new cycle. The current

limit threshold can be set with an external voltage setting

resistor on the CS pin.

Over-Voltage Protection (OVP) & Under-Voltage

Protection (UVP)

The output voltage is continuously monitored for over-

voltage and under-voltage protection. When the output

voltage exceeds its set voltage threshold( 115% of VOUT),

UGATE goes low and LGATE is forced high. When the

feedback voltage is less than 0.45V, under-voltage

protection is triggered and then both UGATE and LGATE

gate drivers are forced low. The controller is latched until

VDD is re-supplied and exceeds the POR rising threshold

voltage or S5 is reset.

VTT Linear Regulator and VTTREF

This VTT linear regulator employs ultimate fast response

feedback loop so that small ceramic capacitors are enough

for keeping track of VTTREF within 40mV at all conditions,

including fast load transient. The VTTREF block consists

of on-chip 1/2 divider, LPF and buffer. This regulator also

has sink and source capability up to 10mA. Bypass

VTTREF to GND with a 33nF ceramic capacitor for stable

operation.

RT8248A

5

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Electrical Characteristics

Parameter Symbol Test Conditions Min Typ Max Unit

PWM Controller

Quiescent Supply Current FB Forced abov e the Regulation Point,

VS5 = 5V, VS3 = 0V, Not Switching -- 135 -- A

TON Operating Current RTON = 620k, VIN = 12V -- 19 -- A

IVLDOIN BIAS Current VS5 = VS3 = 5V, VTT = No Load -- 1 -- A

IVLDOIN Standby Current VS5 = 5V, VS3 = 0, VTT = No Load -- 0.1 10 A

(VDD = 5V, VIN = 12V, RTON = 620kΩ, TA = 25°C, unless otherwise specified)

Absolute Maximum Ratings (Note 1)

-Supply Input Voltage, TON to GND ------------------------------------------------------------------------------------ −0.3V to 32V

-BOOT to PHASE ---------------------------------------------------------------------------------------------------------- −0.3V to 6V

-PHASE to GND

DC ----------------------------------------------------------------------------------------------------------------------------- −0.3V to 32V

< 20ns ----------------------------------------------------------------------------------------------------------------------- −8V to 38V

-LGATE to GND

DC ----------------------------------------------------------------------------------------------------------------------------- −0.3V to 6V

< 20ns ----------------------------------------------------------------------------------------------------------------------- −2.5V to 7.5V

-UGATE to PHASE

DC ----------------------------------------------------------------------------------------------------------------------------- −0.3V to 6V

< 20ns ----------------------------------------------------------------------------------------------------------------------- −5V to 7.5V

-VDD, CS, S3, S5, VTTSNS, VDDQ, VID, VTTREF, VTT, VLDOIN, FB, PGOOD to GND ---------------- −0.3V to 6V

-PGND, VTTGND to GND ------------------------------------------------------------------------------------------------- −0.3V to 0.3V

-Other Pins------------------------------------------------------------------------------------------------------------------- −0.3V to 6.5V

-Power Dissipation, PD @ TA = 25°C

WQFN-20L 3x3 ------------------------------------------------------------------------------------------------------------ 3.33W

-Package Thermal Resistance (Note 2)

WQFN-20L 3x3, θJA ------------------------------------------------------------------------------------------------------- 30°C/W

WQFN-20L 3x3, θJC ------------------------------------------------------------------------------------------------------ 7.5°C/W

-Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C

-Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C

-Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C

-ESD Susceptibility (Note 3)

HBM (Human Body Model) ---------------------------------------------------------------------------------------------- 2kV

Recommended Operating Conditions (Note 4)

-Input Voltage, VIN --------------------------------------------------------------------------------------------------------- 4.5V to 26V

-Control Voltage, VDD ----------------------------------------------------------------------------------------------------- 4.5V to 5.5V

-Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C

-Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C

RT8248A

6

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Parameter Symbol Test Conditions Min Typ Max Unit

VDD -- 0.1 10 A

TON -- 0.1 5 A

S5/S3 1 0.1 1 A

VLDOIN -- 0.1 1 A

Shutdown Current

(VS5 = VS3 = 0V) ISHDN

VID -- 0.5 1 A

FB Error Comparator

Threshold VREF V

REF = 0.675V/0.75V 1 0 1 %

VDDQ Voltage Range 0.675 -- 3.3 V

Switch Frequency fSW RTON = 620k, VIN = 12V,

VDDQ = 1 .5V, IOUT = 20A (Note 5) 320 400 480 kHz

Minimum Off-Time 250 400 550 ns

VDDQ Shutdown Discharge

Resistance V

S5 = 0V, VS3 = 0V -- 15 -- 

Current Sensing

CS Pin Source Current 4.5 5 5.5 A

Zero Crossing Threshold GND  PHASE 5 -- 10 mV

Fault Protection

Current Limit (Positive) GND  PHASE, RCS = 160k 70 80 90 mV

Output UV Threshold VUVP VFB Falling. For both VID is high or

low. 0.4 0.45 0.5 V

UVP Latch Delay FB Forced below UV Threshold -- 30 -- s

OVP Threshold VOVP With Respect to Error Comparator

Threshold 110 115 120 %

OVP Latch Delay FB Forced above OV Threshold -- 5 -- s

VDD POR Threshold Rising Edge, Hysteresis = 120mV,

PWM Disabled below this Level 3.9 4.2 4.5 V

Voltage Ramp Soft-Start Time From S5 Going High to VFB = 0.675V -- 1 -- mS

UV Blank Time From S5 Signal Going High -- 5 -- mS

Thermal Shutdown TSD -- 165 -- C

Driver On-Resistance

UGATE Gate Driver Source RUGATEsr BOOT PHASE Forced to 5V -- 2.5 5 

UGATE Gate Driver Sink RUGATEsk BOOT  PHASE Forced to 5V -- 1.5 3 

LGATE Gate Driver Source RLGATEsr DL, High State -- 2.5 5 

LGATE Gate Driver Sink RLGATEsk DL, Low State -- 0.8 1.6 

LGATE Rising (Phase = 1.5V) -- 40 --

Dead Time UGATE Rising -- 40 -- ns

Internal Boost Charging Switch

On-Resistance VDD to BOOT, 10mA -- -- 80 

RT8248A

7

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Parameter Symbol Test Conditions Min Typ Max Unit

Logic I/O

Logic-High 2 -- --

S3, S5 Input

Voltage Logic-Low -- -- 0.8 V

Logic Input Current S3, S5 = VDD / GND 1 0 1 A

Logic-High 750 -- --

VID Input

Threshold Voltage Logic-Low -- -- 300 mV

PGOOD (Upper Side Threshold Decide by OV Threshold)

Trip Threshold (Falling) Measured at FB, with Respect to

Reference, No Load. Hysteresis = 2% 20 15 10 %

Fault Propagation Delay Falling Edge, FB Forced below

PGOOD Trip Threshold -- 5 -- s

Output Low Voltage ISINK = 1mA -- -- 0.4 V

Leakage Current ILEA K High State, Forced to 5V -- -- 1 A

VTT LDO

VDDQ = VLDOI N = 1.2V/1.35V/1.5V/

1.8V, |IVTT| = 0A 20 -- 20

VDDQ = VLDOI N = 1.2V/1.35V/1.5V/

1.8V, |IVTT| < 1A 30 -- 30

VDDQ = VLDOI N = 1.2V/1.35V,

|IVTT| < 1.2A 40 -- 40

VTT Output Tolerance VVTTTOL

VDDQ = VLDOI N = 1.5V/1.8V,

|IVTT| < 1.5A 40 -- 40

mV

VTT Source Current Limit IVTTOCLSRC V

TT = 0V 1.6 2.6 3.6 A

VTT Sink Current Limit IVTTOCLSNK V

TT = VDDQ 1.6 2.6 3.6 A

VTT Leakage Current IVTTLK S5 = 5V, S3 = 0V, 





VDDQ

V

VTT = 2 10 -- 10 A

VTTSNS Leakage Current IVTTSNSLK I

SINK = 1mA 1 -- 1 A

VTT Discharge Current IDSCHRG V

DDQ = 0V, VTT = 0.5V, S5 = S3 = 0V 10 30 -- mA

VTTREF Output Voltage VVTTREF VVTT = 





VDDQ

VTTREF V

V = 2,

VVDDQ = 1.5V

-- 0.75 -- V

VLDOIN = VVDDQ = 1.5V,

|IVTTREF| < 10mA 15 -- 15

VDDQ/2, VTTREF Output

Voltage Tolerance VVTTREFTOL VLDOIN = VVDDQ = 1.8V,

|IVTTREF| < 10mA 18 -- 18

mV

VTTREF Source Current Limit IVTTREFOCL V

VTTREF = 0V 10 40 80 mA

RT8248A

8

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Typical Application Circuit

Figure 1. Typical Application Circuit with POSCAP Solution

Figure 2. Typical Application Circuit with Pure MLCC Solution

RT8248A

VDD

PHASE

LGATE

BOOT

UGATE

FB

GND

PGOOD

V

VDDQ

VVDD

VIN

PGOOD

TON

VLDOIN

VTTREF

S3

S5

VID

VDDQ

9

17

18

15

16

6

4

5

19

12

10

7

8

11

VTT

VTT

VTTSNS

CS

20

2

13

VTT Control

VDDQ Control

3,

21 (Exposed Pad)

PGND

VTTGND

1

14

(Optional)

1µF

C1

100k

R1

10µF

C2

270k

R2

620k

R3

0

R4 Q1

886N03LS

10µF x 2

C3

0.1µF

C4

Q2

886N03LS

R7

C7

L1

1µH

16k

R5

20k

R6

C8

C9

220µF

C5

1.35V

33nF

C6

Low

0.675V

RT8248A

VDD

PHASE

LGATE

BOOT

UGATE

FB

GND

PGOOD

V

VDDQ

VVDD

VIN

PGOOD

TON

VLDOIN

VTTREF

S3

S5

VID

VDDQ

9

17

18

15

16

6

4

5

19

12

10

7

8

11

VTT

VTT

VTTSNS

CS

20

2

13

VTT Control

VDDQ Control

3,

21 (Exposed Pad)

PGND

VTTGND

1

14

(Optional)

1µF

C1

100k

R1

10µF

C2

270k

R2

620k

R3

0

R4 Q1

886N03LS

10µF x 2

C3

0.1µF

C4

Q2

886N03LS

R7

C7

L1

1µH

16k

R5

20k

R6

C8

C9

22µF x 4

C5

1.35V

33nF

C6

0.675V

Low

Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in

the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may

affect device reliability.

Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is

measured at the exposed pad of the package.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.

Note 5. Not production tested. Test condition refer to electrical characteristics using application circuit.

RT8248A

9

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Typical Operating Characteristics

Switching Frequency vs. Load Current

0

50

100

150

200

250

300

350

400

450

500

0.01 0.1 1 10

Load Current (A)

Switching Frequency (kHz) 1

DDR3L, VIN = 7.4V, VDDQ = 1.35V,

S3 = GND, S5 = 5V, RTON = 620kΩ

Switching Frequency vs. Load Current

0

50

100

150

200

250

300

350

400

450

500

0.01 0.1 1 10

Load Current (A)

Switching Frequency (kHz) 1

DDR3L, VIN = 12V, VDDQ = 1.35V,

S3 = GND, S5 = 5V, RTON = 620kΩ

Switching Frequency vs. Load Current

0

50

100

150

200

250

300

350

400

450

500

0.01 0.1 1 10

Load Current (A)

Switching Frequency (kHz) 1

DDR3L, VIN = 19V, VDDQ = 1.35V,

S3 = GND, S5 = 5V, RTON = 620kΩ

Switching Frequency vs. Load Current

0

50

100

150

200

250

300

350

400

450

500

0.01 0.1 1 10

Load Current(A)

Switching Frequency (kHz) 1

DDR4, VIN = 7.4V, VDDQ = 1.2V,

S3 = GND, S5 = 5V, RTON = 620kΩ

Switching Frequency vs. Load Current

0

50

100

150

200

250

300

350

400

450

500

0.01 0.1 1 10

Load Current (A)

Switching Frequency (kHz) 1

DDR4, VIN = 12V, VDDQ = 1.2V,

S3 = GND, S5 = 5V, RTON = 620kΩ

Switching Frequency vs. Load Current

0

50

100

150

200

250

300

350

400

450

500

0.01 0.1 1 10

Load Current (A)

Switching Frequency (kHz) 1

DDR4, VIN = 19V, VDDQ = 1.2V,

S3 = GND, S5 = 5V, RTON = 620kΩ

RT8248A

10

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Efficiency vs. Load Current

0

10

20

30

40

50

60

70

80

90

100

0.001 0.010 0.100 1.000 10.000

Load Current (A)

Efficiency (%)

DDR3L, VIN = 12V, VDDQ = 1.35V, S3 = S5 = 5V

Efficiency vs. Load Current

0

10

20

30

40

50

60

70

80

90

100

0.001 0.010 0.100 1.000 10.000

Load Current (A)

Efficiency (%)

DDR3L, VIN = 7.4V, VDDQ = 1.35V, S3 = S5 = 5V

Efficiency vs. Load Current

0

10

20

30

40

50

60

70

80

90

100

0.001 0.010 0.100 1.000 10.000

Load Current (A)

Efficiency (%)

DDR3L, VIN = 19V, VDDQ = 1.35V, S3 = S5 = 5V

Efficiency vs. Load Current

0

10

20

30

40

50

60

70

80

90

100

0.001 0.010 0.100 1.000 10.000

Load Current (A)

Efficiency (%)

DDR4, VIN = 7.4V, VDDQ = 1.2V, S3 = S5 = 5V

Efficiency vs. Load Current

0

10

20

30

40

50

60

70

80

90

100

0.001 0.010 0.100 1.000 10.000

Load Current (A)

Efficiency (%)

DDR4, VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V

Efficiency vs. Load Current

0

10

20

30

40

50

60

70

80

90

100

0.001 0.010 0.100 1.000 10.000

Load Current (A)

Efficiency (%)

DDR4, VIN = 19V, VDDQ = 1.2V, S3 = S5 = 5V

RT8248A

11

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

VTT Output Voltage vs. Load Current

0.650

0.655

0.660

0.665

0.670

0.675

0.680

0.685

0.690

0.695

0.700

-1.5 -1.2 -0.9 -0.6 -0.3 0 0.3 0.6 0.9 1.2 1.5

Load Current (A)

Output Voltage (V)

DDR3L, VIN = 12V, VTT = 0.675V, S3 = S5 = 5V

VTT Output Voltage vs. Load Current

0.575

0.580

0.585

0.590

0.595

0.600

0.605

0.610

0.615

0.620

0.625

-1.5 -1.2 -0.9 -0.6 -0.3 0 0.3 0.6 0.9 1.2 1.5

Load Current (A)

Output Voltage (V)

DDR4, VIN = 12V, VTT = 0.6V, S3 = S5 = 5V

Quiescent Current vs. Input Voltage

130

132

134

136

138

140

142

144

146

148

150

4 6 8 10 12 14 16 18 20 22 24 26

Input Voltage (V)

Quiescent Current (µA)

No Switching, S3 = GND, S5 = 5V

Shutdown Current vs. Input Voltage

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

4 6 8 101214161820222426

Input Voltage (V)

Shutdown Current (µA

)

S3 = S5 = GND

VDDQ Output Voltage vs. Load Current

1.15

1.16

1.17

1.18

1.19

1.20

1.21

1.22

1.23

1.24

1.25

0.01 0.1 1 10

Load Current (A)

Output Voltage (V)

DDR4, VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V

VDDQ Output Voltage vs. Load Current

1.30

1.31

1.32

1.33

1.34

1.35

1.36

1.37

1.38

1.39

1.40

0.01 0.1 1 10

Load Current (A)

Output Voltage (V)

DDR3L, VIN = 12V, VDDQ = 1.35V, S3 = S5 = 5V

RT8248A

12

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Non-Tracking Discharge Shutdown

Time (200μs/Div)

S5

(5V/Div)

VTT

(1V/Div)

VDDQ

(1V/Div)

VTTREF

(1V/Div)

No Load, VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V

VDDQ and VTT Start Up

Time (1ms/Div)

PGOOD

(5V/Div)

VTT

(1V/Div)

VDDQ

(1V/Div)

S5

(5V/Div)

No Load, VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V

VTT Voltage vs. Temperature

0.575

0.580

0.585

0.590

0.595

0.600

0.605

0.610

0.615

0.620

0.625

-50 -25 0 25 50 75 100 125

Temperature (°C)

VTT Voltage (V)

DDR4, VIN = 12V, VTT = 0.6V, S3 = S5 = 5V

VDDQ Voltage vs. Temperature

1.15

1.16

1.17

1.18

1.19

1.20

1.21

1.22

1.23

1.24

1.25

-50 -25 0 25 50 75 100 125

Temperature (°C)

VDDQ Voltage (V)

DDR4, VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V

VDDQ Start Up

Time (1ms/Div)

PGOOD

(5V/Div)

VTT

(1V/Div)

VDDQ

(1V/Div)

PHASE

(10V/Div)

VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V, ILoad = 10A

VDDQ Load Transient Response

Time (40μs/Div)

IL

(10A/Div)

UGATE

(20V/Div)

VDDQ

(50mV/Div)

LGATE

(5V/Div)

VDDQ = 1.2V, S3 = S5 = 5V, ILoad = 0.1A to 10A

DDR4, VIN = 12V

RT8248A

13

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Under Voltage Protection

Time (40μs/Div)

PGOOD

(5V/Div)

UGATE

(20V/Div)

VDDQ

(1V/Div)

LGATE

(5V/Div)

VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V

Over Voltage Protection

Time (40μs/Div)

PGOOD

(5V/Div)

PHASE

(5V/Div)

VDDQ

(1V/Div)

LGATE

(5V/Div)

No Load, VIN = 12V, VDDQ = 1.2V, S3 = S5 = 5V

VTT Load Transient Response

Time (50μs/Div)

IVTT

(2A/Div)

VTTREF

(20mV/Div)

VTT

(20mV/Div)

VDDQ = 1.2V, S3 = S5 = 5V, ILoad = −1.5A to 1.5A

DDR4, VIN = 12V

RT8248A

14

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Application Information

The RT8248A PWM controller provides the high efficiency,

excellent transient response, and high DC output accuracy

needed for stepping down high voltage batteries to

generate low voltage chipset RAM supplies in notebook

computers. Richtek's Mach ResponseTM technology is

specifically designed for providing 100ns “instant-on”

response to load steps while maintaining a relatively

constant operating frequency and inductor operating point

over a wide range of input voltages. The topology solves

the poor load transient response timing problems of fixed-

frequency current mode PWMs, and avoids problems

caused by widely varying switching frequencies in

conventional constant-on-time and constant- off-time PWM

schemes. The DRVTM mode PWM modulator is

specifically designed to have better noise immunity for

such a single output application.

The 1.5A sink/source LDO maintains fast transient

response, only requiring 10μF of ceramic output

capacitance. In addition, the LDO supply input is available

externally to significantly reduce the total power losses.

The RT8248A supports all of the sleep state controls,

placing VTT at high-Z in S3 and discharging VDDQ, VTT

and VTTREF (soft-off) in S4/S5.

PWM Operation

The Mach ResponseTM

DRVTM mode controller relies on

the output filter capacitor's Effective Series Resistance

(ESR) to act as a current-sense resistor, so the output

ripple voltage provides the PWM ramp signal. Referring to

the function block diagrams of the RT8248A, the

synchronous high-side MOSFET is turned on at the

beginning of each cycle. After the internal one-shot timer

expires, the MOSFET will be turned off. The pulse width

of this one-shot is determined by the converter's input

and output voltages to keep the frequency fairly constant

over the entire input voltage range. Another one-shot sets

a minimum off-time (400ns typ.).

On-Time Control

The on-time one-shot comparator has two inputs. One

input looks at the output voltage, while the other input

samples the input voltage and converts it to a current.

This input voltage proportional current is used to charge

an internal on-time capacitor. The on-time is the time

required for the voltage on this capacitor to charge from

zero volts to VVDDQ, thereby making the on-time of the

high-side switch directly proportional to the output voltage

and inversely proportional to the input voltage. This

implementation results in a nearly constant switching

frequency without the need of a clock generator, as shown

below :





ON TON VDDQ IN TON

t 3.85p x R x V / (V 0.5) + R x 1



And then the switching frequency is :

VDDQ IN ON

f V / (V x t )

where RTON is the resistor connected from VIN to the TON

pin. Note that the setting on-time must be longer than

100ns (typ.) of the minimum on-time and shorter than 3μs

(typ.) of the maximum on-time.

Diode Emulation Mode

In diode emulation mode, the RT8248A automatically

reduces switching frequency at light load conditions to

maintain high efficiency. As the output current decreases

from heavy load condition, the inductor current will also

be reduced and eventually come to the point where its

valley touches zero current, which is the boundary between

continuous conduction and discontinuous conduction

modes. To emulate the behavior of diodes, the low-side

MOSFET allows only partial negative current to flow when

the inductor freewheeling current reaches negative. As the

load current is further decreased, it takes longer and longer

time to discharge the output capacitor to the level that

requires the next “ON” cycle. The on-time is kept the

same as that in the heavy load condition. In contrast, when

the output current increases from light load to heavy load,

the switching frequency increases to the preset value as

the inductor current reaches the continuous condition. The

transition load point to the light load operation is shown in

Figure 3 and can be calculated as follows :



IN VDDQ

LOAD(SKIP) ON

VV

I x t

2L

where tON is the on-time.

RT8248A

15

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Figure 3. Boundary Condition of CCM/DCM

The switching waveforms may appear noisy and

asynchronous when light load causes diode-emulation

operation, but this is a normal operating condition that

results in high light load efficiency. Trade offs in DEM

noise vs. light load efficiency is made by varying the

inductor value. Generally, low inductor values produce a

broader efficiency vs. load curve, while higher values result

in higher full load efficiency (assuming that the coil

resistance remains fixed) and less output voltage ripple.

The disadvantages for using higher inductor values include

larger physical size and degraded load transient response

(especially at low input voltage levels).

Current Limit Setting for VDDQ (CS)

The RT8248A provides cycle-by-cycle current limit control.

The current limit circuit employs a unique “valley” current

sensing algorithm. If the magnitude of the current sense

signal at PHASE is above the current limit threshold, the

PWM is not allowed to initiate a new cycle (Figure 4).

The actual peak current is greater than the current limit

threshold by an amount equal to the inductor ripple current.

Therefore, the exact current limit characteristic and

maximum load capability are a function of the sense

resistance, inductor value, battery and output voltage.

IL

t

0

IPEAK

ILIM

ILOAD

Figure 4. “Valley” Current Limit

The RT8248A uses the on resistance of the synchronous

rectifier as the current sense element and supports

temperature compensated MOSFET RDS(ON) sensing. The

setting resistor, RILIM, between the CS pin and VDD sets

the current limit threshold. The CS pin sources an internal

5μA (typ.) current source at room temperature. This current

has a 4700ppm/°C temperature slope to compensate the

temperature dependency of RDS(ON). When the voltage

drop across the low-side MOSFET equals the voltage

across the RILIM setting resistor, the positive current limit

will activate. The high-side MOSFET will not be turned on

until the voltage drop across the low-side MOSFET falls

below the current limit threshold.

Choose a current limit setting resistor via the following

equation :

LIMIT LIMIT DS(ON)

RI x R 10/ 5μ

A



And then the CS pin voltage is

VCS = RLIMIT x 5μA

Note that the VCS should be set from 0.4V to 3V.

Carefully observe the PCB layout guidelines to ensure

that noise and DC errors do not corrupt the current-sense

signal seen by PHASE and PGND.

Current Protection for VTT

The LDO has an internally fixed constant over-current limit

of 2.6A while operating at normal condition. From then

on, when the output voltage exceeds 20% of its set

voltage, the internal power good signal will transit from

high to low.

MOSFET Gate Driver (UGATE, LGATE)

The high-side driver is designed to drive high current, low

RDS(ON) N-MOSFET(s). When configured as a floating

driver, 5V bias voltage is delivered from the VDD supply.

The average drive current is proportional to the gate charge

at VGS = 5V times switching frequency. The instantaneous

drive current is supplied by the flying capacitor between

the BOOT and PHASE pins.

A dead-time to prevent shoot through is internally

generated between high-side MOSFET off to low-side

MOSFET on, and low-side MOSFET off to high-side

MOSFET on.

IL

t

0tON

Slope = (VIN - VVDDQ) / L

IPEAK

ILOAD = IPEAK / 2

RT8248A

16

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

The low-side driver is designed to drive high current, low

RDS(ON) N-MOSFET(s). The internal pull down transistor

that drives LGATE low is robust, with a 0.8Ω typical on-

resistance. A 5V bias voltage is delivered from the VDD

supply. The instantaneous drive current is supplied by the

flying capacitor between VDD and PGND.

For high current applications, some combinations of high-

and low-side MOSFETs may cause excessive gate drain

coupling, which leads to efficiency killing, EMI producing

shoot through currents. This is often remedied by adding

a resistor in series on BOOT, which increases the turn-

on rising time of the high-side MOSFET without degrading

the turn-off time (Figure 5).

BOOT

UGATE

PHASE

R

VIN

Figure 5. Increasing the UGATE Rise Time

Power Good Output (PGOOD)

The power good output is an open drain output that requires

a pull-up resistor. When the output voltage is 15% below

its set voltage, PGOOD will be pulled low. It is held low

until the output voltage returns to 87% of its set voltage

once more. During soft-start, PGOOD is actively held low

and only allowed to be pulled high after soft-start is over

and the output reaches 87% of its set voltage. There is a

5μs delay built into PGOOD circuitry to prevent false

transition.

POR Protection

The RT8248A has a VDD supply power on reset protection

(POR). When the VDD voltage is higher than 4.2V (typ.),

VDDQ, VTT and VTTREF will be activated. This is a non-

latch protection.

Soft-Start

The RT8248A provides an internal soft-start function to

prevent large inrush current and output voltage overshoot

when the converter starts up. Soft-start (SS) automatically

begins once the chip is enabled. During soft-start, internal

bandgap circuit gradually ramps up the reference voltage

from zero. The maximum reference value is set externally

as described in Table 1.

The soft-start function of VTT is achieved by the current

limit and VTTREF voltage through the internal RC delay

ramp up after S3 is high. During VTT startup, the current

limit level is 2.6A. This allows the output to start up

smoothly and safely under enough source/sink ability.

Output Over-Voltage Protection (OVP)

The output voltage can be continuously monitored for over-

voltage condition. If the output exceeds 15% of its set

voltage threshold, over voltage protection will be triggered

and the LGATE low-side gate driver will be forced high.

This activates the low-side MOSFET switch which rapidly

discharges the output capacitor and reduces the output

voltage. There is a 5μs latch delay built into the over-

voltage protection circuit. The RT8248A will be latched if

the output voltage remains above the OV threshold after

the latch delay period. The latched OVP will pull low

PGOOD and can only be released by VDD power on reset

or S5.

Note that latching the LGATE high will cause the output

voltage to dip slightly negative when energy has been

previously stored in the LC tank circuit. For loads that

cannot tolerate a negative voltage, place a power Schottky

diode across the output to act as a reverse polarity clamp.

If the over voltage condition is caused by a shorted high-

side switch, turning the low-side MOSFET on 100% will

create an electrical shorted circuit between the battery

and GND, to blow the fuse and disconnecting the battery

from the output.

RT8248A

17

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Output Voltage Setting (FB)

Connect a resistive voltage divider at FB between VDDQ

and GND to adjust the respective output voltage between

0.675V and 3.3V (Figure 6). Choose R2 to be

approximately 10kΩ and solve for R1 using the equation

as follows :

Table 1. VID and Reference Voltage Setting

VID Reference Voltage (V)

High 0.675

Low 0.75

VDDQ (Valley) REF

R1

VV x 1

R2















where VREF is 0.75V or 0.675V depends on the VID setting

in Table 1.

Note that when the RT8248A operates from CCM to DEM,

the reference voltage will add 10mV offset.

PHASE

LGATE

R1

R2

VVDDQ

VIN

UGATE

VDDQ

FB

GND

Figure 6. Setting VDDQ with a Resistive Voltage Divider

When the reference voltage is changed from 0.75V to

0.675V, the OVP latch will be masked for 120μs to prevent

an unexpected shutdown.

VTT Linear Regulator and VTTREF

The RT8248A integrates a high performance low dropout

linear regulator that is capable of sourcing and sinking

currents up to 1.5A. This VTT linear regulator employs

ultimate fast response feedback loop so that small ceramic

capacitors are enough for keeping track of VTTREF within

40mV at all conditions, including fast load transient. To

achieve tight regulation with minimum effect of wiring

resistance, a remote sensing terminal, VTTSNS, should

be connected to the positive node of the VTT output

capacitor(s) as a separate trace from the VTT pin. For

stable operation, total capacitance of the VTT output

terminal can be equal to or greater than 10μF. It is

recommended to attach two 10μF ceramic capacitors in

parallel to minimize the effect of ESR and ESL. If ESR of

the output capacitor is greater than 2mΩ, insert an RC

filter between the output and VTTSNS input to achieve

loop stability. The RC filter time constant should be almost

the same or slightly lower than the time constant made

by the output capacitor and its ESR. The VTTREF block

consists of on-chip 1/2 divider, LPF and buffer. This regulator

also has sink and source capability up to 10mA. Bypass

VTTREF to GND with a 33nF ceramic capacitor for stable

operation.

Output Management by S3, S5 Control

In DDR2/DDR3 memory applications, it is important to

always keep VDDQ higher than VTT/VTTREF, even during

start-up and shutdown. The RT8248A provides this

management by simply connecting both S3 and S5

terminals to the sleep-mode signals such as SLP_S3 and

SLP_S5 in notebook PC system. All VDDQ, VTTREF and

VTT are turned on at S0 state (S3 = S5 = high). In S3

state (S3 = low, S5 = high), VDDQ and VTTREF voltages

are kept on while VTT is turned off and left at high

Output Under-Voltage Protection (UVP)

The output voltage can be continuously monitored for under-

voltage condition. When UVP is enabled, the under voltage

protection is triggered if the FB is less than 0.45V. Then,

both UGATE and LGATE gate drivers will be forced low

until next VDD or S5 reset. During soft-start, the UVP has

a blanking time around 5ms.

Thermal Protection

The RT8248A features a thermal protection function. If

the temperature exceeds the threshold, 165°C (typ.), the

PWM output, VTTREF and VTT will be shut down. The

RT8248A is latched once thermal shutdown is triggered

and can only be released by VDD power on reset or S5.

RT8248A

18

DS8248A-04 October 2014www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

impedance (high-Z) state. The VTT output is floated and

does not sink or source current in this state. In S4/S5

states (S3 = S5 = low), all of the three outputs are disabled

and discharged to ground. The code of each state

represents the following: S0 = full ON, S3 = suspend to

RAM (STR), S4 = suspend to disk (STD), S5 = soft OFF.

(See Table 2)



ON IN VDDQ

IR LOAD(MAX)

t x (V V )

LL x I

where LIR is the ratio of the peak-to-peak ripple current to

the maximum average inductor current.

Find a low loss inductor having the lowest possible DC

resistance that fits in the allotted dimensions. Ferrite cores

are often the best choice, although powdered iron is

inexpensive and can work well at 200kHz. The core must

be large enough and not saturate at the peak inductor

current (IPEAK) :







PEAK LOAD(MAX) IR LOAD(MAX)

I I (L /2) x I

()

SAG

2

LOAD ON OFF(MIN)

OUT IN ON VDDQ ON OFF(MIN)

V

I x L x (tt )

2 x C x V x t V x (t t )









where minimum off-time, tOFF(MIN), is 400ns typically.

Output Capacitor Selection

The output filter capacitor must have low enough ESR to

meet output ripple and load-transient requirements, yet

have high enough ESR to satisfy stability requirements.

Also, the capacitance must be high enough to absorb the

inductor energy going from a full-load to no-load condition

without tripping the OVP circuit.

For CPU core voltage converters and other applications

where the output is subject to violent load transients, the

output capacitor's size depends on how much ESR is

needed to prevent the output from dipping too low under a

load transient. Ignoring the sag due to finite capacitance :



PP

LOAD(MAX)

V

ESR I

Table 2. S3 and S5 truth table

S

TATE S3 S5 VDDQ VTTREF VTT

S0 Hi Hi On On On

S3 Lo Hi On On Off (Hi-Z)

S4/S5 Lo Lo Off

(Discharge)

Off

(Discharge)

Off

(Discharge)

This inductor ripple current also impacts transient-response

performance, especially at low VIN − VVDDQ differences.

Low inductor values allow the inductor current to slew

faster, replenishing charge removed from the output filter

capacitors by a sudden load step. The peak amplitude of

the output transient (VSAG) is also a function of the output

transient. VSAG also features a function of the maximum

duty factor, which can be calculated from the on-time and

minimum off-time :

In non-CPU applications, the output capacitor's size

depends on how much ESR is needed to maintain an

acceptable level of output voltage ripple :



PP

IR LOAD(MAX)

V

ESR L x I

where VP−P is the peak-to-peak output voltage ripple.

Organic semiconductor capacitor(s) or specialty polymer

capacitor(s) are recommended.

The amount of overshoot due to stored inductor energy

can be calculated as :



2

PEAK

SOAR

OUT VDDQ

(I ) x L

V2 x C x V

where IPEAK is the peak inductor current.

VDDQ and VTT Discharge Mode

The RT8248A discharges VDDQ, VTTREF and VTT outputs

when S5 is low or in the S4/S5 state.

When in non-tracking discharge mode, the RT8248A

discharges outputs using internal MOSFETs which are

connected to VDDQ and VTT. The current capability of

these MOSFETs is limited to discharge slowly. Note that

the VDDQ discharge current flows from VDDQ to GND in

this mode. In order to discharge smoothly, the RT8248A

provides a special function that the low-side MOSFET

will switch periodically as phase pin with remaining

voltage.

Output Inductor Selection

The switching frequency (on-time) and operating point (%

ripple or LIR) determine the inductor value as follows :

RT8248A

19

DS8248A-04 October 2014 www.richtek.com

©

Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

Figure 7. Derating Curve of Maximum Power Dissipation

Layout Considerations

Layout is very important in high frequency switching

converter design. If designed improperly, the PCB could

radiate excessive noise and contribute to the converter

instability. Certain points must be considered before

starting a layout for the RT8248A.

Keep current limit setting network as close as possible

to the IC. Routing of the network should avoid coupling

to high voltage switching node.

Connections from the drivers to the respective gate of

the high-side or the low-side MOSFET should be as

short as possible to reduce stray inductance.

All sensitive analog traces and components such as

VDDQ, FB, PGND, PGOOD, CS, VDD, and TON should

be placed away from high voltage switching nodes such

as PHASE, LGATE, UGATE, and BOOT to avoid

coupling. Use internal layer(s) as ground plane(s) and

shield the feedback trace from power traces and

components.

VLDOIN should be connected to VDDQ output with short

and wide trace. If different power source is used for

VLDOIN, an input bypass capacitor should be placed as

close as possible to the pin with short and wide trace.

The output capacitor for VTT should be placed close to

the pin with short and wide connection in order to avoid

additional ESR and/or ESL of the trace.

It is strongly recommended to connect VTTSNS to the

positive node of VTT output capacitor(s) as a separate

trace from the high current power line to avoid additional

ESR and/or ESL. If it is needed to sense the voltage of

the point of the load, it is recommended to attach the

output capacitor(s) at that point. It is also recommended

to minimize any additional ESR and/or ESL of ground

trace between the GND pin and the output capacitor(s).

Current sense connections must always be made using

Kelvin connections to ensure an accurate signal, with

the current limit resistor located at the device.

Power sections should connect directly to ground

plane(s) using multiple vias as required for current

handling (including the chip power ground connections).

Power components should be placed as close to the IC

as possible to minimize loops and reduce losses.

0.0

0.6

1.2

1.8

2.4

3.0

3.6

0 25 50 75 100 125

Ambient Temperature (°C)

Maximum Power Dissipation (W) 1

Four-Layer PCB

Thermal Considerations

For continuous operation, do not exceed absolute

maximum junction temperature. The maximum power

dissipation depends on the thermal resistance of the IC

package, PCB layout, rate of surrounding airflow, and

difference between junction and ambient temperature. The

maximum power dissipation can be calculated by the

following formula :

PD(MAX) = (TJ(MAX) − TA) / θJA

where TJ(MAX) is the maximum junction temperature, TA is

the ambient temperature, and θJA is the junction to ambient

thermal resistance.

For recommended operating condition specifications, the

maximum junction temperature is 125°C. The junction to

ambient thermal resistance, θJA, is layout dependent. For

WQFN-20L 3x3 package, the thermal resistance, θJA, is

30°C/W on a standard JEDEC 51-7 four-layer thermal test

board. The maximum power dissipation at TA = 25°C can

be calculated by the following formula :

PD(MAX) = (125°C − 25°C) / (30°C/W) = 3.33W for

WQFN-20L 3x3 package

The maximum power dissipation depends on the operating

ambient temperature for fixed TJ(MAX) and thermal

resistance, θJA. The derating curves in Figure 7 allow the

designer to see the effect of rising ambient temperature

on the maximum power dissipation.

RT8248A

20

DS8248A-04 October 2014www.richtek.com

Richtek Technology Corporation

14F, No. 8, Tai Yuen 1st Street, Chupei City

Hsinchu, Taiwan, R.O.C.

Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should

obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot

assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be

accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

Outline Dimension

Dimensions In Millimeters Dimensions In Inches

Symbol Min Max Min Max

A 0.700 0.800 0.028 0.031

A1 0.000 0.050 0.000 0.002

A3 0.175 0.250 0.007 0.010

b 0.150 0.250 0.006 0.010

D 2.900 3.100 0.114 0.122

D2 1.650 1.750 0.065 0.069

E 2.900 3.100 0.114 0.122

E2 1.650 1.750 0.065 0.069

e 0.400 0.016

L 0.350 0.450

0.014 0.018

W-Type 20L QFN 3x3 Package

Note : The configuration of the Pin #1 identifier is optional,

but must be located within the zone indicated.

DETAIL A

Pin #1 ID and Tie Bar Mark Options

1

1

22

www.s-manuals.com