RT9161, RT9161A Datasheet. Www.s Manuals.com. Richtek

User Manual: Marking of electronic components, SMD Codes G3, G3**, G3***, G3-, G3-***, G30, G33, G3=, G3F, G3K. Datasheets 1SS196, AX3503B, BC857B, BC858B, BC858BW, BGA2748, EMG3, EUP7965-33VIR1, FMG3A, MIC5219-3.0BML, MIC5219-3.3BML, PZU2.4B, RT9161A-18GX, RT9161A-18PX, RT9166-15PVL, RT9261A-18PB, TC1188-RECT, UMG3N.

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RT9161/A
300/500mA Low Dropout Linear Voltage Regulator
General Description

Features

The RT9161/A is a 300/500mA fixed output voltage low
dropout linear regulator. Typical ground current is
approximately 110μA, from zero to maximum loading
conditions. Wide range of available output voltage fits most
of applications. Built-in output current-limiting most
thermal-limiting provide maximal protection against any
fault conditions.

z

Low Dropout Voltage of 200mV at Output Current
100mA, 450mV at Output Current 300mA, and
750mV at 500mA Output Current

z

Guaranteed 300/500mA Output Current
Internal 1.5Ω
Ω P-MOSFET Draws No Base Current
Low Ground Current 110μ
μA

For ease of application, the RT9161/A comes in the popular
3-pin SOT-23 (300mA), SOT-89 (300mA), SOT-223
(500mA), or TO-92 packages.

z
z
z
z
z
z
z

Ordering Information
RT9161/A-

z

2% Accuracy Output Voltage
Input Voltage Range up to 12V
Extremely Tight Load Regulation
Fast Transient Response
Current-limiting and Thermal-limiting
RoHS Compliant and 100% Lead (Pb)-Free

Applications
Package Type
V : SOT-23-3
X : SOT-89
G : SOT-223
ZL : TO-92 (L-Type)
ZT : TO-92 (T-Type)

z
z
z

Voltage Regulator for LAN Card, CD-ROM, and DVD
Wireless Communication Systems
Battery Powered Systems

Marking Information

For marking information, contact our sales representative
Lead Plating System
P : Pb Free
directly or through a Richtek distributor located in your
G : Green (Halogen Free and Pb Free) area.
Output Voltage
15 : 1.5V
Pin Configurations
16 : 1.6V
:
(TOP VIEW)
49 : 4.9V
50 : 5.0V
VIN
500mA Output Current
300mA Output Current

3

1

Note :
Richtek products are :
`

GND

RoHS compliant and compatible with the current require-

3

VOUT

GND

SOT-23-3

ments of IPC/JEDEC J-STD-020.
`

2

2

VIN VOUT
(TAB)

SOT-89

Suitable for use in SnPb or Pb-free soldering processes.

2

1

GND

3

VIN VOUT
(TAB)

SOT-223
DS9161/A-35 April 2011

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RT9161/A
3
2

VOUT

3

VOUT

GND

1

VIN

2
1

VIN
GND

TO-92 (L-Type)

TO-92 (T-Type)

Typical Application Circuit
RT9161/A
VIN

VOUT

+

CIN
1uF

+

VIN

COUT
10uF

GND

VOUT

Electrolytic

Functional Pin Description
Pin Name

Pin Function

VOUT

Output Voltage.

GND

Ground.

VIN

Power Input.

Function Block Diagram
VIN

VOUT

Thermal
Shutdown

Error Amp
-

+

Current
Limiting
Sensor

1.2V
Reference

GND

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2

DS9161/A-35 April 2011

RT9161/A
Absolute Maximum Ratings
z
z
z
z

z

Input Voltage ---------------------------------------------------------------------------------------------------------------- −0.3 to 14V
Operating Junction Temperature Range ------------------------------------------------------------------------------- −40°C to 125°C
Storage Temperature Range --------------------------------------------------------------------------------------------- −65°C to 150°C
Power Dissipation, PD @ TA = 25°C
SOT-23-3 --------------------------------------------------------------------------------------------------------------------- 0.4W
SOT-89 ----------------------------------------------------------------------------------------------------------------------- 0.571W
SOT-223 --------------------------------------------------------------------------------------------------------------------- 0.741W
TO-92 ------------------------------------------------------------------------------------------------------------------------- 0.625W
Package Thermal Resistance (Note 1)
SOT-23-3, θJA --------------------------------------------------------------------------------------------------------------- 250°C/W
SOT-23-3, θJC --------------------------------------------------------------------------------------------------------------- 140°C/W
SOT-89, θJA ----------------------------------------------------------------------------------------------------------------- 175°C/W
SOT-89, θJC ----------------------------------------------------------------------------------------------------------------- 100°C/W
SOT-223, θJA ---------------------------------------------------------------------------------------------------------------- 135°C/W
SOT-223, θJC --------------------------------------------------------------------------------------------------------------- 15°C/W
TO-92, θJA ------------------------------------------------------------------------------------------------------------------- 160°C/W
TO-92, θJC ------------------------------------------------------------------------------------------------------------------- 125°C/W

Electrical Characteristics
(TA = 25°C, CIN = 1μF, COUT = 10μF, unless otherwise specified.)

Parameter

Symbol

Output Voltage Accuracy

ΔVOUT

Test Conditions
IL = 1mA, VIN = 5V

Output Voltage Temperature
Coefficient
Line Regulation
Load Regulation

(Note 2)

Current Limit
(Note 3)

RT9161

Dropout Voltage

(Note 4)

RT9161A

Standby Current

Min

Typ

Max

Unit

−2

--

2

%

--

50

150

PPM/°C

ΔVLINE

IL = 1mA, VIN= 4.5 to 12V

--

2

3

%VOUT

ΔVLOAD

IL = 1mA to 300/500mA, VIN = 5V

--

1

30/50

mV

ILIM

VIN = 5V, VOUT = 0V

350

580

--

500

900

--

VDROP

IL = 300/500mA

ISTANDBY IL = 0, VIN = 12V

---

450/750 600/1000
110

180

mA
mV
μA

Note 1. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 2. Regulation is measured at constant junction temperature, using pulsed ON time.
Note 3. Current Limit is measured at constant junction temperature, using pulsed ON time.
Note 4. The dropout voltage is defined as VIN − VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.

DS9161/A-35 April 2011

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RT9161/A
Typical Operating Characteristics
Temperature Stability

Quiescient Current vs. Temperature
0.14

3.4

Quiescient Current (mA)

Output Voltage (V)

0.12

VOUT = 3.3V

3.2

3

2.8

2.6

VOUT = 2.5V

0.10
0.08
0.06
0.04
0.02

VIN = 5V
0.00

2.4
-50

-25

0

25

50

75

100

-30

125

0

Temperature (°C)

60

90

120

Temperature (°C)

Dropout Voltage (VIN-VOUT)
1

Short Circuit Current

1.4

125°C

125°C
0.8

Short Circuit Current (A)

Dropout Voltage (V)

30

25°C
0.6

0.4

0.2

1.2

25°C

1
0.8
0.6
0.4
0.2

VOUT = 3.3V
0

0
0

100

200

300

400

500

0

2

Line Transient Response

5

T

4

≈
Output Voltage
Deviation (mV)

VOUT = 3.3V
TA = 25°C

Input Voltage
Deviation (V)

COUT = 10μF Electrolytic
IOUT = 0.1A

6

TT

100
02 >
-1001 >
-200

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4

6

8

10

Line Transient Response
7

Time(100μs/Div)
(100μS/Div)
Time

COUT = 10μF Electrolytic
IOUT = 0.1A

6
5

VOUT = 2.5V
TA = 25°C

T

4

≈

≈
Output Voltage
Deviation (mV)

Input Voltage
Deviation (V)

7

4

Input/Output Differential (V)

I Load (mA)

100

≈
TT

02 >
-1001 >
-200

Time(100μs/Div)
(100μS/Div)
Time

DS9161/A-35 April 2011

RT9161/A
Load Transient Response

VIN = 5V
VOUT = 3.3V

CIN = 1μF
40 COUT = 10μF
20 TA = 25°C
TT

02 >
-20

≈
T

1>

1
-50

50 TA = 25°C
02 >

TT

≈

100
T

101 >
-100

Time(100μs/Div)
(100μS/Div)
Time

Load Transient Response

VIN = 5V
VOUT = 2.5V

CIN = 1μF

40 COUT = 10μF

TA = 25°C

20
02 >

TT

-20

≈
T

11 >
-50

PSRR

02 >

-50

T

-100

Time(100μs/Div)
(100μS/Div)
Time

PSRR
CIN = 1uF
COUT = 10uF Tantalum
VIN = 5V
VOUT = 2.5V
TA = 25°C

-10

-40

≈

101 >

100mA

-30

TT

100

0

PSRR (dB)

-20

TA = 25°C

50

≈

Time(100μs/Div)
(100μS/Div)
Time

CIN = 1uF
COUT = 10uF Tantalum
VIN = 5V
VOUT = 3.3V
TA = 25°C

VIN = 5V
VOUT = 2.5V

CIN = 1μF

100 COUT = 10μF

200
Load Current
(mA)

Load Current
(mA)

50

150

-50

≈

100

PSRR (dB)

Output Voltage
Deviation (mV)

Output Voltage
Deviation (mV)

Load Transient Response

-10

≈

Time
Time(100μs/Div)
(100μS/Div)

60

0

VIN = 5V
VOUT = 3.3V

CIN = 1μF

100 COUT = 10μF

200
Load Current
(mA)

50

150

-50

≈

100
Load Current
(mA)

Output Voltage
Deviation (mV)

Output Voltage
Deviation (mV)

Load Transient Response
60

-20

100mA

-30
-40
-50

10mA

10mA
-60

-60
10

100

1000
1K

10000
10K

Frequency (Hz)
DS9161/A-35 April 2011

100000
100K

1000000
1M

10

100

1K
1000

10K
10000

100K
100000

1M
1000000

Frequency (Hz)
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RT9161/A
Application Information
A 10uF capacitor with 200mΩ or higher ESR, connecting
between VOUT and GND pins, is recommended for
stability. A capacitor with ESR smaller than 200 mΩ may
cause VOUT oscillation as shown in Figure 1. Operating
temperature should be well considered to ensure that the
capacitance is no less than 10uF over the operating
temperature range. Please take the notice that Aluminum
electrolytic capacitors may cause VOUT oscillation when
operating below −25°C. The capacitance can be increased
without limit for better transient response.
A 1uF or higher capacitor should be placed between VIN
and GND to filter out input noise and ensure stable output
voltage.

Region of Stable COUT ESR vs. Load Current
100

VIN = 3.3V
CIN = 1uF
COUT = 10uF

C OUT ESR (Ω)

10

PD(MAX) = ( TJ(MAX) − TA ) / θJA
Where T J(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9161/A, where T J(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-223 packages,
the thermal resistance θJA is 135°C/W on the standard
JEDEC 51-3 single-layer 1S thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by following formula :
PD(MAX) = ( 125°C − 25°C ) / 250 = 0.400 W for
SOT-23-3 packages
PD(MAX) = ( 125°C − 25°C ) / 175 = 0.571 W for
SOT-89 packages
PD(MAX) = ( 125°C − 25°C ) / 135 = 0.741 W for

1

SOT-223 packages

Stable
0.1

PD(MAX) = ( 125°C − 25°C ) / 160 = 0.625 W for

Instable

TO-92 packages
0

100

200

300

400

500

Load Current (mA)

Figure 1
Thermal protection limits power dissipation in RT9161/A.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
PD = (VIN − VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
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The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT9161/A packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Maximum Power Dissipation (mW)

0.01

800

SOT-223 package
700

TO-29 package

600

SOT-89 package

500
400
300

SOT-23-3 package

200
100
0
0

15

30

45

60

75

90

105

120

Ambient Temperature (°C)

Figure 2. Derating Curves
DS9161/A-35 April 2011

RT9161/A
Outline Dimension

A

D

E

L

b

e

C

D1
A1

Dimensions In Millimeters

Dimensions In Inches

Symbol
Min

Max

Min

Max

A

3.175

4.191

0.125

0.165

A1

1.143

1.372

0.045

0.054

b

0.406

0.533

0.016

0.021

C

0.406

0.533

0.016

0.021

D

4.445

5.207

0.175

0.205

D1

3.429

5.029

0.135

0.198

E

4.318

5.334

0.170

0.210

e

1.143

1.397

0.045

0.055

L

12.700

0.500

3-Lead TO-92 Plastic Package

DS9161/A-35 April 2011

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7

RT9161/A

H

D

L
C

B

e

A
A1
b

Dimensions In Millimeters

Dimensions In Inches

Symbol
Min

Max

Min

Max

A

0.889

1.295

0.035

0.051

A1

0.000

0.152

0.000

0.006

B

1.397

1.803

0.055

0.071

b

0.356

0.508

0.014

0.020

C

2.591

2.997

0.102

0.118

D

2.692

3.099

0.106

0.122

e

1.803

2.007

0.071

0.079

H

0.080

0.254

0.003

0.010

L

0.300

0.610

0.012

0.024

SOT-23-3 Surface Mount Package

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DS9161/A-35 April 2011

RT9161/A

D
D1

A

B

C

C1
e

e

H
A
b

b1

b

Dimensions In Millimeters

Dimensions In Inches

Symbol
Min

Max

Min

Max

A

1.397

1.600

0.055

0.063

b

0.356

0.483

0.014

0.019

B

2.388

2.591

0.094

0.102

b1

0.406

0.533

0.016

0.021

C

3.937

4.242

0.155

0.167

C1

0.787

1.194

0.031

0.047

D

4.394

4.597

0.173

0.181

D1

1.397

1.753

0.055

0.069

e

1.448

1.549

0.057

0.061

H

0.356

0.432

0.014

0.017

3-Lead SOT-89 Surface Mount Package

DS9161/A-35 April 2011

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RT9161/A

Dimensions In Millimeters
Symbol

Dimensions In Inches

Min

Max

Min

Max

A

1.400

1.800

0.055

0.071

A1

0.020

0.100

0.001

0.004

b

0.600

0.840

0.024

0.033

B

3.300

3.700

0.130

0.146

C

6.700

7.300

0.264

0.287

D

6.300

6.700

0.248

0.264

b1

2.900

3.100

0.114

0.122

e

2.300

0.091

H

0.230

0.350

0.009

0.014

L

1.500

2.000

0.059

0.079

L1

0.800

1.100

0.031

0.043

3-Lead SOT-223 Surface Mount Package

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Richtek Technology Corporation

Headquarter

Taipei Office (Marketing)

5F, No. 20, Taiyuen Street, Chupei City

5F, No. 95, Minchiuan Road, Hsintien City

Hsinchu, Taiwan, R.O.C.

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Tel: (8863)5526789 Fax: (8863)5526611

Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com

Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.

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