US6K2 Datasheet. Www.s Manuals.com. Rohm
User Manual: Marking of electronic components, SMD Codes K0, K0-***, K01, K02, K0355, K0389, K0390, K0391, K0392, K0393, K0394, K0395, K0396, K0397, K03B7, K03B8, K03B9, K04, K06, K0=***. Datasheets BST86, EM6K6, QS5K2, QS6K1, RJK0355DPA, RJK0389DPA, RJK0390DPA, RJK0391DPA, RJK0392DPA, RJK0393DPA, RJK0394DPA, RJK0395DPA, RJK0396DPA, RJK0397DPA, RJK03B7DPA, RJK03B8DPA, RJK03B9DPA, RT9818C-29GVL, RT9818C-29PVL, US6K1, US6K2, US6K4.
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US6K2
Transistors
Rev.B 1/3
4V Drive
Nch+Nch
MOSFET
US6K2
zStructure zDimensions (Unit : mm)
Silicon N-channel MOSFET
zFeatures
1) Two Nch MOSFETs are put in TUMT6 package.
2) High-speed switching, Low On-resistance.
3) 4V drive.
zApplications
Switching
zPackaging specifications zInner circuit
Package
Code
Taping
Basic ordering unit (pieces)
US6K2
TR
3000
Type
zAbsolute maximum ratings (Ta=25°C)
<It is the same ratings for the Tr1 and Tr2>
∗1
∗2
∗1
Parameter
VVDSS
Symbol
VVGSS
AID
AIDP
AIS
AISP
W / TOTAL
PD
°CTch
°CTstg
Limits Unit
Drain-source voltage
Gate-source voltage
Drain current
Total power dissipation
Channel temperature
Range of storage temperature
Continuous
Pulsed
Continuous
Pulsed
∗1 Pw≤10µs, Duty cycle≤1%
∗2 Mounted on a ceramic board
Source current
(Body diode)
30
150
−55 to +150
20
±1.4
±5.6
0.6
5.6
1.0
W / ELEMENT0.7
zThermal resistance
Parameter
°C/W / TOTAL
Rth(ch-a)
Symbol Limits Unit
Channel to ambient 125
°C/W / ELEMENT179
∗ Mounted on a ceramic board
∗
(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Drain
(4) Tr2 Source
(5) Tr2 Gate
(6) Tr1 Drain
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
∗2∗2
∗1
∗1
(1)
(6)
(3)
(4)
(2)
(5)
TUMT6
Abbreviated symbol : K02
0.2Max.

US6K2
Transistors
Rev.B 2/3
zElectrical characteristics (Ta=25°C)
<It is the same characteristics for the Tr1 and Tr2>
Parameter Symbol
IGSS
Yfs
Min.
−
Typ. Max. Unit Conditions
V(BR) DSS
IDSS
VGS (th)
RDS (on)
C
iss
Coss
Crss
td (on)
tr
td (off)
tf
Qg
Qgs
Qgd
∗
∗
∗
∗
∗
∗
∗
∗
∗
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
∗Pulsed
−10 µAV
GS=20V, VDS=0V
VDD 15V, VGS= 5V
30 −−VI
D= 1mA, VGS=0V
−−1µAV
DS= 30V, VGS=0V
1.0 −2.5 V VDS= 10V, ID= 1mA
−170 240 ID= 1.4A, VGS= 10V
−250 350 mΩ
mΩ
mΩ
ID= 1.4A, VGS= 4.5V
−270 380 ID= 1.4A, VGS= 4V
1−−SV
DS= 10V, ID= 1.4A
−70 −pF VDS= 10V
−15
12
−pF VGS=0V
−
6
−pF f=1MHz
−
6
−ns
−
13
−ns
−
8
−ns
−
1.4
−ns
−
0.6
2.0 nC
−
0.3
−nC ID= 1.4A
−−nC RL= 11Ω, RG= 10Ω
VDD 15V
I
D
= 0.7A
V
GS
= 10V
R
L
= 21Ω
R
G
=10Ω
zBody diode characteristics (Source-drain) (Ta=25°C)
<It is the same characteristics for the Tr1 and Tr2>
V
SD
−−1.2 V I
S
= 0.6A, V
GS
=0VForward voltage
Parameter Symbol Min. Typ. Max. Unit Conditions

US6K2
Transistors
Rev.B 3/3
GATE-SOURCE VOLTAGE : V
GS
(V)
0.001
0.01
0.1
1
10
0.5 1.0 2.01.5 4.02.5 3.0 3.5
DRAIN CURRENT : I
D
(A)
Fig.4 Typical Transfer Characteristics
V
DS
=10V
Pulsed
Ta=125°C
75°C
25°C
−25°C
SOURCE-DRAIN VOLTAGE : V
SD
(V)
0.0
0.01
0.1
1
10
0.5 1.0 1.5
SOURCE CURRENT : I
S
(A)
Fig.6 Source Current vs.
Source-Drain Voltage
V
GS
=0V
Pulsed
Ta=125°C
75°C
25°C
−25°C
DRAIN CURRENT : ID (A)
0.01
1
10
100
1000
0.1 1 10
SWITCHING TIME : t (ns)
Fig.2 Switching Characteristics
Ta=25°C
V
DD
=15V
V
GS
=10V
R
G
=10Ω
Pulsed
tf
td(off)
td(on)
tr
GATE-SOURCE VOLTAGE : V
GS
(V)
0
0
100
700
800
900
600
200
300
400
500
1000
210468
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS
(mΩ)
Fig.5 Static Drain-Source
On-State Resistance vs.
Gate source Voltage
Ta=25°C
Pulsed
I
D
=1.4A
I
D
=0.7A
zElectrical characteristics curves
DRAIN-SOURCE VOLTAGE : VDS (V)
0.01
1
10
100
1000
0.1 1 10 100
CAPACITANCE : C (pF)
Fig.1 Typical Capacitance
vs. Drain-Source Voltage
Ta=25°C
f=1MHz
V
GS
=0V
Ciss
Coss
Crss
TOTAL GATE CHARGE : Qg (nC)
0
0
1
2
3
4
5
10
6
7
8
9
123
GATE-SOURCE VOLTAGE : V
GS
(V)
Fig.3 Dynamic Input Characteristics
Ta=25°C
VDD=15V
ID=1.4A
RG=10Ω
Pulsed
DRAIN CURRENT : I
D
(A)
0.01
0.1
10
100
1000
10000
110
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS (on)
(mΩ)
Fig.7 Static Drain-Source
On-State Resistance
vs. Drain Current ( Ι )
V
GS
=10V
Pulsed
Ta=125°C
75°C
25°C
−25°C
DRAIN CURRENT : I
D
(A)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS (on)
(mΩ)
Fig.8 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙ )
0.01
0.1
10
100
1000
10000
110
V
GS
=4.5V
Pulsed
Ta=125°C
75°C
25°C
−25°C
DRAIN CURRENT : I
D
(A)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS (on)
(mΩ)
Fig.9 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙΙ )
0.01
0.1
10
100
1000
10000
110
V
GS
=4V
Pulsed
Ta=125°C
75°C
25°C
−25°C

Appendix
Appendix1-Rev1.1
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
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otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
