Dust Networks LM2610 802.15.4 Time Synchronous Mesh Network Mote User Manual

Dust Networks, Inc. 802.15.4 Time Synchronous Mesh Network Mote Users Manual

Users Manual

  Advanced Information    LM2610 User’s Guide Dust Networks™ 1   SMARTMESH® LM2610  2.4 GHz Ultra Low-power Embedded Network Manager User’s Guide  Product Description—LM2610 The LM2610 ultra low-power embedded network manager is ideal for small, remote wireless network applications that require both motes and the network manager to operate on battery or solar power. The LM2610 combines Dust Networks’ robust, Intelligent Networking Platform and industry-leading low-power radio technology in an easy-to-integrate embedded subsystem. The ultra low-power LM2610 is tailored for use in battery and solar powered gateways and controllers, and enables the deployment of low-power wireless sensor networks that deliver proven performance in the face of harsh RF and environmental conditions, enabling unattended operation for years at a time. Sophisticated network management algorithms deliver dynamic network optimization and intelligent routing to achieve carrier class reliability, lower latency, and deterministic power management. Additionally, the embedded network manager offers a comprehensive serial API to deliver rich and flexible functionality without complex coding. This API also provides full visibility and control over network configuration, security administration, network status, and performance statistics. The network-ready ultra low-power embedded manager enables OEMs to integrate advanced wireless sensor networking intelligence into monitoring and control solutions with low risk and rapid time-to-market.  Key Features Ultra-Low Power Operation • Low power consumption enables the manager to operate in solar or battery powered applications • Ideal for small, remote wireless network applications Intelligent Network Management • Dynamic network optimization—maintains network health and provides deterministic power management • Intelligent routing—lowers latency, reduces network power consumption and eliminates in-network collisions • Enables >99.9% network reliability even in the most challenging industrial environments  Global Market Solution • IEEE 802.15.4-certified radio operates on 2.4 GHz global license-free band • Configurable radio output—meets RF emission limits for different regions with a single product • Modular RF certifications pending for FCC, IC, CE Fast and Low Risk Integration • Comprehensive APIs deliver flexible functionality without complex coding • Fully integrated and certified RF capabilities—simply add an antenna
 Advanced Information  2  Dust Networks™ LM2610 User’s Guide  Table of Contents 1.0 Absolute Maximum Ratings ................................................................................3 2.0 Normal Operating Conditions .............................................................................3 3.0 Electrical Specifications .....................................................................................3 3.1 Radio ................................................................................................................ 4 3.1.1 Radio Specifications ...................................................................................... 4 3.1.2 Antenna Specifications................................................................................... 5 4.0 Interfaces ..........................................................................................................5 4.1 Hardware Interfaces ............................................................................................ 5 4.1.1 3V RS232 Interface ....................................................................................... 5 4.1.2 MuP JTAG .................................................................................................... 7 4.1.3 AP SPI+ ...................................................................................................... 7 4.2 Electrical Interface .............................................................................................. 8 4.2.1 J1 Board-to-board Pin Out.............................................................................. 8 4.2.1.1 Recommended Mating Connectors ............................................................... 8 4.2.2 J2 MuP JTAG Connector ................................................................................. 8 4.2.3 J6 AP SPI+ Connector.................................................................................... 9 5.0 Mechanical Specifications.................................................................................10 5.1 LM2610 Mechanical Drawings ..............................................................................10 6.0 Regulatory and Standards Compliance .............................................................11 6.1 FCC Compliance.................................................................................................11 6.1.1 FCC Testing ................................................................................................11 6.1.2 FCC-approved Antennas................................................................................12 6.1.3 OEM Labeling Requirements ..........................................................................12 6.2 IC Compliance ...................................................................................................12 6.2.1 IC Testing...................................................................................................12 6.2.2 IC-approved Antennas ..................................................................................12 6.2.3 OEM Labeling Requirements ..........................................................................12 6.3 CE Compliance ..................................................................................................13 6.3.1 Declaration of Conformity .............................................................................13 6.3.2 European Compliance ...................................................................................13 6.3.3 OEM Labeling Requirements ..........................................................................13 6.3.4 Restrictions.................................................................................................13 6.4 RoHS Compliance...............................................................................................13 6.5 Industrial Environment Operation .........................................................................13 7.0 Related Documentation ....................................................................................14 8.0 Ordering Information .......................................................................................14
Advanced Information     LM2610 User’s Guide Dust Networks™ 3 1.0 Absolute Maximum Ratings The absolute maximum ratings shown below should not be violated under any circumstances. Permanent damage to the device may be caused by exceeding one or more of these parameters. Table 1  Absolute Maximum Ratings Parameter  Min  Typ  Max  Units  Comments Supply voltage   –0.3    3.6  V   Voltage on Input Pins  –0.3    3.6  V   Input RF level      10  dBm  Input power at antenna connector Storage temperature range  –40    +85  °C   VSWR of antenna      3:1     ESD protection            Antenna connector      ±250  V  HBM  All other connectors      ±TBD  kV  HBM    ±TBD V CDM All voltages are referenced to VSS Caution! This is an ESD sensitive device. Use proper ESD handling procedures when working with the device to prevent permanent damage.   2.0 Normal Operating Conditions Table 2  Normal Operating Conditions Parameter  Min  Typ  Max  Units  Comments Operational supply voltage range (between VDD and VSS) 3.0 3.3 3.6  V This includes noise and load regulation. During power on, it is essential that the maximum VDD rise time defined in section Error! Reference source not found. is met.  Voltage supply noise      100  mVp-p  50 Hz–50 MHz Peak current      TBD  mA   Average current    TBD    mA  +3.3V, 25 °C Operating temperature range  –40    +85  °C   Maximum allowed temperature ramp during operation     8  °C/min  –40 °C to +85 °C Operating relative humidity  10    95  % RH  Non-condensing The specifications listed are for the power supply connected to VDD and VSS and apply over the operating temperature range unless otherwise specified. 3.0 Electrical Specifications I/O specifications are given below for each I/O level type given in the board-to-board connector tables in sections 4.1 and 4.2.1. Unless otherwise noted, supply voltage is 3.3 V and temperature range is –40 °C to +85 °C.
 Advanced Information  4  Dust Networks™ LM2610 User’s Guide 3.1 Radio 3.1.1 Radio Specifications Table 3  Radio Specifications Parameter  Min  Typ  Max  Units  Comments Frequency band  2.4000  2.4835 GHz  Number of channels    15       Channel separation    5    MHz   Occupied channel bandwidth    2.7    MHz  At –20 dBc Frequency accuracy  –40    +40  ppm   Modulation      IEEE 802.15.4 DSSS Raw data rate    250    Kbps   Receiver operating input level    0    dBm   Receiver sensitivity   TBD  dBm At 50% PER, VDD = 3 V,  25 °C    TBD  dBm At 1% PER, VDD = 3 V,  25 °C, (inferred by 50% PER measurement) Output power, conducted           Power amplifier enabled:             At 25 °C    +8    dBm                   Power amplifier disabled:               At 25 °C    –2    dBm                 Range*         Power amplifier enabled:            Indoor    100    m    Outdoor    300    m   Power amplifier disabled:           Indoor   25   m  25 °C, 50% RH, 1 meter above ground, +2 dBi omnidirectional antenna    Outdoor    200    m   * Actual RF range performance is subject to a number of installation-specific variables including, but not restricted to ambient temperature, relative humidity, presence of active interference sources, line-of-sight obstacles, near-presence of objects (for example, trees, walls, signage, and so on) that may induce multipath fading. As a result, actual performance varies for each instance.
Advanced Information     LM2610 User’s Guide Dust Networks™ 5 3.1.2 Antenna Specifications A MMCX-compatible jack receptacle is provided on board for the antenna connection. For antenna location, refer to the mechanical drawing in section 5.1. The antenna must meet specifications in Table 4. For a list of antennae pre-approved for RF certification, see section 6.1.2. Table 4  Antenna Specifications Parameter  Value Frequency range  2.4–2.4835 GHz Impedance  50 Ω Gain    LM2610-1  +2 dBi maximum Pattern Omni-directional Maximum VSWR  3:1 Connector MMCX* * The LM2610 can accommodate the following RF mating connectors: •  MMCX straight connector such as Johnson 135-3402-001, or equivalent •  MMCX right angle connector such as Tyco 1408149-1, or equivalent When the LM2610 is placed inside an enclosure, the antenna should be mounted such that the radiating portion of the antenna protrudes from the enclosure, and connected using a MMCX connector on a coaxial cable. For optimum performance, allow the antenna to be positioned vertically when installed. 4.0 Interfaces 4.1 Hardware Interfaces Table 5  Hardware Interface Summary Port  Description  Pins Serial UART 6-pin  RTS_T¯¯¯¯¯¯, CTS_T¯¯¯¯¯¯, TX,  RTS_R¯¯¯¯¯¯, CTS_R¯¯¯¯¯¯, RX, VSS  Reset  Active low reset input  RST¯¯¯¯ MuP JTAG  Programming & development of LM2610 code TMS¯¯¯¯, TCK TDI, TDO, VSS AP SPI+  Programming of the AP  FLASH_P_EN¯¯¯¯¯¯¯¯¯¯¯¯, SCK, MOSI, MISO,  SPI_CS¯¯¯¯¯¯¯, VDD, VSS 4.1.1 3V RS232 Interface The serial interface is designed for embedded integration with controllers. This serial interface provides programmatic access for configuration, management, and data access to the LM2610. The port is a 6-pin flow-controlled LVTTL (3.3 V) serial interface accessible through the board-to-board connector. Table 6  Serial Parameters Parameter  Value Bit rate  115200 Parity N Data bits  8 Stop bit  1 Flow control  Hardware handshake  Figure 1 illustrates the process that the LM2610 uses to transmit serial data: 1. The LM2610 ensures the interpacket_delay time has passed since the last transmission. 2. The LM2610 drives RTS_T¯¯¯¯¯  to active, waits for a falling edge on CTS_T¯¯¯¯¯ . Timeout is defined as ack_delay, and is long enough to handle the worst-case response.
 Advanced Information  6  Dust Networks™ LM2610 User’s Guide 3. If the LM2610 times out before the CTS_T¯¯¯¯¯  becomes active, the LM2610 restores RTS_T¯¯¯¯¯  to inactive and drops the packet. 4. If CTS_T¯¯¯¯¯  is active, the LM2610 transmits the packet.  5. RTS_T¯¯¯¯¯  is restored to inactive by the LM2610 after the ack_delay timeout has expired. tCTS_T to RTS_TtRTS_T to CTS_TTX 0x7EByte 00x7EtCTS_T to TXCTS_TRTS_T  Figure 1  Packet Transmission from LM2610  Figure 2 illustrates the process that the LM2610 uses to receive serial data: 1. The Customer Premise Equipment (CPE), ensures the interpacket_delay time has passed since the last transmission. 2. The CPE drives RTS_R¯¯¯¯¯  to active, waits for a falling edge on CTS_R¯¯¯¯¯ . Timeout is defined as ack_delay, and is long enough to handle the worst-case response. 3. If the CPE times out before the CTS_R¯¯¯¯¯  becomes active, the CPE restores RTS_R¯¯¯¯¯  to inactive and drops the packet. 4. If CTS_R¯¯¯¯¯  is active, then the CPE transmits the packet.  5. RTS_R¯¯¯¯¯  is restored to inactive by the CPE after the ack_delay timeout has expired.
Advanced Information     LM2610 User’s Guide Dust Networks™ 7 tCTS_R to RTS_RtRTS_R to CTS_RRX 0x7EByte 00x7EtCTS_R to RXCTS_RRTS_R  Figure 2  Packet Transmission to LM2610   Table 7  UART Timing Values Variable  Description  Min  Max  Units tRX_BAUD  Deviation from baud rate  -2  +2  % tRX_STOP  Number of stop bits (115.2 kbps)  1    bit period tTX_BAUD  Deviation from baud rate  -1  +1  % tTX_STOP  Number of stop bits  1    bit period tCTS_R to RTS_R Assertion of  CTS_R¯¯¯¯¯  to negation of RTS_R¯¯¯¯¯  0 10 ms tRTS_R to CTS_R Assertion of RTS_R¯¯¯¯¯  to assertion of  CTS_R¯¯¯¯¯   22 ms tCTS_R to RX Assertion of CTS_R¯¯¯¯¯  to start of byte  0 10 ms tCTS_T to RTS_T Assertion of  CTS_T¯¯¯¯¯  to negation of RTS_T¯¯¯¯¯  0 10 ms tRTS_T to CTS_T Assertion of RTS_T¯¯¯¯¯  to assertion of  CTS_T¯¯¯¯¯   22 ms tCTS_T to TX Assertion of CTS_T¯¯¯¯¯  to start of byte  0 10 ms tinterpacket_delay The sender of an HDLC packet must wait at least this amount of time before sending another packet 20  ms   4.1.2 MuP JTAG This interface can be used for programming the manager micro-processor (MuP) code image before an LM2610 is installed. The LM2610 J3 connector and pinout is compatible with the AT91SAM-ICE JTAG emulator, as described in http://www.atmel.com/dyn/resources/prod_documents/doc6206.pdf. 4.1.3 AP SPI+ This interface can be used for programming the LM2610 before it is installed. This interface is described in “Design for Manufacture” in the 040-0051DN2510 Integration Guide, and is implemented on the LM2610 J4 connector.
 Advanced Information  8  Dust Networks™ LM2610 User’s Guide 4.2 Electrical Interface 4.2.1 J1 Board-to-board Pin Out  Table 8  J1 Board-to-board Connector Pin Number Pin Name  I/O Direction  I/O Type  Comment 1 VDD  In  3.3 V ± 0.3V   2  NC  -  Do Not Connect  Reserved 3 VSS -    4  RTS_R¯¯¯¯¯¯ In 2  5 TX   Out  4  6  CTS_T¯¯¯¯¯¯   In 2  7  RTS_T¯¯¯¯¯¯ Out 2  8 VSS -    9  CTS_R¯¯¯¯¯¯ Out 2  10 RX  In  2  11 VSS -    12  RTS_A¯¯¯¯¯¯ Out 2 Reserved  13 TX_A   Out  2 Reserved 14  CTS_A¯¯¯¯¯¯   In** 2 Reserved 15  RTS_B¯¯¯¯¯¯   In** 2 Reserved 16 VSS -    17  CTS_B¯¯¯¯¯¯ Out 2 Reserved 18 RX_B  In  2 Reserved 19 VSS -    20  RST¯¯¯¯ In*  2  Active low MuP reset *The RST¯¯¯  input pin is internally pulled up. When driven low, the LM2610 is hardware reset until the signal is de-asserted. Refer to section Error! Reference source not found. for timing requirements on the RST¯¯¯  pin.  ** These pins are internally pulled up.  4.2.1.1 Recommended Mating Connectors The LM2610’s J1 connector is FCIConnect’s Rib-Cage connectors for reliability in high vibration environments (87024-610TRLF). The mating connector options for this connector are shown in the table below. Table 9  Recommended Mating Connectors Connector  Mated Height (mm) FCI 87409-110LF  5.74 FCI 90098-110LF  7.57 FCI 73547-110LF  9.25  4.2.2 J2 MuP JTAG Connector The MuP JTAG connector is provided as the mechanism for loading the MuP software in production. The interface is designed to be compatible with a programming solution provided by IAR Systems.
Advanced Information     LM2610 User’s Guide Dust Networks™ 9 Table 10  J2 MuP JTAG Connector Pin Number Pin Name  I/O Direction  I/O Type  Comment 1 VDD  In  3.3 V ± 0.3V  Supply 2 VDD  In  3.3 V ± 0.3V  Supply 3  Logic 1  Out  3.3V ± 0.3V   4 VSS -    5  TDI  -  2  JTAG test data in 6 VSS -    7  TMS¯¯¯¯ -  2  JTAG test mode select 8 VSS -    9 TCK  -  2 JTAG test clock 10 VSS -    11 TCK*  -  2 JTAG test clock 12 VSS -    13  TDO  -  2  JTAG test data out 14 VSS -    15  RST¯¯¯¯ In  2  Active low MuP reset 16 VSS -    17 VSS -    18 VSS -    19 VSS -    20 VSS -     4.2.3 J6 AP SPI+ Connector The AP SPI+ connector is provided as the mechanism for loading the AP software in production.  Table 11  J6 AP SPI+ Connector Pin Number Pin Name  I/O Direction  I/O Level  Comment 1  SPI_CS¯¯¯¯¯¯¯ In*  3  SPI chip select 2  FLASH_P_EN¯¯¯¯¯¯¯¯¯¯¯¯ In*  1  SPI flash program enable 3 SCK  In*  3 Serial clock 4  MOSI  In*  3  Serial data in 5  MISO  Out  3  Serial data out 6  AP_RST¯¯¯¯¯¯¯ In 1 Access point reset 7 VDD  In  3.3 V ± 0.3V  Supply 8 VSS -    9 NC  -   Reserved 10  RST¯¯¯¯ In  2  Active low MuP reset
 Advanced Information  10  Dust Networks™ LM2610 User’s Guide  5.0 Mechanical Specifications 5.1 LM2610 Mechanical Drawings     Figure 3  LM2610 (Top)
Advanced Information     LM2610 User’s Guide Dust Networks™ 11   Figure 4  LM2610 (Side and Bottom)  6.0 Regulatory and Standards Compliance 6.1 FCC Compliance 6.1.1 FCC Testing The LM2610 Embedded Manager will be tested for compliance with Part 15.247 modular (Intentional Radiator) of the FCC rules and regulations. In order to fulfill FCC certification requirements, products incorporating the LM2610 Embedded Manager must comply with the following: 1.  An external label must be provided on the outside of the final product enclosure specifying the FCC identifier, as described in section 6.1.3 below. 2.  The antenna must be electrically identical to the FCC-approved antenna specifications for the LM2610 as described in 6.1.2, with the exception that the gain may be lower than specified in Table 12. 3.  The device integrating the LM2610 may not cause harmful interference, and must accept any interference received, including interference that may cause undesired operation. 4.  An unintentional radiator scan must be performed on the device integrating the LM2610 Embedded Manager, per FCC rules and regulations, CFR Title 47, Part 15, Subpart B. See FCC rules for specifics on requirements for declaration of conformity. Any changes or modifications to the LM2610 not expressly approved by the party responsible for compliance could void the authority to operate the equipment. .
 Advanced Information  12  Dust Networks™ LM2610 User’s Guide 6.1.2 FCC-approved Antennas The following are FCC-approved antenna specifications for the LM2610. Table 12  FCC-approved Antenna Specifications for the LM2610 Gain  Pattern  Polarization  Frequency  Connector +2 dBi maximum  Omnidirectional  Vertical  2.4–2.4835 GHz  MMCX  6.1.3 OEM Labeling Requirements The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. The outside of the final product enclosure must have a label with the following (or similar) text specifying the FCC identifier. The FCC ID and certification code must be in Latin letters and Arabic numbers and visible without magnification.  Contains transmitter module FCC ID: SJC-LM2610 or  Contains FCC ID: SJC-LM2610  6.2 IC Compliance 6.2.1 IC Testing The LM2610 will be certified for modular Industry Canada (IC) RSS-210 approval. The OEM is responsible for its product to comply with IC ICES-003 and FCC Part 15, Sub. B - Unintentional Radiators. The requirements of ICES-003 are equivalent to FCC Part 15 Sub. B and Industry Canada accepts FCC test reports or CISPR 22 test reports for compliance with ICES-003.  6.2.2 IC-approved Antennas The LM2610 has been designed to operate with the antenna characteristics shown in  Table 13. Antennas not included in this list or having a gain greater than shown in  Table 13 are strictly prohibited for use with this device.  The required antenna impedance is 50 Ohms.  To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.  Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.  Table 13  IC-approved Antenna Specifications for the LM2610 Gain  Pattern  Polarization  Frequency  Connector +2 dBi maximum  Omnidirectional  Vertical  2.4–2.4835 GHz  MMCX  6.2.3 OEM Labeling Requirements The Original Equipment Manufacturer (OEM) must ensure that IC labeling requirements are met. The outside of the final product enclosure must have a label with the following (or similar) text specifying the IC identifier. The IC ID and certification code must be in Latin letters and Arabic numbers and visible without magnification.  Contains IC: 5853-LM2610
Advanced Information     LM2610 User’s Guide Dust Networks™ 13 6.3 CE Compliance 6.3.1 Declaration of Conformity The LM2610 will be tested for conformity with the appropriate standards ETSI EN 300 328, ETSI EN 301 489-17 and EN 60950-1, following the provisions of Radio Equipment and Telecommunication Terminal Equipment directive 99/5/EC with requirements covering EMC directive 89/336/EEC, and low voltage directive 2006/95/EEC. 6.3.2 European Compliance If the LM2610 manager is incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and low-voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. Furthermore, the manufacturer must maintain a copy of this LM2610 user documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. 6.3.3 OEM Labeling Requirements The ‘CE’ marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials “CE” taking the following form:  If the CE marking is reduced or enlarged, the proportions given in the drawing below must be respected.  The CE marking must have a height of at least 5 mm except where this is not possible because of the nature of the apparatus.  The CE marking must be affixed visibly, legibly, and indelibly. Furthermore, since the usage of the 2400 – 2483.5 MHz band is not harmonized throughout Europe, the Restriction sign must be placed to the right of the ‘CE’ marking as shown below. See the R&TTE Directive, Article 12 and Annex VII for more information.  Figure 5  CE Label Requirements 6.3.4 Restrictions Norway prohibits operation near Ny-Alesund in Svalbard. More information can be found at the Norway Posts and Telecommunications site (www.npt.no). 6.4 RoHS Compliance Restriction of Hazardous Substances (RoHS) is a directive that places maximum concentration limits on the use of cadmium (Cd), lead (Pb), hexavalent chromium(Cr+6), mercury (Hg), Polybrominated Biphenyl(PBB) and Polybrominated Diphenyl Ethers (PBDE). Dust Networks is committed to meeting the requirements of the European Community directive 2002/95/EC.  This product has been specifically designed to utilize RoHS compliant materials and to eliminate, or reduce, the use of restricted materials to comply with 2002/95/EC. The Dust Networks RoHS compliant design features include: • RoHS compliant solder for solder joints  • RoHS compliant base metal alloys  • RoHS compliant precious metal plating • RoHS compliant cable assemblies and connector choices  6.5 Industrial Environment Operation The LM2610 is designed to meet the requirements of harsh industrial environments, which includes: • Shock and Vibration—The LM2610 complies with high vibration pipeline testing, as specified in IEC 60770-1. • Temperature Extremes—The LM2610 is designed for industrial storage and operational temperature  range of –40 °C to +85 °C.
 Advanced Information  14  Dust Networks™ LM2610 User’s Guide 7.0 Related Documentation • Called out inline as referenced. 8.0 Ordering Information Product List: LM2610: TBD Contact Information: Dust Networks 30695 Huntwood Ave. Hayward, CA 94544 Toll-Free Phone: 1 (866) 289-3878 Website: www.dustnetworks.com Email: sales@dustnetworks.com
Advanced Information     LM2610 User’s Guide Dust Networks™ 15 Trademarks Dust Networks™, the Dust Networks logo, SmartMesh-XR™, SmartMesh-XD™, SmartMesh IA-510, mesh-to-the-edge™, and Mote-on-Chip™ are trademarks of Dust Networks, Inc. Dust® and SmartMesh® are registered trademarks of Dust Networks, Inc. All third-party brand and product names are the trademarks of their respective owners and are used solely for informational purposes. Copyright This documentation is protected by United States and international copyright and other intellectual and industrial property laws. It is solely owned by Dust Networks, Inc. and its licensors and is distributed under a restrictive license. This product, or any portion thereof, may not be used, copied, modified, reverse assembled, reverse compiled, reverse engineered, distributed, or redistributed in any form by any means without the prior written authorization of Dust Networks, Inc. RESTRICTED RIGHTS: Use, duplication, or disclosure by the U.S. Government is subject to restrictions of FAR 52.227-14(g) (2)(6/87) and FAR 52.227-19(6/87), or DFAR 252.227-7015 (b)(6/95) and DFAR 227.7202-3(a), and any and all similar and successor legislation and regulation. Disclaimer This documentation is provided “as is” without warranty of any kind, either expressed or implied, including but not limited to, the implied warranties of merchantability or fitness for a particular purpose. This documentation might include technical inaccuracies or other errors. Corrections and improvements might be incorporated in new versions of the documentation. Dust Networks does not assume any liability arising out of the application or use of any products or services and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Dust Networks products are not designed for use in life support appliances, devices, or other systems where malfunction can reasonably be expected to result in significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Dust Networks customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify and hold Dust Networks and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Dust Networks was negligent regarding the design or manufacture of its products. Dust Networks reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its products or services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to Dust Network's terms and conditions of sale supplied at the time of order acknowledgment or sale. Dust Networks does not warrant or represent that any license, either express or implied, is granted under any Dust Networks patent right, copyright, mask work right, or other Dust Networks intellectual property right relating to any combination, machine, or process in which Dust Networks products or services are used. Information published by Dust Networks regarding third-party products or services does not constitute a license from Dust Networks to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from Dust Networks under the patents or other intellectual property of Dust Networks.   © Dust Networks, Inc., 2008. All Rights Reserved.  Document number:  040-0062 rev 2 LM2610 User’s Guide  Last Revised:  September 4, 2008  Document Status  Product Status  Definition Advanced Information Planned or under development  This document contains the design specifications for product development. Dust Networks reserves the right to change specifications in any manner without notice. Preliminary  Engineering samples and  pre-production prototypes  This document contains preliminary data; supplementary data will be published at a later time. Dust Networks reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. The product is not fully qualified at this point. No Identification Noted  Full production  This document contains the final specifications. Dust Networks reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Obsolete  Not in production  This document contains specifications for a product that has been discontinued by Dust Networks. The document is printed for reference information only.

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