Edifier EDF54 5.8G Wireless Audio Transceiver/Receiver Module User Manual
Edifier International Limited 5.8G Wireless Audio Transceiver/Receiver Module
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- 1. User Manual
- 2. Users Manual_Statement
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User Manual
深圳市燊利创科技有限公司 SENRITRON ELECTRONICS CO., LTD 深圳市龙华新区民治街道向南大厦2楼201-203 518131 品名(Product): 5.8G 模组 模组型号(Manufactured Part No.):EV01S RX 软件版本(Software Version): RX : V2B 客户物料编号:OT-056-000001-01 说明: 双方确认之产品,封存样品随承认书装订附上. 附录为产品规格书,有同等确认效力.一式两份 双方签署盖章各保存一份. 承 认 印 Signature for Approval 燊利创 Senritron 客 户 Customer EV01S Rx Subwoofer Module 承認書 Version: 1.0 Subject to change without further notice. 2017/04/11 Everestek Inc. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. INDEX Spec .........................................................................................................................................................3 Features ....................................................................................................................................................3 Application ..............................................................................................................................................3 Electrical Specifications ..........................................................................................................................4 Mechanical Specification ........................................................................................................................5 Application ..............................................................................................................................................6 Block Diagram .........................................................................................................................................7 Module Pin Definition .............................................................................................................................8 Reference Schematics ..............................................................................................................................8 Sticker and Package ...............................................................................................................................10 Revision History ....................................................................................................................................12 1. Spec Module FW Main Chip RF Modulation 2. EV01S SUREV2B703135E56 ETK51 5.8GHz FSK Features Radio Frequency: 5.8GHz unlicensed bands Uncompressed Audio Short Audio Latency: < 13ms (analog to analog) Link Distance: up to 40 Meters Advanced RF Selection Algorithm Small RF Foot Print Best Coexistence with Wi-Fi/Bluetooth Highly Integrated SoC: RF/PA/CPU/Flash Embedded Wide-Band Antenna on Module Short RBOM List RF Modulation: FSK Digital I2S (master or slave) Audio Interface, 16/24bit , 32/44.1/48KHz Sampling Rate Low Power Consumption Supply Voltage: 2.7~3.6V Support I2C master/slave mode and SPI/UART Optional module version with MHF connector for external antenna Compliant with EMC Regulations (FCC/CE) 3. Application Wireless Soundbar/Subwoofer 4. Electrical Specifications RF Specification Item Min Typ Max Unit Note RF Carrier Frequency 5725 ─ 5820 MHz For 5.8Ghz ─ ─ MHz -20dB bandwidth dBm -81 dBm Output Power RF Sensitivity ─ Audio Specification(I2S to I2S) Item Min Typ Max Unit Note SNR 142 dB @1kHz THD + N -135 dB @1kHz KHz -140 dB @1kHz Note Frequency response Dynamic range Programmable, <=6KHz Operation Condition Item Min Typ Max Unit VDD 2.7 3.3 3.6 Power Supply Voltage Operating Temperature -5 25 60 °C Ambient temperature Typ Max Unit Note Output power 7dBm Electrical Specification (MCU+RF) Item Min Transmitter current 47 mA Receiver current 45 mA mA Crystal enable, timer or interrupt wake up system Max Unit Note sleep mode Digital interface Item Min Typ VIH 0.7VDD VDD+0.2 Input High Threshold VIL VSS 0.3VDD Input Low Threshold VOH VDD-0.3 VDD Output High Threshold VOL 0.3 Output Low Threshold 5. Mechanical Specification Dimension:34 mm x 18 mm PCB 4 Layers Mechanical Drawing: Bottom view Antenna Area No trace, ground, power copper underneath this area! 11 2 (use plastic screw only) 18 34 25 16.5 1.27 13 25 1.27 5.5 4.7 14 26 (0, 0) Connector Drawing: The no copper area is showed below in pink color. The main board layout should no copper, no trace underneath this area. 6. Application Blue Tooth I2C EV01 Module I2S Soundbar 5.8G RF External MCU I2S EV01 Module I2C External Power Stage Control signal Buttons / LED Subwoofer 7. Block Diagram Low pass filter RFN_RX Balun RFP_RX ETK51 Low pass filter RFP_TX Balun RFN_TX VDDPA PA Bias Connector 8. Pin 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 9. Module Pin Definition Name VDD DGND CODEC_12M P2.0 P2.1 P2.6_PWM P2.7_PWM P0.2_UART_TXD I/O I/O I/O I/O I/O I/O Function Definition VDD (2.7V~3.6V) System ground For audio codec system clock(12.288MHz or 11.2896MHz) GPIO GPIO GPIO or PWM GPIO or PWM GPIO or UART TXD GPIO and SPI chip select for programming internal flash P0.7_SPI_CS I/O, C mode, or Arm Debug port P0.3_UART_RXD_Debug I/O General I/O or UART RXD, ARM debug port DGND System ground DGND System ground General I/O and SPI SCK for SPI in programming internal P0.6_SPI_SCK I/O flash mode, or Arm Debug port P3.2_ADC_IN I/O, A GPIO or ADC input General I/O and SPI MISO for SPI in programming P0.5_SPI_MISO I/O, C internal flash mode, or Arm Debug port Program mode select, active high, default pull low FLASH_PROG For programming internal flash memory Please leave this pin float for normal operation. General I/O and SPI MOSI for SPI in programming internal P0.4_SPI_MOSI I/O, C flash mode, or Arm Debug port P0.0_I2C_SCL I/O General I/O, I2C clock P0.1_I2C_SDA I/O General I/O, I2C data P3.1_ADC_IN I/O, A GPIO or ADC input P3.0_ADC_IN I/O, A GPIO or ADC input I2S_PCM_LRCK I/O I2S LRCK(input for I2S slave, output for I2S master) DGND Power ground I2S_PCM_BCK I/O I2S BCK(input for I2S slave, output for I2S master) I2S_PCM_DIN I/O I2S Data in(from audio codec, or from ADC I2S DATA out) I2S_PCM_DOUT I/O I2S Data out(to audio codec, or to DAC I2S DATA in) Note: P:Power, I/O:GPIO, S:System use only, A:DAC/ADC, C:control Reference Schematics I2S_PCM_BCK I2S_PCM_LRCK I2S_PCM_DOIN 41 I2S_PCM_DOUT JTAG_M FLASH_PROG 42 CODEC_12M FLASH_WP 43 RX_EN TP12 GPIO_P2.4 TP_0.8MM RX_EN VDD_3V C38 37 P1.3 38 I2S_DOUT1 35 I2S_DOUT2 34 GPIO_P2.4 33 GPIO_P2.6_PWM 32 GPIO_P2.7_PWM 31 I2C_SCL 30 I2C_SDA I2C_SCL CDVDD P0.2_UART_TXD 28 P0.3_UART_RXD_Debug 27 RSTN VDD_3V C42 26 25 I2C_SDA 0.1uF C_0402 DGND C11 1uF C_0402 DGND 24 23 22 21 C54 0.5pF C_0201 29 LBD RFN_TX DGND GND GND P1.2 VDD3V P0.4 RFP_TX P0.5 RSTN P0.6 RFP_RX P0.7 P0.3 P3.0 RFN_RX 20 P0.2 VDDPA 12 L9 1.0nH L_0201 ANT DGND L8 2.2nH L_0201 C53 0.5pF C_0201 VDD3V 13 C56 NC/9pF C_0201 P0.1 19 10 11 PCB_ANT P0.0 XTAL_N P3.1 C25 0.5pF C_0201 IN 39 U8 ETK51 XTAL_P 5V_IN ANT2 40 P2.7 3V_OUT L17 1.0nH L_0201 P1.1 VDD3V 16 1uF C_0402 DGND C52 4.7pF C_0201 P1.0 P2.6 15 C20 0.5pF C_0201 DGND XTAL_N JTAG_M EAR_LN 36 MQFN48_0.5_7X7 DGND L6 1.6nH L_0201 PROG_M P2.4 VDD3V C36 NC C_0201 WP EAR_LP 14 PCB_ANT XTAL_P 44 P2.1 IN CLK12M RX_EN TX_EN 45 46 VDD_3V C6 47 P2.0 EAR_RP P3.2 C19 0.8pF C_0201 EAR_LN L5 1.2nH L_0201 EAR_RN 18 L12 0R L_0201 EAR_LP C55 NC/9pF C_0201 C16 9pF C_0201 EAR_RP 17 ANT DGND DGND ANT1 EAR_RN GND GND VbgDAC GND A1 MHF DGND VDD3V DGND 49 DGND 48 C13 1uF C_0402 0.1uF C_0402 DGND DGND DGND A2 MHF C34 4.7pF C_0201 C24 0.1uF C_0402 XTAL_P DGND C3 4.7uF C_0603 SPI_MOSI SPI_SCK SPI_CS SPI_MISO C45 12pF C_0402 P3.0_ADC_IN C44 12pF C_0402 P3.1_ADC_IN DGND VDD_3V LBD TP1 3V TP_1.0MM R1 0R/NC R_0402 VDD_IN P3.2_ADC_IN XTAL_N VDD_3V DGND U7 XTAL16MHZ XTAL_3.2X2.5MM C51 100nF C_0201 DGND DGND J1 26pin_Connector VDD_IN TP2 EAR_LN TP_0.8MM TP3 EAR_LP TP_0.8MM TP4 EAR_RP TP_0.8MM TP5 EAR_RN TP_0.8MM TP6 FLASH_WPTP_0.8MM TP7 JTAG_M TP_0.8MM TP8 RSTN TP_0.8MM TP9 LBD TP_0.8MM EAR_LN DGND EAR_LP CODEC_12M I2S_DOUT1 EAR_RP I2S_DOUT2 GPIO_P2.7_PWM GPIO_P2.6_PWM EAR_RN FLASH_WP P0.2_UART_TXD JTAG_M SPI_CS 10 P0.3_UART_RXD_Debug RSTN DGND 11 12 DGND LBD TP10 GPIO_P2.4 TP_0.8MM SPI_SCK SPI_MISO SPI_MOSI I2C_SDA P3.0_ADC_IN DGND I2S_PCM_DOIN 13 14 15 16 17 18 19 20 21 22 23 24 25 26 GPIO_P2.4 P3.2_ADC_IN FLASH_PROG I2C_SCL P3.1_ADC_IN I2S_PCM_LRCK I2S_PCM_BCK I2S_PCM_DOUT H1 SC1 SC2 SC_PAD SC_PAD PIN_2X13_1.27MM_SMD H_2.0mm DGND BOM: Items Type 1 C CHIP 2 C CHIP Package Spec 0201 0.5pF±0.1pF_25V 0201 0.8pF±0.1pF_25V Quantity Part ref C20,C25,C53,C54 C19 Remark 3 10 11 12 13 14 15 16 17 18 10. C CHIP C CHIP C CHIP C CHIP C CHIP C CHIP C CHIP L CHIP L CHIP L CHIP L CHIP R CHIP R CHIP 26pin_Connector XTAL ETK51 C CHIP C CHIP MHF 0201 0201 0201 0402 0402 0402 0603 0201 0201 0201 0201 0201 0402 0201 0201 4.7pF±0.25pF_25V 9pF±0.25pF_25V 100nF±10%_6.3V 100nF±10%_6.3V 1uF-20%~+80%_6.3V 12pF±5%_50V 4.7uF-20%~+80%_6.3V 1nH±0.3nH 1.2nH±0.3nH 1.6nH±0.3nH 2.2nH±0.3nH 0R±5% 0R±5%_ 1/16W PIN_2X13_1.27MM_SMD XTAL16MHZ MQFN48_0.5_7X7 9pF±0.25pF_25V NC 0201 MHF_3.1X3_SMD Sticker and Package The 1st Line: Module Model Number The 2nd Line: F/W Version The 3rd Line: Serial Number C34,C52 C16 C51 C6,C24,C42 C11,C13,C38 C44,C45 C3 L9,L17 L5 L6 L8 L12 R1 J1 U7 U8 C55,C56 C36 A1,A2 NC NC NC 11. Revision History Date 2017/04/10 Revision 1.0 Descriptions Initial Version
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