Edifier EDF54 5.8G Wireless Audio Transceiver/Receiver Module User Manual

Edifier International Limited 5.8G Wireless Audio Transceiver/Receiver Module

User Manual

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Document ID3526427
Application IDT2hbhtRW486JoP8Am2Q6ag==
Document DescriptionUser Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize84.03kB (1050422 bits)
Date Submitted2017-08-25 00:00:00
Date Available2017-08-25 00:00:00
Creation Date2017-04-17 15:41:21
Producing SoftwareAdobe Acrobat Pro 11.0.5
Document Lastmod2017-04-17 15:41:21
Document TitleUser Manual
Document CreatorAdobe Acrobat Pro 11.0.5
Document Author: oy

深圳市燊利创科技有限公司
SENRITRON ELECTRONICS CO., LTD
深圳市龙华新区民治街道向南大厦2楼201-203 518131
品名(Product): 5.8G 模组
模组型号(Manufactured Part No.):EV01S RX
软件版本(Software Version): RX : V2B
客户物料编号:OT-056-000001-01
说明: 双方确认之产品,封存样品随承认书装订附上.
附录为产品规格书,有同等确认效力.一式两份
双方签署盖章各保存一份.
承 认 印
Signature for Approval
燊利创
Senritron
客 户
Customer
EV01S Rx
Subwoofer Module
承認書
Version: 1.0
Subject to change without further notice.
2017/04/11
Everestek Inc.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
INDEX
Spec .........................................................................................................................................................3
Features ....................................................................................................................................................3
Application ..............................................................................................................................................3
Electrical Specifications ..........................................................................................................................4
Mechanical Specification ........................................................................................................................5
Application ..............................................................................................................................................6
Block Diagram .........................................................................................................................................7
Module Pin Definition .............................................................................................................................8
Reference Schematics ..............................................................................................................................8
Sticker and Package ...............................................................................................................................10
Revision History ....................................................................................................................................12
1.
Spec
Module
FW
Main Chip
RF
Modulation
2.
EV01S
SUREV2B703135E56
ETK51
5.8GHz
FSK
Features

Radio Frequency: 5.8GHz unlicensed bands

Uncompressed Audio

Short Audio Latency: < 13ms (analog to analog)

Link Distance: up to 40 Meters

Advanced RF Selection Algorithm

Small RF Foot Print

Best Coexistence with Wi-Fi/Bluetooth

Highly Integrated SoC: RF/PA/CPU/Flash Embedded

Wide-Band Antenna on Module

Short RBOM List

RF Modulation: FSK

Digital I2S (master or slave) Audio Interface, 16/24bit , 32/44.1/48KHz Sampling Rate

Low Power Consumption

Supply Voltage: 2.7~3.6V

Support I2C master/slave mode and SPI/UART

Optional module version with MHF connector for external antenna

Compliant with EMC Regulations (FCC/CE)
3.
Application

Wireless Soundbar/Subwoofer
4.
Electrical Specifications
RF Specification
Item
Min
Typ
Max
Unit
Note
RF Carrier Frequency
5725
─
5820
MHz
For 5.8Ghz
─
─
MHz
-20dB bandwidth
dBm
-81
dBm
Output Power
RF Sensitivity
─
Audio Specification(I2S to I2S)
Item
Min
Typ
Max
Unit
Note
SNR
142
dB
@1kHz
THD + N
-135
dB
@1kHz
KHz
-140
dB
@1kHz
Note
Frequency response
Dynamic range
Programmable, <=6KHz
Operation Condition
Item
Min
Typ
Max
Unit
VDD
2.7
3.3
3.6
Power Supply Voltage
Operating
Temperature
-5
25
60
°C
Ambient temperature
Typ
Max
Unit
Note
Output power 7dBm
Electrical Specification (MCU+RF)
Item
Min
Transmitter current
47
mA
Receiver current
45
mA
mA
Crystal enable, timer or interrupt
wake up system
Max
Unit
Note
sleep mode
Digital interface
Item
Min
Typ
VIH
0.7VDD
VDD+0.2
Input High Threshold
VIL
VSS
0.3VDD
Input Low Threshold
VOH
VDD-0.3
VDD
Output High Threshold
VOL
0.3
Output Low Threshold
5.
Mechanical Specification



Dimension:34 mm x 18 mm
PCB 4 Layers
Mechanical Drawing:
Bottom view
Antenna Area
No trace, ground, power copper underneath this area!
11
2 (use plastic
screw only)
18
34
25
16.5
1.27
13
25
1.27
5.5
4.7
14
26
(0, 0)

Connector Drawing:
The no copper area is showed below in pink color. The main board layout should no copper, no trace
underneath this area.
6.
Application
Blue Tooth
I2C
EV01
Module
I2S
Soundbar
5.8G
RF
External MCU
I2S
EV01
Module
I2C
External Power Stage
Control signal
Buttons / LED
Subwoofer
7.
Block Diagram
Low
pass
filter
RFN_RX
Balun
RFP_RX
ETK51
Low
pass
filter
RFP_TX
Balun
RFN_TX
VDDPA
PA
Bias
Connector
8.
Pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
9.
Module Pin Definition
Name
VDD
DGND
CODEC_12M
P2.0
P2.1
P2.6_PWM
P2.7_PWM
P0.2_UART_TXD
I/O
I/O
I/O
I/O
I/O
I/O
Function Definition
VDD (2.7V~3.6V)
System ground
For audio codec system clock(12.288MHz or 11.2896MHz)
GPIO
GPIO
GPIO or PWM
GPIO or PWM
GPIO or UART TXD
GPIO and SPI chip select for programming internal flash
P0.7_SPI_CS
I/O, C
mode, or Arm Debug port
P0.3_UART_RXD_Debug
I/O
General I/O or UART RXD, ARM debug port
DGND
System ground
DGND
System ground
General I/O and SPI SCK for SPI in programming internal
P0.6_SPI_SCK
I/O
flash mode, or Arm Debug port
P3.2_ADC_IN
I/O, A GPIO or ADC input
General I/O and SPI MISO for SPI in programming
P0.5_SPI_MISO
I/O, C
internal flash mode, or Arm Debug port
Program mode select, active high, default pull low
FLASH_PROG
For programming internal flash memory
Please leave this pin float for normal operation.
General I/O and SPI MOSI for SPI in programming internal
P0.4_SPI_MOSI
I/O, C
flash mode, or Arm Debug port
P0.0_I2C_SCL
I/O
General I/O, I2C clock
P0.1_I2C_SDA
I/O
General I/O, I2C data
P3.1_ADC_IN
I/O, A GPIO or ADC input
P3.0_ADC_IN
I/O, A GPIO or ADC input
I2S_PCM_LRCK
I/O
I2S LRCK(input for I2S slave, output for I2S master)
DGND
Power ground
I2S_PCM_BCK
I/O
I2S BCK(input for I2S slave, output for I2S master)
I2S_PCM_DIN
I/O
I2S Data in(from audio codec, or from ADC I2S DATA out)
I2S_PCM_DOUT
I/O
I2S Data out(to audio codec, or to DAC I2S DATA in)
Note: P:Power, I/O:GPIO, S:System use only, A:DAC/ADC, C:control
Reference Schematics
I2S_PCM_BCK
I2S_PCM_LRCK
I2S_PCM_DOIN
41
I2S_PCM_DOUT
JTAG_M
FLASH_PROG
42
CODEC_12M
FLASH_WP
43
RX_EN
TP12
GPIO_P2.4 TP_0.8MM
RX_EN
VDD_3V
C38
37
P1.3
38
I2S_DOUT1
35
I2S_DOUT2
34
GPIO_P2.4
33
GPIO_P2.6_PWM
32
GPIO_P2.7_PWM
31
I2C_SCL
30
I2C_SDA
I2C_SCL
CDVDD
P0.2_UART_TXD
28
P0.3_UART_RXD_Debug
27
RSTN
VDD_3V C42
26
25
I2C_SDA
0.1uF
C_0402
DGND
C11
1uF
C_0402
DGND
24
23
22
21
C54
0.5pF
C_0201
29
LBD
RFN_TX
DGND
GND GND
P1.2
VDD3V
P0.4
RFP_TX
P0.5
RSTN
P0.6
RFP_RX
P0.7
P0.3
P3.0
RFN_RX
20
P0.2
VDDPA
12
L9
1.0nH
L_0201
ANT
DGND
L8
2.2nH
L_0201
C53
0.5pF
C_0201
VDD3V
13
C56
NC/9pF
C_0201
P0.1
19
10
11
PCB_ANT
P0.0
XTAL_N
P3.1
C25
0.5pF
C_0201
IN
39
U8
ETK51
XTAL_P
5V_IN
ANT2
40
P2.7
3V_OUT
L17
1.0nH
L_0201
P1.1
VDD3V
16
1uF
C_0402
DGND
C52
4.7pF
C_0201
P1.0
P2.6
15
C20
0.5pF
C_0201
DGND
XTAL_N
JTAG_M
EAR_LN
36
MQFN48_0.5_7X7
DGND
L6
1.6nH
L_0201
PROG_M
P2.4
VDD3V
C36
NC
C_0201
WP
EAR_LP
14
PCB_ANT
XTAL_P
44
P2.1
IN
CLK12M
RX_EN
TX_EN
45
46
VDD_3V C6
47
P2.0
EAR_RP
P3.2
C19
0.8pF
C_0201
EAR_LN
L5
1.2nH
L_0201
EAR_RN
18
L12
0R
L_0201
EAR_LP
C55
NC/9pF
C_0201
C16
9pF
C_0201
EAR_RP
17
ANT
DGND
DGND
ANT1
EAR_RN
GND GND
VbgDAC
GND
A1
MHF
DGND
VDD3V
DGND
49
DGND
48
C13
1uF
C_0402
0.1uF
C_0402
DGND
DGND
DGND
A2
MHF
C34
4.7pF
C_0201
C24
0.1uF
C_0402
XTAL_P
DGND
C3
4.7uF
C_0603
SPI_MOSI
SPI_SCK
SPI_CS
SPI_MISO
C45
12pF
C_0402
P3.0_ADC_IN
C44
12pF
C_0402
P3.1_ADC_IN
DGND
VDD_3V
LBD
TP1
3V
TP_1.0MM
R1
0R/NC
R_0402
VDD_IN
P3.2_ADC_IN
XTAL_N
VDD_3V
DGND
U7
XTAL16MHZ
XTAL_3.2X2.5MM
C51
100nF
C_0201
DGND
DGND
J1
26pin_Connector
VDD_IN
TP2
EAR_LN
TP_0.8MM
TP3
EAR_LP
TP_0.8MM
TP4
EAR_RP
TP_0.8MM
TP5
EAR_RN
TP_0.8MM
TP6
FLASH_WPTP_0.8MM
TP7
JTAG_M
TP_0.8MM
TP8
RSTN
TP_0.8MM
TP9
LBD
TP_0.8MM
EAR_LN
DGND
EAR_LP
CODEC_12M
I2S_DOUT1
EAR_RP
I2S_DOUT2
GPIO_P2.7_PWM
GPIO_P2.6_PWM
EAR_RN
FLASH_WP
P0.2_UART_TXD
JTAG_M
SPI_CS
10
P0.3_UART_RXD_Debug
RSTN
DGND
11
12
DGND
LBD
TP10 GPIO_P2.4 TP_0.8MM
SPI_SCK
SPI_MISO
SPI_MOSI
I2C_SDA
P3.0_ADC_IN
DGND
I2S_PCM_DOIN
13
14
15
16
17
18
19
20
21
22
23
24
25
26
GPIO_P2.4
P3.2_ADC_IN
FLASH_PROG
I2C_SCL
P3.1_ADC_IN
I2S_PCM_LRCK
I2S_PCM_BCK
I2S_PCM_DOUT
H1
SC1
SC2
SC_PAD
SC_PAD
PIN_2X13_1.27MM_SMD
H_2.0mm
DGND
BOM:
Items
Type
1 C CHIP
2 C CHIP
Package
Spec
0201 0.5pF±0.1pF_25V
0201 0.8pF±0.1pF_25V
Quantity
Part ref
C20,C25,C53,C54
C19
Remark
3
10
11
12
13
14
15
16
17
18
10.
C CHIP
C CHIP
C CHIP
C CHIP
C CHIP
C CHIP
C CHIP
L CHIP
L CHIP
L CHIP
L CHIP
R CHIP
R CHIP
26pin_Connector
XTAL
ETK51
C CHIP
C CHIP
MHF
0201
0201
0201
0402
0402
0402
0603
0201
0201
0201
0201
0201
0402
0201
0201
4.7pF±0.25pF_25V
9pF±0.25pF_25V
100nF±10%_6.3V
100nF±10%_6.3V
1uF-20%~+80%_6.3V
12pF±5%_50V
4.7uF-20%~+80%_6.3V
1nH±0.3nH
1.2nH±0.3nH
1.6nH±0.3nH
2.2nH±0.3nH
0R±5%
0R±5%_ 1/16W
PIN_2X13_1.27MM_SMD
XTAL16MHZ
MQFN48_0.5_7X7
9pF±0.25pF_25V
NC 0201
MHF_3.1X3_SMD
Sticker and Package
The 1st Line: Module Model Number
The 2nd Line: F/W Version
The 3rd Line: Serial Number
C34,C52
C16
C51
C6,C24,C42
C11,C13,C38
C44,C45
C3
L9,L17
L5
L6
L8
L12
R1
J1
U7
U8
C55,C56
C36
A1,A2
NC
NC
NC
11.
Revision History
Date
2017/04/10
Revision
1.0
Descriptions
Initial Version

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