Ehong Technology MB18 Bluetooth Module User Manual Datasheet

ShangHai Ehong Technology Co.,Ltd. Bluetooth Module Datasheet

15_EH-MB18 UserMan.pdf

 Ehong Technology Co., Ltd                                            EH-MB18   Bluetooth® Technology Audio Module                                                                                                                 • Bluetooth radio -  Fully embedded Bluetooth® v4.2(Smart ready) -  Bluetooth® v3.0 specification compliant -  TX power +8dbm,-90dbm RX sensitivity -  128-bit encryption security -  Range up to 15m -  Internal chip  antenna or U.fl port -  Multipoint capability(7 transmit data devices connected at the same time) • Support profiles -  SPP (Master and slave), iAP (ipod accessory protocol) -  BLE(GATT Profile) -  HFP ,A2DP,AVRCP,HID(Salve) • User interface -   Send AT command over UART -   Firmware upgrade over USB -   With SPP service active: 560kbps transmission speed (UART) -   PCM interface (I2S,SPDIF) -   I2C interface(Master ),SPI • Audio codec -  optional support for 64Mb of external SPI flash 16Mb internal flash memory (64-bit wide, 45ns) -  80MHz RISC MCU and 80MIPS Kalimba DSP -  Support for CSR's latest CVC technology for narrow-band and wideband voice connections including wind noise reduction -  Support Apt-X ,AAC, Apt-XLL,SBC codec • General I/O - 13 eneral purpose I/Os - 2 analogue I/O - Support for up to 3 capacitive touch sensor inputs - Three fully configurable LED drivers •  FCC and Bluetooth® qualified •  Single voltage supply: 2.7-3.6V  •  Small form factor: 30.4 x 15.26 x 2.4mm •  Operating temperature range: -40 °C  to 85 °C
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   1. Contents 1. Description ......................................................................................................................................................... 4 2. Application ......................................................................................................................................................... 4 3. EH-MB18 Product numbering ........................................................................................................................ 4 4. Electrical Characteristic .................................................................................................................................. 5 4.1. Recommend operation conditions ............................................................................................................ 5 4.2. Absolute Maximum Rating ......................................................................................................................... 5 4.3. Power consumptions .................................................................................................................................. 5 4.4. Input/output Terminal Characteristics ...................................................................................................... 7 4.4.1. Digital Terminals .................................................................................................................................. 7 4.4.2. USB ....................................................................................................................................................... 8 4.4.3. Internal CODEC Analogue to Digital Converter .............................................................................. 8 4.4.4. Internal CODEC Digital to Analogue Converter.............................................................................. 9 5. Pinout and Terminal Description ................................................................................................................ 10 5.1. Pin assignment .......................................................................................................................................... 10 6. Physical Interfaces ......................................................................................................................................... 13 6.1. Power Supply ............................................................................................................................................. 13 6.2. Reset ........................................................................................................................................................... 13 6.3. PIO .............................................................................................................................................................. 14 6.4. AIO .............................................................................................................................................................. 14 6.5. RF interface ............................................................................................................................................... 14 6.6. UART .......................................................................................................................................................... 14 6.7. I2C Master .................................................................................................................................................. 15 6.8. Apple iOS CP reference design .............................................................................................................. 16 6.9. Digital Audio Interfaces ............................................................................................................................ 17 6.9.1. PCM .................................................................................................................................................... 18 6.9.2. Digital Audio Interface (I2S) ............................................................................................................. 19 6.9.3. IEC 60958 Interface (SPDIF) .......................................................................................................... 22 6.10. Microphone input ................................................................................................................................... 23 6.11. Analog Output stage ............................................................................................................................. 24 6.12. USB ......................................................................................................................................................... 24 7. EH-MB18 Reference Design ......................................................................................................................... 26
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   8. Mechanical and PCB Footprint Characteristics ...................................................................................... 27 9. RF Layout Guidelines .................................................................................................................................... 28 10. Reflow Profile ............................................................................................................................................... 29 11. Contact Information ................................................................................................................................... 30  2. Table of Tables TABLE 1: RECOMMENDED OPERATING CONDITIONS .................................................................................................... 5 TABLE 2: ABSOLUTE MAXIMUM RATING RECOMMENDED OPERATING CONDITIONS ................................................... 5 TABLE 3: POWER CONSUMPTIONS ................................................................................................................................ 7 TABLE 4: DIGITAL TERMINAL ......................................................................................................................................... 8 TABLE 5: USB TERMINAL .............................................................................................................................................. 8 TABLE 6: ANALOGUE TO DIGITAL CONVERTER ............................................................................................................. 9 TABLE 7: DIGITAL TO ANALOGUE CONVERTER ........................................................................................................... 10 TABLE 8:PIN TERMINAL DESCRIPTION ..................................................................................................................... 13 TABLE 9: PIN STATUS ON RESET ................................................................................................................................ 14 TABLE 10: POSSIBLE UART SETTINGS ...................................................................................................................... 15 TABLE 11: ALTERNATIVE FUNCTIONS OF THE DIGITAL AUDIO BUS INTERFACE ON THE PCM INTERFACE ............... 18 TABLE 12 : DIGITAL AUDIO INTERFACE SLAVE TIMING ............................................................................................... 21 TABLE 13 : DIGITAL AUDIO INTERFACE MASTER TIMING............................................................................................ 21 TABLE 14: USB INTERFACE COMPONENT VALUES .................................................................................................... 25 3. Table of Figures FIGURE 1:PINOUT OF EH-MB18.............................................................................................................................. 10 FIGURE 2:POWER SUPPLY PCB DESIGN ................................................................................................................ 13 FIGURE 3:CONNECTION TO HOST DEVICE ............................................................................................................... 15 FIGURE 4 : EXAMPLE EEPROM CONNECTION WITH I2C INTERFACE ........................................................................ 16 FIGURE 5 : APPLE CO-PROCESSOR 2.0C ................................................................................................................... 16 FIGURE 6 : APPLE CO-PROCESSOR 2.0B ................................................................................................................... 17 FIGURE 7 : AUDIO INTERFACE ..................................................................................................................................... 18 FIGURE 8 : DIGITAL AUDIO INTERFACE MODES .......................................................................................................... 20 FIGURE 9 : DIGITAL AUDIO INTERFACE SLAVE TIMING ............................................................................................... 21 FIGURE 10 : DIGITAL AUDIO INTERFACE MASTER TIMING .......................................................................................... 21 FIGURE 11: EXAMPLE CIRCUIT FOR SPDIF INTERFACE (CO-AXIAL) ........................................................................ 22 FIGURE 12: EXAMPLE CIRCUIT FOR SPDIF INTERFACE (OPTICAL) ........................................................................... 22 FIGURE 13: MICROPHONE BIASING (SINGLE CHANNEL SHOWN) ............................................................................... 23 FIGURE 14: SPEAKER OUTPUT .................................................................................................................................... 24 FIGURE 15: USB CONNECTIONS ................................................................................................................................ 25 FIGURE 16: REFERENCE DESIGN ............................................................................................................................... 26 FIGURE 17: RECOMMENDED PCB MOUNTING PATTERN (UNIT: MM, DEVIATION:0.02MM)TOP VIEW ..................... 27 FIGURE 18: CLEARANCE AREA OF ANTENNA ............................................................................................................. 28 FIGURE 19: RECOMMENDED REFLOW PROFILE ......................................................................................................... 29
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd    1. Description  The EH-MB18 is an easy to use Bluetooth module, compliant with Bluetooth v4.2. The module provides complete RF platform in a small form factor.  The module enables electronic devices with wireless connectivity, not requiring any RF experience or expertise for integration into the final product. The module being a certified solution optimizes the time to market of the final application.  The module built-in enhanced Kalimba DSP coprocessor with 80MIPS, supports enhanced audio and DSP Applications (t Apt-X, AAC, Apt-XLL, SBC codec).Support GATT,A2DP, AVRCP, HSP, HFP,SPP, iAP and PBAP Profiles communication with smart ready devices.  The module BLE profile communication with smart phones (iOS and Android), must be install the APP. EHong iOS system APP download address: https://itunes.apple.com/cn/app/ehong-link/id854886208?mt=8.  The module has 14 x general purpose IOs, 2x Analogue inputs/outputs (temperature sensor, charger control, etc), 3xs capacitive touch sensors, three fully configurable LED drivers (PWM).The module  optional support for 64Mb of external SPI flash 16Mb internal flash memory (64-bit wide, 45ns),support  Li-Ion battery charger with Instant-ON. 2. Application   Home entertainment eco-system   TVs   Smart remote controllers   Wired or wireless sound bars   Wired or wireless speakers and headphones   Bluetooth low energy connectivity to external 3D glasses   Tablets / PCs / Mobile Connectivity   Wired or wireless headphones for music / gaming / multimedia content   Wired or wireless speakers   Wired or wireless speaker phones   Mono Headsets for voice 3. EH-MB18 Product numbering EH-MB18(B) A.   EH     -------------    Company Name(Ehong) B.   MB18  ------------    Module Name C.   B        -------------    U.FL Connector
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   4. Electrical Characteristic 4.1.  Recommend operation conditions  Operating Condition Min Typical Max Unit Operating Temperature Range -40 -- +85 °C  PIO Voltage +1.7 +3.3 +3.6 V AIO Voltage +1.7 +1.8 +1.95 V LED +1.1 3.7 +3.6 V VDD Voltage +2.7 +3.3 +3.6 V VCHG(a) +4.75 +5 +5.75 V RF frequency 2400 2441 24800 MHz Table 1: Recommended Operating Conditions Note:(a) Maximum charging current 200mA  4.2.  Absolute Maximum Rating Table 2: Absolute Maximum Rating Recommended Operating Conditions 4.3.  Power consumptions DUT Role Connection Packet Type Average Current Unit N/A Deep sleep With UART host connection - 55 uA  N/A  Page scan Page = 1280ms interval Window = 11.25ms  -  219 uA Rating  Min  Max  Unit Storage Temperature  -40  +125  °C  PIO Voltage  -0.4  +3.6  V AIO Voltage  -0.4  +1.95  V LED  -0.4  +3.6  V VDD Voltage  -0.4  +3.6  V VCHG  -0.4  +5.75  V USB_DP/USB_DN Voltage  -0.4  +3.6  V Other Terminal Voltages  VSS-0.4  VDD+0.4  V
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd    N/A  Inquiry a n d p a g e sca n Inquiry = 1280ms interval Page  = 1280ms interval W ind ow   = 11.25ms  -  378 uA Master ACL Sniff = 500ms, 1 attempt, 0 timeout DH1 119 uA Master ACL Sniff = 1280ms, 8 attempts, 1 timeout DH1 109 uA Master SCO Sniff = 100ms, 1 attempt, PCM HV3 7.6 mA Master SCO Sniff = 100ms, 1 attempt, mono audio codec HV3 9.8 mA Master eSCO Setting S3, sniff = 100ms, PCM 2EV3 5.8 mA Master eSCO Setting S3, sniff = 100ms, PCM 3EV3 5.4 mA Master eSCO Setting S3, sniff = 100ms, mono audio codec 2EV3 7.9 mA Master eSCO Setting S3, sniff = 100ms, mono audio codec 3EV3 7.5 mA Slave ACL Sniff = 500ms, 1 attempt, 0 timeout DH1 127 uA Slave ACL Sniff = 1280ms, 8 attempts, 1 timeout DH1 129 uA Slave SCO Sniff = 100ms, 1 attempt, PCM HV3 7.8 mA Slave SCO Sniff = 100ms, 1 attempt, mono audio codec HV3 10 mA Slave eSCO Setting S3, sniff = 100ms, PCM 2EV3 6.2 mA Slave eSCO Setting S3, sniff = 3EV3 5.8 mA
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   100ms, PCM Slave eSCO Setting S3, sniff = 100ms, mono audio codec 2EV3 8.2 mA Slave eSCO Setting S3, sniff = 100ms, mono audio codec 3EV3 7.9 mA Table 3: Power consumptions Note :         Current consumption values are taken with: ■ Firmware ID = 7919 ■ RF TX power set to 0dBm ■ No RF retransmissions in case of eSCO ■ Audio gateway transmits silence when SCO/eSCO channel is open ■ LEDs disconnected ■ AFH off 4.4.  Input/output Terminal Characteristics 4.4.1.  Digital Terminals Digital Terminals Min Type Max Unit Input Voltage VIL input logic level low -0.4 - 0.4 V VIH input logic level high 0.7 x VDD - VDD + 0.4 V Tr/Tf - - 25 ns Output Voltage VOL output logic level low, lOL = 4.0mA - - 0.4 V VOH output logic level high, lOH = -4.0mA 0.75 X VDD - - V Tr/Tf - - 5 ns Input and Tristate Currents Strong pull-up      -150 -40 -10 μA Strong pull-down 10 40 150 μA Weak pull-up -5 -1.0 -0.33 μA Weak pull-down       0.33 1.0 5.0 μA CI Input Capacitance 1.0 - 5.0 pF
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd    Table 4: Digital Terminal  4.4.2.  USB  Min Type Max Unit VDD_USB for correct USB operation 3.10 3.30 3.60 V Input Threshold VIL input logic level low  -  - 0.30 x VDD_USB  V VIH input logic level high 0.70 x VDD_USB  -  -  V Input Leakage Current VSS_DIG < VIN < VDD_USB(a) -1 1 5 µA CI input capacitance 2.5 - 10 pF Output Voltage Levels to Correctly Terminated USB Cable VOL output logic level low 0 - 0.2 V VOH output logic level high 2.80 - VDD_USB V Table 5: USB Terminal (a)  Internal USB pull-up disable 4.4.3.   Internal CODEC Analogue to Digital Converter Analogue to Digital Converter Parameter Conditions Min Type Max Unit Resolution - - - 16 Bits  Input Sample Rate, Fsample  -  8  -  48  kHz          fin = 1kHz B/W = 20Hz→Fsample/Fsample  8kHz - 93 - dB 16kHz - 92 - dB
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   SNR 2 (20kHz max) A-Weighted THD+N < 0.1% 1.6Vpk-pk input 32kHz - 92 - dB 44.1kHz - 92 - dB 48kHz - 92 - dB   THD+N  fin = 1kHz B/W = 20Hz→Fsample/2 (20kHz max) 1.6Vpk-pk input Fsample  8kHz - 0.004 - % 48kHz - 0.008 - % Digital gain Digital gain resolution = 1/32 -24 - 21.5 dB   Analogue gain Pre-amplifier setting = 0dB, 9dB, 21dB or 30dB Analogue setting = -3dB to 12dB in 3dB steps   -3   -   42   dB Stereo separation (crosstalk) - -89 - dB Table 6: Analogue to Digital Converter 4.4.4.  Internal CODEC Digital to Analogue Converter Digital to Analogue Converter Parameter Conditions Min Type Max Unit Resolution - - - 16 Bits Output Sample Rate, Fsample  -  8  -  96  kHz    SNR  fin = 1kHz B/W = 20Hz→20kHz A-Weighted THD+N < 0.01% 0dBFS input Fsample Load  48kHz 100kΩ - 96 - dB 48kHz 32Ω - 96 - dB 48kHz 16Ω - 96 - dB        THD+N      fin = 1kHz B/W = 20Hz→20kHz 0dBFS input Fsample Load  8kHz 100kΩ - 0.002 - % 8kHz 32Ω - 0.002 - % 8kHz 16Ω - 0.003 - % 48kHz 100kΩ - 0.003 - % 48kHz 32Ω - 0.003 - %
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   48kHz 16Ω - 0.004 - % Digital Gain Digital Gain Resolution = 1/32 -24 - 21.5 dB Analogue Gain Analogue Gain Resolution = 3dB -21 - 0 dB Stereo separation (crosstalk) - -88 - dB Table 7: Digital to Analogue Converter  5. Pinout and Terminal Description 5.1.  Pin assignment   Figure 1:Pinout of EH-MB18 Pin Symbol I/O Type Description 1 GND Ground Ground 2 AIO0 Bi-directional Analogue programmable input/output line 3 AIO1 Bi-directional Analogue programmable input/output line 4 CAP_SENSE0 Analogue input Capacitive touch sensor input 5 CAP_SENSE1 Analogue input Capacitive touch sensor input 6 CAP_SENSE2 Analogue input Capacitive touch sensor input 7 GND Ground Ground 8 PCM_IN CMOS Input, with weak internal pull-down Synchronous Data Input 9 PCM_CLK Bi-directional with weak Synchronous Data Clock
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   internal pull-down 10 PCM_SYNC Bi-directional with weak internal pull-down Synchronous Data Sync 11 PCM_OUT CMOS output, tri-state, with weak internal pull-down Synchronous Data Output 12 RESETB CMOS input with weak internal pull-up Active LOW RESETB, input debounced so must be low for >5ms to cause a RESETB 13 UART_CTS Bi-directional with weak pull down Uart clear to send ,active low 14 UART_RTS Bi-directional with weak internal pull-up uart request to send ,active low 15 UART_RX CMOS input with weak internal pull-down UART data input 16 UART_TX Bi-directional CMOS output, tri-state, with weak internal pull-up UART data output 17 USB_D+ Bi-directional USB data plus with selectable internal 1.5K pull up resistor 18 USB_D- Bi-directional USB data minus 19 PIO0 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 20 SPI_CSB Input with weak internal pull-up Chip select for Synchronous Serial Interface for programming only, active low 21 SPI_MISO CMOS output, tri-state, with weak internal pull-down Serial Peripheral Interface output for programming only 22 SPI_MOSI CMOS input, with weak internal pull-down Serial Peripheral Interface input for programming only 23 SPI_CLK Input with weak internal pull-down Serial Peripheral interface clock for programming only 24 LED2 Open drain output LED Driver 25 LED1 Open drain output LED Driver 26 LED0 Open drain output LED Driver 27 PIO6 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 28 PIO7 Bi-directional with programmable strength Programmable input/output line or I2C SDA
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   internal pull-up/down 29 PIO5 Bi-directional with programmable strength internal pull-up/down Programmable input/output line or I2C SCL 30 PIO14 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 31 PIO4 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 32 VDD_3V3 Power Supply +2.7V- +3.6V power input 33 GND Ground Ground 34 VDD_CHG Charger input +4.7V--+5.7V charge  input 35 QSPI_FALSH_IO3 Bi-directional with strong internal pull-down Serial quad I/O flash data bit 3 36 QSPI_FLASH_CS Bi-directional with strong internal pull-up SPI flash chip select 37 QSPI_FLASH_CLK Bi-directional with strong internal pull-down SPI flash clock 38 QSPI_FLASH_IO0 Bi-directional with strong internal pull-down Serial quad I/O flash data bit 0 39 QSPI_FLASH_IO2 Bi-directional with strong internal pull-down Serial quad I/O flash data bit 2 40 QSPI_FLASH_IO1 Bi-directional with strong internal pull-down Serial quad I/O flash data bit 1 41 QSPI_SRAM_CLK Bi-directional with strong internal pull-down SPI RAM clock 42 QSPI_SRAM_CS Bi-directional with strong internal pull-up SPI RAM chip select 43 MIC_RN Analogue Microphone input negative, right 44 MIC_RP Analogue Microphone input positive, right 45 MIC_BIAS_B Analogue out Microphone bias B 46 MIC_LN Analogue Microphone input negative, right 47 MIC_LP Analogue Microphone input positive, left 48 MIC_BIAS_A Analogue out Microphone bias A 49 SPK_RP Analogue Speaker output positive, right 50 SPK_RN Analogue Speaker output negative, right 51 SPK_LN Analogue Speaker output negative, left
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   52 SPK_LP Analogue Speaker output positive, left 53 GND Ground Ground Table 8:PIN Terminal Description  6. Physical Interfaces 6.1.  Power Supply  -  The module DC3.3V power input.  -  Power supply pin connection capacitor to chip and pin as far as possible close -  Capacitor decouples power to the chip  -  Capacitor prevents noise coupling back to power plane. .  Figure 2:Power Supply PCB Design  6.2.  Reset The module may be reset from several sources: RESETB pin, power-on reset, a UART break character or via software configured watchdog timer. The RESETB pin is an active low RESETB and is internally filtered using the internal low frequency clock oscillator. A RESETB will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. At RESETB the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The pull-down state is shown below.  Pin Name / Group Pin Status on RESETB USB_DP N/a USB_DN N/a
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   UART_RX Strong PU UART_TX Weak PU UART_RTS Weak PU UART_CTS Weak PD SPI_MOSI Weak PD SPI_CLK Weak PD SPI_CSB Strong PU SPI_MISO Weak PD RESET Strong PU PIOs Weak PD PCM_IN Weak PD PCM_CLK Weak PD PCM_SYNC Weak PD PCM_OUT Weak PD QSPI_SRAM_CS Strong PU QSPI_FLASH_CS Strong PU QSPI_SRAM_CLK Strong PD QSPI_FLASH_CLK Strong PD Table 9: Pin Status on Reset  6.3.  PIO EH-MB18 has a total of 13digital programmable I/O terminals. They are powered from VDD . Their functions depend on firmware running on the device. PIO lines can be configured through software to have either weak or strong pull-ups or pull-downs. Note:  All PIO lines are configured as inputs with weak pull-downs at reset.  Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. 6.4.  AIO EH-MB18 has 2 analogue I/O terminals. Their functions depend on software. Typically ADC functions can be configured to battery voltage measurement. They can also be used as a digital PIO. 6.5.  RF interface EH-MB18 internet chip antenna and U.fl port choose one of the ways. U.fl port external antenna, impedance is 50 ohm. 6.6.  UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol.
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   The UART CTS and RTS signals can be used to implement RS232 hardware flow control where both are active low indicators.   Table 10: Possible UART Settings  Figure 3:Connection To Host device   6.7.  I2C Master PIO6, PIO7 and PIO8 can be used to form a master I2C interface. The interface is formed using software to drive these lines. It is suited only to relatively slow functions such as driving a LCD, keyboard scanner or EEPROM.  In the  case, PIO lines need to be pulled up through 2.2KΩ resistors.  Parameter  Possible Values Baud Rate  Minimum  1200 baud (≤2%Error) 9600 baud (≤1%Error) Maximum  3M baud (≤1%Error) Flow Control  RTS/CTS or None Parity  None, Odd or Even Number of Stop Bits  1 or 2 Bits per Byte  8
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd    Figure 4 : Example EEPROM Connection with I2C Interface 6.8.   Apple iOS CP reference design The figures below give an indicative overview of what the hardware concept looks like. A specific MFI co-processor layout is available for licensed MFI developers from the MFI program.  Figure 5 : Apple Co-processor 2.0C
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd    Figure 6 : Apple Co-processor 2.0B  6.9.  Digital Audio Interfaces The audio interface circuit consists of: ■ Stereo/Dual-mono audio codec ■ Dual audio inputs and outputs ■ 6 digital MEMS microphone inputs ■ A configurable PCM, I²S or SPDIF  interface  Figure 2 outlines the functional blocks of the interface. The codec supports stereo playback and recording of audio signals at multiple sample rates with a resolution of 16-bit. The ADC and the DAC of the codec each contain 2 independent channels. Any ADC or DAC channel can be run at its own independent sample rate.
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd    Figure 7 : Audio Interface  The interface for the digital audio bus shares the same pins as the PCM codec interface described in Table 11, which means each of the audio buses are mutually exclusive in their usage. Table 11 lists these alternative functions.  PCM Interface SPDIF Interface I²S  Interface PCM_OUT SPDIF_OUT SD_OUT PCM_IN SPDIF_IN SD_IN PCM_SYNC - WS PCM_CLK - SCK  Table 11: Alternative Functions of the Digital Audio Bus Interface on the PCM Interface The audio input circuitry consists of a dual audio input that can be configured to be either single-ended or fully differential and programmed for either microphone or line input. It has an analogue and digital programmable gain stage for optimization of different microphones. The audio output circuitry consists of a dual differential class A-B output stage. 6.9.1.  PCM The audio pulse code modulation (PCM) interface supports continuous transmission and reception of PCM encoded audio data over Bluetooth. Hardware on EH-MB18 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any one time. EH-MB18 can operate as the PCM interface master generating PCM_SYNC and PCM_CLK or as a PCM interface slave accepting externally generated PCM_SYNC and PCM_CLK. EH-MB18 is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments.
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   It supports 13-bit or 16-bit linear, 8-bit u-law or A-law companded sample formats and can receive and transmit on any selection of three of the first four slots following PCM_SYNC. EH-MB18 interfaces directly to PCM audio devices including the following: ■ Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices ■ OKI MSM7705 four channel A-law and μ-law CODEC ■ Motorola MC145481 8-bit A-law and μ-law CODEC ■ Motorola MC145483 13-bit linear CODEC ■ STW 5093 and 5094 14-bit linear CODECs(8) ■ EH-MB18 is also compatible with the Motorola SSI interface 6.9.2.  Digital Audio Interface (I2S) The digital audio interface supports the industry standard formats for I2S, left-justified or right-justified. The interface shares the same pins of the PCM interface as Table 11. Special firmware is needed if I2S is used. Contact EHong for the special firmware when use I2S as the interface between the module and the host or the codec. The I2S support following formats,
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd    Figure 8 : Digital Audio Interface Modes  Symbol Parameter Min Typical Max Unit - SCK Frequency - - 6.2 MHz - WS Frequency - - 96 kHz tch SCK high time 80 - - ns tcl SCK low time 80 - - ns topd SCK to SD_OUT delay - - 20 ns tssu WS to SCK set up time 20 - - ns tsh WS to SCK hold time 20 - - ns tisu SD_IN to SCK set-up time 20 - - ns tih SD_IN to SCK hold time 20 - - ns
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   Table 12 : Digital Audio Interface Slave Timing  Figure 9 : Digital Audio Interface Slave Timing  Symbol Parameter Min Typical Max Unit - SCK Frequency - - 6.2 MHz - WS Frequency - - 96 kHz topd SCK to SD_OUT delay - - 20 ns tspd SCK to WS delay - - 20 ns tisu SD_IN to SCK set-up time 20 - - ns tih SD_IN to SCK hold time 10 - - ns Table 13 : Digital Audio Interface Master Timing  Figure 10 : Digital Audio Interface Master Timing
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   6.9.3.  IEC 60958 Interface (SPDIF) The IEC 60958 interface is a digital audio interface that uses bi-phase coding to minimise the DC content of the transmitted signal and allows the receiver to decode the clock information from the transmitted signal. The IEC 60958 specification is based on the 2 industry standards: ■ AES/EBU ■ Sony and Philips interface specification SPDIF The interface is compatible with IEC 60958-1, IEC 60958-3 and IEC 60958-4.  The SPDIF interface signals are SPDIF_IN and SPDIF_OUT and are shared on the PCM interface pins. The input and output stages of the SPDIF pins can interface to: ■ A 75Ω coaxial cable with an RCA connector, see Figure 11. ■ An optical link that uses Toslink optical components, see Figure 12.   Figure 11: Example Circuit for SPDIF Interface (Co-Axial)    Figure 12: Example Circuit for SPDIF Interface (Optical)
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   6.10.   Microphone input The module contains 2 independent low-noise microphone bias generators. The microphone bias generators are recommended for biasing electret condensor microphones. Figure 9.6 shows a biasing circuit for microphones with a sensitivity between about ‑40 to ‑60dB (0dB = 1V/Pa): Where: ■ The microphone bias generators derives their power from VBAT or VOUT_3V3 \ and requires no capacitor on its output. ■ The microphone bias generators maintains regulation within the limits 70μA to 2.8mA, supporting a 2mA source typically required by 2 electret condensor microphones. If the microphone sits below these limits, then the microphone output must be pre-loaded with a large value resistor to ground. ■ Biasing resistors R1 and R2 equal 2.2kΩ. ■ The input impedance at MIC_LN, MIC_LP, MIC_RN and MIC_RP is typically 6kΩ. ■ C1, C2, C3 and C4 are 100/150nF if bass roll-off is required to limit wind noise on the microphone. ■ R1 and R2 set the microphone load impedance and are normally around 2.2kΩ.   Figure 13: Microphone Biasing (Single Channel Shown)
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   The microphone bias characteristics include: ■ Power supply: ■ CSR8670 BGA microphone supply is VBAT (via SMP_VBAT) or VOUT_3V3 (via SMPS_3V3) ■ Minimum input voltage = Output voltage + drop-out voltage ■ Maximum input voltage is 4.25V ■ Drop-out voltage: ■ 300mV maximum ■ Output voltage: ■ 1.8V or 2.6V ■ Tolerance 90% to 110% ■ Output current: ■ 70μA to 2.8mA ■ No load capacitor required 6.11.   Analog Output stage The output stage digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to a 2Mbits/s 5-bit multi-bit bit stream, which is fed into the analogue output circuitry. The output stage circuit is comprised a DAC with gain setting and class AB amplifier. The output is available as a differential signal between SPKR_A_N and SPKR_L_P for the right channel, as Figure 6 shows, and between SPKL_B_N and SPKL_B_P for the left channel.  Figure 14: Speaker output  6.12.   USB This is a full speed (12M bits/s) USB interface for communicating with other compatible digital devices.  The  module  acts  as  a  USB  peripheral,  responding  to  request  from  a  master  host controller, such as a PC. The USB interface is capable of driving a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented can behave as specified in the USB section of the Bluetooth specification v2.1+EDR or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers.
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   The module has an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when module is ready to enumerate. It signals to the USB master that it is a full speed (12Mbit/s) USB device.    Figure 15: USB Connections  Identifier Value Function Rs 27Ω Nominal Impedance matching to USB cable Table 14: USB Interface Component Values  Note: USB_ON is only used when the firmware need an input to detect if USB is connected and the USB function shall be enabled. In such case it is shared with the module PIO terminals. If detection is not needed (firmware already runs with USB, such as USB DFU or USB CDC), USB_ON is not needed.
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   7. EH-MB18 Reference Design  Figure 16: Reference Design
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   8. Mechanical and PCB Footprint Characteristics   Figure 17: Recommended PCB Mounting Pattern (Unit: mm, Deviation:0.02mm)TOP View
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   9. RF Layout Guidelines EH-MB18 RF design to ensure enough clearance area of antenna, area length is 1.6 times of antenna length, area width is 4 times of antenna width, the bigger the better if the space allows. Module antenna clearance area size, as follows.   Figure 18: Clearance Area of Antenna
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd   10.  Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application.  The data here is given only for guidance on solder reflow.  210 217 ℃ 250 A  B  C  D 1  2 0 25 3  4  5  6  min E              Figure 19: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s.  The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C.  This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components.  Equilibrium  Zone  1  (B)  —  In  this  stage  the  flux  becomes  soft  and  uniformly  encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized.  Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating  oxide  film  formed  on  the  surface  of  each  solder  particle  and  PCB  board.  The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium  Zone  2  (c)  (optional) —  In  order  to  resolve  the  upright  component  issue,  it  is recommended to keep the temperature in 210 – 217  for about 20 to 30 second.  Reflow  Zone  (D) —  The  profile  in  the  figure  is  designed  for  Sn/Ag3.0/Cu0.5.    It  can  be  a reference for other lead-free solder. The peak temperature should be high enough to achieve good  wetting  but  not  so  high  as  to  cause  component  discoloration  or  damage.  Excessive soldering  time  can  lead  to  intermetallic  growth  which  can  result  in  a  brittle  joint.  The recommended peak temperature (Tp) is 230 ~ 250 C.  The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C.
                                                                            Bluetooth Audio Module                                                           Ehong Technology Co., Ltd      11.  Contact Information  Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Phone: +86 21 64769993 Fax: +86 21 64765833 Street address: Rom1505, Blk 1st ,No.833 South Hong mei Rd ,Ming hang district shanghai
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help. Thisdevicecomplieswithpart15oftheFCCrules.Operationissubjecttothefollowingtwoconditions:(1)thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation.Changesormodificationstothisunitnotexpresslyapprovedbythepartyresponsibleforcompliancecouldvoidtheuser'sauthoritytooperatetheequipment.Integrator is reminded to assure that these installation instructionswill not be made available to the end-user of the final host device. the Integrator will be responsible to satisfy SAR/ RF Exposure requirements,when the module integrated into any (portable, mobile, fixed) host device. The final host device, into which this RF Module is integrated" has to be labelledwith an auxilliary lable stating the FCC ID of the RF Module, such as"Contains FCC ID: 2ACCRMB18".

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