Endex Automation Technology ENDEX-IDG001 Bluetooth Module User Manual ENDEX Bluetooth module IDG001 UsersManual

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Document ID	1728455
Application ID	+fafdNJsw5RK4MsmpfNHqw==
Document Description	Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	9.74kB (121807 bits)
Date Submitted	2012-06-21 00:00:00
Date Available	2012-06-26 00:00:00
Creation Date	2012-06-21 08:45:24
Producing Software	GPL Ghostscript 9.04
Document Lastmod	2012-06-21 08:45:24
Document Title	ENDEX Bluetooth module IDG001 UsersManual
Document Creator	PDFCreator Version 1.2.3
Document Author:	Hoa

ENDEX Bluetooth module IDG001
1. Introduction
Part Name: IDG BT_CB
Part Number: IDG BT_CB V1.0
The ENDEX IDG BT_CB Bluetooth module is design for standard SPP (Serial Port Profile) electronic accessory
via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core
Specification Version 3.0 + EDR.
1.1. Major Components
- iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor)
- Serial EEPROM 8K (1024*8) TSSOP 8P
- iPod Authentication Coprocessor V2.0C; Compatible with the iPod, iPhone & iPad (MFI337S3959)
1.2. Features
- Bluetooth 3.0 EDR compliant
- Low power 1.8V RF operation
- RF transmitter output power Class 2
- RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm
- Internal ROM and 4Mibts of flash
- HCI over UART
- I2C for external EEPROM.
- 1 LED driver
1.3. Application
- Fitness System data transformer application.
2. Product Specification
2.1. Interfaces
- Serial port Rx, Tx TTL signal.
2.3. Hardware Design Considerations
- Power
The module requires either 5V supply voltage.
- Serial Flash and Firmware Version
Firmware code is stored on chip internal flash.
- Radio Characteristics
Bluetooth V3.0 + EDR
Frequency Band: 2402-2480 GHz
Number of Channels: 79 1MHz channels
Revision 1.0
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ENDEX Bluetooth module IDG001
- Baud Rate
Desired baud rate
Clock
Div
Actual Baud rate
Error Rate %
57600
16000000
13
20.8675214
58608
1.75
3. Hardware Architecture
BT_RF
LED1
HCI_TXD
HCI_RXD
HCI_RXD
HCI_RXD
RST_N
HCI_RXD
USART1_RX
USART1_TX
P07
P07
P23
LINK_DROP
P24
P24
CP_SCL
P20
P20
CP_SDA
P22
P22
CP_RESET
P04
P04
MFi cp chip
BM57SPPxy
Gateway MCU
J1 connector
IDG BT_CB
4. Environmental Requirements
4.1. Temperature
Conditions
Minimum
Operating Temperature
Non-Operating Temperature
-10 ℃
-40℃
Maximum
+70 ℃
+80 ℃
Operating Humidity
10%
90%
Non-Operating Humidity
5%
95%
4.2. Humidity
Conditions
Minimum
Maximum
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ENDEX Bluetooth module IDG001
5. Dimension
The PCB size is 47.00 mm * 26.25 mm, with two 2.8mm mounting holes can lock screw.
6. Connect interface
Connect pin define, use JST XH 6 pin housing.
Pin No.
Pin function
BT_Rx
BT_Tx
IAP
DC5V
GND
Pin wire color
Green
Yellow
Orange
Red
Black
Revision 1.0
Note
Reserve for FW update
June 21, 2012
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ENDEX Bluetooth module IDG001
7. IDG001 Regulation Statement
In accordance with FCC Part 15C:
IDG001, this module is listed as a Limited Modular Transmitter device.
Therefore, the final host product must be submitted to Endex Automation Technology
Co., Ltd. for confirmation that the installation of the module into the host is in compliance
with the regulations of FCC.
Changes or modifications not expressly approved by the manufacturer could void the
user’s authority to operate the equipment.
FCC Label Instructions:
The outside of final products that contains this module device must display a label
referring to the enclosed module. This exterior label can use wording such as the
following: “Contains Transmitter Module FCC ID: B9OENDEX-IDG001” or “Contains FCC
ID: B9OENDEX-IDG001.” Any similar wording that expresses the same meaning may be
used.
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