Endex Automation Technology ENDEX-IDG001 Bluetooth Module User Manual ENDEX Bluetooth module IDG001 UsersManual

Endex Automation Technology Co., Ltd. Bluetooth Module ENDEX Bluetooth module IDG001 UsersManual

Manual

EENNDDEEXX BBlluueettooootthh mmoodduullee IIDDGG000011 Revision 1.0 June 21, 2012 第1頁/共4頁 1. Introduction Part Name: IDG BT_CB Part Number: IDG BT_CB V1.0 The ENDEX IDG BT_CB Bluetooth module is design for standard SPP (Serial Port Profile) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR. 1.1. Major Components - iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor) - Serial EEPROM 8K (1024*8) TSSOP 8P - iPod Authentication Coprocessor V2.0C; Compatible with the iPod, iPhone & iPad (MFI337S3959) 1.2. Features - Bluetooth 3.0 EDR compliant - Low power 1.8V RF operation - RF transmitter output power Class 2 - RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm - Internal ROM and 4Mibts of flash - HCI over UART - I2C for external EEPROM. - 1 LED driver 1.3. Application - Fitness System data transformer application. 2. Product Specification 2.1. Interfaces - Serial port Rx, Tx TTL signal. 2.3. Hardware Design Considerations - Power The module requires either 5V supply voltage. - Serial Flash and Firmware Version Firmware code is stored on chip internal flash. - Radio Characteristics Bluetooth V3.0 + EDR Frequency Band: 2402-2480 GHz Number of Channels: 79 1MHz channels
EENNDDEEXX BBlluueettooootthh mmoodduullee IIDDGG000011 Revision 1.0 June 21, 2012 第2頁/共4頁 - Baud Rate Desired baud rate Clock P Div Actual Baud rate Error Rate % 57600 16000000 13 20.8675214 58608 1.75 3. Hardware Architecture 4. Environmental Requirements 4.1. Temperature Conditions Operating Temperature Non-Operating Temperature Minimum -10 ℃ -40℃ Maximum +70 ℃ +80 ℃ 4.2. Humidity Conditions Operating Humidity Non-Operating Humidity Minimum 10% 5% Maximum 90% 95% BM57SPPxy BT_RF LED1 Gateway MCU CP_SDA CP_SCL CP_RESET HCI_TXD HCI_RXD RST_N P07 MFi cp chip P23 P24 P20 P22 P04 HCI_RXD HCI_RXD HCI_RXD P07 LINK_DROP P24 P20 P22 P04 USART1_RXUSART1_TXIDG BT_CB J1 connector
EENNDDEEXX BBlluueettooootthh mmoodduullee IIDDGG000011 Revision 1.0 June 21, 2012 第3頁/共4頁 5. Dimension The PCB size is 47.00 mm * 26.25 mm, with two 2.8mm mounting holes can lock screw. 6. Connect interface Connect pin define, use JST XH 6 pin housing. Pin No. Pin function Pin wire color Note 1 BT_Rx Green 2 BT_Tx Yellow 3 IAP Orange Reserve for FW update 4 - - 5 DC5V Red 6 GND Black
EENNDDEEXX BBlluueettooootthh mmoodduullee IIDDGG000011 Revision 1.0 June 21, 2012 第4頁/共4頁 7. IDG001 Regulation Statement In accordance with FCC Part 15C: IDG001, this module is listed as a Limited Modular Transmitter device. Therefore, the final host product must be submitted to Endex Automation Technology Co., Ltd. for confirmation that the installation of the module into the host is in compliance with the regulations of FCC. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. FCC Label Instructions: The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: B9OENDEX-IDG001” or “Contains FCC ID: B9OENDEX-IDG001.” Any similar wording that expresses the same meaning may be used.

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