Fibocom Wireless L830 LTE Module User Manual ng
Fibocom Wireless Inc. LTE Module ng
User manual
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| Document ID | 2893435 |
| Application ID | hwqebLYYAQG65IaTHPjCTg== |
| Document Description | User manual |
| Short Term Confidential | Yes |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 109.64kB (1370482 bits) |
| Date Submitted | 2016-02-02 00:00:00 |
| Date Available | 2016-07-31 00:00:00 |
| Creation Date | 2017-11-17 01:16:37 |
| Producing Software | GPL Ghostscript 9.18 |
| Document Lastmod | 2017-11-17 01:16:37 |
| Document Title | ng |
| Document Creator | WPS Office |
| Document Author: | fangs |
L830-EA M.2 Module Hardware User Manual Version：V1.0.3 Date：2015.09.19 Copyright Copyright ©2015 Fibocom Wireless Inc . All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or transmit the document in any form. Attention The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Trademark The trademark is registered and owned by Fibocom Wireless Inc. Versions Version Date Remarks V1.0.0 2015-06-05 Initial Version Update the supported Cat of HSPA ; V1.0.1 2015-06-16 Update the description of digital voice ; Update the description of USB and Win8/Android switch ; Update the consumption V1.0.2 2015-07-07 V1.0.3 2015-09-19 Update part of error description Delete the Band25, Update the parameters of GPS, and update the logo L830-EA M.2 Module Hardware User Manual Page 2 of 45 Applicability Table No. Type Note L830-EA NA The difference of L830-EA M.2 wireless module as listed below: Model No. L830-EA LTE FDD WCDMA Band Band 1,2,3,4,5,7,8,9,13,17,18,19,20,26,29 1,2,4,5,6,8 L830-EA M.2 Module Hardware User Manual GSM/GPRS/EDGE 850/900/1800/1900MHz Page 3 of 45 Content 1 Foreword.................................................................................................................................................................... 7 1.1 Introduction.....................................................................................................................................................7 1.2 Reference Standard......................................................................................................................................7 2 Product Overview..................................................................................................................................................... 9 2.1 Description......................................................................................................................................................9 2.2 Specifications................................................................................................................................................. 9 2.3 Appearance..................................................................................................................................................14 3 Structure...................................................................................................................................................................15 3.1 Dimension Diagram of Structure.............................................................................................................. 15 3.2 Application Interface Description..............................................................................................................16 3.3 M.2 Connector............................................................................................................................................. 17 4 Hardware Introduction........................................................................................................................................... 18 4.1 Pin Definitions..............................................................................................................................................18 4.1.1 Pin Map............................................................................................................................................. 18 4.1.2 Description of Pins...........................................................................................................................19 5 Hardware Interface.................................................................................................................................................23 5.1 Power Interface........................................................................................................................................... 23 5.1.1 Power Supply................................................................................................................................... 23 5.1.2 VIO_1V8............................................................................................................................................23 5.2 Power on/off and Reset Signal................................................................................................................. 24 5.2.1 Power on /off Signal........................................................................................................................ 24 5.2.1.1 Power on Signal................................................................................................................... 24 5.2.1.2 Power off signal.................................................................................................................... 25 5.2.1.3 The Recommended Design of Power on/off................................................................... 26 5.2.2 RESET Signal.................................................................................................................................. 26 5.3 Status Indicating Signal............................................................................................................................. 27 5.3.1 Status Indicating Pin....................................................................................................................... 27 5.4 USB /SSIC Interface...................................................................................................................................28 5.4.1 USB Interface................................................................................................................................... 28 5.4.2 USB SSIC Interface.........................................................................................................................29 5.5 USIM Interface.............................................................................................................................................29 5.5.1 USIM Pins......................................................................................................................................... 29 L830-EA M.2 Module Hardware User Manual Page 4 of 45 5.5.2 USIM Interface Design....................................................................................................................30 5.5.2.1 “Normal Closed” SIM Card Circuit Design....................................................................... 30 5.5.2.2 “Normally Open” SIM Circuit Design.................................................................................30 5.5.3 Points for Attention in USIM Design............................................................................................. 31 5.5.4 USIM Hot-Plugging..........................................................................................................................32 5.5.4.1 Hardware Connection..........................................................................................................32 5.5.4.2 Software Settings................................................................................................................. 32 5.6 Digital Audio................................................................................................................................................. 33 5.6.1 I2S Interface..................................................................................................................................... 33 5.6.2 PCM Port Description..................................................................................................................... 33 5.7 Win8/Android Switch Control Interface................................................................................................... 34 5.8 W_DISABLE# Interface............................................................................................................................. 35 5.8.1 Description of WWAN_DISABLE# Interface...............................................................................35 5.8.2 GPS_DISABLE# Interface............................................................................................................. 35 5.9 TX_BLANKING Interface........................................................................................................................... 35 5.10 WAKEUP_Host Interface.........................................................................................................................36 5.11 BODY_SAR Interface...............................................................................................................................36 5.12 I2C Interface.............................................................................................................................................. 36 5.13 Clock Interface.......................................................................................................................................... 37 5.14 Config Interface.........................................................................................................................................37 5.15 RF Interface............................................................................................................................................... 37 5.15.1 RF Connector Interface................................................................................................................ 37 5.15.2 RF Connecting Seat......................................................................................................................38 5.15.3 Main Performance of RF Connector.......................................................................................... 39 5.16 Other Interfaces........................................................................................................................................ 39 6 Electrical and Environmental Features...............................................................................................................39 6.1 Electrical Features...................................................................................................................................... 39 6.2 Environmental Features.............................................................................................................................40 7 RF Interface.............................................................................................................................................................41 7.1 Operating Frequency Band....................................................................................................................... 41 7.2 Receiving Sensitivity...................................................................................................................................42 7.3 GNSS............................................................................................................................................................ 43 7.4 RF PCB Design........................................................................................................................................... 43 7.4.1 Wiring Principle................................................................................................................................ 43 L830-EA M.2 Module Hardware User Manual Page 5 of 45 7.4.2 Impedance Design...........................................................................................................................43 7.5 Antenna Design........................................................................................................................................... 44 7.5.1 Main Antenna Design Requirements........................................................................................... 44 L830-EA M.2 Module Hardware User Manual Page 6 of 45 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L830-EA M.2 wireless modules. With the assistance of the document and other instructions, developers can quickly understand the performance of L830-EA M.2 wireless modules and develop products. 1.2 Reference Standard The design of the product compiles with the following standards ： 3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE) 3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment (DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) 3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS) 3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile radio interface 3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol 3GPP TS 3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell reselection in connected mode 3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description; 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services Stage 2 3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2 3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information 3GPP TS 21.111 -v6.3.0: USIM and IC card requirements 3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)" 3GPP TS 45.002 -v6.12.0: Multiplexing and 3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity Module - multiple access on the radio path Mobile Equipment (SIM-ME) interface 3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance specification 3GPP TS 22.004 -v6.0.0: General on supplementary services 3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2 L830-EA M.2 Module Hardware User Manual Page 7 of 45 3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification; 3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD) 3GPP TS 36.101 V9.18.0: User Equipment (UE) radio transmission and reception 3GPP TS 36.104 V9.13.0: Base Station (BS) radio transmission and reception 3GPP TS 36.106 V9.4.0: FDD Repeater radio transmission and reception 3GPP TS 36.113 V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC) 3GPP TS 36.124 V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 36.133 V9.18.0: Requirements for support of radio resource management 3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the FDD UE 3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 34.122 V5.7.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD) 3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+); Radio transmission and reception L830-EA M.2 Module Hardware User Manual Page 8 of 45 2 Product Overview 2.1 Description L830-EA M.2 modules are highly integrated 4G wireless modules, supports 3 modes 16 bands that including the main 4G/3G/2G modes (LTE FDD/ WCDMA/ /GSM) and with wide bands, but not TDD mode in China. These bands support the main operators of Europe and North America and the cellular network of parts of the Asia . 2.2 Specifications Specification L830-EA Operating Frequency LTE FDD: Band 1,2,3,4,5,7,8,9,13,17,18,19,20,26,29 Range WCDMA HSPA+: Band 1,2,4,5,6,8 GSM/GPRS/EDGE: 850/900/1800/1900MHz LTE inter-band CA +5,8,18,19,26 +4,5,13,17,29 +5,8,19,20,26 +5,13,17,29 +3,20 LTE intra-band CA GNSS Supported Weight 5.7 grams LTE FDD Cat6 (300Mbps DL,50Mbps UL) UMTS/HSDPA/HSUPA DC-HSDPA 42Mbps(Cat 24) 3GPP Rel.10 HSUPA 5.76Mbps(Cat6) Data Rate EDGE (E-GPRS) multi-slot class 33(296kbps DL, GSM 3GPP release 7 236.8kbps UL) GPRS multi-slot class 33 (107kbps DL,85.6kbps UL) Physical Dimension ：42x 30 x 2.3 mm L830-EA M.2 Module Hardware User Manual Page 9 of 45 Characteristics Environment Interface ：M.2 Operating Temperature：-30℃ ~ +65℃ Storage Temperature：-40℃ ~ +85℃ Performance Operating Voltage Voltage：3.135V ~ 4.4V Normal：3.3V 5mA (Sleep Mode) Current Consumption (Typical Value) LTE FDD DATA：750mA WCDMA：580mA 2G Talk：300mA (GSM PCL5) Interface RF Interface Antenna ：Mainx1，Diversityx1 1 x USB 2.0，Multiple Profiles over USB，USB SSIC Function Interface SIM Support ，I2C Support，I2S/PCM Support GPIO，Clock Data Features Protocol Stack EDGE GPRS External TCP/IP and UDP/IP protocol stack Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~9 Multi-slot class 33 (5 Down; 4 Up; 6 Total) Coding Scheme MCS1~4 CSD UMTS(14.4kbps)，GSM(9.6kbps) USSD Support SMS MO / MT Text and PDU modes Cell broadcast Audio not supported yet Character Set IRA，GSM，UCS2，HEX FIBOCOM proprietary AT commands AT Commands GSM 07.05 GSM 07.07 L830-EA M.2 Module Hardware User Manual Page 10 of 45 Firmware Loader Tool over USB Accessories User Manual Developer Kit Note: 1. Please make sure the temperature for device will not be higher than 65˚C. 2. The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. 3. Assessment of compliance of the product with the requirements relating to the Radio and Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by PHOENIX TESTLAB (Notified Body No.0700), L830-EA M.2 Module Hardware User Manual Page 11 of 45 Note: Federal Communications Commission (FCC) Declaration of Conformity This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to operate the equipment. RF Exposure Information This device meets the government’s requirements for exposure to radio waves. This device is designed and manufactured not to exceed the emission limits for exposure to radio frequency (RF) energy set by the Federal Communications Commission of the U.S. Government. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC L830-EA M.2 Module Hardware User Manual Page 12 of 45 compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT: In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains TX FCC ID: ZMOL830". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. L830-EA M.2 Module Hardware User Manual Page 13 of 45 2.3 Appearance The product appearance of L830-EA M.2 wireless module is shown as below: Top View： L830-EA Figure 2- 1 Top View Bottom view: Figure 2- 2 Bottom View L830-EA M.2 Module Hardware User Manual Page 14 of 45 3 Structure 3.1 Dimension Diagram of Structure Figure 3- 1 Dimension Diagram of Structure L830-EA M.2 Module Hardware User Manual Page 15 of 45 3.2 Application Interface Description L830-EA M.2 module uses 75-pin gold fingers as the external interface, the size of the module please refer to the section 3.1.As shown in Figure 4-2, L830-EA M.2 module uses the 75-pin fingers interface ( 67 pins are the signal interface and 8 pins are notch) .About the naming rules of M.2, L830-EA adopts the Type 3042-S3-B (30mmx42mm,the maximum thickness of element layer of Top surface is 1.5mm , the thickness of PCB is 0.8mm , Key ID is B ) . L830-EA M.2 Module Hardware User Manual Page 16 of 45 3.3 M.2 Connector Recommend to use the M.2 connector from LOTES, the type is APCI0026-P001A, the package of connector design please refer to the relevant specifications. As shown in Figure 3-2: Figure 3- 2 APCI0026-P001A M.2 connector dimension L830-EA M.2 Module Hardware User Manual Page 17 of 45 4 Hardware Introduction 4.1 Pin Definitions 4.1.1 Pin Map 74 72 +3.3V +3.3V 70 +3.3V 68 CLK32K 66 SIM_DETECT 64 NC 62 NC 60 NC 58 NC 56 NC 54 NC 52 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 NC NC TX_BLANKING SYSCLK GNSS_IRQ GNSS_SDA GNSS_SCL NC UIM_PWR UIM_DATA UIM_CLK UIM_RESET I2S_WA W_DISABLE2# I2S_TX I2S_RX I2S_CLK Notch Notch Notch Notch LED1#(3.3V) W_DISABLE1#(3.3V) FUL_CARD_POWER_OFF#(1.8V) +3.3V +3.3V 10 L830-EA M.2 Module Hardware User Manual CONFIG_2 GND GND 75 73 71 CONFIG_1 69 RESET# 67 ANTCTL3 65 ANTCTL2 63 ANTCTL1 61 ANTCTL0 59 GND 57 NC 55 NC GND NC NC GND NC NC GND SSIC-RXP SSIC-RXN GND SSIC-TXP SSIC-TXN GND DPR WOWWAN# CONFIG_0 Notch Notch Notch Notch GND USB DUSB D+ GND GND 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 11 Page 18 of 45 CONFIG_3 Figure 4-2 Pin Diagram (TOP View) 4.1.2 Description of Pins Pins of L830-EA M.2 modules are described in the table below: Pin# PIN Name I/O Reset Idle Value Value Description The internal connected with GND, CONFIG_3 L830-EA M.2 module shall configure as the WWAN-SSIC0 interface type. Main power supply, voltage range: +3.3V GND +3.3V GND FUL_CARD_POWER_OFF# USB D+ I/O W_DISABLE1# USB D- I/O 10 LED1# 11 GND GND 12 Notch Notch 13 Notch Notch 14 Notch Notch 15 Notch Notch 16 Notch Notch 17 Notch Notch 18 Notch Notch 19 Notch Notch 20 I2S_CLK L830-EA M.2 Module Hardware User Manual PI 3.135V ~ 4.4V GND Main power supply, voltage range: PI 3.135V ~ 4.4V GND PU PU Power off control signal, internal 200K pull-down resistor, CMOS 1.8V USB2.0 signal + PD PU WWAN Disable, Low active, CMOS 3.3V USB2.0 signal - OD PD OD System status LED, drain output , active low , CMOS 3.3V I2S serial clock，CMOS 1.8V , Page 19 of 45 (Not supported yet ) Not connected. 21 CONFIG_0 NC NC L830-EA M.2 module shall configure as the WWAN-SSIC0 interface type. 22 I2S_RX PD 23 WOWWAN# PD PU 24 I2S_TX PD 25 DPR PD PU 26 W_DISABLE2# PD PU 27 GND I2S serial data input, CMOS 1.8V , (Not supported yet ) The module wake-up Host device signal, active low, CMOS 1.8V I2S serial data output，CMOS 1.8V , (Not supported yet ) Body SAR Detect，CMOS 1.8V GPS Disable signal, active low, CMOS 1.8V（not supported yet） GND I2S left and right channel clock 28 I2S_WA PD (LRCK) , CMOS 1.8V , (Not supported yet ) 29 SSIC-TXN 30 UIM_RESET 31 SSIC-TXP 32 UIM_CLK 33 GND 34 UIM_DATA I/O 35 SSIC-RXN 36 UIM_PWR 37 SSIC-RXP 38 NC 39 GND USB SSIC Transmit data minus PP PP USIM card reset signal USB SSIC Transmit data plus PP PP USIM card clock signal GND PU PU USIM card data signal， internal 4.7K pull-up resistor USB SSIC Receive data minus SIM card power supply output， 1.8V/3.0V USB SSIC Receive data plus NC GND I2C serial data clock signal， 40 GNSS_SCL PU PU internal 4.7K pull-up resistor， CMOS 1.8V L830-EA M.2 Module Hardware User Manual Page 20 of 45 41 NC NC I2C serial data clock signal， 42 GNSS_SDA I/O PU PU internal 4.7K pull-up resistor， CMOS 1.8V 43 NC 44 GNSS_IRQ 45 GND 46 SYSCLK 47 NC NC PU PU Win8/Android dual system switch interrupt input signal, CMOS 1.8V GND PD 26MHz clock signal output NC GSM TDMA Timer output signal， 48 TX_BLANKING External GPS control signal , CMOS 1.8V 49 NC NC 50 NC NC 51 GND 52 NC NC 53 NC NC 54 NC NC 55 NC NC 56 NC NC 57 GND 58 NC 59 ANTCTL0 60 NC GND GND NC Tunable antenna control signal,bit0, CMOS 1.8V. (Not supported yet) NC Tunable antenna control signal, MIPI 61 ANTCTL1 RFFE SDATA, CMOS 1.8V . (Not supported yet) 62 NC NC Tunable antenna control signal, MIPI 63 ANTCTL2 RFFE SCLK, CMOS 1.8V. (Not supported yet) L830-EA M.2 Module Hardware User Manual Page 21 of 45 64 NC NC Tunable antenna control signal, MIPI 65 ANTCTL3 RFFE VIO, CMOS 1.8V . (Not supported yet) 66 SIM_DETECT PU PU 67 RESET# PU PU 68 CLK32K PD SIM Detect，CMOS 1.8V,390K ohm pull-up resistor External reset signal input, pull up(100K ohms),CMOS 1.8V 32KHz clock output The inside connect with GND， 69 CONFIG_1 L830-EA M.2 module configure as the WWAN-SSIC0 interface type. 70 +3.3V 71 GND 72 +3.3V 73 GND 74 +3.3V Main power supply input, PI voltage range: 3.135V ~ 4.4V GND Main power supply input, PI voltage range: 3.135V ~ 4.4V GND Main power supply input , PI voltage range: 3.135V ~ 4.4V The inside connect with GND， 75 CONFIG_2 L830-EA M.2 module configure as the WWAN-SSIC0 interface type. PI：Power Input H：High Voltage Level L：Low Voltage Level PD：Pull-Down PU：Pull-Up T：Tristate OD：Open Drain PP：Push-Pull Note : the unused pins can NC directly while designing. L830-EA M.2 Module Hardware User Manual Page 22 of 45 5 Hardware Interface 5.1 Power Interface 5.1.1 Power Supply L830-EA M.2 modules require 3.135V ~ 4.4V direct current power supply, which can provide the maximum GSM emission current of 2A. Input power supply requirements: Parameter Minimum Value Recommended Value Maximum Value Unit +3.3V 3.135 3.3 4.4 Points for attention in design: 1. Supply voltage fluctuation shall be lower than 200mV. 2. Minimum supply voltage drop shall be higher than 3.135V. The filter capacitor design of power supply circuit as follows: Recommended capacitor Application Description 330uF Supply capacitance 1uF,100nF Digital signal noise 39pF,33pF 700 /850 /900 MHz 18pF,8.2pF,6.8pF 800/1700/1800/1900, 2100/2600MHz Reduce power-supply fluctuation during phone call. The capacitance value bigger is better Filter the interference caused by clock and digital signals Filter RF interference Filter RF interference 5.1.2 VIO_1V8 As the power supply for the digital circuit inside the module, VIO_1V8 can be used as the module`s reference level of the status index signal and digital signal. Only used for internal circuit. Parameter Minimum Value L830-EA M.2 Module Hardware User Manual Recommended Value Maximum Value Unit Page 23 of 45 VIO_1V8 1.7135 1.8 1.8865 VIH 0.7* VSD2_1V8 1.8 1.8865 VIL -0.3 0.3* VSD2_1V8 5.2 Power on/off and Reset Signal L830-EA M.2 wireless modules provide two control signals to power on /power off and reset the modules. Pins definition as listed below : Pin# Pin Name Electrical Level Description FUL_CARD_POWER_OFF# CMOS 1.8V Power on/off signal 67 RESET# CMOS 1.8V External reset signal input 5.2.1 Power on /off Signal 5.2.1.1 Power on Signal After the M.2 module is connected to the power supply, the user can through pull up the signal of “ FUL_CARD_POWER_OFF# ” to make the module power on. Timing sequence requirement of the startup pulse: Parameter Condition Minimum Value Typical Value Pulse Width Power on 20 100 Maximum Value Unit ms The timing sequence control is shown in the diagram below: L830-EA M.2 Module Hardware User Manual Page 24 of 45 Figure 5- 1 Power on Timing Control Diagram Note : the“>1s”of VBAT is the time aim at the module power supply(that is the capacitance charging). If the VBAT is already set up or supplied in the long term, then the control time that aimed at VBAT can ignore and only control the“ RESET_N”and “POWER_ON/OFF# ” . 5.2.1.2 Power off signal L830-EA M.2 module supports two power_off modes. Through the software modes to turn off the module in general condition. Only the system halted or happened exceptions, use the following hardware modes to turn off it, pull down the FUL_CARD_POWER_OFF# signal or floating . For details as listed below: ① Off modes Methods Condition Software off Send AT+CPWROFF commands. Normal power_off Pull down the Only used for system halted or happens FUL_CARD_POWER_OFF# signal exceptions and the software modes cannot be or floating used. Hardware off ① The description of hardware power_off as follows (Pull down the FUL_CARD_POWER_OFF signal or floating) : While pulling down the FUL_CARD_POWER_OFF signal or floating, the modules` PMU (Power Management Unit) will be reset, then the module will get into off modes from working modes. Note ①: the RESET_N must be pulled down before pulling down the FUL_CARD_POWER_OFF signal, and then the module will be turned off safely. The timing sequence requirements of the pulse are as follows: Parameter Condition Minimum Value Typical Value Pulse Width Power off 100 Maximum Value Unit ms The timing sequence control is shown in the diagram below: L830-EA M.2 Module Hardware User Manual Page 25 of 45 Figure 5- 2 Power off Timing Control Diagram 5.2.1.3 The Recommended Design of Power on/off The recommended design of FUL_CARD_POWER_OFF# signal is as follows: Figure 5- 3 Recommended Design of FUL_CARD_POWER_OFF# Signal 5.2.2 RESET Signal L830-EA M.2 wireless modules support external reset function. It is feasible to reset the module back to the original state by the Reset Signal. When setting the Reset Signal low for 100ms, the module will be reset and restarted. When the user uses the Reset function, the PMU inside the module will not lose power. Note: Reset signal is a sensitive signal line. In designing PCB layout, please keep the line away from RF interference, and make it well wrapped with ground wire. And it is advised to add an anti-shaking capacitor at the place close to the module end. At the same time; Reset_N signal line shall avoid the PCB edge and the surface, then reset the ESD can be avoided. The timing sequence requirements of its pulse are as follows: Parameters Condition Minimum Value Typical Value Maximum Value Unit Pulse Width Reset 100 1000 ms Recommended design: L830-EA M.2 Module Hardware User Manual Page 26 of 45 Figure 5- 4 Reset# Circuit Recommended Design 5.3 Status Indicating Signal 5.3.1 Status Indicating Pin L830-EA M.2 modules provide drain output signal for indexing RF status. Pin# Pin Name Description 10 LED1# Close or open RF network status index, ,CMOS 3.3V LED# signal description as listed below : No Status LED1# RF function opened Low level RF function closed High level Recommended design: Figure 5- 5 Recommended design of LED Status Index L830-EA M.2 Module Hardware User Manual Page 27 of 45 5.4 USB /SSIC Interface L830-EA M.2 wireless modules support USB 2.0 and USB SSIC. While the L830-EA M.2 module insert into the PC, the USB/SSIC interface will map one MBIM interface and one ACM interface in the PC side on Win8/8.1/10 system. (it will display GNSS Sensor while the ACM port is installed driver ). Through the Win8/Android switch pin can switch to three ACM ports and three NCM ports ② . For details as follows: Win8/8.1/10 system supports MBIM interface without extra drive. If you need to support GNSS you should install the corresponding ACM port drive. ③ Three AOM ports will use for sending AT command(2 of the AOM ports) and grab software LOG information (one of the AOM port). Three NCM ports are virtual network ports, mainly for initiating data traffic. Note ②: About the Win8/Android system switch refer to the section 5.7, Android system requires the corresponded drive is installed on PC. ③ Note : One of the AOM port can use for Modem COM port and initiate data services. Due to the speed of Modem COM port is too slow to up to DL 300Mbpss, so it is not suggested. The Modem COM can be used to initiate data services temporarily only while the client`s NCM port is useless. 5.4.1 USB Interface Pin# Pin Name I/O Description USB_DP I/O USB signal+ USB_DM I/O USB signal- Reference Circuit Design: Figure 5- 6 USB Interface Reference Circuit Design T101 and T102 shall be TVS with capacitance lower than 1pF . VUSB power supply has built connected within the module, so the VBUS PIN of Host side can be floating. USB_D+ and USB_D- are the high-speed differential signal line, and their highest transmission rate is L830-EA M.2 Module Hardware User Manual Page 28 of 45 480Mbps. The following requirements should be followed in designing PCB layout. USB_D+ and USB_D- signal lines should have the same length, and should be parallel; avoid right angle wiring. USB_D+ and USB_D- signal lines should be wrapped with GND at the ends. USB2.0 differential signal line should be laid at the signal layer closest to the ground layer. USB signal line shall be far away from stronger interference signal, such as power supply. Ensure impedance matching; impedance is required to be 90ohm. 5.4.2 USB SSIC Interface L830-EA M.2 wireless modules support USB Super Speed Inter-Chip（USB SSIC, achieve the high speed transmission with low consumption between the chips, meet the high bandwidth transmission requires of the 4G LTE and mobile network. The definition of USB SSIC interface as listed below: Pin# Pin Name I/O Function Description 29 SSIC_TXN 31 SSIC_TXP 35 SSIC_RXN USB SSIC Receiver Signal N，connect SSIC_TXN in AP side 37 SSIC_RXP USB SSIC Receiver Signal P，connect SSIC_TXP in AP side USB SSIC Transmitter Signal N，connect SSIC_RXN in AP side USB SSIC Transmitter Signal P，connect SSIC_RXP in AP side USB SSIC is the high-speed differential signal line, and their highest transmission rate is up to 5Gbps. The following requirements should be followed in designing PCB layout. SSIC_TXN/ SSIC_TXP and SSIC_RXN/ SSIC_RXP are two differential signal lines, the routing requires parallel and equal length, meanwhile, it requires to avoid right angle routing; TX and RX signal lines should be wrapped with GND at the ends. TX and RX signal lines require isolate. The differential signal line should be laid at the signal layer closest to the ground layer. Ensure impedance matching; impedance is required to be 100ohm. 5.5 USIM Interface L830 M.2 series wireless modules support USIM and high speed SIM cards. But 8-line intelligent USIM is not supported yet. 5.5.1 USIM Pins Pin# Pin Name I/O L830-EA M.2 Module Hardware User Manual Function Description Page 29 of 45 36 UIM_PWR USIM power supply signal 30 UIM_RESET USIM Reset Signal 32 UIM_CLK USIM clock signal 34 UIM_DATA I/O USIM data signal USIM Plug-in detection signal , 390K resistor will be pulled up 66 SIM_DETECT by default. High level indicates that SIM card is inserted. Low level indicates that card is not inserted. 5.5.2 USIM Interface Design 5.5.2.1 “Normal Closed” SIM Card Circuit Design Reference Circuit Design: Figure 5- 7 Reference Design of “Normally Closed” SIM Card Interface Normally closed SIM Connector: 1）Pull out SIM card, pin 7 and pin 8 will short-circuit . 2）Insert SIM card, pin 7 and pin 8 will disconnect. 5.5.2.2 “Normally Open” SIM Circuit Design Referenced Circuit Design: L830-EA M.2 Module Hardware User Manual Page 30 of 45 Figure 5- 8 Reference Design of “Normally Open” SIM Card Interface Normally Open SIM Connector: 1）Pull out SIM card, pin 7 and pin 8 will disconnect. 2）Insert SIM card, pin 7 and pin 8 will short-circuit Note: In order to improve EMC performance, the SIM card slot should be close to the module to the largest extent. The filter capacitor on the SIM-card signal circuit should be placed close to SIM card pin to the largest extent. ESD device (like TVS) shall be added to the SIM-card signal circuit protection. ESD device should be placed close to SIM card pin. SIM card connector shall be with shielding function, to improve the anti-jamming capability of SIM card SIM1_CD signal connection supports hot-plugging; active high level by default(change to active low through AT commands ). If the module detects the signal at high level, it means there is a card in the module. 5.5.3 Points for Attention in USIM Design SIM card interface design is very important for the normal operation of the module and SIM card. The following points need to be complied with during the design: SIM card layout and wiring must keep away from EMI interference source, like RF antenna and digital L830-EA M.2 Module Hardware User Manual Page 31 of 45 switch signal. In order to ensure signal completeness, the wire distance between the module and SIM card should not exceed 100mm. In order to avoid mutual interference, USIM_CLK and USIM_IO signals should be separated in wiring. It would be best to wrap them with ground wire respectively. SIM card signal line should be protected with ESD. These protective devices should have small capacitance (like Zener diode, etc.). Users are recommended to select ESD devices with equivalent capacitance lower than 33pF. During layout, ESD device should be close to the SIM card interface. 5.5.4 USIM Hot-Plugging L830-EA M.2 module supports SIM card status-detection function. This function allows the hot-plugging of SIM card. 5.5.4.1 Hardware Connection SIM card hot-plugging function needs to work with SIM_DETECT signal. SIM_DETECT will be at low level without SIM card; after inserting SIM card, SIM_DETECT will be at high level. Note : For “Normal closed” SIM card, as shown in the figure 5-7, SIM_DETECT signal line is connected to U2’s Pin8 (SW2), and Pin7 (SW1) is connected to the ground. When the SIM card is not inserted, SW2 and SW1 short circuit, SW2 will be at low level. When the SIM card is inserted, SW2 and SW1 will be disconnected, SIM_DETECT level will be pulled up. For “Normal opened” SIM card, as shown in the figure 5-8, SIM_DETECT signal line is connected to U2’s Pin8 (SW2), and Pin7 (SW1) will be pulled up 4.7K resistor . When the SIM card is not inserted, SW2 and SW1 will be disconnected, then SW2 will be at low level. When the SIM card is inserted, SW2 and SW1 will short circuit, SIM_DETECT level will be pulled up. 5.5.4.2 Software Settings “+MSMPD” configures AT command for the SIM card status-detection function. If set AT+MSMPD=0, SIM card status-detection function will be closed, and the module will not detect SIM_DETECT signal. If set AT+MSMPD=1, SIM card status-detection function will be in operation, and the module will detect if the SIM card is inserted by SIM_DETECT Pin. If SIM_DETECT is at high level, which indicates SIM card is inserted, the module will automatically register it to the network. L830-EA M.2 Module Hardware User Manual Page 32 of 45 If SIM_DETECT is at low level, which indicates SIM card is not inserted, the module will not register it to the network. Note: the default of +MSMPD parameter is “1”.SIM_DETECT is the detection signal. While the module first power on or plug after that, SIM_DETECT will detect if the SIM card is existing or not. Just only if the SIM_DETECT is low level, the module will cannot read SIM card. 5.6 Digital Audio L830-EA M.2 module supports digital audio I2S interface ④ that supports normal I2S mode and PCM mode. I2S interface level is 1.8V on average. I2S signal description: Pin# Pin Name I/O Description 20 I2S_CLK Bit Clock 28 I2S_WA Left and right channel clock (LRCK) 22 I2S_RX Serial data input 24 I2S_TX Serial data output ④ Note : The digital audio interface is not supported yet. 5.6.1 I2S Interface L830-EA M.2 Signal Direction Audio CODEC I2S Port I2S_CLK I2S_CLK I2S_WA I2S_LRCK I2S_RX I2S_SDOUT I2S_TX I2S_SDIN Description: I2S interface can be configured as client-server work mode. Suitable for various audio sampling frequencies(48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz, 11.025KHz and 8KHz). 5.6.2 PCM Port Description L830-EA M.2 I2S_CLK0(PCM_CLK ,PCM clock signal) L830-EA M.2 Module Hardware User Manual Signal Direction Audio CODEC PCM Port PCM_CLK（PCM clock signal） Page 33 of 45 I2S_WA0(PCM_SYNC , PCM frame PCM_SYNC（PCM frame synchronization signal) synchronization signal） I2S_RX(PCM_DIN , PCM data input) PCM_DOUT（PCM data output） I2S_TX(PCM_DOUT , PCM data output) PCM_DIN（PCM data input） Note: PCM interface can be configured as client-server work mode. Support short frame synchronization at 16, 32, 48, and 64 bit mode Support burst and continuous mode transmission Supports clock length of frame synchronization signal and rising edge/ falling edge trigger configuration of data transmission. Suitable for various audio sampling frequencies(48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz, 11.025KHz and 8KHz). Note: Cause the timing of I2S modes is easier than PCM modes and easier to fit, recommend clients to use transmission audio of I2S mode. While transmission with PCM modes, the PCM timing sequence is difficult to fit to make the tone quality become bad. 5.7 Win8/Android Switch Control Interface L830-EA M.2 module supports the Win8/Android dual system switch. Check and achieve the switch function through interrupt signal ”GNSS_IRQ”. Pin# Name I/O 44 GNSS_IRQ Description The detection signal of Win8/Android dual system switch, CMOS 1.8V The definition of GNSS_IRQ signal function as listed below : No. GNSS_IRQ High/Floating Low Function Win8 system supports, , the module`s USB ports shall set as MBIM mode. Android system supports, the module`s `USB ports shall set as 3ACM+3NCM modes. Note： 1. Check and achieve the Win8/Android system switch through GNSS_IRQ level while module starting . Keep the GNSS_IRQ level stability during starting. 2. Check and achieve the Win8/Android system switch through GNSS_IRQ rising edge/ falling edge while the module starting. The de-bouncing time sets as 100ms. The module will reboot once meeting all the requirements and switch different system supports. L830-EA M.2 Module Hardware User Manual Page 34 of 45 3. ”Win8” refers to Windows version above the Win8, including Win8 / 8.1/10 systems that support MBIM port. For the low version of Windows 7 system, still use the Android system of ACM. 5.8 W_DISABLE# Interface 5.8.1 Description of WWAN_DISABLE# Interface L830-EA M.2 module supports open/close the WWAN RF functional signal through hardware, and this function can also be controlled by AT commands. Pin# Name W_DISABLE1# I/O Description WWAN on/off signal, CMOS 3.3V The definition of W_DISABLE# signal as listed below: No. W_DISABLE# Function Low WWAN off High WWAN on Floating WWAN function is controlled by AT commands, it is on by default. 5.8.2 GPS_DISABLE# Interface L830-EA M.2 module supports open/close GPS functional signal, and this function is also controlled by AT commands. Pin# 26 Name I/O Description W_DISABLE2# GPS on/off signal , 1.8V The definition of GPS_DISABLE# signal as listed below: No. GPS_DISABLE# Function Low GPS off High GPS on Floating GPS function is controlled by AT commands, it is on by default. Note: This function is not supported yet. 5.9 TX_BLANKING Interface Output the low level by default. While the module works in GSM bands, TX_BLANKING will output the pulse signal that synchronized with GSM burst timing sequence. Because of the GSM TX will interface L830-EA M.2 Module Hardware User Manual Page 35 of 45 GPS signal receiving, suggest to close GPS or stop GPS data receiving while AP has detected the TX_BLANKING pulse signal. Pin# Name I/O Description 48 TX_BLANKING External GPS control signal 5.10 WAKEUP_Host Interface L830-EA M.2 module supports WAKEUP_Host; the pin is high level by default. Output low level while awaking host. Pin# Name I/O Description L830-EA M.2 module wakes up the Host signal, 1.8V 23 WOWWAN# signal， low level is available 5.11 BODY_SAR Interface L830-EA M.2 module supports BODY_SAR（DPR pin）. BODY_SAR is input signal(this signal is output by AP-side) and with high level by default. Low level is available. AP can detect the human body`s nearing through distance sensor, then output the BODY_SAR signal with low level. Once the module detect the signal through interrupt detection, it will reduce the TX power. The reduced threshold value can be set by AT commands. Pin# Name I/O Description 25 DPR BODY_SAR detection 5.12 I2C Interface L830-EA M.2 module supports a 12C interface and with I2C master by default. This I2C used for drive external I2C slave device, such as Audio codec and so on. Pin# Name I/O Description 42 GNSS_SDA I/O I2C control signal input/output ,1.8V signal 40 GNSS_SCL I2C control clock signal, 1.8V signal The signal connection of L830-EA I2C and external 12C slave device ( such as Audio Codec）as listed below: L830-EA M.2 Direction L830-EA M.2 Module Hardware User Manual Audio Codec I2C Port Page 36 of 45 GNSS_SDA I2C_SDA GNSS_SCL I2C_SCL 5.13 Clock Interface L830-EA M.2 module supports a 26MHz clock output and a 32KHz clock output. Pin# Name I/O 46 SYSCLK 68 CLK32K Description 26MHz clock output (recommend the external GPS to use it, and can also use as MCLK of audio codec) 32KHz clock output 5.14 Config Interface L830-EA M.2 module supports 4 config pins and the module is configured to WWAN-SSIC-0: Pin# Pin Name I/O Description Value CONFIG_3 The internal connect to GND 21 CONFIG_0 NC 69 CONFIG_1 The internal connect to GND 75 CONFIG_2 The internal connect to GND The configuration of L830-EA M.2 Socket 2 Module type as listed below : Config_0 Config_1 Config_2 Config_3 Module Type and Main Port (pin21) (pin69) (pin75) (pin1) Host Interface Configuration GND GND GND GND SSD-SATA N/A GND GND N/C GND WWAN-PCIe N/A N/C GND GND GND WWAN-SSIC 5.15 RF Interface 5.15.1 RF Connector Interface L830-EA M.2 module provide 2 RF connected interface, used for the connection of external antenna. M is the RF main antenna, D/G is the Diversity/GNSS antenna. L830-EA M.2 Module Hardware User Manual Page 37 of 45 Figure 5- 9 RF connector diagram 5.15.2 RF Connecting Seat L830-EA M.2 module adopts the Murata MM4829-2702 RF connecting seat. The dimension is 2.0*2.0*0.6mm. The structure diagram as follows : Figure 5- 10 Structure diagram of RF connecting seat L830-EA M.2 Module Hardware User Manual Page 38 of 45 Figure 5-11 0.81mm coaxial cable matching RF connector Figure 5-12 the RF connector insert into RF connecting seat 5.15.3 Main Performance of RF Connector Rated condition Frequency range Characteristic impedance Environmental condition DC to 6GHz Temperature range: 50Ω –40°C to +85°C 5.16 Other Interfaces L830-EA M.2 module does not support the GPIO and Tunable ANT interface yet. 6 Electrical and Environmental Features 6.1 Electrical Features The table below lists the range of L830-EA module ’s electrical characteristics: L830-EA M.2 Module Hardware User Manual Page 39 of 45 Parameters Minimum Value Maximum Value Unit Power supply signal 4.4 Digital signal 1.9 6.2 Environmental Features This table below shows the environmental features of L830-EA. Parameters Minimum Value Maximum Value Unit Operational Temperature -30 +65 °C Storage Temperature -40 +85 °C L830-EA M.2 Module Hardware User Manual Page 40 of 45 7 RF Interface 7.1 Operating Frequency Band The RF operating frequency band as listed below: Operating Band Description Mode Tx (MHz) Rx (MHz) Band 1 IMT 2100MHz LTE FDD/WCDMA 1920 - 1980 2110 - 2170 Band 2 PCS 1900MHz LTE FDD/WCDMA/GSM 1850 - 1910 1930 - 1990 Band 3 DCS 1800MHz LTE FDD/GSM 1710 - 1785 1805 - 1880 Band 4 AWS 1700MHz LTE FDD/WCDMA 1710 - 1755 2110 - 2155 Band 5 CLR 850MHz LTE FDD/WCDMA/GSM 824 - 849 869 - 894 Band 6 UMTS 800MHz WCDMA 830 - 840 875 - 885 Band 7 IMT-E 2600Mhz LTE FDD 2500 - 2570 2620 - 2690 Band 8 E-GSM 900MHz LTE FDD/WCDMA/GSM 880 - 915 925 - 960 Band 9 UMTS 1700MHz LTE FDD 1749.9 -1784.9 1844.9 -1879.9 Band 13 USMH Block C LTE FDD 777 - 787 746 - 756 Band 17 LSMH Blocks B/C LTE FDD 704 - 716 734 - 746 LTE FDD 815 - 830 860 - 875 LTE FDD 830 - 845 875 - 890 Band 18 Band 19 Japan Lower 800Mhz Japan Upper 800Mhz Band 20 EUDD 800MHz LTE FDD 832 - 862 791 - 821 Band 26 ECLR 850MHz LTE FDD 814 - 849 859 - 894 Band 29 LSMH blocks D/E LTE FDD N/A 716 - 728 GPS L1 GLONASS L1 L830-EA M.2 Module Hardware User Manual 1574.42 -1576.42 1597.55 -1605.89 Page 41 of 45 7.2 Receiving Sensitivity For different modes , the receiving sensitivity of L830-EA bands as listed below : Mode GSM WCDMA LTE FDD Band Rx Sensitivity(dbm) Note GSM850 -109 BER<2.43% GSM900 -109 BER<2.43% DCS1800 -109 BER<2.43% PCS1900 -109 BER<2.43% Band 1 -110 BER<0.1% Band 2 -110 BER<0.1% Band 4 -110 BER<0.1% Band 5 -110 BER<0.1% Band 6 -110 BER<0.1% Band 8 -110 BER<0.1% Band 1 -101 10MHz Band width Band 2 -99 10MHz Band width Band 3 -101 10MHz Band width Band 4 -100 10MHz Band width Band 5 -101 10MHz Band width Band 7 -98 10MHz Band width Band 8 -100 10MHz Band width Band 9 -100 10MHz Band width Band 13 -100 10MHz Band width Band 17 -100 10MHz Band width Band 18 -100 10MHz Band width Band 19 -100 10MHz Band width Band 20 -101 10MHz Band width Band 26 -100 10MHz Band width Band 29 -100 10MHz Band width Note : The above values are tested in the double antenna situation (Main+Diversity). If used the single antenna (without Diversity), the value of sensitivity will accordingly drop by some 3dbm. L830-EA M.2 Module Hardware User Manual Page 42 of 45 7.3 GNSS L830-EA M.2 module supports GPS , GLONASS and aGPS. The antenna with RF Diversity and GNSS.Through the AT order can open or close the GNSS functions, please reference the AT order manual. For Android system, GNSS output by ACM according to the data format of NEMA0183 , and the baud rate is 115200; For Win8/8.1/10 system, GNSS output by GNSS Sendor. Description Condition Test Result GPS fixing 70mA GPS tracking 70mA GLONASS fixing 65mA GLONASS tracking 65mA Sleep 3.5mA Cold start 38s/–130dBm Warm start 35s/–130dBm Hot Start 1s/–130dBm (GPS signal powers off 1s) aGPS Cold start 1s/–130dBm GPS –158dBm –160dBm GLONASS –157dBm –158dBm Power GPS/ TTFF Sensitivity GLONASS Note：The current of GNSS is testing under the situation of RF disable. 7.4 RF PCB Design 7.4.1 Wiring Principle L830-EA adopts double RF antennas, the MAIN_ANT used for transmitting and receiving, the DIV_ANT used for receiving. On the one hand, diversity antenna can improve the receiving sensitivity, on the other hand, it can also improve the download speed. Because the L830-EA project is for LTE module, the Antenna need double antennas can meet the performance requirements. 7.4.2 Impedance Design The impedance of RF signal line of antenna interface needs to be controlled at 50 ohm. L830-EA M.2 Module Hardware User Manual Page 43 of 45 7.5 Antenna Design 7.5.1 Main Antenna Design Requirements (1) Antenna efficiency Antenna efficiency is the ratio of the input power and radiant power. Because of the antenna’s return loss, material loss and coupling loss, the radiant power is always lower than the input power. The ratio is recommended to be > 40% (–4dB). (2) S11 or VSWR S11 shows the matching degree of the antenna’s 50 ohm impedance, which affects antenna efficiency to a certain extent. It is feasible to use VSWR testing method to measure the index. It is recommended that S11 < –10dB. (3) Polarization Polarization is the rotation direction of the electric field of the antenna at the direction of the largest radiation. It is recommended to use linear polarization; for diversity antenna, it is recommended to use different polarization directions from that of the main antenna. (4) Radiation pattern Radiation pattern refers to the electromagnetic field intensity at various directions in the far field of the antenna. Half-wave doublet antenna is the perfect terminal antenna. In the case of built-in antenna, it is recommended to use PIFA. Antenna area: H 6mm * W 10mm * L 100mm. It is recommended to use PIFA or IFA. Antenna radiation direction: Omni-directional. (5) Gain and directivity Antenna directivity refers to the electromagnetic field intensity at various directions of the electromagnetic wave. Gain is the combination of the antenna efficiency and antenna directivity. It is recommended that antenna gain ≤ 3dBi. (6) Interference In addition to antenna performance, other interference from the PCB will also affect the module performance. In order to ensure the high performance of the module, the interference must be under control. Suggestions: keep speaker, LCD, CPU, FPC wiring, audio circuit, and power supply away from the antenna; add appropriate separation and shielding devices, or conduct filtering on the path. (7) TRP/TIS L830-EA M.2 Module Hardware User Manual Page 44 of 45 TRP (Total Radiated Power)： GSM850/900>28dBm DCS1800/PCS1900 >25dBm WCDMA Band 1, 2, 4, 5, 6, 8>19dBm LTE FDD Band 1, 2, 3, 4, 5, 7, 8, 9, 13, 17, 18, 19, 20, 26 >19dBm TIS (Total Isotropic Sensitivity)： GSM850/900/DCS1800/PCS1900 <-102dBm WCDMA Band 1, 2, 4, 5, 6, 8<-102dBm LTE FDD Band 1, 2, 3, 4, 5, 7, 8, 9, 13, 17, 18, 19, 20, 26 <-95dBm (10MHz Band width) L830-EA M.2 Module Hardware User Manual Page 45 of 45
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