Fibocom Wireless L850GLL LTE module User Manual

L850-GL Hardware User Manual

Version：V1.0.3

Update date：2/25/2017

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L850-GL Hardware User Manual

No. Product model

1

L850-GL

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-

Description

NA

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L850-GL Hardware User Manual

Copyright

Without the prior written

permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product vers

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Version Record

Version Update date

Remark

V1.0.0 2016-12-08 Draft

V1.0.1

2016-12-16

Modify the PCIe Interface Application;

Update the Pin Definition: change pin65 to NC

V1.0.2

2017-02-09

Modify the description

Update the content of PCIe

Add the power Consumption of 3CA

V1.0.3 2017-02-25

Add product certification of warnings

forbidden without Fibocom Wireless Inc. written authorization

-

permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

The document is subject to update from time to time owing to the product vers

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Remark

Modify the PCIe Interface Application;

Update the Pin Definition: change pin65 to NC

Modify the description

Update the content of PCIe

Add the power Consumption of 3CA

Add product certification of warnings

Page 3 of 51

permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

The document is subject to update from time to time owing to the product vers

ion upgrade or other

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Reproduction

forbidden without Fibocom Wireless Inc. written authorization

L850-GL Hardware User Manual

Contents

1

Foreword

................................

1.1 Introduction

................................

1.2 Reference Standard

................................

1.3 Related Documents

................................

2

Overview

................................

2.1 Introduction

................................

2.2 Specification

................................

2.3 Warnings

................................

2.3.1

FCC Statement

................................

2.3.2

IC Statement

................................

2.3.3

CE Statement

................................

2.4 CA combinations

................................

2.5 Application Framework

................................

2.6 Hardware Framework

................................

3

Application Interface

................................

3.1 M.2Interface

................................

3.1.1

Pin Distribution

................................

3.1.2

Pin Definition

................................

3.2 Power Supply

................................

3.2.1

Power Supply

................................

3.2.2

Logic level

................................

3.2.3

Power Consumption

3.3 Control Signal

................................

3.3.1

Module Start-Up

................................

3.3.1.1

Start-upCircuit

................................

3.3.1.2

Start-upTiming

Sequence

3.3.2

Module Shutdown

................................

3.3.3

Module Reset

................................

3.4 USB Interface

................................

3.4.1

USB Interface

Definition

3.4.2

USB2.0 Interface

Application

3.5 PCIe Interface

................................

3.5.1

PCIe Interface

Definition

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Power Consumption

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Sequence

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Definition

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Application

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Definition

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L850-GL Hardware User Manual

3.5.2

PCIe Interface

Application

3.6 USIMInterface

................................

3.6.1

USIM Pins

................................

3.6.2

USIM Interface

Circuit

3.6.2.1

N.C. SIMCard

Slot

3.6.2.2

N.O. SIM Card

Slot

3.6.3

USIM Hot-Plugging

................................

3.6.4

USIM Design

................................

3.7 Status Indicator

................................

3.7.1

LED#1Signal

................................

3.7.2

WOWWAN#

................................

3.7.3

TX_BLANKING

................................

3.8 Interrupt Control

................................

3.8.1

W_DISABLE1#

................................

3.8.2

BODYSAR

................................

3.9 ClockInterface

................................

3.10 ANT Tunable Interface

................................

3.11 Config Interface

................................

3.12 Other Interfaces

................................

4

Radio Frequency

................................

4.1 RF Interface

................................

4.1.1

RF Interface Fu

nctionality

4.1.2

RFConnector Characteristic

4.1.3

RF Connector

Dimension

4.2 Operating Band

................................

4.3 Transmitting Power

................................

4.4 Receiver Sensitivity

................................

4.5 GNSS

................................

4.6 Antenna Design

................................

5

Structure Specification

................................

5.1 Product Appearance

................................

5.2 Dimension of Structure

................................

5.3 M.2 Interface Model

................................

5.4 M.2 Connector

................................

5.5 Storage

................................

forbidden without Fibocom Wireless Inc. written authorization

-

Application

................................................................

................................

................................................................

................................

Circuit

................................................................

................................

Slot

................................................................

................................

Slot

................................................................

................................

................................................................

................................

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nctionality

................................................................

................................

RFConnector Characteristic

................................................................

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Dimension

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L850-GL Hardware User Manual

5.5.1

Storage Life

................................

5.6 Packing

................................

5.6.1

Tray Package

................................

5.6.2

Tray size

................................

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Page 6 of 51

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L850-GL Hardware User Manual

1

Foreword

1.1

Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L850-GL

(hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

develop products.

1.2

Reference

Standard

The design of the product complies with

3GPP TS 34.121-

1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission

and reception (FDD);Part 1: Conformance specification



3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio

tr

ansmission and reception (TDD)

3GPP TS 36.521-

1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing



3GPP TS 21.111 V10.0.0: USIM and IC card requirements



3GPP TS 51.011 V4.15.0: Specifica

(SIM-ME) interface



3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application



3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Applic



3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals

and ancillary equipment



3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)



3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipme

(DTE -

DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)



PCI Express M.2 Specification Rev1.0

1.3



L850 Module Performance Testing Report



RF Antenna Application Design

L8-

Family System Driver Integration and Application Guidance

L8-

Family AT CommandsManual

forbidden without Fibocom Wireless Inc. written authorization

-

The document describes the electrical characteristics, RF performance, dimensions and application

(hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

Standard

The design of the product complies with

the following standards:

1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission

and reception (FDD);Part 1: Conformance specification

3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio

ansmission and reception (TDD)

1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing

3GPP TS 21.111 V10.0.0: USIM and IC card requirements

3GPP TS 51.011 V4.15.0: Specifica

tion of the Subscriber Identity Module -

Mobile Equipment

3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Applic

3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals

3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipme

nt -

Data Circuit terminating Equipment

DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

PCI Express M.2 Specification Rev1.0

Documents

L850 Module Performance Testing Report

RF Antenna Application Design

Specification

Family System Driver Integration and Application Guidance

Family AT CommandsManual

Page 7 of 51

The document describes the electrical characteristics, RF performance, dimensions and application

(hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission

3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio

1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission

Mobile Equipment

3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Applic

ation Toolkit(USAT)

3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals

Data Circuit terminating Equipment

DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

Reproduction

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L850-GL Hardware User Manual

2

Overview

2.1

Introduction

L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface

and

supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication

networks of the mobile operator across the world.

2.2

Specification

Operating Band

LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66

LTE TDD: Band 38, 39, 40, 41

WCDMA/HSPA+: Band 1,2,4,5,8

GNSS/Beidou: support

Data Transmission

LTE FDD

LTE TDD

UMTS/HSPA+

Power Supply DC 3.135V

～

Temperature

Normal operating temperature:

Expand

operating temperature:

Storage temperature:

Physical

characteristics

Interface: M.2 Key

Dimension

：

Weight: About5.8 g

Interface

Antenna

WWAN Main Antenna x 1

WWAN Diversity Antenna x 1

forbidden without Fibocom Wireless Inc. written authorization

-

L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface

supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication

networks of the mobile operator across the world.

LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66

LTE TDD: Band 38, 39, 40, 41

WCDMA/HSPA+: Band 1,2,4,5,8

GNSS/Beidou: support

450Mbps DL/50Mbps UL(Cat 9)

260Mbps DL/30Mbps UL(Cat 9)

When LTE TDD achieves maximum DL rate, its UL rate can

reach 10Mbps only

UMTS/HSPA+

UMTS:384 kbps DL/384 kbps UL

DC-

HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

～

4.4V,Typical 3.3V

Normal operating temperature:

-10°C ～+55°C

operating temperature:

-20°C ～+70°C

Storage temperature:

-40°C ～+85°C

Interface: M.2 Key

-B

：

30 x 42 x 2.3mm

Weight: About5.8 g

WWAN Main Antenna x 1

WWAN Diversity Antenna x 1

Page 8 of 51

L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface

supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication

LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66

When LTE TDD achieves maximum DL rate, its UL rate can

HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

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L850-GL Hardware User Manual

Function Interface

USIM

3V/1.8V

USB 2.0（

just for debugging

PCIe 1.0 X1

W_Disable#

BodySar

LED

Clock

Tunable antenna

I2S(Reserved)

I2C(Reserved)

USB3.0(not supported yet)

Software

Protocol Stack IPV4/IPV6

AT commands

3GPP TS 27.007 and 27.005

Firmware update PCIe

Other feature

Multiple carrier

Windows MBIM support

Windows update

AGNSS

Note:

For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature

ranging from -20℃

to +60

2.3

Warnings

2.3.1

FCC Statement

Federal

Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

(1) This device may not cause harmful interference, and (2) this device must accept any interferenc

received, including interference that may cause undesired operation.

forbidden without Fibocom Wireless Inc. written authorization

-

3V/1.8V

just for debugging

）

Tunable antenna

I2S(Reserved)

I2C(Reserved)

USB3.0(not supported yet)

3GPP TS 27.007 and 27.005

Multiple carrier

Windows MBIM support

Windows update

For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature

to +60

℃.

Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

(1) This device may not cause harmful interference, and (2) this device must accept any interferenc

received, including interference that may cause undesired operation.

Page 9 of 51

For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature

Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interferenc

e

Reproduction forbidden without Fibocom Wireless Inc. w

L850-GL Hardware User Manual

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to pr

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off

interference by one of the following measures:



Reorient or relocate the receiving antenna.



Increase the separation between the equipment and receiver.



Connect the equipment into an outlet on a circu

to which the receiver is connected.



Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:



Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's

authority to operate this

This transmitter must not be co-

located or operating in conjunction with any other antenna or

transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an unc

This equipment should be installed and operated with

your body.

This device is intended only for OEM integrators under the following conditions:

1)

The antenna must be installed such that 20

users, and the maximum antenna gain allowed for use with this device is 5

2)

The transmitter module may not be co

As long as 2 conditions above are met, further

integrator is still responsible for testing their end

required with this module installed

Reproduction forbidden without Fibocom Wireless Inc. w

ritten authorization -

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off

and on, the user is encouraged to try to correct the

interference by one of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circu

it different from that

to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could

authority to operate this

equipment.

located or operating in conjunction with any other antenna or

This equipment complies with FCC radiation exposure limits set forth for an unc

This equipment should be installed and operated with minimum distance 20cm

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20

cm is maintained between the antenna and

users, and the maximum antenna gain allowed for use with this device is 5

dBi.

The transmitter module may not be co

-located with any other transmitter or

antenna.

As long as 2 conditions above are met, further

transmitter

test will not be required. However, the OEM

integrator is still responsible for testing their end

-

product for any additional compliance requirements

Page 10 of 51

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

ovide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

and on, the user is encouraged to try to correct the

Any changes or modifications not expressly approved by the party responsible for compliance could

located or operating in conjunction with any other antenna or

This equipment complies with FCC radiation exposure limits set forth for an unc

ontrolled environment.

minimum distance 20cm

between the radiator &

This device is intended only for OEM integrators under the following conditions:

cm is maintained between the antenna and

dBi.

antenna.

test will not be required. However, the OEM

product for any additional compliance requirements

Reproduction forbidden without Fibocom Wireless Inc. w

L850-GL Hardware User Manual

IMPORTANT NOTE:

In the event that these conditions

configurations or co-location with

another

valid and the FCC ID can not be

used

be responsible for re-

evaluating the end product (including the transmi

authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product m

visible area with the following: “

Contains FCC ID: ZMOL850GL

only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory

2.3.2

IC Statement



This device complies with Industry Canada license

the following two conditions:

1)

this device may not cause interference,

2)

this device must accept any interference, including interference that may cause undesired

operation of the device.



Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux

exempts de licence. L'exploitation

1)

l'appareil ne doit pas produire de brouillage,

2)

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le



This Class B digital apparatus complies with Canadian



Cet appareil numérique de la classe B est conforme à la norme NMB



This device complies with RSS

devic

e does not cause harmful

 Cet appareil est conforme à

la

condition que cet appareil ne provoque aucune interférence

Reproduction forbidden without Fibocom Wireless Inc. w

ritten authorization -

In the event that these conditions

can not be met

(for example certain laptop

another

transmitter), then the FCC authorization

used

on the final product. In these

circumstances,

evaluating the end product (including the transmitter) and obtaining a separate FCC

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product m

Contains FCC ID: ZMOL850GL

L

”. The grantee's FCC ID can be used

only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual.

Industry Canada statement

This device complies with Industry Canada license

-

exempt RSS standard(s). Operation is

this device may not cause interference,

and

this device must accept any interference, including interference that may cause undesired

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux

exempts de licence. L'exploitation

est autorisée aux deux conditions

suivantes:

l'appareil ne doit pas produire de brouillage,

et

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le

fonctionnement.

This Class B digital apparatus complies with Canadian

ICES-003.

Cet appareil numérique de la classe B est conforme à la norme NMB

-

003 du

This device complies with RSS

-

310 of Industry Canada. Operation is subject to the condition

e does not cause harmful

interference.

la

norme RSS-310 d'Industrie Canada.

L'opération

condition que cet appareil ne provoque aucune interférence

nuisible.

Page 11 of 51

(for example certain laptop

is no longer considered

circumstances,

the OEM integrator will

tter) and obtaining a separate FCC

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product m

ust be labeled in a

”. The grantee's FCC ID can be used

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

information/warning as show in this manual.

exempt RSS standard(s). Operation is

subject to

this device must accept any interference, including interference that may cause undesired

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux

appareils radio

suivantes:

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

003 du

Canada.

310 of Industry Canada. Operation is subject to the condition

that this

L'opération

est soumise à la

Reproduction forbidden without Fibocom Wireless Inc. w

L850-GL Hardware User Manual

 This device and its

antenna(s)

antenna or transmitter, except tested built



Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec

antenne ou un autre émetteur, ex



The County Code Selection feature is disabled for products marketed in the US/

 La fonction de sélection de

l'indicatif

États-Unis et au Canada.

Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator &

body.

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

distance ent

re la source de rayonnement et votre corps.

IC : 21374-L850GL

2.3.3

CE Statement

► EU Regulatory Conformance

Hereby, We, Manufacturer name declares that the radio equipment type L850

the Directive 2014/53/EU.

In all cases assessment

of the final product must be mass against the Essential requirements of the

Directive 2014/53/EU

Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

3.2 requirements.

The maximum antenna gain for

is 5 dBi

►

Declaration of Conformity(should include manufacturer contact info.)

Please added certification standard in your user manual which depended on the test standards your

device performed.,

If the DoC should be a simplified ve

full text of the EU declaration of conformity is available at the following internet address: http//

fibocom.com

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ritten authorization -

antenna(s)

must not be co-located or operating in

conjunction

antenna or transmitter, except tested built

-in radios.

Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec

antenne ou un autre émetteur, exception faites des radios intégrées qui ont été

The County Code Selection feature is disabled for products marketed in the US/

l'indicatif

du pays est désactivée pour les

produits

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator &

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

re la source de rayonnement et votre corps.

Hereby, We, Manufacturer name declares that the radio equipment type L850

-

GL is in compliance with

of the final product must be mass against the Essential requirements of the

Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

is 5 dBi

and the antenna

separation distance is 20cm.

Declaration of Conformity(should include manufacturer contact info.)

Please added certification standard in your user manual which depended on the test standards your

If the DoC should be a simplified version, please take below as reference,

full text of the EU declaration of conformity is available at the following internet address: http//

Page 12 of 51

conjunction

with any other

Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec

une autre

ception faites des radios intégrées qui ont été

testées.

The County Code Selection feature is disabled for products marketed in the US/

Canada.

produits

commercialisés aux

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator &

your

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

GL is in compliance with

of the final product must be mass against the Essential requirements of the

Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

separation distance is 20cm.

Please added certification standard in your user manual which depended on the test standards your

rsion, please take below as reference,

The

full text of the EU declaration of conformity is available at the following internet address: http//

www.

Reproduction forbidden without Fibocom Wireless Inc. w

L850-GL Hardware User Manual

L850-

GL is in conformity with the relevant Union

2014 / 53 / EUwith reference to the following standards applied:

Health (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

EN 62311 : 2008

Safety (Article 3.1(a) of Directive 2014/53/EU)

Applied Standard(s):

EN 60950-

1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013

Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)

Applied Standard(s):

Draft EN 301 489-1 V2.1.1 / -

3 V2.1.0 /

Radio frequency spectrum

usage (Article 3.2 of Directive 2014/53/EU)

Applied Standard(s):

Draft EN 301 511 V12.1.10

EN 301 908-1 V11.1.1 / -

2 V11.1.1 /V11.1.1

2.4

CA

combination

CA Combinations

2CA

Inter-band

Intra-band

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ritten authorization -

GL is in conformity with the relevant Union

harmonization legislation: Radio Equipment directive:

2014 / 53 / EUwith reference to the following standards applied:

Health (Article 3.1(a) of Directive 2014/53/EU)

Safety (Article 3.1(a) of Directive 2014/53/EU)

1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013

Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)

3 V2.1.0 /

-52 V1.1.0

usage (Article 3.2 of Directive 2014/53/EU)

2 V11.1.1 /V11.1.1

combination

s

1+3,5,18,19,20,21,26

2+4,5,12,13,17,29,30,66

3+5,7,8,19,20,28

4+5,12,13,17,29,30

5+7,30,66

7+20,28

12+30

13+66

29+30

2,3,4,7,40,41

Page 13 of 51

harmonization legislation: Radio Equipment directive:

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L850-GL Hardware User Manual

CA Combinations

3CA

Inter-band

2 contiguous plus inter

2.5

Application

Framework

The peripheralapplicationsfor L850 module are shown in Figure 2

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ritten authorization -

1+3+7, 1+3+19, 1+3+20,

1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2 contiguous plus inter

-band

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

5+66+66, 13+66+66, 66+66+2, 66+66+66

Framework

The peripheralapplicationsfor L850 module are shown in Figure 2

-1:

Figure2-1 Application Framework

Page 14 of 51

1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30

5+66+66, 13+66+66, 66+66+2, 66+66+66

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L850-GL Hardware User Manual

2.6

Hardware

Framework

The hardware framework in Figure 2

base band and RF functions.

Baseband contains the followings:



GSM/UMTS/LTE FDD controller/Power supply



NAND/internal LPDDR2 RAM

Application interface

RF contains the followings:

RF Transceiver

RF Power/PA

RF Front end

RF Filter

Antenna

3 Application

Interface

3.1

M.2Interface

The L850 module applies standard M.2 Key

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Framework

The hardware framework in Figure 2

-

2 shows the main hardware functions of L850 module,

GSM/UMTS/LTE FDD controller/Power supply

NAND/internal LPDDR2 RAM

Figure 2-2 Hardware Framework

Interface

The L850 module applies standard M.2 Key

-B interface, with a total of 75 pins.

Page 15 of 51

2 shows the main hardware functions of L850 module,

including

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L850-GL Hardware User Manual

3.1.1

Pin Distribution

Note:

Pin “Notch” represents the gap of t

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ritten authorization -

Figure 3-1 Pin Distribution

Pin “Notch” represents the gap of t

he gold fingers.

Page 16 of 51

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L850-GL Hardware User Manual

3.1.2

Pin Definition

The pin definition is as follows:

Pin Name I/O

Reset Value

1

CONFIG_3

O

NC

2

+3.3V PI

3

GND

4

+3.3V PI

5

GND

6

FUL_CARD_

POWER_OFF#

I

PU

7

USB D+ I/O

8

W_DISABLE1#

I

PD

9

USB D- I/O

10

LED1#

O

T

11 GND

12 Notch

13 Notch

14 Notch

15 Notch

16 Notch

17 Notch

18 Notch

19 Notch

20

I2S_CLK

O

PD

21

CONFIG_0

GND

22 I2S_RX

I

PD

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ritten authorization -

Reset Value

Pin Description

NC

NC,L850 M.2 module is configured as

the WWAN –

PCIe,USB3.0 interface

type

Power input

GND

Power input

GND

PU

Power enable,Module

power

input,internal pull up

USB Data Plus

PD

WWAN Disable,active low

USB Data Minus

System status LED,Output

drain,CMOS 3.3V

GND

Notch

PD

I2S Serial clock,

Reserved

GND

GND,L850 M.2 module is configured as

the WWAN –

PCIe,USB3.0 interface

type

PD

I2S Serial receive data,

Page 17 of 51

Type

NC,L850 M.2 module is configured as

PCIe,USB3.0 interface

Power Supply

power

on

CMOS

3.3/1.8V

0.3---3V

CMOS

3.3/1.8V

0.3---3V

open

CMOS 3.3V

Power Supply

CMOS 1.8V

GND,L850 M.2 module is configured as

PCIe,USB3.0 interface

CMOS 1.8V

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L850-GL Hardware User Manual

Pin Name I/O

Reset Value

23 WOWWAN#

O

PD

24

I2S_TX

O

PD

25

DPR

I

PU

26

W_DISABLE2#

I

PU

27 GND

28

I2S_WA

O

PD

29

USB3.0‐Tx‐

O

30 UIM_RESET

O

L

31

USB3.0‐Tx+

O

32 UIM_CLK

O

L

33 GND

34 UIM_DATA I/O

L

35

USB3.0‐Rx‐

I

36 UIM_PWR

O

37

USB3.0‐Rx+

I

38 NC

39 GND

40

GNSS_SCL

O

PU

41

PETn0

O

42

GNSS_SDA

I/O

PU

43 PETp0

O

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Reset Value

Pin Description

Reserved

PD

Wake up host

PD

I2S Serial transmit data,

Reserved

PU

Body SAR Detect,active low

PU

GNSS disable,active low,

Reserved

GND

PD

I2S Word alignment/select,

Reserved

USB3.0 Transmit data minus,

Not support now

SIM reset signal

USB3.0 Transmit data plus,

Not support now

SIM clock Signal

GND

SIM data input/output

USB3.0 receive data minus,

Not support now

SIM power supply,3V/1.8V

USB3.0 receive data plus,

Not support now

NC

GND

PU

I2C Serial clock,

Reserved

PCIe TX Differential signals

Negative

PU

I2C Serial data input/output,

Reserved

PCIe TX Differential signals Positive

Page 18 of 51

Type

CMOS 1.8V

CMOS

3.3/1.8V

CMOS

3.3/1.8V

Power Supply

CMOS 1.8V

1.8V/3V

Power Supply

1.8V/3V

Power Supply

CMOS 1.8V

PCIe TX Differential signals Positive

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L850-GL Hardware User Manual

Pin Name I/O

Reset Value

44

GNSS_IRQ

I

PD

45 GND

46 SYSCLK

O

PD

47

PERn0

I

48 TX_BLANKING

O

PD

49 PERp0

I

50

PERST#

I

T

51 GND

52

CLKREQ#

O

T

53

REFCLKN

I

54

PEWAKE#

O

L

55

REFCLKP

I

56

RFE_RFFE2_

SCLK

O

57 GND

58

RFE_RFFE2_

SDATA

O

59 ANTCTL0

O

60

COEX3

O

PD

61 ANTCTL1

O

62

COEX2

I

T

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Reset Value

Pin Description

PD

GNSS Interrupt Request,

Reserved

GND

PD

26M clock output

PCIe RX Differential signals

Negative

PD

PA Blanking Timer

PCIe RX

Differential signals Positive

PE-

Reset is a functional reset to the

Add-

In card as defined by the PCIe Mini

Card CEM specification

GND

Clock Request is a reference clock

request

signal as defined by the PCIe

Mini Card CEM specification; Also used

by L1 PM Substates

PCIe Reference Clock signal

Negative

PCIe PME Wake. Open Drain with pull

up on platform,active low

PCIe Reference Clock signal

Positive

MIPI Interface Tunable ANT,

RFFE2 clock,Open Drain output

GND

MIPI Interface Tunable ANT,

RFFE2 data,Open Drain output

Tunable ANT CTRL0

PD

Wireless Coexistence between WWAN

and WiFi/BT modules. IDC_UART_TXD,

Reserved

Tunable ANT CTRL1

Wireless Coexistence

between WWAN

and WiFi/BT modules,

IDC_UART_RXD

Page 19 of 51

Type

CMOS 1.8V

Power Supply

1.8V

CMOS 1.8V

Differential signals Positive

Reset is a functional reset to the

In card as defined by the PCIe Mini

CMOS 3.3V

Power Supply

Clock Request is a reference clock

signal as defined by the PCIe

Mini Card CEM specification; Also used

CMOS 3.3V

PCIe PME Wake. Open Drain with pull

CMOS 3.3V

CMOS

3.3/1.8V

Power Supply

CMOS

3.3/1.8V

CMOS 1.8V

Wireless Coexistence between WWAN

and WiFi/BT modules. IDC_UART_TXD,

CMOS

3.3/1.8V

CMOS 1.8V

between WWAN

IDC_UART_RXD

CMOS 1.8V

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L850-GL Hardware User Manual

Pin Name I/O

Reset Value

63 ANTCTL2

O

64

COEX1

O

T

65 NC

66

SIM_DETECT

I

PD

67

RESET#

I

68 NC

69

CONFIG_1

O

GND

70 +3.3V PI

71 GND

72 +3.3V PI

73 GND

74 +3.3V PI

75

CONFIG_2

O

GND

Reset Value: The initial status after modulereset, not the status when working.

H:High Voltage Level

L: Low Voltage Level

PD:Pull-Down

PU:Pull-Up

T:Tristate

OD:Open Drain

PP:Push-Pull

PI: Power Input

PO: Power Output

Note:

The unused pins can be left floating.

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-

Reset Value

Pin Description

,Reserved

Tunable ANT CTRL2

Wireless Coexistence between WWAN

and WiFi/BT modules,

GNSS_EXT_FTA

,Reserved

NC

PD

SIM Detect,internal pull up(330KΩ),

active high

WWAN reset

input,internal

up(10KΩ),active low

NC

GND

GND,L850 M.2 module is configured as

the WWAN –

PCIe,USB3.0 interface

type

Power input

GND

Power input

GND

Power input

GND

GND,L850 M.2 module is configured as

the WWAN –

PCIe,USB3.0 interface

type

Reset Value: The initial status after modulereset, not the status when working.

The unused pins can be left floating.

Page 20 of 51

Type

CMOS 1.8V

Wireless Coexistence between WWAN

GNSS_EXT_FTA

CMOS 1.8V

SIM Detect,internal pull up(330KΩ),

CMOS 1.8V

input,internal

pull

CMOS 1.8V

GND,L850 M.2 module is configured as

PCIe,USB3.0 interface

Power Supply

GND,L850 M.2 module is configured as

PCIe,USB3.0 interface

Reset Value: The initial status after modulereset, not the status when working.

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L850-GL Hardware User Manual

3.2

Power Supply

The power interface of L850 module as shown in the following table:

Pin Name

I/O

2,4,70,72,74 +3.3V

PI

36 UIM_PWR

PO

L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as

the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and

as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as

the external power cannot control the module status through the PCIe protocol.

3.2.1

Power Supply

The L850 module should be powered through

Figure 3-2:

The filter capacitor design for power supply as shown in the following

Recommended

capacitance

Application

220uF x 2

Voltage-

stabilizing

capacitors

1uF,100nF

Digital signal noise

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-

The power interface of L850 module as shown in the following table:

I/O

Pin Description

DC Parameter

Minimum

Value

Typical

Value

PI

Power supply input 3.135

3.3

PO

USIM power supply

1.8V/3V

L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as

the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and

as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as

the external power cannot control the module status through the PCIe protocol.

The L850 module should be powered through

the +3.3V pins, and the power supply design is shown in

Figure 3-2 Power Supply Design

The filter capacitor design for power supply as shown in the following

table:

Description

stabilizing

Reduce power fluctuations of the module in

operation, requiring capacitors with



LDO or DC/DC power supply requires the

capacitor of no less than



The capacitor for battery power supply can

reduced to 100~200uF

Digital signal noise

Filter out the interference generated from the clock

and digital signals

Page 21 of 51

DC Parameter

（V）

Typical

Value

Maximum

Value

3.3

4.4

1.8V/3V

L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as

the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and

it is not sufficient

as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as

the +3.3V pins, and the power supply design is shown in

Reduce power fluctuations of the module in

operation, requiring capacitors with

low ESR.

LDO or DC/DC power supply requires the

capacitor of no less than

440uF

The capacitor for battery power supply can

be

Filter out the interference generated from the clock

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L850-GL Hardware User Manual

Recommended

capacitance

Application

39pF,33pF 700/800,

MHzfrequency band

18pF,8.2pF,6.8pF

1500/1700/1800/1900,2100/

2300,2500/2600MHzfrequen

cy band

The stable power supply can ensure the normal operation of L850 module;and the ripple of the

supply should be less than 300mV in design. When the module operates with themaximum emission

power, the maximum operating current can reach 1000mA, so the power source should be not lower than

3.135V, or the module may shut down or reboot. The power

3.2.2

Logic level

The L850module 1.8V logic level definitionas shown in the following table:

Parameters

Minimum

1.8V logic level

1.71

V

IH

1.3

V

IL

-

The L850module 3.3V logic level definition as shown in the following table:

Parameters

Minimum

3.3V logic level

3.135

V

IH

2.3

V

IL

-

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-

Description

850/900

MHzfrequency band

Filter out low frequency

band RF interference

1500/1700/1800/1900,2100/

2300,2500/2600MHzfrequen

Filter out

interference

medium/high

frequency

The stable power supply can ensure the normal operation of L850 module;and the ripple of the

supply should be less than 300mV in design. When the module operates with themaximum emission

power, the maximum operating current can reach 1000mA, so the power source should be not lower than

3.135V, or the module may shut down or reboot. The power

supply limits are shown in Figure 3

Figure 3-3 Power Supply Limit

The L850module 1.8V logic level definitionas shown in the following table:

Minimum

Typical

Maximum

1.71

1.8 1.89

1.3

1.8 1.89

-

0.3

0

0.5

The L850module 3.3V logic level definition as shown in the following table:

Minimum

Typical

Maximum

3.135

3.3 3.465

2.3

3.3 3.465

-

0.3

0

0.9

Page 22 of 51

band RF interference

frequency

band

RF

The stable power supply can ensure the normal operation of L850 module;and the ripple of the

power

supply should be less than 300mV in design. When the module operates with themaximum emission

power, the maximum operating current can reach 1000mA, so the power source should be not lower than

supply limits are shown in Figure 3

-3:

Maximum

Unit

V

Maximum

Unit

V

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L850-GL Hardware User Manual

3.2.3

Power

Consumption

In the condition of 3.3V power supply, the L850 power consumption as shown in the following table:

Parameter

Mode

I

off

Power off

I

Sleep

WCDMA

LTE FDD

LTE TDD

Radio Off

I

WCDMA-RMS

WCDMA

I

LTE-RMS

LTE FDD

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-

Consumption

In the condition of 3.3V power supply, the L850 power consumption as shown in the following table:

Condition

Power supply,module power off

DRX=6

DRX=8

DRX=9

Paging cycle #64 frames (0.64 sec DRx cycle)

AT+CFUN=4,Flight mode

WCDMA Data transfer Band 1 @+23.5dBm

WCDMA Data transfer Band 2 @+23.5dBm

WCDMA Data transfer Band 4 @+23.5dBm

WCDMA Data transfer Band 5 @+23.5dBm

WCDMA Data transfer Band 8 @+23.5dBm

LTE FDD Data transfer Band 1 @+23dBm

LTE FDD Data transfer Band 2 @+23dBm

LTE FDD Data transfer Band 3 @+23dBm

LTE FDD Data transfer Band 4 @+23dBm

LTE FDD Data transfer Band 5 @+23dBm

LTE FDD Data transfer Band 7 @+23dBm

LTE FDD Data transfer Band 8 @+23dBm

LTE FDD Data transfer Band 11 @+23dBm

LTE FDD Data transfer Band 12 @+23dBm

LTE FDD Data transfer Band 13 @+23dBm

LTE FDD Data transfer Band 17 @+23dBm

LTE FDD Data transfer Band 18 @+23dBm

LTE FDD Data transfer Band 19 @+23dBm

LTE FDD Data transfer Band 20 @+23dBm

Page 23 of 51

In the condition of 3.3V power supply, the L850 power consumption as shown in the following table:

Average

Current(mA)

0.08

2.5

1.8

1.6

Paging cycle #64 frames (0.64 sec DRx cycle)

2.6

Paging cycle #64 frames (0.64 sec DRx cycle)

2.8

1.2

680

710

500

530

580

760

770

710

550

TBD

540

TBD

600

560

580

560

520

630

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L850-GL Hardware User Manual

Parameter

Mode

LTE TDD

The power consumption of L850 in 3CA mode as shown in the following tables:

3CA Combination

1+3+7, 1+3+19, 1+3+20, 1+19+21

2+4+5,

2+4+13, 2+5+30, 2+12+30, 2+29+30

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

5+66+66, 13+66+66, 66+66+2, 66+66+66

Note：

The data above is an

average value obtained by testing some samples.

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-

Condition

LTE FDD Data transfer Band 21 @+23dBm

LTE FDD Data transfer Band 26 @+23dBm

LTE FDD Data transfer Band 28 @+23dBm

LTE FDD Data transfer Band 30 @+23dBm

LTE FDD Data transfer Band 66 @+23dBm

LTE TDD Data transfer Band 38 @+23dBm

LTE TDD Data transfer Band 39 @+23dBm

LTE TDD Data transfer Band 40 @+23dBm

LTE TDD Data transfer Band 41 @+23dBm

The power consumption of L850 in 3CA mode as shown in the following tables:

Condition

(LTE FDD 3CA, Full RB)

1+3+7, 1+3+19, 1+3+20, 1+19+21

2+4+13, 2+5+30, 2+12+30, 2+29+30

5+66+66, 13+66+66, 66+66+2, 66+66+66

Band 1 @+22dBm

Band 2 @+22dBm

Band 3 @+22dBm

Band 4 @+22dBm

Band 5 @+22dBm

Band 7 @+22dBm

Band 12 @+22dBm

Band 13 @+22dBm

Band 19 @+22dBm

Band 20 @+22dBm

Band 21 @+22dBm

Band 28 @+22dBm

Band 30 @+22dBm

Band 66 @+22dBm

average value obtained by testing some samples.

Page 24 of 51

Average

Current(mA)

TBD

540

530

TBD

700

450

320

420

440

Average

Current(mA)

720

880

860

760

800

1110

790

630

760

750

950

720

1330

710

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L850-GL Hardware User Manual

3.3

Control Signal

The L850 module provides two control signals for power on/off and reset operations, the pin defined as

shown in the following table:

3.3.1

Module Start-Up

3.3.1.1

Start-upCircuit

The

FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The

VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module

start-up，

and the circuit design is shown in Figure3

F

igure 3

3.3.1.2

Start-upTiming

Sequence

After powering on, the module will start

more than 20ms (100msis recommended). Meanwhile, the module will output 1.8V voltag

VSD2_1V8 pin and start the initialization process. The start

Pin Pin Name

I/O

6

FUL_CARD_POWER_

OFF#

67

RESET#

Reproduction forbidden without Fibocom Wireless Inc. written authorization

-

The L850 module provides two control signals for power on/off and reset operations, the pin defined as

FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The

VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module

and the circuit design is shown in Figure3

-4:

igure 3

-4 Circuit for Module Start-

up Controlled by AP

Sequence

After powering on, the module will start

-

up by pulling upthe FUL_CARD_POWER_OFF# signal for

more than 20ms (100msis recommended). Meanwhile, the module will output 1.8V voltag

VSD2_1V8 pin and start the initialization process. The start

-

up timing is shown in Figure 3

I/O

Reset Value

Functions

I

PU

Power on/off signal,internalpull

High or floating: Power on

Low : Power off

I

Reset signal, internal 10KΩ

pull-up,active low

Page 25 of 51

The L850 module provides two control signals for power on/off and reset operations, the pin defined as

FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The

VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module

up Controlled by AP

up by pulling upthe FUL_CARD_POWER_OFF# signal for

more than 20ms (100msis recommended). Meanwhile, the module will output 1.8V voltag

e through

up timing is shown in Figure 3

-5:

Type

Power on/off signal,internalpull

-up

High or floating: Power on

3.3/1.8V

Reset signal, internal 10KΩ

1.8V

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L850-GL Hardware User Manual

Note:

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected

interface. The above timing of VSD2_1V8 is only for reference.

The RESET# is required to pull high with a t

tocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already

before starting upthe module, the delay time can be ignored.

3.3.2

Module

Shutdown

The module can be shut down by the following controls:

Shutdown Control

Action

Software

Sending AT+CPWROFF command

Hardware Pull down

FUL_CARD_POWER_OFF# pin

The module can be shut downby sending AT+CPWROFF command. When the module receives the

software shutdown command, the module will start the finalization process (the reverse process of

initialization), andit will be completed after 3s. In the finalization

SIM card and some other parameters from memory, then clear the memory and PMU will be powered off.

After shutdown, the VSD2_1V8 voltage is also shut down. The software control timing isshown in Figure

3-6:

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-

Figure 3-5 Timing Control for Start-up

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected

interface. The above timing of VSD2_1V8 is only for reference.

The RESET# is required to pull high with a t

on1

delay after the +3.3V, because it takes some time

tocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already

before starting upthe module, the delay time can be ignored.

Shutdown

The module can be shut down by the following controls:

Condition

Sending AT+CPWROFF command

Normal shutdown(

recommend

FUL_CARD_POWER_OFF# pin

Only used whena hardware exception occurs

and the software control cannot be used.

The module can be shut downby sending AT+CPWROFF command. When the module receives the

software shutdown command, the module will start the finalization process (the reverse process of

initialization), andit will be completed after 3s. In the finalization process, the module will save the network,

SIM card and some other parameters from memory, then clear the memory and PMU will be powered off.

After shutdown, the VSD2_1V8 voltage is also shut down. The software control timing isshown in Figure

Page 26 of 51

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected

to the M.2

delay after the +3.3V, because it takes some time

tocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already

stable

recommend

)

Only used whena hardware exception occurs

and the software control cannot be used.

The module can be shut downby sending AT+CPWROFF command. When the module receives the

software shutdown command, the module will start the finalization process (the reverse process of

process, the module will save the network,

SIM card and some other parameters from memory, then clear the memory and PMU will be powered off.

After shutdown, the VSD2_1V8 voltage is also shut down. The software control timing isshown in Figure

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L850-GL Hardware User Manual

Figure 3

After the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents the

module from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should be

pulled low after shutting down.

Note:

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2

interface. The above timing of VSD2_1V8 is only for reference.

3.3.3

Module Reset

The L850 module can reset to its initial

(100msis recommended), and the module will restart after the RESET# signal is released. When the

customer executes RESET# function, the PMU remains its power inside the module. The recommended

cir

cuit design is shown in the Figure 3

Figure 3

The reset control timing is shown in Figure 3

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-

Figure 3

-6 Software Shutdown Timing Control

After the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents the

module from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should be

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2

interface. The above timing of VSD2_1V8 is only for reference.

The L850 module can reset to its initial status by pulling down the RESET# signal for more than 10ms

(100msis recommended), and the module will restart after the RESET# signal is released. When the

customer executes RESET# function, the PMU remains its power inside the module. The recommended

cuit design is shown in the Figure 3

-7:

Figure 3

-7 Recommended Design for Reset Circuit

The reset control timing is shown in Figure 3

-8:

Page 27 of 51

After the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents the

module from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should be

The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2

status by pulling down the RESET# signal for more than 10ms

(100msis recommended), and the module will restart after the RESET# signal is released. When the

customer executes RESET# function, the PMU remains its power inside the module. The recommended

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L850-GL Hardware User Manual

Note:

RESET# is a sensitive signal, it’s

case of PCB layout, the RESET# signal lines should keep away from the RF interference and

protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on

the surface

planes to avoid module from reset caused by ESD problems.

3.4 USB Interface

The L850 module supports USB2.0 which is compatible with USB High

Speed (12 Mbit/s). For the USB timing and electrical specification of L850 module,

to“Universal Serial Bus Specification 2.0”.

USB interface just for debugging.

3.4.1

USB Interface

Definition

Pin# Pin Name I/O

Reset Value

7

USB_D+

I/O

9

USB_D-

I/O

3.4.2

USB2.0 Interface

Application

USB interface is used for debugging only, so it only needs to introduce the USB interface test in hardware

design.

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-

Figure 3-10 Reset Timing Control

RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In

case of PCB layout, the RESET# signal lines should keep away from the RF interference and

protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on

planes to avoid module from reset caused by ESD problems.

The L850 module supports USB2.0 which is compatible with USB High

-

Speed (480 Mbit/s) and USB Full

Speed (12 Mbit/s). For the USB timing and electrical specification of L850 module,

to“Universal Serial Bus Specification 2.0”.

Definition

Reset Value

Description

USB Data Plus

USB Data Minus

Application

USB interface is used for debugging only, so it only needs to introduce the USB interface test in hardware

Page 28 of 51

recommended to add a filter capacitor close to the module. In

case of PCB layout, the RESET# signal lines should keep away from the RF interference and

protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on

planes to avoid module from reset caused by ESD problems.

Speed (480 Mbit/s) and USB Full

-

Speed (12 Mbit/s). For the USB timing and electrical specification of L850 module,

please refer

Type

0.3---3V,

USB2.0

0.3---3V,

USB2.0

USB interface is used for debugging only, so it only needs to introduce the USB interface test in hardware

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L850-GL Hardware User Manual

3.5

PCIe Interface

L850 module supports PCIe 1.0 interface and one data

After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM

port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10

system and GNSS interface for

receiving GNSS

3.5.1

PCIe Interface

Definition

Pin# Pin Name I/O

Reset Value

41

PETn0

O

43 PETP0

O

47

PERn0

I

49 PERP0

I

53

REFCLKN

I

55

REFCLKP

I

50

PERST#

I

T

52

CLKREQ#

O

T

54

PEWAKE#

O

L

3.5.2

PCIe Interface

Application

The reference circuit is shown in Figure 3

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-

L850 module supports PCIe 1.0 interface and one data

transmission channel.

After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM

port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10

receiving GNSS

data.

Definition

Reset Value

Description

PCIe TX Differential signals

Negative

PCIe TX Differential signals Positive

PCIe RX Differential signals

NegativeBit0

PCIe RX Differential signals Positive

PCIe Reference Clock signal

Negative

PCIe Reference Clock signal

Positive

PE-

Reset is a functional reset to the Add

card as

defined by the PCIe Mini Card CEM

specification

Clock Request is a reference clock request

signal as defined by the PCIe Mini Card CEM

specification; Also used by L1 PM Substates

PCIe PME

Wake. Open Drain with pull up on

platform,active low

Application

The reference circuit is shown in Figure 3

-9:

Page 29 of 51

After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM

port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10

Type

Reset is a functional reset to the Add

-

In

defined by the PCIe Mini Card CEM

CMOS 3.3V

Clock Request is a reference clock request

signal as defined by the PCIe Mini Card CEM

specification; Also used by L1 PM Substates

CMOS 3.3V

Wake. Open Drain with pull up on

CMOS 3.3V

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L850-GL Hardware User Manual

Figure 3

L850 module supports one PCIe 1.0 interface,

receiving pair RXP/N and clock pair CLKP/N.

PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in

PCB Layout:



The differential signal pair lines shall



The differential signal pair lines shall be short if possible and be controlled within 500mm for AP end;



The impedance of differential signal pair lines is recommended to be 100 ohm, and can be

controlled to 80～

120 ohm i



It shall avoid the discontinuous reference ground, such as segment and space;



When the differential signal lines go through different layers, the via hole of grounding signal should

be in close to that of signal, and gene

holes and the lines shall never cross the segment of plane;



Try to avoid bended lines and avoid introducing common

influence the signal integrity and EMI of

angle of all lines should be equal or greater than 135

lines should be larger than 20mil, and the line caused by bending should be greater than 1.5

times line width at least. When a serpentine line is used for length match with another line, the

bended length of each segment shall be at least 3 times the line

spacing between the bended part of the serpentine line and another one of the differential lines

must be less than 2 times the spacing of normal differential lines (S1<2S);

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Figure 3

-9 Reference Circuit for PCIe Interface

L850 module supports one PCIe 1.0 interface, including three difference pairs: transmit pair TXP/N,

receiving pair RXP/N and clock pair CLKP/N.

PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in

The differential signal pair lines shall

be parallel and equal in length;

The differential signal pair lines shall be short if possible and be controlled within 500mm for AP end;

The impedance of differential signal pair lines is recommended to be 100 ohm, and can be

120 ohm i

n accordance with PCIe protocol;

It shall avoid the discontinuous reference ground, such as segment and space;

When the differential signal lines go through different layers, the via hole of grounding signal should

be in close to that of signal, and generally, each pair of signals require 1

holes and the lines shall never cross the segment of plane;

Try to avoid bended lines and avoid introducing common

-

mode noise in the system, which will

influence the signal integrity and EMI of difference pair. As shown in Figure 3

angle of all lines should be equal or greater than 135

°

, the spacing between difference pair

lines should be larger than 20mil, and the line caused by bending should be greater than 1.5

times line width at least. When a serpentine line is used for length match with another line, the

bended length of each segment shall be at least 3 times the line width (

spacing between the bended part of the serpentine line and another one of the differential lines

must be less than 2 times the spacing of normal differential lines (S1<2S);

Page 30 of 51

including three difference pairs: transmit pair TXP/N,

PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in

The differential signal pair lines shall be short if possible and be controlled within 500mm for AP end;

The impedance of differential signal pair lines is recommended to be 100 ohm, and can be

It shall avoid the discontinuous reference ground, such as segment and space;

When the differential signal lines go through different layers, the via hole of grounding signal should

rally, each pair of signals require 1

-3 grounding signal via

mode noise in the system, which will

difference pair. As shown in Figure 3

-10, the bending

, the spacing between difference pair

lines should be larger than 20mil, and the line caused by bending should be greater than 1.5

times line width at least. When a serpentine line is used for length match with another line, the

width (

≥ 3W). The largest

spacing between the bended part of the serpentine line and another one of the differential lines

must be less than 2 times the spacing of normal differential lines (S1<2S);

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

The difference in length of two data lines in difference pair should be within

match is required for all parts. When the length match is conducted for the differential lines, the

designed position of correct match should be close to that of incorrect match, as shown in Figure

3-

11. However, there is no specific r

pair, that is, the length match is only required in the internal differential lines rather than between

different difference pairs. The length match should be close to the signal pin and pass

small-angle bending design.

Figure 3

-

3.6

USIMInterface

The L850 module has a built-

in USIM card interface, which supports 1.8V and 3V SIM cards.

3.6.1

USIM Pins

The USIM pins descriptionas shown in the

Pin Pin Name

I/O

36 UIM_PWR

PO

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Figure 3-10 Requirement of PCIe Line

The difference in length of two data lines in difference pair should be within 5mil, and the length

match is required for all parts. When the length match is conducted for the differential lines, the

designed position of correct match should be close to that of incorrect match, as shown in Figure

11. However, there is no specific requirements for the length match of transmit pair and receiving

pair, that is, the length match is only required in the internal differential lines rather than between

different difference pairs. The length match should be close to the signal pin and pass

-11 Length Match Design of PCIe Difference Pair

in USIM card interface, which supports 1.8V and 3V SIM cards.

The USIM pins descriptionas shown in the

following table:

I/O

Reset Value

Description

PO

USIM power supply

Page 31 of 51

5mil, and the length

match is required for all parts. When the length match is conducted for the differential lines, the

designed position of correct match should be close to that of incorrect match, as shown in Figure

equirements for the length match of transmit pair and receiving

pair, that is, the length match is only required in the internal differential lines rather than between

different difference pairs. The length match should be close to the signal pin and pass

the

11 Length Match Design of PCIe Difference Pair

in USIM card interface, which supports 1.8V and 3V SIM cards.

Type

1.8V/3V

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Pin Pin Name

I/O

30 UIM_RESET

O

32 UIM_CLK

O

34 UIM_DATA

I/O

66

SIM_DETECT

I

3.6.2

USIM Interface

Circuit

3.6.2.1

N.C. SIMCard Slot

The reference circuit design for N.C. (Normally Closed)SIM card slot is shown in Figure 3

Figure 3

The principlesof theN.C.SIM card slot are described as follows:

When the SIM card

is detached, it connects the short circuit between CD and SW pins, and drives the

SIM_DETECT pin low.



When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

SIM_DETECT pin high.

3.6.2.2

N.O. SIM Card Slot

The reference

circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3

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I/O

Reset Value

Description

L

USIM reset

L

USIM clock

I/O

L

USIM data,internal pull up(4.7KΩ)

PD

USIM card detect, internal 390K

pull-up.

Active high, and high level indicates

SIM card is inserted; and low level

indicates SIM card is detached.

Circuit

The reference circuit design for N.C. (Normally Closed)SIM card slot is shown in Figure 3

Figure 3

-12Reference Circuit for N.C. SIM Card Slot

The principlesof theN.C.SIM card slot are described as follows:

is detached, it connects the short circuit between CD and SW pins, and drives the

When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3

Page 32 of 51

Type

1.8V/3V

USIM data,internal pull up(4.7KΩ)

1.8V/3V

USIM card detect, internal 390K

Active high, and high level indicates

SIM card is inserted; and low level

indicates SIM card is detached.

1.8V

The reference circuit design for N.C. (Normally Closed)SIM card slot is shown in Figure 3

-12:

is detached, it connects the short circuit between CD and SW pins, and drives the

When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3

-13:

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L850-GL Hardware User Manual

Figure 3-

13

The principlesof theN.O.SIM card slot are described as



When the SIM card is detached, it con

the SIM_DETECT pin low.

When the SIM card is

inserted,

SIM_DETECT pin high.

3.6.3

USIM Hot-

Plugging

The L850 module supports the SIM

inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

The SIM card hot-

plugging function can be configuredby “AT+MSMPD” command, and the description for

AT command as shown in the following table:

After the SIM card hot-

plugging detection functionis enabled, the module detects that the SIM card is

insertedwhen the SIM_DETECT pin is high, then executes the initialization program and finish the

AT Command

Hot-plugging

Detection

AT+MSMPD=1

Enable

AT+MSMPD=0

Disable

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13

Reference Circuit for N.O. SIM Card Slot

The principlesof theN.O.SIM card slot are described as

follows:

When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives

the SIM_DETECT pin low.

inserted,

it connects the short circuit between CD and

Plugging

The L850 module supports the SIM

card hot-

plugging function, which determines whether the SIM card is

inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

plugging function can be configuredby “AT+MSMPD” command, and the description for

AT command as shown in the following table:

plugging detection functionis enabled, the module detects that the SIM card is

insertedwhen the SIM_DETECT pin is high, then executes the initialization program and finish the

Function Description

Default value, the SIM card hot-

plugging detection function is

enabled.

The module can detect whether the SIM card is inserted or not

through the SIM_DETECT pin state.

The SIM card hot-

plugging detect function is disabled.

The module readsthe SIM card

when starting up, and the

SIM_DETECT status will not be detected.

Page 33 of 51

nects an open circuit between CD and SW pins, and drives

SW pins, and drives the

plugging function, which determines whether the SIM card is

inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

plugging function can be configuredby “AT+MSMPD” command, and the description for

plugging detection functionis enabled, the module detects that the SIM card is

insertedwhen the SIM_DETECT pin is high, then executes the initialization program and finish the

plugging detection function is

The module can detect whether the SIM card is inserted or not

plugging detect function is disabled.

when starting up, and the

SIM_DETECT status will not be detected.

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L850-GL Hardware User Manual

network registration after reading the SIM ca

module determines that the SIM card is detachedand does not read the SIM card.

Note:

By default, SIM_DETECT is active

command. Please refer to the

3.6.4

USIM Design

The SIM card circuit design shall meet the EMC standards and ESD requirements with the

improvedcapability to resist interference, to ensure that the SIM card can work stably. Thefollowing

guidelines should

be noted in case of design:



The SIM card slotplacement should near the module as close as possible, and away from the RF

antenna, DC/DC power supply, clock signal lines, and other strong interference sources.



The SIM card slot with a metal shielding



The trace length between the SIM card slotand the module should not exceed 100mm, or it could

reduce the signal quality.



The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk

interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with

GND as a group at least.



The filter capacitors and ESDdevices for SIM card signals should be placed near to the SIM card

slot, and the ESD devices with 22~

3.7

Status

Indicator

The L850 module providesthree signals to indicate the operating status of the module, and the status

indicator pinsas shown in the following table:

Pin Pin Name

I/O

Reset Value

10 LED1#

O

23 WOWWAN#

O

48

TX_BLANKING

O

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network registration after reading the SIM card information. When the SIM_DETECT pin is low, the

module determines that the SIM card is detachedand does not read the SIM card.

By default, SIM_DETECT is active

-

high, which can be switched to active

command. Please refer to the AT CommandsManual for the AT command.

The SIM card circuit design shall meet the EMC standards and ESD requirements with the

improvedcapability to resist interference, to ensure that the SIM card can work stably. Thefollowing

be noted in case of design:

The SIM card slotplacement should near the module as close as possible, and away from the RF

antenna, DC/DC power supply, clock signal lines, and other strong interference sources.

The SIM card slot with a metal shielding

housing can improve the anti-

interference ability.

The trace length between the SIM card slotand the module should not exceed 100mm, or it could

The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk

interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with

The filter capacitors and ESDdevices for SIM card signals should be placed near to the SIM card

slot, and the ESD devices with 22~

33pF capacitance should be used.

Indicator

The L850 module providesthree signals to indicate the operating status of the module, and the status

indicator pinsas shown in the following table:

Reset Value

Pin Description

PD System status LED, drain output.

PU Module wakes upHost (AP).

PD PA Blanking

output, externalGPS control

signal.

Page 34 of 51

rd information. When the SIM_DETECT pin is low, the

module determines that the SIM card is detachedand does not read the SIM card.

high, which can be switched to active

-low by the AT

AT CommandsManual for the AT command.

The SIM card circuit design shall meet the EMC standards and ESD requirements with the

improvedcapability to resist interference, to ensure that the SIM card can work stably. Thefollowing

The SIM card slotplacement should near the module as close as possible, and away from the RF

antenna, DC/DC power supply, clock signal lines, and other strong interference sources.

interference ability.

The trace length between the SIM card slotand the module should not exceed 100mm, or it could

The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk

interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with

The filter capacitors and ESDdevices for SIM card signals should be placed near to the SIM card

The L850 module providesthree signals to indicate the operating status of the module, and the status

Type

CMOS 3.3V

CMOS 1.8V

output, externalGPS control

CMOS 1.8V

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3.7.1

LED#1Signal

The LED#1 signal is used to indicate the operating status of the module, and the detailed description as

shown in the following table:

The LED driving circuit is as

follows:

Note:

The resistance of LED current

the driving current.

3.7.2

WOWWAN#

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request.The definition

of WOWWAN# signal is as follows:

The WOWWAN# timing is shown in Figure 3

Module Status

LED1#

RF function ON

Low level (LED On)

RF function OFF

High level (LED Off)

Operating Mode

WOWWAN# Signal

data requests

Pull low 1s then pull high (pulse

Idle/Sleep

High level

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The LED#1 signal is used to indicate the operating status of the module, and the detailed description as

follows:

Figure 3-14 LEDDriving Circuit

The resistance of LED current

-

limiting resistor is selected according to the driving voltage and

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request.The definition

of WOWWAN# signal is as follows:

The WOWWAN# timing is shown in Figure 3

-15:

Figure 3-15 WOWWAN#Timing

LED1#

Signal

Low level (LED On)

High level (LED Off)

WOWWAN# Signal

Pull low 1s then pull high (pulse

signal).

High level

Page 35 of 51

The LED#1 signal is used to indicate the operating status of the module, and the detailed description as

limiting resistor is selected according to the driving voltage and

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request.The definition

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L850-GL Hardware User Manual

3.7.3

TX_BLANKING

When the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronous

with TDD burst TX timing.

As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receiving

when detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.

TX_BLANKING timing i

s shown in Figure 3

3.8

Interrupt

Control

The L850 module provides four interrupt signals, and the pin definition is as follows:

Pin Pin Name I/O

8

W_DISABLE1#

I

25 DPR

I

26

W_DISABLE2#

I

44

GNSS_IRQ

I

3.8.1

W_DISABLE1#

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

controlled by the AT command. The

definition of W_DISABLE1# signal is as follows:

Operating Mode of Module

Default state

TDD burst TX(Band38)

W_DISABLE1# signal

Function

High/Floating

WWAN

Low

WWAN function is disabled, the module entersFlight mode.

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When the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronous

As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receiving

when detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.

s shown in Figure 3

-16:

Figure 3-16 TX_BLANKING Timing

Control

The L850 module provides four interrupt signals, and the pin definition is as follows:

Reset Value

Pin Description

PD Enable/Disable RF network

PU Body SAR detection

PU GNSS Disablesignal,

Reserved

PD GNSS Interrupt Request,

Reserved

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

controlled by the AT command. The module enters the Flight mode afterthe RF function is disabled. The

definition of W_DISABLE1# signal is as follows:

TX_BLANKING Signal

Low level

Output the

pulse signal synchronous with TDD burst TX

Function

WWAN function is enabled, the module exits the Flight mode.

WWAN function is disabled, the module entersFlight mode.

Page 36 of 51

When the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronous

As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receiving

when detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.

The L850 module provides four interrupt signals, and the pin definition is as follows:

Type

CMOS 3.3V

CMOS 1.8V

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

module enters the Flight mode afterthe RF function is disabled. The

pulse signal synchronous with TDD burst TX

function is enabled, the module exits the Flight mode.

WWAN function is disabled, the module entersFlight mode.

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L850-GL Hardware User Manual

Note：

The function of W_DISABLE1# can be customized, please refer to the software porting guide.

3.8.2

BODYSAR

The L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is high

by default, and when the SAR

sensor

As the result, the module then lowers down its emission power to its default threshold value, thus

reducing theRF radiation onthe human body. The threshol

Commands. The definition ofDPR signalas shown in the following

3.9

ClockInterface

The L850 module supports a clock interface, itcan output 26MHz clock.

Pin Pin Name I/O

Reset Value

46

SYSCLK

O

3.10

ANT Tunable

Interface

The module supports ANT Tunable interfaces with two different

GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly

configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the

antenna.

DPR signal

Function

High/Floating

The module keeps the default emission power

Low

Lower the maximum emission power to the threshold value of the module.

Pin Pin Name I/O

Reset Value

56

RFE_RFFE2_

SCLK

O

58

RFE_RFFE2_

SDATA

O

59 ANTCTL0

O

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The function of W_DISABLE1# can be customized, please refer to the software porting guide.

The L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is high

sensor

detects the closing human body, the DPR

signal

As the result, the module then lowers down its emission power to its default threshold value, thus

reducing theRF radiation onthe human body. The threshold of emission power can be set by the

Commands. The definition ofDPR signalas shown in the following

table:

The L850 module supports a clock interface, itcan output 26MHz clock.

Reset Value

Pin Description

26M clock output, default disabled

can be used for externalGPS, etc

Interface

The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 3bit

GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly

configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the

Function

The module keeps the default emission power

Lower the maximum emission power to the threshold value of the module.

Reset Value

Pin Description

Tunable ANT control,MIPI Interface,

RFFE2 clock,Open Drain output

Tunable ANT control,MIPI Interface,

RFFE2 data,Open Drain output

Tunable ANT control,GPO interface,

Page 37 of 51

The function of W_DISABLE1# can be customized, please refer to the software porting guide.

The L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is high

signal

will be pulled down.

As the result, the module then lowers down its emission power to its default threshold value, thus

d of emission power can be set by the

AT

Type

26M clock output, default disabled

can be used for externalGPS, etc

1.8V

control modes, i.e. MIPI interface and 3bit

GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly

configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the

Lower the maximum emission power to the threshold value of the module.

Type

Tunable ANT control,MIPI Interface,

CMOS

3.3/1.8V

Tunable ANT control,MIPI Interface,

CMOS

3.3/1.8V

Tunable ANT control,GPO interface,

CMOS 1.8V

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L850-GL Hardware User Manual

Pin Pin Name I/O

Reset Value

61

ANTCTL1

O

63

ANTCTL2

O

3.11

Config

Interface

The L850 module provides four config pins for the

module:

The M.2 module configuration as the following table:

Config_0

(pin21)

Config_1

(pin69)

Config_2

(pin75)

GND GND

GND

Please refer to ”PCI Express M.2 Specification Rev1.0” for more details.

3.12

Other

Interfaces

The module does not support other interfaces yet.

Pin Pin Name

I/O

Reset Value

1

CONFIG_3

O

21

CONFIG_0

O

L

69

CONFIG_1

O

L

75

CONFIG_2

O

L

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Reset Value

Pin Description

Bit0

Tunable ANT control,GPO interface,

bit1

Tunable ANT control,GPO interface,

Bit2

Interface

The L850 module provides four config pins for the

configuration as the WWAN-

PCIe, USB3.0 type M.2

The M.2 module configuration as the following table:

Config_2

(pin75)

Config_3

(pin1)

Module Type and Main

Host Interface

GND

NC WWAN – PCIe,USB3.0

Please refer to ”PCI Express M.2 Specification Rev1.0” for more details.

Interfaces

The module does not support other interfaces yet.

Reset Value

Pin Description

NC

Internally connected to GND

Page 38 of 51

Type

Tunable ANT control,GPO interface,

CMOS 1.8V

Tunable ANT control,GPO interface,

CMOS 1.8V

PCIe, USB3.0 type M.2

Module Type and Main

Port

Configuration

0

Type

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L850-GL Hardware User Manual

4 Radio

Frequency

4.1

RF Interface

4.1.1

RF Interface

Functionality

The L850

module supports two RF connectors used for external antenna connection. As the Figure 4

shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,

used to receive the diversity RF signals.

4.1.2

RFConnector

Characteristic

Rated Condition

Frequency Range

DC to 6GHz

Characteristic Impedance

50Ω

4.1.3

RF Connector

Dimension

The L850 module adopts standard M.2 module RF connectors, the model name is

company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:

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nc. written authorization -

Frequency

Functionality

module supports two RF connectors used for external antenna connection. As the Figure 4

shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,

used to receive the diversity RF signals.

Figure 4-1 RF connectors

Characteristic

Environment Condition

DC to 6GHz

Temperature Range

50Ω

–40°C to +85°C

Dimension

The L850 module adopts standard M.2 module RF connectors, the model name is

company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:

Page 39 of 51

module supports two RF connectors used for external antenna connection. As the Figure 4

-1

shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,

Environment Condition

The L850 module adopts standard M.2 module RF connectors, the model name is

818004607 from ECT

company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:

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L850-GL Hardware User Manual

Figure 4

Figure 4-

4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector

Reproduction forbidden without Fibocom Wireless Inc. written authorization

-

Figure 4

-2 RF connector dimensions

Figure 4

-3 0.81mm coaxial antenna dimensions

4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector

Page 40 of 51

4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector

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L850-GL Hardware User Manual

4.2

Operating

Band

The L850 module operating bands of the antennas are as follows:

Operating

Band

Description

Band 1 IMT 2100MHz

Band 2 PCS 1900MHz

Band 3 DCS 1800MHz

Band 4 AWS 1700MHz

Band 5 CLR 850MHz

Band 7 IMT-E 2600Mhz

Band 8 E-GSM 900MHz

Band 11 LPDC 1500MHz

Band 12

LSMH Blocks A/B/C

700MHz

Band 13 USMH Block C

700MHz

Band 17 LSMH Blocks B/C

700MHz

Band 18

Japan Lower 800MHz

Band 19

Japan Upper 800MHz

Band 20 EUDD 800MHz

Band 21 UPDC 1500MHz

Band 26 ECLR 850MHz

Band 28 APAC 700MHz

Band 29 LSMH blocks D/E

700MHz

Band 30 WCS blocks A

2300MHz

Band 66 1700MHz

Band 38 IMT-E 2600MHz

Band 39 TDD 1900MHZ

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-

Band

The L850 module operating bands of the antennas are as follows:

Mode

Tx (MHz)

LTE FDD/WCDMA 1920 - 1980

LTE FDD/WCDMA 1850 - 1910

LTE FDD 1710 - 1785

LTE FDD/WCDMA 1710 - 1755

LTE FDD/WCDMA 824 - 849

LTE FDD 2500 - 2570

LTE FDD/WCDMA 880 - 915

LTE FDD 1427.9 - 1447.9

LSMH Blocks A/B/C

LTE FDD

699 - 716

LTE FDD

777 - 787

LTE FDD

704 - 716

Japan Lower 800MHz

LTE FDD 815 - 830

Japan Upper 800MHz

LTE FDD 830 - 845

LTE FDD 832 - 862

LTE FDD 1447.9 - 1462.9

LTE FDD 814 - 849

LTE FDD 703 - 748

LTE FDD

N/A

LTE FDD

2305 - 2315

LTE FDD 1710 - 1780

LTE TDD

2570

LTE TDD

1880

Page 41 of 51

Rx (MHz)

2110 - 2170

1930 - 1990

1805 - 1880

2110 - 2155

869 - 894

2620 - 2690

925 - 960

1475.9 - 1495.9

729 - 746

746 - 756

734 - 746

860 - 875

875 - 890

791 - 821

1495.9 - 1510.9

859 - 894

758 - 803

716 - 728

2350 - 2360

2110 - 2200

2570

- 2620

1880

- 1920

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L850-GL Hardware User Manual

Operating

Band

Description

Band 40 IMT 2300MHz

Band 41

BRS/EBS 2500MHZ

GPS L1

GLONASS

L1

BeiDou

4.3

Transmitting

Power

The transmitting power foreach band of the L850 moduleas shown in the following table:

Mode Band

WCDMA

Band 1

Band 2

Band 4

Band 5

Band 8

LTE FDD

Band 1

Band 2

Band 3

Band 4

Band 5

Band 7

Band 8

Band 11

Band 12

Band 13

Band 17

Band 18

Band 19

Band 20

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-

Mode

Tx (MHz)

LTE TDD

2300

BRS/EBS 2500MHZ

LTE TDD

2496

N/A

Power

The transmitting power foreach band of the L850 moduleas shown in the following table:

Tx Power(dBm) Note

23.5±1

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

Page 42 of 51

Rx (MHz)

2300

- 2400

2496

- 2690

1575.42±1.023

1602.5625±4

1561.098±2.046

The transmitting power foreach band of the L850 moduleas shown in the following table:

10MHz Bandwidth, 1 RB

10MHz

Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz

Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

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L850-GL Hardware User Manual

Mode Band

Band 21

Band 26

Band 28

Band 30

Band 66

LTE TDD

Band 38

Band 39

Band 40

Band 41

4.4

Receiver

Sensitivity

The receiver sensitivity foreach band of the L850 module as shown in the following table:

Mode

Band

WCDMA

Band 1

Band 2

Band 4

Band 5

Band 8

LTE FDD

Band 1

Band 2

Band 3

Band 4

Band 5

Band 7

Band 8

Band 11

Band 12

Band 13

Band 17

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-

Tx Power(dBm) Note

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz Bandwidth, 1 RB

23±1

10MHz

Sensitivity

The receiver sensitivity foreach band of the L850 module as shown in the following table:

Rx Sensitivity(dBm)

Typical

Note

TBD

BER<0.1%

TBD

BER<0.1%

TBD

BER<0.1%

TBD

BER<0.1%

TBD

BER<0.1%

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

Page 43 of 51

10MHz Bandwidth, 1 RB

10MHz

Bandwidth, 1 RB

The receiver sensitivity foreach band of the L850 module as shown in the following table:

BER<0.1%

10MHz Bandwidth

10MHz

Bandwidth

10MHz Bandwidth

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L850-GL Hardware User Manual

Mode

Band

Band 18

Band 19

Band 20

Band 21

Band 26

Band 28

Band 29

Band 30

Band 66

LTE TDD

Band 38

Band 39

Band 40

Band 41

Note:

The above values are measuredfor the dual antennas situation(Main+Diversity). For single main

antenna (without Diversity), the sensitivity will drop around

4.5

GNSS

L850 module supports GNSS/BeiDou and

integrated antenna.

Description

Power

Reproduction forbidden without Fibocom Wireless Inc. written authorization

-

Rx Sensitivity(dBm)

Typical

Note

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

TBD

10MHz Bandwidth

The above values are measuredfor the dual antennas situation(Main+Diversity). For single main

antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE.

L850 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidou

Condition

Test Result

GPS fixing TBD

GPS tracking TBD

GLONASS fixing TBD

GLONASS tracking TBD

BeiDou fixing TBD

BeiDou tracking TBD

Sleep TBD

Page 44 of 51

10MHz Bandwidth

The above values are measuredfor the dual antennas situation(Main+Diversity). For single main

3dBm for each band of LTE.

AGNSS functions, and adopts RF Diversity and GNSS/Beidou

Test Result

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L850-GL Hardware User Manual

Description

TTFF

GPS/GLONASS/BeiDou

AGNSS

Sensitivity

GPS

GLONASS

BeiDou

Note:

Please note that GPS current is tested with RF disabled.

4.6

Antenna

Design

The L850module provides main and diversity antenna

as shown in the following table:

L850 module Main antenna requirements

Frequency range

Bandwidth(WCDMA)

Bandwidth(LTE)

Reproduction forbidden without Fibocom Wireless Inc. written authorization

-

Condition

Test Result

GPS/GLONASS/BeiDou

Cold start TBD

Warm start TBD

Hot Start TBD

Cold start TBD

Open Sky TBD

Please note that GPS current is tested with RF disabled.

Design

The L850module provides main and diversity antenna interfaces, and the antenna design requirements

L850 module Main antenna requirements

The most proper antenna to adapt the frequencies should

WCDMA band 1(2100) : 250 MHz

WCDMA band 2(1900) : 140 MHz

WCDMA band 4(1700) : 445 MHz

WCDMA band 5(850) : 70 MHz

WCDMA band 8(900) : 80 MHz

LTE band 1(2100): 250 MHz

LTE band 2(1900): 140MHz

LTE Band 3(1800): 170 MHz

LTE band 4(1700): 445MHz

LTE band 5(850): 70 MHz

LTE band 7(2600): 190 MHz

LTE Band 8(900): 80 MHz

LTE Band 11(1500): 68 MHz

LTE Band 12(700): 47 MHz

LTE Band 13(700): 41 MHz

Page 45 of 51

Test Result

interfaces, and the antenna design requirements

The most proper antenna to adapt the frequencies should

be used.

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L850-GL Hardware User Manual

L850 module Main antenna requirements

Bandwidth(GNSS/BeiDou)

Impedance

Input power

Recommended standing-wave

ratio (SWR)

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-

L850 module Main antenna requirements

LTE Band 17(700): 42 MHz

LTE Band 18(800): 80 MHz

LTE Band 19(800): 80 MHz

LTE band 20(800): 71 MHz

LTE band 21(1500): 63 MHz

LTE band 26(850): 80 MHz

LTE band 28(700): 100 MHz

LTE band 29(700): 12 MHz

LTE band 30(2300): 55 MHz

LTE band 66(1700): 490MHz

LTE band 38(2600): 50 MHz

LTE Band 39(1900): 40 MHz

LTE band 40(2300): 100 MHz

LTE band 41(2500): 194 MHz

GPS: 2MHz

GLONASS: 8MHz

BeiDou: 4MHz

50Ohm

> 26dBmaverage power WCDMA & LTE

≤ 2:1

Page 46 of 51

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L850-GL Hardware User Manual

5 Structure

Specification

5.1

Product

Appearance

The product appearance for L850 module is shown in Figure5

5.2

Dimension of

Structure

The structuraldimensionof the L850 module is shown in Figure 5

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-

Specification

Appearance

The product appearance for L850 module is shown in Figure5

-1:

Figure 5-1 Module Appearance

Structure

The structuraldimensionof the L850 module is shown in Figure 5

-2:

Figure 5-2 Dimension of Structure

Page 47 of 51

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L850-GL Hardware User Manual

5.3

M.2 Interface

Model

The L850 M.2 module adopts 75-

pin gold finger as external interface, where 67 pins are signal pins and 8

pins are notch pins as shown in Figure 3

the M.2 interface definiti

on, L850 module adopts Type 3042

maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).

5.4

M.2 Connector

The L850 module connects to AP via M.2 connector, it is recommended to use M.2 conn

LOTES company with the model APCI0026

please refer to the specification.

Reproduction forbidden without Fibocom Wireless Inc. written authorization

-

Model

pin gold finger as external interface, where 67 pins are signal pins and 8

pins are notch pins as shown in Figure 3

-

1. For module dimension, please refer to chapter

on, L850 module adopts Type 3042

-S3-

B interface (30x42mm, the component

maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).

The L850 module connects to AP via M.2 connector, it is recommended to use M.2 conn

LOTES company with the model APCI0026

-P001A as shown in Figure 5-

3. The package of connector,

Page 48 of 51

pin gold finger as external interface, where 67 pins are signal pins and 8

1. For module dimension, please refer to chapter

5.2. Based on

B interface (30x42mm, the component

maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).

The L850 module connects to AP via M.2 connector, it is recommended to use M.2 conn

ector from

3. The package of connector,

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L850-GL Hardware User Manual

Figure 5

5.5

Storage

5.5.1 Storage Life

Storage Conditions (recommended): Temperature is 23 ± 5

Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is

12 months.

5.6

Packing

The L850 module uses the tray sealed vacu

the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to

the greatest extent.

Note：

The module is a precision electronic product, and may suffer

electrostatic protection measures are taken.

Reproduction forbidden without Fibocom Wireless Inc. written authorization

-

Figure 5

-3 M.2 Dimension of Structure

Storage Conditions (recommended): Temperature is 23 ± 5

℃

, relative humidity is RH 35

Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is

The L850 module uses the tray sealed vacuum packing, combined with the outer packing method using

the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to

The module is a precision electronic product, and may suffer permanent damage if no correct

electrostatic protection measures are taken.

Page 49 of 51

, relative humidity is RH 35

-70%.

Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is

um packing, combined with the outer packing method using

the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to

permanent damage if no correct

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L850-GL Hardware User Manual

5.6.1

Tray Package

The L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxes

in each case. Tray packaging process is shown

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The L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxes

in each case. Tray packaging process is shown

in Figure 5-4:

Figure 5-4 Tray Packaging Process

Page 50 of 51

The L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxes

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L850-GL Hardware User Manual

5.6.2

Tray size

The

pallet size is 330*175*6.0mm, as shown in Figure 5

ITEM

L

W

DIM 330.0±0.5

175.0±0.5

ITEM A1

B1

DIM 294.0±0.3

159.0±0.3

ITEM

G

J

DIM 105.0±0.2

9.0±0.2

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-

pallet size is 330*175*6.0mm, as shown in Figure 5

-5:

H

T

A0

175.0±0.5

6.0±0.3 0.5±0.1

43±0.3

B1

C

D

E

159.0±0.3

20.0±0.5 9.0±0.5

24.5±0.5

9.0±0.2

Figure 5-5Tray Size (Unit: mm)

Page 51 of 51

B0

43±0.3

33.0±0.3

F

24.5±0.5

187.5±0.2

Fibocom Wireless L850GLL LTE module User Manual

Fibocom Wireless Inc. LTE module Users Manual

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