Fibocom Wireless L860GL LTE Module User Manual ng
Fibocom Wireless Inc. LTE Module ng
Users Manual
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| Mirror Download [FCC.gov] | |
| Document ID | 3993200 |
| Application ID | BtpWxDyw25iWKlosfDueOg== |
| Document Description | Users Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 222.52kB (2781503 bits) |
| Date Submitted | 2018-09-06 00:00:00 |
| Date Available | 2018-09-07 00:00:00 |
| Creation Date | 2018-09-06 13:55:58 |
| Producing Software | Microsoft® Word 2016 |
| Document Lastmod | 2018-09-06 13:56:35 |
| Document Title | ng |
| Document Creator | Microsoft® Word 2016 |
| Document Author: | fangs |
FIBOCOM_L860-GL Hardware User Manual Version：1.0.2 Date：2018-07-28 Copyright Copyright © 2018 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -- Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End user must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 2 of 55 This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed antenna gain is as following table showed: Operating Band Antenna Gain（dBi） WCDMA BAND II 8.5 WCDMA BAND IV 5.5 WCDMA BAND V 9.07 LTE BAND 2 LTE BAND 4 LTE BAND 5 9.41 LTE BAND 7 LTE BAND 12 8.85 LTE BAND 13 10.31 LTE BAND 14 10.38 LTE BAND 17 9.74 LTE BAND 25 LTE BAND 26（814-824） 8.51 LTE BAND 26（824-849） 8.56 LTE BAND 30 LTE BAND 38 LTE BAND 41 5.5 LTE BAND 66 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed Host manufacturer is responsible for ensuring that the host continues to be compliant with the Part 15 subpart B unintentional radiator requirements after the module is installed and operational. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 3 of 55 The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: ZMOL860GL”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 4 of 55 This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareilne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.\ This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the words “Contains transmitter module IC: 21374-L860GL L'étiquette de certification Innovation, Sciences et Développement économique Canada d'un module doit être clairement visible en tout temps lorsqu'elle est installée dans le dispositif hôte. sinon, le périphérique hôte doit être étiqueté pour afficher le numéro de certification Innovation, Sciences et Développement économique Canada du module, précédé des mots "Contient le module émetteur IC: 21374-L860GL. The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed antenna gain is as following table showed Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 5 of 55 L'antenne doit être installée de telle sorte que 20 cm soient maintenus entre l'antenne et les utilisateurs, et le gain d'antenne maximal autorisé est indiqué dans le tableau suivant. Operating Band/ Bande d'opération Max allowed Gain/ Max autorisé Gain (dBi) WCDMA BAND II 8.50 WCDMA BAND IV 5.50 WCDMA BAND V 8.76 LTE BAND 2 9.00 LTE BAND 4 6.00 LTE BAND 5 8.25 LTE BAND 7 9.00 LTE BAND 12 8.76 LTE BAND 13 9.09 LTE BAND 14 9.13 LTE BAND 17 8.79 LTE BAND 25 9.00 LTE BAND 26 （824-849） 8.25 LTE BAND 30 1.00 LTE BAND 38 9.00 LTE BAND 41 5.50 LTE BAND 66 6.00 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 6 of 55 Trademark The trademark is registered and owned by Fibocom Wireless Inc. Version Record Version Update date Remark V1.0.0 2018-01-25 Draft version V1.0.1 2018-03-09 1. Add UL CA combinations description. 2. Modify pin definition and description. 1. Modify module timing V1.0.2 2018-07-19 2. Change tray package type 3. Modify CA Combinations 4. And add RF performance parameters and power consumption V1.0.3 2018-07-28 1. Modify B41 HPUE maximum TX power description 2. Delete Band21/Band32 Related Information Applicability Table No. Product model Description L860-GL-01 NA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 7 of 55 Contents 1 Foreword .................................................................................................................................................. 11 1.1 Introduction .................................................................................................................................... 11 1.2 Reference Standard ....................................................................................................................... 11 1.3 Related Documents ....................................................................................................................... 11 2 Overview.................................................................................................................................................. 12 2.1 Introduction ................................................................................................................................... 12 2.2 Specification .................................................................................................................................. 12 2.3 CA combinations ........................................................................................................................... 13 2.4 Application Framework.................................................................................................................. 15 2.5 Hardware Block Diagram .............................................................................................................. 15 2.6 Antenna Configuration .................................................................................................................. 16 3 Application Interface ................................................................................................................................ 17 3.1 M.2 Interface ................................................................................................................................. 17 3.1.1 Pin Map ............................................................................................................................... 17 3.1.2 Pin Definition....................................................................................................................... 18 3.2 Power Supply ................................................................................................................................ 22 3.2.1 Power Supply...................................................................................................................... 22 3.2.2 Logic level ........................................................................................................................... 24 3.2.3 Power Consumption ........................................................................................................... 24 3.3 Control Signal ............................................................................................................................... 26 3.3.1 Module Start-Up.................................................................................................................. 27 3.3.1.1 Start-up Circuit ......................................................................................................... 27 3.3.1.2 Start-up Timing Sequence........................................................................................ 27 3.3.2 Module Shutdown ............................................................................................................... 28 3.3.3 Module Reset...................................................................................................................... 28 3.3.4 PCIe Reset ......................................................................................................................... 30 3.4 PCIe & USB .................................................................................................................................. 31 3.4.1 PCIe Interface ..................................................................................................................... 31 3.4.1.1 PCIe Interface Definition .......................................................................................... 31 3.4.1.2 PCIe Interface Application ........................................................................................ 32 3.4.2 USB Interface ..................................................................................................................... 34 3.4.2.1 USB Interface Definition ........................................................................................... 34 3.4.2.2 USB2.0 Interface Application ................................................................................... 34 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 8 of 55 3.5 USIM Interface .............................................................................................................................. 35 3.5.1 USIM1 Pins ......................................................................................................................... 35 3.5.2 USIM2 Pins ......................................................................................................................... 35 3.5.3 USIM Interface Circuit ........................................................................................................ 36 3.5.3.1 N.C. SIM Card Slot ................................................................................................... 36 3.5.3.2 N.O. SIM Card Slot................................................................................................... 36 3.5.4 USIM Hot-Plugging ............................................................................................................. 37 3.5.5 USIM Design....................................................................................................................... 38 3.6 Status Indicator ............................................................................................................................. 38 3.6.1 LED#1 Signal ...................................................................................................................... 38 3.7 Interrupt Control ............................................................................................................................ 39 3.7.1 W_DISABLE1# ................................................................................................................... 39 3.7.2 BODYSAR .......................................................................................................................... 40 3.7.3 ANT_CONFIG ..................................................................................................................... 40 3.8 ANT Tunable Interface .................................................................................................................. 40 3.9 Configuration Interface ................................................................................................................. 41 3.10 Other Interfaces .......................................................................................................................... 42 4 Radio Frequency ..................................................................................................................................... 42 4.1 RF Interface .................................................................................................................................. 42 4.1.1 RF Interface Functionality................................................................................................... 42 4.1.2 RF Connector Characteristic .............................................................................................. 42 4.1.3 RF Connector Dimension ................................................................................................... 42 4.2 Operating Band ............................................................................................................................. 44 4.3 Transmitting Power ....................................................................................................................... 45 4.4 Receiver Sensitivity....................................................................................................................... 46 4.4.1 Dual Antenna Receiver Sensitivity ..................................................................................... 46 4.4.2 Four Antenna Receiver Sensitivity ..................................................................................... 47 4.5 GNSS ............................................................................................................................................ 48 4.6 Antenna Design............................................................................................................................. 49 5 Structure Specification ............................................................................................................................ 51 5.1 Dimension of Structure ................................................................................................................. 51 5.2 M.2 Interface Model ...................................................................................................................... 51 5.3 M.2 Connector .............................................................................................................................. 52 5.4 Storage.......................................................................................................................................... 53 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 9 of 55 5.4.1 Storage Life ........................................................................................................................ 53 5.5 Packing ......................................................................................................................................... 53 5.5.1 Tray Package ...................................................................................................................... 53 5.5.2 Tray size ............................................................................................................................. 55 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 10 of 55 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L860-GL (hereinafter referred to as L860). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L860 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards: 3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission and reception (FDD);Part 1: Conformance specification 3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD) 3GPP TS 36.521-1 V13.4.0: User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 21.111 V10.0.0: USIM and IC card requirements 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-ME) interface 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM) application 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT) 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE) 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) PCI Express M.2 Specification Rev1.1 1.3 Related Documents RF Antenna Application Design Specification L8-Family System Driver Integration and Application Guidance L8-Family AT Commands Manual Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 11 of 55 2 Overview 2.1 Introduction L860 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the world. 2.2 Specification Specification LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 29, 30, 66 LTE TDD: Band 38, 39, 40, 41 Operating Band LAA Band 46 Receiver only WCDMA/HSPA+: Band 1, 2, 4, 5, 8 GNSS/Beidou: support LTE 1 Gbps DL/75 Mbps UL(Cat 16) Data UMTS:384 kbps DL/384 kbps UL Transmission UMTS/HSPA+ DC-HSPA+:42 Mbps DL(Cat 24)//11.52 Mbps UL(Cat7) Carrier 5CA Downlink aggregation Power Supply DC 3.135V～4..4V, Typical 3.3V Normal operating temperature: -10°C ～+55°C Temperature Extended operating temperature: -20°C ～+65°C Storage temperature: -40°C ～+85°C Interface: M.2 Key-B Physical Dimension：30 x 42 x 2.3mm characteristics Weight: About 6.2 g Interface Antenna WWAN Antenna x 4 Connector Support 4x4 MIMO Function Dual SIM, 3V/1.8V Interface PCIe 2.0 X1 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 12 of 55 Specification USB 2.0 USB 3.0(Reserved) W_Disable# Body Sar LED Tunable antenna I2S(Reserved) Software Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005 Firmware update PCIe Multiple carrier Windows MBIM support Other feature Windows update AGNSS Note: When temperature goes beyond normal operating temperature range of -10°C~+55°C, RF performance of module may be slightly off 3GPP specifications. For normal operating temperature, LTE FDD Band 4 and 13 can support temperature ranging from -20℃ to +60℃. 2.3 CA combinations DL CA Combinations 2CA Inter-band 1+3, 5, 7, 8, 18, 19, 20, 26, 28, 38, 41, 46 2+4, 5, 12, 13, 14, 29, 30, 46, 66 3+5, 7, 8, 19, 20, 28, 38, 40, 41, 46 4+5, 12, 13, 29, 30, 46 5+7, 30, 46, 66 7+8, 20, 28, 32, 46 12+30, 66 13+46, 66 14+30, 66 25+26, 41, 46 26+41 29+30, 66 30+66 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 13 of 55 DL CA Combinations Intra-band(non-contiguous) Intra-band(contiguous) Inter-band 3CA 2 intra-band(non-contiguous) plus inter-band 2 intra-band(contiguous) plus inter-band Intra-band(non-contiguous) Intra-band(contiguous) Inter-band 2 intra-band(non-contiguous) plus 2 inter-band 2 intra-band(contiguous) plus 2 inter-band 4CA 2 intra-band(contiguous) plus 2 intra-band(contiguous) 2 intra-band(contiguous) plus 2 intra-band(non-contiguous) 3 intra-band(contiguous) plus inter-band 5CA 41+46 46+66 1, 2, 3, 4, 7, 25, 41, 66 1, 2, 3, 5, 7, 40, 41, 66 1+3+5, 1+3+7, 1+3+8, 1+3+19, 1+3+20, 1+3+28, 1+3+38, 1+5+7, 1+7+8, 1+7+20, 1+7+28 2+4+5, 2+4+12, 2+4+13, 2+5+30, 2+12+30, 2+29+30, 2+5+66, 2+13+66, 2+14+30, 2+14+66, 2+30+66, 2+5+46, 2+13+46, 2+46+66, 2+12+66 3+5+7, 3+7+8, 3+7+20, 3+7+28 4+5+30, 4+12+30, 4+29+30 5+30+66, 5+46+66 12+30+66, 13+46+66, 14+30+66, 29+30+66 2+2+5, 2+2+12, 2+2+13, 2+2+30, 2+2+66, 2+4+4, 2+46+46, 2+66+66 3+7+7, 4+4+5, 4+4+12, 4+4+13, 4+46+46, 5+66+66 12+66+66, 13+66+66, 46+46+66, 29+66+66, 30+66+66 1+3+3, 1+7+7, 1+40+40*, 1+41+41* 2+5+5*, 2+46+46, 2+66+66 3+3+5*, 3+3+7, 3+3+20, 3+3+28*, 3+7+7, 3+40+40, 3+41+41*, 3+3+41 4+46+46, 5+5+30*, 5+5+66, 5+46+46*, 5+66+66, 7+7+28* 13+46+46*, 13+66+66, 25+41+41*, 26+41+41*, 28+40+40*,46+46+66 41, 66 40*, 41* 1+3+5+7, 1+3+7+8, 1+3+7+20, 1+3+7+28 2+5+30+66, 2+12+30+66, 2+14+30+66 2+2+5+66, 2+2+12+30, 2+2+12+66, 2+2+13+66, 2+5+66+66, 2+12+66+66, 2+13+66+66, 5+30+66+66, 29+30+66+66* 1+3+3+5*, 1+3+3+7, 1+3+3+20*, 1+3+7+7, 1+7+7+28*, 1+3+40+40*, 2+5+5+30*, 2+5+5+66*, 2+5+46+46*, 2+13+46+46*, 2+46+46+46*, 2+46+46+66, 2+5+66+66, 2+13+66+66 3+3+7+20*, 3+3+7+28*, 3+7+7+28*, 3+28+40+40*, 4+46+46+46*, 5+5+30+66*, 5+46+46+66*, 13+46+46+66*, 66+46+46+46* 3+3+7+7 5+5+66+66 2+46+46+46, 3+40+40+40, 4+46+46+46, 5+46+46+46, 13+46+46+46, 25+41+41+41, 28+40+40+40, 66+46+46+46 Intra-band(non-contiguous) 41 Intra-band(contiguous) 2 intra-band(contiguous) plus 2 intra-band(contiguous) plus interband 2 intra-band(contiguous) plus 3 inter-band 40* 1+3+3+7+7, 3+3+7+7+28*, 2+46+46+46+46*, 46+46+46+46+66* 1+3+3+7+20*, 1+3+7+7+28*, 2+5+5+30+66* Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 14 of 55 DL CA Combinations 2 intra-band(contiguous) plus 2 intra-band(non-contiguous) plus inter-band 2+5+5+66+66* 3 intra-band(contiguous) plus 2 intra-band(non-contiguous) 2+2+46+46+46* 3 intra-band(contiguous) plus 2 inter-band 2+5+46+46+46*, 2+13+46+46+46*, 2+46+46+46+46*, 2+46+46+46+66*, 3+28+40+40+40*, 4+46+46+46+46*, 5+46+46+46+66*, 13+46+46+46+66*, 46+46+46+46+66* 3 intra-band(contiguous) plus 2 intra-band(non-contiguous) 46+46+46+66+66* 4 intra-band(contiguous) plus inter-band 2+46+46+46+46*, 3+40+40+40+40*, 5+46+46+46+46*, 13+46+46+46+46*, 46+46+46+46+66* Intra-band(non-contiguous) 41* Note: * Those CA are not defined in 3GPP as of publication date, they are not fully applicable for SAR test,support pending 3GPP approval. 2.4 Application Framework The peripheral applications for L860 module are shown in Figure 2-1: D/G(AUX1) ANT M2(AUX3) ANT M1(AUX2) ANT Main ANT Module Power Supply ON/OFF# RESET# Control SIM1 SIM2 SIM Card SIM Card PCIe USB2.0 EINT Indicator Host application Figure2-1 Application Framework 2.5 Hardware Block Diagram The hardware block diagram in Figure 2-2 shows the main hardware functions of L860 module, including base band and RF functions. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 15 of 55 Baseband contains the followings: GSM/UMTS/LTE FDD controller/Power supply NAND/internal LPDDR4 RAM Application interface RF contains the followings: RF Transceiver RF Power/PA RF Front end RF Filter Antenna Connector Figure 2-2 Hardware Block Diagram 2.6 Antenna Configuration L860 module support four antennas and the configuration is as below table: Function Description Band configuration Main ANT All supported bands transmit & receive M1 MIMO1 ANT 4x4 MIMO supported bands receive M2 MIMO2 ANT 4x4 MIMO supported bands receive D/G Diversity & GNSS ANT All supported bands and GNSS receive Antenna Connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 16 of 55 3 Application Interface 3.1 M.2 Interface The L860 module applies standard M.2 Key-B interface, with a total of 75 pins. 3.1.1 Pin Map Figure 3-1 Pin Map Note: Pin “Notch” represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 17 of 55 3.1.2 Pin Definition The pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type NC, L860 M.2 module is configured as CONFIG_3 NC the WWAN – PCIe, USB3.0 interface type +3.3V PI Power input Power Supply GND GND Power Supply +3.3V PI Power input Power Supply GND GND Power Supply PU FULL_CARD_ POWER_OFF# Power enable, Module power on input, CMOS internal pull up 3.3/1.8V USB Data Plus 0.3---3V USB D+ I/O W_DISABLE1# USB D- I/O 10 LED1# OD 11 GND 12 Notch Notch 13 Notch Notch 14 Notch Notch 15 Notch Notch 16 Notch Notch 17 Notch Notch 18 Notch Notch 19 Notch Notch 20 I2S_CLK PD WWAN Disable, active low USB Data Minus PD System status LED, Output open drain, CMOS 3.3V GND I2S Serial clock, Reserved CMOS 3.3/1.8V 0.3---3V CMOS 3.3V Power Supply CMOS 1.8V NC, L860 M.2 module is configured as 21 NC CONFIG_0 the WWAN – PCIe, USB3.0 interface type 22 I2S_RX PD I2S Serial receive data, Reserved CMOS 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 18 of 55 Pin Pin Name I/O Reset Value Pin Description Type 23 WOWWAN# PD Wake up host, Reserved CMOS 1.8V 24 I2S_TX PD I2S Serial transmit data, Reserved CMOS 1.8V 25 DPR PD Body SAR Detect, active low 26 W_DISABLE2# PD GNSS disable, active low, Reserved 27 GND GND Power Supply 28 I2S_WA PD I2S Word alignment/select, Reserved CMOS 1.8V 29 USB3.0_TX- 30 UIM_RESET 31 USB3.0_TX+ 32 UIM_CLK SIM clock Signal 1.8V/3V 33 GND GND Power Supply 34 UIM_DATA I/O SIM data input/output 1.8V/3V 35 USB3.0_RX- USB3.0 receive data minus, Reserved 36 UIM_PWR SIM power supply, 3V/1.8V 37 USB3.0_RX+ USB3.0 receive data plus, Reserved 38 NC 39 GND 40 SIM2_DETECT PD 41 PETn0 42 UIM2_DATA I/O 43 PETp0 44 UIM2_CLK SIM2 clock Signal 1.8V/3V 45 GND GND Power Supply 46 UIM2_RESET SIM2 reset signal 1.8V/3V 47 PERn0 48 UIM2_PWR CMOS 3.3/1.8V CMOS 3.3/1.8V USB3.0 Transmit data minus, Reserved SIM reset signal 1.8V/3V USB3.0 Transmit data plus, Reserved 1.8V/3V NC GND SIM2 Detect, internal pull up(390KΩ), active high Power Supply CMOS 1.8V PCIe TX Differential signals Negative SIM2 data input/output 1.8V/3V PCIe TX Differential signals Positive PCIe RX Differential signals Negative SIM2 power supply, 3V/1.8V 1.8V/3V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 19 of 55 Pin Pin Name I/O 49 PERp0 Reset Value Pin Description Type PCIe RX Differential signals Positive Asserted to reset module PCIe interface default. If module went into 50 PERST# PU core dump, it will reset whole module, CMOS 3.3V not only PCIe interface. Active low, internal pull up(10KΩ) 51 GND GND Power Supply Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It 52 CLKREQ# PU also used by L1 PM Sub states CMOS 3.3V mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up(10KΩ) 53 REFCLKN PCIe Reference Clock signal Negative Asserted to wake up system and reactivate PCIe link from L2 to L0, it 54 PEWAKE# depends on system whether supports wake up functionality. Active low, open drain output and CMOS 3.3V should add external pull up on platform PCIe Reference Clock signal 55 REFCLKP 56 RFFE_SCLK 57 GND 58 RFFE_SDATA I/O PD 59 ANTCTL0 Positive PD MIPI Interface Tunable ANT, RFFE clock GND MIPI Interface Tunable ANT, RFFE data Tunable ANT CTRL0 CMOS 1.8V Power Supply CMOS 1.8V CMOS 1.8V Wireless Coexistence between WWAN 60 COEX3 I/O PD and WiFi/BT modules, based on BT-SIG coexistence protocol. COEX_EXT_FTA, CMOS 1.8V Reserved 61 ANTCTL1 PD Tunable ANT CTRL1 CMOS 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 20 of 55 Pin Pin Name I/O Reset Value Pin Description Type Wireless Coexistence between WWAN 62 COEX_RXD and WiFi/BT modules, based on BT-SIG coexistence protocol. UART receive CMOS 1.8V signal(WWAN module side), Reserved 63 ANTCTL2 PD Tunable ANT CTRL2 CMOS 1.8V Wireless Coexistence between WWAN 64 COEX_TXD and WiFi/BT modules, based on BT-SIG coexistence protocol. UART transmit CMOS 1.8V signal(WWAN module side), Reserved 65 ANTCTL3 PD 66 SIM1_DETECT PD 67 RESET# PU Tunable ANT CTRL3 SIM1 Detect, internal pull up(390KΩ), active high WWAN reset input, internal pull up(10KΩ), active low CMOS 1.8V CMOS 1.8V CMOS 1.8V Host antenna configuration detect, ANT_CONFIG 68 PD internal pull up(100KΩ), CMOS 1.8V Reserved GND, L860 M.2 module is configured 69 CONFIG_1 GND as the WWAN – PCIe, USB3.0 interface type 70 +3.3V PI Power input Power Supply 71 GND GND Power Supply 72 +3.3V PI Power input Power Supply 73 GND GND Power Supply 74 +3.3V PI Power input Power Supply NC, L860 M.2 module is configured as 75 CONFIG_2 NC the WWAN – PCIe, USB3.0 interface type Reset Value: The initial status after module reset, not the status when working. H: High Voltage Level L: Low Voltage Level PD: Pull-Down PU: Pull-Up T: Tristate Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 21 of 55 OD: Open Drain PI: Power Input PO: Power Output Note: The unused pins can be left floating. 3.2 Power Supply The power interface of L860 module as shown in the following table: DC Parameter（V） Pin Pin Name I/O Pin Description Minimum Typical Maximum Value Value Value 2, 4, 70, 72, 74 +3.3V PI Power supply input 3.135 3.3 4.4 36 UIM_PWR PO USIM power supply 1.8V/3V 48 UIM2_PWR PO USIM power supply 1.8V/3V L860 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as the external power cannot control the module status through the PCIe protocol. 3.2.1 Power Supply The L860 module should be powered through the +3.3V pins, and the power supply design is shown in Figure 3-2: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 22 of 55 Figure 3-2 Power Supply Design The filter capacitor design for power supply as shown in the following table: Recommended capacitance Application Description Reduce power fluctuations of the module in operation, requiring capacitors with low ESR. 220uF x 2 Voltage-stabilizing capacitors LDO or DC/DC power supply requires the capacitor of no less than 440uF The capacitor for battery power supply can be reduced to 100~200uF 1uF, 100nF Digital signal noise 700/800, 850/900 MHz frequency 39pF, 33pF band Filter out the interference generated from the clock and digital signals Filter out low frequency band RF interference 1500/1700/1800/1900, 18pF, 10pF, 8.2pF, 6.8pF, 3.3pF 2100/2300, 2500/2600MHz, Filter out medium/high frequency band RF 3500/3700MHz, 5GHz frequency interference band The stable power supply can ensure the normal operation of L860 module; and the ripple of the power supply should be less than 300mV in design. Because module support 5CA download, when module operates with the maximum data transfer throughput, the maximum operating current can reach to upper 2500mA. It requests the power source voltage should not be lower than 3.135V, otherwise module may shut down or restart. The power supply requirement is shown in Figure 3-3: Burst transmit Burst transmit Ripple≤300mV Power supply Drop VBAT≥3.135V min:3.135V Figure 3-3 Power Supply Requirement Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 23 of 55 3.2.2 Logic level The L860 module 1.8V logic level definition as shown in the following table: Parameters Minimum Typical Maximum Unit 1.8V logic level 1.71 1.8 1.89 VIH 1.3 1.8 1.89 VIL -0.3 0.3 The L860 module 3.3V logic level definition as shown in the following table: Parameters Minimum Typical Maximum Unit 3.3V logic level 3.135 3.3 3.465 VIH 2.3 3.3 3.465 VIL -0.3 0.3 3.2.3 Power Consumption In the condition of 3.3V power supply, the L860 power consumption as shown in the following table: Parameter Mode Condition Average Current(mA) Ioff Power off IWCDMA-RMS 0.08 DRX=6 13 DRX=8 11.5 DRX=9 11 LTE FDD Paging cycle #64 frames (0.64 sec DRx cycle) 13 LTE TDD Paging cycle #64 frames (0.64 sec DRx cycle) 13 Radio Off AT+CFUN=4, Flight mode 10 WCDMA Data call Band 1 @+23.5dBm 665 WCDMA Data call Band 2 @+23.5dBm 625 WCDMA Data call Band 4 @+23.5dBm 825 WCDMA Data call Band 5 @+23.5dBm 570 WCDMA Data call Band 8 @+23.5dBm 565 WCDMA ISleep Power supply, module power off WCDMA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 24 of 55 Parameter Mode Condition Average Current(mA) LTE FDD ILTE-RMS LTE FDD Data call Band 1 @+23dBm 840 LTE FDD Data call Band 2 @+23dBm 970 LTE FDD Data call Band 3 @+23dBm 785 LTE FDD Data call Band 4 @+23dBm 890 LTE FDD Data call Band 5 @+23dBm 700 LTE FDD Data call Band 7 @+23dBm 890 LTE FDD Data call Band 8 @+23dBm 725 LTE FDD Data call Band 12 @+23dBm 610 LTE FDD Data call Band 13 @+23dBm 750 LTE FDD Data call Band 14 @+23dBm 750 LTE FDD Data call Band 17 @+23dBm 625 LTE FDD Data call Band 18 @+23dBm 690 LTE FDD Data call Band 19 @+23dBm 700 LTE FDD Data call Band 20 @+23dBm 635 LTE FDD Data call Band 25 @+23dBm 1240 LTE FDD Data call Band 26 @+23dBm 700 LTE FDD Data call Band 28 @+23dBm 680 LTE FDD Data call Band 30 @+23dBm 780 LTE FDD Data call Band 66 @+23dBm 915 LTE TDD Data call Band 38 @+23dBm 620 LTE TDD Data call Band 39 @+23dBm 450 LTE TDD Data call Band 40 @+23dBm 770 LTE TDD Data call Band 41 @+23dBm 690 LTE TDD In 5CA mode, the L860 power consumption as shown in the following table:： Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 25 of 55 Condition Average 5CA Combination (LTE FDD 5CA, Full RB) Current(mA) Band 1 @+22dBm <2500mA 1+3+3+7+7, 3+3+7+7+28, 2+46+46+46+46, Band 2 @+22dBm <2500mA 46+46+46+46+66 Band 3 @+22dBm <2500mA Band 5 @+22dBm <2500mA Band 7 @+22dBm <2500mA 2+46+46+46+46, 2+46+46+46+66, Band 13 @+22dBm <2500mA 3+28+40+40+40, 4+46+46+46+46, Band 20 @+22dBm <2500mA Band 28 @+22dBm <2500mA Band 30 @+22dBm <2500mA 5+46+46+46+46, 13+46+46+46+46, Band 40 @+22dBm <2500mA 41+41+41+41+41 Band 41 @+22dBm <2500mA Band 66 @+22dBm <2500mA 1+3+3+7+20, 1+3+7+7+28, 2+5+5+30+66 2+5+5+66+66, 2+2+46+46+46 2+5+46+46+46, 2+13+46+46+46, 5+46+46+46+66, 13+46+46+46+66, 46+46+46+66+66 2+46+46+46+46, 3+40+40+40+40, Note： The data above is an average value obtained by testing some samples. 3.3 Control Signal The L860 module provides two control signals for power on/off and reset operations, the pin defined as shown in the following table: Pin Pin Name I/O Reset Value Functions Type Module power on/off input, FULL_CARD_POWER _OFF# PU 67 RESET# PU internal pull up Power on: High/Floating Power off: Low WWAN reset input, internal pull up(10KΩ), active low 3.3/1.8V 1.8V Asserted to reset module PCIe interface default. If module went into 50 PERST# PU core dump, it will reset whole module, not only PCIe interface. CMOS 3.3V Active low, internal pull up(10KΩ) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 26 of 55 Note： RESET# and PERST# need to be controlled by independent GPIO, and not shared with other devices on the host. 3.3.1 Module Start-Up 3.3.1.1 Start-up Circuit The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. AP (Application Processor) controls the module start-up，the circuit design is shown in Figure3-4: Figure 3-4 Circuit for Module Start-up Controlled by AP 3.3.1.2 Start-up Timing Sequence When power supply is ready, the PMU of module will power on and start initialization process by pulling high FULL_CARD_POWER_OFF# signal. After about 10s, module will complete initialization process. The start-up timing is shown in Figure 3-5: tpr +3.3V FULL_CARD_POWER_OFF# ton1 RESET# ton2 PERST# typical 10s Module State OFF Initialization Activation(AT Command Ready) Figure 3-5 Timing Control for Start-up Index Minimum Typical tpr 0ms ton1 100ms 200ms Notes The delay time of power supply rising from 0V up to 3.135V. If power supply always ready, it can be ignored If the RESET# has a residual voltage, then 100ms is necessary Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 27 of 55 Index Minimum Typical Notes ton2 100ms 400ms PERST# should de-asserted after FULL_CARD_POWER_OFF# 3.3.2 Module Shutdown Module can be shut down by following control: Shutdown Control Action Condition Software Normal shutdown(recommend) Sending AT+CFUN=0 command Only used when a hardware exception Pull down Hardware FULL_CARD_POWER_OFF# pin occurs and the software control cannot be used. Module can be shut down by sending AT+CFUN=0 command. When the module receives the software shutdown command, the module will start the finalization process (the reverse process of initialization), and it will be completed after tsd time(tsd is the time which AP receive OK of “AT+CFUN=0”, if there is no response, the max tsd is 5s). In the finalization process, the module will save the network, SIM card and some other parameters from memory, then clear the memory and shut down PMU. The software control timing is shown in Figure 3-6: tpd +3.3V FULL_CARD_POWER_OFF# toff1 RESET# AT+CFUN=0 toff2 PERST# tsd Module State Activation Finalization OFF Figure 3-6 Software control power off timing Index Minimum tpd 10ms Typical Maxim Notes 100ms +3.3V power supply goes down time. If power supply is always on, it can be ignored toff1 10ms 30ms RESET# should asserted before FULL_CARD_POWER_OFF# toff2 0ms 30ms toff1 PERST# should asserted after RESET# 3.3.3 Module Reset The L860 module can reset to its initial status by pulling down the RESET# signal for more than 10ms Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 28 of 55 (30msis recommended), and module will restart after RESET# signal is released. When customer executes RESET# function, the PMU remains its power inside the module. The recommended circuit design is shown in the Figure 3-7: Figure 3-7 Recommended Design for Reset Circuit There are two reset control timings as below: Host may keep FULL_CARD_POWER_OFF# high when system restarting, module reset timing is shown in the Figure 3-8; Host may assert FULL_CARD_POWER_OFF# high when system restarting, module reset timing is shown in the Figure 3-9; +3.3V FULL_CARD_POWER_OFF# RESET# tres1 tres2 PERST# typical 10s Module State Activation PMU RESET Restart Activation Figure 3-8 Reset control timing1st Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 29 of 55 +3.3V FULL_CARD_POWER_OFF# tres1 tres1 RESET# tres2 PERST# typical 10s Module State Activation PMU RESET Restart Activation Figure 3-9 Reset control timing2nd Index Minimum Typical tres1 10ms 30ms Notes RESET# should asserted time PERST# should asserted after RESET#. tres2 0ms 30ms PERST# is not required for modem restart, thus this pin can be remains high during restart Note: RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In case of PCB layout, the RESET# signal lines should keep away from the RF interference and protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on the surface planes to avoid module from reset caused by ESD problems. 3.3.4 PCIe Reset Module supports PCIe goes in to D3cold L2 state in Win10 system. The D0->D3cold L2@S0/S0ix/S3 ->D0 timing is shown in figure 3-10: +3.3V FULL_CARD_POWER_OFF# RESET# PERST# Module State D0 D3cold L2@S0/S0ix/S3 D0 Figure 3-10 PCIe reset timing Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 30 of 55 3.4 PCIe & USB L860 module supports PCIe and USB interface for data request. PCIe & USB interface functions are as below table: Interface System Priority Description Priority: PCIe>USB. PCIe Win10 High If PCIe and USB ports connected both with PC, module will initial PCIe first, then disable USB port It must disconnect PCIe port, only keep USB connecting. USB Low Android/Linux If keep PCIe and USB connecting both, it needs disable PCIe by BIOS/UEFI of PC 3.4.1 PCIe Interface L860 module supports PCIe Gen2, one lane for data transmission channel.it is also compatible with PCIe Gen1.After L860 module is inserted into PC, PCIe interface can work with the driver, then map a MBIM port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10 system and GNSS interface for receiving GNSS data. 3.4.1.1 PCIe Interface Definition Pin# Pin Name I/O Reset Value Description 41 PETn0 PCIe TX Differential signals Type Negative 43 PETP0 PCIe TX Differential signals Positive 47 PERn0 PCIe RX Differential signals NegativeBit0 49 PERP0 PCIe RX Differential signals Positive 53 REFCLKN PCIe Reference Clock signal Negative 55 REFCLKP PCIe Reference Clock signal Positive Asserted to reset module PCIe interface 50 PERST# PU default. If module went into coredump, it will CMOS 3.3V reset whole module, not only PCIe interface. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 31 of 55 Pin# Pin Name I/O Reset Value Description Type Active low, internal pull up(10KΩ) Asserted by device to request a PCIe reference clock be available (active clock CLKREQ# 52 state) in order to transmit data. It also used by L1 PM Sub states mechanism, asserted by CMOS 3.3V either host or device to initiate an L1 exit. Active low, internal pull up(10KΩ) Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system PEWAKE# 54 whether supports wake up functionality. CMOS 3.3V Active low, open drain output and should add external pull up on platform 3.4.1.2 PCIe Interface Application The reference circuit is shown in Figure 3-11: AP side Module side AC Caps PERn0 PETn0 AC Caps PETP0 REFCLKN REFCLKP +3.3V 10K PERST# CLKREQ# M.2 Key-B 75pin Connector PERP0 WAKE# PETn0(pin41) PETP0(pin43) PERn0(pin47) PERP0(pin49) REFCLKN(pin53) REFCLKP(pin55) PERST#(pin50) CLKREQ#(pin52) PEWAKE#(pin54) Figure 3-11 Reference Circuit for PCIe Interface L860 module supports PCIe Gen2 interface, including three difference pairs: transmit pair TXP/N, receiving pair RXP/N and clock pair CLKP/N. PCIe can achieve the maximum transmission rate of 5 GT/s, and must strictly follow the rules below in PCB Layout: The differential signal pair lines shall be parallel and equal in length; The differential signal pair lines shall be short if possible and be controlled within 15 inch(380 mm) for AP end; The impedance of differential signal pair lines is recommended to be 100 ohm, and can be controlled to 80～120 ohm in accordance with PCIe protocol; Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 32 of 55 It shall avoid the discontinuous reference ground, such as segment and space; When the differential signal lines go through different layers, the via hole of grounding signal should be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes and the lines shall never cross the segment of plane; Try to avoid bended lines and avoid introducing common-mode noise in the system, which will influence the signal integrity and EMI of difference pair. As shown in Figure 3-12, the bending angle of all lines should be equal or greater than 135°, the spacing between difference pair lines should be larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least. When a serpentine line is used for length match with another line, the bended length of each segment shall be at least 3 times the line width (≥3W). The largest spacing between the bended part of the serpentine line and another one of the differential lines must be less than 2 times the spacing of normal differential lines (S1<2S); ≥1.5W ≥3W PCIe Difference Pair 1 ≥1 35° S1<2S ≥20mil PCIe Difference Pair 2 Figure 3-12 Requirement of PCIe Line The difference in length of two data lines in difference pair should be within 5mil, and the length match is required for all parts. When the length match is conducted for the differential lines, the designed position of correct match should be close to that of incorrect match, as shown in Figure 313. However, there is no specific requirements for the length match of transmit pair and receiving pair, that is, the length match is only required in the internal differential lines rather than between different difference pairs. The length match should be close to the signal pin and pass the smallangle bending design. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 33 of 55 Correct match Dismatched end Matched end Incorrect match Figure 3-13 Length Match Design of PCIe Difference Pair 3.4.2 USB Interface The L860 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB FullSpeed (12 Mbit/s).For the USB timing and electrical specification of L860 module, please refer to Universal Serial Bus Specification 2.0”. When module inserted PC, USB can enumerate three ACM and three NCM ports in Android/Linux system, the ports can be configured in practical application. 3.4.2.1 USB Interface Definition Pin# Pin Name I/O Description USB_D+ I/O USB Data Plus Type 0.3---3V, USB2.0 0.3---3V, USB_D- I/O USB Data Minus USB2.0 3.4.2.2 USB2.0 Interface Application The reference circuit is shown in Figure 3-14: Figure 3-14 Reference Circuit for USB 2.0 Interface Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 34 of 55 Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use 0.5pF TVS diodes. USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of 480 Mbit/s, so the following rules shall be followed carefully in the case of PCB layout: USB_D- and USB_D+ signal lines should have the differential impedance of 90 ohms. USB_D- and USB_D+ signal lines should be parallel and have the equal length, the right angle routing should be avoided. USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the ground layer, and wrapped with GND vertically and horizontally. 3.5 USIM Interface The L860 module has dual built-in USIM card interface, which supports 1.8V and 3V SIM cards. 3.5.1 USIM1 Pins The USIM1 pins description as shown in the following table: Pin Pin Name I/O Reset Value Description Type 36 UIM_PWR PO USIM power supply 1.8V/3V 30 UIM_RESET USIM reset 1.8V/3V 32 UIM_CLK USIM clock 1.8V/3V 34 UIM_DATA I/O USIM data, internal pull up(4.7KΩ) 1.8V/3V USIM card detect, internal 390K pullup. 66 SIM_DETECT PD Active high, and high level indicates 1.8V SIM card is inserted; and low level indicates SIM card is detached. 3.5.2 USIM2 Pins The USIM2 pins description as shown in the following table: Pin Pin Name I/O Reset Value Description Type 48 UIM2_PWR PO USIM2 power supply 1.8V/3V 46 UIM2_RESET USIM2 reset 1.8V/3V 44 UIM2_CLK USIM2 clock 1.8V/3V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 35 of 55 Pin Pin Name I/O Reset Value Description 42 UIM2_DATA I/O USIM2 data, internal pull up(4.7KΩ) Type 1.8V/3V USIM2 card detect, internal 390K pull-up. 40 SIM2_DETECT PD Active high, and high level indicates 1.8V SIM card is inserted; and low level indicates SIM card is detached. 3.5.3 USIM Interface Circuit 3.5.3.1 N.C. SIM Card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-15: Figure 3-15 Reference Circuit for N.C. SIM Card Slot The principles of the N.C.SIM card slot are described as follows: When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.3.2 N.O. SIM Card Slot The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-16: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 36 of 55 Figure 3-16 Reference Circuit for N.O. SIM Card Slot The principles of the N.O.SIM card slot are described as follows: When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.4 USIM Hot-Plugging The L860 module supports the SIM card hot-plugging function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot. The SIM card hot-plugging function can be configured by “AT+MSMPD” command, and the description for AT command as shown in the following table: AT Command Hot-plugging Detection Function Description Default value, the SIM card hot-plugging detection function is AT+MSMPD=1 Enable enabled. The module can detect whether the SIM card is inserted or not through the SIM_DETECT pin state. The SIM card hot-plugging detect function is disabled. AT+MSMPD=0 Disable The module reads the SIM card when starting up, and the SIM_DETECT status will not be detected. After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card is Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 37 of 55 inserted when the SIM_DETECT pin is high, then executes the initialization program and finish the network registration after reading the SIM card information. When the SIM_DETECT pin is low, the module determines that the SIM card is detached and does not read the SIM card. Note: By default, SIM_DETECT is active-high, which can be switched to active-low by the AT command. Please refer to the AT Commands Manual for the AT command. 3.5.5 USIM Design The SIM card circuit design shall meet the EMC standards and ESD requirements with the improved capability to resist interference, to ensure that the SIM card can work stably. The following guidelines should be noted in case of design: The SIM card slot placement should near the module as close as possible, and away from the RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources. The SIM card slot with a metal shielding housing can improve the anti-interference ability. The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality. The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least. The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22~33pF capacitance should be used. 3.6 Status Indicator The L860 module provides two signals to indicate the operating status of the module, and the status indicator pins as shown in the following table: Pin Pin Name I/O Reset Value Pin Description Type 10 LED1# System status LED, drain output. CMOS 3.3V 23 WOWWAN# PD Module wakes up Host (AP)，Reserved CMOS 1.8V 3.6.1 LED#1 Signal The LED#1 signal is used to indicate the operating status of the module, and the detailed description as shown in the following table: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 38 of 55 Module Status LED1# Signal RF function ON Low level (LED On) RF function OFF High level (LED Off) The LED driving circuit is shown in figure 3-17: Figure 3-17 LED Driving Circuit Note: The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current. 3.7 Interrupt Control The L860 module provides four interrupt signals, and the pin definition is as follows: Reset Pin Pin Name I/O Pin Description Type Value W_DISABLE1# PD Enable/Disable RF network CMOS 3.3/1.8V 25 DPR PD Body SAR detection CMOS 3.3/1.8V 26 W_DISABLE2# PD GNSS Disable signal Reserved CMOS 3.3/1.8V Host antenna configuration 68 ANT_CONFIG PD detection CMOS 1.8V Reserved 3.7.1 W_DISABLE1# The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The definition of W_DISABLE1# signal is as below table: W_DISABLE1# signal Function High/Floating WWAN function is enabled, the module exits the Flight mode. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 39 of 55 W_DISABLE1# signal Function Low WWAN function is disabled, the module enters Flight mode. Note： The function of W_DISABLE1# can be customized, please refer to the software porting guide. 3.7.2 BODYSAR The L860 module supports Body SAR function by detecting the DPR pin. The voltage level of DPR is high by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing the RF radiation on the human body. The threshold of emission power can be set by the AT Commands. The definition of DPR signal as shown in the following table: DPR signal Function High/Floating The module keeps the default emission power Low Lower the maximum emission power to the threshold value of the module. 3.7.3 ANT_CONFIG L860 module can be configured to support dual antennas or 4 antennas by detecting the ANT_CONFIG pin. ANT_CONFIG is an input port which is pulled high internal in default. When ANT_CONFIG is high level, then module supports dual antennas (Main & D/G ANT). When module detects low level of ANT_CONFIG, then module will be configured to support 4 antennas. The definition of ANT_CONFIG signal is shown as below table: ANT_CONFIG signal Function High/Floating Support dual antennas(Main & D/G ANT)，Reserved Low Support 4 antennas，Reserved 3.8 ANT Tunable Interface The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 4bit GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the antenna. Pin Pin Name I/O Pin Description Type 22 RFFE_VIO Tunable ANT control, MIPI Interface, Power 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 40 of 55 Pin Pin Name I/O Pin Description Type RFFE VIO 56 RFFE_SCLK Tunable ANT control, MIPI Interface, CMOS 1.8V RFFE clock 58 RFFE_SDATA I/O Tunable ANT control, MIPI Interface, CMOS 1.8V RFFE data 59 ANTCTL0 Tunable ANT control, GPO interface, CMOS 1.8V Bit0 ANTCTL1 61 Tunable ANT control, GPO interface, CMOS 1.8V bit1 ANTCTL2 63 Tunable ANT control, GPO interface, CMOS 1.8V Bit2 ANTCTL3 65 Tunable ANT control, GPO interface, CMOS 1.8V Bit3 3.9 Configuration Interface The L860 module provides four configuration pins for the configuration as the WWAN-PCIe, USB3.0 type M.2 module: Pin Pin Name I/O Reset Value Pin Description CONFIG_3 NC 21 CONFIG_0 NC 69 CONFIG_1 Internally connected to GND 75 CONFIG_2 NC Type The M.2 module configuration as the following table: Config_0 Config_1 Config_2 Config_3 Module Type and Port Configuration (pin21) (pin69) (pin75) (pin1) NC GND NC NC Main Host Interface WWAN - PCIe Gen2, USB3.0 Vender defined Please refer to PCI Express M.2 Specification Rev1.1” for more details. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 41 of 55 3.10 Other Interfaces The module does not support other interfaces yet. 4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The L860 module supports four RF connectors used for external antenna connection. As the Figure 4-1 shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna, used to receive the diversity RF signals. “M1” and “M2” are used for support 4x4 MIMO data transfer. Figure 4-1 RF connectors 4.1.2 RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50Ω –40°C to +85°C 4.1.3 RF Connector Dimension L860 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 42 of 55 Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 43 of 55 4.2 Operating Band The L860 module operating bands of the antennas are as follows: Operating Band Description Mode Tx (MHz) Rx (MHz) Band 1 2100MHz LTE FDD/WCDMA 1920 - 1980 2110 - 2170 Band 2 1900MHz LTE FDD/WCDMA 1850 - 1910 1930 - 1990 Band 3 1800MHz LTE FDD 1710 - 1785 1805 - 1880 Band 4 1700MHz LTE FDD/WCDMA 1710 - 1755 2110 - 2155 Band 5 850MHz LTE FDD/WCDMA 824 - 849 869 - 894 Band 7 2600Mhz LTE FDD 2500 - 2570 2620 - 2690 Band 8 900MHz LTE FDD/WCDMA 880 - 915 925 - 960 Band 12 700MHz LTE FDD 699 - 716 729 - 746 Band 13 700MHz LTE FDD 777 - 787 746 - 756 Band 14 700MHz LTE FDD 788 – 798 758 – 768 Band 17 700MHz LTE FDD 704 - 716 734 - 746 Band 18 800MHz LTE FDD 815 - 830 860 - 875 Band 19 800MHz LTE FDD 830 - 845 875 - 890 Band 20 800MHz LTE FDD 832 - 862 791 - 821 Band 25 1900MHz LTE FDD 1850 – 1915 1930 – 1995 Band 26 850MHz LTE FDD 814 - 849 859 - 894 Band 28 700MHz LTE FDD 703 - 748 758 - 803 Band 29 700MHz LTE FDD N/A 716 - 728 Band 30 2300MHz LTE FDD 2305 - 2315 2350 - 2360 Band 66 1700MHz LTE FDD 1710 - 1780 2110 - 2200 Band 38 2600MHz LTE TDD 2570 - 2620 Band 39 1900MHZ LTE TDD 1880 - 1920 Band 40 2300MHz LTE TDD 2300 - 2400 Band 41 2500MHZ LTE TDD 2496 - 2690 Band 46 5200MHZ LTE TDD N/A 5150 – 5925 GPS L1 1575.42±1.023 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 44 of 55 Operating Band Description Mode Tx (MHz) Rx (MHz) GLONASS L1 1602.5625±4 BeiDou 1561.098±2.046 4.3 Transmitting Power The transmitting power for each band of the L860 module as shown in the following table: Mode WCDMA LTE FDD Band 3GPP Requirement(dBm) Tx Power(dBm) Note Band 1 24+1.7/-3.7 23.5±1 Band 2 24+1.7/-3.7 23.5±1 Band 4 24+1.7/-3.7 23.5±1 Band 5 24+1.7/-3.7 23.5±1 Band 8 24+1.7/-3.7 23.5±1 Band 1 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 2 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 3 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 4 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 5 23±2.7 23+2/-1 10MHz Bandwidth, 1 RB Band 7 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 8 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 12 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 13 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 14 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 17 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 18 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 19 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 20 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 25 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 26 23±2.7 23+2/-1 10MHz Bandwidth, 1 RB Band 28 23+2.7/-3.2 23±1 10MHz Bandwidth, 1 RB Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 45 of 55 Mode Band 3GPP Requirement(dBm) Tx Power(dBm) Note Band 30 23±2.7 23+1/-2 10MHz Bandwidth, 1 RB Band 66 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 38 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 39 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 40 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 41 Normal Mode:23±2.7 HPUE Mode:26±2.7 Normal Mode:23+2/-1 HPUE Mode:26+1.5/-1 10MHz Bandwidth, 1 RB LTE TDD 4.4 Receiver Sensitivity 4.4.1 Dual Antenna Receiver Sensitivity All bands support dual antenna, the receiver sensitivity for each band of L860 module is shown in below table: Mode WCDMA Band 3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Note Band 1 -106.7 -111.0 BER<0.1% Band 2 -104.7 -110.6 BER<0.1% Band 4 -106.7 -110 BER<0.1% Band 5 -104.7 -111.4 BER<0.1% Band 8 -103.7 -111.4 BER<0.1% Band 1 -96.3 -101.1 10MHz Bandwidth Band 2 -94.3 -100.6 10MHz Bandwidth Band 3 -93.3 -101 10MHz Bandwidth Band 4 -96.3 -101.5 10MHz Bandwidth Band 5 -94.3 -103.1 10MHz Bandwidth Band 7 -94.3 -99 10MHz Bandwidth Band 8 -93.3 -102.5 10MHz Bandwidth Band 12 -93.3 -103.2 10MHz Bandwidth Band 13 -93.3 -103.1 10MHz Bandwidth Band 14 -93.3 -102.4 10MHz Bandwidth LTE FDD Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 46 of 55 Mode Band LTE TDD 3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Note Band 17 -93.3 -103.5 10MHz Bandwidth Band 18 -96.3 -103.1 10MHz Bandwidth Band 19 -96.3 -103.2 10MHz Bandwidth Band 20 -93.3 -102.7 10MHz Bandwidth Band 25 -92.8 -98.5 10MHz Bandwidth Band 26 -93.8 -103.0 10MHz Bandwidth Band 28 -94.8 -103.3 10MHz Bandwidth Band 29 -93.3 --101 10MHz Bandwidth Band 30 -95.3 --101 10MHz Bandwidth Band 66 -95.8 -101.5 10MHz Bandwidth Band 38 -96.3 -100.2 10MHz Bandwidth Band 39 -96.3 -102.2 10MHz Bandwidth Band 40 -96.3 -100.1 10MHz Bandwidth Band 41 -94.3 -99.4 10MHz Bandwidth Band 46 -88.5 -95.5 20MHz Bandwidth Note: The above values are measured in dual antennas condition (Main+Diversity). For single main antenna (without Diversity), the sensitivity will drop about 3dBm for each band of LTE. 4.4.2 Four Antenna Receiver Sensitivity Some middle/high bands support four antenna, the receiver sensitivity for some middle/high bands of L860 module is shown in below table: Mode LTE FDD Band Middle/High Bands 3GPP Requirement (dBm) Rx Sensitivity Typical(dBm) Band 1 Middle Band -99 -103.5 10MHz Bandwidth Band 2 Middle Band -97 -104 10MHz Bandwidth Band 3 Middle Band -96 -103 10MHz Bandwidth Band 4 Middle Band -99 -104 10MHz Bandwidth Band 66 Middle Band -98.5 10MHz Bandwidth Note Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 47 of 55 Mode Middle/High Bands 3GPP Requirement (dBm) Band 7 High Band -97 -103 10MHz Bandwidth Band 30 High Band 10MHz Bandwidth Band 40 High Band -99 10MHz Bandwidth Band 41 High Band -97 10MHz Bandwidth (2540~2655MHz) Band Rx Sensitivity Typical(dBm) LTE TDD Note Note: The above values are measured in four antennas condition (Main+Diversity+M1+M2). If only use dual antennas (Main+Diversity), the sensitivity will drop about 3dBm for each band of LTE. 4.5 GNSS L860 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidou integrated antenna. Description Condition Test Result GPS fixing 130mA / -122dbm GPS tracking 130mA / -122dbm GLONASS fixing 130mA / -122dbm GLONASS tracking 130mA / -122dbm BeiDou fixing 130mA / -122dbm BeiDou tracking 130mA / -122dbm GPS Sleep 4mA GLONASS Sleep 4mA BeiDou Sleep 4mA Power Power GPS Cold start 37s / -130dBm Warm start 34s / -130dBm Hot Start 2s / -130dBm Cold start 31s / -130dBm Warm start 22s / -130dBm Hot Start 3s / -130dBm TTFF GLONASS Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 48 of 55 Description Condition BeiDou AGNSS GPS Sensitivity GLONASS BeiDou Test Result Cold start 148s / -130dBm Warm start 148s / -130dBm Hot Start 3s / -130dBm Cold start Tracking -160dBm Acquisition -149dBm Tracking -160dBm Acquisition -146dBm Tracking -160dBm Acquisition -141dBm Note: Please note that GPS current is tested with RF disabled. 4.6 Antenna Design The L860module provides main and diversity antenna interfaces, and the antenna design requirements as shown in the following table: L860 module Main antenna requirements Frequency range The most proper antenna to adapt the frequencies should be used. WCDMA band 1(2100) : 250 MHz WCDMA band 2(1900) : 140 MHz Bandwidth(WCDMA) WCDMA band 4(1700) : 445 MHz WCDMA band 5(850) : 70 MHz WCDMA band 8(900) : 80 MHz Bandwidth(LTE) LTE band 1(2100): 250 MHz LTE band 2(1900): 140MHz LTE Band 3(1800): 170 MHz LTE band 4(1700): 445MHz LTE band 5(850): 70 MHz LTE band 7(2600): 190 MHz LTE Band 8(900): 80 MHz Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 49 of 55 L860 module Main antenna requirements LTE Band 12(700): 47 MHz LTE Band 13(700): 41 MHz LTE Band 14(700): 40 MHz LTE Band 17(700): 42 MHz LTE Band 18(800): 80 MHz LTE Band 19(800): 80 MHz LTE band 20(800): 71 MHz LTE band 25(1900): 145 MHz LTE band 26(850): 80 MHz LTE band 28(700): 100 MHz LTE band 29(700): 12 MHz LTE band 30(2300): 55 MHz LTE band 66(1700): 490MHz LTE band 38(2600): 50 MHz LTE Band 39(1900): 40 MHz LTE band 40(2300): 100 MHz LTE band 41(2500): 194 MHz LTE band 46(5GHz): 775 MHz GPS: 2 MHz Bandwidth(GNSS/BeiDou) GLONASS: 8 MHz BeiDou: 4 MHz Impedance 50 ohm Input power > 28 dBm average power WCDMA & LTE Recommended standing-wave ratio (SWR) ≤ 2:1 Note: ANT on B30 suggestion: Peak gain<0dBi, for FCC EIRP requirement, Efficient>50% for carrier TRP requirement. If integrator doesn't follow the instruction, Fibocom doesn't take the responsibility. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 50 of 55 5 Structure Specification 5.1 Dimension of Structure The structural dimension of the L860 module is shown in Figure 5-2: Figure 5-2 Dimension of Structure 5.2 M.2 Interface Model The L860 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 5.2 Dimension of Structure. Based on the M.2 interface definition, L860 module adopts Type 3042-S3-B interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 51 of 55 5.3 M.2 Connector The L860 module connects to AP via M.2 connector, it is recommended to use M.2 connector from LOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector, please refer to the specification. Figure 5-3 M.2 Dimension of Structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 52 of 55 5.4 Storage 5.4.1 Storage Life Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months. 5.5 Packing The L860 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent. Note： The module is a precision electronic product, and may suffer permanent damage if no correct electrostatic protection measures are taken. 5.5.1 Tray Package The L860 module uses tray package, 20 pcs are packed in each tray, with 5 trays including one empty tray on top in each box and 5 boxes in each case. Tray packaging process is shown in Figure 5-4: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 53 of 55 Figure 5-4 Tray Packaging Process Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 54 of 55 5.5.2 Tray size The pallet size is 315*170*6.5mm, as shown in Figure 5-5: Figure 5-5 Tray Size (Unit: mm) ITEM DIM(Unit: mm) 315.0±2.0 170.0±2.0 6.5±0.3 0.8±0.1 43.0±0.3 31.0±0.3 79.0±0.2 60.0±0.2 180.0±0.2 60.0±0.2 40.0±0.2 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM_L860-GL Hardware User Manual Page 55 of 55
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