Fisher Price CBV76-14 Mattel Bluetooth Low Energy Module User Manual
Fisher-Price Inc. Mattel Bluetooth Low Energy Module
Contents
- 1. User Manual
- 2. User manual
User Manual
MATTEL,INC.
MattelBLEModuleUseGuide
IPN:1100153650
BruceCordier
Version1.2
Version:1.2 MattelBLEModuleUseGuide
May27,2014 Page1of22
Contents
SectionPage
1.Introduction..............................................................................................................................................................2
2.ModuleBlockDiagram..............................................................................................................................................2
3.ModuleSchematicandPCBlayout...........................................................................................................................2
4.AltiumLibrarycontainingSchematicFootprintformodule,andPCBfootprintforModule...................................3
5.DatasheetandprogrammingguidesfortheCC2541...............................................................................................3
6.ModulePinlistandpindescription..........................................................................................................................3
7.ModuleSchematicSymbol.......................................................................................................................................4
8.ModulePCBpadConnections(Pinkareashowskeepoutzone).............................................................................5
9.BluetoothLowEnergyChannelsSpectrum...............................................................................................................6
10.FlashMemorySizeofCC2541.................................................................................................................................6
11.OperatingConditions..............................................................................................................................................6
12.BluetoothProtocolsandProfilesSupportedbyModule........................................................................................7
13.DesigningEndProductsforusewithModuleTraceAntenna................................................................................7
14.ExternalAntennaConnection.................................................................................................................................9
15.SmartDeviceCompatibility..................................................................................................................................10
16.Software................................................................................................................................................................10
17.UsingModuleTestFirmwareonModuleandModuleTestApponaniOSDevice..............................................14
18.ProgrammingtheMattelBLEModule..................................................................................................................14
19.DevelopmentTools...............................................................................................................................................15
20.UsingtheCC2541SPIinterface.............................................................................................................................16
21.ModuleManufacturer..........................................................................................................................................16
22.ManufacturingproductswiththeMattelBLEModule.........................................................................................17
23.BTSIGqualificationinformation...........................................................................................................................17
24.FCC,IndustryCanada,Bluetooth.SIGTestReports..............................................................................................18
25.BQEinformation(forfurtherRFtesting)..............................................................................................................18
26.TexasInstrumentsEngineeringSupport...............................................................................................................18
27.BreakoutPCB(Experimenter’sBoard)..................................................................................................................19
28.FCC/IndustryCanadaStatement(tobeplacedonEndProducts)........................................................................20
29.Revisions...............................................................................................................................................................21
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MattelBLEModuleUseGuide
FrontViewRearView
1. Introduction
TheMattelBluetoothLowenergy(BLE)ModuleisadaughterboardthatcanbeaddedtoMattel
endproductstoallowBluetoothLowEnergy(alsocalledBluetoothSmart)connectivitytootherBluetooth
SmartorBluetoothSmartReadydevices.Thisdocument,alongwiththeaccompanyingfilesaremeantto
beusedasaQuickStartGuidefordevelopingwiththemodule,andformanufacturingproductswiththe
module.ThemoduleisbasedonTexasInstrumentsCC2541IC,whichcontainsan8051‐core
microprocessor,andthenecessaryRFcircuitrytoenableBluetoothLowEnergycommunications.
EachMattelBLEModulehasauniqueMACAddressprogrammedintoitduringmodule
manufacture.Thisuniqueaddresscanbeusedtoidentifyuniqueendproducts,andalsoaspartof
softwaresecurityschemestocontrolaccesstoendproducts.
NOTE:TheMattelBLEModulewiththeexistingPCBantenna,andTexasInstrumentsBLE
softwarestackare(willbe)approved“asis”bytheBluetooth.sig.Thisalsoincludestheexact
componentsthatareonthemodule.Anychangetoanyoftheseitems(Components,component
manufacturers,outputantenna,BLEsoftwarestack)areconsideredadesignchangebythe
Bluetooth.sig,andwillrequirefullcompliancetestingandnewproductlistingbytheBluetooth.sig.
2. ModuleBlockDiagram
Containedinsubdirectory:\ModuleBlockDiagram
3. ModuleSchematicandPCBlayout
Containedinsubdirectory:\ModuleSchematic,AltiumLibrary
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4. AltiumLibrarycontainingSchematicFootprintformodule,andPCB
footprintforModule
Containedinsubdirectory:\ModuleSchematic,AltiumLibrary
5. DatasheetandprogrammingguidesfortheCC2541
Containedinsubdirectory:\Datasheets
6. ModulePinlistandpindescription
PinPinNameDescription
6P1_0DigitalI/Opin,Port1,Bit0(20mAdrivecapability)
7P1_1DigitalI/Opin,Port1,Bit1(20mAdrivecapability)
8P1_2DigitalI/Opin,Port1,Bit2
9P1_3DigitalI/Opin,Port1,Bit3
10P1_4DigitalI/Opin,Port1,Bit4
11P1_5DigitalI/Opin,Port1,Bit5
12P1_6DigitalI/Opin,Port1,Bit6
13P1_7DigitalI/Opin,Port1,Bit7
20P0_0DigitalI/Opin,Port0,Bit0
21P0_1DigitalI/Opin,Port0,Bit1
14P0_2DigitalI/Opin,Port0,Bit2
17P0_3DigitalI/Opin,Port0,Bit3
15P0_4DigitalI/Opin,Port0,Bit4
16P0_5DigitalI/Opin,Port0,Bit5
22P0_6DigitalI/Opin,Port0,Bit6
19P0_7DigitalI/Opin,Port0,Bit7
18RESET_N
23P2_0DigitalI/Opin,Port2,Bit0
4P2_1/DDDigitalI/Opin,Port2,Bit1(AlsoDebugdatapin:DD)
5P2_2/DCDigitalI/Opin,Port2,Bit2(AlsoDebugclockpin:DC)
2SCLI2Cclockpin(AlsoDigitalI/O)[LEAVEFLOATINGIFUNUSED]
27SDAI2Cdatapin(AlsoDigitalI/O)[LEAVEFLOATINGIFUNUSED]
24VDD_3PowertoModule,2.6vDC–3.6vDC(Nominal:3.3vDC)
25GNDGround
26GNDGround
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7. ModuleSchematicSymbol
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8. ModulePCBpadConnections(Pinkareashowskeepoutzone)
18
20
21
14
17
15
16
22
19 678910 11 27 2
24
12
13
23
4
5
26
25
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9. BluetoothLowEnergyChannelsSpectrum
10. FlashMemorySizeofCC2541
1) TherearetwoFLASHmemorysizesavailablefortheCC2541IC
a. 128Kbytes
b. 256Kbytes
2) Forwidestcompatibility,the256KByteICsareonthedefaultMattelBLEModule
3) The128KbyteversionoftheICisavailableforasavingsof:~$0.05(US)
4) ThedefaultBLEsoftwarestackusesapproximately90–95Kbytesofcodespace.
5) IfOverTheAirUpdatesoffirmwareareneededforproduct,the256Kbytemoduleshouldbeused,
andtheendproductfirmwareshouldfitinto128Kbytes,allowingfor2banksofcodetobeswitched
duringfirmwareupdate.
11. OperatingConditions
1) PowerSupplyconnectiontoModuleisPin24(VDD_3)
2) GroundConnectionstoModulearePins25,26
3) PowerSupplyVoltageRange:2.6vDC–3.6vDC(3.3vDCnominal)
4) MaximumCurrentdraw(NoperipheralsconnectedtomoduleIOpins):25mA@3.3vDC
5) OperatingTemperature(Minimum):‐17⁰C
6) OperatingTemperature(Maximum):+45⁰C
7) Forfurtherdetails,refertoCC2541datasheet
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12. BluetoothProtocolsandProfilesSupportedbyModule
1) BluetoothProtocolssupportedbyModule:
a. RFPHY
b. LL
c. 4.0HCI
d. L2CAP
e. GAP
f. ATT
g. GATT
h. SM
2) BluetoothProfilessupportedbyModule:
a. ANP
b. BAS
c. BLP
d. BLS
e. CSCP
f. CSCS
g. DIS
h. FMP
i. HIDS
j. HOGP
k. HRP
l. HRS
m. HTP
n. HTS
o. IAS
p. LLS
q. PASP
r. PXP
s. RSCP
t. RSCS
u. SCPP
v. SCPS
w. TIP
x. TPS
13. DesigningEndProductsforusewithModuleTraceAntenna
1) AntennaKeepout:
a. InordertoensureproperoperationofthePCBtraceantennathatisontheBLEmodule
(LabeledasA1ontheToplayersilkscreen),anymetalonnearbyPCBsorinsidetheend
productshouldbekeptasfarawayaspossiblefromtheAntennaarea.Thisareaisshownby
theRedoutlinesinthepicturesbelow.
b. Forexample,iftheBLEmoduleistobedirectlysolderedtoanotherPCB,thesecondPCB
shouldnothaveanytraces,Power/Groundplanes,oranymetalunderorabovethisarea.
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FrontViewRearView
c. BelowisapictureoftheBreakoutPCB(Experimenter’sboard)thatcanbeusedwiththe
Module.Pleasenotehowitwasdesignedtohavenotracesormetalinthekeepoutareanear
theModuleantenna.
2) OtherrulestofollowtoallowforbestoperationoftheBLEmodule
a. Avoidlocatingthemodulenearbatterycompartmentsorbatteries.Theelectricalmassof
batteriescanhavealargedetrimentaleffectonantennaperformance.
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b. Avoidlocatingthemodulenearelectricallynoisycomponents:
i. Motors
ii. Highspeedmicroprocessors
iii. Crystals
iv. Anycomponents/circuitsthatcreatehighfrequencyelectricalnoise
3) Thetraceantennaonthemoduleisdesignedtobeasomnidirectionalaspossible,meaningthatitcan
bemountedinendproductsindifferentorientations(horizontal,vertical)andstillworkwell.
14. ExternalAntennaConnection
PLEASENOTE:Useofanyantennaotherthanthetraceantennaonthemodulewillrequirefull
regulatorycompliancetestingoftheendproductwiththenewantennadesign.(I.e.Bluetooth.SIG,
FCC,IC,etc.)
1) Ifaproductdesignoruserequirestheuseofanexternalantenna,thiscanbeeasilyaccomplished
withtheBLEmodule.Usethefollowingsteps:
a. Remove0OhmresistoratR1
b. Place0OhmresistoratR2
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c. ConnectexternalantennaatA2
15. SmartDeviceCompatibility
1) TheMattelBLEModulecommunicatesviasinglemodeBluetoothSmart(BluetoothLowEnergy)
protocol.ForaSmartDevice(iOSDevice,AndroidDevice)tocommunicatewiththeModule,itmust
meetthefollowingrequirements:
DeviceTypeMinimumOperatingSystemVersionMinimumHardwareRequired
iOSPhoneiOSVersion5iphone4S(ornewer)
iOSTabletiOSVersion5ipad3(ornewer)
ipodTouchiOSVersion6ipodTouch5(ornewer)
Androidphoneor
tablet
AndroidVersion4.3Varies(musttestfor
compatibility)
16. Software
1) StarterModuleFirmware(ModuleIOTest)
a. WehavecreatedafirmwareloadforthemodulethatcontainstheTexasInstrumentsBLE
Stacksoftware,aswellassomesimpleoperatingcodethat:
i. AllowstheModuletoconnecttoanotherBLEdevice.
1. Uponpowerup,theModuletriestoconnecttothesmartdevicetestappfor
30seconds.
2. Ifafter30seconds,noconnectionismade,itstopstheattempt.Atthatpoint,
powerwillhavetoberemovedandre‐appliedtothemoduletoattempt
connection.
ii. ReportsRSSIvaluetotheconnecteddevice
iii. TogglesalltheModuleIOpinsHighorLowwithaTogglecommandfromthe
ConnectedBLEdevice
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1. IOpinsadjacenttoeachotherwilltoggleHIGH/LOWreverseofeachother,
eachtimetheTogglecommandisissued.(i.e.P0.0,P0.2,P0.4,P0.6output
willgoHIGHatthesametimeP0.1,P0.3,P0.5,P0.7willgoLOW)Thisisdone
sothattheusercaneasilytelliftwoadjacentpinsareshorted.
b. HEXfileandSourceCode
Containedinsubdirectory:\ModuleTest,ModuleFirmware
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2) StarteriOSApp
a. ToConnecttotheModuleIOTestFirmwareontheBLEModule,wehavecreatedasimpleiOS
AppcalledModuleTest.Theappcontains:
i. ButtonforConnectingtoBLEModule
ii. ConnectionStatusIndicator
iii. P0.0andP0.1readbackindicators
iv. BarGraphrepresentingRSSIofconnection
v. ToggleIOPinsButton
b. iOSAppInstallation
i. DuetoAppleitunesstorerequirements,wecannotwidelydistributetheIPA
installationfilefortheiOSapp.Instead,theappinstallationishandledthrougha
distributionsystemcalledTestflight.
ii. ForaccesstotheModuleTestapp,pleasecontacttheFisher‐PriceAdvanced
TechnologyResearchteam.
c. SourceCode
i. TheiOSversionoftheModuleTestappisanativeXcodeprogram.
ii. ForaccesstothesourcecodefortheModuleTestapp,pleasecontacttheFisher‐Price
AdvancedTechnologyResearchteam.
ConnectButton
P0.0andP0.1reading
ToggleIOpinscommand
ConnectionStatus
RSSIValue(Connection
Strength)
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3) SoftwareDevelopment
a. PleaseNote:TheBLEModuleisapprovedbytheBluetooth.SIGorganizationwiththe
followinglimitations:
i. TheTexasInstrumentsBLEStacksoftwareisincludedinthefirmwarebuild,andis
notmodifiedinanyway.
ii. Noelectronichardwaremodificationsaremadetothemodule.
iii. Ifeitheroftheseitemsismodified,themoduleandit’sendproductwillhavetobe
re‐tested,andre‐listedwiththeBluetooth.SIGasanewproduct.
b. PotentiallyanysoftwaredevelopercanbeusedtocreateafirmwareloadfortheBLEmodule,
giventhattheyadheretotherestrictionslistedabove.
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17. UsingModuleTestFirmwareonModuleandModuleTestApponaniOS
Device
1) ProgramModuleIOTestfirmwareontoBLEModule.
2) iOSDevicemustmeetminimumhardwareandsoftwarerequirementsforBLEasshownin
Compatibilitytableinthisdocument.
3) InstallModuleTestapponiOSDevice
4) EnsurethatBluetoothisenabledoniOSDevice
5) StartModuleTestapponiOSDevice.
6) ApplyPowertotheBLEModule(Modulefirmwarewillattempttoconnecttoappfornext30seconds)
7) Pressthe“ConnecttoModule”buttoninthetestapp.Atthistime,aprogressindicatorabovethe
connectbuttonwillstartanimatingduringtheconnectionattempt.
8) Afterafewseconds,iftheconnectionissuccessful,thefollowingshouldhappenintheapp:
a. TheConnectionStatusindicationintheappshouldturnblue
b. The“ConnecttoModule”buttonlabelshouldchangeto“Disconnect”(Pressingthebuttonat
thistimewilldisconnectthemodulefromtheapp)
c. TheRSSIgraphshouldfillrelativetotheconnectionsignalstrength
9) Iftheconnectionattemptisnotsuccessful(theprogressindicatorstops,andtheConnectionStatus
indicatorstaysgray),youmaypresstheconnectbuttonagaintoattempttoconnect.
10) OnceaconnectionisestablishedPressingthe“ToggleIO”buttonintheappwillsendacommandto
theBLEmoduletotoggletheoutputstateofallofitsIOpinsThiscanbeverifiedin2ways:
a. ConnectanoscilloscopeorvoltmetertoanyofthemoduleIOpins.WhentheToggle
commandissent,themeasuredpinshouldchangestate(Hightolow,orlowtohigh)
b. TheP0.0andP0.1indicatorsintheappreadbacktheactualvaluesofthoseIOpinsas
reportedbytheCC2541.(Theyarealiveindicatoroftheoutputvaluesofthose2hardware
pins).
18. ProgrammingtheMattelBLEModule
1) DevelopmentProgrammingTools
a. TexasInstrumentsCCDebuggerProgrammer
i. TheCCDebuggerisshownhere:
http://www.ti.com/tool/cc‐debugger
ii. PleasereferencetheCCDebuggerUser’sGuidefoundhere:
http://www.ti.com/lit/pdf/swru197
b. TexasInstrumentsSmartRFFlashProgrammerPCprogram
2) Howtoprogram
a. WhenUsingtheBreakoutPCB(Pleaserefertodiagramin“BreakoutPCB”sectionofthis
document)
i. SetjumperJ1onBreakoutPCBto“DEBUG”,sothatmodulewillbepoweredfromCC
Debugger
ii. ConnectCCDebuggertoprogrammingheaderP2
iii. StartSmartRFflashprogrammingsoftwareonPC
iv. PressRESETbuttononCCDebugger
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v. StatusLEDonCCDebuggershouldturngreen.(IfLEDisRED,thereiseithera
connectionproblemwiththeprogrammer,orpossiblyasoftwaredrivererrorforthe
programmer)
vi. LoadHEXfileintoprogrammersoftware
vii. Programfirmwareontodevice
viii. DisconnectCCdebuggerconnector
ix. SetJumperJ1onBreakoutPCBto“BENCH”topowermoduleandconnectedcircuits
throughconnectorP1
b. WhennotusingtheBreakoutPCB
i. IfnotusingtheBreakoutPCBforconnectionstothemodule,thefollowingdiagram
liststheconnectionsneededtoconnecttotheCCdebuggerforprogramming.
ii. TheminimumsignalsetupforprogrammingwiththeCCdebuggerishighlightedin
yellow.ThepictureistakenfromtheCCDebuggerUser'sGuide(SWRU197).
iii. NOTE:IfusingtheCCDebuggertopowerthetarget,theredsignalisalsoneeded.
iv. NOTE2:Pin2,TargetVoltageSense:ThisisaninputtotheCCDebugger'slevel
shifters.TheCCdebuggerusesthissensetoverifythatthetargetandtheCC
debuggerareoperatingatthesamevoltagelevels.ItshouldreflectthetargetVDD
(oftenthesameaspin9ifpoweringthetargetfromtheCCDebugger).
v. NOTE3:Whencreatingthetargetcircuitdesign,ensurethatthereisnopowersupply
conflictwiththeCCdebuggerandBLEmodulepowersupply.(Forexample,onthe
BreakoutPCBdesignthereisaPowersupplyjumperfortheBLEmodule,1positionof
thejumperdisconnectsthemaincircuitpowerfromtheBLEmodule,andonlypower
themodulethroughtheCCdebuggerconnectorforprogramming.Theotherjumper
positiondisconnectstheDebuggerconnectorpowerpinfromtheModule,and
powersthemoduleonlythroughtheMaincircuit.)
vi. Oncetheelectricalconnectionsaremade,followthesamesoftwareprogramming
proceduresasshownintheprevioussection.
19. DevelopmentTools
1) SoftwareIDEandCompiler:IAREmbeddedWorkbenchforTexasInstruments8051(Keilalsosupplies
compilesoftwarefortheCC2541)
a. ContactTexasInstrumentsorIARSystems(www.iar.com)forsupportonhowtopurchase
thesetools.
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20. UsingtheCC2541SPIinterface
1) TheCC2541IContheBLEModulecancommunicatetootherIC’s(Toyprocessors)viaSPIinterface
2) TheCC2541canactaseithertheMasteroftheslavedeviceinanSPIconnection.
3) AnexampleofhowtoconnecttoanothermicrocontrollerviaSPIisincludedinthedocumentation
Containedinsubdirectory:\SPIConnectionInformation
21. ModuleManufacturer
1) MACAddressProgrammingandModuleTestingProcedures:
Containedinsubdirectory:\ModuleManufacture
2) AftercomponentassemblyontotheBLEmodule,theModulemanufacturernext:
a. ProgramsuniqueMACaddressesontoeachBLEModule
b. ProgramsModuleTestfirmwareontoModule
c. TestsModule
3) MACAddressProgramming‐EveryMattelBLEModulehasauniqueMACAddressprogrammedintoit
duringmodulemanufacture.
a. ThelistofavailableandusedMACaddressesfortheBLEModules(andotherMACaddresses
products)ismaintainedbyMattel/Fisher‐PriceEngineering.
i. ForasetofMACaddressestobeusedduringthemanufactureoftheBLEmodules,
pleasecontacttheFisher‐PriceAdvancedTechnologyResearchteam.
b. PleaserefertotheMACAddressprogrammingsectionoftheSOPdocumentintheModule
Manufacturedirectory.
4) AutomatedTesting(modulemanufacture)
a. PleaserefertothetestingsectionoftheSOPdocumentintheModuleManufacturedirectory.
5) ModuleTestAppTesting
a. Sampletestingofconnection
i. Duringproduction,lottesting(1outofevery100modules)shouldbetestedtoverify
itsabilitytoconnectwiththeModuleTestapp,toverifyproperoperationofthe
Module.
ii. Toperformthistest,pleasefollowtheproceduredetailedelsewhereinthisdocument,
inthesectiontitled:“UsingModuleTestFirmwareonModuleandModuleTestApp
onaniOSDevice”
b. Supplycurrentcheck
i. DuringtheModuleTesttesting,thesupplycurrentoftheBLEModuleshouldbe
monitoredduringthetest.
1. Ifthemaximumsupplycurrentdrawofthemoduleis<30mAduringthe
Moduletesttest,theModulecurrentdrawisconsideredgood.
2. Ifmaximumsupplycurrentdrawis>30mA,thisisconsideredafail,andthe
moduleshouldundergodiagnosistodeterminewhythecurrentdrawis
abovethelimit.
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22. ManufacturingproductswiththeMattelBLEModule
1) OverallProcessDescription:
Containedinsubdirectory:\BLEEndProductOverallElectronicsandTestingProcess
2) Programming
a. ProgrammingproceduresfortheBLEModuleinfinalendproductsaretobedefinedbythe
Project’sDevelopmentElectricalEngineer
3) Testingprocedures/requirements,
a. Testingenvironment
i. Nocellphones,radios,wifi,withinarangeof10mofdeviceundertest
ii. Screenroomisnotrequiredfortesting
iii. ipad4thgeneration(ornewer),iOS5.1(orhigher)
b. TestingofBLEModuleinEndProduct
i. TestingproceduresfortheBLEModuleinfinalendproductsaretobedefinedbythe
Project’sDevelopmentElectricalEngineer
ii. ExampletestingplanforBLEModuleinEndProduct(Thefirstplannedendproduct
fortheBLEModuleisaFisher‐PriceSwingplatform.Pleasefindbelowtheexample
testplanfortheBLEModuleinsidetheswingendproduct)
1. UseasingleiOSdevicewithcustomTestappthatcantalktomultipleend
units(swings)atonce
2. TesterplacesSwingintoTestMode
3. TestAppwillbroadcastavaluetoallBLEdevices
4. TheswingwillreceivethebroadcastvaluesanddisplayonfrontpanelLEDs
(BLEmoduleinswingwillreceivedata,passoverSPIconnectiontoW567ICin
swing,W567controlsfrontpanelLEDs)[ThisconfirmsthatboththeBLE
connection,andtheSPIconnectionbetweenIC’sareproperlytransferring
data.]
5. TesterwillverifyLEDsareexpectedpattern.
6. W567inSwingwillgeneratedatapayloadtoBLEmodule,modulewillsend
payloadbacktoiOSapp(Possiblyecho,ornewdata,TBD)
7. Aspartofreturndata,BLEmodulewillsenduniqueMACaddressofModule
aspartofpayload.Thetestappcanusethistouniquelyidentifytestresults.
8. RSSILimits(TesterwillreadRSSIvaluereportedintestapp.Ifvalueisinrange
ofdefinedrange,RSSIisgood)
a. Distance?TBD(Thisvaluewillbedeterminedwithearlytestsamples
atmanufacture)
b. Orientation?TBD(Thisvaluewillbedeterminedwithearlytest
samplesatmanufacture)
c. AcceptableRangeofRSSIvalues?TBD(Thisvaluewillbedetermined
withearlytestsamplesatmanufacture)
23. BTSIGqualificationinformation
1) PleaseNote:TheBLEModuleisapprovedbytheBluetooth.SIGorganizationwiththefollowing
limitations:
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a. TheTexasInstrumentsBLEStacksoftwareisincludedinthefirmwarebuild,andisnot
modifiedinanyway.
b. Noelectronichardwaremodificationsaremadetothemodule.
c. Ifeitheroftheseitemsismodified,themoduleandit’sendproductwillhavetobere‐
tested,andre‐listedwiththeBluetooth.SIGasanewproduct.
2) Wheretofindlisting
a. Afterregulatorytestingiscompleted,andthefirstendproductusingtheBLEModuleislisted
withBluetooth.sig,thissectionwillbeupdatedwiththelistinginformation.
3) Intentionalradiatortesting
a. AfterregulatorytestingiscompletedforthefirstendproductusingtheBLE.sig,thissection
willbeupdatedwiththetestinformation.
24. FCC,IndustryCanada,Bluetooth.SIGTestReports
Containedinsubdirectory:\TestReports(FCC,IndustryCanada,Bluetooth_SIG)
25. BQEinformation(forfurtherRFtesting)
1) AlltestingandcertificationforthemodulewasconductedthroughaBluetoothQualificationExpert:
JeanChin,GlobalCertification.
a. Heremailaddress:jeanchin@globcert.com
26. TexasInstrumentsEngineeringSupport
1) ToobtainEngineeringsupportfromTexasInstruments,pleasecontact:ChrisYorkey,Texas
InstrumentsApplicationEngineer.
a. Hisemailaddress:chris.yorkey@ti.com
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27. BreakoutPCB(Experimenter’sBoard)
1) ToaidindevelopmentwiththeMattelBLEModule,wehavecreatedaBreakoutPCBtoalloweasy
connectionstotheIOpinsonthemodule.ThebreakoutPCBcontains:
a. PowerInputconnectorP1(toallowmoduleandconnectedcircuittobepoweredwithan
externalpowersupply)
b. Voltageregulatorcircuit(RegulatesvoltageinputonP1to+3.3vDCtopowermoduleand
externalcircuits)
c. Debugheader(toallowprogrammingofModulewithCCDebugger)
d. HeadersP3,P4,P5,P6(toallowaccesstoregulatedpowerandmoduleIOpinsforconnection
toexternalcircuits)
e. SolderconnectionsforModule(allowsModuletobesolderedtoBreakoutPCB)
2) SchematicandPCB
a. Containedinsubdirectory:\BreakoutboardSchematic,PCB
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28. FCC/IndustryCanadaStatement(tobeplacedonEndProducts)
FederalCommunicationsCommission(FCC)Statement
Youarecautionedthatchangesormodificationsnotexpresslyapprovedbythepartresponsibleforcompliance
couldvoidtheuser’sauthoritytooperatetheequipment.
ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice,pursuanttopart
15oftheFCCrules.Theselimitsaredesignedtoprovidereasonableprotectionagainstharmfulinterferenceina
residentialinstallation.Thisequipmentgenerates,usesandcanradiateradiofrequencyenergyand,ifnot
installedandusedinaccordancewiththeinstructions,maycauseharmfulinterferencetoradiocommunications.
However,thereisnoguaranteethatinterferencewillnotoccurinaparticularinstallation.Ifthisequipmentdoes
causeharmfulinterferencetoradioortelevisionreception,whichcanbedeterminedbyturningtheequipment
offandon,theuserisencouragedtotrytocorrecttheinterferencebyoneormoreofthefollowingmeasures:
‐Reorientorrelocatethereceivingantenna.
‐Increasetheseparationbetweentheequipmentandreceiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
‐Consultthedealeroranexperiencedradio/TVtechnicianforhelp.
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:
1)thisdevicemaynotcauseharmfulinterference,and
2)thisdevicemustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation
ofthedevice.
FCCRFRadiationExposureStatement:
ThisequipmentcomplieswithFCCradiationexposurelimitssetforthforanuncontrolledenvironment.Endusers
mustfollowthespecificoperatinginstructionsforsatisfyingRFexposurecompliance.Thistransmittermustnotbe
co‐locatedoroperatinginconjunctionwithanyotherantennaortransmitter.
IndustryCanada(IC)Statement
ThisdevicecomplieswithIndustryCanadalicence‐exemptRSSstandard(s).Operationissubjecttothefollowing
twoconditions:(1)thisdevicemaynotcauseinterference,and(2)thisdevicemustacceptanyinterference,
includinginterferencethatmaycauseundesiredoperationofthedevice.
Canada,avisd’IndustryCanada(IC)
LeprésentappareilestconformeauxCNRd'IndustrieCanadaapplicablesauxappareilsradioexemptsdelicence.
L'exploitationestautoriséeauxdeuxconditionssuivantes:
(1)l'appareilnedoitpasproduiredebrouillage,et
(2)l'utilisateurdel'appareildoitacceptertoutbrouillageradioélectriquesubi,mêmesile
brouillageestsusceptibled'encompromettrelefonctionnement.
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NoticetoOEMintegrator
TheOEMintegratorhastobeawarenottoprovideinformationtotheenduserregardinghowtoinstallor
removethisRFmoduleintheuser’smanualoftheendproductwhichintegratesthismodule.
Theendusermanualshallincludeallrequiredregulatoryinformation/warningasshowinthismanual.
TheOEMintegratorisresponsiblefortestingtheirend‐productforanyadditionalcompliancerequirements
requiredwiththismoduleinstalled.
L'intégrateurOEMdoitêtreconscientdenepasfournirdesinformationsàl'utilisateurfinalquantàlafaçon
d'installeroudesupprimercemoduleRFdanslemanueldel'utilisateurduproduitfinalquiintègrecemodule.
Lemanueldel'utilisateurfinaldoitincluretouteslesinformationsréglementairesrequisesetavertissements
commeindiquédanscemanuel.
Note:Theendproductshallhavesthewords“ContainsTransmitterModuleFCCID:CCT‐CBV76‐14,IC:4390A‐
CBV76”
Version:1.2 MattelBLEModuleUseGuide
May27,2014Page22of22
29. Revisions
1) Version1.1
a. Updatedminimumandmaximumoperatingvoltagesandminimumandmaximumoperating
temperaturesinsection“OperatingConditions”
2) Version1.2
a. AddedFCC/ICWarningstatementinsection:“FCC/IndustryCanadaStatement(tobeplaced
onEndProducts)”
b. AddedlinktoEndProductmanufacturingandtestingprocessdocumentinSection:
“ManufacturingproductswiththeMattelBLEModule”
c. AddedlinktoModuleBlockDiagraminSection:“ModuleBlockDiagram”
d. AddedlinktoFCC,IC,Bluetooth.SIGTestreportsinSection:“FCC,IndustryCanada,
Bluetooth.SIGTestReports”
e. AddednotesforFlashmemorysizesandOverTheAirFirmwareUpdatesinsection:“Flash
MemorySizeofCC2541”