Flaircomm Microelectronics BTM702C Bluetooth Module BT5.0 User Manual revised1219
Flaircomm Microelectronics,Inc. Bluetooth Module BT5.0 Users Manual revised1219
Users Manual_revised1219
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| Document Description | Users Manual_revised1219 |
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| Date Submitted | 2018-12-19 00:00:00 |
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FLC-BTM702 Datasheet FCC ID:P4I-BTM702C Only use PCB antenna,antenna gain:0dbi; FLC-BTM702 Datasheet 7F,Guomai Building,116 East JiangBin Ave,Fuzhou,Fujian,China Subsequent customers have terminal product, needs to be matched with terminal product to test part 15c radiation. Trade Name:Flairmicro Document Type: Bluetooth Module Datasheet Document Number: FLC-BTM702-DS Document Version: V1.1 Release Date: April 16, 2018 Edited by: Zhang Chunsheng Reviewed by: Lin Wei Copyright 2018~ 2020 by Flaircomm Microelectronics Inc., All Right Reserved Without written permission from Flaircomm Microelectronics Inc., reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is prohibited Flaircomm Microelectronics, Inc. -1- FLC-BTM702 Datasheet Release Record Version Release Date Comments V1.0 V1.1 March 13, 2018 April 16, 2018 Release 1. Increase the module's model:BTM702IQ2C and BTM702IQ2D 2. Increase the power description 3. Modify PIO's name Flaircomm Microelectronics, Inc. -2- FLC-BTM702 Datasheet CONTENTS 1. INTRODUCTION ......................................................................................................................................... 6 1.1 NAMING DECLARATION ........................................................................................................................... 6 1.2 BLOCK DIAGRAM ...................................................................................................................................... 6 1.3 FEATURES ................................................................................................................................................. 7 1.4 APPLICATIONS .......................................................................................................................................... 7 2. GENERAL SPECIFICATION ....................................................................................................................... 8 3. PIN DEFINITION .......................................................................................................................................... 9 3.1 PIN CONFIGURATION ............................................................................................................................... 9 3.2 PIN DEFINITION ........................................................................................................................................ 9 4. PHYSICAL INTERFACES.......................................................................................................................... 12 4.1 RESETB.................................................................................................................................................... 12 4.1.1 Digital Pin States on Reset ................................................................................................................. 12 4.2 AUTOMATIC RESET PROTECTION ....................................................................................................... 13 4.3 SERIAL INTERFACES ............................................................................................................................. 13 4.3.1 USB Interface ...................................................................................................................................... 13 4.3.2 UART Interface ................................................................................................................................... 13 4.3.3 SPI ....................................................................................................................................................... 14 4.4 AUDIO INTERFACE ................................................................................................................................. 14 4.4.1 Audio Codec Interface ......................................................................................................................... 14 4.4.1.1 ADC ............................................................................................................................................. 15 4.4.1.2 ADC Sample Rate Selection ....................................................................................................... 15 4.4.1.3 ADC Audio Input Gain ................................................................................................................. 15 4.4.1.4 ADC Pre-Amplifier And Analog/Digital Gain ................................................................................ 16 4.4.1.5 ADC Digital Gain ......................................................................................................................... 16 4.4.1.6 ADC Digital IIR Filter ................................................................................................................... 17 4.4.1.7 DAC ............................................................................................................................................. 17 4.4.1.8 DAC Sample Rate Selection ....................................................................................................... 17 4.4.1.9 DAC Gain .................................................................................................................................... 17 4.4.1.10 DAC Digital FIR Filter ................................................................................................................ 18 4.4.1.11 Microphone Bias Generator ...................................................................................................... 18 4.4.1.12 Output Stage ............................................................................................................................. 19 4.4.1.13 Mono Operator .......................................................................................................................... 19 4.4.1.14 Sidetone .................................................................................................................................... 20 4.4.1.15 Integrated Digital IIR Filter ........................................................................................................ 21 4.4.2 I S Interface ........................................................................................................................................ 21 4.4.3 aptx Codec .......................................................................................................................................... 24 4.5 LED DRIVERS .......................................................................................................................................... 25 4.6 RF INTERFACE ........................................................................................................................................ 26 4.7 GENERAL PURPOSE ANALOGUE IO .................................................................................................... 26 4.8 GENERAL PURPOSE DIGITAL IO .......................................................................................................... 26 5. ELECTRICAL CHARACTERISTIC ............................................................................................................ 27 5.1 ABSOLUTE MAXIMUM RATING.............................................................................................................. 27 5.2 RECOMMENDED OPERATING CONDITIONS ....................................................................................... 27 5.3 INPUT/OUTPUT TERMINAL CHARACTERISTICS ................................................................................. 27 5.3.1 Digital Terminals ................................................................................................................................. 27 5.3.2 USB ..................................................................................................................................................... 28 5.3.3 Stereo Codec: Analog-To-Digital Converter ........................................................................................ 28 5.3.4 Stereo Codec: Digital-To-Analog Converter ........................................................................................ 29 5.3.5 Microphone Bias Generator ................................................................................................................. 30 5.3.6 Current ............................................................................................................................................... 30 6. REFERENCE DESIGN ............................................................................................................................... 31 7. MECHANICAL CHARACTERISTIC .......................................................................................................... 32 8. RECOMMENDED PCB LAYOUT AND MOUNTING PATTERN ............................................................... 34 8.1 INPUT/OUTPUT TERMINAL CHARACTERISTICS ................................................................................. 34 Flaircomm Microelectronics, Inc. -3- FLC-BTM702 Datasheet 9. RECOMMENDED REFLOW PROFILE ..................................................................................................... 36 10. ORDERING INFORMATION .................................................................................................................... 37 10.1 PRODUCT PACKAGING INFORMATION ............................................................................................. 37 10.2 ORDERING INFORMATION .................................................................................................................. 39 10.2.1 Product Revision ............................................................................................................................... 39 10.2.2 Shipping Package ............................................................................................................................. 39 10.2.3 Product Package ............................................................................................................................... 39 10.2.4 Product Grade ................................................................................................................................... 40 Flaircomm Microelectronics, Inc. -4- FLC-BTM702 Datasheet TABLES AND FIGURES Table 1: Naming Declaration ......................................................................................................................... 6 Table 2: General Specification ...................................................................................................................... 8 Table 3: Pin Definition ................................................................................................................................. 11 Table 4: Pin Status on Reset ....................................................................................................................... 12 Table 5: Possible UART Settings ................................................................................................................ 14 Table 6: StandardBaudRates ...................................................................................................................... 14 Table 7: ADC Audio Input Gain Selection ................................................................................................... 17 Table 8: DAC Digital Gain Selection ............................................................................................................ 18 Table 9: DAC Analog Gain Selection .......................................................................................................... 18 Table 10: Sidetone Gain .............................................................................................................................. 20 Table 11: Digital Audio Interface Slave Timing ........................................................................................... 22 Table 12: I²S Slave Mode Timing ................................................................................................................ 23 Table 13: Digital Audio Interface Master Timing ......................................................................................... 23 Table 14: I²S Master Mode Timing Parameters, WS And SCK As Outputs ................................................ 23 Table 15: Absolute Maximum Rating .......................................................................................................... 27 Table 16: Recommended Operating Conditions ......................................................................................... 27 Table 17: Digital Terminal ........................................................................................................................... 28 Table 18: USB Terminal .............................................................................................................................. 28 Table 19: Product Revision ......................................................................................................................... 39 Table 20: Shipping Package ....................................................................................................................... 39 Table 21: Product Package ......................................................................................................................... 39 Table 22: Product Grade ............................................................................................................................. 40 Figure 1: Block Diagram ................................................................................................................................ 6 Figure 2: Pin Configuration ............................................................................................................................ 9 Figure 3: Audio Input and Output ................................................................................................................ 15 Figure 4: Audio Input Gain .......................................................................................................................... 16 Figure 5: Micro phone Biasing..................................................................................................................... 18 Figure 6: Speaker Output ............................................................................................................................ 19 Figure 7: Sidetone ....................................................................................................................................... 20 Figure 8: Digital Audio Interface Modes ...................................................................................................... 22 Figure 9: :Digital Audio Interface Slave Timing ........................................................................................... 23 Figure 10: Digital Audio Interface Master Timing ........................................................................................ 24 Figure 11: LED Equivalent Circuit ............................................................................................................... 25 Figure 12: Placement the Module on a System Board................................................................................ 34 Figure 13: Leave 5mm Clearance Space from the Antenna ....................................................................... 34 Figure 14: Recommended Trace Connects Antenna and the Module ........................................................ 35 Figure 15: Recommended Reflow Profile ................................................................................................... 36 Figure 16: Product Packaging Information (Tape) ...................................................................................... 37 Figure 17: Product Packaging Information (Tray) ....................................................................................... 38 Figure 18: Ordering Information .................................................................................................................. 39 Flaircomm Microelectronics, Inc. -5- FLC-BTM702 Datasheet 1. Introduction FLC-BTM702 is a small form factor, low power and highly economic Bluetooth radio module that allows OEM to add wireless capability to their products. The module supports multiple interfaces that make it simple to design into fully certified embedded Bluetooth solutions. With FLC’s AT+™ programming interfaces, designers can easily customize their applications to support different Bluetooth profiles, such as HS/HF, A2DP, AVRCP, SPP, and etc. The module supports Bluetooth® Enhanced Data Rate (EDR) ,BT5.0 and delivers up to 3 Mbps data rate for distances to 10M. The module is an appropriate product for designers who want to add wireless capability to their products. 1.1 Naming Declaration New Naming Old Naming Description FLC-BTM702IQ2A FLC-BTM702IQ2B NA NA Without shielding case With a shielding case FLC-BTM702IQ2C NA Support aptX；Without a shielding case FLC-BTM702IQ2D NA Support aptX；With a shielding case Table 1: Naming Declaration 1.2 Block Diagram Antenna Filter PIOs Microphone Input SPI USB Qualcomm QCC300x UART Speaker Outputs AIO Flash Crystal VDD Figure 1: Block Diagram Flaircomm Microelectronics, Inc. -6- FLC-BTM702 Datasheet 1.3 Features Fully qualified single-chip dual mode Bluetooth v5.0 Profiles including HS/HF, A2DP, AVRCP, SPP, and etc. UART and USB programming and data interfaces Small form factor SMT pads for easy and reliable PCB mounting Qualcomm TrueWireless™ Stereo (TWS), which allows two devices to be configured as a stereo pair SBC and AAC audio codecs. FLC-BTM702IQ2C/ FLC-BTM702IQ2D support aptX and aptX low latency 1.4 Applications Automobile hands-free applications Stereo headset applications Cable replacements Bar code and RFID scanners Measurement and monitoring systems Industrial sensors and controls Medical devices Industrial PCs and laptops Flaircomm Microelectronics, Inc. -7- FLC-BTM702 Datasheet 2. General Specification Bluetooth Specification Fully qualified single-chip dual mode Bluetooth v5.0 , Class 1.5a Standard HS/HF, A2DP, AVRCP, SPP, etc. detailed profiles depends on the firmware Profiles Frequency Band 2.402GHz ~ 2.480GHz Maximum Data Rate 3Mbps RF Input Impedance 50 ohms Baseband Crystal OSC Interface 26MHz UART, PIO, AIO, USB, SPI, Speaker, Microphone, etc. Sensitivity -85dBm@0.1%BER BT Classic:8.8dBm;BLE:10.21 dBm RF TX Power Power Supply Voltage 2.7V ~ 3.6V DC Working Current Depends on profiles Standby Current TBD Operating Environment Temperature -40ºC to +85ºC Humidity 10%~90% Non-Condensing Certifications TBD Environmental TBD Dimension and Weight Dimension 23.2mm x 11.9mm x 2.0mm Weight TBD Table 2: General Specification a) The maximum RF TX Power is 9dBm. Flaircomm Microelectronics, Inc. -8- FLC-BTM702 Datasheet 3. Pin Definition 3.1 Pin Configuration Figure 2: Pin Configuration 3.2 Pin Definition Pin Symbol I/O Type GND RESETB Input with strong pull-up SPI_CLK Bidirectional with weak pull-down Ground Flaircomm Microelectronics, Inc. Description Ground Reset if low. Pull low for minimum 5ms to cause a reset. SPI_CLK: Debug SPI clock Alternative function: • I2S_SCK:I²S synchronous data clock -9- FLC-BTM702 Datasheet Bidirectional with weak pull-down SPI_MISO SPI_MOSI pull-down SPI_CSB Bidirectional with weak pull-down PIO7 Bidirectional with strong pull-down PIO21 Bidirectional with weak pull-down Bidirectional with weak SPI_MISO: Debug SPI data output Alternative function: • I2S_SD_OUT:I²S synchronous data output SPI_MISO: Debug SPI data input Alternative function: • I2S_SD_IN:I²S synchronous data input SPI_CSB: chip select for Debug SPI, active low Alternative function: • I2S_WS:I²S word select Programmable input/output line Alternative function: • I2S2_WS:I²S2 word select Programmable input/output line Programmable input/output line Bidirectional with strong pull-down PIO9 10 PIO21 11 PIO18 Bidirectional with weak pull-down Bidirectional with weak pull-down PIO16 Bidirectional with strong pull-up 13 PIO17 Bidirectional with strong pull-down 14 SPI_PCM Input with weak pull-up 15 GND Alternative function: • I2S2_SD_SCK:I²S2 synchronous data clock • UART_CTS:UART clear to send, active low Programmable input/output line Programmable input/output line Programmable input/output line 12 Alternative function: • UART_RTS:UART request to send, active low Programmable input/output line 16 Ground MIC_BIAS Analogue 17 GND 18 RF_IN 19 GND 20 NC 21 AIO0 Alternative function: • UART_CTS:UART clear to send, active low SPI/I²S select input: • 0=I² S/PIO interface • 1=SPI Ground Microphone Bias RF Ground RF ground Analogue Transceiver input/output line RF Ground RF ground NC NC Bidirectional Analogue Programmable input/output line Flaircomm Microelectronics, Inc. -10- FLC-BTM702 Datasheet 22 GND Ground Ground 23 MIC_LP Analogue Microphone input positive 24 MIC_LN Analogue Microphone input negative 25 SPK_LN Analogue Speaker output negative (left side) 26 SPK_LP Analogue Speaker output positive (left side) 27 SPK_RN Analogue Speaker output negative (right side) 28 SPK_RP Analogue Speaker output positive (right side) 29 NC NC NC 30 VDD 3.3v power input 3.3v power input 31 USB_DP Bidirectional USB data plus with selectableinternal1.5kpull-upresistor 32 USB_DN Bidirectional USB data minus 33 GND Ground Ground 34 NC NC NC 35 NC NC NC Programmable input/output line 36 PIO8 Bidirectional with strong pull-up 37 GND Ground 38 UART_TX 39 UART_RX 40 LED1 Bidirectional Open-drain output 41 LED0 Bidirectional Open-drain output Programmable input/output line 42 PIO6 Bidirectional with strong pull-down Alternative function: • I2S2_SD_IN:I²S2 synchronous data input • UART_RTS:UART request to send, active low Ground Bidirectional with strong pull-up Bidirectional with strong pull-up UART data output UART data input Alternative function: • I2S2_SD_OUT:I²S2 synchronous data output Table 3: Pin Definition NOTE: Pin8 and pin10 are connected inside the module to accommodate the needs of old customers. Flaircomm Microelectronics, Inc. -11- FLC-BTM702 Datasheet 4. Physical Interfaces 4.1 RESETB BTM702 is reset from several sources: RESETB pin Power-on reset Software configured watchdog timer UART break character The RESETB pin is an active low reset. Assert the reset signal for a period > 5 ms to ensure a full reset. At reset the digital I/O pins are set to inputs for bidirectional pins and outputs are set to tristate. 4.1.1 Digital Pin States on Reset Table 4 shows the pin states of BTM702 on reset. Pin Name / Group I/O Type Reset USB_DP Digital bidirectional Tristate USB_DN Digital bidirectional Tristate PIO0 Digital bidirectional Strong PU PIO1 Digital bidirectional Strong PD PIO2 Digital bidirectional Weak PD PIO3 Digital bidirectional Weak PD PIO4 Digital bidirectional Strong PU PIO5 Digital bidirectional Strong PD PIO6 Digital bidirectional Strong PD PIO7 Digital bidirectional Strong PD Table 4: Pin Status on Reset Flaircomm Microelectronics, Inc. -12- FLC-BTM702 Datasheet 4.2 Automatic Reset Protection BTM702 includes an automatic reset protection circuit that restarts the BTM702 when an unexpected reset occurs, for example, ESD strike or lowering of RST#. This reset protection circuit automatically restarts theBTM702 and enables the application to restore previous operation. NOTE If RESETB is held low for > 2.4 s and VDD is not applied, BTM702 turns off. A rising edge on VDD is then required to power on BTM702. 4.3 Serial Interfaces 4.3.1 USB Interface BTM702 has a full-speed (12 Mbps) USB interface for communicating with other compatible digital devices. The USB interface on BTM702 acts as a USB peripheral, responding to requests from a master host controller. BTM702 contains internal USB termination resistors and requires no external resistors. BTM702 supports the Universal Serial Bus Specification, Revision v2.0 (USB v2.0 Specification). 4.3.2 UART Interface BTM702 has a UART serial interface that provides a simple mechanism for communicating with other serial devices using the RS232 protocol, including for test and debug. When BTM702 is connected to another digital device, UART_RX and UART_TX transfer data between the 2 devices. UART configuration parameters, such as baud rate and packet format, are set using the BTM702 firmware. NOTE: To communicate with the UART at its maximum data rate using a standard PC, the PC requires an accelerated serial port adapter card. The use of UART and USB are mutually exclusive. Parameter Possible Values 1200 baud (≤2%Error) Minimum Baud rate Maximum Flow control Flaircomm Microelectronics, Inc. 9600 baud (≤1%Error) 4Mbaud (≤1%Error) None -13- FLC-BTM702 Datasheet Parity None, Odd or Even Number of stop bits 1 or 2 Bits per byte Table 5: Possible UART Settings Table 6 lists common baud rates and their associated error values for PSKEY_UART_BITRATE. To set the UART baud rate, load PSKEY_UART_BITRATE with the number of bits per second. Baud rate PS Key value(bits per second) Error 1200 2400 4800 9600 19200 38400 57600 76800 115200 230400 460800 921600 1382400 1843200 2764800 1200 2400 4800 9600 19200 38400 57600 76800 115200 230400 460800 921600 1382400 1843200 2764800 1.73% 1.73% 1.73% -0.82% 0.45% -0.18% 0.03% 0.14% 0.03% 0.03% -0.02% 0.00% -0.01% 0.00% 0.00% 3686400 3686400 0.00% Table 6: Standard Baud Rates 4.3.3 SPI The synchronous serial port interface (SPI) can be used for system debugging. It can also be used for in-system programming for the flash memory within the module. SPI interface uses the SPI_MOSI, SPI_MISO, SPI_CSB and SPI_CLK pins. The module operates as a slave and thus SPI_MISO is an output of the module. SPI_MISO is not in high-impedance state when SPI_CSB is pulled high. Instead, the module outputs 0 if the processor is running and 1 if it is stopped. Thus the module should NOT be connected in a multi-slave arrangement by simple parallel connection of slave SPI_MISO lines. 4.4 Audio Interface 4.4.1 Audio Codec Interface Flaircomm Microelectronics, Inc. -14- FLC-BTM702 Datasheet The interface provides following features: Mono analogue input for voice band and audio band Stereo and mono analogue output for voice band and audio band Figure 3: Audio Input and Output The BTM702 audio codec uses a fully differential architecture in the analog signal path. This architecture results in low common-mode-noise sensitivity and good power supply rejection while effectively doubling the signal amplitude. The module features a differential stereo audio output interfaces. 4.4.1.1 ADC The ADC has a second-order Sigma-Delta converter. The ADC is a separate channel with identical functionality. Each channel has an analog and a digital gain stage. 4.4.1.2 ADC Sample Rate Selection ADC supports the following sample rates: 8kHz, 11.025kHz, 16kHz, 22.05kHz, 24kHz, 32kHz, 44.1kHz，48Khz. 4.4.1.3 ADC Audio Input Gain The audio input gain consists of the following components: An analog gain stage based on a pre-amplifier and an analog gain amplifier. A digital gain stage. Flaircomm Microelectronics, Inc. -15- FLC-BTM702 Datasheet Figure 4: Audio Input Gain 4.4.1.4 ADC Pre-Amplifier And Analog/Digital Gain The gain of the ADC inputs can be configured in the range of -27 dB to 63.5 dB steps, making it suitable for line and microphone input levels. 0 dB is 1600 mV pk-pk input. The ADC input impedance is nominal 6 k except when 0 dB pre-amplifier gain is selected when it becomes 12 k. If the input pre-amplifier is disabled, the input impedance varies between 6 kand 34 k depending on gain selection. In normal operation, the input pre-amplifier is enabled. Calls connected by the VM stream automatically select the distribution of gain within the ADC for best performance. Alternatively, the individual gain stages can be set. 4.4.1.5 ADC Digital Gain Digital Gain Selection Value ADC Digital Gain Setting(Db) Digital Gain Selection Value ADC Digital Gain Setting(Db) -24 3.5 -20.5 10 -18 9.5 11 -14.5 12 12 -12 15.5 13 -8.5 Flaircomm Microelectronics, Inc. -16- FLC-BTM702 Datasheet 18 14 -6 21.5 15 -2.5 Table 7: ADC Audio Input Gain Selection 4.4.1.6 ADC Digital IIR Filter The ADC contains 2 integrated anti-aliasing filters: A long IIR filter suitable for music (> 44.1 kHz).G.722 filter. This is a digital IIR filter that improves the stop-band attenuation required for G.722 compliance. This filter is the best selection for 8 kHz/16 kHz/voice. 4.4.1.7 DAC The DAC consists of two high-quality DACs: Each DAC has a fourth-order Sigma-Delta converter. Each DAC is a separate channel with identical functionality. Each channel has an analog and a digital gain stage. 4.4.1.8 DAC Sample Rate Selection DAC supports the following sample rates: 8kHz, 11.025kHz, 16kHz, 22.05kHz, 24kHz, 32kHz, 44.1kHz，48Khz. 4.4.1.9 DAC Gain The DAC outputs have two gain stages, a digital stage followed by an analog stage. The digital gain varies between -24 dB and 21.5 dB and the analog gain between 0 dB and -21 dB, giving a total range of -45 dB to 21.5 dB. Calls connected by the VM stream automatically select the distribution of gain within the DAC for best performance. Alternatively, the individual gain stages can be set. Digital Gain Selection Value DAC Digital Gain Setting (Db) Digital Gain Selection Value DAC Digital Gain Setting (Db) -24 3.5 -20.5 10 -18 9.5 11 -14.5 12 12 -12 15.5 13 -8.5 Flaircomm Microelectronics, Inc. -17- FLC-BTM702 Datasheet 18 14 -6 21.5 15 -2.5 Table 8: DAC Digital Gain Selection Analog gain selection value DAC analog gain setting (dB) Analog gain selection value DAC analog gain setting (dB) -12 -3 -15 -6 -18 -9 -21 Table 9: DAC Analog Gain Selection 4.4.1.10 DAC Digital FIR Filter The DAC contains an integrated digital FIR filter with the following modes: • A default long FIR filter for best performance at ≥ 44.1 kHz. • A short FIR to reduce latency. • A narrow FIR (a sharp roll-off at Nyquist) for G.722 compliance. Best for 8 kHz/16 kHz. 4.4.1.11 Microphone Bias Generator BTM702 contains an independent low-noise microphone bias generator. The microphone bias generator is recommended for biasing electret condensor microphones. Figure 5 shows a typical biasing circuit for electret condenser microphones.. Figure 5: Micro phone Biasing The microphone bias generator provides a selectable output voltage of 1.8 V or 2.6 V Flaircomm Microelectronics, Inc. -18- FLC-BTM702 Datasheet nominal. No output capacitor is required. 4.4.1.12 Output Stage The output stage digital circuitry converts the signal from 16 bit per sample, linear PCM of variable sampling frequency to bit stream, which is fed into the analog output circuitry. The analog output circuit comprises a DAC, a buffer with gain-setting, a low pass filter, and a class AB output stage amplifier. Figure 6 shows that the output is available as a differential signal between SPKR_LN and SPKR_LP for the left channel, and between SPKR_RN and SPKR_RP for the right channel. Figure 6: Speaker Output 4.4.1.13 Mono Operator Mono operation is a single-channel operation of the stereo codec. The left channel represents the single mono channel for audio in and audio out. In mono operation, the right channel is the auxiliary mono channel for dual-mono channel operation. In single channel mono operation, disable the other channel to reduce power consumption. Flaircomm Microelectronics, Inc. -19- FLC-BTM702 Datasheet 4.4.1.14 Sidetone In some applications, it is necessary to implement sidetone. This sidetone function applies configurable gain to the microphone signal and feeds it into the DAC stream. The sidetone routing selects the version of the microphone signal from before or after the digital gain in the ADC interface and adds it to the output signal before or after the digital gain of the DAC interface DA DAC Interface Digital Input Side Tone Route Digital Gain Demu Side Tone Side Tone Gain Side Tone Route Digital Output Analog Output Mu Digital Gain Analog Input ADC Interface AD Figure 7: Sidetone The ADC provides simple gain to the sidetone data. The gain values range from -32.6 dB to 12.0 dB in alternating steps of 2.5 dB and 3.5 dB Value Sidetone Gain Value Sidetone Gain -32.6dB -8.5dB -30.1dB -6.0dB -26.6dB 10 -2.5dB -24.1dB 11 0dB -20.6dB 12 3.5dB -18.1dB 13 6.0dB -14.5dB 14 9.5dB -12.0dB 15 12.0dB Table 10: Sidetone Gain Flaircomm Microelectronics, Inc. -20- FLC-BTM702 Datasheet 4.4.1.15 Integrated Digital IIR Filter BTM702 has a programmable digital filter integrated into the ADC channel of the codec. The filter is a 2-stage, second-order IIR and is for functions such as custom wind noise reduction. The filter also has optional DC blocking. The filter has 10 configuration words in this order: • 1 for gain value • 8 for coefficient values (b01, b02, a01, a02, b11, b12, a11, a12) • 1 for enabling and disabling the DC blocking The gain and coefficients are all 12-bit two's complement signed integer with the format NN.NNNNNNNNNN. NOTE The position of the binary point is between bit[10] and bit[9], where bit[11] is the most significant bit. 4.4.2 I2S Interface BTM702 supports I²S input and output via its industry-standard I²S digital audio interface. BTM702 also supports several alternative PCM data formats. When in PCM mode, the following pin name to function mappings apply. I²S Pin PCM Function I2Sn_SD_IN PCM_IN I2Sn_SD_OUT PCM_OUT I2Sn_WS PCM_SYNC I2Sn_SCK PCM_CLK Flaircomm Microelectronics, Inc. -21- FLC-BTM702 Datasheet Figure 8: Digital Audio Interface Modes The internal representation of audio samples within the BTM702 QFN is 16-bit and data on SD_OUT is limited to 16-bit per channel. Symbol Parameter Min Typ Max Unit – SCK Frequency – – 6.2 MHz – WS Frequency – – 96 kHz Tch SCK high time 80 – – Ns Tcl SCK low time 80 – – Ns Table 11: Digital Audio Interface Slave Timing Symbol Parameter Min Typ Max Unit tssu tsh WS valid to SCK high set-up time 20 – – Ns SCK high to WS invalid hold time SCK low to SD_OUT valid delay time 2.5 – – Ns – – 20 ns topd Flaircomm Microelectronics, Inc. -22- FLC-BTM702 Datasheet tisu SD_IN valid to SCK high set-up time 20 – – ns tih SCK high to SD_IN invalid hold time 2.5 – – ns Table 12: I²S Slave Mode Timing Figure 9: Digital Audio Interface Slave Timing Symbol Parameter Min Typ Max Unit – SCK Frequency – – 6.2 MHz – WS Frequency – – 96 kHz Table 13: Digital Audio Interface Master Timing Symbol Parameter Min Typ Max Unit SCK low to WS valid delay time – – 39.27 ns – – 18.44 ns tisu SCK low to WS valid delay time SD_IN valid to SCK high set-up time 18.44 – – ns tih SCK high to SD_IN invalid hold time – – ns tspd topd Table 14: I²S Master Mode Timing Parameters, WS And SCK As Outputs Flaircomm Microelectronics, Inc. -23- FLC-BTM702 Datasheet Figure 10: Digital Audio Interface Master Timing 4.4.3 aptx Codec The aptX audio codec is available for high-quality stereo audio over Bluetooth. When incorporated in Bluetooth A2DP stereo products, aptX audio coding delivers full wired audio quality. The aptX audio codec source material is delivered transparently over the Bluetooth link, whether it is stored uncompressed or in an alternative compression (AAC, FLAC) format. The aptX codec has the following target applications: ■ Bluetooth stereo headphones/headsets ■ Bluetooth automotive audio ■ Bluetooth stereo speakers The aptX codec has the following benefits: ■ Outstanding Bluetooth Stereo audio quality ■ Faithful reproduction of full audio bandwidth ■ Minimization of lip-sync issues via low-delay audio decoding techniques ■ Nondestructive transcoding from other standard coded audio formats ■ Low code memory and data memory requirements ■ A2DP-compliant negotiation back to the SBC codec when connecting with legacy audio sources The aptX codec has the following key features: ■ Multiple audio sample rate support, including Fs = 44.1 kHz and Fs = 48 kHz ■ Conveyance of CD-quality audio (16-bit and Fs = 44.1 kHz) over Bluetooth at a data rate of 352 kbps ■ Frequency response maintained from 10 Hz to 22 kHz for Fs = 48 kHz ■ Algorithmic delay less than 1.89 ms for Fs = 48 kHz ■ Dynamic range for 16-bit audio in excess of 92 dB NOTE：FLC-BTM702IQ2C/D can support aptX only. Flaircomm Microelectronics, Inc. -24- FLC-BTM702 Datasheet 4.5 LED Drivers BTM702 includes two 3-pad synchronised PWM LED drivers for driving RGB LEDs for producing a wide range of colours. All LEDs are controlled by firmware. The terminals are open-drain outputs, so the LED must be connected from a positive supply rail to the pad in series with a current-limiting resistor. Figure 11: LED Equivalent Circuit From Figure 3 it is possible to derive Equation 1 to calculate ILED. If a known value of current is required through the LED to give a specific luminous intensity, then the value of RLED is calculated. Equation 1: LED Current For the LED pads to act as resistance, the external series resistor, RLED, needs to be such that the voltage drop across it, VR, keeps VPAD below 0.5V. Equation 2 also applies. = VF + VR + VPAD Equation 2: LED PAD Voltage Flaircomm Microelectronics, Inc. -25- FLC-BTM702 Datasheet Note: The LED current adds to the overall current. Conservative LED selection extends battery life. 4.6 RF Interface The module integrates a filter. The user can connect a 50ohms antenna directly to the RF port. 4.7 General Purpose Analogue IO The general purpose analog IO can be configured as ADC inputs by software. Do not connect it if not use. 4.8 General Purpose Digital IO There are eight general purpose digital IOs defined in the module. All these GPIOs can be configured by software to realize various functions, such as button controls, LED displays or interrupt signals to host controller, etc. Do not connect them if not use. Flaircomm Microelectronics, Inc. -26- FLC-BTM702 Datasheet 5. Electrical Characteristic 5.1 Absolute Maximum Rating Rating Min Max Unit Storage Temperature -40 +85 °C PIO/AIO Voltage -0.4 3.60 VDD -0.4 3.60 USB_DP/USB_DN Voltage -0.4 3.60 Other Terminal Voltages except RF -0.4 3.60 Table 15: Absolute Maximum Rating 5.2 Recommended Operating Conditions Operating Condition Min Typical Max Unit Storage Temperature -40 -- +85 °C Operating Temperature Range -40 -- +85 °C VDD +3.1 +3.3 +3.6 PIO +1.7 +1.8 +3.6 Table 16: Recommended Operating Conditions 5.3 Input/output Terminal Characteristics 5.3.1 Digital Terminals Supply Voltage Levels Min Typical Max Unit VIL input logic level low -0.4 +0.4 VIH input logic level high 0.7VDDIO VDDIO+0.4 Tr/Tf 25 ns Input Voltage Levels Output Voltage Levels VOL output logic level low, lOL = 4.0mA VOH output logic level high, lOH = -4.0mA Flaircomm Microelectronics, Inc. 0.4 VDDIO-0.2 -27- FLC-BTM702 Datasheet Tr/Tf Input and Tri-state Current ns -150 -40 -10 μA With strong pull-down 10 40 150 μA With weak pull-up -5 -1.0 -0.33 μA 0.33 +1.0 5.0 μA I/O pad leakage current -1 +1 μA CI Input Capacitance 1.0 5.0 pF With strong pull-up With weak pull-down Table 17: Digital Terminal VDDIO is the supply domain for this i/o. Typical value is 1.8V. 5.3.2 USB USB Terminals Min Typical Input Threshold VIL input logic level low VIH input logic level high 0.7VDD Output Voltage Levels to Correctly Terminated USB Cable VOL output logic level low 0.0 VOH output logic level high 2.8 Max Unit 0.3VDD 0.2 VDD Unit Table 18: USB Terminal 5.3.3 Stereo Codec: Analog-To-Digital Converter Analog-To-Digital Converter Parameter Resolution Input sample rate,Fsample Maximum ADC input signal amplitude Conditions Min Typ Max – – – 16 Bits – – 48 kHz 0dB =1600 mVpk-pk 13 – 2260 mVpk-pk Fsample 8 kHz – 94.4 – dB 16 kHz – 92.4 – dB 32 kHz – 92.5 – dB 44.1 kHz – 93.2 – dB 48 kHz – 91.9 – dB fin=1 kHz B/W=20Hz→Fsample/2(2 0kHz max) SNR A- Weighted THD+N<0.1% 1.6Vpk-pk input Flaircomm Microelectronics, Inc. -28- FLC-BTM702 Datasheet THD+N Digital gain Analog gain fin= 1 kHz B/W=20Hz→Fsample/2 (20 kHz max) Fsample 8 kHz – 0.004 – 1.6Vpk-pk input 48 kHz – 0.016 – -24 – 21.5 dB -3 – 42 dB – -89.9 – dB Min Typ Max Unit – – – 16 Bits – – 48 kHz 100k0 – 95.4 – dB 320 – 96.5 – dB 160 – 95.8 – dB Digital gain resolution = 1/32 Pre-amplifier setting =0 dB, 9dB, 21dB or 30 dB Analog setting =-3dB to12 dBin 3dB steps Stereo separation (crosstalk) 5.3.4 Stereo Codec: Digital-To-Analog Converter Digital-To-Analog Converter Parameter Resolution Output sample rate, Fsample SNR Conditions Fsample fin=1 kHz B/W= 20Hz →20 48kHz kHz A48kHz Weighted THD+N<0.1% 48kHz Load 0dBFSinput THD+N fin=1 kHz B/W= 20Hz →20 kHz 0dBFSinput Fsample Load 8kHz 100k0 – 0.0021 – 8kHz 320 – 0.0031 – 8kHz 160 – 0.0034 – 48kHz 100k0 – 0.0037 – 48kHz 320 – 0.0029 – 48kHz 160 – 0.0042 – Digital gain Digital gain resolution =1/32 -24 – 21.5 dB Analog gain Analog gain resolution =3 dB -21 – dB Output voltage Full-scale swing (differential) – – 778 mVrms – -90.5 – dB Stereo separation (crosstalk) Flaircomm Microelectronics, Inc. -29- FLC-BTM702 Datasheet 5.3.5 Microphone Bias Generator Microphone Bias Generator Min Typ Max Unit Output voltage (1.8 V selected) 1.62 1.8 1.98 Output voltage (2.6 V selected) 2.34 2.6 2.86 Drop out from VBAT input – – 300 mV Output current available – – 2.8 mA Minimum load for stated performance 70 – – uA 5.3.6 Currenta Mode Limbo(Sleep) Limbo(Idle) Connectable(Idle) Discoverable Connected Activecall Min Current(Ma) Type 4.8 TBD TBD 10.5 15.5 Max a:The current is related to the firmware version. Flaircomm Microelectronics, Inc. -30- FLC-BTM702 Datasheet 6.Reference Design Flaircomm Microelectronics, Inc. -31- FLC-BTM702 Datasheet 7. Mechanical Characteristic Flaircomm Microelectronics, Inc. -32- FLC-BTM702 Datasheet Flaircomm Microelectronics, Inc. -33- FLC-BTM702 Datasheet 8.Recommended PCB Layout and Mounting Pattern Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and RF-IN port to better match the impedance to minimize the return loss. As indicated in figure 12 below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this way that module digital part towards your digital section of the system PCB. Figure 12: Placement the Module on a System Board 8.1 Input/output Terminal Characteristics Figure 13: Leave 5mm Clearance Space from the Antenna General design recommendations are: The length of the trace or connection line should be kept as short as possible. Flaircomm Microelectronics, Inc. -34- FLC-BTM702 Datasheet Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness. Routing the RF close to digital sections of the system board should be avoided. To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree routing. Figure 14: Recommended Trace Connects Antenna and the Module Routing of the RF-connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of this part of the trace cannot be controlled. Use as many vias as possible to connect the ground planes. Flaircomm Microelectronics, Inc. -35- FLC-BTM702 Datasheet 9.Recommended Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. ℃ 250 217 210 25 min Figure 15: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217 for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C. Flaircomm Microelectronics, Inc. -36- FLC-BTM702 Datasheet 10.Ordering Information 10.1 Product Packaging Information Figure 16: Product Packaging Information (Tape) Flaircomm Microelectronics, Inc. -37- FLC-BTM702 Datasheet Figure 14: Product Packaging Information (Tray) Flaircomm Microelectronics, Inc. -38- FLC-BTM702 Datasheet 10.2 Ordering Information FLC-BTM702XQYZ Product Revision Shipping Package Product Package Product Grade Figure 18: Ordering Information 10.2.1 Product Revision Product Revision Description Availability Without shielding case With a shielding case Support aptX, Without shielding case Support aptX, With shielding case Yes Yes Yes Yes Table 29: Product Revision 10.2.2 Shipping Package Shipping Package Description Quantity Form Tray Plastic Tray Tape — — — Availability No No Yes Table 20: Shipping Package 10.2.3 Product Package Product Package Description QFN LGA BGA Connector Availability Yes No No No Table 21: Product Package Flaircomm Microelectronics, Inc. -39- FLC-BTM702 Datasheet 10.2.4 Product Grade Product Grade Description Consumer Industrial Automobile After-Market Automobile Before-Market Availability No Yes No No Table 22: Product Grade Flaircomm Microelectronics, Inc. -40- Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. RF Warning Statement Radiation Exposure Statement Power is so low that no RF exposure calculation is needed. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as two conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. To ensure compliance with operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements The module is limited to OEM installation ONLY. The module is limited to installation in mobile or fixed application. We hereby acknowledge our responsibility to provide guidance to the host manufacturer in the event that they require assistance for ensuring compliance with the Part 15 Subpart B requirements. IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product(including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following: “Contains FCC ID:P4I-BTM702C”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. The following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. In the user manual of the end product, the end user has to be informed that the equipment complies with FCC radio-frequency exposure guidelines set forth for an uncontrolled environment. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. The end user manual shall include all required regulatory information/warning as show in this manual.
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