Flaircomm Technologies BTMDC746 Bluetooth Module User Manual FLC BTMD732 Specification
Flaircomm Technologies Inc. Bluetooth Module FLC BTMD732 Specification
Integration Manual
FLC-BTMDC746 Specification
Flaircomm Technologies Confidential
1
FLC-BTMDC746 Specification
Type:
Document Number: FLC-BTMDC746
Version: 0.1
Release Date: 08-10-2009
Flaircomm Technologies Inc.
Address：No.5 Bibo Road, Keyuan Building, 4F, Zhangjiang Hi-Tech Park,
Shanghai 201203, P.R.China
Telephone: 86-21-51088733 Fax: 86-21-50276103
www.flaircomm.com
FLC-BTMDC746 Specification
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Release Record
Version Number
Release Date
Comments
0.1
August 10, 2009
Initial Release
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TABLE OF CONTENTS
1. INTR ODUCTION ................................................................................................................................ 5
1.1 BLOCK DIAGRAM OF THE FLC-BTMDC746 MODULE ......................................................................... 5
1.2 FEATURES ............................................................................................................................................ 5
2. GENERAL SPECIFICATION ............................................................................................................. 6
3. PIN DEFINITION ................................................................................................................................. 8
3.1 PIN CONFIGURATION AND PACKAGE DIMENSIONS ............................................................................... 8
3.2 PIN DEFINITION .................................................................................................................................... 8
3.3 ELECTRICAL CHARACTERISTICS ........................................................................................................... 9
4. FLC-BTMDC746 INTERFACES DESCRIPTION .......................................................................... 11
4.1 USB ................................................................................................................................................... 11
4.2 UART ................................................................................................................................................ 11
4.3 SPI ..................................................................................................................................................... 11
5. RECOMMENDED PCB MOUNTING PATTERN ......................................................................... 12
5.1 LAYER GUIDELINES ............................................................................................................................ 12
5.2 SOLDERING RECOMMENDATIONS ....................................................................................................... 12
6. REGULATORY COMPLIANCES .................................................................................................... 14
6.1 BLUETOOTH ....................................................................................................................................... 14
6.2 FCC ................................................................................................................................................... 14
6.3 CE ...................................................................................................................................................... 15
6.4 ROHS ................................................................................................................................................. 15
7. APPLICATION SCHEMATIC .......................................................................................................... 16
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TABLE OF FIGURES
Figure 1 FLC-BTMDC746Bluetooth Solution for Car Electronics Systems .................................................. 5
Figure 4 FLC-BTMDC746 pin definition ....................................................................................................... 8
Figure 12 Recommended PCB Mounting Pattern ......................................................................................... 12
TABLE OF TABLES
Table 2: General Specification ........................................................................................................................ 6
Table 3: Pin Definition of FLC-BTMDC746 .................................................................................................. 8
Table 4: Absolute Maximum Rating ............................................................................................................... 9
Table 5: Recommended Operating Conditions ................................................................................................ 9
Table 6: DC Characteristics ............................................................................................................................. 9
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1. Introduction
FLC-BTMDC746 is a fully integrated Bluetooth module. It is one of the BlueToneTM series products
developed by Flaircomm. FLC-BTMDC746 is based on CSR’s Bluecore4-ROM with specific interface
design to meet automobile industrial and mobile accessory customers’ needs. It complies with Bluetooth
qualified certification and FCC.
FLC-BTMDC746 complies with Bluetooth specification version 2.1+EDR Class 1. It integrates RF,
Baseband controller, etc., a completed Bluetooth subsystem, in an ultra small package. FLC- BTMDC746
supports OBXN,SPP profiles. It provides a UART interface, several user programmable I/Os and a USB
port.
1.1 Block Diagram of the FLC-BTMDC746 Module
BC41B143A-WLCSP
Balun Switch PA
Crystal
26MHz
SPI/USB/UART
PIO1
PIO2
Figure 1 FLC-BTMDC746Bluetooth Solution for Car Electronics Systems
1.2 Features
BlueTooth V2.1+EDR
FTP,OBEX and SPP Profiles
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2. General Specification
Table 1: General Specification
Product
BlueToneTM Series Bluetooth Module
Model
FLC-BTMDC746
Bluetooth Specification
Standard
Bluetooth2.1, Class I
Frequency Band
2.4~2.48GHz
Modulation Method
GFSK; π/4-DQPSK;8DPSK
Maximum Data Rate
3Mbps
Hopping
1600hops/sec, 1MHz channel space
RF Input Impedance
50 ohms
Baseband Crystal OSC
26MHz
Interface
UART, USB, SPI,
Profiles
FTP,SPP, OBEX, detailed profiles depends on
the firmware
Operation Range
100 meters
Sensitivity
-85dBm@0.1%BER
RF TX Power
Max 20dBm(class I)
Connectivity
Point to Point
Dimension
Dimension
34.8mm x 14mm x 2.5mm
Weight
1g
Power
Supply Voltage
3.3v port: 2.7~3.6V DC
Working Current
---
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Standby Current
<0.5mA
Operation Environment
Temperature
-40ºC to +80ºC
Humility
10%~90% Non-Condensing
Bluetooth
DeviceAddress
Stored in Module’s E2PROM
Certifications
BQB, FCC, RoHS
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3. Pin Definition
3.1 Pin Configuration and Package
Dimensions
Figure 2 FLC-BTMDC746 pin definition
3.2 Pin Definition
Table 2: Pin Definition of FLC-BTMDC746
Pin
Symbol
I/O Type
Description
1
GND
Ground
Ground connection.
2
VCC
Power
Positive power supply for RF circuitry.
3
MODE
Input
Not connected.
4
UART_RTS
Output
UART request to send, active low.
5
UART_RXD
Input
UART data input.
6
USB_D+
Differential
USB data plus with built-in 1.5KOhm pull-up resistor.
7
USB_D-
Differential
USB data minis.
8
UART_CTS
Input
UART clear to send, active low.
9
GND
Ground
Ground connection.
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10
GND
Ground
Ground connection.
11
VDD
Power
Positive supply for digital circuitry.
12
/RST
Input
Reset if low. Input debounced so must be low for >
5ms to cause a reset.
13
/SPI_CS
Input
Chip select for Serial Peripheral Interface device,
active low.
14
SPI_CLK
Input
Serial Peripheral Interface clock.
15
SPI_MISO
Output
Serial Peripheral Interface data output.
16
SPI_MOSI
Input
Serial Peripheral Interface data input.
17
UART_TXD
Output
UART data output.
18
GND
Ground
Ground connection.
3.3 Electrical Characteristics
Table 3: Absolute Maximum Rating
Rating
Minimum
Maximum
Storage Temperature
-40°C
+150°C
Operating Temperature
-40°C
+85°C
VCC Voltage
-0.4v
+3.7v
I/O Pin Output Current
-
35mA
Table 4: Recommended Operating Conditions
Operating Condition
Minimum
Typical
Maximum
Operating Temperature Range
-40°C
25°C
+80°C
UART Voltage
+2.7V
+3.3V
+3.6V
3V3 Voltage
+2.7V
+3.3V
+3.6V
USB D+/D- Voltage
+4.4V
+5.0V
+5.3V
Table 5: DC Characteristics
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Table 7: Radio Characteristics
RF Characteristics
Min
Typical
Max
Unit
Operating Frequency Range
2400
-
2483.5
KHz
Carrier Frequency
2402
-
2480
KHz
Transmit Output Power
-
-
+14 ~ +18
dBm
Receive Sensitivity Range
-82
-
-20
dBm
Modulation Method
GFSK, /4 DQPSK, 8DQPSK
RF Input Impedance
-
50
-
Ohm
Table 7: Radio Characteristics
Terminal
Min
Typical
Max
Unit
Input/Output Voltage Level
3.1
3.3
3.6
V
VIL input logic low
-0.4
-
+0.8
V
VIH input logic high
3.1
-
3.7
V
VOL output logic low
-
-
0.2
V
VOH output logic high
2.9
-
-
V
Strong pull-up
-100
-40
-10
uA
Strong pull-down
10
40
100
uA
Weak pull-up
-5.0
-1.0
-0.2
uA
Weak pull-down
0.2
1.0
5.0
uA
I/O Pad leakage
-1
0
+1
uA
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4. FLC-BTMDC746 Interfaces Description
4.1 USB
FLC-BTMDC746module contains a Full Speed (12Mbit/s) USB v2.0 interface operating as a USB client
peripheral device. It is capable of driving the USB cable directly thus no external USB transceiver is
required. It also features an internal USB pull-up resistor on USB_D+ signal to identify itself as a Full
Speed USB device.
To reduce the current consumption, add 15K pull-down resistors on USB_D+ and USB_D- signals to
prevent these two signals from floating when not in use.
To select USB interface as the host transport interface, set PSKEY_HOST_INTERFACE to 2.
4.2 UART
The UART interface provides a simple mechanism for communications with the host using the RS-232
protocol. It also implements the RS-323 hardware flow control using UART_RTS and UART_CTS signals.
It is capable of running at a maximum of 3Mbits/s baudrate.
The UART interface signals operate at the logical levels of 0 to VDD, thus an external level shifter IC is
required when interfacing to the standard RS-232 voltages.
To select USB interface as the host transport interface, set PSKEY_HOST_INTERFACE to 1 (BCSP), 3
(H4) or 7 (H4DS).
4.3 SPI
PIKBT-BC4-HCI module provides a Synchronous Serial Peripheral interface (16-bit address and 16-bit
data) and operates as a slave SPI device.
The primary use of SPI interface is for system debugging as well as programming persistent settings into
non-volatile memory of a Bluetooth system during production.
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5. Recommended PCB Mounting Pattern
Figure 3 Recommended PCB Mounting Pattern
5.1 Layer Guidelines
To obtain the optimal system performance, a system integrator incorporating this module into the design
should follow the following PCB guidelines:
Do not place any copper or metal near, underneath or above the antenna.
Place ground sticking vias around the edges of the ground copper pours and the board outline to prevent the
RF signal from penetrating into the PCB board causing unintentional resonators.
Avoid placing plastic or any dielectric material closer than 5mm to the antenna.
Any metal placed should be at least 20mm away from the antenna in any direction.
Avoid copper trace loops.
5.2 Soldering Recommendations
FLC-BTMDC746 module is compatible with industrial standard reflow profile for Pb-free soldering
process, while the actual profile used in reflowing the entire system incorporating the module depends on
the thermal mass of the entire components populated on such system. The following soldering
recommendations are given below to ensure the reliable solder joints and operation of the module after
soldering:
Refer to the technical documents of the solder paste used for the reflow profile configurations.
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No more than one flow run.
To ensure enough solder pastes are deposited on the soldering pads, the stencil should be at
least 0.15mm thick.
Always use a low residue “no clean” solder paste.
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6. Regulatory Compliances
6.1 Bluetooth
FLC-BTMDC746 module complies with the following Bluetooth 2.0+EDR specifications:
Radio Specification (Part A, Volume 2 Core System Package)
Baseband Specification (Part A, Volume 2 Core System Package)
Link Management Specification (Part C, Volume 2 Core System Package)
HCI Specification (Part E, Volume 2 Core System Package)
6.2 FCC
Warning: any changes or modifications to the module can void the user’s authority to operate the
module in compliance with FCC requirements.
FLC-BTMDC746 FCC ID: TQ6BTMD746
FLC-BTMDC746 module complies with the FCC Declaration of Conformity (DOC) conforming
to 1) Part 15 Sub-part B Section 15.109 regulation and 2) Part 15 Sub-part C 15.247 regulation.
The operation is subject to the following two conditions:
(1) this device may not cause harmful interference and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
Operation of this device is categorized as a class B equipment in residential area.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. End users must follow the specific operating instructions for satisfying RF exposure
compliance. This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Warning:
The maximum antenna gain allowed for use with this device is 0.35 dBi.
When the module is installed in the host device, the FCC ID label must be visible through a
window on the final device or it must be visible when an access panel, door or cover is easily
removed. If not, a second label must be placed on the outside of the final device that
contains the following text: “Contains FCC ID: TQ6BTMDC746＂
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6.3 CE
FLC-BTMDC746 module conforms to the following standards, thus in accordance with the provisions
of the EC Directives 89/336/EEC, 92/31/EEC and 93/68/EEC:
EN 301 489-17 V.1.2.1: EN 55022, EN 55024, EN 61000
EN 300.328 V1.6.1
6.4 RoHS
FLC-BTMDC746 module meets the requirements of Directive 2002/95/EC of the Europe
Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and does not
contain the following banned substances:
Cadmium, Lead, Mercury, Hexavalent Chromium, PBB (Polybrominated Bi-Phenyl), PBDE
(Polybrominated Diphenyl Ether)
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7. Application Schematic
Please contact with flaircomm R&D