Flexis FX200USB Computer USB Keyboard User Manual FX100 Product Requirements

Flexis Co., Ltd Computer USB Keyboard FX100 Product Requirements

User Manual

FX200USB KEYBOARD FULL SPEC VERSION 1.0 CIO CTO CEO DSGD 2003.02 FLEXIS G.H BANG Y.H YEO Y.H KIM H.S PARK
DSGD APPD CHKD Audit G.H Bang Y.H Kim Y.H Kim 2003.02 model Title FX-200 USB Product Specification Contents 1. Application 2. General Terms 3. Quick Spec 4. General SPEC 5. Environmental Condition 6. Reliability Condition 7. Material Test(Mechanic) 8. Part List Attachment 1 : Key Pad Dimension Attachment 2 : Exterior Limit Approval Attachment 3 : Key Pad Design Attachment 4 : Carrying Case Attachment 5 : Blister Packing Attachment 6 : PCB Schematic
DSGD APPD CHKD Audit G.H Bang Y.H Kim Y.H Kim 2003.02 model Title FX-200 USB Product Specification 1. Application The specification applies to the audit of Whitelite FX100 Flexible Keyboard. 2. General Terms Any changes of part’s spec, structure, material, manufacture and production flows need additional approval. 3. Quick Spec 3-1. Keypad Printing: There should have no misprint, omission, blot and erase on the keypad, and printed skin should be distinct and clear. 3-2. Case: There should have no crack, chop, spot, burr and contraction on the Case-Top, Case-Bottom 3-3. Keypad: All the sizes, tooling, marking, coating should be exactly same as the drawing apparently. 3-4. The interval between case-top and case-bottom should be under 2mm and the screws should not skid on the case-bottom. 3-5. There should have no omission of electronic and mechanical parts.
DSGD APPD CHKD Audit G.H Bang Y.H Kim Y.H Kim 2003.02 model Title FX-200 USB Product Specification 4. General SPEC 4-1. Hardware Character 4-2. Software Character 5.Environmental Condition Contents Condition Input Voltage 5.0V Power Consumption 10mA (Normal) Temp. Variation ±0.3% Contents Condition VER. USB 1.1 DRIVER HID Keyboard Humidity 168HR in Temp. 45℃±2℃ and moisture 90~95 % Storage in High Temp 48HR/ 1HR in 85℃±2℃ Storage in Low Temp 6HR/ 1HR in -40℃±2℃ Thermal Cycling 1HR/1HR in -40℃ ~ 85℃ by 15Cycle
6. Reliability Condition 6-1. Key Pad 6-1-1. Button’s motion and life test: After 300k times of the condition of hiiting,the item should not be stuck. 6-1-2. Contacting Resistance: After pressing key in the weight of 500g,the item’s persistence should be under 500Ω 6-2. Pad Set 6-2-1. Rolling test A: After Rolling 3.5 times under the condition of 50 , ℃85% for 72 hours, the item should work. 6-2-2. Rolling test B: After rolling 10,000 times while holding one side of the item, the item should work. 6-2-3. Eraser test: After rubbing 1,500times with an eraser(500g), the item's print material shouldn't be erased. 6-2-4. Alcohol test: After scrubbing 250times with Methyl alcohol(99.3%) in the weight of 500g, the item's print material shouldn't be erased. 6-2-5. Heat test: After keeping under the condition of -40 and +85℃℃ for an hour and repeat the same test 15 times, the item should work. 6-2-6. Bending test: After bending 10,000 times at the angle of 180°, the items should work. 6-2-7. Rubber stretching test: After stretching for 1 minute in the weight of 3Kg, the item should satisfy all Spec conditions. DSGD APPD CHKD Audit G.H Bang Y.H Kim Y.H Kim 2003.02 model Title FX-200 USB Product Specification
7. Material Test(Mechanic) No. Name PCS Class Std. Remarks 1 CASE TOP 1 2 CASE BOTTOM 1 3 SCREW 5 4 PAD ASS’Y 1 5 USB WIRE JACK 1 Customized 6 PCB ASS’Y 1 DSGD APPD CHKD Audit G.H Bang Y.H Kim Y.H Kim 2003.02 model Title FX-200 USB Product Specification
8. Part List (Schematic) No. Name PCS Class Std. Remarks 1 CHIP RESISTOR 1 7.5K –J-1608 2 CHIP RESISTOR 1 240K-J-1608 3 CHIP RESISTOR 1 470K-J-1608 4 CHIP CONDENSER 1 0.1uF-J-1608 5 CHIP CONDENSER 1 4.7uF-J-1608 6 RESONATOR 1 6MHz 7 COIL 2 HB-IM1608-121JV 8 PCB 1 FR4, t=1.0 9 MICOM 1 CY763413 DSGD APPD CHKD Audit G.H Bang Y.H Kim Y.H Kim 2003.2 model Title FX-200 USB Product Specification
Attachment 1: Key Pad Dimension 11.0mm±0.2 2.7mm±0.2
Attachment 2 : Exterior Limit Approval
Attachment 3 : Key Pad Design Attachment 4 : Carrying Case
Attachment 5 : Blister Packing
Attachment 6 : PCB Schematic 6-1 Schematic
6-2 PCB a.FX200USB PCB b. Part List No. Name Std. PCS Remarks L1,L2 COIL 2 R1 CHIP-RESISTOR 7.5K 1 R2 CHIP-RESISTOR 240K 1 R3 CHIP-RESISTOR 470K 1 R4~R9 CHIP-RESISTOR No Operation 1 C1 CHIP-CONDENSER 4.7uF 1 C2 CHIP-CONDENSER 0.1uF 1 X-TAL RESONATOR 6MHz 1 MICOM MICOM CY763413 1 PCB PCB 1

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