Garmin Canada 3153 Low Power Transmitter 2402-2480 MHz User Manual Install Manual

DynaStream Innovations Inc. Low Power Transmitter 2402-2480 MHz Install Manual

Install Manual

D00001685 Rev 0.4 D52M SoC ANT Module OEM/Integrators Installation Manual / Data sheet DRAFT © 2016 Dynastream Innovations Inc. or
its affiliates
D52M ANT SoC Module
Module Hardware
Integrated printed antenna
On-board 32MHz and 32.768 kHz crystal clocks
1.7V to 3.6V supply voltage range:
Operating temperature: Industrial (-40°C to +85°C)
Up to 24 GPIOs
Programmable output/channel from -20dBm to 4dBm
Excellent receiver sensitivity
-93dBm (ANT mode)
-96dBm (BLE mode)
1dBm resolution RSSI
Total 512kB flash, 64kB RAM
SPI, I2C and UART interfaces
ARM SWD interface
Internal DC/DC converter supported
14 x 9.8 x 2.0mm module
Layout compatible options with N5150M8CD,
N550M8CC, N548M8CB
1
Radio regulatory approval for major markets
BLUETOOTH SIG qualification
RoHS compliant
Preloaded with an ANT Network Processor application
and SoftDevice.
ANT® Operation (using the latest s212 or s332
SoftDevice)
79 selectable RF channels (2402 to 2480 MHz)
Flexible network topologies: peer-to-peer, star, tree,
high node count, mesh and more
Broadcast, acknowledged, and burst data
communication modes
Built-in device search and pairing
Built-in interference handling and radio coexistence
management with application radio disable requests
and application flash write/erase requests
Enhanced ANT features:
o Supports up to 15 logical channels each with
configurable channel periods (5.2ms - 2s)
o Advanced burst data transfer modes (up to
60kbps)
o Optional channel encryption mode (aes-128)
o Supports up to 8 public, private and/or managed
networks
o Advanced power management features to
optimize application power consumption including
Event Filtering and Selective Data Updates
o Asynchronous transmit channel
o Fast channel initiation
Bluetooth®
low energy operation (when loaded with
the latest S132 or S332 SoftDevice)
Bluetooth 4.2 compliant low energy single-mode
protocol stack suitable for Bluetooth low energy
products
o Concurrent Central, Observer, Peripheral, and
Broadcaster roles with up to:
Multiple connections as a central
One connection as a peripheral
Observer
Broadcaster
o Link layer
o L2CAP, ATT, and SM protocols
o GATT and GAP APIs
o GATT Client and Server
1
In certain configurations; See section 2.2 for complete
details
Module Pictures
D00001685 Rev 0.4 D52M SoC ANT Module OEM/Integrators Installation Manual / Data sheet DRAFT © 2016 Dynastream Innovations Inc. or
its affiliates
Table of Contents
D52M ANT SoC Module ......................................................................................................................................................... 1
Table of Figures ..................................................................................................................................................................... 4
List of Tables .......................................................................................................................................................................... 4
Notices and Restricted use Information ............................................................................................................................. 5
One Year Limited Warranty .................................................................................................................................................. 6
1 D52 ANT SoC Module Series Overview ....................................................................................................................... 7
1.1 Nomenclature ............................................................................................................................................... 8
1.2 Production Tracking Code ............................................................................................................................. 8
1.3 D52 ANT SoC Module Starter Kit and Components ......................................................................................... 9
2 Product Overview ...................................................................................................................................................... 10
2.1 Block Diagrams .......................................................................................................................................... 10
2.2 Pin-outs ..................................................................................................................................................... 10
2.3 Preloaded Software .................................................................................................................................... 11
2.4 D52 Module Programming ........................................................................................................................... 12
2.4.1 Programming via SWD interface .................................................................................................... 12
2.4.2 Initializing the SoftDevice ............................................................................................................. 12
2.4.3 Configuring the dc/dc converter .................................................................................................... 12
2.5 Design considerations ................................................................................................................................. 12
2.5.1 M8 (D52M) module mounting ....................................................................................................... 13
2.6 Assembly Considerations ............................................................................................................................. 13
2.6.1 Moisture Control ........................................................................................................................... 13
2.6.2 Cleaning Process .......................................................................................................................... 13
3 Regulatory Approvals and Compliance ................................................................................................................... 14
3.1 United States ............................................................................................................................................. 14
3.2 Canada ...................................................................................................................................................... 14
3.3 European Economic Area ............................................................................................................................ 14
3.4 Australia and New Zealand .......................................................................................................................... 14
3.5 Japan ......................................................................................................................................................... 15
3.6 Korea ......................................................................................................................................................... 15
3.7 BLUETOOTH Qualification ........................................................................................................................... 15
4 Licensing & Conditions of Use .................................................................................................................................. 15
4.1 Conditions of Use ....................................................................................................................................... 15
4.2 SoftDevice Licensing ................................................................................................................................... 15
5 Electrical Specifications ............................................................................................................................................ 15
5.1 Recommended Operating Conditions ........................................................................................................... 15
5.2 Absolute Maximum Ratings ......................................................................................................................... 16
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5.3 Radio Operation Specifications and Antenna Characteristics.......................................................................... 16
5.4 Electrical Specifications ............................................................................................................................... 16
6 Mechanical Drawings ................................................................................................................................................ 16
6.1 D52M ......................................................................................................................................................... 16
7 Support ...................................................................................................................................................................... 16
7.1 ANT Forum................................................................................................................................................. 16
7.2 Technical References .................................................................................................................................. 17
7.3 ANT Developer’s Zone ................................................................................................................................ 17
7.4 ANT and ANT+ Social Media ....................................................................................................................... 17
Appendix A Using the ANT Network Processor Configuration .................................................................................... 18
Appendix B D52 Module Pre-Loaded Software Versions ............................................................................................. 18
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Table of Figures
Figure 1: D52 Module Series Nomenclature ................................................................................................. 8
Figure 2: Production Tracking Code ............................................................................................................ 8
Figure 3: D52MD2M8IA Block Diagram ...................................................................................................... 10
Figure 4: D52M M8 Bottom View ............................................................................................................... 10
Figure 5: Memory Map of the Preloaded Software...................................................................................... 12
List of Tables
Table 1: D52 ANT SoC Module Starter Kit .................................................................................................... 9
Table 2: D52 Module Series Pin-Out .......................................................................................................... 11
Table 3: SoftDevice Licensing and Downloads ........................................................................................... 15
Table 5: Recommended Operating Conditions ........................................................................................... 15
Table 4: Absolute Maximum Ratings ......................................................................................................... 16
Table 6: Current Consumption of Radio Operation ..................................................................................... 16
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Notices and Restricted use Information
Information contained in this document is provided only for your ("Customer" or “you”) convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications.
Dynastream Innovations Inc. ("DYNASTREAM") makes no representations or warranties of any kind whether express or
implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality,
performance, merchantability or fitness for purpose. DYNASTREAM disclaims all liability arising from this information and its
use.
DYNASTREAM does not assume any responsibility for the use of the described ANT module (“the Module(s)”).
DYNASTREAM makes no representation with respect to the adequacy of the module in low-power wireless data
communications applications or systems. Any Products using the Module must be designed so that a loss of communications
due to radio interference or otherwise will not endanger either people or property, and will not cause the loss of valuable
data. DYNASTREAM assumes no liability for the performance of products which are designed or created using the Modules.
The Modules are not designed, intended, or authorized for use as components in systems intended for surgical implant into
the body, or other applications intended to support or sustain life, or for any other application in which the failure of the
Module could create a situation where personal injury or death may occur. If you use the Modules for such unintended and
unauthorized applications, you do so at your own risk and you shall indemnify and hold DYNASTREAM and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and
reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that DYNASTREAM was negligent regarding the design or
manufacture of the Product.
The information disclosed herein is the exclusive property of DYNASTREAM, and is not to be reproduced and/or distributed
without the written consent of DYNASTREAM. No part of this publication may be reproduced or transmitted in any form or
by any means including electronic storage, reproduction, execution or transmission without the prior written consent of
DYNASTREAM. The recipient of this document by its retention and use agrees to respect the security status of the
information contained herein.
DYNASTREAM believes the information contained herein is correct and accurate at the time of its release. However, the
information contained in this document is subject to change without notice and should not be construed as a commitment
by DYNASTREAM unless such commitment is expressly given in a covering document.
The D52 Series of modules have been designed to support the ANT and/or
Bluetooth®
low energy Protocols and are
certified for use in many geographic regions around the globe. However, a product incorporating the D52 series module
may carry the certification IDs of the module only if it complies with the restrictions and terms, including use of
Dynastream-approved software, provided in the conditions of use available at:
www.dynastream.com/components/d52/conditions-of-use
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One Year Limited Warranty
This D52 Module is warranted to be free from defects in materials or workmanship for 1 year from the date of purchase by
the end customer. Within this period, Dynastream will, at its sole option, replace any D52 Modules that fail in normal use.
Replaced D52 Modules have a 1 year warranty. Dynastream retains the exclusive right to replace (with a new or newly-
overhauled replacement product) the D52 Module or offer a full refund of the purchase price at its sole discretion. SUCH
REMEDY SHALL BE THE SOLE AND EXCLUSIVE REMEDY FOR ANY BREACH OF WARRANTY. Such replacement will be made
at no charge to LICENSEE, provided LICENSEE shall be responsible for any transportation cost. This warranty does not
apply to: (i) cosmetic damage, such as scratches, nicks and dents; (ii) damage caused by accident, abuse, misuse, water,
flood, fire, or other acts of nature or external causes; (iii) damage caused by service performed by anyone who is not an
authorized service provider of Dynastream; or (iv) damage to a D52 Module that has been modified or altered without the
written permission of Dynastream. In addition, Dynastream reserves the right to refuse warranty claims against D52
Modules used in contravention of the laws of any country.
THE WARRANTIES AND REMEDIES CONTAINED HEREIN ARE EXCLUSIVE AND IN LIEU OF ALL OTHER WARRANTIES
EXPRESS, IMPLIED, OR STATUTORY, INCLUDING ANY LIABILITY ARISING UNDER ANY WARRANTY OF MERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE, STATUTORY OR OTHERWISE.
IN NO EVENT SHALL DYNASTREAM BE LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT, OR CONSEQUENTIAL
DAMAGES, WHETHER RESULTING FROM THE USE, MISUSE, OR INABILITY TO USE THIS PRODUCT OR FROM DEFECTS IN
THE PRODUCT.
To obtain warranty service, LICENSEE shall contact Dynastream for shipping instructions and obtain a return material
authorization (RMA) tracking number. LICENSEE shall securely pack the D52 Modules and enclose a copy of the original
sales receipt, which is required as the proof of purchase for a warranty claim, and write the tracking number clearly on the
outside of the package. LICENSEE agrees to send the D52 Modules, freight charges prepaid, to the Dynastream address
provided in the Module Distribution Agreement (see www.dynastream.com/components/d52/conditions-of-use).
©2016 Dynastream Innovations Inc. All Rights Reserved.
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1 D52 ANT SoC Module Series Overview
Dynastream Innovations offers the D52 series of ANT SoC Modules, based on Nordic Semiconductor’s nRF52832 SoC
supporting ANT,
Bluetooth®
low energy and extended features such as NFC. This expands Dynastream’s portfolio of multi-
protocol ultra-low power wireless modules, popularized with the N5 series of modules. This draft document describes
characteristics of the D52MD2M8IA, the 14.0 x 9.8 x 2.0mm member of the D52 ANT SoC Module Series. General features
of the D52 series include:
Nordic Semiconductor’s nRF52832 chip with 64kB RAM, 512kB Flash and a 32-bit ARM Cortex M4F CPU
Concurrent ANT and Bluetooth low energy protocol operation using supported SoftDevices (pre-compiled protocol
stack solutions for the nRF52 SoCs):
o S212 ANT only SoftDevice from Dynastream Innovations
o S232 concurrent ANT and Bluetooth low energy SoftDevice from Dynastream Innovations
o S132 Bluetooth low energy only SoftDevice from Nordic Semiconductor
Regulatory certification for many global markets
Qualification by the Bluetooth SIG
Onboard 32MHz and 32.768kHz crystal clocks
Preloaded ANT Network Processor Application, which uses the S212 SoftDevice (scalable ANT protocol stack with
15 channel support). The application provides a standard ANT serial interface front-end that can be connected to
an external application controller.
Easy reprogramming via the onboard SWD interface pins using off-the-shelf ARM programming tools.
D52MD2M8IA supports drop-in compatibility with Dynastream M8 modules
2
(including the following models in
certain configurations: N5150M8CD, N550M8CC, N548M8CB).
The D52 series development kit (D52DK1) contains everything necessary to evaluate and begin development with D52
series modules, with support for the Nordic nRF5 SDK.
2
Layouts are compatible when using the SWDIO pin only; the nRF52832 supports separate reset and SWDIO pins rather
than the single shared line from previous Nordic SoCs. Please see section 2.2 for more information.
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1.1 Nomenclature
Figure 1: D52 Module Series Nomenclature
1.2 Production Tracking Code
For technical support and customer service purposes, a production code of three characters of the format “YWR” is laser
marked on the RF shield as illustrated below. In the code, YW denotes production date code and R denotes module version.
Figure 2: Production Tracking Code
Please refer to Appendix B D52 Module Pre-Loaded Software Versions for differences and important notes of each version.
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1.3 D52 ANT SoC Module Starter Kit and Components
The D52 starter kit (D52DK1) contains all the hardware necessary to get developing with ANT (including with the
D52MD2M8IA), and the downloadable ANT SoC Module Starter Kit User Manual has full details on using the kit with
reference examples and the nRF5 SDK from Nordic Semiconductor. The kit contents are described in Table 1, below:
D52 Starter Kit
Part No: D52DK1
Part No.
Description
Picture
D52QD2M6IA-A
M4 module on carrier board with 20-pin
Molex connector, NFC connections
available, SWD programming header,
additional through-hole connections for
I/O pins
ANTBAT2
Battery board with a Molex socket, a
reset button and a five-position dip
switch
ANTIO1
I/O board with a Molex connector, a
Molex socket, 4 LEDs and 4 buttons
ANTUIF1
USB interface board with a Molex socket
ANTUSB-m
ANT USB dongle
Segger J-Link Lite Programmer
Table 1: D52 ANT SoC Module Starter Kit
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2 Product Overview
2.1 Block Diagrams
Figure 3: D52MD2M8IA Block Diagram
2.2 Pin-outs
A note on backwards drop-in compatibility:
the D52M modules support drop-in compatibility with the following N5 M8
module models from Dynastream Innovations in certain configurations: N5150M8CD, N550M8CC, N548M8CB. For drop-in
compatibility, existing designs must use only the SWDIO capability of the reset/SWDIO pad on previous modules. If
needed, the reset function can be configured on another pad; see Table 2 below for more information.
A note on the preloaded Network Processor application:
Please refer to
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Appendix A Using the ANT Network Processor Configuration for ANT Serial Line specification.
Figure 4: D52M M8 Bottom View
D52M M8 Pin
nRF52832
Pin Name
Description
P230
SWDIO
Serial Wire Debug I/O for debug and programming
P207
P021/RESET
General Purpose I/O / System Reset pin
P225, P226, P219, P220
VCC
Power Supply Pin
P231, P232, P233, P234, P235
VSS
Ground
P224
SWDCLK
Serial Wire Debug clock input for debug and programming
P212
P006
General Purpose I/O
-
P007
General Purpose I/O
P208
P002/AIN0
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
P218
P008
General Purpose I/O
P201
P011
General Purpose I/O
-
P017
General Purpose I/O
P221
P016
General Purpose I/O
P228
P015
General Purpose I/O
P217
P014
General Purpose I/O
P216
P013
General Purpose I/O
P205
P031/AIN7
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
P229
P012
General Purpose I/O
P222
NFC2/P010
NFC antenna connection / General Purpose I/O
-
P019
General Purpose I/O
P227
P020
General Purpose I/O
P215
P022
General Purpose I/O
-
P023
General Purpose I/O
P223
NFC1/P009
NFC antenna connection / General Purpose I/O
P211
P005/AIN3
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
P214
P018
General Purpose I/O
P213
P024
General Purpose I/O
P209
P004/AIN2
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
P210
P003/AIN1
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
-
P026
General Purpose I/O
P203
P029/AIN5
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
P204
P030/AIN6
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
P202
P028/AIN4
General Purpose I/O / Analog SAADC/COMP/LPCOMP input
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D52M M8 Pin
nRF52832
Pin Name
Description
-
P027
General Purpose I/O
P206
P025
General Purpose I/O
Table 2: D52 Module Series Pin-Out
2.3 Preloaded Software
D52 modules are preloaded with the S212 ANT SoftDevice and the ANT Network Processor (NP) application as illustrated
below. Depending on the module revision, the preloaded code may vary. Please refer to Appendix B D52 Module Pre-
Loaded Software Versions for further details. Licensing terms for the preloaded software are described in the Module
Distribution Agreement, which is referenced in Section 4 Licensing & Conditions of Use.
S212 SoftDevice Refer to the S212 nRF52832 SoftDevice Specification.
ANT Network Processor Application Refer to Appendix A Using the ANT Network Processor Configuration
Figure 5: Memory Map of the Preloaded Software
2.4 D52 Module Programming
The D52 ANT SoC module series supports programming by standard Serial Wire Debug (SWD) interface. The two software
components (the SoftDevice and the application code) must be version compatible to operate properly. To ensure proper
operation after reprogramming, it is recommended that the module undergoes a full erasure (e.g. using the erase-all option
in nrfjprog.exe/nRFgo Studio) and all desired software components be explicitly programmed onto the module.
2.4.1
Programming via SWD interface
The D52 ANT SoC Module series supports the Serial Wire Debug (SWD) interface, SWDCLK and SWDIO (refer to Table 2:
D52 Module Series Pin-Out). Programming and debugging of the module only require commonly available tools, such as the
Keil software development environment and the Segger J-Link programmer.
Please refer to “ANT SoC Module Starter Kit User Manual” from Dynastream Innovations for reference software setup and
use with ANT using the Keil software and a J-Link programmer.
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2.4.2
Initializing the SoftDevice
Specification/information for D52M modules will be available in later data sheet revisions.
2.4.3
Configuring the dc/dc converter
D52 series modules can make use of the DC/DC Converter on nRF52832 chips. This can improve power consumption under
certain conditions.
2.5 Design considerations
RF performance is always affected by the environment. Good design makes a product less susceptible to adverse conditions.
The recommendations in this section are guidelines only; you should thoroughly test your products in the intended use case
environments and make necessary modifications and trade-offs.
For assistance in design, STEP model packages and Altium libraries are available from Dynastream Innovations
.
Note: STEP model and Altium Libraries for D52M will be available on product release
2.5.1
M8 (D52M) module mounting
Mechanical drawings will be available in later data sheet drafts along with solder stencils.
2.6 Assembly Considerations
2.6.1
Moisture Control
The D52MD2M8IA is rated at level 1 (MSL1) as defined by IPC/JEDEC J-STD-020.
To ensure good solderability of the PCB pads, it is highly recommended to always have the modules intended for reflow well
sealed when in storage.
2.6.2
Cleaning Process
The module is made using no-clean solder paste. No-clean process is recommended.
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3 Regulatory Approvals and Compliance
Note: This device has not been authorized as required by the Federal Communications Commission. This device is not,
and may not be, offered for sale or lease, or sold or leased, until authorization is obtained.
Modules in the D52 ANT SoC module series, when loaded with an ANT and/or BLUETOOTH low energy stack, have received
regulatory approvals in the United States (FCC) and Canada (IC), and have been verified to conform to the appropriate
regulations in Europe, Australia and New Zealand, Japan and South Korea. The modules have been qualified by
BLUETOOTH SIG. Such approvals and qualification allow the user to place the module inside a finished product and, in most
cases, not require regulatory testing for an intentional radiator, provided no changes or modifications are made to the
module circuitry. This does not preclude the possibility that some other form of authorization or testing may be required for
the finished product.
Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of
the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance.
3.1 United States
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
A host product manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For
example, if a host product was previously authorized as an unintentional radiator under the Declaration of Conformity
procedure without containing a certified transmitter module, then a module is added, the host manufacturer is responsible
for ensuring that the host continues to be compliant with the Part 15 subpart B unintentional radiator requirements after the
module is installed and operational. Because this may depend on the details of how the module is integrated within the
host, the module grantee (the party responsible for the module grant) shall provide guidance to the host manufacturer for
ensuring compliance with the Part 15 Subpart B requirements.
This module is limited to OEM installation ONLY. The OEM Integrator is responsible for ensuring that the end-user has no
manual instructions to remove or install the module. Changes or modifications not expressly approved by Dynastream could
void the user's authority to operate the equipment.
If (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not
have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: O6R3153” or
“Contains FCC ID: O6R3153” must be used. The host OEM user manual must also contain clear instructions on how end
users can find and/or access the module and the FCC ID.
3.2 Canada
This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
3.3 European Economic Area
Information for D52M modules will be finalized in later drafts.
3.4 Australia and New Zealand
Information for D52M modules will be finalized in later drafts.
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3.5 Japan
Information for the D52M modules will be finalized in later drafts.
3.6 Korea
Information for the D52M modules will be finalized in later drafts.
3.7 BLUETOOTH Qualification
Information for the D52M modules will be finalized in later drafts.
4 Licensing & Conditions of Use
Products incorporating D52 series modules wishing to make use of the certifications outlined in section 0 must guarantee
that they are using an approved ANT and or Bluetooth low energy SoftDevice and have entered into a D52 Series Module
Distribution Agreement with Dynastream Innovations. Section 4.1 outlines the conditions of use for D52 modules (which
includes the D52 Series Module Distribution Agreement), and Section 4.2 outlines where to obtain licenses for the approved
SoftDevices.
4.1 Conditions of Use
The D52 Series of modules have been designed to support the ANT and/or Bluetooth low energy Protocols and are certified
for use in many geographic regions around the globe. However, a product incorporating the D52 series module may carry
the certification IDs of the module only if it complies with the restrictions and terms, including use of Dynastream-approved
software, provided in the conditions of use available at:
www.dynastream.com/components/d52/conditions-of-use
4.2 SoftDevice Licensing
ANT and Bluetooth low energy SoftDevices approved for use on the D52 Module series as referenced in section 4.1
Conditions of Use are licensed separately from Dynastream Innovations and Nordic Semiconductor:
SoftDevice
Protocol(s)
Licensor
Link
S212
ANT
Dynastream Innovations
Dynastream SoftDevices
S332
ANT and Bluetooth low
energy
Dynastream Innovations
Dynastream SoftDevices
S132
Bluetooth low energy
Nordic Semiconductor
Nordic Downloads
Table 3: SoftDevice Licensing and Downloads
5 Electrical Specifications
5.1 Recommended Operating Conditions
Parameter
Min
Max
Unit
Operating ambient temperature range, TA
-40
+85
°C
Operating supply voltage
1.7
3.6
V
Table 4: Recommended Operating Conditions
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5.2 Absolute Maximum Ratings
Parameter
Test Conditions
Min
Max
Unit
Supply Voltage
(VCC)
-0.3
3.9
V
VI/O, VCC ≤ 3.6V
-0.3
VCC+0.3
V
VI/O, VCC > 3.6V
-0.3
3.9
V
Storage
temperature range
-40
85
°C
ESD
All pads, according to human-body model,
JEDEC STD 22, method A114
4
kV
According to charged-device model, JEDEC
STD 22, method C101
500
V
Table 5: Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions are not implied. Exposure to absolute-maximum-rated conditions for extended periods
may affect device reliability.
5.3 Radio Operation Specifications and Antenna Characteristics
nRF52832 Output
Setting (dBm)
Typical Peak Radio
Current (mA)*
0 (DCDC, 3V)
5.3
0 (LDO, 3V)
11.6
+4 (DCDC, 3V)
7.5
+4 (LDO, 3V)
16.6
Table 6: Current Consumption of Radio Operation
* For additional information regarding radio current please refer to the nRF52832 product specification from
Nordic Semiconductor
Radiation patterns for D52M will be added in later drafts.
To understand and properly use the radiation pattern for your design, please refer to the application note: Interpreting RF
Radiation Patterns.
5.4 Electrical Specifications
Please refer to the nRF52832 Product Specification by Nordic Semiconductor.
6 Mechanical Drawings
6.1 D52M
Mechanical drawings will be added in later drafts.
7 Support
The D52 ANT SoC module series uses nRF52832 from Nordic Semiconductor. You can seek technical support from Nordic
Semiconductor, www.nordicsemi.com. Application support can be sought from Dynastream Innovations, via
www.thisisant.com.
7.1 ANT Forum
Customers are encouraged to participate in the ANT forum moderated by the application engineering team of Dynastream
Innovations for any engineering discussions. Joining the ANT forum is free and open at http://www.thisisant.com/forum.
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7.2 Technical References
Documents
1. nRF52832 Product Specification, Nordic Semiconductor
2. nRF52 Series Compatibility Matrix, Nordic Semiconductor Infocenter
3. nRF52832 Objective Product Specification, Nordic Semiconductor
4. nRF52832 S212 SoftDevice Specification, Dynastream Innovations
5. nRF52832 S332 SoftDevice Specification, Dynastream Innovations
6. nRF52832 S132 SoftDevice Specification, Nordic Semiconductor
7. nRF52 Development Kit Documentation, Nordic Semiconductor Infocenter
8. ANT SoC Module Starter Kit User Manual, Dynastream Innovations
9. ANT Message Protocol and Usage, Dynastream Innovations
10. Interfacing with ANT General Purpose Chipsets and Modules, Dynastream Innovations
11. ANT Technical Note Migrating an ANT nRF51 Project to nRF52
12. Application Note: Interpreting RF Radiation Patterns, Dynastream Innovations
Software
1. S212 nRF52832 SoftDevice, Dynastream Innovations
2. S332 nRF52832 SoftDevice, Dynastream Innovations
3. S132 nRF52832 SoftDevice, Nordic Semiconductor
4. nRF5 SDK, Nordic Semiconductor
5. ANT Network Processor Application Code
6. ANTwareII a system testing and debugging tool, Dynastream Innovations
7. ObservANT an ANT debugging tool, Dynastream Innovations
Design models
1. D52M Altium library, Dynastream Innovations
(available on product launch)
2. D52M module STEP model, Dynastream Innovations
(available on product launch)
The above documents and software are available at www.dynastream.com, www.thisisant.com and/or www.nordicsemi.com
/ infocenter.nordicsemi.com. User registration may be required.
7.3 ANT Developer’s Zone
ANT development software tools, application notes, reference designs and other public resources are found in the ANT
Developer’s Zone at http://www.thisisant.com/developer.
To begin development with the ANT+ interoperability, please become an ANT+ Adopter or ANT+ Alliance member to obtain
the access to the ANT+ Adopter Zone. ANT+ documents and design tools contained in the ANT+ Adopter zone include the
ANT+ Device Profiles, ANT-FS specification, ANT software (PC/Mac) libraries with source code, simulator tools (SimulANT+),
ObservANT, embedded reference designs with source code, and more.
7.4 ANT and ANT+ Social Media
Further information, resources and news about ANT can be found in social media:
YouTube: http://www.youtube.com/user/ANTAlliance
Twitter: http://twitter.com/ANTPlus
Facebook: https://www.facebook.com/thisisant
LinkedIn: http://www.linkedin.com/groups?gid=1379137
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Appendix A Using the ANT Network Processor Configuration
Appendix to be added in later data sheet drafts.
Appendix B D52 Module Pre-Loaded Software Versions
Information to be included in future data sheet drafts.

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