Gemalto M2M HC25 GSM/GPRS/EDGE/UMTS/HSDPA MODULE User Manual HC25 Hardware Interface Overview
Gemalto M2M GmbH GSM/GPRS/EDGE/UMTS/HSDPA MODULE HC25 Hardware Interface Overview
User Manual
s
HC25
Siemens Cellular Engine
Version: 00.220
DocId: HC25_HO_v00.220
Hardware Interface Overview
General Notes
Product is deemed accepted by Recipient and is provided without interface to Recipient´s products. The
Product constitutes pre-release version and code and may be changed substantially before commercial
release. The Product is provided on an “as is” basis only and may contain deficiencies or inadequacies.
The Product is provided without warranty of any kind, express or implied. To the maximum extent per-
mitted by applicable law, Siemens further disclaims all warranties, including without limitation any
implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party
rights. The entire risk arising out of the use or performance of the Product and documentation remains
with Recipient. This Product is not intended for use in life support appliances, devices or systems where
a malfunction of the product can reasonably be expected to result in personal injury. Applications incor-
porating the described product must be designed to be in accordance with the technical specifications
provided in these guidelines. Failure to comply with any of the required procedures can result in malfunc-
tions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile
technical systems, including GSM products, which also apply to cellular phones must be followed. Sie-
mens AG customers using or selling this product for use in any applications do so at their own risk and
agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum
extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any conse-
quential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation,
damages for loss of business profits, business interruption, loss of business information or data, or other
pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised
of the possibility of such damages. Subject to change without notice at any time.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-
tents and communication thereof to others without express authorization are prohibited. Offenders will
be held liable for payment of damages. All rights created by patent grant or registration of a utility model
or design patent are reserved.
Copyright © Siemens AG 2007
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HC25 Hardware Interface Overview
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Document Name: HC25 Hardware Interface Overview
Version: 00.220
Date: 2007-03-20
DocId: HC25_HO_v00.220
Status: Confidential / Preliminary
Supported Products: HC25
HC25 Hardware Interface Overview
Contents
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Contents
1 Introduction ................................................................................................................. 6
1.1 Related Documents ........................................................................................... 6
1.2 Terms and Abbreviations................................................................................... 6
1.3 Regulatory and Type Approval Information ....................................................... 9
1.3.1 Directives and Standards...................................................................... 9
1.4 SAR requirements specific to portable mobiles ............................................... 11
1.4.1 SELV Requirements ........................................................................... 11
1.5 Safety Precautions........................................................................................... 12
2 Product Concept ....................................................................................................... 13
2.1 Key Features at a Glance ................................................................................ 13
3 Application Interface................................................................................................. 16
3.1 Operating Modes ............................................................................................. 16
4 Antenna Interface...................................................................................................... 17
4.1 Antenna Installation ......................................................................................... 17
4.2 Antenna Pad .................................................................................................... 18
4.3 Antenna Connector.......................................................................................... 19
5 Electrical, Reliability and Radio Characteristics.................................................... 23
5.1 Absolute Maximum Ratings ............................................................................. 23
5.2 Operating Temperatures.................................................................................. 24
5.3 Storage Conditions .......................................................................................... 25
5.4 Reliability Characteristics................................................................................. 26
6 Mechanics.................................................................................................................. 27
6.1 Mechanical Dimensions of HC25..................................................................... 27
6.2 Mounting HC25 to the Application Platform..................................................... 29
6.3 Board-to-Board Application Connector ............................................................ 29
7 Reference Approval .................................................................................................. 31
7.1 Reference Equipment for Type Approval......................................................... 31
7.2 Compliance with FCC Rules and Regulations................................................. 32
8 Appendix.................................................................................................................... 33
8.1 List of Parts and Accessories........................................................................... 33
8.2 Fasteners and Fixings for Electronic Equipment ............................................. 35
8.2.1 Fasteners from German Supplier ETTINGER GmbH......................... 35
8.3 Mounting Advice Sheet.................................................................................... 38
HC25 Hardware Interface Overview
Tables
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Tables
Table 1: Directives ......................................................................................................... 9
Table 2: Standards of North American type approval .................................................... 9
Table 3: Standards of European type approval.............................................................. 9
Table 4: Requirements of quality ................................................................................. 10
Table 5: Overview of operating modes ........................................................................ 16
Table 6: Return loss in the active band........................................................................ 17
Table 7: Product specifications of U.FL-R-SMT connector.......................................... 19
Table 8: Material and finish of U.FL-R-SMT connector and recommended plugs ....... 20
Table 9: Ordering information for Hirose U.FL Series.................................................. 22
Table 10: Absolute maximum ratings............................................................................. 23
Table 11: Board temperature......................................................................................... 24
Table 12: Sample operating conditions without forced air circulation
(according to IEC 60068-2)............................................................................ 24
Table 13: Sample operating conditions with forced air circulation (air speed 0.9m/s) ... 24
Table 14: Storage conditions ......................................................................................... 25
Table 15: Summary of reliability test conditions............................................................. 26
Table 16: Electrical and mechanical characteristics of the board-to-board connector... 29
Table 17: List of parts and accessories.......................................................................... 33
Table 18: Molex sales contacts (subject to change)...................................................... 34
Table 19: Hirose sales contacts (subject to change) ..................................................... 34
HC25 Hardware Interface Overview
Figures
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Figures
Figure 1: Restricted area around antenna pad (side and bottom view) ......................... 18
Figure 2: Mechanical dimensions of U.FL-R-SMT connector......................................... 19
Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plug .............................................. 20
Figure 4: U.FL-R-SMT connector with U.FL-LP-066 plug .............................................. 20
Figure 5: Specifications of U.FL-LP-(V)-040(01) plug .................................................... 21
Figure 6: HC25 – Top and bottom view.......................................................................... 27
Figure 7: Dimensions of HC25 (all dimensions in mm) .................................................. 28
Figure 8: Mechanical dimensions of the board-to-board connector ............................... 30
Figure 9: Reference equipment for Type Approval ........................................................ 31
HC25 Hardware Interface Overview
1 Introduction
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1 Introduction
This document describes the hardware of the Siemens HC25 module that connects to the cel-
lular device application and the air interface. It helps you quickly retrieve interface specifica-
tions, electrical and mechanical details and information on the requirements to be considered
for integrating further components.
1.1 Related Documents
[1] HC25 AT Command Set 00.220
[2] HC25 Release Notes 00.220
1.2 Terms and Abbreviations
Abbreviation Description
ANSI American National Standards Institute
AMR Adaptive Multirate
ARP Antenna Reference Point
B2B Board-to-board connector
BB Baseband
BEP Bit Error Probability
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CS Coding Scheme
CS Circuit Switched
CSD Circuit Switched Data
DAC Digital-to-Analog Converter
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCS Digital Cellular System
DL Download
DRX Discontinuous Reception
DSB Development Support Board
DSP Digital Signal Processor
DTMF Dual Tone Multi Frequency
DTX Discontinuous Transmission
EDGE Enhanced Data rates for GSM Evolution
EFR Enhanced Full Rate
EGSM Enhanced GSM
HC25 Hardware Interface Overview
1.2 Terms and Abbreviations
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EMC Electromagnetic Compatibility
ERP Effective Radiated Power
ESD Electrostatic Discharge
ETS European Telecommunication Standard
ETSI European Telecommunications Standards Institute
FCC Federal Communications Commission (U.S.)
FDD Frequency Division Duplex
FDMA Frequency Division Multiple Access
FR Full Rate
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HSDPA High Speed Downlink Packed Access
HR Half Rate
I/O Input/Output
IF Intermediate Frequency
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Mbps Mbits per second
MCS Modulation and Coding Scheme
MO Mobile Originated
MS Mobile Station, also referred to as TE
MT Mobile Terminated
NTC Negative Temperature Coefficient
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
PCM Pulse Code Modulation
PCS Personal Communication System, also referred to as GSM 1900
PS Packet Switched
PDU Protocol Data Unit
PSK Phase Shift Keying
R&TTE Radio and Telecommunication Terminal Equipment
Abbreviation Description
HC25 Hardware Interface Overview
1.2 Terms and Abbreviations
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RACH Random Access Channel
RF Radio Frequency
RTC Real Time Clock
Rx Receive Direction
SAR Specific Absorption Rate
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SLIC Subscriber Line Interface Circuit
SMS Short Message Service
SRAM Static Random Access Memory
SRB Signalling Radio Bearer
TA Terminal adapter (e.g. GSM engine)
TDMA Time Division Multiple Access
TE Terminal Equipment
TS Technical Specification
Tx Transmit Direction
UL Upload
UMTS Universal Mobile Telecommunications System
URC Unsolicited Result Code
USB Universal Serial Bus
UICC USIM Integrated Circuit Card
USIM UMTS Subscriber Identification Module
WCDMA Wideband Code Division Multiple Access
Abbreviation Description
HC25 Hardware Interface Overview
1.3 Regulatory and Type Approval Information
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1.3 Regulatory and Type Approval Information
1.3.1 Directives and Standards
HC25 has been designed to comply with the directives and standards listed below.
Table 1: Directives
99/05/EC Directive of the European Parliament and of the council of 9 March 1999
on radio equipment and telecommunications terminal equipment and the
mutual recognition of their conformity (in short referred to as R&TTE Direc-
tive 1999/5/EC).
The product is labeled with the CE conformity mark
2002/95/EC Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equip-
ment (RoHS)
Table 2: Standards of North American type approval
CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,
PCS); US Equipment Authorization FCC
UL 60 950 Product Safety Certification (Safety requirements)
NAPRD.03 V3.9.1 Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS132, RSS133 Canadian Standard
Table 3: Standards of European type approval
3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station
(MS) conformance specification
ETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series)
Global System for Mobile communications (GSM); Harmonized standard
for mobile stations in the GSM 900 and DCS 1800 bands covering essen-
tial requirements under article 3.2 of the R&TTE directive (1999/5/EC)
(GSM 13.11 version 7.0.1 Release 1998)
GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
ETSI EN 301 489-1
V1.4.1 Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 1: Common Technical Requirements
ETSI EN 301 489-7
V1.2.1 (2000-09) Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 7: Specific conditions for mobile and portable radio and
ancillary equipment of digital cellular radio telecommunications systems
(GSM and DCS)
IEC/EN 60950-1 (2001) Safety of information technology equipment (2000)
HC25 Hardware Interface Overview
1.3 Regulatory and Type Approval Information
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EN 301 489-24 V1.2.1 Electromagnetic compatibility and Radio Spectrum Matters (ERM); Elec-
tromagnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread
(UTRA) for Mobile and portable (UE) radio and ancillary equipment
EN 301 908-01 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base
Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation
cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and
common requirements of article 3.2 of the R&TTE Directive
EN 301 908-02 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base
Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation
cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct
Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of
the R&TTE Directive
3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary
equipment.
3GPP TS 34.121 Technical Specification Group Radio Access Network; Terminal conform-
ance specification; Radio transmission and reception (FDD)
3GPP TS 34.123-1 User Equipment (UE) conformance specification; Part 1: Protocol con-
formance specification.
3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract Test
Suites.
Table 4: Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
Table 3: Standards of European type approval
HC25 Hardware Interface Overview
1.4 SAR requirements specific to portable mobiles
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1.4 SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable HC25 based applications to be evalu-
ated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For European and US
markets the relevant directives are mentioned below. It is the responsibility of the manufacturer
of the final product to verify whether or not further standards, recommendations or directives
are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1Considerations for evaluation of human exposure to Electromagnetic
Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in
the frequency range 30MHz - 6GHz
Products intended for sale on European markets
EN 50360 Product standard to demonstrate the compliance of mobile phones with
the basic restrictions related to human exposure to electromagnetic
fields (300MHz - 3GHz)
IMPORTANT:
Manufacturers of portable applications based on HC25 modules are required to have their final
product certified and apply for their own FCC Grant and Industry Canada Certificate related to
the specific portable mobile. See also Section 7.2.
1.4.1 SELV Requirements
The power supply connected to the HC25 module shall be in compliance with the SELV
requirements defined in EN 60950-1.
HC25 Hardware Interface Overview
1.5 Safety Precautions
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1.5 Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating HC25. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-
ure to comply with these precautions violates safety standards of design, manufacture and
intended use of the product. Siemens AG assumes no liability for customer’s failure to comply
with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-
lines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing
aids can be affected by interference from cellular terminals or mobiles placed close to
the device. If in doubt about potential danger, contact the physician or the manufac-
turer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-
not be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electri-
cal equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-
ing a vehicle, unless it is securely mounted in a holder for speakerphone operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or opera-
tion can constitute a safety hazard.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential com-
munications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular termi-
nal or mobile.
HC25 Hardware Interface Overview
2 Product Concept
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2 Product Concept
2.1 Key Features at a Glance
Feature Implementation
General
Frequency bands UMTS/HSDPA: Triple band, 850//1900/2100MHz
GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz
GSM class Small MS
Output power
(according to
Release 99)
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Power supply 3.2V < VBATT+ < 4.2V
Physical Dimensions: 50mm x 34mm x 4.5mm
Weight: approx. 10g
RoHS All hardware components fully compliant with EU RoHS Directive
HSDPA features
3GPP Release 5 3.6 Mbps, UL 384 kbps
UE CAT. [1-6], 11, 12 supported
Compressed mode (CM) supported according to 3GPP TS25.212
UMTS features
Release 99, June 2004, W-
CDMA FDD standard PS data rate – 384 kbps DL / 384 kbps UL
CS data rate – 64 kbps DL / 64 kbps UL
HC25 Hardware Interface Overview
2.1 Key Features at a Glance
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GSM / GPRS / EGPRS features
Data transfer GPRS
• Multislot Class 10
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS
• Multislot Class 10
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• BEP reporting
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• PBCCH support
• 1 phase/2 phase access procedures
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
CSD
• V.110, RLP, non-transparent
• 9.6 kbps
SMS Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Fax Group 3; Class 1
Audio Audio speech codecs
GSM: AMR, EFR, FR, HR
3GPP: AMR
One ringing melody supported
CEPT supervisory tones supported
DTMF supported
6 audio modes: Approval, Router, Handset, Headset, Speakerphone and
Transparent mode
TTY support selecting a dedicated audio mode
Download of audio parameters
Gains and volumes can be controlled by AT commands
Several additional ringing melodies
CEPT and ANSI supervisory tones supported
Software
AT commands AT-Hayes GSM 07.05 and 07.07, Siemens
AT commands for RIL compatibility (NDIS/RIL)
MicrosoftTM compatibility RIL / NDIS for Windows MobileTM
SIM Application Toolkit SAT Class C
Firmware update Firmware update from host application over USB.
Feature Implementation
HC25 Hardware Interface Overview
2.1 Key Features at a Glance
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Interfaces
USB Supports a USB 2.0 Full Speed (12Mbit/s) device interface.
Wakeup Control Signal pin to wake up an inactive USB Host into an active state.
Status Signal pins to indicate network connectivity status.
Audio 1 analog interface
UICC interface Supported chip cards: SIM / UICC 3V, 1.8V
Antenna 50Ohms. External antenna can be connected via antenna connector or
antenna pad (spring contact).
Module interface 50-pin board-to-board connector
Power on/off, Reset
Power on/off Switch-on by hardware pin IGT
Switch-off by hardware pin IGT
Switch-off by AT command
Reset Orderly shutdown and reset by AT command
Emergency off by hardware pin EMERG_OFF and restart with hardware
pin IGT
Emergency off Emergency off by hardware pin EMERG_OFF
Evaluation kit
DSB DSB75 Evaluation Board designed to test and type approve Siemens cel-
lular engines and provide a sample configuration for application engineer-
ing. A special adapter is required to connect the module to the DSB75.
Feature Implementation
HC25 Hardware Interface Overview
3 Application Interface
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3 Application Interface
HC25 is equipped with a 50-pin board-to-board connector that connects to the external appli-
cation and incorporates several sub-interfaces: power supply, USB interface, UICC/SIM inter-
face, analog audio interface, as well as various status and control lines (see also Chapter 2).
3.1 Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 5: Overview of operating modes
Mode Function
Normal
operation GSM /
GPRS / UMTS /
HSDPA SLEEP
Power saving mode set automatically when no call is in progress and
the USB connection is suspended by host or not present.
GSM IDLE Software is active. Once registered to the GSM network, paging with
BTS is carried out in order to achieve synchrony with the GSM network.
The repetition rate depends on the parameter BSPA_Multiframe. The
module is ready to send and receive.
GSM TALK/
GSM DATA Connection between two subscribers is in progress. Power consump-
tion depends on the GSM network coverage and several connection
settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and
antenna connection). The following applies when power is to be mea-
sured in TALK_GSM mode: DTX off, FR and no frequency hopping,
otherwise same as for IDLE measurements.
GPRS IDLE Module is attached and ready for GPRS data transfer, but no data is
currently sent or received.
GPRS DATA GPRS data transfer in progress. Power consumption depends on net-
work settings (e.g. power control level), uplink / downlink data rates and
GPRS configuration (e.g. used multislot settings).
EGPRS DATA EGPRS data transfer in progress. Power consumption depends on net-
work settings (e.g. power control level), uplink / downlink data rates and
EGPRS configuration (e.g. used multislot settings).
UMTS /
HSDPA IDLE Module is attached and ready for UMTS / HSDPA data transfer, but no
data is currently sent or received.
UMTS TALK/
UMTS DATA UMTS data transfer in progress. Power consumption depends on net-
work settings (e.g. TPC Pattern) and data transfer rate.
HSDPA DATA HSDPA data transfer in progress. Power consumption depends on net-
work settings (e.g. TPC Pattern) and data transfer rate.
Power
Down The internal power section is shut down. The SW on the module is not active. The interfaces
are not accessible.
HC25 Hardware Interface Overview
4 Antenna Interface
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4 Antenna Interface
The RF interface has an impedance of 50Ω. HC25 is capable of sustaining a total mismatch at
the antenna connector or pad without any damage, even when transmitting at maximum RF
power.
The external antenna must be matched properly to achieve best performance regarding radi-
ated power, DC-power consumption, modulation accuracy and harmonic suppression.
Antenna matching networks are not included on the HC25 PCB and should be placed in the
host application.
Regarding the return loss HC25 provides the following values in the active band:
The connection of the antenna or other equipment must be decoupled from DC voltage. This
is necessary because the antenna connector is DC coupled to ground via an inductor for ESD
protection.
Note: The antenna must be isolated for ESD protection (to withstand a voltage resistance up
to 8kV air discharge).
4.1 Antenna Installation
To suit the physical design of individual applications HC25 offers two alternative approaches
to connecting the antenna:
• Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on the
top side of the PCB. See Section 4.3 for connector details.
• Antenna pad and grounding plane placed on the bottom side. See Section 4.2.
The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Sie-
mens reference equipment submitted to type approve HC25. All RF data specified throughout
this manual are related to the ARP.
IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an
antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the
antenna is connected to the pad, then the Hirose connector must be left empty.
Table 6: Return loss in the active band
State of module Return loss of module Recommended return loss of application
Receive > 8dB > 12dB
Transmit not applicable > 12dB
Idle < 5dB not applicable
HC25 Hardware Interface Overview
4.2 Antenna Pad
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No matter which option you choose, ensure that the antenna pad does not come into contact
with the holding device or any other components of the host application. It needs to be sur-
rounded by a restricted area filled with air, which must also be reserved 1.4mm in height.
Figure 1: Restricted area around antenna pad (side and bottom view)
4.2 Antenna Pad
The antenna can be attached via contact springs.
If you decide to use the antenna pad take into account that the pad has not been intended as
antenna reference point (ARP) for the Siemens HC25 type approval. The antenna pad is pro-
vided only as an alternative option which can be used, for example, if the recommended Hirose
connection does not fit into your antenna design.
Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a
50Ω connector is mandatory for type approval measurements. This requires GSM devices with
an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable
with adapter.
HC25 material properties:
HC25 PCB: FR4
Antenna pad: Gold plated pad
HC25 Hardware Interface Overview
4.3 Antenna Connector
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4.3 Antenna Connector
HC25 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product
name is:
• U.FL-R-SMT
Figure 2: Mechanical dimensions of U.FL-R-SMT connector
Table 7: Product specifications of U.FL-R-SMT connector
Item Specification Conditions
Ratings
Nominal impedance 50ΩOperating temp:-40°C to + 90°C
Operating humidity: max. 90%
Rated frequency DC to 3GHz
Mechanical characteristics
Female contact
holding force 0.15N min Measured with a Ø 0.475 pin gauge
Repetitive operation Contact resistance:
Center 25mΩ
Outside 15mΩ
30 cycles of insertion and disengage-
ment
Vibration No momentary disconnections of 1µs;
No damage, cracks and looseness of
parts
Frequency of 10 to 100Hz, single
amplitude of 1.5mm, acceleration of
59m/s2, for 5 cycles in the direction of
each of the 3 axes
Shock No momentary disconnections of 1µs.
No damage, cracks and looseness of
parts.
Acceleration of 735m/s2, 11ms duration
for 6 cycles in the direction of each of
the 3 axes
Environmental characteristics
Humidity resistance No damage, cracks and looseness of
parts.
Insulation resistance:
100MΩ min. at high humidity
500MΩ min. when dry
Exposure to 40°C, humidity of 95% for
a total of 96 hours
HC25 Hardware Interface Overview
4.3 Antenna Connector
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Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown
below and listed in Table 9. For latest product information please contact your Hirose dealer or
visit the Hirose home page, for example http://www.hirose.com.
Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plug
Figure 4: U.FL-R-SMT connector with U.FL-LP-066 plug
Temperature cycle No damage, cracks and looseness of
parts.
Contact resistance:
Center 25mΩ
Outside 15mΩ
Temperature: +40°C → 5 to 35°C →
+90°C → 5 to 35°C
Time: 30min → within 5min → 30min
within 5min
Salt spray test No excessive corrosion 48 hours continuous exposure to 5%
salt water
Table 8: Material and finish of U.FL-R-SMT connector and recommended plugs
Part Material Finish
Shell Phosphor bronze Silver plating
Male center contact Brass Gold plating
Female center con-
tact Phosphor bronze Gold plating
Insulator Plug: PBT
Receptacle: LCP Black
Beige
Table 7: Product specifications of U.FL-R-SMT connector
Item Specification Conditions
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4.3 Antenna Connector
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In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as
an extremely space saving solution. This plug is intended for use with extra fine cable (up to
Ø 0.81mm) and minimizes the mating height to 2mm. See Figure 5 which shows the Hirose
datasheet.
Figure 5: Specifications of U.FL-LP-(V)-040(01) plug
HC25 Hardware Interface Overview
4.3 Antenna Connector
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Table 9: Ordering information for Hirose U.FL Series
Item Part number HRS number
Connector on HC25 U.FL-R-SMT CL331-0471-0-10
Right-angle plug shell for
Ø 0.81mm cable U.FL-LP-040 CL331-0451-2
Right-angle plug for
Ø 0.81mm cable U.FL-LP(V)-040 (01) CL331-053-8-01
Right-angle plug for
Ø 1.13mm cable U.FL-LP-068 CL331-0452-5
Right-angle plug for
Ø 1.32mm cable U.FL-LP-066 CL331-0452-5
Extraction jig E.FL-LP-N CL331-04441-9
HC25 Hardware Interface Overview
5 Electrical, Reliability and Radio Characteristics
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5 Electrical, Reliability and Radio Characteristics
5.1 Absolute Maximum Ratings
The absolute maximum ratings stated in Table 10 are stress ratings under any conditions.
Stresses beyond any of these limits will cause permanent damage to HC25.
Table 10: Absolute maximum ratings
Parameter Min Max Unit
Supply voltage BATT+ -0.3 4.5 V
Voltage at digital pins in POWER DOWN mode -0.3 0.3 V
Voltage at digital pins in normal operation -0.3 2.8 V
Voltage at analog pins in POWER DOWN mode -0.3 0.3 V
Voltage at analog pins in normal operation -0.3 2.5 V
Voltage at STATSUSx pins -0.5 7.5 V
VUSB -0.3 7.5 V
USB_DP, USB_DN -0.3 7.5 V
PWR_IND -0.3 10 V
VDDLP -0.3 3.25 V
HC25 Hardware Interface Overview
5.2 Operating Temperatures
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5.2 Operating Temperatures
The values stated below are in compliance with GSM recommendation TS 51.010-01.
Table 11 shows the temperatures for automatic shutdown as measured by the on-board mea-
suring element NTC. The maximum allowable ambient temperature that causes the module to
shut down depends on various conditions. The following tables Table 12 and Table 13 show
sample lab environment conditions. Please be aware that the operating duration and the max-
imum ambient temperature will vary significantly for your application.
Note: Generally it is strongly recommended to implement additional measures to lead the heat
out of the application, especially at maximum transmission power levels of WCDMA (24dBm),
e.g. use of ground area for a heat sink or convection (see Section 6.1 for the ground area that
may be used for a heat sink).
Table 11: Board temperature
Parameter Min Typ Max Unit
Operating temperature range -20 +25 +85 °C
Automatic shutdown1
Temperature measured on HC25 board
1. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur.
The possible deviation is in the range of ± 3°C at the overtemperature limit and ± 5°C at the undertem-
perature limit.
< -30 --- >+85 °C
Table 12: Sample operating conditions without forced air circulation (according to IEC 60068-2)
Mode Ambient
Temperature Voltage RF Power Operating
Duration
GSM,
GPRS/EDGE Class 8 +65°C VBATT+ < 3.8V Max. ∞
WCDMA +55°C VBATT+ < 3.4V < 10dBm ∞
WCDMA +65°C VBATT+ < 3.4V < 0dBm ∞
GRPS/EDGE Class10 +65°C VBATT+ < 3.8V Max. < 2min
WCDMA +65°C VBATT+ < 3.8V Max. < 2min
Table 13: Sample operating conditions with forced air circulation (air speed 0.9m/s)
Mode Ambient
Temperature Voltage RF Power Operating
Duration
GSM,
GPRS/EDGE Class 8 +75°C VBATT+ < 3.8V Max. ∞
WCDMA +60°C VBATT+ < 3.4V < 10dBm ∞
WCDMA +70°C VBATT+ < 3.4V < 0dBm ∞
GRPS/EDGE Class 10 +65°C VBATT+ < 3.8V Max. ∞
WCDMA +60°C VBATT+ < 3.4V Max. ∞
HC25 Hardware Interface Overview
5.3 Storage Conditions
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5.3 Storage Conditions
The conditions stated below are only valid for modules in their original packed state in weather
protected, non-temperature-controlled storage locations. Normal storage time under these
conditions is 12 months maximum.
Table 14: Storage conditions
Type Condition Unit Reference
Air temperature: Low
High -40
+85 °C ETS 300 019-2-1: T1.2, IEC 68-2-1 Ab
ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb
Humidity relative: Low
High
Condens.
10
90 at 30°C
90-100 at 30°C
%---
ETS 300 019-2-1: T1.2, IEC 68-2-56 Cb
ETS 300 019-2-1: T1.2, IEC 68-2-30 Db
Air pressure: Low
High 70
106 kPa IEC TR 60271-3-1: 1K4
IEC TR 60271-3-1: 1K4
Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4
Water: rain, dripping, icing and
frosting Not allowed --- ---
Radiation: Solar
Heat 1120
600 W/m2ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb
ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb
Chemically active substances Not recom-
mended IEC TR 60271-3-1: 1C1L
Mechanically active substances Not recom-
mended IEC TR 60271-3-1: 1S1
Vibration sinusoidal:
Displacement
Acceleration
Frequency range
1.5
5
2-9 9-200
mm
m/s2
Hz
IEC TR 60271-3-1: 1M2
Shocks:
Shock spectrum
Duration
Acceleration
semi-sinusoidal
1
50 ms
m/s2
IEC 68-2-27 Ea
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5.4 Reliability Characteristics
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5.4 Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 15: Summary of reliability test conditions
Type of test Conditions Standard
Vibration Frequency range: 10-20Hz; acceleration: 3.1mm
amplitude
Frequency range: 20-500Hz; acceleration: 5g
Duration: 2h per axis = 10 cycles; 3 axes
DIN IEC 68-2-6
Shock half-sinus Acceleration: 500g
Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)
DIN IEC 68-2-27
Dry heat Temperature: +70 ±2×C
Test duration: 16h
Humidity in the test chamber: < 50%
EN 60068-2-2 Bb
ETS 300 019-2-7
Temperature
change (shock) Low temperature: -40×C ±2×C
High temperature: +85×C ±2×C
Changeover time: < 30s (dual chamber system)
Test duration: 1h
Number of repetitions: 100
DIN IEC 68-2-14 Na
ETS 300 019-2-7
Damp heat cyclic High temperature: +55×C ±2×C
Low temperature: +25×C ±2×C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
DIN IEC 68-2-30 Db
ETS 300 019-2-5
Cold (constant
exposure) Temperature: -40 ±2×C
Test duration: 16h DIN IEC 68-2-1
HC25 Hardware Interface Overview
6 Mechanics
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6 Mechanics
6.1 Mechanical Dimensions of HC25
Length:50.00mm
Width: 34.00mm
Height:4.5mm
Figure 6: HC25 – Top and bottom view
Pin 1
Pin 25
Pin 50
Pin 26
Ground
Ground
(for Heat Sink)
Ground
RF Antenna
Connector
HC25 Hardware Interface Overview
6.2 Mounting HC25 to the Application Platform
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6.2 Mounting HC25 to the Application Platform
There are many ways to properly install HC25 in the host device. An efficient approach is to
mount the HC25 PCB to a frame, plate, rack or chassis.
Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized
screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to
achieve better support. To help you find appropriate spacers a list of selected screws and dis-
tance sleeves for 3mm stacking height can be found in Section 8.2.
When using the holes the screws can be inserted from top or bottom.
For proper grounding it is strongly recommended to use the large ground plane on the bottom
of board in addition to the five GND pins of the board-to-board connector. The ground plane
may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.
Please take care that attached cooling elements do not touch the antenna pads on the mod-
ule’s bottom side, as this may lead a short-circuit.
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is
positioned flat against the host device (see also Section 8.3 with mounting advice sheet).
6.3 Board-to-Board Application Connector
This section provides specifications for the 50-pin board-to-board (B2B) connector used to con-
nect HC25 to the host application.
For the module’s external interface the following connector series has been chosen:
Supplier: Hirose ( www.hirose.com )
Type: DF12C (3.0)-50DS-0.5V (SlimStack Receptacle)
Height: 3.0 mm
Table 16: Electrical and mechanical characteristics of the board-to-board connector
Parameter Specification (50-way connector)
Number of Contacts 50
Quantity delivered 2000 Connectors per Tape & Reel
Voltage 50V
Current Rating 0.4A max per contact
Resistance 0.05 Ohm per contact
Dielectric Withstanding Voltage 150V RMS AC for 1min
Operating Temperature -40°C...+85°C
Contact Material phosphor bronze finish: solder plating
Insulator Material PPS, deep brown / Polyamide, beige
FFC/FPC Thickness 0.3mm ±0.05mm (0.012" ±0.002")
Maximum connection cycles 20 (@ 50mOhm max)
Cable FFC (Flat Flexible Cable), max. length 150mm from SIM
interface
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6.3 Board-to-Board Application Connector
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A recommended corresponding board-to-board connector series for external applications is:
Supplier: Hirose ( www.hirose.com )
Type: DF12x-50DP-0.5V (SlimStack Header)
Height: 3.0 – 5.0 mm
For Hirose sales contacts see Chapter 8.
Note: There is no inverse polarity protection for the board-to-board connector. It is therefore
very important that the board-to-board connector is connected correctly to the host application,
i.e., pin1 must be connected to pin1, pin2 to pin 2, etc. Pin assignments are listed in Section
5.5, pin locations are shown in Figure 6.
Figure 8: Mechanical dimensions of the board-to-board connector
HC25 Hardware Interface Overview
7 Reference Approval
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7 Reference Approval
7.1 Reference Equipment for Type Approval
The Siemens reference setup submitted to type approve HC25 consists of the following com-
ponents:
• Siemens HC25 cellular engine
• Development Support Box DSB75 and HC15/HC25-DSB75-Adapter for mounting the
HC25 module
• SIM card reader integrated on DSB75
• U.FL-LP antenna cable
• Handset type Votronic HH-SI-30.3/V1.1/0
•PC as MMI
Figure 9: Reference equipment for Type Approval
HC25 Hardware Interface Overview
7.2 Compliance with FCC Rules and Regulations
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7.2 Compliance with FCC Rules and Regulations
The Equipment Authorization Certification for the Siemens reference application described in
Section 7.1 will be registered under the following identifiers:
FCC Identifier: QIPHC25
Industry Canada Certification Number: 267W-HC25
Granted to Siemens AG
Manufacturers of mobile or fixed devices incorporating HC25 modules are authorized to use
the FCC Grants and Industry Canada Certificates of the HC25 modules for their own final prod-
ucts according to the conditions referenced in these documents. In this case, the FCC label of
the module shall be visible from the outside, or the host device shall bear a second label stating
"Contains FCC ID QIPHC25".
IMPORTANT:
Manufacturers of portable applications incorporating HC25 modules are required to have their
final product certified and apply for their own FCC Grant and Industry Canada Certificate
related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-
table mobiles (see Section 1.4 for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
HC25 Hardware Interface Overview
8 Appendix
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8 Appendix
8.1 List of Parts and Accessories
Table 17: List of parts and accessories
Description Supplier Ordering information
HC25 Siemens Standard module (Siemens IMEI)
Siemens ordering number: L30960-N1050-A100
Customer IMEI mode:
Siemens Ordering number: L30960-N1060-A100
Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117
DSB75 Support Box Siemens Siemens ordering number: L36880-N8811-A100
HC15/HC25-DSB75-Adapter Siemens Siemens ordering number: L30960-N1001-A100
Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0
VOTRONIC
Entwicklungs- und Produktionsgesellschaft für elek-
tronische Geräte mbH
Saarbrücker Str. 8
66386 St. Ingbert
Germany
Phone: +49-(0)6 89 4 / 92 55-0
Fax: +49-(0)6 89 4 / 92 55-88
e-mail: contact@votronic.com
SIM card holder incl. push
button ejector and slide-in
tray
Molex Ordering numbers: 91228
91236
Sales contacts are listed in Table 18.
Board-to-board connector Molex Sales contacts are listed in Table 18.
Antenna connector Hirose Sales contacts are listed in Table 19.
HC25 Hardware Interface Overview
8.1 List of Parts and Accessories
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Table 18: Molex sales contacts (subject to change)
Molex
For further information please click:
http://www.molex.com
Molex Deutschland GmbH
Felix-Wankel-Str. 11
4078 Heilbronn-Biberach
Germany
Phone: +49-7066-9555 0
Fax: +49-7066-9555 29
Mail: mxgermany@molex.com
American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: +1-630-969-1352
Molex China Distributors
Beijing,
Room 1319, Tower B, COFCO Plaza
No. 8, Jian Guo Men Nei Street, 100005
Beijing
P.R. China
Phone: +86-10-6526-9628
Phone: +86-10-6526-972
Phone: +86-10-6526-9731
Fax: +86-10-6526-9730
Molex Singapore Pte. Ltd.
Jurong, Singapore
Phone: +65-268-6868
Fax: +65-265-6044
Molex Japan Co. Ltd.
Yamato, Kanagawa,
Japan
Phone: +81-462-65-2324
Fax: +81-462-65-2366
Table 19: Hirose sales contacts (subject to change)
Hirose Ltd.
For further information please click:
http://www.hirose.com
Hirose Electric (U.S.A.) Inc
2688 Westhills Court
Simi Valley, CA 93065
U.S.A.
Phone: +1-805-522-7958
Fax: +1-805-522-3217
Hirose Electric GmbH
Herzog-Carl-Strasse 4
73760 Ostfildern
Germany
Phone: +49-711-456002-1
Fax: +49-711-456002-299
Email info@hirose.de
Hirose Electric UK, Ltd
Crownhill Business Centre
22 Vincent Avenue, Crownhill
Milton Keynes, MK8 OAB
Great Britain
Phone: +44-1908-305400
Fax: +44-1908-305401
Hirose Electric Co., Ltd.
5-23, Osaki 5 Chome,
Shinagawa-Ku
Tokyo 141
Japan
Phone: +81-03-3491-9741
Fax: +81-03-3493-2933
Hirose Electric Co., Ltd.
European Branch
First class Building 4F
Beechavenue 46
1119PV Schiphol-Rijk
Netherlands
Phone: +31-20-6557-460
Fax: +31-20-6557-469
HC25 Hardware Interface Overview
8.2 Fasteners and Fixings for Electronic Equipment
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8.2 Fasteners and Fixings for Electronic Equipment
This section provides a list of suppliers and manufacturers offering fasteners and fixings for
electronic equipment and PCB mounting. The content of this section is designed to offer basic
guidance to various mounting solutions with no warranty on the accuracy and sufficiency of the
information supplied. Please note that the list remains preliminary although it is going to be
updated in later versions of this document.
8.2.1 Fasteners from German Supplier ETTINGER GmbH
Sales contact:
ETTINGER GmbH
http://www.ettinger.de/main.cfm
Phone: +49-81-046623-0
Fax: +49-81-046623-99
The following tables contain only article numbers and basic parameters of the listed compo-
nents. For further detail and ordering information please contact Ettinger GmbH.
Please note that some of the listed screws, spacers and nuts are delivered with the DSB75
Support Board. See comments below.
Article number: 05.71.038 Spacer - Aluminum /
Wall thickness = 0.8mm
Length 3.0mm
Material AlMgSi-0,5
For internal diameter M2=2.0-2.3
Internal diameter d = 2.4mm
External diameter 4.0mm
Vogt AG No. x40030080.10
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8.2 Fasteners and Fixings for Electronic Equipment
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Article number: 07.51.403 Insulating Spacer for M2
Self-gripping1
1. 2 spacers are delivered with DSB75 Support Board
Length 3.0mm
Material Polyamide 6.6
Surface Black
Internal diameter 2.2mm
External diameter 4.0mm
Flammability rating UL94-HB
Article number: 05.11.209 Threaded Stud M2.5 - M2 Type E /
External thread at both ends
Length 3.0mm
Material Stainless steel X12CrMoS17
Thread 1 / Length M2.5 / 6.0mm
Thread 2 / Length M2 / 8.0mm
Width across flats 5
Recess yes
Type External / External
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8.2 Fasteners and Fixings for Electronic Equipment
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Article number: 01.14.131 Screw M21
DIN 84 - ISO 1207
1. 2 screws are delivered with DSB75 Support Board
Length 8.0mm
Material Steel 4.8
Surface Zinced A2K
Thread M2
Head diameter D = 3.8mm
Head height 1.30mm
Type Slotted cheese head screw
Article number: 01.14.141 Screw M2
DIN 84 - ISO 1207
Length 10.0mm
Material Steel 4.8
Surface Zinced A2K
Thread M2
Head diameter D = 3.8mm
Head height 1.30mm
Type Slotted cheese head screw
HC25 Hardware Interface Overview
8.3 Mounting Advice Sheet
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8.3 Mounting Advice Sheet
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is
positioned flat against the host device. The advice sheet on the next page shows a number of
examples for the kind of bending that may lead to mechanical damage of the module.
Article number: 02.10.011 Hexagon Nut1
DIN 934 - ISO 4032
1. 2 nuts are delivered with DSB75 Support Board
Material Steel 4.8
Surface Zinced A2K
Thread M2
Wrench size / Ø 4
Thickness / L 1.6mm
Type Nut DIN/UNC, DIN934
