Gemalto M2M PLAS9-X Cinterion Module PLAS9-X User Manual plas9 x hid

Gemalto M2M GmbH Cinterion Module PLAS9-X plas9 x hid

user manual

 M2M.GEMALTO.COMCinterion® PLAS9-XHardware Interface OverviewVersion: 00.044DocId: PLAS9-X_HIO_v00.044
GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANYEVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINSINFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARESUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY,MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE ORDECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLYAUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLYAND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTEDBY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES.THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECYREGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIV-ERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUEDACCORDING TO GERMAN LAW.CopyrightTransmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-tents and communication thereof to others without express authorization are prohibited. Offenders will beheld liable for payment of damages. All rights created by patent grant or registration of a utility model ordesign patent are reserved. Copyright © 2017, Gemalto M2M GmbH, a Gemalto CompanyTrademark NoticeGemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certaincountries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora-tion in the United States and/or other countries. All other registered trademarks or trademarks mentionedin this document are property of their respective owners.PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryCinterion® PLAS9-X Hardware Interface Overview2Page 2 of 39Document Name: Cinterion® PLAS9-X Hardware Interface Overview Version: 00.044Date: 2017-09-19DocId: PLAS9-X_HIO_v00.044Status Confidential / Preliminary
Cinterion® PLAS9-X Hardware Interface Overview Contents39PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 3 of 39Contents1 Introduction ................................................................................................................. 61.1 Key Features at a Glance .................................................................................. 61.2 PLAS9-X System Overview ............................................................................... 92 Interface Characteristics .......................................................................................... 102.1 Application Interface ........................................................................................ 102.1.1 USB Interface...................................................................................... 102.1.2 UICC/SIM/USIM Interface................................................................... 112.1.3 Analog-to-Digital Converter (ADC)...................................................... 132.1.4 GPIO Interface.................................................................................... 132.1.5 Control Signals.................................................................................... 142.1.5.1 PWR_IND Signal................................................................. 142.1.5.2 Behavior of the RING0 Line ................................................ 142.1.5.3 Remote Wakeup.................................................................. 142.1.5.4 Low Current Indicator.......................................................... 142.2 GSM/UMTS/LTE Antenna Interface................................................................. 152.2.1 Antenna Installation ............................................................................ 162.2.2 RF Line Routing Design...................................................................... 172.2.2.1 Line Arrangement Instructions ............................................ 172.2.2.2 Routing Examples............................................................... 192.3 Sample Application .......................................................................................... 213 Operating Characteristics ........................................................................................ 233.1 Operating Modes ............................................................................................. 233.2 Power Supply................................................................................................... 244 Mechanical Dimensions ........................................................................................... 254.1 Mechanical Dimensions of PLAS9-X ............................................................... 255 Regulatory and Type Approval Information ........................................................... 275.1 Directives and Standards................................................................................. 275.2 SAR requirements specific to portable mobiles ............................................... 295.3 Reference Equipment for Type Approval......................................................... 305.4 Compliance with FCC and IC Rules and Regulations ..................................... 316 Document Information.............................................................................................. 336.1 Revision History............................................................................................... 336.2 Related Documents ......................................................................................... 336.3 Terms and Abbreviations................................................................................. 336.4 Safety Precaution Notes .................................................................................. 367 Appendix.................................................................................................................... 377.1 List of Parts and Accessories........................................................................... 37
Cinterion® PLAS9-X Hardware Interface Overview Tables39PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 4 of 39TablesTable 1: Signals of the SIM interface (SMT application interface) ............................... 11Table 2: Return loss in the active band........................................................................ 15Table 3: Overview of operating modes ........................................................................ 23Table 4: Directives ....................................................................................................... 27Table 5: Standards of North American type approval .................................................. 27Table 6: Requirements of quality ................................................................................. 27Table 7: Standards of the Ministry of Information Industry of the People’s Republic of China............................................................................ 28Table 8: Toxic or hazardous substances or elements with defined concentration limits............................................................................................................... 28Table 9: Antenna gain limits for FCC and IC (TBD.).................................................... 31Table 10: List of parts and accessories.......................................................................... 37Table 11: Molex sales contacts (subject to change) ...................................................... 38Table 12: Hirose sales contacts (subject to change) ..................................................... 38
Cinterion® PLAS9-X Hardware Interface Overview Figures39PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 5 of 39FiguresFigure 1: PLAS9-X system overview............................................................................... 9Figure 2: USB circuit ..................................................................................................... 10Figure 3: First UICC/SIM/USIM interface ...................................................................... 12Figure 4: Second UICC/SIM/USIM interface................................................................. 12Figure 5: Embedded Stripline line arrangement............................................................ 17Figure 6: Micro-Stripline line arrangement samples...................................................... 18Figure 7: Routing to application‘s RF connector ........................................................... 19Figure 8: Routing to PLAS9-X evaluation module‘s RF connector................................ 20Figure 9: PLAS9-X sample application.......................................................................... 22Figure 10: Decoupling capacitor(s) for BATT+................................................................ 24Figure 11: PLAS9-X – top and bottom view .................................................................... 25Figure 12: Dimensions of PLAS9-X (all dimensions in mm)............................................ 26Figure 13: Reference equipment for type approval......................................................... 30
Cinterion® PLAS9-X Hardware Interface Overview1 Introduction9PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 6 of 391 IntroductionThis document1 describes the hardware of the Cinterion® PLAS9-X module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the re-quirements to be considered for integrating further components.1.1 Key Features at a Glance1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-mentation delivered with your Gemalto M2M product.Feature ImplementationGeneralFrequency bands GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHzUMTS/HSPA+: Triple band, 850 (BdV), 1700 (BdIV), 1900 (BdII)LTE (FDD): Six band, 700 (Bd12 <MFBI Bd17>, Bd13, Bd29 <supplemen-tary downlink>), 850 (Bd5), 1700 (Bd4), 1900 (Bd2)GSM class Small MSOutput power (according to Release 99) Class 4 (+33dBm ±2dB) for EGSM850Class 4 (+33dBm ±2dB) for EGSM900Class 1 (+30dBm ±2dB) for GSM1800Class 1 (+30dBm ±2dB) for GSM1900Class E2 (+27dBm ± 3dB) for GSM 850 8-PSKClass E2 (+27dBm ± 3dB) for GSM 900 8-PSKClass E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSKClass E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSKClass 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdIIClass 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIVClass 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVOutput power (according to Release 8) LTE (FDD):Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd13Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5Class 3 (+23dBm +-2dB) for LTE 1700, LTE FDD Bd4Class 3 (+23dBm +-2dB) for LTE1900, LTE FDD Bd2Power supply 3.3V < VBATT+ < 4.2VOperating temperature (board temperature) Normal operation: -30°C to +85°CExtended operation: -40°C to +95°CPhysical Dimensions: 40mm x 32mm x 2.8mmWeight: approx. 6.5gRoHS All hardware components fully compliant with EU RoHS Directive
Cinterion® PLAS9-X Hardware Interface Overview1.1 Key Features at a Glance9PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 7 of 39LTE features3GPP Release 10 Downlink carrier aggregation (CA) to increase bandwidth, and thereby increase bitrate: • Maximum aggregated bandwidth: 40MHz• Maximum number of component carriers: 2• Inter-band FDD, non-contiguous• Intra-band FDD, contiguous, non-contiguous• Supported inter-band CA configurations: CA_2A-5A (with bandwidth combination set 0), CA_2A-12A (with bandwidth combination sets 0 and 1), CA_2A-29A (with bandwidth combination sets 0, 1 and 2), CA_4A-5A (with bandwidth combination sets 0 and 1), CA_4A-12A (with bandwidth combination sets 0, 1, 2, 3 and 4), CA_4A-29A (with bandwidth combination sets 0, 1 and 2)• Supported intra-band CA configurations: CA_4A-4A (with bandwidth combination set 0)CAT 6 supportedDL 300Mbps, UL 50Mbps2x2 MIMO in DL directionHSPA features3GPP Release 9 UE CAT. 14, 24DC-HSPA+ – DL 42MbpsHSUPA – UL 5.76Mbps Compressed mode (CM) supported according to 3GPP TS25.212UMTS features3GPP Release 9 PS data rate – 384 kbps DL / 384 kbps ULGSM / GPRS / EGPRS featuresData transfer GPRS:• Multislot Class 12• Mobile Station Class B• Coding Scheme 1 – 4EGPRS:• Multislot Class 12• EDGE E2 power class for 8 PSK• Downlink coding schemes – CS 1-4, MCS 1-9• Uplink coding schemes – CS 1-4, MCS 1-9• SRB loopback and test mode B• 8-bit, 11-bit RACH• 1 phase/2 phase access procedures• Link adaptation and IR• NACC, extended UL TBF• Mobile Station Class BSMS Point-to-point MT and MO, Cell broadcast, Text and PDU modeSoftwareAT commands Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M com-mandsFeature Implementation
Cinterion® PLAS9-X Hardware Interface Overview1.1 Key Features at a Glance9PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 8 of 39Firmware update Generic update from host application over USB 2.0 High Speed device interface InterfacesModule interface Surface mount device with solderable connection pads (SMT application interface).Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket.For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-ment.Antenna 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO antennaUSB USB 2.0 High Speed (480Mbit/s) device interface orUSB 3.0 Super Speed (5Gbit/s) device interfaceUICC interface 2 UICC interfaces (switchable)Supported chip cards: UICC/SIM/USIM 3V, 1.8VRING0 Signal line to indicate URCs.Power on/off, ResetPower on/off Switch-on by hardware signal IGTSwitch-off by AT command (AT^SMSO) or IGT (option)Automatic switch-off in case of critical temperature or voltage conditionsReset Orderly shutdown and reset by AT commandEmergency-off Emergency-off by hardware signal EMERG_OFF Special FeaturesAntenna SAIC (Single Antenna Interference Cancellation) / DARP (Downlink Advanced Receiver Performance)Rx Diversity (receiver type 3i - 64-QAM) / MIMOGPIO 10 I/O pins of the application interface programmable as GPIO.Programming is done via AT commands.ADC inputs Analog-to-Digital Converter with two unbalanced analog inputs for (exter-nal) antenna diagnosisEvaluation kitEvaluation module PLAS9-X module soldered onto a dedicated PCB that can be connected to the ALAS6A-DSB75 adapter in order to be mounted onto the DSB75.ALAS6A-DSB75 adapter A special adapter required to connect the PLAS9-X evaluation module to the DSB75.DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. Feature Implementation
Cinterion® PLAS9-X Hardware Interface Overview1.2 PLAS9-X System Overview9PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 9 of 391.2 PLAS9-X System OverviewFigure 1: PLAS9-X system overviewGPIO ADC UICC Powersupply IGT,Emergency OffSIMcardHost application On/OffModuleApplicationPower indication(PWR_IND)GSM/UMTS/LTEPower for application(VEXT)USBGSM/UMTS/LTEAntenna diversity12AntennadiagnosticAntenna switch2x GPIO2x ADCSIMcardRING0
Cinterion® PLAS9-X Hardware Interface Overview2 Interface Characteristics22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 10 of 392 Interface CharacteristicsPLAS9-X is equipped with an SMT application interface that connects to the external applica-tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface2.1.1 USB InterfacePLAS9-X supports a USB 3.0 Super Speed (5Gbps) device interface, and alternatively a USB 2.0 device interface that is High Speed and Full Speed compatible. The USB interface is primarily intended for use as command and data interface, and for downloading firmware1. The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLAS9-X is designed as a self-powered device compliant with the “Universal Serial Bus Spec-ification Revision 3.0”2.Figure 2: USB circuitTo properly connect the module's USB interface to the external application, a USB 3.0 or 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with PLAS9-X needs to be installed.1. Note: For firmware download, the module enumerates new as a USB 2.0 device. Also, it is not possibleto use the USB 2.0 High Speed device mode and the USB 3.0 Super speed device mode simultaneously.2. The specification is ready for download on http://www.usb.org/developers/docs/VREG (3V075) BATT+USB_DP3)lin. reg.GNDModuleDetection only VUSB_IN2)USB part1)1) All serial (including RS) and pull-up resistors for data lines are implemented. USB_DN3)3) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity.VBUS1µF2) Since VUSB_IN is used for detection only it is recommended not to add any further blocking capacitors on the VUSB_IN line.Host wakeup RING0USB_SSRX_NUSB_SSRX_PUSB_SSTX_NUSB_SSTX_PUSB_SS_PHYUSB_HS_PHYUSB 2.0 ControllerUSB 3.0 Controller2.02.03.0100nF100nFSMT
Cinterion® PLAS9-X Hardware Interface Overview2.1 Application Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 11 of 392.1.2 UICC/SIM/USIM InterfacePLAS9-X has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM inter-faces.The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with PLAS9-X and is part of the Gemalto M2M reference equipment submit-ted for type approval. See Chapter 7 for Molex ordering numbers.Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLAS9-X.By default, only the 1st SIM interface is available and can be used. Using the AT command AT^SCFG=”SIM/CS” it is possible to switch between the two SIM interfaces. Command set-tings are non-volatile - for details see [1].Table 1: Signals of the SIM interface (SMT application interface)Signal DescriptionGND Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g., pad P12, may be used to improve EMC.CCCLK1CCCLK2 Chipcard clock lines for 1st and 2nd SIM interface.CCVCC1CCVCC2 SIM supply voltage lines for 1st and 2nd SIM interface.CCIO1CCIO2 Serial data lines for 1st and 2nd SIM interface, input and output.CCRST1CCRST2 Chipcard reset lines for 1st and 2nd SIM interface.CCIN1CCIN2 Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-tion of the SIM. The CCINx signal is active low.The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLAS9-X.
Cinterion® PLAS9-X Hardware Interface Overview2.1 Application Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 12 of 39Figure 3: First UICC/SIM/USIM interfaceThe total cable length between the SMT application interface pads on PLAS9-X and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line.Note: Figure 3 shows how to connect a SIM card holder to the first SIM interface. With the sec-ond SIM interface some internally integrated components on the SIM circuit will have to be ex-ternally integrated as shown for the second SIM interface in Figure 4. The external components at CCIN2 should be populated as close as possible to the signal‘s SMT padFigure 4: Second UICC/SIM/USIM interfaceModuleopen: Card removedclosed: Card insertedCCRST1CCVCC1CCIO1CCCLK1CCIN1SIM /UICC1n220nSMT application interfaceGNDModuleOpen: Card removedClosed: Card insertedCCRST2CCVCC2CCIO2CCCLK2CCIN2SIM /UICC1nF220nFSMT application interfaceGNDVEXT100pF22k2k210k
Cinterion® PLAS9-X Hardware Interface Overview2.1 Application Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 13 of 392.1.3 Analog-to-Digital Converter (ADC)PLAS9-X provides two unbalanced ADC input lines: ADC1_IN and ADC2_IN. They can be used to measure two independent, externally connected DC voltages in the range of 0.05V to VBATT+. 2.1.4 GPIO InterfacePLAS9-X has 10 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. GPIO1...GPIO10 may be configured as low current indicator signal (see Section 2.1.5.4), or may be set as remote host wakeup lines (see Section 2.1.5.3).
Cinterion® PLAS9-X Hardware Interface Overview2.1 Application Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 14 of 392.1.5 Control Signals2.1.5.1 PWR_IND SignalPWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is required.2.1.5.2 Behavior of the RING0 LineThe RING0 line serves to indicate URCs (Unsolicited Result Code).The RING0 line behavior and usage can be configured by AT command. For details see [1]: AT^SCFG.2.1.5.3 Remote WakeupIf no call, data or message transfer is in progress, the external host application may shut downits own module interfaces or other components in order to save power. If a call, data, or otherrequest (URC) arrives, the external application can be notified of this event and be woken upagain by a state transition of a configurable remote wakeup line. Available as remote wakeuplines are all GPIO signals as well as the RING0 line. Please refer to [1]: AT^SCFG: "Re-moteWakeUp/..." for details on how to configure these lines for defined wakeup events onspecified device interfaces. 2.1.5.4 Low Current IndicatorA low current indication is optionally available over a GPIO line. By default, low current indica-tion is disabled and the GPIO pads can be configured and employed as usual. For a GPIO pad to work as a low current indicator the feature has to be enabled by AT com-mand (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI). By default, the GPIO6 pad is config-ured as LCI_IND signal.If enabled, the GPIOx/LCI_IND signal is high when the module is sleeping.
Cinterion® PLAS9-X Hardware Interface Overview2.2 GSM/UMTS/LTE Antenna Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 15 of 392.2 GSM/UMTS/LTE Antenna InterfaceThe PLAS9-X GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity/MIMO antenna to improve signal reliability and quality1. The interface has an impedance of 50. PLAS9-X is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power.The external antennas must be matched properly to achieve best performance regarding radi-ated power, modulation accuracy and harmonic suppression. Matching networks are not in-cluded on the PLAS9-X PCB and should be placed in the host application, if the antenna does not have an impedance of 50.Regarding the return loss PLAS9-X provides the following values in the active band:1. By delivery default the UMTS/LTE Rx diversity/MIMO antenna is configured as available for the modulesince its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. Table 2: Return loss in the active bandState of module Return loss of module Recommended return loss of applicationReceive > 8dB > 12dBTransmit not applicable > 12dBIdle < 5dB not applicable
Cinterion® PLAS9-X Hardware Interface Overview2.2 GSM/UMTS/LTE Antenna Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 16 of 392.2.1 Antenna InstallationThe antenna is connected by soldering the antenna pads (ANT_MAIN; ANT_DRX_MIMO) andtheir neighboring ground pads directly to the application’s PCB.The distance between the antenna pads and their neighboring GND pads has been optimizedfor best possible impedance. To prevent mismatch, special attention should be paid to thesepads on the application’ PCB.The wiring of the antenna connection, starting from the antennapad to the application’s antenna must result in a 50 line impedance. Line width and distanceto the GND plane need to be optimized with regard to the PCB’s layer stack. Related instruc-tions are given in Section 2.2.2.To prevent receiver desensitization due to interferences generated by fast transients like highspeed clocks on the external application PCB, it is recommended to realize the antenna con-nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-tion 2.2.2 for instructions of how to design the antenna connection in order to achieve therequired 50 line impedance.For type approval purposes (i.e., FCC KDB 996369 related to modular approval requirements),an external application must connect the RF signal in one of the following ways:•Via 50 coaxial antenna connector (common connectors are U-FL or SMA) placed as closeas possible to the module's antenna pad.• By soldering the antenna to the antenna connection line on the application’s PCB (withoutthe use of any connector) as close as possible to the module’s antenna pad.• By routing the application PCB’s antenna to the module’s antenna pad in the shortest pos-sible way.
Cinterion® PLAS9-X Hardware Interface Overview2.2 GSM/UMTS/LTE Antenna Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 17 of 392.2.2 RF Line Routing Design2.2.2.1 Line Arrangement InstructionsSeveral dedicated tools are available to calculate line arrangements for specific applicationsand PCB materials - for example from http://www.polarinstruments.com/ (commercial software)or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).Embedded StriplineThis below figure shows line arrangement examples for embedded stripline.Figure 5: Embedded Stripline line arrangement
Cinterion® PLAS9-X Hardware Interface Overview2.2 GSM/UMTS/LTE Antenna Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 18 of 39Micro-StriplineThis section gives two line arrangement examples for micro-stripline. Figure 6: Micro-Stripline line arrangement samples
Cinterion® PLAS9-X Hardware Interface Overview2.2 GSM/UMTS/LTE Antenna Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 19 of 392.2.2.2 Routing ExamplesInterface to RF ConnectorFigure 7 shows a sample connection of a module‘s antenna pad at the bottom layer of the mod-ule PCB with an application PCB‘s coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.40mm is recommended for an application with a PCB layer stack resembling the one of the PLAS9-X evaluation board. For different layer stacks the stripline width will have to follow stripline routing rules, avoiding 90 degree corners and using the shortest distance to the PCB’s coaxial antenna connector.Figure 7: Routing to application‘s RF connectore.g.ANT_ MAING N D G N DEdge of module PCBStripline (50 ohms) on top layer of evaluation board from antenna pad to module edgeWidth = 0.40 mmE.g., U.FL antenna connector50 ohms microstrip lineG N D G N DGround connectionG N D G N D
Cinterion® PLAS9-X Hardware Interface Overview2.2 GSM/UMTS/LTE Antenna Interface22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 20 of 39Figure 8 shows a further sample connection of an evaluation module‘s antenna pad at the bot-tom layer of the PLAS9-X evaluation module PCB with the PCB‘s coaxial antenna connector. The PLAS9-X evaluation module is part of the reference equipment used by Gemalto M2M for type approval (see also Section 5.3). Figure 8: Routing to PLAS9-X evaluation module‘s RF connectore.g.Ant_ WGSMG N D G N DGround ConnectionStripline (50 ohms) on top layer of evaluation board from antenna pad to module edgeWidth = 0,40 mmG N DG N DG N D G N DEdge of Module PCBE.g. U.FL antennaconnector50 ohms micro stripline
Cinterion® PLAS9-X Hardware Interface Overview2.3 Sample Application22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 21 of 392.3 Sample ApplicationFigure 9 shows a typical example of how to integrate an PLAS9-X module with an application. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC µC of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLAS9-X module is active, high level notifies the Power Down mode. If the module is in Power Down mode avoid current flowing from any other source into the mod-ule circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse flow.While developing SMT applications it is strongly recommended to provide test pointsfor certain signals, i.e., lines to and from the module - for debug and/or test purposes.The SMT application should allow for an easy access to these signals. For details onhow to implement test points see [3].The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-sition of components. Some LGA pads are connected to clocks or high speed data streams that might interfere with the module’s antenna. The RF receiver would then be blocked at certain frequencies (self in-terference). The external application’s PCB tracks connected to these pads should therefore be well shielded or kept away from the antenna. This applies especially to the USB and UICC/SIM interfaces.Disclaimer:No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 9 and the information detailed in this section. As functionality and compliance with na-tional regulations depend to a great amount on the used electronic components and the indi-vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLAS9-X modules.
Cinterion® PLAS9-X Hardware Interface Overview2.3 Sample Application22PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 22 of 39Figure 9: PLAS9-X sample application
Cinterion® PLAS9-X Hardware Interface Overview3 Operating Characteristics24PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 23 of 393 Operating Characteristics3.1 Operating ModesThe table below briefly summarizes the various operating modes referred to throughout the document. Table 3: Overview of operating modesMode FunctionNormal operation GSM / GPRS / UMTS / HSPA /LTE SLEEPPower saving set automatically when no call is in progress and the USB connection is detached. GSM / GPRS / UMTS / HSPA / LTE IDLEPower saving disabled or an USB connection active, but no data trans-fer in progress.GPRS DATA GPRS data transfer in progress. Power consumption depends on net-work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).EGPRS DATA EGPRS data transfer in progress. Power consumption depends on net-work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings).UMTS DATA UMTS data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.HSPA DATA HSPA data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.LTE DATA LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.Power Down Normal shutdown after sending the AT^SMSO command. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied. Only a volt-age regulator is active for powering the RTC, as long as operating voltage applied at BATT+ does not drop below approx. 1.4V.Airplane mode Airplane mode shuts down the radio part of the module, causes the module to log off from the GSM/GPRS network and disables all AT commands whose execution requires a radio connection.Airplane mode can be controlled by AT command (see [1]).
Cinterion® PLAS9-X Hardware Interface Overview3.2 Power Supply24PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 24 of 393.2 Power SupplyPLAS9-X needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:• BATT+_RF with 2 lines for the RF power amplifier supply • BATT+ with 2 lines for the general power management. The main power supply from an external application has to be a single voltage source and has to be expanded to two sub paths (star structure). Each voltage domain must be decoupled by application with low ESR capacitors (> 47µF MLCC @ BATT+; > 4x47µF MLCC @ BATT+_RF) as close as possible to LGA pads. Figure 10 shows a sample circuit for decoupling capacitors for BATT+.Figure 10: Decoupling capacitor(s) for BATT+The power supply of PLAS9-X must be able to provide the peak current during the uplink trans-mission. All key functions for supplying power to the device are handled by the power management IC. It provides the following features:• Stabilizes the supply voltages for the baseband using switching regulators and low drop lin-ear voltage regulators.• Switches the module's power voltages for the power-up and -down procedures.• Delivers, across the VEXT line, a regulated voltage for an external application.• LDO to provide SIM power supply.BATT+22Decoupling capacitorse.g. 47µF X5R MLCC4xGNDBATT+BATT+_RFModuleSMT interface 1x
Cinterion® PLAS9-X Hardware Interface Overview4 Mechanical Dimensions26PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 25 of 394 Mechanical Dimensions4.1 Mechanical Dimensions of PLAS9-XFigure 11 shows a 3D view1 of PLAS9-X and provides an overview of the board's mechanical dimensions. For further details see Figure 12. Length: 40mmWidth: 32mmHeight: 2.8mmFigure 11: PLAS9-X – top and bottom view1. The coloring of the 3D view does not reflect the module’s real color.Top viewBottom view
Cinterion® PLAS9-X Hardware Interface Overview4.1 Mechanical Dimensions of PLAS9-X26PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 26 of 39Figure 12: Dimensions of PLAS9-X (all dimensions in mm)
Cinterion® PLAS9-X Hardware Interface Overview5 Regulatory and Type Approval Information32PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 27 of 395 Regulatory and Type Approval InformationNote that some regulatory and type approval information is still to be defined. 5.1 Directives and StandardsPLAS9-X has been designed to comply with the directives and standards listed below.It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-ifications provided in the "PLAS9-X Hardware Interface Description".11. Manufacturers of applications which can be used in the US shall ensure that their applications have aPTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.Table 4: Directives2002/95/EC (RoHS 1)2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)Table 5: Standards of North American type approvalCFR Title 47 Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization FCCOET Bulletin 65(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic FieldsUL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V5.32 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI controlPCS Type Certification Review board (PTCRB)RSS132, RSS133, RSS139 Canadian StandardTable 6: Requirements of qualityIEC 60068 Environmental testingDIN EN 60529 IP codes
Cinterion® PLAS9-X Hardware Interface Overview5.1 Directives and Standards32PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 28 of 39Table 8: Toxic or hazardous substances or elements with defined concentration limitsTable 7: Standards of the Ministry of Information Industry of the People’s Republic of ChinaSJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06).SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Hardware Interface Description.Please see Table 8 for an overview of toxic or hazardous substances or ele-ments that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006.
Cinterion® PLAS9-X Hardware Interface Overview5.2 SAR requirements specific to portable mobiles32PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 29 of 395.2 SAR requirements specific to portable mobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable PLAS9-X based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US marketsES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagneticfields (EMFs) from mobile telecommunication equipment (MTE) in thefrequency range 30MHz - 6GHz IMPORTANT:Manufacturers of portable applications based on PLAS9-X modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate relat-ed to the specific portable mobile.
Cinterion® PLAS9-X Hardware Interface Overview5.3 Reference Equipment for Type Approval32PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 30 of 395.3 Reference Equipment for Type ApprovalThe Gemalto M2M general reference setup submitted to type approve PLAS9-X is shown in the figure below: Figure 13 illustrates the setup for general tests and evaluation purposes. The evaluation module can be plugged directly onto the ALAS6A-DSB75 adapter. The GSM/UMTS/LTE test equipment is still connected via SMA connectors on the ALAS6A-DSB75 adapter. The PC is connected via USB interface.Figure 13: Reference equipment for type approvalPlease note that for EMC and RF performance tests, slightly different reference equipment con-figurations are used. If necessary, please contact Gemalto for further details.V10 643 1X506X202 X201 X 205X400X401X110X120S112S110X121S111C4 13X410X411X405C415C414X510X511X5 51X552X122S601X602X710TP105X700S714S715S710S711V430X505S201 S200X554X703X561S504S503S502S501S500S457S452S456S455S453S454S450S460S451S461S462S464S465S463S466S469S459S467S458S46812312312311012312312312312312312313131311511231112312312312312312312312312312312312312312312312312312312312312312312311111111 4 2 3156915691569112291091029X2031X206X20411DSB753V237V232V236V231V235V230V234V244V243V242V241V239V240V238V233SYNCRTS0DSR0DTR0DCD0RING0TXD0CTS0RXD0ALAS6A-DSB75-AdapterWEVAL-Board with modulePower SupplyPCGSM / UMTS / LTE TestequipmentUSB 3.0GSM/UMTS/LTEUMTS /LTE Rx Diversity /MIMO
Cinterion® PLAS9-X Hardware Interface Overview5.4 Compliance with FCC and IC Rules and Regulations32PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 31 of 395.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M modules reference application described in Section 5.3 will be registered under the following identifiers:•PLAS9-X:FCC Identifier QIPPLAS9-XIndustry Canada Certification Number: 7830A-PLAS9XGranted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating PLAS9-X modules are authorized to use the FCC Grants and Industry Canada Certificates of the PLAS9-X modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPPLAS9-X" and accordingly “Contains IC: 7830A-PLAS9X“. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 9 for FCC and IC.IMPORTANT:Manufacturers of portable applications incorporating PLAS9-X modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-table mobiles (see Section 5.2 for detail).Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Table 9: Antenna gain limits for FCC and IC (TBD.)Maximum gain in operating band FCC limit IC limit UnitBand12, Band13, Band 29 700MHz (LTE) dBiBand 5, 850MHz (GSM/WCDMA/LTE) dBiBand 4, 1700MHz (WCDMA/LTE) dBiBand 2, 1900MHz (GSM/WCDMA/LTE) dBi
Cinterion® PLAS9-X Hardware Interface Overview5.4 Compliance with FCC and IC Rules and Regulations32PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 32 of 39Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-ference in a residential installation. This equipment generates, uses and can radiate radio fre-quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help.This Class B digital apparatus complies with Canadian ICES-003.If Canadian approval is requested for devices incorporating PLAS9-X modules the above note will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-tain any information on how to install or remove the module from the final product.
Cinterion® PLAS9-X Hardware Interface Overview6 Document Information36PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 33 of 396 Document Information6.1 Revision HistoryNew document: "Cinterion® PLAS9-X Hardware Interface Overview" Version 00.0446.2 Related Documents[1] PLAS9-X AT Command Set[2] PLAS9-X Release Note[3] Application Note 48: SMT Module Integration[4] Universal Serial Bus Specification Revision 3.0 [5] Universal Serial Bus Specification Revision 2.0 6.3 Terms and AbbreviationsChapter What is new-- Initial document setup.Abbreviation DescriptionANSI American National Standards InstituteARP Antenna Reference PointCA Carrier AggregationCE Conformité Européene (European Conformity)CS Coding SchemeCS Circuit SwitchedCSD Circuit Switched DataDL Downloaddnu Do not useDRX Discontinuous ReceptionDSB Development Support BoardDTX Discontinuous TransmissionEDGE Enhanced Data rates for GSM EvolutionEGSM Extended GSMEMC Electromagnetic CompatibilityESD Electrostatic DischargeETS European Telecommunication Standard
Cinterion® PLAS9-X Hardware Interface Overview6.3 Terms and Abbreviations36PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 34 of 39ETSI European Telecommunications Standards InstituteFCC Federal Communications Commission (U.S.)FDD Frequency Division DuplexGPRS General Packet Radio ServiceGSM Global Standard for Mobile CommunicationsHiZ High ImpedanceHSDPA High Speed Downlink Packet AccessI/O Input/OutputIMEI International Mobile Equipment IdentityISO International Standards OrganizationITU International Telecommunications Unionkbps kbits per secondLED Light Emitting DiodeLGA Land Grid ArrayLTE Long term evolutionMBB Moisture barrier bagMbps Mbits per secondMCS Modulation and Coding SchemeMFBI Multiple Frequency Band IndicatorMIMO Multiple Input Multiple OutputMLCC Multi Layer Ceramic CapacitorMO Mobile OriginatedMS Mobile Station, also referred to as TEMSL Moisture Sensitivity LevelMT Mobile Terminatednc Not connectedNTC Negative Temperature CoefficientPCB Printed Circuit BoardPCL Power Control LevelPCS Personal Communication System, also referred to as GSM 1900PD Pull Down resistorPDU Protocol Data UnitPS Packet SwitchedPSK Phase Shift KeyingPU Pull Up resistorQAM Quadrature Amplitude ModulationAbbreviation Description
Cinterion® PLAS9-X Hardware Interface Overview6.3 Terms and Abbreviations36PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 35 of 39R&TTE Radio and Telecommunication Terminal EquipmentRF Radio Frequencyrfu Reserved for future useROPR Radio Output Power ReductionRTC Real Time ClockRx Receive DirectionSAR Specific Absorption RateSELV Safety Extra Low VoltageSIM Subscriber Identification ModuleSMD Surface Mount DeviceSMS Short Message ServiceSMT Surface Mount TechnologySRAM Static Random Access MemorySRB Signalling Radio BearerTE Terminal EquipmentTPC Transmit Power ControlTS Technical SpecificationTx Transmit DirectionUL UploadUMTS Universal Mobile Telecommunications SystemURC Unsolicited Result CodeUSB Universal Serial BusUICC USIM Integrated Circuit CardUSIM UMTS Subscriber Identification ModuleWCDMA Wideband Code Division Multiple AccessAbbreviation Description
Cinterion® PLAS9-X Hardware Interface Overview6.4 Safety Precaution Notes36PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 36 of 396.4 Safety Precaution NotesThe following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLAS9-X. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-ure to comply with these precautions violates safety standards of design, manufacture and in-tended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-trical equipment in potentially explosive atmospheres can constitute a safety hazard.Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.IMPORTANT!Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.Some networks require that a valid SIM card be properly inserted in the cellular termi-nal or mobile.
Cinterion® PLAS9-X Hardware Interface Overview7 Appendix38PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 37 of 397 Appendix7.1 List of Parts and AccessoriesTable 10: List of parts and accessoriesDescription Supplier Ordering informationPLAS9-X Gemalto M2M Standard module Gemalto M2M IMEI: Packaging unit (ordering) number: L30960-N5130-B100Module label number:L30960-N5130-B100-111. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the module’s shielding or be printed on a label adhered to the module’s shielding.PLAS9-X Evaluation module Gemalto M2M Ordering number: TBD. (PLAS9)DSB75 Support Box Gemalto M2M Ordering number: L36880-N8811-A100Votronic Handset VOTRONIC / Gemalto M2M Gemalto M2M ordering number: L36880-N8301-A107Votronic ordering number: HH-SI-30.3/V1.1/0Votronic Entwicklungs- und Produktionsgesellschaft für elek-tronische Geräte mbHSaarbrücker Str. 866386 St. IngbertGermanyPhone: +49-(0)6 89 4 / 92 55-0Fax: +49-(0)6 89 4 / 92 55-88Email: contact@votronic.comSIM card holder incl. push button ejector and slide-in trayMolex Ordering numbers: 91228 91236Sales contacts are listed in Table 11.U.FL antenna connector Molex or Hirose Sales contacts are listed in Table 11 and Table 12.
Cinterion® PLAS9-X Hardware Interface Overview7.1 List of Parts and Accessories38PLAS9-X_HIO_v00.044 2017-09-19Confidential / PreliminaryPage 38 of 39Table 11: Molex sales contacts (subject to change)MolexFor further information please click:http://www.molex.comMolex Deutschland GmbHOtto-Hahn-Str. 1b69190 WalldorfGermanyPhone: +49-6227-3091-0Fax: +49-6227-3091-8100Email: mxgermany@molex.comAmerican HeadquartersLisle, Illinois 60532U.S.A.Phone: +1-800-78MOLEXFax: +1-630-969-1352Molex China DistributorsBeijing, Room 1311, Tower B, COFCO PlazaNo. 8, Jian Guo Men Nei Street, 100005BeijingP.R. ChinaPhone: +86-10-6526-9628 Fax: +86-10-6526-9730Molex Singapore Pte. Ltd.110, International RoadJurong Town, Singapore 629174Phone: +65-6-268-6868Fax: +65-6-265-6044Molex Japan Co. Ltd.1-5-4 Fukami-Higashi,Yamato-City,Kanagawa, 242-8585 JapanPhone: +81-46-265-2325Fax: +81-46-265-2365Table 12: Hirose sales contacts (subject to change)Hirose Ltd.For further information please click: http://www.hirose.comHirose Electric (U.S.A.) Inc2688 Westhills CourtSimi Valley, CA 93065U.S.A.Phone: +1-805-522-7958Fax: +1-805-522-3217Hirose Electric Europe B.V.German Branch:Herzog-Carl-Strasse 473760 OstfildernGermany Phone: +49-711-456002-1Fax: +49-711-456002-299Email: info@hirose.deHirose Electric Europe B.V.UK Branch:First Floor, St. Andrews House,Caldecotte Lake Business Park,Milton Keynes MK7 8LEGreat BritainPhone: +44-1908-369060Fax: +44-1908-369078Hirose Electric Co., Ltd.5-23, Osaki 5 Chome, Shinagawa-KuTokyo 141JapanPhone: +81-03-3491-9741Fax: +81-03-3493-2933Hirose Electric Europe B.V. Hogehillweg 81101 CC Amsterdam Z-ONetherlandsPhone: +31-20-6557-460Fax: +31-20-6557-469
39 GEMALTO.COM/M2MAbout GemaltoSince 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. We work closely with global mobile network operators to ensure that Cinterion® modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment. Cinterion products integrate seamlessly with Gemalto identity modules, security solutions and licensing and monetization solutions, to streamline development timelines and provide cost efficiencies that improve the bottom line. As an experienced software provider, we help customers manage connectivity, security and quality of service for the long lifecycle of IoT solutions.For more information please visitwww.gemalto.com/m2m, www.facebook.com/gemalto, or Follow@gemaltoIoT on Twitter.Gemalto M2M GmbHWerinherstrasse 8181541 MunichGermany© Gemalto 2017. All rights reserved. Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries.

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