General Dynamics Itronix IX100XUSI-WLBT 802.11bg WLAN Module User Manual WM BG MR 01 25 041406

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802.11g Wireless LAN SiP Module
(WM-BG-MR -01)
Data Sheet Apr 14th.
2006 Rev 2.5
www.usi.com.tw
Data Sheet
of 802.11g
WM-BG-MR -01 B2B Wireless Lan +BT Combo Module
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802.11g Wireless LAN+BT SiP combo Module V2.2
Introduction
The 802.11 Wireless SiP module WM-BG-MR-01
which refers as “SiP-g combo module” is a small
size module that provides full function of 802.11g/b
and Bluetooth class 2 on a tiny module via 60 pins
board to board connector.
This multi- functionality and board to board physical
interface provides 16 bit PC Card /CF+ bus interface
for WiFi and UART for Bluetooth.
The small size & low profile physical design make it
easier for system design to enable high performance
wireless connectivity without space constrain. The
low power consumption (Sleep mode 1.2 mA) and
excellent radio performance make it the best
solution for OEM customers who require embedded
802.11g Wi-Fi + Bluetooth features, such as,
Wireless PDA, Scanner Smart phone, Media player
slim type Notebook, barcode ,mini-Printer, VoIP
phone etc.
Features
Lead Free design which supporting Green
design requirement, RoHS Compliance.
2 wires, hardware signaling BT WiFi coexistence supported.
Small size suitable for low volume system
integration.PCM audio interface
supported.
Low power consumption & excellent
power management performance, extend
battery life.
For 802.11g feature, Marvell “Libertas” chipset
solution is adopted and CSR BlueCore 03-ROM for
Bluetooth. The Radio architecture & high integration
MAC/BB chip provide excellent sensitivity with rich
system performance. Two antenna connectors
provide antenna connectivity for each function.
WM-BG-MR-01 provides outstanding BT WiFi coexistence solution through internal 2 wires ,
hardware interface to optimized connection with
CSR Bluetooth solution even without good antenna
isolation between BT & WiFi module.
2.412-2.484 GHz two SKUs for worldwide
market.
Easy for integration into mobile and
handheld device with flexible system
configuration and antenna design.
In addition to WEP 64/128, WPA and TKIP, AES is
supported to provide the latest security requirement
on your network.
For the software and driver development, USI
provides extensive technical document and
reference software code for the system integration
under the agreement of Marvell International Ltd.
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802.11g Wireless LAN+BT SiP combo Module V2.2
Change Sheet
Rev. Date
Description of change
Approval & Date
Page Par
Change(s)
1.0 10/1/04 All
All
Draft version for Review
2.0 04/11/05 6,15,
1. Executive summary for target available
17,22
date from “the middle of 1Q 2005” to
,23,
“ the end of 2Q”
25~2
2. Output power for 11g is 13 +/- 1dBm
3. Update the mech. Drawing .
4. Modify the function description for
Marvell Transceiver from ”8010” to
“8015”
5. Correct the Pin Definition for xxx_B is
for “active_high”
6. add description for Pin 28;36;43;58 ;
which reserved for BT’s PCM interface ,
make it no confuse in customer reading.
2.1 04/18/05 25
1. correct the pin definition for Pin24 from
“Control signal to enable engineer testing
mode “ to “Output signal to indicate 16 bit IO
operation. This signal is connected to ground at module
side to indicate 16 bit IO..” then Type is for GND to
indicate the module under the mode for 16bit IO.
2.2 04/28/05 24
2.3 10/31/05 2,
1. Pin A10 pin definition change from “ the pin
is open to “This address range is mainly used
for accessing the CIS in Memory Mode. Signal
HA0 is not used in word access mode.” , Type
change from “ No connection” to “Input ,
PD,5VT”
8,
Power Consumption
2.4 11/08/05 25,26
, 27
Add SDIO Pin Definition
2.5 04/14/06 17, all
1. Specify connectors for BT and WiFi
2. Add page numbers
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802.11g Wireless LAN+BT SiP combo Module V2.2
TABLE OF CONTENTS
1.
EXECUTIVE SUMMARY................................................................................................................ 6
2.
DELIVERABLES ............................................................................................................................. 6
3.
REFERENCE DOCUMENTS......................................................................................................... 7
4.
TECHNICAL SPECIFICATION ..................................................................................................... 8
4.1.
ABSOLUTE MAXIMUM RATING ............................................................................................... 8
4.2.
RECOMMENDABLE OPERATION CONDITION ...................................................................... 8
4.2.1.
TEMPERATURE, HUMIDITY............................................................................................. 8
4.2.1.
VOLTAGE AND CURRENT ............................................................................................... 8
BLUETOOTH ...................................................................................................................................... 8
4.3.
COMPACTFLASH SPECIFICATION ......................................................................................... 9
4.3.1.
DC ELECTRICALS ............................................................................................................. 9
4.3.2.
AC ELECTRICALS ............................................................................................................. 9
4.3.3.
COMPACTFLASH PROTOCAL TIMING ......................................................................... 10
4.4.
WIRELESS SPECIFICATIONS................................................................................................ 14
4.5.
RADIO SPECIFICATIONS 802.11G ........................................................................................ 15
4.6.
RADIO SPECIFICATIONS 802.15 BLUETOOTH ................................................................... 15
4.7.
BLUETOOTH RADIO CHARACTERISTICS............................................................................ 16
4.8.
DIMENSIONS, WEIGHT AND MOUNTING............................................................................. 17
4.8.1.
DIMENSIONS ................................................................................................................... 17
4.8.2.
WEIGHT............................................................................................................................ 17
4.8.3.
MOUNTING ...................................................................................................................... 17
4.9.
SHOCK AND VIBRATION........................................................................................................ 17
5.
COMPATIBILITY AND INTEROPERABILITY ......................................................................... 18
5.1.
5.2.
WI-FI LOGO..................................................................................................................................
WHQL COMPLIANCE ..................................................................................................................
6.
CONFIGURABILITY ..................................................................................................................... 19
7.
OPERATING SYSTEM COMPATIBILITY................................................................................. 20
8.
LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS ..................................... 20
8.1.
8.2.
8.3.
8.4.
8.5.
8.6.
9.
EMC .......................................................................................................................................... 20
PRODUCT SAFETY SPECIFICATION.................................................................................... 20
COMPONENT SPECIFICATION ............................................................................................. 20
RADIO REQUIREMENTS AND APPROVALS ........................................................................ 21
PRODUCT MARKING .............................................................................................................. 22
ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS .................................................... 22
FUNCTIONAL DESCRIPTION................................................................................................ 23
9.1.
HARDWARE ............................................................................................................................. 23
9.2.
HOST INTERFACE .................................................................................................................. 24
9.2.1.
LED INTERFACE ............................................................................................................. 27
9.2.2.
ANTENNA INTERFACE ................................................................................................... 28
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802.11g Wireless LAN+BT SiP combo Module V2.2
9.2.3.
BLUETOOTH INTERFACE .............................................................................................. 28
9.3.
SOFTWARE.............................................................................................................................. 28
10.
DESIGN FOR EXCELLENCE (DFX)...................................................................................... 28
10.1.
10.2.
TESTABILITY ........................................................................................................................... 28
LOGISTICS............................................................................................................................... 29
11.
HUMAN FACTORS ................................................................................................................... 29
12.
INDUSTRIAL DESIGN.............................................................................................................. 29
13.
RELIABILITY.............................................................................................................................. 29
14.
PACKAGE .................................................................................................................................. 29
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802.11g Wireless LAN+BT SiP combo Module V2.2
1. EXECUTIVE SUMMARY
The WM-BG-MR-01 module - is one of the product families in USI’s product offering, targeting for
system integration requiring a smaller form factor. It also provides the standard migration to high
data rate to USI’s current SIP customers. The WM-BG-MR-01 module providing B to B type
connector is provided as option for customers, who want to have Board to board type assembly.
This document outlines the product requirements for a “system in Package” 802.11g/(b) combo module –
here after referred as WM-BG-MR-01 Module.
This product is targeted for first shipments by end of 2Q 2005 and is designated for use in
embedded applications mainly in the mobile device, which required, small size and high data rate
wireless connectivity. The application such as, Wireless PDA, slim type Notebook, Media Adapter,
Barcode scanner, mini-Printer, VoIP phone, Data storage device could be the potential application
for wireless WM-BG-MR-01.
2. DELIVERABLES
The following products and software will be part of the product.
WM-BG-MR-01 Module with packaging
Evaluation kits, including application (CF, PCMCIA Adapter card, RF cable with SMA
connector, antenna),
Software utility which supporting customer for integration, performance test, and
homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the
WM-BG-MR-01 module.
Unit Test / Qualification report
Product Specifications.
Agency certification pre-test report base on adapter boards
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802.11g Wireless LAN+BT SiP combo Module V2.2
3. REFERENCE DOCUMENTS
C.I.S.P.R.
Pub. 22
"Limits and methods of measurement of radio interference
characteristics of information technology equipment." International
Special Committee on Radio Interference (C.I.S.P.R.), Third Edition,
1997.
CB Bulletin
No. 96A
"Adherence to IEC Standards: “Requirements for IEC 950, 2nd Edition
and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product
Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing
to Standards for Safety of Electrical Equipment (IECEE), April 2000.
CFR 47,
Part 15-B
"Unintentional Radiators". Title 47 of the Code of Federal Regulations,
Part 15, FCC Rules, Radio Frequency Devices, Subpart B.
CFR 47,
Part 15-C
"Intentional Radiators". Title 47 of the Code of Federal Regulations,
Part
15,
FCC
Rules,
Subpart
C.
URL:
http://www.access.gpo.gov/nara/cfr/waisidx_98/47cfr15_98.html
CSA C22.2
No. 950-95
"Safety of Information Technology Equipment including Electrical
Business Equipment, Third Edition." Canadian Standards Association,
1995, including revised pages through July 1997.
EN 60 950
"Safety of Information Technology Equipment Including Electrical
Business Equipment." European Committee for Electrotechnical
Standardization (CENELEC), 1996, (IEC 950, Second Edition, including
Amendment 1, 2, 3 and 4).
IEC 950
"Safety of Information Technology Equipment Including Electrical
Business Equipment." European Committee for Electrotechnical
Standardization, Intentional Electrotechnical Commission. 1991, Second
Edition, including Amendments 1, 2, 3, and 4.
IEEE 802.11
“Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY)
Specifications.” Institute of Electrical and Electronics Engineers. 1999.
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802.11g Wireless LAN+BT SiP combo Module V2.2
4. TECHNICAL SPECIFICATION
The WM-BG-MR-01 is a B2B type assembly part, technical supporting, package
requirement needs to be taken into consideration.
4.1. ABSOLUTE MAXIMUM RATING
Supply Power
Non Operating Temperature
Voltage ripple
Max +3.6 Volt
- 40° to 85° Celsius
+/- 2%
Max. Values not exceeding Operating
voltage
4.2. RECOMMENDABLE OPERATION CONDITION
4.2.1. TEMPERATURE, HUMIDITY
The WM-BG-MR-01 module has to withstand the operational requirements as listed in the
table below.
Operating Temperature
Humidity range
-20° to 60° Celsius
Max 95%
Non condensing, relative humidity
4.2.1. VOLTAGE AND CURRENT
Power supply for the WM-BG-MR-01 module will be provided by the host via the power pins
There will be separated power source for WiFi and Bluetooth.
802.11 g(b)
Voltage : VDD
Operating Voltage
Current
Transmit
Receive
Deep Sleep
Inrush current
3.3 Volt
+- 10%
480 mA
275 mA
1.2mA
3000 mA
Typical @54Mbps, 12dbm
Typical@54Mbps, -70dbm
Average
Max.
The power consumption is standard related.
Bluetooth
Voltage : VDD
Operating Voltage
3.3 Volt
+- 10%
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802.11g Wireless LAN+BT SiP combo Module V2.2
Current
Transmit
Receive
Deep Sleep
50 mA
40 mA
100 uA
Typical
Typical
Max
4.3. COMPACTFLASH SPECIFICATION
4.3.1. DC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD=3.3V
Symbol Parameter
Input high voltage
VIH
Input low voltage
VIL
Output high voltage
VOH
Output low voltage
VOL
Condition
Min
Typ
Max
0.5 VDD
-0.5
2.4
VDD+0.5
0.35VDD
0.4
Units
4.3.2. AC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD = 3.3V
Symbol
Parameter
Input
high voltage
IOH
Input low voltage
IOL
Output
high voltage
VOH
Output low voltage
VOL
Condition
=0.7 VDD
=0.18VDD
0.2VDD- 0.6VDD
0.6VDD-0.2VDD
Min
11.3
10.5
2.4
Typ
Max
Units
0.518
0.592
32
38
4.0
4.0
mA
mA
V/ns
V/ns
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802.11g Wireless LAN+BT SiP combo Module V2.2
4.3.3. COMPACTFLASH PROTOCAL TIMING
4.3.3.1. RESET SPECIFICATION
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10
802.11g Wireless LAN+BT SiP combo Module V2.2
4.3.3.2. ATTRIBUTE MEMORY READ/WRITE TIMING SPECIFICATION
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11
802.11g Wireless LAN+BT SiP combo Module V2.2
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12
802.11g Wireless LAN+BT SiP combo Module V2.2
4.3.3.3. I/O READ/WRITE TIMING SPECIFICATION
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13
802.11g Wireless LAN+BT SiP combo Module V2.2
4.4. WIRELESS SPECIFICATIONS
The WM-BG-MR-01 module comply with the following features and standards;
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14
802.11g Wireless LAN+BT SiP combo Module V2.2
Features
WLAN Standards
Bluetooth
Antenna Connector
Coexistence
Frequency Band
Description
IEEE 802 Part 11b/g (802.11b/g)
BluetoothTM 1.1 and 1.2 compliance
Two antenna connectors support 802.11b/g and BT one for each.
Hardware signaling
2.400 – 2.484 GHz
4.5. RADIO SPECIFICATIONS 802.11G
Features
Frequency Band
Number of selectable
channels
Modulation
Description
2.4000 – 2.497 GHz (2.4 GHz ISM Band)
Sub 14 channels
Supported rates
Maximum receive level
Output Power
OFDM, DSSS (Direct Sequence Spread Spectrum),
DBPSK, DQPSK, CCK , 16QAM, 64QAM
1,2, 5.5,11,6,9,12,24,36,48,54 Mbps
- 10dBm (with PER < 8%)
14 dBm +1.5/-1.0 dBm for 1, 2, 5.5, 11Mbps
14 dBm +/- 1.0 dBm for 6, 9Mbps
12 dBm +/- 1.0 dBm for > 12Mbps
Receiver Characteristics
Typical
Max.
Unit
PER <8%, Rx Sensitivity @ 11 Mbps
-87
-85
dBm
PER <8%, Rx Sensitivity @ 5.5 Mbps
-89
-87
dBm
PER <8%, Rx Sensitivity @ 2 Mbps
-90
-88
dBm
PER <8%, Rx Sensitivity @ 1 Mbps
-92
-90
DBm
PER <10%, Rx Sensitivity @ 54 Mbps
-72
-70
DBm
( 3.3V, 25 degree C )
4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH
The Radio specification is compliant with the BluetoothTM 1.1 and 1.2 class 2 specification
Features
Frequency Band
Number of Channels
Description
2400 ~ 2483.5 MHz
79 channels
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15
802.11g Wireless LAN+BT SiP combo Module V2.2
Modulation
Antenna Connector
FHSS (Frequency Hopping Spread Spectrum) ,
GFSK
One Hirose W.FL –R –SMT(10) RF connector
4.7. BLUETOOTH RADIO CHARACTERISTICS
Features
Description
Maximum Receive Level
3 dBm ( Typical )
Output Power
1 dBm ( Typical )
Sensitivity
-81 dbm @ 0.1% BER @ 25 ° Celsius ( Typical )
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16
802.11g Wireless LAN+BT SiP combo Module V2.2
4.8. DIMENSIONS, WEIGHT AND MOUNTING
The following paragraphs provide the requirements for the size, weight and mounting of the
WM-BG-MR-01 module.
4.8.1. DIMENSIONS
The size and thickness of the WM-BG-MR-01 module is listed below:
Antenna
connector for
WiFi
Antenna connector
for BT
The height – will be finalized after the module design is frozen.
4.8.2. WEIGHT
Weight shall not exceed 10 gram including the shielding.
4.8.3. MOUNTING
The WM-BG-MR-01 module is B2B mounted type component. The B2B connector and additional
screw hole provide mounting mechanism to secure the WM-BG-MR-01 module against vibration and
shock on the host system.
4.9. SHOCK AND VIBRATION
All shock and vibration test will be performed by using an interface adapter card. Additional
shock and vibration tests can be performed – on request – by using the real host being PDA,
Textbook or any other application. The interface card will provide mounting facility base on the
recommendation /application guide provided.
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17
802.11g Wireless LAN+BT SiP combo Module V2.2
Vibration
Operating
Non-Operational
Shock
Operational
Non-Operational
Frequency sweep from 3-150-3 Hz with a constant 0.25 G
input
Frequency sweep from 3-150-3 Hz with a constant 0.5 G input
25 G peak within 3.75 msec in normal base position
65 G peak in 3.75 msec in normal base position.
30 G within 8 msec square or trapezoidal shock in + and direction along the 3 axis. (Total 6 shocks)
Note: Above tests are executed without packaging material.
5.
COMPATIBILITY AND INTEROPERABILITY
5.1 WIRELESS LAN
5.1.1 FEATURES
z 802.11 b/g
z WEP Encryption (64bit/128bit)
z IEEE power save mode
z Deep Sleep Mode
z Infrastructure & Ad-Hoc Mode
z Rate adaptation
z WPA TKIP security
z WPA2 (Linux ready)
z 802.1x support
z AES
5.1.2 OPERATING SYSTEMS
z WinCE 4.2/5.0, Windows Mobile 2003, Windows Mobile 5.0
z Certification tool support
z Configuration Utility support
Linux: Slakeware 9.1, Fedora Core 1.0
Kernel: 2.4.22 & above
Certification tool support
Configuration Utility support (Wireless extension support)
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18
802.11g Wireless LAN+BT SiP combo Module V2.2
5.2 BLUETOOTH KEY FEATURES OF THE HCI STACK
5.2.1 NEW BLUETOOTH V1.2 MANDATORY FUNCTIONALITY
z Adaptive Frequency Hopping (AFH)
z Faster Connections
z Flow and Flush Timeout
z LMP Improvements
z Parameter Ranges
5.2.2 OPTIONAL V1.2 FUNCTIONALITY SUPPORTED
z Extended SCO (eSCO), eV3+CRC,eV4,eV5.
z Scatter mode
z LMP Absence Masks, Quality of service and SCO handle
z L2CAP flow and error control
z Synchronisation
5.2.3 STANDARD BLUETOOTH FUNCTIONALITY
z Bluetooth components: Baseband (including LC), LM and HCI
z Standard USB v2.0 and UART (H5) HCI Transport Layers
z All standard radio packet types
z Full Bluetooth data rate, up to 723.2kbps asymmetric
z Operation with up to seven active slaves
z Maximum number of simultaneous active ACL connections:7
z Maximum number of simultaneous active SCO connections:3
z Operation with up to three SCO links, routed to one or more slaves
z Scattermet 2.5 operation
z All standard SCO voice coding, plus “transparent SCO”
z Standard operating modes: page, inquiry, page-scan and inquiry-scan
z All standard pairing, authentication, link key and encryption operations
z Standard Bluetooth power saving mechanisms: Hold, Sniff and Park
modes, including “Forced Hold”
z Dynamic control of peers’ transmit power via LMP
z Master/Slave switch
z Broadcast
z Channel quality driven data rate
z All standard Bluetooth Test Modes
6. CONFIGURABILITY
No user configuration needed. The CIS and MAC Address will be loaded during production of
the WM-BG-MR-01 module.
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19
802.11g Wireless LAN+BT SiP combo Module V2.2
7. OPERATING SYSTEM COMPATIBILITY
Drivers are supported for the following OS:
Windows CE 3.0 /4.2/5.0, PPC2003, 2004, 2005
Linux.
8. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS
The WM-BG-MR-01 module is pre-tested to ensure that all requirements met as set forth in the
following sections.
Final certification (module certification) requires the antenna of targeted system with a leadtime of 6 weeks. The product deliverable shall be a pre-tested WM-BG-MR-01 module. No
module level certification on WM-BG-MR-01 module.
8.1. EMC
The module will be pre-tested to ensure that we can certify the product in the following
countries when final certification will be performed on products and or platforms.
US. FCC CFR47 Part 15-B, Class B
Canada. CSA C22.2, Class B
Europe. 89/336/EEC, EMC Directive, including CE Mark
ETS300 826, EMC standard for 2.4GHz wideband transmission systems
EN55022, Class B (Emissions)
EN50082-1 (Immunity)
EN61000-3-2 (Harmonic AC current emissions)
Japan. VCCI Standard, Class 2 (Emissions)
Korea (MIC)
8.2. PRODUCT SAFETY SPECIFICATION
The WM-BG-MR-01 module is tested and pass successfully the following criteria;
The testing is to assure the quality of safety requirement on module. Final certification will
be conducted on system level.
UL1950 /CSA C22.2.950
EN60 950 (IEC 950)
CB scheme certification from National certification body as listed in CB bulletin No. 96A.
8.3. COMPONENT SPECIFICATION
All components used in this device meet the following component approval requirements.
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802.11g Wireless LAN+BT SiP combo Module V2.2
PRINTED WIRING BOARDS: The printed wiring boards shall be Underwriters
Laboratories Inc. "Recognized Component" (ZPMV2) under the category for Printed
Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board
material shall be rated 130°C minimum.
CONNECTORS: Any connectors, if used, shall be Underwriters Laboratories, Inc.
"Recognized" (ECBT2/RTRT2) in accordance with the requirements in the UL Standard
for Safety, UL 498. Any polymeric connector housing shall be molded of plastics rated
UL 94V-2 or less flammable when tested to UL 94.
WIRING: Any wiring material, if used, shall be UL Recognized Component Appliance
Wiring Material (AVLV2). Wire shall be minimum rated 30V, 105°C.
PLASTIC PARTS - Any plastic parts used shall be molded of plastics that are UL
"Recognized" (QFMZ2) and rated UL 94V-2 or less flammable when tested to UL 94.
“PB FREE” - The entire component Suppliers has to support Green requirement base on
USI’s policy. All of the components which including process and materials has to be Lead
Free.
8.4. RADIO REQUIREMENTS AND APPROVALS
The WM-BG-MR-01 module is tested with adapter card to comply with following standard.
The testing is to assure the performance of regulatory requirement on module. Final
certification will be conducted on system level.
US/CAN:
FCC CFR47 Part 15.247
Japan:
TELEC
Korea:
MIC
Europe: ETS 300-328 V1.6.1
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802.11g Wireless LAN+BT SiP combo Module V2.2
8.5. PRODUCT MARKING
The Module is marked by laser marking which containing the following information:
Description:
Serial number:
Revision:
WM-BG-XX-XX
yyllwkxxxx
format to follow USI revision level in PDM System
For the serial number the following format will be followed:
yy = last two digits of current year
ll = Assembly Location:
UT = USI Taiwan
UM = USI Mexico
UC = USI China
wk = current week (week period = starting on Monday)
xxxx = consecutive number, starting at 0000 at beginning of each week.
8.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS
The use of polychlorinated biphenyls (PCB’s) is prohibited (specifically) as dielectric in
capacitors or transformers.
Electrolytic capacitors shall not be composed of any quaternary salt ammonium and/or
gamma-butyrolactone (i.e. no el caps allowed).
No CFC's (chlorofluorocarbons) shall be used anywhere in the manufacture of this product.
The use of tantalum capacitors should be minimized in any product of the product family
[including the power-supply]. Where the use of tantalum caps cannot be avoided, provisions
must be made in the manufacturing process to prevent reverse polarization.
The WM-BG-MR-01 module hardware design should take the safety of operation into
consideration and prevent the potential risk on Labor safety for manufacturing process.
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22
802.11g Wireless LAN+BT SiP combo Module V2.2
9. FUNCTIONAL DESCRIPTION
The WM-BG-MR-01 module provides and interfaces between Compaq Flash or PC Card
Interface, SDIO , SPI which suitable for wide range high-end processors or low cost ARM7 or
other similar type of processors.
The core of the WM-BG-MR-01 module is the Marvell 88W83 Chipset solution.
The module is design base on the Marvell Libertas solution which contain the flip chip package
MAC/BB chip - 88W8385 , The transceiver 88W8015 low profile package IC to reduce the size
of module. All the other components can be implement by all means to reach the mechanical
specification.
A simplified block diagram of the WM-BG-MR-01 module is depicted in the Fig. below.
88W8385
To be updated with BT
9.1. HARDWARE
The following sections provide the requirements for the different physical interfaces of the
wireless module :
Host Interface
Antenna connections
LED control signal
Bluetooth WiFi coexistence control signals
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23
802.11g Wireless LAN+BT SiP combo Module V2.2
Power
GND
9.2. HOST INTERFACE
The host interface will be compatible with CompactFlash (PCMCIA) standard, 16 bit I/O bus.
Signals which are not used won’t be routed to the physical interface (connector). The host
interface of Combo SiP Bluetooth portion is compliant with UART interface, the default baud
rate setting is 115.2kbps and the optional range is from 9.6kbps to 921.6kbps.
On Board connector
Molex 53794-0608 or 55560-0607
Datasheet_Molex_53
794-0608.pdf
[Socket, 60 pins, with positioning protection, stack
height which is able to support 1.5 mm]
Datasheet_Molex_55
560-0607.pdf
Host System:
Host System Connector
Molex 54722-0607
[Header, 60 pins, with positioning protection, stack height 1.5mm]
Datasheet_Molex_54
722-0607.pdf
Pin definition
[ …] means optional function of the pin.
PD : Signal pull down internally in the chip by 50K ohm while initialization.
PU : Signal pull up internally in the chip by 100K ohm while initialization.
5VT: 5 Volt tolerance pin
xxx_B : Signal pins end with _B are “active high”
Pin #
Definition
WM-BG- CF+
MR-01
GND
D03
D04
D05
Draft Description
Type
interface
GND
HD3
HD4
HD5
GND
IO, PU, 4mA
CompactFlash Data bit[3]
CompactFlash Data bit[4]
CompactFlash Data bit[5]
IO, PU, 4mA
IO, PU, 4mA
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24
802.11g Wireless LAN+BT SiP combo Module V2.2
D06
D07
-CE_1
HD6
HD7
HCE1_B
CompactFlash Data bit[6]
IO, PU, 4mA
CompactFlash Data bit[7]
IO, PU, 4mA
Card Enable1 is driven by the host Input, PU
system and is used as select strobe in
both I/O and memory mode. Enables
even numbered address bytes.
HA10
CompactFlash Address bit [10]. See Input, PU
address bit [0] description.
HOE_B
OUTPUT ENABLE is driven by the host Input, PU
during a memory Read Access.
SD_CMD : SDIO Command Line
HA9
CompactFlash Address bit [9]. See Input, PU
address bit [0] description.
SD_DATA2 : SDIO DATA LINE 2
HA8
CompactFlash Address bit [8]. See Input, PU
address bit [0] description.
HA7
CompactFlash Address bit [7]. See Input, PU
address bit [0] description.
VCC_WLA 3.3V supply voltage for WLAN
Input 3.3 V
HA6
CompactFlash Address bit [6]. See Input, PU
address bit [0] description.
HA5
CompactFlash Address bit [5]. See Input, PU
address bit [0] description.
HA4
CompactFlash Address bit [4]. See Input, PU
address bit [0] description.
HA3
CompactFlash Address bit [3]. See Input, PU
address bit [0] description.
HA2
CompactFlash Address bit [2]. See Input, PU
address bit [0] description.
HA1
CompactFlash Address bit [1]. See Input, PU
address bit [0] description.
A10
-OE
SD_CMD
10
A09
SD_DAT2
11
A08
12
A07
13
VCC
14
A06
15
A05
16
A04
17
A03
18
A02
19
A01
20
A00
21
22
23
24
D00
D01
D02
-IOIS16
25
-CD2
26
N/A
TXD_B
UART Data output, Active High
Output, WPU, 1µA
27
N/A
RTS_B
UART Request to send, Active low,
Tristatable, Pulled-up
Output, WPU, 1µA
28
N/A
PCM_In
29
N/A
Synchronous Data input
VCC_WLA 3.3V power supply for WLAN
HA0
CompactFlash Address bit [0]. The Input, PU
address lines A[10:00] along with
the REG signal are used to select the
following:
• The I/O port address register
• The memory mapped port address
register
• A byte in the card's information
structure (CIS)
HD0
CompactFlash Data bit[0]
IO, PU, 4mA
HD1
CompactFlash Data bit[1]
IO, PU, 4mA
HD2
CompactFlash Data bit[2]
IO, PU, 4mA
HIOIS16_ I/O port is 16bits
Out, 6mA
CD2
Normal operation, this pin is functionally Out, 6mA
for card detection.
Input
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25
802.11g Wireless LAN+BT SiP combo Module V2.2
30
GND
GND
31
GND
GND
32
D10
HD10
CompactFlash Data bit[10]
33
34
35
D09
D08
-STSCHG
CompactFlash Data bit[9]
CompactFlash Data bit[8]
Card status changed
36
-SPKR
HD9
HD8
HSTSCHG
_B
PCM_Sync
37
-REG
HREG_B
Register select and I/O enable
38
-INPACK
39
-WAIT
40
RESET
41
N/A
42
N/A
43
N/A
HINPACK_ INPUT ACKNOWLEDGE is driven by WM- Output, 2mA
BG-MR-01. Is asserted when the device
is selected and the device is responding
to an I/O Read command.
HWAIT_B HWAIT_B is driven by WM-BG-MR-01 and Output, 4mA
allows for extending the memory or I/O
cycle
HRESET
Input, PU
Used to asynchronously reset WLAN.
High active.
N/A
Reserved. Keep connection open on Host N/A
side
WLAN_LED WLAN LED control signal, driven the LED
_B
indicating the link status of WLAN. Active Output, 4mA
low.
PCM_OUT Synchronous Data output
44
IREQ
IREQ_B
45
-WE
46
-IOWR
SD_DAT3
47
-IORD
SD_DAT1
48
-VS1
49
-CE2
SD_CLK
IO, PU, 4mA
IO, PU, 4mA
IO, PU, 4mA
Output, 4mA
Synchronous Data strobe
Input PD, 4mA
Input, PU
Ready/Busy or Interrupt request.
Output, 4mA
In memory mode, this signal indicates
the ready or busy status of the card.
When held high, the card is ready to
accept a new data transfer. When held
low the card is busy.
In I/O mode, this signal is used to
indicate an interrupt condition.
HWE_B
WRITE ENABLE is driven by the host Input, PU
during a memory Write Access
HIOWR_B I/O Write Strobe is driven by the host Input, PU
and is asserted when the host wants to
write to an on-chip I/O register
SD_DAT3 : SDIO DATA LINE 3
HIORD_B I/O Read Strobe is driven by the host Input, PU
and is asserted when the host wants to
read from an on-chip I/O register
SD_DAT1 : SDIO DATA LINE 1
-VS1
This pin is connected to Ground on
module to indicate the voltage of this GND
module is 3.3V card.
HCE2_B
CARD ENABLE2 is driven by the host Input, PU
system and is used as select strobe in
both I/O and memory mode. Enables odd
numbered address bytes
SD_CLK : SDIO CLOCK
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26
802.11g Wireless LAN+BT SiP combo Module V2.2
50
51
52
53
54
55
D15
D14
D13
D12
D11
N/A
HD15
HD14
HD13
HD12
HD11
BT_LED_B
56
N/A
RXD_B
57
N/A
CTS_B
58
N/A
SD_DAT0
PCM_CLK
59
N/A
VCC_BT
60
GND
CompactFlash Data bit[15]
CompactFlash Data bit[14]
CompactFlash Data bit[13]
CompactFlash Data bit[12]
CompactFlash Data bit[11]
BT LED control signal which drives the
LED to indicate the activity of Bluetooth.
Active low.
UART Data input, active High, Pulled
down (weak)
UART Clear to Send, Active low, Pulled
down (weak)
IO, PU, 4mA
IO, PU, 4mA
IO, PU, 4mA
IO, PU, 4mA
IO, PU, 4mA
Output, 4mA
Input, WPD, 1µA
Input, WPD, 1µA
Synchronous Data clock
SD_DAT0 : SDIO DATA LINE 0
3.3V supply voltage for Bluetooth
Input
GND
Pin 1
Pin 59
Pin 60
Pin 60
Pin 59
Fig 1: Pin 1 assignment and indication Drawing
( To be updated with latest design)
9.2.1. LED INTERFACE
The Wireless Module will provide two control signals to the host and capable to drive an LED
to indicate the connectivity and operating status.
The WM-BG-MR-01 have 2 LED’s (output) via 60 pins connector for feedback to the user on
the current WLAN activity state. The signaling will reflect status / activity as described in the
table below. Those two signals are provided via the board to board connector with the
following pin assignment.
Pin No
Pin description
Function description
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27
802.11g Wireless LAN+BT SiP combo Module V2.2
42
WLAN_LED
55
BT_LED_B
Check firmware specification
of GPIO(1) with Marvell
Link activity of Bluetooth
9.2.2. ANTENNA INTERFACE
No antenna diversity supported on the Wireless Module.
The output impedance of the cable is 50 Ohms.
Antenna Connector: Hirose W-FL-R-SMT(10)
9.2.3. BLUETOOTH INTERFACE
There are interfaces signal to routed between WiFi and Bluetooth to provide coexistence with
802.15 Bluetooth modules.
The BT co-existence interface supported, which is 2 Wire CSR co-existence.
The control signals are provided via the 60 pins B2B connector with the interface defined as
below:
Symbol
BTACT
WLAN_active
Interface
“Signal name” & description
2 Wire-CSR
“BT _Priority”
This pin indicates to WLAN BCA device that BT module is
active or will soon be active to TX/RX stage.
2 Wire-CSR
“Wlan_Active”, This pin indicates to BT module that WLAN
is active or will soon be active to TX/RX stage.
Note 1: “WLAN BCA” device is a functional block in 88W8385 works as Bluetooth co-existence management .
9.3. SOFTWARE
The following source code will be provided for porting to the embedded system under the SLA
with chipset supplier
Linux source code
Source code of development utility base on Windows CE
10. DESIGN FOR EXCELLENCE (DFX)
10.1. TESTABILITY
The WM-BG-MR-01 module can be tested on the by using adapter card or similar interface.
The adapter card must be such that from the FTS the WM-BG-MR-01 module is seen and
recognized as PC Card or Compaq Flash.
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28
802.11g Wireless LAN+BT SiP combo Module V2.2
No additional test pins are required to support in-circuit testing.
10.2. LOGISTICS
All customer specific requirements – customization – will be implemented at the highest
possible level to support build to order and keep the number of modules in SMT to a minimum.
Additional module variants might be added base on business potential.
11. HUMAN FACTORS
Due to the nature of this product (embedded module) no human factors required
12. INDUSTRIAL DESIGN
Due to the nature of this product (embedded module) no industrial design requirements are
required.
13. RELIABILITY
The WM-BG-MR-01 module guarantee an MTBF of 150,000 hrs based on an ambient
temperature and workload of 2,920 hours. The workload is based on a unit working for 8 hours
per day, 365 days per year.
The MTBF estimation base on is Bell code standard, Class II.
14. PACKAGE
To be updated.
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29
802.11g Wireless LAN+BT SiP combo Module V2.2
Marvell is Trademark of 3’rd Party.
For Additional information, please contact the following:
Universal Scientific Industrial Co., Ltd.
Headquarters
141, Lane 351, Taiping Road, Sec. 1, Tsao-Tuen, Taiwan,
Http://www.usi.com.tw
Tel: + 886-49-2350876, 2325876
Fax: +886-49-3439561, 2337360,2351093
E-mail:usi@ms.usi.com.tw
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30

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