General Dynamics Itronix IX100XUSI-WLBT 802.11bg WLAN Module User Manual WM BG MR 01 25 041406

General Dynamics Itronix Corporation 802.11bg WLAN Module WM BG MR 01 25 041406

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integrator manual

All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 1 Data Sheet of 802.11g WM-BG-MR -01 B2B Wireless Lan +BT Combo Module Data Sheet Apr 14th. 2006 Rev 2.5 802.11g Wireless LAN SiP Module (WM-BG-MR -01) www.usi.com.tw
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 2Introduction The 802.11 Wireless SiP module WM-BG-MR-01 which refers as “SiP-g combo module” is a small size module that provides full function of 802.11g/b and Bluetooth class 2 on a tiny module via 60 pins board to board connector. This multi- functionality and board to board physical interface provides 16 bit PC Card /CF+ bus interface for WiFi and UART for Bluetooth. The small size & low profile physical design make it easier for system design to enable high performance wireless connectivity without space constrain. The low power consumption (Sleep mode 1.2 mA) and excellent radio performance make it the best solution for OEM customers who require embedded 802.11g Wi-Fi + Bluetooth features, such as, Wireless PDA, Scanner Smart phone, Media player slim type Notebook, barcode ,mini-Printer, VoIP phone etc. For 802.11g feature, Marvell “Libertas” chipset solution is adopted and CSR BlueCore 03-ROM for Bluetooth. The Radio architecture & high integration MAC/BB chip provide excellent sensitivity with rich system performance. Two antenna connectors provide antenna connectivity for each function. WM-BG-MR-01 provides outstanding BT WiFi co-existence solution through internal 2 wires , hardware interface to optimized connection with CSR Bluetooth solution even without good antenna isolation between BT & WiFi module. In addition to WEP 64/128, WPA and TKIP, AES is supported to provide the latest security requirement on your network. For the software and driver development, USI provides extensive technical document and reference software code for the system integration under the agreement of Marvell International Ltd. Features z Lead Free design which supporting Green design requirement, RoHS Compliance. z 2 wires, hardware signaling BT WiFi co-existence supported. z Small size suitable for low volume system integration.PCM audio interface supported. z Low power consumption & excellent power management performance, extend battery life. z 2.412-2.484 GHz two SKUs for worldwide market. z Easy for integration into mobile and handheld device with flexible system configuration and antenna design.
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 3 Change Sheet Rev. Date Description of change Approval & Date Page Par Change(s) 1.0 10/1/04 All All Draft version for Review 2.0 04/11/05 6,15,17,22,23, 25~27 1. Executive summary for target available date from “the middle of 1Q 2005” to “ the end of 2Q” 2. Output power for 11g is 13 +/- 1dBm 3. Update the mech. Drawing . 4. Modify the function description for Marvell Transceiver from ”8010” to “8015” 5. Correct the Pin Definition for xxx_B is for “active_high” 6. add description for Pin 28;36;43;58 ; which reserved for BT’s PCM interface , make it no confuse in customer reading. 2.1 04/18/05 25 1. correct the pin definition for Pin24 from “Control signal to enable engineer testing mode “ to “Output signal to indicate 16 bit IO operation. This signal is connected to ground at module side to indicate 16 bit IO..” then Type is for GND to indicate the module under the mode for 16bit IO. 2.2 04/28/05 24 1. Pin A10 pin definition change from “ the pin is open to “This address range is mainly used for accessing the CIS in Memory Mode. Signal HA0 is not used in word access mode.” , Type change from “ No connection” to “Input , PD,5VT” 2.3 10/31/05 2, 8, 9 Power Consumption 2.4 11/08/05 25,26, 27 Add SDIO Pin Definition 2.5 04/14/06 17, all 1. Specify connectors for BT and WiFi 2. Add page numbers
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 4TABLE OF CONTENTS 1. EXECUTIVE SUMMARY................................................................................................................6 2. DELIVERABLES .............................................................................................................................6 3. REFERENCE DOCUMENTS.........................................................................................................7 4. TECHNICAL SPECIFICATION .....................................................................................................8 4.1. ABSOLUTE MAXIMUM RATING ............................................................................................... 8 4.2. RECOMMENDABLE OPERATION CONDITION ......................................................................8 4.2.1. TEMPERATURE, HUMIDITY............................................................................................. 8 4.2.1. VOLTAGE AND CURRENT ............................................................................................... 8 BLUETOOTH...................................................................................................................................... 8 4.3. COMPACTFLASH SPECIFICATION......................................................................................... 9 4.3.1. DC ELECTRICALS.............................................................................................................9 4.3.2. AC ELECTRICALS ............................................................................................................. 9 4.3.3. COMPACTFLASH PROTOCAL TIMING ......................................................................... 10 4.4. WIRELESS SPECIFICATIONS................................................................................................14 4.5. RADIO SPECIFICATIONS 802.11G ........................................................................................ 15 4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH ................................................................... 15 4.7. BLUETOOTH RADIO CHARACTERISTICS............................................................................16 4.8. DIMENSIONS, WEIGHT AND MOUNTING.............................................................................17 4.8.1. DIMENSIONS ................................................................................................................... 17 4.8.2. WEIGHT............................................................................................................................ 17 4.8.3. MOUNTING ...................................................................................................................... 17 4.9. SHOCK AND VIBRATION........................................................................................................ 17 5. COMPATIBILITY AND INTEROPERABILITY ......................................................................... 18 5.1. WI-FI LOGO.................................................................................................................................. 5.2. WHQL COMPLIANCE .................................................................................................................. 6. CONFIGURABILITY .....................................................................................................................19 7. OPERATING SYSTEM COMPATIBILITY.................................................................................20 8. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS .....................................20 8.1. EMC .......................................................................................................................................... 20 8.2. PRODUCT SAFETY SPECIFICATION.................................................................................... 20 8.3. COMPONENT SPECIFICATION ............................................................................................. 20 8.4. RADIO REQUIREMENTS AND APPROVALS ........................................................................ 21 8.5. PRODUCT MARKING ..............................................................................................................22 8.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS .................................................... 22 9. FUNCTIONAL DESCRIPTION................................................................................................23 9.1. HARDWARE............................................................................................................................. 23 9.2. HOST INTERFACE ..................................................................................................................24 9.2.1. LED INTERFACE .............................................................................................................27 9.2.2. ANTENNA INTERFACE................................................................................................... 28
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 59.2.3. BLUETOOTH INTERFACE .............................................................................................. 28 9.3. SOFTWARE.............................................................................................................................. 28 10. DESIGN FOR EXCELLENCE (DFX)...................................................................................... 28 10.1. TESTABILITY ........................................................................................................................... 28 10.2. LOGISTICS............................................................................................................................... 29 11. HUMAN FACTORS...................................................................................................................29 12. INDUSTRIAL DESIGN..............................................................................................................29 13. RELIABILITY.............................................................................................................................. 29 14. PACKAGE ..................................................................................................................................29
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 6 1. EXECUTIVE SUMMARY The WM-BG-MR-01 module - is one of the product families in USI’s product offering, targeting for system integration requiring a smaller form factor. It also provides the standard migration to high data rate to USI’s current SIP customers. The WM-BG-MR-01 module providing B to B type connector is provided as option for customers, who want to have Board to board type assembly. This document outlines the product requirements for a “system in Package” 802.11g/(b) combo module – here after referred as WM-BG-MR-01 Module. This product is targeted for first shipments by end of 2Q 2005 and is designated for use in embedded applications mainly in the mobile device, which required, small size and high data rate wireless connectivity. The application such as, Wireless PDA, slim type Notebook, Media Adapter, Barcode scanner, mini-Printer, VoIP phone, Data storage device could be the potential application for wireless WM-BG-MR-01. 2. DELIVERABLES The following products and software will be part of the product. WM-BG-MR-01 Module with packaging Evaluation kits, including application (CF, PCMCIA Adapter card, RF cable with SMA connector, antenna), Software utility which supporting customer for integration, performance test, and homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the WM-BG-MR-01 module. Unit Test / Qualification report Product Specifications. Agency certification pre-test report base on adapter boards
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 73. REFERENCE DOCUMENTS C.I.S.P.R. Pub. 22 "Limits and methods of measurement of radio interference characteristics of information technology equipment." International Special Committee on Radio Interference (C.I.S.P.R.), Third Edition, 1997. CB Bulletin No. 96A "Adherence to IEC Standards: “Requirements for IEC 950, 2nd Edition and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing to Standards for Safety of Electrical Equipment (IECEE), April 2000. CFR 47, Part 15-B "Unintentional Radiators". Title 47 of the Code of Federal Regulations, Part 15, FCC Rules, Radio Frequency Devices, Subpart B. CFR 47, Part 15-C "Intentional Radiators". Title 47 of the Code of Federal Regulations, Part 15, FCC Rules, Subpart C. URL: http://www.access.gpo.gov/nara/cfr/waisidx_98/47cfr15_98.html CSA C22.2 No. 950-95 "Safety of Information Technology Equipment including Electrical Business Equipment, Third Edition." Canadian Standards Association, 1995, including revised pages through July 1997. EN 60 950 "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization (CENELEC), 1996, (IEC 950, Second Edition, including Amendment 1, 2, 3 and 4). IEC 950 "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization, Intentional Electrotechnical Commission. 1991, Second Edition, including Amendments 1, 2, 3, and 4. IEEE 802.11 “Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY) Specifications.” Institute of Electrical and Electronics Engineers. 1999.
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 8 4. TECHNICAL SPECIFICATION The WM-BG-MR-01 is a B2B type assembly part, technical supporting, package requirement needs to be taken into consideration. 4.1. ABSOLUTE MAXIMUM RATING Supply Power Max +3.6 Volt Non Operating Temperature - 40° to 85° Celsius Voltage ripple +/- 2% Max. Values not exceeding Operating voltage 4.2. RECOMMENDABLE OPERATION CONDITION 4.2.1. TEMPERATURE, HUMIDITY The WM-BG-MR-01 module has to withstand the operational requirements as listed in the table below. Operating Temperature -20° to 60° Celsius Humidity range Max 95% Non condensing, relative humidity 4.2.1. VOLTAGE AND CURRENT Power supply for the WM-BG-MR-01 module will be provided by the host via the power pins There will be separated power source for WiFi and Bluetooth. 802.11 g(b) Voltage : VDD Operating Voltage 3.3 Volt +- 10% Current Transmit 480 mA Typical @54Mbps, 12dbm Receive 275 mA Typical@54Mbps, -70dbm Deep Sleep 1.2mA Average Inrush current 3000 mA Max. The power consumption is standard related. Bluetooth Voltage : VDD Operating Voltage 3.3 Volt +- 10%
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 9Current Transmit 50 mA Typical Receive 40 mA Typical Deep Sleep 100 uA Max 4.3. COMPACTFLASH SPECIFICATION 4.3.1. DC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended Operation Condition” unless specified. Power supply : VDD=3.3V Symbol Parameter Condition Min Typ Max Units VIH Input high voltage 0.5 VDD - VDD+0.5 V VIL Input low voltage -0.5 - 0.35VDD V VOH Output high voltage 2.4 - - V VOL Output low voltage - - 0.4 V 4.3.2. AC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended Operation Condition” unless specified. Power supply : VDD = 3.3V Symbol Parameter Condition Min Typ Max Units IOH Input high voltage =0.7 VDD 11.3 - 32 mA IOL Input low voltage =0.18VDD 10.5 - 38 mA VOH Output high voltage 0.2VDD- 0.6VDD 2.4 0.518 4.0 V/ns VOL Output low voltage 0.6VDD-0.2VDD - 0.592 4.0 V/ns
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 104.3.3. COMPACTFLASH PROTOCAL TIMING 4.3.3.1. RESET SPECIFICATION
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 114.3.3.2. ATTRIBUTE MEMORY READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 12
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 134.3.3.3. I/O READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 14 4.4. WIRELESS SPECIFICATIONS The WM-BG-MR-01 module comply with the following features and standards;
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 15 Features Description WLAN Standards IEEE 802 Part 11b/g (802.11b/g) Bluetooth BluetoothTM 1.1 and 1.2 compliance Antenna Connector Two antenna connectors support 802.11b/g and BT one for each. Coexistence Hardware signaling Frequency Band 2.400 – 2.484 GHz 4.5. RADIO SPECIFICATIONS 802.11G Features Description Frequency Band 2.4000 – 2.497 GHz (2.4 GHz ISM Band) Number of selectable Sub channels 14 channels Modulation OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK , 16QAM, 64QAM Supported rates 1,2, 5.5,11,6,9,12,24,36,48,54 Mbps Maximum receive level - 10dBm (with PER < 8%) Output Power 14 dBm +1.5/-1.0 dBm for 1, 2, 5.5, 11Mbps 14 dBm +/- 1.0 dBm for 6, 9Mbps 12 dBm +/- 1.0 dBm for > 12Mbps Receiver Characteristics ( 3.3V, 25 degree C ) Typical Max. Unit PER <8%, Rx Sensitivity @ 11 Mbps -87 -85 dBm PER <8%, Rx Sensitivity @ 5.5 Mbps -89 -87 dBm PER <8%, Rx Sensitivity @ 2 Mbps -90 -88 dBm PER <8%, Rx Sensitivity @ 1 Mbps -92 -90 DBm PER <10%, Rx Sensitivity @ 54 Mbps -72 -70 DBm 4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH The Radio specification is compliant with the BluetoothTM 1.1 and 1.2 class 2 specification Features Description Frequency Band 2400 ~ 2483.5 MHz Number of Channels 79 channels
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 16Modulation FHSS (Frequency Hopping Spread Spectrum) , GFSK Antenna Connector One Hirose W.FL –R –SMT(10) RF connector 4.7. BLUETOOTH RADIO CHARACTERISTICS Features Description Maximum Receive Level 3 dBm ( Typical ) Output Power 1 dBm ( Typical ) Sensitivity -81 dbm @ 0.1% BER @ 25 ° Celsius ( Typical )
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 17 4.8. DIMENSIONS, WEIGHT AND MOUNTING The following paragraphs provide the requirements for the size, weight and mounting of the WM-BG-MR-01 module. 4.8.1. DIMENSIONS The size and thickness of the WM-BG-MR-01 module is listed below: The height – will be finalized after the module design is frozen. 4.8.2. WEIGHT Weight shall not exceed 10 gram including the shielding. 4.8.3. MOUNTING The WM-BG-MR-01 module is B2B mounted type component. The B2B connector and additional screw hole provide mounting mechanism to secure the WM-BG-MR-01 module against vibration and shock on the host system. 4.9. SHOCK AND VIBRATION All shock and vibration test will be performed by using an interface adapter card. Additional shock and vibration tests can be performed – on request – by using the real host being PDA, Textbook or any other application. The interface card will provide mounting facility base on the recommendation /application guide provided. Antenna connector for BT Antenna connector for WiFi
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 18 Vibration Operating Frequency sweep from 3-150-3 Hz with a constant 0.25 G input Non-Operational Frequency sweep from 3-150-3 Hz with a constant 0.5 G inputShock Operational 25 G peak within 3.75 msec in normal base position Non-Operational 65 G peak in 3.75 msec in normal base position. 30 G within 8 msec square or trapezoidal shock in + and - direction along the 3 axis. (Total 6 shocks) Note: Above tests are executed without packaging material. 5. COMPATIBILITY AND INTEROPERABILITY 5.1 WIRELESS LAN 5.1.1 FEATURES z 802.11 b/g z WEP Encryption (64bit/128bit) z IEEE power save mode z Deep Sleep Mode z Infrastructure & Ad-Hoc Mode z Rate adaptation z WPA TKIP security z WPA2 (Linux ready) z 802.1x support z AES 5.1.2 OPERATING SYSTEMS z WinCE 4.2/5.0, Windows Mobile 2003, Windows Mobile 5.0 z Certification tool support z Configuration Utility support z Linux: Slakeware 9.1, Fedora Core 1.0 Kernel: 2.4.22 & above Certification tool support Configuration Utility support (Wireless extension support)
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 195.2 BLUETOOTH KEY FEATURES OF THE HCI STACK 5.2.1 NEW BLUETOOTH V1.2 MANDATORY FUNCTIONALITY z Adaptive Frequency Hopping (AFH) z Faster Connections z Flow and Flush Timeout z LMP Improvements z Parameter Ranges 5.2.2 OPTIONAL V1.2 FUNCTIONALITY SUPPORTED z Extended SCO (eSCO), eV3+CRC,eV4,eV5. z Scatter mode z LMP Absence Masks, Quality of service and SCO handle z L2CAP flow and error control z Synchronisation 5.2.3 STANDARD BLUETOOTH FUNCTIONALITY z Bluetooth components: Baseband (including LC), LM and HCI z Standard USB v2.0 and UART (H5) HCI Transport Layers z All standard radio packet types z Full Bluetooth data rate, up to 723.2kbps asymmetric z Operation with up to seven active slaves z Maximum number of simultaneous active ACL connections:7 z Maximum number of simultaneous active SCO connections:3 z Operation with up to three SCO links, routed to one or more slaves z Scattermet 2.5 operation z All standard SCO voice coding, plus “transparent SCO” z Standard operating modes: page, inquiry, page-scan and inquiry-scan z All standard pairing, authentication, link key and encryption operations z Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes, including “Forced Hold” z Dynamic control of peers’ transmit power via LMP z Master/Slave switch z Broadcast z Channel quality driven data rate z All standard Bluetooth Test Modes 6. CONFIGURABILITY No user configuration needed. The CIS and MAC Address will be loaded during production of the WM-BG-MR-01 module.
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 20 7. OPERATING SYSTEM COMPATIBILITY Drivers are supported for the following OS: Windows CE 3.0 /4.2/5.0, PPC2003, 2004, 2005 Linux. 8. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS The WM-BG-MR-01 module is pre-tested to ensure that all requirements met as set forth in the following sections. Final certification (module certification) requires the antenna of targeted system with a lead-time of 6 weeks. The product deliverable shall be a pre-tested WM-BG-MR-01 module. No module level certification on WM-BG-MR-01 module. 8.1. EMC The module will be pre-tested to ensure that we can certify the product in the following countries when final certification will be performed on products and or platforms. US. FCC CFR47 Part 15-B, Class B Canada. CSA C22.2, Class B Europe. 89/336/EEC, EMC Directive, including CE Mark ETS300 826, EMC standard for 2.4GHz wideband transmission systems EN55022, Class B (Emissions) EN50082-1 (Immunity) EN61000-3-2 (Harmonic AC current emissions) Japan. VCCI Standard, Class 2 (Emissions) Korea (MIC) 8.2. PRODUCT SAFETY SPECIFICATION The WM-BG-MR-01 module is tested and pass successfully the following criteria; The testing is to assure the quality of safety requirement on module. Final certification will be conducted on system level. UL1950 /CSA C22.2.950 EN60 950 (IEC 950) CB scheme certification from National certification body as listed in CB bulletin No. 96A. 8.3. COMPONENT SPECIFICATION All components used in this device meet the following component approval requirements.
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 21 PRINTED WIRING BOARDS: The printed wiring boards shall be Underwriters Laboratories Inc. "Recognized Component" (ZPMV2) under the category for Printed Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board material shall be rated 130°C minimum. CONNECTORS: Any connectors, if used, shall be Underwriters Laboratories, Inc. "Recognized" (ECBT2/RTRT2) in accordance with the requirements in the UL Standard for Safety, UL 498. Any polymeric connector housing shall be molded of plastics rated UL 94V-2 or less flammable when tested to UL 94. WIRING: Any wiring material, if used, shall be UL Recognized Component Appliance Wiring Material (AVLV2). Wire shall be minimum rated 30V, 105°C. PLASTIC PARTS - Any plastic parts used shall be molded of plastics that are UL "Recognized" (QFMZ2) and rated UL 94V-2 or less flammable when tested to UL 94. “PB FREE” - The entire component Suppliers has to support Green requirement base on USI’s policy. All of the components which including process and materials has to be Lead Free. 8.4. RADIO REQUIREMENTS AND APPROVALS The WM-BG-MR-01 module is tested with adapter card to comply with following standard. The testing is to assure the performance of regulatory requirement on module. Final certification will be conducted on system level. US/CAN: FCC CFR47 Part 15.247 Japan: TELEC Korea: MIC Europe: ETS 300-328 V1.6.1
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 228.5. PRODUCT MARKING The Module is marked by laser marking which containing the following information: Description: WM-BG-XX-XX Serial number: yyllwkxxxx Revision: format to follow USI revision level in PDM System For the serial number the following format will be followed: yy = last two digits of current year ll = Assembly Location: UT = USI Taiwan UM = USI Mexico UC = USI China wk = current week (week period = starting on Monday) xxxx = consecutive number, starting at 0000 at beginning of each week. 8.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS The use of polychlorinated biphenyls (PCB’s) is prohibited (specifically) as dielectric in capacitors or transformers. Electrolytic capacitors shall not be composed of any quaternary salt ammonium and/or gamma-butyrolactone (i.e. no el caps allowed). No CFC's (chlorofluorocarbons) shall be used anywhere in the manufacture of this product. The use of tantalum capacitors should be minimized in any product of the product family [including the power-supply]. Where the use of tantalum caps cannot be avoided, provisions must be made in the manufacturing process to prevent reverse polarization. The WM-BG-MR-01 module hardware design should take the safety of operation into consideration and prevent the potential risk on Labor safety for manufacturing process.
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 239. FUNCTIONAL DESCRIPTION The WM-BG-MR-01 module provides and interfaces between Compaq Flash or PC Card Interface, SDIO , SPI which suitable for wide range high-end processors or low cost ARM7 or other similar type of processors. The core of the WM-BG-MR-01 module is the Marvell 88W83 Chipset solution. The module is design base on the Marvell Libertas solution which contain the flip chip package MAC/BB chip - 88W8385 , The transceiver 88W8015 low profile package IC to reduce the size of module. All the other components can be implement by all means to reach the mechanical specification. A simplified block diagram of the WM-BG-MR-01 module is depicted in the Fig. below. To be updated with BT 9.1. HARDWARE The following sections provide the requirements for the different physical interfaces of the wireless module : Host Interface Antenna connections LED control signal Bluetooth WiFi coexistence control signals 88W8385
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 24 Power GND 9.2. HOST INTERFACE The host interface will be compatible with CompactFlash (PCMCIA) standard, 16 bit I/O bus. Signals which are not used won’t be routed to the physical interface (connector). The host interface of Combo SiP Bluetooth portion is compliant with UART interface, the default baud rate setting is 115.2kbps and the optional range is from 9.6kbps to 921.6kbps. On Board connector Molex 53794-0608 or 55560-0607 [Socket, 60 pins, with positioning protection, stack height which is able to support 1.5 mm] Datasheet_Molex_53794-0608.pdf Datasheet_Molex_55560-0607.pdf Host System: Host System Connector Molex 54722-0607 [Header, 60 pins, with positioning protection, stack height 1.5mm] Datasheet_Molex_54722-0607.pdf Pin definition [ …] means optional function of the pin. PD : Signal pull down internally in the chip by 50K ohm while initialization. PU : Signal pull up internally in the chip by 100K ohm while initialization. 5VT: 5 Volt tolerance pin xxx_B : Signal pins end with _B are “active high” Pin # Definition Draft Description Type WM-BG-MR-01 CF+ interface 1 GND GND GND 2 D03 HD3 CompactFlash Data bit[3] IO, PU, 4mA 3 D04 HD4 CompactFlash Data bit[4] IO, PU, 4mA 4 D05 HD5 CompactFlash Data bit[5] IO, PU, 4mA
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 255 D06 HD6 CompactFlash Data bit[6] IO, PU, 4mA 6 D07 HD7 CompactFlash Data bit[7] IO, PU, 4mA 7 -CE_1 HCE1_B Card Enable1 is driven by the hostsystem and is used as select strobe inboth I/O and memory mode. Enableseven numbered address bytes. Input, PU 8 A10 HA10 CompactFlash Address bit [10]. Seeaddress bit [0] description. Input, PU 9 -OE SD_CMD HOE_B OUTPUT ENABLE is driven by the hostduring a memory Read Access. SD_CMD : SDIO Command Line Input, PU 10 A09 SD_DAT2 HA9 CompactFlash Address bit [9]. Seeaddress bit [0] description. SD_DATA2 : SDIO DATA LINE 2 Input, PU 11 A08 HA8 CompactFlash Address bit [8]. Seeaddress bit [0] description. Input, PU 12 A07 HA7 CompactFlash Address bit [7]. Seeaddress bit [0] description. Input, PU 13 VCC VCC_WLAN 3.3V supply voltage for WLAN Input 3.3 V 14 A06 HA6 CompactFlash Address bit [6]. Seeaddress bit [0] description. Input, PU 15 A05 HA5 CompactFlash Address bit [5]. Seeaddress bit [0] description. Input, PU 16 A04 HA4 CompactFlash Address bit [4]. Seeaddress bit [0] description. Input, PU 17 A03 HA3 CompactFlash Address bit [3]. Seeaddress bit [0] description. Input, PU 18 A02 HA2 CompactFlash Address bit [2]. Seeaddress bit [0] description. Input, PU 19 A01 HA1 CompactFlash Address bit [1]. Seeaddress bit [0] description. Input, PU 20 A00 HA0 CompactFlash Address bit [0]. Theaddress lines A[10:00] along with the REG signal are used to select thefollowing: • The I/O port address register • The memory mapped port addressregister • A byte in the card's informationstructure (CIS) Input, PU 21 D00 HD0 CompactFlash Data bit[0] IO, PU, 4mA 22 D01 HD1 CompactFlash Data bit[1] IO, PU, 4mA 23 D02 HD2 CompactFlash Data bit[2] IO, PU, 4mA 24 -IOIS16 HIOIS16_B I/O port is 16bits Out, 6mA 25 -CD2 CD2 Normal operation, this pin is functionally for card detection. Out, 6mA 26 N/A TXD_B UART Data output, Active High Output, WPU, 1µA 27 N/A RTS_B UART Request to send, Active low, Tristatable, Pulled-up Output, WPU, 1µA 28 N/A PCM_In Synchronous Data input 29 N/A VCC_WLAN 3.3V power supply for WLAN Input
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 2630 GND GND 31 GND GND 32 D10 HD10 CompactFlash Data bit[10] IO, PU, 4mA 33 D09 HD9 CompactFlash Data bit[9] IO, PU, 4mA 34 D08 HD8 CompactFlash Data bit[8] IO, PU, 4mA 35 -STSCHG HSTSCHG_B Card status changed Output, 4mA 36 -SPKR PCM_Sync Synchronous Data strobe Input PD, 4mA 37 -REG HREG_B Register select and I/O enable Input, PU 38 -INPACK HINPACK_B INPUT ACKNOWLEDGE is driven by WM-BG-MR-01. Is asserted when the device is selected and the device is responding to an I/O Read command. Output, 2mA 39 -WAIT HWAIT_B HWAIT_B is driven by WM-BG-MR-01 and allows for extending the memory or I/O cycle Output, 4mA 40 RESET HRESET Used to asynchronously reset WLAN.High active. Input, PU 41 N/A N/A Reserved. Keep connection open on Hostside N/A 42 N/A WLAN_LED_B WLAN LED control signal, driven the LEDindicating the link status of WLAN. Activelow. Output, 4mA 43 N/A PCM_OUT Synchronous Data output 44 IREQ IREQ_B Ready/Busy or Interrupt request. In memory mode, this signal indicatesthe ready or busy status of the card.When held high, the card is ready toaccept a new data transfer. When heldlow the card is busy. In I/O mode, this signal is used to indicate an interrupt condition. Output, 4mA 45 -WE HWE_B WRITE ENABLE is driven by the hostduring a memory Write Access Input, PU 46 -IOWR SD_DAT3 HIOWR_B I/O Write Strobe is driven by the hostand is asserted when the host wants towrite to an on-chip I/O register SD_DAT3 : SDIO DATA LINE 3 Input, PU 47 -IORD SD_DAT1 HIORD_B I/O Read Strobe is driven by the hostand is asserted when the host wants toread from an on-chip I/O register SD_DAT1 : SDIO DATA LINE 1 Input, PU 48 -VS1 -VS1 This pin is connected to Ground onmodule to indicate the voltage of thismodule is 3.3V card. GND 49 -CE2 SD_CLK HCE2_B CARD ENABLE2 is driven by the hostsystem and is used as select strobe inboth I/O and memory mode. Enables oddnumbered address bytes SD_CLK : SDIO CLOCK Input, PU
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 2750 D15 HD15 CompactFlash Data bit[15] IO, PU, 4mA 51 D14 HD14 CompactFlash Data bit[14] IO, PU, 4mA 52 D13 HD13 CompactFlash Data bit[13] IO, PU, 4mA 53 D12 HD12 CompactFlash Data bit[12] IO, PU, 4mA 54 D11 HD11 CompactFlash Data bit[11] IO, PU, 4mA 55 N/A BT_LED_B BT LED control signal which drives theLED to indicate the activity of Bluetooth.Active low. Output, 4mA 56 N/A RXD_B UART Data input, active High, Pulled down (weak) Input, WPD, 1µA 57 N/A CTS_B UART Clear to Send, Active low, Pulled down (weak) Input, WPD, 1µA 58 N/A SD_DAT0 PCM_CLK Synchronous Data clock SD_DAT0 : SDIO DATA LINE 0 59 N/A VCC_BT 3.3V supply voltage for Bluetooth Input 60 GND GND Fig 1: Pin 1 assignment and indication Drawing ( To be updated with latest design) 9.2.1. LED INTERFACE The Wireless Module will provide two control signals to the host and capable to drive an LED to indicate the connectivity and operating status. The WM-BG-MR-01 have 2 LED’s (output) via 60 pins connector for feedback to the user on the current WLAN activity state. The signaling will reflect status / activity as described in the table below. Those two signals are provided via the board to board connector with the following pin assignment. Pin No Pin description Function description Pin 59Pin 60Pin 59 Pin 1 Pin 60
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 2842 WLAN_LED Check firmware specification of GPIO(1) with Marvell 55 BT_LED_B Link activity of Bluetooth 9.2.2. ANTENNA INTERFACE No antenna diversity supported on the Wireless Module. The output impedance of the cable is 50 Ohms. Antenna Connector: Hirose W-FL-R-SMT(10) 9.2.3. BLUETOOTH INTERFACE There are interfaces signal to routed between WiFi and Bluetooth to provide coexistence with 802.15 Bluetooth modules. The BT co-existence interface supported, which is 2 Wire CSR co-existence. The control signals are provided via the 60 pins B2B connector with the interface defined as below: Symbol Interface “Signal name” & description BTACT 2 Wire-CSR “BT _Priority” This pin indicates to WLAN BCA device that BT module is active or will soon be active to TX/RX stage. WLAN_active 2 Wire-CSR “Wlan_Active”, This pin indicates to BT module that WLAN is active or will soon be active to TX/RX stage. Note 1: “WLAN BCA” device is a functional block in 88W8385 works as Bluetooth co-existence management . 9.3. SOFTWARE The following source code will be provided for porting to the embedded system under the SLA with chipset supplier Linux source code Source code of development utility base on Windows CE 10. DESIGN FOR EXCELLENCE (DFX) 10.1. TESTABILITY The WM-BG-MR-01 module can be tested on the by using adapter card or similar interface. The adapter card must be such that from the FTS the WM-BG-MR-01 module is seen and recognized as PC Card or Compaq Flash.
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 29 y No additional test pins are required to support in-circuit testing. 10.2. LOGISTICS All customer specific requirements – customization – will be implemented at the highest possible level to support build to order and keep the number of modules in SMT to a minimum. Additional module variants might be added base on business potential. 11. HUMAN FACTORS Due to the nature of this product (embedded module) no human factors required 12. INDUSTRIAL DESIGN Due to the nature of this product (embedded module) no industrial design requirements are required. 13. RELIABILITY The WM-BG-MR-01 module guarantee an MTBF of 150,000 hrs based on an ambient temperature and workload of 2,920 hours. The workload is based on a unit working for 8 hours per day, 365 days per year. The MTBF estimation base on is Bell code standard, Class II. 14. PACKAGE To be updated.
802.11g Wireless LAN+BT SiP combo Module V2.2 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI . 30 Marvell is Trademark of 3’rd Party. For Additional information, please contact the following: Universal Scientific Industrial Co., Ltd. Headquarters 141, Lane 351, Taiping Road, Sec. 1, Tsao-Tuen, Taiwan, Http://www.usi.com.tw Tel: + 886-49-2350876, 2325876 Fax: +886-49-3439561, 2337360,2351093 E-mail:usi@ms.usi.com.tw

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