Getac Technology 050 LTE Module User Manual

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Document ID	1850589
Application ID	owKVVX86D/9Nhohv11VAKQ==
Document Description	User manual Pt 1
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
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Filesize	362.19kB (4527358 bits)
Date Submitted	2012-12-03 00:00:00
Date Available	2012-12-03 00:00:00
Creation Date	2012-10-30 19:58:22
Producing Software	Acrobat Distiller 6.0 (Windows)
Document Lastmod	2012-10-30 19:58:22
Document Title	untitled

Product Technical Specification
& Customer Design Guidelines
LTE7750
2400074
Rev A
a‘ [Minimum mm: NBA only
Com-Hi! :4wa lo Gillian
Contents
Introduction .................................................... 15
Supported RF bands ........................................ 15
Physical features ............................................. 15
Application interface features ................................... 15
Packet mode features ......................................... 16
LTE features ............ . ....... r l . 16
Short Message Service (SMS) features ............................ 16
Position location (GPS) ............................... 17
Warranty and support ........................................ 17
Supporting documents ......................................... 17
Accessories VVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVVV 17
Required connectors iiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiii 18
Ordering information ........................................... 18
Integration requirements ....................................... 18
Technology Overview ............................................ 19
LTE ........................................................ 19
CDMA ...................................................... 19
1xEV-DO ................................................. 19
1X and IS-95A ............................................. 20
standards Compliance ........................................... 21
Electrical Specifications ........................................ 23
Host interface pin assignments , . . . 25
Power supply ................................................ 29
USB interface iiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiii 29
USB high/full speed throughput performance ..................... 29
User-developed drivers ...................................... 30
Rev 4 Sep 11 Proprietary and Confidential - Contents subleot to change 7
Product Technical Specification 8. Customer Design Guidelines
SIM interface ............................................... 30
SIM implementation ......................................... 32
Control interface (Signals) ...................................... 33
W_DiSABLE_N — Vlfireless disable ............................ 33
WLAN_LED_N—LED output ................................. 34
Digital Interface .............................................. 35
RF Specifications ............................................... 37
RF connections .............................................. 37
Shielding ................................................. 37
Antenna and cabling ........................................ 38
Ground connection ........................................... 39
Interference and sensitivity ..................................... 39
Interference from other wireless devices ........................ 39
Host-generated RF interference ............................... 40
Device—generated RF interference ............................. 40
Methods to mitigate decreased Rx performance ................... 4O
Radiated Spurious Emissions (RSE) i i
Radiated sensitivity measurement ................................ 41
Sierra Wreiess' sensitivity testing and desensitization investigation . . , 41
Sensitivity vs frequency i i . i ,41
Supported frequencies ......................................... 41
Conducted Rx sensitivity / Tx power .............................. 42
GPS specifications ............................................ 43
Power ........................................................ 46
Power consumption ........................................... 45
Module power states iiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiii 47
Power state transitions ...................................... 48
6 Proprietary and Confidential - Contents subject to change 2400074
Co ntents
Power interface ............................................ 49
Power ramp-up ........................................... 49
Power-up timing . . .
Power supply noise ..................................... 50
SED (Smart Error Detection) .................................. 50
Software Interface ............................................... 51
Support tools ................................................ 51
USB interface ........... . . V . . 51
TCP window size (Windows XP) ................................ 51
Mechanical and Environmental Specifications ....................... 53
Device views ................................................ 54
Labeling .................................................... 55
Electrostatic discharge (ESD) ................................. 55
Thermal considerations llllllllllllllllllllllllllllllllllllllll 56
Regulatory and Industry Approvals ................................ 59
Important notice ............................................ 59
Safety and hazards ............................... r 59
Important compliance information for North American users ............ 60
OEM integration .............................................. 61
Application of regulatory guidelines ............................. 61
OEM device classification process ............................. 61
Antenna Specification .................. . .65
Recommended GPS antenna specifications ........................ 67
Antenna tests rrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrr 67
Design Checklist ................................................ 89
Testing ........................... . .71
AT command entry timing requirement ............................ 71
Rev 4 Sep 11 Proprietary and Confidential - Cements subiect to change 9
Product Technical Specification 8. Customer Design Guidelines
10
Acceptance testing ........................................... 71
Acceptance test requirements ................................. 72
Acceptance test procedure . . . .
Certification testing ........................................... 72
Production testing ............................................ 73
Functional production test ...................................... 73
Production test procedure iiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiii 74
Testing CDMA RF Receive path ............................... 77
LTE RF receive path test ..................................... 78
GPS standalone connector test ................................ 80
Quality assurance testing iiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiiii 80
Suggested testing equipment ................................... 81
Testing assistance provided by Sierra Wireless ..................... 81
lOT/Operator testing .......................................... 81
Extended AT commands for testing ............................... 82
Packaging ..................................................... 85
References .................................................... 87
Web site support ............................................. 87
Sierra Wireless documents ..................................... 87
Command documents ....................................... 87
Other Sierra documents ..................................... 87
industry/other documents .................................... 87
Acronyms ..................................................... 89
Proprietary and Confidential - Contents subject to change 2400074
List of Tables
Table 1-1:
Table 1-2:
Table 3-1:
Table 4-1:
Table 4-2:
Table 43:
Table 4-4:
Table 4-5:
Table 46:
Table 4-7:
Table 5-1:
Table 5-2:
Table 5—3:
Table 5—4:
Table 5-5:
Table 5-6:
Table 5-7:
Table 6~1 :
Table 6-2:
Table 6-3:
Table 6-4:
Table 6-5:
Table 6-6:
48
Table 8—1:
Table A-1:
Table A-2:
Table B-1:
Supported RF bands “““““““““““““““““““““““““““““ 15
Required host-module connectors .......................... 18
Standards compliance ................................... 21
Connector pin assignments ............................... 26
Power and ground specifications ........................... 29
USB interface ................ . . . 29
SIM interface signal ..................................... 30
Module control signals .............................. 33
LED states (Default behavior) ............................ 34
GPlO signals .......................................... 35
LTE frequency band support ............................. 42
LTE bandwidth support ............................... 42
CDMA frequency band support .......................... 42
Conducted Rx (Receive) sensitivlty—LTE bands .............. 42
Conducted Rx (Receive) sensitivity—CDMA bands ......... 42
Conducted Tx (Transmit) power tolerances ................... 43
GPS specifications ..................................... 43
Averaged standby Dc power consumption ................... 45
CDMA DC power consumption (+3.3V) .......... . 46
Averaged call mode DC power consumption (LTE) ............. 46
Miscellaneous DC power consumption ...................... 47
Module power states .................................... 47
Power state transitions (including voltage/temperature trigger levels). .
Mechanical and environmental specifications ................. 53
Antenna requirements ............................... 65
GPS standalone antenna requirements cccccccccccccccccccccc 67
Hardware integration design considerations .....
Rev 4 Sep 11 Proprietary and Confidential - Contents subiect to change 11
Product Technical Specification 8. Customer Design Gundeiines
Table 6-1: Test settings— Receive path .............................. 78
Table 0-2: Extended AT commands ........................... 82
Table F-1: Acronyms and definitions .............................. 89
12 Proprietary and Confidential - Contents subject to change 2400074
List of Figures
Figure 4-1:
Figure 4-2:
Figure 4-3:
Figure 4—4:
Figure 4-5:
Figure 4—6:
Figure 5-1:
Figure 6-1:
Figure 6-2:
Figure 8—1:
Figure 8-2:
Figure 6-3:
Figure 8-4:
Figure 4-1:
Figure 4-2:
System block diagram rrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrr 24
Expanded RF block diagram .............................. 25
SIM application interface ................................. 31
SIM card contacts (contact View) .......................... 31
Recommended wireless disable connection .................. 33
Example LED ..... . 34
Module connectors ..................................... 37
Voltage/temperature monitoring stale machines rrrrrrrrrrrrrr 49
Power»up timing diagram ................................ 49
Top and bottom views ................................... 54
Dimensioned view ...................................... 54
Unit label rrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrr 55
Shield locations ........................................ 56
Device placement in module tray .......................... 85
Shipping package rrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrrr 85
Rev 4 Sep 11 Proprietary and Confidential - Contents sublect to change 13
Product Technical Specification 8. Customer Design Guldellnes
14 Propnelary and Confidential - Comenls subject lo change 2400074
1: Introduction 1
The Sierra Wireless LTE7750 PCI Express Mini Card is a compact,
Iighlweight. wireless LTE- and CDMA-based modern. demgned to be
Verizon Vinreless certified.
The LTE7750 provides LTE. CDMA. and GPS connectivtty tor
portable and handheld computers. point-oi-sale deVices. telemetry
products and other machine-to—rnachine and vertical applications
over several radio trequency bands.
Supported RF bands
The modem. based on Qualcomm‘s MDM9600 baseband processor.
supports data operation on LTE and CDMA networks
Table 1-1: Supported RF bands
LTE - Bandits 700 MHz "
- Celluiar (800 MHz)
com I
. PCS (1900 MHz)
GPS I 1575 42 MHz nla
Physical features
. Smell lorm iactor—oonlorrns to Ft as specilied in PCI Express
Mini Card Electromechanical Sparticalion Revision 1.2,
. Operalmg temperature range: ~30 'C to +60 ”C
Application interface features
- USB interface (QMI)
I NDIS NIC interface support tor \Mndows 7. Windows Vista. and
Windows XP plattorms
- Multiple non-mltiplexed USE channel support
. USB selective suspend to maximize power savrngs
- AT command interiace ([leT Command 59! for User Equrpmen!
(UE) (Release 6) {Doc}! BGPP T521007), plus proprietary
extended AT commands)
- Sottware Development Kit (SDK) Including a Linux APi (Appli-
cation Program Interieca)
Rev 4 Sep 11 Proprietary and Confidential - Contents subiect to change 15
Product Technical Specrlicatian 8. Customer Design Guidelines
0 We DLL support tor Verizon Wireless PC-OEM (Windows)0MA DM (Open
Mobile Alliance Device Managemenl)FOTA (Firmware Over The Air)
Packet mode features
0 LTE data rales (category 3. MIMO)
- 100 Mbps DL wlthln 20 MHz bandwtdth
- 50 Mbps UL Within 20 MHz bendwtdth
I CDMA [5-556 (IXEV~DO Rev. A) data rates
- Up to 3.1 Mbps torward channel
- Up to 1.8 Mbps reverse channel
. CDMA lS-2000 data rates—Up lo 153 kbps, Simultaneous torward and
reverse channel
- Circuibswitched dale bearers (up to 14,4 tcr CDMA)
LTE features
Basra cell selection and system acquisition
- PSS/SSS/MIB decode
- SlBl. SIBQ. SIB3 decoding
- NAS/AS secunty procedures
- Snow SGIAES security
0 COI/Hl reporting
- Paging procedures
~ Paging in Idle and Connected mode
0 Dedicated bearer
- Newark-initiated dedicated bearer
- UE-iniliated dedicated bearer
- Multiple PDN connecltons (IPv4 and vas combinations)
- Connected mode Intra~LTE mobility
- Idle mode Intra-LTE mobility
. iRAT between LTE/2G (future release)
IRAT between LTE/3G tor Idle and connection release wtlh redirection (tulure
release)
Detach procedure
. Network'miltaled detach with realtach requtred
- Nemark~mlllaled detach hllowed b] connechon release
LTE a eHFlPD redirection With data conhnurty (vauvas)
Short Message Service (SMS) features
- Mobile-terminated SMS lor CDMA
- Mobile-anginaled SMS lor CDMA
- Mobile-terminated SMS over IMS for LTE/eHFlPD
1s Proprietary and Confidential - Contents subject to change 2400074
Introduction
0 Mobile-originated SMS over IMS lbr LTE/eHRPD
Position location (GPS)
- Standalone mode
- GLONASS support on GPS connector 1 (luture release)
0 DC bias on GPS connector 1 to support meme! active GPS antenna
Warranty and support
The LTE7750 otters the lollowtng support lealu res:
I Standard 1-year warranty
- Enabling soltware (drivers. SDK. etci) tor Android. Linux. Windows 7,
Windows Vista. and Windows XP
Supporting documents
Several additional downtonts describe Mini Card design. usage. integration. and
other teatures. See Holeronoeo on page 97.
Accessories
The Universal Development Kit (UDK) is a hardware development plattorm tor
AirPri'rne MC~senes "mules. It contains hardware components lor evaluating
and developing With the module. including:
0 Development board
0 Cables
- Antennas (Bands 17, 13. and 7 are not supported by supplied antennas)
- Documentation suite
0 Initial allotment ot support hours
- Other accessories
For instructions on setting up the UDK, see [4] PCI Express Mini Card Dev lat
Quick Start Guide (Doc! 2130705)
For over-thee" LTE testingi ensure that suitable antennas are used. (Two
antennas are required lor this testing: Sierra Wireless otters an LYE-capable
antenna covering 700—2600 MHz BW—please order part number 6000492
(City 1—this contains two antennas“
Rev 4 Sep 11 Proprietary and Confidential - Cements subject to change 17
Product Technical Specification 8. Customer Design Guidelines
Required connectors
Table 1-2 oescnbes the connectors used to integrate AirPrime MC-series
modules into your host oevrce.
Table 1-2: Required host-module connectors‘
Connector type
RF cables - Mate with Hirose U FL connectors
(model U.FL flCLSS1~0471v010)
- Two or three connector jocks. depending on module
suppon for dwersny and GPS luncoonalty (Note The
UDK nastwo connector pelts )
EDGE (52-pin) - Industry-standard mating connector
- Some manufacturers indude Tyoo. Foxconn. Moleat
' Example UDK board uses Motel 6791M
- Industry-standard connector Type depends on Whoa
device aposes the SIM socket
Example UDK board uses In CCMOG»351B
I mum-auruupan nunbels are tor reference only mu m iutnect to cnnnw Choose
contractors mi m nwropn-ie tor ywr om denim
Ordering information
To order, contact the Sierra Wireless Sales Desk at H (604) 232—1488 between
8 AM and 5 PM Pacrlic Tlm‘
Integration requirements
Sierra Vlfireless prov/ides, In the document suilei guidelines for success‘lul Mini
Card integration and otters integration support serVIces as necessary
When integrating the LTE7750 Pct-Express Mini Card. the followrng items need to
be addressed:
0 Mounting—Enact on temperature. shock, and Vibration parlormance
- Pmewpty—Impact on ballery drain and possible FtF rnterterence
- Ant-ni- button and typo—impact on HF periorrnance
- Regulatory Ippvovnlo—As discussed in Regulatory and Industry Approvals on
page 59.
- Service provisionlrio—Menutacturrng process
- snare—As discussed in Soltware Inlerlace on page 51.
- Ho: Inuit-u, compliance With inierlace voltage levels
13 Proprietary and Confidential - Contents suoiect to change 2400074
2: Technology Overview 2
LTE
LTE (Long Term Evolution) Is a Mfr-generation wireless slanmrd.
The SGPP Release a specification outlines the leatures and
requirements.
Key leatures Include.
0 Peak data rate:
- 100 Mpps DL Within 20 MHI bandwtdth
(Peak DL data rate In 10 MHz bandwrdth: 70 Mbps (approx.) tor
Cat 3 devrce)
~ 50 Mbps UL within 20 MHz bandwtdth
Actual throughput ts dependent on the network configuration.
bandwrdtn eesrgned to the UE. the number at users. and HF srg—
nal conditions,
. Up to 200 active users in a cell (5 MHz)
- Less than 5 ms user—plane latency
o Supported bandwidths: 5 MHz/10 MHz
0 Spectrum flexibility: 14—20 MHz (3—20 MHz In future FIW
release)
- Enhanced support lor smite-end QOS
- Physical layer uses:
- DL: OFDMA (Orthogonal Frequency Divrsion Multlple Access).
Momlallon: OPSK. 1610AMv and 640AM
- UL: Single Carrier FDMA (sings carrier modulation and
orthogonal lrequency rmltlplexmg)
Modulation: QPSK. lsoAM
- MIMO (Mum-input Mum-Output) antenna support
CDMA
1 xEV-DO
leV-DO is backwards compatible to both tX and IS-QSNB
standards. However. thV-DO represents an evolutionary
enhancement. specifically designed and optlmzed tor high-speed
wireless data access, This was driven by tundamental ditlerences
between votes and data traffic characteristics.
Rev 4 Sep 11 Proprietary and Confidential - Contents subject to change 19
Product Technical Specitication 8. Customer Design Guidelines
eHRPD (Enhanced High Rate Packet Data) is an enhancement at 1xEV-DO that
enables LTE to CDMA handover.
To optimize tor data. there are some tundamental characteristics and dillerences
between iXand leV-DO. including:
- The network has dedicated spectrum (1 ,25 MHz) lor data tratlic using
ixEV-DO sandard. so resources don't compete with 1X datalvolce (hybrid
mode used to monitor 1X carriers)
- BTS always transmits at maxin'um available power
- Each user receives data trom only one base station at a time (no torward link
so" handol't)
- 1xEV
46 GPIOG - Wampum uu Inpm mm 210
mu m as:
Output him n no
Outpul low 0‘45
47 NC - No connect - .
‘6 EPICS - GCMII film In Invlfl MM 2 10
Input lam QB
Oulpul him no
Oulwr kw 0‘45
49 NC - No mm -
50 GND V ernfl -
5‘ NC . figmmw Mme .
use
52 vcc v 13 v sunny 3.3
I The had maid luv: II ‘NC' ('no connect) nlfli unemneetad.
2. A—Mflw: I—m: NP—Noptll: O—Difl'll «mm: W—m inpul (hlemfl pul an). PD—Dlflhl NW (Ilium! wit awn).
V—Pwu or ground
he Wkly and Confidentél - Cements subjedrlo éiange 2460074
Electrical Specrlications
Power supply
The host provrdes power to theLTE7750 through multiple power and ground pms
as summarized In Table 4-2,
The host must provrde sale and contrnuous power at all tlmes: the module does
not have an Independent power supply, or protection clrcuits to guard against
electrical Issues.
Table 4-2: Power and ground spocificatlons
2. 24, 39. 41V 52 Voltage range See Table 4-1 on oaaezs
Ripple voltage . (. |1oo law” |
9.15, 821,28, -
. 7‘
l.
27.293435
4 350
GND
USB interface
The USB interlace is the path br communication between the host and module.
The intertace complies With the [12] Universal Serial Bus Spevilrcan'on, Rev 2.0.
and the host devrce must be desrgned to the same standard. (When designing
the host den/ice, carelul PCB layout practices must be lollowad.)
Table 4-3: USB Interface
may «we
we: mm
USB rnterlace leatures include:
- Data rate: Fullvspeed (r2 Mbps)/High-speed (430 Mbps)
Module enumeration:
- Windows: Modem or COM ports. usrng host Windows drivers
- Linux: ldev/ttyUSBn dBVlDeS tor Linux systems With the Sierra Wrreless
driver Installed
USE-compliant transcervers
Selectlve suspend mode
Resumptton inillaled by host or module
USB high/full speed throughput performance
This devrce has been designed to achieve optimal pencrmance and rnaxrmum
throughput using USB high speed mode. Although the dams may operate With a
lull speed host throughput performance Will be on an “as is" basis and needs to
Rev 4 Sep 11 Proprietary and Confidential - Cements subject to change 29
Product Technical Specification 8. Customer Design Guidelines
be charamenzed by [he Gall. Note Ihal Ihrougiput Will be reduced and may vary
sagniircanlly based on packel size. host Interface. and firmware revrsionv Siena
Wireless does not recommend using Ihis device in USB lull speed mode
User-developed drivers
Ii you will be developing your own USB drivers, see [5] AirCerd/AirPrime USB
Driver Developer's Guide (Dock2130634).
SIM interface
The module suppons one SIM (Subscriber ldenlity Module) (I .8 V of 3 V) The
SIM holds account inbmalion. allowing users Io use their accounI on multiple
devices.
The SIM pins (Table 44) provide the connections necessary In Interlace In a SIM
socket lecahd on the hosl device as shown in Figure 4-3 on page 31. Voltage
levels over this inlarlace comply with SGPP slandards.
Table 4-4: SIM Interface slgnll
USIMj'WR 8 SIM voltage Pom supply for SIM
US M_DATA 1D DUB IIO Br—directional SIM ddh line
USIM_CLK Selial clock Serial clock for SIM dam
uerer [14 lReset Amelw SIM resel
USI M_GND Ground romance
USIM_GND Is common to module ground
I. Seamtlonpegeaflorsmwdcund:
so Proprietary and Confidential - Cements subject to change 2400074
Electrical Specmcanons
USIM_PWR
4,—
4 7m: \_ ° '
xsn = —° “F (Opuonal
Iva I _L Locale near the
‘3‘ = SIM socket)
15 k5} > 30 I“!
+ _.
Lac-ted near
SIM sockfl
(Opllmal
Locale net! the
SIM socket)
‘7 F 5” f}
” usm_cu<
us MLDAYA
usmjs‘r . .
AIrPrIme
embedded
USIM_GND
module
Locnled near SIM socket
NOTE CureMIy confide! ll ESD
SIM card connector
ESD‘ A H I r ., ,1 armaments venuwea—umny
pvalecuon Increase smut nse me no
_ me to seminal-en lslluvo
Fame 4-: SIM appltcanon mama
cmxuumwcmulwm
Fque u SIM card mnlarLc (canvas! wem
Rev 4 Sep 11 Propnetary and Confldenual ~ Contents sumac! lo change 31
Product Technical Specitication 8. Customer Design Guidelines
Note: For interface design
requirements, rely lo:
(26) BGPP TS 51010-1,
section 27 I 7, or
(36) E75! TS 102 230
V5.50. section 5. 2.
SIM implemenution
When designing the remote SIM interface, you must make sure that SIM signal
integrity is not compromised.
Some design recommendations include:
- Total Impedance ot the VCC and GND connections to the SIM. measured at
the module connector. should be less than 1 a to minimize voltage drop
(includes any trace Impedance and lumped element components—inductors,
tillers. etc).
- Position the SIM connector 510 cm from the rnodute. Ila longer distance is
required because at the host devtoe desrgn, use a shielded Wire assembty—
connect one end as close as posstble to the SIM connector and the other end
as close as possmle to the module connector. The shielded assenbly may
help shield the SIM intertace lrorn system noise.
- Reduce crosstalk on the US|M_DATA line to reduce the risk at tailures during
GCF approval testing.
0 Avoid routing the USIM,CLK and USlMgDATA lines in parallel over distances
>2 cm—cross—coupling ot these lines can cause tailures.
- 36PP has stringent requirements tor IIO rise time (<1 us). signal level limits.
and notse tn‘imuntty—cortSIder this carelully when developing your PCB
layout.
- Keep signal rise little <1 tie—keep USIM srg'tals as shor1 as possible. and
keep very low capacitance traces on Ihe USIM_DATA and USIM‘CLK
signals, Higt capacitance increases signal rise time, potentially causing
your device to tail oertitication bets.
. Add external pull-up resistors (15 kQ—ao kn). it required. between the
USIMADATA and USIMJ’WR lines to optimize the signal rise time.
- VCC line should be decoupled close to the SIM socket
0 SIM is specified to run up to 5 MHz (SIM clock ran). Take note 0! this speed
in the placement and routlng ot the SIM signals and connectors.
- You must decide whether eddticnal ESD protection is required tor your
product. as it Is dependent on the application. mechanical enclosure. and SIM
connector design. The SIM pins will require additional ESD protection it they
are exposed to high ESD levels (LB. can be touched by a user).
0 Putting an optional decoupling capacitor at USIMJ’WH near the SIM socket
is recommended—the longer the trace length (impedance) Irom the socket to
the module, the greater the capacitance requirement to meet compliance
tests.
- Putting an optional series capacitor and resistor lamination (to ground) at
USIM,CLK at the SIM socket to reduce EMI and increase signal integrity is
recommended it the trace length between the SIM socket and module is
long—47 pF and 50 a resistor are recommended.
- Test your first prototype host hardware with a Comprion IT“ SIM test device at
a suitable testing facility.
32 Proprietary and Confidential - Contents subject to change 2400074
Electrical Specifications
Control interface (Signals)
The LTET750 provides siglals tor:
- Power control ol the module trom ll'ie host
- LED driver output
These slyials are surrmarized in Table 4-5 and paragraphs Ihat lollow.
Table 4-5: Module control slgnlls
W_DlSABLE_N ereless disable (Main RF)
WLAN_LED_N 42 LED driver
1. o—oigiu pin cumin; PU—Dlw pin Input, nun-i pull up
W_DISABLE_N — Wireless disable
The host device uses W_DISABLE_N (pin 20) to enable/disable the WAN or
radio modem. When disabled. the modern cannot tranernit or receive inlormetion.
Letting this signal lloat high allows the module to operate normally. This switch
lollows the behavior described in (l 1] PCI Express Mini Card Electromechanical
Specification Revision 12. This pin has a 20 m pull-up resistor. See Figure 4-5
on page 33 lot a recommended implementation.
When integrating with your host device. keep the lollowing in mind:
- The signal is an input to the module and should be mven LOW only tor Its
active state (controlling the power state): otherwise it should be floating or
(High impedance), II should never be driven lo a logic high level. The movie
has an internal pullvup reststor to Module Power (3,3V) In place, so it the
signal is floating or (high impedance). the module will power on.
0 Walt lor two seconds alter asserting W,DlSABLE,N before disconnecting
power
- II the host never needs to assert this power state control to the module. leave
this signal unconnected lrom the host interface.
Wales:
Host > maul-curd
Fain 4-5: Recoil-13mm an": m
liev 43,” it Vbioprialary andoonfidevilfl - Comaits subject to change 33
Product Technical Specification 8. Customer Design Gurdelines
WLAN_LED_N—LED output
The module drives the LED oulpm escorting lo [11] PCI Express Mini Card
Eleamacneni‘caISpecificauhn Revision 1.2. as described in Talia +6 (below),
it desired. LED behavior can be configured using AflLECTRL
Table 4-8: LED slates (Default behavior)
Module is m: powered
(W_DISABLE.N asserted wan POOFFEN=1)
Module is in lorvpower mode |
(W_D|SABLE_N assorted win POOFFEN=U)
Module is Morning imflal power up sell-min l
Module is searching serwoel
Modub has an aaive amen
Module hit an naive context and data I: being
transferred
Device error has occurred.
Modulahasalbchedbanmkandlsrm
currermy in a all
vcc 3 av
Fbin 5-6: Exnrrph LED
3}: Propner ‘ lary anu bonfirientiol - Contents sulrajecllo crrange #0007 N 7;:
Electrlcal Specifications
Digital interface
The LTE7750 Mll'll Card provrdes the general purpose digital l/O (GPIO) Signals
llsled in Table 4-7:
- 8y dalault, all GPIO pins are set as inputs,
- Voltage should not be applied until > is after vcc is applied to the minicard.
- GPIO pins are available lor DEM-defined purposes but may. In tulure
firmware releases. be allocated by Siena Wireless lor specillc functionality.
- For applications not requrring GPIO tuncllonalily. lean/e these pins not
connected on the host.
Table 4-7: GPIO signals
General purpose l0
General purpose l0
m—n-
Ill—li-
Ill—ll-
1 GPIO pills m initilllzed as FD by [he him-r:
27 PD—ugi-I pin Input, intern-l pull m
Rev 4 Sep 11 Propnelary and Confidential - Cameras subject to change 35
Product Technical Specihcation 8. Customer Design Guidelines
36 bropr‘setavy and Confidential - Cements suiajea'to tier-gs éAddbu
5: RF Specifications
The LTE7750 includes three RF connectors tor use with host-supplied
antennas:
- Main HF connector—Rx/Tx path
- GPS connector t—Standalone GPS
. Dwersrty/MIMO/GPS connector 2—Diversny. MIMO. or GPS
The module does not have Integrated antennas,
IIO connector
“Ih RF connect»
BPS connum1
DivonityflflMOIGPS
connector 2
Full! 51 Maduh connector:
RF connections
When attaching antennas to the module:
Note: To dlsccnnect the - Use Htrose UtFL connectors (3 mm x 3 mm. low protlle; model
antenna, make sureyou U.FL #CL331~04710-10) to attach antennas to connectlon polnts
use the Hume U FL on the module. as shown In Figure 5-1 on page 37.
“mm" ’W‘I’w’ - Match coaxral connections between the modme and the antenna
(PIN UFL4.P-N-2(01)) to to 50 n
p E l M“ 599, b the . Mlnllee RF cable losses to the antenna: the recommended
module orooaxlal cable
maxtmum cable loss for antenna cabllng IS 05 dB.
To ensure best thermal perbrmance. It possible use the
mounting holes to attach (ground) the device to the math PCB
ground or a metal chassts,
assemby
Note, I! the antenna connection is shorted or open. the mm wrtl na
sushi/I permanent damage
Shielding
The module is tulty shielded to protect against Em and must not be
removed.
Rev 4 Sep 11 Proprietary and Confidential - Contents subyect to change 37
Product Technical Specitication 8. Customer Design Guidelines
Antenna and cabling
When selecting the antenna and cable. it is critical to RF pei‘lomance to match
antenna gain and cable loss.
Nate: Fa detailed electrical performance Elena. see Appendlx A: Anionne SpeaTiootibri
on page 65
Choosing the correct antenna and cabling
When matching antennas and cabling:
- The antenna (and associated circuitry) should have a nominal Impedance ol
50 Q with a return loss 01 better than 10 dB across each lrequency band at
operation.
The system gain value altecls both radiated power and regulatory (FCC. IC,
CE, etc.) test results.
Designing custom antennas
Consider the lollowmg potnts when designing custom antennas:
~ A skilled RF engineer should do the development to ensure that the RF
perlormance Is maintained.
. It both CDMA and UMTS rriodules WI" be installed in the same platlorm, you
may want to develop separate antennas lor newmum pertormance.
Determining the antenna's location
When deeming where to put the antennas:
o Antenna location may attect RF performance. Although the module Is
shielded to prevent interference in most applications. the placement at the
antenna is still very important—it the host deVice is insullicientty shielded.
high levels at broadband or spurious noise can degrade the module's parlor-
mat-ice.
Connecting cables between the module and the antenna must have 50 Q
impedance, It the impedance ol the module is mismatched. RF periormance
is reduced s‘gnilicantlyi
Antenna cables should be routed. it possuble. away lrom neise sources
(swulching power supplles. LCD assemblies. etc). It the cables are near the
neise sources. the noise may be coupled into the RF cable and into the
antenna. See lnterlerence liom other wireless devices on page 39,
Disabling the diversity antenna
- For LTE bands, use the AT command InXDEt-o to disable receive diverstty or
IRXDEN=1 to enable receive diversity.
For CDMA bands. use the AT command IDIVERSTY to enable or disable
receive diversity.
38 Proprietary and Confidential - Contents subject to change 2400074
RevA Sep11
RF Specifications
Note A diversity anienm Is used to {move oonnedr'on quality and reliability through
redundancy Because Mo enters-tea may experience diligence mterrerenoe em (mi
distortion. delay etc ), when one enienna receives a degraded signal. the other my not be
similarly effected.
Ground connection
When connecting the module to system ground:
0 Prevent noise leakage by establishing a very good ground connection to the
module through the host connector.
- Connect to system ground using the two mounting holes at the top at the
module (shown in Figrre 51 on page 37).
- Minimize ground noise leakage into the HF
Depending on the host board design. noise could polenlially be coucled to
the module lrom the host board. This Is mtnly an issue lor host designs that
have Signals traveling along the length at the module, or circuitry operating at
both ends oi the module interconnects.
Interference and sensitivity
Several interlerenoe sources can shoot the modules RF pertormanoe
(RF desense). Common sources Include power supply noise and demo-
generated HF.
HF desense can be addressed through a combination cl mitigation techniques
(Methods In mitigate decreased Fix periorrnance on page 40) and radated
sensitile measurement (Radiated sensitivity measurement on page 41).
Note. fire LiE’lEO is based on ZlF (Zero lnlermednele Frequency) lechnobgies When
perform EMC (Electorriagneb‘c Carmelrbiliry) tests there are no lF (intermediate
Frequency) component from me modub to consider
Interference from other wireless devices
Wireless devroes operating Inside the host dwice can cause interlerence that
allecls the module.
To determine the most suitable locations tor antennas on your host device.
evaluate each Wireless dewce‘s radio system. consrderlng the iollowing;
- Any harmonics, sub~harmonics. or cross-products oi Signals generated by
Wireless devices that tall in the module‘s Rx range may cause spurious
response. resulting in decreased Rx periormanoe.
- The Tx power and corresponding broadband noise at other wireless devroes
may overload or increase the noise tioor ot the module‘s receiver, resulting in
Rx desense.
Proprietary and Confidential - Cements subject to change 39
Product Technical Spemlication 8. Customer Destgn Guidelines
The severity at this intertorence depends on the closeness ol the other antennas
to the module's antenna. To determine suttable locations tor each Wireless
devtce‘s antenna. thoroughly evaluate your host device's design
Host-generated RF interference
All electronic computing devices generate RF lnterterence that can negatively
sheet the receive sensitivtty ol the module.
Proximity ol host electronics to the antenna in Wireless devices can contribute to
decreased Rx pertormance. Components that are rnosl likely to cause this
Include:
- Microprocessor and memory
. Display panel and display drivers
0 Switching-mode power supplies
Device-generated RF interference
The module can cause interterence With other devtces Wireless devtoes such as
AirPrirne embedded modules transmit in bursts (pulse transients) tor seldurations
(RF burst trequencies). Hearing aids and speakers convert these burst
lrequencies into audible trequencies, resulting in audible noise.
Methods to mitigate decreased Rx performance
It Is Important to Investigate sources ol locallzed Interference early In the desrgn
cycles To reduce the eftect ol device—generated RF on th perlormance:
- Put the antenna as tar as posSible lrom sources ot Interference. The
drawback Is that the module may be less convenient to use.
- Shield the host devtcei The module tlsell Is well shielded to avord external
tnterterenoe. However. the antenna cannot be shielded tor obvtous reasons
In most Instances It is necessary to employ shielding on the components at
the host devrce (such as the main processor and parallel bus) that have the
highest RF emi ssions,
0 Filter out unwanted high~order harmonic energy by using discrete ltltenng on
low lrequency lines.
. Form shielding layers around high-speed clock traces by using mitt-layer
PCBS,
- Route antenna cables away lrorri notse sources,
Radiated Spurious Emissions (RSE)
When desrgmng an antenna tor use with Aerrime embedded modules. the host
device with an AirPrime embedded module must satiety the radiated spurious
emissron (RSE) test cases described in:
- (CDMA) Pieter to COM standards for receive-only mode, and local
regulatory bodies tor transmit mode (transmitter is operating),
40 Prophetary and Confidential - Cements subject to change 2400074
RF Specifications
Note lhal antenna Impedance attects radiated emissmns. which must be
compared against the conducted 50-ohrn emissions baseline (AIrPrtme
embedded modules meet the 500nm conducted emissions requirement)
Radiated sensitivity measurement
A Wireless host demos contains many noise sources that contribute to a reduction
in Fix periormance.
To determme the extent at any receiver periormance desenstlizalion due to sell-
generated noise in the host device. over-the-air (OTA) or radlated testing is
required This testIng can be perlormed by Sierra ereless or you can use your
own OTA test chamber tor In-house testing.
Sierra Wireless' sensitivity testing and
desensitization investigation
Although AirPrIme embedded modules are designed to meet carrier requirements
tor recerer pertomtance, they are still susceptible to various pedormanoe
inhibitors.
As part 01 the Engineering Servrces package. Siena Wireless otters modem OTA
sensitivrty testing and desensitizanon (desense) Investigation For more
mtormation. conlact your account manager or the Sales Desk (see Contact
tntormetion on page 4),
Note: Sm Wireless has the capability to ”unsure TIS (fatal Isotopic Sammy/(y) and
TRP (Total Redhead Power) BMW to CTlAS punished test pmosdure
Sensitivity vs. frequency
For CDMA bands, senSItlvity Is defined as the input power level In dBm that
produces a FER (Frame Erwr Rate) 01 0.5%. SensitIVIty should be measured at
all CDMA lrequencres across each hand.
For LTE bands. senSilIVIty Is delined as the RF level at which throughput Is 95% pl
maXImum.
Supported frequencies
The LTE/750 supports:
0 SIngle—band LTE—See Tobie 54 on page 42‘
- Dual-hand CDMA—See Table 5-3 on me 42,
I G PS
- Radio transceiver requirements tor aGPP Release 7
Rev 4 Sep 11 Proprietary and Confidential - Cements subject to change 41
Pmducl Technical Spemllcalian 8. Customer Deslgn Guldehnes
0 Inter-FIAT and mtar-lrequancy cell resalacuon and handover belwesn
supported lrequency bands
Tabla 5-1: LTE fvoqucncy band Happen
Band 13 Tx 777—787 MHz
Rx 746—756 MHz
mm 5-2: LTE bandwidth suppon‘
1 YONG center“: Ire derived lmm JGPP T536 52l-1 v9.4 1. “N5 4 2,1-I
2’ Bomb lorwhich I rellxnllon dine spanned UE receive! sensitivity 1'me
{Clause 773 M SGPP TS 38521-1 v9 ‘1)ls Illwed
Table 543: CDMA lrequency band suppon
PCS Tx 1350—1910 MHz
Rx 1930-1990 MHZ
Cellular T): 324-649 MHz
Rx. 869-594 MHZ
Conducted Rx sensitivity I Tx power
‘l’ablu 6-4: Conduct-d Rx (Rocoiva) sonsluvity—LTE bands
Full RB 3 3
Per 36?? We"
2. Sensitlmy values scale mm h-mmm
x_ MHZ _=Sensfivny 10MH1_SensiMy- 1010mm MHm_MHz)
3 Verizmiesluemm
Table 5-5: Conduct“! Rx (Receive) sonsltlvlty—ODMA bands
CDMA 1x
5': FER
Cellular (800 MHZ)
EVDOrevA
-m .1055
42 Propnelary and Confidential - Contents subject to change 2400074
RF Specifications
Table 5-6: Conducted Rx (Receive) sensltlvlty—CDMA bands
CDMA 1x
% FER
PCS (1900 MHZ)
EVDO rev A
O 5% PER
Tabla 5-8: Conducud Tx (Transmit) pow" tolerances
LTE
lLTE, Band 13 +23 dBm : us
| com
CDMA Band Class 0 '24 dBm: 1dB
(Cellular)
CDMA Band Class 1 (PCS) 4235 cam: 1:9
(channel 1175)
$24 (13"! : 1dB
(other channels)
1 Hdlmlnuy values
GPS specifications
Nola: Form-Mohavulpafmmncauma, mWGPsaflmW
mmwpagefl
Table 5-1: cps specifications ‘
Saqu channels 12 channel continuous banking
Promcols NMEA 0183 V30
Human.”-
Aoqursiuon hme Wam- start 29 5
Cold dart 325
Holizomf < 2m(50%); <5m(w%)
Accuracy Altitude < d m (50%); < a "1(90’56)
Velodty:<02rnls
Rev 4 Sep 11 Propnetavy and Confidenml - Cameras sub}ect to change 43'
Product Technical Specification 8. Customer Design Guideimes
Table 5—1: ops specmentlons (endanger
hacking? a151 dam
Sensifimy Acquismon (Assisted‘ non-LTE)’ 458 A18!»
Acquisition (Assam, LTE)‘ -153dEm
Acquisition (Sandstone) 714:. dBm
We (6000 m 0' veiocity (100 "V5
°°°'"°"" "m" (em: um may be acceded, m not both.)
i NI vuluns lie chlimmry
2, Trucking sensfivity Is the imsl GPS Swill luvd lot which Die «Vice cm Sbll oelod In
lnMew “MIR: 95% Cine iime when in Wear-l flicking mode
3. Aluminum sensmvily is live lowest GPS sir-l level in! which Ihe dwioe can Ilfll do!”
In iiwlw “mime 50% d the time
44 Proprietary and Confidential - Comenis subject to change 2400074
6: Power
Male: All specifications In
these tables are plelim—
(nary, based on animal
published expectations.
Table 8-1: Avenged standby Dc power consumpllon‘
Sunday current consumption (Sleep mode activated“)
Power consumption
Power consumption measurements in the tables below are ior lhe
LTE7750MinI Card module connecled lo the host PC via USE,
The module does not have ils own paws: source and depends on the
hosl device for power. For a description ol input voltage
requiremenls, see Power supply on me 29.
LTE
CDMA EVDO
LTE Buds 5.5
9.5
CDMA bands
sundlry cumin conium mien (Sleep med- dmlmfl’)
LTE
LTE bands 55 85 mA
CDMA EVDO
CDMA bands 53 65 mA
LCM Power Mode (LPM)IOMIIIC Mod. (Ship mode acuvahd‘)
RF dusbled, but "iodine is opevaional 2.5 3.0 mA
Low Power Mode (LPM)IOWIIHO Mod! (Slew mode WW5)
3 3V um van-no
Fov unwound was. see Tum 5-1, LTE noun-wand W, on pm 42 and m 53. cum-um
RF dumbled. but module is communal 87 so am
Rev 4 $2111 1
bend sum. on nag. 42,
M mummnls Ira nrel‘mmiy.
unwed .1 Minimum! wince
Assumes USB bus is My wee-Med during musuremenll
999 NP
Proprietary and Conl‘iderlial - Contents subject to change
Product Technical Specthcation 8. Customer Design Guidelines
Tabla $2: CDMA Dc pomr consumptlon (63.8w
IS-m 1X Dala current 5032, RC3 (Fwd) / RC3 (RVs).
1536 kbps (Fwd) I 76 B kbgs
(RVs). CDG Urban PMile, USE
active
423 ‘
5032. Rm (Fwd) 1 RN (Rvs).
153.6 kbps (Fwd) I 76.8 kbss
(RVs). CDG Suburban Pickle. USE
acme
Cellular 327 -
5032. R03 (Fwd) I RC3 (RVs).
153 5 kbps (Fwd) I 76.8 kbps
(RVs). 006 Urban Profile. USB
active
370 -
$032. R63 (Fwd) I R63 (Rvs).
153.8 kbps (Fwd) I 76 8 kbps
(RVs). CDG Suburban melle. USE
active
lS—BSG 1xEV-DO
Review» 0 Data wrrmr
006 Urban Prom: USE active
I75 -
324 <
(:06 Suburban Profile. USE acme
CDG Urban Profile. USS aawe
377 -
COG Suburban Profile. USE active
ISSSGA 1xEV«DO
Revislon A Data current
CDG Urban Profile, USE aaiva
479 -
Cellular 331 -
1 iii; 1
CDG Suburban Profile. USB ma
CDG Urbln Profile. USE adiva
CDG Suburban Prof“. USE active
- opemhunal
— all muscled
Maxlmum peak current
PCS or Cellular 1.2
’11
Max RF am power. lull rate, full
operating Inmparamra range.
Maximum peak currem 1.0
Max RF ouput power, lull me, full
opamn‘ng temperature range
All mountain-Its In alumna-y villus
For suppmedbms. RIMS-1. ”Emu-Id swat on page 42 mama-5:. thumw
mm mm. on pg- 42
. Measured u mmmmu val-gs
‘.
2.
Table 6-3: Avarngld clll mode Dc pomr consumption (LTE)‘
Propnetary and Confidentlal - Cements subject to brange
Dal cum! consum pdon
(Includes U53 bus curvant)
—_Elfl mmwm m
2400074
Power
Table 6-4: Miscellaneous no power consumptlon‘
Module OFF leakage .
anew
mm nuumsmmww
Assumes powur wpvly tum on lune
> 100us
Dependerllorr has power supply
n’u lime
GPS comm 1 in Flat-54 on
W31
Inrush current
Ame bias or: GPS port
1. All «newton-ems Ire mil-m vlluel
Module power states
The module has live power males. as described in Table H.
Table 0-6: Module power stiles
Manuals-um
DIM sllte when VCC is It: IW n In. lbw“): MW_DIWLE_N mad
man: u anus olplldnnlreewha am. or uwuung am macaw. m an
wireles- mom
Current can-mm is mm by «ml hum. banana:
I Rndohlnd bot-gum
- Trlrlsrnl purer
‘ Roculveuhultlngs
' DIIII'IM
0 Nurrberolodive‘lxumnea
Moorl- ls Idlve
Sole II controlled hymn marl-co um solver. mas:
- ocsu~=ou1Mmarmnd Sal Iar um em: rue (Hare-u 5;
(Doc! as» is 27.007)»
lewe olmeflule between collard-lemmas":
mmsummmmmmmmwm. a mum-
oolormlnod Inlorvll
kw 4 gap 1i fireprieery and CcrIfirlenlieI - Corlterls subjeci ta ehange 4}-
Product Technical Specilicalicn 8. Customer Design Guidelines
Teble 6-5: Module power states (Confirmed)
Hoe! keeps niomle menu of by driving w_DlS\BLE_N low
Mamie lins «hm-l current
See w_DlsABLE_N —leeleee Me on pepe 33 lor more Mum-lion)
Dluenneded
mo "Mlle no .1 0 \L
Power state transitions
memlldmmummemefluhmdeflmmemcleledwllll I I I I
The module uses stale machines to monilor supply vollage and operating
temperelure, and notifies the host when cn'lical threshold llmlts are exceeded
(See Table 6v5 lor trigger details and Finge 6-1 lor slate mechme behavior.)
Power slate lran slilons may occur:
- Aulonnlically. when critical supply vollage or module lemperalure trigger
levels are encountered.
- Under host control, using available AT commands in response to user choices
(lor example. opting to switch to airplane mode) or opemling condilions.
Table M: Power state transitions (Including volugeltempereture trigger levels)
vou.‘r_m_cxrr 1a TEIP_LO_CIIT -2s
Nonml to Law Pater RF «may suspended
Verne—cm? 2.9 TEIPJILCRIY l 95 |
La. Pot/er to Numd VOLT_HI_NORI 3 5 TEMP.N°RH_LO ‘15
Lou MerloNamel RF IWW resumed
Rom-m m m VOLT_LO_NORII 3.1 mp_ul_uom so
(Ramon vanilla!)
um lime wetting) voLT_Lo_WAlm 3,0 mp_nl_wum l as I
m til/on
(Mm)
1, "mule-«who tempemures I! my own dual m.
2. supplyvolme—uv
38 Mary and Confidentiel - Cements sucjeclrto clams
m ell mwnmnded Mien
um menu or medme
awn-line lmflure ls «manly
IN or high.
m " 74
Power
 .
(NJ-mp vEM:_m_Wu L9,, ”pay you” wunma
may“ > votuugtow 0'
(mung r IEMDJNLMDGM Him lenper‘ure mmlng
ijp <. 1951 new
mun,“ < you
magma > rzw _~
cur-«Lyn > vour
rmInlJrnn ( 15w
mum)“ ‘ mummy
mug-mo , rmfinonmm
W mml Emmi 91mm
Hunted by Power m mm Minded by Power
sm- ut: mum»- “45'5”“ sun no mam,
Fame 54 Voltage/telrpal—nte mung stale mach-n9:
Power interface
Power ramp-up
On Inltal power up. Inrush current depends on the power supply rise time—turn
on firm >100 us Is required for < 3A Inrush current.
The supply vo|iage must remain Within speCItied tolerances while this Is occurring
Power-up timing
The unrt Is ready to enumerate wuih a USB host Wl|h|l1 a maxmurn at 3—5
seconds after power-up. Figure 6-2 on page 49 Illustrates the power-up timing
sequence,
um.
Stu-tun um:
Fun 52 Power-0n umtnp mum
Note Stamp Ilme is Inc M13 afla poweI-up when the mam IS ready to beam the
enumeration sequence
Rev 4 Sep 11 Proprietary and Confidemual - Contents subject to change 49
Product Technical Specmcation 8. Customer Design Guidelines
Power supply noise
Noise In lhe power supply can lead to noise in lhe RF signal.
The power supply npple Iimll lor lhe module :5 no more men 200 mVp
 ( as the snze In bytes)
Verizon Vifireless requlres 1he MTU size to be 1428 bytes
Example
driverlnsiailer IMTUSlze= 1428
TCP window size (Windows XP)
The TCP wrndow 5119 for Wlndows XP IS 128 kB (131072 Was).
Rev 4 Sep 11 Proprietary and Confidential - Contents subpci to change 51

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