Getac Technology AP6234E WLAN module User Manual Module

Getac Technology Corporation WLAN module Module

Contents

User Manual Module

 AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information   Doc. NO:     正基科技股份有限公司   SPECIFICATION  SPEC. NO.:  REV:    1.4  DATE:  10.12. 2013  PRODUCT  NAME: AP6234             APPROVED CHECKED PREPARED DCC ISSUE NAME
 AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information   Doc. NO:       AMPAK     AP6234 WiFi 11a/b/g/n +Bluetooth 4.0 SIP Module Spec Sheet
 AMPAK Technology Inc.      www.ampak.com.tw          Proprietary & Confidential Information   Doc. NO:                                                             1Revision History                                Date  Revision Content  Revised By  Version2012/10/18   - Initial released  Brian  1.0 2012/12/18   - Pin definition modify  Joe  1.1 2013/01/23   - Pin definition modify  Joe  1.2 2013/04/26   - Specification modify  Joe  1.3 2013/10/12   - Block Diagram modify  Brian  1.4
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   2ContentsContents ................................................................................................................... 21.Introduction ......................................................................................................... 32.Features ............................................................................................................... 43.Deliverables ........................................................................................................ 53.1 Deliverables .................................................................................................... 53.2 Regulatory certifications ................................................................................. 54.General Specification ......................................................................................... 64.1 General Specification ......................................................................................  64.2 Voltages .......................................................................................................... 64.2.1 Absolute Maximum Ratings .................................................................... 64.2.2 Recommended Operating Rating ........................................................... 6The module requires two power supplies: VBAT and VDDIO. ......................... 65.WiFi RF Specification ......................................................................................... 75.1 2.4GHz & 5GHz RF Specification ................................................................... 76.Bluetooth Specification ...................................................................................... 96.1 Bluetooth Specification ................................................................................... 97.Pin Assignments ...............................................................................................  107.1 Pin Outline .................................................................................................... 107.2 Pin Definition ................................................................................................ 108.Dimensions ....................................................................................................... 128.1 Physical Dimensions..................................................................................... 128.2 Layout Recommendation ..............................................................................  139.External clock reference .................................................................................. 149.1 SDIO Pin Description ....................................................................................  1410.Host Interface Timing Diagram ........................................................................  1510.1 Power-up Sequence Timing Diagram ......................................................... 1510.2 SDIO Default Mode Timing Diagram........................................................... 1710.3 SDIO High Speed Mode Timing Diagram ................................................... 1811.Recommended Reflow Profile ......................................................................... 1912. Package Information ........................................................................................  2012.1Label ............................................................................................................ 20Label C Inner box label . .................................................................................... 20Label D Carton box label . ................................................................................. 2012.2 Dimension ................................................................................................... 2112.3 MSL Level / Storage Condition ................................................................... 23
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   31. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module, with integrated dual band (2.4GHz/5GHz) IEEE 802.11 a/b/g and single-stream IEEE 802.11n MAC/baseband/radio and Bluetooth 4.0.  The integrated module provides SDIO V2.0 Host interface for Wi-Fi, high-speed UART is provided for the Bluetooth Host interface.   This compact module is a total solution for a combination of Wi-Fi dual mode + BT4.0 technologies. The module is specifically developed for mobiles, tablets or handheld wireless system devices.
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   42. Features IEEE 802.11x Key Features •    Dual-band 2.4GHz/5GHz 802.11a/b/g/n. •    Single-stream IEEE 802.11n support for 20MHz and 40MHz channels   provides PHY layer rates up to 150Mbps. •    WLAN host interface options: SDIO v2.0 — up to 50 MHz clock rate •    Support a single antenna shared between WLAN and Bluetooth. •    Security: WEP, WPS, WPA, WPA2, WMM, WAPI, AES,…    Bluetooth Features •   Bluetooth V4.0(BLE) Low Energy with provisions for supporting future specifications. •    Bluetooth Class1 or Class2 transmitter operation. •    BT host digital interface UART(up to 4 Mbps) with support all Bluetooth4.0   package types •    Multipoint operation with up to seven active ACL links, three active SCO and   eSCO connections.   •    Full support for power savings modes (standard sniff, deep sleep modes) •    ECI - enhanced coexistence support, ability to coordinate BT SCO   transmissions around WLAN receives     A simplified block diagram of the module is depicted in the figure below.
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   53. Deliverables   3.1 Deliverables The following products and software will be part of the product.   Module with packaging  Evaluation Kits   Software utility for integration, performance test.  Product Datasheet.   Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification.
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   64. General Specification 4.1 General Specification                4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol Description Min. Max. UnitVBAT  Input supply Voltage  -0.5  5  V VDDIO Digital/Bluetooth/SDIO/ I/O Voltage  -0.5  3.6  V   4.2.2 Recommended Operating Rating     The module requires two power supplies: VBAT and VDDIO.  Min. Typ. Max. Unit   Operating Temperature  -30  25  85  deg.CVBAT  3.0 3.6 4.8 V VDDIO  1.6 3.3 3.4 V  Model Name  AP6234 Product Description    Supports Wi-Fi dual mode /Bluetoothfunctionalities Dimension  L x W x H: 12.0 x 12.0 x 1.5 (typical) mm  WiFi Interface  SDIOV2.0 BT Interface  UART/ PCM Operating temperature  -30°C to 85°C Storage temperature  -40°C to 85°C Humidity  Operating Humidity 10% to 95% Non-Condensing
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   75. WiFi RF Specification 5.1 2.4GHz & 5GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard  IEEE 802.11a/b/g/n, WiFi compliant Frequency Range    2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) 5.150 GHz ~ 5.850 GHz (5.0 GHz ISM Band) Number of Channels  2.4GHz:Ch1 ~ Ch11 5.0GHz:Please see the table1 Modulation 802.11a : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK Output Power 802.11a /54Mbps : 13 dBm ± 1.5 dB @ EVM  -25dB 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM  -9dB 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM  -25dB 802.11n /MCS7 : 14 dBm ± 1.5 dB @ EVM  -28dB Receive Sensitivity (11n,20MHz)  @10% PER -    MCS=0    PER @ -88 dBm, typical -  MCS=1     PER @ -84 dBm, typical -    MCS=2    PER @ -82 dBm, typical -    MCS=3    PER @ -80 dBm, typical -    MCS=4    PER @ -77 dBm, typical -    MCS=5    PER @ -74dBm, typical -    MCS=6    PER @ -72 dBm, typical -  MCS=7     PER @ -70 dBm, typical Receive Sensitivity (11n,40MHz)  @10% PER -    MCS=0    PER @ -87 dBm, typical -  MCS=1     PER @ -83 dBm, typical -    MCS=2    PER @ -81 dBm, typical -    MCS=3    PER @ -79 dBm, typical -    MCS=4    PER @ -77 dBm, typical -    MCS=5    PER @ -76 dBm, typical -    MCS=6    PER @ -71 dBm, typical -  MCS=7     PER @ -70 dBm, typical Receive Sensitivity (11g) @10% PER -   6Mbps   PER @ -89 dBm, typical -   9Mbps    PER @ -88 dBm, typical -    12Mbps    PER @ -86 dBm, typical
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   8-    18Mbps    PER @ -84 dBm, typical -    24Mbps    PER @ -82 dBm, typical -    36Mbps    PER @ -78 dBm, typical -    48Mbps    PER @ -75 dBm, typical -  54Mbps   PER @ -73 dBm, typical Receive Sensitivity (11b) @8% PER -  1Mbps    PER @ -95 dBm, typical -    2Mbps    PER @ -94 dBm, typical -    5.5Mbps   PER @ -90 dBm, typical -    11Mbps    PER @ -87 dBm, typical Receive Sensitivity (11a) @10% PER -   6Mbps   PER @ -88 dBm, typical -   9Mbps    PER @ -86 dBm, typical -    12Mbps    PER @ -84 dBm, typical -    18Mbps    PER @ -82 dBm, typical -    24Mbps    PER @ -80 dBm, typical -    36Mbps    PER @ -78 dBm, typical -    48Mbps    PER @ -75 dBm, typical -  54Mbps   PER @ -73 dBm, typical Maximum Input Level  802.11b : -10 dBm 802.11a/g/n : -20 dBm Data Rate 802.11a : 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n: MCS0, MCS1, MCS2, MCS3, MCS4, MCS5, MCS6, MCS7 Antenna Reference  Small antennas with 0~2 dBi peak gain    15GHz Channel table Band (GHz)  Operating Channel Numbers Channel center frequencies(MHz)  5.15GHz~5.25GHz 36 5180 40 5200 44 5220 48 5240  5.25GHz~5.35GHz 52 5260 56 5280 60 5300 64 5320 5.5GHz~5.7GHz 100 5500 104 5520 108 5540 112 5560 116 5580 120 5600 124 5620
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   9128 5640 132 5660 136 5680 140 5700 5.725GHz~5.825GHz 149 5745 153 5765 157 5785 161 5805 6. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard  Bluetooth V4.0 of 1, 2 and 3 Mbps. Host Interface  UART Antenna Reference  Small antennas with 0~2 dBi peak gain   Frequency Band  2.400 GHz ~ 2483.5 GHz Number of Channels  79 channels Modulation  FHSS, GFSK, DPSK, DQPSK RF Specification  Min. Typical. Max. Output Power (Class 1.5)    10 dBm   Output Power (Class 2)    2 dBm   Sensitivity @ BER=0.1% for GFSK (1Mbps)   -86 dBm  Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps)   -86 dBm  Sensitivity @ BER=0.01% for 8DPSK (3Mbps)   -80 dBm  Maximum Input Level GFSK (1Mbps):-20dBm π/4-DQPSK (2Mbps) :-20dBm 8DPSK (3Mbps) :-20dBm
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   107. Pin Assignments 7.1 Pin Outline < TOP VIEW >   7.2 Pin Definition  NO Name Type Description 1  GND  - Ground connections 2  WL_BT_ANT  I/O RF I/O port 3  GND  - Ground connections 4  NC  - Floating (Don’t connected to ground) 5  NC  - Floating (Don’t connected to ground) 6  BT_WAKE  I  HOST wake-up Bluetooth device 7  BT_HOST_WAKE  O  Bluetooth device to wake-up HOST 8  NC  - Floating (Don’t connected to ground) 9  VBAT  P  Main power voltage source input 10  XTAL_IN  I  XTAL oscillator input 11  XTAL_OUT  O  XTAL oscillator output 12  WL_REG_ON I Internal regulators power enable/disable 13  WL_HOST_WAKE  O  WLAN to wake-up HOST
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   1114  SDIO_DATA_2  I/O SDIO data line 2 15  SDIO_DATA_3  I/O SDIO data line 3 16  SDIO_DATA_CMD  I/O SDIO command line 17  SDIO_DATA_CLK  I/O SDIO clock line   18  SDIO_DATA_0  I/O SDIO data line 0 19  SDIO_DATA_1  I/O SDIO data line 1 20  GND  - Ground connections 21  VIN_LDO_OUT  P  Internal Buck voltage generation pin 22  VDDIO  P  I/O Voltage supply input 23  VIN_LDO  P  Internal Buck voltage generation pin 24  LPO  I  Low power oscillator clock input (32.768KHz) 25  PCM_OUT  O  PCM Data output 26  PCM_CLK I/O PCM clock 27  PCM_IN  I  PCM data input 28  PCM_SYNC  I/O PCM sync signal 29  NC  - Floating (Don’t connected to ground) 30  NC  - Floating (Don’t connected to ground) 31  GND  - Ground connections 32  NC  - Floating (Don’t connected to ground) 33  GND  - Ground connections 34  BT_RST_N  I  Low asserting reset for Bluetooth core 35  NC  - Floating (Don’t connected to ground) 36  GND  - Ground connections 37  NC  - Floating (Don’t connected to ground) 38  NC  - Floating (Don’t connected to ground) 39  NC  - Floating (Don’t connected to ground) 40  NC  - Floating (Don’t connected to ground) 41  UART_RTS_N O  Bluetooth UART interface 42  UART_TXD O  Bluetooth UART interface 43  UART_RXD I  Bluetooth UART interface 44  UART_CTS_N I  Bluetooth UART interface 45  TP1  - Floating (Don’t connected to ground) 46  TP2  - Floating (Don’t connected to ground) 47  TP3  - Floating (Don’t connected to ground)
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   128. Dimensions 8.1 Physical Dimensions (Unit: mm)            < TOP VIEW >                < Side View >  < TOP VIEW >
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   138.2 Layout Recommendation (Unit: mm)  < TOP VIEW >
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   149.   External clock reference External LPO signal characteristics Parameter Specification Units Nominal input frequency  32.768  kHz Frequency accuracy  30 ppm Duty cycle  30 - 70  % Input signal amplitude  400 to 1800 mV, p-p Signal type  Square-wave  - Input impedance     >100k <5   pF Clock jitter (integrated over 300Hz – 15KHz)  <1  Hz Output high voltage  0.7Vio - Vio  V   9.1 SDIO Pin Description The module supports SDIO version 2.0 for 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.    Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)   Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B)   Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize/ByteCount=512B)  SDIO Pin Description SD 4-Bit Mode DATA0  Data Line 0 DATA1  Data Line 1 or Interrupt DATA2  Data Line 2 or Read Wait DATA3  Data Line 3 CLK Clock CMD Command Line
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   15 10.    Host Interface Timing Diagram 10.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable. ※  WL_REG_ON: Used by the PMU to power up the WLAN section. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset.   ※  BT_RST_N: Low asserting reset for Bluetooth only. This pin has no effect on WLAN and does not control any PMU functions. This pin must be driven high or low (not left floating).    WLAN=ON, Bluetooth=ON
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   16 WLAN=OFF, Bluetooth=OFF   WLAN=ON, Bluetooth=OFF   WLAN=OFF, Bluetooth=ON
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   1710.2 SDIO Default Mode Timing Diagram
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   1810.3 SDIO High Speed Mode Timing Diagram
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   19 11.  Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times   2.5 /sec℃ 2.5°C/sec40~70 sec250℃
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   2012. Package Information 12.1Label  Label A Anti-static and humidity notice  Label B MSL caution / Storage Condition  Label C Inner box label .  Label D Carton box label .
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   2112.2 Dimension
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   22                               AB C Humidity indicator Desiccant C D
AP6234 Datasheet AMPAK Technology Inc.      www.ampak.com.tw        Proprietary & Confidential Information       Doc. NO:   2312.3 MSL Level / Storage Condition   ※NOTE : Accumulated baking time should not exceed 96hrs

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