Grid Connect WIFI300SMT01 GC-WIFI300-SMT-01 User Manual 88MW300 302 Technical Product Brief
Grid Connect Inc. GC-WIFI300-SMT-01 88MW300 302 Technical Product Brief
User manual
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MARVELL CONFIDENTIAL - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
88MW300/302
WLAN Microcontroller
Technical Product Brief
Copyright © 2016 Marvell CONFIDENTIAL Doc. No. MV-S109938-00 Rev. C
May 12, 2016, 2.00 Document Classification: Proprietary Page 1
PRODUCT OVERVIEW
The Marvell® 88MW300/302 is a highly integrated,
low-power WLAN Microcontroller System-on-Chip (SoC)
solution designed for a broad array of smart devices for
Internet of Things (IoT), wearables, accessories,
Machine-to-Machine (M2M), home automation, and
Smart Energy applications.
A high degree of integration enables very low system
costs requiring only a single 3.3V power input, a
38.4 MHz crystal, and SPI Flash. The RF path needs
only a lowpass filter for antenna connection.
The SoC includes a full-featured W LAN subsystem
powered by proven and mature IEEE 802.11n/g/b
Marvell technology. The WLAN subsystem integrates a
WLAN MAC, baseband, and direct-conversion RF radio
with integrated PA, LNA, and transmit/receive switch. It
also integrates a CPU subsystem with integrated
memory to run Marvell WLAN firmware to handle real
time WLAN protocol processing to off-load many WLAN
functions from the main application CPU.
The 88MW300/302 application subsystem is powered by
an ARM Cortex-M4F CPU that operates up to 200 MHz.
The device supports an integrated 512 KB SRAM,
128 KB mask ROM, and a QSPI interface to external
Flash. An integrated Flash Controller with a 32 KB
SRAM cache enables eXecute In Place (XIP) support for
firmware from Flash.
The SoC is designed for low-power operation and
includes several low-power states and fast wake-up
times. Multiple power domains and clocks can be
individually shut down to save power. The SoC also has
a high-efficiency internal PA that can be operated in
low-power mode to save power. The microcontroller and
WLAN subsystems can be placed into low-power states,
independently, supporting a variety of application use
cases. An internal DC-DC regulator provides the 1.8V
rail for the WLAN subsystem.
The SoC provides a full array of peripheral interfaces
including SSP/SPI/I2S (3x), UART (3x), I2C (2x), General
Purpose Timers and PWM, ADC, DAC, Analog
Comparator, and GPIOs. It also includes a hardware
cryptographic engine, RTC, and Watchdog Timer. The
88MW302 includes a high speed USB On-The-Go
(OTG) interface to enable USB audio, video, and other
applications.
A complete set of digital and analog interfaces enable
direct interfacing for I/O avoiding the need for external
chips. The application CPU can be used to support
custom application development avoiding the need for
another microcontroller or processor.
Figure 1 shows an overall block diagram of the device.
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88MW300/302
Technical Product Brief
Doc. No. MV-S109938-00 Rev. C CONFIDENTIAL Copyright © 2016 Marvell
Page 2 Document Classification: Proprietary May 12, 2016, 2.00
Applications
White goods/appliances—refrigerator, washer,
dryer, oven range, microwave, dishwasher, water
heater, air conditioner
Consumer devices and accessories—toys,
speakers, headset, alarm clock, gaming accessory,
remote control
Home automation—smart outlet, light switch,
security camera, thermostat, sprinkler controller,
sensor, door lock, door bell, garage door, security
system
Personal health devices—weighing scale,
glucometer, blood pressure monitor, fitness
equipment
IoT/wearables—coffee pot, rice cooker, vacuum
cleaner, air purifier, smart watch, fitness bracelet,
pet monitor
Commercial/industrial—lighting, building
automation, asset management, Point of Sale
(POS) sales
Gateways—Connecting IR, sub-Gig or Legacy RF,
Bluetooth Smart, ZigBee, ZWave and other radios to
Wi-Fi/IP network
Key Features
Highly integrated SoC requiring very few external
components for a full system operation
Multiple low-power modes and fast wake-up times
Full-featured, single stream 802.11n/g/b WLAN
High-efficiency PA with a low-power (10 dB) mode
Cortex-M4F application CPU for applications with
integrated 512 KB SRAM and 128 KB mask ROM
Flash Controller with embedded 32 KB SRAM
cache to support XIP from external SPI Flash
Secure boot
Full set of digital and analog I/O interfaces
Power Management
Power modes—active, idle, standby, sleep, shutoff,
power-down
Integrated high efficiency buck DC-DC converter
Independent power domains
Brown-out detection
Integrated POR
Wake-up through dedicated GPIO, IRQ, and RTC
Figure 1: Block Diagram
WL_MCI_REFCLK
DMA
Controller
AHB Bus
Fabric
I/O Multiplexer
M0
M1
S0
S1
RTC
PHY
M2
S2
S3
S4
USB
Controller
M3
M4
S7
S5
S6
S8
4k SRAM
JTAG SWD
NVIC
Cortex-M4
MPU FPU
Code RAM0
Code RAM1
Data RAM0
Data RAM1
Flash/Cache
Controller
UART
WDT
PINMUX
SSP/SPI /I2S
I2C
PMU
AHB
decode
ROM
AES/CRC
32 kHz GEN
32 MHz GEN
PLL
Microcontroller
88MW300/302
WLAN
32 KB
SRAM
APB0
APB1
BUCK18
Feroceon
CPU
SRAM/
ROM JTAG
V18
LDO11
V11
.
.
.
I2C
QSPI
SSP/SPI/I2S
ADC/T-Sens
DAC
ACOMP
UART
GPIO
Timer/PWM
X2/12
LDO11
V11V18
LDO18
Digital
Analog
I/O
Digital
Analog
I/O
Digital
Analog
I/O
Digital
Analog
I/O
Digital
Analog
I/O
Digital
Analog
I/O
802.11 MAC
Tx/Rx 1x1
SISO
802.11
Baseband
(DSSS/OFDM,
1x1 SISO)
LNA
Direct
Conversion
WLAN RF
1x1 SISO
PA
T/R
Switch
2.4 GHz
Security/Encryption
VDD Power
Management
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Product Overview
Chip Package
Copyright © 2016 Marvell CONFIDENTIAL Doc. No. MV-S109938-00 Rev. C
May 12, 2016, 2.00 Document Classification: Proprietary Page 3
Chip Package
88MW300—68-pin QFN, 8x8 mm
•USB OTG not supported
•35 GPIOs
•2 GPTs
88MW302—88-pin QFN, 10x10 mm
•USB OTG supported
•50 GPIOs
•4 GPTs
Temperature
Extended: -30 to 85oC
Industrial: -40 to 85oC
Storage: -55 to 125oC
Wireless
IEEE 802.11n/g/b, 1x1 SISO 2.4 GHz and HT20
Integrated CPU, memory, MAC, DSSS/OFDM
baseband, direct conversion RF radio, encryption
Antenna diversity
CMOS and low-swing sine wave input clock
Low-power with deep sleep and standby modes
Pre-regulated supplies
Integrated T/R switch, PA, and LNA
Optional 802.11n features
One Time Programmable (OTP) memory to
eliminate need for external EEPROM
WLAN Rx Path
Direct conversion architecture eliminates need for
external SAW filter
On-chip gain selectable LNA with optimized noise
figure and power consumption
High dynamic range AGC function in receive mode
WLAN Tx Path
Integrated PA with power control
Optimized Tx gain distribution for linearity and noise
performance
WLAN Local Oscillator
Fractional-N for multiple reference clock support
Fine channel step
WLAN Encryption
WEP 64- and 128-bit encryption with hardware TKIP
processing (WPA)
AES-CCMP hardware implementation as part of
802.11i security standard (WPA2)
Enhanced AES engine performance
AES-Cipher-Based Message Authentication Code
(CMAC) as part of the 802.11w security standard
WLAN Authentication and Privacy Infrastructure
(WAPI)
IEEE 802.11 Standards
802.11 data rates of 1 and 2 Mbps
802.11b data rates of 5.5 and 11 Mbps
802.11g data rates 6, 9, 12, 18, 24, 36, 48, and
54 Mbps for multimedia content transmission
802.11g/b performance enhancements
802.11n compliant with maximum data rates up to
72.2 Mbps (20 MHz channel)
Table 1: Package Feature Differences1
1. All I/O features are muxed on GPIOs, except WLAN RF
TX/RX, USB, reference clock, and reset functionality.
Feature 68-Pin 88-Pin
GPIO 35 total
GPIO_0 to GPIO_10
GPIO_16
GPIO_22 to GPIO_33
GPIO_39 to GPIO_49
50 total
GPIO_0 to
GPIO_49
USB 2.0
OTG
-- 1
GPT 2 4
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Technical Product Brief
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Page 4 Document Classification: Proprietary May 12, 2016, 2.00
Microprocessor
Processor
ARM Cortex-M4F, 32-bit
200 MHz main bus clock
Memory
128 KB ROM
512 KB RAM
Flash Controller
Supports QSPI Flash devices
Memory-mapped access to QSPI Flash devices
32 KB SRAM cache
Digital Interfaces
3x I2S stereo
3x SPI master/slave
2x I2C master/slave
3x UART
1x USB OTG 2.0, high-speed
1x QSPI
Up to 50 GPIOs
2x wake-up pins
Analog
2-step ADC with integrated PGA and configurable
resolution/speed
•12-bit/2 MHz sample(s) for fast conversion
•16-bit/16 kHz sample/s with voice quality
•8 single channels or 4 differential channels
2-Channel or 1 differential channel DAC,
10-bit/500 ksps
2 Analog Comparators with programmable
speed/current
On-die/off-chip temperature sensing and battery
monitor
Counters/Timers/PWM
General Purpose Timers (GPT) with LED PWM
support
Real Time Clock (RTC)
CM4 system tick
Watchdog Timer
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and,
if not installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement
The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any
portable device, for example, USB dongle like transmitters is forbidden.
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This
transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular
must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
If the FCC identification number is not visible when the module is installed inside another device, then the outside
of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID:
2AFC3WIFI300SMT01 or Contains FCC ID: 2AFC3WIFI300SMT01”
when the module is installed inside another device, the user manual of this device must contain below warning
statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the
user documentation that comes with the product