HON HAI PRECISION IND T77H566 WiFi/BT Module User Manual 802

HON HAI Precision Ind. Co., Ltd. WiFi/BT Module 802

User Manual rev.pdf

COMPANY CONFIDENTIAL Preliminary Datasheet 1 BCM4356 Dual-Band 2x2 802.11ac and Bluetooth v4.1 Combo Module Project Name M.2 Type1216 BCM4356 WLAN + BT Combo Module Foxconn Part No. T77H566.01 Customer Model Name. PK29S005P10 Product Revision 01S1 HON HAI PRECISION IND. CO., LTD. No.2, 2nd Dong Huan Road, 10th YouSong lndustrial District, Longhua Town, Baoan, ShenZhen Tel: +86-755-28128988#29413 Fax: +86-755-28129800#64886 Revision Note WiFi/BT Module WiFi/BT Module
COMPANY CONFIDENTIAL Preliminary Datasheet 2 Index 1. REVISION HISTORY ................................................................................................................................................... 3 2. INTRODUCTION .......................................................................................................................................................... 4 2.1 HARDWARE ARCHITECTURE .................................................................................................................................... 4 2.2 FEATURES ................................................................................................................................................................ 5 2.3 STANDARDS COMPLIANCE ....................................................................................................................................... 5 3. MECHANICAL SPECIFICATION .............................................................................................................................. 6 3.1 MECHANICAL DRAWING ............................................................................................................................................ 6 3.2 PCB STACK .............................................................................................................................................................. 6 3.3 RECOMMENDED LGA LAND PATTERN ..................................................................................................................... 7 3.4 RECOMMENDED STENCIL APERTURE ....................................................................................................................... 7 3.5 RF CONNECTOR TYPE ............................................................................................................................................. 8 3.6 RF CABLE ASSEMBLY NOTICE .................................................................................................................................. 9 3.7 RF PORT DEFINE ...................................................................................................................................................... 9 4. LGA PIN-OUT DEFINITION ..................................................................................................................................... 10 4.1 MODULE PIN-OUT DEFINITION ................................................................................................................................. 10 4.2 PIN DEFINITION ....................................................................................................................................................... 11 5. PRODUCT SPECIFICATION ................................................................................................................................... 13 5.1 DC ELECTRICAL SPECIFICATION ........................................................................................................................... 13 5.2 RF CHARACTERISTICS(TBD) ................................................................................................................................. 13 5.3 POWER UP SEQUENCE AND TIMING ...................................................................................................................... 15 5.3.1 Control signal Timing (WLAN=ON, BT=ON) ........................................................................................... 16 5.3.2 Control signal Timing (WLAN=OFF, BT=OFF) ....................................................................................... 16 5.3.3 Control signal Timing (WLAN=ON, BT=OFF) ......................................................................................... 17 5.3.3 Control signal Timing (WLAN=OFF, BT=ON) ......................................................................................... 17 5.3.4 WLAN Boot Up Sequence .......................................................................................................................... 17 5.4 UART HOST INTERFACE TIMING ........................................................................................................................... 18 5.5 PCM INTERFACE TIMING ....................................................................................................................................... 19 6.SCHEMATIC REFERENCE DESIGN ...................................................................................................................... 24 7. SOFTWARE REQUIREMENT(TBD) ....................................................................................................................... 26 8. REGULATORY(TBD) ................................................................................................................................................ 26 9. QUALITY ..................................................................................................................................................................... 26 10. PACKAGE INFORMATION ................................................................................................................................... 27 11. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS ..................................................................... 28 11.1 TEMPERATURE ..................................................................................................................................................... 28 11.2 PCB BENDING ...................................................................................................................................................... 28 11.3 HANDLING ENVIRONMENT .................................................................................................................................... 28 11.4 STORAGE CONDITION .......................................................................................................................................... 28 11.5 BAKING CONDITION .............................................................................................................................................. 28 11.6 SOLDERING AND REFLOW CONDITION .................................................................................................................. 29
COMPANY CONFIDENTIAL Preliminary Datasheet 3 1. Revision History Date Change Note Author REV Note 2014-07-25 Initial release(draft) Robin Xu 0.1 2014-07-30 Add customer project code Robin Xu 0.2 2014-08-21 1.Update the block diagram and support BTv4.1 in section2 2.Update the ME drawing in section3.1 3.Update the Recommended stencil aperture in setion3.4 Robin Xu 0.3 2014-11-14 Update WiFi Transmit Output Power Ru-yan Li 0.4 2014-12-2 Add 3.7 RF port define Ru-yan Li 0.5 2014-12-25 1.Update WLAN host interface description 2.Update BT RX sensitivity level Ru-yan Li 0.6
COMPANY CONFIDENTIAL Preliminary Datasheet 4 2. Introduction Project Name: M.2 Type 1216 BCM4356 WLAN+BT Combo Module Project Number: T77H566.01 Form factor M.2 Type 1216 LGA Host Interface WLAN: PCIe mode complies with PCI Express base specification revision 3.0 for x1 lane and power management running at Gen1 speeds. BT: UART for data, PCM for audio PCB 6-layer HDI design RF connector Two MHF-4 RF connectors on module This documentation describes the engineering requirements specification of this M.2 1216 type module. WLAN is compliant with IEEE 802.11 a/b/g/n and 2x2 IEEE 802.11ac MAC/ baseband/radio, Bluetooth is compliant with Bluetooth v4.1+HS. This module takes advantage of the high throughput and extended range of Broadcom MIMO solution It is a confidential document of Foxconn. * For b/g/n and a/b/g/n module, Foxconn HW/FW is the same, platform use different firmware and driver to enable or disable 5GHz 11ac function. 2.1 Hardware Architecture The WLAN+BT combo module is designed base on BROADCOM BCM4356 chipset with external LNA for both 2.4G and 5GHz. The BCM4356 is a complete dual-band (2.4GHz and 5GHz) Wi-Fi 2X2 MIMO MAC/PHY/Radio System-on-a-Chip. This Wi-Fi single–chip device provides a high level of integration with dual-stream IEEE 802.11ac MAC/baseband/radio, Bluetooth v4.1 + HS. In IEEE802.11ac mode, the WLAN operation supports rates of MCS0-MCS9 (up to 256QAM) in 20MHz, 40MHz and 80MHz channels for data rates up to 866.7Mbps. In addition, all the rates specified in IEEE802.11a/b/g/n are supported. See the block diagram as below: WiFi/BT Module
COMPANY CONFIDENTIAL Preliminary Datasheet 5 2.2 Features This module supports the following features:  IEEE 802.11a/b/g/n/ac dual-band 2x2 MIMO radio with virtual-simultaneous dual-band operation  Bluetooth v4.1+EDR with integrated class1 PA  Enhanced Bluetooth and WLAN coexistence performance  WLAN PCIe module complies with PCI express base specification for x1 lane and power management running at Gen1 speeds.  Integrated ARMCR4TM processor with tightly coupled memory for complete WLAN subsystem functionality minimizing the need to wake up the applications processor for standard WLAN functions. This allows for further minimization of power consumption, while maintaining the ability to field upgrade with features,  On-chip memory includes 768KB SRAM and 640KB ROM.  OneDriverTM software architecture for easy migration from existing embedded WLAN and Bluetooth devices as well as future devices.  TX and RX low-density parity check (LDPC) support for improved range and power efficiency.  Supports IEEE802.11ac/n beam forming.  Bluetooth supports a high–speed UART interface(up to 4Mbps) and PCM for audio  Bluetooth Smart Audio technology improves voice and music quality to headsets  Bluetooth low power inquiry and page scan  Bluetooth low energy(BLE) support  Bluetooth Packet Loss Concealment(PLC)  Bluetooth Wide Band Speech(WBS)  GP/HF compliance 2.3 Standards Compliance  Bluetooth 2.1+EDR  Bluetooth 3.0+HS  Bluetooth 4.1(Bluetooth Low Energy)  IEEE802.11ac mandatory and optional requirements for 20MHz,40MHz and 80MHz channels  IEEE802.11n  IEEE802.11a  IEEE802.11b  IEEE802.11g  IEEE802.11d  IEEE802.11h  IEEE802.11i  Security - WEP - WPA/WPA2 - WMM/WMM-PS(U-APSD)/WMM-SA - AES(Hardware Accelerator) - TKIP(Hardware Accelerator) - CKIP(SW support)  Proprietary Protocols - CCXv2 - CCXv3 - CCXv4 - CCXv5  IEEE802.15.2 coexistence compliance-on silicon solution compliant with IEEE 3wire requirements The module will the following future draft/standards:  IEEE802.11r-Fast Roaming (between APs)  IEEE802.11w-Secure Management Frames  IEEE802.11 Extensions: - IEEE802.11e QoS Enhancements(In accordance with the WMM spec, QoS is already supported) - IEEE802.11h 5GHz Extensions - IEEE802.11i MAC Enhancements - IEEE802.11k Radio Resource Measurement
COMPANY CONFIDENTIAL Preliminary Datasheet 6 3. Mechanical Specification 3.1 Mechanical Drawing Typical module dimension (W x L): 12mmx16mm. Max Z-height is 1.53mm. Unit:mm 3.2 PCB stack 6 Layers, HDI, thickness:0.43mm +/-0.05mm
COMPANY CONFIDENTIAL Preliminary Datasheet 7 3.3 Recommended LGA Land Pattern Unit: mm TOP VIEW Suggest use “solder-mask on pad” design for main-board to avoid the soldering short. 3.4 Recommended stencil aperture Remark: Red stencil layer Green (pad layer) Below is recommendation about respectively defined apertures as A,B,B`,C and C`  Stencil thickness=0.12mm A=24*24 mil2 B=22*9 mil2 B`=24*9 mil2 C=40*40 mil2 C`=29.5*29.5mil2  Define space between apertures as D and E D=11mil E=19.5mil
COMPANY CONFIDENTIAL Preliminary Datasheet 8 3.5 RF Connector Type  The standard 2x2mm size RF receptacle connectors to be used in conjunction with the M.2 boards/modules  Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable Prefer to use 1.13mm diameter cable for lower cable loss  1.2mm max. mated height for low profile design Example of IPEX RF connector IPEX P/N: 20449-001E (MHF-4)  Antenna Placement Antenna Interface Remark ANT1 WLAN/BT Main ANT2 WLAN AUX
COMPANY CONFIDENTIAL Preliminary Datasheet 9 3.6 RF cable assembly notice 1> Mating/Unmating Jig We recommend to use below Jig for mating/Unmating RF cable 2> Mating method of RF cable Please push as gently as possible while mating plug with receptacle. (The force must be 30N Max.) 3.7 RF port define Main ANT for WiFi and BT, Aux ANT for WiFi.
COMPANY CONFIDENTIAL Preliminary Datasheet 10 4. LGA Pin-out Definition 4.1 Module pin-out definition 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 105 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 108 1 NC GND 76 2 NC GND 75 3 NC GND 74 4 3.3V GND GND 3.3V 73 5 3.3V 97 104 3.3V 72 6 GND GND 71 7 NC BT_USB_DP 70 8 NC BT_USB_DN 69 9 NC GND 68 10 NC GND GND NC 67 11 NC 98 103 NC 66 12 NC WLAN_LED_L 65 13 NC BT_LED_L 64 14 NC BT_REG_ON 63 15 NC GND 62 16 NC GND GND BT_PCM_CLK 61 17 GND 99 102 BT_PCM_OUT 60 18 NC BT_PCM_IN 59 19 NC BT_PCM_SYNC 58 20 GND BT_UART_RTS_L 57 21 NC BT_UART_RXD 56 22 NC GND GND BT_UART_TXD 55 23 GND 100 101 BT_UART_CTS_L 54 24 BT_DEV_WAKE BT_UART_HOST_ WAKE_L 53 25 NC SDIO_CLK 52 26 GND SDIO_CMD 51 27 SUSCLK(32KHz) SDIO_DATA0 50 28 WL_RFDISABLE_L SDIO_DATA1 49 106 GND PCIE_PME_L PCIE_CLKREQ_L PCIE_PERST_L GND PCIE_REFCLKN PCIE_REFCLKP GND PCIE_TDN PCIE_TDP GND PCIE_RDN PCIE_RDP GND VIO NC NC WL_REG_ON SDIO_WAKE_L SDIO_DATA3 SDIO_DATA2 GND 107 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Top view
COMPANY CONFIDENTIAL Preliminary Datasheet 11 4.2 Pin definition Pin No. Pin Name Type Description Voltage Connecting 1-3, 7-16, 18,19,21, 22,25, 43-44,66, 67 NC - No connection - No 4,5,72,73 3.3V Power DC 3.3V power input 3.3V Yes 24 BT_DEV_WAKE I Bluetooth device wake-up: Signal from the host to the BCM4356 indicating that the host requires attention. • Asserted: The Bluetooth device must wake-up or remain awake. • Deasserted: The Bluetooth device may sleep when sleep criteria are met. The polarity of this signal is software configurable and can be asserted high or low. 1.8V Yes 27 SUSCLK (32KHz) I Suspend Clock is a 32.768 kHz clock supply input that is provided by platform to enable the add-in card to enter reduce power consumption modes. SUSCLK will have a duty cycle that can be as low as 30% or as high as 70%. Accuracy will be up to 200ppm. See the detail spec in section6. 1.8V (Note1) Yes 28 WLAN_RFDISABLE_L I Active low, debounced signal when applied by the system it will disable WLAN radio operation on the add-in cards that implement radio frequency applications. This signal is internal pull-up on the card by default. 1.8V (Note2) No 29 PCIE_PME_L OD PCIe PME Wake. Open Drain with pull up on platform; Active Low 1.8V Yes 30 PCIE_CLKREQ_L OD Clock Request is a reference clock request signal as defined by the PCIe Mini Card CEM specification; Also used by L1 PM Substates. 1.8V Yes 31 PCIE_PERST_L I PE-Reset is a functional reset to the Add-In card as defined by the PCIe Mini Card CEM specification 1.8V Yes 33 PCIE_REFCLKN I PCIe Reference Clock signals (100 MHz) defined by the PCIe specification. - Yes 34 PCIE_REFCLKP 36 PCIE_TDN O PCIe TX differential signals defined by the PCIe specification - Yes 37 PCIE_TDP 39 PCIE_RDN I PCIe RX differential signals defined by the PCIe specification. Add AC cap 0.1uF on PCIe signals of host side. - Yes 40 PCIE_RDP 42 VIO Power Reserved for external 1.8V power source input. If don’t need, MUST keep it floating or open 1.8V (Note3) Option 45 WL_REG_ON I SDIO sideband GPIO pin to enable/disable (reset) the WiFi function. Platform firmware is required to assert/de-assert this pin on every boot (warm and cold). High active. See the detail sequence timing in section5.3. 1.8V Yes 46 SDIO_WAKE_L O SDIO Host Wake. Note in band SDIO wake is not used for non-active modes, Active Low. Require pull up on the host side ( recommended 15K to 100K ) 1.8V No
COMPANY CONFIDENTIAL Preliminary Datasheet 12 47 SDIO_DATA3 I/O SDIO data line 3 1.8V No 48 SDIO_DATA2 I/O SDIO data line 2 1.8V No 49 SDIO_DATA1 I/O SDIO data line 1 1.8V No 50 SDIO_DATA0 I/O SDIO data line 0 1.8V No 51 SDIO_CMD I/O SDIO Command line 1.8V No 52 SDIO_CLK I SDIO clock input 1.8V No 53 BT_UART_HOST_WAKE_L O UART sideband used to wake up host platform via BT device. Open Drain, Active Low. Require pull up on the host side (recommended 15K to 100K ) 1.8V Yes 54 BT_UART_CTS_L I UART Clear To Send connected to RTS on the platform. 1.8V Yes 55 BT_UART_TXD O UART Transmit Data connected to RXD on the platform. 1.8V Yes 56 BT_UART_RXD I UART Receive Data connected to TXD on the platform. 1.8V Yes 57 BT_UART_RTS_L O UART Ready To Send connected to CTS on the platform. 1.8V Yes 58 BT_PCM_SYNC I/O PCM synchronous data SYNC/ I2S Word Select. 1.8V Yes 59 BT_PCM_IN I PCM synchronous data input/ I2S Serial Data IN. 1.8V Yes 60 BT_PCM_OUT O PCM synchronous data output/ I2S Serial Data OUT 1.8V Yes 61 BT_PCM_CLK I/O PCM Clock/ I2S Continuous Serial Clock (SCK) 1.8V Yes 63 BT_REG_ON I Active high. Use GPIO pin to enable/disable the BT function. 1.8V Yes 64 BT_LED_L O BT LED, open drain, active low signal. This signal is used to allow the add-in card to provide status indicators via LED devices that will be provided by the system. 1.8V Option 65 WL_LED_L O WLAN LED, open drain, active low signal. This signal is used to allow the add-in card to provide status indicators via LED devices that will be provided by the system. 1.8V Option 69 BT_USB_DN I/O USB Data ± Differential serial data interface compliant to the USB 2.0 Specification - No 70 BT_USB _DP 6,17,20, 23,26,32, 35,38,41, 62,68,71, 74-108 GND GND Ground 0V Yes Note1: for pin27 SUSCLK(32KHz) signal, BCM4356 chipset is capable to tolerate 3.3V, but 1.8V input source is recommended. Note2: for pin28 WLAN_RFDISABLE signal, it is provided for legacy wireless communications add-in cards. It allows users to disable the add-in card’s RF radio operation via a system-provided switch in order to meet public safety regulations or when otherwise desired. The wireless disable signals are active low signals that when asserted (driven low) by the system shall disable radio operation. All transients resulting from mechanical switches need to be de-bounced by system circuitry. It is anticipated that in the future the requirement for hardware wireless disable signals will be deprecated from use in favor of in-band mechanisms. If use SDIO interface, prefer to use pin45 to do software control to implement enable/disable the WiFi function. Default is 1.8V, and is capable to tolerate 3.3V. Note3: for pin42 VIO, by default, MUST keep this pin floating or open. If host platform can provide the external 1.8V power source as module IO voltage input, thus, the LDO inside module can be removed. It’s just for customized design only
COMPANY CONFIDENTIAL Preliminary Datasheet 13 5. Product Specification 5.1 DC Electrical Specification Absolute Maximum Ratings These specifications indicate levels where permanent damage to the device can occur. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended can adversely affect long-term reliability of the device. Recommended Operating Condition Element Symbol Value Unit Minimum Typical Maximum DC supply voltage for the device 3.3V 3.15 3.3 3.45 V Function operation is not guaranteed outside this limit, and operation outside this limit for extended periods can adversely affect long-term reliability of the device. 5.2 RF Characteristics(TBD) All typical performance specification are measured at RF connector port based-on the room temperature(+25℃) and nominal supply voltages The performance will be updated later based-on overall EDVT and regulatory testing.. WLAN Standard IEEE802.11a/b/g/n/ac Data Rate 2.4GHz 802.11b: 11, 5.5, 2, 1 Mbps; 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps 802.11n: HT20 mode: up to 144.4Mbps 5GHz 802.11a: 54, 48, 36, 24, 18, 12, 9, 6 Mbps 802.11n: HT20 mode: MCS0~7,up to 144.4Mbps HT40 mode: MCS0~7,up to 300Mbps 802.11ac VHT20: MCS0~8, up to 173.3Mbps 802.11ac VHT40: MCS0~9, up to 400Mbps 802.11ac VHT80: MCS0~9, up to 866.7Mbps Modulation Techniques 802.11b: CCK, DQPSK, DBPSK 802.11a/g: 64QAM,16QAM, QPSK, BPSK 802.11n: 64QAM,16QAM, QPSK, BPSK 802.11ac: 256QAM,64QAM,16QAM, QPSK, BPSK Frequency Range 2.4GHz~2.4835GHz 5.15GHz~5.845GHz Media Access Control CSMA/CA with ACK Rating Symbol Value Unit DC supply voltage for the device 3.3V -0.5 to 3.9 V
COMPANY CONFIDENTIAL Preliminary Datasheet 14 Transmit Output Power Per Each Chain 2.4GHz: 11b 1~11Mbps: 16+/-1.5dBm 11g 6~54Mbps: 15+/-1.5dBm 11n HT20 MCS0~ MCS7: 14+/-1.5dBm 5GHz: 11a 6~12Mbps: 15+/-1.5dBm 11a 18~54Mbps: 14+/-1.5dBm 11n/ac 20MHz MCS0~ MCS2: 15+/-1.5dBm 11n/ac 20MHz MCS3~ MCS7: 14+/-1.5dBm 11n/ac 40MHz MCS0~ MCS2: 15+/-1.5dBm 11n/ac 40MHz MCS3~ MCS6: 14+/-1.5dBm 11n/ac HT40 MCS7: 13+/-1.5dBm 11ac VHT20 MCS8: 11+/-1.5dBm 11ac VHT40 MCS8~ MCS9: 11+/-1.5dBm 11ac VHT80 MCS0~ MCS2: 14.5+/-1.5dBm 11ac VHT80 MCS3~ MCS6: 14+/-1.5dBm 11ac VHT80 MCS7: 12+/-1.5dBm 11ac VHT80 MCS8~MCS9: 10+/-1.5dBm Typical Minimum Receiver Sensitivity Per Each Chain 2.4GHz: 11b 1Mbps: -94dBm@PER<=8% 11b 11Mbps: -86dBm@PER<=8% 11g 6Mbps: -90dBm@PER<=10% 11g 54Mbps: -72dBm@PER<=10% 11n HT20 MCS0: -89dBm@PER<=10% 11n HT20 MCS7: -68dBm@PER<=10% 5GHz: 11a 6Mbps: -90dBm@PER<=10% 11a 54Mbps: -72dBm@PER<=10% 11n HT20 MCS0: -90dBm@PER<=10% 11n HT20 MCS7: -69dBm@PER<=10% 11n HT40 MCS0: -86dBm@PER<=10% 11n HT40 MCS7: -67dBm@PER<=10% 11ac VHT20 MCS0,Nss1: -89dBm@PER<=10% 11ac VHT20 MCS8,Nss1: -66dBm@PER<=10% 11ac VHT40 MCS0,Nss1: -86dBm@PER<=10% 11ac VHT40 MCS9,Nss1: -62.5dBm@PER<=10% 11ac VHT80 MCS0,Nss1: -82dBm@PER<=10% 11ac VHT80 MCS9,Nss1: -58dBm@PER<=10% BT Radio Modulation Technology FHSS Operating Frequency 2.402GHz ~ 2.4835GHz Channel Numbers 79 channels with 1MHz BW BDR Transmitter Output Power Typical +9dBm for Class1 (TBD) BDR Power Control 2dB≤Power Control Step≤8dB BDR Initial Carrier Freq. Tolerance ≤ ± 75 kHz BDR Carrier Frequency Drift Drift Rate/50us <±20kHz DH1: +/- 25kHz DH3: +/- 40kHz DH5: +/- 40kHz BDR Modulation Characteristics 140kHz ≤ Δf1avg ≤175kHz Δf2max ≥115kHz Δf2avg/Δf1avg ≥0.8 BDR Maximum Receiver Signal -20dBm@BER < 0.1% at 1Mbps BDR Multi-slot Sensitivity -85dBm@BER < 0.1% at 1Mbps BDR Single Sensitivity -85dBm@BER <= 0.1% at 1Mbps
COMPANY CONFIDENTIAL Preliminary Datasheet 15 EDR Relative Power P[GFSK]-4dB<P[DPSK]< P[GFSK]+1dB EDR Stability and Mod Accuracy -75 kHz <ωi < 75 kHz -10kHz<ω0 <10kHz RMS DEVM<=0.13 for all 8DPSK @3Mbps Peak DEVM<=0.25 for all 8DPSK @3Mbps 99% DEVM<=0.2 for 99% 8DPSK @3Mbps BDR Frequency Range FL>2.4GHz,FH<2.4835GHz EDR Sensitivity -86dBm@BER <= 0.01% at 2Mbps -79dBm@BER <= 0.01% at 3Mbps BDR TX Output Spectrum -20dB Bandwidth ≤1MHz LE Output Power <10dBm LE Modulation Characteristics 225kHz ≤ Δf1avg ≤275kHz; Δf2max ≥185kHz for at least 99.9% test packets; Δf2avg/Δf1avg ≥0.8 LE Carrier frequency offset and drift Carrier frequency offset: ±150kHz Carrier Drift: ≤50kHz Drift rate: ≤20kHz/50us LE Receiver Sensitivity -85dBm@PER <= 30.8% 5.3 Power Up Sequence and Timing The BCM4356 has two signals WL_REG_ON [pin45] & BT_REG_ON [pin63] that allows the host to control the power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. Below timing diagram are provided to indicate proper sequencing of the signals for various operational states.  WL_REG_ON [pin45] Used by the PMU to power up the WLAN section. It’s also OR-gated with BT_REG_ON input to control the internal BCM4356 regulators. When this pin is high, the regulatory are enabled and the WLAN section is out of reset. When this pin is low, the WLAN section is in reset. If both the BT_REG_ON and WLAN_REG_ON pins are low, the regulators are disable.  BT_REG_ON [pin63] Used by the PMU(OR-gated with WL_REG_ON) to power up the internal BCM4356 regulators. If both the BT_REG_ON and WLAN_REG_ON pins are low, the regulators are disable. When this pin is high, the regulatory are enabled and the BT section is out of reset. When this pin is low, the BT section is in reset. Remark: VBAT means DC input 3.3V in below timing diagram.
COMPANY CONFIDENTIAL Preliminary Datasheet 16 5.3.1 Control signal Timing (WLAN=ON, BT=ON) 5.3.2 Control signal Timing (WLAN=OFF, BT=OFF)
COMPANY CONFIDENTIAL Preliminary Datasheet 17 5.3.3 Control signal Timing (WLAN=ON, BT=OFF) 5.3.3 Control signal Timing (WLAN=OFF, BT=ON) 5.3.4 WLAN Boot Up Sequence Below figure shows that the WLAN boot-up sequence from power-up to firmware download.
COMPANY CONFIDENTIAL Preliminary Datasheet 18 5.4 UART Host Interface Timing The UART is a standard 4-wire interface(RX,TX,RTS and CTS) with adjustable baud rates from 9600bps to 4.0Mbps.
COMPANY CONFIDENTIAL Preliminary Datasheet 19 5.5 PCM Interface Timing  Short Frame Sync, Master Mode
COMPANY CONFIDENTIAL Preliminary Datasheet 20  Short Frame Sync, Slave Mode
COMPANY CONFIDENTIAL Preliminary Datasheet 21  Long Frame Sync, Master Mode  Long Frame Sync, Slave Mode
COMPANY CONFIDENTIAL Preliminary Datasheet 22  Receive Only, Short Frame Sync
COMPANY CONFIDENTIAL Preliminary Datasheet 23  Receive Only, Long Frame Sync
COMPANY CONFIDENTIAL Preliminary Datasheet 24 6.Schematic Reference Design Following is the evaluation board schematics of M.2 1216 BCM4356 module for reference.  Low Power Clock The BCM4356 module uses a secondary low frequency clock for low power mode timing. A precision external 32.768 KHz clock that meets the specifications listed in Table 3 is required by BCM4356. Table 3: External 32.768K Low Power Oscillator Specifications Parameter Conditions/ Notes Specification Units Min Typ Max Nominal Input Frequency 32.768 - KHz Frequency Accuracy -200 +200 ppm Input signal amplitude +0.2 +1.8 V, p-p Duty cycle Square waveor sine- wave 30 - 70 % Clock jitter 300Hz-15KHz - 5 ns Clock jitter During initial start-up 10,000 ppm
COMPANY CONFIDENTIAL Preliminary Datasheet 25 Below section describes the directionality of some of the interface signals incorporated in the various pinouts. Because some signals have directionality associated with them, their names and locations may be different between the Platform side and the Module side. The Module pinouts are described in Item2.5. The main differences between Platform-side pinouts and Module-side pinouts are shown in Figure 95~96 of M.2 spec. Figure 95: UART and PCM Signal Direction and Signal Name Changes
COMPANY CONFIDENTIAL Preliminary Datasheet 26 7. Software Requirement(TBD) - Operating System Support  Windows 8  Windows Blue or later Android 4.3 and above - WLAN Feature Support  WiFi Direct  WiFi Display  Wi-Fi Miracast (Intel will support WiDi with Miracast interoperability) - WLAN Security Support  WPA/WPA2 Enterprise  CCX Lite or higher  WMM/AES/TKIP/CKIP - WLAN Transmit Power Reduction  Software control to meet FCC SAR requirement  Capability to disable 5GHz operation - Bluetooth Profile Support  Advanced Audio Distribution Profile(A2DP)  Basic Imaging Profile (BIP)  Basic Printing Profile( BPP)  General Audio/Video Distribution Profile (GAVDP )  Generic Object Profile(GOEP)  Hands-Free Profile(HFP)  Headset Profile(HSP)  Human Interface Device Profile(HID)[2.0/4.0]  Object Push Profile (OPP)  Service Port Profile(SPP)  Personal Area Network Profile(PAN) - BLE (Bluetooth Low Energy) Support  Windows 8  Windows Blue or later 8. Regulatory(TBD) The module shall pass below RF certification based-on customer requirement.  USA : FCC P15B / FCC P15C / FCC P15E (FCC ID: TBD)  Canada : IC RSS-210 (IC ID: TBD)  Japan : TELEC  EU : EN300328 V1.8.1 , EN301893 V1.6.1 , EN301489-1/-17 , EN 60950-1 2nd 9. Quality The product quality must be followed-up by Foxconn factory quality control system.
COMPANY CONFIDENTIAL Preliminary Datasheet 27 10. Package information Below is M.2 1216 package information for reference only.
COMPANY CONFIDENTIAL Preliminary Datasheet 28 11. Environmental Requirements and Specifications 11.1 Temperature 11.1.1 Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0 °C to +70°C. 11.1.2 Non-Operating Temperature Conditions Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -30°C to +85°C. 11.2 PCB bending The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly customer. 11.3 Handling environment ESD There are semiconductors on the module, please handle the module under ESD protected and well-controlled environment (<100V). Terminals Handling Notice The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering, please do not touch LGA portion by hand. Notes: As a rule, baking the components in accordance with condition mentioned above, because tape and real for packaging materials have no heat resistance, please bake the components moved into another container such as heat resistance trays. Others 1. Please make sure to avoid mechanical shock and vibration for this module. 2. Please do not drop the module. 3. Please do not clean the module. 11.4 Storage Condition 1. Moisture barrier bag must be stored under 40 ℃, humidity under 90% RH, when the moisture barrier bag is sealed by Foxconn. 2. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. 3. If Moisture barrier bag is open, the component must be stored in an environment of <25±5℃/10%RH 4. Please keep the module at 30℃/70% RH. 11.5 Baking Condition If below two conditions happens: a) Humidity indicator cards read >30% b) Temp < 30 ℃, Humidity <70%RH, moisture barrier bag open over 96 hours Products require baking before mounting Baking condition: 125 ℃, 12-22 hours Baking times: Max. 2 times
COMPANY CONFIDENTIAL Preliminary Datasheet 29 11.6 Soldering and reflow condition 1) Heating method Conventional Convection or IR/convection 2) Temperature measurement Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method. 3) Solder paste composition Sn/3.0Ag/0.5Cu 4) Allowable reflow soldering times: 2 times, based on the below reflow soldering profile Suggest reflow soldering one time for better reliability. 5) Temperature profile Reflow soldering shall be done according to the below temperature profile. 6) Peak temp: 245 degree C Temperature profile for evaluation of solder heat resistance of a component (at solder joint)
1 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Operations in the 5.15-5.25GHz band are restricted to indoor usage only. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for
2 re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: MCLT77H566”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Industry Canada statement: This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable. Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
3 Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 2878D-T77H566”. Plaque signalétique du produit final Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878D-T77H566". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final
4 quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. Caution : (i) the device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; (ii) the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall comply with the e.i.r.p. limit; and (iii) the maximum antenna gain permitted for devices in the band 5725-5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. (iv) Users should also be advised that high-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and 5650-5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. Avertissement: Le guide d’utilisation des dispositifs pour réseaux locaux doit inclure des instructions précises sur les restrictions susmentionnées, notamment : (i) les dispositifs fonctionnant dans la bande 5 150-5 250 MHz sont réservés uniquement pour une utilisation à l’intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux; (ii) le gain maximal d’antenne permis pour les dispositifs utilisant les bandes 5 250-5 350 MHz et 5 470-5 725 MHz doit se conformer à la limite de p.i.r.e.; (iii) le gain maximal d’antenne permis (pour les dispositifs utilisant la bande 5 725-5 825 MHz) doit se conformer à la limite de p.i.r.e. spécifiée pour l’exploitation point à point et non point à point, selon le cas. (iv) De plus, les utilisateurs devraient aussi être avisés que les utilisateurs de radars de haute puissance sont désignés utilisateurs principaux (c.-à-d., qu’ils ont la priorité) pour les bandes 5 250-5 350 MHz et 5 650-5 850 MHz et que ces radars pourraient causer du brouillage et/ou des dommages aux dispositifs LAN-EL. Europe – EU Declaration of Conformity This device complies with the essential requirements of the R&TTE Directive 1999/5/EC. The following test methods have been applied in order to prove presumption of conformity with the essential requirements of the R&TTE Directive 1999/5/EC: - EN 60950-1/A12: 2011 Safety of Information Technology Equipment - EN 62311: 2008 / Article 3(1)(a) and Article 2 2006/95/EC) Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz-300 GHz) (IEC 62311:2007 (Modified))
5 - EN 300 328 V1.8.1: 2012 Electromagnetic compatibility and Radio spectrum Matters (ERM); Wideband Transmission systems; Data transmission equipment operating in the 2,4 GHz ISM band and using spread spectrum modulation techniques; Harmonized EN covering essential requirements under article 3.2 of the R&TTE Directive - EN 301 893 V1.7.1: 2012 Broadband Radio Access Networks (BRAN); 5 GHz high performance RLAN; Harmonized EN covering essential requirements of article 3.2 of the R&TTE Directive - EN 301 489-1 V1.9.2: 2011 Electromagnetic compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements - EN 301 489-17 V2.2.1: 2012 Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 17: Specific conditions for 2,4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment Česky [Czech] [Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES. Dansk [Danish] Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets typebetegnelse] overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF. Deutsch [German] Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet. Eesti [Estonian] Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of equipment] vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele. English Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. Español [Spanish] Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE. Ελληνική [Greek] ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ [name of manufacturer] ΔΗΛΩΝΕΙ ΟΤΙ [type of equipment] ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ. Français [French] Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE. Italiano [Italian] Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE. Latviski [Latvian] Ar šo [name of manufacturer / izgatavotāja nosaukums] deklarē, ka [type of equipment / iekārtas tips] atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem. Lietuvių [Lithuanian] Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas. Nederlands [Dutch] Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG. Malti Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.
6 [Maltese] Magyar [Hungarian] Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus] megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak. Polski [Polish] Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC. Português [Portuguese] [Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE. Slovensko [Slovenian] [Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES. Slovensky [Slovak] [Meno výrobcu] týmto vyhlasuje, že [typ zariadenia] spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES. Suomi [Finnish] [Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä] tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen. Svenska [Swedish] Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG. 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。 前項合法通信，指依電信法規定作業之無線電通信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。 在5.25-5.35秭赫頻帶內操作之無線資訊傳輸設備，限於室內使用。 1. 本模組於取得認證後將依規定於模組本體標示審驗合格標籤。 2. 系統廠商應於平台上標示「本產品內含射頻模組： XXXyyyLPDzzzz-x」字樣。

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