HON HAI PRECISION IND T77H747 NFC Module User Manual rev 4

HON HAI Precision Ind. Co., Ltd. NFC Module rev 4

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User Manual rev 4

COMPANY CONFIDENTIAL 1 NFC (Near Field Communication) NXP NPC300 Module Project Name NFC (NXP NPC300) Module Document Rev. 5.0 FOXCONN Part No. T77H747.10 Module Rev. 005 FRU Part No. 01AX745 Customer Part No. SW10K97523 FOXCONN Label Rev 00S0 Prepared by Reviewed by Approved by Bandy.Jiang Wei.Liao Chang-Fu Lin Revision Note

COMPANY CONFIDENTIAL 2 Revision History T77H747.10 is made in China, Manufactured by HongFuJin Precision Industry Co., LTD Manufacture Site: ChongQing http://www.foxconn.com Revision Date Originator Comment 1.0 2016/01/28 Smile. Ming Initial release 2.0 2016/04/20 Bandy.Jiang 1> Add pin 1 marking for mechanical drawing. 2> Add SM bus support in addition to I2C bus. (in page 4,5) 3> Add description of pin9 (TX_PWR_REQ) signal with active high 1.8V level output. (in page 15) 4> Change the PN of antenna connector from BM05B-ACHSS-A-GAN-ETF(LF)(SN) to BM05B-ACHKS-A-GAN-ETF(HF) 5> Update material in shielding drawing. 6> Following the latest schematic, update the material description into BOM 7> Add Tray ID label, Carton label, Pallet label into label information 8> Update packing information 3.0 2016/04/26 Bandy.Jiang 1> Update Module picture in page 18 2> Update packing information in page 23~24 3> Update vendor PN of host interface connector in page 15 4.0 2016/06/24 Bandy.Jiang 1> Remove R5 from BOM. 2> Change Foxconn project name from T77H747.00 to T77H747.10 3> Change FRU part No. from 00JT548 to 01AX745. 4> Based on above change list, update module picture, BOM, label contents and packing information. 5.0 2016/06/28 Bandy. Jiang 1> Change Host JST part number from ACHR-05V-A-S to ACHR-05V-A-K(HF) in page 14

COMPANY CONFIDENTIAL 3Content 1. INTRODUCTION ............................................................................................................................................................. 4 1.1 SCOPE ....................................................................................................................................................................... 4 1.2 FUNCTION .................................................................................................................................................................. 4 1.3 HARDWARE BLOCK DIAGRAM ....................................................................................................................................... 5 2. ELECTRICAL CHARACTERISTICS ............................................................................................................................. 6 2.1 OPERATING CONDITIONS .............................................................................................................................................. 6 2.1 HOST INTERFACE CHARACTERISTICS .......................................................................................................................... 7 2.2 POWER-UP SEQUENCE ................................................................................................................................................ 8 2.3 POWER-DOWN SEQUENCE ........................................................................................................................................... 9 2.4 FUNCTION TIMING CHARACTERISTICS ......................................................................................................................... 9 3. NFC CONTACTLESS STANDARD CONFORMANCE ............................................................................................ 10 3.1 FREQUENCY INTEROPERABILITY ............................................................................................................................... 10 3.2 SUPPORTED SMART CARD TYPES .............................................................................................................................. 10 3.3 CONTACTLESS INTERFACE UNIT ................................................................................................................................ 11 4. MECHANICAL ARCHITECTURE ................................................................................................................................ 12 4.1 MODULE MECHANICAL DRAWING .............................................................................................................................. 12 4.2 ANTENNA INTERFACE OF NFC MODULE .................................................................................................................... 13 4.3. HOST INTERFACE OF NFC MODULE ......................................................................................................................... 15 4.4. SHIELDING COVER OF NFC MODULE ....................................................................................................................... 18 4.5. PICTURE OF NFC MODULE ....................................................................................................................................... 18 5. PCB PATTERN OF NFC MODULE ............................................................................................................................ 19 5.1 PCB COMPONENT PLACEMENT ................................................................................................................................. 19 5.2 PCB STACK UP AND MATERIALS .............................................................................................................................. 19 6. BOM (BILL OF MATERIALS) OF NFC MODULE ..................................................................................................... 20 7. MARKING INFORMATION .......................................................................................................................................... 21 8. PACKING INFORMATION ........................................................................................................................................... 23

COMPANY CONFIDENTIAL 6 2. Electrical Characteristics 2.1 operating conditions Absolute Maximum Rating Recommended Operating Condition Symbol Condition Min. Typ. Max Unit VBAT Respect to GND 4.5 5.0 5.5 V PVDD Respect to GND 3.0 3.3 3.6 V PMUVCC Respect to GND 1.62 1.8 1.98 V VDD Respect to GND 1.65 1.8 1.95 V VDD(SIM) Respect to GND 1.62 1.8 1.98 V Remark: VDD for TX_PWR_REQ referred voltage, VDD(SIM) for SWIO_UICC referred voltage. Power Consumption Condition Min. Typ. Max Unit Power consumption Reader mode (PCD active) -- 130 -- mA Reader mode (PCD standby) -- 50 -- uA Peer to peer mode (active) -- 130 -- mA Peer to peer mode (standby) -- 50 -- uA Continue TX mode -- 130 -- mA Hard Power Down mode -- 10 -- uA Symbol Condition Min. Typ. Max Unit VBAT Respect to GND -- 5.0 6.0 V PVDD Respect to GND -- 3.3 4.35 V ESD Limit Level HBM -- -- +/-1.0 KV CDM -- -- +/-500 V Operating Temperature -- 0 +25 +70 ℃ Storage Temperature -- -20 +25 +85 ℃ Storage Humidity -- 0 -- +85 %

COMPANY CONFIDENTIAL 72.1 Host interface characteristics I2C-bus Interface The I2C-bus Interface implements a slave I2C-bus interface with integrated shift register, shift timing generation and slave address recognition. I2C-bus Standard mode (100 KHz SCL), Fast mode (400 KHz SCL) and High-speed mode (3.4 MHz SCL) are supported. I2C-bus timings Here below are timings and frequency specifications. High-speed mode I2C-bus timing specification Symbol Parameter Conditions Min Max Unit fCLK(HIF4) Clock frequency on pin HIF4 I2C-bus SCL; Cb<100pF 0 3.4 MHz tSU;STA Set-up time for a repeated START condition Cb<100pF 160 - ns tHD;STA Hold time(repeated) START condition Cb<100pF 160 - ns tLOW LOW period of the SCL clock Cb<100pF 160 - ns tHIGH HIGH period of the SCL clock Cb<100pF 60 - ns tSU;DAT Date set-up time Cb<100pF 10 - ns tHD;DAT Data hold time Cb<100pF 0 - ns tr(HIF3) Rise time on pin HIF3 I2C-bus SDA; Cb<100pF 10 80 ns tf(HIF3) Fall time on pin HIF3 I2C-bus SDA; Cb<100pF 10 80 ns Vhys Hysteresis voltage Schmitt trigger inputs; Cb<100pF 0.1*VPVDD - V Fast mode I2C-bus timing specification Symbol Parameter Conditions Min Max Unit fCLK(HIF4) Clock frequency on pin HIF4 I2C-bus SCL; Cb<400pF 0 400 KHz tSU;STA Set-up time for a repeated START condition Cb<400pF 600 - ns tHD;STA Hold time(repeated) START condition Cb<400pF 600 - ns tLOW LOW period of the SCL clock Cb<400pF 1.3 - ns tHIGH HIGH period of the SCL clock Cb<400pF 600 - ns tSU;DAT Date set-up time Cb<400pF 100 - ns tHD;DAT Data hold time Cb<400pF 0 900 ns Vhys Hysteresis voltage Schmitt trigger inputs; Cb<400pF 0.1* VPVDD - V

COMPANY CONFIDENTIAL 82.2 Power-up sequence There are 2 different supplies for module which allows set up independently, therefore different power-up sequences have to be considered. 1> VBAT is set up before PVDD This is at least the case when VBAT pin is directly connected to the battery and when module VBAT is always supplied as soon the system is supplied. As VEN pin is referred to VBAT pin, VEN voltage shall go high after VBAT has been set. 2> PVDD and VBAT are set up in the same time It is at least the case when VBAT pin is connected to a PMU/regulator which also supplies PVDD.

COMPANY CONFIDENTIAL 92.3 Power-down sequence 2.4 Function timing characteristics Reset timing Symbol Parameter Conditions Min Typ Max Unit tW(VEN) VEN pulse width To reset 10 - - us tboot Boot time - - 2.5 ms Power-up timings Symbol Parameter Conditions Min Typ Max Unit tt(VBAT-VEN) Transition time from pin VBAT to pin VEN VBAT,VEN Voltage=HIGH 0 0.5 - ms tt(VPVDD-VEN) Transition time from pin PVDD to pin VEN PVDD,VEN Voltage=HIGH 0 0.5 - ms tt(VBAT-VPVDD) Transition time from pin VBAT to pin PVDD VBAT,PVDD Voltage=HIGH 0 0.5 - ms Power-down timings Symbol Parameter Conditions Min Typ Max Unit tVBAT(L) Time VBAT LOW 20 - - ms Download mode timings Symbol Parameter Conditions Min Typ Max Unit Tt(DWL_REQ-VEN) Transition time from pin DWL_REQ to pin VEN DWL_REQ,VEN voltage=HIGH 0 0.5 - ms

COMPANY CONFIDENTIAL 103. NFC contactless standard conformance 3.1 Frequency interoperability When in communication, NFC module is generating some RF frequencies. It is also sensitive to some RF signals as it is looking from data in the field. In order to avoid interference with others RF communication, it is required to tune the antenna matching for antenna board. (Remark: The antenna matching tuning is responsible for antenna vendor) It must limit the RF frequency dispersion to 13.56MHz +/-50ppm. 3.2 Supported smart card types Card Types Read CSN (Card Serial Number) Read/Write application data area Supported baud rates NFC Forum Type1 Tag Yes Yes 106 kbps NFC Forum Type2 Tag Yes Yes 106 kbps NFC Forum Type3 Tag Yes Yes 212, 424 kbps NFC Forum Type4 Tag Yes Yes 106 kbps NFC Forum TypeV Tag Yes Yes 106 kbps ISO/IEC 14443 Type A compliance cards Yes Yes (with application) 106 kbps Mifare Classics 1K,4K Yes Yes (with application) 106 kbps Mifare DESFire Yes Yes (with application) 106 kbps Mifare Ultralight Yes Yes (with application) 106 kbps Mifare Plus Yes Yes (with application) 106 kbps (Mifare) SmartMX Yes Yes (with application) 106 kbps ISO/IEC 14443 Type B compliance cards Yes Yes (with application) 106 kbps FeliCa general card Yes Yes (with application) 212, 424 kbps FeliCa Edy card Yes Yes (with application) 212, 424 kbps FeliCa Suica card Yes Yes (with application) 212, 424 kbps FeliCa PKI Option card Yes Yes (with application) 212, 424 kbps HID iCLASS Seos Yes Yes (with application) 106 kbps

COMPANY CONFIDENTIAL 113.3 Contactless interface unit The NFC module supports various communication modes at different transfer speeds and modulation schemes. The following chapters give more detailed overview of selected communication modes. 1> Reader/Writer communication modes Generally 5 reader/writer communication modes are supported:  PCD reader/writer for ISO/IEC 14443A/MIFARE The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.  PCD reader/writer for ISO/IEC 14443B The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.  PCD reader/writer for Jewel/Topaz tags The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.  PCD reader/writer for FeliCa cards The transfer speed includes 212 kbit/s, 424 kbit/s.  VCD reader/writer for ISO/IEC 15693/ICODE The transfer speed includes 1.65 kbit/s, 26.48 kbit/s. 2> Peer to Peer communication modes (ISO/IEC 18092, Ecma 340 NFCIP-1 communication modes) An NFCIP-1 communication takes place between 2 devices:  NFC initiator: generates RF field at 13.56 MHz and starts the NFCIP-1communication.  NFC Target: responds to NFC initiator command either in a load modulation scheme in Passive communication mode or using a self-generated and self-modulated RF field for Active communication mode. The NFCIP-1 communication differentiates between Active and Passive communication modes.  Active communication mode means both the NFC initiator and the NFC target are using their own RF field to transmit data  Passive communication mode means that the NFC target answers to an NFC initiator command in a load modulation scheme. The NFC initiator is active is terms of generating the RF field. The NFC module supports the Active Target, Active Initiator, Passive Target and Passive Initiator communication modes at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s. 3> Card communication modes The NFC module can be addressed as an ISO/IEC 14443A or ISO/IEC 14443B cards. This means that NFC module can generate an answer in a load modulation scheme. The transfer speed includes 106 kbit/s, 212 kbit/s and 424 kbit/s.

COMPANY CONFIDENTIAL 124. Mechanical Architecture 4.1 Module Mechanical Drawing Dimension (WxL): 20mm x 13mm, Module Max Thickness: 2.2mm Pin 1

COMPANY CONFIDENTIAL 134.2 Antenna interface of NFC module 1> Antenna connector Manufacturer: JST Manufacturer PN: BM05B-ACHKS-A-GAN-ETF(HF) Connector Type Manufacture PN Size ACH connector SMT type with 1.2mm pitch JST : BM05B-ACHKS-A-GAN-ETF(HF) 7.8mm x 4.3mm x 1.5mm Connector 2D drawing: Remark: Dimension Tolerance: +/-0.3mm Pin definition: Pin Symbol I/O Refer Note 1 RXP I VDD Positive receiver input 2 TX1 O VDD Antenna output1 3 GND G N/A Ground 4 TX2 O VDD Antenna output2 5 RXN I VDD Negative receiver input S1 GND G N/A Ground S2 GND G N/A Ground Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output

COMPANY CONFIDENTIAL 142> Recommend Antenna cable design.

COMPANY CONFIDENTIAL 154.3. Host interface of NFC module 1> Host interface connector Manufacturer: KYOCERA Manufacturer PN: 046811612000846 + Connector Manufacture PN Size FPC/FFC connector SMT type with 0.5mm pitch KYOCERA: 046811612000846+ 11.73mm x 4.79mm x 1.28mm Remark: The connector is bottom conduct with golden plating of FPC cable Pin Symbol Pin Type Refer Description 1 VBAT Input Power N/A Power supply from system (4.5V - 5.5V) 2 PVDD Input Power N/A Power supply to I/O (3.0V – 3.6V) 3 I2C_SDA I/O PVDD I2C data 4 I2C _SCL I PVDD I2C clock 5 GND G N/A Ground 6 IRQ O PVDD Interrupt from NFC module to the host (Host_Wake) 7 NFC_Presence G N/A Connect to ground for NFC module presence bit (Low active) 8 VEN I VBAT Reset pin. Set the device in Hard Power Down 9 TX_PWR_REQ O VDD (External TX power supply request) (Active high 1.8V level output) Indicates NFC busy state during NFC communication to touchpad. 10 PMUVCC Input Power N/A Power supply to UICC(1.78V~3.3V) 11 SWIO_UICC I/O VDD(SIM) SWP data connection to SIM 12 DWL_REQ I PVDD Firmware download control pin S1 GND G N/A Ground S2 GND G N/A Ground Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output Pin 1

COMPANY CONFIDENTIAL 16 2> Pin characteristics VEN input pin characteristics Symbol Parameter Conditions Min Typ Max Unit VIH HIGH-level input voltage 1.1 - VBAT V VIL LOW-level input voltage 0 - 0.4 V IIH HIGH-level input current VEN voltage=VBAT - - 1 µA IIL LOW-level input current VEN voltage=0V 1 - - µA Ci Input capacitance - 5 - pF Pin characteristics for IRQ, and TX_PWR_REQ Symbol Parameter Conditions Min Typ Max Unit VOH HIGH-level output voltage IOH<3mA - - - - IRQ and CLK_REQ pin VPVDD -0.4 - VPVDD V TX_PWR_REQ pin VDD-0.4 - VDD V VOL LOW-level output voltage IOL<3mA 0 - 0.4 V CL Load capacitance - - 20 pF tf Fall time CL=12pF max High speed 1 - 3.5 ns Low speed 2 - 10 ns tr Rise time CL=12pF max High speed 1 - 3.5 ns Low speed 2 - 10 ns Rpd Pull-down resistance IRQ and CLK_REQ pins [1] 0.35 - 0.85 MΩ TX_PWR_REQ pin [1] 55 - 120 kΩ [1] Activated in HPO and Monitor states. Input pin characteristics for DWL_REQ Symbol Parameter Conditions Min Typ Max Unit VIH HIGH-level input voltage VPVDD=1.8V 0.65*VPVDD - - V VIL LOW-level input voltage V PVDD=1.8V - - 0.35*VPVDD V VIH HIGH-level input voltage VPVDD=3V 2 - - V VIL LOW-level input voltage VPVDD=3V - - 0.8 V IIH HIGH-level input current - - 1 µA IIL LOW-level input curent 1 - - µA Ci Input capacitance - 5 - pF Rpd Pull down resistance Extra pull-down 0.35 - 0.85 MΩ Pin characteristics for HIF3(used as I2C-bus SDA) and HIF4(used as I2C-bus SCL) Symbol Parameter Conditions Min Typ Max Unit VOL LOW-level output voltage IOL<3mA [1] 0 - 0.4 V CL Load capacitance - - 10 pF tf Fall time CL=100 pF; [1] Rpull-up=2kΩ; Standard and Fast mode 30 - 250 ns CL=100 pF; [1] Rpull-up=1kΩ; High-speed mode 80 - 110 ns tr Rise time CL=100 pF; [1] Rpull-up=2kΩ; Standard and Fast mode 30 - 250 ns CL=100 pF; [1] Rpull-up=1kΩ; High-speed mode 10 - 100 ns VIH HIGH-level input voltage 0.7 *VPVDD - VPVDD V VIL LOW-level input voltage 0 - 0.3*VPVDD V IIH HIGH-level input current VI= VPVDD; high impedance - - 1 µA IIL LOW-level input current VI=0V; high impedance -1 - - µA Ci Input capacitance - 5 - pF [1] Only for pin HIF3(I2C-bus SDA), HIF4(I2C-bus SCL) is only used as input.

COMPANY CONFIDENTIAL 17 SWIO_UICC pin characteristics Symbol Parameter Conditions Min Typ Max Unit VOH HIGH-level output voltage IIH=1mA; [1] IDD(SIM)=50mA; VDD(SIM_PMU)=2.75V; VDD(SIM_PMU) in class B 1.4 - - V VOH HIGH-level output voltage ISIM_SWIO=1mA; [1] IDD(SIM)=30mA; VDD(SIM_PMU)=1.67V; VDD(SIM_PMU) in class C 0.85 VDD(SIM) - - V VOH HIGH-level output voltage IIH =1mA; [1] IDD(SIM)=5mA; VDD(SIM_PMU)=0V; VDD(SIM)-VDDD 0.85 VDD(SIM) - - V VOL LOW-level output voltage 0µA<IIL<20Μa [1] - - 0.15VDD(SIM) V IIH HIGH-level input current - 300 - µA [1] To allow for overshoot, the voltage on SWIO shall remain between -0.3V and VOHmax+0.3V during dynamic operation. 3> Recommend FPC cable .

COMPANY CONFIDENTIAL 18 4.4. Shielding Cover of NFC module Dimension (L x W x H): 11.69mm x 7.88mm x 1.35mm, Thickness: 0.15mm Materials: KU360S 4.5. Picture of NFC module (Top view) (Bottom view) Pin 1

COMPANY CONFIDENTIAL 217. Marking Information Label information

COMPANY CONFIDENTIAL 22

COMPANY CONFIDENTIAL 238. Packing information

COMPANY CONFIDENTIAL 24

COMPANY CONFIDENTIAL 259. Reliability Test plan No Item Test Condition Qty Criteria Result 1 Pull test & Cross Section (2pcs) Cross Section: 1pcs Pull Test: 1pcs 1. Visual inspection: All locations 2. Cross section: BGA/Connector/PTH Hole/Via Hole (SMT/PIH) 3. Pull strength: 0.4mm/0.5mm pitch QFP 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. Function test Pass; 3. Cross section - No separation - Allowable Crack Length: Max. 25% of pad diameter 4. Pull test - 800g for 0.4mm pitch QFP, 1kg for 0.5mm pitch QFP TBD 2 Low Temperature Test 4. Power on; 5. Temp.= -40 ; 6. Test Period = 240hrs. 2 Pls refer to ATC TBD 3 Hot Start Test 1.Power Off , 2.Temperature=100 3.Test period=96 Hours 4.Power on 3times 2 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. Function test Pass. TBD 4 Cold Start Test 1.Power Off 2.Temperature=0 3.Test period=96 Hours 4.Power on 3times 2 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. Function test Pass. TBD 5 Temperature-Humidity Bias (THB) 1. Power On( apply core voltage to PCBA ) 2. Temp.= 85 & Humi.= 85%R.H 3. Test period= 400 Hours 2 Pls refer to ATC TBD 6 Accelerated Thermal Cycles (ATC) ATC: 1.Power off 2.Ta=85 for 7.5mins 3.Ta=85 to -40 for 7.5mins 4.Ta=-40 for 7.5mins 5.Ta=-40 to 85 for 7.5mins 6.Repeat 630cycles Cross Section(both Bright & Dark): BGA/CONNECTOR/PTH Hole/ Via Hole (SMT/PIH) 2 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. Function test Pass; 3. Cross section ( AFTER 630 cycles ) - No separation - Allowable Crack Length: Max. 25% of pad diameter TBD 7 Sine Vibration(Unpackaged) 1. Frequency = 5 ~ 500 ~ 5 HZ; 2. Acceleration = 2 G; 3. Sweep time: 3mins/cycle; 4. Each of x, y, z axis/ 30 min; 5. Power on and continuously ping AP/SG./Golden(AP for WLAN, SG for WWAN, Golden for BT) 6. Product need to be connected with the mating connector which used in laptop. 2 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. Function test Pass; 3. No disconnect between device & AP/SG /Golden during the test . TBD 8 Shock Test(Unpackaged) 1. Half-Sine wave ,50G , 11msec 2. Test +/- x, y, z axes 3. Three shock per axes, total 18 shocks. 4. Product need to be connected with the mating connector which used in laptop. 5. Detect by an electrical discontinuity monitor. 2 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. No electrical discontinuity is greater than 1 microsecond. TBD 9 Sine Vibration(Packaged) 1. Frequency = 5 ~ 500 ~ 5 HZ; 2. Acceleration = 2 Grms; 3. Each of x, y, z axis/ 30 mins. 1 Carton 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. Function test Pass. TBD 10 Shock Test(Packaged) 1. Sine wave ,230G , 3msec ; 2. Test +/- x, y, z axes 1 Carton 1. Visual Inspection – Compliance with IPC-A-610D Class 3 & 39T0261; 2. Function test Pass. TBD 11 Tin Wisker 1. Power off 60/95%RH for 2000hrs; 2. Room Temperature 2000hrs. 10 Whisker Length <50um TBD

COMPANY CONFIDENTIAL 2610. Notice Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0°C to 70°C. Non-Operating Temperature Conditions Neither subassembly shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -20°C to +85°C. Operating Humidity Conditions The product shall be capable of continuous reliable operation when subjected to relative humidity in the range of 0% and 85% non-condensing. Handling Environment Please make sure to avoid mechanical shock and vibration for this module. Please do not drop the module. Please do not clean the module.

FederalCommunicationCommissionInterferenceStatementThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:(1)Thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation.ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice,pursuanttoPart15oftheFCCRules.Theselimitsaredesignedtoprovidereasonableprotectionagainstharmfulinterferenceinaresidentialinstallation.Thisequipmentgenerates,usesandcanradiateradiofrequencyenergyand,ifnotinstalledandusedinaccordancewiththeinstructions,maycauseharmfulinterferencetoradiocommunications.However,thereisnoguaranteethatinterferencewillnotoccurinaparticularinstallation.Ifthisequipmentdoescauseharmfulinterferencetoradioortelevisionreception,whichcanbedeterminedbyturningtheequipmentoffandon,theuserisencouragedtotrytocorrecttheinterferencebyoneofthefollowingmeasures:‐ Reorientorrelocatethereceivingantenna.‐ Increasetheseparationbetweentheequipmentandreceiver.‐ Connecttheequipmentintoanoutletonacircuitdifferentfromthattowhichthereceiverisconnected.‐ Consultthedealeroranexperiencedradio/TVtechnicianforhelp.FCCCaution:Anychangesormodificationsnotexpresslyapprovedbythepartyresponsibleforcompliancecouldvoidtheuser'sauthoritytooperatethisequipment.Thistransmittermustnotbeco‐locatedoroperatinginconjunctionwithanyotherantennaortransmitter.RadiationExposureStatement:ThisequipmentcomplieswithFCCradiationexposurelimitssetforthforanuncontrolledenvironment.Thisequipmentshouldbeinstalledandoperatedwithminimumdistance20cmbetweentheradiator&yourbody.

ThisdeviceisintendedonlyforOEMintegratorsunderthefollowingconditions:Theantennamustbeinstalledsuchthat20cmismaintainedbetweentheantennaandusers,andThetransmittermodulemaynotbeco‐locatedwithanyothertransmitterorantenna.Aslongas2conditionsabovearemet,furthertransmittertestwillnotberequired.However,theOEMintegratorisstillresponsiblefortestingtheirend‐productforanyadditionalcompliancerequirementsrequiredwiththismoduleinstalledIMPORTANTNOTE:Intheeventthattheseconditionscannotbemet(forexamplecertainlaptopconfigurationsorco‐locationwithanothertransmitter),thentheFCCauthorizationisnolongerconsideredvalidandtheFCCIDcannotbeusedonthefinalproduct.Inthesecircumstances,theOEMintegratorwillberesponsibleforre‐evaluatingtheendproduct(includingthetransmitter)andobtainingaseparateFCCauthorization.EndProductLabelingThistransmittermoduleisauthorizedonlyforuseindevicewheretheantennamaybeinstalledsuchthat20cmmaybemaintainedbetweentheantennaandusers.Thefinalendproductmustbelabeledinavisibleareawiththefollowing:“ContainsFCCID:MCLT77H747”.Thegrantee'sFCCIDcanbeusedonlywhenallFCCcompliancerequirementsaremet.ManualInformationTotheEndUserTheOEMintegratorhastobeawarenottoprovideinformationtotheenduserregardinghowtoinstallorremovethisRFmoduleintheuser’smanualoftheendproductwhichintegratesthismodule.Theendusermanualshallincludeallrequiredregulatoryinformation/warningasshowinthismanual.IndustryCanadastatement:ThisdevicecomplieswithISED’slicence‐exemptRSSs.Operationissubjecttothefollowingtwoconditions:(1)Thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation.LeprésentappareilestconformeauxCNRd’ISEDapplicablesauxappareilsradioexemptsdelicence.L’exploitationestautoriséeauxdeuxconditionssuivantes:(1)ledispositifnedoitpasproduiredebrouillagepréjudiciable,et(2)cedispositifdoitacceptertoutbrouillagereçu,ycomprisunbrouillagesusceptibledeprovoquerunfonctionnementindésirable.RadiationExposureStatement:ThisequipmentcomplieswithISEDradiationexposurelimitssetforthforanuncontrolledenvironment.Thisequipmentshouldbeinstalledandoperatedwithminimumdistance20cmbetweentheradiator&yourbody.Déclarationd'expositionauxradiations:

Cetéquipementestconformeauxlimitesd'expositionauxrayonnementsISEDétabliespourunenvironnementnoncontrôlé.Cetéquipementdoitêtreinstalléetutiliséavecunminimumde20cmdedistanceentrelasourcederayonnementetvotrecorps.ThisdeviceisintendedonlyforOEMintegratorsunderthefollowingconditions:(Formoduledeviceuse)1)Theantennamustbeinstalledsuchthat20cmismaintainedbetweentheantennaandusers,and2)Thetransmittermodulemaynotbeco‐locatedwithanyothertransmitterorantenna.Aslongas2conditionsabovearemet,furthertransmittertestwillnotberequired.However,theOEMintegratorisstillresponsiblefortestingtheirend‐productforanyadditionalcompliancerequirementsrequiredwiththismoduleinstalled.CetappareilestconçuuniquementpourlesintégrateursOEMdanslesconditionssuivantes:(Pourutilisationdedispositifmodule)1)L'antennedoitêtreinstalléedetellesortequ'unedistancede20cmestrespectéeentrel'antenneetlesutilisateurs,et2)Lemoduleémetteurpeutnepasêtrecoïmplantéavecunautreémetteurouantenne.Tantqueles2conditionsci‐dessussontremplies,desessaissupplémentairessurl'émetteurneserontpasnécessaires.Toutefois,l'intégrateurOEMesttoujoursresponsabledesessaissursonproduitfinalpourtoutesexigencesdeconformitésupplémentairesrequispourcemoduleinstallé.IMPORTANTNOTE:Intheeventthattheseconditionscannotbemet(forexamplecertainlaptopconfigurationsorco‐locationwithanothertransmitter),thentheCanadaauthorizationisnolongerconsideredvalidandtheICIDcannotbeusedonthefinalproduct.Inthesecircumstances,theOEMintegratorwillberesponsibleforre‐evaluatingtheendproduct(includingthetransmitter)andobtainingaseparateCanadaauthorization.NOTEIMPORTANTE:Danslecasoùcesconditionsnepeuventêtresatisfaites(parexemplepourcertainesconfigurationsd'ordinateurportableoudecertainesco‐localisationavecunautreémetteur),l'autorisationduCanadan'estplusconsidérécommevalideetl'IDICnepeutpasêtreutilisésurleproduitfinal.Danscescirconstances,l'intégrateurOEMserachargéderéévaluerleproduitfinal(ycomprisl'émetteur)etl'obtentiond'uneautorisationdistincteauCanada.

End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 2878D‐T77H747”. Plaque signalétique du produit final Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878D‐T77H747". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. This radio transmitter (IC: 2878D‐T77H747, Model: T77H747) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet émetteur radio (IC: 2878D‐T77H747, Modèle: T77H747) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci‐dessous avec le gain maximal admissible indiqué. types d'antennes non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont strictement interdits pour une utilisation avec cet appareil. 低功率電波輻射性電機管理辦法第十二條經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。第十四條低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。前項合法通信，指依電信法規定作業之無線電通信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。

模組認證： 1. 本模組於取得認證後將依規定於模組本體標示審驗合格標籤。 2. 系統廠商應於平台上標示「本產品內含射頻模組： XXXyyyLPDzzzz‐x」字樣。「電磁波曝露量MPE 標準值1mW/cm2，送測產品實測值為 0.97 mW/cm2」

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