Helium Systems 1 RF Module User Manual

Helium Systems Inc. RF Module Users Manual

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PRELIMINARY DATASHEET

Helium ‘Atom’

HELIUM SYSTEMS INC., IEEE 802.15.4 MODULE

OVERVIEW

The Atom is a dual band FCC, ETSI and IC certiﬁed IEEE 802.15.4 module. It

operates in the 2.4GHz and 915MHz bands in North America, and the 2.4GHz

and 868MHz bands in the EU. The module is also capable of supporting China

frequencies. It comes fully populated with both ceramic chip antennas and U.FL

connectors.

It is perfect as a drop-in module to add certiﬁed wireless capability to an end

product or as a stand-alone wireless device. The module contains onboard chip

and U.FL antennas. The system exhibits -110 dBm sensitivity in the 915/868MHz

bands and -104 dBm sensitivity in the 2.4GHz band. It is ETSI certiﬁed for TX

power up to +13.9 dBm in the 868MHz and +10 dBm in the 2.4GHz band, and

FCC/IC certiﬁed for TX power up to +25 dBm in the 915MHz band and +14

dBm in the 2.4GHz band. Additionally, it oers 8 channels at 868MHz, or 10

channels at 915MHz. In the 2.4GHz band it supports 16 channels in the EU and

15 channels in North America.

The RF sections (IEEE802.15.4 transceivers) of the module are powered

by Atmel’s integrated Cortex-M0+ ATSAMR21G18A (which integrates an

AT86RF233 die), AT86RF212B and SkyWorks FEMs (PA/LNAs). This com-

bination of radios, microcontroller and FEMs marries the best of the available

technologies to derive the best RF performance, power, current consumption

and cost into a 20x20 mm agency-certiﬁed module.

The module comes with pre-programmed ﬁrmware, allowing easy setup and de-

ployment on the Helium wireless network. User interface is via standard UART,

SPI or I2C interfaces, with a well-deﬁned and simple API.

Features

CERTIFICATIONS

Modular certiﬁcation

• ETSI (this is a dierent part number from the FCC/IC version)

• FCC (Modular certiﬁcation)

• IC (Modular certiﬁcation)

• CE / RoHS compliant

OPERATIONAL BANDS

• 2.4 GHz IEEE802.15.4 (all regions)

• 915MHz IEEE802.15.4 (North America version)

• 868MHz IEEE802.15.4 (European version)

• 780MHz IEEE802.15.4 (China WPAN version)

TX POWER

• ETSI

o TX Power 2.4GHz +10 dBm

o TX Power 868 MHz +13.9 dBm

• FCC/IC

o TX Power 2.4GHz +14 dBm

o TX Power 915MHz +27 dBm

RX SENSITIVITY

• -104 dBm, 2.4GHz band

• -110 dBm, 868/915MHz bands

CURRENT CONSUMPTION

• RX current

o 39 mA, both radios active

o 24 mA, 2.4GHz Band only

o 23 mA, sub-GHz Band only

• TX current

o 85 mA @ +10 dBm (2.4GHz, ETSI)

o 155 mA @ +13.9 dBm (868MHz, ETSI)

o 100 mA @ +14 dBm (2.4GHz, FCC/IC)

o 380 mA @ +27 dBm (915MHz, FCC/IC)

VOLTAGE RANGE

• 2.0 to 3.6 V (3.3V typical; 2.4V recommended minimum for full TX power at 915MHz)

TEMPERATURE RANGE

• -40° to +85°C

INTERFACES

• UART / SPI / I2C command interface

• SWD (Serial Wire Debug) for loading user-deﬁned ﬁrmware

• One 12-bit ADC channel

• Up to 13 digital GPIO

Table of Contents

1. Introduction

1.1 Module Interface

1.2 Circuit Description

1.3 Power Management

2. Pin Conﬁguration

3. Speciﬁcations

4. Product Development

5. System Integration

6. Electrical Characteristics

7. Operating Conditions

8. Soldering Information

9. Package Drawing - 40LGA

10. Placement on the PCB

11. Ordering Information

Appendix A Additional Information

A.1 End Product Labeling

A.1.1 Countries Covered by ETSI (EU)

A.1.2 USA and Canada

A.1.3 Note

A.2 FCC Interference Statement

FCC Cautions

A.3 IC Statements

A.4 OEM Responsibilities to comply with FCC and Industry Canada Regulations

A.5 RoHS Compliance

1. Introduction

The Atom™ is a low cost, easy to use, dual-band RF communication module for IoT-enabled

wireless products. It enables designers to easily and quickly add wireless connectivity simply by

supplying 3.3V and a SPI, I2C or UART port, and leveraging the compact Helium Systems API.

Since the module is already FCC, ETSI and IC certiﬁed, there are no complex RF compliance

issues to deal with. Its dual-band support ensures that your product can reach the Helium

network under almost all operating conditions.

1.1 Module Interface

The primary interface to the embedded designer is through the UART or SPI. The UART set-

tings are 115.2K baud, 8N1. Set up your UART for either polling or interrupt on data, and the

module will eortlessly deliver received frames to your host processor. In SPI mode the Atom

is a slave device, with clock polarity = 0 and clock phase = 0 (data is clocked out on the falling

edge, and clocked in on the rising edge). This is commonly referred to as mode 0. SPI clock

speed should be set to 12MHz or less.

When powered on, the module will automatically establish a secure connection to the Helium

network. No commissioning procedure is needed, and security is hardware-based for robust-

ness.

1.2 Circuit Description

The Atom™ incorporates the Atmel SAM R21 processor, which is an ARM Cortex-M0+ class

processor running at up to 48MHz. This processor includes a stacked-die Atmel AT86RF233

2.4GHz IEEE 802.15.4 radio. An external SkyWorks front-end chip (PA/LNA/switch) is

used to permit internal/external antenna selection and to boost RF performance. An Atmel

AT86RF212B 780/868/915MHz IEEE 802.15.4 radio chip is also connected to the processor,

along with an additional SkyWorks front-end chip. On-board chip antennas are supplied for

each band, as well as U.FL connectors for external antennas. All controllable aspects of radio

performance are managed by ﬁrmware in the processor. Several I/O signals are available for

interfacing to the user’s system, primarily for communicating commands and data but also per-

mitting general-purpose analog and/or digital interfacing. No control signals that could directly

aect the radios are available externally.

A separate hardware security chip is also available to the processor. This chip securely stores

encryption keys as well as permanent device conﬁguration details (serial number, operating

bands, model number, MAC addresses, etc.) and also provides secure authentication and ran-

dom number generation.

1.3 Power Management

There are a number of factors which contribute to power consumption by the module. Almost

all of these can be controlled via ﬁrmware in order to minimize power consumption. Here is a

list of the factors:

• Transmit power setting

• LNA enable/disable (may not be needed if the received signal is strong)

• Both vs only one radio being active

• Use of external antenna(s) (potentially higher gain than the chip antennas)

• Use of module I/O signals (no pins left ﬂoating, not driving high-current loads, etc)

• CPU power management (bus/clock speeds, peripheral use, Sleep mode use, etc)

Helium-supplied ﬁrmware endeavors to minimize power consumption both in the CPU conﬁg-

uration choices and by automatically managing the radio system power, taking advantage of the

network’s ability to monitor and adjust both inbound and outbound RF path characteristics.

There are several GPIO signals available to the embedded designer. The ﬁgure below shows

a top side view of the module with the relative placement of the major IO and components.

(Note: the pads shown below indicate relative position, but are on the bottom of the PCB.)

2. Pin Conﬁguration

Table 1: Pin Functions

Pin Function Comments

1GND All GND pads are from the same plane in the module.

23.3 V All 3.3V pads are from the same plane in the module.

3—6 Reserved No Connect

7User I-O 7

8User I-O 8

9User I-O 9

10 User I-O 10

11 Reset

12 SWCLK / User I-O 12 Serial Wire Debug

13 SWDIO / User I-O 13 Serial Wire Debug

14 3.3 V

15 GND

16 GND

17—24 Reserved No Connect

25 GND

26 GND

27 3.3 V

28 User I-O 28

29 User I-O 29

30 User I-O 30

31 User I-O 31

32 User I-O 32

33 User I-O 33

34 User I-O 34

35—38 Reserved No Connect

39 3.3V

40 GND

3. Electrical and RF Summary

The RF and DC speciﬁcations here are based on bench characterization at VDD=3.3V, 21°C.

Note that in all cases the transmitters are capable of higher power, but the values shown are the

maximum settings that meet regulatory agency limits for their respective regions.

Table 2: Speciﬁcations

Typical DC

Characteristics Value Comments

Deep Sleep Current TBD With active watchdog timer

Module TX current 155mA @ +13.9dBm @ 868MHz (ETSI)

85mA @ +10dBm @ 2.4GHz (ETSI)

380mA @ +27dBm @ 915MHz (FCC/IC)

100mA @ +14dBm @ 2.4GHz (FCC/IC)

TX power measured at U.FL connector with

unmodulated CW signal; 3.3V, 21°C; CPU

active at 48MHz

Module RX current 39mA with both radios active;

23mA with only low-band radio active;

24mA with only 2.4GHz radio active

CPU active at 48MHz, LNA active

Typical RF

Characteristics Value Comments

Receive sensitivity -110dBm @ 915MHz using 40Kbps BPSK

modulation (FCC/IC)

Measured using PER test described in

IEEE802.15.4 section 6.5.3.3 (note 1) at the

respective U.FL connector

-110dBm @ 868MHz using 40Kbps BPSK

modulation (ETSI)

-TBDdBm @ 868MHz using 20Kbps BPSK

modulation (ETSI)

-104dBm @ 2.4GHz using 250Kbps

O-QPSK modulation (all regions)

Radio TX power

Peripherals Comments

UART

I2C

ADC

GPIO

Serial Debug Wire

Table 3: Operating Frequencies, Low-band radio (780/868/915MHz)

Channel (IEEE or Helium) (decimal) Center Frequency Region

65 863.7MHz ETSI only, Helium channel

66 864.5MHz ETSI only, Helium channel

67 865.3MHz ETSI only, Helium channel

68 866.1MHz ETSI only, Helium channel

69 866.9MHz ETSI only, Helium channel

70 867.7MHz ETSI only, Helium channel

71 868.5MHz ETSI only, Helium channel

72 869.3MHz ETSI only, Helium channel

0868.3MHz ETSI only, std. IEEE channel

1906MHz FCC / IC only

2908MHz FCC / IC only

3910MHz FCC / IC only

4912MHz FCC / IC only

5914MHz FCC / IC only

6916MHz FCC / IC only

7918MHz FCC / IC only

8920MHz FCC / IC only

9922MHz FCC / IC only

10 924MHz FCC / IC only

Table 4: Operating Frequencies, High-band radio (2.4GHz)

Channel (IEEE or Helium) Center Frequency Region

11 2405MHz all

12 2410MHz all

13 2415MHz all

14 2420MHz all

15 2425MHz all

16 2430MHz all

17 2435MHz all

18 2440MHz all

19 2445MHz all

20 2450MHz all

21 2455MHz all

22 2460MHz all

23 2465MHz all

24 2470MHz all

25 2475MHz all (lower power for FCC/IC)

26 2480MHz ETSI only

4. Product Development

When used with the Helium network, the Atom ﬁrmware handles all aspects of the wireless

protocol services transparently to the end user. Helium’s services also provide the ability to

conﬁgure and use all of the User I/O pins of the Atom module directly from Helium’s servers.

In situations where the end application requires simple I/O, it may be possible to implement

the application without needing an additional CPU. For example, small sensors for light,

temperature, voltage, switch closures, etc. could be implemented directly.

If the application requirements exceed the direct capabilities of the module, then the end

application system can use the module simply as a data communication pathway, using either

SPI or UART to handle communication between their application processor and the Atom

module. Additional details are available in application notes at helium.com.

It is also possible to create custom ﬁrmware for using the module independently from

Helium’s network. In this case, the developer is responsible for handling not only application

requirements, but also all aspects of regulatory agency compliance for the RF signaling. More

information on this will be provided at helium.com in the future.

5. System Integration

The Atom™ dual-band wireless module is designed to be simple to integrate into your product.

When using the module with Helium-supplied standard ﬁrmware, all Regulatory Agency

limiting requirements are managed automatically. Even so, there are a few system integration

guidelines you should be aware of to help meet those requirements. If you decide to implement

your own ﬁrmware, the module can be operated under Helium’s FCC/IC/ETSI approval, as long

as you ensure that the module is never operated outside of the Regulatory limits (as detailed in

this Atom™ datasheet). Here are a few pointers to help you meet those requirements.

• The Atom™ module must be operated within its speciﬁed voltage and temperature limits.

• Variations in voltage and temperature have a small eect of transmitter eciency, and

hence on transmitter power. Highest power output occurs at the low temperature / high

voltage corner, and lowest power is seen at the high temperature / low voltage corner.

• Power supply ﬁltering is included on-board, and no special external ﬁltering has been

needed in our testing. As always, good engineering practices will help ensure ﬁnal product

RF compliance, particularly as regards having good circuit ground connections.

• Do not have ‘planes’ (ground or power) or any other circuit traces under the antenna

section of the module (the area where the chip antennas and U.FL connectors are

located). The antenna section should be in free space (hanging o the edge of the carrier

PCB, or over a routed-out area) for best RF performance.

• When using external antennas, the antenna cables should route directly o the board,

rather than having them cross over the chip antennas or the shielded section.

• Transmit power limits must be observed in all frequency bands, per applicable Regulatory

limits. Since each antenna has its own characteristics, those gains (or losses) must be taken

into account to ensure that transmit power does not exceed the tested limits. The test

conditions for the external antennas included a U.FL-to-SMA cable that exhibited a 0.5dB

loss, and the gain ﬁgures for the tested antennas are listed in this Atom™ datasheet.

• The Atom™ module certiﬁcation does not currently permit simultaneous transmission

from both radios; as a result, there is no antenna co-location requirement. Of course, if

the end product includes additional transmitters, any applicable co-location requirements

will need to be addressed.

• The Helium-supplied label must remain in place, per Regulatory requirements. End-

Product documentation must also contain applicable regulatory notices.

6. Electrical Characteristics

Voltage Range

2.0 to 3.6 V (3.3V typical; 2.4V recommended minimum for full TX power at 915MHz)

Temperature Range

-40° to +85°C

7. Operating Conditions

7.1 Hardware

The module supports various types of antenna conﬁgurations based on the frequency band of

interest and the application range desired. In order to best optimize the right antenna for the

application, the following notes describe how to best setup the module based on the antenna

selected for the application.

7.1.1 U.FL Antenna Conﬁguration

The module supports 1 U.FL coaxial connector for the subGhz band (UFL1) and 1 U.FL coaxial

connector for the 2.4GHz band (UFL2). Both of these connectors are standard U.FL form

factors which is shown below. The part number for the U.FL connector is Molex - 73412-0110.

There are several mating connector options in the same Molex family like 73116-0000 or

73116-0010.

When making the connections to either U.FL connector, it is recommended to have the mating

cable assemblies oriented in the direction shown in the ﬁgure below. This will allow the coaxial

cable to stay as isolated away from the chip antennas to avoid any kind of forced crosstalk on

the U.FL connected RF transmission path. If the coaxial cable is directly run over the top of

the chip antennas, there is higher chance of RF transmission leakage into the U.FL path.

Dimensions = mm/inch

The U.FL to SMA cable that was used during FCC/IC/ETSI testing was a Taoglas CAB.011

cable assembly. This provides a direct SMA connection (for external antennas) to the module

via the U.FL connector.

The recommended antennas for external antenna support that were used with the Taoglas

CAB.011 cable assembly are:

2.4GHz - MobileMark PSKN3-2400S - +2.3dBi

SubGHz - MobileMark PSKN3-700/2100S - +3.0dBi

NOTE: See the FCC/IC/ETSI statement section for full details of the required compliance

with external antennas in order to prevent voiding the modular approval of the module.

8. Soldering Information

The following graph shows the typical reﬂow curve for the placing of the module on the desired

PCB design. The standard reﬂow oven doesn’t apply air pressure therefore the maximum

temperature limit the module can withstand without air pressure is 300°C.

Rework may need to occur in various circumstances with a rework hot air machine using air

pressure. In this case, the module has a tolerance of the same 300°C if the air pressure is very

low; however, the absolute maximum temperature limit should not exceed 280°C under 5.5

PSI at a distance of 1” away from the heat source.

Chart 1: Module Soldering Proﬁle

050 100 150 200 250 300 350 400

100

150

200

250

TEMPERATURE (deg C)

TIME (Seconds)

9. Package Drawing - 40LGA

9.1 Actual Module Pad Dimensions (Top View)

9.2 Recommended Pad Layout (Top View)

10. Placement on the PCB

The design of the host base board needs to keep in mind that the modules RF characteristics

can be aected substantially by any groundplanes within the chip antenna section of the

module. The recommended placement is to have the module placed near an edge or over

the edge to provide the best RF performance from the chip antennas. This will give the best

radiation pattern especially when the module is also placed within an enclosure.

The following ﬁgures give recommendations for the best placement.

Based on the above recommendations, there may be situations where you cannot place the

module near an edge. This may force the module to buried within the center groundplane of

the host base board. Even though this is not recommended due to the dramatic decrease in

chip antenna performance, the U.FL connections will still provide adequate RF performance

to the external antenna of choice. As long as the ground plane can be minimized under the

module as shown in the following ﬁgure.

In all cases, the requirement to run traces under the module may arise. This is allowed provided

there are no traces run through the RF KEEPOUT area described in the Recommended Pad

Layout section above. Beware that high speed data lines running under the module is not

recommended as there might be interference in both directions (host to module and module to

host) especially when the module executes a transmission.

PCB

GROUNDPLANE OK

REMOVE

GROUNDPLANE

PCB

GROUNDPLANE OK

REMOVE

GROUNDPLANE

PCB

GROUNDPLANE OK

REMOVE

GROUNDPLANE

11. Ordering Information

11.1 Countries Covered by ETSI (EU)

ATOM-EU (this module cannot be used in FCC/IC countries)

11.2 USA and Canada

ATOM-AM (this module cannot be used in ETSI countries)

Appendix A – Additional Information

A.1 End Product Labeling

A.1.1 Industry Canada:-

For Industry Canada, the following statements must be included in the end-product

documentation:

Contains Industry Canada ID IC: 12590A-1

Comprend le numéro d’identiﬁcation de l’industrie canadienne ID IC: 12590A-1

A.1.2 United States:-

The ﬁnal ‘end product’ should be labelled in a visible area with the following:

Contains FCC ID: 2ADMK-1

A .1. 3 Note:-

An OEM integrator must not provide information to the end user regarding how to install

or remove this RF module or change RF related parameters in the user manual of the end

product.

The user manual for the end product must include the following information in a prominent

location:

This device has been granted Modular approval for use in mobile applications. OEM integrators

for host products may use the module in their ﬁnal products without additional FCC / IC

(Industry Canada) certiﬁcation if they meet the following conditions. Otherwise, additional

FCC / IC approvals must be obtained.

• If additional transmitters are present in the end product, that product must be evaluated

for compliance with simultaneous transmission requirements.

• External antennas must not exceed 2.3dBi gain (2.4GHz band) or 3.0dBi gain

(900MHz band), including cable loss.

• A label must be axed to the outside of the host product with the following statements:

Contains FCC ID: 2ADMK-1

Contains Industry Canada ID IC: 12590A-1

L’intégrateur OEM doit être conscient de ne pas fournir des informations à l’utilisateur ﬁnal

quant à la façon d’installer ou de supprimer ce module RF ou RF changer les paramètres liés au

mode d’emploi du produit ﬁnal.

Le manuel d’utilisation pour le produit ﬁnal doit comporter les informations suivantes dans un

endroit bien en vue:

Cet appareil a reçu l’agrément modulaire pour une utilisation dans des applications mobiles. Les

intégrateurs OEM pour des produits susceptibles d’utiliser cet appareil peuvent l’utiliser dans

leurs produits ﬁnaux sans certiﬁcation complémentaire de FCC/IC (Industry Canada) s’ils

remplissent les conditions suivantes. A défaut, un agrément complémentaire de FCC/IC doit

être obtenu.

• Si des émetteurs supplémentaires sont présents dans le produit ﬁnal, ce produit

doit être évalué pour valider qu’il respecte les normes en matière de transmission

simultanée.

• Les antennes externes ne doivent pas dépasser un gain de 2.3dBi (2.4GHz de

fréquence) ou de 3.0dBi gain (900MHz de fréquence), y compris la perte de signal

propre au câble.

• Une étiquette doit ﬁgurer sur l’extérieur du produit accueillant l’appareil avec la mention

Contient FCC ID: 2ADMK-1

Contient Industry Canada ID IC: 12590A-1

A.2 FCC Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable

protection against harmful interference in a residential installation. This equipment generates,

uses, and can radiate radio frequency energy. If not installed and used in accordance with the

instructions, this may cause harmful interference to radio communications. However, there is

no guarantee that interference will not occur in a particular installation. If this equipment does

cause harmful interference to radio or television reception, which can be determined by turning

the equipment o and on, the user is encouraged to try to correct the interference by one or

more of the measures listed below.

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit dierent from that to which the

receiver is connected.

• Consult the dealer or an experienced radio/television technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions:

1. This device may not cause harmful interference, and

2. This device must accept any interference received, including interference that may

cause undesired operation

FCC Cautions

FCC Caution: Any changes or modiﬁcations not expressly approved by the party responsible

for compliance could void the user’s authority to operate this equipment.

A.3 IC Statements

Operation is subject to the following two conditions: (1) this device may not cause interference,

and (2) this device must accept any interference, including interference that may cause

undesired operation of the device.

To reduce potential radio interference to other users, the antenna type and its gain should be so

chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted

for successful communication.

This device has been designed to operate with none, one or both of the antennas listed below,

having a maximum gain including cable loss of 2.3dBi gain (2.4GHz band) or 3.0dBi gain

(900MHz band). Antennas not included in this list or having a gain greater than speciﬁed

above are strictly prohibited for use with this device. The required antenna impedance is 50

ohms.

2.4GHz: MobileMark PSNK3-2400S

900MHz: MobileMark PSKN3-700/2100S

Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne peut pas

provoquer d’interférences et (2) cet appareil doit accepter toute interférence, y compris les

interférences qui peuvent causer un mauvais fonctionnement du dispositif.

Pour réduire le risque d’interférence aux autres utilisateurs, le type d’antenne et son gain

doivent être choisies de façon que la puissance isotrope rayonnée équivalente (e.i.r.p) ne

dépasse pas celle admise pour une communication réussie.

Cet appareil a été conçu pour fonctionner sans, ou avec une, ou les deux antennes mentionnées

ci-après, avec un gain maximum y compris la perte de signal propre au câble de 2.3dBi (2.4GHz

de fréquence) ou 3.0dBi (900MHz de fréquence). Les antennes non comprises dans cette

liste ou ayant un gain supérieur à celui qui est spéciﬁé plus haut sont strictement interdites

d’utilisation avec cet appareil. L’impédance requise pour l’antenne est de 50 ohms.

2.4GHz: MobileMark PSN3-2400S

900MHz: MobileMark PSKN3-700/2100S

A.4 OEM Responsibilities to comply with FCC and Industry Canada Regulations

The Atom-AM Module has been certiﬁed for integration into products only by OEM

integrators under the following conditions:

This device has been granted Modular approval for use in mobile applications. OEM integrators

for host products may use the module in their ﬁnal products without additional FCC / IC

(Industry Canada) certiﬁcation if they meet the following conditions. Otherwise, additional

FCC / IC approvals must be obtained.

• If additional transmitters are present in the end product, that product must be evaluated

for compliance with simultaneous transmission requirements.

• External antennas must not exceed 2.3dBi gain (2.4GHz band) or 3.0dBi gain (900MHz

band), including cable loss.

• A label must be axed to the outside of the host product with the following statements:

• Contains FCC ID: 2ADMK-1

• Contains Industry Canada ID IC: 12590A-1

IMPORTANT NOTE: In the event that these conditions cannot be met (for certain conﬁgurations or co-loca-

tion with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid

and the FCC ID and IC Certiﬁcation Number cannot be used on the ﬁnal product. In these circumstances, the

OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining

a separate FCC and Industry Canada authorization.

Le module Atom-AM a été certiﬁée pour l’intégration dans les produits que par les intégrateurs

OEM dans les conditions suivantes:

Cet appareil a reçu l’agrément modulaire pour une utilisation dans des applications mobiles. Les

intégrateurs OEM pour des produits susceptibles d’utiliser cet appareil peuvent l’utiliser dans

leurs produits ﬁnaux sans certiﬁcation complémentaire de FCC/IC (Industry Canada) s’ils

remplissent les conditions suivantes. A défaut, un agrément complémentaire de FCC/IC doit

être obtenu.

• Si des émetteurs supplémentaires sont présents dans le produit ﬁnal, ce produit doit être

évalué pour valider qu’il respecte les normes en matière de transmission simultanée.

• Les antennes externes ne doivent pas dépasser un gain de 2.3dBi (2.4GHz de fréquence)

ou de 3.0dBi gain (900MHz de fréquence), y compris la perte de signal propre au câble.

• Une étiquette doit ﬁgurer sur l’extérieur du produit accueillant l’appareil avec la mention

• Contient FCC ID: 2ADMK-1

• Contient Industry Canada ID IC: 12590A-1

A.5 RoHS Compliance

Atom-EU and Atom-AM devices meet the requirements of Directive 2002/95/EC of the

European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS).

The Atom-EU and Atom-AM modules meet the requirements of Chinese RoHS requirements

SJ/T11363-2006.

Full data can be found at www.helium.com.

NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines conﬁgurations

ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus

considérés comme valides et l’ID de la FCC et IC numéro de certiﬁcation ne peut pas être utilisé sur la produit

ﬁnal. Dans ces circonstances, l’intégrateur OEM sera chargé de réévaluer le produit ﬁnal (y compris l’émetteur)

et l’obtention d’un distincte de la FCC et Industrie Canada l’autorisation.

Helium Systems 1 RF Module User Manual

Helium Systems Inc. RF Module Users Manual

Users Manual

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