Hi Link Electronic HLK-M50 WIFI Module User Manual 15 HLK M50 UserMan r2

niki@hlktech.com Specification

HLK-M50

Shenzhen HaiLingKe Electronic co., Ltd

HLK-M50 SPEC.

.

niki@hlktech.com Specification

HLK-M50

Catalogue

1. PRODUCT INTRODUCTION .............................................................................................................................. 1

1.1. HLK-M50 MODULE TYPE.............................................................................................................................. 1

1.2. WLAN FEATURES............................................................................................................................................ 2

1.3. MCU FEATURES .............................................................................................................................................. 2

2. FUNCTIONAL DIAGRAM ......................................................................................................................................... 3

3.SPECIFICATIONS ........................................................................................................................................................ 3

3.1 SYSTEM MEMORY .................................................................................................................................................. 3

3.2 INTERFACE ............................................................................................................................................................... 4

3.3 INTERFACE EXTENSION APPLICATION EXAMPLE...................................................................................... 5

3.4 POWER ....................................................................................................................................................................... 5

4. MODULE PIN DEFINITION ..................................................................................................................................... 6

4.1 PIN DIAGRAM DEFINITION ................................................................................................................................. 6

4.2 DEFAULT PIN DEFINITION ................................................................................................................................... 7

4.3 GPIO ALTERNATE FUNCTION AND FUNCTION PIN POSITION ................................................................. 8

5. MODULE SIZE CHART ............................................................................................................................................. 8

6. TYPICAL APPLICATION CIRCUIT ........................................................................................................................ 9

7. RECOMMENDED REFLOW TEMPERATURE ..................................................................................................... 9

FCC WARNING ............................................................................................................................................................. 11

niki@hlktech.com Specification

HLK-M50

Page 1 of 12

1. Product introduction

The HLK-M50 WiFi module is a low-power chip that integrates MCU, PMU, clock, and IEEE802.11b / g / n

MAC / PHY / radio.

Module supports 2.4GHz IEEE802.11b / g / n, USB Host and Device 2.0 HS, Micro SD card (SDMMC

interface), UART, I2C, I2S, PMW, SPI and other interfaces, analog keys (GPADC0).

Software using mbedOS5.1 operating system, has two versions : WiFi serial transmission function version

and secondary development.

Second development version provides rich development interface, users can develop their own applications

based on mbedOS through C or C ++. Development kit to provide a large number of guidance documents and test

routines to facilitate rapid development of users.

1.1. HLK-M50 Module Type

Pin section and SMD section front

niki@hlktech.com Specification

HLK-M50

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1.2. WLAN Features

 Single-chip integrated MAC/PHY/Radio

 Supports 2.4GHz IEEE 802.11b/g/n

 Integrated PA, LNA

 20/40MHz bandwidth, maximum 150Mbps

 Support WPA, WPA2, WEP, TKIP,CCMP

 Support STA, softAP, P2P, STA+softAp,STA+P2P

 Support A-MPDU, A-MSDU, HT-BA

 Lightweight TCP / IP protocol stack

1.3. MCU Features

 Integrated ARM-CM4 MCU, the maximum clock frequency of 160MHz

 Integrated MPU and mbed uvisor

 Support external psram interface

 Built-in 8Mbit SPI flash

 Function pin position programmable

 Available external rising / falling edge interrupt or wake-up GPIO

 Integrated UART×2/I2S×2/I2C×1/PWM×8/SPI×4/SDMMC×1/USB2.0×1

 Integrated 2 channel ADC

 Integrated watchdog and low-power timer

 Operating system using mbedOS5.1

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HLK-M50

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2. Functional diagram

HLK-M50 Module functional diagram

3.Specifications

3.1 System memory

Project Parameters

Memory

System

Built-in RAM

96K Bytes User SRAM

32K Bytes icache

Built-in Flash Built-in 8Mbit flash

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HLK-M50

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3.2 Interface

项目参数

GPIO supports up to 17 GPIO ports, of which 16 can trigger interrupts

Serial performance supports up to 2 serial ports, baud rate can be configured to 1200bps -

4Mbps

I2S Interface Features

Supports 2 I2S Interfaces; I2S Host BCLK Supports 96/192/384/512 /

44.1 / 88.2KHz; Supports 16/32 bit per channel, Data Format

Configurable as 16/20 / 24bit or Software Configurable Maximum

24bit per channel)

I2C Interface

Performance

Supports one I2C standard interface. Support master or slave operation.

There are 3 standard speed modes:

1. Standard mode (<100Kb/s)

2. Fast mode (<400Kb/s)

3. High-speed mode (<3.4Mb/s)

PWM Interface

Performance

Supports up to eight PWM interfaces; PWM cycle and duty cycle

programmable, duty cycle can be configured between 0-100; cycle

programmable, the software can choose a different clock to produce

longcycles

SPI Interface

As the SPI host, up to 4 SPI slave; SPI clock programmable and

maximum 20Mhz; data length can be configured by software, the

maximum 64bit;

SDMMC Interface Support 1 SDMMC interface

USB Interface Support 1 USB interface

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HLK-M50

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3.3 Interface Extension Application Example

Note：

1

，

The figure can be extended function, the common firmware do not support some features, please consult

our FAE if you need.

2

，

The module factory default is USB HOST

。

3.4 Power

Symbol Function Min.Voltage（V）

Typical

Voltage（V）

Maximum

Voltage（V）

Current

（mA）

VBAT Supply voltage range

3.3 3.3 3.5 ≥500mA

I/O I/O Input Voltage range

2.7 3.3 3.6 ≤10mA

Symbol Function Min. Voltage (V) Typical Voltage (V) Maximum Voltage (V) Current (mA)

niki@hlktech.com Specification

HLK-M50

Page 6 of 12

VBAT supply voltage range 3.3 3.3 3.5 ≥500mA

I / O I / O Input Voltage Range 2.7 3.3 3.6 ≤10mA

4. Module pin definition

4.1 Pin Diagram Definition

HLK-RM08S default Pin diagram definition

Note：

1

，

The figure is the default definition, the multiplexing function is not listed.

2

，

Please do not arbitrarily pull of each free function pin, so as cause the module does not start properly.

niki@hlktech.com Specification

HLK-M50

Page 7 of 12

4.2 Default Pin definition

Number

Name Type Description

1 RST I RESET signal of the chip

2 ADC I/O General purpose ADC

3 GPIO1 I/O General purpose input/output

4 GPIO2 I/O General purpose input/output

5 GPIO3 I/O General purpose input/output

6 GPIO13 I/O General purpose input/output

7 GPIO12 I/O General purpose input/output

8 3.3V PWR I/O power supply

9 GPIO23 I/O General purpose input/output

10 GPIO22 I/O General purpose input/output

11 GPIO21 I/O General purpose input/output(no interrupt)

12 GPIO0 I/O General purpose input/output

13 GPIO4 I/O General purpose input/output

14 GPIO5 I/O General purpose input/output

15 GND GND buck ground

16 GPIO8 I/O General purpose input/output

17 GPIO7 I/O General purpose input/output

18 GPIO9 I/O General purpose input/output

19 USB-DN I/O USB negative signal

20 USB-DP I/O USB positive signal

21 RX I/O UART_RX

22 TX I/O UART_TX

Pin type definition

：

 I/O → Digital input/output

；

 I → Digital input

 O → Digital output

 A,I → Analog input

 A,O → Analog output

 A,I/O → Analog input/output

 PWR → Power

 GND → Ground

niki@hlktech.com Specification

HLK-M50

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4.3 GPIO alternate function and function pin position

5. Module size chart

Unit：millimetre（mm）

HLK-M50 Dimension

niki@hlktech.com Specification

HLK-M50

Page 9 of 12

6. Typical application circuit

Note：

This is a schematic diagram of the M50 development test suite. Schematic and PCB source files, please ask

sales.

Module over the furnace, please follow this temperature curve in strict implementation. Reflow temperature

deviation is too large will cause damage to the module!

7. Recommended reflow temperature

Module over the furnace, please follow this temperature curve in strict implementation.Reflow temperature

deviation too large will cause damage to the module!

niki@hlktech.com Specification

HLK-M50

Page 10 of 12

Temperature setting (centigrade)

Temper.

area

1 2 3 4 5 6 7 8

Up 125 135 155 185 195 225 240 230

Down 125 135 155 185 195 225 240 230

Conveyor speed: 70.0 cm/min.

niki@hlktech.com Specification

HLK-M50

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FCC Warning

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions:

(1) This device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

NOTE 1: This equipment has been tested and found to comply with the limits for a

Class B digital device, pursuant to part 15 of the FCC Rules. These limits are

designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio

frequency energy and, if not installed and used in accordance with the instructions,

may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this

equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try

to correct the interference by one or more of the following measures:

-

Reorient or relocate the receiving antenna.

-

Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

-Consult the dealer or an experienced radio/TV technician for help.

NOTE 2: Any changes or modifications to this unit not expressly approved by the

party responsible for compliance could void the user's authority to operate the

equipment.

Please notice that if the FCC identification number is not visible when the module is

installed inside another device, then the outside of the device into which the module is

installed must also display a label referring to the enclosed module. This exterior label

niki@hlktech.com Specification

HLK-M50

Page 12 of 12

can use wording such as the following: “Contains FCC ID: 2AD56HLK-M50” any

similar wording that expresses the same meaning may be used.

This equipment complies with FCC radiation exposure limits set forth for an

uncontrolled environment. This transmitter must not be co-located or operating

in conjunction with any other antenna or transmitter. The module is limited to

OEM installation ONLY.

The OEM integrator is responsible for ensuring that the end-user has no manual

instruction to remove or install module.

There is requirement that the grantee provide guidance to the host manufacturer

for compliance with Part 15B requirements.

This module certified that complies with RF exposure requirement under mobile or fixed

condition, this module is to be installed only in mobile or fixed applications.

A mobile device is defined as a transmitting device designed to be used in other than fixed

locations and to generally be used in such a way that a separation distance of at least 20 centimeters

is normally maintained between the transmitter's radiating structure(s) and the body of the user or

nearby persons. Transmitting devices designed to be used by consumers or workers that can be easily

re-located, such as wireless devices associated with a personal computer, are considered to be

mobile devices if they meet the 20 centimeter separation requirement.

Hi Link Electronic HLK-M50 WIFI Module User Manual 15 HLK M50 UserMan r2

ShenZhen HaiLingKe Electronic co.,Ltd. WIFI Module 15 HLK M50 UserMan r2

15_HLK-M50 UserMan r2

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