Honeycomb Technologies HBT24B13AN Bluetooth Module User Manual manual

HBT24B13AN

Data Sheet

HBT24B13AN

Note the label artwork for Products

Warning: Changes or modifications to this unit not expressly approved by the party

responsible for compliance could void the user’s authority to operate the equipment.

NOTE: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications.

However, there is no guarantee that interference will not occur in a particular installation. If

this equipment does cause harmful interference to radio or television reception, which can be

determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one or more of the following measures:





 Reorient or relocate the receiving antenna.





 Increase the separation between the equipment and receiver.





 Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.





 Consult the dealer or an experienced radio/TV technician for help.

HBT24B13AN

Note: This BT Module is designed to be used internally only in Controls products

which with RF shielding. It is not intended to be sold as an end item by itself to

external customers.

FCC Caution: Any changes or modifications not expressly approved by the party

responsible for compliance could void the user’s authority to operate this

equipment.

This module and its antenna(s) must not be co-located with any other transmitters

except in accordance with FCC multi-transmitter product procedures.

The module is intended only for OEM integrator. And it should not be marketed

and sold in a way that has to be end-user accessible / replaceable. The host

product is required to comply with all applicable FCC equipment authorizations

regulations, requirements and equipment functions not associated with the

transmitter module portion. The host manufacturer is responsible for ensuring

compliance with the module(s) installed and fully operational.

Label of the end product:

The final end product must be labeled in a visible area with the following “Contains

Transmitter Module FCC ID: 2AAUWHBT24B13AN” or “Contains FCC ID:

2AAUWHBT24B13AN”. If the size of the end product is larger than 8*10cm, then

the following FCC Part 15.19 statement has to also be available on the label: This

device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this

device must accept any interference received, including interference that may

cause undesired operation.

User manual of the end product:

In the user manual of the end product, the end user has to be informed that:

Warning: Changes or modifications to this unit not expressly approved by the party

responsible for compliance could void the user’s authority to operate the equipment.

NOTE: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications.

However, there is no guarantee that interference will not occur in a particular installation. If

this equipment does cause harmful interference to radio or television reception, which can be

determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one or more of the following measures:

HBT24B13AN





 Reorient or relocate the receiving antenna.





 Increase the separation between the equipment and receiver.





 Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.





 Consult the dealer or an experienced radio/TV technician for help.

If the size of the end product is smaller than 8*10cm, then additional FCC Part

15.19 statement is required to be available in the user manual: This device

complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device

must accept any interference received, including interference that may cause

undesired operation.

HBT24B13AN

BlueTooth 2.1+EDR Module

Features:

 On-chip TX/RX switch

 Small Size: 27mm*13mm Surface Mountable.

 Polar modulation transmitter architecture with very low power

consumption high TX performance.

 Near-Zero IF receiver architecture with 91dBm sensitivity.

 Support for class 1, 2 and 3 transmitting power requirement.

 Fully integrated synthesizer without external loop filter component.

Operational:

 Operating Voltage: 3.2V to 4.3V(typical 3.3V )

 Temperature Range: -20°C to +70°C

 Simple, Four-Wire SPI Interface

BASEBAND

 Fully compliant with Bluetooth 2.1 + EDR specification.

 Support Bluetooth Piconet and Scatternet.

 Support up to 3Mbps high speed UART interface.

 Support Sniff mode, hold mode and park mode.

 Support A-law, μ-law and CVSD digitize audio CODEC in PCM

interface

HBT24B13AN

 Provide 4 wires SPI interface.

DEVICE

 Enhanced support for WLAN/BT Co-existence.

 Standby and sleep modes to minimize power consumption.

 Support share handset system reference clock.

FIGURE 1: PIN DIAGRAM

Device Overview

The BK3211 chip is a highly integrated single-chip Bluetooth device. It

integrates the high-performance transceiver and rich features baseband

processor, which is compliant with Bluetooth 2.1 + EDR specification

HBT24B13AN

FIGURE 2: BLOCK DIAGRAM

TABLE 1-1: PIN DESCRIPTION

FIGURE 3: MICROCONTROLLER TO HBT24B13AN INTERFACE

HBT24B13AN

Mounting Details

The HBT24B13AN is a surface mountable module. Module dimensions are shown in

Figure 4. The module Printed Circuit Board (PCB) is 0.032" thick with castellated

mounting holes on the edge. Figure5 is a recommended host PCB footprint for the

HBT24B13AN. The HBT24B13AN has an integrated PCB antenna. For the best

performance, follow the mounting details shown in Figure 5. It is recommended that

the module be mounted on the edge of the host PCB and an area around the

antenna, approximately 1.2", be kept clear of metal objects. A host PCB ground plane

around the HBT24B13AN acts as a counterpoise to the PCB antenna. It is

recommended to extend the ground plane at least 0.4" around the module.

FIGURE 4: MODULE DETAILS

HBT24B13AN

FIGURE 5 RECOMMENDED PCB FOOTPRINT

CIRCUIT DESCRIPTION

The HBT24B13AN module is a compliant with Bluetooth 2.1 + EDR surface mount

module with integrated crystal, internal voltage regulator, matching circuitry and PCB

antenna. The HBT24B13AN module interfaces to many popular micro-controllers via

a 4-wire serial SPI interface, interrupt, wake, Reset, power and ground.

HBT24B13AN

SCHEMATIC

A schematic diagram of the module is shown in Figure 6 and the Bill of Materials

(BOM) is shown in Table 2. The HBT24B13AN module is based on the BK3211 chip is a

highly integrated single-chip Bluetooth device. ceiver IC. The serial I/O (SCK, SDI, SDO

and CS), RESET, STATE, SELECT and INT pins are brought out to the module pins. The

SDO signal is tri-state buffered by IC2 to solve a silicon errata where the SDO signal

does not release to a high-impedance state after the CS pin returns to its inactive

state. Crystal Y1 is a 26 MHz crystal with a frequency tolerance of ±20 ppm @ 25°C to

±40 ppm.

FIGURE 6 HBT24B13AN SCHEMATIC

TABLE 2

HBT24B13AN BILL OF MATERIALS

HBT24B13AN

Printed Circuit Board

The HBT24B13AN module printed circuit board is con-structed with FR4 material,

two layers and 0.8mm thick. The layers are shown in Figure 7 through Figure 8. The

stack up of the PCB is shown in Figure9

FIGURE 7 TOP COPPER

FIGURE 8 BOTTOM COPPER

HBT24B13AN

FIGURE 9 PCB LAYER STACK UP

PCB Antenna

The PCB antenna is fabricated on the top copper trace. Figure 10 shows the trace

dimensions. The layers below the antenna have no copper traces. The ground and

power planes under the components serve as a counterpoise to the PCB antenna.

Additional ground plane on the host PCB will substantially enhance the performance

of the module.

FIGURE 10 PCB LAYER STACK UP

Honeycomb Technologies HBT24B13AN Bluetooth Module User Manual manual

Shenzhen Honeycomb Technologies Company Limited Bluetooth Module manual

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