Hosiden HRM1016 Bluetooth Module User Manual Technical User manual Installation guideance rev
Hosiden Corporation Bluetooth Module Technical User manual Installation guideance rev
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Technical - User_manual (Installation guideance) rev.pdf
![Installation manual of HRM1016 This document describes the guideance to install Bluetooth moduke HRM1016 (FCC ID:VIYHRM1016, IC:7305A-HRM1016) to customer’s PWB. 1.Mount Form 76 solder bumps, 1.2 mm pitch, diameter is 0.8 mm. 2.Reflow Profile Maximum reflow times : 2 times Recommended reflow temperature profile is shown in Figure 1. Points of this profile are as follows: - Ramp up temperature for preheat stage is 1 to 3 deg C/sec - Preheat stage is from 155 to 165 deg C, from 120 to 150 sec - Ramp up temperature for solder reflow is from 2 to 3 deg C/sec - Peak temperature is from 240 to 245 deg C - Time over 217 deg C is from 40 to 60 sec - Cooling down temperature is from 2 to 4 deg C/sec. Figure 1: Recommended reflow temperature profile 050100150200250030 60 90 120 150 180 210 240 270 300 330 360 390Temperature [deg C] Time [sec]](https://usermanual.wiki/Hosiden/HRM1016/User-Guide-3279421-Page-1.png)













