Huawei Technologies ME309-562 eMTC Module User Manual 1

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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Issue
03
Date
2017-07-18
Copyright © Huawei Technologies Co., Ltd. 2015. All rights reserved.
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, and
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Notice
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
01
2017-03-23
Draft release
02
2017-05-26
1.Cancel SPI/I2C function;
2.Cancel wake_up out function, use
RING to replace it;
3.Update the pin map interface picture
because the change above.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Contents
1 Introduction.................................................................................................................................... 5
2 Overall Description ...................................................................................................................... 6
2.1 About This Chapter........................................................................................................................... 6
2.2 Function Overview............................................................................................................................ 6
2.3 Circuit Block Diagram ....................................................................................................................... 7
2.4 Application Block Diagram ............................................................................................................... 8
3 Description of the Application Interfaces .............................................................................. 10
3.1 About This Chapter ......................................................................................................................... 10
3.2 LGA Interface ................................................................................................................................. 10
4 Mechanical Specifications ......................................................................................................... 20
4.1 About This Chapter ......................................................................................................................... 20
4.2 Storage Requirement ..................................................................................................................... 20
4.3 Moisture Sensitivity ........................................................................................................................ 20
4.4 Dimensions ..................................................................................................................................... 20
4.5 Customer PCB Design ................................................................................................................... 22
4.5.1 PCB Surface Finish ............................................................................................................... 22
4.5.2 PCB Pad Design .................................................................................................................... 22
4.5.3 Solder Mask ........................................................................................................................... 24
4.5.4 Requirements on PCB Layout ............................................................................................... 24
4.5.5 Stencil Design ........................................................................................................................ 24
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME309-562 eMTC LGA module (hereinafter referred to as the
ME309-562 module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME309-562 module.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME309-562 module and provides:

Function Overview

Circuit Block Diagram

Application Block Diagram
2.2 Function Overview
Table 2-1 ME309-562 module features
Feature
Description
Physical
Dimensions

Dimensions (W × L × H): 18 mm × 24 mm × 2.5 mm

Weight TBD
Operating
Bands

HD-FDD LTE: Band 2, Band 4, Band 12, Band13
Operating
Temperature
Normal operating temperature: –30°C to +75°C (Characteristics
guaranteed)
Extended operating temperature[1]: –40°C to +85°C (Normal
working)
Storage
Temperature
–40°C to +95°C
Power
Voltage
3.3 V to 4.2 V (3.8 V is recommended.)
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Feature
Description
Application
Interface
(120-pin LGA
interface)
GPIO x 5
UART interface (one 8-wire UART0, two 4-wire UART1&UART2,
and UART2 is only for debugging)
Standard SIM interface
ADC interface x 2
SPI interface (software not support)
I2C interface (software not support)
LED interface x 2
JTAG interface
Power supply interface
Power on/off interface
Hardware reset interface
Wake in/out interface
Antenna
Interface
RF antenna pad x 1
Data Services
LTE FDD: DL 300kbps; UL 375kbps @1.4MHz BW catM1

[1]: When the ME309-562 module works at –40°C to –30°C or +75°C to +85°C, NOT all its
RF performances comply with the 3GPP specifications.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME309-562 module. The major
functional units of the ME309-562 module contain the following parts:

Baseband controller

Nor flash

RF Circuit
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Figure 2-1 Circuit block diagram of the ME309-562 module
2.4 Application Block Diagram
Figure 2-2 Application block diagram of the ME309-562 module
UART Interface:
The module supports 3 UART interfaces. Two are 4-wire
UARTs, and the other one is 8-wire UART. Uart02 is only for
debugging.
SIM Interface:
The SIM interface provides the interface for a SIM card.
GPIO:
General Purpose I/O pins.
External Power
Supply:
DC 3.8 V is recommended.
ADC:
Analog-to-Digital Converter
I2C:
Inter－Integrated Circuit
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SPI:
Serial Peripheral Interface
RF Pad:
RF antenna interface.
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Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME309-562
module LGA Interface.
3.2 LGA Interface
The ME309-562 module uses a 120-pin LGA as its external interface. For details
about the module and dimensions, see 4.4 Dimensions.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Figure 3-1 Pin map of LGA interface (Top view)
Update 26/05/2017
Figure 3-2 Appearance of ME309-562 module (without label)
Top View
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Table 3-1 Definitions of pins on the LGA interface
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
A8
UART0_TX
UART0 transmit
VOH
1.44
1.8
1.8
VOL
0.36
VIH
1.26
1.8
1.8
VIL
0.54
VIH
1.26
1.8
1.8
VIL
0.54
VOH
1.44
1.8
1.8
VOL
0.36
VIH
1.26
1.8
1.8
VIL
0.54
VOH
1.44
1.8
1.8
VOL
0.36
VOH
1.44
1.8
1.8
VOL
0.36
VOH
1.44
1.8
1.8
Use as
wake_up out
VOL
0.36
VOH
1.44
1.8
1.8
VOL
0.36
VIH
1.26
1.8
1.8
VIL
0.54
VIH
1.26
1.8
1.8
VIL
0.54
VOH
1.44
1.8
1.8
VOL
0.36
VOH
1.44
1.8
1.8
VOL
0.36
VIH
1.26
1.8
1.8
VIL
0.54
output
A7
UART0_RX
UART0 receive
data input
B7
UART0_CTS
UART0 clear to
send
B8
UART0_RTS
UART0 ready
for
receive
C7
C6
UART0_DTR
UART0_DSR
Data terminal
ready
UART0 data set
ready
B6
A6
UART0_DCD
UART0_RING
UART0 data
carrier detect
UART0 ring
indicator
A4
UART1_TX
UART1 transmit
output
A5
UART1_RX
UART1 receive
data input
B4
UART1_CTS
UART1 clear to
send
B5
UART1_RTS
UART1 ready
for
receive
F3
UART2_TX
UART2 transmit
output
F1
UART2_RX
UART2 receive
data input
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HUAWEI ME309-562 eMTC LGA Module
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
F2
UART2_CTS
UART2 clear to
VIH
1.26
1.8
1.8
VIL
0.54
VOH
1.44
1.8
1.8
VOL
0.36
Active low chip
select to SPI
device
VOH
1.44
1.8
1.8
NOT support
VOL
0.36
Clock to SPI
device, running
at 104MHz
VOH
1.44
1.8
1.8
VOL
0.36
Serial data line
for transmitted
data, master out
VOH
1.44
1.8
1.8
VOL
0.36
Serial data line
for received
data, master in
VIH
1.26
1.8
1.8
VIL
0.54
I2C bus serial
clock line (need
pull up to
VCC_EXT)
VOH
1.44
1.8
1.8
VOL
0.36
I2C bus serial
data line (need
pull up to
VCC_EXT)
VOH
1.44
1.8
1.8
VOL
0.36
VIH
1.26
1.8
1.8
VIL
0.54
Power supply for
SIM
1.8/
SIM data
1.8
If not use,
please pull it
send
E2
UART2_RTS
UART2 ready
for
receive
D1
D2
C2
C1
G1
H1
D9
D10
SPI_CS_N
SPI_CLK
SPI_MOSI
SPI_MISO
I2C_SCL
I2C_SDA
SIM_VCC
SIM_IO
I/O
PO
I/O
NOT support
NOT support
NOT support
NOT support
NOT support
3.0
1.8/
3.0
B9
SIM_CLK
SIM clock
1.8/
3.0
C9
SIM_RST
SIM reset
1.8/
3.0
C10
SIM_DETECT
SIM hot swap
VIH
1.26
1.8
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HUAWEI ME309-562 eMTC LGA Module
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
0.54
high to
VCC_EXT on
your board.
VOH
1.44
1.8
1.8
If not use,
please leave it
open.
VOL
0.36
VIH
1.26
1.8
1.8
VIL
0.54
VOH
1.44
1.8
1.8
VOL
0.36
NOT support,
please use
RING as
wake_up out
VOH
1.44
1.8
1.8
VOL
0.36
VOH
1.44
1.8
1.8
VOL
0.36
VOH
1.44
1.8
1.8
VOL
0.36
VIH
VIH
1.26
1.8
Default
configuration
is input pull
down.
VIL
VIL
VOH
1.44
1.8
1.8
VOL
0.36
detection
H: SIM is resent
VIL
L: SIM is absent
E3
L8
SIM_SWITCH
WAKEUP_IN
Switch from one
card to the
other, should
cooperate with
SIM switch IC
chip.
The host sets
the module into
sleep mode or
wakes up the
module from
sleep mode.
H: Sleep mode
is disabled.
L: Sleep mode is
enabled.
(default L )
L3
WAKEUP_OUT
Module wakes
up the host
K3
SLEEP_STATUS
Sleep status
indicator
H: The module
is in wakeup
state.
L: The module is
in sleep state.
J8
E8
G8
LED_MODE
GPIO1
GPIO2
I/O
I/O
Network mode
indicator.
General
Purpose I/O
pins.
General
Purpose I/O
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Default
configuration
is input pull
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Pin
No.
D3
F8
H8
L2
M2
K2
L1
M1
Pin Name
GPIO3
GPIO4
GPIO5
JTAG_TMS
JTAG_TRST_N
JTAG_TCK
JTAG_TDO
JTAG_TDI
Pad
Type
I/O
I/O
I/O
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
pins.
VIH
VIH
1.26
1.8
down.
VIL
VIL
VOH
1.44
1.8
1.8
VOL
0.36
VIH
VIH
1.26
1.8
VIL
VIL
VOH
1.44
1.8
1.8
VOL
0.36
VIH
VIH
1.26
1.8
VIL
VIL
VOH
1.44
1.8
1.8
VOL
0.36
VIH
VIH
1.26
1.8
VIL
VIL
VIH
1.26
1.8
1.8
VIL
0.54
VIH
1.26
1.8
1.8
VIL
0.54
VIH
1.26
1.8
1.8
VIL
0.54
VOH
1.44
1.8
1.8
VOL
0.36
VIH
1.26
1.8
1.8
VIL
0.54
The ADC’s
resolution is
10bit
General
Purpose I/O
pins.
General
Purpose I/O
pins.
General
Purpose I/O
pins.
JTAG test mode
select
JTAG test reset
JTAG test clock
JTAG test data
output
JTAG test serial
data input
K1
ADC_1
AI
Conversion
interface for
analog signals
to digital signals
-0.036
1.836
J1
ADC_2
AI
Conversion
interface for
analog signals
to digital signals
-0.036
1.836
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Default
configuration
is input pull
down.
Default
configuration
is input pull
down.
Default
configuration
is input pull
down.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
D8
POWER_ON
System power on
1.8
Not support,
will cancel it
J3
POWER_OFF
System power off
1.8
Not support,
will cancel it
F9
RESIN_N
System reset,
active low.
1.8
Please add a
pull-high
resister to
1.8V on your
board (not
VCC_EXT).
K8
BOOT_MODE
Boot mode
configure
VIH
1.26
1.8
1.8
VIL
0.54
Please design
a pull-high
resister to
VCC_EXT and
a pull down
resister to
Ground on
your board,
default pull
high resister is
on the PCB
board.
H: boot from
flash
L: boot from
host
K10
VCC_EXT
PO
Pin for external
power output
1.71
1.8
1.89
Max current is
10mA
L9
VCC_Module
PI
Power supply
3.3
3.8
4.2
Max current is
about 300mA
3.3
3.8
4.2
Input
L10
VCC_Module
PI
Power supply
input
P3
RF_ANT
RF
RF pin of
module
A3
Reserved
Reserved,
please keep this
pin open.
B2
Reserved
Reserved,
please keep this
pin open.
B3
Reserved
Reserved,
please keep this
pin open.
C3
Reserved
Reserved,
please keep this
pin open.
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HUAWEI ME309-562 eMTC LGA Module
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
G9
Reserved
Reserved,
please keep this
pin open.
G10
Reserved
Reserved,
please keep this
pin open.
F10
Reserved
Reserved,
please keep this
pin open.
E9
Reserved
Reserved,
please keep this
pin open.
J10
Reserved
Reserved,
please keep this
pin open.
H9
Reserved
Reserved,
please keep this
pin open.
C5
Reserved
Reserved,
please keep this
pin open.
G2
Reserved
Reserved,
please keep this
pin open.
G3
Reserved
Reserved,
please keep this
pin open.
H2
Reserved
Reserved,
please keep this
pin open.
H3
Reserved
Reserved,
please keep this
pin open.
P8
Reserved
Reserved,
please keep this
pin open.
C4
Reserved
Reserved,
please keep this
pin open.
A1
NC
Not connected
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HUAWEI ME309-562 eMTC LGA Module
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
A10
NC
Not connected
P1
NC
Not connected
P10
NC
Not connected
A2
GND
Ground
A9
GND
Ground
B1
GND
Ground
B10
GND
Ground
C8
GND
Ground
E1
GND
Ground
E5
GND
Ground
E6
GND
Ground
E10
GND
Ground
F5
GND
Ground
F6
GND
Ground
G5
GND
Ground
G6
GND
Ground
H5
GND
Ground
H6
GND
Ground
H10
GND
Ground
J2
GND
Ground
J5
GND
Ground
J6
GND
Ground
J9
GND
Ground
K5
GND
Ground
K6
GND
Ground
K9
GND
Ground
M3
GND
Ground
M4
GND
Ground
M5
GND
Ground
M6
GND
Ground
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HUAWEI ME309-562 eMTC LGA Module
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
M7
GND
Ground
M8
GND
Ground
M9
GND
Ground
M10
GND
Ground
N1
GND
Ground
N2
GND
Ground
N3
GND
Ground
N4
GND
Ground
N5
GND
Ground
N6
GND
Ground
N7
GND
Ground
N8
GND
Ground
N9
GND
Ground
N10
GND
Ground
P2
GND
Ground
P4
GND
Ground
P5
GND
Ground
P6
GND
Ground
P7
GND
Ground
P9
GND
Ground

I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates
pins for analog signal input; PI indicates power input pins; PO indicates power output pins;
P indicates power pins.

VIL indicates low-level input voltage; VIH indicates high-level input voltage; VOL indicates lowlevel output voltage; VOH indicates high-level output voltage.

The NC (Not Connected) pins are floating and there are no signal connected to these pins.

The Reserved pins are internally connected to the module. Therefore, these pins should
not be used, otherwise they may cause problems. Please contact with us for more details
about this information.
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Mechanical Specifications
4.1 About This Chapter

Storage Requirement

Moisture Sensitivity

Dimensions

Customer PCB Design
4.2 Storage Requirement
The module must be stored and sealed properly in vacuum package under a
temperature below 40°C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.
4.3 Moisture Sensitivity

The moisture sensitivity is level 3.

After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30°C and the
relative humidity is less than 60%. If the preceding conditions cannot be met, the
module needs to be baked according to the parameters specified in Table 4-1 .
Table 4-1 Baking parameters
Baking
Temperature
Baking
Condition
Baking Duration
Remarks
125°C±5°C
Relative humidity
≤ 60%
8 hours
Refer to JESD-033C
in detail
Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.
4.4 Dimensions
Figure 4-1 shows the dimensions of the ME309-562 module in details.
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HUAWEI ME309-562 eMTC LGA Module
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Figure 4-1 Dimensions (Unit: mm)
The detail information about the corner and the module pin description top view:
1. the yellow pins, diameter is 0.76 mm, pitch is 1.35 mm,
2. the blue pins, diameter is 0.89 mm, pitch is 1.60 mm.
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HUAWEI ME309-562 eMTC LGA Module
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4.5 Customer PCB Design
4.5.1 PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.
4.5.2 PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
Figure 4-2 Footprint design of customer's PCB (Unit: mm)
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Some detail information about the recommend module footprint:
1. the yellow pins, diameter is 0.71 mm, pitch is 1.35 mm,
2. the blue pins, diameter is 0.81 mm, pitch is 1.60 mm.
Figure 4-3 Detail information about the recommend module footprint
Figure 4-4 Recommended Package Size on HUAWEI motherboard (Unit: mm)
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
4.5.3 Solder Mask
Non Solder Mask Defined (NSMD) is recommended. In addition, the solder mask of
the NSMD pad design is larger than the pad so the reliability of the solder joint can be
improved.
The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm–75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.
4.5.4 Requirements on PCB Layout

To reduce deformation, a thickness of at least 1.0 mm is recommended.

Other devices must be located more than 3 mm (5 mm recommended) away
from the two parallel sides of the LGA module (rework requirement),and other
sides with 0.6 mm. The minimum distance between the LGA module and the
PCB edge is 0.3 mm.

When the PCB layout is double sided, the LGA module must be placed on the
second side for assembly; so as to avoid module dropped from PCB or
component (located in module) re-melding defects caused by uneven weight.

Customers PCB together with ME309-562 should be placed in an enclosed box
to reduce the impact of high humidity as far as possible.

The bottom of the module is not allowed to put non-ground line or non-ground
hole. If the design can not be achieved, then the non-gound line and hole must
be covered by green oil.
4.5.5 Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. The
stencil design is shown as Figure 4-5 :
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HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Figure 4-5 Recommended stencil design of LGA module (Unit: mm)
The stencil design has been qualified for HUAWEI motherboard assembly, customers can
adjust the parameters by their motherboard design and process situation to assure LGA
soldering quality and no defect.
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