Huawei Technologies MU609T HSPA Module User Manual English

Huawei Technologies Co.,Ltd HSPA Module English

Contents

Installation Manual

Copyright © Huawei Technologies Co., Ltd. 2012.
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Notice
Some features of the product and its accessories described herein rely on the software
installed, capacities and settings of local network, and may not be activated or may be
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may not exactly match the product or its accessories you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any information or
specifications contained in this manual without prior notice or obligation.
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i
Contents
Getting to Know the MU609T ........................................................................................................................ 1
PCB Design ............................................................................................................................................................ 3
Assembly................................................................................................................................................................ 5
1
Thank you for purchasing HUAWEI MU609T HSPA LGA
Module (hereinafter referred to as the MU609T)
Note:
This manual briefly describes the preparation, the process for PCB Design, Assembly
and safety precautions.
You are recommended to read the manual before using the MU609T.
Getting to Know the MU609T
The package of the LGA module is 140 pin LGA with a dimension of 40 mm × 40 mm ×
4.0 mm. It is applied to the user interface board, and can be used as a wireless terminal
in a network environment.
2
35 .56
35 .56
29 .26
18. 54
18 .54
30 .14
3. 25 7.32
2. 44
4X2.0
4X2.0
35 X3.0
35 X3.0
3.0
3.0
135!
2.0
3X0.6
3X1.0
97 X1.8
97 X1.2
A
5:1 B
C
5:1
D
5:1
E
5:1
Bottom view
3
PCB Design
PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows: the sizes of the solder pads on customers'
PCBs are the same as those of the module's solder pads for the high production
efficiency and high reliability of solder joints. For details, see the following figure:
4
Top view (PCB pad is recommended)
No.
mm
k
36.65
o
35.56
p
30.14
q
29.26
we
2.44
te
3.71
r
18.54
u
24.38
y
3.25
x
7.32
z
9.76
v
14.64
ba
3.05
bb
2.03
bc
1.22
bd
1.83
be
1.02
bf
0.61
5
Requirements on PCB Layout
The thickness of PCB is more than 1.0 mm (1.2 mm recommended) to reduce the
deformation caused by high temperature welding.
The minimum distance between the LGA module and the PCB edge is 1.5 mm. Other
devices must be located more than 1 mm away from the LGA module (more than 3 mm
recommended if rework is considered).
When the PCB layout is double sided, it is recommended that the LGA module be
placed on the second side for assembly.
Design of Solder Mask
The PCB pad design can be solder mask defined (SMD), or non-solder mask defined
(NSMD).NSMD is recommended. In addition, the solder mask of the NSMD pad design
is larger than the pad so the reliability of the solder joint can be improved.
The solder mask must be 100 µm to150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm to 75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.
Assembly
Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For the
stencil design, see the following figure：
6
35 .61
35 .56
29 .26
18 .54
18 .54
30 .09
3. 30
7. 32
2. 44
4X 2.03
4X 2. 08
35 X3.05
35 X3.05
3. 05
3. 05
2. 05
3X 0.65
3X 1.00
97 X1 .88
97 X1 .22
A
5:1
B
5:1
C
5:1
D
5:1 E
5:1
3. 71
9. 76
14 .64
36 .70
29 .26
24 .38
2. 44
3. 71
36 .70
30 .09
4X 0.2
3X0.2
97 X0.2
0.3
0.2
135
4
5
45
1. 27
1. 27
1. 27
1. 27
X
Y
7
Item
Description
Figure
A
Elongate the stencil opening 0.05 mm
with the direction reverse the center of
the module and add an isolation
bridge with 0.2 mm width at the X axis
direction.
B&C
0.3 mm width stencil opening and 0.2
mm space to divide the pad with the
angle of 45.
D
Elongate the stencil opening 0.05 mm
with the reverse direction for the
adjacent pad, but will not reduce the
air gap, and add an isolation bridge
with 0.2 mm width at the X axis
direction.
E
Elongate the stencil opening 0.05 mm
with the X+ direction and add an
isolation bridge with 0.2 mm width at
the axis direction.
Reflow Profile
For the soldering temperature of the LGA module, see the following figure:
8
Reflow parameters:
Temperature Zone
Time
Key Parameter
Preheat zone
(40°C–150°C)
60s–120s
Heating rate:
0.5°C/s–2°C/s
Soak zone
(150°C –200°C)
(t1–t2): 60s–120s
Heating rate: < 1.0°C/s
Reflow zone (>
217°C)
(t3–t4): 30s–90s
Peak reflow
temperature:
230°C–250°C
Cooling zone
Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s
9

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