Huawei ME906 Series LTE M.2 Module Hardware Guide (V100R001 08, English)

2018-05-24

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HUAWEI ME906 Series LTE M.2 Module

Hardware Guide

Issue

Date

2017-12-11

Copyright © Huawei Technologies Co., Ltd. 2017. All rights reserved.
No part of this manual may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei").
The product described in this manual may include copyrighted software of Huawei and possible licensors.
Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract,
reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by
applicable laws or such actions are approved by respective copyright holders.

Trademarks and Permissions
,
, and
are trademarks or registered trademarks of Huawei Technologies Co., Ltd.
LTE is a trade mark of ETSI.
Other trademarks, product, service and company names mentioned may be the property of their respective
owners.

Notice
Some features of the product and its accessories described herein rely on the software installed, capacities
and settings of local network, and therefore may not be activated or may be limited by local network operators
or network service providers.
Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.
Huawei reserves the right to change or modify any information or specifications contained in this manual
without prior notice and without any liability.

DISCLAIMER
ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE
LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED
TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE,
ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL.
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Customers shall comply with all applicable export or import laws and regulations and be responsible to obtain
all necessary governmental permits and licenses in order to export, re-export or import the product mentioned
in this manual including the software and technical data therein.

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

About This Document

About This Document
Revision History
Document
Version

Date

2013-05-06

2013-08-02

Issue 08 (2017-12-11)

Chapter

Descriptions
Creation

2.2

Updated Operating System in Table 2-1
Features

3.4.3

Updated three figures in 3.4.3 RESET# Pins

3.4.5

Added Figure 3-12 Connections of the
W_DISABLE# pin

3.4.6

Added Figure 3-13 Connections of the
GPS_DISABLE# pin

3.4.7

Updated Figure 3-15 Connections of the
Wake_On_WWAN# pin

3.4.8

Updated Figure 3-16 Connections of the
BodySAR_N pin

3.4.9

Updated Figure 3-17 Connections of the
USIM_DET pin

3.10

Updated Table 3-16 List of NC pins

4.3.2

Updated Test Standards

4.4.2

Updated Table 4-8 ME906V conducted Tx
power (Unit: dBm)

5.2

Updated Table 5-1 Absolute ratings for the
ME906 module

5.5.2

Updated Table 5-8 Averaged standby DC
power consumption

5.6

Updated Table 5-16 Test conditions and
results of the reliability of the ME906 module

6.2

Updated Figure 6-1 Dimensions of ME906

8.2

Updated Table 8-1 Product certifications

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Document
Version

Date

2013-08-22

About This Document

Chapter

Descriptions

Updated Appendix A Circuit of Typical
Interface

3.2

Added the description of ANTCTL pins in
Table 3-1 Definitions of pins on the M.2
interface

3.7

Updated Table 3-11 List of ANTCTL pins

5.5.2

Added Table 5-14 DC power consumption
(GPS)

5.6

Updated Table 5-15 Test conditions and
results of the reliability of the ME906 module

2013-10-21

5.6

Updated Table 5-15 Test conditions and
results of the reliability of the ME906 module

2013-12-28

5.5

Updated Table 5-7 Averaged power off DC
power consumption of ME906,
Updated Table 5-8 Averaged standby DC
power consumption of ME906
(WCDMA/HSDPA/LTE/CDMA/EVDO/GSM)
Updated Table 5-9 Averaged Data
Transmission DC power consumption of
ME906V (WCDMA/HSDPA/LTE/CDMA/
EVDO)
Updated Table 5-14 Averaged GPS
operation DC power consumption of ME906

Issue 08 (2017-12-11)

2015-08-20

5.7

Updated 5.7 EMC and ESD Features

2.2

Updated Table 2-1 Features

Updated the definitions of pins on the M.2
interface

4.3.1

Updated the test instrument

4.4

Updated conducted Rx sensitivity and Tx
power

4.5.1

Updated antenna design indicators

4.5.3

Updated antenna requirements

4.5.4

Deleted the radio test environment in issue
01

5.4

Deleted electrical features of application
interfaces in issue 01

7.2

Added a caution about the module

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About This Document

Document
Version

Date

Chapter

Descriptions

2017-06-23

9.13.1

Updated section 9.13.1: EU Regulatory
Conformance

2017-12-11

Deleted privacy policy

Scope
ME906V
ME906E
ME906J

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HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Contents

Contents
1 Introduction.................................................................................................................................... 9
2 Overall Description .................................................................................................................... 10
2.1 About This Chapter ......................................................................................................................... 10
2.2 Function Overview.......................................................................................................................... 10
2.3 Circuit Block Diagram ..................................................................................................................... 12

3 Description of the Application Interfaces .............................................................................. 14
3.1 About This Chapter ......................................................................................................................... 14
3.2 75-pin Gold Finger.......................................................................................................................... 14
3.3 Power Interface .............................................................................................................................. 21
3.3.1 Overview ................................................................................................................................ 21
3.3.2 Power Supply 3.3V Interface ................................................................................................. 22
3.3.3 USIM Power Output USIM_PWR .......................................................................................... 23
3.4 Signal Control Interface .................................................................................................................. 24
3.4.1 Overview ................................................................................................................................ 24
3.4.2 Power_On_Off Control Pin .................................................................................................... 25
3.4.3 RESET# Pins ......................................................................................................................... 30
3.4.4 LED# Pin ............................................................................................................................... 32
3.4.5 W_DISABLE# Pin .................................................................................................................. 33
3.4.6 GPS_DISABLE# Pin .............................................................................................................. 34
3.4.7 Wake_On_WWAN# Pin ......................................................................................................... 34
3.4.8 BodySAR_N Pin .................................................................................................................... 35
3.4.9 USIM_DET Pin ...................................................................................................................... 36
3.5 USB Interface ................................................................................................................................. 38
3.6 USIM Card Interface ...................................................................................................................... 39
3.6.1 Overview ................................................................................................................................ 39
3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 40
3.7 Tunable Antenna Control ................................................................................................................ 42
3.8 Config Pins ..................................................................................................................................... 42
3.9 Reserved Pins ................................................................................................................................ 44
3.10 NC Pins ........................................................................................................................................ 44
3.11 RF Antenna Interface.................................................................................................................... 44
3.11.1 RF Connector location ......................................................................................................... 44

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Contents

3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 45

4 RF Specifications ......................................................................................................................... 49
4.1 About This Chapter ......................................................................................................................... 49
4.2 Operating Frequencies ................................................................................................................... 49
4.3 Conducted RF Measurement ......................................................................................................... 51
4.3.1 Test Environment ................................................................................................................... 51
4.3.2 Test Standards ....................................................................................................................... 51
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 52
4.4.1 Conducted Receive Sensitivity .............................................................................................. 52
4.4.2 Conducted Transmit Power ................................................................................................... 54
4.5 Antenna Design Requirements ...................................................................................................... 56
4.5.1 Antenna Design Indicators..................................................................................................... 56
4.5.2 Interference ........................................................................................................................... 59
4.5.3 Antenna Requirements .......................................................................................................... 59

5 Electrical and Reliability Features ........................................................................................... 63
5.1 About This Chapter ......................................................................................................................... 63
5.2 Absolute Ratings ............................................................................................................................ 63
5.3 Operating and Storage Temperatures and Humidity ...................................................................... 63
5.4 Power Supply Features .................................................................................................................. 64
5.4.1 Input Power Supply ............................................................................................................... 64
5.4.2 Power Consumption .............................................................................................................. 65
5.5 Reliability Features ......................................................................................................................... 77
5.6 EMC and ESD Features ................................................................................................................. 80

6 Mechanical Specifications ......................................................................................................... 82
6.1 About This Chapter ......................................................................................................................... 82
6.2 Dimensions ..................................................................................................................................... 82
6.3 Label ............................................................................................................................................... 83
6.4 Packing System.............................................................................................................................. 84

7 Installation.................................................................................................................................... 86
7.1 About This Chapter ......................................................................................................................... 86
7.2 Connect ME906 to board ............................................................................................................... 86
7.3 Thermal Management .................................................................................................................... 87
7.4 Antenna Plug .................................................................................................................................. 87

8 Certifications ................................................................................................................................ 89
8.1 About This Chapter ......................................................................................................................... 89
8.2 Certifications ................................................................................................................................... 89

9 Safety Information ...................................................................................................................... 91
9.1 Interference .................................................................................................................................... 91
9.2 Medical Device ............................................................................................................................... 91

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9.3 Area with Inflammables and Explosives ......................................................................................... 91
9.4 Traffic Security................................................................................................................................ 92
9.5 Airline Security................................................................................................................................ 92
9.6 Safety of Children ........................................................................................................................... 92
9.7 Environment Protection .................................................................................................................. 92
9.8 WEEE Approval .............................................................................................................................. 92
9.9 RoHS Approval ............................................................................................................................... 92
9.10 Laws and Regulations Observance ............................................................................................. 93
9.11 Care and Maintenance ................................................................................................................. 93
9.12 Emergency Call ............................................................................................................................ 93
9.13 Regulatory Information ................................................................................................................. 93
9.13.1 EU Regulatory Conformance .............................................................................................. 93
9.13.2 FCC Statement .................................................................................................................... 94

10 Appendix A Circuit of Typical Interface .............................................................................. 95
11 Appendix B Acronyms and Abbreviations .......................................................................... 96

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HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Introduction

This document describes the hardware application interfaces and air interfaces that
are provided when HUAWEI ME906 series LTE M.2 Module (ME906V, ME906E and
ME906J) is used.
M.2 is the new name for NGFF (Next Generation Form Factor), which is the
specification of PCI-SIG (Peripheral Component Interconnect Special Interest
Group).
This document helps you to understand the interface specifications, electrical
features and related product information of the ME906 module.
Table 1-1 ME906 series product name
Product name

Description

ME906V

LTE M.2 Module for North America.

ME906E

LTE M.2 Module for Europe.

ME906J

LTE M.2 Module for Japan.

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Overall Description

2.1 About This Chapter
This chapter gives a general description of the ME906 module and provides:


Function Overview



Circuit Block Diagram

2.2 Function Overview
Table 2-1 Features
Feature

Description

Physical
Features

Dimensions (L × W × H): 42 mm × 30 mm × 2.3 mm

Operating
Bands

LTE: FDD Band 1, 2, 4, 5, 8, 13, 17, all bands with diversity

(ME906V)

Weight: about 6 g

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, 2, 4, 5, 8, all bands
with diversity
CDMA 1X/CDMA EVDO Rev.A: BC0, BC1, all bands with
diversity
GSM/GPRS/EDGE: 850/900/1800/1900 MHz
GPS/GLONASS: L1

Operating
Bands
(ME906E)

LTE: FDD Band 1, 2, 3, 5, 7, 8, 20, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, 2, 5, 8, all bands with
diversity
GSM/GPRS/EDGE: 850/900/1800/1900 MHz
GPS/GLONASS: L1

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Overall Description

Feature

Description

Operating
Bands

KDDI:

(ME906J)

CDMA 1X/CDMA EVDO Rev.B: BC0, BC6, all bands with
diversity

LTE: FDD Band 11, 18, all bands with diversity

GPS/GLONASS: L1
DOCOMO:
LTE: FDD Band 1, 19, 21, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, 5, 6, 19, all bands
with diversity
GPS/GLONASS: L1
Operating
Temperature

Normal operating temperature: –10°C to +55°C

Storage
Temperature

–40°C to +85°C

Power Voltage

3.135 V to 4.4 V (3.3 V is typical)

Extended operating temperature[1]: –20°C to +70°C

USIM (3.0 V or 1.8 V)
USIM_DET pin (USIM Hot Swap Detection)
USB 2.0 (High-Speed)
Power_On_Off pin
RESET# pin
Application
Interface (75pin Gold
Finger)

LED# pin
W_DISABLE# pin
GPS_DISABLE# pin
Tunable Antenna control (4 GPIOs)
Wake_On_WWAN# pin
BodySAR_N pin
Power supply (5 pins)

Antenna
Connectors

MAIN and AUX (supports Diversity and GPS simultaneously)

SMS

Supports MO and MT

MM4829-2702RA4 by MURATA or other equivalent parts

Supports formats of PDU
Point-to-point and cell broadcast
Data Services

GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s

(ME906V)

EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s

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Feature

Overall Description

Description
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s
CDMA 1x: DL 153.6 kbit/s; UL 153.6 kbit/s
EVDO Rev.A: DL 3.1 Mbit/s; UL 1.8 Mbit/s
LTE FDD: DL 100 Mbit/s; UL 50 Mbit/s @20M BW cat3

Data Services

GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s

(ME906E)

EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 100 Mbit/s; UL 50 Mbit/s @20M BW cat3

Data Services

WCDMA PS: DL 384 kbit/s; UL 384 kbit/s

(ME906J)

HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s
CDMA 1x: DL 153.6 kbit/s; UL 153.6 kbit/s
EVDO Rev.A: DL 3.1 Mbit/s; UL 1.8 Mbit/s
EVDO Rev.B: DL 14.7 Mbit/s; UL 5.4 Mbit/s
LTE: DL 100 Mbit/s; UL 50 Mbit/s @20M BW cat3

Operating

Windows 7/8/8.1/Android 4.0 or later/Chrome OS

System

[1]: When the ME906 module works at –20°C to –10°C or +55°C to +70°C, NOT all
its RF performances comply with the 3GPP and 3GPP2 (CDMA) RF specifications.

2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME906 module. The application
block diagram and major functional units of the ME906 module contain the following
parts:


Baseband controller

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Overall Description



Power manager



Multi-chip package (MCP) memory



Radio Frequency (RF) transceiver



RF Front End

Figure 2-1 Circuit block diagram of the ME906 module
SIM_DET
EBU

USIM

MCP

ANTCTL
BodySAR_N
Wake_On_WWAN#

M.2
Interface

W_DISABLE#

BASE
BAND
Dig RF

GPS_DISABLE#
RESET#
USB
Power_On_Off

Power

RF Connector
RF Connector

Issue 08 (2017-12-11)

RF TRANSCEIVER

LED#

Tx signal

PRx signal

DRX signal

RF
Front
End

GPS signal
Power
Manager
DRX & GPS signal

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Description of the Application Interfaces

3.1 About This Chapter
This chapter mainly describes the application interfaces of the ME906 module,
including:


75-pin Gold Finger



Power Interface



Signal Control Interface



USB Interface



USIM Card Interface



Tunable Antenna Control



Config Pins



Reserved Pins



NC Pins



RF Antenna Interface

3.2 75-pin Gold Finger
The ME906 module uses a 75-pin Gold Finger as its external interface. For details
about the module dimensions, see "6.2 Dimensions".
Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the ME906
module.

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Description of the Application Interfaces

Figure 3-1 TOP view of Gold Finger interface pins

Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch)
of the ME906 module.
As M.2 Nomenclature, ME906 is Type 3042-S3-B (30 mm × 42 mm, Max.
Component Height on Top is 1.5 mm and single-sided, Key ID is B).

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Description of the Application Interfaces

Table 3-1 Definitions of pins on the M.2 interface
Pin
No.

Pin Name

Pad
Type

Description
Connected to Ground
internally.

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

CONFIG_3

3.3V

Power supply

3.135

3.3

4.4

Ground

3.3V

Power supply

3.135

3.3

4.4

Ground

VIH

1.24

3.6

ME906 is configured as
WWAN-SSIC 0.

A single control to turn
on/off WWAN.
When it is low, WWAN is
powered off.
6

Power_On_Off

When it is high, WWAN is
powered on.

It is internally pulled to
Low.
VIL

–0.3

0.3

When it is high, WWAN
function is determined by
software AT command.
(default enabled)

VIH

1.24

3.6

When it is low, WWAN
function will be turned off.

VIL

–0.3

0.3

It is 3.3 V tolerant but can
be driven by either 1.8 V or
3.3 V GPIO.
7

USB_D+

I/O

USB data + defined in the
USB 2.0 specification.

WWAN disable function

W_DISABLE#

USB_D-

I/O

USB data - defined in the
USB 2.0 specification.

Open drain
and
requires a
pull-up
resistor on
the host.
-

LED#

It is an open drain, active
low signal, used to allow
the M.2 card to provide
status indicators via LED
devices that will be
provided by the host.

Ground

Notch

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Pin
No.

Pin Name

Pad
Type

Description

Notch

Description of the Application Interfaces
Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Notch

Reserved

Reserved for future use,
please keep it NC in host
side.

CONFIG_0

Reserved

Not connected internally.
ME906 is configured as
WWAN-SSIC 0.
Reserved for future use,
please keep it NC in host
side.

Open drain
and
requires a
pull-up
resistor on
the host.

VIH

1.24

3.6

VIL

–0.3

0.3

VIH

1.24

3.6

When it is low, GPS is
turned off.

VIL

–0.3

0.3

WWAN to wake up the host.

Wake_On_WW
AN#

Reserved

It is open drain and active
low.

Reserved for future use,
please keep it NC in host
side.
Hardware pin for BodySAR
detection

BodySAR_N

When it is high, no TX
power backoff (default).
When it is low, TX power
backoff.
GPS disable function

GPS_DISABLE#

When it is high, GPS
function is determined by
software AT command.

Ground

Not connected

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Pin
No.

Pin Name

Pad
Type

Description

Description of the Application Interfaces
Parameter

VOH
30

USIM_RESET

USIM_CLK

Ground

USIM_DATA

I/O

USIM_PWR

Max.
(V)

0.7 x
USIM
_PW
R

3.3

Not connected

VOL

0.2 x
USIM
_PW
R

VOH

0.7 x
USIM
_PW
R

3.3

USIM clock

Ground

VOL

0.2 x
USIM
_PW
R

VOH

0.7 x
USIM
_PW
R

3.3

0.2 x
USIM
_PW
R

USIM data
VIH

Typ.
(V)

USIM reset

VOL
34

Min.
(V)

Not connected

0.7 x
USIM
_PW
R

3.3

Comments

USIM_PW
R=1.8 V or
2.85 V

USIM_P
WR=1.8 V
or 2.85 V

USIM_PW
R=1.8 V or
2.85 V

VIL

0.2 x
USIM
_PW
R

1.75

1.8

1.98

USIM_PW
R=1.8 V

2.75

2.85

3.3

USIM_PW
R=2.85 V

USIM power

Not connected

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Pin
No.

Pin Name

Pad
Type

Description

Ground

I2C_SCL

I2C_SDA

I2C_IRQ

Ground

SYSCLK

TX_BLANKING

I/O

Description of the Application Interfaces
Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Ground

I2C clock.

VIH

1.26

1.8

2.1

This function is under
development.

VIL

–0.3

0.63

Not connected

VOH

1.35

1.8

I2C data.

VOL

0.45

This function is under
development.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Not connected

Interrupt signal to wake up
the module.

VIH

1.26

1.8

2.1

This function is under
development.

VIL

–0.3

0.63

Ground

Module clock output for
external GNSS module.

VOH

1.6

1.8

This function is under
development.

VOL

0.45

Not connected

Tx blanking signal for
external GNSS module.

VOH

1.6

1.8

This function is under
development.

VOL

0.45

Not connected

Ground

Not connected

Ground

Not connected

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Pin
No.

Pin Name

Pad
Type

ANTCTL0

COEX3

ANTCTL1

COEX2

ANTCTL2

COEX1

ANTCTL3

USIM_DET

RESET#

Issue 08 (2017-12-11)

I/O

Description of the Application Interfaces
Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Tunable antenna control
signal, bit 0.

VOH

1.35

1.8

2.1

It is a push-pull type GPIO.

VOL

0.45

For coexistence.

VOH

1.35

1.8

2.1

This function is under
development.

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Tunable antenna control
signal, bit 1.

VOH

1.35

1.8

2.1

It is a push-pull type GPIO.

VOL

0.45

For coexistence.

VOH

1.35

1.8

2.1

This function is under
development.

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Tunable antenna control
signal, bit 2.

VOH

1.35

2.1

It is a push-pull type GPIO.

VOL

0.45

For coexistence.

VOH

1.35

1.8

2.1

This function is under
development.

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Tunable antenna control
signal, bit 3.

VOH

1.35

1.8

2.1

It is a push-pull type GPIO.

VOL

0.45

USIM hot swap detection
pin

VIH

1.26

1.8

2.1

When USIM is absent,
USIM_DET is low.

VIL

–0.3

0.63

Module reset, active low

VIH

1.26

3.6

VIL

–0.3

0.3

Description

When USIM is present,
USIM_DET is high (pulled
up to 1.8V);

Not connected

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Pin
No.

Pad
Type

Pin Name

Description
Connected to ground
internally.

Description of the Application Interfaces
Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

CONFIG_1

3.3V

Power supply

3.135

3.3

4.4

Ground

3.3V

Power supply

3.135

3.3

4.4

Ground

3.3V

Power supply

3.135

3.3

4.4

CONFIG_2

ME906 is configured as
WWAN-SSIC 0.

Connected to ground
internally.
ME906 is configured as
WWAN-SSIC 0.



I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates
power input pins; PO indicates power output pins; P indicates power pins.



VIL indicates low-level input voltage; VIH indicates high-level input voltage; VOL indicates
low-level output voltage; VOH indicates high-level output voltage.



The NC (Not Connected) pins are floating and there are no signal connected to these pins.



The Reserved pins are internally connected to the module. Therefore, these pins should
not be used, otherwise they may cause problems. Please contact with us for more details
about this information.

3.3 Power Interface
3.3.1 Overview
The power supply part of the ME906 module contains:


3.3V pin for the power supply



USIM_PWR pin for USIM card power output

Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
PinNo.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

2, 4, 70, 72, 74

3.3V

Power supply

3.135

3.3

4.4

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PinNo.

3, 5, 11, 27, 33,
39, 45, 51, 57,
71, 73

Pin Name

USIM_PWR

Ground

Pad Type

Description

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

1.75

1.8

1.98

USIM_PW
R=1.8 V

2.75

2.85

3.3

USIM_PW
R=2.85 V

Power supply

Ground

3.3.2 Power Supply 3.3V Interface
The ME906 module power is supplied through the 3.3V pins and the voltage ranges
from 3.135 V to 4.4 V (typical value is 3.3 V). The ME906 provides 5 power pins and
11 GND pins. To ensure that the ME906 module works normally, all the pins must be
connected. The M.2 connector pin is defined as that should support 500 mA/Pin
continuous.
When the ME906 module works at GSM mode, the module transmits at the
maximum power, the transient peak current may reach 2.5 A. In this case, the power
pin voltage will drop. Make sure that the voltage does not drop below 3.135 V in any
case.
The traces of the power supply should be as short and wide as possible. It is
recommended that at least one 220 μF capacitance is added onto the 3.3V power
rails and as close to the M.2 connector as possible. Customer can reduce the
capacitance if it can be guaranteed that the 3.3V pin does not drop below 3.135 V in
any case.
Figure 3-2 shows the recommended power circuit of ME906 module.
Figure 3-2 Recommended power circuit of ME906 module

3.3V
3.3V

Module
(Modem)

330 pF 100 nF 1 μF 22 μF 220 μF

3.135 V is the minimum voltage supplied to ME906 by the host, and 3.3V pin must never be
under 3.135 V in any case, which is shown as follow:

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4.4V
Do not drop below 3.135V,
during TX, the maximum
current may be 2.5 A.
3.3V

3.135V

If customer wants to power cycle ME906, the 3.3V pin must stay below 1.8 V for
more than 100 ms.
Figure 3-3 shows the power supply timing sequence between power cycling.
Figure 3-3 ME906 power supply timing sequence between power cycling

Parameter

Remarks

Time (Min.)

Unit

Toff

Power off time

100

3.3.3 USIM Power Output USIM_PWR
Through the USIM_PWR power supply interface, the ME906 module can supply 1.8
V or 2.85 V power to USIM card. The transient current can reach 200 mA, so special
attention should be taken on PCB design at the host side.

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3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the ME906 module consists of the following:


Power On/Off (Power_On_Off) pin



Module reset (RESET#) pin



LED control (LED#) pin



WWAN disable control (W_DISABLE#) pin



GPS disable control (GPS_DISABLE#) pin



Wake signal out from module (Wake_On_WWAN#) pin



BodySAR detection (BodySAR_N) pin



USIM detection (USIM_DET) pin

Table 3-3 lists the pins on the signal control interface.
Table 3-3 Pins on the signal control interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VIH

1.24

3.6

Comments

A single control to turn
on/off WWAN.
When it is low, WWAN is
powered off.
6

Power_On_Off

When it is high, WWAN is
powered on.

It is internally pulled to
Low.
VIL

–0.3

0.3

When it is high, WWAN
function is determined by
software AT command.
(default enabled)

VIH

1.24

3.6

When it is low, WWAN
function will be turned off.

VIL

It is 3.3 V tolerant but can
be driven by either 1.8 V or
3.3 V GPIO.
WWAN disable function

W_DISABLE#

LED#

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It is an open drain, active
low signal, used to allow
the M.2 card to provide
status indicators via LED
devices that will be
provided by the host.

–0.3

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0.3

Open drain
and
requires a
pull-up
resistor on
the host.

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide
Pin
No.

Pad
Type

Pin Name

Wake_On_WW
AN#

Description

BodySAR_N

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

It is open drain and active
low.

Comments

Open drain
and
requires a
pull-up
resistor on
the host.

VIH

1.24

3.6

VIL

–0.3

0.3

VIH

1.24

3.6

VIL

–0.3

0.3

WWAN to wake up the host.
O

Hardware pin for BodySAR
detection
25

Description of the Application Interfaces

When it is high, no TX
power backoff (default).

When it is low, TX power
backoff.
GPS disable function

GPS_DISABLE#

When it is high, GPS
function is determined by
software AT command.

When it is low, GPS is
turned off.
USIM hot swap detection
pin
66

USIM_DET

VIH

1.26

1.8

2.1

When USIM is absent,
USIM_DET is low.

VIL

–0.3

0.63

Module reset, active low

VIH

1.26

3.6

VIL

–0.3

0.3

When USIM is present,
USIM_DET is high (pulled
up to 1.8V);

RESET#

3.4.2 Power_On_Off Control Pin
The ME906 module can be controlled to be powered on/off by the Power_On_Off pin.
Table 3-4 Two States of Power_On_Off
Item

Pin state

Description

High

ME906 is powered on.
NOTE: If ME906 needs to be powered on automatically, the
Power_On_Off pin must be pulled up to 3.3 V.

Low

ME906 is powered off.
It is internally pulled low with a weak pull-down resistor.

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If ME906 is powered by regulator with 3.3 V
If ME906 is powered by 3.3 V voltage regulator (such as notebook or Ultrabook),
Power_On_Off should be pulled up to 3.3 V through a resistor.
The pull-up resistor should be not greater than 10 kΩ.
Following is the power on/off sequence:
1.

The module gets 3.3 V when supply for the module is switched on.

The module is turned on since Power_On_Off is pulled up to 3.3 V by the host.

Host cuts off 3.3 V supply to power off the module.

The recommended circuit is shown as in Figure 3-4 .
Figure 3-4 Recommended connections of Power_On_Off pin (auto power)

ME906

3.3V

Pin2, 4, 70, 72, 74

10 kΩ
Power_On_Off
Pin6

Power on sequence
Do not toggle RESET# during power on sequence. Pulling RESET# low will extend
time for module startup.
Recommended power on timing sequence is shown as Figure 3-5 .

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Figure 3-5 Recommended power on timing sequence

3.3V

RESET#

Power_On_Off

Power on

Power off Sequence
Cutting off 3.3 V will power off the module.
Figure 3-6 Recommended power off timing sequence ( cut off 3.3 V )

3.3V

RESET#

Power_On_Off

Power off

If ME906 is powered directly to battery
For use case ME906 is connected directly to battery, such as tablet platforms,
Power_On_Off should be controlled by a GPIO from host to control ME906 to be
powered on/off.
It is critical to make sure the module is safely shut off when the tablet SoC is shut off.
There will be current leakage if the module is not shut off properly. So it is important
to keep Power_On_Off logic low for more than 500 ms to shut off the module.

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The recommended connections are shown as Figure 3-7 .
Figure 3-7 Recommended connections of Power_On_Off pin (control)

ME906

HOST

Power_On_Off
GPIO

Pin6

Power on sequence
Do not toggle RESET# during power on sequence, pulling RESET# low will extend
time for module startup. The recommended power on timing sequence is shown as
Figure 3-8 .
Figure 3-8 Recommended power on timing sequence

3.3V (battery
always on)

RESET#

Power_On_off

t0
t0 ≥ 0ms

Power on

Power off Sequence
Keep Power_On_Off logic low for more than 500 ms to shut off the module.

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Figure 3-9 Recommended power off timing sequence (connect to battery)

3.3V (battery,
always on)

RESET#

Logic low or high-impedance (preferred)

Power_On_Off

Logic low or high-impedance (preferred)

t1
t1 ≥ 500 ms

Power off

Warm boot (restart) sequence
In the notebook/tablet when using the warm boot, followed sequence is
recommended.
Figure 3-10 Recommended warm boot timing in the notebook/tablet

3.3V (battery,
always on)
.

RESET#

Power_On_Off
t2
t2 ≥ 500 ms

Warm boot in the notebook/tablet

If there is limitation on the controlling GPIO to be programmable 500 ms, the
hardware solution as shown in Figure 3-11 can be used.

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Figure 3-11 Power on off circuit (hardware solution)

ME906

HOST

Power_On_Off

Pin 6

GPIO2
3.3V (battery)

NMOS

1MΩ

Q1
NMOS
Q2

0Ω
VCCGPIO2

VCCGPIO2 is the power domain of the GPIO2.
When VCCGPIO2 is ON, Q2 is on and Q1 is off. So the Pin 6 is controlled by

GPIO2 of host.
When VCCGPIO2 is Off, Q2 is off and Q1 is on. So the Pin 6 is pulled low,
then the module is powered off.

3.4.3 RESET# Pins
The ME906 module can be reset through the RESET# pin asynchronous, active low.
Whenever this pin is active, the module will immediately be placed in a Power On
reset condition. Care should be taken for this pin unless there is a critical failure and
all other methods of regaining control and/or communication with the WWAN subsystem have failed.
Pulling low RESET# more than 20 ms and then pulling high will reset the module.
RESET# is optional, which can be not connected. Pulling low Power_On_Off for
more than 500 ms and then pulling high can also work as a reset.
RESET# is internally pulled up to 1.8 V, which is automatically on when 3.3 V is
applied even though Power_On_Off is low. Cautions should be taken on circuit
design or else there may be back driving issue.
Hardware circuit for RESET# (option 1) GPIO is high-impedance when the host is
powered off.

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ME906
Pin 67

RESET#

HOST

0Ω

GPIO1

33рF

GPIO1 should be high-impedance
when it is powered off.

Hardware circuit for RESET# (option 2) GPIO is not high-impedance when the host
is powered off.
Use 2 N-MOSFET so that the logic of RESET# and GPIO are the same.
VCCGPIO1

ME906

HOST
RESET#

Pin 67
NMOS

1MΩ

33рF
NMOS

0Ω
GPIO1

Hardware circuit for RESET# (option 3) GPIO is not high-impedance when the host
is powered off.
Use only one N-MOSFET, in this case the logic of RESET# and GPIO1 is reversed.

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ME906

HOST
RESET#

Pin 67

33рF

0Ω
GPIO1



As the RESET# signal is relatively sensitive, it is recommended to install a 33 pF
capacitor near to the M.2 pin.



Triggering the RESET# signal will lead to loss of all data in the module. It
will also disconnect the module from the network resulting in a call drop.

3.4.4 LED# Pin
ME906 provides an open drain signal to indicate the RF status.
Table 3-5 State of the LED# pin
No.

Operating Status

LED#

RF function is turned on

Output Low, current sink

RF function is turned off

Output High-Z

Figure 3-12 shows the recommended circuits of the LED# pin. The brightness of LED
can be adjusted by adjusting the resistance of the series resistor, and the maximum
sink current is 40 mA.

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Figure 3-12 Driving circuit

3.3V

Module
(Modem)
LED

LED#

BB Chip

3.4.5 W_DISABLE# Pin
ME906 provides a hardware pin (W_DISABLE#) to disable or enable the radio. In
addition, the radio can also be enabled or disabled through software AT commands.
Table 3-6 Function of the W_DISABLE# pin
No.

W_DISABLE#

Function

Low

WWAN function will be turned off.

High

WWAN function is determined by software AT
command. Default enabled.

Floating

WWAN function is determined by software AT
command. Default enabled.

Figure 3-13 Connections of the W_DISABLE# pin

Module
(Modem)

VCC From Host

1.8V
10 kΩ

Host

BB Chip
W_DISABLE#

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It is recommended not to add a diode on the W_DISABLE# pin outside the ME906
module.

3.4.6 GPS_DISABLE# Pin
ME906 provides a hardware pin (GPS_DISABLE#) to disable or enable the GPS. In
addition, the GPS can also be enabled or disabled through software AT commands.
Table 3-7 Function of the GPS_DISABLE# pin
No.

GPS_DISABLE#

Function

Low

GPS function is disabled.

High

GPS function is determined by software AT
command. Default enabled.

Floating

GPS function is determined by software AT
command. Default enabled.

Figure 3-14 Connections of the GPS_DISABLE# pin

Module
(Modem)

VCC From Host
1.8V

10 kΩ

Host

BB Chip
GPS_DISABLE#

It is recommended not to add a diode on the GPS_DISABLE# pin outside the ME906
module.

3.4.7 Wake_On_WWAN# Pin
ME906 provides an open drain output Wake_On_WWAN# pin to wake host, which is
low active.

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Figure 3-15 Wave form of the Wake_On_WWAN# pin

Figure 3-16 Connections of the Wake_On_WWAN# pin

10 kΩ

3.4.8 BodySAR_N Pin
ME906 provides an input pin BodySAR_N for BodySAR detection.
Table 3-8 Function of the BodySAR_N pin
No.

BodySAR_N

Function

Low

Max. TX power will be backed off by setting through AT
command

High

Max. TX power will NOT be backed off (default)

Floating

Max. TX power will NOT be backed off

If BodySAR_N pin is used to monitor the proximity sensor output directly, there are
some essential preconditions for this hardware solution.
ME906 cannot provide any control signal for the proximity sensor, and any control or
programming required by the proximity sensor should be handled by the HOST side.

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Figure 3-17 Connections of the BodySAR_N pin

Module
(Modem)

VCC From Host
1.8V
10 kΩ

BB Chip
BodySAR_N

USB

Proximity
sensor

Host AP

It is recommended not to add a diode on the BodySAR_N pin outside the ME906
module.

3.4.9 USIM_DET Pin
ME906 supports USIM hot swap function.
ME906 provides an input pin (USIM_DET) to detect whether the USIM card is
present or not. This pin is a level trigger pin.
Table 3-9 Function of the USIM_DET pin
No.

USIM_DET

function

High level

USIM card insertion.
If the USIM card is present, USIM_DET should be High.

Low level

USIM card removal.
If the USIM card is absent, USIM_DET should be Low.

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Figure 3-18 Connections of the USIM_DET pin

Module
(Modem)

USIM Deck
1.8V

BB Chip
USIM_DET
470 pF

If USIM card is absent, the CD connects to Ground.
If USIM card is present, the CD is open.

CD is a pin detecting of USIM in the USIM socket, in normal, there will be a detect pin
in the USIM socket.



It is recommended not to add a diode on the USIM_DET pin outside the ME906
module.



The normal SHORT USIM connector should be employed. The logic of
USIM_DET is shown as Figure 3-19 . High represents that USIM is inserted; Low
represents that USIM is removed.



When USIM is inserted (hot), USIM_DET will change from Low to High;



When USIM is removed (hot), USIM_DET will change from High to Low;



ME906 will detect the level of USIM_DET to support the hot swap.

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Figure 3-19 Logic of USIM_DET

WWAN Module
1.8V
USIM Connector Switch

USIM installed=
Not Connected

USIM_DET

Modem
Processor

USIM not
installed=
GND

3.5 USB Interface
The ME906 is compliant with USB 2.0 high speed protocol. The USB input/output
lines are following USB 2.0 specifications. Definition of the USB interface:
Table 3-10 USB Interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

USB_D+

I/O

USB data + defined in the
USB 2.0 specification.

USB_D-

I/O

USB data - defined in the
USB 2.0 specification.

Figure 3-20 Recommended circuit of USB interface

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Figure 3-21 shows the timing sequence between 3.3V and USB D+.
Figure 3-21 ME906 USB D+ and 3.3V power on timing sequence

3.3V

Power_On_Off

Tpd

USB D+

Parameter

Remarks

Time (Nominal value)

Unit

Tpd

Power valid to USB D+ high

The layout design of this circuit on the host board should comply with the USB 2.0 high speed
protocol, with differential characteristic impedance of 90 Ω.

3.6 USIM Card Interface
3.6.1 Overview
The ME906 module provides a USIM card interface complying with the ISO 7816-3
standard and supports both 1.8 V and 3.0 V USIM cards.
Table 3-11 USIM card interface signals
Pin
No.

Pin Name

USIM_RESET

Issue 08 (2017-12-11)

Pad
Type

Description

Parameter

Min. (V)

Typ.
(V)

Max. (V)

Comments

VOH

0.7 x
USIM_PWR

3.3

0.2 x
USIM_PWR

USIM_PW
R=1.8 V or
2.85 V

VOL

USIM reset

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Pin
No.

Pin Name

Pad
Type

USIM_CLK

USIM_DATA

USIM_PWR

I/O

Description

Description of the Application Interfaces

Parameter

Min. (V)

Typ.
(V)

Max. (V)

Comments

VOH

0.7 x
USIM_PWR

3.3

VOL

0.2 x
USIM_PWR

USIM_P
WR=1.8 V
or 2.85 V

VOH

0.7 x
USIM_PWR

3.3

VOL

0.2 x
USIM_PWR

VIH

0.7 x
USIM_PWR

3.3

VIL

0.2 x
USIM_PWR

1.75

1.8

1.98

2.75

2.85

3.3

USIM clock

USIM data

USIM_PW
R=1.8 V or
2.85 V

USIM_PW
R=1.8 V

USIM power
USIM_PW
R=2.85 V

3.6.2 Circuit Recommended for the USIM Card Interface
As the ME906 module is not equipped with an USIM socket, you need to place an
USIM socket on the user interface board.
Figure 3-22 shows the circuit of the USIM card interface.

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Figure 3-22 Circuit of the USIM card interface



The ESD protection component should choose low capacitance. The capacitance
of the component should be lower than 10 pF.



To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
M.2 interface (it is recommended that the PCB circuit connects the M.2 interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead
to wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the ME906 module.



A 100 nF capacitor (0402 package is recommended so that greater capacitance
such as 1 uF can be employed if necessary) and a 33 pF capacitor are placed
between the USIM_PWR and Ground pins in parallel. Three 33 pF capacitors are
placed between the USIM_DATA and Ground pins, the USIM_RESET and Ground
pins, and the USIM_CLK and Ground pins in parallel to filter interference from RF
signals.



It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. Transient voltage suppressor diode should be placed as
close as possible to the USIM socket, and the Ground pin of the ESD protection
component is well connected to the power Ground pin that supplies power to the
ME906 module.

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3.7 Tunable Antenna Control
The module provides 4 tunable antenna control pins.
Table 3-12 List of ANTCTL pins
Pin
No.

Pin Name

Pad Type

Description
Tunable antenna control
signal, bit 0.
It is a push-pull type GPIO.

ANTCTL0

Tunable antenna control
signal, bit 1.
It is a push-pull type GPIO.
61

ANTCTL1

Tunable antenna control
signal, bit 2.
It is a push-pull type GPIO.
63

ANTCTL2

Tunable antenna control
signal, bit 3.
65

ANTCTL3

It is a push-pull type GPIO.

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

VOH

1.35

1.8

2.1

VOL

0.45

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

2.1

VOL

0.45

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VIL

–0.3

0.63

The mapping of each band to ANTCTL outputs is configurable, and the default output
is 0 V.

3.8 Config Pins
The module provides 4 config pins. ME906 is configured as WWAN-SSIC 0.

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Table 3-13 List of CONFIG pins
Pin
No.

Pad
Type

Pin Name

CONFIG_3

CONFIG_0

Description
Connected to Ground
internally.
ME906 is configured as
WWAN-SSIC 0.

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Not connected internally.

CONFIG_1

CONFIG_2

ME906 is configured as
WWAN-SSIC 0.
Connected to ground
internally.
ME906 is configured as
WWAN-SSIC 0.
Connected to ground
internally.
ME906 is configured as
WWAN-SSIC 0.

In the M.2 spec, the 4 pins are defined as shown in Table 3-14 .
Table 3-14 List of Config pins
Config_0
(Pin 21)

Config_1
(Pin 69)

Config_2
(Pin 75)

Config_3
(Pin 1)

Module type and
Main host interface

Port
Configuration

Ground

WWAN-SSIC

The GPIO0-7 pins have configurable assignments. There are 4 possible functional
pin out configurations. These 4 configurations are called Port Config0-3. In each Port
Configuration each GPIO is defined as a specific functional pin. The GPIO pin
assignment can be seen in Table 3-15 . ME906 supports Config 0. But the audio
function is not implemented in ME906.
Table 3-15 GPIO pin function assignment per port configuration (not supported by
default)
GPIO Pin

Port Config 0 (GNSS+Audio ver1)

GPIO_0 (Pin40)

GNSS_SCL

GPIO_1 (Pin 42)

GNSS_SDA

GPIO_2 (Pin 44)

GNSS_IRQ

GPIO_3 (Pin 46)

SYSCLK

GPIO_4 (Pin 48)

TX_Blanking

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GPIO Pin

Port Config 0 (GNSS+Audio ver1)

GPIO_5 (Pin 20)

Audio_0 (not supported)

GPIO_6 (Pin 22)

Audio_1 (not supported)

GPIO_7 (Pin 24)

Audio_2 (not supported)

3.9 Reserved Pins
The module provides some reserved pins. All of reserved pins cannot be used by the
customer. All of them should be Not Connected (NC). If customer wants to have
other special functions, please contact us.
Table 3-16 List of reserved pins
PinNo.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

20, 22,
24

Reserved

Reserved for future
use, please keep it NC
in host side.

3.10 NC Pins
The module has some NC pins. All of NC pins are not connected in the module.
Table 3-17 List of NC pins
PinNo.
28, 29, 31, 35, 37,
38, 41, 43, 47, 49,
50,52, 53, 54, 55,
56, 58, 68

Pin
Name

Pad Type

Description

Not connected

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

3.11 RF Antenna Interface
3.11.1 RF Connector location
ME906 module provides 2 antenna connectors for connecting the external antennas.

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Figure 3-23 RF antenna connectors

3.11.2 Coaxial RF Connector Guidelines


The antenna interface must be used with coaxial cables with characteristic
impedance of 50 Ω.



The ME906 module supports the buckled RF connector antenna connection
methods: buckled RF connector MM4829-2702RA4 by MURATA or other
equivalent connectors.

Figure 3-24 shows the RF connector dimensions.

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Figure 3-24 RF connector dimensions

Table 3-18 The major specifications of the RF connector
Rated Condition

Environmental Condition

Frequency range

DC to 6 GHz

Temperature range:

Characteristic impedance

50 Ω

–40°C to +85°C

There are two kinds of coaxial cables (0.81 mm and 1.13 mm) mating the RF
connector in the ME906.
1.13 mm cable is recommended.
Figure 3-25 shows the specifications of 0.81 mm coaxial cable mating the
recommended RF connector.

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Figure 3-25 Specifications of 0.81 mm coaxial cable mating with the RF connector

Figure 3-26 shows the connection between the RF connector and the 0.81 mm cable.
Figure 3-26 Connection between the RF connector and the 0.81 mm cable

Figure 3-27 shows the specifications of 1.13 mm coaxial cable mating the
recommended RF connector.

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Figure 3-27 Specifications of 1.13 mm coaxial cable mating with the RF connector

Figure 3-28 shows the connection between the RF connector and the 1.13 mm cable.
Figure 3-28 Connection between the RF connector and the 1.13 mm cable

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4.1 About This Chapter
This chapter describes the RF specifications of the ME906 module, including:


Operating Frequencies



Conducted RF Measurement



Conducted Rx Sensitivity and Tx Power



Antenna Design Requirements

4.2 Operating Frequencies
Table 4-1 to Table 4-3 show the RF bands supported by ME906.
Table 4-1 RF bands of ME906V
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

UMTS Band 4

1710 MHz–1755 MHz

2110 MHz–2155 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM850

824 MHz–849 MHz

869 MHz–894 MHz

GSM900

880 MHz–915 MHz

925 MHz–960 MHz

GSM1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

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Operating Band

LTE Band 4

1710 MHz–1755 MHz

2110 MHz–2155 MHz

LTE Band 5

824 MHz–849 MHz

869 MHz–894 MHz

LTE Band 8

880 MHz–915 MHz

925 MHz–960 MHz

LTE Band 13

777 MHz–787 MHz

746 MHz–756 MHz

LTE Band 17

704 MHz–716 MHz

734 MHz–746 MHz

CDMA BC0

824 MHz–849 MHz

869 MHz–894 MHz

CDMA BC1

1850 MHz–1910 MHz

1930 MHz–1990 MHz

GPS L1

1574.42 MHz–1576.42 MHz

GLONASS L1

1597.55 MHz–1605.89 MHz

Table 4-2 RF bands of ME906E
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM850

824 MHz–849 MHz

869 MHz–894 MHz

GSM900

880 MHz–915 MHz

925 MHz–960 MHz

GSM1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 3

1710 MHz–1785 MHz

1805 MHz–1880 MHz

LTE Band 5

824 MHz–849 MHz

869 MHz–894 MHz

LTE Band 8

880 MHz–915 MHz

925 MHz–960 MHz

LTE Band 7

2500 MHz–2570 MHz

2620 MHz–2690 MHz

LTE Band 20

832 MHz–862 MHz

791 MHz–821 MHz

GPS L1

1574.42 MHz–1576.42 MHz

GLONASS L1

1597.55 MHz–1605.89 MHz

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Table 4-3 RF bands of ME906J
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 6

830 MHz–840 MHz

875 MHz–885 MHz

UMTS Band 19

830 MHz–845 MHz

875 MHz–890 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 11

1427.9 MHz–1447.9 MHz

1475.9 MHz–1495.9 MHz

LTE Band 18

815 MHz–830 MHz

860 MHz–875 MHz

LTE Band 19

830 MHz–845 MHz

875 MHz–890 MHz

LTE Band 21

1447.9 MHz–1462.9 MHz

1495.9 MHz–1510.9 MHz

CDMA BC0

824 MHz–849 MHz

869 MHz–894 MHz

CDMA BC6

1920 MHz–1980 MHz

2110 MHz–2170 MHz

GPS L1

1574.42 MHz–1576.42 MHz

GLONASS L1

1597.55 MHz–1605.89 MHz

4.3 Conducted RF Measurement
4.3.1 Test Environment
Test instrument

R&S CMU200, R&S CMW500, Agilent 8960, Anritsu
MT8820C

Power supply

Keithley 2303, Agilent 66319

RF cable for testing

Rosenberger Precision Microwave Cable

Murata coaxial
cable

MXHP32HP1000



The compensation for different frequency bands relates to the cable and the test
environment.



The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards
Huawei modules meet 3GPP and 3GPP2 test standards. Each module passes strict
tests at the factory and thus the quality of the modules is guaranteed.

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4.4 Conducted Rx Sensitivity and Tx Power
4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver
performance of ME906.
Table 4-4 ME906V conducted Rx sensitivity
Item

Typical Value (dBm)

Note

GMSK

–109

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

GMSK

–109

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

GMSK

–108.5

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

GMSK

–108.5

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

UMTS Band 1

–110

BER < 0.1%

UMTS Band 2

–109.5

BER < 0.1%

UMTS Band 4

–110

BER < 0.1%

UMTS Band 8

–110

BER < 0.1%

UMTS Band 5

–110

BER < 0.1%

LTE Band 1

–101

FDD QPSK throughput > 95%

LTE Band 2

–99

FDD QPSK throughput > 95%

LTE Band 4

–101

FDD QPSK throughput > 95%

LTE Band 5

–101

FDD QPSK throughput > 95%

LTE Band 8

–101

FDD QPSK throughput > 95%

LTE Band 13

–101

FDD QPSK throughput > 95%

LTE Band 17

–101

FDD QPSK throughput > 95%

CDMA BC0

–108

FER < 0.5%

CDMA BC1

–107

FER < 0.5%

GSM850

GSM900

GSM1800

GSM1900

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Table 4-5 ME906E conducted Rx sensitivity
Item

Typical Value (dBm)

Note

GMSK

–109

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

GMSK

–109

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

GMSK

–108.5

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

GMSK

–108.5

BER < 2.43%

8PSK

–102

MCS5, BLER < 10%

UMTS Band 1

–110

BER < 0.1%

UMTS Band 2

–109.5

BER < 0.1%

UMTS Band 5

–110

BER < 0.1%

UMTS Band 8

–110

BER < 0.1%

LTE Band 1

–101

FDD QPSK throughput > 95%

LTE Band 2

–99

FDD QPSK throughput > 95%

LTE Band 3

–100

FDD QPSK throughput > 95%

LTE Band 5

–101

FDD QPSK throughput > 95%

LTE Band 7

–99

FDD QPSK throughput > 95%

LTE Band 8

–101

FDD QPSK throughput > 95%

LTE Band 20

–101

FDD QPSK throughput > 95%

GSM850

GSM900

GSM1800

GSM1900

Table 4-6 ME906J conducted Rx sensitivity
Item

Typical Value (dBm)

Note

UMTS Band 1

–110

BER < 0.1%

UMTS Band 5

–110

BER < 0.1%

UMTS Band 6

–110

BER < 0.1%

UMTS Band 19

–110

BER < 0.1%

LTE Band 1

–101

FDD QPSK throughput > 95%

LTE Band 11

–101

FDD QPSK throughput > 95%

LTE Band 18

–101

FDD QPSK throughput > 95%

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Item

Typical Value (dBm)

Note

LTE Band 19

–101

FDD QPSK throughput > 95%

LTE Band 21

–101

FDD QPSK throughput > 95%

CDMA BC0

–108

FER< 0.5%

CDMA BC6

–107

FER< 0.5%

Table 4-7 ME906 GPS specifications
TTFF

Sensitivity

Cold start

42s

Warm start

42s

Hot Start

Cold start

–143 dBm

Tracking

–157 dBm



The test values are the average of some test samples.



LTE sensitivity is tested in SIMO (Main + AUX).



The input satellites signal strength for GPS TTFF is –130 dBm.



The circular error probability for GPS value is 50%.

4.4.2 Conducted Transmit Power
The conducted transmit power is another indicator that measures the performance of
ME906. Table 4-8 to Table 4-10 list the required ranges of the conducted transmit
power.
Table 4-8 ME906V conducted Tx power
Item
GSM850

GSM900

GSM1800

GSM1900

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Typical Value (dBm)

Note (dB)

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

±1

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Item

Typical Value (dBm)

Note (dB)

UMTS Band 1

23.5

±1

UMTS Band 2

23.5

±1

UMTS Band 4

23.5

±1

UMTS Band 5

23.5

±1

UMTS Band8

23.5

±1

LTE Band 1

±1

LTE Band 2

±1

LTE Band 4

±1

LTE Band 5

±1

LTE Band 8

±1

LTE Band 13

±1

LTE Band 17

±1

CDMA BC0

±1

CDMA BC1

±1

Table 4-9 ME906E conducted Tx power
Item

Typical Value (dBm)

Note (dB)

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

±1

UMTS Band 1

23.5

±1

UMTS Band 2

23.5

±1

UMTS Band 5

23.5

±1

UMTS Band 8

23.5

±1

LTE Band 1

±1

GSM850

GSM900

GSM1800

GSM1900

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Item

Typical Value (dBm)

Note (dB)

LTE Band 2

±1

LTE Band 3

±1

LTE Band 5

±1

LTE Band 8

±1

LTE Band 7

±1

LTE Band 20

±1

Table 4-10 ME906J conducted Tx power
Item

Typical Value (dBm)

Note (dB)

UMTS Band 1

23.5

±1

UMTS Band 5

23.5

±1

UMTS Band 6

23.5

±1

UMTS Band 19

23.5

±1

LTE Band 1

±1

LTE Band 11

±1

LTE Band 18

±1

LTE Band 19

±1

LTE Band 21

±1

CDMA BC0

±1

CDMA BC6

±1

Maximum Power Reduction (MPR) of LTE is according to 3GPP TS 36.521-1.

4.5 Antenna Design Requirements
4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of
an antenna. The radiated power of an antenna is always lower than the input power
due to the following antenna losses: return loss, material loss, and coupling loss. The

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efficiency of an antenna relates to its electrical dimensions. To be specific, the
antenna efficiency increases with the electrical dimensions. In addition, the
transmission cable from the antenna port of ME906 to the antenna is also part of the
antenna. The cable loss increases with the cable length and the frequency. It is
recommended that the cable loss is as low as possible, for example,
MXHP32HP1000
made by Murata or equivalent.
The following antenna efficiency (free space) is recommended for ME906 to ensure
high radio performance of the module:


Efficiency of the primary antenna: ≥ 40% (working frequency below 960 MHz); ≥
50% (working frequency over 1420 MHz)



Efficiency of the diversity antenna: ≥ half of the efficiency of the primary antenna
in receiving band; (≥ 50% @ 1574.42 MHz–1605.89 MHz)

In addition, the efficiency should be tested with the transmission cable.

S11(VSWR) and S21
S11 indicates the degree to which the input impedance of an antenna matches the
reference impedance (50 Ω). S11 shows the resonance feature and impedance
bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression
of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector
analyzer.
The following S11 values are recommended for the antenna of ME906:


S11 of the primary antenna ≤ –6 dB



S11 of the diversity antenna ≤ –6 dB (≤ –10 dB @ 1574.42 MHz–1605.89 MHz)

In addition, S11 is less important than the efficiency, and S11 has not strong
correlation to wireless performance.
S21 indicates the isolation between two antennas.

Isolation
For a wireless device with multiple antennas, the power of different antennas is
coupled with each other. Antenna isolation is used to measure the power coupling.
The power radiated by an antenna might be received by an adjacent antenna, which
decreases the antenna radiation efficiency and affects the running of other devices.
To avoid this problem, evaluate the antenna isolation as sufficiently as possible at the
early stage of antenna design.
Antenna isolation depends on the following factors:


Distance between antennas



Antenna type



Antenna direction

The primary antenna must be placed as near as possible to the ME906 to minimize
the cable length. The diversity antenna needs to be installed perpendicularly to the
primary antenna. The diversity antenna can be placed farther away from the ME906.
Antenna isolation can be measured with a two-port vector network analyzer.
The following S21 values are recommended for the antenna on laptops:

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

Isolation between the primary and diversity antennas ≤ –12 dB (≤ –15 dB @
1574.42 MHz–1605.89 MHz)



Isolation between the primary (diversity) antenna and the Wi-Fi antenna ≤ –15
dB

Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates
with time in the direction of maximum radiation.
The linear polarization is recommended for the antenna of ME906.

Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in
the remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns are recommended for the antenna of ME906.


Primary antenna: omnidirectional.



Diversity antenna: omnidirectional (Upper Hem Partial Radiated Power ≥ 40% @
1574.42 MHz–1605.89 MHz)

In addition, the diversity antenna’s pattern should be complementary with the primary
antenna’s pattern.

Gain and Directivity
The radiation pattern of an antenna represents the field strength of the radiated
electromagnetic waves in all directions, but not the power density that the antenna
radiates in the specific direction. The directivity of an antenna, however, measures
the power density that the antenna radiates.
Gain, as another important parameter of antennas, correlates closely to the
directivity. The gain of an antenna takes both the directivity and the efficiency of the
antenna into account. The appropriate antenna gain prolongs the service life of
relevant batteries.
The following antenna gain is recommended for ME906.


Gain of the primary antenna ≤ 2.5 dBi



Gain of the diversity antenna ≤ 2.5 dBi

ECC of the antenna
ECC is short for Envelope Correlation Coefficient. It is the cross-correlation value of
the complex patterns of the master and diversity antenna. It indicates how similar the
magnitude and the phase patterns of the two antennas are. If two antennas have no
similarity, the ECC should be zero. Actually, the less ECC, the better diversity

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RF Specifications

performance.
The following ECC is recommended for ME906.


ECC ≤ 0.5 (working frequency below 0.96 GHz);



ECC ≤ 0.3 (working frequency above 1.4 GHz)


The antenna consists of the antenna body and the relevant RF transmission cable. Take
the RF transmission cable into account when measuring any of the preceding antenna
indicators.



Huawei cooperates with various famous antenna suppliers who are able to make
suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the
radio performance (especially the TIS) of the module. To guarantee high performance
of the module, the interference sources on the user board must be properly
controlled.
On the user board, there are various interference sources, such as the LCD, CPU,
audio circuits, and power supply. All the interference sources emit interference
signals that affect the normal operation of the module. For example, the module
sensitivity can be decreased due to interference signals. Therefore, during the
design, you need to consider how to reduce the effects of interference sources on the
module. You can take the following measures: Use an LCD with optimized
performance; shield the LCD interference signals; shield the signal cable of the
board; or design filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of
the module.

4.5.3 Antenna Requirements
The antenna for ME906 must fulfill the following requirements:
Table 4-11 Antenna Requirements of ME906V
Antenna Requirements
Frequency range

Issue 08 (2017-12-11)

Depending on frequency band(s) provided by the
network operator, the customer must use the most
suitable antenna for that/those band(s)

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Antenna Requirements
Bandwidth of primary
antenna

70 MHz in GSM850
80 MHz in GSM900
170 MHz in GSM1800
140 MHz in GSM1900
41 MHz in LTE Band 13
42 MHz in LTE Band 17
70 MHZ in UMTS Band 5/LTE Band 5
80 MHz in UMTS Band 8/LTE Band 8
445 MHz in UMTS Band 4/LTE Band 4
140 MHz in UMTS Band 2/LTE Band 2
250 MHz in UMTS Band 1/LTE Band 1
70 MHz in CDMA BC0
140 MHz in CDMA BC1

Bandwidth of diversity
antenna

25MHz in GSM850
35MHz in GSM900
75MHz in GSM1800
60MHz in GSM1900
10MHz in LTE Band 13
12MHz in LTE Band 17
25MHz in UMTS Band 5/LTE Band 5
35MHz in UMTS Band 8/LTE Band 8
45MHz in UMTS Band 4/LTE Band 4
60MHz in UMTS Band 2/LTE Band 2
60MHz in UMTS Band 1/LTE Band 1
25MHz in CDMA BC0
60MHz in CDMA BC1
35 MHz in GNSS

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max.

≤ 3:1 (≤ 2:1 @ 1574.42 MHz–1605.89 MHz)

VSWR recommended

≤ 2:1 (≤ 1.5:1 @ 1574.42 MHz–1605.89 MHz)

Table 4-12 Antenna Requirements of ME906E
Antenna Requirements
Frequency range

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Depending on frequency band(s) provided by the
network operator, the customer must use the most
suitable antenna for that/those band(s)

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Antenna Requirements
Bandwidth of primary
antenna

70 MHz in GSM850
80 MHz in GSM900
170 MHz in GSM1800
140 MHz in GSM1900
250 MHz in UMTS Band 1/LTE Band 1
140 MHz in UMTS Band 2/LTE Band 2
70 MHz in UMTS Band 5/LTE Band 5
80 MHz in UMTS Band 8/LTE Band 8
170 MHz in LTE Band 3
190 MHz in LTE Band 7
71 MHz in LTE Band 20

Bandwidth of diversity
antenna

25 MHz in GSM850
35 MHz in GSM900
75 MHz in GSM1800
60 MHz in GSM1900
60 MHz in UMTS Band 1/LTE Band 1
60 MHz in UMTS Band 2/LTE Band 2
25 MHz in UMTS Band 5/LTE Band 5
35 MHz in UMTS Band 8/LTE Band 8
75 MHz in LTE Band 3
70 MHz in LTE Band 7
30 MHz in LTE Band 20
35 MHz in GNSS

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max.

≤ 3:1 (≤ 2:1 @ 1574.42 MHz–1605.89 MHz)

VSWR recommended

≤ 2:1 (≤ 1.5:1 @ 1574.42 MHz–1605.89 MHz)

Table 4-13 Antenna Requirements of ME906J
Antenna Requirements
Frequency range

Issue 08 (2017-12-11)

Depending on frequency band(s) provided by the
network operator, the customer must use the most
suitable antenna for that/those band(s)

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Antenna Requirements
Bandwidth of primary
antenna

250 MHz in UMTS Band 1
70 MHZ in UMTS Band 5
55 MHz in UMTS Band 6
60 MHz in UMTS Band 19
70 MHz in CDMA BC0
250 MHz in CDMA BC6
250 MHz in LTE Band 1
68 MHz in LTE Band 11
60 MHz in LTE Band 18
60 MHz in LTE Band 19
63 MHz in LTE Band 21

Bandwidth of diversity
antenna

60 MHz in UMTS Band 1
25 MHz in UMTS Band 5
10 MHz in UMTS Band 6
15MHz in UMTS Band 19
25 MHz in CDMA BC0
60 MHz in CDMA BC6
60 MHz in LTE Band 1
20 MHz in LTE Band 11
15 MHz in LTE Band 18
15 MHz in LTE Band 19
15 MHz in LTE Band 21
35 MHz in GNSS

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max.

≤ 3:1 (≤ 2:1 @ 1574.42 MHz–1605.89 MHz)

VSWR recommended

≤ 2:1 (≤ 1.5:1 @ 1574.42 MHz–1605.89 MHz)

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HUAWEI ME906 Series LTE M.2 Module
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Electrical and Reliability Features

5.1 About This Chapter
This chapter describes the electrical and reliability features of the interfaces in the
ME906 module, including:


Absolute Ratings



Operating and Storage Temperatures and Humidity



Power Supply Features



Reliability Features



EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the ME906 module. Using the ME906 module
beyond these conditions may result in permanent damage to the module.
Table 5-1 Absolute ratings for the ME906 module
Symbol

Specification

Min.

Max.

Unit

3.3V

External power voltage

–0.5

5.0

5.3 Operating and Storage Temperatures and Humidity
Table 5-2 lists the operating and storage temperatures and humidity for the ME906
module.

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Electrical and Reliability Features

Table 5-2 Operating and storage temperatures and humidity for the ME906 module
Specification

Min.

Max.

Unit

Normal operating temperatures

–10

+55

°C

Extended temperatures[1]

–20

+70

°C

Ambient temperature for storage

–40

+85

°C

[1]: When the ME906 module works at –20°C to –10°C or +55°C to +70°C, NOT all its RF
performances comply with the 3GPP and 3GPP2 (CDMA) RF specifications.

5.4 Power Supply Features
5.4.1 Input Power Supply
Table 5-3 lists the requirements for input power of the ME906 module.
Table 5-3 Requirements for input power for the ME906 module
Parameter

Min.

Typ.

Max.

Ripple

Unit

3.3 V

3.135

3.3

4.4

0.05

Figure 5-1 Power supply during burst emission

The minimum value of the power supply must be guaranteed during the burst (with 2.5 A peak
in GSM, GPRS or EGPRS mode).

Table 5-4 Requirements for input current of the ME906 module
Power

3.3 V

Issue 08 (2017-12-11)

Peak (Max.)

Normal (Max.)

Max. Avg@100uS

Max. Avg@1S

2500 mA

1100 mA

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5.4.2 Power Consumption
The power consumption of ME906 in different scenarios are respectively listed in
Table 5-5 to Table 5-12 .
The power consumption listed in this section are tested when the power supply of
ME906 module is normal voltage (3.3 V), and all of test values are measured at room
temperature.
Table 5-5 Averaged power off DC power consumption of ME906
Description

Test Value (uA)

Notes/Configuration

Typical
Power off

Normal voltage (3.3 V) is ON and
Power_On_Off pin is pulled low.

150

Table 5-6 Averaged standby DC power consumption of ME906 (WCDMA/HSDPA/LTE/CDMA/EVDO/GSM)
Description

Sleep

LTE

Bands

LTE
bands

Test Value
(mA)[1]

Test Value
(mA)[2]

Typical

4.8

1.8

Notes/Configuration

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network.
USB is in suspend.

HSPA+/WCDMA

UMTS
bands

4.8

1.8

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network.
USB is in suspend.

CDMA/EVDO

CDMA
bands

5.5

2.5

Module is powered up.
SCI=2 (5.12s)
Module is registered on the
network.
USB is in suspend.

GPRS/EDGE

GSM
bands

5.0

2.2

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network.
USB is in suspend.

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Radio Off

Bands

All bands

Electrical and Reliability Features

Test Value
(mA)[1]

Test Value
(mA)[2]

Typical

4.0

1.0

Notes/Configuration

Module is powered up.
RF is disabled.
USB is in suspend.

Idle

LTE

LTE
bands

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

HSPA+/WCDMA

UMTS
bands

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

CDMA/EVDO

CDMA
bands

Module is powered up.
SCI=2 (5.12s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

GPRS/EDGE

GSM
bands

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

Radio Off

All bands

Module is powered up.
RF is disabled.
USB is in active.

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Electrical and Reliability Features



[1] The test values in this list are the averaged standby DC power consumption of ME906
(WCDMA/HSDPA/LTE/CDMA/EVDO/GSM) when the software version is 11.xxx.xx.xx.xx.



[2] The test values in this list are the averaged standby DC power consumption of ME906
(WCDMA/HSDPA/LTE/CDMA/EVDO/GSM) when the software version is 12.xxx.xx.xx.xx.

Table 5-7 Averaged Data Transmission DC power consumption of ME906V
(WCDMA/HSDPA/LTE/CDMA/EVDO)
Description

Band

Test Value (mA)

Notes/Configuration

Typical
WCDMA

HSDPA

Band 1

180

1 dBm Tx Power

(IMT2100)

220

10 dBm Tx Power

640

23.5 dBm Tx Power

Band 2

190

1 dBm Tx Power

(PCS 1900)

220

10 dBm Tx Power

650

23.5 dBm Tx Power

Band 4

190

1 dBm Tx Power

(AWS)

270

10 dBm Tx Power

510

23.5 dBm Tx Power

Band 5

180

1 dBm Tx Power

(850 MHz)

210

10 dBm Tx Power

500

23.5 dBm Tx Power

Band V8

170

1 dBm Tx Power

(900 MHz)

220

10 dBm Tx Power

510

23.5 dBm Tx Power

Band 1

190

1 dBm Tx Power

(IMT2100)

240

10 dBm Tx Power

680

23.5 dBm Tx Power

Band 2

200

1 dBm Tx Power

(PCS 1900)

250

10 dBm Tx Power

720

23.5 dBm Tx Power

Band 4

210

1 dBm Tx Power

(AWS)

290

10 dBm Tx Power

680

23.5 dBm Tx Power

190

1 dBm Tx Power

Band 5

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Hardware Guide

Description

Band

Electrical and Reliability Features

Test Value (mA)

Notes/Configuration

Typical
(850 MHz)

LTE

220

10 dBm Tx Power

620

23.5 dBm Tx Power

Band 8

180

1 dBm Tx Power

(900 MHz)

230

10 dBm Tx Power

600

23.5 dBm Tx Power

330

1 dBm Tx Power

370

10 dBm Tx Power

760

23 dBm Tx Power

310

1 dBm Tx Power

370

10 dBm Tx Power

770

23 dBm Tx Power

340

1 dBm Tx Power

400

10 dBm Tx Power

750

23 dBm Tx Power

330

1 dBm Tx Power

350

10 dBm Tx Power

630

23 dBm Tx Power

330

1 dBm Tx Power

380

10 dBm Tx Power

630

23 dBm Tx Power

340

1 dBm Tx Power

390

10 dBm Tx Power

720

23 dBm Tx Power

340

1 dBm Tx Power

380

10 dBm Tx Power

720

23 dBm Tx Power

170

1 dBm Tx Power

210

10 dBm Tx Power

610

24 dBm Tx Power

190

1 dBm Tx Power

Band 1

Band 2

Band 4

Band 5

Band 8

Band 13

Band 17

CDMA

BC0

BC1

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HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Description

Band

Electrical and Reliability Features

Test Value (mA)

Notes/Configuration

Typical

EVDO

BC0

BC1

220

10 dBm Tx Power

710

24 dBm Tx Power

190

1 dBm Tx Power

220

10 dBm Tx Power

610

24 dBm Tx Power

200

1 dBm Tx Power

240

10 dBm Tx Power

720

24 dBm Tx Power

Table 5-8 Averaged DC power consumption of ME906V (GPRS/EDGE)
Description

Test Value (mA)

PCL

Notes/Configuration

1 Up/1 Down

Typical
GPRS850

320
550

2 Up/1 Down

870

4 Up/1 Down

130

GPRS900

2 Up/1 Down

250

4 Up/1 Down

350

1 Up/1 Down

580

2 Up/1 Down

770

4 Up/1 Down
10

1 Up/1 Down

180

2 Up/1 Down

250

4 Up/1 Down

200

1 Up/1 Down

310

2 Up/1 Down

490

4 Up/1 Down

120
170

Issue 08 (2017-12-11)

1 Up/1 Down

180

130

GPRS1800

1 Up/1 Down
2 Up/1 Down

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Description

Test Value (mA)

Electrical and Reliability Features

PCL

Notes/Configuration

Typical
210
GPRS1900

200

520

4 Up/1 Down

210

4 Up/1 Down

210

1 Up/1 Down

350

2 Up/1 Down

560

4 Up/1 Down
15

1 Up/1 Down

180

2 Up/1 Down

230

4 Up/1 Down

220

1 Up/1 Down

370

2 Up/1 Down

630

4 Up/1 Down
15

1 Up/1 Down

180

2 Up/1 Down

250

4 Up/1 Down

170

1 Up/1 Down

260

2 Up/1 Down

420

4 Up/1 Down
10

1 Up/1 Down

160

2 Up/1 Down

230

4 Up/1 Down

170

1 Up/1 Down

250

2 Up/1 Down

390

4 Up/1 Down

120
160

Issue 08 (2017-12-11)

1 Up/1 Down
2 Up/1 Down

130

EDGE1900

160

150

EDGE1800

1 Up/1 Down
2 Up/1 Down

150

EDGE900

310

120

EDGE850

4 Up/1 Down

1 Up/1 Down
2 Up/1 Down

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Description

Test Value (mA)

Electrical and Reliability Features

PCL

Notes/Configuration

Typical
220

4 Up/1 Down

Table 5-9 Averaged Data Transmission DC power consumption of ME906E
(WCDMA/HSDPA/LTE)
Description

Band

Test Value (mA)

Notes/Configuration

Typical
WCDMA

HSDPA

Issue 08 (2017-12-11)

Band 1

160

1 dBm Tx Power

(IMT2100)

200

10 dBm Tx Power

670

23.5 dBm Tx Power

Band 2

160

1 dBm Tx Power

(PCS
1900)

200

10 dBm Tx Power

690

23.5 dBm Tx Power

Band 5

160

1 dBm Tx Power

(850
MHz)

200

10 dBm Tx Power

530

23.5 dBm Tx Power

Band 8

180

1 dBm Tx Power

(900
MHz)

270

10 dBm Tx Power

600

23.5 dBm Tx Power

Band 1

240

1 dBm Tx Power

(IMT2100)

290

10 dBm Tx Power

680

23.5 dBm Tx Power

Band 2

240

1 dBm Tx Power

(PCS
1900)

290

10 dBm Tx Power

700

23.5 dBm Tx Power

Band 5

230

1 dBm Tx Power

(850
MHz)

270

10 dBm Tx Power

550

23.5 dBm Tx Power

Band 8

250

1 dBm Tx Power

(900

340

10 dBm Tx Power

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Description

Band

Test Value (mA)

Electrical and Reliability Features

Notes/Configuration

Typical

LTE

MHz)

620

23.5 dBm Tx Power

Band 1

310

1 dBm Tx Power

350

10 dBm Tx Power

800

23dBm Tx Power

300

1 dBm Tx Power

350

10 dBm Tx Power

740

23 dBm Tx Power

300

1 dBm Tx Power

350

10 dBm Tx Power

770

23 dBm Tx Power

290

1 dBm Tx Power

330

10 dBm Tx Power

620

23 dBm Tx Power

300

1 dBm Tx Power

340

10 dBm Tx Power

690

23 dBm Tx Power

350

1 dBm Tx Power

470

10 dBm Tx Power

870

23 dBm Tx Power

300

1 dBm Tx Power

390

10 dBm Tx Power

720

23 dBm Tx Power

Band 2

Band 3

Band 5

Band 8

Band 7

Band 20

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HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Electrical and Reliability Features

Table 5-10 Averaged DC power consumption of ME906E (GSM/GPRS/EDGE)
Description

Test Value (mA)

PCL

Notes/Configuration

1 Up/1 Down

Typical
GPRS850

300
420

2 Up/1 Down

600

4 Up/1 Down

120

GPRS900

2 Up/1 Down

240

4 Up/1 Down

300

600

4 Up/1 Down
10

1 Up/1 Down

170

2 Up/1 Down

240

4 Up/1 Down

220

1 Up/1 Down

250

2 Up/1 Down

330

4 Up/1 Down
10

1 Up/1 Down

150

2 Up/1 Down

200

4 Up/1 Down

210

1 Up/1 Down

270

2 Up/1 Down

360

4 Up/1 Down
10

1 Up/1 Down

160

2 Up/1 Down

210

4 Up/1 Down

200

1 Up/1 Down

300

2 Up/1 Down

360

4 Up/1 Down

120
170

Issue 08 (2017-12-11)

1 Up/1 Down
2 Up/1 Down

120

EDGE850

430

120

GPRS1900

1 Up/1 Down

160

130

GPRS1800

1 Up/1 Down
2 Up/1 Down

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Description

Test Value (mA)

Electrical and Reliability Features

PCL

Notes/Configuration

Typical
240
EDGE900

4 Up/1 Down

200

290

2 Up/1 Down

360

4 Up/1 Down

120

EDGE1800

1 Up/1 Down

170

2 Up/1 Down

240

4 Up/1 Down

160

1 Up/1 Down

220

2 Up/1 Down

270

4 Up/1 Down

120

EDGE1900

1 Up/1 Down

140

2 Up/1 Down

170

4 Up/1 Down

160

1 Up/1 Down

240

2 Up/1 Down

290

4 Up/1 Down

120

1 Up/1 Down

140

2 Up/1 Down

170

4 Up/1 Down

Table 5-11 Averaged Data Transmission DC power consumption of ME906J
(WCDMA/HSDPA/LTE/CDMA/EVDO)
Description

Band

Test Value
(mA)

Notes/Configuration

Typical
WCDMA

Band 1

Band 5

Issue 08 (2017-12-11)

160

1 dBm Tx Power

200

10 dBm Tx Power

600

23.5 dBm Tx Power

160

1 dBm Tx Power

190

10 dBm Tx Power

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Description

Band

Test Value
(mA)

Electrical and Reliability Features

Notes/Configuration

Typical

Band 6

Band
19

HSDPA

Band 1

Band 5

Band 6

Band
19

LTE

Band 1

Band
11

Band
18

Issue 08 (2017-12-11)

560

23.5 dBm Tx Power

160

1 dBm Tx Power

190

10 dBm Tx Power

560

23.5 dBm Tx Power

160

1 dBm Tx Power

190

10 dBm Tx Power

560

23.5 dBm Tx Power

250

1 dBm Tx Power

340

10 dBm Tx Power

630

23.5 dBm Tx Power

240

1 dBm Tx Power

260

10 dBm Tx Power

580

23.5 dBm Tx Power

240

1 dBm Tx Power

260

10 dBm Tx Power

580

23.5 dBm Tx Power

240

1 dBm Tx Power

260

10 dBm Tx Power

580

23.5 dBm Tx Power

280

1 dBm Tx Power

350

10 dBm Tx Power

670

23 dBm Tx Power

280

1 dBm Tx Power

340

10 dBm Tx Power

680

23 dBm Tx Power

270

1 dBm Tx Power

330

10 dBm Tx Power

680

23 dBm Tx Power

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Description

Band

Test Value
(mA)

Electrical and Reliability Features

Notes/Configuration

Typical
Band
18

Band
21

CDMA

BC0

BC6

EVDO

BC0

BC6

280

1 dBm Tx Power

350

10 dBm Tx Power

630

23 dBm Tx Power

290

1 dBm Tx Power

350

10 dBm Tx Power

730

23 dBm Tx Power

170

1 dBm Tx Power

210

10 dBm Tx Power

650

24 dBm Tx Power

170

1 dBm Tx Power

220

10 dBm Tx Power

520

21 dBm Tx Power

190

1 dBm Tx Power

230

10 dBm Tx Power

650

24 dBm Tx Power

190

1 dBm Tx Power

240

10 dBm Tx Power

520

21 dBm Tx Power



All power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.



LTE test condition: 10/20 MHz bandwidth, QPSK, 1 RB when testing max. Tx power and
full RB when testing 0 dBm or 10 dBm;



Test condition: for max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in
Table 4-8 to Table 4-10 ; for max. data throughput, see 2.2 Function Overview, which are
listed in Table 2-1 Features.

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Electrical and Reliability Features

Table 5-12 Averaged GPS operation DC power consumption of ME906
Description

Test Value (mA)

Notes/Configuration

Typical
GPS fixing

100

GPS tracking

100

RF is disabled;
USB is in active;
The Rx power of GPS is –130 dBm.

5.5 Reliability Features
Table 5-13 lists the test conditions and results of the reliability of the ME906 module.
Table 5-13 Test conditions and results of the reliability of the ME906 module
Item
Stress

Test Condition
Low-temperature
storage

High-temperature
storage

Low-temperature
operating

High-temperature
operating

Damp heat
cycling

Issue 08 (2017-12-11)



Temperature: –40ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: 85ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: –20ºC



Operation mode: working
with service connected



Test duration: 24 h



Temperature: 70ºC



Operation mode: working
with service connected



Test duration: 24 h



High temperature: 55ºC



Low temperature: 25ºC



Humidity: 95%±3%



Operation mode: working
with service connected



Test duration: 6 cycles;
12 h+12 h/cycle

Standard
JESD22A119-C

Sample
size
3
pcs/group

Results
Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A103-C

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC6006
8-2-1

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-C

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A101-B

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide
Item

Test Condition
Thermal shock

Salty fog test



Low temperature: –40º



High temperature: 85ºC



Temperature change
interval: < 20s



Operation mode: no
power



Test duration: 100 cycles;
15 min+15 min/cycle



Temperature: 35°C



Density of the NaCl
solution: 5%±1%



Operation mode: no
power, no package



Test duration:

Electrical and Reliability Features
Standard

Sample
size

Results

JESD22A106-B

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A107-B

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h
Sine vibration

Shock test

Issue 08 (2017-12-11)



Frequency range: 5 Hz to
200 Hz



Acceleration: 1 Grms



Frequency scan rate: 0.5
oct/min



Operation mode: working
with service connected



Test duration: 3 axial
directions. 2 h for each
axial direction.



Half-sine wave shock



Peak acceleration: 30
Grms



Shock duration: 11 ms



Operation mode: working
with service connected



Test duration: 6 axial
directions. 3 shocks for
each axial direction.

JESD22B103-B

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESDB104-C

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide
Item
Drop test

Life

High temperature
operating life

High temperature
& high humidity

Temperature
cycle

Electrical and Reliability Features

Test Condition

Standard

Sample
size

Results



IEC6006
8-2-32

3
pcs/group

Visual inspection: ok

0.8 m in height. Drop the
module on the marble
terrace with one surface
facing downwards, six
surfaces should be
tested.



Operation mode: no
power, no package



Temperature: 70ºC



Operation mode: working
with service connected



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point



High temperature: 85ºC



Humidity: 85%



Operation mode:
powered on and no
working



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point



High temperature: 85ºC



Low temperature: –40ºC



Temperature change
slope: 6ºC/min



Operation mode: no
power



Test duration: 168 h,

Function test: ok
RF specification: ok

JESD22A108-B

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A110-B

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok
Cross section: ok

JESD22A104-C

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok
Cross section: ok

336 h, 500 h, 1000 h for
inspection point
ESD

HBM (Human
Body Model)

ESD with DVK
(or embedded in
the host)

Issue 08 (2017-12-11)



1 kV (Class 1 B)



Operation mode: no
power



Contact Voltage: ±2 kV,
±4 kV



Air Voltage : ±2 kV, ±4
kV, ±8 kV



Operation mode: working
with service connected

JESD22A114-D

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC6100
0-4-2

2 pcs

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide
Item

Test Condition

Electrical and Reliability Features
Standard

Sample
size

Results

Groups ≥ 2

5.6 EMC and ESD Features
The following are the EMC design comments:


Attention should be paid to static control in the manufacture, assembly,
packaging, handling, and storage process to reduce electrostatic damage to
HUAWEI module.



RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustments on RF match circuit.



TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.



TVS should be added on the USIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF.



Resistors in parallel and a 10 nF capacitor should be added on RESET# and
Power_On_Off signal to avoid shaking, and the distance between the capacitor
and the related pin should be less than 100 mil.



PCB routing should be V-type rather than T-type for TVS.



An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:


The electrostatic discharge protected area (EPA) must have an ESD floor whose
surface resistance and system resistance are greater than 1 x 104 Ω while less
than 1 x 109 Ω.



The EPA must have a sound ground system without loose ground wires, and the
ground resistance must be less than 4 Ω.



The workbench for handling ESD sensitive components must be equipped with
common ground points, the wrist strap jack, and ESD pad. The resistance
between the jack and common ground point must be less than 4 Ω. The surface
resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.



The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be
connected to the dedicated jack. The crocodile clip must not be connected to the
ground.



The ESD sensitive components, the processing equipment, test equipment,
tools, and devices must be connected to the ground properly. The indexes are as
follows:
−

Hard ground resistance < 4 Ω

−

1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

−

1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide
−

Electrical and Reliability Features

The electronic screwdriver and electronic soldering iron can be easily
oxidized. Their ground resistance must be less than 20 Ω.



The parts of the equipment, devices, and tools that touch the ESD sensitive
components and moving parts that are close to the ESD sensitive components
must be made of ESD materials and have sound ground connection. The parts
that are not made of ESD materials must be handled with ESD treatment, such
as painting the ESD coating or ionization treatment (check that the friction
voltage is less than 100 V).



Key parts in the production equipment (parts that touch the ESD sensitive
components or parts that are within 30 cm away from the ESD sensitive
components), including the conveyor belt, conveyor chain, guide wheel, and
SMT nozzle, must all be made of ESD materials and be connected to the ground
properly (check that the friction voltage is less than 100 V).



Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.



Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.



Boards and IC chips must not be stacked randomly or be placed with other ESD
components.



Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.
HUAWEI ME906 series module does not include any protection against overvoltage.

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Mechanical Specifications

6.1 About This Chapter
This chapter describes the following aspects of the ME906 module:


Dimensions



Label



Packing System

6.2 Dimensions
Figure 6-1 shows the dimensions of ME906 in details.
Figure 6-1 Dimensions of ME906

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HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Mechanical Specifications

6.3 Label
Figure 6-2 shows the dimensions of ME906 label.
Figure 6-2 Dimensions of label

Label area
on top

Shield area
on top

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Mechanical Specifications

Label area
on bottom

6.4 Packing System
ME906 package includes the blister tray, the blister tray cover, and the carton (with
bottom and top clapboard).
The blister tray of the ME906 module package is as shown in the following figure.
There are 75 pcs modules for every tray, 6 pcs trays in one carton, and 450 pcs
modules for every carton. And the blister tray cover covers the top tray.

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Mechanical Specifications

Figure 6-3 Package assembly

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Installation

7.1 About This Chapter
This chapter describes the assembly of ME906, including:


Connect ME906 to board



Antenna Plug

7.2 Connect ME906 to board
Figure 7-1 Install ME906

It refers to M.2 specification.
The module will need a mechanical retention at the end of the board. The module
specifies a 5.5 mm Dia. keep out zone at the end for attaching a screw.
The module Stand-off and mounting screw also serve as part of the module Electrical
Ground path. The Stand-off should be connected directly to the ground plane on the
platform. So that when the module is mounted and the mounting screw is screwed on
to hold the module in place, this will make the electrical ground connection from the
module to the platform ground plane.

The module could not be installed or removed when the host is powered on.
Otherwise, it may result in permanent damage to the module.

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Installation

7.3 Thermal Management
Because ME906 is very small, the dissipating heat is very important to it.
It has to take several means to ensure ME906 to meet the specification.
The methods described as follow:


The mounting screw is to hold the module in place, and connect the heat source
to the platform ground plane of the custom board.



About the custom board, it can afford larger and much more area of grounding
layers to enhance cooling of the PCB and ensure that the heat spreads evenly in
the PCB.



The stand-off provides a thermal ground path. The design requirements for
thermal are a material with a minimum conductivity of 50 watts per meter Kelvin
and surface area of 22 Sq mm.



The customer can add a heat sink on the model top surface, and this method
can bring out much heat source of the module.

7.4 Antenna Plug
Figure 7-2 Mating the plug

Align the mating tool or the mating end of the tool over the plug end of the cable
assembly.

Firmly place the tool over the plug until it is secured in the tool.

Place the plug cable assembly (held in the tool) over the corresponding receptacle.

Assure that the plug and receptacle are aligned press-down perpendicular to the
mounting surface until both connectors are fully mated.

Remove the mating tool by pulling it up carefully.

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Installation

Figure 7-3 Unmating the plug



The extraction tool is recommended.



Any attempt of unmating by pulling on the cable may result in damage and influence the
mechanical / electrical performance.

It is recommended not to apply any pull forces after the bending of the cable, as
described in Figure 7-4 .
Figure 7-4 Do not apply any pull forces after the bending of the cable

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Certifications

8.1 About This Chapter
This chapter gives a general description of certifications of ME906.

8.2 Certifications
Table 8-1 shows certifications the ME906 module has been implemented. For more demands,
please contact us for more details about this information.

Table 8-1 Product certifications
Certification

Model Name
ME906V

ME906E

ME906J



FCC



CCC

NCC



A-TICK



Jate&Telec



EU RoHS



JGPSSI



SGS RoHS

PVC-Free



GCF



Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Certification

Certifications

Model Name
ME906V

ME906E

ME906J

PTCRB



Halogen-free



CCF(CTIA/CDG)

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Safety Information

Read the safety information carefully to ensure the correct and safe use of your
wireless device. Applicable safety information must be observed.

9.1 Interference
Power off your wireless device if using the device is prohibited. Do not use the
wireless device when it causes danger or interference with electric devices.

9.2 Medical Device


Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities.



Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider.



Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential
interference with the pacemaker. If you are using an electronic medical device,
consult the doctor or device manufacturer to confirm whether the radio wave
affects the operation of this device.

9.3 Area with Inflammables and Explosives
To prevent explosions and fires in areas that are stored with inflammable and
explosive devices, power off your wireless device and observe the rules. Areas
stored with inflammables and explosives include but are not limited to the following:


Gas station



Fuel depot (such as the bunk below the deck of a ship)



Container/Vehicle for storing or transporting fuels or chemical products



Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder)



Area indicated with the "Explosives" sign

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Safety Information



Area indicated with the "Power off bi-direction wireless equipment" sign



Area where you are generally suggested to stop the engine of a vehicle

9.4 Traffic Security


Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.



RF signals may affect electronic systems of motor vehicles. For more
information, consult the vehicle manufacturer.



In a motor vehicle, do not place the wireless device over the air bag or in the air
bag deployment area. Otherwise, the wireless device may hurt you owing to the
strong force when the air bag inflates.

9.5 Airline Security
Observe the rules and regulations of airline companies. When boarding or
approaching a plane, power off your wireless device. Otherwise, the radio signal of
the wireless device may interfere with the plane control signals.

9.6 Safety of Children
Do not allow children to use the wireless device without guidance. Small and sharp
components of the wireless device may cause danger to children or cause
suffocation if children swallow the components.

9.7 Environment Protection
Observe the local regulations regarding the disposal of your packaging materials,
used wireless device and accessories, and promote their recycling.

9.8 WEEE Approval
The wireless device is in compliance with the essential requirements and other
relevant provisions of the Waste Electrical and Electronic Equipment Directive
2012/19/EU (WEEE Directive).

9.9 RoHS Approval
The wireless device is in compliance with the restriction of the use of certain
hazardous substances in electrical and electronic equipment Directive 2011/65/EU
(RoHS Directive).

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HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Safety Information

9.10 Laws and Regulations Observance
Observe laws and regulations when using your wireless device. Respect the privacy
and legal rights of the others.

9.11 Care and Maintenance
It is normal that your wireless device gets hot when you use or charge it. Before you
clean or maintain the wireless device, stop all applications and power off the wireless
device.


Use your wireless device and accessories with care and in clean environment.
Keep the wireless device from a fire or a lit cigarette.



Protect your wireless device and accessories from water and vapour and keep
them dry.



Do not drop, throw or bend your wireless device.



Clean your wireless device with a piece of damp and soft antistatic cloth. Do not
use any chemical agents (such as alcohol and benzene), chemical detergent, or
powder to clean it.



Do not leave your wireless device and accessories in a place with a considerably
low or high temperature.



Use only accessories of the wireless device approved by the manufacture.
Contact the authorized service center for any abnormity of the wireless device or
accessories.



Do not dismantle the wireless device or accessories. Otherwise, the wireless
device and accessories are not covered by the warranty.



The device should be installed and operated with a minimum distance of 20 cm
between the radiator and your body.

9.12 Emergency Call
This wireless device functions through receiving and transmitting radio signals.
Therefore, the connection cannot be guaranteed in all conditions. In an emergency,
you should not rely solely on the wireless device for essential communications.

9.13 Regulatory Information
The following approvals and notices apply in specific regions as noted.

9.13.1 EU Regulatory Conformance
Statement
Hereby, Huawei Technologies Co., Ltd. declares that this device is in compliance with
the essential requirements and other relevant provisions of Directive 2014/53/EU.

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Safety Information

The most recent, effective version of the DoC (Declaration of Conformity) can be
viewed at http://consumer.huawei.com/certification.
This device may be operated in all member states of the EU.
Observe national and local regulations where the device is used.
This device may be restricted for use, depending on the local network.

Frequency Bands and Power
(a) Frequency bands in which the radio equipment operates: Some bands may not be
available in all countries or all areas. Please contact the local carrier for more details.
(b) Maximum radio-frequency power transmitted in the frequency bands in which the
radio equipment operates: The maximum power for all bands is less than the highest
limit value specified in the related Harmonized Standard.
The frequency bands and transmitting power (radiated and/or conducted) nominal
limits applicable to this radio equipment are as follows: GSM 900: 37 dBm, GSM
1800: 34 dBm, WCDMA 900/2100: 25.7 dBm, LTE Band 1/3/7/8/20: 25.7 dBm.

Software Information
Software updates will be released by the manufacturer to fix bugs or enhance
functions after the product has been released. All software versions released by the
manufacturer have been verified and are still compliant with the related rules.
All RF parameters (for example, frequency range and output power) are not
accessible to the user, and cannot be changed by the user.
For the most recent information about accessories and software, please see the DoC
(Declaration of Conformity) at http://consumer.huawei.com/certification.

9.13.2 FCC Statement
Federal Communications Commission Notice (United States): Before a wireless
device model is available for sale to the public, it must be tested and certified to the
FCC that it does not exceed the limit established by the government-adopted
requirement for safe exposure.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Warning: Changes or modifications made to this equipment not expressly approved
by HUAWEI may void the FCC authorization to operate this equipment.

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HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Appendix A Circuit of Typical Interface

Appendix A Circuit of Typical
Interface

DNI: Do Not Install initially.
M.2: new name of NGFF.

1
3
5
7
9
11

USB_DP
USB_DM

21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75

1.8V (3.3V), active low
from proximity sensor

USB SCH

2.2pF

USB_DP

DNI,Reserve for
USB eye debug.

C10
DNI
USB_DM

33pF

1.8V, Active Low

ANT_TUNE_0
ANT_TUNE_1
ANT_TUNE_2
ANT_TUNE_3
RESET #
CONFIG1
CONFIG2

Cap close to pin67

33pF

C14
DNI

C13
DNI

C12
DNI

C11
DNI

Tunable antenna SCH
R14

ANT_TUNE_0

R15

ANT_TUNE_1

R16

ANT_TUNE_2

R17

ANT_TUNE_3

P2
P4
P6
P8
P10

2
4
6
8
10

R23
POWER_ON_OFF
W_DISABLE #
LED #

GPIO2

1.8V(3.3V).high:on,low:off
VBAT

1.8V(3.3V),active low
R8

D1
CONFIG0
WAKE_On_WWAN #
BODYSAR_N

CONFIG[3:0] to PC

to PC USB2.0 interface

P1
P3
P5
P7
P9
P11

P21
P23
P25
P27
P29
P31
P33
P35
P37
P39
P41
P43
P45
P47
P49
P51
P53
P55
P57
P59
P61
P63
P65
P67
P69
P71
P73
P75

P20
P22
P24
P26
P28
P30
P32
P34
P36
P38
P40
P42
P44
P46
P48
P50
P52
P54
P56
P58
P60
P62
P64
P66
P68
P70
P72
P74

76 M1

20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74

200

RF on: light on
RF off: light off

GPS_DISABLE #

1.8V(3.3V),active low

USIM_RESET
USIM_CLK
USIM_IO
USIM_PWR

M.2: 3.135V-4.4V,typical 3.3V
current: 2.5A max
One 220uF Tantalum Capacitor is needed to
make sure that the voltage does not drop
below 3.135 V in any case.
USIM_DET

VBAT

M2 77

330pF

100nF

10K
1.8V (3.3V),open drain ,active low
CONFIG3
CONFIG2
CONFIG1
CONFIG0

CONFIG3

100K
R2

100K

Module output: 0V or NC

1V8(3V3)

ME906 is configed as WWAN-SSIC0 internally

CONFIG[3:0] is for card type indication and present detection

1V8

Config pin SCH

1uF

22uF

220uF

1.8V tolerence
RC is reserved for RF debug
Power_on_off control option 1
When module on/off is controlled only by VBAT, must use this design
R24 should not be larger than 10K
When use option 1 , R23 must be DNI

USIM SCH

VBAT

0
0

33pF

C18:to avoid twitter
other devices: for GCF or PTCRB debug.

Issue 08 (2017-12-11)

G 1

GPIO2

3 D

2 S

Q3
2 S

When Vgpio2 is off
Q1 is off and Q2 is on
Power_On_Off is is pulled LOW
Module is shut off safely
Vgpio2

G 1

3 D

R19

G 1

Q2
2 S

Q1
2 S

GPIO1 is from SOC
V-gpio1 is power supply of GPIO1 domain

USIM absent: CD-->GND;
USIM present: CD Open
USIM_PWR: 1.8V or 3.0V

R21

VBAT

When Vgpio2 is ON
Q1 is on and Q2 is off
Power_On_Off is controlled by GPIO2

C15

C17

C16

C19

C18

0402

G 1

3 D

9
S3
GPIO1

POWER_ON_OFF

When VBAT is always on, must use this design
When use option 2 , R24 must be DNI
GPIO2 is from SOC

3 D

33pF

11
M2

33pF

0
0

470pF

R12
R13

1uF

USIM_CLK
USIM_IO

6
3VPP
7CLK
I/O

10K

Power_on_off control option 2

1
5VCC
2GND
RST

R20

USIM_RESET R11

RESET #

USIM_PWR

R24

V-gpio1

RESET control SCH
8
S2

4
CD

R22

10
M1
USIM_DET USIM_DET Must Be Used.

V-gpio2 is power supply of GPIO2 domain

Capacitor of D2 should be less than 10pF
GND of socket should be well connected to module GND
Note: If M1 and M2 pin is metal,you can connect it to GND

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

CCC

China Compulsory Certification

Coding Scheme

CSD

Circuit Switched Data

Direct Current

DMA

Direct Memory Access

DVK

Development Kit

EBU

External Bus Unit

EDGE

Enhanced Data for GSM Evolution

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

EPA

Electrostatic Discharge Protected Area

ESD

Electrostatic Discharge

European Union

FCC

Federal Communications Commission

FDD-TDMA

Frequency Division Duplexing-Time Division
Multiple Access

GMSK

Gaussian Minimum Shift Keying

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

GSM

Global System for Mobile communication

HBM

Human Body Model

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

HSIC

High Speed Inter-Chip Interface

HSDPA

High-Speed Downlink Packet Access

HSPA+

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

IPC

Inter Processor Communications

ISO

International Standards Organization

I2S

I2C Sound

LCP

Liquid Crystal Polyester

LDO

Low-Dropout

LED

Light-Emitting Diode

LTE

Long Term Evolution

MCP

Multi-chip Package

MIPI

Mobile Industry Processor Interface

NGFF

Next Generation Form Factor

NTC

Negative Temperature Coefficient

Power Amplifier

PBCCH

Packet Broadcast Control Channel

PCB

Printed Circuit Board

PDU

Protocol Data Unit

PMU

Power Management Unit

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous
Substances

RSE

Radiated Spurious Emission

RTC

Real-time Clock

SIMO

Single Input Multiple Output

TTL

Transistor-transistor Logic

TVS

Transient Voltage Suppressor

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

Issue 08 (2017-12-11)

HUAWEI ME906 Series LTE M.2 Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

Issue 08 (2017-12-11)

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Huawei ME906 Series LTE M.2 Module Hardware Guide (V100R001 08, English)

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