Ingenico E790GPRS Elite 790 GPRS User Manual Introduction to the Integra outstanding assets
Ingenico Elite 790 GPRS Introduction to the Integra outstanding assets
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March 2002/ version 1.6
Integra
Version : 1.7
Date : March 2002
Reference : WM_Integra_UG_016
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son autorisation préalable.
March 2002/ version 1.6
Integra
Level/
Indice
Date/ Date History of the evolution /
Historique des évolutions
Writer / Rédacteur
0.3 June 2000 Creation and Correction P. Calvez, S. Dechicha F.
Doherier, T. Lapousterle,
M. Nau, D. Martinez, B.
Zenou
1.2 Sept. 2000 Correction: figure 5 application note for serial link S. Dechicha
1.3 Sept 2000 Application note for external SIM 3V/5V interface S. Dechicha
1.4 January
2001
Minor formal modifications + addition of the mechanical
specifications
M. Nau
1.5 August
2001
SIM3/5V electric scheme added + modification flat cable
reference
S. Marion
1.6 March 2002 Modifications to include 2C-2 module version N. Subiger
1.7 March 2002 Add RF exposure and OEM instructions O. Clerc
Name / Nom Function /
Fonction
Date/ Date Signature/ Signature
Written by / Rédigé par B.Zenou Product Marketing June
2000
Validated by / Validé par D. MARTINEZ Modem Support Engineer June
2000
Approved by / Approuvé
par
P.Calvez Product Marketing Senior
Manager
June
2000
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son autorisation préalable.
March 2002/ version 1.6
Integra
Integra User’s Guide
Hardware Specifications
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March 2002/ version 1.6
Integra
Contents
1 Introduction to the Integra: outstanding assets........................................................................................................................7
1.1 Scope of the user’s guide ............................................................................................................ 7
1.2 General characteristics ................................................................................................................ 8
1.2.1 General..................................................................................................................................... 8
1.2.2 Electrical ................................................................................................................................... 8
1.2.3 Physical .................................................................................................................................... 8
1.2.4 Basic Features.......................................................................................................................... 8
1.2.5 Interfaces.................................................................................................................................. 9
1.3 Mechanical Design Overview .................................................................................................... 10
2 Safety precautions ..................................................................................................................................................................................13
2.1 RF safety.................................................................................................................................... 13
2.1.1 General................................................................................................................................... 13
2.1.2 Exposure to RF energy...........................................................................................................13
2.1.3 Efficient modem operation......................................................................................................13
2.1.4 Antenna care and replacement .............................................................................................. 13
2.2 General safety ........................................................................................................................... 14
2.2.1 Driving..................................................................................................................................... 14
2.2.2 Electronic devices................................................................................................................... 14
2.2.3 Vehicle electronic equipment .................................................................................................14
2.2.4 Medical electronic equipment................................................................................................. 14
2.2.5 Aircraft .................................................................................................................................... 14
2.2.6 Children .................................................................................................................................. 14
2.2.7 Blasting areas......................................................................................................................... 14
2.2.8 Potentially explosive atmospheres ......................................................................................... 15
2.3 Safety standards........................................................................................................................ 15
3 Standard Compliance ............................................................................................................................................................................15
3.1 GSM compliance ....................................................................................................................... 15
3.2 FTA Compliance ........................................................................................................................ 16
3.2.1 IMEI Number .......................................................................................................................... 16
3.2.2 CE Label................................................................................................................................. 17
4 Hardware Interfaces...............................................................................................................................................................................18
4.1 Interfaces on the 50-pin general purpose connector................................................................ 18
4.1.1 The 50-pin connector description ........................................................................................... 18
4.1.2 Power supply .......................................................................................................................... 22
4.1.3 Serial link ................................................................................................................................ 24
4.1.4 ON / ~OFF .............................................................................................................................. 25
4.1.5 BOOT...................................................................................................................................... 27
4.1.6 Reset signal (~RST) ............................................................................................................... 28
4.1.7 Flashing LED .......................................................................................................................... 29
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March 2002/ version 1.6
Integra
4.1.8 General Purpose Input/Output ............................................................................................... 29
4.1.9 Analog to Digital Converter ....................................................................................................29
4.1.10 Audio Interface........................................................................................................................ 31
4.1.11 SIM interface........................................................................................................................... 35
4.1.12 SPI bus ................................................................................................................................... 37
4.1.13 Keypad interface..................................................................................................................... 37
4.2 RF Interface ............................................................................................................................... 39
4.2.1 RF connector .......................................................................................................................... 39
4.2.2 RF performances.................................................................................................................... 39
4.3 SIM interface.............................................................................................................................. 39
5 Connector Supplier and Peripheral devices ............................................................................................................................40
5.1 Where to find the SMD connectors............................................................................................ 40
5.1.1 GSM Antenna ......................................................................................................................... 41
5.1.2 The SIM card holder ............................................................................................................... 42
6 Climatic and mechanical environment....................................................................................................................................... 42
7 Demonstration board............................................................................................................................................................................43
8 General guidelines for the use of the Integra.......................................................................................................................... 44
8.1 Key information.......................................................................................................................... 44
8.1.1 Hardware and RF ................................................................................................................... 44
8.1.2 The Antenna ........................................................................................................................... 44
8.1.3 Firmware upgrade .................................................................................................................. 44
8.1.4 Getting started ........................................................................................................................ 45
9 Reference documents .......................................................................................................................................................................... 46
10 Acronyms and Abbreviations.............................................................................................................................................................47
11 Index 48
12 Annexes 53
12.1 Mechanical specifications.......................................................................................................53
12.2 3V/5V SIM management ........................................................................................................ 54
12.3 AT command list..................................................................................................................... 54
13 RF exposure instructions ....................................................................................................................................................................59
14 Instructions to OEM ................................................................................................................................................................................60
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March 2002/ version 1.6
Integra
Cautions:
Information furnished herein by Wavecom are accurate and reliable. However no responsibility
is assumed for its use.
Please read carefully the safety precautions.
If you have any technical questions regarding this document or the product described in it,
please contact your distributor.
General information about Wavecom and its range of products is available at the following
internet address: http://www.wavecom.com
Trademarks
Some mentioned products are registered trademarks of their respective companies
Copyright
The Integra user’s guide is copyrighted by Wavecom SA with all rights reserved. No part of this
user’s guide may be produced in any form without the prior written permission of
Wavecom SA.
No patent liability is assumed with respect to the use of the information contained herein.
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son autorisation préalable.
March 2002/ version 1.6
Integra
1 Introduction to the Integra: outstanding assets
Integra M2100 series integrated modem provides a quick and easy way to plug in GSM and GPRS
functionality to systems and terminals. Available in dual-band configurations, this full type approved
integrated modem constitutes a self-contained, fully integrated implementation of the GSM/GPRS
standard.
Thanks to standard interfaces, it can be integrated into any system which offers unlimited assets. It is
ready for voice, SMS, data and fax. Integra is a product with a sole connector, which puts together all the
interface signals in order to facilitate its integration.
It has an integrated SIM connector as well as a standard RF connector type MMCX (Miniature Micro
Connector).
For system integrators, Integra is the fast track to the wireless world.
1.1 Scope of the user’s guide
This document describes the hardware interface and the technical specifications of the Integra M2100
series modem.
The integrated modem is referenced as Integra according to the GSM/GPRS 900 standard, the
GSM/GPRS 1800 standard and the GSM/GPRS 1900 standard. This product is based on a Dual Band
WISMOTM: every integrated modem referenced Integra-G900/1800 includes a GSM 900/1800 MHz
module and every integrated modem referenced Integra-G900/1900 includes a GSM 900/1900 MHz
module. This two dual-band modems have the same specifications unless otherwise specified. Integra
has two version, one GSM only and one GSM/GPRS. The GSM and GSM/GPRS versions have the
same specifications unless otherwise specified.
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March 2002/ version 1.6
Integra
1.2 General characteristics
1.2.1 General
• Dual Band GSM/GPRS modem E-GSM 900/1800 or E-GSM 900/1900
• Class 4 (2W at 900MHz)
• Class 1 (1W at 1800/1900 MHz)
• Small size and low power consumption
• Voice, SMS
• fax and data transmission without extra hardware
• Tricodec (FR/EFR/HR)
• Internal 3V SIM interface
• Easy remote control by AT commands for dedicated applications
• Fully Type Approved according to GSM Phase 2+ specifications
• Fully shielded and ready-to-use
1.2.2 Electrical
• Power supply: 5 VDC +/- 5% 1A
• 310 mA average in GSM 900 at Tx power max 2W
• 410 mA average in GSM/GRPS 900 at Tx power max 2W
• 9 mA in idle mode
1.2.3 Physical
• Absolute maximum dimension: 46 x 64 x 12 mm
• Weight: 90 g
• Volume: 36.21 cm3
• Casing: Complete shielding-stainless steel-
• Mounting: 4 screw holes
• Operating temperature range: -20°C to + 55°C
• Storage temperature: -35°C to +85°C
1.2.4 Basic Features
1.2.4.1 telephony
• Telephony (TCH/FS) & Emergency calls
• Full Rate, Enhanced Full Rate and Half Rate
• Dual Tone Multi Frequency function (DTMF)
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March 2002/ version 1.6
Integra
1.2.4.2 Short Message Service (GSM and GPRS mode)
• Text and PDU
• Point to point MT & MO
• SMS Cell Broadcast
1.2.4.3 GSM circuit Data Features
• Data circuit asynchronous, transparent and non transparent up to 14,400 bits/s
• Automatic fax group 3 (Class 1 & 2)
• Alternate speech and fax
• MNP2, V.42bis
1.2.4.4 GPRS Packet Data Features
• GPRS Class 2
• Coding Schemes: C1S1 to CS4
• Compliant with SMG31bis
1.2.4.5 GSM Supplementary services
• Call Forwarding
• Call Barring
• Multiparty
• Call Waiting and Call Hold
• Calling Line Identity
• Advice of Charge
• USSD
• Closed User Group
• Explicit Call Transfer
1.2.4.6 Other features
• ME+SIM phone book management
• Fixed Dialling Number
• SIM Toolkit Class 2
• SIM, network and service provider locks
• Real Time Clock
• Alarm management
• Software upgrade through Xmodem protocol
• UCS2 character set management
1.2.5 Interfaces
Single antenna interface
Internal SIM interface: 3V only
External SIM interface: 3V only for engineering sample.
3V or 5V for production unit
For Data Operation:
RS-232C serial link
remote control by AT commands (GSM 07.07 and 07.05)
baud rate from 300 to 115,200 bits/s
from 300 up to 38400 bits/s with autobauding
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March 2002/ version 1.6
Integra
1.3 Mechanical Design Overview
Integra is encased as shown in the figure here-below. It includes a WISMO™ module, a 50-pin
connector, a SIM holder and a RF connector.
figure 1 : mechanical description
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March 2002/ version 1.6
Integra
figure 2 : mechanical description II
4 screw holes allow the Integra to be fixed on the mother PCB. The Integra can be mounted
indifferently on both sides (top or bottom).
For further details see mechanical specifications in annex.
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March 2002/ version 1.6
Integra
Note: Interfaces
The integrated modem has a sole 50-pin connector which gathers all the interface signals in order to
facilitate its integration.
It has an integrated SIM card holder as well as a standard RF connector type MMCX (Miniature Micro
Connector)
The concept of the integrated modem has been defined to integrate on a sole device:
• only one standard easy to find connector (worldwide supplied) gathering the analog and digital
interfaces
• one standard easy to find RF connector. See chapter RF connector page 34
• one SIM card holder. See chapter SIM interface
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March 2002/ version 1.6
Integra
2 Safety precautions
IMPORTANT
FOR THE EFFICIENT AND SAFE OPERATION OF
YOUR GSM INTEGRATED MODEM
READ THIS INFORMATION BEFORE USE
2.1 RF safety
2.1.1 General
Your Integra modem is based on the GSM standard for cellular technology. The GSM standard is spread
all over the world. It covers Europe, Asia and some parts of America and Africa. This is the most used
telecommunication standard.
Your modem is actually a low power radio transmitter and receiver. It sends out and receives radio
frequency energy. When you use your Integra integrated modem, the cellular system which handles your
calls controls both the radio frequency and the power level of your cellular modem.
2.1.2 Exposure to RF energy
There has been some public concern about possible health effects of using GSM modems. Although
research on health effects from RF energy has focused on the current RF technology for many years,
scientists have begun research regarding newer radio technologies, such as GSM. After existing
research had been reviewed, and after compliance to all applicable safety standards had been tested, it
has been concluded that the product was fitted for use.
If you are concerned about exposure to RF energy there are things you can do to minimize exposure.
Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, you can
reduce RF exposure by operating your cellular modem efficiently by following the below guidelines.
2.1.3 Efficient modem operation
For your modem to operate at the lowest power level, consistent with satisfactory call quality :
If your modem has an extendible antenna, extend it fully. Some models allow you to place a call with the
antenna retracted. However your modem operates more efficiently with the antenna fully extended.
Do not hold the antenna when the modem is « IN USE ». Holding the antenna affects call quality and
may cause the modem to operate at a higher power level than needed.
2.1.4 Antenna care and replacement
Do not use the modem with a damaged antenna. If a damaged antenna comes into contact with the skin,
a minor burn may result. Replace a damaged antenna immediately. Consult your manual to see if you
may change the antenna yourself. If so, use only a manufacturer-approved antenna. Otherwise, have
your antenna repaired by a qualified technician.
Use only the supplied or approved antenna. Unauthorized antennas, modifications or attachments could
damage the modem and may contravene local RF emission regulations or invalidate type approval.
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March 2002/ version 1.6
Integra
2.2 General safety
2.2.1 Driving
Check the laws and the regulations regarding the use of cellular devices in the area where you have to
drive as you always have to comply with them. When using your modem while driving, please :
give full attention to driving,
pull off the road and park before making or answering a call if driving conditions so require.
2.2.2 Electronic devices
Most electronic equipment, for example in hospitals and motor vehicles is shielded from RF energy.
However RF energy may affect some improperly shielded electronic equipment.
2.2.3 Vehicle electronic equipment
Check your vehicle manufacturer representative to determine if any on-board electronic equipment is
adequately shielded from RF energy.
2.2.4 Medical electronic equipment
Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc...) to
determine if they are adequately shielded from external RF energy.
Turn your modem OFF in health care facilities when any regulations posted in the area instruct you to do
so. Hospitals or health care facilities may be using RF monitoring equipment.
2.2.5 Aircraft
Turn your modem OFF before boarding any aircraft.
• Use it on the ground only with crew permission.
• Do not use it in the air.
To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA)
regulations require you to have permission from a crew member to use your modem while the aircraft
is on the ground. To prevent interference with cellular systems, local RF regulations prohibit using your
modem while airborne.
2.2.6 Children
Do not allow children to play with your modem. It is not a toy. Children could hurt themselves or others
(by poking themselves or others in the eye with the antenna, for example). Children could damage the
modem, or make calls that increase your modem bills.
2.2.7 Blasting areas
To avoid interfering with blasting operations, turn your unit OFF when in a « blasting area » or in areas
posted : « turn off two-way radio ». Construction crew often use remote control RF devices to set off
explosives.
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March 2002/ version 1.6
Integra
2.2.8 Potentially explosive atmospheres
Turn your modem OFF when in any area with a potentially explosive atmosphere. It is rare, but your
modem or its accessories could generate sparks. Sparks in such areas could cause an explosion or fire
resulting in bodily injuries or even death.
Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include
fueling areas such as petrol stations ; below decks on boats ; fuel or chemical transfer or storage
facilities ; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders.
Do not transport or store flammable gas, liquid, or explosives, in the compartment of your vehicle which
contains your modem or accessories.
Before using your modem in a vehicle powered by liquefied petroleum gas (such as propane or butane)
ensure that the vehicle complies with the relevant fire and safety regulations of the country in which the
vehicle is to be used.
2.3 Safety standards
THIS INTEGRA COMPLIES WITH ALL APPLICABLE RF SAFETY STANDARDS.
This cellular modem meets the standards and recommendations for the protection of public exposure
to RF electromagnetic energy established by governmental bodies and other qualified organizations,
such as the following :
Directives of the European Community, Directorate General V in Matters of Radio Frequency
Electromagnetic Energy
3 Standard Compliance
3.1 GSM compliance
Reference regulations: TBR 19, TBR 20, TBR 31, TBR 32
Table 1 : Wavecom acceptance test
Tests Applied Standard Acceptance Criteria
Performance
Test
ETSI recommendation for
GSM/DCS
communication.
Full conformity to the recommendation regarding the main RF
parameters.
Cooking Test - The test continues even after the Cooking Test milestone has been
reached
Stress Test Therma shocks IEC 68-2-
14.
Full conformity to the recommendation regarding the main parameters.
Vibration Test Sinusoidal vibration IEC
68-2-6.
No performance degradation or mechanical degradation is allowed after
test.
Vibration Test Random vibration IEC 68-
2-36.
No performance degradation or mechanical degradation is allowed after
test.
Shock Test IEC 68-2-27. No performance degradation or mechanical degradation is allowed after
test.
Bump Test IEC 68-2-29. No performance degradation or mechanical degradation is allowed after
test.
Humidity Test Corrosion test IEC 68-2-3. No visible degradation of the product, both visual and functionnal.
The unit is tested at room temperature and must be fully operative for
the main RF parameters.
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March 2002/ version 1.6
Integra
Warehouse Test Low temperance IEC 68-
2-1.
Under normal condition (room temperature) after the test, the unit must
behave in full conformity with the main RF parameters specification.
Warehouse Test High temperature IEC 68-
2-2.
Under normal condition (room temperature) after the test, the unit must
behave in full conformity with the main RF parameters specification.
Dust Test MIL-STD-810D, method
510-3.
No visible dust in the visible areas. No more than 50 dust particules in
the cabinet of the product. The unit, tested at room temperature must
be fully operative.
Light Test UV radiation and
temperature EDF
HN60E03.
Visual inspection on the discoloration and other degradation effects
such as cracks in the material of the unit after the test.
Fall Test IEC 68-2-32. Only minor casing degradation is allowed, with a maximum dimension
change of 1mm. The unit must remain fully operative and full
specification for the main RF parameters.
Electro Static
Discharge Test
IEC 1000-4-2. No performance degradation allowed after the test.
Salt Mist Test IEC 68-2-11 After the test, visual inspection on the unit.
Atmosphere
Test
Flowing mixed gas
corrosion. IEC 68-2-60
After the test, visual inspection on the unit and inside.
Marking Test EN 60 950 After the test, visual inspection on the unit. No degradation is allowed
on the marking.
3.2 FTA Compliance
The Integra has received a Full-Type Approval (according to normal MS requirements) in the
configuration using the internal SIM interface.
3.2.1 IMEI Number
GSM 900/1800:
TAC: 5 000 64
FAC: 11
Serial Numbers: 000000 to 999999
GSM 900/1900:
TAC: 500 100
FAC: 11
Serial Number: 000000 to 999999
GSM/GPRS 900/1800:
TAC: 500161
FAC: 11
Serial Numbers: 000000 to 999999
GSM/GPRS 900/1900:
TAC: 500167
FAC: 11
Serial Number: 000000 to 999999
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March 2002/ version 1.6
Integra
3.2.2 CE Label
The Integra integrated modem is CE compliant which implies that the modem is in conformity with the
European Community directives and it bears the CE label
Carrying out tests:
Electro-magnetic field immunity
EN 61000-4-3
ETS 300-342—1
Radiated emission
EN 55022
ETS 300-342
ESD immunity
EN 61000-4-2
ETS 300-342-1
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March 2002/ version 1.6
Integra
4 Hardware Interfaces
This chapter describes the hardware interfaces:
• interfaces on the 50-pin general purpose connector
• RF interface
• SIM interface
4.1 Interfaces on the 50-pin general purpose connector
4.1.1 The 50-pin connector description
Table 2 : 50-pin connector description
Pin # Name I/O I/O type Description Comment
1 GND GROUND High current
2 GND GROUND High current
3 +5V Supply High current
4 +5V Supply High current
5 CT109/DCD O CMOS/2X RS232-Data Carrier Detect
6 GND GROUND High current
7
GPIO4 I/O CMOS/2X General Purpose I/O
8 SPK2N O Analog Speaker2 negative output
9 CT125/RI O CMOS/2X RS232-Ring Indicator
10 SPK2P O Analog Speaker 2 positive output
11 Flashing LED I/O CMOS/2X Working mode indication
Led
Driven by module
12 SPK1P O Analog Speaker 1 positive output
13 CT106/CTS O 1X RS232 interface Clear To
Send
14 SPK1N O Analog Speaker 1 negative output
15 ON/~OFF I Power ON/OFF control ON = VCC(3)
16 MIC2P I Analog Microphone 2 positive
input
17 AUXV0 I Analog Auxiliary ADC input
18 MIC2N I Analog Microphone 2 negative
input
19 ~RST I Reset active low Open Collector
20 MIC1P I Analog Microphone 1 positive
input
21 GND I Ground
22 MIC1N I Analog Microphone 1 negative
input
23 BOOT I BOOT Open Collector
24 GND GROUND High current
25 CT103/TX I RS232 interface - Transmit Pull up to VCC(3)
with 100KΩ when
not used
26 GPIO0 I/O CMOS/2X General Purpose I/O
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Pin # Name I/O I/O type Description Comment
27 CT107/DSR O 1X RS232 interface
Data Set Ready
28 CT104/RX O 1X RS232 interface – Receive
29 CT108-2/DTR I RS232 interface
Data Terminal Ready
Pull up to VCC(3)
with 100KΩ when
not used
30 CT105/RTS I RS232 interface
Request To Send
Pull up to VCC(3)
with 100KΩ when
not used
31 COL3 I/O 1X Keypad column
32 COL4 I/O 1X Keypad column
33 COL1 I/O 1X Keypad column
34 COL2 I/O 1X Keypad column
35 ROW4 I/O 1X Keypad row
36 COL0 I/O 1X Keypad column
37 ROW2 I/O 1X Keypad row
38 ROW3 I/O 1X Keypad row
39 ROW0 I/O 1X Keypad row
40 ROW1 I/O 1X Keypad row
41 GND(1)
NC(2)
GROUND(1)
No Connected(2) High current
42 SPI_EN O 1X SPI enable
43 SPI_IO I/O 1X I2 C Data or SPI Data
44 SPI_CLK O 1X I2 C Clock or SPI Clock
45 SIMCLK O 2X Clock for SIM Interface 3V mode
46 SIMRST O 2X Reset for SIM interface 3V mode
47 SIMVCC O SIM card supply 3V mode
6mA max
48 SIMPRES1 I SIM card detect Connected to SIM
connector pin 8.
Pin 4 of SIM
connector must be
pulled down to
GND with 1 KΩ*
49 SIMDATA I/O 3X I/O for SIM interface 3V mode
50 GND(1),
GPO0(2)**
See (1) and (2) High current
(1) for engineering sample
(2) for production unit.
(3) VCC = application digital power supply either 5V or 2.8V
*see SIM socket diagram 4.3 SIM interface
** GPO0 is a general purpose output for selection of external SIM 3V or 5V
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March 2002/ version 1.6
Integra
Table 3 : operating conditions
Parameter I/O type Min Max Condition
Vinput low CMOS -0.5 V 0.8 V
Vinput high CMOS 2.1 V 3.0 V
Voutput low 1X 0.2 V IOL = -1 mA
2X 0.2 V IOL = -2 mA
3X 0.2 V IOL = -3 mA
Voutput high 1X 2.6 V IOH = 1 mA
2X 2.6 V IOH = 2 mA
3X 2.6 V IOH = 3 mA
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March 2002/ version 1.6
Integra
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
GND
+5V
GND
SPK2N
MIC2P
GND
GPIO0
CT104/Rx
CT105/RTS
COL4
ROW3
SPI EN
SIMRST
SIMPRES1
GND(1), GPO0(2)
SPK2P
SPK1P
SPK1N
MIC2N
MIC1P
MIC1N
COL2
COL0
ROW1
SPI CL
K
GND
+ 5 V
CT109/DCD
GPIO4
ON/~OFF
BOOT
CT103/Tx
CT107/DS
R
CT108-2/DT
R
COL3
ROW2
GND(1), NC(2)
SIMCL
K
SIMVCC
SIMDATA
CT125/RI
FLASHING LED
CT106/CTS
AUXV0
~RST
GND
COL1
ROW4
ROW0
SPI IO
(1) for engineering sample
(2) for production unit
figure 3 : 50-pin connector
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March 2002/ version 1.6
Integra
49 50
1 2
figure 4 : pin numbering/bottom view
4.1.2 Power supply
The main power supply is provided through a double connection. These connections are respectively the
pin 3 and 4 for the +5V and the pins 1 and 2 for the ground (GND). The pins 6, 21, 24 and 40 are also
ground connection in order to produce a proper ground plane.
A 5V +/-5% - 1A power is strictly required to supply the modem. Otherwise, serious dysfunctions may
appear. However, the modem does not have to constantly deliver 1A current at 5V on this power supply.
This power supply is internally regulated to a nominal value VBATT.
Table 4 : power supply pin description
Pin number Name Description Comment
1 GND Ground High Current
2 GND Ground High Current
3 +5 V Ground High Current
4 +5 V Ground High Current
6 GND Ground High Current
21 GND Ground High Current
24 GND Ground High Current
41* GND Ground High Current
50* GND Ground High Current
*for engineering sample
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March 2002/ version 1.6
Integra
Table 5 : Power consumption in EGSM only mode @ 25°C
Conditions INOM I
MAX
+5V During TX bursts @ 2W 810 mA 1 A
+5V Average @ 2W 310 mA 370 mA
+5V Average @ 0.5W 185 mA 200 mA
+5V Average Idle mode 22 mA 25 mA
+5V Average Idle with power saving
mechanism activated
9.2 mA 10.5 mA
Table 6 : Power consumption in GSM only 1800 and1900 mode @ 25°C
Conditions INOM I
MAX
+5V During TX bursts @ 1W 635 mA 800 mA
+5V Average @ 1W 260 mA 280 mA
+5V Average @ 0.25W 150 mA 170 mA
+5V Average Idle mode 20 mA 22 mA
+5V Average Idle with power saving
mechanism activated
9.2 mA 10.5 mA
Table 7 : Power consumption in EGSM/GPRS cl2 mode @ 25°C
Conditions INOM I
MAX
+5V During TX bursts @ 2W 810 mA 1 A
+5V Average @ 2W 310 mA 370 mA
+5V Average @ 0.5W 185 mA 200 mA
+5V Average in GPRS @ 2W 410 mA 490 mA
+5V Average Idle mode 22 mA 25 mA
+5V Average Idle with power saving
mechanism activated
9.2 mA 10.5 mA
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March 2002/ version 1.6
Integra
Table 8 : Power consumption GSM/GPRS cl2 1800 or 1900 mode @
25°C
Conditions INOM I
MAX
+5V During TX bursts @ 1W 635 mA 800 mA
+5V Average @ 1W 260 mA 280 mA
+5V Average @ 0.25W 150 mA 170 mA
+5V Average in GPRS @ 1W 360 mA 400 mA
+5V Average Idle mode 20 mA 22 mA
+5V Average Idle with power saving
mechanism activated
9.2 mA 10.5 mA
4.1.3 Serial link
A serial link interface is available complying with V24 protocol signalling but not with V28 (electrical
interface) due to a 2.8 Volts interface. TX, RTS and DTR can be either 5V or 3V.
The signals are Tx data (CT103/TX), Rx data (CT104/RX), Request To Send (CT105/RTS), Clear To
Send (CT106/CTS), Data Terminal Ready (CT108-2/DTR) and Data Set Ready (CT107/DSR).
The set of RS232 signals can be required for GSM DATA services application. The 2 additional signals
are Data Carrier Detect (CT109/DCD) and Ring Indicator (CT125/RI).
Table 7 : Serial Link pin description
Signal Pin number I/O I/O type* Description
CT103 / TX 25 I CMOS Transmit serial data
CT104 / RX 28 O 1X Receive serial data
CT105 / RTS 30 I CMOS Ready To Send
CT106 / CTS 13 O 1X Clear To Send
CT107 / DSR 27 O 1X Data Set Ready
CT108-2 / DTR 29 I CMOS Data Terminal Ready
CT109 / DCD 5 O CMOS / 2X Data Carrier Detect
CT125 / RI 9 O CMOS / 2X Ring Indicator
CT102/GND 21,24…** Ground
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector
description
** Any of the available GND pins can be used
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March 2002/ version 1.6
Integra
11 S
_
RTS
7 S_RX
15
GND
26
5 S_RI
6 S_DCD
10 S
_
CTS
12 S
_
DSR
8S
_
DTR
9S
_
TX
14 VCC
VCC
VCC
GND
3
DTR 21
RTS 18
VCC 13
16
1
28
25
CTS 19
DSR 17
RI 24
DCD 23
VCC
RX 22
TX 20
27
2
4
C1+
C1-
C2+
C2-
T1IN
T2IN
T3IN
T4IN
T5IN
R1OUTB
R2OUT
R3OUT
R4OUT
ON
T1OUT
R1I
N
T2OUT
T3OUT
T4OUT
T5OUT
R2I
N
R3I
N
ERRO
R
OFF
Modem Level Shifte
r
Terminal
MAX 3238
figure 5* : level shifter application diagram for serial link
* This application note is valid for VCC ≥ 3.0Volt (see MAX3238 specifications). Auto shut down mode is not used in
this example.
4.1.4 ON / ~OFF
This input is used to switch ON or OFF the Integra modem. A high level signal has to be provided on
the ON/~OFF pin to switch on the modem. The level of the voltage of this signal has to be maintained
to VCC during a minimum time of 1 second. When powered off, the shutdown current is roughly
60 µA.
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March 2002/ version 1.6
Integra
Table 8 : ON / OFF pin description
Signal Pin number I/O I/O type* Description
ON/∼OFF 15 I CMOS Module Power ON/OFF
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
4.1.4.1 Power OFF procedure
In order to power OFF the Integra, switch it OFF both via software (AT+CPOF, See AT commands
user’s guide for more details) and via hardware line. See the diagram below.
figure 6 : power OFF procedure 1
figure 7 : power OFF procedure 2
A
bout
500 ms
A
bout
500 ms
OK response
A
T+CPOF
ON/~OFF
Serial link
to Integra
Serial link
from Integra
Integra status
ON
OFF
A
bout
500
ms
ON/~OFF
Serial link
to Integra
A
T+CPOF
Serial Link
from Integra OK response
A
bout
500 ms
Integra Status
ON
OFF
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March 2002/ version 1.6
Integra
4.1.5 BOOT
This input is used to switch the Integra into download mode (backup procedure). The internal boot
procedure is started when this pin is low during the power ON of the module. In normal mode, this pin
has to be left open. If used, this input has to be driven by an open collector or an open drain. See below
an example of application diagram. See also the software upgrade procedure in General Guidelines
chapter 8
BOOT : pin 23
Switch BOOT
figure 8 : boot procedure
If Switch Boot = 1, Boot pin 23 = 0, to download mode
If Switch Boot = 0, Boot pin 23 = 1, to normal mode
Table 9 : BOOT pin description
Signal Pin number I/O I/O type* Description
BOOT 23 I CMOS SW downloading
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
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March 2002/ version 1.6
Integra
4.1.6 Reset signal (~RST)
This signal is used to force a reset of the Integra. It has to be used by providing low level during
approximately 2ms. This signal has to be considered as an emergency reset only. A reset procedure is
already driven by an internal hardware during the power-up sequence.
This signal can also be used to provide a reset to an external device. If no external reset is necessary
this input can be left open. If used (emergency reset), it has to be driven by an open collector or an open
drain. See below an example of application diagram.
Reset : pin 19
Switch reset
figure 9 : reset procedure
If switch Reset = 1, Reset pin 19 = 0
If switch Reset = 0, Reset pin 19 = 1
Table 10 : reset signal pin description
Signal Pin number I/O I/O type* Description
∼RST 19 I/O Module Reset
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
Table 11 : reset signal electrical characteristics
Parameter Min Max Unit
Input Impedance ( R ) 4.7 kΩ
Input Impedance ( C ) 10 NF
Table 12 : reset signal operating conditions
Parameter Min Max Condition
*VT- 1.1V 1.2 V
*VT+ 1.7V 1.9 V
VOL 0.4 V IOL = -50 µA
VOH 2.0 V IOH = 50 µA
VT-, VT+ : Hysterisis Level
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March 2002/ version 1.6
Integra
4.1.7 Flashing LED
The flashing LED signal is used to indicate the working mode of the Integra.
Table 13 : the flashing LED pin description
Signal Pin number I/O I/O type* Description
Flashing LED 11 I/O CMOS/2X Working mode indication
LED
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
Table 14 : LED and Integra status
LED status Integra status
OFF Download mode or switched OFF
Permanent Switched ON, not registered on the network
Slow flash Switched ON, registered on the network
ON
Quick flash Switched ON, registered on the network, communication in
progress
4.1.8 General Purpose Input/Output
The Integra provides 2 General Purpose I/O. They are used to control any external device.
Table 15 : General Purpose pin description
Signal Pin number I/O I/O type* Description Default value
GPIO0 26 I/O CMOS / 2X General Purpose
I/O
0
GPIO4 7 I/O CMOS / 2X General Purpose
I/O
0
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
All digital I/O comply with 3Volts CMOS.
You can access (write or read) the GPIO value via AT+WIOW and AT+WIOR. See AT commands
user’s guide for more details.
4.1.9 Analog to Digital Converter
Analog to Digital converter (ADC) input is provided by the Integra. This converter is a 10 bits one,
ranging from 0 to 2.5V. You can see the measurements via AT+ADC. See AT commands user’s guide
for more details.
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March 2002/ version 1.6
Integra
Table 16 : A/D converter pin description
Signal Pin number I/O I/O type* Description
AUXV0 17 I Analog A/D converter
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
description
Table 17 : A/D converter electrical characteristics
Parameter Min Max Unit
Resolution 10 bits
Sampling rate 90.3 Ksps
Input signal range 0 2.5V V
ADC Reference Accuracy 0.5 %
Integral Accuracy +/- 1 LSB
Differential Accuracy +/- 1 LSB
Input Impedance ( R ) 10 MΩ
Input Impedance ( C ) 50 pF
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March 2002/ version 1.6
Integra
4.1.10 Audio Interface
Two different microphone inputs and two different speaker outputs are supported.
The connection can be either differential or single-ended but using a differential connection in order to
reject common mode noise and TDMA noise is recommended.
4.1.10.1 Microphone 2 Inputs
The MIC2 inputs are differential ones. They already include the convenient biasing for an electret
microphone (0,5 mA and 2 Volts). This electret microphone can be directly connected on these inputs.
The impedance of the microphone 2 has to be around 2kΩ. These inputs are the standard ones for a
handset design while MIC1 inputs can be connected to an external headset or a handsfree kit.
The gain of MIC2 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB. The
connection to the microphone is direct. The gain can be tuned using the AT+VGR command.
See chapter Connector suppliers and peripheral devices.
MIC2P
C1
C1 = 22pF to 100pF
33 pF recommanded
MIC2N
figure 10 : microphone 2 input
C1 has to be the nearest as possible to the microphone. Microphone manufacturers provide this
capacitor directly soldered on the microphone.
Table 18 : microphone 2 input pin description
Signal Pin # I/O I/O type* Description
MIC2P 16 I Analog Microphone 2 positive input
MIC2N 18 I Analog Microphone 2 negative input
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
4.1.10.2 Microphone 1 Inputs
The MIC1 inputs are differential and do not include internal bias. To use these inputs with an electret
microphone, bias has to be generated outside the INTEGRA modem according to the characteristic of
this electret microphone. These inputs are the standard ones used for an external headset or a
handsfree kit. When using a single-ended connection, be sure to have a very good ground plane, a very
good filtering as well as shielding in order to avoid any disturbance on the audio path.
The gain of MIC1 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB.
The gain can be tuned using the AT+VGR command.
Differential connection VCC analog power supply 2.8V
R1
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C2
MIC1P
R2
C1
March 2002/ version 1.6
Integra
figure 11 : microphone 1 input
R1 = R4 = from 100 to 330 Ω
R2 = R3 = usually between 1KΩ and 3.3KΩ as per the
microphone characteristics
C1 = 22pF to 100pF
C2 = 47µF
R1 and R4 are used as a voltage supply filter with C2.
C1 has to be the nearest possible to the microphone. Microphone manufacturers provide this capacitor
directly soldered on the microphone.
Table 19 : microphone 1 input pin description
Signal Pin # I/O I/O type* Description
MIC1P 20 I Analog Microphone 1 positive input
MIC1N 22 I Analog Microphone 1 negative input
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
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Integra
4.1.10.3 Speaker 2 Outputs
Speaker outputs SPK2 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF.
These outputs are differential and the output power can be adjusted by step of 2dB. The output can be
directly connected to a speaker.
When using a single-ended connection, be sure to have a very good ground plane, a very good filtering
as well as shielding in order to avoid any disturbance on the audio path.
Differential Connection
SPK2P
SPK2N
Single-ended Connection
C1
SPK2P
figure 12 : speaker 2 output
C1 = from 100nF to 47µF as per the speaker characteristics and the output power.
Using a single-ended connection also includes losing half of the output power compared to a
differential connection.
Table 20 : speaker 2 output pin description
Signal Pin # I/O I/O type* Description
SPK2P 10 O Analog Speaker 2 positive output
SPK2N 8 O Analog Speaker 2 negative output
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
+
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4.1.10.4 Speaker 1 Outputs
Speaker outputs SPK1 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF.
These outputs are differential and the output power can be adjusted by step of 2dB. The output can be
directly connected to a speaker.
When using a single-ended connection, be sure to have a very good ground plane, a very good
filtering as well as a shielding in order to avoid any disturbance on the audio path.
Differential Connection
SPK1P
SPK1N
Single-ended Connection C1
SPK1P
figure 13 : speaker 1 output
C1 = from 100nF to 47µF as per the speaker characteristics.
Using a single-ended connection also includes losing half of the output power compared to a
differential connection.
Table 21 : speaker 1 output pin description
Signal Pin # I/O I/O type* Description
SPK1P 12 O Analog Speaker 1 positive output
SPK1N 14 O Analog Speaker 1 negative output
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
+
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Integra
4.1.11 SIM interface
The external SIM interface is available through the 50-pin connector in order to use a stand-alone SIM
card holder. This interface is 3V only on the engineering samples. 5V SIMs can be driven with
production unit using an external level shifter.
SIM line must not exceed 15 cm. see also “General guidelines” chapter 8
5 signals are available:
SIMVCC: SIM power supply.
SIMRST: reset.
SIMCLK: clock.
SIMDATA: I/O port.
SIMPRES1 SIM card detect. This signal is connected to the external SIM connector on pin 8. Pin 4 of
SIM connector must be pulled down to GND with 1 KΩ.
This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality.
Transient Voltage Suppressor diodes are internally added on the signals connected to the SIM socket in
order to prevent any Electro-Static Discharge. TVS diodes with low capacitance (less than 10pF) are
connected on SIMCLK and SIMDATA to avoid any disturbance of the rising and falling edge.
Table 22 : SIM interface pin description
Signal Pin number I/O I/O type* Description
SIMCLK 45 O 2X SIM Clock
SIMRST 46 O 2X SIM Reset
SIMDATA 49 I/O CMOS / 3X SIM Data
SIMVCC 47 O
SIM Power Supply
SIMPRES1 48 I CMOS SIM Card Detect
GPO0** 50 O 2X SIM 3V or 5V
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
** for production units
See application schematics in annex for 3V/5V SIM management
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Integra
Table 23 : SIM interface electrical characteristics
Parameter Conditions Min Typ Max Unit
SIMDATA VIH IIH = ± 20µA 0.7xSIMVCC V
SIMDATA VIL I
IL = 1mA 0.3xSIMVCC V
SIMRST,
SIMDATA
SIMCLK VOH
Source current =
20µA
SIMVCC – 0.1V V
SIMRST,
SIMDATA
SIMCLK VOL
Sink current =
- 200µA
0.1 V
SIMVCC Output
Voltage
ISIMVCC <= 6mA 2.70 2.80 2.85 V
SIMCLK Rise/Fall
Time
Loaded with 30pF 50 ns
SIMRST,
SIMDATA
Rise/Fall Time
Loaded with 30pF 1 µs
SIMCLK
Frequency
Loaded with 30pF 3.25 MHz
Table 24 : SIM socket pin description
Signal Pin number Description
VCC 1 SIMVCC
RST 2 SIMRST
CLK 3 SIMCLK
CC4 4 R10 to GROUND
GND 5 GROUND
VPP 6 Not connected
I/O 7 SIMDATA
CC8 8 SIMPRES1
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Integra
SIMVCC 1
SIMRST 2
SIMCLK 3
SIMDATA 7
SIMPRES1 8
1 K
VCC
RST
CL
K
CC4
GND
VPP
I / O
CC8
GND
Figure 14: SIM socket
4.1.12 SPI bus
The SPI bus includes a CLK signal, an I/O signal and an EN signal complying with SPI bus standard.
The maximum speed transfer is 3.25Mb/s.
Table 25 : SPI Bus pin description
Signal Pin number I/O I/O type* Description
SPI_CLK 44 O 1X SPI Serial Clock
SPI_IO 43 I/O CMOS / 1X SPI Data
SPI_EN 42 O 1X SPI Enable
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
4.1.13 Keypad interface
This interface provides 10 connections : 5 rows (R0 to R4) and 5 columns (C0 to C4).
The scanning is a digital one, and the debouncing is done in the integrated modem. No discrete
components like R,C (Resistor, Capacitor) are needed.
It is possible to scan the column and rows using the: AT+ CMER. command. See AT command user’s
guide for more details.
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Table 26 : keypad interface pin description
Signal Pin number I/O I/O type* Description
ROW0 39 I/O CMOS / 1X Row scan
ROW1 40 I/O CMOS / 1X Row scan
ROW2 37 I/O CMOS / 1X Row scan
ROW3 38 I/O CMOS / 1X Row scan
ROW4 35 I/O CMOS / 1X Row scan
COL0 36 I/O CMOS / 1X Column scan
COL1 33 I/O CMOS / 1X Column scan
COL2 34 I/O CMOS / 1X Column scan
COL3 31 I/O CMOS / 1X Column scan
COL4 32 I/O CMOS / 1X Column scan
*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin connector description
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4.2 RF Interface
The impedance is 50 Ohms nominal.
4.2.1 RF connector
The RF connector is MMCX (Miniature Micro Connector) standard type.
An antenna can be directly connected through the matting connector or using a small adaptor. See also
paragraph on GSM antenna.
4.2.2 RF performances
RF performances are compliant with the ETSI recommendation 05.05 and 11.10.
The main parameters are :
• Receiver:
• EGSM Sensitivity : < -104 dBm
• GSM 1800/GSM 1900 Sensitivity : < -102 dBm
• Selectivity @ 200 kHz : > +9 dBc
• Selectivity @ 400 kHz : > +41 dBc
• Dynamic range : 62 dB
• Intermodulation : > -43 dBm
• Co-channel rejection : + 9 dBc
Transmitter :
• Maximum output power (EGSM) : 33 dBm +/- 2 dB
• Maximum output power (DCS/PCS) : 30 dBm +/- 2 dB
• Minimum output power (EGSM): 5 dBm +/- 5 dB
• Minimum output power (DCS/PCS): 0 dBm +/- 5 dB
• H2 level : < -30 dBm
• H3 level : < -30 dBm
• Noise in 925 - 935 MHz : < -67 dBm
• Noise in 935 - 960 MHz : < -79 dBm
• Noise in 1805 - 1880 MHz : < -71 dBm
• Phase error at peak power : < 5 ° RMS
• Frequency error : +/- 0.1 ppm max
4.3 SIM interface
The internal SIM interface of the Integra supports 3V SIMs only.
The part number reference of the SIM card holder supplier is MOLEX 91228-0002
The part number reference of the SIM receptacle supplier is MOLEX 91236-0002
See also subdivision The SIM card holder.
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March 2002/ version 1.6
Integra
5 Connector Supplier and Peripheral devices
5.1 Where to find the SMD connectors
The Integra matting interface connector is made by SAMTEC France (http://www.samtec.com/).
Many SAMTEC products are available via SAMTEC dealers throughout the world.
The connectors data sheets are available in annex of this document.
Figure 15: high and low profile CLP connectors
Part number : FFSD-20-S-10-01-N
Figure 16: flexible flat cable
Part number : FLE 125 01LDVA
Figure 17: flex cable connector
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March 2002/ version 1.6
Integra
5.1.1 GSM Antenna
The integrated modem antenna connector is a MMCX connector. The MMCX connector incorporates a
'Snap On' latching action in order to make the connection easier with an excellent RF performance. An
additional advantage is its small physical size which is 50% of the standard MCX connector.
This type of connector is suitable for the standard ranges of flexible and semi-rigid cables. The
characteristic impedance of the MMCX coaxial connector is 50 ohm.
The antenna manufacturer must guarantee that the antenna will be working according to the following
radio characteristics:
Table 27 : radio characteristics
EGSM 900 GSM 1800 GSM 1900
Frequency RX 925 to 960 MHz 1805 to 1880 MHz 1930 to 1990 MHz
Frequency TX 880 to 915 MHz 1710 to 1785 MHZ 1850 to 1910 MHz
RF power stand 2W at 12.5 % duty cycle 1W at 12.5 % duty cycle 1W at 12.5 % duty cycle
Impedance 50 Ω
VSWR < 2
Typical radiated
gain 0 dBi on azimuth plane
The Integra requires an MMCX (Miniature Micro Connector) plug to connect an antenna
Figure 18: MMCX connector example (right angle)
An antenna with matting connector can be ordered, for example, from :
IMS Connectors Systems GMBH
Obere Hauptstrasse 30
D-79843 Löffingen
Germany
Tel : +49 76 54 90 10
Fax : +49 76 54 90 11 99
http://www.imscs.com/
or using a small MMCX / SMA adaptor can be ordered, for example, from :
Amphenol Socapex
http://www.amphenol.com/
Order N° : 908-31100
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son autorisation préalable.
March 2002/ version 1.6
Integra
5.1.2 The SIM card holder
The SIM card holder used in the integrated modem is a MOLEX connector.
Part number connector: 99228-0002
Part number holder : 91236-0002
For more information about this connector :
http://www.molex.com/
It is possible to use a stand-alone SIM card holder through the 50-pin connector (the length of the SIM
line must not exceed 15 cm).
6 Climatic and mechanical environment
Table 28 : climatic and mechanical environment
WM2C-G900/G1800 ENVIRONNEMENTAL CLASSES
TYPE OF TEST STANDARDS STORAGE TRANSPORTATION OPERATING (PORT USE)
Class 1.2 Class 2.3 Class 7.3
Cold IEC 68-2.1 -25° C 72 h -40° C 72 h -20° C (GSM) 16 h
Ab test -10° C (DCS) 16 h
Dry heat IEC 68-2.2 +70° C 72 h +70° C 72 h +55° C 16 h
Bb test
Change of temperature IEC 68-2.14 -40° / +30° C 5 cycles -20° / +30° C (GSM) 3 cycles
Na/Nb test t1 = 3 h -10° / +30° C (DCS) 3 cycles
t1 = 3 h
Damp heat IEC 68-2.30 +30° C 2 cycles +40° C 2 cycles +40° C 2 cycles
cyclic Db test 90% - 100% RH 90% - 100% RH 90% - 100% RH
variant 1 variant 1 variant 1
Damp heat IEC 68-2.56 +30° C 4 days +40° C 4 days +40° C 4 days
Cb test
Sinusoidal vibration IEC 68-2.6 5 - 62 Hz : 5 mm / s
Fc test 62 - 200Hz : 2 m / s2
3 x 5 sweep cycles
5 - 20 Hz : 0.96 m2 / s3 10 -12 Hz : 0.96 m2 / s3
Random vibration IEC 68-3.36 20 - 500Hz : - 3 dB / oct 12 - 150Hz : - 3 dB / oct
wide band Fdb test 3 x 10 min 3 x 30 min
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March 2002/ version 1.6
Integra
7 Demonstration board
Keypad
WMOi3
Integrated
Modem
SIM
Card
Holder
Reset
RS 232
serial link
Power
Supply
5V only/1 A
Audio RJ 9
Handset and
handsfree
Antenna
Connector
Flex
connector
ON/OFF
Download
Test
connector
Flashing
LED
Figure 19: Integra demoboard description
The Wavecom demonstration board (“demoboard”) is manufactured by Wavecom. It can be ordered
from Wavecom or directly from your distributor.
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March 2002/ version 1.6
Integra
8 General guidelines for the use of the Integra
8.1 Key information
8.1.1 Hardware and RF
• Ground plane: Wavecom recommends to have a common ground plane for analog,
digital and RF grounds.
• Length of the SIM interface lines (15 cm maximum)
• Bias of the Microphone inputs must be properly adjusted when using audio connectors
(mic + speaker) 1.
• EMC protection on audio input/output (filters against 900 MHz)
• ESD protection on serial link,…
• Possible spurious emission radiated by the application to the RF receiver in the
receiver band
8.1.2 The Antenna
The antenna sub-system and integration in the application is a major issue. It is a major issue in the
choice of the antenna cable ( type, length, performances, thermal resistance, etc.)
These elements could affect GSM performances such as sensitivity and emitted power.
The antenna should be isolated as much as possible from the digital circuitry including the interface
signals.
It is recommended to shield the terminal. On terminals including the antenna, a poor shielding could
dramatically affect the sensitivity of the terminal. Subsequently, the power emitted through the antenna
could affect the application.
8.1.3 Firmware upgrade
The Integra firmware is stored in flash memory and it can easily be upgraded.
Two upgrade procedures are available:
• one (nominal) procedure based on the Xmodem protocol (AT+WDWL command)
• one emergency mode (backup procedure) based on a Wavecom specific downloader
8.1.3.1 Nominal upgrade procedure
The firmware file can be downloaded into the modem using the Xmodem protocol.
To enter this mode, the AT+WDWL command (see description in the AT command manual) has to be
sent to the Integra.
The necessary serial signals to proceed with the Xmodem downloading are:
Rx, Tx, RTS, CTS, GND.
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March 2002/ version 1.6
Integra
8.1.3.2 backup procedure
In case the nominal upgrade mode is not possible (due to critical corruption on the flash memory), a
backup procedure is also available. It requires a WAVECOM specific software to download the firmware
file into the modem.
This tool has to run on a PC connected to the serial bus of the modem. As this procedure is very specific
and needs Wavecom tools, this process has to be executed by your distributor.
The necessary signals to proceed with the downloading are: Rx, Tx, RTS, CTS, GND.
Prior to running the WAVECOM downloader, the modem has to be set in download mode.
For this, the BOOT signal has to be set to low while powering ON (or reseting) the modem.
The application must support serial speed changes, up to 115,200 bps and hardware flow control.
8.1.4 Getting started
8.1.4.1 Minimum hardware interface to get started
As a minimum, it is necessary to connect the following signals to properly operate the Integra :
Table 29 : minimum signals to operate the Integra
Pin number Name Description
1 GND GROUND
2 GND GROUND
3 +5V Power supply
4 +5V Power supply
6 GND GROUND
13 CT106/CTS Clear To Send
15 ON/OFF Power On/OFF*
21 GND GROUND
24 GND GROUND
25 CT103/TX Transmit
28 CT104/RX Receive
30 CT105/RTS Request To Send
* connected to +5V for example
The serial link signals must be used through the implementation of the serial link level shifter. See
figure 5 : level shifter application diagram for serial link
8.1.4.2 Terminal emulator setup
Here below is an example based on the WindowsTM Hyperterminal application (terminal emulator
program).
Setup:
START – PROGRAMS – ACCESSORIES – HYPERTERMINAL , then
Start the software HYPERTRM
Give the name of your choice, click on the icone of your choice, then click “OK”, then
choose:
Connect using : direct to COM1
Properties :
choose 9600 bps – 8 bits data – no parity – 1 stop bit – hardware flow control
Click “OK”
Once Hyperterminal is open and configured, it can be used to send AT commands to the Integra.
Please see the “Informative Example” annex in the AT command user’s guide to test your Integra.
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March 2002/ version 1.6
Integra
9 Reference documents
Table 31 : GSM ETSI recommendations for Phase I and Phase II.
Specification Reference Title
GSM ph2 Radio ETSI GSM 05.05 and GT 01 v4.2.1
DCS ph2 Radio ETSI GSM05.05 and GT01 v4.2.1
GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 and GT 01 v4.2.1
GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 and GT 01 v4.2.1
GSM ph2 Layer 2 ETSI GSM 04.06 and GT 01 v4.2.1
GSM ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1
DCS ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1
GSM/DCS Multiband ETSI GSM 02.07, 03.22, 04.08, 04.13, 05.05, 05.08 and GT 01 v4.2.1
GSM ph2 SIM ETSI GSM 11.11 and GT 01 v4.2.1
GSM ph2 Teleservices ETSI GSM 03.50 and GT 01 v4.2.1
GSM ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11, 06.10, 06.11, 06.1
06.31, 06.32, 07.01, 09.07 and GT 01 v4.2.1
DCS ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11, 06.10, 06.11, 06.1
06.31, 06.32, 07.01, 09.07 and GT 01 v4.2.1
You can find the documents on
ETSI Contacts: ETSI Secretariat
F-06921 Sophia Antipolis cedex, France
e-mail: secretariat@etsi.fr
http://www.etsi.org
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March 2002/ version 1.6
Integra
10 Acronyms and Abbreviations
ADC : Analog Digital Converter
ASIC : Application Specific Integrated Circuit
BCCH : Broadcast Control Channel
CE : Communauté Européenne
CLK : Clock
CTS : Clear To send
dB : decibel
DCD : Data Carrier Detect
DCE : Data Circuit Terminating Equipment
DSR : Data Set Ready
DTE : Data Terminal Equipment
DTR : Data Terminated Ready
EFR : Enhanced Full Rate
E-GSM : Extended- GSM
EMC : Electromagnetic Conformity
EN : Enable
ETSI :
FAC : Final Assembly Code
FR : Full-Rate
FTA : Full Type Approval
GND : Ground
GPIO : General Purpose Input Output
GPRS : General Packet Radio Service
GSM : Global System for Mobile Communication
HR : Half-Rate
IMEI : International Mobile Equipment Identity
MO : Mobile Originated
MT : Mobile Terminated
OEM : Original Equipment Manufacturer
PDA : Personal Digital Assistant
PCB : Printed Circuit Board
PRES : Presence
RI : Ring Indicator
RTS : Request To Send
SIM : Subscriber Identity Module
SMD : Surface Mounted Design
SMS : Short Message Service
TAC : Type Approval Code
TDMA : Time Code Multiple Access
TE : Terminal Equipment
VSWR : Voltage Standing Wave Ratio
WAP : Wireless application Protocol
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March 2002/ version 1.6
Integra
11 Index
2
2X, 19, 20, 22, 23, 27, 34, 41
A
Advice of Charge, 9
analog, 12, 52
Analog, 19, 20, 34, 35, 36, 38, 39, 40, 66
antenna, 9, 13, 14, 15, 46, 48, 49, 52
antenna cable, 52
asynchronous, 9
AT commands, 8, 9, 63
AT+ CMER, 44
AT+CPOF, 29
autobauding, 9
AUXV0, 20, 35
B
baud rate, 9
BOOT, 20, 31
bursts, 26
C
Call Barring, 9
Call Forwarding, 9
Call Hold, 9
Call Waiting, 9
Calling Line Identity, 9
Casing, 8
CE, 18, 56
Cell Broadcast, 9
Class 1, 8, 9
Class 4, 8
Closed User Group, 9
CMOS, 19, 20, 23, 27, 29, 31, 34, 41, 44, 45
column, 21, 44
connector, 7, 10, 12, 19, 22, 27, 29, 31, 32, 33,
34, 35, 36, 38, 39, 40, 41, 44, 45, 46, 47, 48,
49
converter, 34, 35
D
data, 7, 8, 27, 64, 65
Data Carrier Detect, 19, 27
dB, 46, 56
DCS, 7, 16, 26, 46, 48, 55
digital, 12, 34, 44, 52, 66
Digital, 34, 56
dual-band, 7
E
Easy remote control, 8
Echo, 63, 65
EFR, 8, 56
EMC protection, 52
Emergency calls, 8
ESD protection, 52
ETSI, 16, 46, 55
Explicit Call Transfer, 9
F
fax, 7, 8, 9
Fixed Dialling Number, 9
Flash LED, 20
FR, 8, 56
G
gain, 36, 37, 48, 66
general purpose, 19
General Purpose, 19, 20, 34
GND, 25
GND, 19, 20, 21, 22, 25, 27, 41, 43, 56
GPIO, 66
GPRS, 56
Ground plane, 52
GSM, 7, 8, 9, 13, 16, 27, 41, 48, 52, 55, 56
H
handset, 36
hardware, 7, 8, 19, 29, 32, 53
HR, 8, 56
I
I/O, 19, 20, 21, 22, 23, 27, 29, 31, 32, 33, 34,
35, 36, 38, 39, 40, 41, 43, 44, 45
Idle, 26
idle mode, 8
interface, 7, 8, 9, 12, 19, 20, 21, 22, 27, 41, 42,
44, 45, 46, 52
K
Keyboard, 21, 44
M
MIC1N, 20, 38
MIC1P, 20, 38
MIC2N, 20, 36
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March 2002/ version 1.6
Integra
MIC2P, 20, 36
microphone, 36, 37, 38, 63
Microphone, 63
Microphone, 20, 36, 37, 38, 52
MMCX (Miniature Micro Connector), 7, 12, 46,
48
MNP2, 9
MO, 9, 56
modem, 7, 8, 10, 12, 13, 14, 15, 16, 18, 25, 28,
37, 44, 46, 48, 49
module, 7, 10, 31
Mounting, 8
MT, 9, 56
Multiparty, 9
N
nominal value, 25
O
OFF, 15, 16, 20, 28, 29, 30
Ohms, 39, 40, 46
ON/~OFF, 20, 28
operating conditions, 23, 27, 29, 31, 32, 33,
34, 35, 36, 38, 39, 40, 41, 44, 45
Operating temperature range, 8
P
PCB, 11
PCS, 7, 46, 48
Performance Test, 16
Phone Book, 64
phonebook, 64
point to point, 9
power, 8, 13, 25, 29, 30, 32, 39, 40, 41, 46, 48,
52
power supply, 25, 41
Power supply, 8, 25
R
radio, 13, 16, 48, 65
Real Time Clock, 9
RF, 7, 10, 12, 13, 14, 15, 16, 17, 19, 46, 48, 52
Ring Indicator, 19, 27
RST, 20, 32, 33, 43
S
serial link, 9, 27, 52
Signal, 27, 29, 31, 32, 33, 34, 35, 36, 38, 39,
40, 41, 43, 44, 45, 63
SIM, 7, 8, 9, 10, 12, 19, 22, 41, 42, 43, 46, 49,
52, 55, 56
SIM Toolkit, 9
SIMCLK, 22, 41, 42, 43
SIMDATA, 22, 41, 42, 43
SIMPRES, 41
SIMRST, 22, 41, 42, 43
SIMVCC, 22, 41, 42, 43
SMS, 7, 8, 9, 56
socket, 22, 41
speaker, 36, 39, 40, 52
Speaker, 19, 20, 39, 40, 63
SPI, 21, 22, 44
SPK1N, 20, 40
SPK1P, 20, 40
Storage temperature, 8
T
Telephony, 8
terminal, 52
Tricodec, 8
U
UCS2, 9
USSD, 9
V
V.42bis, 9
VCC, 20, 21, 22, 43
voice, 7, 63, 66
Volume, 8
W
WAP, 56
Weight, 8
Integra, 1, 3, 6, 7, 10, 11, 13, 16, 17, 18, 28,
29, 31, 32, 34, 46, 52
X
Xmodem, 9
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March 2002/ version 1.6
Integra
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Integra
Figures
figure 1 : mechanical description........................................................................................................... 10
figure 2 : mechanical description II........................................................................................................ 11
figure 3 : 50-pin connector..................................................................................................................... 21
figure 4 : pin numbering/bottom view .................................................................................................... 22
figure 5* : level shifter application diagram for serial link ...................................................................... 25
figure 6 : power OFF procedure 1 ......................................................................................................... 26
figure 7 : power OFF procedure 2 ......................................................................................................... 26
figure 8 : boot procedure ....................................................................................................................... 27
figure 9 : reset procedure ...................................................................................................................... 28
figure 10 : microphone 2 input............................................................................................................... 31
figure 11 : microphone 1 input............................................................................................................... 32
figure 12 : speaker 2 output................................................................................................................... 33
figure 13 : speaker 1 output................................................................................................................... 34
Figure 14: SIM socket............................................................................................................................ 37
Figure 15: high and low profile CLP connectors.................................................................................... 40
Figure 16: flexible flat cable................................................................................................................... 40
Figure 17: flex cable connector ............................................................................................................. 40
Figure 18: MMCX connector example (right angle) .............................................................................. 41
Figure 19: Integra demoboard description ............................................................................................ 43
Tables
Table 1 : Wavecom acceptance test ..................................................................................................... 15
Table 2 : 50-pin connector description .................................................................................................. 18
Table 3 : operating conditions ............................................................................................................... 20
Table 4 : power supply pin description .................................................................................................. 22
Table 5 : Power consumption in EGSM mode @ 25°C......................................................................... 23
Table 6 : Power consumption in GSM 1800 and1900 mode @ 25°C................................................... 23
Table 7 : Serial Link pin description ...................................................................................................... 24
Table 8 : ON / OFF pin description........................................................................................................ 26
Table 9 : BOOT pin description ............................................................................................................. 27
Table 10 : reset signal pin description................................................................................................... 28
Table 11 : reset signal electrical characteristics.................................................................................... 28
Table 12 : reset signal operating conditions.......................................................................................... 28
Table 13 : the flashing LED pin description........................................................................................... 29
Table 14 : LED and Integra status......................................................................................................... 29
Table 15 : General Purpose pin description .......................................................................................... 29
Table 16 : A/D converter pin description ............................................................................................... 30
Table 17 : A/D converter electrical characteristics ................................................................................ 30
Table 18 : microphone 2 input pin description....................................................................................... 31
Table 19 : microphone 1 input pin description....................................................................................... 32
Table 20 : speaker 2 output pin description .......................................................................................... 33
Table 21 : speaker 1 output pin description .......................................................................................... 34
Table 22 : SIM interface pin description ................................................................................................ 35
Table 23 : SIM interface electrical characteristics ................................................................................. 36
Table 24 : SIM socket pin description ................................................................................................... 36
Table 25 : SPI Bus pin description ........................................................................................................ 37
Table 26 : keypad interface pin description........................................................................................... 38
Table 27 : radio characteristics.............................................................................................................. 41
Table 28 : climatic and mechanical environment ..................................................................................42
Table 29 : minimum signals to operate the Integra ...............................................................................45
Table 31 : GSM ETSI recommendations for Phase I and Phase II....................................................... 46
Table 30 : AT command list................................................................................................................... 54
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March 2002/ version 1.6
Integra
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Integra
12 Annexes
12.1 Mechanical specifications
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March 2002/ version 1.6
Integra
12.2 3V/5V SIM management
12.3 AT command list
For comprehensive information about AT Commands, please read the AT Commands user’s guide
Table 30 : AT command list
General Commands
+CGMI Manufacturer Identification
+CGMM Request Model Identification
+CGMR Request Revision Identification
+CGSN Product Serial Number
+CSCS Select TE Character Set
+CIMI Request IMSI
+CCID Card Identification
+GCAP Capabilities List
A/ Repeat Last Command
+CPOF Power Off
+CFUN Set Phone Functionality
+CPAS Phone Activity Status
+CMEE Report Mobile Equipment Errors
+CKPD Keypad Control
+CCLK Clock management
+CALA Alarm management
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March 2002/ version 1.6
Integra
Call Control Commands
D Dial command
H Hang-up Command
A Answer a Call
+CEER Extended Error Report
+VTD, +VTS DTMF Signals
ATDL Redial Last Telephone Number
AT%Dn Automatic Dialing (or SMS send) with DTR
ATSO Automatic Answer
+CICB Incoming Call Bearer
+VGR, +VGT Gain Control
+CMUT Microphone Mute Control
+SPEAKER Speaker and Microphone Selection
+ECHO Echo Cancellation
+SIDET Side Tone Modification
+VIP Initialize Voice Parameters
+CSNS Single Numbering Scheme
Network Service Commands
+CSQ Signal Quality
+COPS Operator Selection
+CREG Network Registration
+WOPN Read Operator Name
+CPOL Preferred Operator List
Security Commands
+CPIN Enter PIN
+CPIN2 Enter PIN2
+CPINC PIN Remaining Attempt Number
+CLCK Facility Lock
+CPWD Change Password
Phone Book Commands
+CPBS Select Phone Book Memory Storage
+CPBR Read Phone Book Entries
+CPBF Find Phone Book Entries
+CPBW White Phone Book Entry
+CPBP Phone Book Phone Search
+CPBN Move Action in Phone Book
+CNUM Subscriber Number
+WAIP Avoid Phone Book Init
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Integra
Short Message Commands
+CSMS Select Message Service
+CNMA New Message Acknowledgement
+CPMS Preferred Message Storage
+CMGF Preferred Message Format
+CSAS Save Settings
+CRES Restore Settings
+CSDH Show Text Mode parameters
+CNMI New Message Indication
+CMGR Read Message
+CMGL List Message
+CMGS Send Message
+CMGW Write Message to Memory
+CMSS Send Message from Storage
+CSMP Set Text Mode Parameters
+CMGD Delete Message
+CSCA Service Center Address
+CSCB Select Cell Broadcast Message Types
+WCBM Cell Broadcast Message Identifiers
+WMSC Message Status Modification
+WMGO Message Overwriting
Supplementary Services Commands
+CCFC Call Forwarding
+CLCK Call Barring
+CPWD Modify SS Password
+CCWA Call Waiting
+CLIR Calling Line Identification Restriction
+CLIP Calling Line Identification Presentation
+COLP Connected Line Identification Presentation
+CAOC Advice Of Charge
+CACM AccumulatedCcall Meter
+CAMM Accumulated Call Meter Maximum
+CPUC Price Per Unit and Currency Table
+CHLD Call Related Supplementary Services
+CLCC List Current Calls
+CSSN Supplementary Service Notifications
+CUSD Unstructured Supplementary Service Data
+CCUG Closed User Group
Data Commands
+CBST Bearer Type Selection
+FCLASS Select Mode
+CR Service Reporting Control
+CRC Cellular Result Codes
+ILRR DTE-DCE Local Rate Reporting
+CRLP Radio Link Protocol Parameters
+DOPT Others Radio Link Parameters
%C Select Data Compression
+DS V42 bis Data Compression
+DR V42 bis Data Compression Report
\N Select Data Error Correcting Mode
confidential © 56/60
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written
agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans
son autorisation préalable.
March 2002/ version 1.6
Integra
Fax Commands
+FTM Transmit Speed
+FRM Receive Speed
+FTH HDLC Transmit Speed
+FRH HDLC Receive Speed
+FTS Stop Transmission and Wait
+FRS Receive Silence
Fax Class 2 Commands
+FDT Transmit Data
+FDR Receice Data
+FET Transmit Page Punctuation
+FPTS Page Transfer Status Parameters
+FK Terminate Session
+FBOR Page Transfer Bit Order
+FBUF Buffer Size Report
+FCQ Copy Quality Checking
+FCR Capability to Receive
+FDIS Current Sessions Parameters
+FDCC DCE Capabilities Parameters
+FLID Local ID String
+FPHCTO Page Transfer Timeout Parameter
V24-V25 Commands
+IPR Fixed DTE Rate
+ICF DTE-DCE Character Framing
+IFC DTE-DCE Local Flow Control
&C Set DCD Signal
&D Set DTR Signal
&S Set DSR Signal
O Back to Online Mode
Q Result Code Suppression
V DCE Response Format
Z Default Configuration
&W Save Configuration
&T Auto-Tests
E Echo
&F Restore Factory Settings
&V Display Configuration
I Request Identification Information
SIM Toolkit Commands
+STSF SIM Toolkit Set Facilities
+STIN SIM Toolkit Indication
+STGI SIM Toolkit Get Information
+STCR SIM Toolkit Control Response
+STGR SIM Toolkit Give Response
confidential © 57/60
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written
agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans
son autorisation préalable.
March 2002/ version 1.6
Integra
Specific AT Commands
+CCED Cell Environment Description
+CCED Automatic RxLev Indication
+WIND General Indications
+ADC Analog Digital Converters Measurements
+CMER Mobile Equipment Event Reporting
+WLPR Read Language Preference
+WLPW Write Language Preference
+WIOR Read GPIO Value
+WIOW Write GPIO Value
+WAC Abort Command
+WTONE Play Tone
+WDTMF Play DTMF Tone
+WDWL Wavecom Downloading
+WVR Wavecom Voice Rate
+WDR Data Rate
+WHWV Hardware Version
+WDOP Date Of Production
+WSVG Wavecom Select Voice Gain
+WSTR Wavecom Status Request
+WSCAN Wavecom Scan
+WRIM Ring Indicator Mode
+W32K Power saving mode
confidential © 58/60
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written
agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans
son autorisation préalable.
March 2002/ version 1.6
Integra
13 RF exposure instructions
Pursuant to 47 CFR § 24.52 of the FCC Rules and Regulations, personnal
communications services (PCS) equipment is subject to the radiofrequency radiation exposure
requirements specified in § 1.1307(b), § 2.1091 and § 2.1093 as approporiate.
The Wavecom Modem is a GSM (PCS 1900) terminal which operates in the US
licensed PCS frequency spectrum. The device transmits over the 1850-1910 MHz band and
receives over the 1930-1990 MHz Band.
Wavecom, Inc. certifies that it has determined that the Modem complies with the RF
hazard requirements applicable to broadband PCS equipment operating under the authority of
47 CFR Part 24, Subpart E of the FCC Rules and Regulations. This determination is
dependent upon installation, operation and use of the equipment in accordance with all
instructions provided.
The Modem is designed for and intended to be used in fixed and mobile applications.
"Fixed" means that the device is physically secured at one location and is not able to be easily
moved to another location. "Mobile" means that the device is designed to be used in other
than fixed locations and generally in such a way that a separation distance of at least 20 cm is
normally maintained between the transmitter's antenna and the body of the user or nearby
persons. The Modem is not designed for or intended to be used in portable applications
(within 20 cm of the body of the user) and such uses are strictly prohibited.
To ensure that the unit complies with current FCC regulations limiting both maximum
RF output power and human exposure to radiofrequency radiation, a separation distance of at
least 20 cm must be maintained between the unit's antenna and the body of the user and any
nearby persons at all times and in all applications and uses. Additionally, in mobile
applications, maximum antenna gain must not exceed 3 dBi (to comply with Section 24.232(b)
and is limited to7 dBi for fixed applications. Finally, the tune-up procedure for the O9EM2113
ensures that the maximum RF output power of the device does not exceed 30.0 dBm within
the variations that can be expected due to quantity production and testing on a statistical
basis.
confidential © 59/60
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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans
son autorisation préalable.
March 2002/ version 1.6
Integra
14 Instructions to OEM
Wavecom User’s manual includes specific warnings and cautions in order to ensure that OEMs
are aware of their responsibilities, with regards to RF exposure compliance, for products into which the
modem is integrated. With this guidance, the OEM will be able to incorporate into their documentation
the necessary operating conditions and warnings.
OEMs need to provide a manual with the ‘’final’’ product that clearly states the operating
requirements and conditions and that these must be observed to ensure compliance with current FCC
RF exposure requirements / MPE limits (refer to chapter 13. RF exposure instructions ). This will
enable the OEM to generate (and provide the end-user with) the appropriate operating instructions,
warnings and cautions, and/or markings for their product.
confidential © 60/60
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agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans
son autorisation préalable.