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Intel® NUC
Board D53427RKE
Technical Product Specification

May 2013
Order Number: G97389-001

The Intel NUC Board D53427RKE may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel NUC Board D53427RKE Specification Update.

Revision History
Revision
001

Revision History

Date
®

First release of the Intel
Specification

NUC Board D53427RKE Technical Product

May 2013

Disclaimer
This product specification applies to only the standard Intel® NUC Board with BIOS identifier
RKPPT10H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All Intel® NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel NUC Boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.

Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright  2013, Intel Corporation. All rights reserved.

Board Identification Information
Basic Intel® NUC Board D53427RKE Identification Information
AA Revision

BIOS Revision

Notes

G87790-400

RKPPT10H.86A.0017

1,2

Notes:
1.

The AA number is found on a small label on the component side of the board.

The Intel® QS77 PCH and Intel® Core™ i5-3427U processor used on this AA revision consists
of the following components:

Device

Stepping

S-Spec Numbers

Intel Core i5-3427U

SR0N7

Intel BD82QS77

5A002U

Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See www.intel.com/nextunitofcomputing for the latest documentation.

iii

Intel NUC D53427RKE Technical Product Specification

Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel® NUC
Board D53427RKE.

Intended Audience
The TPS is intended to provide detailed, technical information about Intel NUC Board
D53427RKE and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.

What This Document Contains
Chapter

Description

A description of the hardware used on Intel NUC Board D53427RKE

A map of the resources of the Intel NUC Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

Regulatory compliance and battery disposal information

Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.

CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel NUC D53427RKE Technical Product Specification

Other Common Notation

Used after a signal name to identify an active-low signal (such as USBP0#)

Gigabyte (1,073,741,824 bytes)

GB/s

Gigabytes per second

Gb/s

Gigabits per second

Kilobyte (1024 bytes)

Kilobit (1024 bits)

kb/s

1000 bits per second

Megabyte (1,048,576 bytes)

MB/s

Megabytes per second

Megabit (1,048,576 bits)

Mb/s

Megabits per second

TDP

Thermal Design Power

xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

Contents
Revision History
Disclaimer ................................................................................................ ii
Board Identification Information .................................................................. iii
Errata ......................................................................................................iii

Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v

1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout (Top) ............................................................... 13
1.1.3 Board Layout (Bottom) .......................................................... 15
1.1.4 Block Diagram ...................................................................... 17
1.2 Online Support ................................................................................. 18
1.3 Processor ........................................................................................ 18
1.4 System Memory ............................................................................... 19
1.4.1 Memory Configurations .......................................................... 20
1.5 Intel® QS77 Express Chipset .............................................................. 22
1.5.1 Direct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces ................................................................. 22
1.6 Graphics Subsystem ......................................................................... 23
1.6.1 Integrated Graphics ............................................................... 23
1.6.2 USB ..................................................................................... 25
1.6.3 AHCI Mode ........................................................................... 25
1.7 Real-Time Clock Subsystem ............................................................... 26
1.8 LAN Subsystem ................................................................................ 26
1.8.1 Intel® 82579LM Gigabit Ethernet Controller .............................. 27
1.8.2 LAN Subsystem Software ....................................................... 27
1.8.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.9 Hardware Management Subsystem ..................................................... 29
1.9.1 Hardware Monitoring ............................................................. 29
1.9.2 Fan Monitoring ...................................................................... 29
1.9.3 Thermal Solution ................................................................... 30
1.10 Power Management .......................................................................... 31
1.10.1 ACPI .................................................................................... 31
1.10.2 Hardware Support ................................................................. 33
1.11 Intel® Security and Manageability Technologies .................................... 36
1.11.1 Intel® vPro™ Technology ........................................................ 36
1.11.2 Intel® Small Business Technology ............................................ 39

vii

Intel NUC D53427RKE Technical Product Specification

2 Technical Reference
2.1 Memory Resources ........................................................................... 41
2.1.1 Addressable Memory ............................................................. 41
2.2 Connectors and Headers .................................................................... 42
2.2.1 Back Panel Connectors ........................................................... 43
2.2.2 Connectors and Headers (Bottom) ........................................... 44
2.3 BIOS Setup Configuration Jumper ....................................................... 52
2.4 Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header . 53
2.5 Mechanical Considerations ................................................................. 55
2.5.1 Form Factor .......................................................................... 55
2.6 Electrical Considerations .................................................................... 56
2.6.1 Power Supply Considerations .................................................. 56
2.6.2 Fan Header Current Capability ................................................ 57
2.7 Thermal Considerations ..................................................................... 57
2.8 Reliability......................................................................................... 60
2.9 Environmental .................................................................................. 60

3 Overview of BIOS Features
3.1
3.2
3.3
3.4
3.5
3.6
3.7

3.8
3.9

Introduction ..................................................................................... 61
BIOS Flash Memory Organization ........................................................ 62
System Management BIOS (SMBIOS) ................................................. 62
Legacy USB Support ......................................................................... 62
BIOS Updates .................................................................................. 63
3.5.1 Language Support ................................................................. 63
3.5.2 Custom Splash Screen ........................................................... 64
BIOS Recovery ................................................................................. 64
Boot Options .................................................................................... 65
3.7.1 Network Boot........................................................................ 65
3.7.2 Booting Without Attached Devices ........................................... 65
3.7.3 Changing the Default Boot Device During POST ......................... 65
Hard Disk Drive Password Security Feature .......................................... 66
BIOS Security Features ..................................................................... 67

4 Error Messages and Blink Codes
4.1 Front-panel Power LED Blink Codes ..................................................... 69
4.2 BIOS Error Messages ........................................................................ 69

5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 71
5.1.1 Safety Standards................................................................... 71
5.1.2 European Union Declaration of Conformity Statement ................ 72
5.1.3 Product Ecology Statements ................................................... 73
5.1.4 EMC Regulations ................................................................... 74
5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 76
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 77
5.2 Battery Disposal Information .............................................................. 78

viii

Contents

Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.

Major Board Components (Top) .......................................................... 13
Major Board Components (Bottom) ..................................................... 15
Block Diagram .................................................................................. 17
Memory Channel and SO-DIMM Configuration ...................................... 21
LAN Connector LED Locations ............................................................. 28
Thermal Solution and Fan Header ....................................................... 30
Location of the Standby Power LED ..................................................... 35
Back Panel Connectors ...................................................................... 43
Connectors and Headers (Bottom) ...................................................... 44
Connection Diagram for Front Panel Header ......................................... 50
Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 51
Location of the BIOS Configuration Setup Jumper ................................. 52
Intel MEBX Reset Header ................................................................... 54
Board Dimensions ............................................................................. 55
Localized High Temperature Zones ..................................................... 58
Intel Visual BIOS Home Screen .......................................................... 61

Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.

Feature Summary ............................................................................. 11
Components Shown in Figure 1 .......................................................... 14
Components Shown in Figure 2 .......................................................... 16
Supported Memory Configurations ...................................................... 19
Triple Display Configuration Resolutions .............................................. 24
LAN Connector LED States ................................................................. 28
Effects of Pressing the Power Switch ................................................... 31
Power States and Targeted System Power ........................................... 32
Wake-up Devices and Events ............................................................. 33
Connectors and Headers Shown in Figure 10 ........................................ 45
PCI Express Full-/Half-Mini Card Connector .......................................... 46
Dual-Port Front Panel USB 2.0 Header ................................................. 48
19 V Internal Power Supply Connector ................................................ 49
Front Panel Header ........................................................................... 49
States for a One-Color Power LED....................................................... 50
BIOS Setup Configuration Jumper Settings .......................................... 53
Intel MEBX Reset Header Signals ........................................................ 54
Fan Header Current Capability ............................................................ 57
Thermal Considerations for Components .............................................. 59
Tcontrol Values for Components ......................................................... 59
Environmental Specifications .............................................................. 60
Acceptable Drives/Media Types for BIOS Recovery................................ 64
Boot Device Menu Options ................................................................. 65
Master Key and User Hard Drive Password Functions ............................ 66
Supervisor and User Password Functions ............................................. 67
Front-panel Power LED Blink Codes ..................................................... 69

Intel NUC D53427RKE Technical Product Specification

27.
28.
29.
30.

BIOS Error Messages ........................................................................ 69
Safety Standards .............................................................................. 71
EMC Regulations ............................................................................... 74
Regulatory Compliance Marks ............................................................ 77

Product Description

1.1

Overview

1.1.1

Feature Summary

Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

Processor

• Soldered-down Intel® Core™ i5-3427U processor with up to 17 W TDP
― Integrated graphics
― Integrated memory controller

Memory

• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module
(SO-DIMM) sockets
• Support for DDR3 1600 MHz and DDR3 1333 MHz SO-DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory

Chipset

Intel® QS77 Express Chipset consisting of the Intel® QS77 Express Platform
Controller Hub (PCH)

Graphics

• Integrated graphics support for processors with Intel® Graphics Technology:
― One High Definition Multimedia Interface* (HDMI*) back panel connector
― Two mini DisplayPort* back panel connectors

Audio

Intel® High Definition Audio via the HDMI v1.4a and DisplayPort 1.1a interfaces
through the PCH

Peripheral
Interfaces

• USB 2.0 ports:
― Two front panel ports are implemented through one dual-port internal
header
― Two ports are implemented with vertical back panel connectors
― One port is reserved for the PCI Express* Half-Mini Card
― One port is reserved for the PCI Express Full-Mini Card
• One front panel USB 3.0 port is implemented through an external connector
(blue)

Expansion
Capabilities

• One PCI Express Half-Mini Card connector

Intel® Visual BIOS

• Intel® Visual BIOS resident in the Serial Peripheral Interface (SPI) Flash
device

• One PCI Express Full-Mini Card connector

• Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)

continued

Intel NUC D53427RKE Technical Product Specification

Table 1. Feature Summary (continued)
LAN Support

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® 82579LM Gigabit
Ethernet Controller

Hardware Monitor
Subsystem

Hardware monitoring subsystem, based on a Nuvoton NCT5577D embedded
controller, including:
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• One processor fan header
• Fan sense input used to monitor fan activity
• Simple fan speed control

Intel Security and
Manageability
Technologies

• Intel® Active Management Technology (Intel® AMT) 8.0
• Intel® Virtualization (Intel® VT)
• Intel® Virtualization for Directed I/O (Intel® VT-d)
• Intel® Trusted Execution Technology (Intel® TXT)
• Intel® Identity Protection Technology (Intel® IPT)
• Intel® Anti-Theft Technology (Intel® AT)
• Trusted Platform Module (TPM)
• Intel® Small Business Technology (Intel® SBT)

Product Description

1.1.2

Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC
Board D53427RKE.

Figure 1. Major Board Components (Top)

Intel NUC D53427RKE Technical Product Specification

Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1

Item from Figure 1

Description

Standby power LED

Battery

Processor fan header

Onboard power button

Power LED

Hard Disk Drive LED

Thermal solution

Product Description

1.1.3

Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC
Board D53427RKE.

Figure 2. Major Board Components (Bottom)

Intel NUC D53427RKE Technical Product Specification

Table 3. Components Shown in Figure 2

Item from
Figure 2

Description

Back panel connectors

PCI Express Full-Mini Card connector

PCI Express Half-Mini Card connector

Front panel dual-port USB 2.0 header

Front panel USB 3.0 port

BIOS setup configuration jumper

Front panel header

Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header

DDR3 SO-DIMM 2 socket

DDR3 SO-DIMM 1 socket

Internal DC power connector

Product Description

1.1.4

Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

Intel NUC D53427RKE Technical Product Specification

1.2

1.3

Online Support
To find information about…

Visit this World Wide Web site:

Intel NUC Board D53427RKE

http://www.intel.com/products/motherboard/index.htm

NUC Board Support

http://www.intel.com/p/en_US/support?iid=hdr+support

Available configurations for Intel NUC
Board D53427RKE

http://ark.intel.com

Chipset information

https://wwwssl.intel.com/content/www/us/en/chipsets/performancechipsets/chipsets.html

BIOS and driver updates

http://downloadcenter.intel.com

Tested memory

http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm

Integration information

http://www.intel.com/support/go/buildit

Processor

The board has a soldered-down Intel Core i5-3427 processor with Integrated Graphics
Technology and integrated memory controller.

NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.

Product Description

1.4

System Memory

The board has two 204-pin SO-DIMM sockets and supports the following memory
features:
•
•
•
•
•

•
•
•
•

1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts
Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)
Two independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided SO-DIMMs
16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
Minimum recommended total system memory: 1024 MB
Non-ECC SO-DIMMs
Serial Presence Detect
DDR3 1600 MHz and DDR3 1333 MHz SDRAM SO-DIMMs

NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.
Table 4 lists the supported SO-DIMM configurations.
Table 4. Supported Memory Configurations
SO-DIMM
Capacity
1024 MB
2048 MB
2048 MB
4096 MB
4096 MB
8192 MB
Note:

Configuration (Note)
SS
DS
SS
DS
SS
DS

SDRAM
Density
1 Gbit
1 Gbit
2 Gbit
2 Gbit
4 Gbit
4 Gbit

SDRAM Organization
Front-side/Back-side
128 M x8/empty
128 M x8/128 M x8
256 M x8/empty
256 M x8/256 M x8
512 M x8/empty
512 M x8/512 M x8

Number of SDRAM
Devices
8
16
8
16
8
16

“DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).

For information about…

Refer to:

Tested Memory

http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm

Intel NUC D53427RKE Technical Product Specification

1.4.1

Memory Configurations

The processor supports the following types of memory organization:
•

•

Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.

For information about…

Refer to:

Memory Configuration Examples

http://www.intel.com/support/motherboards/desktop/sb/cs011965.htm

Product Description

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Intel NUC D53427RKE Technical Product Specification

Intel® QS77 Express Chipset

1.5

Intel QS77 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces.
The Intel QS77 Express Chipset is a centralized controller for the board’s I/O paths.
For information about

Refer to

The Intel QS77 chipset

http://www.intel.com/products/desktop/chipsets/index.htm

Resources used by the chipset

Chapter 2

1.5.1

Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.

1.5.2

Display Interfaces

Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports. The PCH receives the display data over Intel® Flexible Display
Interface (Intel® FDI) and transcodes the data as per the display technology protocol
and sends the data through the display interface.

1.5.2.1

Intel® Flexible Display Interconnect (Intel® FDI)

Intel FDI connects the display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the display monitor.

1.5.2.2

High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized
copy or unreceptive between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDMI).

Product Description

1.6

Graphics Subsystem

The board supports graphics through Intel Graphics Technology.

1.6.1

Integrated Graphics

The board supports integrated graphics through Intel FDI.

Intel® High Definition (Intel® HD) Graphics

1.6.1.1

The Intel HD graphics controller features the following:
•

3D Features
 DirectX* 10.1 and OpenGL* 3.0 compliant
 DirectX 11.0 CS4.0 only

•

 Shader Model 4.0
Video
 High-Definition content at up to 1080p resolution
 Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video
formats
 Intel HD Technology with Advanced Hardware Video Transcoding
 Blu-ray* S3D via HDMI 1.4a
 Dynamic Video Memory Technology (DVMT) 5.0 support
 Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration

1.6.1.2

Video Memory Allocation
®

Intel Dynamic Video Memory Technology (DVMT) is a method for dynamically
allocating system memory for use as graphics memory to balance 2D/3D graphics and
system performance. If your computer is configured to use DVMT, graphics memory is
allocated based on system requirements and application demands (up to the
configured maximum amount). When memory is no longer needed by an application,
the dynamically allocated portion of memory is returned to the operating system for
other uses.

1.6.1.3

High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. Each port is compatible with all ATSC and DVB
HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of
lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The
maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant
with the HDMI 1.4a specification.

Intel NUC D53427RKE Technical Product Specification

1.6.1.3.1

Integrated Audio Provided by the HDMI Interface

The following audio technologies are supported by the HDMI 1.4a interface directly
from the PCH:
•
•
•
•
•

AC-3 - Dolby* Digital
Dolby Digital Plus
DTS-HD*
Dolby TrueHD, DTS-HD Master Audio*, (Lossless Blu-ray Disc* Audio Format
LPCM, 192 kHz/24-bit, 8 Channel

1.6.1.4

DisplayPort*

DisplayPort is a digital communication interface that utilizes differential signaling to
achieve a high bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPort is suitable for display
connections between consumer electronics devices such as high definition optical disc
players, set top boxes, and TV displays. The DisplayPort interface supports the 1.1a
specification. There are two mini DisplayPort connectors on the back panel.
DisplayPort’s maximum supported display resolution is 2560 x 1600 @ 60 Hz refresh
rate with a 16:10 aspect ratio (WQXGA).
For information about

Refer to

DisplayPort technology

http://www.displayport.org

1.6.1.4.1

Integrated Audio Provided by the DisplayPort Interfaces

The mini DisplayPort interfaces support LPCM 96 KHz/24-bit, 2-channel audio directly
through the PCH.

NOTE
The PCH only supports one audio stream at a time over DisplayPort. Dual audio
signals are not supported.
1.6.1.4.2

Triple Display Configurations

For triple display configurations, at least two displays must be connected to native
DisplayPort monitors. Use of DisplayPort converters will not allow triple display
outputs.
Table 5. Triple Display Configuration Resolutions

Active Display

DisplayPort
2560 x 1600 at 60 Hz

DisplayPort
1920 x 1200 at 60 Hz

HDMI*
1080P at 60 Hz

Product Description

1.6.1.5

High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized
copy or interception between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDMI and DisplayPort).

1.6.2

USB

The board supports USB 2.0/3.0 ports. The port arrangement is as follows:
•

USB 2.0 ports:
 Two front panel ports are implemented through one dual-port internal header
 Two ports are implemented with vertical back panel connectors
 One port is reserved for the PCI Express Half-Mini Card

•

 One port is reserved for the PCI Express Full-Mini Card
One front panel USB 3.0 port is implemented through an external connector (blue)

All USB 2.0/3.0 ports are high-speed, full-speed, and low-speed capable.

NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.
For information about

Refer to

The location of the USB connectors on the back panel

Figure 9, page 43

The location of the front panel USB headers

Figure 2, page 15

1.6.3

AHCI Mode

The board supports AHCI storage mode via the Intel QS77 Express Chipset.

NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft Windows 7
and Windows 8 include the necessary AHCI drivers without the need to install separate
AHCI drivers during the operating system installation process, however, it is always
good practice to update the AHCI drivers to the latest available by Intel.

Intel NUC D53427RKE Technical Product Specification

1.7

Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied via the power supply 5 V STBY rail.

NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.8

LAN Subsystem

The LAN subsystem consists of the following:
•
•
•

Intel 82579LM Gigabit Ethernet Controller (10/100/1000 Mb/s)
Intel QS77 Express Chipset
RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• Jumbo frame support
• LAN connect interface between the PCH and the LAN controller
• Power management capabilities
 ACPI technology support
•

 LAN wake capabilities
LAN subsystem software

For information about

Refer to

LAN software and drivers

http://downloadcenter.intel.com

Product Description

1.8.1

Intel® 82579LM Gigabit Ethernet Controller

The Intel 82579LM Gigabit Ethernet Controller supports the following features:
•
•
•

10/100/1000 BASE-T IEEE 802.3 compliant
Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle (LPI) mode)
Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
 PCI Express-based interface for active state operation (S0) state

•
•
•
•

1.8.2

 SMBUS for host and management traffic (Sx low power state)
Compliant to IEEE 802.3x flow control support
802.1p and 802.1q
TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
Full device driver compatibility

LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.
For information about

Refer to

Obtaining LAN software and drivers

http://downloadcenter.intel.com

Intel NUC D53427RKE Technical Product Specification

1.8.3

RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item

Description

Link LED (Green)

Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 6 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 6. LAN Connector LED States
LED

LED Color

LED State

Condition

Off

LAN link is not established.

Link

Green

LAN link is established.

Blinking

LAN activity is occurring.

Off

10 Mb/s data rate is selected.

Green

100 Mb/s data rate is selected.

Yellow

1000 Mb/s data rate is selected.

Data Rate

Green/Yellow

Product Description

1.9

Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including thermal and voltage monitoring.
For information about

Refer to

Wired for Management (WfM) Specification

www.intel.com/design/archives/wfm/

1.9.1

Hardware Monitoring

The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577D
embedded controller, which supports the following:
•
•
•
•

1.9.2

Processor and system ambient temperature monitoring
Chassis fan speed monitoring
Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp, PCH Vcc
SMBus interface

Fan Monitoring

Fan monitoring can be implemented using third-party software.

Intel NUC D53427RKE Technical Product Specification

1.9.3

Thermal Solution

Figure 6 shows the location of the thermal solution and processor fan header.

Item

Description

Processor fan header

Thermal solution

Figure 6. Thermal Solution and Fan Header

Product Description

1.10 Power Management
Power management is implemented at several levels, including:
•
•

Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
 Power Input
 Instantly Available PC technology
 LAN wake capabilities
 Wake from USB
 WAKE# signal wake-up support
 Wake from S5
 +5 V Standby Power Indicator LED

1.10.1

ACPI

ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
•
•
•
•
•
•

Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 9 on page 33)
Support for a front panel power and sleep mode switch

Table 7 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
If the system is in this
state…

…and the power switch is
pressed for

Off
(ACPI G2/G5 – Soft off)

Less than four seconds

Power-on
(ACPI G0 – working state)

On
(ACPI G0 – working state)

Less than four seconds

Soft-off/Standby
(ACPI G1 – sleeping state)

On
(ACPI G0 – working state)

More than six seconds

Fail safe power-off
(ACPI G2/G5 – Soft off)

Sleep
(ACPI G1 – sleeping state)

Less than four seconds

Wake-up
(ACPI G0 – working state)

Sleep
(ACPI G1 – sleeping state)

More than six seconds

Power-off
(ACPI G2/G5 – Soft off)

…the system enters this state

Note

Note: Depending on power management settings in the operating system.

Intel NUC D53427RKE Technical Product Specification

1.10.1.1

System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 8 lists the power states supported by the board along with the associated system
power targets. See the ACPI specification for a complete description of the various
system and power states.
Table 8. Power States and Targeted System Power
Global States

Sleeping States

Processor
States

G0 – working
state

S0 – working

C0 – working

D0 – working
state.

Full power > 30 W

G1 – sleeping
state

S3 – Suspend to
RAM. Context
saved to RAM.

No power

D3 – no power
except for
wake-up logic.

Power < 5 W

(Note 2)

G1 – sleeping
state

S4 – Suspend to
disk. Context
saved to disk.

No power

D3 – no power
except for
wake-up logic.

Power < 5 W

(Note 2)

G2/S5

S5 – Soft off.
Context not saved.
Cold boot is
required.

No power

D3 – no power
except for
wake-up logic.

Power < 5 W

(Note 2)

G3 –
mechanical off

No power to the
system.

No power

D3 – no power for
wake-up logic,
except when
provided by
battery or
external source.

No power to the system.
Service can be performed
safely.

AC power is
disconnected
from the
computer.

Device States

Targeted System
Power (Note 1)

Notes:

Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.

Dependent on the standby power consumption of wake-up devices used in the system.

Product Description

1.10.1.2

Wake-up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific
states.
Table 9. Wake-up Devices and Events
Devices/events that wake up the system…

…from this sleep state

Power switch

S3, S4, S5

RTC alarm

S3, S4, S5

LAN

S3, S4, S5

USB

WAKE#

S3, S4, S5

(Note

(Note 1)
(Notes 1 and 3)

…from this global state
G1, G2, G3
G1, G2
G1, G2

(Note 3)
(Note 3)

G1
(Note 1)

G1, G2

(Note 3)

Notes:
1.

S4 implies operating system support only.

Wake from S4 and S5 is recommended by Microsoft.

Wake from device/event not supported immediately upon return from AC loss.

Wake on LAN is only supported from sleep (S3) or hibernate (S4) in Windows 8.

NOTE
The use of these wake-up events from an ACPI state requires an operating system that
provides full ACPI support. In addition, software, drivers, and peripherals must fully
support ACPI wake events.

1.10.2

Hardware Support

The board provides several power management hardware features, including:
•
•
•
•
•
•
•

Wake from Power Button signal
Instantly Available PC technology
LAN wake capabilities
Wake from USB
WAKE# signal wake-up support
Wake from S5
+5 V Standby Power Indicator LED

NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.

Intel NUC D53427RKE Technical Product Specification

1.10.2.1

Power Input

When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about

Refer to

The location of the internal power connector

Figure 2, page 15

The signal names of the internal power connector

Table 13, page 49

1.10.2.2

Instantly Available PC Technology

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 9 on page 33 lists the devices and events that can
wake the computer from the S3 state.
The use of Instantly Available PC technology requires operating system support and
drivers for any installed PCI Express add-in card.

1.10.2.3

LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The
LAN subsystem monitors network traffic at the Media Independent Interface. Upon
detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that
powers up the computer.

1.10.2.4

Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.10.2.5

WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.

1.10.2.6

Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from an ACPI S5 state.

Product Description

1.10.2.7

+5 V Standby Power Indicator LED

The standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power LED.

CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.

Figure 7. Location of the Standby Power LED

Intel NUC D53427RKE Technical Product Specification

1.11 Intel® Security and Manageability
Technologies
Intel® Security and Manageability Technologies provides tools and resources to help
small business owners and IT organizations protect and manage their assets in a
business or institutional environment.

NOTE
Software with security and/or manageability capability is required to take advantage of
Intel platform security and/or management technologies.

1.11.1

Intel® vPro™ Technology

Intel® vPro™ Technology is a collection of platform capabilities that support enhanced
manageability, security, virtualization and power efficiency. The key platform
capabilities include:
•
•
•
•
•
•
•

Intel® Active Management Technology (Intel® AMT) 8.0
Intel® Virtualization (Intel® VT)
Intel® Virtualization for Directed I/O (Intel® VT-d)
Intel® Trusted Execution Technology (Intel® TXT)
Intel® Identity Protection Technology (Intel® IPT)
Intel® Anti-Theft Technology (Intel® AT)
Trusted Platform Module (TPM)

For information about

Refer to

Intel vPro Technology

http://support.intel.com/support/vpro/

1.11.1.1

Intel® Active Management Technology

When used with third-party management and security applications, Intel Active
Management Technology (Intel AMT) allows business owners and IT organizations to
better discover, heal, and protect their networked computing assets.
Some of the features of Intel AMT include:
•
•
•
•
•

Out-of-band (OOB) system access, to discover assets even while PCs are
powered off
Remote trouble-shooting and recovery, which allows remote diagnosis and recovery
of systems after OS failures
Hardware-based agent presence checking that automatically detects and alerts
when critical software agents have been stopped or are missing
Proactive network defense, which uses filters to block incoming threats while
isolating infected clients before they impact the network
Remote hardware and software asset tracking, helping to track computer assets
and keep virus protection up-to-date

Product Description

•

Keyboard, video and mouse (KVM) remote control, which allows redirection of a
managed system’s video to a remote console which can then interact with it using
the console’s own mouse and keyboard

NOTE
Intel AMT requires the computer system to have an Intel AMT-enabled chipset,
network hardware and software, as well as connection with a power source, a
corporate network connection, and an Intel AMT-enabled remote management console.
Setup requires additional configuration of the platform.
For information about

Refer to

Intel Active Management Technology

http://www.intel.com/technology/platformtechnology/intel-amt/index.htm

1.11.1.2

Intel® Virtualization Technology

Intel® Virtualization Technology (Intel® VT) is a hardware-assisted technology that,
when combined with software-based virtualization solutions, provides maximum
system utilization by consolidating multiple environments into a single server or
client.

NOTE
A processor with Intel VT does not guarantee that virtualization will work on your
system. Intel VT requires a computer system with a chipset, BIOS, enabling software
and/or operating system, device drivers, and applications designed for this feature.
For information about

Refer to

Intel Virtualization Technology

http://www.intel.com/technology/virtualization/tec
hnology.htm

1.11.1.3

Intel® Virtualization Technology for Directed I/O

Intel® Virtualization Technology for Directed I/O (Intel® VT-d) allows addresses in
incoming I/O device memory transactions to be remapped to different host addresses.
This provides Virtual Machine Monitor (VMM) software with:
•
•

Improved reliability and security through device isolation using hardware assisted
remapping.
Improved I/O performance and availability by direct assignment of devices.
For information about

Refer to

Intel Virtualization Technology for Directed
I/O

http://www.intel.com/technology/itj/2006/v10i3/2-io/4virtualization-techniques.htm

Intel NUC D53427RKE Technical Product Specification

Intel® Trusted Execution Technology

1.11.1.4

Intel® Trusted Execution Technology (Intel® TXT) is a hardware security solution that
protects systems against software-based attacks by validating the behavior of key
components at startup against a known good source. It requires that Intel VT be
enabled and the presence of a TPM.
For information about

Refer to

Intel Trusted Execution Technology

http://www.intel.com/content/www/us/en/architectureand-technology/trusted-execution-technology/malwarereduction-general-technology.html

Intel® Identity Protection Technology

1.11.1.5

Intel® Identity Protection Technology (Intel® IPT) provides a simple way for websites
and enterprises to validate that a user is logging in from a trusted computer. This is
accomplished by using the Intel Manageability Engine embedded in the chipset to
generate a six-digit number that, when coupled with a user name and password, will
generate a One-Time Password (OTP) when visiting Intel IPT-enabled websites. Intel
IPT eliminates the need for the additional token or key fob required previously for
two-factor authentication.
For information about

Refer to

Intel Identity Protection Technology

http://ipt.intel.com

1.11.1.6

Intel Anti-Theft Technology
®

Intel Anti-Theft (Intel® AT) provides local, tamper-resistant defense that works like
a poison pill that disables the computer and access to its data even if the operating
system (OS) is reimaged, a new hard drive is installed, or the computer is
disconnected from the network.

NOTE
No computer system can provide absolute security under all conditions. Intel AT
requires the computer system to have an Intel® AT-enabled chipset, BIOS, firmware
release, software, and an Intel AT-capable Service Provider/ISV application and
service subscription. The detection (triggers), response (actions), and recovery
mechanisms only work after the Intel® AT functionality has been activated and
configured. Certain functionality may not be offered by some ISVs or service
providers and may not be available in all countries. Intel assumes no liability for lost
or stolen data and/or systems or any other damages resulting thereof.

For information about

Refer to

Intel Anti-Theft

http://antitheft.intel.com/welcome.aspx

Product Description

1.11.1.7

Trusted Platform Module (TPM)

The ST Micro ST33ZP24AR28PVSP version 1.2 revision 116 component is specifically
designed to enhance platform security above-and-beyond the capabilities of today’s
software by providing a protected space for key operations and other security critical
tasks. Using both hardware and software, the TPM protects encryption and signature
keys at their most vulnerable stages—operations when the keys are being used
unencrypted in plain-text form. The TPM shields unencrypted keys and platform
authentication information from software-based attacks.
For information about

Refer to

ST Micro TPM version 1.2

http://www.st.com/web/en/home.html

1.11.2

Intel® Small Business Technology

Intel® Small Business Technology (Intel® SBT) provides small businesses with security
and productivity capabilities to help keep their PCs up-to-date, protected and running
well. Intel SBT is the firmware component of Intel® Small Business Advantage (Intel®
SBA) and includes this hardware functionality:
•
•

Local Maintenance Timer – Enables applications to “wake-up” the host platform
when it is powered down or in a sleep state.
Local Software Monitor – Provides a common reporting mechanism to monitor
applications running on the host operating system.

For information about

Refer to

Intel Small Business Advantage

http://www.intel.com/go/SBA

Intel NUC D53427RKE Technical Product Specification

Technical Reference

2.1

Memory Resources

2.1.1

Addressable Memory

The board utilizes 16 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 16 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
•
•
•
•
•
•

BIOS/SPI Flash device (128 Mb)
Local APIC (19 MB)
Direct Media Interface (40 MB)
PCI Express configuration space (256 MB)
PCH base address registers PCI Express ports (up to 256 MB)
Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards
(256 MB)

The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 8 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.

Intel NUC D53427RKE Technical Product Specification

2.2

Connectors and Headers

CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
•
•

Back panel I/O connectors
On-board I/O connectors and headers (see page 44)

Technical Reference

2.2.1

Back Panel Connectors

Figure 9 shows the location of the back panel connectors for the board.

Item

Description

A
B
C
D
E
F
G

LAN connector
HDMI connector
Mini DisplayPort connector #1
Mini DisplayPort connector #2
USB 2.0 port
USB 2.0 port
19 V DC input jack

Figure 8. Back Panel Connectors

Intel NUC D53427RKE Technical Product Specification

2.2.2

Connectors and Headers (Bottom)

Figure 10 shows the locations of the connectors and headers on the bottom-side of the
board.

Figure 9. Connectors and Headers (Bottom)

Technical Reference

Table 10 lists the connectors and headers identified in Figure 10.
Table 10. Connectors and Headers Shown in Figure 10
Item from
Figure 10

Description

PCI Express Full-Mini Card connector

PCI Express Half-Mini Card connector

Front panel dual-port USB 2.0 header

Front panel header

Intel MEBX Reset header

Internal DC power connector

Intel NUC D53427RKE Technical Product Specification

2.2.2.1

Signal Tables for the Connectors and Headers

Table 11. PCI Express Full-/Half-Mini Card Connector
Pin

Signal Name

WAKE#

+3.3 V aux

Reserved

GND

Reserved

1.5 V

CLKREQ#

Reserved

GND

Reserved

REFCLK-

Reserved

REFCLK+

Reserved

GND

Reserved

GND

Reserved

GND

PERST#

PERn0

+3.3 V aux

PERp0

GND

+1.5 V

GND

SMB_CLK

PETn0

SMB_DATA

PETp0

GND

USB_D-

GND

USB_D+

Additional Signal Name

continued

Technical Reference

Table 11. PCI Express Full-/Half-Mini Card Connector (continued)
Pin

Signal Name

+3.3 V aux

GND

+3.3 V aux

LED_WWAN#

GND

LED_WLAN#

Reserved

LED_WPAN#

Reserved

+1.5V

Reserved

GND

Reserved

+3.3 V aux

Additional Signal Name

(mSATA) NC
(Intel AMT) C-Link_CLK*
(Intel AMT) C-Link_DAT*
(Intel AMT) C-Link_RST*
(mSATA) mSATA SEL

NOTE
The mSATA signals are routed only to the PCIe full-mini card connector and not to
the half-mini card connector. These signals are required to support mSATA
modules.

NOTE
The Intel AMT C-Link signals are routed only to the PCIe half-mini card connector
and not to the full-mini card connector. These signals are required to support Intel
AMT Wake-on-LAN for wireless cards.

Intel NUC D53427RKE Technical Product Specification

Table 12. Dual-Port Front Panel USB 2.0 Header
Pin

Signal Name

+5 V DC

D−

D+

Ground

KEY (no pin)

No Connect

2.2.2.2

Add-in Card Connectors

The board has the following add-in card connectors:
•
•

One PCI Express Half-Mini Card
One PCI Express Full-Mini Card

Technical Reference

2.2.2.3

Power Supply Connectors

The board has the following power supply connectors:
•

•

External Power Supply – the board can be powered through a 19 V DC connector
on the back panel. The back panel DC connector is compatible with a 5.5 mm/OD
(outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is
+19 (±10%) V DC and the shell is GND. The maximum current rating is 10 A.
Internal Power Supply – the board can alternatively be powered via the internal
19 V DC 1 x 2 power connector, where pin 1 is GND and pin 2 is +19 (±10%) VDC.
The internal 1 x 2 power connector is a Molex 5566-2 header which accepts a
Molex 5557-02R connector from the power supply.

Table 13. 19 V Internal Power Supply Connector
Pin

Signal Name

Ground

+19 V (±10%)

For information about

Refer to

Power supply considerations

Section 2.5.1, page 56

2.2.2.4

Front Panel Header

This section describes the functions of the front panel header. Table 14 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 14. Front Panel Header
Pin

Signal Name

Description

Signal Name

Description

HDD_POWER_LED

Pull-up resistor
(750 Ω) to +5V

POWER_LED_MAIN

[Out] Front panel LED
(main color)

HDD_LED#

[Out] Hard disk
activity LED

POWER_LED_ALT

[Out] Front panel LED
(alt color)

GROUND

Ground

POWER_SWITCH#

[In] Power switch

RESET_SWITCH#

[In] Reset switch

GROUND

Ground

+5V_DC

Power

Key

No pin

Intel NUC D53427RKE Technical Product Specification

Figure 10. Connection Diagram for Front Panel Header
2.2.2.4.1

Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires a SATA hard
drive or optical drive connected to an onboard SATA connector.
2.2.2.4.2

Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3

Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 15 shows the
possible LED states.
Table 15. States for a One-Color Power LED
LED State

Description

Off

Power off

Blinking

Standby

Steady

Normal operation

NOTE
The LED behavior shown in Table 15 is default – other patterns may be set via BIOS
setup.

Technical Reference

2.2.2.4.4

Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.

2.2.2.5

Front Panel USB 2.0 Header

Figure 12 is a connection diagram for the front panel USB 2.0 header.

NOTE

•
•

The +5 V DC power on the USB header is fused.
Use only a front panel USB connector that conforms to the USB 2.0 specification for
high-speed USB devices.

Figure 11. Connection Diagram for Front Panel
USB 2.0 Dual-Port Header

Intel NUC D53427RKE Technical Product Specification

2.3

BIOS Setup Configuration Jumper

CAUTION
Do not move a jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the board
could be damaged.
Figure 13 shows the location of the BIOS Setup Configuration jumper.
Table 16 describes the BIOS Setup configuration jumper settings for the three modes:
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.

Figure 12. Location of the BIOS Configuration Setup Jumper

Technical Reference

Table 16 lists the settings for the jumper.
Table 16. BIOS Setup Configuration Jumper Settings
Function/Mode

Jumper Setting

Configuration

Normal

1-2

The BIOS uses current configuration information and passwords
for booting.

Configure

2-3

After the POST runs, Setup runs automatically. The maintenance
menu is displayed.
Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.

Recovery

2.4

None

The BIOS attempts to recover the BIOS configuration. A
recovery CD or flash drive is required.

Intel® Management Engine BIOS Extension
(Intel® MEBX) Reset Header

The Intel® MEBX reset header (see Figure 13) allows you to reset the Intel ME
configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper
(not supplied) will accomplish the following:
•
•

Return all Intel ME parameters to their default values.
Reset the Intel MEBX password to the default value (admin).

CAUTION
Always turn off the power and unplug the power cord from the computer before
installing an MEBX reset jumper. The jumper must be removed before reapplying
power. The system must be allowed to reach end of POST before reset is complete.
Otherwise, the board could be damaged.

NOTE
After using the MEBX Reset, a “CMOS battery failure” warning will occur during the
next POST. This is expected and does not indicate a component failure.

Intel NUC D53427RKE Technical Product Specification

Figure 13. Intel MEBX Reset Header
Table 17. Intel MEBX Reset Header Signals

Function

PCH_RTCRST_PULLUP

Ground

No connection

Technical Reference

2.5
2.5.1

Mechanical Considerations
Form Factor

The board is designed to fit into a custom chassis. Figure 14 illustrates the mechanical
form factor for the board. Dimensions are given in inches [millimeters]. The outer
dimensions are 4.0 inches by 4.0 inches [101.60 millimeters by 101.60 millimeters].

Figure 14. Board Dimensions

Intel NUC D53427RKE Technical Product Specification

2.6
2.6.1

Electrical Considerations
Power Supply Considerations

CAUTION
The external 19 V DC jack is the primary power input connector of Intel NUC Board
D53427RKE. However, the board also provides an internal 1 x 2 power connector that
can be used in custom-developed systems that have a custom internal power supply.
The internal 1 x 2 power connector is a Molex 5566-2 header which accepts a Molex
5557-02R connector from the power supply.
There is no isolation circuitry between the external 19 V DC jack and the internal 1 x 2
power connector. It is the system integrator’s responsibility to ensure no more than
one power supply unit is or can be attached to the board at any time and to ensure the
external 19 V DC jack is covered if the internal 1 x 2 power connector is to be used.
Simultaneous connection of both external and internal power supply units could result
in potential damage to the board, power supplies, or other hardware.
System power requirements will depend on actual system configurations chosen by the
integrator, as well as end user expansion preferences. It is the system integrator’s
responsibility to ensure an appropriate power budget for the system configuration is
properly assessed based on the system-level components chosen.

Technical Reference

2.6.2

Fan Header Current Capability

Table 18 lists the current capability of the fan headers.
Table 18. Fan Header Current Capability

2.7

Fan Header

Maximum Available Current

Processor fan

.1 A

Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 58 oC at the processor fan
inlet is a requirement. Whenever possible, use of a processor heat sink that provides
omni-directional airflow to maintain required airflow across the processor voltage
regulator area is recommended.

CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the system integrator. Intel makes no warranties or
representations that merely following the instructions presented in this document will
result in a system with adequate thermal performance.

CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.

CAUTION
The processor voltage regulator area (shown in Figure 15) can reach a temperature of
up to 97.5 oC in an open chassis. Ensure that proper airflow is maintained in the
processor voltage regulator circuit. Failure to do so may result in shorter than
expected product lifetime.

Intel NUC D53427RKE Technical Product Specification

Figure 15 shows the locations of the localized high temperature zones.

Item

Description

A
B

Processor voltage regulator area
Thermal solution

Figure 15. Localized High Temperature Zones

Technical Reference

Table 19 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 19. Thermal Considerations for Components
Component

Maximum Case Temperature

Processor

For processor case temperature, see processor datasheets and
processor specification updates

Intel QS77 Express Chipset

104 oC

To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 20. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.
Table 20. Tcontrol Values for Components
Component

Tcontrol

Processor

For processor case temperature, see processor datasheets and
processor specification updates

Intel QS77 Express Chipset

104 oC

For information about

Refer to

Processor datasheets and specification updates

Section 1.2, page 18

Intel® 7 Series Chipset Thermal Mechanical Specifications and
Design Guidelines

http://www.intel.com/Products/Desktop/
Chipsets/ec-QS77/QS77technicaldocuments.htm

Intel NUC D53427RKE Technical Product Specification

2.8

Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332
Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate
repair rates and spare parts requirements. The MTBF for the board is 71,537 hours.

2.9

Environmental

Table 21 lists the environmental specifications for the board.
Table 21. Environmental Specifications
Parameter

Specification

Temperature
Non-Operating

-40 °C to +60 °C

Operating

0 °C to +50 °C

Shock
Unpackaged

50 g trapezoidal waveform
Velocity change of 170 inches/s²

Packaged

Half sine 2 millisecond
Product Weight (pounds)

Free Fall (inches)

Velocity Change (inches/s²)

<20

167

21-40

152

41-80

136

81-100

118

Vibration
Unpackaged

5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)

Packaged

5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Overview of BIOS Features

3.1

Introduction

The board uses an Intel® Visual BIOS that is stored in the Serial Peripheral Interface
Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI
Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration
utility, LAN EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as RKPPT10H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The Visual BIOS Setup program can be used to view and change the BIOS settings for
the computer. The BIOS Setup program is accessed by pressing the key after
the Power-On Self-Test (POST) memory test begins and before the operating system
boot begins.

Figure 16. Intel Visual BIOS Home Screen

Intel NUC D53427RKE Technical Product Specification

NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 52 shows how to put the board in configure mode.

3.2

BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 128 Mb
(16000 KB) flash memory device.

3.3

System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The MIF
database defines the data and provides the method for accessing this information. The
BIOS enables applications such as third-party management software to use SMBIOS.
The BIOS stores and reports the following SMBIOS information:
•
•
•
•

BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.

3.4

Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s
USB drivers are not yet available. Legacy USB support is used to access the BIOS
Setup program, and to install an operating system that supports USB. By default,
Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.

Overview of BIOS Features

4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards
and mice are recognized and may be used to configure the operating system.
(Keyboards and mice are not recognized during this period if Legacy USB support
was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel® Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.

3.5

BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
•

•

Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Intel® F7 switch during POST allows a user to select where the BIOS .bio file is
located and perform the update from that location/device. Similar to performing a
BIOS Recovery without removing the BIOS configuration jumper.

Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.

NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about

Refer to

BIOS update utilities

http://support.intel.com/support/motherboards/desktop/sb
/CS-022312.htm

3.5.1

Language Support

The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for support.

Intel NUC D53427RKE Technical Product Specification

3.5.2

Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.

NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about

Refer to

Intel Integrator Toolkit

www.intel.com/go/itk

Additional Intel® software tools

www.intel.com/go/itk

3.6

BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 22 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need to
be made bootable.
Table 22. Acceptable Drives/Media Types for BIOS Recovery
Media Type (Note)

Can be used for BIOS recovery?

Hard disk drive (connected to SATA or USB)

Yes

CD/DVD drive (connected to SATA or USB)

Yes

USB flash drive

Yes

USB diskette drive (with a 1.4 MB diskette)

No (BIOS update file is bigger than 1.4 MB size limit)

NOTE
Supported file systems for BIOS recovery:
•
•
•
•
•

NTFS (sparse, compressed, or encrypted files are not supported)
FAT32
FAT16
FAT12
ISO 9660

For information about

Refer to

BIOS recovery

http://www.intel.com/support/motherboards/desktop/sb/cs-023360.htm

Overview of BIOS Features

3.7

Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.

3.7.1

Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.

3.7.2

Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
•
•
•

Video adapter
Keyboard
Mouse

3.7.3

Changing the Default Boot Device During POST

Pressing the key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 23 lists the boot device menu
options.
Table 23. Boot Device Menu Options
Boot Device Menu Function Keys

Description

<↑> or <↓>

Selects a default boot device

Exits the menu, and boots from the selected device

Exits the menu and boots according to the boot priority
defined through BIOS setup

Intel NUC D53427RKE Technical Product Specification

3.8

Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the
hard disk drive until the correct password is given. Hard Disk Drive Passwords are set
in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3
resume, the system BIOS will automatically unlock drives on resume from S3.
The User hard disk drive password, when installed, will be required upon each powercycle until the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The
Master Key hard disk drive password exists as an unlock override in the event that the
User hard disk drive password is forgotten. Only the installation of the User hard disk
drive password will cause a hard disk to be locked upon a system power-cycle.
Table 24 shows the effects of setting the Hard Disk Drive Passwords.
Table 24. Master Key and User Hard Drive Password Functions
Password Set

Password During Boot

Neither

None

Master only

None

User only

Master and User Set

Master or User

During every POST, if a User hard disk drive password is set, POST execution will
pause with the following prompt to force the user to enter the Master Key or User hard
disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system
will continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the
above prompt. The user will have three attempts to correctly enter the hard disk drive
password. After the third unsuccessful hard disk drive password attempt, the system
will halt with the message:
Hard Disk Drive Password Entry Error
A manual power cycle will be required to resume system operation.

NOTE
As implemented on D53427RKE, Hard Disk Drive Password Security is only supported
on SATA port 0. The passwords are stored on the hard disk drive so if the drive is
relocated to another computer that does not support Hard Disk Drive Password
Security feature, the drive will not be accessible.

Overview of BIOS Features

3.9

BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
•
•
•
•

•

•
•
•

The supervisor password gives unrestricted access to view and change all the Setup
options in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
If only the supervisor password is set, pressing the key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user
passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
19 characters in length.
To clear a set password, enter a blank password after entering the existing
password.

Table 25 shows the effects of setting the supervisor password and user password. This
table is for reference only and is not displayed on the screen.
Table 25. Supervisor and User Password Functions

Setup Options

Password
to Enter
Setup

Password
During
Boot

None

Can change a
limited
number of
options

Supervisor Password

Supervisor

None

N/A

Can change all
options

Enter Password
Clear User Password

User

Can change all
options

Can change a
limited
number of
options

Supervisor Password
Enter Password

Supervisor or
user

Password
Set

Supervisor
Mode

User Mode

Neither

Can change all
options (Note)

Supervisor
only

Can change all
options

User only
Supervisor
and user set

Note:

If no password is set, any user can change all Setup options.

Intel NUC D53427RKE Technical Product Specification

Error Messages and Blink Codes

4.1

Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 26).
Table 26. Front-panel Power LED Blink Codes
Type

Pattern

Note

BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error

(Note)

On-off (1.0 second each) two times, then
2.5-second pause (off), entire pattern repeats
(blink and pause) until the system is powered
off.

Memory error

On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.

Thermal trip warning

Each beep will be accompanied by the following
blink pattern: .25 seconds on, .25 seconds off,
.25 seconds on, .25 seconds off. This will result
in a total of 16 blinks.

When no VGA option ROM is
found.

Note: Disabled per default BIOS setup option.

4.2

BIOS Error Messages

Table 27 lists the error messages and provides a brief description of each.
Table 27. BIOS Error Messages
Error Message

Explanation

CMOS Battery Low

The battery may be losing power. Replace the battery soon.

CMOS Checksum Bad

The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.

Memory Size Decreased

Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.

No Boot Device Available

System did not find a device to boot.

Intel NUC D53427RKE Technical Product Specification

Regulatory Compliance and Battery
Disposal Information

5.1

Regulatory Compliance

This section contains the following regulatory compliance information for Intel NUC
Board D53427RKE:
•
•
•
•
•

5.1.1

Safety standards
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) standards
Product certification markings

Safety Standards

Intel NUC Board D53427RKE complies with the safety standards stated in Table 28
when correctly installed in a compatible host system.
Table 28. Safety Standards
Standard

Title

CSA/UL 60950-1

Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)

EN 60950-1

Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)

IEC 60950-1

Information Technology Equipment – Safety - Part 1: General
Requirements (International)

Intel NUC D53427RKE Technical Product Specification

5.1.2

European Union Declaration of Conformity
Statement

We, Intel Corporation, declare under our sole responsibility that the products Intel®
NUC Board D53427RKE is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC
(ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC,
2006/95/EC, and 2002/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,
2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.

5.1.3

Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.

5.1.3.1

Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
printed wiring board assembly and lithium battery.

Intel NUC D53427RKE Technical Product Specification

5.1.4

EMC Regulations

Intel NUC Board D53427RKE complies with the EMC regulations stated in Table 29
when correctly installed in a compatible host system.
Table 29. EMC Regulations
Regulation

Title

FCC 47 CFR Part 15,
Subpart B

Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)

ICES-003

Interference-Causing Equipment Standard, Digital Apparatus. (Canada)

EN55022

Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)

EN55024

Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)

EN55022

Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)

CISPR 22

Limits and methods of measurement of Radio Disturbance Characteristics
of Information Technology Equipment. (International)

CISPR 24

Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurement. (International)

VCCI V-3, V-4

Voluntary Control for Interference by Information Technology Equipment.
(Japan)

KN-22, KN-24

Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)

CNS 13438

Bureau of Standards, Metrology, and Inspection (Taiwan)

FCC Declaration of Conformity
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
•

Reorient or relocate the receiving antenna.

Regulatory Compliance and Battery Disposal Information

•
•
•

Increase the separation between the equipment and the receiver.
Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.
Japan VCCI Statement
Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.

Korea Class B Statement
Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas.

Intel NUC D53427RKE Technical Product Specification

5.1.5

ENERGY STAR* 5.2, e-Standby, and ErP
Compliance

The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Intel NUC Board D53427RKE allows for a compliant system built to meet the following
program requirements, including appropriate selection of an efficient power supply:
•
•
•
•
•

ENERGY STAR v5.2, category B
EPEAT*
Korea e-Standby
European Union Energy-related Products Directive 2013 (ErP) Lot 6
ENERGY STAR v6.0 draft 3

NOTE
ENERGY STAR denotes a system level energy specification, defined by the US
Environmental Protection Agency, that relies upon all of the system's components,
including processor, chipset, power supply, HDD, graphics controller, memory, etc. to
meet the specification. For more information on ENERGY STAR Computers Program
requirements version 5.2, go to:
http://www.energystar.gov

For information about

Refer to

ENERGY STAR requirements and recommended configurations

http://www.intel.com/go/energystar

Electronic Product Environmental Assessment Tool (EPEAT)

http://www.epeat.net/

Korea e-Standby Program

http://www.kemco.or.kr/new_eng/pg02
/pg02100300.asp

European Union Energy-related Products Directive 2009 (ErP)

http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

Regulatory Compliance and Battery Disposal Information

5.1.6

Regulatory Compliance Marks (Board Level)

Intel NUC Board D53427RKE has the regulatory compliance marks shown in Table 30.
Table 30. Regulatory Compliance Marks
Description

Mark

UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel NUC Boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive,
Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio
Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel
supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.

Korea Certification mark. Includes an adjacent KCC (Korean
Communications Commission) certification number:
KCC-REM-CPU-D53427RKE.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).

V-0

China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel NUC Boards and associated collateral. The color of
the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel NUC Boards has been determined to
be 10 years.

Intel NUC D53427RKE Technical Product Specification

5.2

Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.

PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.

FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør
om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse
med gældende miljølovgivning.

OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.

VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.

VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des
Herstellers entsprechend.

AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Compliance and Battery Disposal Information

PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.

WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.

Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.

Intel NUC D53427RKE Technical Product Specification

AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.

OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.

PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.

UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Compliance and Battery Disposal Information

Intel NUC D53427RKE Technical Product Specification

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