Intel Box Motherboard Matx Xeon S1155 Dbs1200V3Rps Users Manual Intel® ® Processor E3 1200 Product Family And LGA 1155 Socket Thermal/Mechanical Specifications Design Guidelines

2015-02-02

• 1 Introduction
  • 1.1 References
  • 1.2 Definition of Terms
• 2 Package Mechanical & Storage Specifications
  • 2.1 Package Mechanical Specifications
    • 2.1.1 Package Mechanical Drawing
    • 2.1.2 Processor Component Keep-Out Zones
    • 2.1.3 Package Loading Specifications
    • 2.1.4 Package Handling Guidelines
    • 2.1.5 Package Insertion Specifications
    • 2.1.6 Processor Mass Specification
    • 2.1.7 Processor Materials
    • 2.1.8 Processor Markings
    • 2.1.9 Processor Land Coordinates
  • 2.2 Processor Storage Specifications
• 3 LGA1155 Socket
  • 3.1 Board Layout
    • 3.1.1 Suggested Silkscreen Marking for Socket Identification
  • 3.2 Attachment to Motherboard
  • 3.3 Socket Components
    • 3.3.1 Socket Body Housing
    • 3.3.2 Solder Balls
    • 3.3.3 Contacts
    • 3.3.4 Pick and Place Cover
  • 3.4 Package Installation / Removal
    • 3.4.1 Socket Standoffs and Package Seating Plane
  • 3.5 Durability
  • 3.6 Markings
  • 3.7 Component Insertion Forces
  • 3.8 Socket Size
• 4 Independent Loading Mechanism (ILM)
  • 4.1 Design Concept
    • 4.1.1 ILM Assembly Design Overview
    • 4.1.2 ILM Back Plate Design Overview
    • 4.1.3 Shoulder Screw and Fasteners Design Overview
  • 4.2 Assembly of ILM to a Motherboard
  • 4.3 ILM Interchangeability
  • 4.4 Markings
  • 4.5 ILM Cover
• 5 LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
  • 5.1 Component Mass
  • 5.2 Package/Socket Stackup Height
  • 5.3 Loading Specifications
  • 5.4 Electrical Requirements
  • 5.5 Environmental Requirements
• 6 Thermal Specifications
  • 6.1 Thermal Specifications
    • 6.1.1 Intel® Xeon® Processor E3-1280 (95W)Thermal Profile
    • 6.1.2 Intel® Xeon® Processor E3-1200 (80W) Thermal Profile
    • 6.1.3 Intel® Xeon® Processor E3-1260L (45W) Thermal Profile
    • 6.1.4 Intel® Xeon® Processor E3-1220L (20W) Thermal Profile
    • 6.1.5 Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics Thermal Profile
    • 6.1.6 Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL
    • 6.1.7 Thermal Metrology
  • 6.2 Processor Thermal Features
    • 6.2.1 Processor Temperature
    • 6.2.2 Adaptive Thermal Monitor
    • 6.2.3 THERMTRIP# Signal
  • 6.3 Intel® Turbo Boost Technology
    • 6.3.1 Intel® Turbo Boost Technology Frequency
    • 6.3.2 Intel® Turbo Boost Technology Graphics Frequency
  • 6.4 Thermal Considerations
    • 6.4.1 Intel® Turbo Boost Technology Power Control and Reporting
    • 6.4.2 Package Power Control
    • 6.4.3 Power Plane Control
    • 6.4.4 Turbo Time Parameter
• 7 PECI Interface
  • 7.1 Platform Environment Control Interface (PECI)
    • 7.1.1 Introduction
• 8 Sensor Based Thermal Specification Design Guidance
  • 8.1 Sensor Based Specification Overview (DTS 1.0)
  • 8.2 Sensor Based Thermal Specification
    • 8.2.1 TTV Thermal Profile
    • 8.2.2 Specification When DTS value is Greater than TCONTROL
  • 8.3 Thermal Solution Design Process
    • 8.3.1 Boundary Condition Definition
    • 8.3.2 Thermal Design and Modelling
    • 8.3.3 Thermal Solution Validation
  • 8.4 Fan Speed Control (FSC) Design Process
    • 8.4.1 DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data
  • 8.5 System Validation
• 9 1U Thermal Solution
  • 9.1 Performance Targets
  • 9.2 1U Collaboration Heatsink
    • 9.2.1 Heatsink Performance
    • 9.2.2 Thermal Solution
    • 9.2.3 Assembly
  • 9.3 1U Reference Heatsink
    • 9.3.1 Heatsink Performance
    • 9.3.2 Thermal Solution
    • 9.3.3 Assembly
  • 9.4 Geometric Envelope for 1U Thermal Mechanical Design
  • 9.5 Thermal Interface Material
  • 9.6 Heat Pipe Thermal Consideration
• 10 Active Tower Thermal Solution
  • 10.1 Introduction
  • 10.2 Mechanical Specifications
    • 10.2.1 Cooling Solution Dimensions
    • 10.2.2 Retention Mechanism and Heatsink Attach Clip Assembly
  • 10.3 Electrical Requirements
    • 10.3.1 Active Tower Heatsink Power Supply
  • 10.4 Cooling Requirements
• 11 Thermal Solution Quality and Reliability Requirements
  • 11.1 Reference Heatsink Thermal Verification
  • 11.2 Mechanical Environmental Testing
    • 11.2.1 Recommended Test Sequence
    • 11.2.2 Post-Test Pass Criteria
    • 11.2.3 Recommended BIOS/Processor/Memory Test Procedures
  • 11.3 Material and Recycling Requirements
• A Component Suppliers
• B Mechanical Drawings
• C Socket Mechanical Drawings
• D Package Mechanical Drawings